JP2009139157A - Temperature heightening/lowering unit and temperature heightening/lowering test handler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature heightening/lowering unit and a temperature heightening/lowering test handler, that increase or decrease temperatures of a large amount of semiconductor devices at a time, and achieve a high-speed processing as the whole system. <P>SOLUTION: In the handler for carrying out a high-temperature test and a low-temperature test, the temperature heightening/lowering unit 1 is composed of a temperature increasing unit 11 and a temperature decreasing unit 12 each being a portion of a process performing apparatus arranged on a circumferentially equally disposed position of the test handler H which applies various treatment processes on devices such as an electronic component, a semiconductor device and the like. The temperature increasing/decreasing unit 1 includes: a drum 2 which is applied with a rotational force by a motor M1 through a belt and rotates around a rotation axis O; and a separation table 3. The drum 2 is made up by arranging cylindrical container rails 21 annularly each comprising a carrying path for the devices therein and an opening in the outer circumferential direction of the drum 2. The separation table 3 is disposed in a chamber shared by the drum 2 and configured to rotate a device discharged from the drum 2, through 90°. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an improvement in a test handler that performs various process processes on devices such as electronic components and semiconductor devices, and in particular, a high temperature reduction unit for a device that enables high temperature reduction of a large number of devices at once, and Related to high temperature test handler.

  Conventionally, devices are mainly used indoors, such as audio, television, and personal computers. However, in recent years, with the introduction of IT in automobiles, they have been used in various applications for automobiles. For this reason, the environment used by automobiles, in extreme cases, is required to have performance that can be used mainly in high temperatures and low temperatures, such as desert areas and the Arctic Circle.

  The device structure consists of a pellet made of aluminum wiring on a silicon substrate, a board (copper, glass epoxy, etc.) on which it is mounted, wiring to connect them (gold, aluminum, solder, etc.), and the whole It is composed of a protective resin.

  As mentioned above, the device is composed of various substances, but the thermal expansion coefficient and thermal resistance are different, respectively, the characteristics at normal temperature and the characteristics at high temperatures such as deserts and low temperatures such as the Arctic Circle, In the worst case, it may not operate in a high and low temperature environment. Therefore, when performing device characteristic inspection, it is necessary to assume the use under such high temperature and low temperature conditions.

  In addition, as described above, since the device has a different coefficient of thermal expansion depending on the properties of the stacked components, the substances contained in the components expand due to temperature changes from the time of assembly at room temperature. It is conceivable that cracks (cracks) occur in the entire part and it will not function. Since the thermal resistance also varies depending on the properties of the materials constituting the part, the electrical characteristics obtained at room temperature may not be obtained at high and low temperatures.

  Thus, for example, a low temperature handler for IC has been proposed that performs IC quality inspection in a low temperature environment in a chamber assuming use at a low temperature (see Patent Document 1). According to this document, it is configured so that the inside of the chamber is kept at a positive pressure and outside air containing moisture is not mixed in the chamber without increasing the size of the apparatus, and the chamber is kept in a low temperature environment while being kept in the low temperature environment. This prevents frosting on the cooling unit of the apparatus due to moisture in the entire air flowing into the inside.

  Also, assuming use under high temperatures, a rail-shaped heater is provided before the device mounted on the lead frame is transported to the test position, and a plurality of devices waiting for testing are placed on the rail-shaped heater. A technique has been proposed in which the devices can be heated to a desired temperature with the heat of the heater by arranging them (see Patent Document 2).

There is also proposed an apparatus in which a plurality of rows of conveyance rails provided with heating means are provided in the middle of the conveyance path, a lead frame moves on the conveyance rails, and a device is heated on the rails to perform a test (patent) Reference 3).
JP-A-6-148268 JP 2004-219226 A JP 2005-62090 A

  By the way, when testing a device under the assumption of high and low temperatures, the test temperature is around 120 ° C. in the high temperature test and about −40 ° C. in the low temperature test.

  As a method for raising the temperature to a high temperature environment, for example, when the temperature of the device is raised from room temperature to 125 ° C., a sudden temperature change causes a large damage to the device. Moreover, even if the device surface has reached a predetermined temperature, the inside of the device may not have reached the predetermined temperature. Therefore, it is necessary to spend at least about 90 seconds to heat the device slowly. This also applies to the case of being placed in a low temperature environment.

  In this regard, in the test apparatuses in Patent Documents 1 and 2, since the devices are aligned in a row, and the test is performed one by one by sequentially heating or cooling, the soak time for raising or lowering the temperature of the device is tested. Since it is long with respect to time, the processing time as a whole also becomes long, and in order to shorten processing time, it was necessary to heat a lot of devices at once.

  Moreover, if it is a device like DIP / SIP (pin insertion type) conventionally used, the method of putting and applying an electric heater in a conveyance rail like patent documents 2 and 3 was main. In recent SMD (surface mount type) devices, since the product is transported by a transport arm or the like, it is preferable to measure by making the inside of the measuring section into a high-temperature tank by high-temperature air blow or the like.

  Furthermore, when a plurality of rails are provided in parallel as in Patent Document 3, a space is required for the apparatus configuration when a large number of devices are processed at the same time by increasing the number of rails.

  In addition, when a device is inserted into the rail shown in Patent Document 3, it is common to insert the electrode portion in the left-right direction, in other words, in the direction perpendicular to the insertion direction with respect to the axis or the insertion direction of the rail. It is. On the other hand, in a test in a test handler equipped with a rotary transfer table, particularly an electrical characteristic inspection (hereinafter also simply referred to as “electric test”) in which voltage, current, resistance, frequency, etc. are measured by contacting an electrode of a device. In view of space saving, a configuration in which the contact, which is a contact, is arranged in the radial direction of the transfer table is preferable.

