JP2000088916A - Component conveyor in and out of chamber and component tester - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component conveyor in and out of a chamber capable of effectively preventing a dew formation in an opening of the chamber in the case of receiving and delivering a component in and out of the chamber in the state that the chamber is particularly at the ambient temperature or lower (normal temperature or lower) and a component tester. SOLUTION: The component conveyor has a moving base 4 slidably passing an opening 6 provided in a chamber 300 substantially sealed therein and mounted reciprocally in and out of the chamber 300, a component container 12 provided on a surface of the base 4 and detachably mountable for the component, an outside shutter 50 provided at an outside end of the chamber of the base 4, with the base 4 passed through the opening 6, brought into contact with an outside peripheral edge of the opening 6 at a position for slidably moving to the inside of the chamber 300 to a maximum limit to seal the opening 6, and an inside shutter 52 brought into contact with the inside peripheral edge of the opening 6 at a position for slidably moving to an outside of the chamber 300 to a maximum limit to seal the opening 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component transfer device inside and outside a chamber and a component test device, and more particularly, it can effectively prevent dew condensation at a component transfer opening formed in a chamber. The present invention relates to a component transfer device inside and outside a chamber and a component test device.

[0002]

2. Description of the Related Art In the course of manufacturing semiconductor devices and the like,
A test device for testing an electronic component such as an IC chip finally manufactured is required. As one type of such a test apparatus, an apparatus for testing an IC chip under normal temperature or a temperature lower than normal temperature is known. This is because, as a characteristic of the IC chip, it is ensured that the IC chip operates well even at normal temperature or low temperature.

In such a test apparatus, the upper part of the test head is covered with a chamber, the inside is made a closed space,
The C chip is transported over the test head, where the IC
The chip is connected to the test head by pressing it, and the test is performed while keeping the inside of the chamber at a normal or low temperature within a certain temperature range. By such a test, the IC chip is successfully tested, and at least is classified into a good product and a defective product.

In the test apparatus for testing an IC chip inside the chamber as described above, an outlet opening is formed in the chamber to transfer the IC chip from the inside of the chamber to the outside of the chamber. The IC chip is moved out of the chamber. Inside the chamber, an IC chip tray holding IC chips is movably arranged,
The IC chip moves inside the chamber while being held by the tray. At the outlet of the chamber, an opening / closing mechanism such as an opening / closing shutter is provided to prevent outside air from entering the inside of the chamber from the outside and maintain the inside of the chamber at a predetermined temperature.

[0005]

However, when the open / close shutter is opened and the IC chip inside the chamber is moved from the outlet opening of the chamber to the outside of the chamber, outside air flows from the outlet opening of the chamber. When the inside of the chamber is at a low temperature, dew condensation easily occurs. If dew condensation occurs on the inner wall or tray near the outlet opening of the chamber, the dew water may adhere to the IC chip, which may cause a short circuit phenomenon of electric wiring in the test of the IC chip. For this reason, it is necessary to prevent condensation as much as possible.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described circumstances, and particularly, in a case where components are transferred inside and outside the chamber while the inside of the chamber is at or below room temperature (room temperature or lower), the opening of the chamber is required. It is an object of the present invention to provide a component transport device inside and outside a chamber and a component test device, which can effectively prevent dew condensation in a component.

[0007]

In order to achieve the above object, the present invention provides a component transfer apparatus for moving parts inside and outside a chamber, which slides through an opening provided in a substantially sealed chamber. A moving base mounted on the surface of the moving base so as to be able to reciprocate in and out of the chamber; a component accommodating portion provided on a surface of the moving base and capable of detachably mounting components; and a chamber of the moving base. Provided at the outer end,
An outer shutter that contacts the outer peripheral edge of the opening and seals the opening at a position where the moving base passes through the opening and slides to the maximum inside the chamber; and a chamber of the moving base. An inner shutter that is provided at an inner end and that abuts the inner peripheral edge of the opening at a position where the moving base passes through the opening and slides to the outside of the chamber as much as possible, and seals the opening; When,
Having.

According to the present invention, there is provided a component transfer device for mounting inside and outside a chamber, wherein a through-hole corresponding to an opening of the chamber is formed, and a resilient seal member and the movable base are maximally provided inside the chamber. An outer cushioning member that is located between the outer shutter and the seal member at a position where the outer shutter is slid and reduces a collision force of the outer shutter; Preferably, the apparatus further includes an inner cushioning member located between the inner shutter and the seal member for reducing a collision force of the inner shutter.

[0009] The component transfer device inside and outside the chamber according to the present invention further includes a frame holding the seal member, and a spring connecting the outer buffer member and the inner buffer member to the frame member. Is preferred.

[0010] It is preferable that a tapered surface is formed around the through hole of the seal member so that the outer buffer member and the inner buffer member come into contact with each other.

It is preferable that a component opening / closing shutter for opening and closing the component housing portion is slidably mounted on the surface of the movable base.

While the movable base slides to the maximum inside the chamber, the movable base engages with a member constituting an opening of the chamber and slides the component opening / closing shutter to open the component housing. It is preferable that the engaging piece is provided in the component opening / closing shutter.

It is preferable that the component transfer device inside and outside the chamber according to the present invention further include a drive mechanism connected to the outer shutter and for sliding the outer shutter together with the moving base.

Although the drive mechanism is not particularly limited, for example, a drive mechanism having a motor having a rotating drive shaft and a drive belt moving by the drive shaft is preferable. It is preferable to further include a guide rail for guiding the sliding movement of the outer shutter.

A chamber according to the present invention is a chamber having any one of the above-described component transfer devices.

A component testing apparatus according to the present invention includes the chamber, and a test head mounted inside the chamber for testing components.

In the present invention, the component is not particularly limited, but is, for example, an IC chip.

[0018]

According to the present invention, there is provided a component transfer device for inside and outside of a chamber,
For example, it is attached to a component outlet opening in a chamber of a component test apparatus. In the component transfer device and the component test device according to the present invention, when a component is transferred from the inside of the chamber to the outside, first, the moving base is slid and moved to a maximum position inside the chamber. At that position, the components in the chamber are transferred to the component storage provided in the moving base. In this state, the outer shutter provided on the moving base abuts the outer peripheral edge of the opening of the chamber, and seals the opening. Therefore, it is possible to effectively prevent the outside air from flowing from the outside of the chamber to the inside of the chamber through the opening when the parts in the chamber are transferred to the parts accommodating part provided in the moving base.

