JP2006292590A - Inspection method and inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact inspection device and an inspection method capable of preparing quickly low temperature and high temperature conditions, capable of enhancing inspection efficiency, and capable of reducing an installation space as small as possible. <P>SOLUTION: This device for inspecting a temperature characteristic of a work of an inspection object has a work supply part 12 for supplying the work for the inspection, an inspection part 40 for heating-measuring and cooling-measuring the work 50 supplied from the work supply part, and a transfer means 20 for transferring the work between the work supply part and the inspection part, the inspection part has measuring parts 42, 43 for conducting the one out of the heating measurement and cooling measurement, in both sides, with a measuring part 41 for conducting the other measurement thereof therebetween, and a conveying means 30 for conveying the work is provided between the measuring part 41 for conducting the other measurement and the measuring parts 42, 43 for conducting the one measurement adjacent thereto. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an inspection apparatus and an inspection method suitable for inspecting temperature characteristics of electronic parts such as piezoelectric devices such as piezoelectric vibrators and piezoelectric oscillators.

At present, there are various types of electronic components used. Among them, for example, piezoelectric devices such as piezoelectric vibrators and piezoelectric oscillators are widely used as reference signal sources for many electronic devices.
Some of these electronic devices are used in various environments. For example, electronic devices used in wireless systems such as mobile phones are used in a wide temperature range from cold regions to tropical regions. . For this reason, a piezoelectric device mounted on such an electronic device is required to have stable characteristics over a wide temperature range, for example, good frequency characteristics.

For example, a so-called AT-cut type crystal resonator formed by cutting a crystal into a circle or a rectangle, an oscillator using the same, a variation in frequency temperature characteristics due to processing accuracy of the crystal resonator, a spurious vibration, etc. There is a characteristic that deteriorates the frequency temperature characteristic. For this reason, in a piezoelectric device incorporated in an electronic device or the like in which frequency temperature characteristics are important, it is necessary to inspect whether or not the frequency temperature characteristics conform to requirements at the time of manufacture.
In particular, a temperature compensated crystal oscillator (TCXO) used as a reference signal source for a mobile phone or the like requires a frequency accuracy of 1/5 or less as compared with an oscillator using the above-described AT-cut crystal resonator. Therefore, precise inspection is required.

Conventionally, in this type of inspection apparatus, a plate-like mounting portion for mounting a piezoelectric device as an electronic component, a temperature changing means such as a heater for changing the temperature, and the piezoelectric device are arranged above and below the piezoelectric device. An inspection probe that is moved up and down is provided (not shown).
In such an inspection apparatus, the temperature of the placement unit is detected by a temperature sensor, and the temperature changing unit is driven to adjust the temperature of the placement unit to a target temperature. Then, after confirming that the temperature to be inspected has been reached with the temperature sensor, the inspection probe is brought into contact with a lead terminal of the piezoelectric device, and a drive voltage is applied to the piezoelectric device through a part of the inspection probe. The output of the piezoelectric device is input to a frequency detector (not shown) such as a frequency counter connected to the outside via another inspection probe to which no drive voltage is applied, and the frequency of the piezoelectric device under a predetermined temperature condition is calculated. It comes to detect.

However, in the inspection apparatus having such a configuration, the low temperature and high temperature inspection conditions are repeatedly generated by one temperature changing means, so that it takes a long inspection time to obtain the necessary series of temperature conditions, and the efficiency is high. Is bad.
Thus, an inspection apparatus as shown in FIG. 10 has also been proposed (see Patent Document 1).
In the figure, this inspection apparatus has five electric heating plates 2 arranged in a row in the horizontal direction, and each electric heating plate creates five types of temperature conditions, and the piezoelectric means that is the inspection target is formed by the conveying means 3. Devices are sent sequentially.
In such an inspection apparatus 1, since a plurality of temperature conditions can be formed in advance, it is not necessary to create high and low temperature conditions by heating and cooling. Therefore, the inspection time is shortened and the inspection efficiency is improved.

JP2002-214270

  However, since the inspection apparatus 1 as shown in FIG. 10 has a plurality of electrothermal plates arranged in a row, the size in the length direction becomes large, which causes another problem that installation space is required.

  The present invention has been made to solve the above-described problems, and can quickly create low and high temperature conditions, improve inspection efficiency, and reduce the installation space as much as possible. An object is to provide a compact inspection apparatus and inspection method.

