JP2000304809A - Ic test device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To detect various information about an IC tray at different positions on its transporting route with high efficiency and without any failure, and to realize miniaturization and cost reduction thereof. SOLUTION: Bar code marks BC having information such as ID numbers are displayed on a plurality of IC trays CR carrying ICs to be tested respectively. A barcode reader 311 is supported by a turning device having a turntable 312 and a motor 313. The barcode marks BC on the IC trays CR located at first and second positions CR6, CR6 on both sides sandwiching the barcode reader 311 are read by one barcode reader 311 by operating the rotating devices 312, 313 for controlling the attitude of the barcode reader 311.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC test apparatus for testing a semiconductor integrated circuit device (hereinafter, abbreviated as IC), and more particularly to an IC test apparatus using a plurality of IC trays.
The present invention relates to an IC test apparatus configured to transport C.

[0002]

2. Description of the Related Art In order to inspect the function, performance, durability and the like of an IC manufactured through an IC manufacturing process, a handler is used.
r) IC test equipment, also called r), is used. In an IC testing apparatus, a plurality of ICs to be tested are conveyed in a state in which a plurality of ICs are collectively mounted on a tray, and various tests are performed in a state where they are appropriately transferred to a test head and brought into electrical contact therewith. The IC for which the test has been completed is carried out of the test head, and is placed on a tray according to the test result, whereby sorting into non-defective and defective products is performed.

[0003] In addition to a tray for accommodating ICs before testing or for accommodating tested ICs (hereinafter also referred to as a customer tray), a handler for circulating and transporting the inside of the handler (hereinafter also referred to as a test tray) is provided. ). In this type of handler, the IC under test is placed between the customer tray and the test tray before and after the test.
Is replaced. The reason why a plurality of ICs to be tested are mounted on the tray and transported is to protect the ICs being transported during transportation and to increase the efficiency of processing.

Further, there is also known an IC test apparatus in which a test head is housed in a temperature-controllable chamber, and a test is performed in a state where the inside of the chamber is set to a high temperature or a low temperature and a temperature stress is applied to an IC under test. Have been.

In such an IC test apparatus, the positions of the trays being conveyed and the trays stored in the trays are used in each processing section in order to efficiently deliver the IC under test and perform other processing. In some cases, information such as the type and number of the IC under test is required. For this reason, conventionally, a data sheet in which necessary information is set is stuck on the surface (side surface or the like) of the tray, and this is detected by a reflection type or transmission type optical sensor having a light transmitting unit and a light receiving unit. I have to.

[0006] The data sheet has a plurality of trigger marks displayed or perforated (hereinafter simply referred to as "display") in a line at regular intervals, and displays data marks at positions corresponding to the respective trigger marks. Necessary information is set in binary notation depending on whether or not. The trigger mark and the data mark are scanned by the optical sensor for detecting the trigger mark and the optical sensor for detecting the data mark, and the presence or absence of the data mark at the position corresponding to the trigger mark is detected, thereby setting the data sheet. Detected information.

The scanning of the data sheet by the optical sensor is
This is performed by moving the sensor with respect to the tray to which the data sheet is attached, or by moving the tray to which the data sheet is attached with respect to the sensor. Some optical sensors for detecting data marks are provided in the same number as the number of trigger marks so that data can be detected without scanning.

[0008]

However, according to the prior art, since information is set by binary data, the data sheet becomes longer (larger) in spite of a smaller amount of information that can be set, and the information setting is made. There is a problem that the amount is large and the time required for scanning and detection is long.

Further, if the positional relationship between the mark on the data sheet and the optical sensor is not strictly set, there is a problem that high-precision reading cannot be performed and erroneous detection may occur.

Further, when such information is to be detected at a plurality of different locations in the tray transport path, it is necessary to provide a reading device including an optical sensor at each location, resulting in poor efficiency and increased cost. There is also a problem.

[0011] In addition, when a data mark is displayed on a data sheet by punching, there is a problem that such an operation is complicated.

The present invention has been made in view of such a problem of the prior art, and various kinds of information relating to an IC tray can be efficiently and erroneously provided at a plurality of different places in a transfer route of the IC tray. The purpose is to enable detection without detection.

[0013]

To achieve the above object, according to the present invention, a plurality of ICs for transporting an IC under test are provided.
A bar code mark in which various information is set is provided on each of the trays, and each bar code mark of the IC tray at the first position and the second position which are different from each other is read by a single bar code reader. An IC test apparatus is provided.

According to the present invention, various types of information are set on the IC tray by bar code marks and read by a bar code reader. The bar code marks display a large amount of information in a relatively narrow area. Therefore, the amount of information to be set can be set larger than before, and the barcode mark can be read collectively by a barcode reader, so that the time required for detection can be greatly reduced. it can.

Further, since the positional relationship between the bar code reader and the bar code mark may be relatively rough, the occurrence of erroneous detection is reduced, and it is not necessary to perform positioning for information detection with a very high accuracy. Reduction can also be achieved.

Further, according to the present invention, the bar code marks on the IC trays at different positions in the transport path are read by a single bar code reader, so that the bar code marks on the IC trays at different positions are different. The configuration can be simplified, and the size and cost of the apparatus can be reduced, as compared with the case where barcode readers corresponding to each are provided to read the data.

Although not particularly limited, the attitude of the bar code reader is such that the bar code reader selectively points to one of the bar code marks of the IC under test at the first position and the second position. In this case, the first position and the second position are arranged on both sides of the bar code reader, and the bar code reader is used as the support means. Can be adopted.

The information set in the bar code mark includes identification information for identifying the IC tray from other IC trays, and the I-test under test accommodated in the IC tray.
It can include one or more of C type information, information on the number of ICs to be tested at the same time, and other information.

The bar code mark is displayed on a member detachable from the IC tray and can be attached to the IC tray. The bar code mark is used in a high temperature or low temperature environment to apply a temperature stress to the IC under test. When the present invention is applied to an IC tray, it is desirable to use a metal plate, a label, or the like that has resistance to the temperature stress as a member for displaying the barcode mark.

