JP4100790B2 - Electronic component adsorption device and electronic component test device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component testing apparatus for testing an electronic component such as an IC chip at a predetermined temperature, and an electronic component adsorption device used for the electronic component testing apparatus, and particularly to damage of the electronic component by suppressing self-heating of the electronic component during a high temperature test. The present invention relates to an electronic component test apparatus and an electronic component adsorption apparatus that can prevent a problem and perform a test at an accurate temperature.
[0002]
[Prior art]
In the manufacturing process of a semiconductor device or the like, a test apparatus for testing an electronic component such as an IC chip finally manufactured is required. As one type of such a test apparatus, an apparatus for testing an IC chip under normal temperature, a temperature condition higher or lower than normal temperature is known. This is because, as a characteristic of the IC chip, it is necessary to ensure that it operates well even at room temperature, high temperature or low temperature.
[0003]
In this type of electronic component testing apparatus, the upper part of the test head is covered with a chamber to form a sealed space, the interior of the chamber is kept at a constant temperature environment such as normal temperature, high temperature or low temperature, and the IC chip is mounted on the test head. Then, the IC chip is pressed against the test head and electrically connected thereto to perform the test. By such a test, the IC chip is well tested and classified into at least a good product and a defective product.
[0004]
[Problems to be solved by the invention]
However, with the recent increase in the speed and integration of IC chips, the amount of self-heating during operation tends to increase, and this amount of self-heating tends to increase even during testing. For example, some types of IC chips generate self-heating of 30 watts.
[0005]
For this reason, for example, when a high temperature test of about 125 ° C. is performed, the amount of heat due to self-heating is applied to the IC chip in addition to this amount of heat, which may cause the temperature of the IC chip to exceed its allowable limit. Further, even in the normal temperature test and the low temperature test, even if the inside of the chamber is maintained at a constant temperature, the self-heating amount of the IC chip is generated, so that it becomes difficult to perform the test at the target test temperature.
[0006]
The present invention has been made in view of such problems of the prior art, and suppresses self-heating of electronic components during a high-temperature test to prevent damage to the electronic components and perform testing at an accurate temperature. It is an object of the present invention to provide an electronic component adsorption device and an electronic component test device that can perform the above-described process.
[0007]
[Means for Solving the Problems]
(1) In order to achieve the above object, an electronic component suction apparatus according to a first aspect of the present invention includes an adsorption head that adsorbs an electronic component, an adsorption force application unit that applies an adsorption force to the adsorption head, In an electronic component suction device that includes suction force breaking means for releasing the suction force, and performs suction holding and release of the electronic component,On the suction surface of the suction head, a groove portion through which a fluid for releasing the suction force of the suction head can pass is formed,When the electronic component is held in a fixed position,To cool the electronic componentsA fluid for releasing the suction force of the suction head is sprayed on the electronic component.
[0008]
  Claims8The electronic component testing apparatus includes a suction head that sucks an electronic component to be tested, a suction force applying unit that applies a suction force to the suction head, and a suction force destruction unit that releases the suction force of the suction head. In the electronic component testing apparatus for testing by pressing the terminal of the electronic component to be tested against the contact part of the test head,On the suction surface of the suction head, a groove portion through which a fluid for releasing the suction force of the suction head can pass is formed,The electronic device under test pressed against the suction head for at least an arbitrary time during the test of the electronic device under testTo test the electronic components under testOn the other hand, a fluid for releasing the suction force of the suction head is sprayed.
[0009]
When releasing an electronic component sucked by the suction head, it is often the case that the electronic component is not released smoothly by simply stopping the application of the suction force. The smaller and lighter the electronic component, the more pronounced this problem. For this reason, the suction force breaking means is provided, and the electronic component is released smoothly by forcing the suction fluid such as air back against the electronic component sucked and held by the suction head to release the suction force. To be done.
[0010]
In the present invention, by utilizing this suction force breaking means, a fluid for releasing the suction force of the suction head is sprayed on the electronic device under test pressed against the suction head for at least an arbitrary time during the test. The self-heating generated during the test can be dissipated to the surroundings. As a result, it is possible to prevent destruction or damage of electronic components due to overheating, which is a problem particularly in high-temperature tests.
[0011]
In addition to the high-temperature test, since the temperature rise due to self-heating is suppressed by spraying the fluid, the test can be performed at the target accurate temperature, and the reliability of the test result is improved.
[0013]
When the fluid flows in the groove formed on the suction surface, the cooling effect on the electronic component is promoted, and the above-described temperature rise suppression effect due to self-heating becomes more remarkable. Further, since the temperature rise suppression effect is enhanced, it is possible to cool with a small amount of fluid or by spraying a fluid for a short time.
[0014]
(2) In the above invention, the operation command for spraying the fluid is not particularly limited.2and10In the described invention, spraying of the fluid onto the electronic component is performed by sending a command signal from the control means to the suction force breaking means.
[0015]
The suction force applying means and the suction force breaking means are controlled in order to hold the electronic component on the suction head and release it from the suction head. The control means for controlling this control is shared or other control means is provided. For example, the fluid can be sprayed.
[0016]
(3In the above invention, the temperature of the fluid sprayed on the electronic component is not particularly limited.3and10The described invention further includes a temperature control unit that controls the fluid sprayed to the electronic component to a predetermined temperature.
[0017]
By controlling the temperature of the fluid sprayed on the electronic component to a predetermined temperature, the above-described cooling effect is more efficiently exhibited.
[0018]
(4) In the above invention, the specific configuration of the adsorption force applying means is not particularly limited.4and10In the described invention, the suction force applying means includes a fluid supply source, an ejector connected to the suction head, and an ejector valve provided in a fluid path including the fluid supply source, the ejector, and the suction head. It is characterized by including these.
[0019]
That is, by supplying a fluid such as air from the fluid supply source to the ejector, the electronic component can be sucked and held on the suction head. This adsorption force is turned on and off by opening and closing the ejector valve.
[0020]
  In the above invention, the specific configuration of the adsorption force breaking means is not particularly limited.5and10In the described invention, the adsorption force destruction means includes a fluid supply source and a destruction valve connected to the fluid supply source and the adsorption head.
[0021]
That is, by supplying a fluid such as air from the fluid supply source to the suction head, the fluid flows through the suction head in a direction opposite to the suction force, so that even a small and lightweight electronic component can be reliably and accurately released. be able to. This release ON / OFF is performed by opening and closing the destruction valve.
[0022]
(5) These claims4,5and10Although not particularly limited in the described invention, the claims6and10In the described invention, the fluid supply source of the adsorption force applying means and the fluid supply source of the adsorption force breaking means are the same fluid supply source. By doing so, the fluid supply circuit is simplified and the cost can be reduced.
[0023]
  These claims4,5and10Although not particularly limited in the described invention, the claims7and10In the described invention, the fluid that is sprayed onto the electronic component is commonly used as the fluid that is applied to the adsorption force applying means. This also simplifies the fluid supply circuit of the electronic component adsorption device and the electronic component test device, and can reduce the cost.
