WO2020203948A1

WO2020203948A1 - Component transport processing device

Info

Publication number: WO2020203948A1
Application number: PCT/JP2020/014464
Authority: WO
Inventors: 今井　▲しょう▼二郎
Original assignee: アキム株式会社
Priority date: 2019-04-04
Filing date: 2020-03-30
Publication date: 2020-10-08
Also published as: CN113677608B; CN113677608A

Abstract

Provided is a component transport processing device which has a high processing capacity per unit time and can improve processing (e.g. measurement) accuracy.　A component transport processing device 1 comprises: a turret rotary transport device 10 that holds a plurality of components with a plurality of component holding mechanisms 45 and transports the plurality of components along a portion of an annular transport path T; a component supply area 51 for supplying the components to the component holding mechanisms 45, the component supply area 51 being disposed on the transport path T; a processing device 70 that is disposed in a processing area 52 located downstream of the component supply area 51 in the transport path T, and performs predetermined processing on the components; a movement mechanism 125 that is disposed on the processing device 70 and moves the components; and a component unloading area 53 for unloading the components, which is disposed downstream of the processing area in the transport path T. The movement mechanism 125 has: a mounting plate 50 that has a plurality of mounting sections 100 on which the components are individually mounted; a heat transfer member 130 that transfers heat to the mounting plate 50; and a rotary drive unit 60 that integrally rotates a heat exchange unit 135 and the mounting plate 50 about a mounting plate rotary shaft 55.

Description

Parts transfer processing equipment

The present invention relates to a parts transfer processing apparatus suitable for a process of processing various parts, for example, an inspection process of inspecting the temperature characteristics of electronic parts.

Since the physical properties of crystal units and thermistor elements change significantly with temperature, it is necessary to evaluate and inspect the temperature characteristics before shipping as parts. Since these parts are used in large quantities and are mounted in an extremely small package, they are inspected by a device called an inspection device that automatically measures and evaluates characteristics.

Conventionally, as an inspection device for evaluating the temperature characteristics of electrical properties, it has been known that parts are transported by a turret type rotary transfer device, and a measuring device is arranged on the path to perform sequential inspection. (See, for example, Patent Document 1).

At this time, the temperature of each electronic component is controlled to a predetermined temperature while the electronic component is rotating by the rotary transfer device on the turret side. For example, FIG. 20 shows a conventional component characteristic inspection device 301. The component 315 is mounted on a component transport carrier (not shown). The turret table 310 on which the carrier is placed is rotationally driven around the turret table rotation shaft 312. The component 315 is supplied to the carrier from the component supply device 325. The temperature of the component 315 stabilizes at a predetermined first temperature while the turret table 310 rotates and the component transport carrier holding the component 315 passes, for example, the first temperature control region 340. Then, the characteristics of the component at the first temperature, for example, the value of the electric resistance are measured by the first measuring device in the first measuring region 335. Further, the temperature of the component 315 stabilizes at a predetermined second temperature while the turret table 310 rotates and the component transport carrier holding the component 315 passes through the second temperature control region 350. Then, the characteristics of the component at the second temperature, for example, the value of the electric resistance are measured by the second measuring device in the second measuring region 345. Finally, the parts 315 are collected in the storage box 330.

Patent No. 3777395

However, in the conventional characteristic inspection device, it is necessary to stabilize the temperature of both the transport carrier and the component while the transport carrier passes through each temperature control region. That is, since not only the heat capacity of the parts but also the heat capacity of the transport carrier is added, there is a problem that it takes time to reach the temperature. Further, especially when the output characteristics are measured at a plurality of measurement points (temperature control regions), that is, at two points, for example, a measurement point of 0 ° C. or lower and a measurement point of 80 ° C., the time required for stabilization to each temperature is different. , The transport speed of the transport device shall be adjusted to the slowest possible one. Therefore, there is a limit to the improvement of processing capacity.

Also, if you try to increase the measurement temperature (measurement point), you need to make the turret table larger, and there is also the problem that the entire device becomes larger.

Further, for example, when evaluating the temperature characteristics of a component processed in the processing apparatus, it is assumed that the component stabilizes at a predetermined temperature set during passage in each temperature control region (for example, first). While passing through the temperature control region 340, the temperature of the component 315 stabilizes at a predetermined first temperature), and the measured electrical resistance value of the component 315 is the resistance value at the set temperature (first temperature). Is getting as.

However, depending on the state of heat exchange between the turret table and the part 315 (part transfer carrier), the temperature of the part 315 may deviate from the predetermined temperature to be stabilized.

In addition, as the miniaturization of parts progresses, the processing (measurement) accuracy may decrease, for example, the parts are more susceptible to the influence of the surrounding environment (for example, the influence of outside air temperature, humidity, dust and dirt) during measurement.

In addition, miniaturization of parts increases the difficulty of positioning the probe when measuring the part and the part holder when holding or releasing the part, which takes time to measure, hold or release, or makes a contact error. There is also a problem that (holding error) occurs.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a parts transfer processing apparatus having a high processing capacity per unit time and capable of improving processing (measurement) accuracy.

The present invention includes a turret type rotary transfer device that holds a plurality of parts by a plurality of component holding mechanisms and conveys the plurality of the parts along a part of an annular transfer path, and is arranged in the transfer path. , A processing device arranged in a component supply area for supplying the component to the component holding mechanism and a processing area located on the downstream side of the component supply area in the transport path, and performing a predetermined process on the component. The moving mechanism includes a moving mechanism provided in the processing apparatus for moving the parts, and a component carrying area arranged on the downstream side of the processing area in the transport path to carry out the parts. A mounting plate having a plurality of mounting portions on which the parts are individually mounted, a heat transfer member that transfers heat to the previously described mounting plate, and the heat transfer member and the previously described mounting plate are integrated into a plate rotation. It is a parts transfer processing apparatus characterized by having a rotation drive unit that rotates around a shaft.

Further, the present invention comprises a turret type rotary transfer device for holding a plurality of parts by component holders of a plurality of component holding mechanisms and transporting the plurality of the components along a part of an annular transfer path. The processing device includes a processing device that is arranged in a processing area in the transport path and performs a predetermined process on the component, and the process device is a mounting unit on which the component transported by the component holder is placed. The part is moved by rotating the mounting plate having the above, the heat transfer member for transferring heat to the previously described mounting plate, and the heat transfer member and the previously described mounting plate about the plate rotation axis. It has a drive unit and a probe that performs the processing on the moving component, and has a relative position between the component holder of the component holding mechanism and the above-mentioned placing portion, and / or the probe of the processing device. It is a component transport processing apparatus characterized by having a positioning means for adjusting the relative position of the above-described mounting portion.

According to the parts transfer processing device of the present invention, it is possible to obtain an excellent effect that it is possible to provide a parts transfer processing device having a high processing capacity per unit time and capable of improving the accuracy of processing (for example, measurement).

It is a top view of the parts transfer processing apparatus which concerns on embodiment of this invention. It is a side view of the parts transfer processing apparatus which concerns on embodiment of this invention. It is a side view of (A) processing apparatus which concerns on embodiment of this invention, (B) schematic diagram of processing apparatus. (A) is a plan view of the temperature stabilizer arranged in the processing region, (B) is a side partial sectional view of the measuring portion of the temperature stabilizer, and (C) is a sectional view of the mounting portion. It is a side view of the turret type rotary conveyor. It is a plane schematic diagram explaining the whole operation of a turret type rotary transfer apparatus. It is a side schematic diagram explaining the transport operation of a part by a turret type rotary transport device. It is a top view of the mounting plate explaining embodiment of this invention. It is a top view of the modification of the mounting plate which explains embodiment of this invention. It is a figure explaining another embodiment of this invention, (A) the plan view of the mounting plate, (B) the graph which shows the temperature change of the moving part. It is a figure explaining another embodiment of this invention, (A) side view of the processing area, (B) plan view of the processing area, (C) a partially enlarged sectional view of FIG. .. It is a plane schematic view of the processing area explaining another embodiment of this invention. (A) to (C) are front schematic views explaining the operation of the probe positioning mechanism of the embodiment of the present invention. (A) to (E) are side schematic views showing the operation of the probe positioning mechanism. (A) to (C) are partially enlarged views showing the centering operation of the probe positioning mechanism. (A) to (C) are front schematic views showing the operation of the component holder positioning mechanism of the embodiment. (A) to (E) are side schematic views showing the operation of the component holder positioning mechanism. (A) and (B) are plan views which show the mounting plate. It is a top view which shows the mounting plate which concerns on other embodiment of this invention. It is a top view of the conventional parts transfer processing apparatus.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

The drawing is an example of the embodiment of the present invention, and the parts with the same reference numerals represent the same objects in the drawings. In each drawing, some configurations will be omitted as appropriate to simplify the drawings. Then, the size, shape, thickness, etc. of the portion are exaggerated as appropriate.

<Overall configuration>
FIG. 1 is a schematic plan view illustrating a component transfer processing device 1 according to an embodiment of the present invention. The component transfer processing device 1 evaluates the characteristics and the like while transporting the components. Specifically, the component transfer processing device 1 is used to evaluate the temperature dependence of the output of an electronic component (for example, a thermistor element). Be done.

The parts transfer processing device 1 of the present embodiment includes a disk-shaped turret type rotary transfer device 10, a parts supply area 51, a processing device 70, a moving mechanism 125, and a parts carry-out area 53.

The turret type rotary transport device 10 holds a plurality of parts by a plurality of component holding mechanisms 45, and transports the plurality of parts along a part of the annular transport path T (indicated by a broken line in the figure).

The component supply area 51 is an area arranged in the transfer path T to supply the component to the component holding mechanism 45, and the processing area 52 is located on the downstream side of the component supply area 51 in the transfer path T with respect to the component. This is an area in which a processing device 70 for performing a predetermined process is arranged, and a component carry-out area 53 is an area arranged on the downstream side of the process area 52 in the transport path T to carry out the parts.

FIG. 2 is a side schematic view of the parts transport processing device 1. The turret type rotary transfer device 10 is rotationally driven by the turret table drive device 20 around the turret table rotary shaft 15. The turret type rotary transfer device 10 has a plurality of component holding mechanisms 45 fixedly arranged at equal intervals on the peripheral edge of its own turret table 12. A plurality of elevating urging mechanisms 40 are provided on the gantry 35 provided independently of the turret type rotary transfer device 10. The component holding mechanism 45 cooperates with the elevating urging mechanism 40 in the component supply area 51, the processing area 52, and the component unloading area 53 (see FIG. 1) to collect (hold) and / or release the parts. Do it.

The processing device 70 performs predetermined processing (for example, measurement of temperature characteristics) on the parts, and has a moving mechanism 125 and a measuring unit 95. The moving mechanism 125 mounts the mounting plate 50 having a plurality of mounting portions 100 on which the parts are individually mounted, the heat transfer member 130 that transfers heat to the mounting plate 50, and the heat transfer member 130. The plate 50 is integrated with a rotation drive unit (mounting plate rotation drive unit) 60 that rotates around a rotation shaft (mounting plate rotation shaft) 55.

The control device 25 is composed of a storage device such as a CPU, RAM, ROM, and a hard disk drive, and is composed of a turret type rotary transfer device 10 for component transfer control, a component holding mechanism 45 for component release / recovery control, and component processing ( Output measurement) Performs various controls such as control. The CPU is a so-called central processing unit, and various programs are executed to realize various functions. The RAM is used as a work area and a storage area of the CPU, and the ROM stores an operating system and a program executed by the CPU.

With reference to FIG. 1 again, the component transfer processing device 1 holds the components by a plurality of (12 pieces as an example) component holding mechanisms 45 arranged in the circumferential direction of the turret type rotary transfer device 10. The turret type rotary transport device 10 moves these component holding mechanisms 45 in the circumferential direction (for example, in the counterclockwise direction in FIG. 1) in synchronization with each other, and simultaneously transports a plurality of components along the annular transport path T. To do.

As a result, on the transport path T, a component supply area 51 for supplying the component to the component holding mechanism 45, a processing area 52 arranged on the downstream side of the component supply area 51 and performing a predetermined process on the component, and A component unloading area 53 for unloading components is configured so as to be arranged further downstream of the processing area 52.

In the parts supply area 51, parts are supplied by an automatic parts supply device 65 (for example, a parts feeder). The turret type rotary transfer device 10 is rotationally driven in the direction of arrow R, and the parts held by the parts holding mechanism 45 in the parts supply area 51 are carried out in the parts carry-out area 53 via the processing area 52 counterclockwise. .. In the processing area 52, for example, a process of measuring the temperature characteristic of the electric resistance value of the component is performed. Since there are a plurality of processing areas 52 in the present embodiment, the parts pass through the plurality of processing areas 52.

A plurality of processing devices 70 are arranged in the processing area 52 along the circumferential direction of the turret type rotary transport device 10. In this example, the processing devices 70 can independently perform different processing. Specifically, for example, each processing device 70 controls (heats or cools) the component so as to have a different set temperature (near) for each processing device 70, and measures the temperature characteristics of the component at the set temperature. To do.

Here, as an example, a case where seven processing devices 70 are arranged in the processing area 52 is shown. Specifically, the first processing device 70A to the seventh processing device 70G are arranged in the first processing area 52A to the seventh processing area 52G, respectively.

For example, in the first processing device 70A arranged in the first processing area 52A located on the upstream side of the transport path T among the processing devices 70, for example, the parts are heated (or raised) to a set temperature (near) of 25 ° C. (Cooling) and the output characteristics of the electrical resistance value when the temperature of the component reaches 25 ° C (near) are measured. The parts whose output characteristics have been measured by the first processing device 70A are collected by the part holding mechanism 45 and transported to the second processing region 52B located downstream of the transport path T. Further, for example, the quality / defect of the component is also determined by the first processing device 70A (or a determination device (not shown separately) provided separately), and the component determined to be defective is not transported to the second processing area 52B. It is discharged to a collection box (not shown) arranged near the first processing device 70A.