[0020]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a partially cutaway perspective view showing an embodiment of an IC test apparatus to which the present invention is applied, FIG. 2 is a conceptual view showing a method of handling an IC under test in the IC test apparatus,
FIG. 3 is a plan view schematically showing various transfer means provided in the IC test apparatus, FIG. 4 is a perspective view showing the structure of an IC stocker of the IC test apparatus, and FIG. 5 is used in the IC test apparatus. FIG. 18 is a perspective view showing a customer tray, FIG. 18 is a cross-sectional view (cross-sectional view taken along the line XVIII-XVIII in FIG. 3) for explaining a method of routing an IC under test in a test chamber, and FIG. FIG. 9 is a cross-sectional view (a cross-sectional view taken along line XIX-XIX in FIG. 3) for explaining a method of handling the test IC.

FIGS. 2 and 3 show the IC of this embodiment.
FIG. 4 is a diagram for understanding a method of handling ICs to be tested in a test apparatus and an operation range of a transfer unit, and in actuality, there is a portion in which members arranged in a vertical direction are shown in plan view. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.

The IC test apparatus 1 of the present embodiment
IC with high or low temperature stress applied to C
Is a device that tests (inspects) whether the IC operates properly and classifies the ICs according to the test results. In such an operation test under the condition of applying a temperature stress, the IC under test to be tested is A test is performed on an IC carrier (IC tray, test tray) CR (see FIGS. 7 and 8) conveyed through the IC test apparatus 1 from a large number of loaded trays (hereinafter, also referred to as a customer tray KT; see FIG. 5). It is implemented by reloading the IC.

For this reason, the IC test apparatus 1 of the present embodiment
As shown in FIGS. 1 and 2, an IC storage unit 100 stores an IC under test to be tested, classifies and stores tested ICs, and an IC under test transmitted from the IC storage unit 100. 200 into the chamber 300, a chamber 300 including a test head, and an unloader 400 for sorting and extracting tested ICs tested in the chamber 300.

[0024] The IC magazine 100 IC storage section 100, a pre-test IC stocker 101 for storing the IC before test, post-test IC stores the IC classified according to the result of the test stocker 102
Are provided.

The pre-test IC stocker 101 and the tested IC stocker 102, as shown in FIG. 4, have a frame-shaped tray support frame 103, and penetrate from the lower portion of the tray support frame 103 and move upward and downward. And an elevator 104 which can be used. Tray support frame 10
3 has a customer tray KT as shown in the enlarged view of FIG.
Are stacked and supported, and only the stacked customer trays KT are moved up and down by the elevator 104.

The pre-test IC stocker 101 includes:
While the customer trays KT storing the ICs to be tested to be tested are stacked and held,
In the C stocker 102, customer trays KT in which ICs to be tested after the test are appropriately classified are stacked and held.

Since the pre-test IC stocker 101 and the tested IC stocker 102 have the same structure, the pre-test IC stocker 101 and the tested IC stocker 1 have the same structure.
02 can be set to an appropriate number as needed.

In the example shown in FIGS. 1 and 2, one stocker LD is provided in the pre-test stocker 101, one empty stocker EMP to be sent to the unloader unit 400 is provided next to the stocker LD, and the tested IC stocker 102 is provided. , UL5 are provided so that they can be sorted and stored in a maximum of five categories according to test results. In other words, besides the non-defective products and the defective products, the non-defective products are classified into those having a high operation speed, medium-speed ones, low-speed ones, and some of the defective ones requiring retesting.

The customer tray KT which loader unit 200 described above, the lower device substrate 201 to the window 202 of the loader unit 200 by the tray transfer arm (not shown) provided between the IC storage section 100 and the device substrate 201 Carried from. And this loader unit 2
At 00, the IC under test loaded on the customer tray KT is once transferred to the pitch conversion stage 203 by the first transfer device 204, where the IC under test is
Of the pitch conversion stage 203 after correcting the mutual position of the
The IC under test transferred to the IC carrier CR stopped at the position CR1 (see FIG. 6) in the chamber 300 by using the second transfer device 205.

The pitch conversion stage 203 provided on the device substrate 201 between the window 202 and the chamber 300 has a relatively deep concave portion, and the peripheral portion of the concave portion is surrounded by an inclined surface. Means for correcting the position of the IC and pitch change of the IC.
When the IC under test sucked into the IC chip 4 is dropped, the falling position of the IC under test is corrected on the inclined surface. Thereby, for example, the mutual positions of the four ICs to be tested are accurately determined, and the customer tray KT and the IC carrier CR are determined.
Even if the mounting pitch differs, the IC under test whose position has been corrected and the pitch has been changed is adsorbed by the second transfer device 205 and transferred to the IC carrier CR, whereby the IC carrier C is transferred.
The IC under test can be reloaded into the IC accommodating portion 14 formed in the R with high accuracy.

As shown in FIG. 3, a first transfer device 204 for transferring an IC under test from the customer tray KT to the pitch conversion stage 203 includes a rail 204a provided on an upper portion of the device substrate 201 and a rail 204a.
a movable arm 204b capable of reciprocating between the customer tray KT and the pitch conversion stage 203 (this direction is defined as a Y direction), and an X direction supported by the movable arm 204b along the movable arm 204b. And a movable head 204c that can move to

The movable head 2 of the first transfer device 204
The suction head 204d is attached to the downward direction of the suction tray 204d. The suction head 204d moves while sucking air, thereby sucking the IC under test from the customer tray KT, and moving the IC under test to the pitch conversion stage. 203. Such a suction head 204d is
For example, about four ICs are mounted on the movable head 204c, and four ICs to be tested can be dropped into the pitch conversion stage 203 at a time.

On the other hand, the pitch conversion stage 20
The second transfer device 205 for transferring the IC under test from the IC card 3 to the IC carrier CR1 in the chamber 300 has the same configuration, and as shown in FIGS.
A movable arm 205b capable of reciprocating between a pitch conversion stage 203 and an IC carrier (an IC carrier located in CR1) by the rail 205a provided above the test chamber 301; A movable head 205c supported by the arm 205b and movable in the X direction along the movable arm 205b.

