JP3968490B2 - Component conveying device inside and outside chamber and component testing device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component conveying apparatus and a component testing apparatus inside and outside a chamber, and more specifically, a component conveying apparatus inside and outside a chamber capable of effectively preventing dew condensation at a component conveying opening formed in the chamber, and The present invention relates to a component testing apparatus.
[0002]
[Prior art]
In the manufacturing process of a semiconductor device or the like, a test apparatus for testing an electronic component such as an IC chip finally manufactured is required. As one type of such a test apparatus, an apparatus for testing an IC chip under normal temperature or a temperature condition lower than normal temperature is known. This is because, as a characteristic of the IC chip, it is guaranteed that it operates well even at room temperature or low temperature.
[0003]
In such a test apparatus, the upper part of the test head is covered with a chamber, the inside is made a sealed space, and the IC chip is transported onto the test head, where the IC chip is pressed and connected to the test head, The test is performed at room temperature or low temperature within a certain temperature range. By such a test, the IC chip is well tested and at least divided into a good product and a defective product.
[0004]
In such a test apparatus for testing an IC chip inside a chamber, an outlet opening is formed in the chamber in order to transfer the IC chip from the inside of the chamber to the outside of the chamber, and the IC chip is inserted from the opening. Moved outside the chamber. Inside the chamber, an IC chip tray for holding an IC chip is movably disposed, and the IC chip is held by the tray and moves inside the chamber. An opening / closing mechanism such as an opening / closing shutter is provided at the outlet of the chamber to prevent outside air from being mixed into the chamber from the outside and to maintain the interior of the chamber at a predetermined temperature.
[0005]
[Problems to be solved by the invention]
However, when the open / close shutter is opened and the IC chip inside the chamber is moved from the chamber outlet opening to the outside of the chamber, outside air enters the chamber through the outlet opening, and the temperature inside the chamber is low. In some cases, there is a problem that condensation easily occurs. If dew condensation occurs on the inner wall or tray near the outlet opening of the chamber, the dew condensation water may adhere to the IC chip, which may cause a short circuit phenomenon in the electrical wiring during the IC chip test. For this reason, it is necessary to prevent condensation as much as possible.
[0006]
The present invention has been made in view of such a situation, and in the case where parts are delivered inside and outside the chamber, particularly inside the chamber at a room temperature or lower (room temperature or lower temperature), dew condensation at the opening of the chamber. It is an object of the present invention to provide a component conveying device and a component testing device inside and outside a chamber that can effectively prevent the above.
[0007]
[Means for Solving the Problems]
In order to achieve the above-mentioned object, a component conveying apparatus inside and outside a chamber according to the present invention slides through an opening provided in a chamber that is substantially sealed inside, and connects the inside and outside of the chamber. A moving base mounted so as to be reciprocally movable, provided on a surface of the moving base, a component accommodating portion capable of detachably mounting components, and provided at an outer end of a chamber of the moving base, the moving An outer shutter that contacts the outer peripheral edge of the opening and seals the opening at a position where the base passes through the opening and slides to the maximum inside the chamber, and an inner end of the chamber of the moving base An inner shutter that is in contact with the inner peripheral edge of the opening and seals the opening at a position where the moving base passes through the opening and slides to the maximum outside the chamber. It has a.
[0008]
In the component conveying apparatus inside and outside the chamber according to the present invention, a through-hole corresponding to the opening of the chamber is formed, and the elastic sealing member and the moving base slide to the maximum inside the chamber. And an outer cushioning member that is positioned between the outer shutter and the seal member to relieve a collision force of the outer shutter, and the inner base at a position where the moving base slides to the maximum outside the chamber. It is preferable to further include an inner buffer member that is positioned between the shutter and the seal member and that reduces the collision force of the inner shutter.
[0009]
It is preferable that the internal / external component conveyance device according to the present invention further includes a frame body that holds the seal member, and a spring that connects the outer buffer member and the inner buffer member to the frame body. .
[0010]
It is preferable that a tapered surface is formed around the through hole of the seal member so that the outer buffer member and the inner buffer member abut each other.
[0011]
It is preferable that a component opening / closing shutter for opening and closing the component accommodating portion is slidably mounted on the surface of the moving base.
[0012]
Engagement for engaging the member constituting the opening of the chamber and sliding the component opening / closing shutter to open the component accommodating portion while the moving base slides to the maximum inside the chamber. It is preferable that a piece is provided in the component opening / closing shutter.
[0013]
It is preferable that the component conveying apparatus inside and outside the chamber according to the present invention further includes a drive mechanism that is connected to the outer shutter and slides the outer shutter together with the moving base.
[0014]
Although it does not specifically limit as said drive mechanism, For example, what has a motor with the drive shaft which rotates and the drive belt which moves with the said drive shaft is preferable. It is preferable to further have a guide rail for guiding the sliding movement of the outer shutter.
[0015]
The chamber according to the present invention is a chamber having any one of the above-described component conveying devices.
[0016]
The component testing apparatus according to the present invention includes the chamber and a test head that is mounted in the chamber and performs a component test.
[0017]
In the present invention, the component is not particularly limited, but is, for example, an IC chip.
[0018]
[Action]
The component conveying apparatus inside and outside the chamber according to the present invention is mounted, for example, on a component outlet opening in a chamber of a component testing apparatus. In the component conveying apparatus and the component testing apparatus according to the present invention, when conveying a component from the inside of the chamber to the outside, first, the moving base is slid and moved to the maximum inside the chamber. At that position, the components in the chamber are transferred to the component accommodating portion provided in the moving base. In this state, the outer shutter provided on the moving base contacts the outer peripheral edge of the opening of the chamber and seals the opening. Therefore, when transferring the components in the chamber to the component accommodating portion provided in the moving base, it is possible to effectively prevent the outside air from flowing from the outside of the chamber into the chamber through the opening.
[0019]
In order to move the component placed on the component receiving portion of the moving base to the outside of the chamber, the moving base is slid and positioned to the maximum outside the chamber. At that position, the part is transferred from the part accommodating part to the outside of the chamber. In this state, the inner shutter provided on the moving base contacts the inner peripheral edge of the opening of the chamber and seals the opening. Therefore, even when components are transferred from the component accommodating portion provided in the moving base to the outside of the chamber, it is possible to effectively prevent the outside air from flowing from the outside of the chamber to the inside of the chamber through the opening.
[0020]
It should be noted that the component conveying apparatus inside and outside the chamber according to the present invention can be mounted in the component entrance opening in the chamber of the component testing apparatus. In that case, with the slide base moved to the maximum position on the outside of the chamber, the parts are transferred from the outside of the chamber to the parts container, and the position is set to the maximum inside the chamber. Then, the part is transferred from the part accommodating part to the inside of the chamber.