  According to the first aspect of the present invention, there is provided an apparatus for inspecting a temperature characteristic of a workpiece to be inspected, a workpiece supply unit for supplying the workpiece for inspection, and a supply from the workpiece supply unit. An inspection unit that performs heating measurement and cooling measurement on the workpiece to be performed, and a transfer unit that transfers the workpiece between the workpiece supply unit and the inspection unit, The measurement unit for measuring one of the heating and cooling and the measurement unit for performing the other measurement on both sides, and the measurement unit for performing the one measurement and the other of the measurement unit adjacent to the measurement unit. This is achieved by an inspection apparatus provided with a transport means for transporting the workpiece between the measurement units.

According to the configuration of the first aspect of the invention, the inspection unit has a measurement unit that performs measurement of the other on both sides with a measurement unit that performs measurement of one of heating or cooling interposed therebetween. Since the temperature conditions necessary for each of the cooling measurements are made separately, it takes a long time to make a temperature suitable for heating measurement by, for example, cooling measurement and then increasing the temperature by one measurement unit. You can create both temperature conditions at the same time without needing time.
Further, the transfer means simply reciprocates between the inspection unit and the supply unit composed of a workpiece supply tray or the like, and does not move between the measurement units of the inspection unit. can do.
That is, with the one measurement unit located at the center as the center, the transfer unit different from the transfer unit distributes the workpiece for which the one measurement has been completed to the other measurement unit on both sides thereof. Since it was conveyed, it can carry out inspection by efficiently conveying the work side for each measurement part in which different temperature conditions are made, and inspection efficiency is high.
Moreover, since only three measuring parts are required depending on the heating and cooling conditions, the entire apparatus can be formed compactly, which is excellent in terms of space saving.
Thus, it is possible to provide a compact inspection apparatus that can quickly create temperature conditions of low and high temperatures, improve inspection efficiency, and reduce the installation space as much as possible.

According to a second aspect of the present invention, in the configuration of the first aspect, each of the measuring units measures a plurality of the workpieces in one measurement, and the plurality of workpieces that are measurement units in the one measurement are described above. The transfer unit is configured to transfer at a time, and the transfer unit includes a feeding head and a material removal head corresponding to each measurement unit with respect to the measurement unit.
According to the configuration of the second invention, since a plurality of workpieces can be inspected at a time, the inspection efficiency is further improved. In addition, since the head portion of the transfer means has the material supply head and the material removal head, it is possible to supply the workpiece to the inspection unit and remove the material by a reciprocating operation, and the transfer efficiency is good.

According to a third aspect of the invention, in the configuration of the first or second aspect of the invention, a cooling measurement unit is provided as the one measurement unit, and a heating measurement unit is provided as the other measurement unit on both sides of the cooling measurement unit. It is characterized by providing.
According to the configuration of the third invention, the cooling measurement unit first cools the work and performs one measurement, and then alternately distributes to the heating measurement units on both sides to perform the other measurement by heating. Can do. For this reason, since it was set as the structure which raises temperature in each heating measurement part, the tact time required for temperature rise can be shortened more. And if the workpiece | work which complete | finished heating measurement is returned to the center cooling measurement part, it can cool during the waiting time which waits for material removal.

According to a fourth aspect of the present invention, in the configuration according to the second or third aspect, the transport unit includes a carrier that holds a workpiece corresponding to the measurement unit, and an arm that moves the carrier between adjacent measurement units. The arm is configured to move two carriers in the direction in which the measuring units are arranged.
According to the configuration of the fourth aspect of the present invention, the workpiece, which is an extremely small electronic component, can be reliably and easily conveyed by conveying the workpiece in units of carriers while holding a plurality of workpieces on the carrier.
In addition, since the arm is configured to move the two carriers in the direction in which the respective measurement units are arranged, by moving the carrier alternately left and right, the measurement of cooling and heating is performed while the cooling plate in the center is moved. The position can be efficiently inspected as the material removal standby position after the heating measurement.

According to a fifth aspect of the present invention, in the configuration of the fourth aspect of the invention, the heating measurement unit and the cooling measurement unit are each provided with a heating plate and a cooling plate having contact surfaces, and the carrier is heated. It is characterized in that heat is conducted to the work held by the carrier by being brought into close contact with the contact surface of the plate or the cooling plate.
According to the configuration of the fifth invention, it is difficult to directly apply the work, which is an extremely small electronic component, directly to the contact surface, and it is uncertain whether the temperature rises or falls for each work. Is securely held by the carrier, and the carrier itself is applied to the abutting surface so as to conduct heat to the workpiece via the carrier, whereby a reliable and rapid inspection can be realized.