  Under such circumstances, when the method of inserting and heating the device into the rail is adopted as one processing step of the test handler equipped with the transfer table, if the device ejected from the rail is picked up in the same direction, The direction of the electrode of the device is 90 ° different from the direction of the contact. That is, in this case, it is necessary to reverse the direction of the device ejected from the rail.

  However, assuming a test at a high temperature or low temperature as described above, putting another process between the heat process and the electrical test will result in a situation where the temperature is lower or higher than the set temperature of the heated or cooled device. Connected and hinders the realization of highly accurate testing. Therefore, it has been desired to realize a technique capable of performing other processing such as an electrical test while keeping the device discharged from the rail at a set temperature.

  The present invention has been proposed in order to solve the above-described problems of the prior art. The object of the present invention is to increase or decrease the temperature of a large number of devices at a time in a handler that performs a high temperature test and a low temperature test. An object of the present invention is to provide a high temperature reduction unit and a high temperature reduction test handler for a device such as an electronic component or a semiconductor device that realizes high-speed processing as a whole apparatus.

  In order to achieve the above-mentioned object, the invention of claim 1 receives a device such as an electronic component or a semiconductor device from a transfer device provided with a process processing apparatus for performing various process processes, and the device is subjected to predetermined heating or cooling means. A high-temperature reduction unit that sequentially heats or cools and delivers the device to the transport device, a receiving position for receiving devices from the transport device, a transport path for transporting and storing a plurality of received devices, and the transport device A storage rail provided with a delivery position for delivering the device to the device, a support portion for arranging and holding the storage rail in an annular shape at predetermined intervals, and a plurality of the storage rails arranged in the annular shape to the support portion. A drum provided with a driving means for intermittently rotating via a drum, and a device delivered to the transport device from a delivery position of the drum; Characterized in that and a direction changing device for changing the orientation.

  The invention of claim 6 relates to a high temperature test handler having the high temperature apparatus of claim 1, wherein a holding unit for holding a device such as a semiconductor device or an electronic component is provided at a circumferentially equidistant position. A turntable; and a process processing unit that performs various processing steps such as device appearance inspection, electrical property inspection, taping packing, and the like at circumferentially equidistant positions of the turntable, and the holding unit by intermittently rotating the turntable Is a high temperature reduction test handler that transports each process processing unit as a stop position, receives a device from a holding unit provided in the transport apparatus, and heats or cools the device and sequentially transfers it to the holding mechanism. A high temperature reduction unit having a function of high temperature and / or low temperature is provided as the one-process processing unit, and the high temperature reduction unit is removed from the transfer device. A storage rail having a position for receiving a chair, a transport path for transporting and storing a plurality of received devices, and a position for delivering the device to the transport device, and a plurality of the storage rails arranged in an annular shape at predetermined intervals A drum comprising: a support portion that holds and holds; and a driving means that intermittently rotates the plurality of storage rails arranged in an annular shape via the support portion; and the transfer device from the delivery position of the drum And a direction changing device that receives the device delivered to the device and rotates the device from a predetermined center to change the direction of the device.

  According to the above aspect, the high temperature reduction unit used for the test handler is provided with a plurality of storage rails that can store a plurality of devices therein in an annular shape and is configured to be rotatable via the support portion. A large number of devices can be simultaneously stored in the entire storage rail. Therefore, a large number of devices can be held at the same time, heated or cooled, and devices can be transferred one by one to a separately provided test handler. As a result, the soaking time for the device, that is, the heating or cooling time in the impregnated state can be sufficiently secured in the high temperature reduction unit without delaying the delivery timing to the test handler.

  Further, by arranging the storage rails in an annular shape, it is possible to save space compared to the case where the storage rails are arranged in parallel in a planar shape. Moreover, it is possible to ensure a sufficient soak time of the device during one round by a simple action of rotating.

The invention of claim 2 is characterized in that, in the invention of claim 1, the heating means is provided with a heater in the drum or in the vicinity of the drum, or the whole unit is provided in a chamber in a high temperature atmosphere.
The invention according to claim 7 is the invention according to claim 6, wherein the means for heating the device is provided with a heater in the drum or in the vicinity of the drum, or the entire unit is provided in a chamber in a high temperature atmosphere. It is characterized by.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the cooling means is provided with a cooling element in the drum or in the vicinity of the drum, or the entire unit is provided in a chamber of a cooling atmosphere. Features.
The invention of claim 8 is the invention of claim 6 or 7, wherein the means for cooling the device is provided with a cooling element in the drum or in the vicinity of the drum, or the entire unit is provided in a chamber of a cooling atmosphere. It is characterized by becoming.

  In the above-described aspect, the high temperature unit is provided with heating means such as a heater in or near the drum, and radiates infrared rays, and the emitted infrared rays are directly or indirectly via a storage rail. The device can be heated from a close position. In this case, the storage rail is preferably made of a material having high thermal conductivity. It is also possible to cover the entire unit with a chamber and to make the inside of the chamber a high temperature atmosphere as a heating means. On the other hand, in the low temperature unit, the device can be cooled by using a Peltier element as a cooling means instead of the heater, or by using a cooling atmosphere in the chamber as a cooling atmosphere.

