JP2021060412A - Transport unit - Google Patents

Abstract

To provide a transport unit for transporting objects between an object storage unit and a measurement unit, which improves throughput at the measurement unit.SOLUTION: A transport unit 16 provided herein is configured to transport objects (e.g., wafers and probe cards) between an object storage unit 12 and a measurement unit 14. The transport unit 16 has environmental control means configured to control an object transport environment, when transporting objects from one of the object storage unit 12 and the measurement unit 14 to the other unit, such that the object transport environment becomes closer to an environment of the other unit.SELECTED DRAWING: Figure 1

Description

The present invention relates to a prober for inspecting the electrical characteristics of a plurality of semiconductor elements (chips) formed on a semiconductor wafer, and in particular, moves the transported object between a transported object storage unit and a plurality of measuring units to move the transported object. The present invention relates to a prober provided with a transport unit and a transport unit for transporting to a transported object storage unit or each measuring unit.

Conventionally, it is moved between a transported object storage unit (cassette stock unit that stores a plurality of wafers), a plurality of measuring units (wafer inspection unit), and the transported material storage unit and each measuring unit. A prober (wafer inspection device) including a transport unit (self-propelled chassis) for transporting the transported object to the transported object storage unit or each measuring unit has been proposed (see, for example, Patent Document 1). According to the prober described in Patent Document 1, for example, when N measuring units are used, the inspection time can be shortened to 1 / N as compared with the case where one measuring unit is used.

Further, conventionally, in a prober, an inspection (high temperature inspection or low temperature inspection) of electrical characteristics of a wafer at a high temperature (or low temperature) has been carried out. In this inspection, the wafer is usually transported from the cassette to the wafer chuck by a transport arm, and the wafer is heated (or cooled) to the inspection temperature on the wafer chuck to inspect the electrical characteristics. After the inspection is completed, the wafer chuck is inspected. The wafer is cooled (or heated) above, and after the temperature reaches room temperature, the wafer is returned to the cassette by the transfer arm.

Japanese Unexamined Patent Publication No. 5-334497

However, in the prober described in Patent Document 1, when a high temperature inspection or a low temperature inspection is performed in each measuring unit, the environment of the transported object storage unit (usually the normal temperature environment) and the environment of each measuring unit (high temperature environment or low temperature environment). The following problems arise due to the difference between.

For example, when performing a high-temperature inspection, before the start of the inspection, a waiting time (for preheating) is required for each measuring unit to bring the wafer or probe card at room temperature closer to the inspection temperature, and the throughput at each measuring unit is required. There is a problem that (processing capacity per unit time) decreases. In particular, when the high temperature inspection is performed again after exchanging the wafer or probe card, it takes time for the wafer chuck to reach a high temperature again, so that the waiting time becomes longer until the next high temperature inspection can be performed. The throughput at the measuring unit is further reduced. In addition, when performing a high-temperature inspection, when replacing the wafer or probe card after the inspection is completed, each measurement unit requires a waiting time to bring the high-temperature wafer or probe card close to room temperature, which also causes each measurement. There is a problem that the throughput in the department is reduced.

Similarly, when performing a low temperature inspection, a waiting time is required for each measuring unit to bring the wafer or probe card at room temperature closer to the inspection temperature before the inspection starts, which causes a problem that the throughput at each measuring unit decreases. There is. In particular, when the low temperature inspection is performed again after exchanging the wafer or probe card, it takes time for the wafer chuck to become low temperature again, so that the waiting time becomes longer until the next low temperature inspection can be performed. The throughput at the measuring unit is further reduced. In addition, when performing a low temperature inspection, after the inspection is completed, a waiting time is required for each measuring unit to bring the wafer or probe card in a low temperature state close to a temperature at which condensation does not occur (usually normal temperature), which also causes each measurement. There is a problem that the throughput in the department is reduced.

As described above, in the prober described in Patent Document 1, when the high temperature inspection or the low temperature inspection is performed in each measuring part, the environment of the transported goods storage part (usually the normal temperature environment) and the environment of each measuring part (high temperature environment or Due to the difference from the low temperature environment), the waiting time for bringing the transported object closer to a predetermined temperature (for example, inspection temperature or normal temperature) in each measuring unit becomes long, and the throughput in each measuring unit decreases. There is a need to improve this and improve the throughput at each measurement unit.

The present invention has been made in view of such circumstances, and moves between a transported object storage unit and a plurality of measuring units to store a transported object (for example, at least one of a wafer and a probe card). It is an object of the present invention to provide a prober and a transfer unit capable of improving the throughput in each measurement unit in a prober provided with a unit or a transfer unit to transfer to each measurement unit.

In order to achieve the above object, the prober of the present invention controls a transported object storage unit for storing a plurality of transported objects, a plurality of measuring units, a housing for storing the transported objects, and an environment inside the housing. A transport unit provided with environmental control means, which moves between the transported object storage unit and each measuring unit to transport the transported object into the transported object storage unit or each measuring unit, and the transport unit is transferred to the transported object. A moving device for moving between the storage unit and each measuring unit is provided, and the environment control means controls the environment inside the housing so as to be an environment corresponding to the environment of the destination of the transported object.

The transport unit according to one aspect of the prober of the present invention further includes a sensor for detecting the environment inside the housing, and the environment control means controls the inside of the housing to a target environment based on the detection result of the sensor. ..

In one aspect of the prober of the present invention, when the transport destination of the transport unit is a measurement unit, the environmental control means is inside the housing so that the environment corresponds to the inspection performed in the measurement unit of the transport destination. Control the environment of.

In one aspect of the prober of the present invention, when the transport destination of the transport unit is a measuring unit on which a high temperature inspection is performed, the environmental control means is such that the transported object housed in the housing is heated. The environment inside the housing is controlled.

In one aspect of the prober of the present invention, the transport destination of the transport unit is the transport material storage unit, and the transport product whose high temperature state has been reached by the high temperature inspection is transported into the transport product storage unit. In this case, the environment control means controls the environment in the housing so that the transported object housed in the housing is cooled.

In one aspect of the prober of the present invention, when the transport destination of the transport unit is a measuring unit on which a low temperature inspection is performed, the environmental control means is such that the transported object housed in the housing is cooled. The environment inside the housing is controlled.

In one aspect of the prober of the present invention, the transported object whose transport destination is the transported object storage unit and whose transport unit has been in a low temperature state by a low temperature inspection is transported into the transported object storage unit. In the case, the environment control means controls the environment in the housing so that the transported object housed in the housing is heated.

One aspect of the prober of the present invention is that when the transport destination of the transport unit is a measuring unit in which an inspection is performed in a predetermined gas atmosphere, the environmental control means has such a predetermined gas atmosphere in the housing. Controls the environment inside the housing.

One aspect of the prober of the present invention is a transport object holding arm provided in the transport unit to hold the transport object, which enters and exits through an opening formed in the housing and holds the transport object. It is provided with a transported object holding arm that is stored in the housing together with the transported object in a held state.

The transported object storage unit and each measuring unit according to one aspect of the prober of the present invention are arranged at regular intervals with the surfaces accessed by the transport unit facing each other. It is arranged between the transported object storage unit and each measuring unit.

One aspect of the prober of the present invention includes a transport unit rotation mechanism that rotates the transport unit so that the opening into which the transport object holding arm enters and exits faces the transport object storage unit or each measurement unit.

Each measuring unit of one aspect of the prober of the present invention is arranged two-dimensionally in the horizontal direction and the vertical direction.

In one aspect of the prober of the present invention, the moving device has a first movable body that moves in the horizontal direction, which is the arrangement direction of each measuring unit, between the transported object storage unit and each measuring unit, and the first movable body. A first movable body moving mechanism that moves the body in the horizontal direction and a first movable body that is movably attached to the first movable body in the vertical direction, which is the arrangement direction of each measuring unit, and the transport unit is centered on the vertical axis. A second movable body that rotatably supports the second movable body, a second movable body moving mechanism that moves the second movable body in the vertical direction, and a center of rotation of the transport unit that is attached to the second movable body and that rotates the transport unit on a vertical axis. It is provided with a transfer unit rotation mechanism that rotates as a plumb bob.

The conveyed object of one aspect of the prober of the present invention is at least one of a wafer and a probe card, and the conveyed object holding arm is a wafer arm for holding the wafer and a probe card arm for holding the probe card. At least one of them.

Each of the plurality of measuring units according to one aspect of the prober of the present invention includes a wafer chuck adjusted to a target temperature and a probe card holding unit to which a probe card is detachably mounted.

The environmental control means of one aspect of the prober of the present invention is provided on the upper surface inside the housing.

The environmental control means of one aspect of the prober of the present invention is provided substantially at the center of the upper surface.

A transport unit according to another aspect of the present invention moves between a transport material storage unit that stores a plurality of transport objects and a plurality of measurement units, and transports the transported object into the transport object storage unit or each measurement unit. A housing for storing the transported object, and an environment control means for controlling the environment inside the housing so that the environment inside the housing is in accordance with the environment of the transport destination of the transported object. , Equipped with.

According to the present invention, a transfer unit that moves between a transported object storage unit and a plurality of measuring units to transport a transported object (for example, at least one of a wafer and a probe card) to the transported object storage unit or each measuring unit. In the prober provided with the above, it is possible to provide a prober and a transfer unit capable of improving the throughput in each measuring unit.