The movable head 2 of the second transfer device 205
At 05c, a suction head 205d is mounted in a downward direction. The suction head 205d moves while sucking air to suck the IC under test from the pitch conversion stage 203. The IC under test is placed in CR1 through the opened entrance 303.
To the IC carrier CR located at For example, about four such suction heads 205d are mounted on the movable head 205c, and four ICs under test are
Can be transferred to the IC carrier CR located in CR1.

Chamber 300 The chamber 300 according to the present embodiment comprises an IC carrier C
The test head is provided with a constant temperature function (temperature control function) for applying a desired high or low temperature stress to the IC under test loaded in R, and the IC under test subjected to the thermal stress is subjected to a test at a constant temperature. 302 contact portion 302a
Contact.

In the IC test apparatus 1 of this embodiment, when a low temperature stress is applied to the IC under test, the heat is removed by a hot plate 401 described later.
When a high temperature stress is applied to C, heat is removed by natural heat radiation. However, a separate heat removal tank or heat removal zone is provided, and when a high temperature is applied, the IC under test is cooled by blowing air to return it to room temperature, and when a low temperature is applied, the IC under test is heated or heated. , The temperature may be returned to a temperature at which dew condensation does not occur.

The test head 302 having the contact portion 302a is provided on the lower right side (+ X side) of the center of the test chamber 301.
Are provided with stationary positions CR5 of the IC carrier CR. Then, the IC transferred to this position CR5
The IC under test placed on the carrier CR is directly carried onto the test head 302 by the third transfer device 304,
The test is performed by bringing the IC under test into electrical contact with the contact portion 302a.

Further, the IC under test after the test is
The exit carrier EX which does not return to the carrier CR but moves to and from the position CR5 on both sides of the test head 302.
It is remounted on T and carried out of the chamber 300. When a high temperature stress is applied, the heat is naturally removed after being carried out of the chamber section 300.

Here, the details of the IC carrier (IC tray) will be described. FIG. 6 is a perspective view for explaining a transport path of an IC carrier used in the IC test apparatus of the present embodiment, FIG. 7 is a perspective view showing the same IC carrier, and FIG. 8 is a plan view showing the same IC carrier. (A) shows a state where the shutter is closed, and (B) shows a state where the shutter is opened. 9 is a sectional view taken along line IX-IX in FIG.
FIG. 10 is a sectional view taken along line XX in FIG.

FIG. 11 is a view showing a bar code mark provided on the IC carrier, and FIGS. 12A to 12C are views showing examples of variations of the position where the bar code mark is provided on the IC carrier. . FIGS. 13A and 13B and FIGS. 14A and 14B are diagrams showing a schematic configuration of a barcode detecting unit of the IC test apparatus according to the present embodiment. ) Is a cross-sectional view of a part of the chamber section cut in a horizontal plane (XY plane), (B)
FIG. 3 is a cross-sectional view of a part of a chamber section cut along a vertical plane (YZ plane). 15 is a plan view showing an IC accommodating portion of the IC carrier shown in FIG. 7, FIG. 16 is a diagram showing another example of a bar code mark provided on the IC carrier, and FIG. 17 is a diagram showing a test object in a test chamber of the IC test apparatus. FIG. 3 is a plan view for explaining an IC test order.

First, the IC carrier CR of this embodiment is
The wafer is conveyed while circulating in the chamber section 300. FIG. 6 shows this operation. In the present embodiment, first, an empty IC carrier CR is transported to the front and rear positions (positions corresponding to the entrances 303, 303) CR1 and CR1 in the Y direction of the chamber section 300, and the loader is loaded at this position CR1. The IC under test sent from the unit 200 is loaded,
IC carrier C at position CR1 where IC under test is loaded
R is a horizontal position CR by a horizontal transport device (not shown).
2 is transferred.

It is to be noted that the test target I
Strictly speaking, the position for receiving C is the position CR shown in FIG.
The position is slightly higher than 1 (this position is indicated by a two-dot chain line in FIG. 6). This is because the IC carrier CR faces the entrance 303 opened on the ceiling of the test chamber 301 from below, and the entrance 303 is shielded by the IC carrier CR.
This is to prevent heat release in the chamber section 300. For this reason, the IC carrier CR slightly rises from the position CR1 when receiving the IC under test.

The IC carrier CR transported to the position CR2
Is transported in a vertically stacked state by a vertical transport device (not shown) in a state of being stacked in several stages, and the position CR5
After waiting until the IC carrier becomes empty, the IC carrier is conveyed from a lowermost position CR3 to a position CR4 substantially at the same level as the test head 302 by a horizontal conveying device (not shown). Mainly during this transportation, a high or low temperature stress is applied to the IC under test.

Further, the horizontal transport device (not shown) transports the test head 302 from the position CR4 to the horizontal position CR5, where only the IC under test is contacted with the contact portion 302a of the test head 302 (see FIG. 2). ). After the IC under test has been sent to the contact portion 302a, the IC carrier CR is transported from the position CR5 to a horizontal position CR6. Here, after a barcode mark provided on the side surface is read by a barcode detection unit 310 described later in detail, the barcode mark is conveyed vertically upward and returns to the original position CR1.

As described above, since the IC carrier CR is circulated and conveyed only in the chamber section 300, once the temperature is increased or decreased, the temperature of the IC carrier itself is maintained as it is. The thermal efficiency in the part 300 will be improved.

FIGS. 7 and 8 are a perspective view and a plan view, respectively, showing the structure of the IC carrier CR according to the present embodiment. Eight concave portions 12 are formed on the upper surface of a strip-shaped plate 11, and each of the concave portions 12 is formed. IC for mounting IC under test
Two housing portions 14 are formed.

A mark member 19 on which a barcode mark BC is displayed is attached to substantially the center of one of the side surfaces along the longitudinal direction of the plate 11. The bar code mark BC is, for example, as shown in FIG. 11, in which various kinds of information are represented by bar codes. Here, it is assumed that identification information for identifying the IC carrier CR from other IC carriers CR is set in the barcode mark BC. As the identification information, an ID number can be adopted, and the ID number is, for example, all the IC carriers CR circulated in the chamber section 300.
, A serial number can be given to use the number.