  The invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein the support member is a disk that holds the storage rails arranged in an annular shape from the inner peripheral surface at both ends, A rotating shaft is provided at the center of the disk, and the driving means rotates the rotating shaft.

  According to a fifth aspect of the present invention, in the invention according to any one of the first to third aspects, the support member includes a pulley and a belt hung on the pulley, and the storage rail is spaced from the belt at a predetermined interval. The drive means rotates the rotating shaft of the pulley.

  According to the above aspect, when the storage rails are arranged in an annular shape, various configurations can be employed depending on the purpose, application, and arrangement space of the apparatus.

  The invention according to claim 9 is the invention according to any one of claims 6 to 8, wherein the direction changing device is configured to move the device from the holding unit to a position that coincides with the position of the adjacent holding unit of the turntable. A receiving position for receiving the transfer and a transfer position for transferring, and an angle formed by the receiving position and the transfer position with respect to the center of the direction changing device, and the center of the turntable of the holding portion adjacent to the turntable. The sum of angles formed with respect to is a direction change angle that changes the orientation of the device.

  The invention of claim 10 is the invention according to any one of claims 6 to 9, wherein in the high temperature reduction unit, the device electrode is inserted into the storage rail so as to be parallel to a tangential direction of the turntable. An electrical property inspection device for inspecting the electrical property of the device is provided in a position adjacent to the turntable on the downstream side of the high temperature reduction unit, and in the electrical property inspection device, the electrode is connected to the turntable. The turntable is configured to inspect horizontally in the radial direction of the turntable, and the direction changing device receives a device transferred from the high temperature reducing unit to the transfer device, and changes the direction of the device by 90 °. And it delivers to the said conveying apparatus, It is characterized by the above-mentioned.

  The invention according to claim 11 is the invention according to any one of claims 6 to 10, wherein the holding portion is provided at 36 positions at intervals of 10 ° with respect to the turntable. An angle between the position and the center of the direction changing device is 80 °.

  In the above-described aspect, since the device is received and stored on the storage rail from the transfer device side, and the device is transferred again to the transfer device, it can be configured as one processing step processing device of the transfer device. Compared to a configuration in which devices are held on rails and heated and delivered sequentially, there is no need to prepare a new test handler for high-temperature testing. Can be suppressed at low cost.

  Further, in the direction changing device, the sum of the angle formed by the receiving position and the delivery position with respect to the center of the direction changing device and the angle formed by the holding table adjacent to the turntable with respect to the center of the turntable is a device. By changing the orientation of the device, the orientation of the device can be changed to the desired angle with a simpler configuration that combines the position of the holding part of the turntable and the placement position of the device of the orientation change device. can do.

  In particular, in the electrical property inspection in the transfer apparatus having the turntable as in the present invention, the contactor that measures the electrical property of the device in contact with the electrode of the device due to the problem of the space in the width direction of the adjacent process processing unit. Are arranged so as to be parallel to the radial direction, not to the tangential direction of the turntable.

  On the other hand, it is necessary to insert the electrode of the device in parallel to the tangential direction of the turntable with respect to the storage rail of the high temperature reduction unit. Therefore, in the present invention, in the direction changing device provided in the chamber of the high temperature or low temperature atmosphere, the direction of the device coming out of the high temperature reduction unit is changed by 90 °, thereby proceeding directly to the electrical characteristic inspection. Can do. Further, conventionally, a reversing device is provided outside the chamber and reversed, and the device has moved up and down from a predetermined temperature over time, but according to the present invention, Without such a situation, it is possible to perform a highly accurate electrical test while keeping the device at a predetermined temperature.

  According to the present invention as described above, in a handler that performs a high temperature test and a low temperature test, an electronic component or a semiconductor device that enables high temperature or low temperature of a large number of devices at a time and realizes high-speed processing as the entire apparatus. It is possible to provide a high temperature reduction unit and a high temperature reduction test handler for the devices.

  Next, the best mode for carrying out the present invention (hereinafter referred to as the present embodiment) will be described with reference to FIGS.

(1) Configuration of the present embodiment The high temperature reduction test handler in this embodiment constitutes one process in which the high temperature reduction unit is positioned in the same manner as the appearance inspection process, electrical property inspection process, taping process, etc. in the test handler. As the process processing apparatus, it is provided at a circumferentially equidistant position of the test handler.

[1. Overall configuration of high temperature test handler]
The overall configuration of the low temperature test handler of the present embodiment will be described with reference to FIG. FIG. 1 is a plan view (a) and a schematic side view (b) of a high temperature test handler including the high temperature unit of this embodiment as a one-step processing apparatus. In the present embodiment, as a process processing apparatus of one test handler, a high temperature unit 11 that increases the temperature of a device such as an electronic component or a semiconductor device, and a device whose temperature is increased or a temperature increased device is increased. The low temperature unit 12 is provided at a different position. However, this embodiment shows an optimum embodiment. In addition to the embodiment, only one of the high temperature unit 11 and the low temperature unit 12 can be provided as a process processing apparatus.

  As shown in FIG. 1, the high temperature reduction unit 1 of the present embodiment is a process processing apparatus provided at a circumferentially equidistant position of a test handler H that performs various process processes on devices such as electronic components and semiconductor devices. Are formed of a high temperature unit 11 and a low temperature unit 12.