[0021]
In any case, the inner shutter or the outer shutter provided in the moving base contacts the inner peripheral edge or the outer inner peripheral edge of the opening of the chamber, and seals the opening. Therefore, in any case, it is possible to effectively prevent the outside air from flowing from the outside of the chamber into the chamber through the opening, and it is possible to effectively prevent the occurrence of condensation when the temperature inside the chamber is low. it can.
[0022]
Even when a test is performed at a high temperature inside the chamber, the component conveying device and the component testing device according to the present invention can prevent the introduction of outside air from the opening when transferring the components. The efficiency of temperature control is improved.
[0023]
Further, in the component conveying apparatus and the component testing apparatus according to the present invention, the conventional shutter that is conventionally required is not required separately from the component conveying apparatus to be mounted in the opening of the chamber. The parts can be conveyed by the parts conveying device. Therefore, the parts transport operation becomes faster.
[0024]
In the component conveying device and the component testing device according to the present invention, the impact due to the collision of the outer shutter or the inner shutter can be effectively reduced by providing the outer buffer member and the inner buffer member at the opening of the chamber.
[0025]
In the component conveying apparatus and the component testing apparatus according to the present invention, a component opening / closing shutter that opens and closes the component accommodating portion is slidably mounted on the surface of the moving base, so that the component is removed from the component accommodating portion when the moving base slides. It is possible to effectively prevent the dropout.
[0026]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described based on embodiments shown in the drawings.
1 to 4 are schematic perspective views of a component conveying apparatus inside and outside a chamber according to one embodiment of the present invention, FIGS. 5A and 5B are cross-sectional views of main parts of a moving base, and FIG. 6 is an opening of the chamber. FIG. 7 and FIG. 8 are cross-sectional views of the main part of the member constituting the opening of the chamber, FIG. 9 is an overall perspective view of the IC chip component testing apparatus according to one embodiment of the present invention, FIG. 10 is a schematic diagram for explaining a transport path of an IC chip to be tested by the test apparatus shown in FIG. 9, and FIG. 11 is a schematic diagram of an IC chip transfer apparatus for realizing the flow of the IC chip in the test apparatus. FIG. 12 is a schematic view showing a conveyance path of the IC chip tray inside the chamber.
[0027]
[First Embodiment]
As shown in FIGS. 1 and 2, two component conveying devices 2 according to one embodiment of the present invention are mounted on a chamber wall 301 of a chamber 300 according to one embodiment of the present invention. In FIG. 3 and FIG. 4, only the single component conveying apparatus 2 is shown for ease of illustration. 1 to 4, only a part of the chamber wall 301 of the chamber 300 that is notched is illustrated, but in practice, except for the opening 8 formed in the opening configuration unit 8, The inside of the chamber 300 is stretched so as to be sealed. FIG. 1 is a perspective view of two component transfer apparatuses 2 as viewed from the inside of the chamber 300, and FIG. 2 is a perspective view of the two component transfer apparatuses 2 as viewed from the outside of the chamber 300. FIG. 3 is a perspective view of the single component conveying device 2 as viewed from the outside of the chamber 300, and FIG. 4 is a perspective view of the single component conveying device 2 as viewed from the inside of the chamber 300.
[0028]
As shown in FIGS. 1 to 4, the moving base 4 is mounted on the opening 6 of the opening forming unit 8 attached to the chamber wall 301 of the chamber 300 so as to be able to reciprocate between the inside and the outside of the chamber 300. It is. As shown in FIGS. 5A and 5B, the moving base 4 has a recess 9 formed therein, and a plurality of concave component housing portions 12 are formed at substantially equal intervals along the longitudinal direction. The component storage block 10 is fixed. The surface of the component housing block 10 is substantially flush with the surface of the moving base 4. In the present invention, the component housing portion 12 may be formed directly on the moving base 4, but in order to easily cope with changes in the size, shape, or number of components to be transported, the component housing block 10 is preferably exchangeable with respect to the moving base 4.
[0029]
A component opening / closing shutter 14 is mounted on the component housing block 10 in which the component housing portion 12 is formed so as to be slidable along the longitudinal direction thereof. In the component opening / closing shutter 14, the shutter 14 communicates with each component accommodating portion 12 at the slide position shown in FIG. 5B, and a plurality of through holes 16 for opening each component accommodating portion 12 are provided along the longitudinal direction. It is formed. As shown in FIG. 5A, the component opening / closing shutter 14 closes each component accommodating portion 12 in the normal sliding position, and an IC chip as a component accommodated in each component accommodating portion 12 does not fall off. It is like that.
[0030]
As shown in FIGS. 1 to 4, in order to guide the sliding movement of the component opening / closing shutter 14, a plurality of guide pulleys 18 are fixed to the component housing block 10, and these guide pulleys 18 pass through the shutter 14. The edge of the hole 16 is rotatably engaged. The width in the longitudinal direction along the shutter 14 of the through-hole 16 with which the guide pulley 18 is engaged restricts the movement width of the shutter 14 in the longitudinal sliding movement. As shown in FIGS. 1 to 5, an engagement piece 20 for sliding the component opening / closing shutter 14 to open the component accommodating portion 12 is integrally formed at one end in the longitudinal direction of the component opening / closing shutter 14 (outside the chamber 300). It is molded into. The engagement piece 20 is formed by bending a longitudinal end portion of a plate material constituting the shutter 14 upward at a substantially right angle.
[0031]
1-4, each opening component unit 8 has a substantially rectangular through-hole, which is a substantial opening 6 of the chamber 300, as shown in FIGS. It has the sealing member 30 which has. The seal member 30 is made of, for example, elastic rubber such as sponge rubber or synthetic resin. The sealing member 30 has a substantially rectangular plate shape, and raised portions 31a and 31b surrounding the periphery of the opening 6 are integrally formed on both sides thereof. Tapered surfaces 40a and 40b whose inner diameter decreases toward the opening 6 are formed on the inner peripheral side of the raised portions 31a and 31b.
[0032]
Frame bodies 32 a and 32 b that hold the seal member 30 from both sides are mounted on the outer peripheral sides of the raised portions 31 a and 31 b formed on both surfaces of the seal member 30. These frames 32a and 32b are made of, for example, a synthetic resin such as FRP having excellent heat insulation and mechanical strength. The overall shape of each of the frames 32a and 32b is substantially rectangular, and openings 33a and 33b are formed in a substantially central portion. The raised portions 31a and 31b of the seal member 30 are fitted into the openings 33a and 33b. As shown in FIGS. 7 and 8, the frames 32 a and 32 b are attached and fixed to the chamber wall 301 of the chamber 300. The chamber wall 301 is preferably composed of a wall material having a heat insulating material in order to seal the inside of the chamber 300 and to insulate the outside from the outside.
