WO2017056607A1 - Device and method for inspecting electronic component - Google Patents

Device and method for inspecting electronic component Download PDF

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Publication number
WO2017056607A1
WO2017056607A1 PCT/JP2016/069422 JP2016069422W WO2017056607A1 WO 2017056607 A1 WO2017056607 A1 WO 2017056607A1 JP 2016069422 W JP2016069422 W JP 2016069422W WO 2017056607 A1 WO2017056607 A1 WO 2017056607A1
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WO
WIPO (PCT)
Prior art keywords
inspection
dry gas
electronic component
temperature
space
Prior art date
Application number
PCT/JP2016/069422
Other languages
French (fr)
Japanese (ja)
Inventor
秀樹 朝倉
建豪 藤田
晶夫 菅野
信明 前澤
Original Assignee
株式会社村田製作所
株式会社東京ウエルズ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所, 株式会社東京ウエルズ filed Critical 株式会社村田製作所
Priority to CN201680042075.3A priority Critical patent/CN108291934B/en
Priority to JP2017542942A priority patent/JP6560356B2/en
Publication of WO2017056607A1 publication Critical patent/WO2017056607A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices

Definitions

  • the present invention relates to an electronic component inspection apparatus and inspection method.
  • the electronic components are adversely affected by moist air, and accurate inspection is hindered, and the reliability of the electronic components may be impaired.
  • condensation or frosting may occur in the electronic component or the inspection apparatus due to such moist air.
  • a mode in which the electronic components are inspected in a closed inspection room so that the temperature environment can be maintained For example, it is necessary to open and close the shutter, and the opening of the shutter changes the temperature in the examination room, which takes time to return to a predetermined temperature environment, and may take a whole examination time. there were.
  • JP 2002-214283 A Japanese Patent Laid-Open No. 10-274667 JP 2006-292590 A
  • the present invention has been made in view of such circumstances, and an object thereof is to provide an electronic component inspection apparatus and an inspection method capable of performing an accurate inspection without impairing the reliability of the electronic component. .
  • An electronic component inspection apparatus is an inspection apparatus that inspects temperature characteristics of an electronic component in a state where dry gas is supplied, and is provided in an inspection room for inspecting the electronic component and an inspection room.
  • a transport mechanism for transporting the electronic components supplied to the inspection room a first dry gas supply unit for supplying dry gas to the first space on one side of the transport mechanism in the inspection room, A second dry gas supply unit that supplies dry gas to the second space on the other surface side of the transport mechanism, and the first space is larger than the second space, and the second dry gas supply unit
  • the dry gas supply pressure is higher than the dry gas supply pressure of the first dry gas supply unit.
  • the dry gas supply pressure of the second dry gas supply unit that supplies the dry gas to the second space of the examination room is dry in the first space (having a larger area than the second space) of the examination room. It is larger than the dry gas supply pressure of the first dry gas supply unit for supplying the gas. According to this, even when the internal space of the examination room is divided into the first and second spaces by the transport mechanism, it is possible to suppress damp air from staying in one space side. Therefore, an accurate inspection can be performed without impairing the reliability of the electronic component.
  • a component supply path for supplying the electronic component to the inspection room, and a suction unit for sucking gas from the suction hole in the inspection chamber for supplying the electronic component from the component supply path to the inspection room are further provided. You may prepare.
  • the suction hole of the suction unit may be provided on the second space side.
  • the supply hole of the second dry gas supply unit may be provided adjacent to the suction hole of the suction unit.
  • the part supply path and the inspection room may always be opened so that electronic parts can be supplied while the inspection apparatus is operating.
  • a component discharge path for discharging the electronic component from the inspection room, and a blow-out unit that blows gas into the blow-out hole in the inspection chamber for discharging the electronic component from the inspection room to the component discharge path are further provided. You may prepare.
  • the part discharge path and the inspection room may always be opened so that electronic parts can be discharged while the inspection apparatus is operating.
  • a first temperature control unit that controls the temperature of the inspection room in order to set the electronic component to a predetermined temperature
  • a second temperature control unit that controls the temperature of the region near the suction hole of the suction unit in the inspection room.
  • a third temperature control unit that controls the temperature in the vicinity of the blowout hole of the blowout unit in the examination room.
  • At least one of the temperatures by the second and third temperature control units may be controlled between the temperature by the first temperature control unit and normal temperature.
  • the transport mechanism may transport the electronic component in the horizontal direction.
  • the transport mechanism may transport the electronic component in the rotation direction in a plan view of the inspection room.
  • the transport mechanism may be formed with at least one through-hole that communicates the first space and the second space.
  • the second dry gas supply unit may supply the dry gas toward the through hole so that a gas flow from the second space through the through hole toward the first space is formed.
  • the supply hole diameter of the second dry gas supply unit may be smaller than the supply hole diameter of the first dry gas supply unit.
  • the electronic component may be a crystal vibrating device.
  • An electronic component inspection apparatus is an inspection apparatus that inspects temperature characteristics of an electronic component in a state in which dry gas is supplied.
  • a component discharge path for discharging electronic components from the inspection room, a suction part for sucking gas from the suction holes in the inspection chamber to supply the electronic components from the component supply path to the inspection chamber, and the electronic component in the inspection chamber A discharge part that blows out gas to a blow-out hole in the inspection room for discharging from the part to the parts discharge path, a first temperature control part that controls the temperature of the inspection room in order to set the electronic component at a predetermined temperature, and the inspection room Near the suction hole of the suction part
  • a third temperature control unit for controlling the temperature in the vicinity of the blowout hole of the blowout unit in the examination room, and at least one of the temperatures by the
  • At least one of the temperatures by the second and third temperature control units is controlled between the temperature by the first temperature control unit and the normal temperature.
  • the part supply path and the inspection room may always be opened so that electronic parts can be supplied while the inspection apparatus is operating.
  • the part discharge path and the inspection room may always be opened so that electronic parts can be discharged while the inspection apparatus is operating.
  • An electronic component inspection method is an inspection method for inspecting temperature characteristics of an electronic component in a state where a dry gas is supplied, wherein (a) supplying the dry gas to an inspection room; b) supplying an electronic component to the inspection room, and (c) transferring the electronic component supplied to the inspection room for inspection by a transfer mechanism provided in the inspection room, (a) Supplying a dry gas to the first space on one side of the transfer mechanism in the examination room and supplying a dry gas to the second space on the other side of the transfer mechanism in the examination room.
  • the dry gas supply pressure supplied to the second space side is larger than the dry gas supply pressure supplied to the first space side.
  • the dry gas supply pressure supplied to the second space side of the examination room is larger than the dry gas supply pressure supplied to the first space (having a larger area than the second space) side of the examination room.
  • an electronic component inspection apparatus and inspection method capable of performing an accurate inspection without impairing the reliability of the electronic component.
  • FIG. 1 is an overall schematic diagram of an inspection apparatus according to an embodiment of the present invention.
  • FIG. 2 is a plan view for explaining an inspection apparatus according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view for explaining an inspection apparatus according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view for explaining an inspection apparatus according to an embodiment of the present invention.
  • FIG. 5 is a flowchart showing an electronic component inspection method according to an embodiment of the present invention.
  • FIG. 6 is an overall schematic diagram of an inspection apparatus according to another embodiment of the present invention.
  • FIG. 1 is an overall schematic view of an inspection apparatus according to an embodiment of the present invention
  • FIGS. 2 and 3 are a plan view and a cross-sectional view for explaining the inspection apparatus.
  • the XYZ axes in FIGS. 1 to 3 are common in each figure, the XY axis direction indicates the horizontal direction, and the Z axis direction indicates the vertical direction.
  • the inspection apparatus 1 is an apparatus that inspects the temperature characteristics of the electronic component W that is a workpiece.
  • the electronic component W may be a piezoelectric vibration device (for example, a crystal vibration device).
  • the inspection apparatus 1 performs an inspection such as a temperature-frequency characteristic of the piezoelectric vibration device.
  • the following example demonstrates the aspect which test
  • the inspection apparatus 1 includes a component supply unit 10 and a component supply path 12 for supplying an electronic component W, and first to third inspection chambers 20, 30, and 40. Is provided.
  • the temperature characteristics of the electronic component W supplied from the component supply unit 10 are inspected in the order of the first inspection chamber 20, the second inspection chamber 30, and the third inspection chamber 40. It is comprised so that.
  • the component supply unit (for example, part feeder) 10 accommodates a plurality of uninspected electronic components W and supplies them to the first inspection chamber 20 that is the first inspection through the component supply path (for example, linear feeder) 12. .
  • the component supply path 12 connects between the component supply unit 10 and the first inspection chamber 20 so that the electronic component W can be supplied to the first inspection chamber 20.
  • the first inspection room 20 is a sealed space for performing an inspection at a first set temperature (for example, a low temperature).
  • the first inspection chamber 20 can adjust the temperature and gas supply of its internal space.
  • the inspection can be performed in a low temperature state and a dry gas sealed.
  • the first examination room 20 may be controlled to a low temperature state using, for example, a water-cooled Peltier unit.
  • the first inspection chamber 20 is provided with a transport table 22 that is an example of a transport mechanism for transporting the electronic component W supplied from the component supply path 12.
  • the transfer table 22 is configured to be rotatable about the Z axis as a rotation axis in the XY plan view.
  • the conveyance table 22 is an index table whose outer periphery is formed in a gear shape, and stores electronic components W one by one between adjacent teeth, and rotates and conveys intermittently at a predetermined pitch. Also good.
  • the transfer table 22 may transfer the electronic component W in the first inspection chamber 20 in the horizontal direction and the rotation direction. Details of the transfer table 22 will be described later.
  • the first inspection chamber 20 is provided with an inspection mechanism 24 that performs an electrical inspection on the electronic component W transported by the transport table 22. As described above, by inspecting the plurality of electronic components W by the inspection mechanism 24 while transporting the plurality of electronic components W by the transport table 22, the plurality of electronic components W can be efficiently inspected by the flow operation.
  • the inspection mechanism 24 includes a measurement unit (not shown) that measures the electrical characteristics of the electronic component W and a calculation unit (not shown) that performs a calculation based on the measurement result.
  • the electronic component W determined to be a non-defective product is further transported toward the component path (component discharge path) 26 by the transport mechanism 22 for the next process, while the electronic component W determined to be defective is Since it is not always necessary to perform the next process, for example, it may be taken out from the transport table 22 and stored in a storage tray (not shown) for storing defective products.
  • the second inspection chamber 30 is connected to the first inspection chamber 20 via the component passage 26 and inspects the electronic component W supplied from the first inspection chamber 20.
  • the second inspection chamber 30 is a sealed space for performing inspection at a second set temperature (for example, normal temperature).
  • the second examination room 30 can adjust the temperature and gas supply of its internal space like other examination rooms. For example, the examination can be performed in a room temperature state and a dry gas sealed. It is like that.
  • the second examination room 30 may be controlled to a room temperature using, for example, an air-cooled Peltier unit. Similar to the other inspection rooms, the second inspection room 30 is provided with a transport table 32 for transporting the electronic component W and an inspection mechanism 34 that performs an electrical inspection on the electronic component W.
  • the third inspection chamber 40 is connected to the second inspection chamber 30 via the component passage 36 and inspects the electronic component W supplied from the second inspection chamber 30.
  • the third inspection chamber 40 is a sealed space for performing inspection at a third set temperature (for example, high temperature).
  • the third examination room 40 can adjust the temperature and gas supply of its internal space like other examination rooms. For example, the examination can be performed in a high temperature state and a dry gas sealed. It is like that.
  • the third examination room 40 may be controlled to a high temperature state using, for example, a heater unit.
  • the third inspection room 40 is provided with a transport table 42 for transporting the electronic component W and an inspection mechanism 44 that performs an electrical inspection on the electronic component W.
  • the third inspection chamber 40 is provided with a component discharge path 46 for discharging the electronic component W after all the inspections are completed, and the electronic component W accommodates the components that have been inspected via the component discharge path 46. Is stored in a storage tray (not shown).
  • FIG. 2 is a plan view of the first inspection chamber 20 on the component supply side
  • FIG. 3 is a cross-sectional view taken along line III-III in FIG.
  • FIG. 4 is a cross-sectional view of a portion where the first examination chamber 20 and the second examination chamber 30 are connected.
  • the first examination room 20 includes a base 25 and a cover 27 attached above the base 25, and an internal space is constituted by the base 25 and the cover 27.
  • the transfer table 22 extends into the first examination chamber 20 in an XY plane so as to divide the internal space formed by the base 25 and the cover 27 into a first space S1 and a second space S2. Is provided.
  • the base 25 is formed with a step due to the recess 21, and the transfer table 22 is provided above the recess 21 so as to cover the opening thereof, so that the internal space of the first inspection chamber 20 is covered by the transfer table 22.
  • the first space S ⁇ b> 1 on the 27th side and the second space S ⁇ b> 2 on the recessed portion 21 side of the base 25 of the transfer table 22 may be divided.
  • the first space S1 is wider than the second space S2 or substantially the same size as the second space S2. Note that the first space S1 and the second space S2 are spatially connected to each other so that the gas flow between them is possible.
