TWI619951B - Electronic component transfer device and electronic component inspection device - Google Patents

Abstract

The invention provides an electronic component conveying device and an electronic component inspection device which can increase the number of electronic components conveyed per unit time.

The electronic component conveying device of the present invention includes a conveying section that can arrange and convey a plurality of electronic components, a supply holding section that can hold a plurality of the electronic components and is disposed in the conveying section, and a supply and recovery holding section that A plurality of the above-mentioned electronic parts can be held and supplied and recovered; and the holding pitch of the electronic parts of the supply holding part can be adjusted to be the same as the placement pitch of the electronic parts of the conveying part, and the holding pitch of the electronic parts of the supply recovery holding part is greater than The electronic component is arranged at a pitch of the conveying section, the supply and holding section arranges the plurality of electronic components in the conveying section, and the supply and recovery holding section divides the plurality of electronic components from the conveying section into a plurality of times.

Description

Electronic component transfer device and electronic component inspection device

The invention relates to an electronic component conveying device and an electronic component inspection device.

There has been known an electronic component inspection device for inspecting the electrical characteristics of electronic components such as IC devices, and an electronic component transfer device for assembling an IC device to a holding portion of an inspection portion is assembled in the electronic component inspection device. . During the inspection of the IC device, the IC device is arranged on the holding portion, and a plurality of probe pins provided on the holding portion are brought into contact with each terminal of the IC device.

The above-mentioned electronic component transfer device includes the following components: an immersion board that heats or cools the IC device in advance to adjust the temperature suitable for checking the IC device; and a supply shuttle that transfers the IC device after the temperature of the immersion board is adjusted to Near the inspection department; the first device transfer head, which transfers the IC devices between the tray on which the IC devices are arranged and the dipping board, and the IC devices between the dipping board and the supply shuttle; IC device; the second device transfer head, which transfers the IC devices between the supply shuttle and the inspection section, and the IC device transfer between the inspection section and the recovery shuttle; and the third device transfer head, which performs the recovery shuttle Transportation of IC devices between the trays with the IC devices for recycling.

The first device transfer head, the second device transfer head, and the third device transfer head each include a plurality of hand assemblies holding IC devices. Further, each hand assembly includes a suction nozzle for sucking the IC device, and the suction nozzle is used to hold and hold the IC device 90 by suction. In addition, the supply shuttle and the recovery shuttle each have a plurality of pockets for arranging the IC devices, and the inspection section has a plurality of holding sections for arranging the IC devices.

In addition, Patent Document 1 discloses a device transfer device for an IC processing machine in which the head interval 90 of each head 81 of the multi-head head 80 can be adjusted.

In this device handling device for IC processing machine, the suction head interval 90 is set to N times the device receiving cavity interval 202 of the custom tray 100, and a plurality of devices under test (DUT) are suctioned / released at one time.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 8-264993

In the conventional electronic component transfer device, the distance between the holding portion of the inspection portion and the distance between the pockets of the supply shuttle was set to be the same. In this case, as long as the distance between the pockets of the supply shuttle is less than the maximum distance between the nozzles of the hand assembly of the first device transport head, the distance between the nozzles of the hand assembly of the first device transport head can be adjusted to The distance between the pockets of the supply shuttle is the same, and all the hand components of the first device transfer head simultaneously arrange the IC devices in the pockets of the supply shuttle.

However, in the case where the distance between the pockets of the supply shuttle is larger than the maximum distance between the nozzles of the hand components of the first device transfer head, all the hand components of the first device transfer head cannot simultaneously arrange the IC devices in the recesses of the supply shuttle. Therefore, the first device transfer head divides the IC device into a plurality of recesses arranged in the supply shuttle. Therefore, the number of IC devices transferred per unit time is reduced. The same applies to the third device transfer head.

Moreover, in the device transfer device for an IC processing machine described in Patent Document 1, although the multiple test heads 80 are used to adsorb / liberate a plurality of test devices at one time in a custom tray 100, the patent In Document 1, it is not described in which manner the plurality of holding sections in the inspection section are arranged in the plurality of devices under test. Therefore, in the device transfer device for an IC processor described in Patent Document 1, the number of IC devices transferred per unit time cannot be increased. the amount.

An object of the present invention is to provide an electronic component transfer device and an electronic component inspection device that can increase the number of electronic components transferred per unit time.

The present invention has been made to solve at least a part of the problems described above, and can be implemented as the following forms or application examples.

[Application Example 1]

The electronic component transfer device of the present invention is characterized by including: a transfer unit that can arrange and transfer a plurality of electronic parts; a supply holding unit that can hold a plurality of the above-mentioned electronic parts and is arranged in the transfer unit; and a supply recovery hold It can hold and supply and recover a plurality of the electronic parts; and the holding pitch of the electronic parts of the supply holding part can be adjusted to be the same as the placement distance of the electronic parts of the conveying part; the electronic parts of the supply and holding part can be adjusted. The holding pitch is greater than the electronic component placement pitch of the conveying section; the supply holding section arranges a plurality of the electronic components in the conveying section; the supply recovery holding section separates the plurality of electronic components from the conveying section into a plurality of times.

This can increase the number of electronic parts transferred per unit time.

[Application Example 2]

In the electronic component transfer device of the present invention, it is preferable that the supply and holding unit collectively arrange the plurality of the electronic components in the transfer unit.

This can increase the number of electronic parts transferred per unit time.

[Application Example 3]

In the electronic component transfer device of the present invention, it is preferable that the time from when the supply recovery holding portion is held to the placement of the electronic part is shorter than the time from when the supply holding portion is held from the placement to the placement of the electronic part.

This can increase the number of electronic parts transferred per unit time.

[Application Example 4]

In the electronic component conveying device of the present invention, it is preferable that the supply and holding portion can move in a direction in which the plurality of electronic components are arranged and a direction orthogonal to the direction in which the plurality of electronic components are arranged.

Thereby, the electronic component can be easily held.

[Application Example 5]

The electronic component transfer device of the present invention is characterized by including: a transfer unit that can arrange and transfer a plurality of electronic parts; and a recycling and holding unit that can hold the plurality of electronic parts arranged in the transfer unit and transfer the plurality of electronic parts from the transfer unit Take out; and supply a recycling holding part, which can hold and supply and recycle a plurality of the electronic parts; and the electronic part holding pitch of the recycling holding part can be adjusted to be the same as the electronic part configuration pitch of the transferring part; the above supply The electronic component holding pitch of the recycling holding portion is greater than the electronic component disposing pitch of the transferring portion; the supply recycling holding portion divides the plurality of electronic components into the transferring portion; the recycling holding portion separates the plurality of electronic components from The above-mentioned transfer section is taken out.

This can increase the number of electronic parts transferred per unit time.

[Application Example 6]

In the electronic component transfer device of the present invention, it is preferable that the above-mentioned recovery holding portion is to be restored. The plurality of electronic components are collectively taken out from the transfer unit.

This can increase the number of electronic parts transferred per unit time.

[Application Example 7]

In the electronic component transfer device of the present invention, it is preferable that the time from when the supply and recovery holding section self-holds to disposing the electronic component is shorter than the time from when the recovery holding section self-holds to disposing the electronic component.