A perspective view showing a schematic configuration of a prober of the present embodiment. Front view of each measuring unit Perspective view of the transport unit Vertical cross-sectional view showing the schematic configuration of the transport unit Perspective view of mobile device Partially enlarged perspective view of the mobile device Vertical cross-sectional view showing the schematic configuration of the transport unit and the measuring unit. Vertical cross-sectional view showing the schematic configuration of the transport unit

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a schematic configuration of a prober 10 of the present embodiment.

As shown in FIG. 1, the prober 10 of the present embodiment moves between the transported object storage unit 12, the plurality of measuring units 14, and the transported object storage unit 12 and each measuring unit 14, and the transported object (book). In the embodiment, at least one of the wafer and the probe card) is conveyed into the conveyed object storage unit 12 or each measurement unit 14, and the transfer unit 16 is between the conveyed object storage unit 12 and each measurement unit 14. It is provided with a moving device (conveying unit moving device) 22 to be moved by the above.

The transported object storage unit 12 and each measuring unit 14 are arranged at regular intervals in the Y direction with the surfaces accessed by the transport unit 16 facing each other (that is, facing each other).

The transport unit 16 is arranged between the transport storage unit 12 and each measurement unit 14.

The transported object storage unit 12 includes a wafer storage unit 12a for storing a plurality of wafers and a probe card storage unit 12b for storing a plurality of probe cards. The number and arrangement of the transported object storage units 12 are not particularly limited, and in the present embodiment, the four transported object storage units 12 including the wafer storage unit 12a and the probe card storage unit 12b are accessed by the transport unit 16. (The surface on the right side in FIG. 1) is arranged in the horizontal direction (X-axis direction) with the surface facing the same direction. The side opposite to the side accessed by the transport unit 16 (left side in FIG. 1) is accessed by an operator when collecting a wafer or probe card.

As shown in FIG. 1, each of the plurality of measuring units 14 is a rectangular parallelepiped formed by combining a plurality of frames extending in the X-axis direction, a plurality of frames extending in the Y-axis direction, and a plurality of frames extending in the Z-axis direction. A shape measuring chamber (also called a prober chamber), in which, as shown in FIG. 7, a wafer chuck 18 for holding a wafer, a head stage 20, and a test mounted on the head stage 20 are placed. A head (not shown) and a first probe card holding mechanism 36 for holding the probe card PC are arranged.

FIG. 2 is a front view of each measuring unit 14.

The number and arrangement form of the measuring units 14 are not particularly limited, and in the present embodiment, as shown in FIGS. 1 and 2, a measuring unit group consisting of four measuring units 14 arranged in the horizontal direction (X-axis direction). Are stacked in three stages in the vertical direction (Z-axis direction), and are arranged two-dimensionally with the side surface (the surface on the left side in FIG. 1) accessed by the transport unit 16 facing in the same direction.

A wafer holding arm (wafer arm: conveyed object holding arm) 16b and a probe card holding arm (probe card arm) 16c of the conveying unit 16 are provided on each measuring unit 14 (the surface on the side accessed by the conveying unit 16). An opening 14a for entering and exiting is formed. The surface of each measuring unit 14 other than the surface on which the opening 14a is formed may be closed, or the opening may be formed.

The wafer chuck 18 is adjusted to a high or low target temperature (inspection temperature) by a well-known temperature control device (for example, a heat plate or a chiller device built in the wafer chuck 18).

The environment in each measuring unit 14 is controlled as follows. For example, the temperature in each measuring unit 14 is controlled to a target temperature (inspection temperature) by the temperature of the wafer chuck 18 arranged in each measuring unit 14. Further, the humidity in each measuring unit 14 is controlled to a target humidity by purging dry air in each measuring unit 14 by a well-known mechanism. Further, the environment in each measuring unit 14 is controlled by purging a predetermined gas (for example, nitrogen gas) in each measuring unit 14 by a well-known mechanism. Each measuring unit 14 carries out a plurality of types of inspections such as a high temperature inspection, a low temperature inspection, and an inspection in a predetermined gas (for example, nitrogen gas) atmosphere, which will be described later. The environment inside each measuring unit 14 is controlled so that the environment inside each measuring unit 14 is an environment corresponding to the inspection performed by each measuring unit 14. The inspection performed by each measuring unit 14 may be the same among the measuring units or may be different from each other.

The first probe card holding mechanism 36 is a means for holding the probe card PC in a detachable manner, and is provided above the wafer chuck 18, for example, on the head stage 20 side. The first probe card holding mechanism 36 detachably holds the probe card PC conveyed to the first probe card holding mechanism 36 by the probe card conveying mechanism described later. Since the first probe card holding mechanism 36 is well known (see, for example, Japanese Patent Application Laid-Open No. 2000-150596), further description thereof will be omitted.

In each measurement unit group, four measurement devices 38 and an alignment device 38 that perform relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18 are measured. A moving device (not shown) that moves the portions 14 to each other is arranged. The alignment device 38 is moved to each other among the four measuring units 14 included in the measuring unit group in which the alignment device 38 is arranged, and is shared among the four measuring units 14. As the moving device for moving the alignment device 38 between the four measuring units 14 to each other, for example, those described in JP-A-2014-150168 can be applied.

The alignment device 38 is a means for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18, and is moved up and down in the Z-axis direction. It is composed of a moving / rotating mechanism for moving the wafer chuck 18 such as the shaft movable portion 38a, the Z-axis fixing portion 38b, and the XY movable portion 38c in the XYZ−θ direction. The alignment device 38 mainly uses a method known for the probe of the probe card PC that holds the wafer W held by the wafer chuck 18 while moving in the XYZ-θ direction and is held above the wafer chuck 18. It is used for alignment, electrical contact between the wafer W and the probe, and electrical characteristic inspection of the wafer W via a test head.

The alignment device 38 holds the wafer chuck 18 in the measuring unit 14, and has a probe card receiving position P1 near the opening 14a (see FIG. 7A) and a preheat position P2 below the first probe card holding mechanism 36. (See FIG. 7B). This movement is achieved by a well-known alignment device movement device (not shown).

The aligning device moving device moves the alignment device 38 in a state of holding the wafer chuck 18 heated to the target temperature when receiving the probe card PC to the probe card receiving position P1 and moves the first probe card holding mechanism 36 of the probe card PC. The alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature is moved to the preheat position P2 at the time of transfer to.

The alignment device 38 includes a second probe card holding mechanism 40 (also referred to as a card lifter).

The second probe card holding mechanism 40 is a means for receiving the probe card PC from the probe card holding arm 16c and holding the probe card PC. For example, the second probe card holding mechanism 40 is a holding mechanism attached to the Z-axis movable portion 38a while surrounding the wafer chuck 18. It is composed of a portion 40a (for example, a ring-shaped member or a plurality of pins) and an elevating mechanism (not shown) that elevates the holding portion 40a with respect to the Z-axis movable portion 38a in the Z-axis direction.

To receive and hold the probe card PC, the holding portion 40a is raised in the Z-axis direction with respect to the Z-axis movable portion 38a while the alignment device 38 is moved to the probe card receiving position P1 to receive and hold the probe card PC (lower surface outer peripheral edge). ), And the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a that rises in the Z-axis direction. The probe card PC is held directly above the wafer chuck 18.

The probe card transfer mechanism is a means for transporting the probe card PC held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36, for example, in the Z-axis direction provided in the alignment device 38. It is composed of a Z-axis movable portion 38a that is raised and lowered.

The transfer of the probe card PC to the first probe card holding mechanism 36 is realized by raising the Z-axis movable portion 38a in the Z-axis direction while the alignment device 38 is moved to the preheat position P2.

FIG. 3 is a perspective view of the transport unit 16, and FIG. 4 is a vertical cross-sectional view showing a schematic configuration of the transport unit 16.

The transport unit 16 moves between the transport material storage unit 12 and each measurement unit 14 in the X-axis direction and the Z-axis direction to move the wafer W or the probe card PC into the transport object storage unit 12 or each measurement unit 14. As shown in FIGS. 3 and 4, it is a housing for accommodating the wafer W and the probe card PC, and is a means for transporting the wafer W and the probe card PC (wafer holding arm 16b and probe card holding arm 16c). The housing 16a is provided with an opening 16f through which the probe is inserted and exited. The housing 16a has a rectangular parallelepiped shape, and inside the housing 16a, a wafer holding arm 16b, a probe card holding arm 16c, an arm moving mechanism (not shown) for individually moving the arms 16b and 16c, and a housing 16a An environment control means 16d for controlling the environment inside and a sensor 16e for detecting the environment inside the housing 16a are arranged. The number of transport units 16 is not particularly limited, and in this embodiment, one transport unit 16 is used. Two transport units 16 are drawn in FIG. 1, and this is a state in which one transport unit 16 is accessing the transport material storage unit 12 (probe card storage unit 12b) (at the lower right in FIG. 1). (Refer to the drawn transport unit 16) and the state of accessing the measuring unit 14 (see the drawn transport unit 16 in the upper left of FIG. 1).