  More specifically, at position 1 in FIG. 1, a plurality of devices aligned and conveyed from the parts feeder are arranged at equal circumferential positions so as to extend below the turntable T (here, 36 at 10 degree intervals). ) Picked up by the nozzle N of the suction holding mechanism provided. This turntable T is intermittently rotated by 10 ° in the clockwise direction in the figure, and is provided with an appearance inspection device in which the polarity of the electrode of the device is checked by an appearance camera or the like at position 2, and the polarity at position 3 A reversing device for correcting the above is provided.

  In the present embodiment, the device supply means to the turntable T is a parts feeder. However, this is merely an example of the component supply means. In addition, for example, supply in a lead frame, tube (stick) supply Any known supply means such as wafer supply can be substituted.

  And the high temperature unit 11 which concerns on this embodiment is provided in the position 4, and the device hold | maintained at the nozzle N here is heated by predetermined temperature. The heated device is again held by the nozzle N, and the heated device is subjected to an electrical test process in the high-temperature test apparatus at position 5. Further, at position 6, a reversing device is provided that changes the orientation of the device discharged from the high-temperature test apparatus by 90 ° from the configuration of the device orientation in the high-temperature test apparatus described later.

  At the position 7, the low temperature unit 12 according to the present embodiment is provided, and the device held and transported by the nozzle N is cooled from the heated temperature to the normal temperature. The room temperature device is then subjected to an electrical test at position 8 by a low temperature test apparatus. In the low temperature unit 12, the electrical test process at position 8 may be performed in a state where the device is cooled from room temperature and cooled.

  The device that has completed the electrical test process as described above is held in the nozzle N as it is, and the reversing device (position 9), the appearance inspection device (position 10) for discriminating defective products, defective products and non-defective products. Sorting and sorting device (positions 11 and 12) that classifies and shoots according to the level, taping devices (positions 13 and 14) that sequentially pack non-defective products on tape, and forced discharge that discards devices that have not been taped and packed It goes through the device (position 15). In addition, arrangement | positioning of the process processing apparatus in the position 1-15 is the illustration in this embodiment, and arrangement | positioning of process processing apparatuses other than the high temperature reduction unit 1 and a high temperature test apparatus is for the kind of device, and the objective of a user. It can be changed accordingly.

[2. Configuration of high temperature reduction unit]
Next, the structure of the high temperature reduction unit 1 is demonstrated with reference to FIGS. FIG. 2 is a perspective view (a) and a plan view (b) extracted from only the high temperature reduction unit 1 at positions 5 and 6 and positions 7 and 8 from the overall configuration shown in the plan view of FIG.

  In addition, the structure of the high temperature unit 11 and the low temperature unit 12 is a difference of whether a heating means is provided or a cooling means is provided so that it may mention later. Therefore, in the following, these will be described as the high temperature reduction unit 1 without distinction.

[2-1. Drum configuration]
As illustrated in FIG. 2, the high temperature reduction unit 1 includes a drum 2 that is rotated about a rotation axis O and is given a rotational force by a motor M <b> 1 via a belt.

  2A and 3, the drum 2 has a cylindrical shape and includes a plurality of storage rails 21 that are internally provided with a device conveyance path and an opening in the outer peripheral surface of the drum 2. It is arranged in an annular shape. The drum 2 also includes support members 22 that maintain the storage rail 21 in an annular shape at both ends of the storage rail 21. The support member 22 is formed in a disk shape, and supports the storage rail 21 from the inner peripheral surface side at both ends of the drum 2. And this support member 22 is connected with the rotating shaft O provided in the center axis | shaft of the drum 2 in the center part.

  Here, the heating or cooling means of the high temperature reduction unit 1 will be described. In the high temperature unit 11, heating means such as a heater is provided in or near the drum 2 to radiate infrared rays, and the emitted infrared rays are conducted directly or indirectly to the device through the storage rail and close to the device. Heat the device from position. In this case, the storage rail 21 is preferably made of a material having high thermal conductivity. It is also possible to cover the entire unit with a chamber and to make the inside of the chamber a high temperature atmosphere as a heating means. On the other hand, in the low temperature unit 12, a Peltier element is used as a cooling means instead of a heater, or the inside of the chamber is used as a cooling means as a cooling means. In the case where the atmosphere in the chamber is increased or decreased in temperature, as a heating or cooling means, as shown by a one-dot chain line in FIG. Use a low temperature environment. In this case, specifically, the inside of the chamber is set to around 120 ° C. when the temperature is high, and about −40 ° C. when the temperature is low.

  In the present embodiment, as shown in FIG. 3A, the drum 2 has eight storage rails 21 arranged at intervals of 45 degrees, and the rotation shaft O is rotated by the drive of the motor M1. It rotates intermittently at intervals, that is, 45 ° intervals.

  As shown in FIG. 3 (b), the shape of one storage rail 21 is a surface that is square and has a vertically long shape and is a cylindrical surface that is located on the outer periphery when the drum 2 is configured. , With a narrow groove. Further, the size of the inner peripheral surface forming the transport path of the storage rail 21 is designed according to the size of the semiconductor device to be processed, and the transported semiconductor device is transported without being clogged or in contact with the side surface. It is appropriately designed to have a possible size.

  Further, the axial lengths of the drum 2 and the storage rail 21 are determined by the number of semiconductor devices waiting in the conveyance path of the storage rail 21 and the desired number of semiconductor devices for batch processing. The waiting number of the semiconductor device is such that the delivery time interval to the test handler H (the sum of the transport time per intermittent rotation of the test handler H and the processing time in one process) and the semiconductor device to a predetermined temperature. Heating or cooling time is considered. For example, if the heating time of the device is 90 seconds, the intermittent rotation timing of the turntable T is 0.2 to 0.3 seconds, so that about 50 devices are provided for one storage rail 21. It is configured to be stored.

