JP4999002B2 - High temperature reduction device and test handler equipped with high temperature reduction device - Google Patents

Description

  The present invention relates to an improvement of a test handler that performs various process processes on a semiconductor device, and in particular, a device for lowering the temperature of a device such as a semiconductor device or an electronic component, and a lowering of the temperature of the device. The present invention relates to a test handler equipped with a device.

  Conventionally, devices such as semiconductor devices and electronic components have been mainly used indoors, such as audio, television, personal computers, etc., but in recent years, they are used in a wide variety of applications as automobiles due to the introduction of automobile IT. It is like that. For this reason, the environment used by automobiles, in extreme cases, is required to have performance that can be used mainly in high temperatures and low temperatures, such as desert areas and the Arctic Circle.

  Device structures such as semiconductor devices consist of pellets made of aluminum wiring on a silicon substrate, substrates (copper, glass epoxy, etc.) on which they are mounted, and wiring (gold, aluminum, solder, etc.) connecting them. , And made of resin that protects the whole.

  As described above, devices such as semiconductor devices are composed of various substances, but their thermal expansion coefficients and thermal resistances are different, and the characteristics at normal temperature and high temperatures such as deserts and under low temperatures such as the Arctic Circle. The characteristics are different, and in the worst case, it may not operate in a high and low temperature environment. Therefore, in fields where high reliability is required for devices such as automotive applications, in addition to normal electrical characteristics inspection at room temperature (hereinafter also simply referred to as “electrical test” or “test”), tests at high temperatures are performed. It is requested.

  In addition, as described above, devices such as semiconductor devices have different coefficients of thermal expansion depending on the properties of the stacked components. In this case, it is considered that cracks (cracks) occur in the entire part and it does not function. Since the thermal resistance also varies depending on the properties of the materials constituting the part, the electrical characteristics obtained at room temperature may not be obtained at high and low temperatures.

  In view of this, for example, a low temperature handler for IC that inspects the quality of an IC in a low temperature environment in a chamber has been proposed (see Patent Document 1). This technology is configured so that the inside of the chamber is kept at a positive pressure and outside air containing moisture is not mixed in the chamber without increasing the size of the apparatus, and the inside of the chamber is kept in a low temperature environment while being kept in the chamber. The object is to prevent frost formation on the cooling unit of the apparatus due to moisture in the entire air flowing in.

In addition, assuming use at high temperatures, a heater is provided in the form of a rail until the semiconductor device mounted on the lead frame is transported to the test position, and a plurality of semiconductor devices waiting for the test are placed on the rail-shaped heater. A technique has been proposed in which a semiconductor device can be heated to a desired temperature with a heater by arranging the pieces (see Patent Document 2).
JP-A-6-148268 JP 2004-219226 A

  By the way, in the above-mentioned high temperature test, a dedicated test device is required. In general, when testing a semiconductor device under the assumption of high and low temperatures, the test temperature is at least about 100 ° C. in the high temperature test and about −40 ° C. in the low temperature test. In order to bring the device to such a temperature, it takes at least several seconds to several tens of seconds, so that the test handler processing speed, that is, the productivity is lowered as a whole, and the test cost is increased as a result.

  As described above, since the high temperature test is costly and time consuming, there is a tendency to be limited to a high value added device corresponding to the high temperature test. However, it is necessary to perform a high temperature test to ensure reliability even in general-purpose devices, and a high and low temperature test apparatus capable of achieving both reliability, cost, and productivity has been demanded. In addition, separate test handlers may be required for high temperature and room temperature tests. In such a case, in addition to the increase in apparatus cost as described above, there has been a problem in apparatus installation space.

  For example, in the test apparatuses in Patent Documents 1 and 2, the semiconductor devices are aligned in a row, and are subjected to a process of sequentially heating or cooling and testing one by one. Since the test time is long, the overall processing time is also long. In addition, in the techniques of Patent Documents 1 and 2 described above, a space corresponding to the length of the rail is necessary, and there is a problem in terms of space saving of the device configuration.

  Furthermore, if it is a semiconductor device like DIP / SIP (pin insertion type) used conventionally, the method of putting an electric heater in a conveyance rail like patent document 2, and applying was main, In recent SMD (surface mount type) semiconductor devices, since the product is transported by a transport arm or the like, it is preferable to measure the inside of the measurement unit by forming it into a high-temperature tank using a high-temperature air blow or the like.

  Even if the device is heated to various temperatures by various methods, the device is not heated or kept warm during the test. The test in the most desirable state has not always been realized because the temperature is lower than the temperature of 1.

  The present invention has been proposed in order to solve the above-described problems of the prior art, and the object thereof is a high temperature test of a device such as a semiconductor device or an electronic component in a handler that performs a high temperature test and a low temperature test. It is an object of the present invention to provide a device having a low temperature and a test handler equipped with a high temperature reduction device that can reduce the space of the entire device and realize high-speed processing at low cost.