The wafer holding arm 16b is a means for holding the wafer W, and is, for example, arranged in the housing 16a so as to be movable in the horizontal direction along a guide rail (not shown) provided in the housing 16a. There is. The wafer holding arm 16b is housed in the housing 16a together with the wafer W while holding the wafer W.

The probe card holding arm 16c is a means for holding the probe card PC, and is arranged in the housing 16a so as to be movable in the horizontal direction along a guide rail (not shown) provided in the housing 16a, for example. Has been done. The probe card holding arm 16c is housed in the housing 16a together with the probe card PC while holding the probe card PC. The probe card PC includes a card holder CH. A seal ring may be included instead of the card holder CH.

The number and arrangement of the arms 16b and 16c are not particularly limited, and in the present embodiment, as shown in FIG. 4, two wafer holding arms 16b and one probe card holding arm 16c are arranged in three upper and lower stages. There is.

The arm moving mechanism is composed of a well-known mechanism, for example, a drive motor (not shown) provided in the housing 16a. By rotating the drive motor in the forward and reverse directions, the arms 16b and 16c individually reciprocate in the horizontal direction and move in and out through the opening 16f formed in the housing 16a.

The transport unit 16 includes an air curtain forming means 42.

The air curtain forming means 42 is a means for forming an air curtain that closes the opening 16f formed in the housing 16a to make the inside of the housing 16a a closed or substantially closed space, for example, by a well-known air injection port. It is configured.

The number, shape, and arrangement of the air injection ports are not particularly limited, and in the present embodiment, as shown in FIG. 4, the upper end is near the upper end edge of the opening 16f in a posture in which a plurality of air injection ports inject air downward. It is arranged along the edge (in the direction orthogonal to the paper surface in FIG. 4). The arrow 44 in FIG. 4 shows an example of the flow of dry air injected from the environmental control means 16d, and the wafer chuck 18 is shown.

The environment inside the housing 16a is controlled as follows. For example, the temperature and humidity in the housing 16a can be adjusted to the target temperature and humidity under a predetermined gas atmosphere by purging dry air (high temperature or low temperature dry air) or a predetermined gas (nitrogen gas) in each measuring unit 14. Be controlled. This is a well-known environmental control means 16d, for example, a temperature control gas supply source including a heater and a cooler (cooler), a blower, and a pipeline connecting the blower (none of which is shown) and the housing 16a (not shown). (Not shown). The environmental control means 16d may include a dehumidifier. The gas (high temperature or low temperature dry air) whose temperature (and humidity) has been adjusted by the temperature control gas supply source is supplied into the housing 16a through a conduit by a blower, and is injected from the air injection port to the housing. An air curtain is formed that closes the opening 16f formed in 16a. As a result, the inside of the housing 16a becomes a closed or substantially closed space. The gas supply source supplied into the housing 16a and the gas supply source injected from the air injection port may be the same or different. The surface of the housing 16a other than the surface on which the opening 16f is formed may be closed, or the opening may be formed. The environmental control means 16d may be attached to the housing 16a, or may be attached to the arms 16b and 16c.

The sensor 16e is a sensor that detects the environment inside the housing 16a, and is, for example, a temperature sensor or a humidity sensor. The sensor 16e may be included in the environmental control means 16d.

The environment control means 16d controls the environment inside the housing 16a so that the environment corresponds to the environment of the destination of the transported object. Specifically, the environment control means 16d controls the inside of the housing 16a to the target environment based on the detection result of the sensor 16e. For example, the environmental control means 16d controls the temperature control gas supply source so that the temperature and humidity in the housing 16a become the target temperature and humidity based on the detection result of the sensor 16e. The function of the environmental control means 16d is realized by, for example, feedback control by a controller (not shown) to which the sensor 16e and the temperature control gas supply source (heater and cooler) are electrically connected. The environmental control means 16d and the air curtain forming means 42 may be integrated. That is, in one device, an air injection port may be provided downward so as to close the opening 16f, and an air injection port for dry air for controlling the environment inside the housing 16a may be provided. Here, it is preferable that the air injection port for the dry air for controlling the environment in the housing 16a is provided so that the injected dry air circulates well in the housing 16a. By integrating the environmental control means 16d and the air curtain forming means 42, the space for providing the environmental control means 16d and the air curtain forming means 42 is reduced, and the space of the housing 16a can be effectively used. .. Further, by integrating the environmental control means 16d and the air curtain forming means 42, a temperature control gas supply source including a heater, a cooler (cooler), and a temperature control gas supply source including a heater and a cooler (cooler) are provided between the environmental control means 16d and the air curtain forming means 42. Blowers can be shared.

FIG. 5 is a perspective view of the moving device 22, and FIG. 6 is a partially enlarged perspective view of the moving device 22.

The moving device 22 is a means for moving the transport unit 16 between the transport unit 12 and each measurement unit 14 in the X-axis direction and the Z-axis direction. For example, as shown in FIGS. 5 and 6, the moving device 22 is a means for moving the transport unit 16 in the X-axis direction and the Z-axis direction. The first movable body 24 and the first movable body 24 that move in the horizontal direction (X-axis direction), which is the arrangement direction of each measuring unit 14, between the transported object storage unit 12 and each measuring unit 14 are moved in the horizontal direction (X-axis direction). The first movable body moving mechanism (not shown) that moves in the direction (direction), is attached to the first movable body 24 so as to be movable in the vertical direction (Z-axis direction), which is the arrangement direction of each measuring unit 14, and is a transport unit. A second movable body 26 that rotatably supports 16 with the vertical axis (Z axis) as the center of rotation, and a second movable body moving mechanism that moves the second movable body 26 in the vertical direction (Z axis direction) (not shown). , It is attached to the second movable body 26, and is composed of a transport unit rotation mechanism 28 that rotates the transport unit 16 with the vertical axis (Z axis) as the center of rotation.

The first movable body 24 is, for example, a frame body formed by connecting the four corners of each of a pair of upper and lower rectangular frames 24a with four frames 24b extending in the Z-axis direction, and the lower portion thereof is the conveyed object storage portion 12. It is movably connected to two guide rails 30 extending in the X-axis direction arranged parallel to each other on the base 34 between each measuring unit 14.

The first movable body moving mechanism is composed of a well-known moving mechanism, for example, a ball screw connected to the first movable body 24, a drive motor for rotating the ball screw (neither is shown), or the like. By rotating the drive motor in the forward and reverse directions, the first movable body 24 (conveying unit 16) moves in the X-axis direction along the guide rail 30. Of course, not limited to this, the first movable body moving mechanism is a mechanism for self-propelling the first movable body 24, for example, a wheel provided on the first movable body 24 and a drive motor for rotating the wheel. May be good.

The second movable body 26 is movably connected to two guide rails 32 extending in the Z-axis direction arranged parallel to the first movable body 24.

The second movable body moving mechanism is composed of a well-known moving mechanism, for example, a ball screw connected to the second movable body 26, a drive motor for rotating the ball screw (neither is shown), or the like. By rotating the drive motor in the forward and reverse directions, the second movable body 26 (conveying unit 16) moves in the Z-axis direction along the guide rail 32. Of course, not limited to this, the second movable body moving mechanism is a mechanism for self-propelling the second movable body 26, for example, a wheel provided on the second movable body 26 and a drive motor for rotating the wheel. May be good.

The transport unit rotation mechanism 28 is composed of a well-known rotation mechanism, for example, a rotation shaft (vertical shaft) provided on the second movable body 26, a drive motor 28a for rotating the rotation shaft, and the like. The upper surface of the transport unit 16 is fixed to a rotating shaft (vertical shaft). By rotating the drive motor 28a in the forward and reverse directions, the transport unit 16 rotates 180 ° around the vertical axis (Z axis), and an opening 16f formed in the transport unit 16 through which the arms 16b and 16c enter and exit is formed. It is in a state of facing the transported object storage unit 12 or each measuring unit 14.

Each device and mechanism such as the alignment device 38, the arm moving mechanism, the environmental control means 16d, and the moving device 22 (first movable body moving mechanism, second movable body moving mechanism, transport unit rotating mechanism 28) are not shown. It is driven by control by a control means (controller, etc.).

Next, an operation example of the transport unit 16 in the prober 10 of the present embodiment will be described.

<Wafer transfer operation example 1>
First, an operation example in which the transfer unit 16 transfers the wafer W from the wafer storage unit 12a (for example, room temperature 23 ° C.) to the measurement unit 14 where the high temperature inspection (for example, inspection temperature 80 ° C.) is performed will be described.

First, the transfer unit 16 is moved to a position accessible to the wafer storage unit 12a (a position where the wafer W can be taken out), and the transfer unit 16 is rotated by 180 ° to allow the arms 16b and 16c to move in and out of the transfer unit 16. The opening 16f formed in the above is opposed to the wafer accommodating portion 12a.

Next, the wafer holding arm 16b is advanced into the wafer storage portion 12a, one wafer W is taken out from the wafer storage portion 12a, and is stored in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transfer destination (here, the high temperature inspection at 80 ° C. performed in the measurement unit 14). Specifically, a gas whose temperature has been adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature has been adjusted to 60 ° C.) is supplied into the housing 16a, and is injected from an air injection port to the housing. An air curtain is formed that closes the opening 16f formed in the body 16a. As a result, the inside of the housing 16a is closed or a substantially closed space. The target temperature at which the temperature control gas supply source adjusts the temperature is not limited to 60 ° C., and the distance and time during which the wafer W is transported from the wafer storage unit 12a to the measurement unit 14 at the transfer destination, and the measurement unit 14 at the transfer destination. The temperature can be set appropriately in consideration of the inspection temperature and the like.