The information displayed using the barcode mark BC is not limited to the identification information but may be other information. For example, the type information of the IC under test accommodated in the IC carrier and the information to be tested at the same time. Information on the number of ICs to be tested may be used. The information set in the barcode mark BC does not need to be a single piece of information, and a plurality of pieces of information can be set at the same time.

In the present embodiment, the mark member 19 is made of a rectangular plate, and is made of a heat-resistant material that can sufficiently withstand the temperature stress in the chamber 300. As the mark member 19, for example, a metal plate such as aluminum (Al) having a thickness of 0.5 mm can be used. However, a heat-resistant resin plate or the like may be used. The barcode mark BC can be displayed by drawing with an energy ray such as a laser beam or an electron beam, or may be displayed by etching, printing, or the like.

The mark member 19 on which the bar code mark BC is displayed is detachably attached to the plate 11 by screwing or other attaching means. By making the mark member 19 attachable to and detachable from the plate 11, there is an advantage that information related thereto can be changed according to a change in the type of the IC under test accommodated in the IC carrier CR. . However, if there is no need to change the information, the mark member 19 may be fixed by welding, bonding, or the like, or the barcode mark BC may be attached to the plate 11 without using such a mark member 19. May be directly displayed on the side face of.

As the mark member 19 for displaying the bar code mark BC, not only the above-mentioned plate-shaped body but also a heat-resistant sheet is used, and this is adhered to the side surface of the plate 11. Is also good.

The display position of the barcode mark BC on the plate 11 is, as described above,
It is not limited to the substantially central portion of one of the side surfaces along the longitudinal direction of. For example, it may be provided only on one or the other of the other side surfaces of the plate 11 along the longitudinal direction, and on both side surfaces of the plate 11 along the lateral direction.

The bar code mark BC does not need to be provided at one place for the IC carrier CR, but can be provided at two or more places. For example, as shown in FIG. 12 (A), both are provided on both side surfaces along the longitudinal direction of the plate 11, and as shown in FIG. It can be provided at two places, or at three places on one side of the plate 11, as shown in FIG. When barcode marks BC are provided at a plurality of locations, the same information can be set for each barcode mark BC, or different information can be set for each barcode mark BC. further,
The position of the barcode mark BC is not limited to the side surface of the plate 11, but may be provided on the upper surface or the lower surface.

As shown in FIG. 11, the bar code mark BC is not only displayed on one line, but also shown in FIG.
, Can be displayed in two levels, or can be further multi-level.

The IC accommodating portion 14 formed on the plate 11 is placed in a state where two blocks 13 having the same shape face each other as shown in FIG.
Is formed by screwing to the concave portion 12.
Here, 16 IC housing portions 14 for mounting the IC under test are formed along the longitudinal direction of the plate 11, and the mounting pitch P of the IC under test in the longitudinal direction of the plate 11 is provided.
₁ (see FIG. 17) are set at equal intervals.

The mounting position of the blocks 13, 13 with respect to the concave portion 12 of the plate 11 is appropriately determined according to the size and shape of the IC to be mounted. For example, FIG.
In the case where an IC under test which is larger than the IC under test mounted in the IC accommodating section 14 shown in FIG.
As shown in the figure, only the mounting position may be changed using the same blocks 13 and 13. At this time, since the position of the screw is changed, the plate 11 may be used as a dedicated product for the IC under test, or the plate 1 may be formed with the screwed portion as a long hole.
1 may be shared. By appropriately combining the blocks 13 of this type, it is possible to support ICs of all sizes.

A guide plate 17 in which a guide hole (guide means) 171 is formed between the concave portion 12 of the plate 11 and the blocks 13, 13 is held in the IC accommodating portion 14. FIG. 15C shows a state where the IC under test is accommodated in one IC accommodating portion 14. When the IC under test cannot secure the positioning accuracy depending on the outer periphery of the package mold like a BGA type IC of a chip size package. And the like, the guide hole 171 of the guide plate 17 is provided.
The solder balls HB of the IC under test are positioned by the peripheral edge of the IC chip, thereby improving the contact accuracy with the contact pins.

As shown in FIGS. 7 and 8, the opening of the upper surface of the IC carrier CR is provided in order to prevent the IC under test accommodated in the IC accommodating portion 14 of the IC carrier CR from shifting or popping out. A shutter 15 for opening and closing is provided.

The shutter 15 is openable and closable with respect to the plate 11 by a spring 16. When the IC under test is housed in or taken out of the IC housing 14, a shutter opening / closing mechanism which will be described later is used. By opening and closing the shutter 15 as shown in FIG. 8B using (open / close drive means) 18, the IC under test is accommodated or taken out. On the other hand, when the shutter opening / closing mechanism 18 is released, the shutter 15 returns to the original state due to the elastic force of the spring 16, and as shown in FIG.
The opening surface of the IC accommodating portion 14 is covered with a shutter 15 so that the IC under test accommodated in the IC accommodating portion 14 can be held without displacement or popping out even during high-speed conveyance. Become.

The shutter 15 has three pulleys 11 provided on the upper surface of the plate 11 as shown in FIGS.
2, the central pulley 112 engages with a long hole 152 formed in the shutter 15, and the two pulleys 112 provided at both ends hold both end edges of the shutter 15.

However, the center pulley 112 and the shutter 15
Engagement with the long hole 152 is such that there is almost no backlash in the longitudinal direction of the plate 11, whereas a slight gap is provided between the pulleys 112 at both ends and both end edges of the shutter 15. Is provided. By doing so, even if a thermal stress acts on the IC carrier CR in the chamber section 300, the expansion or contraction due to the thermal stress is caused by the central pulley 1
It is distributed to both ends with the center at 12, and is appropriately absorbed by gaps provided at both ends. Therefore, the amount of expansion or contraction of the entire length of the shutter 15 in the longitudinal direction is halved even at both ends where the shutter 15 expands or contracts the most, whereby a difference between the amount of expansion and contraction of the plate 11 can be reduced.