In order to move the components mounted on the component housing of the movable base to the outside of the chamber, the movable base is slid and moved to the maximum outside the chamber.
At that position, the component is transferred from the component storage to the outside of the chamber. In this state, the inner shutter provided on the moving base abuts on the inner peripheral portion of the opening of the chamber,
The opening is sealed. Therefore, even when a component is transferred from the component storage portion provided on the moving base to the outside of the chamber, it is possible to effectively prevent outside air from flowing into the chamber from the outside of the chamber through the opening.

It should be noted that the component transfer device inside and outside the chamber according to the present invention can be mounted in the component entrance opening in the chamber of the component test device. In that case, slide the moving base and move the parts from the outside of the chamber to the parts accommodating part while maximizing the position inside the chamber, and move the moving base to the maximal position inside the chamber. Then, the part is transferred from the part storage section to the inside of the chamber.

In any case, the inner shutter or the outer shutter provided in the movable base abuts on the inner peripheral edge or the outer inner peripheral edge of the opening of the chamber, and seals the opening. Therefore, in any case, it is possible to effectively prevent external air from flowing into the chamber from the outside of the chamber through the opening, and to effectively prevent dew condensation from occurring when the temperature inside the chamber is low. it can.

Even when a test is performed with the inside of the chamber at a high temperature, the component transfer device and the component test device according to the present invention can prevent the introduction of outside air from the opening when the components are transferred. The efficiency of temperature control in the chamber is improved.

Further, in the component transfer device and the component test device according to the present invention, a shutter having a conventional structure, which is conventionally required separately from the component transfer device mounted in the opening of the chamber, is not required. The component can be transported by the component transport device without waiting. Therefore, the speed of the component transfer operation is increased.

In the parts transporting apparatus and the parts testing apparatus according to the present invention, by providing the outer buffer member and the inner buffer member at the opening of the chamber, it is possible to effectively reduce the impact caused by the collision of the outer shutter or the inner shutter. it can.

In the component transport device and the component testing device according to the present invention, a component opening / closing shutter that opens and closes the component housing portion is slidably mounted on the surface of the movable base, so that the component can be moved when the movable base slides. It can be effectively prevented from dropping out of the storage section.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings. 1 to 4 are schematic perspective views of a component transfer device inside and outside a chamber according to an embodiment of the present invention. FIGS. 5A and 5B are cross-sectional views of main parts of a moving base.
FIG. 7 is an exploded perspective view of members constituting the opening of the chamber, FIG.
8 is a sectional view of a main part of a member constituting an opening of a chamber, FIG. 9 is an overall perspective view of an IC chip component test apparatus according to an embodiment of the present invention, and FIG. 10 is a test using the test apparatus shown in FIG. FIG. 11 is a schematic diagram illustrating a transfer path of an IC chip to be performed, FIG. 11 is a schematic diagram schematically illustrating an IC chip transfer device for realizing a flow of the IC chip in the test apparatus, and FIG. FIG. 3 is a schematic diagram showing a transfer path of an IC chip tray in FIG.

[ First Embodiment] As shown in FIGS. 1 and 2, a chamber wall 301 of a chamber 300 according to one embodiment of the present invention is provided with two component transfer devices 2 according to one embodiment of the present invention. Is installed. FIGS. 3 and 4 show only a single component transport device 2 for ease of illustration. In FIGS. 1 to 4, only a cut-out part of the chamber wall 301 of the chamber 300 is shown, but in practice, except for the opening 8 formed in the opening forming unit 8, The inside of the chamber 300 is stretched to hermetically seal. FIG. 1 is a perspective view of the two component transfer devices 2 as viewed from the inside of the chamber 300, and FIG. 2 is a perspective view of the two component transfer devices 2 as viewed from the outside of the chamber 300. FIG. 3 is a perspective view of the single component transfer device 2 viewed from the outside of the chamber 300, and FIG.
FIG. 2 is a perspective view of a single component transport device 2 as viewed from the inside of FIG.

As shown in FIGS. 1-4, the chamber 300
The moving base 4 is mounted on the opening 6 of the opening constituting unit 8 attached to the chamber wall 301 so as to be able to reciprocate inside and outside the chamber 300. As shown in FIGS. 5 (A) and 5 (B), a concave portion 9 is formed in the movable base 4 and a plurality of concave component housing portions 12 are formed inside the movable base 4 at substantially equal intervals along the longitudinal direction. The component storage block 10 is fixed. The surface of the component housing block 10 is substantially flush with the surface of the movable base 4. In the present invention, the component accommodating portion 12 may be formed directly on the movable base 4. However, in order to easily cope with a case where the size, shape or number of components to be conveyed is changed, the component accommodating block 12 is required. It is preferable that 10 can be exchanged with respect to the movable base 4.

A component opening / closing shutter 14 is mounted on the component housing block 10 in which the component housing portion 12 is formed so as to be slidable along the longitudinal direction. The part opening / closing shutter 14 has the shutter 14 shown in FIG.
At the slide position shown in FIG. 4, a plurality of through holes 16 communicating with the respective component housing portions 12 and opening the respective component housing portions 12 are formed along the longitudinal direction. As shown in FIG. 5A, the component opening / closing shutter 14 closes each component housing 12 in the normal sliding position, and the IC chip as a component housed inside each component housing 12 does not fall off. It has become.

As shown in FIGS. 1 to 4, a plurality of guide pulleys 18 are fixed to the component housing block 10 for guiding the sliding movement of the component opening / closing shutter 14, and these guide pulleys 18 are shutters. 14 is rotatably engaged with the edge of the through hole 16. The longitudinal width of the through hole 16 with which the guide pulley 18 is engaged along the shutter 14 limits the movement width of the shutter 14 in the longitudinal sliding movement. As shown in FIGS.
At one end in the longitudinal direction (outside of the chamber 300), an engagement piece 20 for sliding the component opening / closing shutter 14 to open the component housing 12 is integrally formed. Engagement piece 2
0 is formed by, for example, bending a longitudinal end portion of a plate material constituting the shutter 14 upward substantially at a right angle.

Each opening constituting unit 8 shown in FIGS.
As shown in FIG. 6 to FIG. 8, a substantially rectangular through-hole serving as the substantial opening 6 of the chamber 300 has a resilient seal member 30 formed substantially in the center. The seal member 30 is made of, for example, elastic rubber such as sponge rubber or synthetic resin. The seal member 30 has a substantially rectangular plate shape, and raised portions 31a and 31b surrounding the periphery of the opening 6 are integrally formed on both surfaces thereof. On the inner peripheral side of each of the raised portions 31a and 31b, tapered surfaces 40a and 40 of which the inner diameter decreases toward the opening 6 are formed.
b is formed.