[0024]
(6The invention is not particularly limited, but the claims9The described invention further includes a chamber for maintaining a constant ambient temperature around the contact portion.
[0025]
When the present invention is applied to an electronic component testing apparatus that applies a predetermined temperature to an electronic component by keeping the atmospheric temperature in the chamber constant, the above-described effect becomes more prominent.
[0026]
(8) In the above invention, the type of fluid is not particularly limited, but air is more preferable in consideration of easy handling and low cost.
[0027]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing an embodiment of an electronic component testing apparatus according to the present invention, FIG. 2 is a conceptual diagram showing a method of routing an IC under test in the electronic component testing apparatus, and FIG. 3 is provided in the electronic component testing apparatus. FIG. 12 is a cross-sectional view (corresponding to the line XII-XII in FIG. 3) for explaining the method of routing the IC under test in the test chamber of the electronic component test apparatus. FIG. 13 is a cross-sectional view (corresponding to line XIII-XIII in FIG. 3) for explaining a method of routing the IC under test in the unloader section of the electronic component testing apparatus.
[0028]
2 and 3 are diagrams for understanding the IC handling method and the operation range of the transfer device in the electronic component test apparatus of the present embodiment, and are actually arranged in the vertical direction. There is also a portion in which the members that have been shown are shown in a plane. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.
[0029]
The electronic component test apparatus 1 according to the present embodiment determines whether or not the IC properly operates in a state in which the IC under test is subjected to a temperature stress at a normal temperature, a high temperature of about 125 ° C., or a low temperature of about −30 ° C., for example. Is an apparatus that classifies ICs according to the test results, and an operation test in a state where such temperature stress is applied is a tray (not shown) on which a number of ICs to be tested are mounted. Is omitted, but hereinafter also referred to as a customer tray KT), the IC under test is transferred to the IC carrier CR (see FIG. 5) transported in the electronic component testing apparatus 1 and implemented.
[0030]
For this reason, as shown in FIGS. 1 and 2, the electronic component testing apparatus 1 of the present embodiment stores ICs to be tested to be tested from now on, and also stores an IC storage unit 100 that classifies and stores tested ICs. And classifying the loader unit 200 for sending the IC under test sent from the IC storage unit 100 to the chamber unit 300, the chamber unit 300 including the test head, and the tested ICs that have been tested in the chamber unit 300. And an unloader unit 400 to be taken out.
[0031]
IC storage unit 100
The IC storage unit 100 is provided with a pre-test IC stocker 101 that stores ICs to be tested before testing, and a tested IC stocker 102 that stores ICs to be tested classified according to the test results.
[0032]
The pre-test IC stocker 101 and the tested IC stocker 102 are configured to include a frame-like tray support frame and an elevator that enters from the lower part of the tray support frame and can move up and down. Yes. A plurality of customer trays KT are stacked and supported on the tray support frame, and only the stacked customer trays KT are moved up and down by the elevator.
[0033]
The pre-test IC stocker 101 holds and holds the customer tray KT storing the IC under test to be tested, while the tested IC stocker 102 holds the IC under test after the test. The customer trays KT classified as appropriate are stacked and held.
[0034]
Since the pre-test IC stocker 101 and the tested IC stocker 102 have the same structure, the number of the pre-test IC stocker 101 and the tested IC stocker 102 is set to an appropriate number as necessary. be able to.
[0035]
In the example shown in FIG. 1 and FIG. 2, one stocker LD is assigned to the pre-test stocker 101, and one empty stocker EMP to be sent to the unloader unit 400 is assigned next to the stocker LD. Five stockers UL1, UL2,..., UL5 are assigned and can be sorted and stored in a maximum of five categories according to the test results. That is, in addition to good products and defective products, the non-defective products are classified into high-speed, medium-speed, low-speed, or defective products that require retesting.
[0036]
Loader unit 200
The above-described customer tray KT is carried from the lower side of the apparatus substrate 201 to the window 202 of the loader unit 200 by a tray transfer arm (not shown) provided between the IC storage unit 100 and the apparatus substrate 201. Then, in the loader unit 200, the ICs to be tested loaded on the customer tray KT are once transferred to the pitch conversion stage 203 by the first transfer device 204, and the mutual positions of the ICs to be tested are corrected here. After changing the pitch, the IC carrier that is further transferred to the pitch conversion stage 203 is stopped at the position CR1 (see FIG. 4) in the chamber 300 using the second transfer device 205. Transship to CR.
[0037]
The pitch conversion stage 203 provided on the apparatus substrate 201 between the window portion 202 and the chamber portion 300 has a relatively deep concave portion, and an IC in which the peripheral edge of the concave portion is surrounded by an inclined surface. When the IC under test adsorbed by the first transfer device 204 is dropped into the recess, the drop position of the IC under test is corrected on the inclined surface. Thereby, for example, the mutual positions of four ICs to be tested are accurately determined, and even if the mounting pitches of the customer tray KT and the IC carrier CR are different, the ICs to be tested whose positions have been corrected and changed in pitch are second. The IC to be tested can be accurately loaded in the IC accommodating portion 14 formed on the IC carrier CR by adsorbing with the transfer device 205 and transferring it to the IC carrier CR.
[0038]
As shown in FIG. 3, the first transfer device 204 for transferring the IC under test from the customer tray KT to the pitch conversion stage 203 includes a rail 204a installed on the upper portion of the device substrate 201 and a customer tray by the rail 204a. A movable arm 204b that can reciprocate between the KT and the pitch conversion stage 203 (this direction is defined as a Y direction), and a movable arm supported by the movable arm 204b and movable in the X direction along the movable arm 204b. And a head 204c.
[0039]
A suction head 204d is mounted downward on the movable head 204c of the first transfer device 204. The suction head 204d moves while sucking air, thereby sucking the IC under test from the customer tray KT. Then, the IC under test is dropped into the pitch conversion stage 203. For example, about four suction heads 204d are attached to the movable head 204c, and four ICs to be tested can be dropped onto the pitch conversion stage 203 at a time.
[0040]
On the other hand, the second transfer device 205 for transferring the IC to be tested from the pitch conversion stage 203 to the IC carrier CR1 in the chamber section 300 has the same configuration. As shown in FIGS. A rail 205a installed on the top of the test chamber 301, a movable arm 205b that can reciprocate between the pitch conversion stage 203 and the IC carrier CR1 by the rail 205a, and a movable arm supported by the movable arm 205b. And a movable head 205c that can move in the X direction along 205b.
[0041]
A suction head 205d is mounted downward on the movable head 205c of the second transfer device 205, and the suction head 205d moves while sucking air, so that the IC to be tested can be removed from the pitch conversion stage 203. And the IC under test is transferred to the IC carrier CR1 via the inlet 303 provided in the ceiling of the test chamber 301. For example, about four such suction heads 205d are attached to the movable head 205c, and four ICs to be tested can be transferred to the IC carrier CR1 at a time.