Next, the transfer unit 16 is moved to a position accessible to the measurement unit 14 at the transfer destination (a position where the wafer W can be delivered), and the transfer unit 16 is rotated by 180 ° to move the arms 16b and 16c in and out. The opening 16f formed in the transport unit 16 faces the measurement unit 14 at the transport destination. During this time, the wafer W housed in the transport unit 16 continues to be heated by the gas supplied into the housing 16a (closed or substantially closed space).

Next, the wafer holding arm 16b is advanced into the measuring unit 14 through the opening 16f on the transfer unit 16 side and the opening 14a on the measuring unit 14 side on which the air curtain is formed, and the wafer W is loaded on the wafer chuck 18. The wafer holding arm 16b passes through the opening 16f in a state of being closed by the air curtain while holding the wafer W, and advances into the measuring unit 14. At that time, the wafer W is further heated by the air curtain.

As described above, the following effects can be obtained by closing the opening 16f with an air curtain instead of the physical door or shutter as in the prior art.

First, as in the case where the opening 16f is closed by a physical door or shutter, the inside of the housing 16a can be closed or a substantially closed space, and the temperature is adjusted in the closed housing 16a. By supplying the gas, the environment inside the housing 16a is made suitable for the environment of the measurement unit 14 at the transfer destination (here, the high temperature inspection at 80 ° C. performed in the measurement unit 14). be able to.

Secondly, the probe card holding arm 16c can be advanced into the measuring unit 14 while keeping the inside of the housing 16a in a sealed state.

Thirdly, compared to the case where the opening 16f is closed by a physical door or shutter, the time required to open and close the physical door or shutter is not required, so that the probe card holding arm 16c quickly advances into the measuring unit 14. Can be made to.

Fourth, when the probe card PC is delivered, the probe card PC can be heated by the action of the air curtain sprayed on the probe card PC.

Fifth, when the opening 16f is closed by a physical door or shutter, the gas supplied to the inside of the housing 16a touches the physical door or shutter and enters the external environment through the physical door or shutter. The heat is dissipated, and as a result, the temperature of the gas supplied to the inside of the housing 16a decreases, whereas when the opening 16f is closed by the air shutter as in this example, the gas is supplied to the inside of the housing 16a. Since the gas comes into contact with the air curtain having the same temperature as this, it is possible to suppress a decrease in the temperature of the gas supplied to the inside of the housing 16a.

The loaded wafer W is held by the wafer chuck 18 by vacuum suction. Then, the wafer W is heated by the wafer chuck 18 and waits until it reaches the inspection temperature (80 ° C. in this case). When the inspection temperature is reached, the alignment device 38 moves in the XYZ−θ direction and the wafer chuck is used. The wafer W held by the wafer 18 is aligned with the probe of the probe card PC held above the wafer chuck 18 by a well-known method, and then the wafer chuck 18 is moved in the Z-axis direction by the action of the alignment device 38. By electrically contacting the wafer W with the probe, the electrical characteristics of the wafer W are inspected via the test head.

In this way, the environment inside the transfer unit 16 is controlled (by heating the wafer) by utilizing the time from the wafer storage unit 12a to the transfer destination measurement unit 14 to transfer the wafer to the transfer destination measurement unit 14. By reducing the difference from the inspection temperature at 14, the waiting time for bringing the wafer closer to the inspection temperature in the measurement unit 14 at the transfer destination can be shortened (or eliminated) as compared with the conventional technique. As a result, the throughput of the measuring unit 14 can be improved.

<Wafer transfer operation example 2>
Next, an operation example in which the wafer W whose transfer unit 16 has been in a high temperature state (for example, 80 ° C.) by the high temperature inspection is transferred from the measurement unit 14 to the wafer storage unit 12a (for example, room temperature 23 ° C.) will be described. ..

First, the wafer W immediately after the high temperature inspection is completed is taken out from the measuring unit 14 by the wafer holding arm 16b and stored in the housing 16a. This is performed in the reverse procedure of the wafer transfer operation example 1. At the same time, the environment of the wafer storage unit 12a at the transfer destination (here, room temperature 23).
The environment inside the housing 16a is controlled so that the environment corresponds to (° C.). Specifically, a gas whose temperature has been adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature has been adjusted to 40 ° C.) is supplied into the housing 16a, and is injected from an air injection port to the housing. An air curtain is formed that closes the opening 16f formed in the body 16a. As a result, the inside of the housing 16a is closed or a substantially closed space. The target temperature at which the temperature control gas supply source adjusts the temperature is not limited to 40 ° C., the distance and time during which the wafer W is transported from the measuring unit 14 to the wafer storage unit 12a at the transfer destination, and the wafer storage unit 12a at the transfer destination. The temperature can be set appropriately in consideration of the temperature and the like in the above. Immediately after the high temperature inspection is completed, the wafer W is held by the wafer holding arm 16b, passes through the opening 16f closed by the air curtain, is taken from the measuring unit 14, and is housed in the housing 16a. To. At that time, the wafer W is cooled by the air curtain sprayed on the wafer W, and is further cooled by the gas supplied into the housing 16a.

Next, the transfer unit 16 is moved to a position accessible to the wafer storage unit 12a of the transfer destination (a position where the wafer W can be delivered), and the transfer unit 16 is rotated by 180 ° to move the arms 16b and 16c in and out. The opening 16f formed in the transfer unit 16 is made to face the wafer storage portion 12a of the transfer destination. During this time, the wafer W housed in the transport unit 16 continues to be cooled by the gas supplied into the housing 16a (closed or substantially closed space).

As described above, by closing the opening 16f with an air curtain instead of the physical door or shutter as in the prior art, the same effect as that of the wafer transfer operation example 1 can be obtained.

Next, the wafer holding arm 16b is advanced into the wafer storage portion 12a, and the wafer W is returned into the wafer storage portion 12a.

In this way, the environment inside the transfer unit 16 is controlled (by cooling the wafer) by utilizing the time from the measurement unit 14 to the transfer of the wafer into the transfer destination wafer storage unit 12a, and the transfer destination wafer is stored. By reducing the difference from the temperature of the part 12a, it is possible to eliminate (or shorten) the waiting time for bringing the wafer closer to normal temperature in the measuring part 14 as compared with the conventional technique, and the wafer for which the high temperature inspection has been completed can be eliminated. It can be immediately taken out from the measuring unit 14 and returned to the wafer accommodating unit 12a. As a result, the throughput of the measuring unit 14 can be improved. Further, it is possible to eliminate (or shorten) the waiting time until the operator collects the wafer after the wafer is stored.

<Wafer transfer operation example 3>
Next, an operation example in which the transfer unit 16 transfers the wafer W from the wafer storage unit 12a (for example, room temperature 23 ° C.) to the measurement unit 14 where the low temperature inspection (for example, inspection temperature −10 ° C.) is performed will be described. To do.

First, the transfer unit 16 is moved to a position accessible to the wafer storage unit 12a (a position where the wafer W can be taken out), and the transfer unit 16 is rotated by 180 ° to allow the arms 16b and 16c to move in and out of the transfer unit 16. The opening 16f formed in the above is opposed to the wafer accommodating portion 12a.

Next, the wafer holding arm 16b is advanced into the wafer storage portion 12a, one wafer W is taken out from the wafer storage portion 12a, and is stored in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transfer destination (here, the low temperature inspection at −10 ° C. performed in the measurement unit 14). Specifically, a gas whose temperature or humidity has been adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature has been adjusted to -15 ° C.) is supplied into the housing 16a and from an air injection port. An air curtain is formed which is injected and closes the opening 16f formed in the housing 16a. As a result, the inside of the housing 16a is closed or a substantially closed space. The target temperature at which the temperature control gas supply source adjusts the temperature is not limited to -15 ° C., the distance and time during which the wafer W is transported from the wafer storage unit 12a to the measurement unit 14 at the transfer destination, and the measurement unit 14 at the transfer destination. It is possible to set an appropriate temperature in consideration of the inspection temperature and the like in.

Next, the transfer unit 16 is moved to a position accessible to the measurement unit 14 at the transfer destination (a position where the wafer W can be delivered), and the transfer unit 16 is rotated by 180 ° to move the arms 16b and 16c in and out. The opening 16f formed in the transport unit 16 faces the measurement unit 14 at the transport destination. During this time, the wafer W housed in the transport unit 16 continues to be temperature-controlled (for example, cooled) and dried by the gas supplied into the housing 16a (sealed or substantially closed space). As a result, it is possible to prevent dew condensation from occurring on the wafer W while the wafer W is being conveyed to the measurement unit 14 at the transfer destination.