[0033]
As shown in FIGS. 6 to 8, a substantially rectangular outer cushioning member 34 a is attached to the outside of the chamber of one frame 32 a so as to be able to contact and separate using a spring 36 and a fixture 38. The attachment 38 is for attaching the outer cushioning member 34a to the frame 32a so as to be movable within a predetermined range, and the spring 36 is an outer cushioning in a state where no external force acts on the outer cushioning member 34a. The member 34a is pressed away from the frame body 32a, and the state shown in FIG. 7 is maintained.
[0034]
A substantially rectangular inner cushioning member 34b is mounted on the inner side of the chamber of the other frame body 32b so as to be able to contact and separate using a spring 36 and a fixture 38. The attachment 38 is for attaching the inner cushioning member 34b to the frame 32b so as to be movable within a predetermined range, and the spring 36 is an inner cushioning in a state where no external force acts on the inner cushioning member 34b. The member 34b is pressed in the direction of pulling away from the frame body 32b, and the state shown in FIG. 8 is maintained.
[0035]
Each buffer member 34a and 34b has openings 46a and 46b, respectively. The opening 46a of the outer cushioning member 34a is larger than the opening 46b of the inner cushioning member 34b, and the engagement piece 20 of the component opening / closing shutter 14 passes through the opening 46a as shown in FIG. The opening 46b is configured not to pass through. The opening 46b is large enough to allow the moving base 4 and the component opening / closing shutter 14 to pass through, and the engagement piece 20 can be engaged with the inner surface of the inner buffer member 34b. These buffer members 34a and 34b are made of a synthetic resin similar to the frame bodies 32a and 32b.
[0036]
As shown in FIGS. 6 to 8, raised portions 45a and 45b are integrally formed on the inner surfaces of the buffer members 34a and 34b along the peripheries of the openings 46a and 46b. Tapered surfaces 42a and 42b are formed on the outer peripheries of the raised portions 45a and 45b. The tapered surfaces 42a and 42b can be pressed against the tapered surfaces 40a and 40b of the seal member 30, respectively.
[0037]
The outer surfaces of the buffer members 34a and 34b are counterbored along the peripheries of the openings 46a and 46b, and the packings 44a and 44b are fixed to these portions. These packings 44a and 44b are made of an elastic member such as sponge rubber, for example. As shown in FIGS. 7 and 8, an outer shutter 50 and an inner shutter 52, which will be described later, can contact the packings 44a and 44b, respectively.
[0038]
Although omitted in FIGS. 7 and 8, as shown in FIG. 6, a guide base 48 that guides the sliding movement of the moving base 4 is fixed by a bolt 49 or the like below the inside of the chamber of the frame 32 b. . The guide base 48 is positioned further inside the chamber than the inner buffer member 34b, below the opening 46b, and fixed to the frame 32b.
[0039]
As shown in FIG. 1 to FIG. 4 and FIG. 8, an outer shutter 50 is fixed to the outer end of the chamber of the moving base 4 and is slidable together with the moving base 4. As shown in FIGS. 1 to 4 and 7, an inner shutter 52 is fixed to a chamber inner end portion of the moving base 4, and is slidable together with the moving base 4.
[0040]
The inner shutter 52 has a larger cross-sectional area than the opening 46b of the inner buffer member 34b, and the sliding position of the moving base 4 shown in FIG. 7 (the moving base 4 passes through the opening 6 and reaches the outside of the chamber 300 to the maximum). At a position where the sliding movement is limited), the abutting against the packing 44b and the opening 46b are sealed. In this state, the inner buffer member 34b moves toward the seal member 30 against the elastic force of the spring 36 shown in FIG. 6 in accordance with the sliding movement of the inner shutter 52, and the tapered surface 42b is tapered. Press contact with the surface 40b. As a result, the opening 6 is closed in a good sealed state by the inner shutter 52 and the inner buffer member 34b. When the moving base 4 passes through the opening 6 and slides to the outside of the chamber 300 to the maximum extent, the impact when the inner shutter 52 collides with the inner buffer member 34b is improved by the spring 36 shown in FIG. Can be relaxed.
[0041]
As shown in FIG. 4, a plurality of rollers 54 are rotatably attached to the lower part of the inner shutter 52, and the guide base 48 is in a state where the movable base 4 is slid to the outside of the chamber 300 to the maximum extent. Located on the top. As a result, the moving base 4 is held at both ends, the holding is stabilized, and it is easy to move when the moving base 4 next slides.
[0042]
As shown in FIG. 8, the outer shutter 50 includes, for example, a first block 56 and a second block 58, which are integrated with bolts or the like and fixed to the chamber outer end of the moving base 4. The outer shutter 50 including the first block 56 and the second block 58 has a larger cross-sectional area than the opening 46a of the outer cushioning member 34a, and the sliding position of the moving base 4 shown in FIG. 6, and slides to the maximum inside the chamber 300) to contact the packing 44 a and seal the opening 46 a. In this state, the outer buffer member 34a moves toward the seal member 30 against the elastic force of the spring 36 shown in FIG. 6 in accordance with the sliding movement of the outer shutter 50, and the tapered surface 42a is tapered. Press contact with the surface 40a. As a result, the opening 6 is closed in a good sealed state by the outer shutter 52 and the outer buffer member 34a. When the movement base 4 passes through the opening 6 and slides to the maximum extent inside the chamber 300, the spring 36 shown in FIG. Can be relaxed.
[0043]
Further, as shown in FIG. 8, when the moving base 4 passes through the opening 6 and slides to the inside of the chamber 300 to the maximum extent, the component opening / closing that is slidably mounted on the surface of the moving base 4 is opened and closed. The engagement piece 20 of the shutter 14 cannot pass through the opening 46b of the inner buffer member 34b. As a result, the engagement piece 20 engages with the inner buffer member 34b, and the component opening / closing shutter 14 slides relative to the moving base 4 and moves as shown in FIG. All the parts accommodating parts 12 provided in the base 4 are opened.
[0044]
In this way, the component opening / closing shutter 14 is slid and opened by simply sliding the moving base 4 into the chamber 300, so that all the component accommodating portions 12 are opened. Therefore, a separate drive mechanism for opening the component opening / closing shutter 14 is required. Therefore, the mechanism can be simplified. In addition, the operation is also fast. As shown in FIG. 5 (B), a component adsorption device in which the tested IC chip in the chamber 300 is not shown in each component accommodating portion 12 with all the component accommodating portions 12 opened by the component opening / closing shutter 14. It is transferred.