A sixth invention is characterized in that, in the configuration of any of the fourth and fifth inventions, the cooling plate of the cooling measurement unit is constituted by a cryocooler.
According to the structure of 6th invention, there exists an advantage that there is almost no trouble like a Peltier device which does not need a maintenance and there exists a possibility of element disconnection by selecting a sealed cryocooler.

According to a seventh invention, in the configuration of any one of the fourth to sixth inventions, the cooling plate of the cooling measurement unit and / or the heating plate of the heating measurement unit is a Peltier element.
According to the configuration of the seventh invention, when a Peltier element is used for the cooling plate of the cooling measurement unit and / or the heating plate of the heating measurement unit, electrical energy and heat are mutually converted with a compact configuration using a semiconductor. In addition, heating and cooling can be performed freely.

According to the eighth aspect of the present invention, there is provided the second and third measuring units for measuring the other on both sides of the first measuring unit for measuring one of heating and cooling. , Transfer means for transferring the workpiece from the supply portion of the workpiece to be inspected to the first measurement unit, the first measurement unit and the second measurement unit, and the first measurement An inspection method for inspecting a temperature characteristic of a workpiece by an inspection apparatus having a conveying means for conveying the workpiece between the first measuring portion and the third measuring portion, wherein the workpiece to be inspected by the transfer means is a first measuring portion. In the first measurement unit, the first measurement is performed on the workpiece, and the workpiece for which the first measurement has been completed is sequentially distributed to the second or third measurement unit by the conveyance unit and conveyed. And achieved by the inspection method for performing the second measurement.
According to the configuration of the eighth invention, the workpiece to be inspected is sequentially transferred to the first measurement unit by the transfer means, and the first measurement is performed on the workpiece in the first measurement unit, Since the work for which the first measurement has been completed is sequentially distributed to the second or third measurement unit by the transfer means and transferred to perform the second measurement, for example, the first measurement performed at a low temperature is performed. From the measurement to the second measurement performed at a high temperature can be performed very efficiently.

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is a schematic configuration diagram showing an embodiment of an inspection apparatus of the present invention.
The inspection apparatus 10 performs an inspection of temperature characteristics of an electronic component (workpiece) to be inspected. In particular, in this embodiment, the frequency-temperature characteristics of a piezoelectric device are inspected.
That is, the inspection apparatus 10 is for inspecting the frequency temperature characteristics of an electronic component that is a workpiece, and is particularly configured to inspect a piezoelectric device such as a piezoelectric oscillator among the electronic components. However, the configuration almost the same as that of FIG. 1 enables inspection of not only piezoelectric devices but also various electronic components.

  In FIG. 1, an inspection apparatus 10 has a workpiece supply / removal unit 11 for supplying an uninspected workpiece or removing a workpiece after inspection with respect to a workpiece 50 which is a piezoelectric device to be inspected. Yes. The workpiece supply / removal unit 11 includes, for example, a mounting table, and carries a supply tray 12, a removal tray 13, and a defective tray 14 that stores defective products that are found as a result of inspection. Preferably, the mounting table of the workpiece supply / removal unit 11 is movable as indicated by an arrow A along the X direction.

In the inspection apparatus 10, the inspection unit 40 that inspects the workpiece has a plurality of measurement units for cooling or heating the workpiece, and in this embodiment, includes three measurement units.
That is, the inspection unit 40 is disposed on both sides of the cooling measurement unit 41 as the first measurement unit or one measurement unit that cools and inspects the temperature characteristics of the workpiece, and the cooling measurement unit 41 along the X direction. Each has a second measuring unit or the other measuring unit that inspects the temperature characteristics of the workpiece by heating. The second measurement unit or the other measurement unit corresponds to the illustrated first heating measurement unit 42 and second heating measurement unit 43 in the present embodiment.
The conveying means 30 of the inspection apparatus 10 includes a guide along the X direction (not shown), and has an arm 31 that moves along the guide and can be moved up and down in the Z direction. The arm 31 holds a plate-like carrier and conveys it in the X direction. In this embodiment, the arm 31 includes two carriers, a first carrier 32 and a second carrier 33. .