In the second processing apparatus 70B arranged in the second processing region 52B, for example, electricity is generated when the component is heated (or cooled) to a set temperature (near) of 40 ° C. and the component reaches 40 ° C. (near). The output characteristics of the resistance value are measured. The parts whose output characteristics have been measured by the second processing device 70B are collected by the part holding mechanism 45 and transported to the third processing region 52C located downstream of the transport path T. Further, for example, the quality / defect of the component is also determined by the second processing device 70B (or a determination device (not shown separately) provided separately), and the component determined to be defective is not transported to the third processing area 52C. It is discharged to a collection box (not shown) arranged near the second processing device 70B.

In the third processing apparatus 70C arranged in the third processing region 52C, for example, electricity is generated when the component is heated (or cooled) to a set temperature (near) of 65 ° C. and the component reaches 65 ° C. (near). The output characteristics of the resistance value are measured. The parts whose output characteristics have been measured by the third processing device 70C are collected by the part holding mechanism 45 and transported to the fourth processing region 52D located downstream of the transport path T. Further, for example, the quality / defect of the component is also determined by the third processing device 70C (or a determination device (not shown separately) provided separately), and the component determined to be defective is not transported to the fourth processing area 52D. It is discharged to a collection box (not shown) arranged near the third processing device 70C.

In the fourth processing apparatus 70D arranged in the fourth processing region 52D, for example, electricity is generated when the component is heated (or cooled) to a set temperature (near) of 80 ° C. and the component reaches 80 ° C. (near). The output characteristics of the resistance value are measured. The parts whose output characteristics have been measured by the fourth processing device 70D are collected by the part holding mechanism 45 and transported to the component carry-out area 53 located downstream of the transport path T. Further, for example, the quality / defect of the component is also determined by the fourth processing device 70D (or a determination device (not shown separately) provided separately), and the component determined to be defective is not transported to the component carry-out area 53. 4 Discharged to a collection box (not shown) arranged near the processing device 70D.

Hereinafter, in the 5th processing area 52E to the 7th processing area 52G, the same processing can be performed by setting the predetermined temperature in the same manner. An unused processing area 52 (processing device 70) may exist, and the processing may not be performed continuously (adjacent processing area 52) as described above.

Further, in this example, the case where the processing devices 70A to 70G for continuously measuring the output characteristics (plurality of different temperature characteristics) at different set temperatures are arranged in the processing area 52 is shown. Depending on the situation, a processing device 70 that performs processing other than measurement of temperature characteristics may be arranged, or the processing device 70 is not arranged continuously (adjacent) along the circumferential direction, and in the figure, for example, the third processing. There may be an area where the processing device 70 is not arranged, such as when the device 70C is not arranged.

Further, on the transport path T, the posture of the component held by the component holding mechanism 45 is detected as appropriate, for example, on the downstream side of the component supply area 51, between the processing devices 70, or on the upstream side of the component carry-out area 53. A means for adjusting the parts, a means for cleaning the holding means of the part holding mechanism 45, and the like may be arranged. For example, the area between the component supply area 51 and the processing area 52 can be defined as the preprocessing area, and the area between the processing area 52 and the component unloading area 53 can be defined as the post-processing area. However, the preprocessing area and the post-processing area are broadly defined as processing. It is a category of area.

As an example, in FIG. 1, the pretreatment areas 52Sa and 52Sb are arranged in the immediate vicinity of the downstream side of the parts supply area 51. The preprocessing region 52Sa is provided with an image pickup device 70Sa that captures the posture of the component held by the component holding mechanism 45 with a still image, a moving image, or the like (including detection by infrared rays, irradiation, or the like). Further, a posture adjusting device 70Sb is provided in the pretreatment area 52Sb closest to the downstream side of the imaging device 70Sa. In the posture adjusting device 70Sb, the orientation (angle in the circumferential direction with respect to the holding axis) of the component held by the component holding mechanism 45 is adjusted with high accuracy, and at the same time, the center position of the component coincides with a predetermined position (matching the holding axis). Positioned so as to be (position). The posture adjusting device 70Sb analyzes the posture (state) of the component held by the component holding mechanism 45 based on, for example, an image taken by the imaging device 70Sa. If there is an abnormality in the posture (state), the posture adjusting device 70Sb temporarily releases and holds the component again, or controls the holding means of the component holding mechanism 45 to obtain the correct posture (state). adjust. By shifting the posture of the parts in this way, the processing devices 70A to 70G downstream of the parts can take out (hold) the parts from the mounting plate 50 and store (release) the parts with high accuracy. Can be done. Although the post-treatment area is not particularly shown, for example, an appearance inspection device for visually inspecting parts may be arranged as the post-treatment area.

Further, the preparation area 51P may be arranged between the parts carry-out area 53 and the parts supply area 51. In the present embodiment, in the preparation area 51P, for example, a cleaning device 65P for cleaning the holding means (for example, suction means) of the component holding mechanism 45 to prepare for the next suction is provided.

The location of the imaging device 70Sa, the posture adjusting device 70Sb, and the cleaning device 65P is arbitrary on the transport path T, and at least one of these may not be arranged.

Further, although not shown, a discharge area and a discharge means for discharging abnormal parts before reaching the parts carry-out area 53 may be appropriately provided on the transport path T.

Further, the image pickup device 70Sa and the posture adjustment device 70Sb are included in the concept of the processing device 70 of the present embodiment in a broad sense. The pre-processing areas 52Sa and 52Sb are also included in the concept of the processing area 52 in a broad sense.

The parts that have completed all output measurements in this way and are not defective pass through the parts carry-out area 53, and after the postures (circumferential orientation and horizontal position) are appropriately adjusted, they are wound on the supply reel 5. The parts are packaged by being carried out to the resin tape for packing.

<Processing device>
Next, the processing apparatus 70 arranged in the processing area 52 will be described with reference to FIGS. 3 and 4. FIG. 3 is a schematic view showing an extracted main configuration of the processing device 70, FIG. 3A is a side view, and FIG. 3B is a schematic diagram of the main configuration of the measuring unit 95. Further, FIG. 4 is a schematic view of the temperature stabilizer 125.

As shown in FIG. 3A, the processing device 70 has a temperature stabilizing device 125 that controls the temperature of the component and conveys the component in an annular shape, and a measuring unit 95 that measures the output characteristics of the component.

The temperature stabilizer 125 also serves as a moving mechanism for moving the parts and a temperature stabilizing mechanism for controlling the temperature of the parts while moving the parts with the moving mechanism. That is, the temperature stabilizer 125 also serves as a moving mechanism for transporting parts and a heat transfer mechanism for heating and cooling the parts. The temperature stabilizer 125 includes a mounting plate 50 capable of accommodating parts.

The measuring unit 95 is an action unit that performs a predetermined action (here, an output measuring action) on the component, and the measuring unit 95 makes a measurement that electrically contacts the electrode 120 (see FIG. 3B) of the component 170. It includes a probe 110, a probe elevating unit 111 that raises and lowers the measurement probe 110, and a probe positioning mechanism 200 that adjusts the position of the measurement probe 110 in a plane direction with high accuracy. The measurement probe 110 is held by the probe elevating part 111, and the position is adjusted in the plane direction by the probe positioning mechanism 200 via the probe elevating part 111. As a result, the measurement probe 110 moves up and down in the vertical direction (vertical direction) with respect to the plane of the mounting plate 50 by the probe elevating portion 111, and moves in the plane direction of the mounting plate 50 by the probe positioning mechanism 200.

When the component 170 to be measured reaches directly below the measurement probe 110 in the measurement unit 95 in the measurement area 54, the rotation of the mounting plate 50 stops. After that, as shown in FIG. 3B, the pair of measurement probes 110 descend and come into contact with the pair of electrodes 120. After measuring the characteristics with the measuring device 105 via the measuring probe 110, the measuring probe 110 rises, the mounting plate 50 rotates again, and the next component 170 moves directly under the measuring probe 110.

As shown in FIG. 3A, the probe positioning mechanism 200 engages with the mounting plate 50 (or a member serving as a reference position for the mounting plate 50) and has a relative position with respect to the mounting plate 50. The probe positioning engaging portion 210 to be adjusted, the engaging portion elevating mechanism 211 for raising and lowering the probe positioning engaging portion 210, and the engaging portion for slightly moving the probe positioning engaging portion 210 in the XY plane direction. It has a plane moving mechanism 201. The movement by the engaging portion elevating mechanism 211 and the engaging portion plane moving mechanism 201 is performed in advance before the measuring probe 110 (probe elevating portion 111) comes into contact with the component. Specifically, the measuring probe 110 (probe elevating portion 111) comes into contact with the component after the engagement of the probe positioning engaging portion 210 with the probe positioning hole 103 is completed.

The engaging portion plane moving mechanism 201 can move in the horizontal linear direction (X direction and Y direction) with respect to the measuring portion support 99 which is fixedly placed on the floor surface. For example, the engaging portion horizontal movement mechanism 201 is arranged on the measuring portion support 99 via a slide component 202 (for example, a rollable ball-shaped member) arranged on the measuring portion support 99 and the slide component 202. The planar moving body 203 is movable in the horizontal direction with respect to the measuring unit support 99.

The engaging portion elevating mechanism 211 is mounted so as to be movable in the vertical direction with respect to the plane moving body 203. The probe elevating portion 111 is mounted on the engaging portion elevating mechanism 211 so as to be movable in the vertical direction. At the time of measurement, first, the engaging portion elevating mechanism 211 lowers the probe positioning engaging portion 210 to a predetermined position (probe positioning hole 103 described later) to perform positioning, and then the probe elevating portion 111 only measures the measuring probe 110. To descend.

The temperature stabilizer 125 will be described with reference to FIG. FIG. (A) is a top view of the mounting plate 50 provided in the temperature stabilizer 125, and FIG. (B) is a cross-sectional schematic view of the temperature stabilizer 125.

As shown in FIG. 4A, the temperature stabilizer 125 is a moving mechanism for rotating and moving a plurality of parts at the same time, and has a plurality of mounting portions 100 which are recesses in which the parts are individually mounted. A disk-shaped mounting plate 50 is provided. The mounting plate 50 is integrally with the heat transfer member 130 described later, and rotates around the mounting plate rotation shaft 55 in a state where parts are mounted.

The mounting portions 100 are arranged at equal intervals along the circumferential direction of the mounting plate 50. The annular locus in which the mounting portion 100 moves as the mounting plate 50 rotates becomes the movement path of the parts.

It is preferable that the inner dimensions of the mounting portion 100 (recess) substantially match the outer dimensions of the parts. In this way, the misalignment of the parts in the mounting portion 100 is suppressed. Further, when the component is mounted on the mounting portion 100, the component is required to have high position accuracy. Therefore, in order to improve the holding accuracy of the parts, it is desirable to adjust the posture by, for example, the posture adjusting device 70Sb (see FIG. 1).

On the movement path of the parts formed on the upper surface of the mounting plate 50, the measurement area 54 in which the measurement unit 95 of the processing device 70 is arranged and the entry / exit area 57 in which the parts are held or released by the parts holding mechanism 45. Is provided. The measurement area 54 is an area including a mounting unit 1001 arranged directly under the measurement unit 95 (measurement probe 110), and the entry / exit area 57 functions, for example, when the component holding mechanism 45 (holds or releases the component). It is an area for holding or opening a part by the part holding mechanism 45), and includes a mounting portion 1017 on which the part to be held or released is stopped. Specifically, as shown in FIG. 4A, the area including the mounting portion 1017 existing at the position closest to (immediately below) the component holding mechanism 45 that performs the holding / releasing operation is the entry / exit area 57. .. Further, in this example, the entry / exit region 57 is a region arranged at a position of 180 degrees on the mounting plate 50 with respect to the measurement region 54.

That is, in the present embodiment, for example, in the clockwise direction, the parts arranged in the mounting portion 100 for half a circumference from the entry / exit area 57 to the measurement area 54 are the parts before measurement, and they are measured when they are located in the measurement area 54. The output characteristics are measured by the unit 95. On the other hand, in the clockwise direction, the parts arranged in the mounting portion 100 for half a circumference from the measurement area 54 to the entry / exit area 57 are already measured parts, and when they are located in the entry / exit area 57, the component holding mechanism 45 It is taken out from the mounting portion 100.

The positions of the entry / exit area 57 and the measurement area 54 are areas fixed to the rotating mounting plate 50, but for example, when the time (distance) from the acceptance of parts to the measurement is changed, the position is fixed. The fixed positions (fixed phase difference in the circumferential direction) of the entry / exit area 57 and the measurement area 54 can be changed. For example, when the phase difference is less than 180, the time (distance) from the acceptance of the component to the measurement becomes short, and when the phase difference is larger than 180, the time (distance) from the acceptance of the component to the measurement becomes long.

In the entry / exit region 57, the parts mounted on the mounting portion 100 (1017) of the mounting plate 50 are controlled to a predetermined temperature (for example, 25 ° C.) while rotating by the temperature stabilizer 125. Then, after measuring the output at the predetermined temperature in the measuring unit 95, it is moved to the entry / exit area 57 again and collected by the component holder of the component holding mechanism 45 (not shown here). The mounting plate 50 rotates, for example, clockwise in the figure (A) about the mounting plate rotation shaft 55.

Further, a plurality of probe positioning holes 103 are arranged in the circumferential direction on the outer periphery of the mounting portion 100. In this example, the probe positioning holes 103 are individually (one-to-one) corresponding to each mounting portion 100 in the same number as the mounting portions 100.