  • the inspection apparatus 1 includes first and second dry gas supply units 50 and 52 that supply dry gas to the first inspection chamber 20, and an electronic component W in the first inspection chamber 20.
  • the temperature of the suction part 54 for sucking the gas for supplying the gas, the blowing part 56 for blowing the gas for discharging the electronic component W from the first examination room 20, and the temperature of the first examination room 20 are independently controlled.
  • the first to third temperature control units 58, 60, and 62 that are possible are further included.
  • the first dry gas supply unit 50 supplies dry gas to the first space S1 of the first inspection chamber 20, while the second dry gas supply unit 52 supplies dry gas to the second space S2 of the first inspection chamber 20.
  • the dry gas is supplied to the second space S ⁇ b> 2 through the supply hole 29 provided in 21.
  • the first and second dry gas supply units 50 and 52 supply the gas with high dryness to the extent that the gas with low dryness can be prevented from entering the first examination chamber 20. 1
  • the inside of the examination room 20 is controlled to a positive pressure.
  • the dry gas component to be supplied is not particularly limited, but may be air or nitrogen, for example.
  • the first and second dry gas supply units 50 and 52 are configured such that the dry gas supply pressure of the second dry gas supply unit 52 is greater than the dry gas supply pressure of the first dry gas supply unit 50. ing.
  • the gas supply amount itself may be adjusted, or the size of the hole diameter (diameter) through which the gas is supplied may be adjusted.
  • the hole diameter R2 of the supply hole 29 of the second dry gas supply section 52 is made smaller than the hole diameter R1 of the supply hole 28 of the first dry gas supply section 50, whereby the second dry gas is supplied.
  • the suction unit 54 is configured to suck the gas in the first examination chamber 20 through a suction hole 25a formed in the base 25.
  • the suction hole 25 a is formed on the component supply path 12 side in the base 25 of the first examination chamber 20, and may be formed outside the opening of the recess 21 of the base 25.
  • the suction hole 25a is provided on the second space S2 side when viewed from the transfer table 22.
  • a gas curtain gas barrier
  • a gas curtain is formed on the component supply path 12 side in the first inspection chamber 20 by gas suction by the suction unit 54, thereby suppressing the outside air from entering from the component supply path 12. it can.
  • a guide is provided for preventing the electronic component W supplied from the component supply path 12 from being scattered until the electronic table W is accommodated in the transfer table 22 between the teeth. It may be.
  • the suction hole 25 a of the suction part 54 may be provided adjacent to the supply hole 29 of the second dry gas supply part 52. As shown in FIG. 2, the suction hole 25 a of the suction unit 54 may be provided upstream of the supply hole 29 of the second dry gas supply unit 52 in the rotation direction of the transfer table 22. As described above, the supply hole 29 of the second dry gas supply part 52 is provided adjacent to the suction hole 25a of the suction part 54, so that the dry gas from the supply hole 29 is directed toward the suction hole 25a and is dried. A low degree of gas can be blown away, and the dry gas in the first examination chamber 20 can be agitated in the entire internal space to achieve a uniform degree of dryness.
  • the blow-out unit 56 is configured to blow out the gas in the first examination chamber 20 through a blow-out hole 25b formed in the base 25.
  • the blowout hole 25 b is formed on the component passage (component discharge passage) 26 side in the base 25 of the first examination chamber 20, and may be formed outside the opening of the concave portion 21 of the base 25. Further, the blowout hole 25b is provided on the second space S2 side as viewed from the transfer table 22.
  • the electronic component W can be discharged from the first inspection chamber 20 to the component passage 26 by blowing gas from the blowing portion 56.
  • the second examination room is provided through the suction hole 35a formed in the base 35 of the second examination room 30 in the same manner as the supply process of the electronic component W in the first examination room 20.
  • the suction part 64 By sucking the gas in 30 by the suction part 64, the electronic component W can be taken into the transfer table 35 in the second inspection chamber 30 from the component passage 26.
  • a gas curtain (gas barrier) is formed on the part passage 26 side in the second inspection chamber 30 by the gas blowing by the blow-out portion 56, and thereby it is possible to suppress the outside air from entering from the part passage 26.
  • the blowing unit 56 may be able to suck the gas once so as to be attracted to the transfer table 22 before blowing the gas from the blowing hole 25b. As a result, the electronic component W can be accurately discharged to the component passage 26.
  • the speed of the supply and discharge process of the electronic part W can be realized while suppressing the generation of moisture.
  • various mechanisms for handling the electronic component W are not required separately, and the number of components of the inspection apparatus can be reduced.
  • the entrance / exit space of the electronic component W is made as small as possible to reduce the size of the inspection device, and the entry of extraneous outside air is suppressed as the entrance / exit space is reduced. Can do.
  • the temperature of the first examination room 20 is controlled by the first temperature control unit 58, the second temperature control unit 60, and the third temperature control unit 62 independently of each other.
  • the first temperature control unit 58 controls the temperature of the first inspection chamber 20 in order to set the electronic component W to a predetermined temperature that is an inspection temperature range. If the first inspection chamber 20 is for inspection at a low temperature, for example, the first temperature control unit 58 may perform temperature control using a Peltier element or cooling water, for example.
  • the first temperature control unit 58 controls the temperature of the bottom surface (base 25) of the internal space of the first examination chamber 20.
  • the temperature control region by the first temperature control unit 58 is not particularly limited, but all or one of the lower regions of the transfer table 22 except for the temperature control regions by the second and third temperature control units 60 and 62. Part.
  • the second temperature control unit 60 and the third temperature control unit 62 can be controlled independently of the first temperature control unit 58, respectively.
  • the second temperature control unit 60 can control the temperature of the region near the suction hole 25a (that is, the inlet side region) in the first examination chamber 20, and the third temperature control unit 62 can control the temperature of the first examination chamber.
  • region) near the blowing hole 25b in 20 may be sufficient.
  • Either one or both of the second and third temperature control units 60 and 62 may be set to a temperature between the temperature by the first temperature control unit 58 and the normal temperature (outside temperature).
  • the first temperature control unit 58 is controlled to be ⁇ 30 ° C. or more and ⁇ 10 ° C. or less, and one or both of the second and second temperature control units are controlled to about 10 ° C. May be.
  • the transfer table 22 of the first examination chamber 20 is formed with at least one through hole 23 that communicates the first space S1 and the second space S2.
  • the through hole 23 extends along the Z-axis direction.
  • a plurality of through holes 23 may be formed in the conveyance table 22 at predetermined intervals along the rotation direction of the conveyance table 22.
  • the second dry gas supply unit 52 supplies the dry gas toward the through hole 23 side.
  • the part supply path 12 and the first inspection chamber 20 may always be opened so that the electronic part W can be supplied while the inspection apparatus 1 is operating. In other words, regardless of whether or not the electronic component W is supplied to the first inspection chamber 20, the gap between the component supply path 12 and the first inspection chamber 20 is opened while the first inspection chamber 20 is operating. You may continue.
  • a shutter may be provided between the component supply path 12 and the first inspection chamber 20 to suppress a gas flow between the two while the inspection apparatus 1 is operating.
  • the first inspection chamber 20 and the component passage 26 may always be opened so that the electronic component W can be discharged while the inspection apparatus 1 is operating. In other words, regardless of whether or not the electronic component W is discharged from the first inspection chamber 20, the first inspection chamber 20 and the component passage 26 are kept open while the first inspection chamber 20 is operating. May be.
  • a shutter between the first inspection chamber 20 and the component passage 26 may be provided that suppresses the flow of gas flow between the two while the inspection apparatus 1 is operating.
  • the dry gas supply pressure of the second dry gas supply unit 52 that supplies the dry gas to the second space S2 of the first inspection chamber 20 is the first.
  • the pressure is higher than the dry gas supply pressure of the first dry gas supply unit 50 that supplies the dry gas to the first space S1 (having a size larger than the second space S2) of the examination room 20.
  • the electronic component inspection method according to the present embodiment includes the contents described for the inspection apparatus 1.
  • dry gas is supplied to the first examination room 20 (S10). Specifically, dry gas is supplied to the first and second spaces S1, S2 of the first examination room 20 using the first and second dry gas supply units 50, 52, respectively. At this time, the dry gas supply pressure of the second dry gas supply unit 52 is set larger than the dry gas supply pressure of the first dry gas supply unit 50. As a result, the dry gas can be agitated in the entire internal space of the first examination chamber 20 to make the dryness uniform.
  • the first to third temperature control units 58, 60, and 62 perform temperature control on the first inspection chamber 20, thereby allowing the first inspection chamber 20 to be inspected at a first set temperature (for example, a low temperature). ),
  • the vicinity of the entrance / exit of the electronic component W is set to a temperature closer to room temperature than the first set temperature. According to this, for example, when the first examination room 20 is a low temperature examination, the occurrence of condensation and frost formation in the vicinity of the entrance / exit of the first examination room 20 is prevented, and the reliability of the electronic component W is not impaired. Accurate inspection can be done.
  • the electronic component W is supplied to the first examination room 20 (S12). Specifically, one electronic component W is supplied by supplying the uninspected electronic component W accommodated in the component supply unit 10 to the component supply path 12 and sucking the gas from the suction hole 25a by the suction unit 54. Each is accommodated between adjacent teeth of the transfer table 22. In other words, gas is sucked from the suction holes 25a so that the electronic component W is inserted between adjacent teeth of the transport table at the timing when the transport table 22 rotates at a predetermined pitch. Thus, while supplying the plurality of electronic components W to the first inspection chamber 20, they are transported toward the inspection mechanism 24 by the transport table 22.
  • the electronic component W is inspected in the first inspection room 20. Specifically, the electronic component W is electrically inspected at the timing when it is transported to the inspection mechanism 24 by the transport table 22, and the electronic component W that has been inspected is directed toward the component passage 26 for the next inspection. It is further conveyed.
  • the electronic component W that has been inspected by the first inspection chamber 20 is supplied to the second inspection chamber 30 through the component passage 26 and is inspected at the second set temperature (for example, normal temperature) in the second inspection chamber 30 ( S16), and thereafter, similarly, it is supplied to the third inspection chamber 40 through the component passage 36, and the inspection at the third set temperature (for example, high temperature) is performed in the third inspection chamber 40 (S18).
  • the second set temperature for example, normal temperature
  • the third inspection chamber 40 for example, high temperature
  • the dry gas supply pressure supplied to the second space S2 side of the first inspection chamber 20 is the first space S1 (the first space in the first inspection chamber 20). It is larger than the dry gas supply pressure supplied to the side having a space of 2 spaces S2 or more. According to this, even when the internal space of the first examination room 20 is divided into the first and second spaces S1 and S2 by the transfer table 22, it is moistened to one space (second space S2) side. It is possible to suppress the retention of air. Therefore, an accurate inspection can be performed without impairing the reliability of the electronic component W.
  • the inspection apparatus 1 has been described with an example in which the electronic device W inspects a plurality of temperature ranges (for example, low temperature, normal temperature, and high temperature), but the present invention is limited to this.
  • the temperature range may be any one.
  • the order is not limited to low temperature, normal temperature, and high temperature, and different orders may be applied.
  • a Peltier unit for example, a water-cooled Peltier unit
  • the inspection can be performed in a preferred order as appropriate according to the type of the electronic component W or the like.
  • each specific configuration of the first inspection room 20 shown in FIGS. 2 to 4 may be applied to an inspection room such as a normal temperature inspection or a high temperature inspection. According to this, even in normal temperature and high temperature inspections, it is possible to prevent harmful effects due to moisture, and it is possible to perform an accurate inspection without impairing the reliability of the electronic component W.
  • the index table that can be transported in the horizontal direction and the rotation direction has been described as an example of the transport mechanism.
  • the specific configuration and transport direction of the transport mechanism are not limited thereto.
  • the way of dividing the first spaces S1 and S2 is not particularly limited.
  • the electronic component to be inspected may be other devices other than the piezoelectric vibration device as long as there is a demand for inspecting the temperature characteristics.
  • the piezoelectric vibration device may include other piezoelectric vibrators other than the crystal vibrator.
  • one supply hole is provided in each of the first and second dry gas supply units.
  • the number and arrangement of the supply holes are not limited to the example in the above embodiment.
  • a plurality of supply holes for the second dry gas supply unit may be formed.
  • the configuration in which the inspection apparatus includes the second dry gas supply unit has been described.
  • the second dry gas supply unit may be omitted. Even if the second dry gas supply unit is not provided, at least one of the temperatures by the second and third temperature control units is controlled between the temperature by the first temperature control unit and the normal temperature, thereby A sudden temperature change in the vicinity of supply or discharge of the component can be prevented, and adverse effects on the electronic component due to the temperature change can be suppressed or alleviated. Therefore, an accurate inspection can be performed without impairing the reliability of the electronic component.
  • FIG. 6 is an overall schematic diagram of an inspection apparatus according to another embodiment (second embodiment) of the present invention.
  • the inspection according to the second set temperature for example, room temperature
  • the inspection according to the third set temperature for example, high temperature
  • the inspection apparatus 3 includes a component supply unit 10 and a component supply path 12 for supplying an electronic component W, a first inspection chamber 20 based on a first set temperature (for example, low temperature), a second and a third. And a second inspection room 70 at a set temperature (for example, normal temperature and high temperature).