This can increase the number of electronic parts transferred per unit time.

[Application Example 8]

In the electronic component transfer device of the present invention, it is preferable that the recovery holding portion is movable in a direction in which the plurality of electronic components are arranged and a direction orthogonal to the direction in which the plurality of electronic components are arranged.

Thereby, the electronic component can be easily held.

[Application Example 9]

In the electronic component transfer device of the present invention, it is preferable that a direction in which a plurality of the electronic components are arranged in the transfer portion is the same as a transfer direction of the transfer portion.

This can shorten the time required for the supply and recovery holding portion to arrange or take out electronic components.

[Application Example 10]

In the electronic component transfer device of the present invention, it is preferable that when the supply and recovery holding portion is arranged or taken out, the supply and recovery holding portion may be moved in a direction orthogonal to a direction in which a plurality of the electronic components are arranged. The transfer unit can move in a direction in which a plurality of the electronic components are arranged.

This can shorten the time required for the supply and recovery holding portion to arrange or take out electronic components.

[Application Example 11]

In the electronic component transfer device of the present invention, it is preferable that the electronic component transfer device is disposed in the transfer portion. When the distance between the plurality of electronic parts is set to a, and when the distance between the plurality of electronic parts held by the supply recovery holding section is set to b, b / a is an integer of 2 or more.

Thereby, the electronic parts can be arranged or taken out a minimum number of times when the electronic parts are arranged or taken out in the supply and recovery holding portion.

[Application Example 12]

In the electronic component transfer device of the present invention, it is preferable that the electronic component transfer device includes a holding portion capable of holding the electronic component; and the supply recovery holding portion can press the electronic component against the holding portion.

Thereby, the terminal of the electronic component can be electrically connected to the probe pin provided on the holding portion by pressing the electronic component by the holding portion for inspection.

[Application Example 13]

In the electronic component conveying device of the present invention, it is preferable that the supply recovery holding section and the conveying section are provided with two.

Thereby, the two conveying sections and the two supply recovery holding sections are mutually supplemented in time, and the number of electronic parts conveyed per unit time can be further increased.

[Application Example 14]

The electronic component inspection device of the present invention is characterized in that it includes: a conveying section that can arrange and convey a plurality of electronic components; a supply and holding section that can hold and hold a plurality of the electronic components and is arranged in the conveying section; and a supply and recovery holding section , Which can hold and supply a plurality of the above-mentioned electronic parts, and supply and recycle them; and an inspection section, which checks the above-mentioned electronic parts; and the holding pitch of the electronic parts supplied to the holding part can be adjusted to be the same as the placement pitch of the electronic parts of the above-mentioned transportation part ; The holding distance of the electronic parts supplied to the recovery holding part is larger than that of the conveying part. The sub-components are arranged at a pitch; the supply and holding section arranges the plurality of electronic components in the conveying section; and the supply and recovery holding section divides the plurality of electronic components into the conveying section in a plurality of times.

This can increase the number of electronic parts transferred per unit time. With this, the time during which the inspection section is not in operation can be reduced, and the number of inspections of electronic parts per unit time can be increased.

[Application Example 15]

The electronic component inspection device of the present invention is characterized in that it includes a transfer unit that can arrange and transfer a plurality of electronic parts, and a recycling and holding unit that can hold a plurality of the electronic parts arranged in the transfer unit and transfer the plurality of electronic parts from the transfer unit. Take out; supply a recycling holding unit that can hold and supply a plurality of the above-mentioned electronic parts to supply and recycle; and an inspection unit that checks the electronic parts; and the electronic part holding space of the recycling holding unit can be adjusted to the above-mentioned transfer unit The electronic component arrangement pitch is the same; the electronic component retention pitch of the supply recovery holding part is greater than the electronic part configuration pitch of the conveying part; the supply recovery holding part divides a plurality of the electronic parts into the transportation part; the recovery The holding unit takes out the plurality of electronic components from the transfer unit.

This can increase the number of electronic parts transferred per unit time. With this, the time during which the inspection section is not in operation can be reduced, and the number of inspections of electronic parts per unit time can be increased.

[Application Example 16]

In the electronic component inspection device of the present invention, it is preferable that the supply and recovery holding section can supply the electronic component to the inspection section and recover from the inspection section.

Thereby, the electronic parts can be supplied to the inspection unit for inspection by the supply recovery holding part, and after the inspection, the electronic parts can be recovered from the inspection part by the supply recovery holding part.

1‧‧‧Inspection device (electronic parts inspection device)

1-1 ~ 1-7‧‧‧step

2-1 ~ 2-7‧‧‧step

6‧‧‧Operation Department

11A‧‧‧The first pallet transfer mechanism

11B‧‧‧Second pallet transfer mechanism

12‧‧‧Temperature adjustment section (dipping board)

13‧‧‧The first device transfer head

14‧‧‧ Device Supply Department (Supply Shuttle)

15‧‧‧3rd pallet transfer mechanism

16‧‧‧ Inspection Department

17‧‧‧ 2nd device transfer head

18‧‧‧Device Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧ 3rd device transfer head

21‧‧‧The 6th pallet transfer mechanism

22A‧‧‧4th pallet transfer mechanism

22B‧‧‧5th pallet transfer mechanism

61‧‧‧Input Department

62‧‧‧Display

80‧‧‧Control Department

90‧‧‧IC device

131‧‧‧hand assembly

132‧‧‧Nozzle

141‧‧‧Dent

161‧‧‧holding department

175‧‧‧hand assembly

176‧‧‧Nozzle

181‧‧‧Dent

200‧‧‧tray

201‧‧‧hand assembly

2) 2‧‧‧ Nozzle

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ Inspection area

A4‧‧‧device recycling area (recycling area)

A5‧‧‧Tray removal area

R1‧‧‧Room 1

R2‧‧‧Room 2

R3‧‧‧Room 3

P1 ~ P6‧‧‧Pitch

P11 ~ P16‧‧‧Pitch

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

FIG. 1 is a schematic plan view showing a first embodiment of the electronic component inspection apparatus of the present invention.

FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. 1. FIG.

FIG. 3 is a plan view showing a main part of an inspection section of the electronic component inspection apparatus shown in FIG. 1. FIG.

FIG. 4 is a cross-sectional view showing a main part of an inspection section of the electronic component inspection apparatus shown in FIG. 1. FIG.

FIG. 5 is a cross-sectional view showing a main part of a device supply section of the electronic component inspection apparatus shown in FIG. 1. FIG.

FIG. 6 is a cross-sectional view showing a main part of a device recovery section of the electronic component inspection apparatus shown in FIG. 1. FIG.

FIG. 7 is a cross-sectional view showing a main part of a second device transfer head of the electronic component inspection apparatus shown in FIG. 1. FIG.

FIG. 8 is a cross-sectional view showing a main part of a first device transfer head of the electronic component inspection apparatus shown in FIG. 1. FIG.

FIG. 9 is a cross-sectional view showing a main part of a third device transfer head of the electronic component inspection apparatus shown in FIG. 1. FIG.

10 (a) and 10 (b) are diagrams for explaining the operation of the electronic part inspection device shown in FIG. 1 and the conventional electronic part inspection device.

