JP2000206189A - Component transferring device and component testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable accurate positioning to be performed by providing a fixed base to hold a pair of first cam guides to receive the load of a moving base on both sides of the moving base to hold a component holding part, allowing the movements of the moving base along a first axis, and making the moving base allow thermal displacements in the direction of the interval of the first cam guides. SOLUTION: This device is formed of a component holding part, a moving base 330, first cam guides 328, a common fixed base 322, and first cam floors 332 and 334. The upper end parts of suspending rods 326 are fixed to the common fixed base 322, and the first cam guide 328 is fixed to the lower end parts of each pair of suspending rods 326. The moving base 330 is held at the first cam guides 328 via the first cam floors 332 and 334 and is freely moved along the X-axis. A second cam floor 338 is engaged with the guide rail of a rod- shaped second can guide 336 fixed to the common fixed base 322 and guides the movements of the moving base 330 along the x-axis along a center axis of movement CL.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component transfer device and a component test device, and more particularly, to a component transfer device and a component test device capable of accurate positioning even in an environment where a member undergoes thermal displacement.

[0002]

2. Description of the Related Art In the course of manufacturing semiconductor devices and the like,
A test device for testing an electronic component such as an IC chip finally manufactured is required. As one type of such a test apparatus, an apparatus for testing an IC chip at room temperature or at a temperature higher or lower than room temperature is known.
This is because, as a characteristic of the IC chip, it is ensured that the IC chip operates well even at room temperature, high temperature or low temperature.

In such a test apparatus, the upper part of the test head is covered with a chamber, the inside is made a closed space,
The C chip is transported over the test head, where the IC
The test is performed while the chip is pressed against and connected to the test head, and the inside of the chamber is kept at room temperature, high temperature or low temperature within a certain temperature range. By such a test, the IC chip is successfully tested, and at least is classified into a good product and a defective product.

[0004]

In a test apparatus for testing an IC chip inside a chamber as described above, the thermal expansion of a member constituting a transfer device for transferring an IC chip is caused by the temperature atmosphere inside the chamber. Alternatively, thermal displacement due to thermal contraction becomes a problem. For example, a transfer device generally has a component holding unit and a moving base for moving the component holding unit in one axial direction. The moving base normally absorbs thermal displacement by connecting one end to a linear motor guide or the like and holding the other end movably in the axial direction by a cam follower, a bearing, or the like.

[0005] Therefore, for example, when thermal expansion occurs in the moving base, the thermal expansion of the moving base is absorbed only at the other end of the moving base, and the position of the component holding portion held at substantially the center of the moving base is changed. It will be shifted toward the other end of the moving base. For this reason, a position shift of the component holding unit occurs, and it becomes difficult to transport the IC chip held by the component holding unit to an accurate position. In particular, the I held in the component holding unit
It becomes difficult to accurately position and set the C chip at the contact portion of the test head or the like.

When the component holding portion is small and light in weight,
Although it does not cause much problem, in recent years, a component capable of holding a large number of IC chips in the component holding portion at once has been developed, and its shape tends to increase and its weight increases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has a small position displacement of a component holding unit and is capable of accurate positioning even when a member constituting the component transfer device undergoes thermal displacement. And a component test apparatus.

[0008]

In order to achieve the above object, a component transport device according to the present invention comprises a component holding portion for holding a component, and the component holding portion holding at least a component in a first axial direction. A movable base, a pair of first cam guides disposed on both sides of the movable base and receiving the load of the movable base, a common fixed base holding the first cam guides, A first cam follower that connects the moving base to the first cam guides so as to allow uniaxial movement and allow the moving base to thermally displace in the direction of the gap between the two first cam guides; Having. In the present invention, the cam follower is used in a broad concept including a bearing and a roller. In the present invention, the component holding unit is not particularly limited, and may be a component suction unit.

The component transfer device according to the present invention is fixed to the common fixed base, and the moving base is connected by a second cam follower at a position near a moving center where the moving base moves along the first axial direction. It is preferable to further include a second cam guide for guiding the first axial movement of the base.

A connecting member for connecting the two first cam guides is further provided, and at least one end of the connecting member is connected to the first cam guide so as to be movable in a longitudinal direction of the connecting member. Preferably, a spring force is applied in a direction in which the first cam guides approach each other along the longitudinal direction of the member.

A drive mechanism for moving the moving base in the first axial direction is not particularly limited, and examples thereof include a rotary link and a cam follower driven by a rotary drive shaft.

The common fixed base is located, for example, outside the insulated chamber, and the moving base is located inside the chamber.

[0013] It is preferable that the component holding portion is movably held with respect to the movable base in a second axis direction substantially perpendicular to the first axis direction. It is preferable that the second axial direction is a vertical direction, and the component holding portion is held by a movable base with a spring.

The first cam guides are suspended from the common fixed base, for example.

[0015] A component testing apparatus according to the present invention includes the above-described component transport device and a test head for testing components held in a component holding unit of the component transport device.

[0016]

In the component conveying apparatus according to the present invention, both sides of the moving base are connected to the pair of first cam guides via the first cam followers, and the moving base is moved in the direction of the distance between the two first cam guides. Thermal displacement is allowed. Therefore, even if the moving base thermally expands or contracts in the direction of the distance between the first cam guides (collectively, "thermal displacement"), the moving base is thermally displaced in the direction of both first cam guides from the moving center of the moving base. The moving center does not shift. Therefore, the position of the component holding portion held with respect to the moving base is less likely to be displaced, and accurate positioning is possible.

The movement of the moving base in the first axial direction is guided by the second cam follower and the second cam guide disposed near the moving center of the moving base, and the moving center does not shift.

The two first cam guides are connected by a connecting member, and at least one end of the connecting member is movable in the longitudinal direction of the connecting member with respect to one of the first cam guides. Thermal displacement can be absorbed. Further, by applying a spring force in a direction in which the first cam guides approach each other along the longitudinal direction of the connecting member, the first cam guide receiving the load of the moving base is made rigid,
Even if the weight of the moving base and the parts holding part is large,
These can be held well. The spring force at this time is determined based on the total weight applied to the first cam guide, such as the moving base and the component holder.

[0019] The component transfer device according to the present invention, when mounted inside a chamber where the inside has a low or high temperature,
Particularly effective. The common fixed base is exposed to room temperature, especially when the common fixed base is located outside the chamber,
Since the moving base is exposed to a low or high temperature, a difference in thermal displacement between the two becomes a problem. The component transfer device according to the present invention can also absorb such a difference in thermal displacement.

In the component conveying device according to the present invention, the component holding portion is held by the moving base with the spring, so that the forward movement of the component holding portion along the second axial direction is moved against the spring force. In this case, the backward movement can be performed by the spring force itself.

Since the component testing apparatus according to the present invention has the above-described component transport device, the components held by the component holding unit can be accurately positioned with respect to the test head even in a low-temperature or high-temperature environment. , A good test can be performed.