[0042]
Chamber part 300
The chamber section 300 according to the present embodiment has a constant temperature function for applying a target high or low temperature stress to the IC under test loaded on the IC carrier CR, and the device under test is in a state where the heat stress is applied. The IC is brought into contact with the contact portion 302a of the test head 302 in a constant temperature state, and a tester (not shown) performs the test.
[0043]
Incidentally, in the electronic component testing apparatus 1 according to the present embodiment, when a low temperature stress is applied to the IC under test, heat is removed by a hot plate 401 described later to prevent condensation on the IC under test. When high temperature stress is applied to the test IC, heat is removed by natural heat dissipation. However, if a separate heat removal tank or heat removal zone is provided and a high temperature is applied, the IC under test is cooled by air blowing to return to room temperature, and if a low temperature is applied, the IC under test is heated with air or a heater. It may be configured to return to a temperature at which no condensation occurs by heating.
[0044]
The test head 302 having the contact portion 302a is provided at the center lower side of the test chamber 301, and the stationary position CR5 of the IC carrier CR is provided on both sides of the test head 302. Then, the IC under test placed on the IC carrier CR that has been transported to the position CR5 is directly carried onto the test head 302 by the third transfer device 304, and the IC under test is electrically contacted with the contact portion 302a. The test is performed.
[0045]
Further, the IC under test that has finished the test is not returned to the IC carrier CR, but is loaded onto the exit carrier EXT that moves in and out to the positions CR5 on both sides of the test head 102, and is carried out of the chamber section 300. When a high temperature stress is applied, the heat is naturally removed after unloading from the chamber section 300.
[0046]
4 is a perspective view of a main part for explaining the IC carrier transport path in the present embodiment, FIG. 5 is a perspective view showing the embodiment of the IC carrier, and FIG. 6 is a sectional view taken along line VI-VI in FIG. 7 is a sectional view taken along the line VII-VII in FIG. 5 (shutter open), and FIG. 8 is a plan view for explaining the test sequence of the IC under test in the chamber section 300.
[0047]
First, the IC carrier CR of the present embodiment is circulated and conveyed in the chamber unit 300. FIG. 4 shows this handling state. In the present embodiment, first, an IC carrier CR1 on which the IC under test sent from the loader unit 200 is loaded is positioned in front of and behind the chamber unit 300, respectively. The IC carrier CR at the position CR1 is transported to a horizontal position CR2 by a horizontal transport device (not shown).
[0048]
Strictly speaking, the position where the IC under test is received from the second transfer device 205 is slightly above the position CR1 shown in the figure (this position is indicated by a two-dot chain line in FIG. 4). This is to prevent the heat release in the chamber unit 300 by allowing the IC carrier CR to face the entrance 303 opened on the ceiling of the test chamber 301 from below and shielding the entrance 303 with the IC carrier CR. Therefore, the IC carrier CR slightly rises from the position CR1 when receiving the IC under test.
[0049]
The IC carrier CR transported to the position CR2 is transported in a state where it is stacked in the vertical direction by the elevator 311 shown in FIG. 4 and waits until the IC carrier at the position CR5 becomes empty. The sheet is transported from the lower position CR3 to a position CR4 substantially the same as the test head 302 by a horizontal transport device (not shown). Mainly during this conveyance, high or low temperature stress is applied to the IC under test.
[0050]
Further, a horizontal transport device (not shown) transports the test head 302 from the position CR4 to the horizontal position CR5, where only the IC under test is sent to the contact portion 302a of the test head 302. The IC carrier CR after the IC to be tested is sent to the contact portion 302a is transported from the position CR5 to the horizontal position CR6 by a horizontal transport device (not shown), and then lifted upward in the vertical direction by the elevator 314. It is conveyed and returns to the original position CR1.
[0051]
Thus, since the IC carrier CR is circulated and conveyed only in the chamber part 300, once the temperature is raised or lowered, the temperature of the IC carrier itself is maintained, and as a result, in the chamber part 300 Thermal efficiency will be improved.
[0052]
FIG. 5 is a perspective view showing the structure of the IC carrier CR of the present embodiment. Eight concave portions 12 are formed on the upper surface of the strip-shaped plate 11, and an IC housing for placing an IC under test in each of the concave portions 12 is shown. Two portions 14 are formed.
[0053]
Sixteen IC accommodating portions 14 of the present embodiment are formed along the longitudinal direction of the plate 11 by attaching the block 13 to the recess 12, and the mounting pitch P of the IC under test in the longitudinal direction of the plate 11 is formed.₁(See FIG. 8) are set at equal intervals.
[0054]
Incidentally, a guide plate 17 in which a guide hole (see FIG. 6) 171 is formed between the concave portion 12 of the plate 11 and the blocks 13 and 13 is sandwiched in the IC housing portion 14 of the present embodiment. When the IC under test cannot be ensured in positioning accuracy depending on the outer periphery of the package mold like the BGA type IC of the chip size package, the solder ball terminal HB of the IC under test is connected by the peripheral edge of the guide hole 171 of the guide plate 17. Positioning can be performed, thereby improving the contact accuracy with the contact pin.
[0055]
As shown in FIG. 5, the IC carrier CR has a shutter 15 for opening and closing the opening surface of the IC carrier CR in order to prevent the IC under test housed in the IC housing portion 14 from being displaced or popped out. Is provided.
[0056]
The shutter 15 is openable and closable with respect to the plate 11 by a spring 16. A shutter opening / closing mechanism 182 is used when the IC under test is accommodated in the IC accommodating portion 14 or taken out from the IC accommodating portion 14. By opening the shutter 15 as shown in FIG. 7, the IC under test is accommodated or removed. On the other hand, when the shutter opening / closing mechanism 182 is released, the shutter 15 returns to the original state by the elastic force of the spring 16, and the opening surface of the IC accommodating portion 14 of the plate 11 is covered by the shutter 15, as shown in FIG. As a result, the IC under test accommodated in the IC accommodating portion 14 is held without being displaced or popped out even during high-speed conveyance.
[0057]
As shown in FIG. 5, the shutter 15 of the present embodiment is supported by three pulleys 112 provided on the upper surface of the plate 11, and the central pulley 112 is engaged with a long hole 152 formed in the shutter 15. The two pulleys 112 and 112 provided at both ends respectively hold the both end edges of the shutter 15.
[0058]
However, the engagement between the central pulley 112 and the long hole 152 of the shutter 15 is such that there is almost no backlash in the longitudinal direction of the plate 11. A slight gap is provided between the edges. Thus, even if thermal stress acts on the IC carrier CR in the chamber portion 300, the expansion or contraction caused by the stress is distributed to both ends around the central pulley 112, and is appropriately absorbed by the gap provided at both ends. Is done. Therefore, the amount of expansion or contraction of the entire shutter 15 in the longitudinal direction is halved at both ends where the shutter 15 expands or contracts most, thereby reducing the difference from the amount of expansion or contraction of the plate 11.
[0059]
The shutter opening / closing mechanism of the present embodiment is configured as follows.