11 (a) and (b) are diagrams for explaining the operation of the electronic component inspection device shown in FIG. 1 and the conventional electronic component inspection device.

12 (a) and 12 (b) are diagrams for explaining the operation of the electronic component inspection device shown in FIG. 1 and the conventional electronic component inspection device.

13 (a) and (b) are diagrams for explaining the operation of the electronic component inspection device shown in FIG. 1 and the conventional electronic component inspection device.

14 (a) and 14 (b) are diagrams for explaining the operation of the electronic part inspection device shown in FIG. 1 and the conventional electronic part inspection device.

15 (a) and (b) are diagrams for explaining the operation of the electronic part inspection device shown in FIG. 1 and the conventional electronic part inspection device.

16 (a) and 16 (b) are diagrams for explaining the operation of the electronic part inspection device shown in FIG. 1 and the conventional electronic part inspection device.

FIG. 17 is a graph showing the time required for the operation of the electronic part inspection device shown in FIG. 1 and the previous electronic part inspection device.

Fig. 18 is a schematic plan view showing a second embodiment of the electronic component inspection device of the present invention.

Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the embodiments shown in the attached drawings.

<First Embodiment>

FIG. 1 is a schematic plan view showing a first embodiment of the electronic component inspection apparatus of the present invention. FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 3 is a plan view showing a main part of an inspection section of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 4 is a cross-sectional view showing a main part of an inspection section of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 5 is a cross-sectional view showing a main part of a device supply section of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 6 is a cross-sectional view showing a main part of a device recovery section of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 7 is a cross-sectional view showing a main part of a second device transfer head of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 8 shows the first device moving of the electronic component inspection apparatus shown in FIG. 1. FIG. Sectional view of the main part of the feed head. FIG. 9 is a cross-sectional view showing a main part of a third device transfer head of the electronic component inspection apparatus shown in FIG. 1. FIG. 10 to 16 are diagrams for explaining operations of the electronic component inspection device shown in FIG. 1 and the conventional electronic component inspection device, respectively. FIG. 17 is a graph showing the time required for the operation of the electronic part inspection device shown in FIG. 1 and the previous electronic part inspection device. Fig. 18 is a schematic plan view showing a second embodiment of the electronic component inspection device of the present invention.

In the following, for convenience of explanation, as shown in FIG. 1, the three axes that are orthogonal to each other are the X axis, the Y axis, and the Z axis (the same is true for FIG. 18). The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Further, a direction parallel to the X axis is also referred to as "X direction", a direction parallel to the Y axis is also referred to as "Y direction", and a direction parallel to the Z axis is also referred to as "Z direction". The directions of the arrows of the X-axis, Y-axis, and Z-axis are referred to as positive sides, and the directions opposite to the arrows are referred to as negative sides. The upstream side in the direction of transport of electronic components is also simply referred to as the "upstream side", and the downstream side is also simply referred to as the "downstream side". In addition, the "horizontal" mentioned in this specification is not limited to a complete level, and includes a state inclined slightly (for example, less than about 5 °) with respect to the level as long as it does not hinder the transportation of electronic components.

In the following, for convenience of explanation, the upper side in FIG. 4 to FIG. 9 is referred to as “upper” or “upper”, the lower side is referred to as “down” or “lower”, the right side is referred to as “right”, and the left side is referred to as "left".

In addition, in FIG. 10 to FIG. 16, for the sake of easy understanding, the same reference numerals as those of the inspection apparatus 1 of this embodiment are also given to the previous inspection apparatus.

The inspection device (electronic parts inspection device) 1 shown in Fig. 1 is used for inspection. Test (hereinafter referred to as "inspection") IC devices such as BGA (Ball grid array) package or LGA (Land grid array) package, LCD (Liquid Crystal Display), CIS (CMOS Image Sensor: CMOS image sensor) and other electronic components of electronic devices. In addition, in the following, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component for inspection will be representative. This IC device will be described as "IC device 90".

As shown in FIG. 1, the inspection device 1 is divided into the following: a tray supply area A1, a device supply area (hereinafter referred to as the "supply area") A2, an inspection area A3, and a device recovery area (hereinafter referred to as the "recycling area") A4 , And the tray removal area A5. These areas are separated from each other by a wall portion or a gate, etc., which are not shown. Therefore, the supply area A2 becomes the first room R1 divided by the wall portion or the gate, and the inspection area A3 becomes the second room R2 divided by the wall portion or the gate. The recovery area A4 becomes the wall or gate. The third room R3 is divided by the gate and other areas. The first room R1 (supply area A2), the second room R2 (inspection area A3), and the third room R3 (recovery area A4) are each configured to ensure airtightness and thermal insulation. Thereby, the first room R1, the second room R2, and the third room R3 can maintain humidity and temperature as much as possible. In addition, the first room R1 and the second room R2 can be controlled to a specific humidity and a specific temperature, respectively.

The IC device 90 passes through each of the above-mentioned areas in order from the tray supply area A1 to the tray removal area A5, and is inspected in the inspection area A3 in the middle. According to this, the inspection apparatus 1 is formed to include an electronic component transporting apparatus that transports the IC device 90 and the control unit 80 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and inspection control (not shown). unit. In addition, the inspection device 1 has a configuration other than the inspection unit 16 and the inspection control unit to constitute an electronic component conveying device.

The tray supply area A1 is an area where trays 200 in which a plurality of IC devices 90 are arranged in an unchecked state are supplied. In the tray supply area A1, a plurality of trays 200 may be arranged in an overlapping manner.

The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3, respectively. A first tray transfer mechanism 11A and a second tray transfer mechanism 11B are provided so as to straddle the tray supply area A1 and the supply area A2.

In the supply area A2, a temperature adjustment section (dip plate) 12, which is an arrangement section where the IC device 90 is arranged, a first device transfer head (supply holding section) 13, and a third tray transfer mechanism are provided. 15.

The temperature adjustment section 12 is a device that heats or cools the plurality of IC devices 90, and adjusts (controls) the devices suitable for checking the temperature of the IC devices 90. That is, the temperature adjustment unit 12 is a temperature control member (component) that can arrange the IC device 90 and perform both heating and cooling of the IC device 90. In the configuration shown in FIG. 1, two temperature adjustment sections 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in (carried in) from the tray supply area A1 by the first tray transfer mechanism 11A is transferred to any one of the temperature adjustment units 12 and placed.

The first device transfer head 13 is supported in the supply area A2 so as to be movable in the X direction (the first direction), the Y direction (the third direction), and the Z direction (the second direction). With this, the first device transfer head 13 can transfer the IC device 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the IC between the temperature adjustment section 12 and the device supply section 14 described later. Transport of device 90.

As shown in FIG. 8, the first device transfer head 13 includes a plurality of hand assemblies 131 as holding parts for holding the IC device 90. The number of such hand assemblies 131 may be plural, and it is not particularly limited. In this embodiment, the case of eight is described as an example. Furthermore, the eight hand assemblies 131 are arranged in a matrix form with four in the X direction and two in the Y direction. Therefore, in FIG. 8, only the four hand assemblies 131 arranged in a row in the X direction can be seen. Since the configuration of each of the hand units 131 is the same, one hand unit 131 will be representatively described below. In addition, in the description of the operation, four hand assemblies 131 that can be seen are representatively described. The hand unit 131 includes a suction nozzle 132 and is held by holding the IC device 90. That is, the hand assembly 131 is in a state in which the IC device 90 is disposed at the front end of the suction nozzle 132, and a pump (not shown) is driven to suck air (fluid), and the inner cavity of the suction nozzle 132 is set to a negative pressure state. The front end of the suction nozzle 132 holds (adsorbs and holds) the IC device 90. In addition, by driving other pumps (not shown) to supply air (fluid), the negative pressure state of the inner cavity of the suction nozzle 132 is released, and the IC device 90 held by the suction nozzle 132 is released.