The components to be subjected to the component transport device and the component test device according to the present invention are not limited to electronic components such as IC chips, but various components.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings.

FIG. 1 is a perspective view of a main part of a component transporting apparatus according to an embodiment of the present invention, FIG. 2 is a front view of the component transporting apparatus viewed from a Y direction, and FIG. 3 is a view of the component transporting apparatus viewed from an X direction. FIG. 4 is a perspective view of an IC test apparatus according to one embodiment of the present invention, FIG. 5 is a conceptual diagram showing a method of handling an IC chip under test in the IC test apparatus, and FIG. 6 is an IC test apparatus of FIG. FIG. 7 is a plan view schematically showing various transport devices provided in the IC test apparatus, FIG. 7 is a perspective view of a main part for describing a transport path of an IC carrier applied to the IC test apparatus in FIG. 4, and FIG. IC
FIG. 9 is a perspective view showing an embodiment of an IC carrier applied to the test apparatus, FIG. 9 is a sectional view taken along line IX-IX in FIG. 8 (shutter closed), and FIG. 10 is a sectional view taken along line IX-IX in FIG. FIG. 11 is a plan view for explaining the test order of the IC under test in the test chamber of the IC test apparatus of FIG. 4, and FIG. 12 is a front view of a main part showing details of the component suction part (FIG. 6).
13 is a side view of a main part showing the details of the component suction part (a view taken in the direction of the arrow XIII in FIG. 6), and FIG. 14 is a drawing of an IC chip to be tested in a test chamber of the IC test apparatus in FIG. FIG. 15 is a cross-sectional view for explaining a turning method (corresponding to line XIV-XIV in FIG. 6), and FIG. 15 is a cross-sectional view for explaining a turning method of an IC chip under test in an unloader section of the IC test apparatus in FIG. (Corresponding to the XV-XV line in FIG. 6).

[First Embodiment] As shown in FIGS.
The component transport device 304 according to one embodiment of the present invention is used to transport an IC chip as a component inside the chamber 300. The inside of the chamber 300 is surrounded by a heat insulating material 324, and the inside of the chamber 300 is maintained at a high temperature (for example, 125 ° C.) or a low temperature (-30 ° C.) in order to perform a high temperature test or a low temperature test of the IC chip. It is.

On the ceiling wall forming the chamber 300, a common fixed base 322 is installed outside the heat insulating material. The common fixed base 322 may also serve as a part of the ceiling wall of the chamber 300, or may be separate from the ceiling wall of the chamber 300. A movable base 330 and other members described below are located inside the chamber 300, and a common fixed base 322 is located outside the chamber 300.

The upper ends of the four suspension rods 326 are fixed to the common fixed base 322 with bolts or the like.
A first cam guide 328 is fixed to the lower end of each pair of suspension rods 326. Further, the second cam guide 3 is formed by four hanging rods (not shown).
36 is suspended and fixed to the common fixed base 322. The second cam guide 336 is formed of a rectangular frame elongated in the X-axis direction, and includes a pair of first cam guides 328.
Is located at the approximate center.

The X axis is a moving base 330 described later.
And the moving center CL of the moving base 330.
Substantially coincides with the arrangement center position of the second cam guide 336. 1 to 3, the X axis, the Y axis, and the Z axis are perpendicular to each other, and the X axis corresponds to the first axis of the present invention, and the Z axis corresponds to the second axis of the present invention. Direction.

Both ends of each first cam guide 328 in the X-axis direction are connected by a connecting rod 350 as a connecting member. However, one end 352 of the connection rod 350 is fixed to one first cam guide 328, while the other end 354 is fixed to the other first cam guide 328.
The rod 350 is movably connected in the longitudinal direction. A first spring 356 is mounted on the other end 354 of each connecting rod 350. Each first spring 356
The spring force acts on the first cam guide 328 in a direction in which the distance between the two first cam guides 328 is reduced. First spring 356
The spring force is such that even if both the first cam guides 328 receive the full load of the moving base 330 described later, the distance between the first cam guides 328 is not widened, and the spring force is Even if the connecting rod 350 thermally contracts relatively in the Y-axis direction, the spring force is sufficient to absorb the difference in thermal displacement.

A guide rail 304a is fixed inside each first cam guide 328 along the X-axis direction. The moving base 330 is disposed between the first cam guides 328, and a roller-shaped upper first cam follower 332 and a roller-shaped lower first cam follower 334 are rotatably mounted on both sides thereof. In the example shown in FIGS. 1 to 3, four upper first cam followers 332 and two lower first cam followers 3 are provided on both sides of the movable base 330.
34 is rotatably arranged. The upper first cam follower 332 is connected to the guide rail 304 of the first cam guide 328.
a rotatably engaged around the Y axis along the upper surface of a.
The lower first cam follower 334 is connected to the guide rail 304a.
Is rotatably engaged around the Y axis.

Therefore, the movable base 330 is held by the first cam guides 328 via the first cam followers 332 and 334, and is movable in the X-axis direction. The total load of the moving base 330 is
The two first cam guides 328 are provided via the cam followers 332.
To act on. The engagement between the first cam followers 332 and 334 and the guide rail 304a of each first cam guide 328
The movable base 330 is allowed to relatively thermally displace in the direction of the interval 28 (Y-axis direction).

On the lower surface of the movable base 330, four roller-shaped second cam followers 338 rotatable around the Z axis are mounted. These second cam followers 338 are engaged with the guide rails of the rod-shaped second cam guide 336 fixed to the common fixed base 322, and move the moving base 330 along the movement center axis CL in the X-axis direction. Guide to move to. That is, the moving base 330
Is determined by the engagement between the second cam guide 336 disposed along the central axis CL and the second cam follower 338 mounted on the lower surface of the movable base 330. The movement center axis CL substantially coincides with the center of the movement base 330 in the Y-axis direction, and the Y axis between the first cam guides 328.
The center substantially coincides with the axial center, and also substantially coincides with the center axis of the second cam guide 336.

Both ends of the pair of second cam guides 336 are held by holding blocks 335 (only one is shown in FIG. 1) fixed to a common fixed base 322 by lifting rods 337. One end of each second cam guide 336 is fixed to a holding block 335 (not shown), and the other end is connected to the holding block 335 (shown) so as to be movable in the X-axis direction. With such a structure, it is possible to absorb the thermal displacement of the second cam guide 336 in the X-axis direction.

Although omitted in FIG. 1, FIGS. 2 and 3
As shown in (1), a pair of movable heads 304b each having a suction head (component holding unit) 304c is disposed below the movable base 330. Each suction head 304c includes, for example, eight suction pads, and an IC chip can be vacuum-sucked to each suction pad. Since the details of the movable head 304b and the suction head 304c will be described in a second embodiment described later, detailed description thereof will be omitted here.