When measuring a part using the measuring probe 110 in each processing device 70, high positioning accuracy is required when the measuring probe 110 comes into contact with the measuring probe 110, especially as the miniaturization of the part progresses. Therefore, in the present embodiment, as shown in FIG. 3, the measuring unit 95 includes a probe positioning engaging unit 210 that can descend prior to the measuring probe 110.

As shown by the dotted line in FIG. 3A, the processing device 70 lowers the probe positioning engaging portion 210 prior to the contact of the measuring probe 110 with the component, and the component to be measured in the measurement area 54 is moved. It engages with the probe positioning hole 103 corresponding to the mounted mounting portion 100 (1001).

At this time, at least one of the probe positioning engaging portion 210 and the probe positioning hole 103 has a tapered shape (specifically, a conical shape). In the present embodiment, the probe positioning engaging portion 210 is a conical protrusion, and the probe positioning hole 103 is a perfect circular hole having a diameter smaller than the maximum outer diameter of the conical protrusion. As a result, when both are engaged, the probe positioning engaging portion 210 is in a coaxial state with reference to the probe positioning hole 103, and is autonomously centered (position adjusted). Due to this centering effect, the engaging portion plane moving mechanism 201 moves in the horizontal direction (X direction and Y direction in the figure) and is positioned with high accuracy in the horizontal direction with reference to the probe positioning hole 103. After that, the probe elevating unit 111 lowers the measuring probe 110 and brings it into contact with the component with reference to the engaging portion plane moving mechanism 201. By doing so, highly accurate positioning at the time of measurement becomes possible.

Although the case where the position is mechanically adjusted in the horizontal direction by engaging the probe positioning hole 103 and the probe positioning engaging portion 210 is illustrated here, the present invention is not limited to this. For example, the probe positioning mechanism 200 may control the horizontal position of the measurement probe 110 by an imaging means, a sensor, or the like (not shown).

In the present embodiment, the number of probe positioning holes 103 is equal to or larger than the number of mounting portions 100. By providing the probe positioning holes 103 corresponding to each mounting portion 100, the measurement probe 110 can be correctly positioned with respect to all the mounting portions 100.

However, as shown by the dotted line in FIG. 4A, the probe positioning hole 103F is fixedly arranged in the measurement area 54, and the position of the measurement probe 110 is adjusted (centering) with respect to all the mounting portions 100 stopped in the measurement area 54. ) May be performed by the common probe positioning hole 103F.

With reference to FIG. 4B, the temperature stabilizer 125 is arranged adjacent to the mounting plate 50 and the mounting plate 50 on the back surface (back surface) side, and transfers heat to the mounting plate 50. The heat transfer member 130 is provided. The shape of the heat transfer member 130 is preferably substantially the same as that of the mounting plate 50 (substantially disk-shaped), but it may be distributed in a plurality of shapes. The heat transfer member 130 and the mounting plate 50 are integrally driven by the mounting plate rotation driving unit 60 around the mounting plate rotation shaft 55. In order to improve the heat transfer efficiency, the mounting plate 50 and the heat transfer member 130 are preferably in contact with each other on flat surfaces, and a heat conductive sheet or the like may be interposed between them. Therefore, the temperature of the mounting plate 50 is controlled by the heat transfer member 130 so that the entire temperature is uniform (single).

In the heat transfer member 130, the heat exchange portion 135 is provided on the plane opposite to the side adjacent to the mounting plate 50. The heat transfer member 130 includes, for example, a heat transfer plate 130A and a Peltier element 130B. The temperature of the heat transfer plate 130A in the heat transfer member 130 is monitored, and the output of the Peltier element 130B is controlled by using the monitoring result. This structure facilitates the replacement of the mounting plate 50. For example, when it is desired to lower the temperature of the mounting plate 50 to control the parts to a temperature lower than room temperature, the mounting plate 50 side of the heat transfer member 130 becomes low temperature and the heat exchange portion 135 side becomes high temperature. In that case, the heat exchange unit 135 should be air-cooled with a fan or cold water should be supplied from a chiller, which is an external heat exchanger, to cool the heat exchange unit 135 so that heat can be easily dissipated from the heat exchange unit 135. Is desirable. On the contrary, when it is desired to raise the temperature of the mounting plate 50 to control the temperature of the component to be higher than the room temperature, the mounting plate 50 side of the heat transfer member 130 becomes high temperature and the heat exchange unit 135 side becomes low temperature. In this case, it is conceivable to bring hot water into contact with the heat exchange unit 135 to heat it. These temperature controls are performed by the temperature control device 137.

The temperature control device 137 is composed of a storage device such as a CPU, RAM, ROM, and a hard disk drive. The CPU is a so-called central processing unit, and various programs are executed to realize various functions. The RAM is used as a work area and a storage area of the CPU, and the ROM stores an operating system and a program executed by the CPU. The temperature control device 137 may be provided for each temperature stabilization device 125, or may be integrated with the control device 25 (see FIG. 1). The temperature control by the temperature control device 137 is performed by, for example, PID control, but since it is a general well-known technique, detailed description thereof will be omitted.

The mounting plate 50 and the heat transfer member 130 are interchangeably configured. Therefore, for example, a plurality of types of mounting plates 50 having different sizes and arrangement numbers of the mounting portions 100 are prepared, and a plurality of types of heat transfer members 130 having different characteristics (specifications) are prepared and placed. Therefore, it can be replaced as appropriate according to the processing.

In the temperature stabilizer 125, the temperature of the component is stabilized at a predetermined temperature rather than the moving time required from when the component is carried into the inlet / output region 57 to when it reaches the measuring unit 95 (measurement region 54 / acting unit). The temperature control time, which is the time until, is short. That is, the temperature of the component is stable at the target value before the component reaches the measurement region 54.

In the present embodiment, as an example, the size (diameter) of the mounting plate 50 is the same in all the processing devices 70, and the measurement area 54 is set at a position of 180 degrees with respect to the entry / exit area 57. That is, even in a plurality of processing devices 70 (processing areas 52) set at a plurality of different temperatures, the distance between the entry / exit area 57 and the measurement area 54 is the same. With such a configuration, as described above, the temperature of the component is stabilized at the target value before the component reaches the measurement region 54 in all the processing regions 52.

As an example, in the present embodiment, the mounting plates 50 have the same size and the number of mounting portions 100 is the same among the plurality of processing devices 70, and the mounting portions 100 rotate at a constant speed. As a result, the distance of the movement path of the parts from the entry / exit area 57 to the measurement area 54 becomes the same, and the parts received in the entry / exit area 57 (mounting portion 100) of each mounting plate 50 among the plurality of processing devices 70. Moves to the measurement area 54 at the same timing. Further, the time related to the measurement is substantially constant regardless of the set temperature, and after the measurement, the time is transferred to the downstream processing device 70, so that the time is moved to the entry / exit area 57 again at the same timing.

Therefore, the processing devices 70A to 70G arranged in the processing areas 52A to 52G all have the same arrangement relationship with the radial direction of each phase (phase every 30 degrees) of the turret type rotary transfer device 10 as a reference line. It becomes. Specifically, the mounting portion 100 existing in the inlet / output region 57 of each processing device 70 exists directly under the nozzle of the corresponding component holding mechanism 45, and is a turret type rotary transfer device based on the mounting portion 100. On the extension line in the radial direction of 10, the mounting portion 100 on the measurement region 54 side of the processing device 80 exists. By doing so, the assembly work of the parts transfer processing device 1 and the pre-setting work (position adjustment work) can be made the same work in the plurality of processing areas 52A to 52G, and the assembly efficiency and maintenance can be performed. Efficiency is dramatically increased.

Since the mounting plate 50 and the heat transfer member 130 are interchangeable, the size (diameter) of the mounting plate 50 is different depending on the processing content, and the measurement is performed from the entry / exit area 57, not limited to this example. The distance to the region 54 (measurement unit 95) may be different. Further, as shown in the cross section of the mounting portion 100 of FIG. 4C, the mounting portion 100 has a plurality of shaped pockets that fit the outer shapes of a plurality of parts 172-1, 172-2 having different sizes. Is also preferable. In this way, it is possible to measure a plurality of types of parts 172-1, 172-2 without exchanging the mounting plate 50.

<Turret type rotary transfer device>
The turret type rotary transfer device 10 will be described with reference to the side schematic view of FIG. The elevating urging mechanism 40 is fixed to a pedestal 35 independent of the turret type rotary transfer device 10. That is, the elevating urging mechanism 40 is fixedly arranged corresponding to each processing area 52 on the transport path T. The component holding mechanism 45 is fixed to the turret table 12 and changes its position as the turret table 12 rotates. The elevating urging mechanism 40 is installed at an appropriate position to engage with the component holding mechanism 45 that is temporarily stopped in each processing area 52. In this embodiment, as shown in FIG. 6, 12 pedestals 35 correspond to each processing device 70 (70A to 70G, 70Sa, 70Sb), automatic parts supply device 65, supply reel 5, and cleaning device 65P. Lifting and lifting mechanism 40 (40A to 40L) is fixedly installed.

Specifically, the elevating urging mechanism 40 reciprocates up and down in the vertical direction (Z direction shown in FIG. 5), and when it descends, it urges the component holding mechanism 45 arranged below it. Although detailed illustration is omitted, the elevating and lowering urging mechanism 40 includes, for example, a motor that performs rotary motion, a swash plate cam structure that engages with the rotary shaft of the motor to convert the rotary motion into linear reciprocating motion, and a swash plate cam. The structure includes a shaft portion 151 for transmitting linear reciprocating motion, an engaging portion 155 formed at the lower end of the shaft portion 151, and the like. The shaft portion 151 is supported by an elastic body (not shown) upward in the vertical direction. As a result, the shaft portion 151 and the engaging portion 155 are reciprocating in the vertical direction by the rotational power of the motor. Then, the lowered engaging portion 155 comes into contact with the component holding mechanism 45 and pushes it down.

The configuration of the elevating urging mechanism 40 is not limited to this, and the shaft portion 151 and the engaging portion 155 may be directly driven in the vertical direction by a linear power source such as an air cylinder, a hydraulic cylinder, or an electromagnetic solenoid. ..

The smaller the weight load of the turret type rotary transfer device 10 for transporting parts, the easier it is to increase the processing speed and the less power consumption. In the component transfer processing device 1 of the present embodiment, since the elevating and lowering urging mechanism 40 and the turret type rotary conveying device 10 are separately arranged, the elevating and lowering urging mechanism is added to the rotational weight of the turret type rotary conveying device 10. 40 is not included. As a result, the processing speed can be easily increased as a whole, and the power consumption can be reduced.

The component holding mechanism 45 includes a component holder 145, a holder elevating portion 147 that raises and lowers the component holder 145 in the vertical direction, and a component holder positioning mechanism 180 that adjusts the position of the component holder 145 in the plane direction with high accuracy. And have. The component holder 145 sucks and holds the component from the mounting section 100, and releases (accommodates) the component to the mounting section 100.

The component holder 145 is, for example, a nozzle capable of sucking and holding the component, or releasing the suction to release the component. Specifically, the component holder 145 has a hollow tube shape (cylindrical shape), and each is connected to a diaphragm pump (not shown). The diaphragm pump is controlled by the control device 25, and the internal space of the component holder 145 is depressurized when the component is sucked, and the internal space of the component holder 145 is returned to the atmospheric pressure when the component is released.

The component holder 145 is guided in the vertical direction by the holder elevating portion 147, but is urged upward in the vertical direction by an urging means (not shown) when the urging force of the elevating urging mechanism 40 is not applied. ing. When the holder elevating part 147 comes into contact with the lowered elevating urging mechanism 40 and is urged downward, the holder elevating part 147 guides the component holder 145 downward in the vertical direction. When the elevating and lowering urging mechanism 40 is raised, the holder elevating part 147 guides the part holder 145 to be raised by the urging means (for example, a spring) built in by itself.

The component holder positioning mechanism 180 includes an engaging portion 182 for positioning the component holder that can be raised and lowered in the vertical direction (Z direction in the drawing), an engaging portion elevating mechanism 181 that raises and lowers the engaging portion 182 for positioning the component holder, and the like. It has an engaging portion plane moving mechanism 184 that slightly moves the component holder positioning engaging portion 182 in the XY plane direction.

The engaging portion plane moving mechanism 184 can move in the horizontal direction (X direction and / or Y direction) with respect to the turret table 12, which cannot move in the vertical direction. For example, the engaging portion horizontal movement mechanism 184 is placed on the turret table 12 via a slide component 222 (for example, a rollable ball-shaped member) provided on the surface (upper surface) of the turret table 12 and the slide component 222. It is composed of a plane moving body 183 or the like which is arranged and can move horizontally with respect to the turret table 12.

The engaging portion elevating mechanism 181 is mounted so as to be movable in the vertical direction with respect to the plane moving body 183. When the engaging portion elevating mechanism 181 is not urged by an external force, it is urged upward in the vertical direction by an urging means (not shown). The holder elevating part 147 is mounted so as to be movable in the vertical direction with respect to the engaging part elevating mechanism 181. In a state where no external force is applied to the holder elevating part 147, the holder is urged upward in the vertical direction by an urging means (not shown). The upward urging force of the engaging portion elevating mechanism 181 is smaller than that of the upward urging force of the holder elevating portion 147. Therefore, when the holder elevating portion 147 is urged downward by the elevating mechanism 40, the engaging portion elevating mechanism 181 first descends preferentially and stops at the bottom dead center, and then the engaging portion stopped. The holder elevating portion 147 descends independently of the elevating mechanism 181.

As a result, the component holder 145 can be raised and lowered independently of the engaging portion for positioning the component holder.