  Further, as shown in FIG. 2, the drum 2 includes an insertion position X for insertion into the storage rail 21 that receives a device from the test handler H and a discharge position Y for discharging from the storage rail 21 in the same direction. That is, on the turntable T side, both the insertion position X for receiving the device from the test handler H and inserting it into the storage rail 21 and the discharge position Y for discharging the device from the storage rail 21 are provided. The insertion position X is provided on the storage rail 21a at the top of the annular shape, and the discharge position Y is stored upstream of the insertion position X in the rotation direction of the turntable T and downstream of the drum 2 in the rotation direction. It is provided on the rail 21b.

  At this insertion position X, as shown in detail enlarged views in FIGS. 4A and 4B, a stage 23a on which the received device C is temporarily placed by the lowering operation (Z-axis movement) of the nozzle N is provided. A push-in member 23b is provided for inserting devices placed on the stage 23a one by one toward the storage rail 21b. The pushing member 23b is configured to reciprocate on the stage 23a from the turntable T side toward the storage rail 21b in accordance with the rotation timing of the turntable T of the test handler H.

  On the other hand, the discharge position Y is provided at the turntable T side end of the storage rail 21a located at the top of the annular shape. At this discharge position Y, as shown in detail enlarged views in FIGS. 4A and 4C, the device C at the side end of the storage rail 21a is separated from the storage rail, and the nozzle N of the test handler H is separated. Is provided with an escape 24a that is moved to a position for pickup. Further, a feed member 24b for sequentially feeding the devices in the storage rail 21a is provided for the escape 24a.

  The feed member 24b is inserted from the opening of the storage rail 21b and moves in the axial direction of the storage rail 21a from the opposite side of the test handler H toward the turntable T side. The drive mechanism is provided on the side of the drum 2 and is realized by the ball screw B being rotated by the rotation of a motor (not shown) and the support portion 24c connected thereto being moved.

  The movement timing of the feed member 24b is also synchronized with the timing of intermittent rotation of the turntable T in the test handler H. As the nozzle N moves, the devices stored in the storage rail 21a are escaped one by one. It is supposed to be discharged towards. The feeding member 24b is also configured to retract from the position where it is inserted into the groove of the storage rail 21a to the retraction rail 21c and move to a position where it does not interfere with the storage rail 21a. After all the devices are transported to the turntable T side, they are moved to the retreat rail 21c at the end opposite to the test handler H, which is a position that does not interfere with the groove.

  Further, the escape 24a receives the device C from the storage rail 21b, and then moves to a surface parallel to the conveyance path of the storage rail 21a, that is, 45 ° in the direction of the arrow in the drawing to the insertion position X, and moves to the nozzle N. The heated device is delivered (after the rotation is indicated by a two-dot chain line in the figure).

  The mechanism for transporting the device placed in the groove of the storage rail may use any configuration of known linear component transfer means, such as a configuration in which vibration and air act in the transport direction. it can. In this regard, in the present embodiment, like a feed member 24b shown as an example in the figure, it has substantially the same shape as the groove of the conveyance path, and is configured to move in the groove toward the storage rail 21a. .

[2-2. Configuration of isolation table]
The high temperature reduction unit 1 of this embodiment is provided with the separation table 3 adjacent to the downstream side of the drum 2, as shown in FIG. Here, the role of the separation table 3 in the high temperature reduction unit 1 will be described.

  In the test handler H of the present embodiment in FIG. 1, at a position 1, an electrode is picked up from a parts supply device such as a parts feeder with the electrodes facing in a direction parallel to the tangential direction of the turntable T, and thereafter at positions 2 to 4. In the process, the process is performed without changing the direction of the electrodes.

  On the other hand, in the high / low temperature test apparatus implemented at the position 5 or the position 8, it is necessary to suppress the width space in the tangential direction of the turntable T because of the arrangement as one process of the turntable T. .

  For this reason, in the high / low temperature test apparatus, the contact electrode, which is a contact that requires space in the width direction, is arranged not in the tangential direction of the turntable T but in the radial direction.

  On the other hand, the high temperature reduction unit 1 in the present embodiment is for inserting a device into the storage rail 21. For this rail, the electrode of the device is set to 90 ° with respect to the insertion direction as described above. Need to be done. The storage rail 21 is arranged in the radial direction of the turntable T.

  Under such circumstances, it is necessary to invert the device discharged from the high temperature reduction unit 1 by 90 ° before conducting an electrical test. However, for example, if a conventional reversing device such as the one disposed at the position 6 or 9 in FIG. 1 is provided at the downstream side of the high temperature reduction unit 1, a device heated or cooled over time can be obtained. As time elapses, the temperature rises or falls below a predetermined temperature, resulting in an electrical test that cannot be performed at a desired temperature.

  Therefore, in the present embodiment, the device is rotated 90 ° in a high and low temperature atmosphere similar to the state in the drum 2 in the chamber by the separation table 3 disposed in the same chamber as the drum 2. is there.

  A specific configuration of the separation table 3 is shown in FIG. FIG. 5A is a schematic diagram showing a configuration of the separation table 3 in the present embodiment, and FIG. 5B is a schematic diagram showing a configuration of a conventional separation table (or satellite table).