A pair of support rods 344 are fixed to the upper end of each movable head 304b so as to extend upward in the Z-axis direction. A stopper ring 345 is fixed to the upper end of each support rod 344, and the upper end of the second spring 346 is engaged with the stopper ring 345. The lower end of each second spring 346 is fixed or abutted on the upper surface of the moving base 330. As a result, each movable head 304b has a pair of second springs 3b.
The moving base 330 is independently held by the moving base 330, and the moving base 330 receives the full load of the movable base 304b.

When no external force is applied to the support rod 344, each movable head 304 b is moved by the movable base 304 by the spring force of the second spring 346.
It is held at an upper position closest to the position 30. At a plurality of predetermined positions of the common fixed base 322, as shown in FIG. 3, pressure cylinders or motor actuators 347 as Z-axis driving means are installed. Moving base 33
By driving the motor actuator 347 at the stage where 0 moves to a predetermined position in the X-axis direction, the drive rod 347
a is lowered downward in the Z-axis direction, and the top of the support rod 344 can be pushed downward. Support rod 344
Is pressed down against the spring force of the second spring 346, the selected movable head 304b becomes
It is pushed down along the Z-axis direction. Also, by driving the motor actuator 347, the driving rod 347a
Is returned to the upper position in the Z-axis direction, the movable head 304b is returned to the upper position in the Z-axis direction by the spring of the second spring 346.

The independent Z of each movable head 304b
The axial movement is performed by the movement base 330 shown in FIGS.
The guide is guided by a Z-axis direction guide 348 which is fixed to the.

The moving base 330 moves in the X-axis direction at the lower end of a rotary drive shaft 340 synchronously driven by a drive belt 342 mounted on an upper portion of the common fixed base 322 shown in FIGS. This is performed by a rotating link and a cam follower (not shown) connected to the unit. By driving the rotation drive shaft 340 and driving the moving base 330 by a rotating link and a cam follower (not shown), the moving base 330 can move in both directions along the X-axis direction.

In the component transfer device 304 according to the present embodiment, both sides of the moving base 330 are the first cam followers 332.
And 334 are connected to the pair of first cam guides 328 to allow the movable base 330 to be thermally displaced in the direction of the space between the two first cam guides 328 (Y-axis direction). For this reason, even if the moving base 330 thermally expands or contracts in the direction of the space between the first cam guides 328 due to the ambient temperature of the chamber 300, the thermal displacement from the moving center CL of the moving base 330 toward both the first cam guides 328. Therefore, the center of movement does not shift. Therefore, the position of the suction head 304c as a component holding unit held with respect to the moving base 330 is hardly displaced, and accurate positioning is possible.

In this embodiment, in particular, the movement of the moving base 330 in the X-axis direction is guided by the second cam follower 338 and the second cam guide 336 arranged near the moving center of the moving base 330, and the moving center CL is shifted. Never.

The two first cam guides 328 are connected by a connecting rod 350, and one end 354 of the connecting rod 350 is connected.
Is movable in the longitudinal direction of the connecting rod 350 with respect to the first cam guide 328, so that thermal displacement of the connecting rod 350 in the longitudinal direction can be absorbed. Further, since the spring force is applied by the first spring 356 in the direction in which the first cam guides 328 approach each other along the longitudinal direction of the connecting rod 350, the movable head 304b
In addition, the first cam guide 328 which receives the entire load of the moving base 330 is made rigid, so that even if the moving base 330 and the movable head 304b are heavy, they can be satisfactorily held.

The component conveying device 304 according to the present embodiment
The effect is particularly large when it is mounted inside the chamber 300 where the inside becomes low temperature or high temperature. In particular, when the common fixed base 322 is located outside the chamber 300, the common fixed base 322 is exposed to room temperature, and the movable base 330
Is exposed to low or high temperatures, the difference in thermal displacement between the two becomes a problem. Component transport device 304 according to the present embodiment
Then, such a difference in thermal displacement can be absorbed.

Further, in the present embodiment, the movable head 30
4b is held against the moving base 330 by the spring of the second spring 346. Therefore, the downward movement of the movable head 304b along the Z-axis direction is performed by moving the movable head 304b against the spring force of the second spring 346 using the driving rod 347a shown in FIG. This can be performed by the spring force of the spring 346 itself.

The component transfer device 304 according to the present embodiment
It is suitable to be used inside the chamber 300 of the IC test apparatus. Even if the inside of the chamber 300 is in a low or high temperature environment, the IC chip held by each suction head 304c can be accurately positioned with respect to the test head. And a good test can be performed.

[Second Embodiment] In the present embodiment, the case where the component transport device 304 according to the first embodiment is mounted inside the chamber 300 of the IC test device 1 shown in FIG. 4 as a component test device will be described. This will be described as an example.

The IC test apparatus 1 according to the present embodiment shown in FIG. 4 is a state in which a high temperature (for example, 125 ° C.) or low temperature (−30 ° C.) temperature stress is applied to an IC chip as an electronic component to be tested. Test (inspection) whether the IC chip operates properly, and according to the test result, the IC
This is a device for sorting chips. The operation test under such a temperature stress is performed under the I-test under test.
From the customer tray on which many C chips are mounted, the IC
The test is performed by mounting the IC chip under test on an IC carrier conveyed in the test apparatus 1.

For this reason, the IC test apparatus 1 of the present embodiment
As shown in FIG. 5 and FIG. 6, the IC storage unit 100 stores an IC chip to be tested from now on, and classifies and stores tested IC chips.
A loader unit 200 for sending the IC chip to be tested sent from the chamber 300 to the chamber 300, a chamber 300 including a test head, and an unloader unit 400 for classifying and extracting the tested IC chips tested in the chamber 300. Have been.

The IC storage unit 100 stores the pre-test IC stocker 101 for storing the IC chips to be tested before the test, and the tested ICs for storing the IC chips to be tested classified according to the test results. A stocker 102 is provided.

The pre-test IC stocker 101 includes:
While the customer trays storing the IC chips to be tested to be tested are stacked and held, the tested IC stocker 102 has a customer tray in which the IC chips to be tested are appropriately classified. Laminated and held.

Since the pre-test IC stocker 101 and the tested IC stocker 102 have the same structure, the pre-test IC stocker 101 and the tested IC stocker 1 have the same structure.
02 can be set to an appropriate number as needed.

In the example shown in FIGS. 5 and 6, one stocker LD is provided in the pre-test stocker 101, one empty stocker EMP to be sent to the unloader section 400 is provided next to the stocker LD, and the tested IC stocker 102 is provided. , UL5 are provided so that they can be sorted and stored in a maximum of five categories according to test results. In other words, besides the non-defective products and the defective products, the non-defective products are classified into those having a high operation speed, medium-speed ones, low-speed ones, and some of the defective ones requiring retesting.