Frames 32a and 32b for holding the seal member 30 from both sides are mounted on the outer peripheral side of the raised portions 31a and 31b formed on both surfaces of the seal member 30. These frames 32a and 32b are made of, for example, a synthetic resin such as FRP having excellent heat insulating properties and mechanical strength. The entire shape of each of the frame bodies 32a and 32b is substantially rectangular, and openings 33a and 33b are formed at substantially the center. These openings 33a and 3
The raised portions 31a and 31b of the seal member 30 are fitted into 3b. As shown in FIG. 7 and FIG.
a and 32b are fixedly attached to the chamber wall 301 of the chamber 300. The chamber wall 301 is preferably made of a wall material having a heat insulating material in order to seal the inside of the chamber 300 and to insulate it from the outside.

As shown in FIG. 6 to FIG.
a outside buffer member 34 having a substantially rectangular shape
a is mounted so as to be able to contact and retreat with a spring 36 and a fixture 38. The attachment 38 is for attaching the outer buffer member 34a to the frame 32a so as to be movable within a predetermined range, and the spring 36 is in a state where no external force acts on the outer buffer member 34a.
The outer cushioning member 34a is pressed in a direction in which the outer cushioning member 34a is separated from the frame 32a, and the state shown in FIG. 7 is maintained.

Inside the chamber of the other frame 32b, a substantially rectangular inner cushioning member 34b is mounted using a spring 36 and a fixture 38 so as to be able to contact and separate from each other. The attachment 38 is for attaching the inner cushioning member 34b to the frame 32b so as to be movable within a predetermined range, and the spring 36 is adapted to be attached to the inner cushioning member 34b in a state where no external force acts on the inner cushioning member 34b. The member 34b is pressed in a direction to pull it away from the frame 32b, and the state shown in FIG. 8 is maintained.

The cushioning members 34a and 34b have openings 46a and 46b, respectively. Outer cushioning member 3
The opening 46a of the inner cushioning member 34b is
As shown in FIG. 8, the engaging piece 20 of the component opening / closing shutter 14 is configured so as to pass through the opening 46a but not through the opening 46b.
The opening 46b is large enough to allow the movement base 4 and the component opening / closing shutter 14 to pass therethrough, and the engaging piece 20 can be engaged with the inner surface of the inner buffer member 34b. These cushioning members 34a and 34b are
It is made of the same synthetic resin as that of 2b.

As shown in FIG. 6 to FIG.
a and 34b have openings 46a and 46b, respectively.
Protrusions 45a and 45b are integrally formed along the periphery of b. Tapered surfaces 42a and 42b are formed on the outer periphery of these raised portions 45a and 45b, and these tapered surfaces 42a and 42b can be pressed against the tapered surfaces 40a and 40b of the seal member 30, respectively.

The outer surfaces of the cushioning members 34a and 34b are counterbored along the peripheries of the openings 46a and 46b.
4b is fixed. These packings 44a and 44
b is made of an elastic member such as sponge rubber. These packings 44a and 44b have the structure shown in FIG.
As shown in FIG. 8 and FIG. 8, an outer shutter 50 and an inner shutter 52, which will be described later, can come into contact with each other.

Although omitted in FIGS. 7 and 8, FIG.
As shown in the figure, a guide base 48 for guiding the sliding movement of the moving base 4 is fixed to the lower side of the frame 32b inside the chamber by bolts 49 or the like. Information base 48
Is located further inside the chamber than the inner cushioning member 34b, below the opening 46b, and is fixed to the frame 32b.

As shown in FIGS. 1 to 4 and FIG. 8, an outer shutter 50 is fixed to the outer end of the chamber of the movable base 4 and is slidable together with the movable base 4. As shown in FIGS. 1 to 4 and 7, an inner shutter 52 is fixed to the inner end of the movable base 4 inside the chamber, and is slidable together with the movable base 4.

The inner shutter 52 includes an inner buffer member 34b.
The sliding position of the moving base 4 shown in FIG. 7 (the position at which the moving base 4 passes through the opening 6 and slides to the maximum outside the chamber 300) has a larger cross-sectional area than the opening 46b of FIG. The opening 4 contacts the packing 44b.
Seal 6b. In this state, the inner cushioning member 3
4b corresponds to the sliding movement of the inner shutter 52,
The spring 36 shown in FIG. 6 moves toward the seal member 30 against the elastic force of the spring 36, and the tapered surface 42b is pressed against the tapered surface 40b. As a result, the opening 6 is closed by the inner shutter 52 and the inner cushioning member 34b in a favorable sealed state. The moving base 4 passes through the opening 6 and the chamber 30
When the inner shutter 52 collides with the inner cushioning member 34b when sliding to the maximum outside of 0, the spring 36 shown in FIG. 6 can favorably reduce the impact.

As shown in FIG. 4, a plurality of rollers 54 are rotatably mounted below the inner shutter 52.
The movable base 4 is positioned on the guide base 48 with the movable base 4 slidably moved to the outside of the chamber 300. As a result, the movable base 4 is held at both ends, the holding is stabilized, and the movable base 4 is easily moved next time when the movable base 4 slides.

The outer shutter 50 is, as shown in FIG.
For example, the movable base 4 includes a first block 56 and a second block 58, which are integrated by bolts or the like.
Is fixed to the outer end of the chamber. The outer shutter 50 including the first block 56 and the second block 58 has a larger cross-sectional area than the opening 46a of the outer buffer member 34a, and slides the moving base 4 shown in FIG. 6 and slides to the maximum inside of the chamber 300), and abuts the packing 44a to seal the opening 46a. In this state, the outer cushioning member 34a moves toward the seal member 30 against the elastic force of the spring 36 shown in FIG.
Presses against the tapered surface 40a. As a result, the opening 6
The outer shutter 52 and the outer cushioning member 34a are closed in a good sealed state. When the moving base 4 passes through the opening 6 and slides to the maximum inside the chamber 300, the spring 36 shown in FIG. Can be eased.

As shown in FIG. 8, when the movable base 4 passes through the opening 6 and slides to the maximum inside the chamber 300, the movable base 4 is slidably mounted on the surface of the movable base 4. Engagement piece 2 of a certain part opening / closing shutter 14
0 cannot pass through the opening 46b of the inner buffer member 34b. As a result, the engagement piece 20 engages with the inner buffer member 34b, and the component opening / closing shutter 14 slides relative to the moving base 4 and moves as shown in FIG. Open all the component accommodating portions 12 provided on the base 4.