As shown in FIG. 3A, the mounting plate 50 and the support base 119 of the heat transfer member 130 are on the upper surface thereof and do not overlap with the mounting plate 50 (region exposed from the mounting plate 50). More specifically, one or more component holder positioning holes 104 are arranged in the vicinity of the entry / exit region 57. In this example, the component holder positioning hole 104 corresponds to the mounting portion 100 of the entry / exit area 57, and one is provided on the outer periphery of the mounting portion 100.

As already described, the parts are transported between the processing devices 70 by repeatedly holding and releasing the parts by the part holding mechanism 45. In this case, especially when the component is small, high positioning accuracy is required when holding or releasing the component. Also, when packaging parts, high positioning accuracy is also required. In the present embodiment, the component holder positioning mechanism 180 enables highly accurate positioning using the positioning means when the component is held / released.

Specifically, prior to holding or releasing the part by the part holder 145, the part holder positioning engaging portion 182 is lowered and engaged with the part holder positioning hole 104.

At this time, at least one of the component holder positioning engaging portion 182 and the component holder positioning hole 104 has a tapered shape (specifically, a conical shape). In the present embodiment, the component holder positioning engaging portion 182 is a conical protrusion, and the component holder positioning hole 104 is a perfect circular hole having a diameter smaller than the maximum outer diameter of the conical protrusion. As a result, when both are engaged, the component holder positioning engaging portion 182 is in a coaxial state with reference to the component holder positioning hole 104, and is autonomously centered (position adjusted). Due to this centering effect, the engaging portion plane moving mechanism 184 moves in the horizontal direction (X direction and Y direction in the figure) and is positioned with high accuracy in the horizontal direction with reference to the component holder positioning hole 104. After that, the holder elevating portion 147 lowers the component holder 145 to approach the mounting portion 100 with reference to the engaging portion plane moving mechanism 184. By doing so, highly accurate positioning of the component holder 145 with respect to the mounting portion 100 is realized when the component is held or opened.

Here, a case where the position is mechanically adjusted by engaging the component holder positioning engaging portion 182 and the component holder positioning hole 104 has been illustrated, but the present invention is not limited to this. For example, the component holder positioning mechanism 180 may control the horizontal position of the component holder 145 by an imaging means or a sensor (not shown).

Further, the elevating and lowering urging mechanism 40 is configured so that the position and the pushing amount of the engaging portion of the elevating and lowering urging mechanism 40 can be appropriately changed according to the purpose and role, as in the case where the thickness of the component is changed. ing.

<Overall operation>
The overall operation of the turret type rotary transfer device 10 will be described with reference to FIG. In FIG. 6, the turret type rotary transfer device 10 includes 12 component holding mechanisms 45 (45A to 45L) as an example. Further, in order to explain the overall operation, the imaging device 70Sa, the posture adjusting device 70Sb, and the processing devices 70A to 70G may be collectively referred to as the processing device 70.

For example, in FIG. 6A, the first elevating urging mechanism 40A is fixed on the first processing area 52A, the second elevating urging device 40B is fixed on the second processing area 52B, and the third elevating urging device 40B is fixed. The device 40C is fixed on the third processing area 52C, the fourth elevating urging device 40D is fixed on the fourth processing area 52D, and the fifth elevating urging device 40E is fixed on the fifth processing area 52E. The 6 elevating urging device 40F is fixed on the 6th processing area 52F, the 7th elevating urging device 40G is fixed on the 7th processing area 52G, and the 8th elevating urging device 40H is fixed on the component unloading area 53. The ninth elevating urging device 40I is fixed on the preparation area 51P, the tenth elevating urging device 40J is fixed on the parts supply area 51, and the eleventh elevating urging device 40K is the first pretreatment area 52Sa, first. 12 The elevating urging device 40L is fixed on the second pretreatment area 52Sb.

Further, FIG. 6A shows a state in which the turret type rotary transfer device 10 is temporarily stopped, the first component holding mechanism 45A is stopped on the first processing area 52A, and the second component holding mechanism 45B is second. The third component holding mechanism 45C is stopped on the processing area 52B, the third component holding mechanism 45C is stopped on the third processing area 52C, the fourth component holding mechanism 45D is stopped on the fourth processing area 52D, and the fifth component holding mechanism 45E is stopped on the fourth processing area 52D. 5 Stopped on processing area 52E, 6th component holding mechanism 45F stopped on 6th processing area 52F, 7th component holding mechanism 45G stopped on 7th processing area 52G, 8th component holding mechanism 45H The ninth component holding mechanism 45I is stopped on the preparation area 51P, the tenth component holding mechanism 45J is stopped on the component supply area 51, and the eleventh component holding mechanism 45K is stopped on the component supply area 51. It is stopped on the processing area 52Sa, and the 12th component holding mechanism 45L is stopped on the second preprocessing area 52Sb.

In this state, the elevating and lowering urging mechanisms 40A to 40L operate, and by urging the component holding mechanism 45, various operations according to the purpose are executed in parallel while moving the components up and down.

In the state of FIG. 6 (A), when the operation (processing) in each region is completed, the turret type rotary transfer device 10 transfers the parts while rotating 30 degrees counterclockwise, for example, and is shown in FIG. 6 (B). Stop in the state. This rotation angle coincides with the circumferential phase difference (30 degrees) of the arrangement angles of the component holding mechanisms 45A to 45L.

As a result, the first component holding mechanism 45A is stopped on the second processing area 52B, the second component holding mechanism 45B is stopped on the third processing area 52C, and the third component holding mechanism 45C is stopped on the fourth processing area 52D. The fourth component holding mechanism 45D is stopped on the fifth processing area 52E, the fifth component holding mechanism 45E is stopped on the sixth processing area 52F, and the sixth component holding mechanism 45F is stopped on the seventh processing area 52G. The seventh component holding mechanism 45G is stopped on the component carry-out area 53, the eighth component holding mechanism 45H is stopped on the preparation area 51P, and the ninth component holding mechanism 45I is stopped on the component supply area 51. The tenth component holding mechanism 45J is stopped on the first pretreatment area 52Sa, the eleventh component holding mechanism 45K is stopped on the second preprocessing area 52Sb, and the twelfth component holding mechanism 45L is stopped on the first processing area 52A. Is stopped at.

Similarly, by operating the elevating urging mechanisms 40A to 40I in each of these areas, various operations according to the purpose are executed in parallel while moving the parts up and down.

In the state of FIG. 6B, when the operation (processing) in each region is completed, the turret type rotary transfer device 10 further rotates the parts counterclockwise by 30 degrees to convey the parts, and is shown in FIG. 6C. Stop in the state.

By repeating the operations of FIGS. 6 (A) to 6 (C), parts are sequentially supplied from the part supply area 51, and all the parts are subjected to desired processing while sequentially moving in each processing area 52. It is applied and carried out from the parts carry-out area 53.

Next, the component collection operation and the component release operation by the component holding mechanism 45 will be described with reference to FIG. 7. The figure shows the first mounting plate 50A to the third mounting plate 50C, the parts 172A to 172C, 173A to 173C, and the third mounting plate 50A to 173C arranged in each of the first processing region 52A to the third processing region 52C. It is a side view which shows the outline of 1 part holder 145A to 3rd part holder 145C.

In the figure, the hatched parts 172A to 172C are parts to be moved (transported) (for example, already measured), and the parts 173A to 173C shown in white are (for example, the measurement is completed). ) Parts that are not subject to movement (transportation), and part 171 is a part that is newly arranged on the mounting plate 50 shown in the figure. Further, during the period shown in the figure, the first mounting plate 50A to the third mounting plate 50C have stopped rotating due to the loading and unloading of parts.

FIG. 7A shows a state in which the first component holder 145A of the first component holding mechanism 45A is in contact with the component 172A to be transported in the entry / exit area 57 on the first mounting plate 50A, and the second component holding. The state in which the second component holder 145B of the mechanism 45B is in contact with the component 172B to be transported in the entry / exit region 57 on the second mounting plate 50B, and the third component holder 145C of the third component holding mechanism 45C are in contact with each other. A state in which the component 172C to be transported is in contact with the entry / exit region 57 on the third mounting plate 50C is shown. These are done at the same timing.

After that, as shown in FIG. 6B, when the first component holder 145A sucks and holds the component 172A and rises, the mounting portion 100A becomes a hole in the entry / exit region 57 of the first mounting plate 50A.

When the second component holder 145B sucks and holds the component 172B and rises in synchronization with the operation of the first component holder 145A, the mounting portion 100B becomes a hole in the entry / exit region 57 of the second mounting plate 50B. When the third component holder 145C sucks and holds the component 172C and rises in synchronization with the operation of the first component holder 145A, the mounting portion 100C becomes a hole in the entry / exit region 57 of the third mounting plate 50C.

FIG. 3C shows a state in which the turret type rotary transfer device 10 is rotated (for example, rotated by 30 degrees). The 12th component holding mechanism 45L moves onto the 1st mounting plate 50A. In this case, the 12th component holder 145L sucks and holds the new component 171 from the component supply area 51 (see FIG. 6) and moves to the entry / exit area 57 of the first mounting plate 50A. The mounting portion 100A of the first mounting plate 50A is a hole because the component 172A has been taken out in advance.

The first component holding mechanism 45A moves onto the second mounting plate 50B. In this case, the first component holder 145A sucks and holds the component 172A and moves to the entry / exit region 57 of the second mounting plate 50B. The mounting portion 100B of the second mounting plate 50B is a hole because the component 172B has been taken out in advance.

The second component holder 145B that attracts and holds the component 172B moves to the entry / exit area 57 of the third mounting plate 50C. The mounting portion 100C of the third mounting plate 50C is a hole because the component 172C has been taken out in advance.

After that, as shown in FIG. (D), each component holding mechanism 45 releases the component to the mounting portion 100 which is a hole. Specifically, the 12th component holder 145L of the 12th component holding mechanism 45L releases a new component 171 to the mounting portion 100A in the entry / exit area 57 on the first mounting plate 50A, and the first component holding mechanism 45A. The first component holder 145A releases the component 172A to the mounting portion 100B in the entry / exit area 57 on the second mounting plate 50B, and the second component holder 145B of the second component holding mechanism 45B mounts the third component. The component 172B is released to the mounting portion 100C in the entry / exit region 57 on the mounting plate 50C.

When the parts 172 (172A, 172B, etc.) are sucked and held (recovered), the lower end of the parts holder 145 and the parts 172 are brought into close contact with each other. On the other hand, when releasing the parts 172 (172A, 172B, etc.), it is important not to generate static electricity between the lower end of the part holder 145 and the part 172, and the part 172 is placed by the lower end of the part holder 145. Not pressing against the unit 100 is effective in suppressing static electricity.

That is, by controlling the descending stroke of the elevating urging mechanism 40, there are cases where the parts of the mounting portion 100 are attracted (recovered) and cases where the parts are released to the mounting portion 100, and the lower end of the component holder 145. The position of the bottom dead center of the part (holding end) is controlled to be different.

After FIG. 7 (D), the first mounting plate 50A, the second mounting plate 50B, and the third mounting plate 50C start (restart) rotation. The temperature of the new component 171 housed in the mounting portion 100A of the first mounting plate 50A becomes the set temperature (for example, 25 ° C.) of the first mounting plate 50A as the first mounting plate 50A rotates. Be controlled.

Similarly, the temperature of the component 172A housed in the mounting portion 100B of the second mounting plate 50B becomes the set temperature of the second mounting plate 50B (for example, 40 ° C.) as the second mounting plate 50B rotates. Is controlled by.

Similarly, the temperature of the component 172B housed in the mounting portion 100C of the third mounting plate 50C becomes the set temperature of the third mounting plate 50C (for example, 65 ° C.) as the third mounting plate 50C rotates. Is controlled by.

As described above, the component holding mechanism 45 of the present embodiment releases the component on the mounting plate 50 and collects the component from the mounting plate 50 at substantially the same time. Although not particularly shown, the measurement (processing) is completed when the rotation of the first mounting plate 50A, the second mounting plate 50B, and the third mounting plate 50C at a predetermined angle is completed in the state of FIG. 7 (D). The 12th part holder 145L and the first part holder 145A are positioned directly under the second part holder 145B, and the parts are carried out in the same state as in FIG. 7A. Repeated.

In the conventional parts transfer processing device, the parts being transferred are temporarily stopped by the turret type rotary transfer device, and each part is directly processed (predetermined action) while maintaining its posture. Therefore, the transfer speed of the turret type rotary transfer device 10 is controlled by the processing speed (speed of a predetermined action) of each processing area. On the other hand, according to the component transfer processing device 1, the processing device 70 further independently transfers the parts received from the component holding mechanism 45 of the turret type rotary transfer device 10, and performs a predetermined action (measurement of output characteristics). I do. As a result, the processing time in the processing device 70 and the transfer speed of the turret type rotary transfer device 10 can be set independently. Specifically, when evaluating the temperature characteristics of a component placed on the mounting portion 100, it takes time to stabilize at a predetermined temperature due to the heat capacity of the component, but from the entry / exit area 57 in the processing device 70. By sufficiently securing the movement path to the measurement area (acting part) 54, the temperature of each component can be stabilized in a sufficient time. Nevertheless, the transfer speed of the entire parts transfer processing device 1 does not decrease. Further, in the conventional parts transport processing device, since the transport carrier for transporting the parts is moved between a plurality of temperature control regions, the overall heat capacity is large and it takes time for the temperature to stabilize. However, in the present embodiment, since the parts are directly mounted on the mounting plate 50 whose temperature is controlled to the target temperature in advance, the target temperature is reached in a short time (short path). For example, in the case of a small part having a volume of 8 cm ³ or less, particularly in the case of a small part of 1 cm ³ or less, a small part of 27 mm ³ or less, and an ultra-small part of 4 mm ³ or less, the temperature arrival time of the conventional transport carrier type However, in the present embodiment, the component reaches the target temperature in 5 seconds or less (for example, about 2 seconds to 5 seconds).