Loader section 200 The above-described customer tray is placed on the window 202 of the loader section 200 by a tray transfer arm (not shown) provided between the IC storage section 100 and the apparatus board 201.
01 is carried from below. Then, the loader unit 200
In the above, the IC chips to be tested loaded on the customer tray are once transferred to the pitch conversion stage 203 by the first transfer device 204 (see FIG. 6), where the mutual positions of the IC chips to be tested are corrected, and After changing the pitch, the IC chip under test transferred to the pitch
Position C in the chamber 300 using the transfer device 205 of FIG.
The IC carrier 310 is stopped at R1 (see FIGS. 5 and 7). At that time, the shutter at the entrance 303 of the chamber 300 shown in FIG. 4 is open.

The window 202 and the chamber 3 shown in FIGS.
00, the pitch conversion stage 203 provided on the device substrate 201 has a relatively deep concave portion,
The concave portion is a means for correcting the position and changing the pitch of the IC chip whose peripheral edge is surrounded by the inclined surface. When the IC chip to be tested sucked by the first transfer device 204 is dropped into the concave portion, the inclined portion is inclined. The drop position of the IC chip under test is corrected on the surface. Thereby, for example, the mutual positions of the four IC chips under test are accurately determined,
Even if the mounting pitch between the customer tray and the IC carrier in the chamber is different, the IC chip under test whose position has been corrected and the pitch has been changed is sucked by the second transfer device 205 and transferred to the IC carrier 310 in the chamber. The IC chip to be tested can be accurately transferred to the IC accommodating recess formed in the IC carrier 310 in the chamber.

As shown in FIG. 6, the first transfer device 204 for transferring the IC chips under test from the customer tray to the pitch conversion stage 203 is provided on the device substrate 201.
And a rail 204a erected above the
4a, a movable arm 204b capable of reciprocating between the customer tray and the pitch conversion stage 203 (this direction is defined as an X direction); and a movable arm 204b supported by the movable arm 204b and extending in the Y direction along the movable arm 204b. And a movable head 204c that can move.

The movable head 2 of the first transfer device 204
The suction head 204d is mounted downward on the head 04c. The suction head 204d moves while sucking air to suck the IC chip under test from the customer tray, and the IC chip under test is pitch-converted. Drop it into the stage 203. Such a suction head 20
4d is mounted on the movable head 204c, for example, about four, so that four IC chips under test can be dropped into the pitch conversion stage 203 at a time.

On the other hand, the pitch conversion stage 20
The second transfer device 205 for transferring the IC chips to be tested from the IC chip 3 to the IC carrier in the chamber 300 also has the same configuration, and as shown in FIGS. 4 and 6, a rail 205a provided on the upper portion of the device substrate 201. And this rail 205
a and pitch conversion stage 203 and IC
Movable arm 20 capable of reciprocating between carriers
5b and a movable head 205c supported by the movable arm 205b and movable in the Y direction along the movable arm 205b.

The movable head 2 of the second transfer device 205
A suction head 205d is mounted downward on the head 05c. The suction head 205d moves while sucking air to suck the IC chip under test from the pitch conversion stage 203, and
3, the IC chip under test is transferred to the IC carrier 310 in the chamber. Such a suction head 205
For example, d is mounted on the movable head 205c, for example, about four, and can transfer four IC chips to be tested to the IC carrier at a time.

The chamber 300 according to the present embodiment has an IC at a position CR1.
The test head 302 is provided with a constant temperature function of applying a desired high-temperature or low-temperature stress to the IC chip under test loaded on the carrier 310. The contact portion 302a (see FIGS. 5 and 7) is brought into contact.

In the IC test apparatus 1 of this embodiment, when a low-temperature stress is applied to the IC chip under test, the heat is removed by a hot plate 401 described later, but the high-temperature stress is applied to the IC chip under test. , Heat is removed by natural heat radiation. However, if a separate heat removal tank or heat removal zone is provided and the high temperature is applied, the IC chip under test is cooled by blowing air to return to room temperature, and if the low temperature is applied, the IC chip under test is heated or cooled. The temperature may be returned to a temperature at which dew condensation does not occur by heating with a heater or the like.

The test head 302 having the contact portion 302a shown in FIG. 5 is provided below the center of the chamber 300, and the stationary position CR5 of the IC carrier 310 is provided on both sides of the test head 302. Then, the IC carrier 31 transported to this position CR5
The IC chip under test placed on the test head 302 is directly carried onto the test head 302 by the third transfer device 304 shown in FIG. 6 and the IC chip under test is brought into electrical contact with the contact portion 302a. Done. In the present embodiment, the third transport device 304 has the same structure as the component transport device 304 of the first embodiment.

After the test, the IC chip under test is
Without returning to the carrier 310, the position EXT shown in FIG.
1 to the exit carrier. Thereafter, the exit carrier is carried out to the slide position EXT2 outside the chamber 300. At the position EXT2, when the IC chip is taken out of the exit carrier and a high-temperature stress is applied to the IC chip inside the chamber 300, the IC chip is carried out of the chamber 300 and then naturally cooled.

The specific structure of the exit carrier is not particularly limited. However, as shown in FIG. 8, an IC carrier 310 shown in FIG.
Individual) formed plates.

FIG. 7 shows the flow of the IC carrier 310 in the chamber 300 three-dimensionally. As shown in FIG. 7, two sets of I
C carrier 310 is moved from position CR1 to position CR, respectively.
6 and return to the position CR1.

The I transported from the position CR1 to the position CR2
The C carrier 310 is conveyed in a state of being stacked in multiple stages downward in the vertical direction. After waiting until the IC carrier at the position CR5 becomes empty, the C carrier 310 is moved from the lowest position CR3 to a position substantially at the same level as the test head 302. It is transported to CR4. Mainly during this transport, a high temperature or low temperature stress is applied to the IC chip under test.

Further, the test head 30 is moved from the position CR4.
The IC chip is transported to the horizontal position CR5 toward the second side, where only the IC chip under test is sent to the contact portion 302a of the test head 302. IC carrier 310 after IC chip under test is sent to contact portion 302a
Is transported from the position CR5 to the horizontal position CR6, then transported vertically upward, and returns to the original position CR1.

As described above, since the IC carrier 310 is circulated and conveyed only in the chamber 300, once the temperature is raised or lowered, the temperature of the IC carrier itself is maintained. Thermal efficiency will be improved.

FIG. 8 is a perspective view showing the structure of the IC carrier 310 of the present embodiment. Eight concave portions 12 are formed on the upper surface of a strip-shaped plate 11, and the IC chip to be tested is placed in each of the concave portions 12. IC housing 14 for
Are formed one by one.

In the present embodiment, the IC accommodating portion 14 is
16 are formed along the longitudinal direction of the plate 11 by attaching the blocks 13 to the mounting pitch P of the IC chip 2 to be tested in the longitudinal direction of the plate 11.
₁ (see FIG. 11) are set at equal intervals.