First, in the routing route of the IC carrier CR shown in FIG. 4, the position where the shutter 15 needs to be opened is the position CR1 for receiving the IC under test from the second transfer device 205 (strictly, the window portion slightly above it). 303) and a position CR5 where the IC under test is transferred to the contact portion 302a of the test head 302 by the third transfer device 304.
[0060]
In the present embodiment, as shown in FIGS. 4, 6, and 7, a fluid pressure cylinder 182 that opens and closes by opening and closing the opening and closing block 181 provided on the upper surface of the shutter 15 is employed as the shutter opening and closing mechanism at the position CR <b> 1. Has been. The fluid pressure cylinder 182 is attached to the test chamber 301 side. Then, as shown in FIGS. 6 and 7, the rod of the fluid pressure cylinder 182 is moved backward with respect to the IC carrier CR in a stopped state, so that the shutter 15 is opened while hooking the opening / closing block 181 provided on the shutter 15. open. When the mounting of the IC under test is completed, the shutter 15 is closed by advancing the rod of the fluid pressure cylinder 182.
[0061]
On the other hand, at the position CR5 near the test head 302, the IC carrier CR itself is moved by a horizontal transport device (not shown), and the shutter 15 is opened and closed using this. For example, the IC carrier CR is transported horizontally from the position CR4 to the position CR5, and a stopper for opening and closing the shutter 15 is provided on the way to the test chamber 301 side, and the IC carrier CR is positioned from the position CR4. When moving to CR5, the shutter 15 is provided at a position that contacts the opening / closing block 181. The position where the stopper is provided is also a position where the shutter 15 is fully opened when the IC carrier CR stops at the position CR5. In this example, since the shutter 15 is provided with the two opening / closing blocks 181, two stoppers are also provided. As a result, the shutter 15 is also fully opened along with the horizontal conveyance of the IC carrier CR.
[0062]
When the IC carrier CR is transported from the position CR5 to CR6, the shutter 15 needs to be closed. For this reason, for example, a cam surface is formed on the stopper described above, and when the IC carrier CR is transported from the position CR5 to the position CR6, the rear end portion of the opening / closing block 181 of the shutter 15 is placed on the cam surface. The shutter 15 is gradually closed by continuing the contact.
[0063]
Incidentally, the movable heads 205c and 304b of the second transfer device 205 and the third transfer device 304 are provided with positioning pins for alignment with the IC carrier CR when the IC under test is delivered. Yes. As a representative example, FIG. 6 shows the movable head 205c of the second transfer device 205, but the movable head 304b of the third transfer device 304 has the same configuration.
[0064]
As shown in the figure, the movable head 205c is provided with two positioning pins 205e, 205e across one IC under test. Therefore, positioning holes 113 and 113 for engaging the positioning pins 205e and 205e are formed on the plate 11 side of the IC carrier CR. Although not particularly limited, in this example, one positioning hole 113 (right side in FIG. 6) is a perfect circular hole, and the other positioning hole (left side in the same figure) is a long circular hole that is long in the width direction. As a result, the positioning is mainly performed in one positioning hole 113 and the position error with respect to the positioning pin 205e is absorbed by the other positioning hole 113. Further, a tapered surface for calling the positioning pin 205e is formed on the upper surface of each positioning hole 113.
[0065]
Reference numeral “153” shown in FIG. 7 is an opening through which the positioning pin 205e can engage with the positioning hole 113 when the shutter 15 is opened.
[0066]
In the electronic component testing apparatus 1 of the present embodiment, when all the ICs to be tested are transferred to the test head 302 by the third transfer device 304 at the position CR5 in the vicinity of the test head 302, the IC carrier CR is moved to the position CR5. In this case, a residual detection device is provided in order to confirm that no IC under test remains in any of the IC accommodating portions 14 of the IC carrier CR.
[0067]
This residual detection device has a photoelectric sensor provided in the middle of positions CR5 to CR6 shown in FIG. 4, and irradiates detection light in the Z-axis direction along the center line CL of the IC carrier CR shown in FIG. Is received. In order to allow this detection light to pass, through holes 111 are provided in the bottom surface of the IC accommodating portion 14 of the plate 11, and through holes 154 are also provided in the shutter 15 at positions corresponding to the respective IC accommodating portions 14. Yes. As a result, when the IC carrier CR finishes delivering the IC under test and moves from the position CR5 to CR6, the movement pulse signal is received from the encoder of the horizontal transfer device, thereby the position of the IC accommodating portion 14 of the IC carrier CR. The timing is confirmed, and the light reception status of the photoelectric sensor at the timing is confirmed. Here, if the IC under test remains in the IC accommodating portion 14, light reception by the photoelectric sensor is not confirmed, so that, for example, an alarm is issued to indicate an abnormality.
[0068]
In the test head 302 of this embodiment, eight contact portions 302a have a constant pitch P.₂As shown in FIG. 8, the suction arm 304c of the contact arm also has the same pitch P.₂Is provided. The IC carrier CR has a pitch P₁16 ICs under test are accommodated, and at this time, P₂= 2 ・ P₁It is said that
[0069]
The IC under test connected to the test head 302 at one time is different from the IC under test arranged in 1 row × 16 columns as shown in FIG. ) Are tested simultaneously.
[0070]
That is, in the first test, eight ICs to be tested arranged in rows 1, 3, 5, 7, 9, 11, 13, 15 are connected to the contact portion 302a of the test head 302 and tested. In the second test, the IC carrier CR is set to P for one row pitch.₁The ICs to be tested arranged in rows 2, 4, 6, 8, 10, 12, 14, and 16 are similarly tested. For this reason, the IC carrier CR that has been transported to the positions CR5 on both sides of the test head 302 has a pitch P in the longitudinal direction by a horizontal transport device (not shown).₁Just move.
[0071]
Incidentally, the result of this test is stored in an address determined by, for example, the identification number assigned to the IC carrier CR and the number of the IC under test assigned inside the IC carrier CR.
[0072]
In the electronic component test apparatus 1 of the present embodiment, a third transfer device 304 is provided in the vicinity of the test head 302 in order to transfer the IC under test to the contact portion 302 a of the test head 302 and perform the test.
[0073]
FIG. 9 is a front view showing the embodiment of the suction device (as viewed in the direction of arrow IX in FIG. 3), FIG. 10 is a cross-sectional view of the main part of the suction device and a circuit block, and FIG. It is a bottom view.
[0074]
The third transfer device 304 shown in FIG. 12 includes a rail 304a provided along the stationary position CR5 of the IC carrier CR and the extending direction (Y direction) of the test head 302, and the rail 304a. A movable head 304b that can reciprocate between the stationary position CR5 of the carrier CR and a suction head 304c provided downward on the movable head 304b are provided.
[0075]
The suction head 304c is configured to be movable in the vertical direction by a driving device (not shown) (for example, a fluid pressure cylinder or an electric motor). By moving the suction head 304c up and down, the IC under test can be sucked and the IC under test can be pressed against the contact portion 302a.