In order to achieve the above object, the invention of claim 1 is a high temperature reduction apparatus that receives a device such as a semiconductor device or an electronic component, and sequentially transfers the device to a transfer device that performs various process processes by heating or cooling the device. A disc-shaped inner ring provided so as to be capable of intermittent rotation under the control of a motor; a cover provided so as to cover the inner ring; and a means for heating or cooling a device held by the inner ring. Is provided with its disk-shaped surface in the vertical direction, holding a plurality of devices on the outer peripheral surface, and moving the device held by intermittent rotation from the delivery position to the transport device to the heating or cooling position. A holding portion that returns to the delivery position after one rotation is provided, and the cover is provided with a hole for the device to enter and exit at a position corresponding to the delivery position of the inner ring.

The invention of claim 7 includes various processing steps in which the device is taped and packaged through an appearance inspection and an electrical property inspection of the device such as the semiconductor device or the electronic component while the device such as the semiconductor device or the electronic component is transferred by the transfer device. A test handler having a process processing unit for performing a process of receiving a device from a holding mechanism provided in the transfer device, heating or cooling the device and sequentially transferring the device to the holding mechanism, or both The high temperature reducing device having the above function is provided as a one-step processing unit, and the high temperature reducing device is provided so as to cover the inner ring and a disc-shaped inner ring that can be intermittently rotated by control of a motor. And a means for heating or cooling the device held on the inner ring. The inner ring holds a plurality of devices on the outer peripheral surface, and intermittently rotates. A holding unit that moves the held device from a delivery position that delivers the device to the transfer device to a position where the device is heated or cooled; and the cover is moved into and out of the position corresponding to the delivery position of the inner ring. It is characterized by having a hole for the purpose.

  According to the above aspect, the holding unit for holding a plurality of devices is provided on the outer peripheral surface of the disk-shaped inner ring, the devices conveyed by the conveying device are sequentially received, and the inner ring is rotated once on the circumference. , And sequentially deliver again to the transport device. Moreover, while covering this so that it may insulate with external atmosphere, heating or cooling means, such as a heater, are provided. As a result, it is possible to heat or cool a plurality of devices held by the holding portion of the inner ring for the time required for one rotation of the inner ring, and to transfer devices from the inner ring to the transfer device one by one. The delivery timing to the transport device is not delayed. In addition, while the device held at the holding position provided on the circumference of the inner ring makes one revolution on the circumference of the inner ring, the time of several seconds to several tens of seconds required to bring the device to a predetermined temperature is allowed. Can be secured.

Further, by arranging the device holding portions in an annular shape in the inner ring, for example, space can be saved as compared with a case where the storage rails are arranged in parallel in a planar shape. Moreover, it is possible to ensure a sufficient soak time of the device during one round by a simple action of rotating.
Also, by providing the inner ring with a disk-shaped surface in the vertical direction, when the high temperature reducing device is used as one process processing unit of the transfer device, the space in the left-right direction (XY plane direction) is omitted. Thus, the apparatus can be installed without interfering with other process processing units.

  Furthermore, it is not necessary to prepare a new test handler for high-temperature testing, as compared to a configuration in which the device is held on a conventional rail, and this is heated and transferred sequentially. Since it can be incorporated as a one-process processing unit, it is possible to save the apparatus installation space and to reduce the apparatus cost.

The invention according to claim 8 is the invention according to claim 7 , wherein the inner ring is provided with a disk-shaped surface in a vertical direction.

  In the aspect as described above, by providing the disk-shaped surface of the inner ring in the vertical direction, when the high temperature reducing device is used as one process processing unit of the conveying device, the horizontal direction (XY plane direction) Space can be omitted, and the apparatus can be installed without interfering with other process processing units.

According to a tenth aspect of the present invention, in the seventh aspect of the invention, the inner ring is provided with a disk-shaped surface in a horizontal direction.

  In the above-described aspect, when a large device is transported, if the inner ring and the cover surface are installed in the vertical direction, they may not be absorbed by the suction nozzle and may fall off. There is no such a situation, and it is possible to provide a mode suitable for a large variety.

A second aspect of the present invention is characterized in that, in the first aspect of the present invention, the heating means comprises a heater block in the cover, and the cover is configured as a heater block.
According to the above aspect, the cover provided with the heating means of the device on the outer periphery of the inner ring is configured as a heater block, whereby the device held on the inner ring can be uniformly heated.

According to a third aspect of the present invention, in the first aspect of the present invention, the cooling means includes a cooling element in the cover, and the cover is configured as a cooling block.
According to the above aspect, for example, a cooling element such as a Peltier element is provided on the cover as the cooling means, and the cover is used as a cooling block, whereby the device held on the inner ring can be cooled. In this way, it is possible to cool to a desired temperature below room temperature by using a temperature reducing device at room temperature or a temperature generated by a Peltier element as a cooling means.

According to a fourth aspect of the present invention, in the first aspect of the present invention, the heating means includes a heater provided on the inner ring.
According to the above aspect, by providing the heater on the inner ring, the device held on the outer periphery of the inner ring can be heated from a close position.

According to a fifth aspect of the present invention, in the first aspect of the present invention, the holding portion sucks and holds the device on an outer peripheral surface, and the cooling means is a device and a holding position by sucking and holding the holding portion. It is characterized in that the air flowing in from the gap of the device takes heat of the device.
According to the above aspect, since the cooling mechanism is an adsorption mechanism which is a holding mechanism of the device, the air flowing from the gap between the device and the holding position by the suction holding is deprived of the heat of the device. Can be provided.