[0045]
Thereafter, no external force acts on the component opening / closing shutter 14 in the middle of the movement from the sliding position of the moving base 4 shown in FIG. 8 to the sliding position shown in FIG. 14 returns from the state shown in FIG. 5B to the state shown in FIG. As a result, during the movement of the movement base 4, as shown in FIG. 5A, each component accommodating portion 12 is closed by the shutter 14, and the IC chip accommodated inside each component accommodating portion 12 is removed. There is no risk of dropping off.
[0046]
Next, a mechanism for sliding the moving base 4 will be described.
As shown in FIGS. 1 to 4 and 8, a linear bearing 60 is fixed to the lower part of the second block 58 of the outer shutter 50, and the linear bearing 60 reciprocates in a linear direction along the guide rail 62. It is free to move. As shown in FIGS. 1 to 4, the guide rail 62 is fixed on a fixed base 61 of the transport device 2. An electric motor 70 is mounted below one end in the longitudinal direction of the fixed base 61.
[0047]
The inner periphery of one end of the ring-shaped drive belt 66 is wound around the rotation drive shaft 68 of the electric motor 70 by about a half turn. A free roller 74 is rotatably mounted below the other end in the longitudinal direction of the fixed base 61, and the inner periphery of the other end of the drive belt 66 is wound around the free roller 74 by about a half turn. In addition, another free roller 72 is rotatably disposed near the rotation drive shaft 68 and is in contact with the belt 66 from the outside of the drive belt 66 so that the belt 66 is tensioned. Therefore, when the rotary drive shaft 68 is rotated by the motor 70, the drive belt 66 is also moved along the longitudinal direction of the ring.
[0048]
The lower end of the connection block 64 is fixedly attached to a part of the drive belt 66. When the drive belt 66 moves along the ring-shaped longitudinal direction, the connection block 64 is simultaneously moved in the longitudinal direction of the fixed base 61. It is possible to move along. The upper end of the connection block 64 is attached and fixed to the second block 58 of the outer shutter 50 with a bolt or the like, and the outer shutter 50 can be linearly moved along the guide rail 62 simultaneously by moving the connection block 64. It has become.
[0049]
The rotation drive shaft 68 of the electric motor 70 can be rotated in both forward and reverse directions depending on the performance of the motor itself or by combining a gear mechanism with the rotation shaft of the motor. The rotation angle amount is measured by an encoder, for example. To be controlled. Alternatively, the rotation of the rotary drive shaft 68 is controlled so that the position of the outer shutter 50 including the connection block 64 is detected by a position sensor or the like and stopped at a predetermined position. Not only the position of the outer shutter 50 but also the slide position of the moving base 4 may be detected by a position sensor, and the rotation of the rotation drive shaft 68 may be controlled according to the position signal.
[0050]
For example, the state shown in FIG. 3 shows a state in which the rotation of the rotation drive shaft 68 of the electric motor 70 is stopped while the connecting block 64 has moved to the nearest position of the motor 70. In this state, the outer shutter 50 is farthest from the opening 6 of the chamber 300, and the inner shutter 52 fixed to the moving base 4 closes the opening 6 as shown in FIG. 1 and 2 stops the rotation of the rotary drive shaft 68 of the electric motor 70 in a state in which the connection block 64 has moved to the closest position to the opening 6 of the chamber 300. Indicates the state. In this state, as shown in FIG. 8, the outer shutter 50 fixed to the moving base 4 closes the opening 6. As best shown in FIG. 3, in order to limit the linear reciprocation of the outer shutter 50 along the guide rail 62 within a predetermined range, a stopper is provided on the fixed base 61 near both ends of the guide rail 62. Each member 80 is fixedly attached.
[0051]
In the chamber 300 using the component conveying apparatus 2 according to the present embodiment, when the IC chip is conveyed from the inside of the chamber 300 to the outside, first, the rotation driving shaft 68 is rotated by the motor 70 shown in FIGS. The moving base 50 is slid along the guide rail 62. At the same time, the moving base 4 is also slid to move the moving base 4 to the maximum extent inside the chamber 300 as in the case of the component conveying device 2 on the near side in FIGS. At that position, as shown in FIG. 8, the engagement piece 20 of the component opening / closing shutter 14 is caught by the inner buffer member 34b, and the component opening / closing shutter 14 slides relative to the moving base 4, and FIG. ), The component housing part 12 is opened.
[0052]
In this state, the IC chip in the chamber 300 is transferred to each component housing portion 12. In this state, as shown in FIG. 8, the outer shutter 50 provided in the moving base 4 closes and seals the opening 6 of the chamber 300. Therefore, when the components in the chamber 300 are transferred to the component accommodating portion 12 provided in the moving base 4, it is possible to effectively prevent outside air from flowing from the outside of the chamber into the chamber through the opening 6.
[0053]
In order to move the IC chip mounted on the component housing portion 12 of the moving base 4 to the outside of the chamber 300, the rotation driving shaft 68 is rotated in the reverse direction by the motor 70 shown in FIGS. It is moved along the guide rail 62 in a direction away from the opening 6. At the same time, the moving base 4 is also slid to be located at the maximum outside the chamber 300 as shown in FIGS. During the movement, the component opening / closing shutter 14 returns from the state shown in FIG. 5 (B) to the state shown in FIG. 5 (A) by a spring (not shown). As a result, during the movement of the movement base 4, as shown in FIG. 5A, each component accommodating portion 12 is closed by the shutter 14, and the IC chip accommodated inside each component accommodating portion 12 is removed. There is no risk of dropping off.
[0054]
The component opening / closing shutter 14 is slid relative to the moving base 4 by a component opening / closing shutter drive mechanism (not shown) at the slide position of the movement base 4 shown in FIGS. Thus, all the component accommodating parts 12 are opened. In this state, the IC chip is transferred from the component housing unit 12 to the outside of the chamber using a suction device (not shown). In this state, as shown in FIG. 7, the inner shutter 52 provided in the moving base 4 closes and seals the opening 6 of the chamber 300. Therefore, even when the IC chip is transferred from the component housing portion 12 provided in the moving base 4 to the outside of the chamber, it is possible to effectively prevent the outside air from flowing from the outside of the chamber to the inside of the chamber through the opening 6. .
[0055]
As described above, the inner shutter 50 or the outer shutter 52 provided in the moving base 4 closes and seals the opening 6 of the chamber. Therefore, it is possible to effectively prevent the outside air from flowing from the outside of the chamber into the chamber through the opening 6, and it is possible to effectively prevent the occurrence of condensation when the temperature inside the chamber is low.