The shutter 1 is provided on the IC carrier CR.
In order to prevent the shutter 15 from interfering with the upper surface of the plate 11 when opening and closing the shutter 5 and to smoothly open and close the shutter 15, the shutter 15 has a plurality of sliding members 151 (FIG. 8).
9 in this example) are attached. This sliding body 15
1 is made of a material having a lower hardness than the metal forming the plate 11, for example, various resins such as engineering plastics, and is mounted in a through hole formed in the shutter 15.

By providing such a sliding member 151 between the shutter 15 and the plate 11, the opening and closing operation of the shutter 15 can be performed smoothly, and the shutter 15 and the plate 11 can be prevented from being mutually damaged.
It can extend the life of itself.

Next, the shutter opening / closing mechanism 18 of the present embodiment will be described.
Will be described. First, the IC carrier CR shown in FIG.
The position at which the shutter 15 needs to be opened in the circuit path of the device is a position CR1 (strictly, slightly above) where the IC under test is received from the second transfer means 205, and the IC under test is transferred to the third transfer device. Test head 3 by 304
02 of the position CR5 to be delivered to the contact part 302a
There are three places.

Although not particularly limited, in the present embodiment, as shown in FIGS. 6, 9 and 10, at the position CR1, the opening / closing block 181 provided on the upper surface of the shutter 15 is used as the opening / closing driving means 18 as a fluid pressure. Cylinder 182
To open and close. The fluid pressure cylinder 182 is mounted on the test chamber 301 side. And
By retracting the rod of the fluid pressure cylinder 182 with respect to the stopped IC carrier CR, the shutter 15 is opened while the opening / closing block 181 provided on the shutter 15 is hooked. When the mounting of the IC under test is completed, the shutter 15 is closed by moving the rod of the fluid pressure cylinder 182 forward.

On the other hand, at the position CR5 near the test head 302, since the IC carrier CR itself is moved by a horizontal transfer device (not shown), the shutter 15 is opened and closed by using this. That is, the IC carrier CR is transported horizontally from the position CR4 to the position CR5, and a stopper (not shown) for opening and closing the shutter 15 is provided on the way. This stopper is provided on the test chamber 301 side, and the IC carrier CR
Is moved from the position CR4 to the position CR5.
5 is provided at a position in contact with the opening / closing block 181. The position where the stopper is provided is also the position where the shutter 15 is fully opened when the IC carrier CR stops at the position CR5. In this example, shutter 1
5, two opening / closing blocks 181 are provided, so that two stoppers are also provided.

Further, a cam surface is formed on the stopper. This cam surface is a mechanism for gradually closing the shutter 15 fully opened at the position CR5 with the movement of the IC carrier CR. That is, when the IC carrier CR is transported from the position CR5 to the position CR6, the shutter 15 gradually closes because the rear end of the opening / closing block 181 of the shutter 15 keeps contacting the cam surface. Will be.

As described above, the IC carrier CR according to the present embodiment can accommodate and remove the IC under test only by opening and closing the shutter 15 without having a complicated shape and structure, so that the operation time is significantly reduced. .

Further, in the IC carrier CR of the present embodiment, since both ends of the shutter 15 are supported by the springs 16, the balance of the shutter 15 at the time of opening and closing is good, and the center of the shutter 15 is It is easy to open and close only by gripping only.

Incidentally, the movable heads 205c and 304b of the second transfer device 205 and the third transfer device 304 include:
Positioning pins for aligning the IC under test with the IC carrier CR when transferring the IC under test are provided.
As a representative example, FIG. 9 shows the movable head 205c of the second transfer device 205, but the movable head 304b of the third transfer device 304 has the same configuration.

As shown in the drawing, the movable head 205c is provided with two positioning pins 205e, 205e straddling one IC under test. Therefore, the positioning pins 2 are provided on the plate 11 side of the IC carrier CR.
Positioning holes 11 with which 05e and 205e engage respectively
3, 113 are formed. Although not particularly limited, in this example, one positioning hole 113 (the right side in FIG. 9) is a perfect circular hole, and the other positioning hole (the left side in FIG. 9) is a long oval hole in the width direction. As a result, the positioning is performed mainly in one positioning hole 113 and the positioning pin 205e is positioned in the other positioning hole 113.
And the position error of the position is absorbed. The positioning pins 20 are provided on the upper surface of each positioning hole 113.
A tapered surface for inviting 5e is formed.

In this case, one of the positioning pins 205e and the positioning hole 113 is worn by engagement with the positioning hole 113, and there is a possibility that the positioning accuracy is gradually reduced. It is also possible to mount a bush (not shown) made of a material having a lower hardness than the metal constituting the pin 205e, for example, various resins such as engineering plastic. By providing such a low-hardness bush in the hole 113 of the plate 11, when the positioning pin 205e is fitted, the wear target is the bush, and if the bush is worn to such an extent that the positioning accuracy is reduced. By replacing this, the life of the IC carrier CR can be extended.

By the way, as shown in FIG.
An opening 153 is provided in the shutter 15 so that the positioning pin 205e can be engaged with the positioning hole 113 when the shutter 5 is opened.

As shown in FIG. 1, a bar code detector 310 is provided on the lower left side (−X side) of the center of the chamber 300. The schematic configuration of the barcode detection unit 310 and its vicinity is shown in FIGS.
(A) and (B), and FIGS. 14 (A) and (B).

The bar code detector 310 is provided in the chamber 30
In order to protect it from the environment (temperature stress) inside 1, it is housed in a case (housing) 320 and is inserted into a chamber 301 through a rectangular opening formed on a side surface thereof by screws or the like. Fixed. Chamber 30
Since the opening on one side is closed by the corresponding side of the case 320, there is no problem such as outside air entering the inside of the chamber 301. Note that the barcode detection unit 31
0 may not be inserted from the side of the chamber 301 but may be inserted from the bottom.

The bar code detecting section 310 is
Is installed at a predetermined position in the chamber 301,
It is arranged at a substantially intermediate portion between the pair of positions CR6.

The bar code detecting section 310 comprises a bar code reader 311 and rotating devices (supporting means, rotating means) 312 and 313 for rotating the bar code reader 311 about a direction substantially parallel to the Z axis. You. As the barcode reader 311, a laser reader using a visible light semiconductor laser (for example, a wavelength of about 670 nm) as a light source can be employed. However, the present invention is not limited to this, and a CCD type reader using a CCD image sensor as a light receiving element using an LED as a light source, or a reader of another type may be employed.