According to a sixth aspect of the present invention, in the first aspect of the present invention, the cover is provided with a blow-in port that allows external air to flow into the cover, and the cooling means is connected to the normal temperature or from the blow-in port. It is characterized by flowing in cooled air.
According to the above aspect, for example, a device heated in a high temperature apparatus can be cooled to a desired temperature below the normal temperature by using the low temperature apparatus by the normal temperature or the temperature of the cooling air.

The invention according to claim 9 is the invention according to claim 7 , wherein the transfer device is configured to transfer the device in a horizontal direction by a turntable provided with the various process processing units at circumferentially equidistant positions. The converting device is installed with the surface of the disk parallel to the radial direction of the turntable.

  According to the above aspect, a plurality of test process processing devices are arranged at circumferentially equidistant positions on the turntable of the test handler, but the inner ring and the cover plane of the high temperature reducing device are arranged in the radial direction of the turntable. On the other hand, by setting the surfaces parallel to each other, there is no interference with the adjacent process processing apparatus, and space saving is possible in installing the apparatus.

The invention of claim 11 is the invention according to claims 7 to 10 , wherein when used in the one-process processing section as a high temperature function in the high temperature reducing device, as a process processing section downstream from the process processing section, An electrical property inspection unit, wherein the electrical property inspection unit contacts the electrode of the device that descends while being held by the holding means, and measures the voltage, current, resistance, or frequency of the device; A heating element provided to cover the device to be heated and a heater for heating the heating element, heated by the high temperature function of the high temperature reducing device, conveyed to the electrical property inspection unit by the holding mechanism, and lowered It is characterized in that a temperature drop of the device is prevented by heating the device being heated by the heat retaining body.

  In the above aspect, the heat of the heated heat retaining body further warms the ambient air of the heat retaining body due to heat conduction from the heater to the heat retaining body. As a result, there is a possibility that the temperature of the device heated by the high temperature function of the high temperature reducing device may be lowered during the transportation of the electrical property inspection unit from the high temperature reducing device. It becomes possible to prevent a temperature drop. Thereby, the high temperature measurement in the electrical measurement inspection can be performed with desired temperature accuracy, and the electrical measurement inspection with higher accuracy can be performed.

  According to the present invention as described above, in a handler that performs a high temperature test and a low temperature test, it is possible to increase or decrease the temperature of a device such as a semiconductor device or an electronic component, thereby saving space and speeding up the entire device. It is possible to provide an realized device high temperature reduction apparatus and a test handler including the high temperature reduction apparatus.

  Next, the best mode for carrying out the present invention (hereinafter referred to as the present embodiment) will be described with reference to FIGS. Here, the high temperature reduction device of the present embodiment includes a high temperature device and a low temperature device as an embodiment thereof, and as will be described later, the high temperature device and the low temperature device have a general mechanical configuration. Is the same, and has a difference between a heater for increasing the temperature and a cooling means for decreasing the temperature.

[1. This embodiment]
(1) Outline of Configuration First, the overall configuration of the high temperature reducing device of the present embodiment will be described with reference to FIG. FIG. 1 is a plan view (a) and a schematic side view (b) of a test handler including the high temperature reducing apparatus of this embodiment as its one-step processing apparatus.

  In this embodiment, as a process processing apparatus of one test handler, a high-temperature apparatus that increases the temperature of a device such as a semiconductor device or an electronic component, and a low-temperature apparatus that reduces the temperature of a device or increases the temperature of a heated device Are provided at different positions. In addition, a heat insulation test device for maintaining the temperature of the heated device is provided at a position where the high temperature measurement is provided on the downstream side of the high temperature device.

  In addition, this embodiment shows an optimal embodiment. As another embodiment, the process processing unit of the test handler can be configured by using only a high temperature device or a low temperature device, and the temperature can be reduced. In the case of only the apparatus, the high temperature measurement step is omitted, and thus the above-described heat insulation test apparatus is not used. Further, even when a high temperature apparatus is used, a heat insulation test apparatus is not essential, and can be used in appropriate combination depending on the type or use of the device.

  As shown in FIG. 1, the high-temperature reduction apparatus 1 of the present embodiment is a process processing apparatus provided at a circumferentially equidistant position of a test handler H that performs various process processes on devices such as semiconductor devices and electronic components. It comprises a high temperature device 11 and a low temperature device 12 forming a part of the above. In addition, as a part of the process processing apparatus provided at the circumferentially equidistant position of the handler H, a heat insulation test apparatus 13 that performs an electrical characteristic inspection while keeping the temperature of the device heated by the high temperature apparatus 11 is provided. .

  More specifically, a plurality of devices C (16 here at intervals of 22.5 degrees) are provided at equal circumferential positions so that the devices C aligned and conveyed from the parts feeder extend below the turntable T. Picked up at position 1 by the suction holding mechanism. This turntable T rotates intermittently in the clockwise direction in the figure, and is provided with an appearance inspection process processing apparatus that performs a polarity check of the electrode of the device in an appearance camera or the like at position 2 and corrects the polarity at position 3. A reversing process processing apparatus is provided. In the present embodiment, the parts supply means to the turntable T is a parts feeder. However, this is merely an example of the parts supply means. In addition, for example, supply by a lead frame, tube (stick) supply, Any known supply means such as wafer supply can be substituted.