[0056]
Even when a test is performed at a high temperature inside the chamber, in the chamber 300 provided with the component conveying device 2 according to the present embodiment, introduction of outside air from the opening 6 can be prevented when the components are transferred. The efficiency of temperature control in the chamber 300 is improved.
[0057]
Further, in the chamber 300 provided with the component conveying device 2 according to the present embodiment, a shutter having a conventional structure that is conventionally required separately from the component conveying device 2 attached to the opening 6 of the chamber 300 becomes unnecessary. The IC chip can be transferred by the component transfer device 2 without waiting for the opening / closing of the IC chip. Therefore, the transfer operation of the IC chip to the outside of the chamber becomes high speed.
[0058]
[Second Embodiment]
In the present embodiment, an IC chip component testing apparatus 1 using the two component conveying devices 2 according to the first embodiment in an IC chip outlet opening of a chamber 300 will be described.
[0059]
The IC test apparatus 1 according to this embodiment shown in FIG. 9 tests (inspects) whether or not the IC chip properly operates in a state where high or low temperature stress is applied to the IC chip as the electronic component to be tested. The device classifies the IC chips according to the test results. In the operation test in a state in which such temperature stress is applied, the IC chip to be tested is transferred from the customer tray on which a large number of IC chips to be tested are mounted to the IC carrier conveyed in the IC test apparatus 1. To be implemented.
[0060]
Therefore, as shown in FIGS. 9 and 10, the IC test apparatus 1 of the present embodiment stores an IC chip to be tested from now on, and an IC storage unit that classifies and stores tested IC chips. 100, a loader unit 200 that sends an IC chip to be tested sent from the IC storage unit 100 into the chamber 300, a chamber 300 including a test head, and a tested IC chip that has been tested in the chamber 300. The unloader part 400 is comprised.
[0061]
IC storage unit 100
The IC storage unit 100 is provided with a pre-test IC stocker 101 for storing the IC chip to be tested before the test, and a tested IC stocker 102 for storing the IC chip to be tested classified according to the test result. Yes.
[0062]
The pre-test IC stocker 101 holds a stack of customer trays in which IC chips to be tested are stored, while the tested IC stocker 102 holds the ICs to be tested. A customer tray in which chips are appropriately classified is stacked and held.
[0063]
Since the pre-test IC stocker 101 and the tested IC stocker 102 have the same structure, the number of the pre-test IC stocker 101 and the tested IC stocker 102 is set to an appropriate number as necessary. be able to.
[0064]
In the example shown in FIGS. 9 and 10, one stocker LD is provided in the pre-test stocker 101, one empty stocker EMP to be sent to the unloader unit 400 is provided next thereto, and five in the tested IC stocker 102. Stockers UL1, UL2,..., UL5 are provided so that they can be sorted and stored in a maximum of five categories according to the test results. That is, in addition to good products and defective products, the non-defective products are classified into high-speed, medium-speed, low-speed, or defective products that require retesting.
[0065]
Loader unit 200
The customer tray described above is carried from the lower side of the apparatus substrate 201 to the window 202 of the loader unit 200 by a tray transfer arm (not shown) provided between the IC storage unit 100 and the apparatus substrate 201. In the loader unit 200, the IC chips to be tested loaded on the customer tray are once transferred to the pitch conversion stage 203 by the first transfer device 204 (see FIG. 11). After correcting the position and changing the pitch, the IC chip to be tested transferred to the pitch conversion stage 203 is further moved to the position CR1 (see FIGS. 10 and 12) in the chamber 300 using the second transfer device 205. To the IC carrier 110 according to the present embodiment that has been stopped. At that time, the shutter at the entrance 303 of the chamber 300 shown in FIG. 9 is open.
[0066]
The pitch conversion stage 203 provided on the apparatus substrate 201 between the window 202 and the chamber 300 shown in FIGS. 9 to 11 has a relatively deep recess, and the periphery of the recess is surrounded by an inclined surface. IC chip position correction and pitch changing means having a different shape, and when the IC chip to be tested adsorbed to the first transfer device 204 is dropped into the recess, the drop position of the IC chip to be tested is inclined on the inclined surface. Will be corrected. As a result, for example, the mutual positions of four IC chips to be tested are accurately determined, and even if the mounting pitches of the customer tray and the IC carrier in the chamber are different, the IC chips to be tested whose positions have been corrected and changed are changed. The IC chip to be tested can be accurately loaded in the IC housing recess formed in the in-chamber IC carrier 110 by being sucked by the second transfer device 205 and reloaded onto the in-chamber IC carrier 110.
[0067]
As shown in FIG. 11, the first transfer device 204 for transferring the IC chips to be tested from the customer tray to the pitch conversion stage 203 includes a rail 204a installed on the upper portion of the device substrate 201, and the rail 204a. A movable arm 204b capable of reciprocating between the pitch conversion stage 203 and the pitch conversion stage 203 (this direction is defined as a Y direction), and a movable head supported by the movable arm 204b and movable in the X direction along the movable arm 204b. 204c.
[0068]
A suction head 204d is mounted downward on the movable head 204c of the first transport device 204. The suction head 204d moves while sucking air, thereby sucking the IC chip to be tested from the customer tray. Then, the IC chip to be tested is dropped into the pitch conversion stage 203. For example, about four suction heads 204d are mounted on the movable head 204c, and four IC chips to be tested can be dropped onto the pitch conversion stage 203 at a time.
[0069]
On the other hand, the second transfer device 205 for transferring the IC chip to be tested from the pitch conversion stage 203 to the IC carrier in the chamber 300 has the same configuration, and as shown in FIG. 9 and FIG. A rail 205a erected on the rail, a movable arm 205b that can reciprocate between the pitch conversion stage 203 and the IC carrier by the rail 205a, supported by the movable arm 205b, and along the movable arm 205b in the X direction. And a movable head 205c that can be moved to the position.
[0070]
A suction head 205d is mounted downward on the movable head 205c of the second transport device 205, and the suction head 205d moves while sucking air, so that the IC to be tested is detected from the pitch conversion stage 203. The chip is adsorbed, and the IC chip to be tested is transferred to the in-chamber IC carrier 110 through the inlet 303 of the chamber 300. For example, about four such suction heads 205d are attached to the movable head 205c, and four IC chips to be tested can be loaded onto an IC carrier at a time.
[0071]
Chamber 300
The chamber 300 according to the present embodiment has a constant temperature function for applying a target high or low temperature stress to the IC chip to be tested loaded on the IC carrier 110 at the position CR1, and the thermal stress is applied. A certain IC chip to be tested is brought into contact with the contact portion 302a (see FIGS. 10 and 12) of the test head 302 in a constant temperature state.