  • the second inspection chamber 70 is provided with a transport table 72 that sequentially transports the electronic components W supplied from the component passage 26 to the inspection mechanisms 74 and 76.
  • the normal temperature inspection may be performed by the inspection mechanism 74 while transporting the electronic component W that has been subjected to the low temperature inspection
  • the high temperature inspection may be performed by the inspection mechanism 76 while transporting the electronic component W.
  • the second inspection chamber 70 is partially controllable so that the inspection mechanism 74 can be inspected at the second set temperature and the inspection mechanism 76 can be inspected at the third set temperature.
  • the electronic component W that has been inspected by the inspection mechanism 76 is stored in a storage tray (not shown) for storing the inspection-completed component via the component discharge path 78.
  • the set temperature for the inspection in the first laboratory may be two types.
  • the combination may be, for example, low temperature and normal temperature.
  • each embodiment described above is for facilitating understanding of the present invention, and is not intended to limit the present invention.
  • the present invention can be changed / improved without departing from the spirit thereof, and the present invention includes equivalents thereof.
  • those obtained by appropriately modifying the design of each embodiment by those skilled in the art are also included in the scope of the present invention as long as they include the features of the present invention.
  • each element included in each embodiment and its arrangement, material, condition, shape, size, and the like are not limited to those illustrated, and can be changed as appropriate.
  • each element included in each embodiment can be combined as much as technically possible, and combinations thereof are included in the scope of the present invention as long as they include the features of the present invention.

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  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Abstract

The present invention is provided with: an inspection chamber (20) in which an electronic component W is inspected; a transport mechanism (22) provided inside the inspection chamber (20), said transport mechanism (22) transporting, for inspection purposes, the electronic component W supplied to the inspection chamber (20); a first dry gas supply part (50) for supplying dry gas to a first space (S1) in the inspection chamber (20), the first space (S1) being on one surface side of the transport mechanism (22); and a second dry gas supply part (52) for supplying dry gas to a second space (S2) in the inspection chamber (20), the second space (S2) being on the other surface side of the transport mechanism (22). The first space (S1) is at least as wide as the second space (S2), and the pressure at which dry gas is supplied by the second dry gas supply part (52) is higher than the pressure at which dry gas is supplied by the first dry gas supply part (50).

Description

電子部品の検査装置及び検査方法Electronic component inspection apparatus and inspection method
　本発明は、電子部品の検査装置及び検査方法に関する。 The present invention relates to an electronic component inspection apparatus and inspection method.
　電子部品が組み込まれた電子機器は様々な温度環境で使用されるため、広い温度範囲に対して電子部品が所望の電気的特性を備えているかどうかの検査が行われる（特許文献１乃至３参照）。特に、水晶振動子などを用いた圧電振動デバイスでは、広い温度範囲で良好な周波数特性が要求されるため、このような温度特性の検査は重要である。 Since an electronic device incorporating an electronic component is used in various temperature environments, it is inspected whether the electronic component has a desired electrical characteristic over a wide temperature range (see Patent Documents 1 to 3). ). In particular, in a piezoelectric vibration device using a crystal resonator or the like, good frequency characteristics are required in a wide temperature range, and thus such temperature characteristics inspection is important.
　しかしながら、従来の温度特性の検査においては、湿った空気によって電子部品に悪影響が与えられ、正確な検査が妨げられるとともに、電子部品の信頼性を損なう場合があった。例えば、低温状態で電子部品を検査する場合、そのような湿った空気によって電子部品や検査装置に結露や着霜などが発生する場合があった。 However, in the conventional temperature characteristic inspection, the electronic components are adversely affected by moist air, and accurate inspection is hindered, and the reliability of the electronic components may be impaired. For example, when an electronic component is inspected at a low temperature, condensation or frosting may occur in the electronic component or the inspection apparatus due to such moist air.
　なお、所定の温度環境に保ちながら電子部品を検査するために、温度環境を維持可能なように密閉された検査室内で電子部品を検査する態様が考えられるが、そのような検査室に電子部品を供給するためには、例えばシャッタの開閉動作が必要となり、シャッタの開放によって検査室内の温度が変化してしまい、所定の温度環境に戻す時間がかかり、全体として検査時間がかかってしまう場合があった。 In order to inspect electronic components while maintaining a predetermined temperature environment, there may be a mode in which the electronic components are inspected in a closed inspection room so that the temperature environment can be maintained. For example, it is necessary to open and close the shutter, and the opening of the shutter changes the temperature in the examination room, which takes time to return to a predetermined temperature environment, and may take a whole examination time. there were.
特開２００２－２１４２８３号公報JP 2002-214283 A 特開平１０－２７４６６７号公報Japanese Patent Laid-Open No. 10-274667 特開２００６－２９２５９０号公報JP 2006-292590 A
　本発明はこのような事情に鑑みてなされたものであり、電子部品の信頼性を損なうことなく、正確な検査を行うことができる電子部品の検査装置及び検査方法を提供することを目的とする。 The present invention has been made in view of such circumstances, and an object thereof is to provide an electronic component inspection apparatus and an inspection method capable of performing an accurate inspection without impairing the reliability of the electronic component. .
　本発明の一側面に係る電子部品の検査装置は、ドライガスが供給された状態で電子部品の温度特性を検査する検査装置であって、電子部品を検査する検査室と、検査室内に設けられ、検査室に供給された電子部品を検査するために搬送する搬送機構と、検査室における搬送機構の一方面側の第１空間にドライガスを供給する第１ドライガス供給部と、検査室における搬送機構の他方面側の第２空間にドライガスを供給する第２ドライガス供給部とを備え、第１空間は、第２空間以上の広さを有しており、第２ドライガス供給部のドライガス供給圧力は、第１ドライガス供給部のドライガス供給圧力よりも大きい。 An electronic component inspection apparatus according to an aspect of the present invention is an inspection apparatus that inspects temperature characteristics of an electronic component in a state where dry gas is supplied, and is provided in an inspection room for inspecting the electronic component and an inspection room. A transport mechanism for transporting the electronic components supplied to the inspection room, a first dry gas supply unit for supplying dry gas to the first space on one side of the transport mechanism in the inspection room, A second dry gas supply unit that supplies dry gas to the second space on the other surface side of the transport mechanism, and the first space is larger than the second space, and the second dry gas supply unit The dry gas supply pressure is higher than the dry gas supply pressure of the first dry gas supply unit.
　上記構成によれば、検査室の第２空間にドライガスを供給する第２ドライガス供給部のドライガス供給圧力が、検査室の第１空間（第２空間以上の広さを有する）にドライガスを供給する第１ドライガス供給部のドライガス供給圧力よりも大きい。これによれば、搬送機構によって検査室の内部空間が第１及び第２空間に分けられている場合であっても、一方の空間側に湿った空気が滞留することを抑制することができる。したがって、電子部品の信頼性を損なうことなく、正確な検査を行うことができる。 According to the above configuration, the dry gas supply pressure of the second dry gas supply unit that supplies the dry gas to the second space of the examination room is dry in the first space (having a larger area than the second space) of the examination room. It is larger than the dry gas supply pressure of the first dry gas supply unit for supplying the gas. According to this, even when the internal space of the examination room is divided into the first and second spaces by the transport mechanism, it is possible to suppress damp air from staying in one space side. Therefore, an accurate inspection can be performed without impairing the reliability of the electronic component.
　上記検査装置において、電子部品を検査室に供給するための部品供給路と、電子部品を部品供給路から検査室に供給するために、検査室内の吸引孔からガスを吸引する吸引部とをさらに備えてもよい。 In the inspection apparatus, a component supply path for supplying the electronic component to the inspection room, and a suction unit for sucking gas from the suction hole in the inspection chamber for supplying the electronic component from the component supply path to the inspection room are further provided. You may prepare.
　上記検査装置において、吸引部の吸引孔は、第２空間側に設けられてもよい。 In the inspection apparatus, the suction hole of the suction unit may be provided on the second space side.
　上記検査装置において、第２ドライガス供給部の供給孔は、吸引部の吸引孔に隣接して設けられてもよい。 In the inspection apparatus, the supply hole of the second dry gas supply unit may be provided adjacent to the suction hole of the suction unit.
　上記検査装置において、部品供給路と検査室との間は、検査装置が作動している間、電子部品が供給可能なように常に開放されてもよい。 In the above inspection apparatus, the part supply path and the inspection room may always be opened so that electronic parts can be supplied while the inspection apparatus is operating.
　上記検査装置において、電子部品を検査室から排出するための部品排出路と、電子部品を検査室から部品排出路へ排出するために、検査室内の吹出孔にガスを吹出す吹出部とをさらに備えてもよい。 In the inspection apparatus, a component discharge path for discharging the electronic component from the inspection room, and a blow-out unit that blows gas into the blow-out hole in the inspection chamber for discharging the electronic component from the inspection room to the component discharge path are further provided. You may prepare.
　上記検査装置において、部品排出路と検査室との間は、検査装置が作動している間、電子部品が排出可能なように常に開放されてもよい。 In the above inspection apparatus, the part discharge path and the inspection room may always be opened so that electronic parts can be discharged while the inspection apparatus is operating.
　上記検査装置において、電子部品を所定温度に設定するために検査室の温度を制御する第１温度制御部と、検査室における吸引部の吸引孔付近の領域の温度を制御する第２温度制御部と、検査室における吹出部の吹出孔付近の領域の温度を制御する第３温度制御部とをさらに備えてもよい。 In the inspection apparatus, a first temperature control unit that controls the temperature of the inspection room in order to set the electronic component to a predetermined temperature, and a second temperature control unit that controls the temperature of the region near the suction hole of the suction unit in the inspection room. And a third temperature control unit that controls the temperature in the vicinity of the blowout hole of the blowout unit in the examination room.
　上記検査装置において、第２及び第３温度制御部による温度の少なくとも一方は、第１温度制御部による温度と常温の間に制御されてもよい。 In the inspection apparatus, at least one of the temperatures by the second and third temperature control units may be controlled between the temperature by the first temperature control unit and normal temperature.
　上記検査装置において、搬送機構は、電子部品を水平方向に搬送してもよい。 In the inspection apparatus, the transport mechanism may transport the electronic component in the horizontal direction.
　上記検査装置において、搬送機構は、検査室の平面視において電子部品を回転方向に搬送してもよい。 In the inspection apparatus, the transport mechanism may transport the electronic component in the rotation direction in a plan view of the inspection room.
　上記検査装置において、搬送機構には、第１空間と第２空間を連通する少なくとも一つの貫通孔が形成されてもよい。 In the inspection apparatus, the transport mechanism may be formed with at least one through-hole that communicates the first space and the second space.
　上記検査装置において、第２ドライガス供給部は、第２空間から貫通孔を通って第１空間に向かうガス流が形成されるように、貫通孔側に向かってドライガスを供給してもよい。 In the inspection apparatus, the second dry gas supply unit may supply the dry gas toward the through hole so that a gas flow from the second space through the through hole toward the first space is formed. .
　上記検査装置において、第２のドライガス供給部の供給孔径は、第１のドライガス供給部の供給孔径よりも小さくてもよい。 In the above inspection apparatus, the supply hole diameter of the second dry gas supply unit may be smaller than the supply hole diameter of the first dry gas supply unit.
　上記検査装置において、電子部品は、水晶振動デバイスであってもよい。 In the above inspection apparatus, the electronic component may be a crystal vibrating device.
　本発明の他の一側面に係る電子部品の検査装置は、ドライガスが供給された状態で電子部品の温度特性を検査する検査装置であって、電子部品を検査する検査室と、検査室内に設けられ、検査室に供給された電子部品を検査するために搬送する搬送機構と、検査室内にドライガスを供給するドライガス供給部と、電子部品を検査室に供給するための部品供給路と、電子部品を検査室から排出するための部品排出路と、電子部品を部品供給路から検査室に供給するために、検査室内の吸引孔からガスを吸引する吸引部と、電子部品を検査室から部品排出路へ排出するために、検査室内の吹出孔にガスを吹出す吹出部と、電子部品を所定温度に設定するために検査室の温度を制御する第１温度制御部と、検査室における吸引部の吸引孔付近の領域の温度を制御する第２温度制御部と、検査室における吹出部の吹出孔付近の領域の温度を制御する第３温度制御部とを備え、第２及び第３温度制御部による温度の少なくとも一方は、第１温度制御部による温度と常温の間に制御される。 An electronic component inspection apparatus according to another aspect of the present invention is an inspection apparatus that inspects temperature characteristics of an electronic component in a state in which dry gas is supplied. A transport mechanism for transporting the electronic components supplied to the inspection room to inspect, a dry gas supply unit for supplying dry gas into the inspection chamber, and a component supply path for supplying the electronic components to the inspection room; A component discharge path for discharging electronic components from the inspection room, a suction part for sucking gas from the suction holes in the inspection chamber to supply the electronic components from the component supply path to the inspection chamber, and the electronic component in the inspection chamber A discharge part that blows out gas to a blow-out hole in the inspection room for discharging from the part to the parts discharge path, a first temperature control part that controls the temperature of the inspection room in order to set the electronic component at a predetermined temperature, and the inspection room Near the suction hole of the suction part And a third temperature control unit for controlling the temperature in the vicinity of the blowout hole of the blowout unit in the examination room, and at least one of the temperatures by the second and third temperature control units. Is controlled between the temperature and normal temperature by the first temperature control unit.