The bar code reader 311 is fixed on a rotary table 312 constituting a rotating device in such a manner as to be directed slightly obliquely upward with respect to the horizontal. The rotary table 312 is driven to rotate by a motor 313 that rotates based on a control signal from a control device (not shown). As the motor 313, a pulse motor that can be positioned at an arbitrary rotation angle can be used. However, the present invention is not limited to the pulse motor, and a servomotor or another type of motor can be employed. The rotation angle of the motor 313 is detected by a rotary encoder, and the rotation position is accurately controlled.

The bar code reader 311 is connected to the rotating device 31
The first attitude for detecting the barcode mark BC of the IC carrier CR located at the position CR1 (first position) on the back side (+ Y side) by being rotationally driven by Posture rotated 180 degrees
That is, two postures, that is, the second posture for detecting the barcode mark BC of the IC carrier CR positioned at the position CR1 (second position) on the near side (−Y side) can be selectively taken. It has become.

As shown in FIGS. 12B and 12C,
When a configuration in which a plurality of barcode marks BC are displayed on one side of the IC carrier CR is employed, the rotating device 31
2 and 313, it is possible to cope by adjusting only a required angle. However, in this case, the bar code reader 311 is configured to be movable along a direction substantially parallel to the X direction, and the bar code reader 311 is moved stepwise in the X direction while the rotation angle is kept constant, so that the IC carrier CR can be moved. Each barcode mark BC may be read.

The bar code detector 310 is provided in the chamber 30
In order to reduce the influence of the temperature stress in the case 1, the case 320 is housed in the case 320, so that the case 320 has a pair of bar codes so that the bar code reader 311 can detect the bar code mark BC of the IC carrier CR. Window 32
1 is formed. The window 321 is formed by forming an opening at a corresponding position on a corresponding wall surface of the case 320, and attaching a transparent member such as glass to the opening. The entire side wall of the case 320 may be made of transparent glass or the like.

The bar code information read by the bar code reader 311 is decoded, transferred to the control device, and stored in a storage device or subjected to a corresponding process according to the contents. The barcode detection unit 311 and the control device are connected by wire or wirelessly.

In this embodiment, the bar code detection unit 310 having a single bar code reader 311 reads the bar code mark BC of the IC carrier CR located at the pair of positions CR 6. For example, the barcode mark BC of the IC carrier CR located at the pair of positions CR1, the pair of positions CR2, or the pair of positions CR3 may be read. The bar code reader 311 or the rotating devices 312 and 313 are mounted on the elevating device so that the bar code reader 311 can be moved in the vertical direction. The barcode mark BC may be read. The barcode reader 311 or the rotating devices 312 and 313 are mounted on another rotating device that rotates about a horizontal axis, and the barcode reader 311 can be rotated around the horizontal axis. The bar code marks BC of the IC carrier CR located at other plural positions may be read.

In order to more positively protect the bar code detecting section 310 from the temperature stress in the chamber 301, outside air or temperature-controlled air is supplied into the case 320 for accommodating the bar code detecting section 310 to forcibly air-condition. You may do so.

In the IC test apparatus of the present embodiment, all the ICs to be tested are moved to the test head 3 by the third transfer device 304 at the position CR5 near the test head 302.
02, the IC carrier CR moves to the position CR.
5 is returned to the position CR6. At this time, a residual detection device is provided to confirm that the IC under test does not remain in any of the IC housing sections 14 of the IC carrier CR.

This residual detecting device is provided with a position CR shown in FIG.
It has a photoelectric sensor provided in the middle of 5 to CR6, irradiates detection light in the Z-axis direction along the center line CL of the IC carrier CR shown in FIG. 9, and receives it. In order to allow the detection light to pass therethrough, through holes 111 are provided in the bottom surface of the IC accommodating section 14 of the plate 11, and the through holes 15 are also provided in the shutter 15 at positions corresponding to the respective IC accommodating sections 14.
4 are provided. As a result, when the IC carrier CR moves from the position CR5 to the position CR6 after completing the delivery of the IC under test, it receives a movement pulse signal from the encoder of the horizontal transfer device, and thereby receives the IC carrier CR.
The position timing of the IC accommodating portion 14 is confirmed, and the light receiving state of the photoelectric sensor at that timing is confirmed. Here, if the IC under test remains in the IC accommodating section 14, since light reception by the photoelectric sensor is not confirmed, for example, an alarm is issued to alert the user that the IC is abnormal.

The test head 302 of this embodiment has 8
Contact portions 302a have a constant pitch P₂Provided by
As shown in FIG.
The same pitch P₂It is provided in.
The IC carrier CR has a pitch P₁With 16
The IC under test is housed,₂= 2 · P₁ of
Relationship.

The ICs to be tested connected to the test head 302 at one time are different from the ICs to be tested arranged in one row × 16 columns as shown in FIG.
(Shaded area) are tested simultaneously.

That is, in the first test, 1, 3, 5,
Eight ICs to be tested arranged in rows 7, 9, 11, 13, and 15 are connected to the contact portion 302a of the test head 302 for testing. In the second test, the IC carrier CR is moved by P for one row pitch. Move _one , 2, 4, 6, 8,
ICs to be tested arranged in 10, 12, 14, and 16 columns are similarly tested. Therefore, IC carrier CR that has been transported to either side of the position CR5 the test head 302 is moved in the longitudinal direction by a horizontal transport device outside the drawing by a pitch P _1.

The result of this test is transmitted to the bar code detector 31.
For example, it is stored in an address determined by, for example, the ID number set in the barcode mark BC attached to the IC carrier CR detected by 0 and the number of the IC under test allocated inside the IC carrier CR.