[0072]
Incidentally, in the IC test apparatus 1 of this embodiment, when a low temperature stress is applied to the IC chip to be tested, heat is removed by the hot plate 401 described later, but high temperature stress is applied to the IC chip to be tested. In some cases, heat is removed by natural heat dissipation. However, a separate heat removal tank or heat removal zone is provided, and when a high temperature is applied, the IC chip to be tested is cooled to room temperature by blowing air, and when a low temperature is applied, the IC chip to be tested is heated with warm air or You may comprise so that it may return to the temperature which does not produce dew condensation by heating with a heater etc.
[0073]
A test head 302 having a contact portion 302a shown in FIG. 10 is provided on the lower center side of the chamber 300, and a stationary position CR5 of the IC carrier 110 is provided on both sides of the test head 302. Then, the IC chip to be tested mounted on the IC carrier that has been transported to the position CR5 is directly transported onto the test head 302 by the third transport device 304 shown in FIG. The test is performed by making electrical contact with 302a.
[0074]
In addition, the IC chip to be tested that has finished the test is not returned to the IC carrier 110, but is slid into the chamber 300 to the position EXT1 shown in FIG. 12 is replaced. Thereafter, the movement base 4 is carried out to the slide position EXT2 outside the chamber 300 by the movement described in the description of the component conveying apparatus 2 according to the first embodiment. At the position EXT2, the IC chip is taken out from the moving base 4, and when high temperature stress is applied to the IC chip inside the chamber 300, the heat is naturally removed after the IC chip is carried out of the chamber 300.
[0075]
FIG. 12 three-dimensionally shows the flow of the IC carrier 110 in the chamber 300. As shown in FIG. 12, inside the chamber 300, two sets of IC carriers 110 circulate from position CR1 to position CR6 and return to position CR1.
[0076]
The IC carrier 110 transported from the position CR1 to the position CR2 is transported in a state where it is stacked in the vertical direction and waits until the IC carrier at the position CR5 becomes empty. To the test head 302 to the same level position CR4. Mainly during this conveyance, high or low temperature stress is applied to the IC under test.
[0077]
Further, it is transported from the position CR4 to the horizontal position CR5 toward the test head 302, where only the IC under test is sent to the contact portion 302a of the test head 302. The IC carrier 110 after the IC under test is sent to the contact portion 302a is transported from the position CR5 to the horizontal position CR6, then transported upward in the vertical direction, and returns to the original position CR1. .
[0078]
As described above, since the IC carrier 110 is circulated and conveyed only in the chamber unit 300, once the temperature is lowered to a high temperature or a low temperature, the temperature of the IC carrier itself is maintained, and as a result, the thermal efficiency in the chamber unit 300 is maintained. Will be improved.
[0079]
The test head 302 of this embodiment shown in FIG. 10 is provided with eight contact portions 302a at a constant pitch, and the contact arm suction heads are also provided at the same pitch. Further, the IC carrier 110 accommodates 16 IC chips to be tested at a predetermined pitch.
[0080]
The IC chips to be tested connected to the test head 302 at a time are, for example, IC chips to be tested every other column with respect to the IC chips to be tested arranged in 1 row × 16 columns.
[0081]
That is, in the first test, eight IC chips to be tested arranged in 1, 3, 5, 7, 9, 11, 13, 15 rows are connected to the contact portion 302a of the test head 302 and tested. In the second test, the IC carrier is moved by one row pitch, and the IC chips to be tested arranged in the 2, 4, 6, 8, 10, 12, 14, 16 rows are similarly tested. For this reason, although not shown, there is provided a moving device that moves the IC carrier 110 conveyed to the positions CR5 on both sides of the test head 302 by a predetermined pitch in the longitudinal direction.
[0082]
Incidentally, the result of this test is stored in an address determined by, for example, the identification number assigned to the IC carrier and the number of the IC chip under test assigned in the IC carrier.
[0083]
In the IC test apparatus 1 of the present embodiment, a third transport device 304 shown in FIG. 11 is provided in the vicinity of the test head 302 in order to transfer the IC chip to be tested to the contact portion 302 a of the test head 302 and perform the test. It has been. The third conveying device 304 includes a stationary position CR5 of the IC carrier and a rail 304a provided along the extending direction (Y direction) of the test head 302, and the stationary position of the test head 302 and the IC carrier by the rail 304a. A movable head 304b capable of reciprocating between the CR5 and a suction head provided downward on the movable head 304b is provided. The suction head is configured to be moved in the vertical direction by a driving device (not shown) (for example, a fluid pressure cylinder). By this vertical movement of the suction head, the IC chip to be tested can be sucked and the IC chip to be tested can be pressed against the contact portion 302a (see FIG. 11).
[0084]
In the third transport device 304 of the present embodiment, two movable heads 304b are provided on one rail 304a, and the interval is set equal to the interval between the test head 302 and the IC carrier stationary position CR5. Yes. The two movable heads 304b are simultaneously moved in the Y direction by one drive source (for example, a ball screw device), while the respective suction heads 304c are moved in the vertical direction by independent drive devices.
[0085]
As described above, each suction head 304c can suck and hold eight IC chips to be tested at a time, and the interval is set equal to the interval of the contact portion 302a. Details of the operation of the third transport device 304 are omitted.
[0086]
Unloader unit 400
The unloader unit 400 is provided with two component conveying devices 2 for delivering the above-described tested IC chip from the chamber 300. As shown in FIGS. 10 and 11, the movement base 4 of these component conveying apparatuses 2 can reciprocate in the X direction between the positions EXT1 on both sides of the test head 302 and the position EXT2 of the unloader unit 400. It is configured. At positions EXT1 on both sides of the test head 302, in order to avoid interference with the IC carrier, it appears slightly above the stationary position CR5 of the IC carrier and overlaps slightly below the suction head of the third transport device 304. To do.
[0087]
The specific structure of these two component conveying apparatuses 2 is the same as that of the component conveying apparatus 2 shown in FIG. 1 and FIG. As shown in FIGS. 1 and 2, while one moves to the position EXT <b> 1 of the chamber 300, the other moves to a position EXT <b> 2 of the unloader unit 400, so that a substantially symmetrical operation is performed.
[0088]
A hot plate 401 is provided in the vicinity of the out-chamber position EXT2 of the moving base 4 of the component conveying apparatus 2. This hot plate 401 is for heating to a temperature at which dew condensation does not occur when a low temperature stress is applied to the IC chip under test. Therefore, when a high temperature stress is applied, the hot plate 401 is heated. The plate 401 need not be used.