  And the high temperature apparatus 11 which concerns on this embodiment is provided in the position 4, and the device hold | maintained at the adsorption holding mechanism here is heated to predetermined temperature. The heated device is again held by the suction holding mechanism, and the electrical test process is performed at the position 5 and the position 6 while maintaining the heated temperature in the heat insulation test apparatus 13 in a heated state.

  At the position 7, the temperature reducing device 12 according to the present embodiment is provided, in which the device held and transported by the suction holding mechanism is cooled from the heated temperature to room temperature. Then, the device at room temperature is subjected to an electrical test at positions 8 and 9. In the low temperature apparatus 1b, the electrical test process at the positions 8 and 9 may be performed in a state where the device is cooled from room temperature and cooled.

  The device that has completed the electrical test process as described above is held in the suction holding mechanism as it is, as in the conventional case, the reversing process processing apparatus (position 10), and the appearance inspection processing unit (position 11) for determining defective products. A sorting / sorting process processing device (positions 12 and 13) for classifying a plurality of defective products and non-defective products according to their levels and shooting, a taping process processing device (positions 14 and 15) for sequentially packing good products on a tape, A forced discharge process processing apparatus (position 16) for discarding the device that has not been taping packed is used. Note that these process processes are appropriately combined depending on the use and type of the device, the purpose of the user, etc. In the present invention, examples of the processing apparatus other than the above-described high temperature reduction apparatus and the heat insulation test apparatus are examples. Is merely shown and is not an essential component in the present invention.

(2) Configuration and Operational Effects of High Temperature Reduction Device and Thermal Insulation Test Device Next, the configuration and operational effect of the high temperature reduction device and the thermal insulation test device will be described with reference to FIGS.

(2-1) Configuration of high temperature apparatus [Configuration 1-Arrangement of inner ring of heater]
FIG. 2 illustrates a configuration in which the heater of the high temperature increasing device is disposed as an inner ring as an example of the high temperature decreasing device of the present embodiment. FIGS. 2A and 2B are an AA ′ cross-sectional schematic diagram (a) and a BB ′ cross-sectional schematic diagram (b) of the high temperature apparatus 11 shown in the plan view of FIG. 1.

  As shown in FIG. 2, the high-temperature device 11 has a disk-shaped inner ring 21 that is formed in a cylindrical shape whose overall shape is short in the axial direction (BB ′ direction) and is rotatable in the clockwise direction in the drawing. And a cover 22 provided so as to cover the outer periphery thereof with a hollow inside, and a manifold 23 for controlling the suction and holding of the device in the inner ring, and is rotated intermittently by a shaft 21e and a motor (not shown) around the center. To be controlled. Moreover, as shown in FIG. 1, the plane of the inner ring 21 and the cover 22 of the high temperature lowering device 11 is set parallel to the radial direction of the turntable. That is, it is installed in the same manner as the direction of the reel of the taping device known conventionally.

  The inner ring 21 includes a holding portion 21a that holds devices such as semiconductor devices or electronic components on a disc-shaped outer peripheral surface at equal intervals, and a heater 21b provided on the inner peripheral side of the holding portion 21a. The holding part 21a is provided with a plurality of holding positions 21c (16 in this case) at the circumferentially equidistant positions, and holds the device by evacuating the device via the air passage 21d at the holding position 21c. Yes. More specifically, after the air passage 21d is drawn out toward the center of the circle, the air passage 21d bends vertically toward the axial direction of the inner ring 21 immediately before the heater in the center direction of the inner ring, thereby It abuts on the hole 23a or the groove 23b and is vacuum-sucked by a vacuum mechanism connected thereto.

  Note that the vacuum suction at this holding position shows an optimum embodiment, and any known holding means such as a chuck mechanism for mechanically holding the device can be adopted, and the holding mechanism depends on the type of device. Should be selected as appropriate. In the present embodiment, for convenience of explanation, the number of holding positions 21c is about 16. However, an actual device has a mounting area of about 0.6 mm × 0.3 mm from a so-called 0603 size and a maximum length of about 10 mm. In the case of a small electronic component such as 0603 size, about 100 holding positions can be provided.

  Further, the inner ring 21 is intermittently rotated in synchronization with the rotation of the turntable T under the control of a motor (not shown), and the suction nozzle N descends and reaches the holding position 21c. Device D is received.

  The heater 21b is a heating unit that radiates infrared rays from the inside of the inner ring 21, and the infrared rays radiated from the heating unit are directly or indirectly transmitted to the device via the holding unit 21a to heat the device from a close position. Will be able to. Therefore, in this case, the holding part 21a is preferably made of a material having a high thermal conductivity.

  As described above, the cover 22 is provided so as to cover the outer periphery with the inside being hollow, and is provided with a hole 22a for the suction nozzle N of the suction holding mechanism to enter and exit. Further, in this embodiment, the cover 22 is insulated from the external atmosphere and holds heat generated from the heater 21b in the internal atmosphere.

  2B and 2C, the manifold 23 has a circular shape coaxial with the inner ring 21 and is provided on the back surface of the inner ring 21. As described above, the inner ring 21 is rotated by the shaft 21e of the shaft portion and a motor (not shown), but the manifold 23 is fixed to the cover 22 and does not rotate.