Further, according to the component transfer processing device 1, the temperature of the component reaches a predetermined temperature and stabilizes while the component moves from the input / output area 57 to the measurement area (acting unit) 54 in the processing device 70. It is possible to evaluate the characteristics of parts in the above, and as a result, it is possible to accurately evaluate the temperature characteristics of parts. Further, in the present embodiment, since the transport carrier for transporting the parts is not used, the loss and error of heat transfer between the mounting plate 50 and the parts are small. As a result, the error of the stabilization temperature of the component can be reduced, and the reliability of the measurement is improved. In the case of a conventional parts transfer processing device, since the transfer carrier slides and moves on the temperature control plate, heat transfer loss occurs between the two, and heat transfer troubles occur due to wear and dirt. As a result, the reliability of the temperature of the parts on the transport carrier tends to decrease.

<Master parts>
With reference to FIG. 8, the measurement of parts in the parts transfer processing device 1 of the present embodiment will be further described. FIG. 8 is a plan view of the mounting plate 50.

As already described, when the temperature characteristics of the parts processed by the processing apparatus 70 are evaluated, the heat (heat / cold heat) of the heat transfer member 130 set to a predetermined temperature is transferred through the mounting plate 50. It is transmitted to the parts mounted on the mounting portions 100 (1001 to 1032). As a result, the parts are controlled (heated and cooled) to the predetermined temperature during the rotational movement of the mounting plate 50. In the present embodiment, any mounting plate 50 is configured to be stable near the set temperature between the entry / exit area 57 and the measurement area 54 (at any set temperature). The size of the plate 50, the rotation speed (movement time), and the like are controlled).

However, the temperature of the mounting plate 50 itself is not uniform due to factors such as wall thickness. Further, the thermal contact between the mounting plate 50 and the heat transfer member 130 is not always completely uniform. Further, the temperature of the entire heat transfer member 130 itself, which is a Peltier element, is not uniform.

Therefore, even if an attempt is made to control the parts to a predetermined temperature by the temperature control device 137 (see FIG. 4), the actually obtained temperatures vary among the plurality of mounting portions 100 on the mounting plate 50. For example, in the first mounting portion 1001, the seventh mounting portion 1007, and the 16th mounting portion 1016 shown in FIG. 8A, even if the mounting plate 50 is to be controlled to 80 ° C., the respective mounting portions are mounted. When the placement is moved to the measurement area 54, not all placements are always exactly at 80 ° C.

On the other hand, the output characteristics of parts do not necessarily have to be measured exactly at 80 ° C. If the actual temperature of the parts varies, the actual temperature in the varied state is used as the measured value, and the actual measurement is performed. It suffices to grasp the output characteristics in the value. In other words, if the actual temperature of a part and the actual output of the part can be measured accurately at the same time, the correlation (temperature characteristics) between the "temperature (contrast information)" and "output" of the part can be inspected. Become. Although "temperature" is illustrated here as comparison information, the present invention is not limited to this, and information linked to various external environments such as humidity, illuminance, pressure, and volume can be selected as comparison information.

Therefore, in the present embodiment, reference parts (hereinafter, referred to as "master parts 250") for performing processing in the processing device 70 in real time are arranged in a part of the plurality of mounting units 100.

The master component 250 uses its own electrical output to obtain comparison information (for example, "temperature information") required for measurement of the component 170 to be measured, which is accommodated in the mounting portion 100 adjacent thereto. It becomes a member provided to the measuring device 105 from the measuring probe 110. For example, the master component 250 is a component of the same type as the component 170 to be mounted, and its output temperature-dependent characteristics (correlation information between the output and the comparison information) are inspected with high accuracy in advance, and the correlation information is grasped. It is preferable that the parts are finished. By using this master component 250, the measuring device 105 can back-calculate the temperature information (comparison information) from the output value by using the already grasped correlation information. Specifically, for example, when the measuring device 105 measures the resistance value or frequency of the component 170 by using its electrical output, the measuring device 105 uses the master component 250 to measure the resistance value or frequency. Measure. The measuring device 105 back-calculates the actual temperature by using the correlation information with the resistance value and frequency of the master component 250. Based on this actual temperature, the actual temperature of the adjacent component 170 to be measured is predicted with high accuracy. In this case, the master part 250 is, for example, a part of the same type (a part having the same configuration) as the part 170 to be actually measured, and it is particularly desirable that the master part 250 is a part produced in the same lot.

On the other hand, the output mode of the master component 250 may differ from the output mode of the component 170 to be measured. The measuring device 105 of the processing device 70 holds the arrangement information of the master component 250 on the mounting plate 50 in advance, so that the measuring probe 110 is required for the measurement of the component 170 by utilizing the dedicated output of the master component 250. Comparison information can be obtained. For example, when the comparison information is "temperature information", it is preferable that the master component 250 is a dedicated component for temperature measurement that can output its own actual temperature as digital information from the terminal. By reading the output information of the master component 250 with the measuring device 105 via the measuring probe 110, the temperature information (comparison information) of the master component 250 can be acquired, and the actual temperature of the component 170 can be estimated from this temperature information. It becomes. For example, when the comparison information becomes temperature information, a thermistor element or the like can be used.

Here, a case where both the master component 250 and the component 170 to be measured are measured by the measurement probe 110 is illustrated, but a dedicated probe for measuring the master component 250 is provided to measure the master component 250. And component 170 measurement can be made independent.

It is desirable that the master component 250 is arranged in the vicinity of the actual component 170 to be measured, preferably in a close position, and more preferably in the mounting section 100 adjacent to the mounting section 100 in which the component 170 to be measured is housed. As a result, the comparison information (for example, temperature information) obtained from the master component 250 can be adopted as it is as the comparison information (actual temperature) of the actual component 170. That is, each master component 250 is set with a guess-corresponding area 250A, and an actual component 170 to which the comparison information of the master component 250 is applied is arranged in the guess-corresponding area 250A. The estimation-corresponding areas 250A are arranged at equal intervals in the circumferential direction on the mounting plate 50.

The figure (A) shows a case where one mounting portion 100 is opened and the master component 250 is arranged. As a result, since the master component 250 and the actual component 170 to which the comparison information is applied are always adjacent to each other, the prediction accuracy of the comparison information is high. That is, the estimation corresponding area 250A on which the master component 250 is placed has a structure in which one component 170 to be measured is arranged so as to be adjacent to the master component 250 in the circumferential direction.

In this case, for example, the temperature of the master component 250 is measured when the 29th mounting unit 1029 is located in the measurement area 54, and the measurement target is measured when the next 30th mounting unit 1030 is located in the measurement area 54. The output characteristics of component 170 are measured. Then, by referring to the comparison information (temperature information) obtained from the master component 250 immediately before, the actual temperature of the component 170 is estimated and the temperature output characteristic is acquired. At this time, it is also preferable to simultaneously measure the outputs of the adjacent master component 250 and the actual component 170 in the estimation corresponding area 250A by increasing the number of measurement probes 110. By doing so, it is possible to prevent a decrease in processing capacity.

Further, the figure (B) shows a case where the master component 250 is arranged by opening the three mounting portions 100. Here, one mounting portion adjacent to the upstream side of the master component 250 and two mounting portions connected to the downstream side are included in the estimation corresponding area 250A.

In this case, for example, the output of the component 170 is measured when the second mounting unit 1002 is located in the measurement area 54, and then the temperature of the master component 250 when the third mounting unit 1003 is located in the measurement area 54. Is measured, and the output of the component 170 is measured when each of the subsequent fourth mounting portion 1004 and fifth mounting portion 1005 is located in the measurement area 54. Then, the temperature information (comparison information) back-calculated from the master component 250 is estimated to be the actual temperature of these three actual measurement target components 170, and the temperature output characteristics are calculated.

The master component 250 is arranged (carried in / out) on the mounting portion 100 of the mounting plate 50 (taken in / out by the component holding mechanism 45) each time the processing device 70 processes the master component 250, similarly to the component 170 to be measured. It is also preferable that the parts are always arranged in the mounting portion 100 of the mounting plate 50 and not carried in or out. When the master component 250 is always placed on the mounting section 100, it is also preferable to mechanically fix the master component 250 to the mounting section 250 so as not to accidentally carry it out.

Further, when a plurality of master parts 250 are arranged on one mounting plate 50, they may be different types of master parts (for the purpose of measuring different characteristics). For example, a resistance element and a thermistor element may be arranged as a master component 250 on one mounting plate 50.

Incidentally, in order to eliminate the measurement error due to the temperature variation in the circumferential direction of the mounting plate 50, it is conceivable to use a data table or the like. Specifically, for example, for each mounting portion, the relationship (temperature difference) between the target temperature and the value (measured value) obtained by measuring the temperature of each mounting portion after stabilizing the temperature of the mounting plate 50 as a whole. ), Etc. Then, this data table can be held in the control device 25 or the like and corrected by calculation.

However, in this case, it is necessary to acquire a data table for each mounting plate 50, and when the mounting plate 50 is replaced, the processing becomes complicated, such as changing the target data table. Further, when the characteristics of the mounting plate 50 (or the heat transfer member 130) change due to aging or aging, it is necessary to reacquire the data table.

Therefore, according to the present embodiment, the master component 250 uses the mounting portion 100 (for example, the adjacent mounting portion 100) in the vicinity of the mounting portion 100 on which the component to be measured is arranged, and the measurement target is measured. It is possible to acquire the temperature condition at almost the same place in almost the same time as the part 170. That is, as compared with the master component 250 whose temperature is stable by orbiting on the mounting plate 50 in advance, the component 170 to be measured is the master component before moving from the entry / exit area 57 to the measurement area 54. Considering that the temperature becomes substantially equal to the temperature of 250 and stabilizes, it was decided to measure the temperature of the master component 250 and estimate this as the temperature of the component 170 to be measured.

That is, according to the present embodiment, it is only necessary to arrange the dedicated component or the master component 250, which is the same type of component as the component to be measured, in the mounting unit 100. Therefore, for example, data for temperature correction or temperature prediction. Compared with the method of predicting the temperature of the part to be measured by performing a table or calculation using it, the comparison information required for processing the part to be measured is acquired in real time and with high accuracy with a simple configuration. be able to. Specifically, in the measurement of the temperature-dependent characteristics of the output, the temperature of the component to be measured can be predicted with high accuracy in real time.

Note that FIG. 8 illustrates a case where the master component 250 and the component 170 to be measured are arranged in the circumferential direction in the estimation corresponding area 250A, but the present invention is not limited to this, and as shown in FIG. 9A, for example. In addition, two rows (inner row and outer row) of mounting portions 100 are prepared in the circumferential direction, the master component 250 is arranged in one row (here, the outer row), and the other row (here, the inner row). The component 170 to be measured may be arranged in the row). That is, in each estimation corresponding area 250A, the master component 250 and the component 170 to be measured can be adjacent to each other in the radial direction. In this case, it is preferable not to carry in / out the master component 250. The master component 250 can also be fixed to the mounting plate 50.

Further, in the present embodiment, the case where the output measurement is performed in the single measurement area 54 after the component to be measured reaches the target temperature has been illustrated, but the present invention is not limited to this. For example, as shown in FIG. 9B, in the range after reaching the target temperature, a plurality of measurement areas 54A, 54B, 54C are provided in the circumferential direction, and simultaneous timing is provided in each measurement area 54A, 54B, 54C. It is also possible to measure the output for different purposes. This is effective when there are many measurement items of component 170. If there are many measurement items and a plurality of items are collectively measured in a single measurement area 54, the measurement time becomes long and the processing capacity decreases. It is also possible to independently arrange the measurement unit 95 described with reference to FIG. 3 in each of the measurement areas 54A, 54B, 54C of FIG. 9B. On the other hand, a single measurement unit 95 is arranged so as to straddle a plurality of measurement areas 54A, 54B, 54C, and a measurement probe corresponding to each measurement area 54A, 54B, 54C is moved up and down by a common elevating mechanism. It is also preferable to let it.

Furthermore, it is also possible to perform measurements for the same purpose (same item) in each of the measurement areas 54A, 54B, and 54C. That is, as shown in the measurement area 54X in which these are integrated, if the same purpose measurement is simultaneously performed on the plurality of parts 170 arranged in the circumferential direction, the processing capacity can be significantly improved. Here, since the case where the measurement of the three parts 170 is collectively performed in the measurement area 54X is illustrated, the loading / unloading of the parts 170 in the loading / unloading area 57 may be executed three times in succession.

<Temperature slope inspection>
10A and 10B are views showing an example of another embodiment of the present invention, FIG. 10A is a top view of one mounting plate 50, and FIG. 10B is a measurement of FIG. 10A. It is a graph which shows an example of the result.

In the embodiments so far, an example in which one measuring unit 95 is provided in one processing device 70 (mounting plate 50) has been described, but the present invention is not limited to this, and for example, a plurality of measuring units 95 on one mounting plate 50 are provided. A plurality of measuring units 95 (measurement areas 54) capable of measuring the output characteristics of each component may be provided at positions corresponding to the mounting units 100.

Specifically, as shown in FIG. 5A, for example, the first measurement unit 95A, the second measurement unit 95B, the third measurement unit 95C, and the fourth measurement unit 95D are placed on one mounting plate 50. Deploy. The configurations of the measuring units 95A to 95D are all the same as those of the measuring unit 95 described above, and the other configurations are also the same as those of the above-described embodiment. Further, the set temperature of the mounting plate 50 is, for example, 80 ° C., and the component 170 is placed between the measurement region (the fourth measurement region (the position of the fourth measurement unit 95D)) located at the position of 180 degrees from the entry / exit region 57. It shall be stable at 80 ° C.