  The first and second carriers 32 and 33 have the same structure and are simultaneously moved in the same direction by the same distance. Each of the carriers 32 and 33 has a plate shape that is long in the X direction, and has a plurality of work holding portions on the upper surface thereof along the X direction. That is, the number of workpieces that can be held at one time on this carrier is a measurement unit that can simultaneously perform frequency measurement under the temperature condition of the inspection object. The work holding part of the carrier accommodates the work, and the upper end of the work is a bottomed hole that is exposed, and an inspection probe (to be described later) is brought into direct contact with the exposed upper surface of the work. Further, the bottom surface of the carrier is a contact surface that is in contact with a measurement unit such as the cooling measurement unit 41, and heat is conducted to the held work through the carrier. For this reason, the carrier is preferably formed of a lightweight metal having excellent thermal conductivity and heat resistance. In this embodiment, the carriers 32 and 33 are made of, for example, stainless steel or titanium.

  The transfer means 20 has a head portion 21 for sucking or chucking a component at an arm tip (not shown), similar to that used in a normal component mounter. For example, as shown in FIG. 2A, the head unit 21 includes a material supply head 22 and a material removal head 23 that are respectively driven up and down.

The above configuration will be described in more detail with reference to FIGS. 2 is an explanatory view showing the movement and configuration of the transfer means 20, FIG. 3 is an explanatory view showing the movement and configuration of the carrier, and FIG. 4 is an explanatory view showing the movement and configuration of the probe unit.
In FIG. 2, the above-described material supply head 22 and material removal head 23 are individually attached to the head portion 21 of the transfer means 20 so as to be movable up and down. The material supply head 22 and the material removal head 23 can hold the workpiece 50 by vacuum suction or mechanical chucking. When the transfer means is at the position of the workpiece supply / removal part 11 in FIG. 1 due to the movement of an arm or the like (not shown), the material supply / removal unit 11 moves downward in the direction of arrow A. When the tray 12 is positioned, as shown in FIG. 2A, the material supply head 22 descends as indicated by an arrow HK and sucks the work 50 on the material supply tray 12.

When the feeding head 22 is raised and the transfer means 20 is positioned on the cooling measurement unit 41 in FIG. 1, the feeding head 22 is lowered as indicated by an arrow HK and is moved to the holding portion of the second carrier 33. The work 50 is transferred. In this case, as shown in FIG. 2B, a plurality of suction means of the feeding head 22 are continuously provided along the extending direction of the second carrier 33, and are simultaneously lifted and lowered. ing.
FIG. 2C shows the movement of the material removal head 23 of the head portion 21, and this material removal head 23 has the same configuration as the above-described material supply head 22. The finished work 50 is sucked and retracted from the position of the inspection unit 40 to the position just above the material removal tray 13 and lowered as indicated by an arrow HK so that the work 50 is placed on the material removal tray 13. .

When the first carrier 32 and the second carrier 33 in FIG. 3 are measured and inspected with the cooling plate 45 exposed on the upper surface of the cooling measurement unit 41, the direction of the arrow U is as shown in FIG. To rise. At this time, the second carrier 33 is also raised by the arm 31 described in FIG. 1 in synchronization with the first carrier 32. Next, as shown in FIG. 3B, the first carrier 32 and the second carrier 33 are moved by the arm in the direction of arrow S, and the first carrier 32 is a cooling measurement unit 41. The second carrier 33 is positioned on the first heating measurement unit 42 adjacent to the cooling measurement unit 41.
Subsequently, as shown in FIG. 3C, the first carrier 32 and the second carrier 33 are lowered in the direction of the arrow D by the movement of the arm and come into contact with the corresponding measurement unit. .

  As shown in FIG. 4A, the probe unit 44 in FIG. 4 is positioned on each measurement unit, in the illustrated case, on the cooling measurement unit 41, and between the probe unit 44 and the cooling measurement unit 41. Due to the above-described movement, the first carrier 32 is transported, and the first carrier 32 is lowered in the direction of the arrow PK2. Correspondingly, the probe holding portion 48 of the probe unit 44 is also lowered as shown by the arrow PK2 to perform measurement inspection. FIG. 4B is a side view of the above state.