  As shown in FIG. 2 (c), the manifold 23 is provided with a hole 23a and a groove 23b. The hole 23a and the groove 23b are used for vacuum-adsorbing the device through the joint 23c. It is connected to a vacuum mechanism (not shown). The hole 23a is a circular pipe that communicates with the air passage 21d at the uppermost position P1 of the inner ring 21 where the inner ring 21 receives the device D from the suction nozzle N in the holding position 21c. This hole 23a is illustrated in FIG. As shown in FIG. 4, the vacuum valve is connected to the electromagnetic valve V, and vacuum suction and atmospheric release are repeated intermittently under the control of the electromagnetic valve V. The switching timing between the vacuum suction and the atmospheric release is programmed to synchronize with the lowering and raising operations of the suction nozzle N.

  On the other hand, the groove 23b is a pipe that communicates with the ventilation path 21d located at the holding position 21c other than the uppermost position P1 of the inner ring 21 in the holding position 21c, and has a substantially horseshoe shape, and the shape of the ventilation path 21d at the uppermost position P1. Only a portion is cut out and the other ventilation path 21d is covered. Then, as shown in FIGS. 2B and 2C, the pipe of the groove 23b is connected to a vacuum suction mechanism (not shown) from the pipe 23c via a joint 23d, and is always vacuum-sucked. .

[Configuration 2-Heater circumference arrangement]
The configuration of another embodiment of the high temperature device of the present embodiment will be described with reference to FIG. In the embodiment of FIG. 3, a heater block 22b and a plurality of cylindrical heaters 22c are provided with the heater disposed on the inner peripheral side of the inner ring in FIG. As described above, the cover 22 provided with the device heating means on the outer periphery of the inner ring is configured as a heater block, whereby the device held on the inner ring can be uniformly heated.

  The configuration of the inner ring device holding mechanism and the configuration for rotation are the same as in the embodiment of FIG.

(2-2) Operational Effect of High Temperature Apparatus The operation of the high temperature apparatus 11 having the above-described configuration will be described with reference to FIGS. 2 and the embodiment of FIG. 3 are the differences in whether the heating means is disposed on the inner ring or the cover as described above, and the substantial action is the same. The embodiment of FIG. 2 will be described as a representative.

  First, at the position 3 shown in FIG. 1, the device D <b> 1 that has finished the reversal process is conveyed to the high temperature apparatus 11 at the position 4 by the rotation of the turntable T. As shown in FIG. 4A, the device D1 held by the suction nozzle N1 of the suction holding mechanism and transported to the position 4 has a hole provided in the upper portion of the cover 22 when the suction nozzle N is lowered. Inserted into the high temperature apparatus 11 from 22a. The suction nozzle N1 releases the suction when it reaches the holding position 21c, whereby the device D1 is transferred to the holding position 21c and is held by vacuuming at the holding position 21c.

  Thereafter, as shown in FIG. 4B, when the suction nozzle N1 is lifted and retracted, the inner ring 21 is rotationally shifted by one suction position under the control of a motor (not shown). Here, as shown in FIG. 4C, the suction nozzle N1 descends again and picks up the device D2 that has already been inserted and has completed one rotation.

  At this time, the turntable T is rotationally shifted by one process processing position, and the suction nozzle N1 conveys the device D2 to the high-temperature electrical characteristic inspection at position 5 (see FIG. 1) as the next process. On the other hand, as shown in FIG. 4D, the suction nozzle N2 moves while holding the device D3 to the position 4 (see FIG. 1) where the high temperature apparatus 11 is provided. Then, the suction nozzle N2 is lowered with respect to the holding position 21c that is picked up by the device D2, and the device D3 is inserted.

  According to the high temperature apparatus of the present embodiment as described above, a plurality of holding positions are provided at the circumferentially equidistant positions of the disk-shaped inner ring, and the device held at the holding positions is taken from the suction holding mechanism of the test handler. After sequentially receiving and rotating once on the circumference of the inner ring, it is sequentially transferred again to the suction holding mechanism. Moreover, while covering this so that it may insulate with external atmosphere, heating means, such as a heater, is provided in an inner ring | wheel or cover. As a result, multiple devices held at the holding position of the inner ring can be heated at the same time, and devices can be delivered from the inner ring to the adsorption holding mechanism of the test handler one by one. There is no delay in timing.

  In addition, while the device held at the holding position provided on the circumference of the inner ring makes one revolution on the circumference of the inner ring, the time of several seconds to several tens of seconds required to bring the device to a predetermined temperature is allowed. Can be secured.

  By arranging the holding positions in the inner ring in an annular shape, for example, space can be saved compared to a case where the storage rails are arranged in parallel in a planar shape. Similarly, by providing the disk-shaped surface of the inner ring in the vertical direction, when the high temperature reducing device is used as one process processing unit of the transfer device, the space in the left-right direction (XY plane direction) is omitted. Therefore, the apparatus can be installed without interfering with other process processing units. Moreover, it is possible to ensure a sufficient soak time of the device during one round by a simple action of rotating. Furthermore, by installing the inner ring and cover plane of the high temperature reduction device parallel to the radial direction of the turntable, there is no interference with the adjacent process processing equipment, and space saving is achieved in the installation of the equipment. Is possible.

