JP7273399B2 - Parts transfer processing equipment - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component transfer processing apparatus suitable for processes for processing various components, such as an inspection process for inspecting temperature characteristics of electronic components.

Crystal oscillators and thermistor elements change their physical properties greatly with temperature, so it is necessary to evaluate and inspect their temperature characteristics before shipping them as parts. Since these parts are used in large quantities and mounted in extremely small packages, they are inspected by an apparatus called an inspection apparatus that automatically measures and evaluates their characteristics.

Conventionally, an inspection apparatus for evaluating temperature characteristics of electrical properties is known in which parts are conveyed by a turret-type rotary conveying apparatus, and a measuring apparatus is arranged on the route to sequentially perform inspections. (See Patent Document 1, for example).

At this time, the temperature of each electronic component is controlled to a predetermined temperature while the electronic component is being rotated by the rotary conveying device on the turret side. For example, FIG. 14 shows a conventional component characteristic inspection apparatus 301 . The component 315 is mounted on a component transport carrier (not shown). A turret table 310 on which the carrier is placed is rotationally driven around a turret table rotating shaft 312 . A component 315 is supplied to the carrier from a component supply device 325 . While the turret table 310 rotates and the component transport carrier holding the component 315 passes through, for example, the first temperature control area 340, the temperature of the component 315 stabilizes at a predetermined first temperature. A property of the component at the first temperature, for example the value of the electrical resistance, is then measured by the first measuring device in the first measuring area 335 . Further, while the turret table 310 rotates and the component transport carrier holding the component 315 passes through the second temperature control area 350, the temperature of the component 315 is stabilized at the predetermined second temperature. A property of the component, for example the value of electrical resistance, at a second temperature is then measured by a second measuring device in the second measuring area 345 . Finally, the parts 315 are collected in the storage box 330. FIG.

Patent No. 3777395

However, the conventional characteristic inspection apparatus needs to stabilize the temperature of both the transport carrier and the component while the transport carrier passes through each temperature control area. That is, not only the heat capacity of the component but also the heat capacity of the transport carrier is added, so there is a problem that it takes time to reach the temperature. Also, especially when measuring output characteristics at multiple measurement points (temperature control area), for example, a measurement point of 0°C or less and a measurement point of 80°C, the time required to stabilize at each temperature is different. , the transport speed of the transport device must be adjusted to the slowest possible. For this reason, there is a limit to improvement in processing capacity.

In addition, when trying to increase the measurement temperature (measurement points), it is necessary to increase the size of the turret table, which causes the problem of increasing the size of the entire apparatus.

Further, for example, when evaluating the temperature characteristics of a part to be processed in a processing apparatus, it is assumed that the part is stabilized at a predetermined temperature during passage in each temperature control region (for example, the first While passing through the temperature control region 340, the temperature of the component 315 is stabilized at a predetermined first temperature), the measured electrical resistance value of the component 315 is the resistance value at the set temperature (first temperature) has been obtained as

However, depending on the state of heat exchange between the turret table and the component 315 (component transport carrier), the temperature of the component 315 may deviate from the predetermined temperature to be stabilized.

In addition, the more miniaturized the parts, the more susceptible the parts are to the influence of the surrounding environment (for example, the influence of outside temperature, humidity, dust, etc.) during measurement, and the processing (measurement) accuracy may decrease.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a component conveying and processing apparatus that has a high processing capacity per unit time and is capable of improving processing (measurement) accuracy.

The present invention provides a turret-type rotary conveying device that holds a plurality of parts by a plurality of part holding mechanisms and conveys the plurality of parts along a part of an annular conveying path; a component supply area for supplying the component to the component holding mechanism; and a processing apparatus arranged in a processing area positioned downstream of the component supply area in the conveying path to perform a predetermined process on the component. a moving mechanism provided in the processing apparatus for moving the component; and a component carrying-out area arranged downstream of the processing area in the transport path for carrying out the component, wherein the moving mechanism comprises: A mounting plate having a mounting portion on which the component is mounted, a heat transfer member for transferring heat to the mounting plate, and the heat transfer member and the mounting plate are integrally formed around the plate rotation axis. a rotation drive unit for rotating, wherein a plurality of the placement units are provided, the reference component for the processing is arranged on a part of the placement units, and the processing apparatus moves the component by the moving mechanism. A measurement unit arranged in a measurement area on the path and measuring an output having a correlation with the comparison information of the component, the measurement unit measuring the comparison information calculated backward from the measured value of the output of the reference component, The component conveying and processing apparatus is characterized in that the reference component is approached to the reference component and referred to as the comparison information of the component moved by the moving mechanism .

According to the parts conveying and processing apparatus of the present invention, it is possible to provide an excellent effect that it is possible to provide a parts conveying and processing apparatus that has a high throughput per unit time and can improve the accuracy of processing (for example, measurement).

1 is a plan view of a component transport processing apparatus according to an embodiment of the present invention; FIG. 1 is a side view of a component transport processing apparatus according to an embodiment of the present invention; FIG. 1A is a side view of a processing device, and FIG. 1B is a schematic diagram of a processing device according to an embodiment of the present invention; FIG. (A) is a plan view of a temperature stabilizing device arranged in a processing area, (B) is a side partial cross-sectional view of a measuring section of the temperature stabilizing device, and (C) is a cross-sectional view of a placing section. 1 is a schematic side view of a turret-type rotary transfer device; FIG. It is a plane schematic diagram explaining the whole operation|movement of a turret type|mold rotary conveyance apparatus. It is a side schematic diagram explaining the conveyance operation|movement of components by a turret type|mold rotary conveyance apparatus. It is a top view of a mounting plate explaining an embodiment of the present invention. It is a top view of the modification of the mounting plate explaining embodiment of this invention. It is a figure explaining other embodiments of the present invention, and (A) is a top view of a mounting plate, and (B) is a graph which shows a temperature change of parts under movement. It is a figure explaining other embodiments of the present invention, (A) is a side schematic diagram of a processing field, (B) is a plane schematic diagram of a processing field, and (C) is a partially expanded sectional view of the same figure (B). . FIG. 4 is a schematic plan view of a processing area for explaining another embodiment of the present invention; FIG. 4 is a schematic plan view of a processing area for explaining another embodiment of the present invention; FIG. 11 is a plan view of a conventional parts conveying and processing apparatus;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

The drawings are an example of the embodiment of the present invention, and the parts with the same reference numerals represent the same parts in the drawings. In addition, in each figure, a part of the configuration is appropriately omitted to simplify the drawing. Then, the size, shape, thickness, etc. of the portion are appropriately exaggerated.

<Overall composition>
FIG. 1 is a schematic plan view for explaining a component transport processing apparatus 1 according to one embodiment of the present invention. The parts conveying/processing apparatus 1 evaluates the characteristics of the parts while conveying them. be done.

The component transport processing apparatus 1 of this embodiment includes a disk-shaped turret-type rotary transport device 10 , a component supply area 51 , a processing apparatus 70 , a moving mechanism 125 , and a component unloading area 53 .

The turret-type rotary conveying device 10 holds a plurality of parts by a plurality of part holding mechanisms 45 and conveys the plurality of parts along a part of an annular conveying path T (indicated by broken lines in the figure).

The component supply area 51 is arranged on the transport path T to supply the parts to the component holding mechanism 45, and the processing area 52 is located downstream of the component supply area 51 on the transport path T to supply the components. This is an area in which the processing device 70 that performs a predetermined process is arranged, and the component carrying-out area 53 is arranged downstream of the processing area 52 in the transport path T, and is an area for carrying out components.

FIG. 2 is a schematic side view of the component transport processing apparatus 1. As shown in FIG. The turret-type rotary transfer device 10 is rotationally driven by a turret table driving device 20 around a turret table rotating shaft 15 . The turret-type rotary transfer device 10 has a plurality of component holding mechanisms 45 fixedly arranged at equal intervals on the periphery of its own turret table 12 . A plurality of elevation urging mechanisms 40 are provided on a stand 35 that is provided independently of the turret-type rotary transfer device 10 . The component holding mechanism 45 cooperates with the elevation biasing mechanism 40 to collect (hold) and/or release components in the component supply area 51, the processing area 52, and the component unloading area 53 (see FIG. 1). Do.

The processing device 70 performs predetermined processing (for example, temperature characteristic measurement, etc.) on the component, and has a moving mechanism 125 and a measuring section 95 . The moving mechanism 125 includes a mounting plate 50 having a plurality of mounting portions 100 on which components are individually mounted, a heat transfer member 130 for transferring heat to the mounting plate 50, and a heat transfer member 130 and a mounting plate 50. and a rotation driving section (mounting plate rotation driving section) 60 that rotates the plate 50 integrally around a rotation axis (mounting plate rotation axis) 55 .

The control device 25 is composed of a CPU, a RAM, a ROM, a storage device such as a hard disk drive, and the like, and controls the conveyance of parts by the turret-type rotary conveying device 10, the release and recovery control of parts by the part holding mechanism 45, and the processing of parts ( output measurement) control, etc. A CPU is a so-called central processing unit, and executes various programs to realize various functions. The RAM is used as a work area and storage area for the CPU, and the ROM stores an operating system and programs executed by the CPU.

Referring to FIG. 1 again, the component transport processing apparatus 1 holds components by a plurality of (12, for example) component holding mechanisms 45 arranged in the circumferential direction of the turret-type rotary transport apparatus 10 . The turret-type rotary conveying device 10 synchronizes these component holding mechanisms 45 with each other and moves them in the circumferential direction (for example, in the counterclockwise direction in FIG. 1), thereby simultaneously conveying a plurality of components along the annular conveying path T. do.

As a result, on the transport path T, there are a component supply area 51 that supplies components to the component holding mechanism 45, a processing area 52 that is arranged downstream of the component supply area 51 and performs a predetermined process on the parts, A component unloading area 53 for unloading components is arranged downstream of the processing area 52 .

In the component supply area 51, components are supplied by an automatic component supply device 65 (for example, a parts feeder). The turret-type rotary transfer device 10 is rotationally driven in the direction of arrow R, and the components held by the component holding mechanism 45 in the component supply area 51 are carried out in the component carry-out area 53 through the processing area 52 counterclockwise. . In the processing area 52, for example, processing for measuring the temperature characteristics of the electrical resistance value of the component is performed. In addition, in this embodiment, since there are a plurality of processing areas 52 , the component passes through these plurality of processing areas 52 .