In the IC test apparatus 1 of this embodiment, the IC under test is applied to the contact portion 302a of the test head 302.
Transport device 304 for transporting and testing the
Are provided near the test head 304. FIG.
FIG. 3 is a sectional view taken along the line XVIII-XVIII in FIG.
A rail 304a provided along the extending direction (Y direction) of R5 and the test head 302;
A movable head 304b capable of reciprocating between the test head 302 and the stationary position CR5 of the IC carrier CR by a, and a suction head 304c provided downward on the movable head 304b. Suction head 3
04c is configured to be able to move in the vertical direction by a driving device (for example, a fluid pressure cylinder) not shown. By moving the suction head 304c up and down, the IC under test can be sucked and the IC under test can be pressed against the contact portion 302a.

In the third transfer device 304 of the present embodiment,
Two movable heads 304b are provided on one rail 304a, and the distance between them is the distance between the test head 302 and the IC.
It is set equal to the interval between the carrier CR and the stationary position CR5. And these two movable heads 304b
Are simultaneously moved in the Y direction by one drive source (for example, a ball screw device), while the respective suction heads 304c are vertically moved by independent drive devices.

As described above, each suction head 3
04c can suck and hold eight ICs at a time, and the interval between them is set equal to the interval between the contact portions 302a.

[0094] The unloader section 400 unloader section 400, exit carriers EX for paying out the test IC described above from the chamber section 300
T is provided. This exit carrier EXT
As shown in FIG. 3 and FIG.
2 and the unloader 40
It is configured to be able to reciprocate in the X direction between the position EXT2 at position 0. Position E on both sides of test head 302
In the XT1, as shown in FIG. 18, in order to avoid interference with the IC carrier CR, the stationary position CR5 of the IC carrier is used.
It comes up and down slightly above and slightly below the suction head 304c of the third transfer device 304.

The specific structure of the exit carrier EXT is not particularly limited. However, as shown in FIG. 7, an IC carrier CR shown in FIG.
Individual) formed plates.

Two exit carriers EXT are provided on each side of the test head 302 for convenience. While one exit carrier EXT is moved to the position EXT1 of the test chamber 301, the other is located at the position EXT of the unloader unit 400.
An almost symmetric operation such as moving to step 2 is performed.

Returning to FIG. 3, the IC test apparatus 1 of the present embodiment
In the figure, a hot plate 401 is provided near the position EXT2 of the exit carrier EXT. The hot plate 401 is for heating the IC under test to a temperature at which dew condensation does not occur when a low temperature stress is applied to the IC under test. Therefore, when a high temperature stress is applied, the hot plate 401 is heated. 401 need not be used.

The hot plate 401 of the present embodiment has a structure corresponding to the fact that the suction head 404d of the fourth transfer device 404 described later can hold eight ICs to be tested at one time.
It is configured to be able to accommodate 32 × 16 rows and 32 ICs under test. Then, the hot plate 401 is divided into four areas corresponding to the suction head 404c of the fourth transfer device 404, and the eight tested ICs sucked and held from the exit carrier EXT2 are sequentially placed in those areas. The eight ICs under test that have been heated for a long time are directly sucked by the suction head 404c and transferred to the buffer unit 402.

In the vicinity of the hot plate 401, two buffer units 402 each having a lifting table 405 are provided.
Is provided. FIG. 19 is a sectional view taken along line XIX-XIX in FIG.
Moves in the Z direction between the same level position (the Z direction) as the exit carrier EXT2 and the hot plate 401 and a level position above it, specifically, the level position of the device substrate 201. The specific structure of the buffer unit 402 is not particularly limited.
R and exit carrier EXT,
It can be constituted by a plate in which a plurality of recesses (here, eight) capable of accommodating C are formed.

Also, the pair of lifting tables 405
Performs an almost symmetric operation such that while one is stationary at the ascending position, the other is stationary at the descending position.

The exit carrier EXT2 described above
Unloader section 400 ranging from buffer section 402 to buffer section 402
Is provided with a fourth transfer device 404. As shown in FIG. 3 and FIG. 19, the fourth transfer device 404 includes a rail 404 a
And the exit carrier E by the rail 404a.
A movable arm 404b that can move between the XT2 and the buffer section 402 in the Y direction; and a suction head 404c that is supported by the movable arm 404b and that can move up and down in the Z direction with respect to the movable arm 404b. Moves in the Z direction and the Y direction while sucking air, thereby adsorbing the IC under test from the exit carrier EXT, and placing the IC under test on the hot plate 401.
And the IC under test is attracted from the hot plate 401 to drop the IC under test into the buffer unit 402. The eight suction heads 404c of this embodiment are mounted on the movable arm 404b, and can transfer eight ICs under test at a time.

Incidentally, as shown in FIG. 19, the movable arm 404b and the suction head 404c are
02 is set at a position where it can pass through the level position between the ascending position and the descending position of the ascending / descending table 405, so that even if one ascending / descending table 405 is at the ascending position, the other ascending / descending table is not interfered with. The IC under test can be transferred to 405.

Further, the unloader unit 400 is provided with a fifth transfer device 406 and a sixth transfer device 407, and the test device carried to the buffer unit 402 by the fifth and sixth transfer devices 406 and 407. The tested ICs are reloaded on the customer tray KT.

For this reason, the apparatus board 201 is provided with a window 403 for arranging an empty customer tray KT carried from the empty stocker EMP of the IC storage unit 100 so as to face the upper surface of the apparatus board 201. One has been established.

As shown in FIGS. 1, 3 and 19, the fifth transfer device 406 connects a rail 406a provided on the upper portion of the device substrate 201 with the buffer portion 402 and the window portion 403 by the rail 406a. A movable arm 406b that can move in the Y direction, a movable head 406c that is supported by the movable arm 406b, and that can move in the X direction with respect to the movable arm 406b, and a suction device that is attached downward to the movable head 406c and that can move up and down in the Z direction And a head 406d. And this suction head 4
06d moves in the X, Y and Z directions while sucking air, thereby sucking the IC under test from the buffer unit 402 and transferring the IC under test to the customer tray KT of the corresponding category. Suction head 406d of the present embodiment
Are mounted on the movable head 406c, and can transfer two ICs at a time.

The fifth transfer device 406 of this embodiment
The movable arm 406b is formed so as to be short so that the IC under test is transferred only to the customer tray KT set in the two rightmost windows 403. It is effective to set a customer tray KT of a category having a high category.