As described above, the movable base 4 is moved to the chamber 300.
The component opening / closing shutter 14 slides only by sliding the component opening / closing part, and the component housing 12 is completely opened. Therefore, a separate driving mechanism for opening the component opening / closing shutter 14 is not required, and the mechanism can be simplified. In addition, the operation also becomes faster. As shown in FIG. 5 (B), in a state where the component accommodating portions 12 are all opened by the component opening / closing shutter 14, the tested I
The C chip is transferred by a component suction device (not shown).

Thereafter, when the moving base 4 is moved from the sliding position shown in FIG. 8 to the sliding position shown in FIG. 7, no external force acts on the component opening / closing shutter 14, so that a spring (not shown) is used. The part opening / closing shutter 14 is moved from the state shown in FIG.
The state returns to the state shown in FIG. As a result, while the moving base 4 is moving, as shown in FIG.
The shutter 14 is closed, and there is no possibility that the IC chip housed inside each of the component housing sections 12 will fall off.

Next, a mechanism for sliding the movable base 4 will be described. As shown in FIGS. 1 to 4 and 8, a linear bearing 60 is fixed below the second block 58 of the outer shutter 50, and the linear bearing 60 reciprocates in a linear direction along a guide rail 62. It is movable. The guide rail 62 is fixed on a fixed base 61 of the transport device 2 as shown in FIGS. An electric motor 70 is mounted below one end of the fixed base 61 in the longitudinal direction.

The inner circumference of one end of a ring-shaped drive belt 66 is wound around the rotary drive shaft 68 of the electric motor 70 by about half. A free roller 74 is rotatably mounted below the other end of the fixed base 61 in the longitudinal direction, and the inner circumference of the other end of the drive belt 66 is wound around the free roller 74 by about a half turn. In addition, another free roller 72 is rotatably arranged near the rotary drive shaft 68, and comes into contact with the belt 66 from outside the drive belt 66,
The belt 66 has a tension. Therefore, when the rotation drive shaft 68 is rotated by the motor 70, the drive belt 6
6 also moves along the ring-shaped longitudinal direction.

The lower end of the connection block 64 is attached and fixed to a part of the drive belt 66. When the drive belt 66 moves along the longitudinal direction of the ring, the connection block 64 is also moved to the fixed base 61 at the same time. It is movable along the longitudinal direction. The upper end of the connection block 64 is attached and fixed to the second block 58 of the outer shutter 50 with a bolt or the like. When the connection block 64 moves, the outer shutter 50 can simultaneously move linearly along the guide rail 62. It has become.

The rotary drive shaft 68 of the electric motor 70 can be rotated in both forward and reverse directions by the performance of the motor itself or by combining a gear mechanism with the rotary shaft of the motor. It is measured and controlled by an encoder. Alternatively, the position of the outer shutter 50 including the connection block 64 is detected by a position sensor or the like, and the rotation of the rotary drive shaft 68 is controlled so as to stop at a predetermined position. Not only the position of the outer shutter 50 but also the slide position of the movable base 4 may be detected by a position sensor, and the rotation of the rotary drive shaft 68 may be controlled according to the position signal.

For example, the state shown in FIG. 3 shows a state where the rotation of the rotary drive shaft 68 of the electric motor 70 is stopped while the connecting block 64 has moved to the position closest to the motor 70. In that state, the outer shutter 50 is
0, which is furthest from the opening 6 of FIG.
An inner shutter 52 fixed to the moving base 4 closes the opening 6. 1 and 2, the connecting block 64 includes the chamber 30.
The figure shows a state in which the rotation of the rotary drive shaft 68 of the electric motor 70 is stopped in a state in which the rotary drive shaft 68 of the electric motor 70 has moved to the position closest to the opening 6 of the zero.
In this state, as shown in FIG. 8, the outer shutter 50 fixed to the movable base 4 closes the opening 6.
As best shown in FIG. 3, in order to limit the linear reciprocation of the outer shutter 50 along the guide rail 62 within a predetermined range, a stopper is provided on the fixed base 61 near both ends of the guide rail 62. The members 80 are respectively fixedly mounted.

In the chamber 300 using the component transfer device 2 according to the present embodiment, when the IC chip is transferred from the inside of the chamber 300 to the outside, first, the rotation drive shaft 68 is moved by the motor 70 shown in FIGS. Rotate and move base 5
0 is slid along the guide rail 62. At the same time, the moving base 4 also slides, and the moving base 4 is positioned at the maximum inside the chamber 300 like the component transporting device 2 on the near side in FIGS. At that position, as shown in FIG. 8, the engaging piece 20 of the component opening / closing shutter 14 is caught by the inner buffer member 34b, and the component opening / closing shutter 14 slides relative to the moving base 4, and as shown in FIG. As shown in ()), the component storage unit 12 is opened.

In this state, the IC chip in the chamber 300 is transferred to each component accommodating section 12. In this state, as shown in FIG. 8, the outer shutter 50 provided on the movable base 4 closes and seals the opening 6 of the chamber 300. Therefore, when transferring the components in the chamber 300 to the component storage unit 12 provided in the moving base 4,
External air can be effectively prevented from flowing into the chamber from the outside of the chamber through the opening 6.

In order to move the IC chip placed on the component accommodating portion 12 of the moving base 4 to the outside of the chamber 300, the motor 70 shown in FIGS.
Is rotated in the opposite direction, and the outer shutter 50 is
2 along the direction away from the opening 6. At the same time, the moving base 4 also slides and is positioned at the maximum outside the chamber 300 as shown in FIGS. During the movement, the part opening / closing shutter 14 returns from the state shown in FIG. 5B to the state shown in FIG. 5A by a spring (not shown). As a result, while the moving base 4 is moving, as shown in FIG. 5A, the shutters 14 are closed for the respective component accommodating portions 12, and the IC chips accommodated in the respective component accommodating portions 12 are removed. There is no risk of dropping.

At the sliding position of the movable base 4 shown in FIGS. 3 and 4, the component opening / closing shutter 14 is slid with respect to the movable base 4 by a component opening / closing shutter driving mechanism (not shown). As shown in ()), all the component housings 12 are opened. In this state, the IC chip is transferred from the component accommodating section 12 to the outside of the chamber using a suction device or the like (not shown). In this state, as shown in FIG.
2 closes and seals the opening 6 of the chamber 300.
Therefore, the component housing 1 provided in the moving base 4
When transferring IC chips from 2 to the outside of the chamber,
External air can be effectively prevented from flowing into the chamber from the outside of the chamber through the opening 6.