A plurality of processing devices 70 are arranged in the processing area 52 along the circumferential direction of the turret-type rotary transfer device 10 . In this example, the processors 70 can independently perform different processes. Specifically, for example, each of the processing apparatuses 70 controls (heats or cools) the parts to a different set temperature (near) for each processing apparatus 70, and measures the temperature characteristics of the parts at the set temperatures. do.

Here, as an example, a case where seven processing apparatuses 70 are arranged in the processing area 52 is shown. Specifically, a first processing device 70A to a seventh processing device 70G are arranged in the first processing region 52A to the seventh processing region 52G, respectively.

For example, in the first processing apparatus 70A arranged in the first processing area 52A located upstream of the transport path T, the temperature of the component is raised (or cooling), and the output characteristic of the electrical resistance value when the part reaches 25° C. (near) is measured. The components whose output characteristics have been measured by the first processing device 70A are collected by the component holding mechanism 45 and transported to the second processing area 52B located downstream of the transport path T. FIG. Further, for example, the first processing device 70A (or a separately provided determination device (not shown)) determines whether the parts are good or bad, and the parts determined to be defective are not conveyed to the second processing area 52B. It is discharged to a recovery box (not shown) arranged near the first processing device 70A.

In the second processing device 70B arranged in the second processing area 52B, for example, while heating (or cooling) the parts to a set temperature (near) of 40°C, the electric A resistance output characteristic is measured. The components whose output characteristics have been measured by the second processing device 70B are collected by the component holding mechanism 45 and transported to the third processing area 52C located downstream of the transport path T. FIG. Further, for example, the second processing device 70B (or a separately provided determination device (not shown)) determines whether the parts are good or bad, and the parts determined to be defective are not conveyed to the third processing area 52C. It is discharged to a recovery box (not shown) arranged near the second processing device 70B.

In the third processing device 70C arranged in the third processing area 52C, for example, the temperature of the component is increased (or cooled) to the set temperature (near) of 65°C, and the electric power when the component reaches (near) 65°C A resistance output characteristic is measured. The components whose output characteristics have been measured by the third processing device 70C are collected by the component holding mechanism 45 and transported to the fourth processing area 52D located downstream of the transport path T. FIG. Further, for example, the third processing device 70C (or a separately provided determination device (not shown)) determines whether the component is good or defective, and the component determined as defective is not conveyed to the fourth processing area 52D. It is discharged to a recovery box (not shown) arranged near the third processing device 70C.

In the fourth processing device 70D arranged in the fourth processing area 52D, for example, while heating (or cooling) the component to a set temperature (near) of 80°C, the electric power when the component reaches 80°C (near) A resistance output characteristic is measured. The components whose output characteristics have been measured by the fourth processing device 70D are collected by the component holding mechanism 45 and transported to the component carry-out area 53 located downstream of the transport path T. FIG. Further, for example, the quality of the parts is determined by the fourth processing device 70D (or a determination device (not shown) provided separately). 4 It is discharged to a recovery box (not shown) arranged near the processing device 70D.

Thereafter, the fifth processing region 52E to the seventh processing region 52G can also be similarly set to a predetermined temperature and the same processing can be performed. Note that there may be unused processing regions 52 (processing devices 70), and processing may not be performed continuously (adjacent processing regions 52) as described above.

In addition, in this example, the processing devices 70A to 70G for measuring the output characteristics (a plurality of different temperature characteristics) at different set temperatures are continuously arranged in the processing area 52, but the contents of the processing Depending on the condition, the processing device 70 may be arranged to perform processing other than the temperature characteristic measurement, and the processing device 70 may not be arranged continuously (adjacently) along the circumferential direction, and in the figure, for example, the third processing There may be regions where the processing device 70 is not arranged, such as where the device 70C is not arranged.

Further, the posture of the component held by the component holding mechanism 45 is detected appropriately on the transport path T, for example, downstream of the component supply area 51, between the processing devices 70, or upstream of the component carry-out area 53. It is also possible to arrange a means for adjusting the component holding mechanism 45, a means for cleaning the holding means of the component holding mechanism 45, or the like. For example, the area between the component supply area 51 and the processing area 52 can be defined as the pre-processing area, and the area between the processing area 52 and the component unloading area 53 can be defined as the post-processing area. It becomes the category of the area.

As an example, in FIG. 1, pretreatment areas 52Sa and 52Sb are arranged immediately downstream of the component supply area 51 . The preprocessing area 52Sa is provided with an image capturing device 70Sa that captures the posture of the component held by the component holding mechanism 45 as a still image or moving image (including detection by infrared rays, irradiation, or the like). In addition, a posture adjustment device 70Sb is provided in the preprocessing region 52Sb on the downstream side of the imaging device 70Sa. In the posture adjustment device 70Sb, the orientation of the component held by the component holding mechanism 45 (angle in the circumferential direction with respect to the holding axis) is adjusted with high accuracy, and the center position of the component is adjusted to a predetermined position (aligned with the holding axis). position). The posture adjusting device 70Sb analyzes the posture (state) of the component held by the component holding mechanism 45, for example, based on the image captured by the imaging device 70Sa. If there is an abnormality in the posture (state), the posture adjusting device 70Sb temporarily releases the component and holds it again, or controls the holding means of the component holding mechanism 45 so that the posture (state) is correct. adjust. In this way, by controlling the posture of the component, it is possible to take out (hold) the component from the mounting plate 50 and store (release) the component in the downstream processing devices 70A to 70G with high accuracy. can be done. Although the post-processing area is not particularly illustrated, for example, a visual inspection device or the like for performing visual inspection of parts may be arranged as the post-processing area.

Further, a preparation area 51P may be arranged between the component carry-out area 53 and the component supply area 51 . In this embodiment, in the preparation area 51P, for example, a cleaning device 65P that cleans holding means (for example, suction means) of the component holding mechanism 45 and prepares for the next suction is provided.

Note that the image pickup device 70Sa, the attitude adjustment device 70Sb, and the cleaning device 65P can be arranged anywhere on the transport path T, and at least one of them does not have to be arranged.

Although not shown, a discharge area and discharge means for discharging abnormal components before reaching the component carry-out area 53 may be provided on the transport path T as appropriate.

In addition, the imaging device 70Sa and the posture adjustment device 70Sb are included in the concept of the processing device 70 of this embodiment in a broad sense. The preprocessing areas 52Sa and 52Sb are also included in the concept of the processing area 52 in a broad sense.

After all the output measurements have been completed in this way, the non-defective components pass through the component carry-out area 53 and are wound around the supply reel 5 after their attitudes (direction in the circumferential direction and position in the horizontal direction) are appropriately adjusted. The parts are carried out on a resin tape for packing, and the parts are packaged.

<Processing device>
Next, with reference to FIGS. 3 and 4, the processing device 70 arranged in the processing area 52 will be described. 3A and 3B are schematic diagrams showing the main components of the processing device 70, with FIG. 3A being a side view and FIG. 4 is a schematic diagram of the temperature stabilizing device 125. As shown in FIG.

As shown in FIG. 3A, the processing device 70 has a temperature stabilizing device 125 that controls the temperature of the component and conveys the component in a loop, and a measuring unit 95 that measures the output characteristics of the component.

The temperature stabilizing device 125 serves both as a moving mechanism for moving the component and as a temperature stabilizing mechanism for controlling the temperature of the component while being moved by the moving mechanism. That is, the temperature stabilizing device 125 serves both as a movement mechanism for conveying parts and as a heat transfer mechanism for heating and cooling the parts. The temperature stabilization device 125 comprises a mounting plate 50 on which components can be accommodated.

The measurement unit 95 is an action unit that performs a predetermined action (here, an output measurement action) on the component, and the measurement unit 95 performs measurement by electrically contacting the electrode 120 (see FIG. 3B) of the component 170. It has a probe 110, a probe elevating unit 111 that elevates the measurement probe 110, and a probe positioning mechanism 200 that adjusts the position of the measurement probe 110 in the planar direction with high accuracy. The measurement probe 110 is held by a probe elevating section 111 and is positionally adjusted in the planar direction by the probe positioning mechanism 200 via the probe elevating section 111 . As a result, the measurement probe 110 is raised and lowered in a direction perpendicular to the plane of the mounting plate 50 by the probe elevating section 111 and moved in the plane direction of the mounting plate 50 by the probe positioning mechanism 200 .

When the component 170 to be measured reaches directly below the measurement probe 110 in the measurement section 95 in the measurement area 54, the mounting plate 50 stops rotating. After that, the pair of measurement probes 110 is lowered to come into contact with the pair of electrodes 120 as shown in FIG. 3(B). After the characteristic is measured by the measuring device 105 via this measuring probe 110 , the measuring probe 110 rises, the mounting plate 50 rotates again, and the next component 170 moves directly below the measuring probe 110 .

As shown in FIG. 3A, the probe positioning mechanism 200 engages with the mounting plate 50 (or a member that serves as a reference position of the mounting plate 50) to determine the relative position with respect to the mounting plate 50. The probe positioning engaging portion 210 to be adjusted, the engaging portion elevating mechanism 211 for raising and lowering the probe positioning engaging portion 210, and the engaging portion for minutely moving the probe positioning engaging portion 210 in the XY plane direction. It has a planar movement mechanism 201 . It should be noted that the movement by the engaging portion lifting mechanism 211 and the engaging portion plane moving mechanism 201 is performed prior to the measurement probe 110 (probe lifting portion 111) coming into contact with the component. Specifically, after the probe positioning engaging portion 210 completes engagement with the probe positioning hole 103, the measurement probe 110 (probe elevating portion 111) comes into contact with the component.

The engaging portion planar movement mechanism 201 is movable in horizontal and linear directions (X direction and Y direction) with respect to the measurement portion support table 99 fixedly mounted on the floor surface. For example, the engaging portion planar movement mechanism 201 includes a slide component 202 (for example, a ball-shaped member that can freely roll) arranged on the measuring portion support base 99 and arranged on the measuring portion support base 99 via the slide component 202. It has a planar moving body 203 that is horizontally movable with respect to the measuring part support base 99 .