  Compared to a configuration in which the device is held on a conventional rail, heated sequentially, and delivered, there is no need to prepare a new test handler for high temperature testing. Since it can be incorporated as a one-process processing apparatus, it is possible to save the apparatus installation space and reduce the apparatus cost.

  Here, as described above, in this embodiment, the number of holding positions 21c is set to about 16 for convenience of explanation. However, an actual device has a maximum mounting size from a so-called 0603 size having a mounting area of 0.6 mm × 0.3 mm. In the case of a small electronic component of 0603 size or the like, about 100 holding positions can be provided. If 100 holding positions are provided, the index time of the test handler H, that is, the turntable T of the test handler H starts moving from one processing position to an adjacent processing position and then moves to the next processing position. Time ([processing position moving time] + [processing time]) is 0.1 second, the device inserted in the high temperature device is rotated once by the inner ring by the suction nozzle, and is sucked again. A heating time of 10 seconds (0.1 second × 100 holding position) can be secured before being picked up by the nozzle.

(2-3) Configuration of Low Temperature Apparatus Next, in FIG. 1, a specific embodiment of the low temperature apparatus constituting the processing process apparatus at position 7 will be described. Note that, as described above, the low temperature apparatus of the present embodiment has the same configuration and operational effects for rotating the high temperature apparatus and the inner ring, and the configuration and operational effects for holding the device. Since there is a difference between the provision of a heater and the provision of a cooling means for lowering the temperature, the cooling means for lowering the temperature will be described below, and the description of the configuration common to the higher temperature apparatus will be omitted.

The cooling means of the low temperature apparatus of this embodiment consists of the following three aspects as shown in FIGS.
[Configuration 1-Cooling means 1]
FIG. 5 is a cross-sectional view taken along the line CC ′ of the low temperature apparatus shown in FIG. As shown in FIG. 5, the first mode of the temperature lowering apparatus is provided with a vacuum suction mechanism as a cooling means instead of the heater in the mode of the temperature increasing apparatus shown in FIG. More specifically, a vacuum suction mechanism 31b provided on the inner peripheral side of a holding portion 31a that holds a device such as a semiconductor device or an electronic component at equal intervals in the circumferential direction of the disk shape of the inner ring 31 is provided. . The other inner ring and cover configurations are the same as in the embodiment of FIG.

  As described above, since the vacuum suction mechanism is provided on the inner peripheral side of the inner ring 31 as the cooling means, the air in the cover 32 is sucked from the gap between the device D and the holding position 31c. By actively flowing in from the hole 32a, external air circulates in the cover, and the device held by the holding portion 31a of the inner ring 31 is cooled.

  Note that the cooling here refers to returning the device heated to a high temperature at the position 4 to the room temperature for the room temperature electrical characteristic test at the positions 8 and 9 in the test handler of the present embodiment shown in FIG. It is a process and is not intended for cooling to room temperature or below.

  In the above aspect, it becomes possible to cool the device heated in the high temperature apparatus to room temperature using the low temperature apparatus. In particular, by using a vacuum suction mechanism as a cooling means and also serving as a device holding mechanism, an apparatus can be provided at low cost. Also, by incorporating a high temperature apparatus and a low temperature apparatus in one test handler, it is possible to perform an electrical characteristic inspection of a device in a high temperature state and an electrical characteristic inspection of a device in a normal temperature state with one test handler. become. Therefore, it is not necessary to prepare a new test handler for the high temperature test, and it is possible to save the apparatus installation space and to reduce the apparatus cost.

[Configuration 2-Cooling means 2]
As shown in FIG. 6, the second mode of the low temperature apparatus does not use the heater in the high temperature apparatus mode shown in FIG. 2, and further, as a cooling means, in an arbitrary position of the cover 42 and in the cover 42. In contrast, an air inlet 42b through which cooling air is forced to flow is provided. The other inner ring and cover configurations are the same as in the embodiment of FIG.

  In the above aspect, it becomes possible to cool the device heated in the high temperature apparatus to a desired temperature below the normal temperature by using the low temperature apparatus by the normal temperature or the temperature of the cooling air. Also, by incorporating a high temperature device and a low temperature device into one test handler, it is possible to perform electrical property inspection of a device in a high temperature state and electrical property inspection of a device in a room temperature or low temperature state with one test handler. become able to. Therefore, it is not necessary to prepare a new test handler for the high temperature test or the low temperature test, and it is possible to save the apparatus installation space and to reduce the apparatus cost.

[Configuration 3-Cooling means 3]
As shown in FIG. 7, the second mode of the low temperature apparatus is incorporated with a Peltier element 52 c as a cooling means in the heater block 52 b instead of the cylindrical heater in the heater block in the high temperature apparatus mode shown in FIG. 3. The device is cooled by maintaining the atmosphere on the inner peripheral side of the cover 52 in the vicinity of the temperature at which the Peltier element 52c is generated. The other inner ring and cover configurations are the same as in the embodiment of FIG.