[0089]
The hot plate 401 according to the present embodiment has 2 columns × 16 rows and a convenient number of 32 to-be-measured corresponding to the fact that the suction head 404c of the fourth transfer device 404 described later can hold 8 IC chips to be tested at a time. A test IC chip can be accommodated. Then, corresponding to the suction head 404c of the fourth transport device 404, the hot plate 401 is divided into four regions, and eight tested IC chips that are sucked and held from the component storage portion 12 of the moving base 4 at the position EXT2. Are placed in these regions in order, and the eight IC chips to be tested that have been heated the longest are sucked as they are by the suction head 404 c and transferred to the buffer unit 402.
[0090]
In the vicinity of the hot plate 401, two buffer units 402 each having a lift table are provided. The lift table of each buffer unit 402 is located between the same level position (Z direction) as the moving base 4 and the hot plate 401 at the position EXT2 and a level position above it, specifically, the level position of the apparatus substrate 201. Is moved in the Z direction. The specific structure of the buffer unit 402 is not particularly limited. For example, as with the IC carrier 110 and the moving base 4, the buffer unit 402 is configured by a plate in which a plurality of recesses (eight in this case) that can accommodate the IC chip to be tested are formed. be able to.
[0091]
In addition, the pair of lifting tables constituting the buffer unit 402 performs a substantially symmetrical operation in which one of the lifting tables is stationary at the raised position while the other is stationary at the lowered position.
[0092]
The unloader unit 400 in the range from the movement base 4 to the buffer unit 402 at the position EXT2 is provided with a fourth transport device 404 (see FIG. 11). As shown in FIGS. 9 and 11, the fourth transfer device 404 moves in the Y direction between the rail 404 installed on the upper portion of the device substrate 201 and the position EXT2 and the buffer unit 402 by the rail 404a. Movable arm 404b, and suction head 404c supported by movable arm 404b and capable of moving up and down in the Z direction with respect to movable arm 404b. The suction head 404c moves in the Z direction and the Y direction while sucking air. As a result, the IC chip to be tested is sucked from the moving base 4 at the position EXT2, the IC chip to be tested is dropped onto the hot plate 401, and the IC chip to be tested is picked up from the hot plate 401. Into the buffer unit 402. Eight suction heads 404c of this embodiment are mounted on the movable arm 404b, and can transfer eight IC chips to be tested at a time.
[0093]
Incidentally, the movable arm 404b and the suction head 404c are set to positions that can pass through the level position between the rising position and the lowering position of the buffer unit 402, and even if one of the buffer units 402 is in the rising position. The IC chip to be tested can be transferred to the other buffer unit 402 without interference.
[0094]
Furthermore, the unloader unit 400 is provided with a fifth transport device 406 and a sixth transport device 407, and the fifth and sixth transport devices 406 and 407 have tested the test target transported to the buffer unit 402. The test IC chip is transferred to the customer tray.
[0095]
For this reason, the device substrate 201 is conveniently provided with a window portion 403 for arranging an empty customer tray carried from the empty stocker EMP (see FIG. 10) of the IC storage unit 100 so as to face the upper surface of the device substrate 201. Four have been established.
[0096]
As shown in FIGS. 9 and 11, the fifth transfer device 406 moves in the Y direction between the buffer portion 402 and the window portion 403 by a rail 406a installed on the upper portion of the device substrate 201 and the rail 406a. A movable arm 406b, a movable head 406c supported by the movable arm 406b and movable in the X direction with respect to the movable arm 406b, and a suction head 406d attached downward to the movable head 406c and vertically movable in the Z direction. I have. The suction head 406d moves in the X, Y, and Z directions while sucking air, so that the IC chip to be tested is sucked from the buffer unit 402, and the IC chip to be tested is transferred to the customer tray of the corresponding category. To do. Two suction heads 406d of this embodiment are mounted on the movable head 406c, and can transfer two IC chips to be tested at a time.
[0097]
The fifth transfer device 406 of the present embodiment has a short movable arm 406b so that the IC chip to be tested is transferred only to the customer tray set in the two rightmost windows 403. It is effective to set a customer tray of a category with a high occurrence frequency in the two windows 403 at the right end.
[0098]
On the other hand, as shown in FIGS. 9 and 11, the sixth transfer device 406 includes two rails 407a and 407a installed on the upper portion of the device substrate 201, and the buffer unit 402 by the rails 407a and 407a. A movable arm 407b that can move in the Y direction between the window 403, a movable head 407c supported by the movable arm 407b and movable in the X direction with respect to the movable arm 407b, and attached to the movable head 407c downward. And a suction head 407d that can move up and down in the Z direction. The suction head 407d moves in the X, Y, and Z directions while sucking air, so that the IC chip to be tested is sucked from the buffer unit 402, and the IC chip to be tested is transferred to the customer tray of the corresponding category. To do. Two suction heads 407d of this embodiment are mounted on the movable head 407c, and can transfer two IC chips to be tested at a time.
[0099]
The above-described fifth transfer device 406 transfers the IC chip to be tested only to the customer tray set in the two rightmost window portions 403, whereas the sixth transfer device 407 transfers to all the window portions 403. The IC chip under test can be transferred to the set customer tray. Therefore, the IC chip under test with a high occurrence frequency is classified by using the fifth transfer device 406 and the sixth transfer device 407, and the IC chip under test with a low occurrence frequency is set in the sixth transfer device. Classification can be performed only by the device 407.
[0100]
In order to prevent the suction heads 406d and 407d of the two transport devices 406 and 407 from interfering with each other, as shown in FIGS. 9 and 11, the rails 406a and 407a are provided at different heights, and the two suction heads are provided. Even if 406d and 407d operate simultaneously, they are configured so as to hardly interfere. In the present embodiment, the fifth transport device 406 is provided at a position lower than the sixth transport device 407.
[0101]
Incidentally, although not shown in the figure, an elevating table for elevating the customer tray is provided below the device substrate 201 of each window portion 403, and the tested IC chips to be tested are reloaded to be full. The full customer tray is lowered and delivered to the tray transfer arm, and is transported to the corresponding stockers UL1 to UL5 (see FIG. 10) of the IC storage unit 100 by the tray transfer arm. In addition, the empty customer tray is transported from the empty stocker EMP to the window portion 403 that has been emptied by paying out the customer tray, and is loaded onto the lifting table and set in the window portion 403 by the tray transfer arm.
[0102]
In one buffer unit 402 of this embodiment, 16 IC chips to be tested can be stored, and memories for storing the categories of IC chips to be tested stored in the respective IC chip storage positions of the buffer unit 402 are provided. It has been.