Then, while a certain part 170 arranged in the mounting portion 100 of the entry / exit region 57 by the component holding mechanism 45 moves on the mounting plate 50, the same component 170 is measured by the first measuring unit 95A and the second measurement. The output characteristics are measured by the unit 95B, the third measurement unit 95C, and the fourth measurement unit 95D.

After the component 170 is arranged in the mounting portion 100 of the entry / exit region 57, its temperature gradually rises as it moves in the circumferential direction, and in this example, it reaches the fourth measuring unit 95D as in the above embodiment. The set temperature (for example, 80 ° C.) has been sufficiently reached before.

That is, for example, the first measuring unit 95A is arranged at a predetermined position in the moving path of the component 170, for example, the timing t1 at which the temperature of the component 170 is predicted to reach 25 ° C., and the timing t2 is predicted to reach 50 ° C. The second measuring unit 95B is arranged at the timing t3, the third measuring unit 95C is arranged at the timing t3 predicted to reach 65 ° C., and the fourth measuring unit 95D is arranged at the timing t4 that stabilizes at 80 ° C. As a result, on the temperature slope as shown in FIG. 10B, it is possible to measure the outputs of four types of elapsed times t1, t2, t3, and t4 after the component 170 is placed on the mounting plate 50. The temperature characteristics of this component 170 can be calculated from the correlation between the actual temperature and the output at these four locations.

Since the first to third measurement units 95A to 95C measure the output of the component whose temperature is rising, the temperature at the time of measurement tends to vary. Therefore, as described in FIG. 8A and the like, the master parts 250 are arranged adjacent to each other, and the actual temperature (comparison information) of the parts 170 to be measured in the first to fourth measurement units 95A to 95D is set. , It is preferable to estimate in real time at the temperature of the adjacent master component 250. For example, as shown by the chain line in FIG. 10B, even if the temperature rise curve of the component 170 changes due to the outside air temperature or the like, by arranging the master component 250, the temperature of the first measuring unit 95A is 18 ° C. The output characteristics, the output characteristics of 28 ° C. are obtained by the second measuring unit 95B, the output characteristics of 53 ° C. are obtained by the third measuring unit 95C, and the output characteristics of 80 ° C. are obtained by the fourth measuring unit 95D. That is, by estimating the temperature of the component 170 whose temperature is rising by the master component 250, the temperature characteristics of the component 170 can be calculated in any external environment.

In the case of a configuration in which one measuring unit 95 is provided in one processing area 52 as shown in FIG. Need to be moved. The data of the temperature-dependent characteristics of the output can be obtained by integrating the data of the four locations. On the other hand, according to the configuration shown in FIG. 10, although it is necessary to secure the arrangement areas of the plurality of measuring units 95, the output inspection of a plurality of temperatures is completed in one processing area 52, and if these are integrated, the output can be output. Since data on temperature-dependent characteristics can be obtained, processing may be speeded up. Another advantage is that the output characteristics (temperature slope characteristics) of the component 170 during temperature rise or temperature fall can be inspected.

In this case, since the first measuring unit 95A to the fourth measuring unit 95D can measure the parts at the same time, the temperature slope inspection can be continuously performed on the plurality of parts 170.

<Cover member of processing device>
11A and 11B are views showing an example of another embodiment of the present invention, FIG. 11A is a side view of one processing device 70, and FIG. 11B is a top view of the processing device 70. , (C) is a partially enlarged sectional view of FIG. (A).

As shown in FIGS. (A) and (B), the component transport processing device 1 may include a cover member 500 that integrally covers one or a plurality of processing devices 70. The cover member 500 is made of, for example, a transparent resin material, and integrally covers the temperature stabilizer 125 and the measuring unit 95 in one processing region 52 including the measuring unit support 99, but the rotation of the component holding mechanism 45 It is a substantially L-shaped box when viewed from the side so as not to interfere with movement. That is, the cover member 500 mainly has a temperature stabilizer 125, a lower region 500B that covers the lower side (measurement unit support 99) side of the measurement unit 95, and an upper region 500A that mainly covers the upper part of the measurement unit 95, and has a lower region. The size (volume) of 500B is larger than that of the upper region 500A. Further, a desired gas is injected into the cover member 500 from a gas injection portion (not shown). The types of gas are dry gas (for example, dry air and nitrogen) to prevent dew condensation, inert gas (for example, nitrogen gas, argon gas, etc.) to suppress unnecessary reactions, and static gas to prevent dust intrusion. Clean air with electrical measures, temperature-controlled gas to improve the accuracy of temperature control, etc. are injected. Further, as shown by the dotted line, the upper region 500A can be opened upward with respect to the lower region 500B by the hinge mechanism 501. When the upper region 500A is opened, the measuring unit 95 (particularly, the probe positioning mechanism 200 and the measuring probe 110 portion) is exposed, so that the measuring unit 95 can be easily maintained.

When measuring parts, it is necessary to prevent dew condensation, minimize contact with pollutants such as dust and dirt in the atmosphere, and avoid the influence of the temperature (change) of the surrounding environment. .. Therefore, in order to prevent the parts, the mounting plate 50, and the measuring unit 95 (particularly the measuring probe 110) from being exposed to the surrounding environment, the entire processing device 70, which is one or a plurality of processing units, is covered with the cover member 500. The inside of the cover member 500 is filled with a gas according to the purpose while being integrally covered with. In particular, it is preferable to inject a dry gas at the time of low temperature measurement because it is important to prevent dew condensation.

On the other hand, the main parts of the measuring unit 95, specifically, the probe positioning mechanism 200 and the measuring probe 110 parts (parts other than the temperature stabilizing device 125 and the measuring unit support base 99) are (compared to the temperature stabilizing device 125). The drive mechanism is delicate and complicated, and it is a part that requires frequent maintenance such as replacement and cleaning. Therefore, in the present embodiment, the upper region 500A can be opened. As a result, manual adjustment and maintenance of the main part of the measuring unit 95 can be easily performed as appropriate.

In the figure (A), as an example, the entire upper region 500A is centered on the hinge mechanism 501 provided on the back side (outer peripheral side of the component transport processing device 1) of the cover member 500 in the back side direction (in the direction of the arrow in the figure). It shows a configuration in which it is rotated and opened. However, the present invention is not limited to this, and various opening mechanisms can be adopted, such as the upper surface portion of the upper region 500A sliding to open. Further, not limited to this example, the lower region 500B may also be configured to be openable.

Further, the upper surface 500U of the lower region 500B extends in the horizontal direction so as to vertically separate the component holding mechanism 45 and the moving mechanism (temperature stabilizer 125). A first opening 503 and a second opening 504 are provided on a part of the upper surface 500U. The first opening 503 is configured so that it can pass (insert) directly under the engaging portion 182 for positioning the component holder. Further, the second opening 504 is configured so that it can pass (insert) directly under the component holder 145.

With such a configuration, while maintaining the state in which the processing device 70 is integrally covered with the cover member 500, the parts are supplied to the mounting portion 100 of the mounting plate 50 in the entry / exit region 57, and the mounting portion 100 Parts can be taken out from.

FIG. 3C is an enlarged cross-sectional view of the upper surface 500U portion. It is desirable that the processing device 70 minimizes contact with the surrounding environment (outside air) during the operation of the component transport processing device 1, for example, in order to prevent dew condensation. From that viewpoint, the cover member 500 Is preferably sealed. Therefore, it is preferable that the first opening 503 and the second opening 504 are provided with means for blocking from the outside air 507. The blocking means 507 is, for example, an air curtain flowing in the horizontal direction. In this case, as shown in FIG. 6C, an air (gas) flow path 508 is formed at least inside the upper surface 500U, and air (preferably a dry gas for preventing dew condensation) passes through the flow path 508. Let me. As a result, the engagement portion 182 for positioning the component holder is always open to the first opening 503, and the component holder 145 can be inserted into the second opening 504, while the humid outside air is a cover member. It is possible to prevent the entry into the 500.

Note that, as the blocking means 507, a physical shutter or the like may be provided so as to open only when the component holder positioning engaging portion 182 or the component holder 145 is inserted. However, in this case, the configuration and the drive mechanism become complicated. On the other hand, the air curtain does not require a physical opening / closing operation and configuration.

Although this example shows an example in which one processing device 70 is integrally covered with the cover member 500, for example, a plurality of processing devices 70 may be integrally covered with the cover member 500.

Further, in order to improve the accuracy of the stabilization temperature of the parts, it is preferable to fill the cover member 500 with a gas whose temperature is positively controlled so as to match the stabilization temperature of the parts (temperature-controlled gas).

<Measuring probe calibration device>
FIG. 12 is a top view of the processing apparatus 70 showing an example of another embodiment of the present invention. On the mounting plate 50, a probe calibration component 260 for forming the measurement probe 110 is arranged by utilizing a part of a plurality of mounting portions 100 or a dedicated area.

The measuring probe 110 may have a change in its own resistance value or the wiring resistance value up to the measuring device 105 due to foreign matter adhering to the tip or deterioration over time. Further, the measurement probe 110 needs to be replaced regularly, but the resistance value of the measurement probe 110 itself also fluctuates depending on the replacement work.

Therefore, in the present embodiment, a plurality of probe calibration components 260 are arranged on the movement locus of the mounting plate 50, and the measurement probe 110 is brought into contact with the probe calibration component 260 at an arbitrary timing to perform an energization operation. .. It is preferable that the probe calibration component 260 is a resistance circuit and has a structure having as little temperature-dependent characteristics as possible. Further, it is preferable that the resistance values of the plurality of probe calibration components 260 are different. As a result, by measuring the plurality of resistance values of the probe calibration component 260 with the measuring probe 110, it is possible to check the change in the resistance value of the measuring probe 110 and its internal wiring with high accuracy. By the way, even if the resistance value of the measuring probe 110 fluctuates, the output measurement of the component 170 is not affected if the data is corrected on the measuring device 105 side. Further, when the fluctuation amount of the resistance value exceeds the permissible range, the processing operation can be stopped and an alarm for maintenance can be generated.

Although the case where the probe calibration parts 260 are arranged at four locations in the circumferential direction of the mounting plate 50 is illustrated here, the number thereof is not particularly limited.

<Detailed structure of positioning mechanism>
The positioning mechanism of the component transfer processing device 1 will be further described with reference to FIGS. FIG. 13A is a view for explaining an example of the probe positioning mechanism 200, and is a view of the processing device 70 as viewed from the rotation center side (left direction in FIG. 1) of the turret type rotary transfer device 10. Note that FIG. 13 (A) shows a state in which the probe elevating portion 111 and the engaging portion elevating mechanism 211 are both at top dead center, and FIG. 13 (B) shows a state in which the probe elevating portion 111 is at top dead center and the engaging portion elevating mechanism 211. Is the state of the bottom dead center, and FIG. 13C shows the state of the bottom dead center of both the probe elevating part 111 and the engaging part elevating mechanism 211.

The engaging portion plane moving mechanism 201 in the probe positioning mechanism 200 has a measuring portion support base 99, a slide component 202, a plane moving body 203, and a holding frame 204.

The measuring unit support base 99 is a portion that is immovably fixed to the base (table), and a recess 212 is provided on the upper surface (top surface) thereof. The recess 212 has a two-step outer diameter in the depth direction, and the upper portion has a stepped shape wider than the lower portion (bottom portion). The slide component 202 is housed inside the recess 212.

The slide component 202 is formed by, for example, an annular upper layer portion 202A and a lower layer portion 202B laminated via a ball member 202C. By rolling the ball member 202C, the upper layer portion 202A and the lower layer portion 202B can move relative to each other in the plane direction. The lower layer portion 202B is in close contact with the bottom surface and the inner peripheral wall of the lower portion of the recess 212, and movement within the lower layer portion 202B is restricted. The upper layer 202A having the same size as the lower layer 202B is arranged in the upper portion of the recess 212. Since the upper layer portion 202A is smaller than the upper portion of the recess 212, a gap G1 is formed around the upper layer portion 202A. As a result, the upper layer portion 202A can move (slide) in the horizontal direction (X direction and / or Y direction) with the gap G1 as the upper limit. A part of the upper layer portion 202A finely protrudes from the upper surface of the measuring portion support base 99.

A plane moving body 203 is arranged on the upper surface of the measuring unit support base 99 so as to cover it. The bottom surface of the flat moving body 203 is in contact with the upper layer portion 202A of the slide component 202, and as a result, a fine gap G2 is formed between the bottom surface of the flat moving body 203 and the upper surface of the measuring unit support base 99. The plane moving body 203 can move in the horizontal direction (X direction and / or Y direction) with respect to the measuring unit support base 99 via the slide component 202. The plane moving body 203 includes a shaft portion 205 projecting vertically downward from the bottom surface. The shaft portion 205 is inserted into the central hole of the upper layer portion 202A of the slide component 202 and engages in the radial direction.

Further, the plane moving body 203 has an expansion portion 203K extending in the plane direction. The second slide component 203S is arranged in the recess formed on the upper surface of the expansion portion 203K. The structure of the second slide component 203S is the same as that of the slide component 202. A holding frame 204 for vertically sandwiching the expansion portion 203K is fixed on the upper surface of the measuring portion support base 99. Therefore, the holding frame 204 covers a part of the upper surface of the expansion portion 203K.