  In the above aspect, the device heated in the high temperature apparatus can be cooled to a desired temperature below normal temperature by using the low temperature apparatus at normal temperature or a temperature generated by a Peltier element as a cooling means. . Also, by incorporating a high temperature device and a low temperature device into one test handler, it is possible to perform electrical property inspection of a device in a high temperature state and electrical property inspection of a device in a room temperature or low temperature state with one test handler. become able to. Therefore, it is not necessary to prepare a new test handler for the high temperature test or the low temperature test, and it is possible to save the apparatus installation space and to reduce the apparatus cost.

(2-4) Configuration and Operational Effect of Insulation Test Device FIG. 7 shows an example of the insulation test device of the present embodiment. Fig.7 (a) is a perspective view of the heat insulation test apparatus 13 of this embodiment, (b) and (c) are the schematic diagrams seen from the side surface.

  As shown in the perspective view of FIG. 7A, the heat insulation test apparatus 13 of the present embodiment is a plate-like metal for measuring the voltage, current, resistance, frequency, etc. in contact with the electrodes of the device D. It comprises a contact 13a which is a body, a heat retaining body 13b provided so as to cover the contact 13a, and a heater 13c which heats the heat retaining body 13b.

  The heat retaining body 13b is made of a metal having a relatively high thermal conductivity, such as aluminum or iron, and covers the device D descending in the direction of the contact 13a by the descent operation of the suction nozzle N in the Z-axis direction. A hole or a groove is formed, and the heat of the heated heater 13c is transmitted to the heat retaining body 13b.

  Due to the heat conduction from the heater 13c to the heat retaining body 13b, the heat of the heated heat retaining body 13b further warms the air around the heat retaining body 13b with the hole or groove as the center. As a result, the temperature of the device D heated by the high temperature increasing device 11 at the position 4 in FIG. 1 may be lowered during the transfer from the position 4 to the position 5 and the position 6, but the heat retaining body 13b. It is possible to prevent such a temperature drop by heating with atmospheric heat or conduction heat. Thereby, the high temperature measurement in the electrical measurement inspection can be performed with desired temperature accuracy, and the electrical measurement inspection with higher accuracy can be performed.

  In the present embodiment, the shape of the heat retaining body 13b is specified in the drawing. However, the shape that covers the device without interfering with the process of bringing the electrode of the device into contact with the contact, and the atmosphere from the heat retaining body 13b. The shape of the device is not particularly limited as long as the temperature of the device can be prevented from being lowered by heating or heating by conduction heat.

[2. Other Embodiments]
The present invention is not limited to the aspects shown in the present embodiment, and includes the following aspects, for example. In the above embodiment, as shown in FIG. 1, an embodiment has been described in which the inner ring and the cover plane of the high temperature reducing device are provided in the radial direction of the turntable with respect to the turntable of the test handler. For example, as shown in the partially enlarged view of FIG. 9, the inner ring and the surface of the cover are installed perpendicular to the radial direction of the turntable, that is, parallel to the tangential direction of the turntable. Is also possible. In this figure, an AA ′ sectional view and a BB ′ sectional view are in the state shown in FIG.

  Moreover, in the said embodiment, although it is supposed that the direction of the inner ring | wheel and cover surface of a high temperature reduction apparatus is arrange | positioned in the orthogonal | vertical direction with respect to a turntable, this invention is not limited to such embodiment. Instead, for example, as shown in the cross-sectional views of FIGS. 10A and 10B, the surfaces of the inner ring 61 and the cover 62 can be provided parallel (horizontally) to the turntable T. According to such an aspect, for example, when a large device is transported, if the inner ring and the cover surface are installed in the vertical direction, they may fall without being sucked by the suction nozzle, but they should be placed horizontally. This solves such a problem.

  Further, in the above-described embodiment, the inner ring of the high temperature reducing device is arranged in a substantially perfect circle with the holding part being in an annular shape. However, in the present invention, for example, the inner ring is arranged in an elliptical shape. As long as the soak time is secured by rotating the ring, the meaning of the annular arrangement is not limited to a perfect circle. The number of holding units to be arranged is a matter of design, and can be changed as appropriate according to the processing time of the test handler and the heating or cooling time of a device such as a semiconductor device or an electronic component.

  Further, the support member that holds the inner ring holding portion in an annular shape is not limited to the disk-like configuration as in the above embodiment, for example, a configuration in which a belt is arranged on a pulley and the holding portion is provided on the belt, etc. Any configuration that can secure the soak time by rotating the holding portion is included in the scope of the present invention. As described above, in the present invention, when the inner ring holding portions are arranged in an annular shape, various configurations can be adopted according to the purpose, application, and arrangement space of the apparatus.