As described above, the inner shutter 50 or the outer shutter 52 provided on the movable base 4 closes and seals the opening 6 of the chamber. Therefore, the opening 6
It is possible to effectively prevent external air from flowing into the chamber from the outside through the chamber, and to effectively prevent dew condensation from occurring when the temperature inside the chamber is low.

Even when a test is performed with the inside of the chamber at a high temperature, in the chamber 300 equipped with the component transfer device 2 according to the present embodiment, introduction of outside air from the opening 6 is required when transferring components. Chamber 300
The efficiency of temperature control in the inside is improved.

Further, in the chamber 300 provided with the component transfer device 2 according to the present embodiment, a shutter having a conventional structure, which is conventionally required separately from the component transfer device 2 mounted in the opening 6 of the chamber 300, becomes unnecessary. In addition, the IC chip can be transferred by the component transfer device 2 without waiting for opening and closing of the conventional shutter. Therefore, the operation of transporting the IC chip to the outside of the chamber becomes faster.

[ Second Embodiment] In the present embodiment, the two component transfer devices 2 according to the first embodiment are
The IC chip component testing apparatus 1 used for the IC chip exit opening of No. 0 will be described.

The IC test apparatus 1 according to the present embodiment shown in FIG. 9 tests whether an IC chip as an electronic component to be tested operates properly under high or low temperature stress. (Inspection), and classifies IC chips according to the test results. The operation test under such a temperature stress is performed by replacing the IC chip under test with an IC carrier carried in the IC test apparatus 1 from a customer tray on which a large number of IC chips under test are mounted. Will be implemented.

For this reason, the IC test apparatus 1 of the present embodiment
As shown in FIG. 9 and FIG. 10, an IC storage unit 100 for storing an IC chip to be tested from now on, and for classifying and storing tested IC chips, Test IC chip in chamber 300
200, a chamber 300 including a test head, and an unloader 400 for classifying and extracting tested IC chips tested in the chamber 300
It is composed of

[0061] The IC magazine 100 IC storage section 100, test IC for storing a pre-test IC stocker 101 for storing the IC chip before the test, the tested IC chips classified according to the result of the test A stocker 102 is provided.

The pre-test IC stocker 101 includes:
While the customer trays storing the IC chips to be tested to be tested are stacked and held, the tested IC stocker 102 has a customer tray in which the IC chips to be tested are appropriately classified. Laminated and held.

Since the pre-test IC stocker 101 and the tested IC stocker 102 have the same structure, the pre-test IC stocker 101 and the tested IC stocker 1 have the same structure.
02 can be set to an appropriate number as needed.

In the example shown in FIGS. 9 and 10, one stocker LD is provided in the pre-test stocker 101, and one empty stocker EMP sent to the unloader unit 400 is provided next to the stocker LD.
In addition, the tested IC stocker 102 is provided with five stockers UL1, UL2,..., UL5 so that the stockers can be sorted into up to five categories according to the test results and stored. In other words, besides the non-defective products and the defective products, the non-defective products are classified into those having a high operation speed, medium-speed ones, low-speed ones, and some of the defective ones requiring retesting.

Loader 200 The above-described customer tray is placed on the window 202 of the loader 200 by a tray transfer arm (not shown) provided between the IC storage unit 100 and the device board 201.
01 is carried from below. Then, the loader unit 200
In the above, the IC chips to be tested loaded on the customer tray are temporarily transferred to the pitch conversion stage 203 by the first transfer device 204 (see FIG. 11), where the mutual positions of the IC chips to be tested are corrected, and After changing the pitch, the IC chip under test transferred to the pitch conversion stage 203 is further stopped at the position CR1 in the chamber 300 (see FIGS. 10 and 12) using the second transfer device 205. To the IC carrier 110 according to the present embodiment. At that time, the shutter at the entrance 303 of the chamber 300 shown in FIG. 9 is open.

The pitch conversion stage 203 provided on the apparatus substrate 201 between the window 202 and the chamber 300 shown in FIGS. 9 to 11 has a relatively deep concave portion, and the peripheral edge of the concave portion is inclined. I with a shape surrounded by
This is a means for correcting the position of the C chip and changing the pitch. When the IC chip to be tested sucked by the first transfer device 204 is dropped into the concave portion, the drop position of the IC chip to be tested is corrected on the inclined surface. Become. Thereby, for example, the mutual positions of the four IC chips to be tested are accurately determined, and even if the mounting pitch between the customer tray and the IC carrier in the chamber is different, the IC chips to be tested whose positions have been corrected and the pitches thereof have been changed. The IC chip to be tested can be accurately transferred to the IC accommodating recess formed in the IC carrier 110 in the chamber by being sucked by the second transfer device 205 and transferred to the IC carrier 110 in the chamber.

As shown in FIG. 11, the first transfer device 204 for transferring the IC chips under test from the customer tray to the pitch conversion stage 203 is provided on the device substrate 20.
1 and a rail 204a erected above the
A movable arm 204b capable of reciprocating between the customer tray and the pitch conversion stage 203 (this direction is defined as a Y direction) by 04a, supported by the movable arm 204b, and extending in the X direction along the movable arm 204b. And a movable head 204c that can move.

The movable head 2 of the first transfer device 204
The suction head 204d is mounted downward on the head 04c. The suction head 204d moves while sucking air to suck the IC chip under test from the customer tray, and the IC chip under test is pitch-converted. Drop it into the stage 203. Such a suction head 20
4d is mounted on the movable head 204c, for example, about four, so that four IC chips under test can be dropped into the pitch conversion stage 203 at a time.

On the other hand, the pitch conversion stage 20
The second transfer device 205 for transferring the IC chips to be tested from the IC carrier 3 to the IC carrier in the chamber 300 also has the same configuration, and as shown in FIGS.
And a rail 205a erected above the
5a, pitch conversion stage 203 and I
Movable arm 2 that can reciprocate between C carrier
05b, supported by the movable arm 205b,
A movable head 205c that can move in the X direction along the movable arm 205b.

The movable head 2 of the second transfer device 205
A suction head 205d is mounted downward on the head 05c. The suction head 205d moves while sucking air to suck the IC chip under test from the pitch conversion stage 203, and
The IC chip under test is transferred to the in-chamber IC carrier 110 via 3. Such a suction head 205
For example, d is mounted on the movable head 205c, for example, about four, and can transfer four IC chips to be tested to the IC carrier at a time.