The engaging portion elevating mechanism 211 is mounted on the planar moving body 203 so as to be freely movable in the vertical direction. The probe elevating section 111 is mounted on the engaging section elevating mechanism 211 so as to be freely movable in the vertical direction. At the time of measurement, first, the probe positioning engaging portion 210 is lowered to a predetermined position (probe positioning hole 103 described later) by the engaging portion elevating mechanism 211 for positioning. lower the

The temperature stabilizing device 125 will be described with reference to FIG. 1A is a top view of a mounting plate 50 provided in the temperature stabilizing device 125, and FIG. 1B is a schematic cross-sectional view of the temperature stabilizing device 125. FIG.

As shown in FIG. 4A, the temperature stabilizing device 125 is a moving mechanism that rotates and moves a plurality of parts simultaneously, and has a plurality of mounting portions 100, which are concave portions on which the parts are individually mounted. A disk-shaped mounting plate 50 is provided. The mounting plate 50 is integrated with a heat transfer member 130, which will be described later, and rotates around a mounting plate rotating shaft 55 while the components are mounted thereon.

The mounting portions 100 are arranged at regular intervals along the circumferential direction of the mounting plate 50 . As the mounting plate 50 rotates, the annular trajectory along which the mounting portion 100 moves becomes the movement path of the component.

In addition, it is preferable that the inner dimension of the mounting portion 100 (recessed portion) substantially matches the outer dimension of the component. By doing so, positional displacement of the component within the mounting section 100 is suppressed. In addition, when a component is mounted on the mounting section 100, the component is required to have high positional accuracy. Therefore, it is desirable to adjust the posture using, for example, the posture adjusting device 70Sb (see FIG. 1) in order to increase the holding accuracy of the component.

On the component movement path formed on the upper surface of the mounting plate 50, there are a measurement area 54 in which the measuring unit 95 of the processing device 70 is arranged, and an entry/exit area 57 in which the component holding mechanism 45 holds or releases the component. is provided. The measurement area 54 is an area including the placement section 1001 arranged directly below the measurement section 95 (measurement probe 110), and the entry/exit area 57 includes, for example, the component holding mechanism 45 (which functions when holding or releasing a component). This is an area where a component is held or released by the component holding mechanism 45), and includes a mounting section 1017 on which the component to be held or released stops. Specifically, as shown in FIG. 4(A), an area including the placement section 1017 that is located closest to (immediately below) the component holding mechanism 45 that performs the holding/releasing operation becomes the entry/exit area 58 . . Also, in this example, the entrance/exit area 57 is an area arranged at a position of 180 degrees on the mounting plate 50 with respect to the measurement area 54 .

That is, in the present embodiment, for example, the parts arranged on the placement section 100 in the half circumference from the entry/exit area 57 to the measurement area 54 in the clockwise direction are the parts before measurement. Output characteristics are measured by the unit 95 . On the other hand, the components placed on the placement section 100 half the circumference from the measurement area 54 to the loading/unloading area 57 in the clockwise direction are the components that have already been measured. It is taken out from the mounting section 100 .

The positions of the entry/exit area 57 and the measurement area 54 are areas fixed with respect to the rotationally moving mounting plate 50. However, for example, when changing the time (distance) from acceptance of the component to measurement, The fixed positions (fixed phase difference in the circumferential direction) of the entry/exit area 57 and the measurement area 54 can be changed. For example, if the phase difference is less than 180, the time (distance) from component reception to measurement is shortened, and if the phase difference is greater than 180, the time (distance) from component reception to measurement is long.

In the loading/unloading area 57, the component mounted on the mounting portion 100 (1017) of the mounting plate 50 is controlled to a predetermined temperature (for example, 25° C.) while being rotated by the temperature stabilizing device 125. After the measurement unit 95 measures the output at the predetermined temperature, the part is moved to the entry/exit area 57 again and collected by the part holder of the part holding mechanism 45 (not shown here). The mounting plate 50 rotates around the mounting plate rotating shaft 55, for example, clockwise in FIG.

A plurality of probe positioning holes 103 are arranged in the circumferential direction on the outer circumference of the mounting section 100 . In this example, the same number of probe positioning holes 103 as the mounting portions 100 are provided in correspondence with each mounting portion 100 (one-to-one).

In each processing device 70, when measuring a component using the measurement probe 110, high positioning accuracy is required when contacting with the measurement probe 110, especially as the component becomes smaller. Therefore, in this embodiment, as shown in FIG. 3, the measuring section 95 includes a probe positioning engaging section 210 that can be lowered prior to the measuring probe 110 .

As indicated by the dotted line in FIG. 3A, the processing device 70 lowers the probe positioning engaging portion 210 prior to the contact of the measurement probe 110 with the part, so that the part to be measured in the measurement area 54 is It is engaged with the probe positioning hole 103 corresponding to the mounted mounting portion 100 (1001).

At this time, at least one of the probe positioning engaging portion 210 and the probe positioning hole 103 has a tapered shape (specifically, a conical shape). In this embodiment, the probe positioning engaging portion 210 is a conical protrusion, and the probe positioning hole 103 is a circular hole with a smaller diameter than the maximum outer diameter of the conical protrusion. As a result, when both are engaged, the probe positioning engaging portion 210 becomes coaxial with the probe positioning hole 103 as a reference, and is centered (position-adjusted) autonomously. Due to this centering effect, the engaging portion planar movement mechanism 201 moves in the horizontal direction (the X direction and the Y direction in the drawing), and is positioned with high accuracy in the horizontal direction with the probe positioning hole 103 as a reference. After that, with the engaging portion planar movement mechanism 201 as a reference, the probe lifting portion 111 lowers the measurement probe 110 to contact the component. By doing so, it is possible to perform highly accurate positioning during measurement.

Although the case where the position is mechanically adjusted in the horizontal direction by engaging the probe positioning hole 103 and the probe positioning engaging portion 210 is illustrated here, the present invention is not limited to this. For example, the probe positioning mechanism 200 may control the horizontal position of the measurement probe 110 by imaging means, a sensor, or the like (not shown).

In this embodiment, the number of probe positioning holes 103 is equal to or greater than the number of placement sections 100 . By providing the probe positioning holes 103 corresponding to the respective mounting portions 100 , the measurement probes 110 can be positioned correctly with respect to all the mounting portions 100 .

However, as shown by the dotted line in FIG. 4A, the probe positioning holes 103F are fixedly arranged in the measurement area 54, and the position adjustment (centering) of the measurement probes 110 with respect to all the mounting parts 100 stopped in the measurement area 54 is performed. ) may be performed by a common probe positioning hole 103F.

Referring to FIG. 4B, the temperature stabilizing device 125 is arranged adjacent to the mounting plate 50 on the back side (back side) of the mounting plate 50, and transfers heat to the mounting plate 50. A heat transfer member 130 is provided. The shape of the heat transfer member 130 is desirably substantially the same shape (substantially disc-shaped) as the mounting plate 50, but may be dispersedly arranged. The heat transfer member 130 and the mounting plate 50 are integrally driven to rotate about the mounting plate rotating shaft 55 by the mounting plate driving device 60 . In order to improve heat transfer efficiency, it is preferable that the mounting plate 50 and the heat transfer member 130 are in contact with each other, and a heat conductive sheet or the like may be interposed between them. Therefore, the temperature of the mounting plate 50 is controlled by the heat transfer member 130 so that the entire mounting plate 50 has a uniform (single) temperature.

In the heat transfer member 130, a heat exchange portion 135 is provided on a plane opposite to the side where the mounting plate 50 is adjacent. The heat transfer member 130 includes, for example, a heat transfer plate 130A and a Peltier element 130B. The temperature of the heat transfer plate 130A in the heat transfer member 130 is monitored, and the output of the Peltier element 130B is controlled using the monitoring result. This structure facilitates replacement of the mounting plate 50 . For example, if it is desired to lower the temperature of the mounting plate 50 and control the components to a temperature lower than the normal temperature, the mounting plate 50 side of the heat transfer member 130 becomes low temperature, and the heat exchange section 135 side becomes high temperature. In that case, the heat exchange section 135 may be air-cooled with a fan or water-cooled by supplying cold water from a chiller, which is a heat exchanger provided outside, so that heat can be easily radiated from the heat exchange section 135. is desirable. Conversely, when it is desired to raise the temperature of the mounting plate 50 to control the temperature of the component to be higher than the normal temperature, the mounting plate 50 side of the heat transfer member 130 becomes high temperature, and the heat exchange section 135 side becomes low temperature. In this case, it is conceivable to bring hot water into contact with the heat exchange section 135 to warm it. These temperature controls are performed by the temperature controller 137 .

The temperature control device 137 is composed of a CPU, a RAM, a ROM, a storage device such as a hard disk drive, and the like. A CPU is a so-called central processing unit, and executes various programs to realize various functions. The RAM is used as a work area and storage area for the CPU, and the ROM stores an operating system and programs executed by the CPU. The temperature control device 137 may be provided for each temperature stabilizing device 125, or may be integrated with the control device 25 (see FIG. 1). The temperature control by the temperature control device 137 is performed, for example, by PID control, but since it is a generally known technique, detailed description thereof will be omitted.

Note that the mounting plate 50 and the heat transfer member 130 are configured to be replaceable. Therefore, for example, a plurality of types of mounting plates 50 having different sizes and numbers of placement portions 100 are prepared, and a plurality of types of heat transfer members 130 having different characteristics (specifications) are prepared. Therefore, it is possible to appropriately replace them according to the processing.

The temperature stabilizing device 125 stabilizes the temperature of the part at a predetermined temperature more than the movement time required for the part to reach the measuring section 95 (measurement area 54/action section) after the part is carried into the loading/unloading area 57. The temperature control time, which is the time until That is, before the part reaches the measurement area 54, the temperature of the part has stabilized at the target value.

In this embodiment, as an example, in all the processing apparatuses 70 , the size (diameter) of the mounting plate 50 is the same, and the measurement area 54 is set at a position of 180 degrees with respect to the entrance/exit area 57 . That is, even in a plurality of processing apparatuses 70 (processing areas 52) set to a plurality of different temperatures, the distance between the entry/exit area 57 and the measurement area 54 is the same. With such a configuration, the temperature of the part is stabilized at the target value before the part reaches the measurement area 54 in all the processing areas 52 as described above.