Incidentally, a guide plate 17 in which a guide hole (see FIG. 9) 171 is formed between the concave portion 12 of the plate 11 and the blocks 13, 13 is held in the IC accommodating portion 14 of the present embodiment. I have. In the case where the positioning accuracy cannot be ensured due to the outer periphery of the package mold, such as when the IC chip 2 under test is a BGA type IC chip 2 of a chip size package, the guide plate 17 is used.
The solder ball terminals HB of the IC chip under test 2 are positioned by the peripheral edge of the guide hole 171, thereby increasing the contact accuracy with the contact pins.

As shown in FIG. 8, the opening of the upper surface of the IC carrier 310 is opened and closed in order to prevent the IC chip 2 under test accommodated in the IC accommodating portion 14 of the IC carrier 310 from shifting or popping out. Shutter 15 is provided.

The shutter 15 is openable and closable with respect to the plate 11 by a spring 16. The shutter 15 can be opened and closed when the IC chip 2 to be tested is housed in the IC housing 14 or taken out from the IC housing 14. Mechanism 1
By opening the shutter 15 as shown in FIG. 10 using the IC 82, the IC chip 2 to be tested is accommodated or taken out. On the other hand, when the shutter opening / closing mechanism 182 is released, the shutter 15 returns to the original state by the elastic force of the spring 16, and the opening surface of the IC housing portion 14 of the plate 11 is covered by the shutter 15 as shown in FIG. As a result, the IC chip under test 2 accommodated in the IC accommodating section 14 is held without displacement or jumping out even during high-speed conveyance.

As shown in FIG. 8, the shutter 15 of this embodiment includes three pulleys 1 provided on the upper surface of the plate 11.
The pulley 112 at the center is engaged with an elongated hole 152 formed in the shutter 15, and the two pulleys 112 provided at both ends hold both end edges of the shutter 15.

However, the center pulley 112 and the shutter 15
Engagement with the long hole 152 is such that there is almost no backlash in the longitudinal direction of the plate 11, whereas a slight gap is provided between the pulleys 112 at both ends and both end edges of the shutter 15. Is provided. In this way, even if a thermal stress acts on the IC carrier 310 in the chamber 300, the expansion or contraction due to the thermal stress is caused by the central pulley 1
It is distributed to both ends with the center at 12, and is appropriately absorbed by gaps provided at both ends. Therefore, the amount of expansion or contraction of the entire length of the shutter 15 in the longitudinal direction is halved even at both ends where the shutter 15 expands or contracts the most, whereby a difference between the amount of expansion and contraction of the plate 11 can be reduced.

The shutter opening / closing mechanism of this embodiment is configured as follows. First, in the routing path of the IC carrier 310 shown in FIG.
Two positions CR1 for receiving the chip 2 (strictly, slightly above the window 303) and a position CR5 for transferring the IC chip 2 under test to the contact portion 302a of the test head 302 by the third transfer device 304. It is.

In the present embodiment, as shown in FIGS. 7, 9 and 10, at the position CR1, as a shutter opening / closing mechanism, a fluid pressure for opening / closing by opening / closing a block 181 provided on the upper surface of the shutter 15 is used. Cylinder 182
Has been adopted. The fluid pressure cylinder 182 is mounted on the test chamber 301 side. And FIG.
As shown in FIG. 10, by retracting the rod of the fluid pressure cylinder 182 with respect to the IC carrier 310 in the stopped state, the shutter 15 is opened while the opening / closing block 181 provided on the shutter 15 is hooked. When the mounting of the IC chip 2 under test is completed, the shutter 15 is closed by moving the rod of the fluid pressure cylinder 182 forward.

On the other hand, at the position CR5 near the test head 302, since the IC carrier 310 itself is moved by a horizontal transfer device (not shown), the shutter 15 is opened and closed by using this. For example, IC carrier 31
0 is conveyed horizontally from the position CR4 to the position CR5. In the middle of this, a stopper for opening and closing the shutter 15 is provided on the test chamber 301 side, and the IC carrier 310 moves from the position CR4 to the position CR5. In this case, the shutter 15 is provided at a position in contact with the opening / closing block 181. The position where the stopper is provided is also the position where the shutter 15 is fully opened when the IC carrier 310 stops at the position CR5. In this example, the shutter 15
Are provided with two opening / closing blocks 181,
Two stoppers are also provided. Thereby, the IC carrier 310
With the horizontal conveyance, the shutter 15 is also fully opened.

When the IC carrier 310 is transported from this position CR5 to CR6, it is necessary to close the shutter 15. For this reason, for example, a cam surface is formed in the above-described stopper, and when the IC carrier 310 is transported from the position CR5 to the position CR6, the rear end of the opening / closing block 181 of the shutter 15 is formed on the cam surface. By continuing the contact, the shutter 15 is gradually closed.

Incidentally, the movable heads 205c and 304b of the second transfer device 205 and the third transfer device 304 have
When the IC chip 2 under test is delivered, the IC carrier 31
A positioning pin for performing alignment with zero is provided. As a representative example, FIG. 9 shows the movable head 205c of the second transport device 205, but the movable head 304b of the third transport device 304 has the same configuration.

As shown in the figure, the movable head 205c is provided with two positioning pins 205e, 205e straddling one IC chip 2 to be tested. For this reason,
On the plate 11 side of the IC carrier 310, positioning holes 113, 113 with which the positioning pins 205e, 205e are respectively engaged are formed. Although not particularly limited, in this example, one positioning hole 113 (the right side in FIG. 9) is a perfect circular hole, and the other positioning hole (the left side in FIG. 9) is a long oval hole in the width direction. In this way, the positioning is mainly performed in one positioning hole 113, and the positioning error with the positioning pin 205e is absorbed in the other positioning hole 113. In addition, a tapered surface is formed on the upper surface of each positioning hole 113 to attract the positioning pin 205e.

Reference numeral "153" shown in FIG. 10 is an opening for allowing the positioning pin 205e to engage with the positioning hole 113 when the shutter 15 is opened.

Further, in the IC test apparatus 1 of the present embodiment,
When all the IC chips 2 to be tested are transferred to the test head 302 by the third transfer device 304 at the position CR5 near the test head 302, the IC carrier 310 is returned from the position CR5 to the position CR6. A residual detection device is provided to confirm that the IC chip 2 to be tested does not remain in any of the IC housing portions 14 of the IC carrier 310.

This residual detecting device has a position CR shown in FIG.
5 to CR6, and irradiates and receives detection light in the Z-axis direction along the center line CL of the IC carrier 310 shown in FIG. In order to allow the detection light to pass therethrough, through holes 111 are provided on the bottom surface of the IC accommodating portion 14 of the plate 11, and the through holes 1 are also provided in the shutter 15 at positions corresponding to the respective IC accommodating portions 14.
54 are provided. Thereby, the IC carrier 31
0 completes the delivery of the IC chip under test 2 and returns to position CR5.
From the horizontal transfer device to the CR6 when receiving the movement pulse signal,
The position timing of the IC accommodating portion 14 of the carrier 310 is confirmed, and the light receiving state of the photoelectric sensor at that timing is confirmed. Here, if the IC chip 2 to be tested remains in the IC accommodating section 14, since light reception by the photoelectric sensor is not confirmed, for example, an alarm is issued to alert the user to an abnormality.