Next, the wafer holding arm 16b is advanced into the measuring unit 14 through the opening 16f on the transfer unit 16 side and the opening 14a on the measuring unit 14 side on which the air curtain is formed, and the wafer W is loaded on the wafer chuck 18. The wafer holding arm 16b passes through the opening 16f in a state of being closed by the air curtain while holding the wafer W, and advances into the measuring unit 14. At that time, the wafer W is further cooled and dried by the air curtain. As a result, it is possible to prevent dew condensation from occurring on the wafer W when the wafer W is delivered.

As described above, by closing the opening 16f with an air curtain instead of the physical door or shutter as in the prior art, the same effect as that of the wafer transfer operation example 1 can be obtained.

The loaded wafer W is held by the wafer chuck 18 by vacuum suction. Then, the wafer W is cooled by the wafer chuck 18 and waits until the inspection temperature (here, −10 ° C.) is reached. When the inspection temperature is reached, the alignment device 38 moves in the XYZ−θ direction and the wafer. The wafer W held by the chuck 18 is aligned with the probe of the probe card PC held above the wafer chuck 18 by a well-known method, and then the wafer chuck 18 moves in the Z-axis direction by the action of the alignment device 38. By electrically contacting the wafer W with the probe, the electrical characteristics of the wafer W are inspected via the test head. It should be noted that, in the measuring unit 14 of the transport destination, a gas having a dew point (for example, at 20 ° C.) that does not condense at the cooling temperature of the wafer or probe card by a well-known means so that dew condensation does not occur on the wafer or probe card during the low temperature inspection. Dry air) is supplied, and the low temperature test is performed in an environment where this gas is supplied.

In this way, the environment inside the transfer unit 16 is controlled (by cooling the wafer) by utilizing the time from the wafer storage unit 12a to the transfer destination measurement unit 14 to transfer the wafer to the transfer destination measurement unit 14. By reducing the difference from the inspection temperature of 14, the waiting time for bringing the wafer closer to the inspection temperature in the measurement unit 14 at the transfer destination can be shortened (or eliminated) as compared with the conventional technique. As a result, the throughput of the measuring unit 14 can be improved.

<Wafer transfer operation example 4>
Next, an operation example in which the wafer W whose transfer unit 16 has been in a low temperature state (for example, −40 ° C.) by the low temperature inspection is transferred from the measurement unit 14 to the wafer storage unit 12a (for example, room temperature 23 ° C.) will be described. To do.

First, the wafer W immediately after the low temperature inspection is completed is taken out from the measuring unit 14 by the wafer holding arm 16b and stored in the housing 16a. This is carried out in the reverse procedure of the wafer transfer operation example 3. At the same time, the environment of the wafer storage unit 12a at the transfer destination (here, room temperature 23).
The environment inside the housing 16a is controlled so that the environment corresponds to (° C.). Specifically, a gas whose temperature or humidity has been adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature has been adjusted to 15 ° C.) is supplied into the housing 16a and injected from an air injection port. An air curtain is formed to close the opening 16f formed in the housing 16a. As a result, the inside of the housing 16a is closed or a substantially closed space. The target temperature at which the temperature control gas supply source adjusts the temperature is not limited to 15 ° C., the distance and time during which the wafer W is transported from the measuring unit 14 to the wafer storage unit 12a at the transfer destination, and the wafer storage unit 12a at the transfer destination. The temperature can be set appropriately in consideration of the temperature and the like in the above. Immediately after the low temperature inspection is completed, the wafer W is held by the wafer holding arm 16b, passes through the opening 16f closed by the air curtain, is taken from the measuring unit 14, and is housed in the housing 16a. To. At that time, the wafer W is heated by the air curtain sprayed on the wafer W, and is further heated by the gas supplied into the housing 16a. As a result, it is possible to prevent dew condensation from occurring on the wafer W when the wafer W is delivered.

Next, the transfer unit 16 is moved to a position accessible to the wafer storage unit 12a of the transfer destination (a position where the wafer W can be delivered), and the transfer unit 16 is rotated by 180 ° to move the arms 16b and 16c in and out. The opening 16f formed in the transfer unit 16 is made to face the wafer storage portion 12a of the transfer destination. During this time, the wafer W housed in the transport unit 16 continues to be heated by the gas supplied into the housing 16a (closed or substantially closed space). As a result, it is possible to prevent dew condensation from occurring on the wafer W while the wafer W is being conveyed to the wafer storage portion 12a.

As described above, by closing the opening 16f with an air curtain instead of the physical door or shutter as in the prior art, the same effect as that of the wafer transfer operation example 1 can be obtained.

Next, the wafer holding arm 16b is advanced into the wafer storage portion 12a, and the wafer W is returned into the wafer storage portion 12a.

In this way, the environment inside the transfer unit 16 is controlled (by heating the wafer) by utilizing the time from the measurement unit 14 to the transfer of the wafer into the transfer destination wafer storage unit 12a, and the transfer destination wafer is stored. By reducing the difference from the temperature of the part 12a, it is possible to eliminate (or shorten) the waiting time for bringing the wafer closer to normal temperature in the measuring part 14 as compared with the conventional technique, and the wafer for which the low temperature inspection has been completed can be eliminated. It can be immediately taken out from the measuring unit 14 and returned to the wafer accommodating unit 12a. As a result, the throughput of the measuring unit 14 can be improved. Further, it is possible to prepare a temperature environment that prevents dew condensation from occurring on the wafer by the time the wafer is conveyed into the wafer storage portion 12a.

<Wafer transfer operation example 5>
Next, an operation example in which the transfer unit 16 transfers the wafer W from the wafer storage unit 12a (for example, room temperature 23 ° C.) to the measurement unit 14 where the inspection is performed in a predetermined gas (for example, nitrogen gas) atmosphere. Will be described.

First, the transfer unit 16 is moved to a position accessible to the wafer storage unit 12a (a position where the wafer can be taken out), and the transfer unit 16 is rotated by 180 ° to move the transfer unit 16 into which the arms 16b and 16c enter and exit. The formed opening 16f is opposed to the wafer storage portion 12a.

Next, the wafer holding arm 16b is advanced into the wafer storage portion 12a, one wafer W is taken out from the wafer storage portion 12a, and is stored in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transport destination (here, inspection under a predetermined gas (for example, nitrogen gas) atmosphere). Specifically, wiring exposed on the wafer surface (particularly copper wiring) and a gas for preventing oxidation of the probe of the probe card (for example, nitrogen gas) are supplied into the housing 16a, and an air injection port is provided. An air curtain is formed that closes the opening 16f formed in the housing 16a by being injected from. As a result, the inside of the housing 16a is closed or a substantially closed space.

Next, the transfer unit 16 is moved to a position accessible to the measurement unit 14 at the transfer destination (a position where the wafer W can be delivered), and the transfer unit 16 is rotated by 180 ° to move the arms 16b and 16c in and out. The opening 16f formed in the transport unit 16 faces the measurement unit 14 at the transport destination. During this time, the antioxidant gas continues to be supplied to the inside of the transport unit 16 (closed or substantially closed space). As a result, it is possible to prevent the wafer W from being oxidized while the wafer W is being conveyed to the measurement unit 14 at the transfer destination. An antioxidant gas is also supplied to the measuring unit 14 at the transport destination by a well-known means.

Next, the wafer holding arm 16b is advanced into the measuring unit 14 through the opening 16f on the transfer unit 16 side and the opening 14a on the measuring unit 14 side on which the air curtain is formed, and the wafer W is loaded on the wafer chuck 18. The wafer holding arm 16b passes through the opening 16f in a state of being closed by the air curtain while holding the wafer W, and advances into the measuring unit 14. At that time, the wafer W is prevented from being oxidized by the action of the air curtain.

As described above, by closing the opening 16f with an air curtain instead of the physical door or shutter as in the prior art, the same effect as that of the wafer transfer operation example 1 can be obtained.

The loaded wafer W is held by the wafer chuck 18 by vacuum suction. Then, while the alignment device 38 moves in the XYZ−θ direction, the wafer W held by the wafer chuck 18 is aligned with the probe of the probe card PC held above the wafer chuck 18 by a well-known method. Next, the wafer chuck 18 moves in the Z-axis direction by the action of the alignment device 38 to electrically contact the wafer W and the probe, so that the electrical characteristics of the wafer W are inspected via the test head. .. The inspection is carried out in an environment where an antioxidant gas is supplied.

In this way, the wafer is inspected in a predetermined gas (for example, nitrogen gas) atmosphere during the period from the wafer storage unit 12a to the transfer destination measurement unit 14, as in the measurement unit 14. Since the wafer is placed in the above environment, the wiring exposed on the wafer surface (particularly the copper wiring) is prevented from being oxidized during transportation and delivery.

It should be noted that this operation example 5 can also be carried out in combination with the wafer transfer operation examples 1 to 4.

<Probe card transfer operation example 1>
Next, the operation example when the transfer unit 16 conveys the probe card PC from the probe card storage unit 12b (for example, room temperature 23 ° C.) to the measurement unit 14 where the high temperature inspection (for example, inspection temperature 80 ° C.) is performed. explain.

First, the transfer unit 16 is moved to a position where the probe card storage unit 12b can be accessed (a position where the probe card PC can be taken out), and the transfer unit 16 is rotated by 180 ° to transfer the arms 16b and 16c in and out. The opening 16f formed in the unit 16 faces the probe card storage portion 12b.