As an example, in the present embodiment, the mounting plates 50 of the plurality of processing apparatuses 70 have the same size, the same number of mounting portions 100, and rotate at a constant speed. As a result, the distance of the movement path of the component from the loading/unloading area 57 to the measurement area 54 becomes the same, and the components received in the loading/unloading area 57 (mounting unit 100) of each mounting plate 50 among the plurality of processing apparatuses 70 move to the measurement area 54 at the same timing. Also, the time required for measurement is substantially constant regardless of the set temperature, and after measurement, the wafer is conveyed to the downstream processing device 70, so it moves to the input/output area 57 again at the same timing.

Therefore, the processing devices 70A to 70G arranged in the processing areas 52A to 52G all have the same arrangement relationship with the radial direction of each phase (phase of every 30 degrees) of the turret-type rotary transfer device 10 as a reference line. becomes. Specifically, the placement section 100 existing in the entry/exit area 57 of each processing apparatus 70 exists directly below the nozzle of the corresponding component holding mechanism 45, and the turret-type rotary transfer apparatus is positioned with this placement section 100 as a reference. 10, there is a mounting section 100 on the measurement area 54 side of the processing device 80 on the extension line in the radial direction. By doing so, the assembling work and the preliminary setting work (position adjustment work) of the component conveying and processing apparatus 1 can be performed in the same work among the plurality of processing areas 52A to 52G, and the assembling efficiency and maintenance can be improved. Efficiency is dramatically improved.

Note that since the mounting plate 50 and the heat transfer member 130 are replaceable, the size (diameter) of the mounting plate 50 is not limited to this example, and the size (diameter) of the mounting plate 50 can be changed according to the contents of the process, or the measurement from the entry/exit area 57 can be performed. The distance to the area 54 (measurement section 95) may be varied. In addition, as shown in the cross section of the mounting section 100 in FIG. 4C, the mounting section 100 has a plurality of shaped pockets that match the outer shapes of the plurality of parts 172-1 and 172-2 having different sizes. is also preferred. By doing so, it is possible to measure a plurality of types of components 172-1 and 172-2 without exchanging the mounting plate 50. FIG.

<Turret type rotary transfer device>
The turret-type rotary transfer device 10 will be described with reference to the schematic side view of FIG.

A lift urging mechanism 40 is fixed to a stand 35 independent from the turret-type rotary transfer device 10 . That is, the elevation biasing mechanism 40 is fixedly arranged corresponding to each processing area 52 on the transport path T. As shown in FIG. The component holding mechanism 45 is fixed to the turret table 12 and changes its position as the turret table 12 rotates. The lift biasing mechanism 40 is positioned appropriately to engage a component holding mechanism 45 that pauses at each processing area 52 . In this embodiment, as shown in FIG. 6, the pedestal 35 is provided with 12 units corresponding to the respective processing devices 70 (70A to 70G, 70Sa, 70Sb), the automatic component supply device 65, the supply reel 5, and the cleaning device 65P. is fixedly installed.

Specifically, the elevation biasing mechanism 40 reciprocates up and down in the vertical direction (the Z direction shown in FIG. 5), and when lowered, biases the component holding mechanism 45 arranged therebelow. Although not shown in detail, the elevation biasing mechanism 40 includes, for example, a motor that performs rotary motion, a swash plate cam structure that engages with the rotating shaft of the motor to convert the rotary motion into linear reciprocating motion, and a swash plate cam. The structure includes a shaft portion 151 that transmits linear reciprocating motion, an engaging portion 155 formed at the lower end of the shaft portion 151, and the like. The shaft portion 151 is supported vertically upward by an elastic body (not shown). As a result, the shaft portion 151 and the engaging portion 155 can reciprocate in the vertical direction by the rotational power of the motor. Then, the lowered engaging portion 155 comes into contact with the component holding mechanism 45 and pushes it down.

The configuration of the elevation biasing mechanism 40 is not limited to this, and the shaft portion 151 and the engaging portion 155 may be directly driven vertically by a direct-acting power source such as an air cylinder, a hydraulic cylinder, or an electromagnetic solenoid. .

The smaller the weight load of the turret-type rotary conveying device 10 that conveys the parts, the easier it is to increase the processing speed and the less the power consumption. In the component transport processing apparatus 1 of the present embodiment, the lift biasing mechanism 40 fixedly arranged and the turret type rotary transfer device 10 are separated. 40 not included. As a result, the overall processing speed can be easily increased, and power consumption can be reduced.

The component holding mechanism 45 includes a component holder 145, a holder elevating unit 147 that vertically moves the component holder 145, and a component holder positioning mechanism 180 that adjusts the planar position of the component holder 145 with high precision. and The component holder 145 sucks and holds the component from the placement section 100 and releases (accommodates) the component onto the placement section 100 .

The component holder 145 is, for example, a nozzle capable of holding a component by suction or releasing the component by canceling suction. Specifically, the component holders 145 are hollow tubular (cylindrical) and are connected to diaphragm pumps (not shown). The diaphragm pump is controlled by the control device 25 to depressurize the internal space of the component holder 145 when sucking the component, and return the internal space of the component holder 145 to atmospheric pressure when releasing the component.

The component holder 145 is guided in the vertical direction by the holder elevating unit 147, but is urged vertically upward by an urging means (not shown) when the urging force of the elevation urging mechanism 40 is not applied. ing. When the holder elevating section 147 comes into contact with the lowered elevation urging mechanism 40 and is urged downward, the holder elevating section 147 guides the component holder 145 downward in the vertical direction. When the elevation urging mechanism 40 rises, the holder raising/lowering part 147 guides the component holder 145 to rise by means of an urging means (for example, a spring) incorporated therein.

The component holder positioning mechanism 180 includes a component holder positioning engaging portion 182 that can move up and down in the vertical direction (the Z direction in the drawing), an engaging portion elevating mechanism 181 that raises and lowers the component holder positioning engaging portion 182, It has an engaging portion planar movement mechanism 184 for minutely moving the component holder positioning engaging portion 182 in the XY plane direction.

The engaging portion planar movement mechanism 184 can move in the horizontal direction (X direction and/or Y direction) with respect to the turret table 12 which cannot move in the vertical direction. For example, the engaging portion planar movement mechanism 184 includes a slide component 222 (for example, a rollable ball-shaped member) provided on the surface (upper surface) of the turret table 12, and a slide component 222 on the turret table 12 via the slide component 222. It is composed of a planar moving body 183 or the like that is arranged and horizontally movable with respect to the turret table 12 .

The engaging portion elevating mechanism 181 is mounted on the planar moving body 183 so as to be freely movable in the vertical direction. In a state where the engaging portion elevating mechanism 181 is not urged by an external force, it is urged vertically upward by an urging means (not shown). The holder elevating section 147 is mounted movably in the vertical direction with respect to the engaging section elevating mechanism 181 . In a state where no external force is applied to the holder elevating section 147, it is urged upward in the vertical direction by an urging means (not shown). The upward biasing force in the engaging portion elevating mechanism 181 is smaller than the upward biasing force in the retainer elevating portion 147 . Therefore, when the holder elevating unit 147 is urged downward by the elevating urging mechanism 40, first, the engaging portion elevating mechanism 181 is preferentially lowered and stopped at the bottom dead center, and then the stopped engaging portion The holder elevating unit 147 is independently lowered with respect to the elevating mechanism 181 .

As a result, the component holder 145 can move up and down independently of the component holder positioning engaging portion.

As shown in FIG. 3A, the mounting plate 50 and the support base 119 of the heat transfer member 130 have upper surfaces thereof which do not overlap with the mounting plate 50 (regions exposed from the mounting plate 50), More specifically, one or more component holder positioning holes 104 are arranged in the vicinity of the entering/exiting region 57 . In this example, the component holder positioning hole 104 corresponds to the mounting portion 100 of the entrance/exit area 57 and is provided on the outer periphery of the mounting portion 100 .

As already described, the parts are transported between the processing apparatuses 70 by repeatedly holding and releasing the parts by the part holding mechanism 45 . In this case, especially when the parts are small, high positioning accuracy is required when holding or releasing the parts. High positioning accuracy is also required when packaging components. In this embodiment, the component holder positioning mechanism 180 can perform highly accurate positioning using the positioning means when holding/releasing the component.

Specifically, prior to holding or releasing the component by the component holder 145 , the component holder positioning engaging portion 182 is lowered to engage with the component holder positioning hole 104 .

At this time, at least one of the component holder positioning engaging portion 182 and the component holder positioning hole 104 has a tapered shape (specifically, a conical shape). In this embodiment, the component holder positioning engaging portion 182 is a conical protrusion, and the component holder positioning hole 104 is a circular hole with a smaller diameter than the maximum outer diameter of the conical protrusion. As a result, when the two are engaged, the component holder positioning engaging portion 182 becomes coaxial with the component holder positioning hole 104 as a reference, and is centered (position-adjusted) autonomously. Due to this centering effect, the engaging portion planar movement mechanism 184 moves in the horizontal direction (the X direction and the Y direction in the drawing), and is positioned with high accuracy in the horizontal direction with the component holder positioning hole 104 as a reference. After that, with the engagement portion planar movement mechanism 184 as a reference, the holder elevating portion 147 lowers the component holder 145 to approach the mounting portion 100 . By doing so, highly accurate positioning of the component holder 145 with respect to the placement section 100 is realized in holding or releasing the component.

Although the case where the position is mechanically adjusted by engaging the component holder positioning engaging portion 182 and the component holder positioning hole 104 is illustrated here, the present invention is not limited to this. For example, the component holder positioning mechanism 180 may control the horizontal position of the component holder 145 using imaging means, a sensor, or the like (not shown).

In addition, the elevation urging mechanism 40 is configured so that the position of the engaging portion of the elevation urging mechanism 40 and the pushing amount can be appropriately changed according to the purpose and role, such as when the thickness of the component is changed. ing.