　上記構成によれば、第２及び第３温度制御部による温度の少なくとも一方が、第１温度制御部による温度と常温の間に制御される。これにより、電子部品の供給又は排出付近における急激な温度変化を防止することができ、温度変化に伴う電子部品への悪影響を抑制又は緩和することができる。したがって、電子部品の信頼性を損なうことなく、正確な検査を行うことができる。 According to the above configuration, at least one of the temperatures by the second and third temperature control units is controlled between the temperature by the first temperature control unit and the normal temperature. Thereby, a rapid temperature change in the vicinity of the supply or discharge of the electronic component can be prevented, and an adverse effect on the electronic component due to the temperature change can be suppressed or alleviated. Therefore, an accurate inspection can be performed without impairing the reliability of the electronic component.
　上記検査装置において、部品供給路と検査室との間は、検査装置が作動している間、電子部品が供給可能なように常に開放されてもよい。 In the above inspection apparatus, the part supply path and the inspection room may always be opened so that electronic parts can be supplied while the inspection apparatus is operating.
　上記検査装置において、部品排出路と検査室との間は、検査装置が作動している間、電子部品が排出可能なように常に開放されてもよい。 In the above inspection apparatus, the part discharge path and the inspection room may always be opened so that electronic parts can be discharged while the inspection apparatus is operating.
　本発明の一側面に係る電子部品の検査方法は、ドライガスが供給された状態で電子部品の温度特性を検査する検査方法であって、（ａ）検査室にドライガスを供給すること、（ｂ）検査室に電子部品を供給すること、及び、（ｃ）検査室内に設けられた搬送機構によって、検査室に供給された電子部品を検査するために搬送することを含み、（ａ）は、検査室における搬送機構の一方面側の第１空間にドライガスを供給し、検査室における搬送機構の他方面側の第２空間にドライガスを供給することを含み、第１空間は、第２空間以上の広さを有しており、第２空間側へ供給するドライガス供給圧力は、第１空間側へ供給するドライガス圧力よりも大きい。 An electronic component inspection method according to an aspect of the present invention is an inspection method for inspecting temperature characteristics of an electronic component in a state where a dry gas is supplied, wherein (a) supplying the dry gas to an inspection room; b) supplying an electronic component to the inspection room, and (c) transferring the electronic component supplied to the inspection room for inspection by a transfer mechanism provided in the inspection room, (a) Supplying a dry gas to the first space on one side of the transfer mechanism in the examination room and supplying a dry gas to the second space on the other side of the transfer mechanism in the examination room. The dry gas supply pressure supplied to the second space side is larger than the dry gas supply pressure supplied to the first space side.
　上記構成によれば、検査室の第２空間側へ供給するドライガス供給圧力が、検査室の第１空間（第２空間以上の広さを有する）側へ供給するドライガス供給圧力よりも大きい。これによれば、搬送機構によって検査室の内部空間が第１及び第２空間に分けられている場合であっても、一方の空間側に湿った空気が滞留することを抑制することができる。したがって、電子部品の信頼性を損なうことなく、正確な検査を行うことができる。 According to the above configuration, the dry gas supply pressure supplied to the second space side of the examination room is larger than the dry gas supply pressure supplied to the first space (having a larger area than the second space) side of the examination room. . According to this, even when the internal space of the examination room is divided into the first and second spaces by the transport mechanism, it is possible to suppress damp air from staying in one space side. Therefore, an accurate inspection can be performed without impairing the reliability of the electronic component.
　本発明によれば、電子部品の信頼性を損なうことなく、正確な検査を行うことができる電子部品の検査装置及び検査方法を提供することができる。 According to the present invention, it is possible to provide an electronic component inspection apparatus and inspection method capable of performing an accurate inspection without impairing the reliability of the electronic component.
図１は、本発明の一実施形態に係る検査装置の全体概略図である。FIG. 1 is an overall schematic diagram of an inspection apparatus according to an embodiment of the present invention. 図２は、本発明の一実施形態に係る検査装置を説明するための平面図である。FIG. 2 is a plan view for explaining an inspection apparatus according to an embodiment of the present invention. 図３は、本発明の一実施形態に係る検査装置を説明するための断面図である。FIG. 3 is a cross-sectional view for explaining an inspection apparatus according to an embodiment of the present invention. 図４は、本発明の一実施形態に係る検査装置を説明するための断面図である。FIG. 4 is a cross-sectional view for explaining an inspection apparatus according to an embodiment of the present invention. 図５は、本発明の一実施形態に係る電子部品の検査方法を示すフローチャートである。FIG. 5 is a flowchart showing an electronic component inspection method according to an embodiment of the present invention. 図６は、本発明の他の実施形態に係る検査装置の全体概略図である。FIG. 6 is an overall schematic diagram of an inspection apparatus according to another embodiment of the present invention.
　以下に本発明の実施の形態を説明する。以下の図面の記載において、同一又は類似の構成要素は同一又は類似の符号で表している。図面は例示であり、各部の寸法や形状は模式的なものであり、本願発明の技術的範囲を当該実施の形態に限定して解するべきではない。 Embodiments of the present invention will be described below. In the following description of the drawings, the same or similar components are denoted by the same or similar reference numerals. The drawings are exemplary, the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be construed as being limited to the embodiments.
　図１は本発明の一実施形態に係る検査装置の全体概略図であり、図２及び図３はこの検査装置を説明するための平面図及び断面図である。図１乃至３におけるＸＹＺ軸は各図において共通であり、ＸＹ軸方向は水平方向を示し、Ｚ軸方向は鉛直方向を示している。 FIG. 1 is an overall schematic view of an inspection apparatus according to an embodiment of the present invention, and FIGS. 2 and 3 are a plan view and a cross-sectional view for explaining the inspection apparatus. The XYZ axes in FIGS. 1 to 3 are common in each figure, the XY axis direction indicates the horizontal direction, and the Z axis direction indicates the vertical direction.
　以下、図１から図４を参照しつつ、本発明の一実施形態に係る電子部品の検査装置を説明する。 Hereinafter, an electronic component inspection apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4.
　本実施形態に係る検査装置１は、ワークである電子部品Ｗの温度特性を検査する装置である。電子部品Ｗは圧電振動デバイス（例えば水晶振動デバイス）であってもよく、この場合、検査装置１は圧電振動デバイスの温度－周波数特性などの検査を行う。以下の一例では、電子部品Ｗに対して複数の温度範囲（例えば低温、常温及び高温）を検査する態様を説明する。 The inspection apparatus 1 according to the present embodiment is an apparatus that inspects the temperature characteristics of the electronic component W that is a workpiece. The electronic component W may be a piezoelectric vibration device (for example, a crystal vibration device). In this case, the inspection apparatus 1 performs an inspection such as a temperature-frequency characteristic of the piezoelectric vibration device. The following example demonstrates the aspect which test | inspects several temperature range (for example, low temperature, normal temperature, and high temperature) with respect to the electronic component W. FIG.
　図１に示すように、本実施形態に係る検査装置１は、電子部品Ｗを供給するための部品供給部１０及び部品供給路１２と、第１から第３の検査室２０，３０，４０とを備える。この検査装置１は、部品供給部１０（部品供給路１２）から供給される電子部品Ｗが、第１検査室２０、第２検査室３０及び第３検査室４０の順番に温度特性が検査されるように構成されている。 As shown in FIG. 1, the inspection apparatus 1 according to the present embodiment includes a component supply unit 10 and a component supply path 12 for supplying an electronic component W, and first to third inspection chambers 20, 30, and 40. Is provided. In this inspection apparatus 1, the temperature characteristics of the electronic component W supplied from the component supply unit 10 (component supply path 12) are inspected in the order of the first inspection chamber 20, the second inspection chamber 30, and the third inspection chamber 40. It is comprised so that.
　部品供給部（例えばパーツフィーダ）１０は、未検査の複数の電子部品Ｗを収容し、それらを部品供給路（例えばリニアフィーダ）１２を介して最初の検査である第１検査室２０へ供給する。部品供給路１２は、電子部品Ｗを第１検査室２０へ供給可能なように、部品供給部１０と第１検査室２０の間を連結している。 The component supply unit (for example, part feeder) 10 accommodates a plurality of uninspected electronic components W and supplies them to the first inspection chamber 20 that is the first inspection through the component supply path (for example, linear feeder) 12. . The component supply path 12 connects between the component supply unit 10 and the first inspection chamber 20 so that the electronic component W can be supplied to the first inspection chamber 20.
　第１検査室２０は、第１の設定温度（例えば低温）において検査を行うための密閉空間である。第１検査室２０は、その内部空間の温度及びガス供給を調整可能となっており、例えば、低温状態かつドライガスが密封された状態で検査を行うことができるようになっている。第１検査室２０は、例えば水冷式ペルチェユニットを用いて低温状態に制御されてもよい。 The first inspection room 20 is a sealed space for performing an inspection at a first set temperature (for example, a low temperature). The first inspection chamber 20 can adjust the temperature and gas supply of its internal space. For example, the inspection can be performed in a low temperature state and a dry gas sealed. The first examination room 20 may be controlled to a low temperature state using, for example, a water-cooled Peltier unit.
　第１検査室２０には、部品供給路１２から供給された電子部品Ｗを搬送するための、搬送機構の一例である搬送テーブル２２が設けられている。搬送テーブル２２は、ＸＹ平面視においてＺ軸を回転軸として回転可能に構成されている。搬送テーブル２２は、図１に示すように、外周が歯車状に形成され、電子部品Ｗを隣接する歯の間に一つずつ収容して所定ピッチで間欠的に回転搬送するインデックステーブルであってもよい。このように、搬送テーブル２２は、第１検査室２０内において電子部品Ｗを水平方向かつ回転方向に搬送してもよい。なお、搬送テーブル２２の詳細は後述する。 The first inspection chamber 20 is provided with a transport table 22 that is an example of a transport mechanism for transporting the electronic component W supplied from the component supply path 12. The transfer table 22 is configured to be rotatable about the Z axis as a rotation axis in the XY plan view. As shown in FIG. 1, the conveyance table 22 is an index table whose outer periphery is formed in a gear shape, and stores electronic components W one by one between adjacent teeth, and rotates and conveys intermittently at a predetermined pitch. Also good. Thus, the transfer table 22 may transfer the electronic component W in the first inspection chamber 20 in the horizontal direction and the rotation direction. Details of the transfer table 22 will be described later.
　第１検査室２０には、搬送テーブル２２によって搬送された電子部品Ｗに対して電気的検査を行う検査機構２４が設けられている。このように、複数の電子部品Ｗを搬送テーブル２２によって搬送しながら検査機構２４によって検査することによって、複数の電子部品Ｗを流れ作業で効率良く検査することができる。検査機構２４は、電子部品Ｗに対して電気的特性の測定を行う測定部（図示しない）と、当該測定の結果に基づいて演算を行う演算部（図示しない）とを備えている。検査の結果、良品と判断された電子部品Ｗは、次工程のために搬送機構２２によって部品通路（部品排出路）２６に向けてさらに搬送され、他方、不良品と判断された電子部品Ｗは、必ずしも次工程を行う必要がないので、例えば、搬送テーブル２２から取り出して不良品を収容するための収容トレイ（図示しない）に格納してもよい。 The first inspection chamber 20 is provided with an inspection mechanism 24 that performs an electrical inspection on the electronic component W transported by the transport table 22. As described above, by inspecting the plurality of electronic components W by the inspection mechanism 24 while transporting the plurality of electronic components W by the transport table 22, the plurality of electronic components W can be efficiently inspected by the flow operation. The inspection mechanism 24 includes a measurement unit (not shown) that measures the electrical characteristics of the electronic component W and a calculation unit (not shown) that performs a calculation based on the measurement result. As a result of the inspection, the electronic component W determined to be a non-defective product is further transported toward the component path (component discharge path) 26 by the transport mechanism 22 for the next process, while the electronic component W determined to be defective is Since it is not always necessary to perform the next process, for example, it may be taken out from the transport table 22 and stored in a storage tray (not shown) for storing defective products.
　第２検査室３０は、部品通路２６を介して第１検査室２０と連結され、第１検査室２０から供給された電子部品Ｗを検査する。第２検査室３０は、第２の設定温度（例えば常温）において検査を行うための密閉空間である。第２検査室３０は、他の検査室と同様に、その内部空間の温度及びガス供給を調整可能となっており、例えば、常温状態かつドライガスが密封された状態で検査を行うことができるようになっている。第２検査室３０は、例えば空冷式ペルチェユニットを用いて常温状態に制御されてもよい。第２検査室３０には、他の検査室と同様に、電子部品Ｗを搬送するための搬送テーブル３２と、電子部品Ｗに対して電気的検査を行う検査機構３４が設けられている。 The second inspection chamber 30 is connected to the first inspection chamber 20 via the component passage 26 and inspects the electronic component W supplied from the first inspection chamber 20. The second inspection chamber 30 is a sealed space for performing inspection at a second set temperature (for example, normal temperature). The second examination room 30 can adjust the temperature and gas supply of its internal space like other examination rooms. For example, the examination can be performed in a room temperature state and a dry gas sealed. It is like that. The second examination room 30 may be controlled to a room temperature using, for example, an air-cooled Peltier unit. Similar to the other inspection rooms, the second inspection room 30 is provided with a transport table 32 for transporting the electronic component W and an inspection mechanism 34 that performs an electrical inspection on the electronic component W.