An adjusting screw 204N for adjusting a vertical gap with respect to the upper surface of the expansion portion 203K is installed on the holding frame 204. The lower end of the adjusting screw 204N comes into contact with the second slide component 203S. Further, at the lower end of the adjusting screw 204N, a protrusion to be inserted into the annular upper layer portion of the second slide component 203S is formed. As a result, since the plane moving body 203 comes into contact with both the measuring unit support base 99 and the holding frame 204, movement (disengagement) in the vertical direction (Z direction in FIG. 3A) is restricted.

On the other hand, the plane moving body 203 is allowed to move relative to the measuring unit support base 99 and the holding frame 204 in the horizontal direction by the slide component 202 and the second slide component 203S. A gap G3 is formed between the side surface of the holding frame 204 and the side surface of the plane moving body 203, and the gap G3 can be used as an upper limit for sliding movement in the X direction and / or the Y direction. The size of the gap G3 can be adjusted by, for example, the side adjusting screw 204M provided on the holding frame 204. Further, the gap G3 is set to be smaller than the gap G1. Although only the gap G3 in the X-axis direction is shown in FIG. 13, the gap in the Y direction has the same structure.

On the front side of the plane moving body 203, an engaging portion elevating mechanism 211 is provided so as to be movable in the vertical direction (Z direction) with respect to the plane moving body 203 (and the measuring unit support base 99). The engaging portion elevating mechanism 211 holds the engaging portion 210 for probe positioning. Further, a probe elevating portion 111 is provided on the front surface side of the engaging portion elevating mechanism 211 so as to be movable in the vertical direction with respect to the engaging portion elevating mechanism 211. The probe elevating unit 111 holds the measurement probe 110.

The elevating mechanism of the probe elevating part 111 and the engaging part elevating mechanism 211 has a known configuration using a motor, an air cylinder, a hydraulic cylinder, an electromagnetic solenoid, an urging means (spring), and the like, and thus detailed description thereof will be omitted. ..

With such a configuration, the plane moving body 203 can adjust its position with respect to the measuring unit support base 99 in the horizontal direction (X direction and / or Y direction) by a gap G3 minutes.

Then, the engaging portion elevating mechanism 211 can be moved up and down with respect to the plane moving body 203 (measuring portion support base 99), and the probe elevating portion 111 can be raised and lowered with respect to the engaging portion elevating mechanism 211. The probe elevating part 111 can be moved up and down with respect to the plane moving body 203 (measurement unit support base 99) at a different timing independent of the elevating operation of the engaging part elevating mechanism 211.

As a result, when measuring a component with the measuring probe 110, the measuring probe 110 can be lowered after the probe positioning engaging portion 210 is lowered to a predetermined position to perform positioning in the plane direction.

Next, the positioning operation of the measurement probe 110 in the processing device 70 will be described with reference to FIGS. 14 and 15. FIG. 14 is a side schematic view showing an extracted main part of the processing device 70 shown in FIG.

As shown in FIG. 14 (A), when the component 172 to be measured stops in the measurement area 54, the engaging portion elevating mechanism 211 lowers, and as shown in FIG. 14 (B), the probe positioning engaging portion The 210 is engaged with the probe positioning hole 103 to perform centering in the plane direction.

By the way, FIG. 15 is an enlarged cross-sectional view showing a state in which the probe positioning engaging portion 210 is engaged with the probe positioning hole 103. As shown in the figure, the probe positioning engaging portion 210 of the present embodiment has a tip portion 210T having a tapered or conical shape. Further, the probe positioning hole 103 has a cylindrical shape, and its diameter D1 is smaller than the maximum diameter D2 of the tip portion 210T and is set to be equivalent to the diameter D3 in the middle of the conical inclined surface.

As a result, when the engagement state between the probe positioning engaging portion 210 and the probe positioning hole 103 progresses, the tip portion 210T is guided inward in the radial direction of the probe positioning hole 103, and the central axis of the tip portion 210T is gradually moved. , Approaching the coaxial state with respect to the central axis of the probe positioning hole 103 (see the arrow in FIG. 15B). When the probe positioning engaging portion 210 reaches the bottom dead center and the outer peripheral surface of the tip portion 210T completely engages (closes) with the opening edge of the probe positioning hole 103, as shown in FIG. 15C, The probe positioning engaging portion 210 and the probe positioning hole 103 are in a coaxial state, and so-called centering is completed.

By the way, for example, when the diameter D1 of the probe positioning hole 103 is larger than the maximum diameter D2 of the tip portion 210T, the tip portion 210T can move in the radial direction inside the probe positioning hole 103 when both are engaged. , High-precision centering becomes difficult.

In the present embodiment, as shown in FIG. 15C, since the tip portion 210T is configured to be closely engaged with the opening edge of the probe positioning hole 103 in the middle of the inclined surface, the accuracy of both is high. Centering is possible.

Returning to FIG. 14B, the plane moving body 203 moves in the horizontal direction (X direction and Y direction in the drawing) in conjunction with the centering operation by the probe positioning engaging portion 210 and the probe positioning hole 103.

As a result, the positioning of the measuring probe 110 in the plane direction is completed with the probe positioning hole 103 as the position reference. After that, as shown in FIG. 14C, the measuring probe 110 is separated from the engaging portion elevating mechanism 211. Only the probe elevating part 111 is lowered to bring the measurement probe 110 into contact with the component 172. Incidentally, at the stage of FIG. 14 (B), as the probe positioning engaging portion 210 is lowered, the probe elevating portion 111 and the measuring probe 110 are also lowered, so that the probe elevating portion 111 in FIG. 14 (C) is also lowered. The single descending stroke of the chisel is designed to be short.

When the measurement by the measuring probe 110 is completed, the measuring probe 110 is raised by the probe elevating part 111 ((D)), and the probe positioning engaging part 210 is also raised by the engaging part elevating mechanism 211 (the same). FIG. (E). The measurement probe 110 and the probe positioning engaging portion 210 may be raised at the same time after the measurement.

Next, the component holder positioning mechanism 180 will be described with reference to FIG. Since the structure of the component holder positioning mechanism 180 is similar to that of the probe positioning mechanism 200, the description of the same or similar structure may be omitted. In addition, in FIG. 16A, both the holder elevating part 147 and the engaging part elevating mechanism 181 are in the state of the top dead center, and in FIG. The mechanism 181 is in the bottom dead center state, and FIG. 16C shows the state in which both the holder elevating portion 147 and the engaging portion elevating mechanism 181 are in the bottom dead center state.

The engaging portion plane moving mechanism 184 has a pedestal 226, a slide component 222, a plane moving body 183, and a holding frame 224. The pedestal 226 is part of the turret table 12. The pedestal 226 may be fixed to the turret table 12 as a separate member. Further, since the slide component 222 is the same as the slide component 202 of the probe positioning mechanism 200 shown in FIG. 14A, detailed description thereof will be omitted.

A recess 188 is provided on the upper surface of the turret table 12 (pedestal 226). The recess 188 has a two-step outer diameter in the depth direction, and the upper portion has a stepped shape wider than the lower portion (bottom surface). The slide component 222 is housed inside the recess 188. Since the mode of accommodating the slide component 222 in the recess 188 is the same as that of the slide component 202 of FIG. 13 (A), the description thereof will be omitted here.

A plane moving body 183 is arranged on the upper surface of the pedestal 226 so as to cover it. The bottom surface of the plane moving body 183 is in contact with the upper layer portion of the slide component 222, and a fine gap G2 is formed between the bottom surface of the plane moving body 183 and the upper surface of the pedestal 226. The plane moving body 183 can move in the horizontal direction (X direction and / or Y direction) with respect to the pedestal 226 via the slide component 222. The plane moving body 183 includes a shaft portion 227 that projects vertically downward from the bottom surface. The shaft portion 227 is inserted into the central hole of the upper layer portion 222A of the slide component 222 and engages in the radial direction.

Further, the plane moving body 183 has an expansion portion 183K extending in the plane direction. The second slide component 183S is arranged in the recess formed on the upper surface of the expansion portion 183K. The structure of the second slide component 183S is the same as that of the slide component 222. A holding frame 224 for vertically sandwiching the expansion portion 183K is fixed to the upper surface of the pedestal 226. Therefore, the holding frame 224 covers a part of the upper surface of the expansion portion 183K.

An adjusting screw 224N for adjusting a vertical gap with respect to the upper surface of the expansion portion 183K is installed on the holding frame 224. The lower end of the adjusting screw 224N comes into contact with the second slide component 183S. Further, at the lower end of the adjusting screw 224N, a protrusion to be inserted into the annular upper layer portion of the second slide component 183S is formed. As a result, the plane moving body 183 is in contact with both the pedestal 226 and the holding frame 224, so that the movement (disengagement) in the vertical direction (Z direction) is restricted.

On the other hand, the plane moving body 183 is allowed to move relative to the pedestal 226 and the holding frame 224 in the horizontal direction by the slide part 222 and the second slide part 183S. A gap G3 is formed between the side surface of the holding frame 224 and the side surface of the planar moving body 183, and the gap G3 can be used as an upper limit for sliding movement in the X direction and / or the Y direction. The size of the gap G3 can be adjusted by, for example, the side adjusting screw 224M provided on the holding frame 224. Further, the gap G3 is set to be smaller than the gap G1 formed in the slide component 222.

On the front side of the plane moving body 183, an engaging portion elevating mechanism 181 is provided so as to be movable in the vertical direction (Z direction) with respect to the plane moving body 183 (and the pedestal 226). The engaging portion elevating mechanism 181 holds the engaging portion 182 for positioning the component holder. Further, a holder elevating portion 147 is provided on the front surface side of the engaging portion elevating mechanism 181 so as to be movable in the vertical direction with respect to the engaging portion elevating mechanism 181. The holder elevating part 147 holds the component holder 145. The component holder 145 is, for example, a suction nozzle.

The holder elevating portion 147 is urged vertically upward with respect to the engaging portion elevating mechanism 181 by an upward urging member (for example, a spring member) (not shown). Therefore, when no external force acts, the holder elevating portion 147 stands still at the top dead center with respect to the engaging portion elevating mechanism 181. Similarly, the engaging portion elevating mechanism 181 is urged vertically upward with respect to the planar moving body 183 by an upward urging member (for example, a spring member) (not particularly shown). Therefore, when no external force acts, the engaging portion elevating mechanism 181 rests at the top dead center with respect to the plane moving body 183. The urging force of the upper urging member of the holder elevating portion 147 is set to be larger than the urging force of the upper urging member of the engaging portion elevating mechanism 181.

As shown in FIG. 16B, the upper surface of the holder elevating portion 147 is urged downward by abutting with the engaging portion 155 of the shaft portion 151 of the elevating mechanism 40. As a result, the holder elevating part 147 tries to move downward, but the urging force of the upper urging member inside the holder elevating part 147 is larger than the urging force of the upper urging member inside the engaging part elevating mechanism 181. Since the size is also large, the engaging portion elevating mechanism 181 is preferentially lowered, and the engaging portion elevating mechanism 181 reaches the bottom dead center. After that, as shown in FIG. 16C, the holder elevating portion 147 is lowered relative to the engaging portion elevating mechanism 181.

The power of the elevating mechanism (retainer elevating part 147) of the component holder 145 (support 146) and the elevating mechanism (engagement part elevating mechanism 181) of the component holder positioning engaging portion 182 is provided with elevating. The structure is not limited to the force mechanism 40 and elastic members such as springs that serve as drag (restoring force) thereof, and may have a known configuration using a motor, an air cylinder, a hydraulic cylinder, an electromagnetic solenoid, or the like.

The positioning operation of the component holder 145 in the component holding mechanism 45 will be described with reference to FIG. FIG. 17 is a side schematic view showing the main part of the component holding mechanism 45 shown in FIG. 2 by extracting it, and here, the holding operation of the component 172 will be described as an example.

As shown in FIG. 17A, when the part 172 to be held (the part 172 whose measurement is completed) stops in the entry / exit area 57, the engaging portion 155 of the elevating urging mechanism 40 is moved to the upper surface of the holder elevating portion 147. Engage with the portion and urge it downward (FIG. 17 (B)). This urging force is transmitted to the engaging portion elevating mechanism 181 to lower the component holder positioning engaging portion 182. As a result, the component holder positioning engaging portion 182 and the component holder positioning hole 104 engage with each other to perform centering. The shape of the tip of the component holder positioning engaging portion 182, the shape of the component holder positioning hole 104, and the centering mode by both are described with the probe positioning engaging portion 210 and the probe positioning hole 103 shown in FIG. Since it is the same, the description here will be omitted.

The plane moving body 183 moves in the horizontal direction (X direction and Y direction in the drawing) in conjunction with the centering operation by the component holder positioning engaging portion 182 and the component holder positioning hole 104. As a result, the engaging portion elevating mechanism 181 reaches the bottom dead center at the same time as the preliminary positioning of the component holder 145 is completed with the component holder positioning hole 104 as the position reference.

After that, when the engaging portion 155 of the elevating urging mechanism 40 further pushes down the holder elevating portion 147, as shown in FIG. 17C, only the holder elevating portion 147 is independent of the engaging portion elevating mechanism 181. Descends and comes into contact with component 172. Incidentally, as the component holder positioning engaging portion 182 is lowered in FIG. 17B, the holder elevating part 147 is also lowered, so that only the holder elevating part 147 in FIG. 17C is independent. The descending stroke of is short.

Further, since the component holder 145 has been positioned relative to the mounting portion 100 (component 172) in the plane direction in FIG. 17 (B), the center of the component 172 is as shown in FIG. 17 (C). Can be adsorbed and held. After that, when the urging of the elevating mechanism 40 is released, the component holder 145 rises (FIG. 17 (D)), the holder elevating part 147 reaches the top dead center, and then together with the engaging part elevating mechanism 181. The engaging portion 182 for positioning the component holder is raised (FIG. 17 (E)). Although the suction operation of the component 172 is introduced here, the same applies to the release operation of the component 172.