<Overall operation>
The overall operation of the turret-type rotary transfer device 10 will be described with reference to FIG. In FIG. 6, the turret-type rotary transfer device 10 includes, for example, 12 component holding mechanisms 45 (45A to 45L). Further, in order to describe the overall operation here, the imaging device 70Sa, the attitude adjustment device 70Sb, and the processing devices 70A to 70G may be collectively referred to as the processing device 70. FIG.

For example, in FIG. 6A, the first elevation biasing mechanism 40A is fixed above the first processing area 52A, the second elevation biasing device 40B is fixed above the second processing area 52B, and the third elevation biasing mechanism 40B is fixed above the second processing area 52B. The device 40C is fixed on the third processing area 52C, the fourth lift biasing device 40D is fixed on the fourth processing region 52D, the fifth lifting biasing device 40E is fixed on the fifth processing region 52E, and the The sixth lifting biasing device 40F is fixed on the sixth processing area 52F, the seventh lifting biasing device 40G is fixed on the seventh processing region 52G, and the eighth lifting biasing device 40H is fixed on the component carry-out region 53. , the ninth elevation urging device 40I is fixed on the preparation area 51P, the tenth elevation urging device 40J is fixed on the parts supply area 51, and the eleventh elevation urging device 40K is fixed on the first pretreatment area 52Sa, the 12 lift urging device 40L is fixed on the second pretreatment area 52Sb.

FIG. 6(A) shows a state in which the turret-type rotary transfer device 10 is temporarily stopped, the first component holding mechanism 45A is stopped above the first processing area 52A, and the second component holding mechanism 45B is in the second position. The third component holding mechanism 45C is stopped on the third processing region 52C, the fourth component holding mechanism 45D is stopped on the fourth processing region 52D, and the fifth component holding mechanism 45E is stopped on the fourth processing region 52D. The sixth component holding mechanism 45F is stopped on the sixth processing region 52F, the seventh component holding mechanism 45G is stopped on the seventh processing region 52G, and the eighth component holding mechanism 45H is stopped on the seventh processing region 52G. The ninth component holding mechanism 45I is stopped on the preparation region 51P, the tenth component holding mechanism 45J is stopped on the component supply region 51, and the eleventh component holding mechanism 45K is stopped on the first front side. It stops on the processing area 52Sa, and the twelfth component holding mechanism 45L stops on the second preprocessing area 52Sb.

In this state, the elevation urging mechanisms 40A to 40L operate to urge the component holding mechanism 45, thereby moving the component up and down while simultaneously performing various operations according to the purpose.

In the state of FIG. 6(A), when the operation (processing) in each region is completed, the turret-type rotary transfer device 10 rotates, for example, 30 degrees counterclockwise to transfer the component, as shown in FIG. 6(B). stop in the state This rotation angle matches the circumferential phase difference (30 degrees) of the arrangement angles of the component holding mechanisms 45A to 45L.

As a result, the first component holding mechanism 45A is stopped on the second processing region 52B, the second component holding mechanism 45B is stopped on the third processing region 52C, and the third component holding mechanism 45C is stopped on the fourth processing region 52D. , the fourth component holding mechanism 45D is stopped on the fifth processing area 52E, the fifth component holding mechanism 45E is stopped on the sixth processing area 52F, and the sixth component holding mechanism 45F is stopped on the seventh processing area 52G. The seventh component holding mechanism 45G is stopped above the component delivery area 53, the eighth component holding mechanism 45H is stopped above the preparation area 51P, and the ninth component holding mechanism 45I is stopped above the component supply area 51. , the tenth component holding mechanism 45J is stopped on the first preprocessing area 52Sa, the eleventh component holding mechanism 45K is stopped on the second preprocessing area 52Sb, and the twelfth component holding mechanism 45L is stopped on the first processing area 52A. will be stopped.

Similarly, in each of these areas, the elevation urging mechanisms 40A to 40I are operated to move the parts up and down while simultaneously executing various operations according to the purpose.

In the state shown in FIG. 6(B), when the operation (processing) in each area is completed, the turret-type rotary transfer device 10 further rotates 30 degrees counterclockwise to transfer the component, as shown in FIG. 6(C). stop in the state

By repeating the operations of FIGS. 6A to 6C, the parts are sequentially supplied from the component supply area 51, and all the parts are moved through the respective processing areas 52 in order to be processed as desired. After being processed, the parts are unloaded from the component unloading area 53 .

Next, referring to FIG. 7, the component collecting operation and the component releasing operation by the component holding mechanism 45 will be described. The figure shows the first mounting plate 50A to the third mounting plate 50C, the components 172A to 172C and 173A to 173C arranged thereon, and the third mounting plate 50A to the third mounting plate 50C in the first processing region 52A to the third processing region 52C, respectively. FIG. 10 is a side view showing an outline of one-part holder 145A to third-part holder 145C;

In the figure, hatched parts 172A to 172C are parts to be moved (conveyed) (for example, already measured), and white parts 173A to 173C (for example, measurement has been completed). ) is a component that is not to be moved (conveyed), and a component 171 is a component that is newly placed on the illustrated mounting plate 50 . Further, during the period shown in the figure, the rotation of the first mounting plate 50A to the third mounting plate 50C is stopped for loading and unloading of components.

FIG. 7A shows a state in which the first component holder 145A of the first component holding mechanism 45A is in contact with a component 172A to be conveyed in the loading/unloading area 57 on the first mounting plate 50A, and a second component holding mechanism 45A. A state in which the second component holder 145B of the mechanism 45B is in contact with the transport target component 172B in the entry/exit area 57 on the second mounting plate 50B, and a state in which the third component holder 145C of the third component holding mechanism 45C It shows a state in which the loading/unloading area 57 on the third mounting plate 50C is in contact with the component 172C to be transported. These are done at the same timing.

After that, as shown in FIG. 4B, when the first component holder 145A lifts up while sucking and holding the component 172A, the mounting portion 100A becomes a void in the entrance/exit area 57 of the first mounting plate 50A.

When the second component holder 145B rises by sucking and holding the component 172B in synchronism with the operation of the first component holder 145A, the mounting portion 100B becomes a void in the entry/exit area 57 of the second mounting plate 50B. When the third component holder 145C sucks and holds the component 172C and rises in synchronism with the operation of the first component holder 145A, the mounting portion 100C becomes a void in the entrance/exit area 57 of the third mounting plate 50C.

FIG. 1C shows a state in which the turret-type rotary transfer device 10 is rotated (for example, rotated by 30 degrees). The twelfth component holding mechanism 45L moves onto the first mounting plate 50A. In this case, the twelfth component holder 145L sucks and holds a new component 171 from the component supply area 51 (see FIG. 6) and moves to the loading/unloading area 57 of the first mounting plate 50A. The mounting portion 100A of the first mounting plate 50A is empty because the component 172A is taken out in advance.

The first component holding mechanism 45A moves onto the second mounting plate 50B. In this case, the first component holder 145A sucks and holds the component 172A and moves to the loading/unloading area 57 of the second mounting plate 50B. The mounting portion 100B of the second mounting plate 50B is empty because the component 172B has been taken out in advance.

The second component holder 145B, which sucks and holds the component 172B, moves to the entry/exit area 57 of the third mounting plate 50C. The mounting portion 100C of the third mounting plate 50C is empty because the component 172C is taken out in advance.

After that, as shown in FIG. (D), each component holding mechanism 45 releases the component to the mounting section 100 which is a hole. Specifically, the twelfth component holder 145L of the twelfth component holding mechanism 45L releases the new component 171 onto the placement section 100A in the entry/exit area 57 on the first placement plate 50A, and the first component holding mechanism 45A The first component holder 145A of the second component holding mechanism 45B releases the component 172A to the placement section 100B in the loading/unloading area 57 on the second placement plate 50B, and the second component holder 145B of the second component holding mechanism 45B moves to the third placement. The component 172B is released onto the mounting portion 100C at the entry/exit area 57 on the mounting plate 50C.

When sucking and holding (recovering) the component 172 (172A, 172B, etc.), the lower end of the component holder 145 and the component 172 are brought into close contact with each other. On the other hand, when releasing the component 172 (172A, 172B, etc.), it is important not to generate static electricity between the lower end of the component holder 145 and the component 172, and the component 172 is placed by the lower end of the component holder 145. Not pressing against the portion 100 is effective in suppressing static electricity.

In other words, by controlling the downward stroke of the elevation urging mechanism 40, the lower end of the component holder 145 is adjusted when the component on the mounting section 100 is sucked (recovered) and when the component is released onto the mounting section 100. The bottom dead center position of the part (holding end) is controlled to be different.

After FIG. 7D, the first mounting plate 50A, the second mounting plate 50B, and the third mounting plate 50C start (restart) rotating. As the first mounting plate 50A rotates, the temperature of the new component 171 accommodated in the mounting portion 100A of the first mounting plate 50A reaches the set temperature (for example, 25° C.) of the first mounting plate 50A. controlled.

Similarly, as the second mounting plate 50B rotates, the temperature of the components 172A accommodated in the mounting portion 100B of the second mounting plate 50B changes to the set temperature of the second mounting plate 50B (eg, 40° C.). controlled by

Similarly, as the third mounting plate 50C rotates, the component 172B accommodated in the mounting portion 100C of the third mounting plate 50C changes its temperature from the set temperature of the third mounting plate 50C (for example, 65° C.). controlled by

In this manner, the component holding mechanism 45 of the present embodiment releases the component onto the mounting plate 50 and recovers the component from the mounting plate 50 substantially at the same time. Although not particularly shown, in the state of FIG. 7(D), when the first mounting plate 50A, the second mounting plate 50B, and the third mounting plate 50C are rotated by a predetermined angle, the measurement (processing) is completed. The finished parts, the twelfth part holder 145L, the first part holder 145A, and the second part holder 145B are positioned directly below the second part holder 145B. Repeated.