　第３検査室４０は、部品通路３６を介して第２検査室３０と連結され、第２検査室３０から供給された電子部品Ｗを検査する。第３検査室４０は、第３の設定温度（例えば高温）において検査を行うための密閉空間である。第３検査室４０は、他の検査室と同様に、その内部空間の温度及びガス供給を調整可能となっており、例えば、高温状態かつドライガスが密封された状態で検査を行うことができるようになっている。第３検査室４０は、例えばヒータユニットを用いて高温状態に制御されてもよい。第３検査室４０には、他の検査室と同様に、電子部品Ｗを搬送するための搬送テーブル４２と、電子部品Ｗに対して電気的検査を行う検査機構４４が設けられている。 The third inspection chamber 40 is connected to the second inspection chamber 30 via the component passage 36 and inspects the electronic component W supplied from the second inspection chamber 30. The third inspection chamber 40 is a sealed space for performing inspection at a third set temperature (for example, high temperature). The third examination room 40 can adjust the temperature and gas supply of its internal space like other examination rooms. For example, the examination can be performed in a high temperature state and a dry gas sealed. It is like that. The third examination room 40 may be controlled to a high temperature state using, for example, a heater unit. As in the other inspection rooms, the third inspection room 40 is provided with a transport table 42 for transporting the electronic component W and an inspection mechanism 44 that performs an electrical inspection on the electronic component W.
　第３検査室４０には、全ての検査が終了した電子部品Ｗを排出するための部品排出路４６が設けられており、電子部品Ｗは部品排出路４６を介して検査終了の部品を収容するための収容トレイ（図示しない）に格納される。 The third inspection chamber 40 is provided with a component discharge path 46 for discharging the electronic component W after all the inspections are completed, and the electronic component W accommodates the components that have been inspected via the component discharge path 46. Is stored in a storage tray (not shown).
　次に、図２から図４を参照して検査装置１の詳細を説明する。ここで、図２は、第１検査室２０のうち部品供給側の平面図であり、図３は図２のＩＩＩ－ＩＩＩ線断面図である。また、図４は、第１検査室２０と第２検査室３０とが連結された部分の断面図である。 Next, details of the inspection apparatus 1 will be described with reference to FIGS. Here, FIG. 2 is a plan view of the first inspection chamber 20 on the component supply side, and FIG. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a cross-sectional view of a portion where the first examination chamber 20 and the second examination chamber 30 are connected.
　第１検査室２０は、ベース２５と、ベース２５の上方に取り付けられたカバー２７とを備え、ベース２５及びカバー２７によって内部空間が構成されている。そして、搬送テーブル２２は、ベース２５及びカバー２７によって構成された内部空間を第１空間Ｓ１及び第２空間Ｓ２に概して２つに分割するように、第１検査室２０内にＸＹ平面状に延在して設けられている。例えば、ベース２５には凹部２１による段差が形成されており、搬送テーブル２２が凹部２１の上方にその開口を覆って設けられることによって、第１検査室２０の内部空間が、搬送テーブル２２におけるカバー２７側の第１空間Ｓ１と、搬送テーブル２２のベース２５の凹部２１側の第２空間Ｓ２とに分割されていてもよい。第１空間Ｓ１は、第２空間Ｓ２よりも広い又は第２空間Ｓ２と略同じ広さを有している。なお、第１空間Ｓ１及び第２空間Ｓ２は、両者間のガス流の往来が可能であるように互いに空間的につながっている。 The first examination room 20 includes a base 25 and a cover 27 attached above the base 25, and an internal space is constituted by the base 25 and the cover 27. The transfer table 22 extends into the first examination chamber 20 in an XY plane so as to divide the internal space formed by the base 25 and the cover 27 into a first space S1 and a second space S2. Is provided. For example, the base 25 is formed with a step due to the recess 21, and the transfer table 22 is provided above the recess 21 so as to cover the opening thereof, so that the internal space of the first inspection chamber 20 is covered by the transfer table 22. The first space S <b> 1 on the 27th side and the second space S <b> 2 on the recessed portion 21 side of the base 25 of the transfer table 22 may be divided. The first space S1 is wider than the second space S2 or substantially the same size as the second space S2. Note that the first space S1 and the second space S2 are spatially connected to each other so that the gas flow between them is possible.
　図３及び図４に示すように、検査装置１は、第１検査室２０にドライガスを供給する第１及び第２ドライガス供給部５０，５２と、電子部品Ｗを第１検査室２０内に供給するためにガスを吸引する吸引部５４と、電子部品Ｗを第１検査室２０から排出するためにガスを吹出す吹出部５６と、第１検査室２０の温度をそれぞれ独立して制御可能である第１から第３温度制御部５８，６０，６２とをさらに備える。 As shown in FIGS. 3 and 4, the inspection apparatus 1 includes first and second dry gas supply units 50 and 52 that supply dry gas to the first inspection chamber 20, and an electronic component W in the first inspection chamber 20. The temperature of the suction part 54 for sucking the gas for supplying the gas, the blowing part 56 for blowing the gas for discharging the electronic component W from the first examination room 20, and the temperature of the first examination room 20 are independently controlled. The first to third temperature control units 58, 60, and 62 that are possible are further included.
　第１ドライガス供給部５０は、第１検査室２０の第１空間Ｓ１にドライガスを供給し、他方、第２ドライガス供給部５２は、第１検査室２０の第２空間Ｓ２にドライガスを供給するものである。具体的には、第１ドライガス供給部５０は、カバー２７に設けられた供給孔２８を通って第１空間Ｓ１にドライガスを供給し、第２ドライガス供給部５２は、ベース２５の凹部２１に設けられた供給孔２９を通って第２空間Ｓ２にドライガスを供給する。第１及び第２ドライガス供給部５０，５２は、ドライ度の高いガスを供給することによって、ドライ度の低いガスが第１検査室２０内へ進入することを抑制することができる程度に第１検査室２０内を正圧に制御する。また、供給されるドライガス成分は特に限定されるものではないが、例えば空気や窒素などであってもよい。第１及び第２ドライガス供給部５０，５２によって第１検査室２０をドライ状態とすることによって、湿気による影響を抑制して正確な検査を行うことができる。 The first dry gas supply unit 50 supplies dry gas to the first space S1 of the first inspection chamber 20, while the second dry gas supply unit 52 supplies dry gas to the second space S2 of the first inspection chamber 20. Supply. Specifically, the first dry gas supply unit 50 supplies the dry gas to the first space S <b> 1 through the supply hole 28 provided in the cover 27, and the second dry gas supply unit 52 is a recess of the base 25. The dry gas is supplied to the second space S <b> 2 through the supply hole 29 provided in 21. The first and second dry gas supply units 50 and 52 supply the gas with high dryness to the extent that the gas with low dryness can be prevented from entering the first examination chamber 20. 1 The inside of the examination room 20 is controlled to a positive pressure. Further, the dry gas component to be supplied is not particularly limited, but may be air or nitrogen, for example. By making the first inspection chamber 20 dry by the first and second dry gas supply units 50 and 52, it is possible to suppress the influence of moisture and perform an accurate inspection.
　また、第１及び第２ドライガス供給部５０，５２は、第２ドライガス供給部５２のドライガス供給圧力が、第１ドライガス供給部５０のドライガス供給圧力よりも大きくなるように構成されている。この場合、ガス供給量自体を調整してもよいし、あるいは、ガスが供給される孔径（直径）の大きさを調整してもよい。孔径の大きさを調整する場合、第２ドライガス供給部５２の供給孔２９の孔径Ｒ２を、第１ドライガス供給部５０の供給孔２８の孔径Ｒ１よりも小さくすることによって、第２ドライガス供給部５２のガス供給圧力を大きくすることができる。例えば、Ｒ１＝８ｍｍφであるのに対し、Ｒ２＝０．５ｍｍφであってもよい。 The first and second dry gas supply units 50 and 52 are configured such that the dry gas supply pressure of the second dry gas supply unit 52 is greater than the dry gas supply pressure of the first dry gas supply unit 50. ing. In this case, the gas supply amount itself may be adjusted, or the size of the hole diameter (diameter) through which the gas is supplied may be adjusted. When adjusting the size of the hole diameter, the hole diameter R2 of the supply hole 29 of the second dry gas supply section 52 is made smaller than the hole diameter R1 of the supply hole 28 of the first dry gas supply section 50, whereby the second dry gas is supplied. The gas supply pressure of the supply part 52 can be increased. For example, R1 = 8 mmφ but R2 = 0.5 mmφ.
　吸引部５４は、ベース２５に形成された吸引孔２５ａを介して、第１検査室２０内のガスを吸引するように構成されている。吸引孔２５ａは、第１検査室２０のベース２５における部品供給路１２側に形成されており、ベース２５の凹部２１の開口の外側に形成されていてもよい。また、吸引孔２５ａは、搬送テーブル２２から見て第２空間Ｓ２側に設けられている。吸引孔２５ａからガス吸引することによって、電子部品Ｗを部品供給路１２から第１検査室２０に取り込み、搬送テーブル２２の歯の間に収容することができる。また、吸引部５４によるガス吸引によって、第１検査室２０における部品供給路１２側においてガスカーテン（ガス障壁）が形成され、これにより、部品供給路１２から外気が進入することを抑制することができる。 The suction unit 54 is configured to suck the gas in the first examination chamber 20 through a suction hole 25a formed in the base 25. The suction hole 25 a is formed on the component supply path 12 side in the base 25 of the first examination chamber 20, and may be formed outside the opening of the recess 21 of the base 25. The suction hole 25a is provided on the second space S2 side when viewed from the transfer table 22. By sucking gas from the suction hole 25a, the electronic component W can be taken into the first inspection chamber 20 from the component supply path 12 and accommodated between the teeth of the transfer table 22. In addition, a gas curtain (gas barrier) is formed on the component supply path 12 side in the first inspection chamber 20 by gas suction by the suction unit 54, thereby suppressing the outside air from entering from the component supply path 12. it can.
　なお、第１検査室２０内には、部品供給路１２から供給される電子部品Ｗが搬送テーブル２２に歯の間に収容されるまでの間に飛散することを防止するためのガイドが設けられていてもよい。 In the first inspection chamber 20, a guide is provided for preventing the electronic component W supplied from the component supply path 12 from being scattered until the electronic table W is accommodated in the transfer table 22 between the teeth. It may be.
　また、吸引部５４の吸引孔２５ａは、第２ドライガス供給部５２の供給孔２９に隣接して設けられていてもよい。図２に示すように、吸引部５４の吸引孔２５ａは、第２ドライガス供給部５２の供給孔２９の、搬送テーブル２２の回転方向上流側に設けられていてもよい。このように第２ドライガス供給部５２の供給孔２９が、吸引部５４の吸引孔２５ａに隣接して設けられることによって、供給孔２９からのドライガスを、吸引孔２５ａ側に向けて、ドライ度の低いガスを吹き飛ばすとともに、第１検査室２０のドライガスを内部空間全体に撹拌してドライ度の均一化を図ることができる。 Further, the suction hole 25 a of the suction part 54 may be provided adjacent to the supply hole 29 of the second dry gas supply part 52. As shown in FIG. 2, the suction hole 25 a of the suction unit 54 may be provided upstream of the supply hole 29 of the second dry gas supply unit 52 in the rotation direction of the transfer table 22. As described above, the supply hole 29 of the second dry gas supply part 52 is provided adjacent to the suction hole 25a of the suction part 54, so that the dry gas from the supply hole 29 is directed toward the suction hole 25a and is dried. A low degree of gas can be blown away, and the dry gas in the first examination chamber 20 can be agitated in the entire internal space to achieve a uniform degree of dryness.