The test head 302 of this embodiment has 8
Contact portions 302a have a constant pitch P₂Provided by
As shown in FIG. 11, the contact arm
The suction head 304c also has the same pitch P₂Provided in
You. The IC carrier 310 has a pitch P₁At 1
Six IC chips 2 to be tested are accommodated.
₂= 2 · P₁The relationship has been.

The IC chip under test 2 connected to the test head 302 at a time has one row × one row as shown in FIG.
With respect to the IC chips 2 to be tested arranged in 16 rows, the IC chips 2 to be tested in other rows (portions indicated by oblique lines) are simultaneously tested.

That is, in the first test, 1, 3, 5,
Eight test pieces arranged in 7, 9, 11, 13, and 15 rows
The IC chip 2 is connected to the contact portion 30 of the test head 302.
2a, and test for the second test.
A 310 for one row pitch₁ Just move
Tests arranged in 6, 8, 10, 12, 14, 16 rows
The IC chip 2 is similarly tested. For this reason, the test head
IC carrier transported to the position CR5 on both sides of the
The rear 310 is moved in the longitudinal direction by a horizontal transfer device (not shown).
Pitch P₁Just move.

Incidentally, the result of this test is stored in an address determined by, for example, the identification number given to the IC carrier 310 and the number of the IC chip 2 to be tested allocated inside the IC carrier 310.

In the IC test apparatus 1 of this embodiment, the IC under test is applied to the contact portion 302a of the test head 302.
A third transfer device 304 is provided near the test head 302 for transferring the chip 2 and performing a test.

FIG. 12 is a front view showing the suction head, and is a view taken in the direction of the arrow XII in FIG. 6, and FIG.
FIG. 14 is a sectional view taken along line XIV-XIV in FIG.

The third transfer device 304 shown in FIG.
A rail 304a provided along the stationary position CR5 of the C carrier 310 and the extension direction (X direction) of the test head 302, and reciprocates between the test head 302 and the stationary position CR5 of the IC carrier 310 by the rail 304a. And a suction head 304 provided downward on the movable head 304b.
c. Although FIG. 14 schematically illustrates the third transport device 304, the actual specific structure is as follows.
The structure is the same as that of the component transport device 304 shown in FIGS.

The suction head 304c is configured to be able to move in the vertical direction in the Z-axis direction by the motor actuator 347 of the transfer device 304 according to the first embodiment shown in FIG. By moving the suction head 304c up and down, the IC chip under test 2 can be sucked,
The IC chip under test 2 can be pressed against the contact portion 302a.

The suction head 304c of this embodiment will be described in more detail. As shown in FIGS. 12 and 13, the suction head 304c is attached to the movable head 304b shown in FIGS. 2 and 3, and moves up and down with respect to the contact portion 302a. Floating mechanism 304
The movable base 304c3 is attached to the movable base 304c3. A suction pad 304c2 for sucking the IC chip 2 under test is fixed to the movable base 304c3. Although not particularly limited, this suction pad 304c2
Holds the IC chip 2 by vacuum suction.

Pusher base 304c1 and movable base 3
04c3 and floating mechanism 304 interposed
c6 is configured as follows. First, a guide pin 304c5 that engages with a guide bush 302a2, which is one of the guide means described later, is fixed to the movable base 304c3 at the center thereof, and its base end is inserted into an insertion hole formed in the pusher base 304c1. It is continuous with the small-diameter pin 304c7 to be inserted. Thus, the movable base 304c3 can move with respect to the pusher base 304c1 in the XY plane by the gap of the small diameter pin 304c7 with respect to the insertion hole formed in the pusher base 304c1.

The movable base 304c3 can move upward in the Z-axis direction with respect to the pusher base 304c1, but a spring 304c interposed between the pusher base 304c1 and the movable base 304c3.
8, the movable base 304c3 becomes the pusher base 3
04c1. Therefore, when no external force is applied, the state shown in FIG. 12 is maintained, but the guide pin 304c5 and the guide bush 302
When an external force acts in the X direction or the Y direction when engaging with a2, the movable base 304c3 becomes
It moves in the XY plane with respect to c1. Also,
The hydraulic cylinder 304c4, which will be described later,
If the XY plane of the movable base 304c3 is inclined when the movable base 304c3 is pressed via the movable base 304c3, the movable base 304c3 is opposed to the elastic force of the spring 304c8.
3 changes its attitude with respect to the pusher base 304c1.

In the suction head 304c of this embodiment, the base 304b1 on which the pusher base 304c1 is mounted
A hydraulic block 304c4 is fixed to the movable base 304c3, and a pressing block 304c9 is attached to the movable base 304c3. The rod end of the hydraulic cylinder 304c4 comes into contact with the upper surface of the pressing block 304c9 and presses it. The movable base 304c3 is pressed through the movable base 304c3.

As shown in FIG. 13, the suction head 304c of this embodiment has a single pusher base 3
The four movable bases 304c3 are provided so as to float independently of each other with respect to 04c1.
The above-described fluid pressure cylinder 304c4 is also used for each movable base 30.
4c3 (base 304b
1) is provided.

A guide pin 304c5 having a tapered surface at the tip is fixed to the movable base 304c3, and a guide bush 302a2 is fixed to the contact portion 302a. The suction head 304c is connected to the contact portion 30.
2a, the guide pin 304c5
Engages the guide bush 302a2 from the tapered surface, whereby the movable base 304c3 is aligned with the contact portion 302a.

When the type of the IC chip under test 2 is changed and the type of the contact portion 302a is changed, the type of the suction head 304c is also changed. In this embodiment, the pusher base 304c1 shown in FIG. The parts below are replaced as a change kit, and the base 30
4b1 and the fluid pressure cylinder 304c4 are used as they are. As a result, the components of the change kit can be minimized to reduce the cost, and the weight of the change kit can be minimized, thereby improving the exchange workability.

As shown in FIG. 14, in the third transfer device 304 of the present embodiment, two movable heads 304b are connected to the guide rail 30 by a moving base not shown in FIG.
It is mounted movably in the X-axis direction along 4a. The distance between the movable heads 304b in the X-axis direction is
Is set to be equal to the distance between the stationary position CR5 of the IC carrier 310. And these two movable heads 3
04b is simultaneously moved in the X-axis direction by the drive mechanism described in the first embodiment, while each suction head 304c is vertically moved by an independent drive device.

As described above, each suction head 3
04c can adsorb and hold eight IC chips 2 to be tested at a time, and the interval between the IC chips 2 is the contact portion 302a.
Is set equal to the interval.