Specifically, the probe holding unit 48 of the probe unit 44 holds a number of probes 46 and 47 corresponding to the number of workpieces to be inspected at one time (measurement unit) with their tips facing downward. The probes 46 and 47 are connected to a measuring circuit including a frequency counter for supplying a driving voltage to the piezoelectric device as the work 50 and measuring a frequency from each piezoelectric device inside the probe holding unit 48.
The cooling measurement unit 41 is provided with a cooling plate 45 having a flat contact surface on the upper surface thereof. The cooling plate 45 exhibits a cooling function by, for example, a cryocooler and is controlled by a temperature controller 69 described later. The cooling plate 45 transmits heat to the work 50 held by the first carrier 32 via the first carrier 32 pressed against the contact surface. As a result, the piezoelectric device that is the workpiece 50 is excited under the condition of a preset cooling temperature, and the frequency characteristic is detected on the probe unit 44 side, whereby a temperature characteristic inspection is performed.
Here, the cryocooler is a device that utilizes the fact that the vapor pressure of an inert gas such as He is 10 ⁻⁸ Pa or less, and is a device that obtains a low temperature by condensing and sorbing gas molecules.
The advantage of using a cryocooler for the cooling plate 45 is that there is almost no trouble such as element breakage such as a Peltier element, and maintenance such as gas replacement is not required by selecting a sealed cryocooler. Is a point.

On the other hand, the first heating measurement unit 42 and the second heating measurement unit 43 shown in FIG. 3 have substantially the same configuration as the cooling measurement unit 41, and each heating plate 49, 49 uses, for example, a Peltier element. The heating plate. Thereby, a precise temperature condition can be created with a compact configuration using a semiconductor.
Note that both the cooling plate and the heating plate may be formed of Peltier elements. A Peltier device is a device that changes the temperature by applying a current to, for example, a flat silicon semiconductor, and uses the Seebeck effect that when the current is applied, one end becomes high temperature and the other end becomes low temperature. It is an element. Since this Peltier element can reverse a high temperature part and a low temperature part by the direction to which an electric current is applied, it can be used for both heating and cooling. If a Peltier element is used, it can be configured more compactly than a temperature variable device that controls the temperature by circulating a refrigerant.

With reference to FIG. 4, the outline of the electrical configuration of the inspection apparatus 10 will be described.
The measurement controller 61 of the first control unit 60 is connected to the driving means 1 indicated by reference numeral 63, the driving means 2 indicated by reference numeral 64, the temperature controller 69 of the second control part 65, and the like. The driving means 1 denoted by reference numeral 63 includes an air cylinder, which is an elevating means for the probe unit 44, an elevating means for the contact probe, a power supply circuit for driving the workpiece 50, and the like. The measurement controller 61 is connected to the driving means 2 indicated by reference numeral 64 for driving the arm of the conveying means for conveying the carrier described in FIG. Although not shown, the transfer means 20 and the workpiece supply / removal unit 11 shown in FIG. 1 are driven and controlled by the first or second drive means.
Furthermore, the measurement controller 61 is connected to a frequency counter 62 as a detection circuit. This frequency counter 62 is connected to the probes 46 and 47. That is, the frequency counter 62 has a function of measuring the frequency of the signal output from the work 50 via the probes 46 and 47, and the frequency measurement result is recorded in the measurement controller 61. .

The second control unit 65 includes a temperature controller 69 as temperature control means connected to the measurement controller 61 of the first control unit 60 and means controlled by the temperature controller 69.
The cooling measurement unit 41 is provided with a temperature sensor or the like so that the temperature of the cooling plate 45 can be detected. As this temperature sensor, for example, a temperature thermistor using a thermocouple or a semiconductor is used, and its resistance / voltage conversion unit 66 converts a resistance value that changes in accordance with the temperature into a voltage, and performs A / D The conversion unit 68 performs analog-digital conversion and sends it to the temperature controller 69.

The inspection apparatus 10 of the present embodiment is configured as described above, and an example of its operation will be described next. FIGS. 5 to 9 show examples of the operation of the inspection apparatus 10. In these drawings, the shape of the workpiece is changed for each measurement unit for convenience of understanding. However, in reality, all the workpieces have the same shape. It is.
FIG. 5A shows the state described with reference to FIG.
That is, the head portion 21 of the transfer means moves in the direction of the arrow I <b> 1 and picks up the first row of workpieces 50-1 on the supply tray 12 by the supply head 22. Here, for convenience of understanding, it is assumed that the workpiece as a measurement unit is one row of the feed tray 12, and all the workpieces belonging to the row are simultaneously subjected to the same processing.