In the conventional parts conveying and processing apparatus, the parts being conveyed are temporarily stopped by the turret-type rotating conveying apparatus, and each part is directly processed (predetermined action) while maintaining its posture. Therefore, the transfer speed of the turret-type rotary transfer device 10 is limited by the processing speed of each processing area (the speed of the predetermined action). On the other hand, according to the component conveying and processing apparatus 1, the processing device 70 further independently transfers the component received from the component holding mechanism 45 of the turret rotary conveying device 10, and performs a predetermined action (measurement of output characteristics). I do. As a result, the processing time in the processing device 70 and the transfer speed of the turret rotary transfer device 10 can be set independently. Specifically, when evaluating the temperature characteristics of a component placed on the placement unit 100, it takes time for the component to stabilize at a predetermined temperature due to the heat capacity of the component. By securing a sufficient moving path to the measurement area (action part) 54, the temperature of each part can be stabilized in a sufficient time. In spite of this, the reduction in the transport speed of the entire parts transport processing apparatus 1 can be avoided. Furthermore, in the conventional component transport processing apparatus, the transport carrier that transports the components is moved between a plurality of temperature adjustment areas, so the overall heat capacity is large, and it takes time to stabilize the temperature. However, in this embodiment, the component is directly mounted on the mounting plate 50 which is temperature-controlled to the target temperature in advance, so that the target temperature is reached in a short time (short path). For example, in the case of small parts with a volume of 8 cm ³ or less, especially in the case of small parts of 1 cm ³ or less, small parts of 27 mm ³ or less, and even ultra-small parts of 4 mm ^{3 or} less, the conventional transfer carrier type has a temperature arrival time of is required for 40 to 60 seconds, in this embodiment, the part reaches the target temperature in 5 seconds or less (for example, about 2 to 5 seconds).

Furthermore, according to the component transport processing apparatus 1, the temperature of the component reaches and stabilizes at a predetermined temperature while the component moves from the entry/exit area 57 to the measurement area (action section) 54 in the processing apparatus 70. allows characterization of the part at , resulting in accurate temperature characterization of the part. In addition, in this embodiment, since a transport carrier for transporting components is not used, loss and error in heat transfer between the mounting plate 50 and the components are small. As a result, the error in the stabilization temperature of the component can be reduced, increasing the reliability of the measurement. In the case of the conventional parts conveying and processing apparatus, the conveying carrier moves while sliding on the temperature control plate, so heat transfer loss occurs between the two, and heat transfer trouble occurs due to wear and dust. As a result, the reliability of the temperature of the components on the transport carrier tends to decrease.

<Master part>
With reference to FIG. 8, the measurement of components in the component transport processing apparatus 1 of this embodiment will be further described. 8 is a plan view of the mounting plate 50. FIG.

As already described, when evaluating the temperature characteristics of a component processed in the processing apparatus 70, the heat (heat/cold) of the heat transfer member 130 set at a predetermined temperature is transferred through the mounting plate 50. are transmitted to the components placed on the placement section 100 (1001 to 1032). As a result, the component is controlled (heated and cooled) to the predetermined temperature while the mounting plate 50 is rotating. In the present embodiment, any mounting plate 50 (regardless of the set temperature) is configured to be stabilized around the set temperature between the entry/exit area 57 and the measurement area 54 (mounting temperature). The size of the plate 50, rotation speed (moving time), etc. are controlled).

However, the entire temperature of the mounting plate 50 itself is not uniform due to factors such as thickness. Also, the thermal contact between the mounting plate 50 and the heat transfer member 130 is not always completely uniform. Furthermore, the temperature of the entire heat transfer member 130 itself, which is a Peltier element, is not uniform.

Therefore, even if the temperature control device 137 (see FIG. 4) is used to control the component to a predetermined temperature, the temperatures actually obtained among the plurality of mounting portions 100 on the mounting plate 50 vary from one another. For example, in the first mounting section 1001, the seventh mounting section 1007, and the sixteenth mounting section 1016 shown in FIG. When the placement section moves to the measurement area 54, it is not always the case that all the placement sections are exactly at 80°C.

On the other hand, it is not necessary to strictly measure the output characteristics of a component at 80°C. It is only necessary to grasp the output characteristics at the value. In other words, if the actual temperature of a part and the actual output of the part can be measured accurately at the same time, it is possible to inspect the correlation (temperature characteristics) between the "temperature (comparison information)" and "output" of the part. Become. Here, "temperature" is exemplified as comparison information, but the present invention is not limited to this, and information linked to various external environments such as humidity, illuminance, pressure, sound volume, etc. can be selected as comparison information.

Therefore, in the present embodiment, a reference component (hereinafter referred to as a “master component 250”) for performing processing in the processing device 70 in real time is arranged on a part of the plurality of placement sections 100 .

The master component 250 uses its own electrical output to measure comparison information (for example, “temperature information”) necessary for measurement of the component 170 to be measured that is housed in the mounting section 100 adjacent thereto. From the probe 110 , it becomes the member that provides the measuring device 105 . For example, the master component 250 is a component of the same type as the component 170 to be mounted, and the temperature dependence characteristics of its output (correlation information between output and comparison information) are inspected in advance with high accuracy, and the correlation information is grasped. It is preferable to use a part that is finished. By using this master component 250, the measurement device 105 can inversely calculate the temperature information (comparison information) from the output value using the grasped correlation information. Specifically, for example, when the measuring device 105 measures the resistance value and frequency of the component 170 using its electrical output, the measuring device 105 uses the master component 250 to measure the resistance value and frequency. Measure. The measuring device 105 uses the resistance value and frequency of the master component 250 and the correlation information to inversely calculate the actual temperature. Based on this actual temperature, the actual temperature of the adjacent component 170 to be actually measured is predicted with high accuracy. In this case, the master part 250 is, for example, a part of the same type (a part having the same configuration) as the part 170 to be actually measured, and particularly preferably a part produced in the same lot.

On the other hand, the output mode of the master component 250 may differ from the output mode of the component 170 to be actually measured. Since the measurement device 105 of the processing device 70 holds the arrangement information of the master component 250 on the mounting plate 50 in advance, the measurement probe 110 uses the dedicated output of the master component 250 to measure the component 170. contrast information can be obtained. For example, when the comparison information is "temperature information", it is preferable that the master component 250 be a dedicated component for temperature measurement that can output its own actual temperature as digital information from a terminal. By reading the output information of this master component 250 with the measuring device 105 via the measuring probe 110, the temperature information (comparison information) of the master component 250 can be obtained, and the actual temperature of the component 170 can be estimated from this temperature information. becomes. For example, when the comparison information is temperature information, a thermistor element or the like can be used.

Here, the case where both the master component 250 and the component 170 to be measured are measured by the measurement probe 110 is exemplified. and part 170 measurement can be made independent.

The master component 250 is desirably placed in the vicinity of the actual component 170 to be measured, preferably in a position close to it, more preferably in the placement section 100 adjacent to the placement section 100 in which the component 170 to be measured is accommodated. As a result, the comparison information (for example, temperature information) obtained from the master component 250 can be used as the comparison information (actual temperature) of the actual component 170 as it is. In other words, each master part 250 has a presumed corresponding area 250A, and the actual part 170 to which the comparison information of this master part 250 is applied is arranged in this presumed corresponding area 250A. The estimated corresponding areas 250A are arranged in the mounting plate 50 at regular intervals in the circumferential direction.

FIG. 4A shows the case where one placement section 100 is opened and the master component 250 is placed. As a result, since the master part 250 and the actual part 170 to which the comparison information is applied are always adjacent to each other, the prediction accuracy of the comparison information is high. In other words, the estimation corresponding area 250A on which the master component 250 is placed has a structure in which one component 170 to be actually measured is arranged so as to be adjacent to this master component 250 in the circumferential direction.

In this case, for example, the temperature of the master component 250 is measured when the twenty-ninth receiver 1029 is positioned in the measurement region 54, and the temperature of the measurement target is measured when the next thirtieth receiver 1030 is positioned in the measurement region . The output characteristics of component 170 are measured. Then, by referring to the comparison information (temperature information) obtained from the previous master component 250, the actual temperature of this component 170 is estimated, and the temperature output characteristic is acquired. At this time, by increasing the number of measurement probes 110, it is also preferable to simultaneously measure the output of adjacent master component 250 and actual component 170 in inference corresponding area 250A. By doing so, it is possible to avoid lowering the processing capacity.

In addition, FIG. 2B shows a case where the master component 250 is arranged with three placement sections 100 opened. Here, one placement section adjacent to the upstream side of the master component 250 and two placement sections connected to the downstream side are included in the estimation corresponding area 250A.

In this case, for example, the output of the component 170 is measured when the second receiver 1002 is positioned in the measurement region 54, and then the temperature of the master component 250 is measured when the third receiver 1003 is positioned in the measurement region 54. is measured, and the output of the component 170 is measured when each of the subsequent fourth and fifth receivers 1004 and 1005 is positioned in the measurement region 54 . Then, temperature information (comparison information) calculated inversely from the master component 250 is assumed to be the actual temperatures of these three components 170 to be actually measured, and the temperature output characteristics are calculated.

Note that the master component 250 is arranged (carried in and out) on the mounting portion 100 of the mounting plate 50 each time it is processed by the processing device 70 (carried in and out by the component holding mechanism 45), similarly to the component 170 to be actually measured. Alternatively, it is preferable to always place them on the mounting portion 100 of the mounting plate 50 and not to carry them in or out. When the master component 250 is always placed on the mounting section 100, it is also preferable to mechanically fix the master component 250 to the mounting section 250 so as not to carry it out by mistake.

Furthermore, when a plurality of master components 250 are arranged on one mounting plate 50, the master components may be of different types (for the purpose of measuring different characteristics). For example, a resistive element and a thermistor element may be arranged as the master component 250 for one mounting plate 50 .

Incidentally, in order to eliminate measurement errors due to temperature variations in the circumferential direction of the mounting plate 50, a data table or the like may be used. Specifically, for example, for each mounting portion, the relationship (temperature difference ). This data table can be stored in the control device 25 or the like and corrected by calculation.

However, in this case, it is necessary to obtain a data table for each mounting plate 50, and when the mounting plate 50 is replaced, the processing becomes complicated, such as changing the target data table. Furthermore, when the characteristics of the mounting plate 50 (or the heat transfer member 130) change due to secular change, it is necessary to acquire the data table again.