[0100] The unloader section 400 unloader section 400, the above-mentioned test IC chips 2
Is provided from the chamber 300. This exit carrier is shown in FIG.
As shown in FIG. 14, the test head 302 is configured to be able to reciprocate in the Y direction between a position EXT1 on each side of the test head 302 and a position EXT2 of the unloader unit 400. At positions EXT1 on both sides of the test head 302, as shown in FIG. 14, in order to avoid interference with the IC carrier 310, the suction head 304 of the third transport device 304 is slightly above the stationary position CR5 of the IC carrier.
It emerges so as to overlap slightly below c.

Although the specific structure of the exit carrier is not particularly limited, it is constituted by a plate in which a plurality of recesses (here, eight) capable of accommodating the IC chip under test 2 are formed as in an IC carrier 310 shown in FIG. be able to.

Two exit carriers are provided on each side of the test head 302 for convenience. While one exit carrier is moved to the position EXT1 of the test chamber 301, the other is moved to the position EXT2 of the unloader section 400. Perform an almost symmetric operation.

Returning to FIG. 6, the IC test apparatus 1 of the present embodiment
Then, close to the exit carrier position EXT2,
A hot plate 401 is provided. The hot plate 401 is used to heat the IC chip under test to a temperature at which dew condensation does not occur when a low temperature stress is applied to the IC chip under test. Plate 401 need not be used.

The hot plate 401 of the present embodiment has a capacity of 2 columns × 16 rows, 32 times, corresponding to the fact that the suction head 404c of the fourth transfer device 404 described later can hold eight IC chips under test at a time. A plurality of IC chips to be tested can be accommodated. And the fourth transport device 4
The hot plate 401 is divided into four regions corresponding to the suction heads 404c of No. 04, and eight tested I suction-held from the component housing portion 12 of the moving base 4 at the position EXT2.
C chips are sequentially placed in those areas, and the eight IC chips under test heated the longest are placed in the suction head 404c.
And is transferred to the buffer unit 402 as it is.

In the vicinity of the hot plate 401, two buffer units 402 each having a lifting table are provided. FIG. 15 is a cross-sectional view taken along line XV-XV in FIG. 6. The elevation table 405 of each buffer unit 402 has the same level position (Z direction) as the exit carrier EXT2 and the hot plate 401, and the level position above it. Specifically, Z between the level position of the device substrate 201 and Z
Move in the direction. The specific structure of the buffer section 402 is not particularly limited. For example, like the IC carrier 310 and the exit carrier, the buffer section 402 is formed of a plate having a plurality of recesses (eight in this case) capable of accommodating the IC chip 2 under test. be able to.

The pair of lifting tables 405
Performs an almost symmetric operation such that while one is stationary at the ascending position, the other is stationary at the descending position.

The position E of the exit carrier described above
A fourth transfer device 404 is provided in the unloader unit 400 ranging from the XT2 to the buffer unit 402.
As shown in FIGS. 6 and 15, the fourth transporting device 404 includes a rail 40 erected above the device substrate 201.
4a, a movable arm 404b capable of moving in the X direction between the exit carrier position EXT2 and the buffer section 402 by the rail 404a, and a movable arm 40
4b, and Z with respect to the movable arm 404b.
And a suction head 404c capable of moving up and down in the direction. The suction head 404c moves in the Z direction and the X direction while sucking air, thereby sucking the IC chip 2 under test from the exit carrier. 2 is dropped on the hot plate 401, and the IC chip 2 under test is sucked from the hot plate 401 to drop the IC chip 2 under test into the buffer unit 402. The suction head 404c of the present embodiment includes a movable arm 404b.
And eight IC chips 2 to be tested can be transferred at one time.

Incidentally, as shown in FIG. 15, the movable arm 404b and the suction head 404c are
02 is set at a position where it can pass through the level position between the ascending position and the descending position of the ascending / descending table 405, so that even if one ascending / descending table 405 is at the ascending position, the other ascending / descending table is not interfered with. The IC chip 2 under test can be transferred to 405.

Further, a fifth transfer device 406 and a sixth transfer device 407 are provided in the unloader section 400, and the test pieces transferred to the buffer section 402 by the third and sixth transfer apparatuses 406 and 407 are provided. The completed IC chip under test 2 is reloaded on the customer tray KT.

For this reason, the apparatus board 201 has a window 403 for arranging an empty customer tray KT carried from the empty stocker EMP of the IC storage unit 100 so as to face the upper surface of the apparatus board 201. One has been established.

As shown in FIG. 4, FIG. 6, and FIG. 15, the fifth transfer device 406 is composed of a rail 406a provided above the device substrate 201, and a buffer 404 and a window 403 formed by the rail 406a. A movable arm 406b capable of moving in the X direction, a movable head 406c supported by the movable arm 406b, and capable of moving in the Y direction with respect to the movable arm 406b,
c, and a suction head 406d attached downward and capable of moving up and down in the Z direction. Then, the suction head 406d moves in the X, Y, and Z directions while sucking air, thereby sucking the IC chip 2 under test from the buffer unit 402 and placing the IC chip 2 under test in a customer tray of a corresponding category. Transfer to KT. Two suction heads 406d of the present embodiment are mounted on the movable head 406c, and can transfer two IC chips 2 to be tested at a time.

The fifth transfer device 406 of the present embodiment
Is to transfer the IC chip 2 under test only to the customer tray KT set in the two rightmost windows 403,
The movable arm 406b is formed short, and it is effective to set a customer tray KT of a category that frequently occurs in these two windows 403 at the right end.

On the other hand, the sixth transfer device 406
As shown in FIG. 4, FIG. 6 and FIG.
Rails 407a, 407a installed on the upper part of
A movable arm 407b capable of moving in the X direction between the buffer section 402 and the window section 403 by the rails 407a, 407a; and a movable head supported by the movable arm 407b and capable of moving in the Y direction with respect to the movable arm 407b. And a suction head 4 attached downward to the movable head 407c and capable of moving up and down in the Z direction.
07d. Then, this suction head 407
When d moves in the X, Y, and Z directions while sucking air, the IC chip 2 under test is sucked from the buffer unit 402, and the IC chip 2 under test is transferred to the customer tray KT of the corresponding category. Two suction heads 407d of this embodiment are mounted on the movable head 407c, and can transfer two IC chips 2 to be tested at a time.

While the above-described fifth transfer device 406 transfers the IC chip 2 to be tested only to the customer tray KT set in the two rightmost windows 403, the sixth transfer device 407 has The IC chip 2 under test can be transferred to the customer tray KT set in the window section 403 of FIG. Accordingly, the IC chip under test 2 in the category with a high frequency of occurrence is classified using the fifth transport device 406 and the sixth transport device 407, and the IC chip under test 2 in the category with a low frequency of occurrence is the sixth IC device. Can be classified only by the transfer device 407.