The chamber 300 according to the present embodiment has an IC at a position CR1.
The test head 302 is provided with a constant temperature function of applying a target high-temperature or low-temperature stress to the IC chip under test loaded on the carrier 110. The contact portion 302a (see FIGS. 10 and 12) is brought into contact.

In the IC test apparatus 1 of this embodiment, when a low-temperature stress is applied to the IC chip under test, the heat is removed by a hot plate 401 described later, but the high-temperature stress is applied to the IC chip under test. , Heat is removed by natural heat radiation. However, if a separate heat removal tank or heat removal zone is provided and the high temperature is applied, the IC chip under test is cooled by blowing air to return to room temperature, and if the low temperature is applied, the IC chip under test is heated or cooled. The temperature may be returned to a temperature at which dew condensation does not occur by heating with a heater or the like.

A test head 302 having a contact portion 302a shown in FIG. 10 is provided on the lower side of the center of the chamber 300.
A rest position CR5 of the carrier 110 is provided. Then, the IC chip under test placed on the IC carrier carried to the position CR5 is directly carried onto the test head 302 by the third carrying device 304 shown in FIG. The test is performed by making electrical contact with 302a.

The IC chip to be tested after the test is not returned to the IC carrier 110, but slides into the chamber 300 to the position EXT1 shown in FIG. It is replaced in the component storage unit 12. Thereafter, the movement base 4 is carried out to the slide position EXT2 outside the chamber 300 by the movement described in the description of the component transfer device 2 according to the first embodiment. At the position EXT2, the IC chip is taken out of the movable base 4 and when a high temperature stress is applied to the IC chip inside the chamber 300, the chamber 30
After being carried out from zero, the heat is naturally removed.

FIG. 12 shows an IC in the chamber 300.
3 shows a three-dimensional flow of the carrier 110.
As shown in FIG. 12, inside the chamber 300, two sets of IC carriers 110 circulate from the position CR1 to the position CR6, respectively, and return to the position CR1.

The I transported from the position CR1 to the position CR2
The C carrier 110 is conveyed in a state of being stacked in multiple stages downward in the vertical direction. After waiting until the IC carrier at the position CR5 becomes empty, the C carrier 110 is moved from the lowest position CR3 to a position substantially at the same level as the test head 302. It is transported to CR4. Mainly during this transportation, a high or low temperature stress is applied to the IC under test.

Further, the test head 30 is moved from the position CR4.
The wafer is conveyed toward the horizontal position CR5 toward the second side, where only the IC under test is sent to the contact portion 302a of the test head 302. The IC under test has a contact portion 302
a after the IC carrier 110 is sent to the position C
After being transported from R5 to the horizontal position CR6, it is transported vertically upward and returns to the original position CR1.

As described above, since the IC carrier 110 is circulated and conveyed only in the chamber section 300, once the temperature is raised or lowered, the temperature of the IC carrier itself is maintained as it is. The thermal efficiency at 300 will be improved.

The test head 3 of this embodiment shown in FIG.
02, eight contact portions 302a are provided at a constant pitch, and suction heads of the contact arms are also provided at the same pitch. Also, the IC carrier 110
Is designed to accommodate 16 IC chips under test at a predetermined pitch.

The IC chips to be tested which are connected to the test head 302 at one time are, for example, IC chips to be tested arranged in one row × 16 columns, and the IC chips to be tested are arranged every other column.
C chip.

That is, in the first test, 1, 3, 5,
The eight IC chips under test arranged in rows 7, 9, 11, 13, and 15 are connected to the contact portions 302 of the test head 302.
a, and in the second test, the IC carrier was moved by one row pitch to obtain 2, 4, 6, 8, 1
The IC chips under test arranged in rows 0, 12, 14, and 16 are similarly tested. Therefore, although not shown, the IC transported to the position CR5 on both sides of the test head 302
A moving device for moving the carrier 110 by a predetermined pitch in the longitudinal direction is provided.

Incidentally, the result of this test is stored in an address determined by, for example, the identification number given to the IC carrier and the number of the IC chip under test allocated inside the IC carrier.

In the IC test apparatus 1 of this embodiment, the IC under test is applied to the contact portion 302a of the test head 302.
A third transfer device 304 shown in FIG. 11 is provided in the vicinity of the test head 302 in order to transfer a chip and perform a test. The third transport device 304 includes a rail 304a provided along the stationary position CR5 of the IC carrier and the extending direction (Y direction) of the test head 302, and the stationary position of the test head 302 and the IC carrier by the rail 304a. A movable head 304b capable of reciprocating with the CR5 and a suction head provided downward on the movable head 304b are provided. The suction head is configured to be movable in the vertical direction by a driving device (for example, a fluid pressure cylinder) not shown.
By moving the suction head up and down, the IC chip under test can be sucked and the IC chip under test can be pressed against the contact portion 302a (see FIG. 11).

In the third transfer device 304 of the present embodiment,
Two movable heads 304b are provided on one rail 304a, and the distance between them is the distance between the test head 302 and the IC.
It is set equal to the interval between the carrier and the stationary position CR5. The two movable heads 304b are simultaneously moved in the Y direction by one drive source (for example, a ball screw device), while the respective suction heads 304b are moved.
c is moved vertically by independent driving devices.

As described above, each suction head 3
04c is capable of adsorbing and holding eight IC chips under test at a time, and the interval between them is set equal to the interval between the contact portions 302a. This third transfer device 30
Details of the operation 4 are omitted.

Unloader 400 The unloader 400 is provided with two component transfer devices 2 for dispensing the tested IC chips from the chamber 300. As shown in FIGS. 10 and 11, the movable base 4 of the component transport device 2 can reciprocate in the X direction between a position EXT1 on each side of the test head 302 and a position EXT2 of the unloader unit 400. Is configured. At positions EXT1 on both sides of the test head 302, in order to avoid interference with the IC carrier, the EXT comes and goes slightly above the stationary position CR5 of the IC carrier and slightly below the suction head of the third transfer device 304. I do.

The specific structure of these two component transport devices 2 is the same as that of the component transport device 2 shown in FIGS. As shown in FIG. 1 and FIG.
While moving to the position EXT1 of 0, the other performs an almost symmetric operation such as moving to the position EXT2 of the unloader unit 400.

A hot plate 401 is provided near the position EXT2 outside the chamber of the moving base 4 of the component transfer device 2. The hot plate 401
When a low temperature stress is applied to the C chip, the C chip is heated to a temperature at which dew condensation does not occur. Therefore, when a high temperature stress is applied, the hot plate 401 does not need to be used. .