  The conventional separation table 30 shown in FIG. 5B is a line connecting the center P of the turntable T and the center Q of the separation table 30 with the receiving position from the turntable T and the delivery position being a common position R. Is configured such that the center of the position R is located at the center. Therefore, the direction of the electrode of the device mounted on the separation table 30 is parallel to the tangent l of the turntable T and the separation table 30. Therefore, the orientation of the device does not change even when the separation table 30 rotates.

  On the other hand, in the separation table 3 of the present embodiment shown in FIG. 5A, the separation table 3 is provided separately at an angle of 80 ° from the reception position R1 and the delivery position R2. Further, the separation table 3 is arranged with respect to the turntable so that a straight line connecting the center position P of the turntable T and the center position Q of the separation table 3 passes through the midpoint between these positions R1 and R2.

  Here, conventionally, the separation table 30 is received from the turntable T from the same position and delivered at the same position, so that the orientation of the device is not changed. However, in the separation table 3 of this embodiment, the separation table 30 is received at a different position. Since the delivery is performed, the orientation of the device is changed at the time of receipt and delivery.

  More specifically, in the separation table 3, since the positions R1 and R2 are provided at an angle of 80 ° as described above, the device mounted on R1 of the separation table 3 is rotated by the rotation of the separation table. By moving to R2, the orientation of the device changes by 80 °. Further, in the turntable T, the nozzle delivers the device to the separation table 3 at the receiving position R1, and receives the device from the separation table 3 at the delivery position R2 rotated by 10 °. You will receive it at a different angle. Therefore, the device held by the nozzle N as a whole has a 90 ° orientation due to the movement from R1 to R2 due to the orientation change 80 ° in the device on the separation table 3 and the orientation change 10 ° in the turntable T. Will be changed.

  In addition, the arrangement angle of the nozzle set to 10 ° on the turntable T and the arrangement angle between the positions R1 and R2 set to 80 ° on the separation table 3 are examples, and the angles of R1 and R2 of the separation table 3 are Depending on the arrangement angle of the nozzles on the turntable T, it can be changed as appropriate. The arrangement angle may be set so that the device orientation change angle θ1 is the sum of the nozzle arrangement angle θ2 of the turntable T and the placement angle θ3 of the separation table 3. That is, the configuration is such that [change angle θ1] = [nozzle arrangement angle θ2] + [mounting angle θ3].

  Further, the separation table 3 reciprocates by receiving the rotational force of the motor M2 shown in FIG. 2 through a belt, and matching the 80 ° angle of R1 and R2 with the timing of intermittent rotation in the turntable T. It is.

(2) Operation of the present embodiment The operation of the high-temperature reduction unit 1 of the present embodiment configured as described above will be described with reference to a schematic diagram showing the operation of FIG. In the following, embodiments of the high temperature unit 11 at the position 4 in FIG. 2 and the high temperature test apparatus 14 at the position 5 will be described, but the case of the low temperature unit and the low temperature test apparatus at the positions 7 and 8 will be omitted. The contents of the processes in the low temperature unit 12 and the low temperature test apparatus 14 are the same as the processes in the high temperature unit 11 and the high temperature test apparatus 13.

  In the present embodiment, the device is delivered from the parts feeder at position 1 to the 36 nozzles N of the test handler H. The device held by the nozzle N sequentially moves from position 1 to position 3 and is conveyed to the high temperature reduction unit at position 4.

  The pre-heating device C held by the nozzle N is transferred to the stage 23a by the lowering operation of the nozzle N1 in the Z-axis direction at the insertion position X of the high temperature unit 11 at position 4. The device C1 placed on the stage 23a is sequentially inserted into the storage rail 21a by the push-in member 23b (see FIG. 4A).

  Here, as described above, the number of devices that can be inserted in the storage rail 21 can be set as appropriate depending on the type of device, the length of the storage rail 21, and the like. . Therefore, when 25 devices are inserted into the storage rail 21a, the drum 2 rotates 45 °, which is one storage rail. Further, when viewed from the delivery time to the test handler H, as described above, in the present embodiment, about 25 devices are accommodated in a row of storage rails. When passing to the nozzles of the test handler H that rotates intermittently at intervals of 3 seconds, the time for transferring all the devices in one row of the storage rail 21 is about 10 to 15 seconds. That is, since the drum 2 is intermittently rotated at intervals of 10 to 15 seconds, the device insertion operation from the nozzle N to the storage rail at the insertion position X of the storage rail 21b is also performed in about 10 to 15 seconds. To.

  On the other hand, in the storage rail 21b, the storage operation of the device in the storage rail 21a is completed, and one rotation (here, 315 ° from the insertion position X to the discharge position Y is performed in the direction of the arrow shown in FIG. 2 or FIG. 3). Rotated) and a fully heated device is housed. 4 is inserted into the storage rail 21b from the end opposite to the turntable T, and the devices are pushed out one by one against the escape 24a. The escape 24a on which the device is placed rotates by 45 ° in the direction indicated by the arrow in FIG. 4A or indicated by the two-dot chain line in FIG. 4C, and carries the device on the escape 24a to the insertion position X. The nozzle N receives this device.

  The nozzle N holds the heated device, the turntable T rotates 10 °, and the nozzle N is positioned at the receiving position R1 of the separation table 3. In this position, the nozzle N delivers the heated device to the separation table 3 at the receiving position R1 of the separation table 3.