The top view (a) and side surface schematic diagram (b) which show the whole structure of the test handler containing the high temperature reduction apparatus in embodiment of this invention. The A-A 'cross section (a) and B-B' cross section (b) which show the one aspect | mode of the high temperature apparatus in embodiment of this invention, and the schematic diagram (c) which shows a manifold. The A-A 'sectional view showing one mode of the high temperature device in the embodiment of the present invention. The schematic diagram which shows the process of the other aspect of the high temperature apparatus in embodiment of this invention. C-C 'sectional drawing which shows the one aspect | mode of the low temperature apparatus in embodiment of this invention. C-C 'sectional drawing which shows the other aspect of the low temperature apparatus in embodiment of this invention. C-C 'sectional drawing which shows the other aspect of the low temperature apparatus in embodiment of this invention. The perspective view (a) which shows the one aspect | mode of the heat retention test apparatus in embodiment of this invention, and schematic diagram (b) and (c). The elements on larger scale which show the structure of the test handler containing the high temperature reduction apparatus in other embodiment of this invention. Sectional drawing (a) which shows the high temperature reduction apparatus in other embodiment of this invention, and D-D 'sectional drawing (b) in sectional drawing (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... High temperature reduction apparatus 11 ... High temperature increase apparatus 12 ... Low temperature apparatus 13 ... Insulation test apparatus 13a ... Contact 13b ... Insulation body 13c ... Heater 21, 31, 41, 51, 61 ... Inner ring 22, 32, 42, 52, 62 ... Cover 21a, 31a, 61a ... Holding portion 21b ... Heater 21c, 31c, 61c ... Holding position 21d, 61d ... Ventilation paths 21e, 31e, 41e, 51e, 61e ... Shaft 22a, 32a ... Hole 22b ... Heater block 22c, 62c ... cylindrical heaters 23, 63 ... manifold 23a ... hole 23b ... groove 23c ... pipe 23d ... joint 31b ... vacuum suction mechanism 42b ... blowing port 52b ... heater block 52c ... Peltier elements D, D1, D2, D3 ... device H ... Test handlers N, N1, N2 ... Suction nozzle T ... Turntable V ... Solenoid valve

Claims (11)

A high temperature reduction device that receives a device such as a semiconductor device or an electronic component, and sequentially transfers the device to a transfer device that heats or cools and performs various process processes,
A disc-shaped inner ring provided so as to be intermittently rotated by control of the motor, a cover provided so as to cover the inner ring, and a means for heating or cooling the device held by the inner ring,
The inner ring is provided with its disk-shaped surface in a vertical direction, holds a plurality of devices on the outer peripheral surface, and moves from a delivery position that delivers the device held by intermittent rotation to a conveying device to a position where it is heated or cooled. It has a holding part that moves and makes one rotation and then returns to the delivery position,
The high temperature reduction apparatus according to claim 1, wherein the cover includes a hole for a device to enter and exit at a position corresponding to a delivery position of the inner ring. The high temperature reduction apparatus according to claim 1, wherein the heating unit includes a heater provided in the cover, and the cover is configured as a heater block. The high temperature reduction device according to claim 1, wherein the cooling unit includes a cooling element in the cover, and the cover is configured as a cooling block. The high temperature reduction device according to claim 1, wherein the heating means is provided by providing a heater in the inner ring. The holding unit is to hold the device on the outer peripheral surface by suction,
2. The high temperature reduction apparatus according to claim 1, wherein the cooling unit is configured such that air flowing in from a gap between the device and the holding position by adsorption holding by the holding unit takes heat of the device. 3. The cover is provided with a blowing port for allowing outside air to flow into the cover,
The high-temperature reduction apparatus according to claim 1, wherein the cooling means is configured to cause room temperature or cooled air to flow from the blowing port. A process processing unit is provided that performs various processing steps for taping and packing a device through an appearance inspection and an electrical property inspection of the device such as the semiconductor device or the electronic component while the device such as the semiconductor device or the electronic component is transferred by the transfer device. A test handler,
A high temperature reduction apparatus having a function of increasing or decreasing the temperature by receiving a device from a holding mechanism provided in the transfer apparatus, and sequentially transferring the device to the holding mechanism by heating or cooling the device. As a processing unit,
The high temperature reducing device includes a disc-shaped inner ring provided so as to be intermittently rotated by control of a motor, a cover provided so as to cover the inner ring, and a means for heating or cooling a device held by the inner ring. Prepared,
The inner ring holds a plurality of devices on the outer peripheral surface, and moves the device held by intermittent rotation from the delivery position to the transfer device to the heating or cooling position, and then returns to the delivery position after one rotation. Part
The cover is provided with a hole for allowing the holding mechanism to go in and out at a position corresponding to a delivery position of the inner ring. 8. The test handler with a high temperature reducing device according to claim 7 , wherein the inner ring is provided with a disk-shaped surface thereof in a vertical direction. The transport device transports the device in the horizontal direction by means of a turntable equipped with the various process processing units at circumferentially equidistant positions,
9. The test handler provided with the high temperature reducing device according to claim 8, wherein the high temperature reducing device is installed with a surface of the disk parallel to a radial direction of the turntable. 8. The test handler provided with a high temperature reducing device according to claim 7 , wherein the inner ring is provided with a disk-shaped surface in a horizontal direction. When used in the one process processing unit as a high temperature function in the high temperature reduction device, as a process processing unit downstream from the process processing unit, comprising an electrical property inspection unit,
The electrical property inspection unit
A contact for measuring the voltage, current, resistance or frequency of the device in contact with the electrode of the descending device held by the holding means;
A heat insulator provided to cover the contact and the descending device;
A heater for heating the heat retaining body,
The device that is heated by the high temperature function of the high temperature reduction device and that is transported and lowered to the electrical property inspection unit by the holding mechanism is heated by the heat retaining body, thereby preventing a temperature drop of the device. The test handler provided with the high temperature reduction apparatus of any one of Claims 7-10 characterized by these.

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