The two transfer devices 406 and 407
4 and 15, these rails 406a and 407a are provided at different heights so that the suction heads 406d and 407d do not interfere with each other even if the two suction heads 406d and 407d operate simultaneously. It is configured to hardly interfere. In this embodiment,
The fifth transfer device 406 is provided at a position lower than the sixth transfer device 407.

Incidentally, although not shown, a lifting table for raising and lowering the customer tray KT is provided below the device substrate 201 in each window 403, and the tested IC chip 2 under test is provided. Is loaded with the customer tray KT which is full due to the reloading, and the lowered tray is transferred to the tray transfer arm, and the corresponding stocker U of the IC storage unit 100 is transferred by the tray transfer arm.
L1 to UL5 (see FIG. 5). In addition, the window portion 403 that is empty after the customer tray KT has been paid out has:
The empty customer tray KT is transported from the empty stocker EMP by the tray transfer arm, is replaced on the elevating table, and is set in the window 403.

One buffer section 402 of the present embodiment can store 16 IC chips 2 to be tested, and the ICs under test stored at each IC storage position of the buffer section 402.
A memory for storing the category of each chip 2 is provided.

Then, the category and position of the IC chip 2 under test deposited in the buffer section 402 are stored for each IC chip 2 under test, and the IC chip 2 under test deposited in the buffer section 402 is stored. The customer tray KT of the category to which it belongs is called from the IC storage unit 100 (UL1 to UL5), and the third and sixth transport devices 40 described above are called up.
Tested IC for customer tray KT corresponding to 6,407
The chip 2 is stored.

In the IC test apparatus 1 according to the present embodiment, the test head 302 disposed inside the chamber 300
As the third transfer device 304 for transferring and pressing the IC chip 2 to the contact portion 302a, a component transfer device 304 having a structure shown in FIGS. 1 to 3 is employed. Therefore, even when the inside of the chamber 300 is in a low or high temperature environment, the IC chip 2 held by the suction head 304c can be accurately positioned with respect to the contact portion 302b of the test head 302, and a good test is performed. be able to.

Other Embodiments The present invention is not limited to the above-described embodiments, and can be variously modified within the scope of the present invention. For example, in the above-described embodiment, IC
Although a chip is used, a component handled by the component transport device and the component test device according to the present invention is not particularly limited to an IC chip.

[0121]

As described above, according to the component transporting device of the present invention, even when a member constituting the component transporting device undergoes thermal displacement, the positional displacement of the component holding portion is small and accurate. Positioning becomes possible. Further, according to the component test apparatus of the present invention, since the above-described component transport device is provided, it is possible to accurately position the component held by the component holding unit with respect to the test head even in a low-temperature or high-temperature environment. And a good test can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part of a component conveying device according to an embodiment of the present invention.

FIG. 2 is a front view of the component transport device as viewed from a Y direction.

FIG. 3 is a side view of the component transport device as viewed from the X direction.

FIG. 4 is a perspective view of an IC test apparatus according to one embodiment of the present invention.

FIG. 5 is a conceptual diagram showing a method of handling an IC chip under test in an IC test apparatus.

FIG. 6 is a plan view schematically showing various transport devices provided in the IC test apparatus of FIG.

FIG. 7 is an IC applied to the IC test apparatus of FIG. 4;
FIG. 4 is a perspective view of a main part for describing a carrier transport path.

FIG. 8 is an IC applied to the IC test apparatus of FIG. 4;
It is a perspective view showing an embodiment of a carrier.

9 is a cross-sectional view (shutter closed) along line IX-IX in FIG.

FIG. 10 is a sectional view (shutter open) along line IX-IX in FIG. 8;

FIG. 11 is a plan view for explaining a test order of an IC under test in a test chamber of the IC test apparatus of FIG. 4;

FIG. 12 is a front view of a main part (a view taken in the direction of arrow XII in FIG. 6) showing details of a component suction unit;

FIG. 13 is a side view of a main part (a view taken in the direction of an arrow XIII in FIG. 6) showing details of a component suction unit;

14 is a cross-sectional view (corresponding to line XIV-XIV in FIG. 6) for explaining a method of handling an IC chip under test in a test chamber of the IC test apparatus in FIG. 4;

FIG. 15 is a cross-sectional view (corresponding to line XV-XV in FIG. 6) for explaining a method of handling an IC chip under test in an unloader section of the IC test apparatus in FIG. 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... IC test apparatus 2 ... IC chip 100 ... IC storage part 200 ... Loader part 300 ... Chamber 301 ... Test chamber 302 ... Test head 302a ... Contact part 302a1 ... Contact pin 302a2 ... Guide bush 303 ... Chamber entrance 304 ... Parts conveyance Device 304c Suction head 304c1 Pusher base 304c2 Suction pad 304c3 Movable base 304c4 Fluid pressure cylinder 304c5 Guide pin 304c6 Floating mechanism 304c7 Small-diameter pin 304c8 Spring 304c9 Press block 310 IC carrier 322 Common fixed base 324 heat insulating material 326 hanging rod 328 first cam guide 330 moving base 332,334 first cam follower 336 second camger De 338 ... second cam follower 340 ... rotary drive shaft 344 ... supporting rod 346 ... second spring 348 ... Z-axis direction guide 350 ... connecting rod (connecting member) 356 ... first spring 400 ... unloader

Claims (8)

[Claims] 1. A component holding unit for holding a component, a moving base held by the component holding unit and movable at least in a first axial direction, and a load on the moving base disposed on both sides of the moving base. A pair of first cam guides, a common fixed base that holds the two first cam guides, and a first axial movement of the moving base, and the movement of the moving bases in the direction of the distance between the first cam guides. The moving base is moved to the first position so as to allow the base to be thermally displaced.
A first cam follower connected to the cam guide; 2. fixed to the common fixed base,
2. The moving base according to claim 1, further comprising a second cam guide connected by a second cam follower at a position near a moving center that moves along the first axial direction, and guiding the moving base in the first axial direction. 3. Parts transfer equipment. 3. A connecting member for connecting the two first cam guides, wherein at least one end of the connecting member is connected to the first cam guide so as to be movable in a longitudinal direction of the connecting member. , Both first along the longitudinal direction of the connecting member
3. The component conveying device according to claim 1, wherein a spring force is applied in a direction in which the cam guide approaches. 4. The component transfer device according to claim 1, wherein the common fixed base is located outside the insulated chamber, and the movable base is located inside the chamber. 5. The device according to claim 1, wherein the component holding unit is movably held in a second axis direction substantially perpendicular to the first axis direction with respect to the moving base. Parts transfer device. 6. The component conveying device according to claim 5, wherein the second axial direction is a vertical direction, and the component holding unit is held on a moving base by a spring. 7. The component conveying device according to claim 1, wherein said first cam guides are suspended from said common fixed base. 8. A component conveying device according to claim 1, wherein:
A test head for testing a component held by a component holding unit of the component transport device.