  The nozzle N is positioned at the delivery position R2 of the separation table 3 with the rotation of the turntable T by 10 °, and receives the heated device further rotated by 80 ° by the separation table 3. Here, since this device receives the nozzle N at R2 which is shifted by 10 ° from the nozzle position at the time of delivery, the rotation angle 80 ° by the separation table 3 and the rotation angle 10 ° of this nozzle position are added. Thus, the device is received by the nozzle N while being rotated by 90 °.

  Next, the turntable T is further rotated by 10 °, the nozzle N is positioned on the high temperature test apparatus 13, and the electrode of the device is brought into contact with the contact of the high temperature test apparatus 13 by the lowering operation of the nozzle N in the Z-axis direction. Perform electrical tests. After the electrical test, the turntable T is further rotated by 10 °, the nozzle N is positioned on the reversing device at position 9, and the heated and tested device is rotated by 90 ° by the downward movement of the nozzle N in the Z-axis direction. . Note that, for example, a conventional mechanism can be used as the reversing device in addition to the device disclosed in Japanese Patent Application Laid-Open No. 2004-186328 previously proposed by the present applicant.

  In the high temperature reduction unit 1 of the present embodiment, the processing as described above is sequentially performed in each of the 36 nozzles provided at the circumferentially equidistant positions of the turntable T.

(3) Effects of the present embodiment According to the high temperature reduction test handler H of the present embodiment that operates as described above, the high temperature reduction unit 1 disposed in a chamber of a high temperature or low temperature atmosphere is connected to the rotary shaft O. The drum 2 is configured to be rotatable at the center, and the drum 2 is provided with a plurality of annular storage rails 21 that are vertically long and have a conveyance path inside and can store a plurality of devices. 21 and the entire drum 2 can accommodate a large number of devices simultaneously.

  Therefore, in the high temperature reduction unit 1 of the present embodiment, a large number of devices can be simultaneously held and heated or cooled, and further, devices can be transferred from the drum 2 to the test handler H one by one. Is possible. Thereby, it is possible to sufficiently ensure the soak time for the device in the drum 2, that is, the heating or cooling time in the impregnated state without delaying the delivery timing to the test handler H.

  Further, the storage rail 21 is arranged in an annular shape, the device is delivered from the nozzle N of the turntable T at the insertion position X of the storage rail 21, and then the device is delivered to the test handler H after one rotation. By adopting the configuration, for example, space can be saved as compared with the case where the storage rails are arranged in parallel in a planar shape. Moreover, it is possible to ensure a sufficient soak time of the device during one round by a simple action of rotating.

  Furthermore, the device insertion position X from the test handler H and the device discharge position Y to the test handler H are not provided at the same storage rail 21 position but at adjacent positions, so that Devices can be switched smoothly. In particular, since the device is received and stored in the storage rail from the turntable T side, and the device is transferred again from the turntable T side, it can be configured as one processing step processing apparatus of the test handler H. Compared to a configuration in which the device is held and heated and delivered sequentially, there is no need to prepare a new test handler for the high-temperature test, and the installation cost is reduced and the equipment cost is low. Can be suppressed.

  Further, the separation table 3 is disposed in the same high-temperature or low-temperature atmosphere chamber as the drum 2, and the device orientation is changed by 90 ° for an electrical test as a subsequent processing step. Can do. In this regard, conventionally, a reversing device is provided outside the chamber and the reversing is performed, and the device has moved up and down from a predetermined temperature with the passage of time outside the chamber. According to the present embodiment, it is possible to perform an electrical test with high accuracy while keeping the device at a predetermined temperature without such a situation.

  Further, the separation table 3 is provided with two device receiving positions R1 and delivery positions R2, and the midpoint of these positions is positioned on a line connecting the centers of the turntable T and the separation table 3. . In addition, the change angle of the orientation of the device for the electrical test is the sum of the arrangement angle of the receiving position R1 and the delivery position R2 with respect to the center of the turntable T and the arrangement angle with respect to the center of the separation table 3. Thereby, the direction of the device can be changed to a desired angle with a simpler configuration in which the nozzle position of the turntable T and the mounting position of the separation table 3 are combined.

(4) Other Embodiments The present invention is not limited to the aspect shown in the first embodiment, and includes, for example, the following aspects. In the above embodiment, in the drum 2, the storage rail 21 is arranged in a substantially true circle as an annular shape. However, in the present invention, for example, the storage rail is arranged in an elliptical shape, and the storage rail is rotated. As long as the soak time is ensured, the significance of the annular arrangement is not limited to a perfect circle. Further, the length and number of storage rails to be arranged are design matters, and can be appropriately changed according to the processing time of the test handler and the heating or cooling time of the device.

  Further, the support member for holding the drum storage rail in an annular shape is not limited to the configuration as in the above-described embodiment. For example, as in the drum 20 shown in FIG. Any configuration that can secure the soak time by rotating the storage rail, such as a configuration in which the storage rail is fixed, is also included in the scope of the present invention. As described above, in the present invention, when the storage rails are arranged in an annular shape, various configurations can be adopted according to the purpose, application, and arrangement space of the apparatus.

  In this embodiment, the device is inserted into and discharged from the storage rail by the push-in member 23b or the push-out member 24b. However, the present invention is not limited to this, and any known transfer method such as air chute or vibration transfer can be used. It can be adopted. For example, the device can be discharged from the storage rail by tilting toward the turntable T and moving in the discharge position Y direction of the test handler H by the weight of the device.