[0076]
The suction head 304c of this embodiment will be described in more detail.
As shown in FIGS. 9 and 10, the suction head 304c is attached to a Z-axis direction driving device (not shown), and moves up and down with respect to the contact portion 302a, and a floating mechanism with respect to the pusher base 304c1. A suction pad 304c2 for sucking an IC under test is fixed to the movable base 304c3. The suction pad 304c2 is fixed to the movable base 304c3.
[0077]
This state is shown in FIGS. 10 and 11. The suction head main body 304c10 fixed to the movable base 304c3 has a substantially rectangular parallelepiped shape, and a through hole 304c11 for performing vacuuming is formed therein. The suction pad 304c2 made of an elastic body is fixed in the suction head main body 304c10, and the suction force when evacuated is applied to the tip of the suction pad 304c2.
[0078]
Further, a plurality of (here, four) groove portions 304c12 as shown in FIG. 11 are formed on the suction surface of the suction head main body 304c10, and the IC under test is shown in FIG. In a state of being pressed against the contact portion 302a, the through hole 304c11 of the suction head main body 304c10 is communicated with the outside. Note that the shape and quantity of the groove 304c12 shown in FIG. 11 are merely examples, and can be appropriately changed according to various conditions such as the self-heating amount of the IC under test and the air temperature.
[0079]
The suction head 304c is provided with a pneumatic circuit 305 shown in FIG. This pneumatic circuit 305 uses factory air (air piping system routed in the factory), an air source 305a (corresponding to the fluid supply source of the present invention) such as a dedicated compressor, and compressed air as a drive source. An ejector 305c that performs evacuation and an ejector valve 305b that performs ON / OFF of the ejector 305c are connected in series, and the suction force generated by this circuit is applied to the suction pad 304c2 through the through hole 304c11 of the suction head 304c. Is granted.
[0080]
Further, a break valve 305e is provided in a circuit branched in parallel from the air source 305a, and the tip thereof is also connected to the through hole 304c11 of the suction head 304c. The destruction valve 305e has a function of opening the IC to supply compressed air from the air source 305a to the suction pad 304c2, thereby releasing the IC under test attached to the suction pad 304c2. That is, when the IC under test is released, the destruction valve 305e is instantaneously opened.
[0081]
Particularly in this embodiment, the compressed air from the destruction valve 305e is used to dissipate the self-heating generated during the test of the IC under test. That is, the control of the opening / closing of the ejector valve 305b when performing evacuation and the opening / closing of the release valve 305e when releasing the IC under test is performed by either a command signal (electrical or pneumatic / hydraulic) from the control device 305f. When the IC under test is held by suction, the destruction valve 305e is closed and the ejector valve 305b is opened. When the IC under test held by suction is pressed against the contact portion 302a, the ejector valve 305b is also closed.
[0082]
At this time, since the IC under test is fixed by the suction head 304c and the contact portion 203a, the air source 305a is not used. Accordingly, the destruction valve 305e is opened while the ejector valve 305b is closed, and the compressed air from the air source 305a is blown through the hole 304c11 to the IC under test. As a result, compressed air, which is normally at normal temperature, is blown onto the IC under test and flows through the groove 304c12 formed on the suction surface, so that even if the IC under test self-heats, it is cooled. can do.
[0083]
At this time, although not particularly limited, as shown in FIG. 10, a temperature control unit 305d for controlling the temperature of the compressed air is provided in the circuit of the destruction valve 305e, and the temperature of the air blown to the IC under test is self-heated. It is more preferable to set an appropriate value according to the amount and the test temperature.
[0084]
When the compressed air is blown onto the IC under test, the destruction valve 305e does not need to be normally opened, and the flow rate can be controlled by, for example, an ON / OFF duty ratio.
[0085]
The floating mechanism 304c6 interposed between the pusher base 304c1 and the movable base 304c3 is configured as follows. First, a guide pin 304c5 that engages with a guide bush 302a2, which is one guide means to be described later, is fixed to the movable base 304c3 at the center thereof, and its proximal end is a small-diameter pin fixed to the pusher base 304c1. 304c7 is inserted. As a result, the movable base 304c3 can move with respect to the pusher base 304c1 by the gap between the guide pin 304c5 and the small diameter pin 304c7 in the XY plane.
[0086]
The movable base 304c3 can move upward in the Z-axis direction with respect to the pusher base 304c1, but the movable base 304c3 is provided by a spring 304c8 interposed between the pusher base 304c1 and the movable base 304c3. Is biased away from the pusher base 304c1. Therefore, when no external force is applied, the state shown in FIG. 9 is maintained. However, when the external force is applied in the X direction or the Y direction when the guide pin 304c5 and the guide bush 302a2 are engaged, the movable base 304c3 becomes the pusher base. It moves in the XY plane with respect to 304c1. Further, if the XY plane of the movable base 304c3 is inclined when a fluid pressure cylinder 304c4 described later presses the movable base 304c3 via the pressing block 304c9, the movable base 304c3 is pushed against the elastic force of the spring 304c8. The posture is changed with respect to 304c1.
[0087]
In the suction head 304c of this embodiment, a fluid pressure cylinder 304c4 is fixed to a base 304b1 to which a pusher base 304c1 is attached, and a pressing block 304c9 is attached to the movable base 304c3. Comes into contact with and presses the upper surface of the pressing block 304c9, and the movable base 304c3 is pressed through this.
[0088]
The suction head 304c of the present embodiment is provided such that eight movable bases 304c3 float independently of each other with respect to one common pusher base 304c1, and the above-described fluid pressure cylinders 304c4 are also movable. It is provided at a position independent from the base 304c3 (base 304b1).
[0089]
A guide pin 304c5 having a tapered surface at the tip is fixed to the movable base 304c3, and a guide bush 302a2 is fixed to the contact portion 302a. The guide pin 304c5 and the guide bush 302a2 constitute guide means of the present invention. When the suction head 304c is lowered toward the contact portion 302a, the guide pin 304c5 is engaged with the guide bush 302a2 from the tapered surface. The movable base 304c3 is aligned with the contact portion 302a.
[0090]
In addition, when the type of IC under test is changed and the type of the contact portion 302a is changed, the type of the suction head 304c is also changed. In this embodiment, however, the parts below the pusher base 304c1 shown in FIG. As a change kit, the base 304b1 and the fluid pressure cylinder 304c4 are used as they are. As a result, the cost of the change kit can be reduced by minimizing the components of the change kit, and the weight of the change kit can also be minimized, thereby improving the replacement workability.
[0091]
As shown in FIG. 12, in the third transfer device 304 of this embodiment, two movable heads 304b are provided on one rail 304a, and the distance between them is a stationary position CR5 of the test head 302 and the IC carrier CR. And is set equal to the interval. The two movable heads 304b are simultaneously moved in the Y direction by one drive source (for example, a ball screw device), while the respective suction heads 304c are moved in the vertical direction by independent drive devices.
[0092]
As described above, each of the suction heads 304c can suck and hold eight ICs to be tested at a time, and the interval is set equal to the interval of the contact portions 302a.