The hot plate 401 of the present embodiment has a capacity of 2 columns × 16 rows, 32 times, corresponding to the fact that the suction head 404c of the fourth transfer device 404 described later can hold eight IC chips under test at a time. A plurality of IC chips to be tested can be accommodated. And the fourth transport device 4
The hot plate 401 is divided into four regions corresponding to the suction heads 404c of No. 04, and eight tested I suction-held from the component housing portion 12 of the moving base 4 at the position EXT2.
C chips are sequentially placed in those areas, and the eight IC chips under test heated the longest are placed in the suction head 404c.
And is transferred to the buffer unit 402 as it is.

In the vicinity of the hot plate 401, two buffer units 402 each having a lifting table are provided. The lifting table of each buffer unit 402 includes the moving base 4 and the hot plate 40 at the position EXT2.
1 is moved in the Z direction between the same level position (Z direction) and a level position above it, specifically, the level position of the device substrate 201. Although the specific structure of the buffer unit 402 is not particularly limited, for example, the IC carrier 110
Like the moving base 4, the plate can be configured with a plurality of (here, eight) concave portions capable of accommodating the IC chip under test.

The pair of lifting tables constituting the buffer section 402 perform substantially symmetrical operations such that while one is stationary at the ascending position, the other is stationary at the descending position.

The unloader section 400 in the range from the moving base 4 at the position EXT2 to the buffer section 402 has the fourth
Of the transfer device 404 (see FIG. 11). As shown in FIGS. 9 and 11, the fourth transfer device 404 includes a rail 404
a movable arm 4 that can move in the Y direction between the position EXT2 and the buffer unit 402 by the rail 404a.
04b and supported by the movable arm 404b,
A suction head 404c that can move up and down in the Z direction with respect to the movable arm 404b. The suction head 404c moves in the Z direction and the Y direction while sucking air, so that the test is performed from the moving base 4 at the position EXT2. The IC chip is sucked, the IC chip under test is dropped on the hot plate 401, and the IC chip under test is sucked from the hot plate 401 to drop the IC chip under test into the buffer unit 402. The eight suction heads 404c of this embodiment are mounted on the movable arm 404b, and can transfer eight IC chips under test at a time.

Incidentally, the movable arm 404b and the suction head 404c are set at positions where they can pass through the level position between the raised position and the lowered position of the buffer unit 402, whereby one buffer unit 402 is moved to the raised position. Even if there is no interference, the other buffer unit 402
The IC chip under test can be transferred to the IC chip.

Further, a fifth transfer device 406 and a sixth transfer device 407 are provided in the unloader section 400, and the test pieces transferred to the buffer section 402 by the fifth and sixth transfer apparatuses 406 and 407 are provided. The IC chips to be tested are reloaded on the customer tray.

For this reason, the apparatus board 201 is provided with a window for arranging an empty customer tray carried from the empty stocker EMP (see FIG. 10) of the IC storage unit 100 so as to face the upper surface of the apparatus board 201. 403 are opened for convenience.

The fifth transfer device 406 is similar to that shown in FIGS.
As shown in FIG. 1, a rail 406a provided on the upper portion of the device substrate 201, a movable arm 406b capable of moving in the Y direction between the buffer section 402 and the window section 403 by the rail 406a, and supported by the movable arm 406b The movable head 406c includes a movable head 406c that can move in the X direction with respect to the movable arm 406b, and a suction head 406d that is attached downward to the movable head 406c and that can move up and down in the Z direction. Then, the suction head 40
6d moves in the X, Y, and Z directions while sucking air, thereby sucking the IC chip under test from the buffer unit 402 and transferring the IC chip under test to the customer tray of the corresponding category. Suction head 406 of the present embodiment
Two d are mounted on the movable head 406c and can transfer two IC chips under test at a time.

The fifth transfer device 406 of this embodiment
The movable arm 406b is formed to be short so that the IC chip under test is transferred only to the customer tray set in the two rightmost windows 403. It is effective to set a customer tray of a category with a high category.

On the other hand, the sixth transfer device 406
As shown in FIGS. 9 and 11, two rails 407a, 407a provided on the upper portion of the device substrate 201, and the rails 407a, 407a can move between the buffer section 402 and the window section 403 in the Y direction. Movable arm 40
7b, a movable head 407c supported by the movable arm 407b and movable in the X direction with respect to the movable arm 407b, and a suction head 407d attached downward to the movable head 407c and movable vertically in the Z direction. . Then, the suction head 407d moves in the X, Y and Z directions while sucking air,
The IC chip under test is sucked from the buffer unit 402, and the IC chip under test is transferred to a customer tray of a corresponding category. Two suction heads 407d of this embodiment are mounted on the movable head 407c, and can transfer two IC chips under test at a time.

While the above-described fifth transfer device 406 transfers the IC chip under test only to the customer tray set in the two rightmost windows 403, the sixth transfer device 407 has all the windows. The IC chip under test can be transferred to the customer tray set in the unit 403. Therefore, the IC under test in the category that frequently occurs
The chips are transferred to the fifth transfer device 406 and the sixth transfer device 40
7 and the IC chips under test in the category of low occurrence frequency can be classified only by the sixth transfer device 407.

The two transfer devices 406 and 407
9 and 11, these rails 406a and 407a are provided at different heights so that the suction heads 406d and 407d do not interfere with each other even if the two suction heads 406d and 407d operate simultaneously. It is configured to hardly interfere. In this embodiment,
The fifth transfer device 406 is provided at a position lower than the sixth transfer device 407.

Incidentally, although not shown, a lifting table for raising and lowering the customer tray is provided below the device substrate 201 of each window 403.
A customer tray filled with the tested IC chips to be tested is loaded and lowered, and the full tray is transferred to a tray transfer arm, and the corresponding stocker UL1 to UL of the IC storage unit 100 is transferred by the tray transfer arm.
5 (see FIG. 10). Further, the empty customer tray is delivered from the empty stocker EMP by the tray transfer arm to the empty window portion 403 where the customer tray has been paid out, and is set on the window portion 403 after being replaced on the elevating table.

One buffer section 402 of the present embodiment can store 16 IC chips under test, and stores the category of the IC chip under test stored in each IC chip storage position of the buffer section 402. A memory is provided.