Next, the probe card holding arm 16c is advanced into the probe card storage unit 12b, and one probe card PC is taken out from the probe card storage unit 12b and stored in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transfer destination (here, the high temperature inspection at 80 ° C. performed in the measurement unit 14). Specifically, a gas whose temperature has been adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature has been adjusted to 60 ° C.) is supplied into the housing 16a, and is injected from an air injection port to the housing. An air curtain is formed that closes the opening 16f formed in the body 16a. As a result, the inside of the housing 16a is closed or a substantially closed space. The target temperature at which the temperature control gas supply source adjusts the temperature is not limited to 60 ° C., and the distance and time during which the probe card PC is transported from the probe card storage unit 12b to the measurement unit 14 at the transfer destination, and the measurement unit at the transfer destination. An appropriate temperature can be set in consideration of the inspection temperature and the like in 14.

Next, the transfer unit 16 is moved to a position where the measurement unit 14 of the transfer destination can be accessed (a position where the probe card PC can be delivered), and the transfer unit 16 is rotated by 180 ° to move the arms 16b and 16c in and out. The opening 16f formed in the transport unit 16 is opposed to the measurement unit 14 at the transport destination. During this time, the probe card PC housed in the transport unit 16 continues to be heated by the gas supplied into the housing 16a (closed or substantially closed space).

Next, the probe card holding arm 16c is advanced into the measuring unit 14 through the opening 16f on the transport unit 16 side and the opening 14a on the measuring unit 14 side on which the air curtain is formed (see FIG. 7A). The probe card holding arm 16c, while holding the probe card PC, passes through the opening 16f in a state of being blocked by the air curtain and advances into the measuring unit 14. At that time, the probe card PC is further heated by the air curtain sprayed on the probe card PC.

As described above, by closing the opening 16f with an air curtain instead of the physical door or shutter as in the prior art, the same effect as that of the wafer transfer operation example 1 can be obtained.

Next, the holding portion 40a of the second probe card holding mechanism 40 receives the probe card PC from the probe card holding arm 16c and holds the probe card PC. Specifically, the holding portion 40a can be moved by the Z axis while the alignment device 38 holding the wafer chuck 18 heated to the target temperature (here, the inspection temperature 80 ° C.) is moved to the probe card receiving position P1. The probe card PC is brought into contact with the probe card PC (outer peripheral edge of the lower surface) by raising the portion 38a in the Z-axis direction, and the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a rising in the Z-axis direction. As a result, the probe card PC is delivered to the holding portion 40a, and is held directly above the wafer chuck 18 by the holding portion 40a. During this time, the probe card PC is heated by the radiant heat of the wafer chuck 18 below it.

Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature (here, the inspection temperature 80 ° C.) is moved to the preheat position P2 (see FIG. 7B). During this time as well, the probe card PC is heated by the radiant heat of the wafer chuck 18 below it.

Next, the probe card PC is conveyed to the first probe card holding mechanism 36 (see FIG. 7B). Specifically, the Z-axis movable portion 38a (second probe) is in a state where the alignment device 38 holding the wafer chuck 18 heated to the target temperature (here, the inspection temperature 80 ° C.) is moved to the preheat position P2. By raising the card holding mechanism 40) in the Z-axis direction, the probe card PC held by the second probe card holding mechanism 40 is conveyed to the first probe card holding mechanism 36. The probe card PC conveyed to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36. During this time as well, the probe card PC is heated by the radiant heat of the wafer chuck 18 below it.

As described above, the probe card PC is not only heated in the transfer unit 16, but also is delivered from the probe card holding arm 16c and held by the first probe card holding mechanism 36 until the wafer chuck 18 is held. Continues to be seamlessly heated (preheated) by the radiant heat of the.

As a result, even if it takes about 10 to several tens of seconds for the probe card PC heated in the transfer unit 16 to be delivered from the probe card holding arm 16c and held by the first probe card holding mechanism 36, it is on the way. The probe card PC in the preheated state can be held by the first probe card holding mechanism 36 without lowering the temperature of the probe card PC.

In this way, the environment inside the transfer unit 16 is controlled (by heating the probe card) by utilizing the time from the probe card storage unit 12b to the transfer destination measurement unit 14 to transfer the probe card to the transfer destination. By reducing the difference from the inspection temperature in the measurement unit 14 of the above, the waiting time (for preheating) for bringing the probe card closer to the inspection temperature in the measurement unit 14 at the transfer destination is shortened as compared with the conventional technique. (Or can be eliminated). As a result, the throughput of the measuring unit 14 can be improved.

<Probe card transfer operation example 2>
Next, regarding an operation example in which the probe card PC whose transfer unit 16 has been in a high temperature state (for example, 80 ° C.) by the high temperature inspection is transferred from the measurement unit 14 to the probe card storage unit 12b (for example, room temperature 23 ° C.). explain.

First, the probe card PC immediately after the high temperature inspection is completed is taken out from the measuring unit 14 by the probe card holding arm 16c and stored in the housing 16a. This is performed in the reverse procedure of the probe card transfer operation example 1. At the same time, the environment inside the housing 16a is controlled so that the environment corresponds to the environment of the probe card storage unit 12b (here, the room temperature is 23 ° C.) of the transport destination. Specifically, a gas whose temperature has been adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature has been adjusted to 40 ° C.) is supplied into the housing 16a, and is injected from an air injection port to the housing. An air curtain is formed that closes the opening 16f formed in the body 16a. As a result, the inside of the housing 16a is closed or a substantially closed space. The target temperature at which the temperature control gas supply source adjusts the temperature is not limited to 40 ° C., the distance and time during which the probe card PC is transported from the measuring unit 14 to the probe card storage unit 12b at the transport destination, and the probe card at the transport destination. An appropriate temperature can be set in consideration of the temperature of the storage unit 12b and the like. Immediately after the high temperature inspection is completed, the probe card PC is held by the probe card holding arm 16c, passes through the opening 16f closed by the air curtain, is taken from the measuring unit 14, and is taken into the housing 16a. It is stored. At that time, the probe card PC is cooled by the air curtain sprayed on the probe card PC, and is further cooled by the gas supplied into the housing 16a.

Next, the transfer unit 16 is moved to a position where the probe card storage unit 12b of the transfer destination can be accessed (a position where the probe card PC can be delivered), and the transfer unit 16 is rotated by 180 ° to rotate the arms 16b and 16c. The opening 16f formed in the transfer unit 16 in which the device enters and exits is made to face the probe card storage portion 12b of the transfer destination. During this time, the probe card PC housed in the transport unit 16 continues to be cooled by the gas supplied into the housing 16a (sealed or substantially closed space).

As described above, by closing the opening 16f with an air curtain instead of the physical door or shutter as in the prior art, the same effect as that of the wafer transfer operation example 1 can be obtained.

Next, the probe card holding arm 16c is advanced into the probe card storage unit 12b, and the probe card PC is returned into the probe card storage unit 12b.

In this way, the environment inside the transfer unit 16 is controlled (by cooling the probe card) by utilizing the time from the measurement unit 14 until the probe card is transferred into the probe card storage unit 12b of the transfer destination. By reducing the difference from the temperature of the probe card storage unit 12b of the above, it is possible to eliminate (or shorten) the waiting time for bringing the probe card closer to room temperature in the measuring unit 14 as compared with the conventional technique, and high temperature inspection. The probe card can be immediately taken out from the measuring unit 14 and returned to the probe card accommodating unit 12b after the above is completed. As a result, the throughput of the measuring unit 14 can be improved. Further, it is possible to eliminate (or shorten) the waiting time until the operator collects the probe card after storing the probe card.

<Probe card transfer operation example 3>
Next, an operation example in which the transfer unit 16 conveys the probe card PC from the probe card storage unit 12b (for example, room temperature 23 ° C.) to the measurement unit 14 where a low temperature inspection (for example, inspection temperature −10 ° C.) is performed. Will be described.

First, the transfer unit 16 is moved to a position where the probe card storage unit 12b can be accessed (a position where the probe card can be taken out), and the transfer unit 16 is rotated by 180 ° to allow the arms 16b and 16c to move in and out. The opening 16f formed in 16 faces the probe card storage portion 12b.

Next, the probe card holding arm 16c is advanced into the probe card storage unit 12b, and one probe card PC is taken out from the probe card storage unit 12b and stored in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transfer destination (here, the low temperature inspection at −10 ° C. performed in the measurement unit 14). Specifically, a gas whose temperature or humidity has been adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature has been adjusted to -15 ° C.) is supplied into the housing 16a and from an air injection port. An air curtain is formed which is injected and closes the opening 16f formed in the housing 16a. As a result, the inside of the housing 16a is closed or a substantially closed space. The target temperature at which the temperature control gas supply source adjusts the temperature is not limited to -15 ° C., and the distance and time during which the probe card PC is transported from the probe card storage unit 12b to the measurement unit 14 at the transfer destination and the measurement of the transfer destination are performed. The temperature can be set appropriately in consideration of the inspection temperature of the unit 14.