　吹出部５６は、ベース２５に形成された吹出孔２５ｂを介して、第１検査室２０内のガスを吹出すように構成されている。吹出孔２５ｂは、第１検査室２０のベース２５における部品通路（部品排出路）２６側に形成されており、ベース２５の凹部２１の開口の外側に形成されていてもよい。また、吹出孔２５ｂは、搬送テーブル２２から見て第２空間Ｓ２側に設けられている。吹出部５６からガスを吹出すことによって、電子部品Ｗを第１検査室２０から部品通路２６へ排出することができる。このとき、第２検査室３０においても、第１検査室２０の電子部品Ｗの供給処理と同様に、第２検査室３０のベース３５に形成された吸引孔３５ａを介して、第２検査室３０内のガスを吸引部６４によって吸引することによって、電子部品Ｗを部品通路２６から第２検査室３０内の搬送テーブル３５に取り込むことができる。また、吹出部５６によるガス吹出しによって、第２検査室３０における部品通路２６側においてガスカーテン（ガス障壁）が形成され、これにより、部品通路２６から外気が進入することを抑制することができる。なお、吹出部５６は、吹出孔２５ｂからガスを吹出す前に、搬送テーブル２２に引き付けるよう一旦ガスを吸引可能であってもよい。これによって、電子部品Ｗを部品通路２６へ正確に排出することができる。 The blow-out unit 56 is configured to blow out the gas in the first examination chamber 20 through a blow-out hole 25b formed in the base 25. The blowout hole 25 b is formed on the component passage (component discharge passage) 26 side in the base 25 of the first examination chamber 20, and may be formed outside the opening of the concave portion 21 of the base 25. Further, the blowout hole 25b is provided on the second space S2 side as viewed from the transfer table 22. The electronic component W can be discharged from the first inspection chamber 20 to the component passage 26 by blowing gas from the blowing portion 56. At this time, also in the second examination room 30, the second examination room is provided through the suction hole 35a formed in the base 35 of the second examination room 30 in the same manner as the supply process of the electronic component W in the first examination room 20. By sucking the gas in 30 by the suction part 64, the electronic component W can be taken into the transfer table 35 in the second inspection chamber 30 from the component passage 26. Further, a gas curtain (gas barrier) is formed on the part passage 26 side in the second inspection chamber 30 by the gas blowing by the blow-out portion 56, and thereby it is possible to suppress the outside air from entering from the part passage 26. Note that the blowing unit 56 may be able to suck the gas once so as to be attracted to the transfer table 22 before blowing the gas from the blowing hole 25b. As a result, the electronic component W can be accurately discharged to the component passage 26.
　このように、吸引部５４及び吹出部５６を用いて電子部品Ｗの供給及び排出を行うため、湿気の発生を抑制しつつ、電子部品Ｗの供給及び排出処理の高速化を実現することができる。また、別途、電子部品Ｗをハンドリングするための各種の機構が不要となり、検査装置の部品点数を少なくすることができる。さらに、ハンドリング機構が不要となるため、電子部品Ｗの出入口スペースを可能な限り小さくして検査装置の小型化を図るとともに、出入口スペースを小さくしたことに伴って余計な外気の進入を抑制することができる。 As described above, since the electronic part W is supplied and discharged using the suction part 54 and the blowing part 56, the speed of the supply and discharge process of the electronic part W can be realized while suppressing the generation of moisture. . In addition, various mechanisms for handling the electronic component W are not required separately, and the number of components of the inspection apparatus can be reduced. Furthermore, since a handling mechanism is not necessary, the entrance / exit space of the electronic component W is made as small as possible to reduce the size of the inspection device, and the entry of extraneous outside air is suppressed as the entrance / exit space is reduced. Can do.
　第１検査室２０は、第１温度制御部５８、第２温度制御部６０及び第３温度制御部６２によって、それぞれ互いに独立して温度制御される。第１温度制御部５８は、電子部品Ｗを検査温度範囲である所定温度に設定するために、第１検査室２０の温度を制御するものである。第１検査室２０が例えば低温において検査するためのものであれば、第１温度制御部５８は、例えばペルチェ素子や冷却水を用いた温度制御を行うものであってもよい。第１温度制御部５８は、第１検査室２０の内部空間の底面（ベース２５）の温度を制御する。第１温度制御部５８による温度制御領域は、特に限定されるものではないが、第２及び第３温度制御部６０，６２による温度制御領域を除いて、搬送テーブル２２の下方領域の全部又は一部であってもよい。 The temperature of the first examination room 20 is controlled by the first temperature control unit 58, the second temperature control unit 60, and the third temperature control unit 62 independently of each other. The first temperature control unit 58 controls the temperature of the first inspection chamber 20 in order to set the electronic component W to a predetermined temperature that is an inspection temperature range. If the first inspection chamber 20 is for inspection at a low temperature, for example, the first temperature control unit 58 may perform temperature control using a Peltier element or cooling water, for example. The first temperature control unit 58 controls the temperature of the bottom surface (base 25) of the internal space of the first examination chamber 20. The temperature control region by the first temperature control unit 58 is not particularly limited, but all or one of the lower regions of the transfer table 22 except for the temperature control regions by the second and third temperature control units 60 and 62. Part.
　第２温度制御部６０及び第３温度制御部６２は、それぞれ、第１温度制御部５８とは独立して制御可能である。第２温度制御部６０は、例えば、第１検査室２０における吸引孔２５ａ付近の領域（すなわち入口側領域）の温度を制御可能であり、また、第３温度制御部６２は、第１検査室２０における吹出孔２５ｂ付近の領域（すなわち出口側領域）であってもよい。第２及び第３温度制御部６０，６２のいずれか一方又はその両方は、第１温度制御部５８による温度と、常温（外気温度）の間の温度に設定可能であってもよい。これによって、第１検査室２０の出入口付近のドライ度が低くなった場合であっても、電子部品Ｗの湿気による影響を抑制することができる。特に、低温検査の場合には、ドライ度が低いと電子部品Ｗや装置内部の機構が結露や着霜する場合があるため効果的である。低温検査の場合、例えば、第１温度制御部５８を－３０℃以上－１０℃以下に制御し、他方、第２及び第２温度制御部のいずれか一方又はその両方を１０℃程度に制御してもよい。 The second temperature control unit 60 and the third temperature control unit 62 can be controlled independently of the first temperature control unit 58, respectively. For example, the second temperature control unit 60 can control the temperature of the region near the suction hole 25a (that is, the inlet side region) in the first examination chamber 20, and the third temperature control unit 62 can control the temperature of the first examination chamber. The area | region (namely, exit side area | region) near the blowing hole 25b in 20 may be sufficient. Either one or both of the second and third temperature control units 60 and 62 may be set to a temperature between the temperature by the first temperature control unit 58 and the normal temperature (outside temperature). Thereby, even if the dryness near the entrance / exit of the first examination room 20 is low, the influence of moisture of the electronic component W can be suppressed. In particular, in the case of low temperature inspection, if the dryness is low, the electronic component W and the mechanism inside the apparatus may be condensed or frosted, which is effective. In the case of the low temperature inspection, for example, the first temperature control unit 58 is controlled to be −30 ° C. or more and −10 ° C. or less, and one or both of the second and second temperature control units are controlled to about 10 ° C. May be.
　第１検査室２０の搬送テーブル２２には、第１空間Ｓ１と第２空間Ｓ２を連通する少なくとも一つの貫通孔２３が形成されている。搬送テーブル２２がＸＹ平面状に延在して形成される場合、貫通孔２３はＺ軸方向に沿って延在している。図１に示すように、搬送テーブル２２には、搬送テーブル２２の回転方向に沿って所定間隔をあけて複数の貫通孔２３が形成されていてもよい。この場合、第２ドライガス供給部５２は、貫通孔２３側に向かってドライガスを供給することが好ましい。搬送テーブル２２に貫通孔２３が形成されることによって、第１空間Ｓ１と第２空間Ｓ２との間にガス流が形成される。具体的には、ガス供給圧力が高い第２空間Ｓ２側から貫通孔２３を通って第１空間Ｓ１に向かうガス流が形成される。これによって、第２空間Ｓ２に湿ったガスが集中することを抑制することができる。 The transfer table 22 of the first examination chamber 20 is formed with at least one through hole 23 that communicates the first space S1 and the second space S2. When the transfer table 22 is formed extending in the XY plane, the through hole 23 extends along the Z-axis direction. As shown in FIG. 1, a plurality of through holes 23 may be formed in the conveyance table 22 at predetermined intervals along the rotation direction of the conveyance table 22. In this case, it is preferable that the second dry gas supply unit 52 supplies the dry gas toward the through hole 23 side. By forming the through hole 23 in the transfer table 22, a gas flow is formed between the first space S1 and the second space S2. Specifically, a gas flow is formed from the second space S2 side where the gas supply pressure is high through the through hole 23 toward the first space S1. Thereby, it is possible to suppress the moist gas from being concentrated in the second space S2.
　部品供給路１２と第１検査室２０との間は、検査装置１が作動している間、電子部品Ｗが供給可能なように常に開放されていてもよい。言い換えれば、電子部品Ｗを第１検査室２０に供給するか否かに関わらず、第１検査室２０が作動している間、部品供給路１２と第１検査室２０との間を開放し続けてもよい。あるいは、変形例として、部品供給路１２と第１検査室２０との間は、検査装置１が作動している間、両者間のガス流の往来を抑制するシャッタが設けられていてもよい。 The part supply path 12 and the first inspection chamber 20 may always be opened so that the electronic part W can be supplied while the inspection apparatus 1 is operating. In other words, regardless of whether or not the electronic component W is supplied to the first inspection chamber 20, the gap between the component supply path 12 and the first inspection chamber 20 is opened while the first inspection chamber 20 is operating. You may continue. Alternatively, as a modification, a shutter may be provided between the component supply path 12 and the first inspection chamber 20 to suppress a gas flow between the two while the inspection apparatus 1 is operating.
　また、同様に、第１検査室２０と部品通路２６との間は、検査装置１が作動している間、電子部品Ｗが排出可能なように常に開放されていてもよい。言い換えれば、電子部品Ｗを第１検査室２０から排出するか否かに関わらず、第１検査室２０が作動している間、第１検査室２０と部品通路２６との間を開放し続けてもよい。あるいは、変形例として、第１検査室２０と部品通路２６との間は、検査装置１が作動している間、両者間のガス流の往来を抑制するシャッタが設けられていてもよい。 Similarly, the first inspection chamber 20 and the component passage 26 may always be opened so that the electronic component W can be discharged while the inspection apparatus 1 is operating. In other words, regardless of whether or not the electronic component W is discharged from the first inspection chamber 20, the first inspection chamber 20 and the component passage 26 are kept open while the first inspection chamber 20 is operating. May be. Alternatively, as a modification, a shutter between the first inspection chamber 20 and the component passage 26 may be provided that suppresses the flow of gas flow between the two while the inspection apparatus 1 is operating.
　以上のとおり、本実施形態に係る電子部品の検査装置によれば、第１検査室２０の第２空間Ｓ２にドライガスを供給する第２ドライガス供給部５２のドライガス供給圧力が、第１検査室２０の第１空間Ｓ１（第２空間Ｓ２以上の広さを有する）にドライガスを供給する第１ドライガス供給部５０のドライガス供給圧力よりも大きい。これによれば、搬送テーブル２２によって第１検査室２０の内部空間が第１及び第２空間Ｓ１，Ｓ２に分けられている場合であっても、一方の空間（第２空間Ｓ２）側に湿った空気が滞留することを抑制することができる。したがって、電子部品Ｗの信頼性を損なうことなく、正確な検査を行うことができる。 As described above, according to the electronic component inspection apparatus according to the present embodiment, the dry gas supply pressure of the second dry gas supply unit 52 that supplies the dry gas to the second space S2 of the first inspection chamber 20 is the first. The pressure is higher than the dry gas supply pressure of the first dry gas supply unit 50 that supplies the dry gas to the first space S1 (having a size larger than the second space S2) of the examination room 20. According to this, even when the internal space of the first examination room 20 is divided into the first and second spaces S1 and S2 by the transfer table 22, it is moistened to one space (second space S2) side. It is possible to suppress the retention of air. Therefore, an accurate inspection can be performed without impairing the reliability of the electronic component W.
　次に、図５を参照しつつ、本実施形態に係る電子部品の検査方法を説明する。本実施形態では、上述した検査装置１を用いて電子部品Ｗを検査する態様を説明する。なお、本実施形態に係る電子部品の検査方法は、検査装置１について説明した内容を含むものである。 Next, an electronic component inspection method according to the present embodiment will be described with reference to FIG. In the present embodiment, an aspect in which the electronic component W is inspected using the above-described inspection apparatus 1 will be described. The electronic component inspection method according to the present embodiment includes the contents described for the inspection apparatus 1.
　まず、第１検査室２０にドライガスを供給する（Ｓ１０）。具体的には、第１及び第２ドライガス供給部５０，５２を用いて第１検査室２０の第１及び第２空間Ｓ１，Ｓ２にそれぞれドライガスを供給する。このとき、第２ドライガス供給部５２のドライガス供給圧力を、第１ドライガス供給部５０のドライガス供給圧力よりも大きくする。これによって、第１検査室２０の内部空間全体にドライガスを撹拌させてドライ度の均一化を図ることができる。 First, dry gas is supplied to the first examination room 20 (S10). Specifically, dry gas is supplied to the first and second spaces S1, S2 of the first examination room 20 using the first and second dry gas supply units 50, 52, respectively. At this time, the dry gas supply pressure of the second dry gas supply unit 52 is set larger than the dry gas supply pressure of the first dry gas supply unit 50. As a result, the dry gas can be agitated in the entire internal space of the first examination chamber 20 to make the dryness uniform.
　また、第１から第３温度制御部５８，６０，６２によって第１検査室２０に対して温度制御を行うことによって、第１検査室２０を、検査を行うための第１設定温度（例えば低温）に制御しつつ、電子部品Ｗの出入口付近を第１設定温度よりも、常温に近い温度に設定する。これによれば、例えば、第１検査室２０が低温検査である場合、第１検査室２０の特に出入口付近における結露や着霜の発生を防止して、電子部品Ｗの信頼性を損なうことなく、正確な検査を行うことができる。 Further, the first to third temperature control units 58, 60, and 62 perform temperature control on the first inspection chamber 20, thereby allowing the first inspection chamber 20 to be inspected at a first set temperature (for example, a low temperature). ), The vicinity of the entrance / exit of the electronic component W is set to a temperature closer to room temperature than the first set temperature. According to this, for example, when the first examination room 20 is a low temperature examination, the occurrence of condensation and frost formation in the vicinity of the entrance / exit of the first examination room 20 is prevented, and the reliability of the electronic component W is not impaired. Accurate inspection can be done.