Therefore, according to the present embodiment, by using the placement section 100 near the placement section 100 (for example, the adjacent placement section 100) where the component to be measured is arranged, the master component 250 is used to measure the measurement target. Temperature conditions can be obtained at almost the same location at about the same time as the component 170 . That is, compared with the master component 250 whose temperature is stabilized by being circulated on the mounting plate 50 in advance, the component 170 to be actually measured is moved from the entry/exit area 57 to the measurement area 54 . In view of the fact that the temperature of the master component 250 becomes almost equal to the temperature of the component 250 and is stabilized, the temperature of the master component 250 is measured and estimated as the temperature of the component 170 to be actually measured.

In other words, according to the present embodiment, it is only necessary to place the dedicated part or the master part 250, which is a part of the same type as the part to be actually measured, on the mounting part 100. Therefore, for example, data for temperature correction or temperature prediction can be obtained. Compared to the method of estimating the temperature of the part to be measured by using a table and calculations using it, it has a simple configuration, but acquires the comparison information necessary for processing the part to be measured in real time and with high accuracy. be able to. Specifically, in the measurement of the temperature dependent characteristics of the output, the temperature of the part to be measured can be predicted in real time with high accuracy.

Although FIG. 8 illustrates the case where the master component 250 and the component 170 to be actually measured are arranged in the circumferential direction in the estimation corresponding area 250A, the present invention is not limited to this. 2, two rows (an inner row and an outer row) of the mounting portions 100 are prepared in the circumferential direction, and the master components 250 are arranged in one row (here, the outer row) and the other row (here, the inner row). column) may be arranged with the parts 170 to be measured. In other words, in each estimated corresponding area 250A, the master component 250 and the component 170 to be actually measured can be adjacent to each other in the radial direction. In this case, it is preferable not to carry in/out the master component 250 . Master component 250 can also be fixed to mounting plate 50 .

Further, in the present embodiment, the output measurement is performed in the single measurement area 54 after the component to be actually measured reaches the target temperature, but the present invention is not limited to this. For example, as shown in FIG. 9B, a plurality of measurement regions 54A, 54B, and 54C are provided in the circumferential direction in the range after reaching the target temperature, and simultaneous timing can also be used to measure output for different purposes. This is effective when the component 170 has many measurement items. When there are many measurement items, if a plurality of items are to be measured in a single measurement area 54, the measurement time will be long and the processing capacity will be reduced. It is also possible to independently arrange the measurement units 95 described in FIG. On the other hand, a single measuring unit 95 is arranged across a plurality of measurement areas 54A, 54B, 54C, and measurement probes corresponding to each measurement area 54A, 54B, 54C are vertically moved by a common lifting mechanism. It is also preferable to let

Furthermore, it is also possible to perform measurements for the same purpose (same items) in each of the measurement areas 54A, 54B, and 54C. In other words, as shown in a measurement area 54X where these are integrated, if a plurality of components 170 arranged in the circumferential direction are simultaneously measured for the same purpose, the throughput can be greatly improved. Here, the case where three components 170 are collectively measured in the measurement area 54X is exemplified.

<Temperature Slope Inspection>
10A and 10B are diagrams showing an example of another embodiment of the present invention, in which FIG. 10A is a top view of one mounting plate 50, and FIG. 10 is a graph illustrating an example of results;

In the above-described embodiments, an example in which one measuring unit 95 is provided in one processing apparatus 70 (mounting plate 50) has been described. A plurality of measurement units 95 (measurement areas 54 ) capable of measuring the output characteristics of each component may be provided at positions corresponding to the placement unit 100 .

Specifically, as shown in FIG. 1A, for example, a first measuring section 95A, a second measuring section 95B, a third measuring section 95C, and a fourth measuring section 95D are arranged on one mounting plate 50. Deploy. The configuration of each of the measurement units 95A to 95D is the same as that of the measurement unit 95 described above, and the configuration other than this is also the same as that of the above embodiment. The setting temperature of the mounting plate 50 is, for example, 80° C., and the component 170 is positioned between the entry/exit area 57 and the measurement area (fourth measurement area (position of the fourth measurement unit 95D)) located at a position of 180 degrees. It shall be stable at 80°C.

Then, while a certain component 170 placed on the mounting section 100 in the loading/unloading area 57 is moved on the mounting plate 50 by the component holding mechanism 45, the same component 170 is measured by the first measuring section 95A and the second measuring section 95A. The output characteristics are measured by the section 95B, the third measurement section 95C and the fourth measurement section 95D.

After the component 170 is placed on the placement section 100 of the loading/unloading area 57, its temperature gradually rises as it moves in the circumferential direction, and in this example reaches the fourth measuring section 95D as in the above embodiment. The set temperature (e.g. 80°C) has been sufficiently reached before.

That is, for example, the first measuring section 95A is arranged at a predetermined position in the course of the movement of the component 170, for example, at the timing t1 at which the temperature of the component 170 is expected to reach 25°C, and at the timing t2 at which the temperature of the component 170 is expected to reach 50°C. , the third measuring unit 95C is placed at timing t3 when the temperature is expected to reach 65.degree. C., and the fourth measuring unit 95D is placed at timing t4 when the temperature stabilizes at 80.degree. As a result, in the temperature slope shown in FIG. 10(B), it is possible to measure outputs at four types of elapsed times t1, t2, t3, and t4 after placing the component 170 on the mounting plate 50. FIG. The temperature characteristics of this component 170 can be calculated from the correlation between the actual temperatures at these four locations and the output.

Note that since the first to third measuring units 95A to 95C measure the output of the component whose temperature is rising, the temperature at the time of measurement tends to vary. Therefore, as described in FIG. 8A and the like, the master component 250 is arranged adjacently, and the actual temperature (comparative information) of the component 170 to be measured in the first to fourth measuring units 95A to 95D is measured. , the temperature of the adjacent master component 250 is preferably estimated in real time. For example, as shown by the dashed line in FIG. 10B, even if the temperature rise curve of the component 170 changes due to the outside air temperature or the like, by arranging the master component 250, the first measuring unit 95A can be kept at 18° C. Output characteristics, output characteristics at 28° C. for the second measurement unit 95B, output characteristics for 53° C. for the third measurement unit 95C, and output characteristics for 80° C. for the fourth measurement unit 95D are obtained. That is, by estimating the temperature of the component 170 whose temperature is rising by the master component 250, the temperature characteristics of this component 170 can be calculated regardless of the external environment.

In the case of a configuration in which one measurement unit 95 is provided in one processing area 52 as shown in FIG. must be moved. The data of the four points are integrated to obtain the data of the temperature dependent characteristics of the output. On the other hand, according to the configuration shown in FIG. 10, although it is necessary to secure an arrangement area for a plurality of measuring units 95, the output inspection of a plurality of temperatures is completed in one processing area 52, and if these are integrated, the output can be increased. Data on temperature-dependent characteristics can be obtained, so processing can be speeded up in some cases. Another advantage is that the output characteristics (temperature slope characteristics) of the component 170 can be inspected while the temperature is rising or falling.

In this case, since the first measuring section 95A to the fourth measuring section 95D can simultaneously measure the components, the temperature slope inspection can be continuously performed on the plurality of components 170. FIG.

<Cover member of processing equipment>
11A and 11B are diagrams showing an example of another embodiment of the present invention. FIG. 11A is a side view of one processing apparatus 70, and FIG. 11B is a top view of the processing apparatus 70. FIG. 1(C) is a partially enlarged cross-sectional view of FIG. 1(A).

As shown in FIGS. 1A and 1B, the component conveying and processing apparatus 1 may include a cover member 500 that integrally covers one or a plurality of processing apparatuses 70. FIG. The cover member 500 is made of, for example, a transparent resin material, and integrally covers the temperature stabilizing device 125 and the measurement unit 95, including the measurement unit support base 99, in one processing area 52. However, the component holding mechanism 45 does not rotate. It is a substantially L-shaped box when viewed from the side so as not to interfere with movement. That is, the cover member 500 has a lower region 500B that mainly covers the temperature stabilizing device 125 and the lower side of the measuring section 95 (measuring section support table 99), and an upper region 500A that mainly covers the upper side of the measuring section 95. 500B has a larger size (volume) than the upper region 500A. A desired gas is injected into the cover member 500 from a gas injection part (not shown). Types of gas include dry gas (e.g. dry air or nitrogen) to prevent condensation, inert gas (e.g. nitrogen gas, argon gas, etc.) to suppress unnecessary reactions, and static gas to prevent dust from entering. Clean air with anti-electricity measures, temperature-controlled gas for high precision temperature control, etc. are injected. Further, the upper region 500A can be opened upward with respect to the lower region 500B by the hinge structure 501, as indicated by the dotted line. When the upper region 500A is opened, the measuring section 95 (particularly, the probe positioning mechanism 200 and the measuring probe 110) is exposed, so maintenance of the measuring section 95 can be facilitated.

When measuring components, it is necessary to prevent condensation, minimize contact with contaminants such as dust and dirt in the atmosphere, and avoid the effects of temperature (changes) in the surrounding environment. . For this reason, in order to prevent the component, the mounting plate 50 and the measuring section 95 (particularly the measuring probe 110, etc.) from being exposed to the surrounding environment, the entire processing apparatus 70, which is one or a plurality of processing units, is covered with a cover member 500. , and fills the inside of the cover member 500 with a gas according to the purpose. In particular, in the case of low-temperature measurement, it is preferable to inject dry gas because it is important to prevent dew condensation.

On the other hand, the main parts of the measurement unit 95, specifically the probe positioning mechanism 200 and the measurement probe 110 (parts other than the temperature stabilization device 125 and the measurement unit support base 99) are (compared to the temperature stabilization device 125 t) The drive mechanism is delicate and complicated, and it is a part that requires frequent maintenance such as replacement and cleaning. Therefore, in this embodiment, the upper region 500A is made openable. As a result, manual adjustment and maintenance of the major portions of the measuring section 95 can be easily performed as appropriate.

In FIG. 4A, as an example, the entire upper region 500A is moved in the back side direction (in the direction of the arrow in the figure) centering on the hinge mechanism 501 provided on the back side of the cover member 500 (on the outer peripheral side of the parts conveying and processing apparatus 1). The configuration is shown to be opened by pivoting. However, the present invention is not limited to this, and various opening mechanisms can be employed such as opening the upper surface portion of the upper region 500A by sliding. In addition, the configuration is not limited to this example, and the lower region 500B may also be configured to be openable.