[0103]
Then, the category and position of the IC chip under test stored in the buffer unit 402 are stored for each IC chip under test, and the customer tray of the category to which the IC chip under test stored in the buffer unit 402 belongs is stored. Called from the IC storage unit 100 (UL1 to UL5), the tested IC chip is stored in the corresponding customer tray by the third and sixth transfer devices 406 and 407 described above.
[0104]
Since the IC chip component testing apparatus 1 according to the present embodiment has the chamber 300 according to the first embodiment, the inside of the chamber 300 is tested particularly at a temperature below room temperature (room temperature or below). In this case, dew condensation at the IC chip outlet opening 6 of the chamber 300 can be effectively prevented. Further, it is possible to improve the conveyance speed for discharging the IC chip from the inside of the chamber 300 to the outside of the chamber. Furthermore, according to the IC chip component test apparatus according to the present embodiment, since the introduction of the outside air from the outlet opening of the chamber 300 can be prevented as much as possible even when the inside of the chamber 300 is heated to a high temperature, Efficiency is improved.
[0105]
Other embodiments
The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.
For example, in the above-described embodiment, the component conveying device according to the present invention is attached to the IC chip outlet opening of the chamber 300, but the component conveying device according to the present invention is attached to the IC chip inlet opening of the chamber 300. May be. However, in that case, it is necessary to transfer the IC chip from the moving base 4 to the IC carrier 110 inside the chamber 300.
[0106]
In the embodiment described above, an IC chip is used as a component. However, the component handled by the component conveying apparatus and the component testing apparatus according to the present invention is not particularly limited to the IC chip.
[0107]
【The invention's effect】
As described above, according to the component conveying apparatus and the component testing apparatus in and out of the chamber according to the present invention, even when the inside of the chamber is set at a normal temperature or lower (normal temperature or lower), the opening of the chamber is used. It is possible to effectively prevent dew condensation. In addition, it is possible to improve the conveyance speed of parts inside and outside the chamber. Furthermore, according to the parts conveying apparatus and the parts testing apparatus inside and outside the chamber according to the present invention, the efficiency of the internal temperature control of the chamber is improved even when the temperature inside the chamber is increased.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of a component conveying apparatus inside and outside a chamber according to an embodiment of the present invention.
FIG. 2 is a schematic perspective view of the two component conveying devices shown in FIG. 1 viewed from different angles.
FIG. 3 is a perspective view of one of the two component conveying devices shown in FIGS. 1 and 2 as seen from a different angle.
FIG. 4 is a perspective view of one of the two component conveying devices shown in FIGS. 1 and 2 as seen from a different angle.
FIGS. 5A and 5B are cross-sectional views of the main part of the moving base.
FIG. 6 is an exploded perspective view of members constituting the opening of the chamber.
FIG. 7 is a cross-sectional view of a main part of a member constituting the opening of the chamber.
FIG. 8 is a cross-sectional view of a main part of a member constituting the opening of the chamber.
FIG. 9 is an overall perspective view of an IC chip component testing apparatus according to an embodiment of the present invention.
FIG. 10 is a schematic diagram for explaining a transport path of an IC chip to be tested by the test apparatus shown in FIG.
FIG. 11 is a schematic view schematically showing an IC chip transfer device for realizing the flow of the IC chip in the test apparatus.
FIG. 12 is a schematic view showing a conveyance path of an IC chip tray in the chamber.
[Explanation of symbols]
1 ... IC chip parts testing equipment
2 ... Parts conveyor
4 ... Moving base
6 ... Opening
8 ... Opening unit
12 ... Parts housing
14 ... Parts open / close shutter
16 ... Through hole
20 ... engaging piece
30 ... Sealing member
32a, 32b ... Frame
34a ... Outer buffer member
34b ... Inner cushioning member
36 ... Spring
40a, 40b ... Tapered surface
42a, 42b ... Tapered surface
44a, 44b ... packing
50 ... Outer shutter
52 ... Inner shutter
60 ... Linear bearing
61 ... Fixed base
62 ... Guide rail
64 ... Connecting block
66 ... Drive belt
68 ... Drive shaft
70 ... Motor
200 ... Loader section
300 ... Chamber
301 ... Chamber wall
302 ... Test head
302a ... Contact part
400 ... Unloader section

Claims (10)

A moving base that slideably passes through an opening provided in a substantially sealed chamber and is reciprocally mounted in and out of the chamber;
A component housing part provided on the surface of the moving base, and capable of detachably mounting components;
The moving base is provided at the outer end of the chamber, and the moving base is in contact with the outer peripheral edge of the opening at a position where the moving base passes through the opening and slides to the maximum inside the chamber. Sealing the outer shutter;
The moving base is provided at the inner end of the chamber, and the moving base is in contact with the inner peripheral edge of the opening at a position where the moving base passes through the opening and slides to the outside of the chamber to the maximum. Sealing the inner shutter,
A component conveying device inside and outside the chamber. A through-hole corresponding to the opening of the chamber is formed, and an elastic sealing member;
An outer cushioning member that is located between the outer shutter and the seal member at a position where the moving base slides to the maximum inside the chamber, and that reduces the collision force of the outer shutter;
2. An inner cushioning member that is positioned between the inner shutter and the seal member at a position where the moving base slides to the maximum outside the chamber, and that relieves a collision force of the inner shutter. The component conveying apparatus inside and outside the chamber described in 1. A frame for holding the seal member;
The component conveying apparatus inside and outside the chamber according to claim 2, further comprising a spring connecting the outer buffer member and the inner buffer member to the frame. 4. The component conveying device inside and outside the chamber according to claim 2, wherein a tapered surface is formed around the through-hole of the seal member so that the outer buffer member and the inner buffer member abut each other. 5. The component conveying device inside and outside the chamber according to claim 1, wherein a component opening / closing shutter for opening and closing the component accommodating portion is slidably mounted on a surface of the moving base. Engagement for engaging the member constituting the opening of the chamber and sliding the component opening / closing shutter to open the component accommodating portion while the moving base slides to the maximum inside the chamber. The component conveying apparatus according to claim 5, wherein a piece is provided in the component opening / closing shutter. The component conveying apparatus inside and outside the chamber according to any one of claims 1 to 6, further comprising a drive mechanism connected to the outer shutter to slide the outer shutter together with the moving base. The component conveying apparatus inside and outside the chamber according to claim 7, wherein the driving mechanism includes a motor having a rotating driving shaft and a driving belt moved by the driving shaft. The component conveying apparatus inside and outside the chamber according to claim 7 or 8, further comprising a guide rail for guiding sliding movement of the outer shutter. A component testing apparatus comprising the component conveying apparatus according to claim 1.

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