[0093]
Unloader unit 400
The unloader unit 400 is provided with an exit carrier EXT for delivering the above-described tested IC from the chamber unit 300. As shown in FIGS. 3 and 12, the exit carrier EXT is configured to reciprocate in the X direction between positions EXT1 on both sides of the test head 302 and position EXT2 of the unloader unit 400. At positions EXT1 on both sides of the test head 302, as shown in FIG. 12, in order to avoid interference with the IC carrier CR, the suction head 304c of the third transfer device 304 is slightly above the stationary position CR5 of the IC carrier. Invade so as to overlap slightly below.
[0094]
Although the specific structure of the exit carrier EXT is not particularly limited, it can be configured by a plate in which a plurality of recesses (eight in this case) capable of accommodating the IC under test are formed as in the IC carrier CR shown in FIG.
[0095]
Two exit carriers EXT are provided on each side of the test head 302. While one of the exit carriers EXT moves to the position EXT1 of the test chamber 301, the other moves to the position EXT2 of the unloader unit 400. The operation is almost symmetrical.
[0096]
Returning to FIG. 3, in the electronic component testing apparatus 1 of the present embodiment, a hot plate 401 is provided in the vicinity of the position EXT2 of the exit carrier EXT. This hot plate 401 is for heating to a temperature at which dew condensation does not occur when a low temperature stress is applied to the IC under test. Therefore, when a high temperature stress is applied, the hot plate 401 401 need not be used.
[0097]
The hot plate 401 of the present embodiment corresponds to 32 columns of 16 devices under test, 2 columns × 16 rows, corresponding to the fact that a suction head 404d of a fourth transfer device 404 described later can hold 8 ICs to be tested at a time. An IC can be accommodated. Then, corresponding to the suction head 404d of the fourth transfer device 404, the hot plate 401 is divided into four regions, and eight tested ICs sucked and held from the exit carrier EXT2 are placed in these regions in order, Eight ICs to be tested that have been heated for a long time are directly sucked by the suction head 404 d and transferred to the buffer unit 402.
[0098]
Two buffer units 402 each having a lifting table 405 are provided in the vicinity of the hot plate 401. FIG. 13 is a cross-sectional view taken along the line XIII-XIII in FIG. 3. The lifting table 405 of each buffer unit 402 has the same level position (Z direction) as the exit carrier EXT2 and the hot plate 401 and the level position above it. Specifically, it moves in the Z direction between the level position of the device substrate 201. The specific structure of the buffer unit 402 is not particularly limited. For example, like the IC carrier CR and the exit carrier EXT, the buffer unit 402 is configured by a plate in which a plurality of recesses (eight in this case) can be accommodated. Can do.
[0099]
The pair of lift tables 405 perform a substantially symmetric operation in which one of them is stationary at the raised position while the other is stationary at the lowered position.
[0100]
The unloader unit 400 in the range from the exit carrier EXT2 to the buffer unit 402 described above is provided with a fourth transfer device 404. As shown in FIGS. 3 and 13, the fourth transfer device 404 includes a rail 404 a installed on the upper portion of the device substrate 201, and the rail 404 a between the exit carrier EXT 2 and the buffer unit 402 in the Y direction. A movable arm 404b that can move, and a suction head 404c that is supported by the movable arm 404b and that can move up and down in the Z direction with respect to the movable arm 404b. The suction head 404c sucks air in the Z direction and the Y direction. By moving, the IC under test is sucked from the exit carrier EXT, the IC under test is dropped onto the hot plate 401, and the IC under test is picked up from the hot plate 401 and dropped into the buffer unit 402. Eight suction heads 404c according to this embodiment are mounted on the movable arm 404b, and can transfer eight ICs to be tested at a time.
[0101]
Incidentally, as shown in FIG. 13, the movable arm 404 b and the suction head 404 c are set to positions that can pass through a level position between the rising position and the lowering position of the lifting table 405 of the buffer unit 402. Even if the lift table 405 is in the raised position, the IC under test can be transferred to the other lift table 405 without interference.
[0102]
Further, the unloader unit 400 is provided with a fifth transfer device 406 and a sixth transfer device 407, and the third and sixth transfer devices 406 and 407 have tested the objects to be transported to the buffer unit 402. The test IC is transferred to the customer tray KT.
[0103]
For this reason, the apparatus substrate 201 is provided with four windows 403 for arranging the empty customer tray KT transported from the empty stocker EMP of the IC storage unit 100 so as to face the upper surface of the apparatus substrate 201. ing.
[0104]
As shown in FIGS. 1, 3 and 13, the fifth transfer device 406 includes a rail 406 a installed on the upper part of the device substrate 201, and the rail 406 a between the buffer unit 402 and the window unit 403 in the Y direction. A movable arm 406b that can move, a movable head 406c that is supported by the movable arm 406b and can move in the X direction with respect to the movable arm 406b, and a suction head 406d that is attached downward to the movable head 406c and can move up and down in the Z direction. It has. The suction head 406d moves in the X, Y, and Z directions while sucking air, thereby sucking the IC under test from the buffer unit 402 and transferring the IC under test to the customer tray KT of the corresponding category. . Two suction heads 406d of this embodiment are mounted on the movable head 406c, and two ICs to be tested can be transferred at a time.
[0105]
In the fifth transfer device 406 of this embodiment, the movable arm 406b is formed short so that the IC under test is transferred only to the customer tray KT set in the two windows 403 at the right end. It is effective to set a customer tray KT of a category with a high occurrence frequency in the two windows 403 at the right end.
[0106]
On the other hand, as shown in FIGS. 1, 3 and 13, the sixth transfer device 406 includes two rails 407a and 407a installed on the upper portion of the device substrate 201, and a buffer section by the rails 407a and 407a. A movable arm 407b that can move between the window 402 and the window portion 403 in the Y direction, a movable head 407c that is supported by the movable arm 407b and that can move in the X direction with respect to the movable arm 407b, and downward toward the movable head 407c. A suction head 407d that is attached and can move up and down in the Z direction is provided. The suction head 407d moves in the X, Y, and Z directions while sucking air, thereby sucking the IC under test from the buffer unit 402 and transferring the IC under test to the customer tray KT of the corresponding category. . Two suction heads 407d of this embodiment are mounted on the movable head 407c, and can transfer two ICs to be tested at a time.
[0107]
The fifth transfer device 406 described above transfers the IC under test only to the customer tray KT set in the two window portions 403 on the right end, whereas the sixth transfer device 407 is provided to all the window portions 403. The IC under test can be transferred to the set customer tray KT. Therefore, the IC under test having a high occurrence frequency is classified using the fifth transfer device 406 and the sixth transfer device 407, and the IC under test having a low occurrence frequency is classified as the sixth transfer device 407. Can be classified only by.