In FIG. 5B, the head unit 21 moves on the cooling measurement unit 41 along the direction of the arrow I <b> 2 and supplies the first carrier 32 positioned on the cooling measurement unit 41. The workpiece 50-1 is transferred from the head 22. As a result, as described with reference to FIG. 4, the workpiece 50-1 is cooled, and the frequency at a predetermined temperature is measured.
Next, in FIG. 6C, the head unit 21 moves in the direction of arrow I <b> 3, moves onto the feed tray 12, and picks up the workpieces 50-2 arranged in the next row by the feed head 22. . During this time, the cooling of the work 50-1 is continued through the first carrier 32 in the cooling measurement unit 41.

  Subsequently, in FIG. 6D, the head unit 21 moves in the direction of arrow I <b> 4 and is positioned on the cooling measurement unit 41. Here, the first carrier 32 and the second carrier 33 are transported in the direction of the arrow M1, so that the first carrier is moved to the first heating measurement unit 42, and the workpiece 50-1 is the first carrier. 32 is heated. At the same time, since the second carrier 33 is conveyed on the cooling measurement unit 41, the workpiece 50-2 is cooled via the second carrier 33, and the workpiece 50-1 and the workpiece 50-2 are The heating and cooling measurements are performed simultaneously.

In FIG.7 (e), the head part 21 moves to the arrow I5 direction, is located on the supply tray 12, and the supply head 22 picks up the workpiece | work 50-3. At this time, measurement by heating and cooling is continued in the heating measurement unit 42 for the workpiece 50-1 and in the cooling measurement unit 41 for the workpiece 50-2. When the heating measurement is completed, the heating is also terminated.
Next, in FIG. 7F, the first carrier 32 and the second carrier 33 are conveyed in the direction of the arrow M2, and the workpiece 50-2 is heated and measured by the second heating measurement unit 43, and the workpiece 50- 1 is located on the cooling measurement unit 41 while being held by the first carrier 32 and is in a retracted state. Then, the workpiece 50-2 is picked up by the material removal head 23 of the head portion 21 that has moved in the direction of arrow I6.

Subsequently, in FIG. 8G, the head portion 21 slightly moves in the direction of the arrow I <b> 7 and feeds the workpiece 50-3 onto the first carrier 32 from the feeding head 22. As a result, cooling / measurement of the workpiece 50-3 is started by the cooling measurement unit 41 via the first carrier 32. The workpiece 50-2 is heated and measured by the second heating measurement unit 43 via the second carrier 33.
In FIG. 8 (h), the head portion 21 has moved on the material removal tray 13 along the arrow I 8, and the workpiece 50-1 that has been measured from the material removal head 13 is removed on the material removal tray 13. Material. When a part or all of the workpiece 50-1 is determined to be defective according to the measurement result, it is discarded on the defective tray 14 in FIG. Further, when the measurement by the second heating measurement unit 43 is completed via the second carrier 33, the workpiece 50-2 is also heated. The cooling and measurement of the workpiece 50-3 are continued.

  In FIG. 9 (i), the head portion 21 moves on the feed tray 12 along the arrow I 9 and picks up the workpiece 50-4 by the feed head 22. At this time, the first carrier 32 and the second carrier 33 are conveyed in the direction of the arrow M3. For this reason, the workpiece 50-2 is placed on standby for removal of material on the cooling measurement unit 41, and the workpiece 50-3 is heated and measured by the first heating measurement unit 42 via the first carrier 32. Be started.

Thus, according to the inspection apparatus 10 of the present embodiment, the transfer means 20 sequentially transfers the workpieces 50-1 to 50-4 to be inspected to the central cooling measurement unit 41, and the cooling measurement unit 41 These workpieces can be heated and measured. Since the workpieces that have been heated and measured are sequentially distributed and conveyed by the conveying means 30 to the first or second heating measurement units 42 and 43 to perform heating and measurement, for example, the work is performed at a low temperature. The measurement can be carried out very efficiently from the measurement performed to the measurement performed at a high temperature.
In addition, when the measurement by cooling and the measurement by heating are performed at the same time, the entire apparatus is compacted and the installation space is reduced because the measurement unit is arranged in a straight line without arranging a large number of measurement units on a straight line. Is possible.