The category and position of the IC chip under test deposited in the buffer unit 402 are stored for each IC chip under test, and the category and position of the IC chip deposited under the buffer unit 402 belong to the category. The customer tray is called from the IC storage unit 100 (UL1 to UL5), and the above-described third and sixth transfer devices 406 and 407 are called.
Then, the tested IC chip is stored in the corresponding customer tray.

Since the IC chip component testing apparatus 1 according to the present embodiment has the chamber 300 according to the first embodiment, the inside of the chamber 300 is particularly subjected to the IC chip at a temperature equal to or lower than normal temperature (normal temperature or lower). When the test is performed, dew condensation at the IC chip outlet opening 6 of the chamber 300 can be effectively prevented. Also, chamber 3
The transfer speed for discharging the IC chip from the inside of the chamber to the outside of the chamber can be improved. Further, according to the IC chip component testing apparatus according to the present embodiment, the chamber 3
Even when the inside of 00 is heated to a high temperature, the introduction of outside air from the outlet opening of the chamber 300 can be prevented as much as possible, so that the efficiency of controlling the temperature inside the chamber 300 is improved.

Other Embodiments The present invention is not limited to the above-described embodiments, and can be variously modified within the scope of the present invention. For example, in the embodiment described above, the chamber 300
Although the component transfer device according to the present invention is mounted on the IC chip outlet opening of the first embodiment, the component transfer device according to the present invention may be mounted on the IC chip inlet opening of the chamber 300. However, in that case, the moving base 4 is
It is necessary to transfer the IC chip to the IC carrier 110 inside the device.

In the above-described embodiment, an IC chip is used as a component. However, a component handled by the component transport device and the component test device according to the present invention is not particularly limited to an IC chip.

[0107]

As described above, according to the component transfer device and the component test device inside and outside the chamber according to the present invention, even when the inside of the chamber is particularly at room temperature or lower (room temperature or lower). Dew condensation at the opening of the chamber can be effectively prevented. In addition, it is possible to improve the transfer speed of components inside and outside the chamber. further,
ADVANTAGE OF THE INVENTION According to the component conveyance apparatus inside and outside a chamber and the component test apparatus which concern on this invention, even when making the inside of a chamber high temperature, the efficiency of internal temperature control of a chamber improves.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a component transfer device inside and outside a chamber according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view of the two component conveying devices shown in FIG. 1 as viewed from another angle.

FIG. 3 is a perspective view of one of the two component conveying apparatuses shown in FIGS. 1 and 2 viewed from another angle.

FIG. 4 is a perspective view of one of the two component conveying devices shown in FIGS. 1 and 2 as viewed from another angle.

5 (A) and 5 (B) are cross-sectional views of main parts of a moving base.

FIG. 6 is an exploded perspective view of a member constituting an opening of the chamber.

FIG. 7 is a sectional view of a main part of a member constituting an opening of a chamber.

FIG. 8 is a sectional view of a main part of a member constituting an opening of the chamber.

FIG. 9 is an overall perspective view of an IC chip component testing apparatus according to one embodiment of the present invention.

FIG. 10 is a schematic diagram for explaining a transfer route of an IC chip to be tested by the test apparatus shown in FIG. 9;

FIG. 11 is a schematic diagram schematically showing an IC chip transfer device for realizing the flow of IC chips in the test apparatus.

FIG. 12 is a schematic view showing a transfer path of an IC chip tray inside a chamber.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... IC chip component test apparatus 2 ... Component transport device 4 ... Moving base 6 ... Opening 8 ... Opening component unit 12 ... Component housing 14 ... Component opening / closing shutter 16 ... Through hole 20 ... Engagement piece 30 ... Seal member 32a , 32b ... Frame 34a ... Outer buffering member 34b ... Inner buffering member 36 ... Spring 40a, 40b ... Tapered surface 42a, 42b ... Tapered surface 44a, 44b ... Packing 50 ... Outer shutter 52 ... Inner shutter 60 ... Linear bearing 61 ... Fixed Base 62 Guide rail 64 Connection block 66 Drive belt 68 Drive shaft 70 Motor 200 Loader unit 300 Chamber 301 Chamber wall 302 Test head 302a Contact unit 400 Unloader unit

Claims (10)

[Claims] 1. A moving base which slides through an opening provided in a substantially sealed chamber and is reciprocally mounted inside and outside the chamber; and the moving base. A component storage part, which is provided on a surface of the mobile base and on which components can be removably mounted, and is provided at an outer end of the chamber of the moving base, wherein the moving base passes through the opening and is maximally inside the chamber. An outer shutter that abuts an outer peripheral edge of the opening at a position where the moving base slides, and seals the opening; and an outer shutter provided at an inner side end of the chamber of the moving base, wherein the moving base passes through the opening. An inner shutter that abuts the inner peripheral edge of the opening at a position where the sliding movement is maximized to the outside of the chamber and seals the opening. 2. A through-hole corresponding to an opening of the chamber is formed, and a resilient seal member is provided. The outer shutter is provided at a position where the movable base slides to the maximum inside the chamber. An outer buffer member located between the inner shutter and the seal member at a position where the movable base slides to the outside of the chamber to a maximum extent, 2. The component transfer device inside and outside the chamber according to claim 1, further comprising: an inner buffer member positioned between the inner shutter and the buffer member to reduce a collision force of the inner shutter. 3. The component transfer device according to claim 2, further comprising: a frame holding the seal member; and a spring connecting the outer buffer member and the inner buffer member to the frame member. 4. The component transfer inside and outside the chamber according to claim 2, wherein a tapered surface is formed around the through hole of the seal member so that the outer buffer member and the inner buffer member respectively come into contact with each other. apparatus. 5. The component transfer device inside and outside the chamber according to claim 1, wherein a component opening / closing shutter that opens and closes the component storage portion is slidably mounted on a surface of the movable base. 6. While the movable base slides to the maximum inside the chamber, the movable base is engaged with a member constituting an opening of the chamber, and the component opening / closing shutter is slid to move the component housing portion. The component conveying device according to claim 5, wherein an engagement piece for opening is provided in the component opening / closing shutter. 7. The component transfer device inside and outside the chamber according to claim 1, further comprising a drive mechanism connected to the outer shutter and configured to slide the outer shutter together with the movable base. 8. The component transfer device inside and outside the chamber according to claim 7, wherein the drive mechanism has a motor having a drive shaft that rotates, and a drive belt that is moved by the drive shaft. 9. The component transfer device inside and outside the chamber according to claim 7, further comprising a guide rail for guiding the slide movement of the outer shutter. 10. A component test apparatus having the component transport device according to claim 1.