[0108]
In order to prevent the suction heads 406d and 407d of the two transfer devices 406 and 407 from interfering with each other, the rails 406a and 407a are provided at different heights as shown in FIGS. Even if 406d and 407d operate simultaneously, they are configured so as to hardly interfere. In the present embodiment, the fifth transfer device 406 is provided at a position lower than the sixth transfer device 407.
[0109]
Incidentally, although not shown in the figure, an elevating table for elevating and lowering the customer tray KT is provided on the lower side of the apparatus substrate 201 of each window 403, and the tested ICs to be tested are reloaded to be full. The customer tray KT is placed and lowered, the full tray is transferred to the tray transfer arm, and is transported to the corresponding stockers UL1 to UL5 of the IC storage unit 100 by the tray transfer arm. The empty customer tray KT is transported from the empty stocker EMP to the window 403 that has been emptied after the customer tray KT is dispensed by the tray transfer arm, and is placed on the lifting table and set in the window 403. The
[0110]
One buffer unit 402 of the present embodiment is capable of storing 16 ICs to be tested, and is provided with memories for storing the categories of ICs to be tested stored in the respective IC storage positions of the buffer unit 402. .
[0111]
Then, the category and position of the IC under test stored in the buffer unit 402 are stored for each IC under test, and the customer tray KT of the category to which the IC under test stored in the buffer unit 402 belongs is stored in the IC. Called from the unit 100 (UL1 to UL5), the tested ICs are stored in the corresponding customer trays KT by the third and sixth transfer devices 406 and 407 described above.
[0112]
Next, the operation will be described.
The stocker LD of the IC storage unit 100 stores a customer tray KT on which an IC before the test is mounted. The customer tray KT is set in the window unit 202 of the loader unit 200. From the customer tray KT facing the upper surface of the device substrate 201, for example, four ICs to be tested are sucked at a time using the first transfer device 204, and then dropped onto the pitch conversion stage 203 to be tested. IC position correction and pitch change are performed.
[0113]
Next, using the second transfer device 205, for example, four ICs to be tested dropped onto the pitch conversion stage 203 are adsorbed at a time and carried into the test chamber 301 from the inlet 303 to the position CR1. Place it on a stationary IC carrier CR. Since the position CR1 is provided in two places in the test chamber 301, the second transfer device 205 carries the IC under test alternately with respect to these two IC carriers CR. At this time, the shutter 15 of the IC carrier CR is opened and closed by the fluid pressure cylinder 182 (see FIG. 4).
[0114]
When 16 ICs to be tested are placed at the respective positions CR1, the IC carrier CR is transported in the test chamber 301 in the order CR1 → CR2 →... → CR4 shown in FIG. High or low temperature stress is applied.
[0115]
When the IC carrier CR on which the pre-test IC is mounted is transported to the positions CR5 on both sides of the test head 302, the shutter 15 of the IC carrier 15 is opened by a stopper (not shown), and the third carrier as shown in FIG. One suction head (here, the left side) 304c of the transfer device 304 is lowered to suck every other IC under test (see FIG. 8), and then rises again to stand by. At the same time, the other suction head (here, the right side) 304c presses the eight ICs to be tested against the contact portion 302a of the test head 302 to execute the test. When the IC to be tested is held by suction, as shown in FIG. 10, a command signal is sent from the control device 305f to the ejector valve 305b and the release valve 305e, and the release valve 305e is closed and the ejector valve 305b is opened. .
[0116]
At this time, the exit carrier EXT (indicated by a two-dot chain line) does not exist on the upper side of the left IC carrier CR5 and has moved to the position EXT2 outside the test chamber 301. Further, the exit carrier EXT is present in the EXT1 on the upper side of the right IC carrier CR5, and the test of the IC under test sucked by the right suction head 304c is awaited.
[0117]
As shown in FIG. 9, the suction head 304c that sucks eight ICs to be tested to the suction pad 304c2 is lowered entirely by a Z-axis drive device (not shown). At this time, the guide pin 304c5 is engaged with the guide bush 302a2. As a result, the movable base 304c3 floats at an appropriate position with respect to the contact portion 302a.
[0118]
Before and after the solder ball terminal HB of the IC under test contacts the contact pin 302a1 of the contact portion 302a, the fluid pressure cylinder 304c4 is operated to advance the rod tip, thereby pressing the upper surface of the movable base 304c3 via the pressing block 304c9. To do. By this pressing action, even if the entire pusher base 304c1 of the suction head 304c is deformed due to thermal stress or processing failure, it can be absorbed, and each solder ball terminal HB of the IC under test can be absorbed by each contact pin 302a1. The force pressed against is almost even.
[0119]
Further, when the IC under test is pressed against the contact portion 302a, evacuation up to that point is no longer necessary, so a command signal is sent from the control device 305f to the ejector valve 305b, and the ejector valve 305b is closed.
[0120]
Then, the destruction valve 305e is opened while the ejector valve 305b is closed, and the compressed air from the air source 305a is blown to the IC under test through the through hole 304c11. As a result, the compressed air, which is generally set to normal temperature, or the compressed air set to an appropriate temperature by the temperature control unit 305d is blown to the IC under test, and further flows through the groove 304c12 formed on the suction surface. Therefore, even if the IC under test self-heats, it can be cooled.
[0121]
When the test of the eight ICs to be tested attracted to the right suction head 304c is completed in this way, as shown in FIG. 12B, these movable heads 304b and 304b are moved to the right side, and the left suction head 304c is moved. The eight ICs to be tested adsorbed onto the test head are pressed against the contact portion 302a of the test head 302 to perform the test.
[0122]
On the other hand, the eight tested ICs sucked by the right suction head 304c are placed on the waiting exit carrier EXT, and then the exit carrier EXT on which the tested IC is placed is placed in the test chamber 301. It moves from position EXT1 to position EXT2 outside the test chamber 301.
[0123]
Thus, when the exit carrier EXT moves out of the test chamber 301, the right suction head 304c descends toward the IC carrier CR at the right position CR5, and sucks the remaining eight ICs to be tested and rises again. Then, it waits for the test of the IC under test sucked by the left suction head 304c to end. Before the suction head 304c is sucked, the IC carrier CR has a pitch P so that the remaining IC under test can be sucked by the suction head 304c.₁Only move (see FIG. 8).
[0124]
At the same time, the left exit carrier EXT moves into the test chamber 301 and waits at this position EXT1 for the test of the IC under test sucked by the left suction head 304c to end.
[0125]
Thus, when the test of the IC under test sucked by the left suction head 304c is completed, these movable heads 304b and 304b are moved to the left side, and the remaining eight ICs to be tested sucked by the right suction head 304c are moved. The test is performed by pressing against the contact portion 302a of the test head 302.
[0126]
On the other hand, the eight tested ICs sucked by the left suction head 304c are placed on the waiting exit carrier EXT, and then the exit carrier EXT on which the tested IC is placed is placed in the test chamber 301. It moves from position EXT1 to position EXT2 outside the test chamber 301.
[0127]
Hereinafter, this operation is repeated, but the two suction heads 304c are alternately accessed to one contact portion 302a, and one of them waits for the other test to be completed. The time for adsorbing the IC is absorbed in the other test time, and the index time can be shortened accordingly.