As described above, in the above embodiment, as shown in FIGS. 18A, 14 and 17, there is one probe positioning engaging portion 210 and a component holder positioning engaging portion 182 (that is, the probe). Although the case where the positioning hole 103 and the component holder positioning hole 104 are one) is illustrated, the centering accuracy can be further improved by using a plurality of these. In particular, the positioning accuracy of the engaging portion plane moving mechanism 201 and the engaging portion plane moving mechanism 184 in the θ direction (rotational direction in the illustrated XY plane) can be improved. For example, as shown in FIG. 18B, when the probe positioning engaging portions 210 are provided at two locations, the two

probe positioning holes

103A and 103A are used to center one mounting portion 100. You may do so. In this case, for example, the probe positioning engaging portion 210 is centered on the mounting portion 100 in which the component 172 to be measured is housed, and the probe positioning holes are (omitted) equidistant from the mounting portion 100 and are closest to each other. 103A and 103A are used. As a result, the positioning accuracy can be further improved as compared with the case where the probe positioning engaging portion 210 is one. Further, if two rows are provided in the circumferential direction as in the

probe positioning holes

103B and 103B, a pair of dedicated

probe positioning holes

103B and 103B can be provided for each mounting portion 100. The same applies to the plurality of component

holder positioning holes

104A and 104A. Further, in the present embodiment, the case where the component holder positioning hole 104 is fixedly arranged independently of the mounting plate 50 or the mounting portion 100 has been illustrated, but the present invention is not limited thereto. As shown in FIG. 18B, similarly to the probe positioning hole 103, the component

holder positioning holes

104B and 104B are provided corresponding to each mounting portion 100, and are rotated together with the mounting portion 100. You can also do it. Of course, the probe positioning hole 103 and the component holder positioning hole 104 may be used in combination.

When positioning the contact position of the measuring probe 110 in the measuring unit 95, the measuring probe 110 itself needs to be brought into contact with the electrode pad portion which is very thin and smaller than the size of the component. Moreover, if the contact condition is poor, accurate measurement cannot be performed. Therefore, it can be said that more accurate positioning is required on the measuring unit 95 side as compared with the component holding mechanism 45 side. Therefore, it is preferable to have a plurality of probe positioning engaging portions 210. Of course, on the component holding mechanism 45 side as well, positioning may be performed using a plurality of component holder positioning engaging portions 182.

Further, the distance between the probe positioning engaging portion 210 (probe positioning hole 103) and the measuring probe 110 (mounting portion 100 to be measured) and the component holder positioning engaging portion 182 (part holder positioning hole 104). Positioning accuracy is higher when the distance between the component holder 145 and the component holder 145 (mounting portion 100 for component holding target) is as close as possible. Therefore, it is preferable that the probe positioning hole 103 and the component holder positioning hole 104 are close to the target mounting portion 100.

Further, in the present embodiment, the case where the component holder positioning hole 104 is fixedly arranged independently from the mounting plate 50 or the mounting portion 100 is illustrated, but the present invention is not limited to this. Similar to the probe positioning hole 103, the component holder positioning hole 104 can be provided corresponding to each mounting portion 100, and can be rotated together with the mounting portion 100. Of course, the probe positioning hole 103 and the component holder positioning hole 104 may be used in combination.

Similarly, in the present embodiment, the case where the probe positioning hole 103 rotates integrally with the mounting plate 50 or the mounting portion 100 has been illustrated, but the present invention is not limited to this. The probe positioning hole 103 may be fixedly arranged in the measurement region 54 independently of the mounting plate 50.

However, in order to improve the centering accuracy, it is preferable to provide a probe positioning hole 103 and a component holder positioning hole 104 corresponding to each mounting portion 100 and rotate them together.

As described above, according to the present embodiment, highly accurate positioning is possible when measuring a part using the measuring probe 110 and when holding / releasing the part by the part holder 145, and by extension, at the time of measurement. Error and hold / release error can be prevented.

In the present embodiment, the structure of the processing device 70 is not limited to the illustrated one. Another structure can be adopted as long as the probe positioning engaging portion 210 and the probe positioning hole 103 are first engaged to perform the centering operation and then the measurement probe 110 is in contact with the component. Similarly, the structure of the component holding mechanism 45 is not limited to that shown in the figure. If the structure is such that the component holder positioning engaging portion 182 and the component holder positioning hole 104 engage first to perform a centering operation, and then the component holder 145 approaches the mounting portion 100, another structure is used. Can be adopted.

<Multi-product measurement>
Next, still another embodiment will be described with reference to FIG. FIG. 19 is a plan view of the mounting plate 50.

In the above embodiment, an example in which the output measurement of the same type of parts is performed by one processing device 70 has been described, but the output measurement of a plurality of types of parts may be performed by one processing device 70.

That is, as shown in the figure, a plurality of different types of

parts

177, 178, and 179 are mixedly placed and conveyed on one mounting plate 50. On the other hand, the measurement area 54 is the same as that of the above embodiment, and the output of a plurality of types of

parts

177, 178, and 179 can be measured by one measurement unit 95 (same measurement probe 110). Of course, it is also possible to prepare a plurality of measurement areas corresponding to a plurality of

parts

177, 178, and 179.

As described above, the component transfer processing device 1 of the present embodiment replaces the measurement unit 95 and the mounting plate 50 in the same manner as the same mounting plate 50 and the same type of parts even if the parts are of different types. Since the processing can be performed (without), it can contribute to the improvement of the processing efficiency.

Further, the processing devices 70 arranged in the circumferential direction of the component transfer processing device 1 are not limited to devices that perform the same type of processing (for example, measurement processing of temperature output characteristics), and a plurality of different processing (for example, measurement processing of temperature output characteristics) is performed. Temperature output characteristic measurement processing and resistance measurement processing, etc.) may be mixed.

It should be noted that the parts transport processing apparatus of the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

1 Parts transfer processing device 10 Turret type rotary transfer device 12 Turret table 15 Turret table Rotating shaft 20 Turret table drive device 25 Control device 35 Stand 40 Lifting urging mechanism 45 Parts holding mechanism 50 Mounting plate 51 Parts supply area 52 Processing area 53 Parts carry-out area 54 Measurement area 55 Mounting plate rotating shaft 57 Loading / unloading area 60 Mounting plate rotation drive unit 65 Automatic parts supply device 70 Processing device 95 Measuring unit 99 Measuring unit Support base 100 Mounting unit 105 Measuring device 110 Measuring probe 111 Probe Elevating part 119 Support base 120 Electrode 125 Moving mechanism (temperature stabilizer)
130 Heat transfer member 135 Heat exchange unit 137 Temperature control device 145

Parts holder

170, 172, 172A-172C, 173, 173A-173C, 171, 177, 178, 179 Parts 180 Parts holder Positioning mechanism 182 For parts holder positioning Engagement part 184 Engagement part plane movement mechanism 188 Recess 189 Elevating mechanism 200 Probe positioning mechanism 201 Engagement part plane movement mechanism 210 Probe positioning engagement part 211 Engagement part elevating mechanism 226 Pedestal 250 Master part 301 Characteristic inspection device 310 Turret Table 312 Turret table Rotating shaft 315 Parts 325 Parts supply device 330 Storage box 335 First measurement area 340 First temperature control area 345 Second measurement area 350 Second temperature control area 500 Cover member 501 Rotating shaft 507 Blocking means 508 Flow path 210T Tip T Transport path

Claims

A turret type rotary transfer device that holds a plurality of parts by a plurality of component holding mechanisms and conveys the plurality of the components along a part of an annular transfer path.
A component supply area arranged in the transport path to supply the component to the component holding mechanism,
A processing device arranged in a processing area located on the downstream side of the component supply area in the transport path and performing a predetermined process on the component.
A moving mechanism provided in the processing device for moving the parts, and
A component unloading area, which is arranged on the downstream side of the processing area in the transport path and unloads the component, is provided.
The moving mechanism
A mounting plate having a mounting portion on which the parts are mounted,
A heat transfer member that transfers heat to the above-mentioned mounting plate, and
It has a rotation drive unit that integrally rotates the heat transfer member and the above-mentioned mounting plate and rotates the plate rotation axis.
A parts transfer processing device characterized by this.
The above-mentioned mounting plate is characterized in that the temperature is controlled by the heat transfer member so that the entire plate has a single temperature.
The parts transport processing apparatus according to claim 1.
A plurality of the above-mentioned mounting portions are provided, and the reference parts for the processing are arranged in a part of the mounting portions.
The parts transport processing apparatus according to claim 1 or 2.
A plurality of the reference parts are placed at equal intervals in the circumferential direction.
The parts transport processing apparatus according to claim 3.
The reference component is placed at a position close to the component to be processed.
The parts transport processing apparatus according to claim 3 or 4.
The reference part is a dedicated part.
The parts transport processing apparatus according to any one of claims 3 to 5, wherein the parts transfer processing apparatus is characterized in that.
The reference component is a component of the same type as the component.
The parts transport processing apparatus according to any one of claims 3 to 5, wherein the parts transfer processing apparatus is characterized in that.
The processing device is arranged in a measurement area on the movement path of the component by the moving mechanism, and includes a measuring unit that measures an output having a correlation with the comparison information of the component.
The measuring unit
The comparison information calculated back from the measured value of the output of the reference component is referred to as the comparison information of the component moved by the moving mechanism in close proximity to the reference component.
The parts transport processing apparatus according to any one of claims 3 to 7.
A calibration-dedicated component for calibrating the measurement probe in contact with the measurement probe of the processing apparatus is arranged on the above-mentioned mounting plate.
The parts transport processing apparatus according to any one of claims 1 to 8, wherein the parts transfer processing apparatus is characterized in that.
The processing apparatus has a measuring means capable of measuring the output characteristics of the component at positions corresponding to a plurality of pre-described portions on one pre-described plate.
The parts transport processing apparatus according to any one of claims 1 to 9, wherein the parts transfer processing apparatus is characterized in that.
A plurality of the measuring means are provided for one pre-described plate, and the characteristics of the plurality of the parts are measured at the same time in the plurality of mounting portions.
The parts transport processing apparatus according to claim 10.
A cover member that integrally covers the processing device.
The parts transport processing apparatus according to any one of claims 1 to 11.
A part of the cover member is provided so as to separate the component holding mechanism and the moving mechanism.
A part of the component holding mechanism has an opening through which the component holding mechanism can pass.
The parts transport processing apparatus according to claim 12.
A part of the cover member is configured to be openable so that a part of the processing device is exposed.
The parts transport processing apparatus according to claim 12 or 13.
Dry gas is injected into the cover member.
The parts transport processing apparatus according to any one of claims 12 to 14, wherein the component transport processing device is characterized.
The turret type rotary transfer device moves the plurality of component holding mechanisms in synchronization with each other.
The parts transport processing apparatus according to any one of claims 1 to 15, wherein the parts transfer processing apparatus is characterized in that.
A turret-type rotary transfer device that holds a plurality of parts by component holders of a plurality of component holding mechanisms and conveys the plurality of the components along a part of an annular transfer path.
A processing device arranged in a processing area in the transport path and performing a predetermined process on the component,
With
The processing device is
A mounting plate having a mounting portion on which the component transported by the component holder is mounted,
A heat transfer member that transfers heat to the above-mentioned mounting plate, and
A rotation drive unit that moves the parts by rotating the heat transfer member and the above-mentioned mounting plate together about a plate rotation axis.
It has a probe that performs the treatment on the moving part.
The component holding mechanism has a positioning means for adjusting the relative position of the component holder and the previously described placement portion and / or the relative position of the probe and the previously described placement portion of the processing device.
A parts transfer processing device characterized by this.
The positioning means has a probe positioning means for adjusting the relative position between the probe and the above-mentioned mounting portion.
The probe positioning means
An engaging part plane moving mechanism that guides the probe in the plane direction of the above-mentioned mounting plate,
The probe positioning engaging portion provided on the engaging portion plane moving mechanism side and the engaging portion
It has a probe positioning hole provided at a position corresponding to the previously described mounting portion to be processed.
The processing device adjusts the relative position of the probe and the above-described prepositioning portion by engaging the probe positioning engaging portion with the probe positioning hole prior to the process of contacting the probe with the component. The parts transport processing apparatus according to claim 17.
The component transfer processing device according to claim 18, wherein the probe positioning hole rotates together with the above-described mounting portion.
The probe positioning means
It has a plurality of the probe positioning engaging portions and a plurality of the probe positioning holes corresponding to the plurality of the probe positioning engaging portions.
The processing device simultaneously engages the plurality of probe positioning engaging portions with the plurality of probe positioning holes.
The parts transport processing apparatus according to claim 18 or 19.
The component holding mechanism has a component holder positioning means for adjusting the relative position between the component holder and the above-mentioned placing portion.
The component holder positioning means
A holder-side engaging portion plane moving mechanism that guides the component holder in the plane direction of the above-mentioned mounting plate,
The engaging portion for positioning the component holder provided on the plane moving mechanism side of the engaging portion on the holder side,
It has a component holder positioning hole provided at a position corresponding to the previously described mounting portion to be held.
The component holding mechanism engages the component holder positioning engaging portion with the component holder positioning hole prior to the operation of holding or opening the component by the component holder, thereby engaging the component holder with the component holder positioning hole. The component transfer processing apparatus according to any one of claims 17 to 19, wherein the relative position of the above-mentioned placing portion is adjusted.
Place a plurality of different types of the above-mentioned parts on one pre-described plate.
The parts transport processing apparatus according to any one of claims 17 to 21, wherein the parts transfer processing apparatus is characterized in that.
The processing is performed on the plurality of parts by the same probe.
The parts transport processing apparatus according to claim 22.