In addition, the distance between the hand units 131 (holding distance of electronic parts) P5 is adjustable, and it is appropriate To adjust. In the present embodiment, for the inspection unit 16 and the device supply unit 14, the distance P5 between the hand assemblies 131 is adjusted (set) to the distance between the holding portions 161 of the inspection unit 16 (electronic component placement pitch) P1 and the second device. The distance between the suction nozzles 176 of the hand assembly 175 of the transfer head 17 (the electronic component holding distance) P4 (b) is 1/2, and the distance from the cavity 141 of the device supply section 14 (the electronic component placement distance) P2 (a) The same situation will be described.

The third tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in the state after removing all the IC devices 90 in the X direction. Then, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transfer mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, a device supply section (supply shuttle) 14, a check section 16, and a second device transfer head (supply recovery holding section) 17 as a transfer section (supply transfer section) capable of arranging and transferring IC devices 90 are provided. And a device recovery section (recovery shuttle) 18 as a transfer section (recovery transfer section) that can arrange and transport the IC devices 90.

The device supply section 14 includes a configuration board on which the IC device 90 is arranged, and a device supply section body that is movable in the X direction, and the configuration board is detachably provided on the device supply section body. This device supply unit 14 is a device that transports the IC device 90 after temperature adjustment (temperature control) to the vicinity of the inspection unit 16 and is movably supported between the supply area A2 and the inspection area A3 in the X direction. The IC device 90 on the temperature adjustment unit 12 is transferred to the device supply unit 14 by the first device transfer head 13 and placed thereon. In addition, in the device supply section 14, similarly to the temperature adjustment section 12, a plurality of IC devices 90 may be heated or cooled to be adjusted to a temperature suitable for inspecting the IC devices 90.

If the device supply portion 14 is described in more detail, as shown in FIG. 5, a cavity (electronic component placement portion) 141 is provided on the upper surface of the device supply portion 14 as a plurality of recesses for accommodating (arranging) the IC device 90. . Each of the IC devices 90 is housed in each of the recesses 141, and is thereby placed in the device supply unit 14.

The shape, size (size), and arrangement (position) of each pocket 141 are set according to the shape, size (size) of the IC device 90 to be inspected, and the arrangement of the holding portion 161 of the inspection portion 16. In the present embodiment, a case where the distance P2 between the pockets 141 is set to be 1/2 of the distance P1 between the holding portion 161 of the inspection unit 16 and the distance P4 between the suction nozzles 176 of the hand unit 175 will be described.

In addition, although the magnitude relationship between the pitch P2 (a), the pitch P1, and the pitch P4 (b) is not particularly limited as long as the pitch P1 and the pitch P4 are larger than the pitch P2, P1 / P2 and P4 (b) / P2 (a) It is preferably an integer of 2 or more.

In addition, in this embodiment, when viewed from the Z direction in FIG. 1, the outer shape of the cavity 141 is a shape corresponding to the outer shape of the IC device 90, that is, a quadrangle.

The number of the recesses 141 is not particularly limited as long as the number of the recesses 141 is plural. In this embodiment, a case of eight (4 × 2) will be described as an example. In addition, four recesses 141 are arranged in a matrix in the X direction and two in the Y direction. Therefore, in FIG. 5, only the four recesses 141 arranged in a row in the X direction can be seen. In the description of the operation, four recesses 141 that can be seen are representatively described.

Inspection Department 16 Department inspection. A component that tests the electrical characteristics of the IC device 90, that is, a component that holds the IC device 90 when the IC device 90 is inspected. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while maintaining the state of the IC device 90. Then, the terminals of the IC device 90 are electrically connected (contacted) with the probe pins, and the inspection of the IC device 90 is performed through the probe pins. The inspection of the IC device 90 is performed based on a program stored in a memory section of an inspection control section provided in a tester (not shown) connected to the inspection section 16. In addition, in the inspection section 16, similarly to the temperature adjustment section 12, the plurality of IC devices 90 may be heated or cooled to adjust the temperature suitable for inspecting the IC devices 90.

If the inspection section 16 is described in more detail, as shown in FIG. 3 and FIG. 4, on the upper surface of the inspection section 16, a holding section (electronic component placement section) is provided as a plurality of recesses for accommodating (holding) the IC device 90. 161. Each of the IC devices 90 is housed in each of the holding portions 161 and is thereby arranged in the inspection portion 16.

The shape, size (size), and arrangement (position) of each holding portion 161 are set according to the shape, size (size), and the like of the IC device 90 to be inspected. In this embodiment, the holding portion 161 is The distance P1 is set to be the same as the distance P4 between the suction nozzles 176 of the hand unit 175 of the second device transfer head 17.

In addition, in this embodiment, the outer shape of the IC device 90 is a quadrangle when viewed from the Z direction in FIG. 1 (in a plan view). Therefore, the outer shape of the holding portion 161 has a shape corresponding to the outer shape of the IC device 90, that is, a quadrangle.

The number of the holding portions 161 is not particularly limited as long as it is plural. In the present embodiment, a case of eight will be described as an example. In addition, four holding portions 161 are arranged in a matrix form in the X direction and four in the Y direction. In addition, in the description of the operation, four holding portions 161 arranged in one line in the X direction will be representatively described.

The second device transfer head 17 is supported in the inspection area A3 so as to be movable in the Y direction and the Z direction. In addition, the second device transfer head 17 can transfer and place the IC devices 90 on the device supply section 14 carried in from the supply area A2 to the inspection section 16 and can also transfer the IC devices 90 on the inspection section 16 to It is placed on the device recovery unit 18. When the IC device 90 is inspected, the second device transfer head 17 presses the IC device 90 toward the inspection section 16, and thereby the IC device 90 is brought into contact with the inspection section 16. Thereby, as described above, the terminals of the IC device 90 and the probe pins of the inspection section 16 are electrically connected.

As shown in FIG. 7, the second device transfer head 17 includes a plurality of hand assemblies 175 as holding portions for holding the IC device 90. The number of such hand assemblies 175 is not particularly limited as long as they are plural. In the present embodiment, the case of eight is described as an example. In addition, four hand assemblies 175 are arranged in a matrix in the X direction and two are arranged in the Y direction. Therefore, in FIG. 7, only the four hand assemblies 175 arranged in a row in the X direction can be seen. Since the configuration of each hand unit 175 is the same, one hand unit 175 will be representatively described below. In addition, in the description of the operation, four hand assemblies 175 that can be seen are representatively described. The hand unit 175 includes a suction nozzle 176 and holds the IC device 90 by suction. That is, the hand assembly 175 is in a state where the IC device 90 is arranged at the front end of the suction nozzle 176, and a pump (not shown) is driven to suck air (fluid), and the inner cavity of the suction nozzle 176 is set to a negative pressure state, and Hold the front end of the suction nozzle 176 (suction With holding) IC device 90. In addition, by driving other pumps (not shown) to supply air (fluid), the negative pressure state of the inner cavity of the suction nozzle 176 is released, and the IC device 90 held by the suction nozzle 176 is released.