The present invention is not limited to the above-described embodiment.
The electronic component to be inspected according to the present invention is not limited to a piezoelectric device, and any electric or electronic component whose temperature characteristics are problematic can be inspected.
The inspection unit of the inspection apparatus of the present invention may be provided with a heating measurement unit at the center and cooling measurement units on both sides of the heating measurement unit.
A part of the conditions and configurations of the above-described embodiment may be omitted as appropriate, or may be combined with other configurations not mentioned.

1 is a schematic configuration diagram showing the overall configuration of an inspection apparatus according to an embodiment of the present invention. The figure of the transfer means of the inspection apparatus of FIG. The figure which shows the motion of the conveyance means of the inspection apparatus of FIG. The figure which shows the probe unit and electrical structure of the inspection apparatus of FIG. The figure which shows the operation example of the test | inspection apparatus of FIG. The figure which shows the operation example of the test | inspection apparatus of FIG. The figure which shows the operation example of the test | inspection apparatus of FIG. The figure which shows the operation example of the test | inspection apparatus of FIG. The figure which shows the operation example of the test | inspection apparatus of FIG. The partial top view which shows an example of the conventional inspection apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Inspection apparatus, 11 ... Work supply / removal part, 12 ... Feeding tray, 20 ... Transfer means, 21 ... Head part, 22 ... Feeding head, 23 ... Material removal head, 30 ... Conveying means, 31 ... Arm, 32 ... First carrier, 33 ... Second carrier, 40 ... Inspection part, 41 ... Cooling Measurement unit, 42 ... first heating measurement unit, 43 ... second heating measurement unit

Claims (8)

An apparatus for inspecting the temperature characteristics of a workpiece to be inspected,
A workpiece supply unit for supplying the workpiece for inspection;
An inspection unit that performs heating measurement and cooling measurement on the workpiece supplied from the workpiece supply unit;
A transfer means for transferring the workpiece between the workpiece supply unit and the inspection unit;
The inspection unit
It has a measurement part that performs the other measurement on both sides across the measurement part that performs one measurement of heating or cooling,
An inspection apparatus comprising: a measurement unit that performs the one measurement; and a conveying unit that conveys the workpiece between the other measurement unit adjacent to the measurement unit.   Each of the measurement units is configured to measure a plurality of the workpieces at a time, and is configured to transport the transport means at a time for a plurality of workpieces that are measurement units in the one-time measurement, The inspection apparatus according to claim 1, wherein the transfer means includes a material supply head and a material removal head corresponding to each measurement unit with respect to the measurement unit.   The inspection apparatus according to claim 1, further comprising a cooling measurement unit as the one measurement unit and a heating measurement unit as the other measurement unit on both sides of the cooling measurement unit. .   The transport means includes a carrier that holds a workpiece corresponding to the measurement unit, and an arm that moves the carrier between adjacent measurement units. The arm moves two carriers in the direction in which the measurement units are arranged. The inspection apparatus according to claim 2, wherein the inspection apparatus is configured to be moved to a position.   The heating measurement unit and the cooling measurement unit are each provided with a heating plate and a cooling plate each provided with a contact surface, and by bringing the carrier into close contact with the contact surface of the heating plate or the cooling plate, The inspection apparatus according to claim 4, wherein heat is conducted to the work held by the carrier.   The inspection apparatus according to claim 4, wherein the cooling plate of the cooling measurement unit is constituted by a cryocooler.   7. The inspection apparatus according to claim 4, wherein the cooling plate of the cooling measurement unit and / or the heating plate of the heating measurement unit is a Peltier element. The first and second measurement units that perform the other measurement on both sides of the first measurement unit that performs one measurement of heating or cooling, and the first measurement unit are inspection targets. Transfer means for transferring the workpiece from the workpiece supply unit, and conveying means for conveying the workpiece between the first measurement unit and the second measurement unit, and between the first measurement unit and the third measurement unit. An inspection method for inspecting the temperature characteristics of a workpiece by an inspection apparatus having
The workpiece to be inspected by the transfer means is sequentially transferred to the first measuring unit,
In the first measurement unit, the first measurement is performed on the workpiece,
The inspection method characterized in that the work for which the first measurement has been completed is sequentially transferred to the second or third measuring unit by the transfer means and transferred to perform the second measurement.

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