The plane schematic diagram (a) and side surface schematic diagram (b) which show the whole structure of the low temperature test handler in embodiment of this invention. The perspective view (a) and top view (b) which show the whole structure of the high temperature reduction unit in embodiment of this invention. The side sectional view (a) and perspective view (b) which show the composition of the drum in the embodiment of the present invention. The perspective view which shows the structural member of the drum in embodiment of this invention. The partial enlarged view (a) which shows the structure of the separation table in embodiment of this invention, and the partial enlarged view (b) which show the conventional separation table. The schematic diagram which shows the structure of the drum in other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... High temperature reduction unit 2 ... Drum 3 ... Separation table 4 ... High temperature reduction part 11 ... High temperature unit 12 ... Low temperature unit 13 ... High temperature test device 14 ... High temperature test device 21 ... Storage rail 21a ... Storage rail 21b ... Storage Rail 21c ... Retraction rail 22 ... Support member 23a ... Stage 23b ... Pushing member 24a ... Escape 24b ... Pushing member 24c ... Supporting part 30 ... Separating table B ... Ball screw C ... Device H ... (High / low temperature) Test handlers M1, M2 ... Motor N ... Nozzle O ... Rotating shaft R1 ... Receiving position R2 ... Delivery position T ... Turntable X ... Receiving position Y ... Delivery position

Claims (11)

A device such as an electronic component or a semiconductor device is received from a transport apparatus equipped with a process processing apparatus that performs various process processes, and the device is heated or cooled by a predetermined heating or cooling means, and sequentially transferred to the transport apparatus. A low temperature unit,
A receiving rail that receives a device from the transfer device, a transfer path that transfers and stores a plurality of received devices, a delivery position that delivers the device to the transfer device, and a plurality of the storage rails A drum provided with a support portion arranged and held in an annular shape at intervals, and a driving means for intermittently rotating the plurality of storage rails arranged in an annular shape via the support portion;
A direction changing device for receiving a device delivered to the transport device from a delivery position of the drum and changing a direction of the device;
A low temperature reduction unit characterized by comprising   The high-temperature reduction unit according to claim 1, wherein the heating unit includes a heater in the drum or in the vicinity of the drum, or the entire unit is provided in a chamber in a high-temperature atmosphere.   The high temperature reduction unit according to claim 1 or 2, wherein the cooling means includes a cooling element in the drum or in the vicinity of the drum, or the entire unit is provided in a cooling atmosphere chamber. The support member is a disk that holds the storage rails arranged in an annular shape on the inner peripheral surface at both ends,
A rotation axis is provided at the center of the disk;
The high temperature reduction unit according to any one of claims 1 to 3, wherein the driving means rotates the rotating shaft. The support member includes a pulley and a belt hung on the pulley,
The storage rails are arranged at predetermined intervals on the belt,
The high temperature reduction unit according to any one of claims 1 to 3, wherein the driving unit rotates a rotation shaft of the pulley. A turntable having a holding portion for holding a device such as a semiconductor device or an electronic component at a circumferentially equidistant position, and various types of device inspection, electrical characteristic inspection, taping packaging, etc. at the circumferentially equidistant position of the turntable. A high temperature test handler that includes a process processing unit that performs a processing process, intermittently rotates the turntable and conveys the holding unit with each process processing unit as a stop position,
A high temperature reduction unit having a function of increasing temperature or decreasing temperature or receiving both of the devices from a holding unit provided in the transfer device and sequentially transferring the devices to the holding mechanism. As a process processing unit,
The high temperature reduction unit is
A storage rail comprising a position for receiving a device from the transport apparatus, a transport path for transporting and storing a plurality of received devices, and a position for delivering the device to the transport apparatus, and a plurality of the storage rails at predetermined intervals. A drum comprising: a support part arranged and held in an annular shape; and a driving means for intermittently rotating the plurality of storage rails arranged in an annular shape via the support part;
A direction changing device that receives the device delivered to the transport device from the delivery position of the drum and rotates the device from a predetermined center to change the orientation of the device;
A low temperature test handler characterized by comprising   7. The low temperature test handler according to claim 6, wherein the means for heating the device includes a heater near the drum or the drum, or the entire unit is provided in a chamber of a high temperature atmosphere.   8. The low temperature test according to claim 6, wherein the means for cooling the device includes a cooling element in the drum or in the vicinity of the drum, or the entire unit is provided in a chamber of a cooling atmosphere. handler.   The direction changing device includes a receiving position for receiving a device from the holding unit and a delivery position for delivering at a position that coincides with a position of an adjacent holding unit of the turntable, and the receiving position and the receiving position. The sum of the angle formed with respect to the center of the direction changing device and the angle formed with respect to the center of the turntable of adjacent holding portions of the turntable is a direction changing angle that changes the orientation of the device. The high temperature reduction test handler according to any one of claims 6 to 8. In the high temperature reduction unit, the device electrode is configured to be inserted into the storage rail in a direction parallel to the tangential direction of the turntable,
In the turntable, an electrical property inspection device for inspecting the electrical property of the device is provided at a position adjacent to the downstream side of the high temperature reduction unit, and in this electrical property inspection device, the electrode is disposed in the radial direction of the turntable. Configured to inspect horizontally
The said direction change apparatus receives the device delivered to the said conveying apparatus from the said high temperature reduction unit, changes the direction of this device 90 degrees, and delivers to the said conveying apparatus. 10. The low temperature test handler according to any one of 9 above. The holding portion is provided at 36 places every 10 ° with respect to the turntable,
11. The low temperature test handler according to claim 6, wherein an angle formed by the receiving position and the delivery position with respect to the center of the direction changing device is 80 degrees.

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