Next, the transfer unit 16 is moved to a position where the measurement unit 14 of the transfer destination can be accessed (a position where the probe card PC can be delivered), and the transfer unit 16 is rotated by 180 ° to move the arms 16b and 16c in and out. The opening 16f formed in the transport unit 16 is opposed to the measurement unit 14 at the transport destination. During this time, the probe card PC housed in the transport unit 16 continues to be cooled and dried by the gas supplied into the housing 16a (sealed or substantially closed space). As a result, it is possible to prevent dew condensation from occurring on the probe card PC while the probe card PC is being conveyed to the measurement unit 14 at the transfer destination.

Next, the probe card holding arm 16c is advanced into the measuring unit 14 through the opening 16f on the transport unit 16 side and the opening 14a on the measuring unit 14 side on which the air curtain is formed (see FIG. 7A). The probe card holding arm 16c, while holding the probe card PC, passes through the opening 16f in a state of being blocked by the air curtain and advances into the measuring unit 14. At that time, the probe card PC is further cooled and dried by the air curtain sprayed on the probe card PC. As a result, it is possible to prevent dew condensation from occurring on the probe card PC when the probe card PC is delivered.

As described above, by closing the opening 16f with an air curtain instead of the physical door or shutter as in the prior art, the same effect as that of the wafer transfer operation example 1 can be obtained.

Next, the holding portion 40a of the second probe card holding mechanism 40 receives the probe card PC from the probe card holding arm 16c and holds the probe card PC. Specifically, with the alignment device 38 holding the wafer chuck 18 cooled to the target temperature (here, the inspection temperature −10 ° C.) moved to the probe card receiving position P1, the holding portion 40a is moved to the Z axis. The movable portion 38a is raised in the Z-axis direction to abut the probe card PC (outer peripheral edge of the lower surface), and the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a rising in the Z-axis direction. As a result, the probe card PC is delivered to the holding portion 40a, and is held directly above the wafer chuck 18 by the holding portion 40a. During this time, the probe card PC is cooled by the wafer chuck 18 below it.

Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 cooled to the target temperature (here, the inspection temperature −10 ° C.) is moved to the position P2 (see FIG. 7B). During this time as well, the probe card PC is cooled by the wafer chuck 18 below it.

Next, the probe card PC is conveyed to the first probe card holding mechanism 36 (see FIG. 7B). Specifically, the Z-axis movable portion 38a (second probe) is in a state where the alignment device 38 holding the wafer chuck 18 cooled to the target temperature (here, the inspection temperature −10 ° C.) is moved to the position P2. By raising the card holding mechanism 40) in the Z-axis direction, the probe card PC held by the second probe card holding mechanism 40 is conveyed to the first probe card holding mechanism 36. The probe card PC conveyed to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36. During this time as well, the probe card PC is cooled by the wafer chuck 18 below it.

As described above, the probe card PC is not only cooled in the transfer unit 16, but also is delivered from the probe card holding arm 16c and held by the first probe card holding mechanism 36 until the wafer chuck 18 is held. Keeps cooling seamlessly.

As a result, even if it takes about 10 to several tens of seconds for the probe card PC cooled in the transfer unit 16 to be delivered from the probe card holding arm 16c and held by the first probe card holding mechanism 36, it is on the way. The probe card PC in the cooled state can be held by the first probe card holding mechanism 36 without raising the temperature of the probe card PC. A gas having a dew point (for example, dry air at 20 ° C.) that does not condense at the cooling temperature of the wafer or probe card is supplied into the measurement unit 14 at the transfer destination by a well-known means.

In this way, the environment inside the transfer unit 16 is controlled (by cooling the wafer) by utilizing the time from the probe card storage unit 12b to the transfer destination measurement unit 14 to transfer the probe card. By reducing the difference from the inspection temperature of the measuring unit 14, it is possible to shorten (or eliminate) the waiting time for bringing the probe card closer to the inspection temperature in the measuring unit 14 at the transfer destination as compared with the conventional technique. As a result, the throughput of the measuring unit 14 can be improved.

<Probe card transfer operation example 4>
Next, an operation example in which the probe card PC whose transfer unit 16 has been in a low temperature state (for example, −40 ° C.) by the low temperature inspection is conveyed from the measurement unit 14 to the probe card storage unit 12b (for example, room temperature 23 ° C.). Will be described.

First, the probe card PC immediately after the low temperature inspection is completed is taken out from the measuring unit 14 by the probe card holding arm 16c and stored in the housing 16a. This is performed in the reverse procedure of the probe card transfer operation example 3. At the same time, the environment inside the housing 16a is controlled so that the environment corresponds to the environment of the probe card storage unit 12b (here, the room temperature is 23 ° C.) of the transport destination. Specifically, a gas whose temperature or humidity has been adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature has been adjusted to 15 ° C.) is supplied into the housing 16a and injected from an air injection port. An air curtain is formed to close the opening 16f formed in the housing 16a. As a result, the inside of the housing 16a is closed or a substantially closed space. The target temperature at which the temperature control gas supply source adjusts the temperature is not limited to 15 ° C., the distance and time during which the probe card PC is transported from the measuring unit 14 to the probe card storage unit 12b at the transport destination, and the probe card at the transport destination. An appropriate temperature can be set in consideration of the temperature of the storage unit 12b and the like. Immediately after the low temperature inspection is completed, the probe card PC is held by the probe card holding arm 16c, passes through the opening 16f closed by the air curtain, is taken from the measuring unit 14, and is taken into the housing 16a. It is stored. At that time, the probe card PC is heated by the air curtain sprayed on the probe card PC, and is further heated by the gas supplied into the housing 16a. As a result, it is possible to prevent dew condensation from occurring on the probe card PC when the probe card PC is delivered.

Next, the transfer unit 16 is moved to a position where the probe card storage unit 12b of the transfer destination can be accessed (a position where the probe card PC can be delivered), and the transfer unit 16 is rotated by 180 ° to rotate the arms 16b and 16c. The opening 16f formed in the transfer unit 16 in which the device enters and exits is made to face the probe card storage portion 12b of the transfer destination. During this time, the probe card PC housed in the transport unit 16 continues to be heated by the gas supplied into the housing 16a (closed or substantially closed space). As a result, it is possible to prevent dew condensation from occurring on the probe card PC while the probe card PC is being conveyed to the probe card storage portion 12b.

As described above, by closing the opening 16f with an air curtain instead of the physical door or shutter as in the prior art, the same effect as that of the wafer transfer operation example 1 can be obtained.

Next, the probe card holding arm 16c is advanced into the probe card storage unit 12b, and the probe card PC is returned into the probe card storage unit 12b.

In this way, the environment inside the transfer unit 16 is controlled (by heating the probe card) by utilizing the time from the measurement unit 14 until the probe card is transferred into the probe card storage unit 12b of the transfer destination. By reducing the difference from the temperature of the probe card storage unit 12b of the above, it is possible to eliminate (or shorten) the waiting time for bringing the probe card closer to room temperature in the measuring unit 14 as compared with the conventional technique, and low temperature inspection. The probe card can be immediately taken out from the measuring unit 14 and returned to the probe card accommodating unit 12b after the above is completed. As a result, the throughput of the measuring unit 14 can be improved. Further, it is possible to prepare a temperature environment that prevents dew condensation from occurring on the probe card by the time the probe card is conveyed into the probe card storage portion 12b.

<Probe card transfer operation example 5>
Next, when the transfer unit 16 conveys the probe card PC from the probe card storage unit 12b (for example, room temperature 23 ° C.) to the measurement unit 14 where the inspection is performed in a predetermined gas (for example, nitrogen gas) atmosphere. An operation example will be described.

First, the transfer unit 16 is moved to a position where the probe card storage unit 12b can be accessed (a position where the probe card can be taken out), and the transfer unit 16 is rotated by 180 ° to allow the arms 16b and 16c to move in and out. The opening 16f formed in 16 faces the probe card storage portion 12b.

Next, the probe card holding arm 16c is advanced into the probe card storage unit 12b, and one probe card PC is taken out from the probe card storage unit 12b and stored in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transport destination (here, inspection under a predetermined gas (for example, nitrogen gas) atmosphere). Specifically, wiring exposed on the wafer surface (particularly copper wiring) and a gas for preventing oxidation of the probe of the probe card (for example, nitrogen gas) are supplied into the housing 16a, and an air injection port is provided. An air curtain is formed that closes the opening 16f formed in the housing 16a by being injected from. As a result, the inside of the housing 16a is closed or a substantially closed space.

Next, the transfer unit 16 is moved to a position where the measurement unit 14 of the transfer destination can be accessed (a position where the probe card PC can be delivered), and the transfer unit 16 is rotated by 180 ° to move the arms 16b and 16c in and out. The opening 16f formed in the transport unit 16 is opposed to the measurement unit 14 at the transport destination. During this time, the antioxidant gas continues to be supplied to the inside of the transport unit 16 (closed or substantially closed space). As a result, it is possible to prevent the probe card PC from being oxidized while the probe card PC is being conveyed to the measurement unit 14 at the transfer destination. An antioxidant gas is also supplied to the measuring unit 14 at the transport destination by a well-known means.

Next, the probe card holding arm 16c is advanced into the measuring unit 14 through the opening 16f on the transport unit 16 side and the opening 14a on the measuring unit 14 side on which the air curtain is formed. The probe card holding arm 16c, while holding the probe card PC, passes through the opening 16f in a state of being blocked by the air curtain and advances into the measuring unit 14. At that time, the probe card PC is prevented from being oxidized by the action of the air curtain.