Further, the upper surface 500U of the lower region 500B extends horizontally so as to vertically separate the component holding mechanism 45 and the moving mechanism (the temperature stabilizing device 125). A first opening 503 and a second opening 504 are provided in a part of the upper surface 500U. The first opening 503 is configured to allow passage (insertion) of the component holder positioning engaging portion 182 directly below. Further, the second opening 504 is configured so that the component holder 145 can pass through (insert through) directly under the component holder 145 .

With such a configuration, while maintaining the state in which the processing apparatus 70 is integrally covered with the cover member 500, in the loading/unloading area 57, parts are supplied to the mounting section 100 of the mounting plate 50, and the mounting section 100 is moved. Parts can be removed from the

FIG. 4C is an enlarged cross-sectional view of the upper surface 500U. It is desirable that the processing apparatus 70 has minimal contact with the surrounding environment (outside air) during the operation of the component conveying and processing apparatus 1, for example, in order to prevent dew condensation. is preferably closed. Therefore, it is preferable to provide the first opening 503 and the second opening 504 with shielding means 507 from the outside air. The blocking means 507 is, for example, an air curtain flowing horizontally. In this case, as shown in FIG. 4C, an air (gas) flow path 508 is formed at least inside the upper surface 500U, and air (preferably dry gas for preventing condensation) passes through this flow path 508. Let As a result, the component holder positioning engaging portion 182 is always opened in the first opening portion 503 and the component holder 145 is opened in the second opening portion 504 so as to be able to be inserted. Entry into 500 can be blocked.

A physical shutter or the like may be provided as the blocking means 507 so as to be opened only when the component holder positioning engaging portion 182 or the component holder 145 is inserted. However, in this case, the configuration and drive mechanism are complicated. Air curtains, on the other hand, do not require physical opening and closing operations and configurations.

In this example, one processing apparatus 70 is integrally covered with the cover member 500 , but a plurality of processing apparatuses 70 may be integrally covered with the cover member 500 , for example.

Furthermore, in order to increase the accuracy of the stabilization temperature of the component, it is preferable to fill the cover member 500 with a gas whose temperature is positively controlled so as to match the stabilization temperature of the component (temperature-controlled gas).

<Measurement probe calibration device>

FIG. 12 is a top view of a processing device 70 showing an example of another embodiment of the invention. Probe calibration components 260 for configuring the measurement probe 110 are arranged on the mounting plate 50 using a part of the plurality of mounting sections 100 or a dedicated area.

The resistance value of the measurement probe 110 itself or the wiring resistance value to the measurement device 105 may change due to foreign matter adhering to the tip or deterioration over time. Moreover, the measurement probe 110 needs to be replaced periodically, and the resistance value of the measurement probe 110 itself fluctuates due to the replacement work.

Therefore, in this embodiment, a plurality of probe calibration components 260 are arranged on the movement locus of the mounting plate 50, and the measurement probe 110 is brought into contact with the probe calibration components 260 at an arbitrary timing to perform the energization operation. . It should be noted that this probe calibration component 260 is preferably a resistance circuit and has a structure that does not have temperature dependent characteristics as much as possible. Moreover, it is preferable that the plurality of probe calibration components 260 have different resistance values. As a result, by measuring a plurality of resistance values of the probe calibration component 260 using the measurement probe 110, changes in the resistance values of the measurement probe 110 and its internal wiring can be checked with high accuracy. Incidentally, even if the resistance value of the measurement probe 110 fluctuates, the output measurement of the component 170 will not be affected if the data is corrected on the measurement device 105 side. Moreover, when the amount of variation in the resistance value exceeds the allowable range, the processing operation can be stopped and an alarm for maintenance can be generated.

Although the case where the probe components 260 are arranged at four locations in the circumferential direction of the mounting plate 50 is illustrated here, the number is not particularly limited.

Here, as shown in FIG. 13A, there is only one probe positioning engaging portion 210 and one component holder positioning engaging portion 182 (that is, one probe positioning hole 103 and one component holder positioning hole 104). is one), but the centering accuracy can be further improved by using a plurality of them. In particular, it is possible to increase the positioning accuracy of the engaging portion planar movement mechanism 201 and the engaging portion planar movement mechanism 184 in the θ direction (rotational direction on the XY plane shown in the figure). For example, as shown in FIG. 13B, when the probe positioning engaging portions 210 are provided at two locations, the two probe positioning holes 103A, 103A are used to center one placing portion 100. You can do it. In this case, for example, the probe positioning engaging portion 210 is centered on the mounting portion 100 in which the part 172 to be measured is accommodated, and is (substantially) equidistant from and closest to the two probe positioning holes. 103A, 103A are used. As a result, the positioning accuracy can be further improved as compared with the case where there is only one probe positioning engaging portion 210 . Also, like the probe positioning holes 103B, 103B, if two rows are provided in the circumferential direction, a pair of dedicated probe positioning holes 103B, 103B can be provided for each mounting portion 100. FIG. The same applies to the plurality of component holder positioning holes 104A, 104A. Moreover, in the present embodiment, the case where the component holder positioning holes 104 are fixed and arranged independently of the mounting plate 50 or the mounting section 100 has been exemplified, but the present invention is not limited to this. As shown in FIG. 13B, like the probe positioning holes 103, component holder positioning holes 104B and 104B are provided corresponding to the mounting sections 100, and are rotated together with the mounting sections 100. can also Of course, the probe positioning hole 103 and the component holder positioning hole 104 may also be used.

The parts conveying and processing apparatus 1 of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

Reference Signs List 1 component transport processing device 10 turret-type rotary transport device 12 turret table 15 turret table rotating shaft 20 turret table driving device 25 control device 35 base 40 elevation biasing mechanism 45 component holding mechanism 50 mounting plate 51 component supply area 52 processing area 53 Component unloading area 54 Measuring area 55 Mounting plate rotating shaft 57 Inlet/out area 60 Mounting plate driving device 65 Automatic component supply device 70 Processing device 95 Measuring unit 99 Measuring unit support table 100 Mounting unit 105 Measuring device 110 Measuring probe 111 Probe elevation Part 119 support base 120 electrode 125 moving mechanism (temperature stabilizing device)
130 heat transfer member 135 heat exchange section 137 temperature control device 145 component holders 170, 172, 172A-172C, 173, 173A-173C, 171 component 180 component holder positioning mechanism 182 component holder positioning engaging portion 184 engagement Part plane moving mechanism 188 Recess 189 Elevating mechanism 200 Probe positioning mechanism 201 Engaging part plane moving mechanism 210 Probe positioning engaging part 211 Engaging part elevating mechanism 226 Pedestal 250 Master part 301 Characteristic inspection device 310 Turret table 312 Turret table rotation axis 315 Component 325 Component supply device 330 Storage box 335 First measurement area 340 First temperature control area 345 Second measurement area 350 Second temperature control area 500 Cover member 501 Rotating shaft 507 Blocking means 508 Channel T Transport path

Claims (14)

a turret-type rotary conveying device that holds a plurality of parts by a plurality of part holding mechanisms and conveys the plurality of parts along a part of an annular conveying path;
a component supply area arranged on the transport path to supply the component to the component holding mechanism;
a processing device disposed in a processing area located downstream of the component supply area in the transport path and performing a predetermined process on the component;
a moving mechanism provided in the processing apparatus for moving the component;
a component carry-out area arranged downstream of the processing area in the transport path for carrying out the component;
The moving mechanism is
a mounting plate having a mounting portion on which the component is mounted;
a heat transfer member that transfers heat to the mounting plate;
a rotation drive unit that rotates the heat transfer member and the mounting plate integrally about a plate rotation axis ;
A plurality of the placement units are provided, and a reference part for the processing is arranged on a part of the placement units,
The processing device includes a measurement unit arranged in a measurement area on a movement path of the part by the movement mechanism and measuring an output having a correlation with the comparison information of the part,
The measurement unit
The comparison information back-calculated from the measured value of the output of the reference part is referred to as the comparison information of the part moved by the moving mechanism while approaching the reference part.
A parts conveying and processing apparatus characterized by: The mounting plate is temperature-controlled by the heat transfer member so that the whole is at a single temperature,
2. The parts conveying and processing apparatus according to claim 1. A plurality of the reference parts are placed at regular intervals in the circumferential direction.
3. The parts conveying and processing apparatus according to claim 1 or 2 , characterized in that: arranging the reference part at a position close to the part to be processed ;
4. The component transfer processing apparatus according to any one of claims 1 to 3, characterized in that: The reference part is a dedicated part,
5. The component transfer processing apparatus according to any one of claims 1 to 4, characterized in that: The reference part is a part of the same type as the part ,
5. The component transfer processing apparatus according to any one of claims 1 to 4 , characterized in that: A calibration-dedicated component for calibrating a measurement probe of the processing device by coming into contact with the measurement probe of the processing device is arranged on the mounting plate.
7. The component transfer processing apparatus according to any one of claims 1 to 6 , characterized in that: The processing apparatus has measuring means capable of measuring the output characteristics of the component at positions corresponding to the plurality of mounting portions on the single mounting plate, respectively.
8. The component transfer processing apparatus according to any one of claims 1 to 7, characterized in that: A plurality of the measuring means are provided for one mounting plate, and simultaneously measure characteristics of a plurality of the components on the plurality of mounting portions.
9. The parts conveying and processing apparatus according to claim 8 , characterized in that: Having a cover member that integrally covers the processing device,
10. The component transfer processing apparatus according to any one of claims 1 to 9, characterized in that: A part of the cover member is provided so as to separate the component holding mechanism and the moving mechanism ,
A part of the component holding mechanism has an opening through which it can pass,
11. The parts conveying and processing apparatus according to claim 10, characterized in that: A portion of the cover member is configured to be openable to expose a portion of the processing device,
12. The component transfer processing apparatus according to claim 10 or 11, characterized in that: a dry gas is injected into the interior of the cover member;
13. The component transfer processing apparatus according to any one of claims 10 to 12, characterized in that: The turret-type rotary transfer device moves the plurality of component holding mechanisms in synchronization with each other,
14. The component transfer processing apparatus according to any one of claims 1 to 13, characterized in that:

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