　こうして第１検査室２０の環境を準備した後、第１検査室２０に電子部品Ｗを供給する（Ｓ１２）。具体的には、部品供給部１０に収容されている未検査の電子部品Ｗを部品供給路１２に供給し、吸引部５４によって吸引孔２５ａからガスを吸引することによって、電子部品Ｗを一つずつ搬送テーブル２２の隣接する歯の間に収容する。言い換えれば、搬送テーブル２２が所定ピッチで回転するタイミングで、搬送テーブルの隣接する歯の間に電子部品Ｗを挿入するよう、吸引孔２５ａからガス吸引する。こうして、複数の電子部品Ｗを第１検査室２０に供給しながら、それらを搬送テーブル２２によって検査機構２４に向けて搬送する。 After preparing the environment of the first examination room 20 in this way, the electronic component W is supplied to the first examination room 20 (S12). Specifically, one electronic component W is supplied by supplying the uninspected electronic component W accommodated in the component supply unit 10 to the component supply path 12 and sucking the gas from the suction hole 25a by the suction unit 54. Each is accommodated between adjacent teeth of the transfer table 22. In other words, gas is sucked from the suction holes 25a so that the electronic component W is inserted between adjacent teeth of the transport table at the timing when the transport table 22 rotates at a predetermined pitch. Thus, while supplying the plurality of electronic components W to the first inspection chamber 20, they are transported toward the inspection mechanism 24 by the transport table 22.
　その後、第１検査室２０において電子部品Ｗを検査する。具体的には、搬送テーブル２２によって検査機構２４に搬送されたタイミングで、電子部品Ｗが電気的に検査され、検査終了した電子部品Ｗは、次の検査を行うために部品通路２６に向けてさらに搬送される。第１検査室２０による検査を終えた電子部品Ｗは、部品通路２６を通って第２検査室３０に供給され、第２検査室３０において第２設定温度（例えば常温）による検査が行われ（Ｓ１６）、その後、同様に、部品通路３６を通って第３検査室４０に供給され、第３検査室４０において第３設定温度（例えば高温）による検査が行われる（Ｓ１８）。 Thereafter, the electronic component W is inspected in the first inspection room 20. Specifically, the electronic component W is electrically inspected at the timing when it is transported to the inspection mechanism 24 by the transport table 22, and the electronic component W that has been inspected is directed toward the component passage 26 for the next inspection. It is further conveyed. The electronic component W that has been inspected by the first inspection chamber 20 is supplied to the second inspection chamber 30 through the component passage 26 and is inspected at the second set temperature (for example, normal temperature) in the second inspection chamber 30 ( S16), and thereafter, similarly, it is supplied to the third inspection chamber 40 through the component passage 36, and the inspection at the third set temperature (for example, high temperature) is performed in the third inspection chamber 40 (S18).
　以上のとおり、本実施形態に係る電子部品の検査方法によれば、第１検査室２０の第２空間Ｓ２側へ供給するドライガス供給圧力が、第１検査室２０の第１空間Ｓ１（第２空間Ｓ２以上の広さを有する）側へ供給するドライガス供給圧力よりも大きい。これによれば、搬送テーブル２２によって第１検査室２０の内部空間が第１及び第２空間Ｓ１，Ｓ２に分けられている場合であっても、一方の空間（第２空間Ｓ２）側に湿った空気が滞留することを抑制することができる。したがって、電子部品Ｗの信頼性を損なうことなく、正確な検査を行うことができる。 As described above, according to the electronic component inspection method according to the present embodiment, the dry gas supply pressure supplied to the second space S2 side of the first inspection chamber 20 is the first space S1 (the first space in the first inspection chamber 20). It is larger than the dry gas supply pressure supplied to the side having a space of 2 spaces S2 or more. According to this, even when the internal space of the first examination room 20 is divided into the first and second spaces S1 and S2 by the transfer table 22, it is moistened to one space (second space S2) side. It is possible to suppress the retention of air. Therefore, an accurate inspection can be performed without impairing the reliability of the electronic component W.
　本発明は、上記実施形態に限定されることなく種々に変形して適用することが可能である。 The present invention is not limited to the above embodiment and can be applied in various modifications.
　本実施形態では、検査装置１が電子部品Ｗに対して複数の温度範囲（例えば低温、常温及び高温の３つ）を検査する態様を例に挙げて説明したが、本発明はこれに限定されず、温度範囲はいずれか一つであってもよい。また複数の温度範囲を検査する場合、低温、常温及び高温の順番に限るものではなく、異なる順番を適用してもよい。例えば、図１に示す第１から第３の検査室における温度制御を全てペルチェユニット（例えば水冷式ペルチェユニット）で構成することによって、いずれかの検査室を加熱又は冷却することが可能となり、検査装置の機構を変更することなく、電子部品Ｗの種類などに応じて適宜好ましい順番で検査を行うことができる。 In the present embodiment, the inspection apparatus 1 has been described with an example in which the electronic device W inspects a plurality of temperature ranges (for example, low temperature, normal temperature, and high temperature), but the present invention is limited to this. The temperature range may be any one. Moreover, when inspecting a plurality of temperature ranges, the order is not limited to low temperature, normal temperature, and high temperature, and different orders may be applied. For example, by configuring all of the temperature control in the first to third inspection rooms shown in FIG. 1 with a Peltier unit (for example, a water-cooled Peltier unit), it becomes possible to heat or cool any of the inspection rooms. Without changing the mechanism of the apparatus, the inspection can be performed in a preferred order as appropriate according to the type of the electronic component W or the like.
　また、図２から図４に示す第１検査室２０の具体的各構成を、常温検査又は高温検査などの検査室に適用してもよい。これによれば、常温及び高温検査においても、湿気による弊害を防止することができ、電子部品Ｗの信頼性を損なうことなく、正確な検査を行うことができる。 Further, each specific configuration of the first inspection room 20 shown in FIGS. 2 to 4 may be applied to an inspection room such as a normal temperature inspection or a high temperature inspection. According to this, even in normal temperature and high temperature inspections, it is possible to prevent harmful effects due to moisture, and it is possible to perform an accurate inspection without impairing the reliability of the electronic component W.
　また、上記実施形態では、吸引部５４及び吹出部５６を用いて電子部品Ｗの供給及び排出を行う態様を説明したがこれに限定されるものではなく、例えば、既存のハンドリング機構を適用して、電子部品Ｗの供給及び排出を行ってもよい。 Moreover, although the aspect which performs supply and discharge | emission of the electronic component W using the suction part 54 and the blowing part 56 was demonstrated in the said embodiment, it is not limited to this, For example, applying an existing handling mechanism The electronic component W may be supplied and discharged.
　また、上記実施形態では、搬送機構の一例として水平方向かつ回転方向に搬送可能なインデックステーブルを説明したが、搬送機構の具体的構成や搬送方向はこれに限定されるものではない。また、第１空間Ｓ１及びＳ２の分け方も特に限定されるものではない。 In the above-described embodiment, the index table that can be transported in the horizontal direction and the rotation direction has been described as an example of the transport mechanism. However, the specific configuration and transport direction of the transport mechanism are not limited thereto. Further, the way of dividing the first spaces S1 and S2 is not particularly limited.
　また、上記実施形態では、検査対象である電子部品は、温度特性を検査する需要があるものであれば、圧電振動デバイス以外のその他のデバイスであってもよい。また圧電振動デバイスは、水晶振動子以外のその他の圧電振動子を備えるものであってもよい。 In the above embodiment, the electronic component to be inspected may be other devices other than the piezoelectric vibration device as long as there is a demand for inspecting the temperature characteristics. The piezoelectric vibration device may include other piezoelectric vibrators other than the crystal vibrator.
　また、上記実施形態では、第１及び第２ドライガス供給部の供給孔はそれぞれ一つずつとしたが、供給孔の個数や配置は上記実施形態の例に限るものではない。例えば、第１空間Ｓ１及び第２空間Ｓ２内にドライガスをより効率良く撹拌させるために、第２ドライガス供給部の供給孔を複数形成してもよい。 In the above embodiment, one supply hole is provided in each of the first and second dry gas supply units. However, the number and arrangement of the supply holes are not limited to the example in the above embodiment. For example, in order to more efficiently stir the dry gas in the first space S1 and the second space S2, a plurality of supply holes for the second dry gas supply unit may be formed.
　また、上記実施形態では、検査装置が第２ドライガス供給部を備える構成を説明したが、第２ドライガス供給部は省略してもよい。第２ドライガス供給部を備えていない構成であっても、第２及び第３温度制御部による温度の少なくとも一方が、第１温度制御部による温度と常温の間に制御されることによって、電子部品の供給又は排出付近における急激な温度変化を防止することができ、温度変化に伴う電子部品への悪影響を抑制又は緩和することができる。したがって、電子部品の信頼性を損なうことなく、正確な検査を行うことができる。 In the above embodiment, the configuration in which the inspection apparatus includes the second dry gas supply unit has been described. However, the second dry gas supply unit may be omitted. Even if the second dry gas supply unit is not provided, at least one of the temperatures by the second and third temperature control units is controlled between the temperature by the first temperature control unit and the normal temperature, thereby A sudden temperature change in the vicinity of supply or discharge of the component can be prevented, and adverse effects on the electronic component due to the temperature change can be suppressed or alleviated. Therefore, an accurate inspection can be performed without impairing the reliability of the electronic component.
　次に、本発明の第２実施形態について説明する。なお、以下の説明においては上記内容と異なる点を説明することとし、上記内容と同じ構成については図中において同一の符号を付している。 Next, a second embodiment of the present invention will be described. In the following description, points different from the above contents will be described, and the same components as those described above are denoted by the same reference numerals in the drawings.
　図６は、本発明の他の実施形態（第２実施形態）に係る検査装置の全体概略図である。本実施形態に係る検査装置においては、第２設定温度（例えば常温）による検査と、第３設定温度（例えば高温）による検査とが１つの検査室に集約されている点で、上記実施形態と異なっている。 FIG. 6 is an overall schematic diagram of an inspection apparatus according to another embodiment (second embodiment) of the present invention. In the inspection apparatus according to the present embodiment, the inspection according to the second set temperature (for example, room temperature) and the inspection according to the third set temperature (for example, high temperature) are integrated in one inspection room, and Is different.
　本実施形態に係る検査装置３は、電子部品Ｗを供給するための部品供給部１０及び部品供給路１２と、第１設定温度（例えば低温）による第１検査室２０と、第２及び第３設定温度（例えば常温及び高温）による第２検査室７０とを備える。第２検査室７０には、部品通路２６から供給された電子部品Ｗを検査機構７４，７６に順番に搬送する搬送テーブル７２が設けられている。例えば、低温検査が終了した電子部品Ｗを搬送しながら検査機構７４によって常温検査を行い、さらに電子部品Ｗを搬送しながら検査機構７６によって高温検査を行ってもよい。第２検査室７０は、検査機構７４において第２設定温度で検査可能であるとともに、検査機構７６において第３設定温度で検査可能であるように、部分的に温度制御可能となっている。検査機構７６による検査が終了した電子部品Ｗは、部品排出路７８を介して検査終了の部品を収容するための収容トレイ（図示しない）に格納される。 The inspection apparatus 3 according to this embodiment includes a component supply unit 10 and a component supply path 12 for supplying an electronic component W, a first inspection chamber 20 based on a first set temperature (for example, low temperature), a second and a third. And a second inspection room 70 at a set temperature (for example, normal temperature and high temperature). The second inspection chamber 70 is provided with a transport table 72 that sequentially transports the electronic components W supplied from the component passage 26 to the inspection mechanisms 74 and 76. For example, the normal temperature inspection may be performed by the inspection mechanism 74 while transporting the electronic component W that has been subjected to the low temperature inspection, and the high temperature inspection may be performed by the inspection mechanism 76 while transporting the electronic component W. The second inspection chamber 70 is partially controllable so that the inspection mechanism 74 can be inspected at the second set temperature and the inspection mechanism 76 can be inspected at the third set temperature. The electronic component W that has been inspected by the inspection mechanism 76 is stored in a storage tray (not shown) for storing the inspection-completed component via the component discharge path 78.
　なお、上記例とは異なり、最初の検査室における検査の設定温度を２種類としてもよい。また、２種類を同じ検査室において検査する場合、その組み合わせは例えば低温と常温であってもよい。 In addition, unlike the above example, the set temperature for the inspection in the first laboratory may be two types. When two types are inspected in the same laboratory, the combination may be, for example, low temperature and normal temperature.