As described above, by closing the opening 16f with an air curtain instead of the physical door or shutter as in the prior art, the same effect as that of the wafer transfer operation example 1 can be obtained.

After that, the probe card PC is conveyed to the first probe card holding mechanism 36 in the same procedure as the probe card conveying operation examples 1 and 3, and is detachably held by the first probe card holding mechanism 36.

In this way, the probe card is inspected in a predetermined gas (for example, nitrogen gas) atmosphere even during the period from the probe card storage unit 12b to the transfer destination measurement unit 14. Since the probe card is placed in the same environment as No. 14, the probe of the probe card is prevented from being oxidized during transportation and delivery.

It should be noted that this operation example 5 can also be carried out in combination with the probe card transfer operation examples 1 to 4.

As described above, according to the present embodiment, the transported object storage unit 12 and the plurality of measuring units 14 move to move the transported object (for example, at least one of the wafer and the probe card) to the transported object storage unit. In the prober 10 provided with the transfer unit 16 for conveying to the 12 or each measurement unit 14, it is possible to provide a prober capable of improving the throughput in each measurement unit 14.

In this method, the environment (for example, temperature and humidity) in the transport unit 16 (housing 16a) is controlled by utilizing the time until the transported object is transported to the transport destination (measurement unit 14 or the transported object storage unit 12). This is due to the fact that, as compared with the prior art, the waiting time for bringing the transported object closer to a predetermined temperature (for example, inspection temperature or normal temperature) in each measuring unit can be shortened (or eliminated). is there.

Further, according to the present embodiment, the environment inside the housing 16a, which is smaller than the entire prober 10, is controlled instead of controlling the environment of the entire prober 10, that is, the environment inside the housing 16a. Is locally controlled, so that energy saving can be realized as compared with the case of controlling the environment of the entire prober 10. Further, the amount of gas (dry air or nitrogen gas) supplied into the housing 16a can be reduced.

Further, according to the present embodiment, the installation area of the prober 10 can be minimized. In addition, the time for the transport unit 16 to access the transport material storage unit 12 or each measurement unit 14 can be minimized.

In this method, the transported object storage unit 12 and each measuring unit 14 are arranged at regular intervals in the Y direction with the surfaces accessed by the transport unit 16 facing each other (that is, facing each other). This is due to the fact that the transport unit 16 is arranged between the transport material storage unit 12 and each measurement unit 14.

Next, another embodiment of the transport unit 16 will be described.

FIG. 8 is a vertical cross-sectional view showing a schematic configuration of the transport unit 16 of another embodiment. The parts already described in FIG. 4 are designated by the same reference numerals and the description thereof will be omitted.

In the transport unit 16 shown in FIG. 8, the environmental control means 16d and the air curtain forming means 42 are separately provided. By providing the environmental control means 16d and the air curtain forming means 42 separately (independently) in this way, the operation of the environmental control means 16d and the air curtain forming means 42 can be performed independently. For example, the environment control means 16d controls the environment inside the housing 16a with warm air, and the air curtain forming means 42 independently operates the environment control means 16d and the air curtain forming means 42 so as to close the opening 16f with cold air. be able to. Further, when the environmental control means 16d and the air curtain forming means 42 are separately provided, the environmental control means 16d is provided on the upper surface inside the housing 16a, so that the environmental control means 16d is efficiently housing. The environment within 16a can be controlled. Further, when the environmental control means 16d and the air curtain forming means 42 are separately provided, the environmental control means 16d is more efficiently provided by providing the environmental control means 16d at substantially the center of the upper surface of the housing 16a. The environment within 16a can be controlled. Here, the substantially center means that it does not have to be a strict center, and it may be near the center or near the center.

Next, a modified example will be described.

In the present embodiment, the configuration in which the arms 16b and 16c of the transport unit 16 enter and exit through the opening 16f formed in the housing 16a is illustrated, but the present invention is not limited to this, and for example, the housing 16a of the transport unit 16 A similar opening (not shown) is formed on the surface opposite to the side on which the opening 16f is formed, and the arms 16b and 16c individually reciprocate in the horizontal direction to reciprocate the opening 16f and the opposite side. It may be configured to enter and exit through an opening. In this way, the transfer unit rotation mechanism 28 can be omitted. Then, even though the transport unit rotation mechanism 28 is omitted, that is, access to the transport object storage unit 12 or each measurement unit 14 by the arms 16b and 16c can be realized without rotating the transport unit 16. In this case, in addition to the air curtain forming means 42 for forming the air curtain that closes the opening 16f formed in the housing 16a of the transport unit 16, an air curtain that closes the opening formed on the opposite side of the opening 16f is provided. By providing the transport unit 16 with the same air curtain forming means to be formed, the inside of the housing 16a can be sealed or a substantially closed space, and the same effect as that of the above embodiment can be obtained.

Further, in the present embodiment, the configuration in which each measuring unit 14 is two-dimensionally arranged in the horizontal direction (X-axis direction) and the vertical direction (Z-axis direction) is illustrated, but the present invention is not limited to this, and each measuring unit 14 is not limited to this. May be arranged in only one row in the horizontal direction (X-axis direction), or may be arranged in only one row in the vertical direction (Z-axis direction). By arranging the measuring units 14 in only one row in the horizontal direction (X-axis direction), the second movable body moving mechanism can be omitted. Further, by arranging the measuring units 14 in only one row in the vertical direction (Z-axis direction), the first movable body moving mechanism can be omitted.

Further, in the present embodiment, the configuration using one transport unit 16 and one moving device 22 is illustrated, but the present invention is not limited to this, and a plurality of transport units 16 and a plurality of moving devices 22 may be used. By doing so, the throughput in each measuring unit 14 can be further improved.

Further, in the present embodiment, the configuration using the wafer holding arm 16b and the probe card holding arm 16c has been illustrated, but the present invention is not limited to this, and only the wafer holding arm 16b may be used, or only the probe card holding arm 16c may be used. You may use it.

Further, in the present embodiment, the configuration in which the transport unit 16 is provided with the arms 16b and 16c is illustrated, but the present invention is not limited to this, and the arms 16b and 16c (or each arm 16b and 16c) (or An arm corresponding to this) may be provided. Also by this, each arm can take out the transported object from the transported object storage unit 12 or the measuring unit 14 and store it in the transport unit 16, and also can take out the transported object from the transport unit 16 and store the transported object in the transported object storage unit 12 or It can be handed over to the measuring unit 14.

Further, in the present embodiment, the configuration in which the opening 16f formed in the housing 16a is closed by an air curtain is illustrated, but the present invention is not limited to this, and the opening 16f is opened when the transported object is taken out or delivered, and the transported object is opened. The transfer unit 16 may be provided with opening / closing means such as a shutter or a door that is closed during transportation, and the opening 16f may be opened / closed by the opening / closing means. Further, the opening 14a formed in each measurement unit 14 may be configured to be closed by the same air curtain, or the opening 14a may be opened and closed by the same opening opening / closing means.

As described above, the transport unit (housing) uses the time required to transport the transported object to the transport destination (measurement unit or transport object storage unit) so that the environment is suitable for the environment of the transport destination of the transported object. The idea of controlling the environment in) is not limited to the prober of the above embodiment, but moves between the transported object storage unit and the plurality of measuring units to transport the transported material into the transported material storage unit or the plurality of measuring units. It can be applied to a prober provided with all kinds of transport units (for example, the self-propelled chassis described in Japanese Patent Application Laid-Open No. 5-334497).

Although the prober of the present invention has been described in detail above, the present invention is not limited to the above examples, and it goes without saying that various improvements and modifications may be made without departing from the gist of the present invention. is there.

10 ... Prober, 12 ... Conveyed material storage, 12a ... Wafer storage, 12b ... Probe card storage, 14 ... Measuring unit, 14a ... Opening, 16 ... Conveying unit, 16a ... Housing, 16b ... Wafer holding arm, 16c ... Probe card holding arm, 16d ... Environmental control means, 16e ... Sensor, 16f ... Opening, 18 ... Wafer chuck, 20 ... Head stage, 22 ... Moving device, 24 ... First movable body, 26 ... Second movable body, 28 ... Transfer unit rotation mechanism, 28a ... Drive motor, 30, 32 ... Guide rail, 34 ... Base, CH ... Card holder, PC ... Probe card, W ... Wafer

Claims (4)

A transport unit that transports a transported object between the transported object storage unit and the measuring unit.
When transporting the transported object from either one of the transported object storage unit and the measuring unit to the other, environmental control for controlling the transporting environment of the transported object so that the transporting environment of the transported object approaches the other environment. Equipped with means
Transport unit. It has a housing for storing the transported object, and has a housing.
The environment control means controls the environment inside the housing as a transport environment for the transported object.
The transport unit according to claim 1. When the transported object is transported from the transported object storage unit to the measuring unit, the environmental control means controls the transport environment of the transported object according to the inspection temperature of the measuring unit.
The transport unit according to claim 1 or 2. Provided to a prober provided with the transported object storage unit and the measuring unit.
The transport unit according to any one of claims 1 to 3.

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