[0128]
On the other hand, eight ICs to be tested that have completed the test with the test head 302 described above are alternately delivered to the position EXT2 outside the test chamber 301 by two exit carriers EXT.
[0129]
As shown in FIG. 13, the eight tested ICs delivered to the right position EXT2 by the exit carrier EXT are collectively sucked by the suction head 404c of the fourth transfer device 404, and 4 of the hot plate 401 It is placed in one of the two areas. In the following embodiment, the case where a low-temperature heat stress is applied will be described. However, when a high-temperature heat stress is applied, the heat is directly transferred from the exit carrier EXT to the buffer unit 402.
[0130]
The suction head 404c of the fourth transfer device 404 that has transported the tested IC to one area of the hot plate 401 does not return to its original position, but is the most time among the tested ICs that have been placed on the hot plate 401 so far. The eight ICs that have passed are sucked at that position, and the heated tested ICs are placed on the lifting table 405 (here, the right side) of the buffer unit 402 that is in the lowered position.
[0131]
As shown in FIG. 13, the left lifting table 405 on which eight tested ICs are placed by the previous operation of the fourth transfer device 404 moves to the raised position, and the right lifting table 405 is moved accordingly. The table 405 moves to the lowered position. Eight tested ICs are mounted on the left lifting table 405 moved to the raised position, and these tested ICs are stored by the fifth and sixth transfer devices 406 and 407 as test contents. Are transferred to the customer tray KT of the corresponding category. FIG. 13 shows an example in which the tested IC is transferred to the customer tray KT by the fifth transfer device 406.
[0132]
Thereafter, such an operation is repeated to transfer the tested IC to the customer tray KT of the corresponding category. In the unloader unit 400, the fourth transfer device 404 and the fifth or sixth transfer device 406, 407 are at different levels. By disposing in the position, the fourth transfer device 404 and the fifth and sixth transfer devices 406 and 407 can be operated simultaneously, thereby increasing the throughput.
[0133]
The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.
[0134]
【The invention's effect】
As described above, according to the present invention, since the self-heating generated during the test is radiated to the surroundings, it is possible to prevent destruction or damage of the electronic component due to overheating, which is a problem particularly in a high-temperature test.
[0135]
In addition to the high-temperature test, since the temperature rise due to self-heating is suppressed by spraying the fluid, the test can be performed at the target accurate temperature, and the reliability of the test result is improved.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of an electronic device test apparatus according to the present invention.
2 is a conceptual diagram showing a method of routing an IC under test in the electronic component testing apparatus of FIG. 1. FIG.
FIG. 3 is a plan view schematically showing various transfer devices provided in the electronic component testing apparatus of FIG. 1;
4 is a perspective view of an essential part for explaining an IC carrier transport path applied to the electronic component testing apparatus of FIG. 1; FIG.
5 is a perspective view showing an embodiment of an IC carrier applied to the electronic component testing apparatus of FIG. 1. FIG.
6 is a cross-sectional view (shutter closed) taken along line VI-VI in FIG.
7 is a cross-sectional view (shutter open) taken along line VII-VII in FIG. 5;
8 is a plan view for explaining a test order of IC under test in a test chamber of the electronic component test apparatus of FIG. 1; FIG.
FIG. 9 is a front view (an IX arrow view of FIG. 3) showing the embodiment of the adsorption device of the present invention.
FIG. 10 is a diagram showing a cross-section of essential parts and a circuit block of an embodiment of the adsorption device of the present invention.
FIG. 11 is a bottom view showing a suction surface of the suction head shown in FIG. 10;
12 is a cross-sectional view (corresponding to line XII-XII in FIG. 3) for explaining a method of routing the IC under test in the test chamber of the electronic component testing apparatus in FIG. 1;
13 is a cross-sectional view (corresponding to line XIII-XIII in FIG. 3) for explaining a method of routing the IC under test in the unloader section of the electronic component testing apparatus in FIG.
[Explanation of symbols]
1 ... Electronic component testing equipment
100: IC storage unit
200: Loader section
300 ... Chamber part
301 ... Test chamber
302 ... Test head
302a ... Contact part
304 ... Third transfer device
304c ... Adsorption head (adsorption device)
304c10 ... Suction head body
304c11 ... through hole
304c12 ... Groove
305 ... Pneumatic circuit
305a ... Air source (fluid supply source)
305b ... Ejector valve (adsorption force applying means)
305c ... Ejector (Adsorption force applying means)
305d ... Temperature control unit
305e ... Release valve (Adsorption force destruction means)
305f ... Control device (control means)
400: Unloader section
CR ... IC carrier
EXT ... Exit carrier
IC ... Electronic components
HB ... Solder ball (terminal)

Claims (10)

A suction head for sucking an electronic component; a suction force applying means for applying a suction force to the suction head; and a suction force breaking means for releasing the suction force of the suction head. In the electronic component adsorption device to perform,
On the suction surface of the suction head, a groove portion through which a fluid for releasing the suction force of the suction head can pass is formed,
When the electronic component is held at a fixed position, a fluid for releasing the suction force of the suction head is sprayed on the electronic component to cool the electronic component. Adsorption device. 2. The electronic component suction device according to claim 1, wherein the fluid is sprayed onto the electronic component by sending a command signal from a control means to the suction force breaking means. Electronic component suction device according to claim 1 or 2, further comprising a temperature control unit for controlling the fluid to be sprayed to the electronic component to a predetermined temperature. The suction force applying means includes a fluid supply source, an ejector connected to the suction head, and an ejector valve provided in a fluid path including the fluid supply source, the ejector, and the suction head. electronic component suction device according to any one of claims 1 to 3, characterized in. The suction force breaking means includes a fluid source, the electronic component suction device according to any one of claims 1-4 for, characterized in that it comprises a release valve connected to the fluid source and the suction head. 6. The electronic component adsorption apparatus according to claim 4 , wherein the fluid supply source of the adsorption force applying means and the fluid supply source of the adsorption force breaking means are the same fluid supply source. The fluid to be sprayed to the electronic component, the electronic component suction device according to any one of claims 1 to 6, the fluid to be applied to the suction force applying means, characterized in that it is shared. A suction head for sucking an electronic component to be tested; a suction force applying means for applying a suction force to the suction head; and a suction force breaking means for releasing the suction force of the suction head; In an electronic component testing device that tests by pressing against the contact part of the test head,
On the suction surface of the suction head, a groove portion through which a fluid for releasing the suction force of the suction head can pass is formed,
For releasing the suction force of the suction head with respect to the electronic device under test to cool the electronic device under test pressed against the suction head for at least an arbitrary time during the test of the electronic device under test . An electronic component testing apparatus characterized by spraying a fluid. 9. The electronic component testing apparatus according to claim 8 , further comprising a chamber for making the ambient temperature around the contact portion constant. Electronic device test apparatus characterized by comprising an electronic component suction device according to any one of claims 1-7.

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