　なお、以上説明した各実施形態は、本発明の理解を容易にするためのものであり、本発明を限定して解釈するためのものではない。本発明は、その趣旨を逸脱することなく、変更／改良され得るととともに、本発明にはその等価物も含まれる。即ち、各実施形態に当業者が適宜設計変更を加えたものも、本発明の特徴を備えている限り、本発明の範囲に包含される。例えば、各実施形態が備える各要素およびその配置、材料、条件、形状、サイズなどは、例示したものに限定されるわけではなく適宜変更することができる。また、各実施形態が備える各要素は、技術的に可能な限りにおいて組み合わせることができ、これらを組み合わせたものも本発明の特徴を含む限り本発明の範囲に包含される。 Each embodiment described above is for facilitating understanding of the present invention, and is not intended to limit the present invention. The present invention can be changed / improved without departing from the spirit thereof, and the present invention includes equivalents thereof. In other words, those obtained by appropriately modifying the design of each embodiment by those skilled in the art are also included in the scope of the present invention as long as they include the features of the present invention. For example, each element included in each embodiment and its arrangement, material, condition, shape, size, and the like are not limited to those illustrated, and can be changed as appropriate. In addition, each element included in each embodiment can be combined as much as technically possible, and combinations thereof are included in the scope of the present invention as long as they include the features of the present invention.
　　　１　検査装置
　　２０　第１検査室
　　２２　搬送テーブル
　　２３　貫通孔
　２５ａ　吸引孔
　２５ｂ　吹出孔
　　２６　部品通路
　　２８　第１のドライガス供給部の供給孔
　　２９　第２のドライガス供給部の供給孔
　　５０　第１のドライガス供給部
　　５２　第２のドライガス供給部
　　５４　吸引部
　　５６　吹出部
　　５８　第１温度制御部
　　６０　第２温度制御部
　　６２　第３温度制御部
　　Ｒ１　第１のドライガス供給部の供給孔径
　　Ｒ２　第２のドライガス供給部の供給孔径
　　Ｓ１　第１空間
　　Ｓ２　第２空間
　　　Ｗ　電子部品
  DESCRIPTION OF SYMBOLS 1 Inspection apparatus 20 1st inspection chamber 22 Transfer table 23 Through-hole 25a Suction hole 25b Outlet hole 26 Parts passage 28 Supply hole of 1st dry gas supply part 29 Supply hole of 2nd dry gas supply part 50 1st dry Gas supply part 52 Second dry gas supply part 54 Suction part 56 Blowout part 58 First temperature control part 60 Second temperature control part 62 Third temperature control part R1 Supply hole diameter R1 of the first dry gas supply part R2 Second Supply hole diameter of dry gas supply part S1 1st space S2 2nd space W Electronic component

Claims (19)

  1. 　ドライガスが供給された状態で電子部品の温度特性を検査する検査装置であって、
    　前記電子部品を検査する検査室と、
    　前記検査室内に設けられ、前記検査室に供給された電子部品を検査するために搬送する搬送機構と、
    　前記検査室における前記搬送機構の一方面側の第１空間にドライガスを供給する第１ドライガス供給部と、
    　前記検査室における前記搬送機構の他方面側の第２空間にドライガスを供給する第２ドライガス供給部と
    を備え、
    　前記第１空間は、前記第２空間以上の広さを有しており、
    　前記第２ドライガス供給部のドライガス供給圧力は、前記第１ドライガス供給部のドライガス供給圧力よりも大きい、電子部品の検査装置。     An inspection device for inspecting the temperature characteristics of an electronic component in a state where dry gas is supplied,
    An inspection room for inspecting the electronic component;
    A conveyance mechanism that is provided in the inspection chamber and conveys the electronic components supplied to the inspection chamber;
    A first dry gas supply unit for supplying dry gas to the first space on the one surface side of the transfer mechanism in the inspection room;
    A second dry gas supply unit that supplies dry gas to the second space on the other surface side of the transfer mechanism in the inspection room;
    The first space is larger than the second space,
    The electronic component inspection apparatus, wherein a dry gas supply pressure of the second dry gas supply unit is larger than a dry gas supply pressure of the first dry gas supply unit.
  2. 　前記電子部品を前記検査室に供給するための部品供給路と、
    　前記電子部品を前記部品供給路から前記検査室に供給するために、前記検査室内の吸引孔からガスを吸引する吸引部と
    をさらに備えた、請求項１記載の検査装置。     A component supply path for supplying the electronic component to the inspection room;
    The inspection apparatus according to claim 1, further comprising a suction unit configured to suck gas from a suction hole in the inspection chamber in order to supply the electronic component from the component supply path to the inspection chamber.
  3. 　前記吸引部の吸引孔は、前記第２空間側に設けられた、請求項２記載の検査装置。 The inspection device according to claim 2, wherein the suction hole of the suction part is provided on the second space side.
  4. 　前記第２ドライガス供給部の供給孔は、前記吸引部の吸引孔に隣接して設けられた、請求項３記載の検査装置。 The inspection apparatus according to claim 3, wherein the supply hole of the second dry gas supply unit is provided adjacent to the suction hole of the suction unit.
  5. 　前記部品供給路と前記検査室との間は、前記検査装置が作動している間、前記電子部品が供給可能なように常に開放された、請求項２から４のいずれか一項に記載の検査装置。 5. The device according to claim 2, wherein the component supply path and the inspection room are always open so that the electronic component can be supplied while the inspection device is operating. 6. Inspection device.
  6. 　前記電子部品を前記検査室から排出するための部品排出路と、
    　前記電子部品を前記検査室から前記部品排出路へ排出するために、前記検査室内の吹出孔にガスを吹出す吹出部と
    をさらに備えた、請求項２から５のいずれか一項に記載の検査装置。     A component discharge path for discharging the electronic component from the inspection room;
    6. The apparatus according to claim 2, further comprising a blow-out portion that blows gas into a blow-out hole in the inspection chamber in order to discharge the electronic component from the inspection chamber to the component discharge path. Inspection device.
  7. 　前記部品排出路と前記検査室との間は、前記検査装置が作動している間、前記電子部品が排出可能なように常に開放された、請求項６記載の検査装置。 The inspection apparatus according to claim 6, wherein the part discharge path and the inspection room are always opened so that the electronic parts can be discharged while the inspection apparatus is operating.
  8. 　前記電子部品を所定温度に設定するために前記検査室の温度を制御する第１温度制御部と、
    　前記検査室における前記吸引部の吸引孔付近の領域の温度を制御する第２温度制御部と、
    　前記検査室における前記吹出部の吹出孔付近の領域の温度を制御する第３温度制御部と
    をさらに備えた、請求項６又は７に記載の検査装置。     A first temperature control unit for controlling the temperature of the examination room in order to set the electronic component to a predetermined temperature;
    A second temperature control unit for controlling the temperature in the vicinity of the suction hole of the suction unit in the examination room;
    The inspection apparatus according to claim 6, further comprising a third temperature control unit that controls a temperature in a region near the blowout hole of the blowout unit in the examination room.
  9. 　前記第２及び第３温度制御部による温度の少なくとも一方は、前記第１温度制御部による温度と常温の間に制御される、請求項８記載の検査装置。 9. The inspection apparatus according to claim 8, wherein at least one of the temperatures by the second and third temperature control units is controlled between a temperature by the first temperature control unit and a normal temperature.
  10. 　前記搬送機構は、前記電子部品を水平方向に搬送する、請求項１から９のいずれか一項に記載の検査装置。 The inspection apparatus according to any one of claims 1 to 9, wherein the transport mechanism transports the electronic component in a horizontal direction.
  11. 　前記搬送機構は、前記検査室の平面視において前記電子部品を回転方向に搬送する、請求項１から１０のいずれか一項に記載の検査装置。 The inspection apparatus according to any one of claims 1 to 10, wherein the transport mechanism transports the electronic component in a rotation direction in a plan view of the inspection room.
  12. 　前記搬送機構には、前記第１空間と前記第２空間を連通する少なくとも一つの貫通孔が形成された、請求項１から１１のいずれか一項に記載の検査装置。 The inspection apparatus according to any one of claims 1 to 11, wherein the transport mechanism is formed with at least one through hole communicating with the first space and the second space.
  13. 　前記第２ドライガス供給部は、前記第２空間から前記貫通孔を通って前記第１空間に向かうガス流が形成されるように、前記貫通孔側に向かってドライガスを供給する、請求項１２記載の検査装置。 The said 2nd dry gas supply part supplies dry gas toward the said through-hole side so that the gas flow which goes to the said 1st space through the said through-hole from the said 2nd space may be formed. 12. The inspection apparatus according to 12.
  14. 　前記第２のドライガス供給部の供給孔径は、前記第１のドライガス供給部の供給孔径よりも小さい、請求項１から１３のいずれか一項に記載の検査装置。 The inspection apparatus according to any one of claims 1 to 13, wherein a supply hole diameter of the second dry gas supply section is smaller than a supply hole diameter of the first dry gas supply section.
  15. 　前記電子部品は、水晶振動デバイスである、請求項１から１４のいずれか一項に記載の検査装置。 The inspection apparatus according to any one of claims 1 to 14, wherein the electronic component is a crystal vibrating device.
  16. 　ドライガスが供給された状態で電子部品の温度特性を検査する検査装置であって、
    　前記電子部品を検査する検査室と、
    　前記検査室内に設けられ、前記検査室に供給された電子部品を検査するために搬送する搬送機構と、
    　前記検査室内にドライガスを供給するドライガス供給部と、
    　前記電子部品を前記検査室に供給するための部品供給路と、
    　前記電子部品を前記検査室から排出するための部品排出路と、
    　前記電子部品を前記部品供給路から前記検査室に供給するために、前記検査室内の吸引孔からガスを吸引する吸引部と、
    　前記電子部品を前記検査室から前記部品排出路へ排出するために、前記検査室内の吹出孔にガスを吹出す吹出部と、
    　前記電子部品を所定温度に設定するために前記検査室の温度を制御する第１温度制御部と、
    　前記検査室における前記吸引部の吸引孔付近の領域の温度を制御する第２温度制御部と、
    　前記検査室における前記吹出部の吹出孔付近の領域の温度を制御する第３温度制御部とを備え、
    　前記第２及び第３温度制御部による温度の少なくとも一方は、前記第１温度制御部による温度と常温の間に制御される、検査装置。     An inspection device for inspecting the temperature characteristics of an electronic component in a state where dry gas is supplied,
    An inspection room for inspecting the electronic component;
    A conveyance mechanism that is provided in the inspection chamber and conveys the electronic components supplied to the inspection chamber;
    A dry gas supply unit for supplying dry gas into the inspection chamber;
    A component supply path for supplying the electronic component to the inspection room;
    A component discharge path for discharging the electronic component from the inspection room;
    In order to supply the electronic component from the component supply path to the inspection chamber, a suction unit that sucks gas from a suction hole in the inspection chamber;
    In order to discharge the electronic component from the inspection chamber to the component discharge path, a blow-out unit that blows gas into a blow-out hole in the inspection chamber;
    A first temperature control unit for controlling the temperature of the examination room in order to set the electronic component to a predetermined temperature;
    A second temperature control unit for controlling the temperature in the vicinity of the suction hole of the suction unit in the examination room;
    A third temperature control unit that controls the temperature of the area near the blowout hole of the blowout part in the examination room;
    The inspection apparatus, wherein at least one of the temperatures by the second and third temperature control units is controlled between a temperature by the first temperature control unit and a normal temperature.
  17. 　前記部品供給路と前記検査室との間は、前記検査装置が作動している間、前記電子部品が供給可能なように常に開放された、請求項１６記載の検査装置。 The inspection apparatus according to claim 16, wherein the part supply path and the inspection room are always opened so that the electronic parts can be supplied while the inspection apparatus is operating.
  18. 　前記部品排出路と前記検査室との間は、前記検査装置が作動している間、前記電子部品が排出可能なように常に開放された、請求項１６又は１７に記載の検査装置。 The inspection apparatus according to claim 16 or 17, wherein the part discharge path and the inspection room are always opened so that the electronic parts can be discharged while the inspection apparatus is operating.
  19. 　ドライガスが供給された状態で電子部品の温度特性を検査する検査方法であって、
    　（ａ）検査室にドライガスを供給すること、
    　（ｂ）前記検査室に電子部品を供給すること、及び、
    　（ｃ）前記検査室内に設けられた搬送機構によって、前記検査室に供給された電子部品を検査するために搬送すること
    を含み、
    　前記（ａ）は、前記検査室における前記搬送機構の一方面側の第１空間にドライガスを供給し、前記検査室における前記搬送機構の他方面側の第２空間にドライガスを供給することを含み、
    　前記第１空間は、前記第２空間以上の広さを有しており、前記第２空間側へ供給するドライガス供給圧力は、前記第１空間側へ供給するドライガス圧力よりも大きい、電子部品の検査方法。
          An inspection method for inspecting temperature characteristics of an electronic component in a state where dry gas is supplied,
    (A) supplying dry gas to the laboratory;
    (B) supplying electronic components to the examination room; and
    (C) transporting the electronic component supplied to the inspection chamber by a transport mechanism provided in the inspection chamber;
    (A) supplying dry gas to the first space on the one surface side of the transfer mechanism in the examination room and supplying dry gas to the second space on the other surface side of the transfer mechanism in the examination room. Including
    The first space is larger than the second space, and the dry gas supply pressure supplied to the second space is larger than the dry gas pressure supplied to the first space. Inspection method for parts.
PCT/JP2016/069422 2015-09-29 2016-06-30 Device and method for inspecting electronic component WO2017056607A1 (en)

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