The distance P1 between the hand units 175 (electronic component holding distance) P4 and the holding portion 161 of the inspection unit 16 is set to be the same.

In addition, in each of the hand assemblies 175, similarly to the temperature adjustment unit 12, the plurality of IC devices 90 can be heated or cooled to be adjusted to a temperature suitable for inspecting the IC devices 90.

The device recovery section 18 includes a configuration board on which the IC device 90 is disposed, and a device recovery section body that can be moved in the X direction, and the configuration board is detachably provided on the device recovery section body. The device recovery section 18 is a device that transports the IC device 90 after the inspection by the inspection section 16 to the recovery area A4, and is movably supported between the inspection area A3 and the recovery area A4 in the X direction. The IC device 90 on the inspection section 16 is transferred to the device recovery section 18 by the second device transfer head 17 and placed.

If the device recovery section 18 is described in more detail, as shown in FIG. 6, a recess (electronic component configuration section) 181 is provided on the upper surface of the device recovery section 18 as a plurality of recesses for accommodating (arranging) the IC device 90. . Each of the IC devices 90 is housed in each of the recesses 181, and is thereby placed in the device recovery unit 18.

The shape, size (size), and arrangement (position) of each recess 181 are set according to the shape, size (size) of the IC device 90 to be inspected, and the arrangement of the holding portion 161 of the inspection portion 16. In the present embodiment, the case where the distance between the pockets 181 (the disposition pitch of the electronic components) P3 is set to be 1/2 of the distance between the holding portion 161 of the inspection section 16 and the distance P1 between the suction nozzle 176 of the hand assembly 175 Instructions.

In addition, although the magnitude relationship between the pitch P3 (a), the pitch P1, and the pitch P4 (b) is not particularly limited as long as the pitch P1 and the pitch P4 are larger than the pitch P3, P1 / P3 and P4 (b) / P3 (a) It is preferably an integer of 2 or more.

In addition, in this embodiment, when viewed from the Z direction in FIG. 1, the outer shape of the cavity 181 is a shape corresponding to the outer shape of the IC device 90, that is, a quadrangle.

The number of the recesses 181 is not particularly limited as long as the number of the recesses 181 is plural. In this embodiment, a case of eight (4 × 2) will be described as an example. In addition, four recesses 181 are arranged in a matrix in the X direction and two in the Y direction. Therefore, in FIG. 6, only four recesses 181 arranged in a row in the X direction can be seen. In the description of the operation, four recesses 181 that can be seen are typically described.

The recovery area A4 is an area of the IC device 90 after the recovery inspection is completed. In this collection area A4, a collection tray 19, a third device transfer head (recovery holding portion) 20, and a sixth tray transfer mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

The collection trays 19 are fixed in the collection area A4, and in the configuration shown in FIG. 1, three collection trays are arranged in the X direction. Three empty trays 200 are also arranged in the X direction. Then, the IC device 90 on the device recovery section 18 moved to the recovery area A4 is transported to one of these recovery trays 19 and the empty tray 200 and placed. Thereby, the IC device 90 is collected and classified based on the inspection result.

The third device transfer head 20 is supported in the recovery area A4 so as to be movable in the X direction, the Y direction, and the Z direction. Thereby, the third device transfer head 20 can transfer the IC device 90 from the device collection unit 18 to the collection tray 19 or the empty tray 200.

As shown in FIG. 9, the third device transfer head 20 includes a plurality of hand assemblies 201 as holding parts for holding the IC device 90. The number of such hand assemblies 201 is not particularly limited as long as there are a plurality of them. In this embodiment, the case of eight will be described as an example. Furthermore, eight hand assemblies 201 are arranged in a matrix in four directions in the X direction and two are arranged in the Y direction. Therefore, in FIG. 9, only four hand assemblies 201 arranged in a row in the X direction can be seen. Since the configuration of each hand unit 201 is the same, one hand unit 201 will be representatively described below. In addition, in the description of the operation, four hand assemblies 201 that can be seen are representatively described. The hand unit 201 includes a suction nozzle 202, and the IC device 90 is held by suction. That is, the hand assembly 201 is in a state where the IC device 90 is arranged at the front end of the suction nozzle 202, and a pump (not shown) is driven to suck air (fluid), and the inner cavity of the suction nozzle 202 is set to a negative pressure state, and the Hold the front end of the nozzle 202 (suction With holding) IC device 90. In addition, the air (fluid) is supplied by driving another pump (not shown) to release the negative pressure state of the inner cavity of the suction nozzle 202, and the IC device 90 held by the suction nozzle 202 is released.

In addition, the distance between the hand assemblies 201 (holding distance of electronic parts) P6 is adjustable, and has been adjusted appropriately. In this embodiment, for the inspection unit 16 and the device recovery unit 18, the distance P6 between the hand units 201 is adjusted (set) to the distance P1 between the holding unit 161 of the inspection unit 16 and the hand unit of the second device transfer head 17. A description will be given of a case where the distance between the suction nozzles 176 of 175 is 1/2 of the distance P4 and the distance between the suction holes 176 of the device recovery portion 18 is the same as the distance P3 (a).

The sixth tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction. Then, after the conveyance, the tray 200 is arranged at the position where the IC devices 90 are collected, and may be any one of the three empty trays 200 described above.

The tray removal area A5 is an area where the trays 200 on which the plurality of IC devices 90 of the inspection completion state are arranged are recovered and removed. In the tray removal area A5, a plurality of trays 200 may be arranged to overlap.

Further, a fourth tray conveyance mechanism 22A and a fifth tray conveyance mechanism 22B that convey the tray 200 one by one are provided so as to span the recovery area A4 and the tray removal area A5. The fourth tray transfer mechanism 22A is a mechanism that transfers the tray 200 on which the IC devices 90 having been inspected are placed from the recovery area A4 to the tray removal area A5. The fifth tray transfer mechanism 22B is a mechanism that transfers the empty tray 200 for recycling the IC devices 90 from the tray removal area A5 to the collection area A4.

The inspection control section of the tester performs, for example, inspection of the electrical characteristics of the IC device 90 arranged in the inspection section 16 based on a program stored in a memory section (not shown).

As shown in FIG. 2, the inspection device 1 includes a control unit 80 and an operation unit 6 that is electrically connected to the control unit 80 and performs each operation of the inspection device 1. The control unit 80 controls, for example, the first tray transfer mechanism 11A, the second tray transfer mechanism 11B, the temperature adjustment unit 12, the first device transfer head 13, the device supply unit 14, the third tray transfer mechanism 15, the inspection unit 16, and the second Device transfer head 17, device recovery unit 18, third device transfer head 20, and sixth tray transfer mechanism 21. The driving of each unit such as the fourth tray conveyance mechanism 22A, the fifth tray conveyance mechanism 22B, and the display portion 62.

The operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard and a mouse. The display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel. The operation of the operation unit 6 of the operator (operator) is performed by, for example, operating the input unit 61 by moving the cursor to the position of each operation button (icon) displayed on the display unit 62 and selecting (clicking) it.

The input unit 61 is not limited to the one described above, and examples include a mechanical operation button such as a push button. In addition, the operation unit 6 is not limited to the one described above, and examples thereof include a device capable of inputting and displaying an image, such as a touch panel. The display unit 62 of the operation unit 6 constitutes a notification unit.

Next, the operation when the IC device 90 is transported by the inspection device 1 will be described.

In order to facilitate understanding, the operation of the conventional inspection device when the IC device 90 is transported will be described.

The premise is that the distance P1 between the holding portion 161 of the inspection portion 16 of the inspection device 1 and the suction nozzle 176 of the hand assembly 175 of the second device transfer head 17 is greater than the distance P4 of the hand assembly 131 of the first device transfer head 13. The maximum distance between the suction nozzle 132 and P5, and the maximum distance between the suction nozzle 202 and the nozzle 202 of the hand assembly 201 of the third device transport head 20. In this case, the inspection device 1 can increase the IC device 90 that is transported on average per unit time. Of quantity.

First, the dimensions of the various parts of the inspection device 1 of the present embodiment are as described above, and the distance P4 between the holding portion 161 of the inspection portion 16 and the suction nozzle 176 of the hand assembly 175 of the second device transfer head 17 is set to be the same. . In addition, P1 and P4 are set to 60 mm, for example.

Further, the distance P3 between the recesses 141 of the device supply unit 14 and the distance P3 between the recesses 181 of the device recovery unit 18, the distance P5 between the suction nozzles 132 of the hand assembly 131 of the first device transfer head 13, and the third device transfer head. The distance between the nozzles 202 of the hand assembly 201 of 20 is the same as P6, and the intervals are P2, P3, P5 and P6 are 1/2 of the pitches P1 and P4. The P2, P3, P5, and P6 are set to, for example, 30 mm.

On the other hand, as shown in FIG. 10 (b), the dimensions of each part of the previous inspection device are separated from the cavity 141 of the device supply unit 14 by P12, the distance of the holding portion 161 of the inspection unit 16 by P11, and the device recovery unit. The distance P13 between the recesses 181 of 18 and the distance P14 between the suction nozzles 176 of the hand assembly 175 of the second device transfer head 17 are set to be the same. The P11, P12, P13, and P14 are set to, for example, 60 mm.

In addition, the distance P15 between the suction nozzles 132 of the hand assembly 131 of the first device transfer head 13 and the nozzle P202 between the suction assembly 132 of the hand assembly 201 of the third device transfer head 20 is the same, and the distances P15 and P16 are the distance P11 , P12, P13 and 1/2 of P14. The P15 and P16 are set to, for example, 30 mm.

First, the operation of the conventional inspection device will be described.

[Step 2-1]

In the previous inspection device, as shown in FIG. 10 (b), the first device transfer head 13 holds the IC device 90 disposed on the temperature adjustment section 12 by each hand assembly 131, and moves it toward the positive side in the Z direction. Move at least one of the X direction and the Y direction, that is, above the device supply section 14, and then move to the negative side of the Z direction, and arrange two IC devices 90 of the four IC devices 90 on the device supply section 14. Two of the four recesses 141. Set the time required for this step 2-1 to "1". In addition, the above-mentioned required time is not marked with units such as "second", but is displayed as a relative value, and is not a strict value, but a rough value.

[Step 2-2]

Next, as shown in FIG. 11 (b), the first device transfer head 13 moves toward the positive side in the Z direction, moves toward the positive side in the X direction, and then moves toward the negative side in the Z direction, and arranges the remaining two IC devices 90 on the The remaining two recesses 141 of the device supply section 14. The time required for this step 2-2 is "1". In this way, in the previous inspection device, the first device transfer head 13 divided the four (plural) IC devices 90 held therein into two (plural) positions and placed them in the pockets of the device supply unit 14. 141.

[Step 2-3]

Next, as shown in FIG. 12 (b), the device supply unit 14 moves to the positive side in the X direction, that is, below the second device transfer head 17. The time required in this step 2-3 is "0.5".

[Step 2-4]

Next, as shown in FIG. 13 (b), the second device transfer head 17 moves to the negative side in the Z direction, and holds (removes) each IC device 90 disposed in the device supply section 14 with each hand assembly 175, and moves it toward Z Move in the positive direction and move in the negative direction in the Y direction, that is, move each IC device 90 above the holding portions 161 of the inspection section 16 and then move it in the negative direction of the Z direction to arrange each IC device 90 in the inspection section. 16 的 each holding portion 161. The time required in this step 2-4 is "0.5". As described above, in the conventional inspection device, the second device transfer head 17 collectively takes out the four IC devices 90 from the recesses 141 of the device supply section 14 and collectively arranges them in the holding sections 161 of the inspection section 16.

Furthermore, the inspection of each IC device 90 is performed by the inspection unit 16 while pressing each IC device 90 toward each holding portion 161 by the second device transfer head 17.

[Step 2-5]

Next, as shown in FIG. 14 (b), the second device transfer head 17 holds the IC device 90 disposed in each holding portion 161 of the inspection portion 16 by each hand assembly 175, and moves toward the positive side in the Z direction and toward Y Moving in the positive direction, that is, above the device recovery unit 18 and then moving in the negative direction of the Z direction, each IC device 90 is disposed in each of the recesses 181 of the device recovery unit 18. The time required for this step 2-5 is "0.5". As described above, in the previous inspection device, the second device transfer head 17 took out the four IC devices 90 collectively from the holding portions 161 of the device inspection portion 16 and placed them collectively in the recesses 181 of the device recovery portion 18.

[Step 2-6]

Next, as shown in FIG. 15 (b), the device recovery unit 18 moves to the positive side in the X direction.

Then, the third device transfer head 20 moves in at least one of the X direction and the Y direction, That is, it moves above the device recycling section 18, and then moves to the negative side in the Z direction. With 4 of the 4 hand modules 201, 2 of the 4 IC devices 90 held in the device recycling section 18 are held. IC device 90. The time required for this step 2-6 is "1".

[Step 2-7]

Next, as shown in FIG. 16 (b), the third device transfer head 20 moves to the positive side of the Z direction, moves to the positive side of the X direction, and then moves to the negative side of the Z direction, and holds the other two of the device recovery unit 18. IC 装置 90. The time required for this step 2-7 is "1". As described above, in the conventional inspection device, the third device transfer head 20 separates the four IC devices 90 arranged in the device recovery section 18 into two times.

Further, the third device transfer head 20 transfers each IC device 90 to one of the collection tray 19 and the empty tray 200 based on the detection result.

Here, the time for the second device transfer head 17 to hold the IC device 90 is shorter than the time for the first device transfer head 13 to hold the IC device 90. One of the reasons is that the first device transfer head 13 moves not only in the Z direction but also in the X direction when the IC device 90 is disposed in the device supply unit 14 in the first device transfer head 13 and is transferred in the second device. When the head 17 removes the IC device 90 from the device supply section 14 and when the IC device 90 is disposed in the device recovery section 18, the second device transfer head 17 moves in the Z direction, but in the X direction, the device supply section 14 and the device recovery The section 18 moves.

Similarly, the time for the second device transfer head 17 to hold the IC device 90 is shorter than the time for the third device transfer head 20 to hold the IC device 90. One of the reasons is that the third device transfer unit 20 moves not only in the Z direction but also in the X direction when the IC device 90 is disposed in the device recovery unit 18 in the third device transfer head 20, and is in the second device. When the transfer head 17 removes the IC device 90 from the device supply section 14 and when the IC device 90 is placed in the device recovery section 18, the second device transfer head 17 moves in the Z direction, but in the X direction, the device supply section 14 and the device The collection unit 18 moves.

However, in the previous inspection apparatus, four ICs were transferred to the second device transfer head 17. The device 90 is taken out from each holding section 161 of the inspection section 16 in an integrated manner, and is arranged in the recesses 181 of the device recovery section 18 in an integrated manner. The first device transfer head 13 divides the four IC devices 90 that are held into two positions. In each of the pockets 141 in the device supply section 14, the third device transfer head 20 separates the four IC devices 90 arranged in the device recovery section 18 into two times. That is, the number of operations of the second device transfer head 17 that requires a short time is once when the IC device 90 is supplied, and once when the IC device 90 is recovered, that is, two times in total (steps 2-4, steps 2-5), but the time required for the first device transfer head 13 and the third device transfer head 20 to take a long time is 2 respectively, that is, a total of 4 times (step 2-1, step 2-2, step 2-6, steps 2-7). Therefore, in the conventional inspection apparatus, the time required for the transportation of the IC device 90 becomes longer, and the number of the IC devices 90 transported per unit time is smaller.

Next, the operation of the inspection device 1 according to this embodiment will be described.

[Step 1-1]

In the inspection device of this embodiment, as shown in FIG. 10 (a), the first device transfer head 13 holds the IC device 90 disposed on the temperature adjustment unit 12 by each hand assembly 131 and moves it toward the positive side in the Z direction. Further, each IC device 90 is disposed in each of the pockets 141 of the device supply section 14 by moving in at least one of the X direction and the Y direction, that is, above the device supply section 14 and then toward the negative direction of the Z direction. The time required in this step 1-1 is "1". As described above, in the inspection device 1, the first device transfer head 13 collectively arranges the four (plural) IC devices 90 held in the recesses 141 of the device supply unit 14.

[Step 1-2]

Next, as shown in FIG. 11 (a), the device supply unit 14 moves to the positive side in the X direction, that is, below the second device transfer head 17.

Then, the second device transfer head 17 moves to the negative side in the Z direction, and two of the four hand modules 175 hold (remove) two of the four IC devices 90 arranged in the device supply section 14. IC device 90. The time required for this step 1-2 is "0.5".

[Steps 1-3]

Next, as shown in FIG. 12 (a), the second device transfer head 17 moves to the positive side in the Z direction, and the device supply unit 14 moves to the positive side in the X direction, and then the second device transfer head 17 moves to the negative side in the Z direction. The other two IC components 90 disposed on the device supply unit 14 are held by the remaining two hand components 175. The time required in this step 1-3 is "0.5". As described above, in the inspection device 1, the second device transfer head 17 separates four (plural) IC devices 90 into two (plural) times and takes them out of the recesses 141 of the device supply unit 14.

[Steps 1-4]

Next, as shown in FIG. 13 (a), the second device transfer head 17 moves to the positive side in the Z direction and moves to the negative side in the Y direction, that is, each IC device 90 is positioned above each holding portion 161 of the inspection portion 16. Then, the IC devices 90 are moved to the negative side in the Z direction, and the IC devices 90 are arranged on the holding portions 161 of the inspection portion 16. The time required in this step 1-4 is "0.5". As described above, in the inspection device 1, the second device transfer head 17 collectively arranges the four IC devices 90 on each of the holding portions 161 of the inspection portion 16.

Furthermore, the inspection of each IC device 90 is performed by the inspection unit 16 while pressing each IC device 90 toward each holding portion 161 by the second device transfer head 17.

[Steps 1-5]

Next, as shown in FIG. 14 (a), the second device transfer head 17 holds the IC device 90 disposed in each holding portion 161 of the inspection portion 16 by each hand assembly 175, and moves toward the positive side in the Z direction and toward Y Move in the positive direction, that is, above the device recovery section 18, and then move to the negative direction in the Z direction. Two of the four IC devices 90 are arranged in the four recesses 181 of the device recovery section 18. Of the two recesses 181. The time required for this step 1-5 is "0.5".

[Steps 1-6]

Next, as shown in FIG. 15 (a), the second device transfer head 17 moves to the positive side of the Z direction, and the device recovery unit 18 moves to the positive side of the X direction, and then the second device transfer head 17 moves to the negative side of the Z direction. The remaining two IC devices 90 are disposed in the remaining two recesses 181 of the device recovery unit 18. The time required in this step 1-6 is "0.5". In this way, in the inspection device 1, the second device The component transfer head 17 divides the four IC devices 90 into the recesses 181 of the component recovery unit 18 in two stages.

[Steps 1-7]

Next, as shown in FIG. 16 (a), the device recovery unit 18 moves to the positive side in the X direction.

Then, the third device transfer head 20 moves in at least one of the X direction and the Y direction, that is, above the device recovery unit 18, and then moves to the negative side of the Z direction, and is held and arranged on the device by each hand assembly 201 Each IC device 90 in the collection unit 18. The time required for this step 1-6 is "1". As described above, in the inspection device 1, the third device transfer head 20 takes out the four IC devices 90 arranged in the device recovery unit 18 collectively.

Further, the third device transfer head 20 transfers each IC device 90 to one of the collection tray 19 and the empty tray 200 based on the detection result.

In the inspection device 1, the second device transfer head 17 separates the four IC devices 90 from the recesses 141 of the device supply unit 14 twice, and arranges the four IC devices 90 into the device recovery twice. Each of the pockets 181 of the part 18, but the first device transfer head 13 is a collective arrangement of the four IC devices 90 held in each of the pockets 141 of the device supply part 14, and the third device transfer head 20 is arranged on the device The four IC devices 90 of the collection unit 18 are held collectively. That is, the number of operations of the second device transfer head 17 that requires a short time is two times when the IC device 90 is supplied, and two times when the IC device 90 is recovered, that is, a total of four times (steps 1-2, step 1-3, steps 1-5, steps 1-6), but the time required for the first device transfer head 13 and the third device transfer head 20 to take a long time is 1 each, that is, 2 times in total (step 1-1, steps 1-7). Therefore, in the inspection device 1, the time required to transport the IC device 90 becomes shorter, and the number of IC devices 90 to be transported per unit time can be increased.

The above results are shown in the graph of FIG. 17. The horizontal axis in FIG. 17 is each step 1-1 to 1-7 of the inspection device 1 of this embodiment, and each step 2-1 to 2-7 of the operation of the previous inspection device, and the vertical axis is in this embodiment. The time (required time) required for each step 1-1 to 1-7 of the inspection device 1, and the time required for each step 2-1 to 2-7 of the operation of the previous inspection device time.

As shown in FIG. 17, in the inspection device 1 of this embodiment, the time required for steps 1-2 and 1-6 is shortened to the time required for steps 2-2 and 2-6 of the previous inspection device, respectively. According to this, it can be seen that, in the inspection device 1, compared with the previous inspection device, the time required to transport the IC device 90 is shortened.

As described above, according to the inspection device 1, the number of IC devices 90 that can be transported per unit time can be increased.

Accordingly, the time during which the inspection unit 16 is not in operation can be reduced, and the number of inspections of the IC device 90 per unit time can be increased.

<Second Embodiment>

Fig. 18 is a schematic plan view showing a second embodiment of the electronic component inspection device of the present invention.

Hereinafter, although the second embodiment is described, the differences from the first embodiment described above will be mainly described, and the description of the same matters will be omitted.

As shown in FIG. 18, in the inspection apparatus 1 of the second embodiment, two device supply sections 14, a device recovery section 18, and a second device transfer head 17 are arranged in the Y direction, respectively. Thereby, the number of IC devices 90 that are transported per unit time can be increased, so that the number of inspections of the IC devices 90 per unit time can be increased.

In addition, since there are two device supply units 14, they can be supplemented with each other in time. Similarly, since there are two device recovery units 18, they can be supplemented in time with each other. Similarly, since there are two second device transfer heads 17, Can complement each other in time. Thereby, the number of IC devices 90 transported per unit time can be further increased, and the number of inspections of the IC devices 90 per unit time can be further increased.

According to the second embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

As mentioned above, although the electronic component transfer device and the electronic component inspection device of the present invention are described, The description is based on the illustrated embodiment, but the present invention is not limited to this, and the configuration of each part may be replaced with an arbitrary configuration having the same function. Moreover, you may add another arbitrary structure.

In addition, the present invention may be a combination of any two or more configurations (features) in each of the embodiments described above.

Claims (16)

An electronic parts conveying device, comprising: a conveying part that can arrange and convey a plurality of electronic parts; a supply and holding part that can hold a plurality of the electronic parts and is arranged in the conveying part; and a supply and recovery holding part It can hold a plurality of the above-mentioned electronic parts and supply and recycle them; and the holding pitch of the electronic parts of the above-mentioned supply holding part can be adjusted to be the same as the placement pitch of the electronic parts of the above-mentioned conveying part; The spacing is greater than the placement distance of the electronic parts of the conveying section; the supply and holding section arranges a plurality of the electronic components in the conveying section; the supply and recovery holding section divides the plurality of electronic components into the conveying section and separates them from the conveying section. For example, the electronic component transfer device according to claim 1, wherein the supply and holding unit collectively arranges the plurality of electronic components in the transfer unit. For example, the electronic component transfer device of claim 1 or 2, wherein the time from the supply recovery holding portion to holding the electronic component is shorter than the time from the supply holding portion to holding the electronic component. For example, the electronic component transfer device according to claim 1 or 2, wherein the supply holding part can move in a direction in which the plurality of electronic components are arranged and a direction orthogonal to the direction in which the plurality of electronic components are arranged. An electronic parts conveying device, comprising: a conveying section, which can be configured to convey a plurality of electronic parts; A recovery and holding unit that can hold and remove a plurality of the electronic components arranged in the transporting unit from the transporting unit; and a supply and recovery holding unit that can hold and supply and recover the plurality of electronic parts; and The electronic component holding pitch of the recycling holding part can be adjusted to be the same as the electronic part configuration spacing of the carrying part; the electronic component holding pitch of the supply recycling holding part is larger than the electronic part configuration pitch of the carrying part; the supply recycling holding part will have a plurality of Each of the electronic components is divided into a plurality of times and is arranged in the conveying section; and the recovery and holding section takes out the plurality of electronic components from the conveying section. For example, the electronic component transfer device of claim 5, wherein the recovery and holding unit takes out a plurality of the electronic components from the transfer unit collectively. For example, the electronic component transfer device of claim 5 or 6, wherein the time from the supply and recovery holding section to holding the electronic parts is shorter than the time from the recovery holding section to holding the electronic parts. For example, the electronic component transfer device according to any one of claims 1, 2, 5, and 6, wherein the recovery holding portion may be arranged in a direction in which a plurality of the electronic components are arranged and orthogonal to a direction in which the plurality of the electronic components are arranged. Move in the direction. For example, the electronic component transfer device according to any one of claims 1, 2, 5, and 6, wherein the direction in which the plurality of electronic components are arranged in the transfer portion is the same as the transfer direction of the transfer portion. For example, if the electronic component transfer device according to any one of items 1, 2, 5, and 6 is configured or taken out of the supply recovery holding portion, the supply recovery holding portion may be configured with a plurality of the above. Orientation of electronic parts When the cross direction moves, the conveying section can move in a direction where a plurality of the electronic components are arranged. For example, the electronic component transfer device according to any one of claims 1, 2, 5, and 6, wherein a distance between a plurality of the electronic components arranged in the transfer unit is set to a, and the plurality of the supply recovery holding units are held by the plurality. When the distance between the aforementioned electronic components is set to b, b / a is an integer of 2 or more. For example, the electronic component transfer device according to any one of claims 1, 2, 5, and 6 has a holding portion capable of holding the electronic component; and the supply recovery holding portion may press the electronic component against the holding portion. According to the electronic component transfer device of any one of claims 1, 2, 5, and 6, the supply recovery holding portion and the transfer portion are respectively provided with two. An electronic component inspection device, comprising: a conveying section that can arrange and convey a plurality of electronic components; a supply and holding section that can hold and hold a plurality of the electronic components and are arranged in the conveying section; and a supply and recovery holding section, It can hold and supply a plurality of the above-mentioned electronic parts, and supply and recycle them; and an inspection section that checks the above-mentioned electronic parts; and the holding pitch of the electronic parts of the above-mentioned holding parts can be adjusted to be the same as the placement pitch of the electronic parts of the above-mentioned conveying parts; The electronic component holding pitch of the supply recovery holding part is greater than the electronic part arrangement pitch of the conveying part; the supply holding part arranges a plurality of the electronic parts in the conveying part; the supply recovery holding part divides the plurality of electronic parts into a plurality of Take out from the above-mentioned conveying section. An electronic parts inspection device, comprising: The transfer unit can be configured to transfer a plurality of electronic parts; the recycling and holding unit can hold and remove the plurality of electronic parts arranged in the transferring unit from the above-mentioned transferring unit; and the recycling and holding unit can transfer the plurality of electronic parts The above-mentioned electronic parts are held and supplied and recycled; and an inspection section that inspects the above-mentioned electronic parts; and the electronic parts holding pitch of the above-mentioned recycling holding parts can be adjusted to be the same as the arrangement pitch of the electronic parts of the above-mentioned conveying parts; the above-mentioned supply and recycling holding parts The electronic component holding pitch is greater than the electronic component disposition pitch of the conveying section; the supply recovery holding section divides the plurality of electronic components into the conveying section in a plurality of times; the recovery holding section separates the plurality of electronic components from the conveying section. take out. The electronic component inspection device according to claim 14 or 15, wherein the supply and recovery holding unit can supply the electronic component to the inspection unit and recover from the inspection unit.