On the other hand, the sixth transfer device 407
As shown in FIGS. 1, 3 and 19, two rails 407a, 407a provided on the upper portion of the device substrate 201, and the buffer section 402 is formed by the rails 407a, 407a.
Arm 4 that can move in the Y direction between the window and the window 403
07b and supported by the movable arm 407b,
A movable head 407c that can move in the X direction with respect to the movable arm 407b; and a suction head 407d that is attached downward to the movable head 407c and that can move up and down in the Z direction.
And Then, the suction head 407d moves in the X, Y and Z directions while sucking air, thereby sucking the IC under test from the buffer unit 402 and transferring the IC under test to the customer tray KT of the corresponding category. . Two suction heads 407d of this embodiment are mounted on the movable head 407c, and can transfer two ICs at a time.

While the above-described fifth transfer device 406 transfers the IC under test only to the customer tray KT set in the two rightmost windows 403, the sixth transfer device 4
07 can transfer the IC under test to the customer tray KT set in all the windows 403. Therefore, the IC under test of the category with a high frequency of occurrence is classified using the fifth transfer device 406 and the sixth transfer device 407, and the I under test of the category with a low frequency of occurrence is tested.
C can be classified only by the sixth transfer device 407.

These two transfer devices 406 and 407
1 and 19, these rails 406a and 407a are provided at different heights so that the suction heads 406d and 407d do not interfere with each other, and even if the two suction heads 406d and 407d operate simultaneously. It is configured to hardly interfere. In this embodiment,
The fifth transfer device 406 is provided at a position lower than the sixth transfer device 407.

Although not shown, a lifting table for raising and lowering the customer tray KT is provided below the device substrate 201 in each window 403, and the tested ICs to be tested are reloaded. The customer tray KT, which is filled and filled, is lowered, and the full tray is transferred to a tray transfer arm.
Transported to L5. Further, the empty customer tray KT is transported from the empty stocker EMP by the tray transfer arm to the empty window portion 403 where the customer tray KT has been paid out, and is set on the window portion 403 after being replaced on the elevating table. You.

In one buffer unit 402 of this embodiment, 16 ICs to be tested can be stored.
There is provided a memory for storing the category of the IC under test stored in each IC storage location 02.

The category and position of the IC under test deposited in the buffer 402 are stored for each IC under test, and the IC under test deposited in the buffer 402 is stored.
The customer tray KT of the category to which the
00 (UL1 to UL5), and the fifth
Then, the tested ICs are stored in the corresponding customer trays KT by the sixth transfer devices 406 and 407.

Next, the operation will be described. The customer tray KT on which the IC before the test is mounted is stored in the stocker LD of the IC storage unit 100.
Is set in the window 202 of the loader unit 200. From the customer tray KT facing the upper surface of the device substrate 201, for example, four ICs to be tested are sucked at a time using the first transfer device 204, and once dropped into the pitch conversion stage 203 to be tested. IC position correction and pitch change are performed.

Next, using the second transfer device 205, four ICs to be tested dropped into the pitch conversion stage 203 are sucked at a time, for example, four ICs at a time, and the entrance 303
From the test chamber 301 to the position CR1
On the IC carrier CR that is stationary. Since two positions CR1 are provided in the test chamber 301, the second transfer device 205
The IC under test is carried alternately to the carrier CR. At this time, the shutter 15 of the IC carrier CR is opened and closed by the fluid pressure cylinder 182 (see FIG. 6).

At each position CR1, 16 ICs are tested.
When individually mounted, the IC carrier CR is transported in the test chamber 301 in the order of CR1 → CR2 →... → CR4 shown in FIG. 6, during which high-temperature or low-temperature stress is applied to the IC under test.

An IC carrier CR on which a pre-test IC is mounted
Is carried to the position CR5 on both sides of the test head 302, the shutter 15 of the IC carrier 15 is opened by the above-mentioned stopper, and as shown in FIG. 18A, one suction head ( Here on the left) 30
4c descends and sucks every other IC under test (FIG. 17).
Rise again and wait here. At the same time,
The other suction head (here, right side) 304c presses the eight suctioned ICs to be tested against the contact portions 302a of the test head 302 to execute a test.

At this time, an exit carrier EXT (shown by a two-dot chain line) is provided above the left IC carrier CR5.
Does not exist, the position EXT2 outside the test chamber 301
Have moved to. Also, an exit carrier EXT exists in EXT1 of the upper side of the right IC carrier CR5, and the IC under test sucked by the right suction head 304c.
Wait for the test to finish.

The 8 suctioned by the right suction head 304c
When the test of the ICs under test is completed, as shown in FIG. 18B, the movable heads 304b, 304b are moved to the right, and the eight ICs under test adsorbed on the suction head 304c on the left are tested. The test is performed by pressing against the contact portion 302a of the head 302.

On the other hand, the eight tested ICs sucked by the suction head 304c on the right side are placed on the exit carrier EXT which is waiting, and then the exit carrier EXT on which the tested IC is placed is placed in the test chamber. 3
01 moves from the position EXT1 inside the test chamber 301 to the position EXT2 outside the test chamber 301.

When the exit carrier EXT moves outside the test chamber 301, the right suction head 304c moves the IC carrier CR located at the right position CR5.
, And sucks the remaining eight ICs to be tested, rises again, and waits for the test of the ICs to be sucked to the left suction head 304c to be completed. Before the suction head 304c is adsorbed, IC carrier CR is the rest of the IC so as to be adsorbed by the suction heads 304c, moves by the pitch _{P 1} (see FIG. 17).

At about the same time, the left exit carrier EXT moves into the test chamber 301, and waits at this position EXT1 to end the test of the IC under test sucked by the left suction head 304c.

When the test of the IC under test sucked by the left suction head 304c is completed, the movable heads 304b, 304b are moved to the left, and the remaining eight test heads sucked by the right suction head 304c are moved. Test IC
Is pressed against the contact portion 302a of the test head 302 to perform a test.

On the other hand, the eight tested ICs sucked by the suction head 304c on the left side are placed on the exit carrier EXT which is waiting, and then the exit carrier EXT on which the tested IC is placed is placed in the test chamber. 3
01 moves from the position EXT1 inside the test chamber 301 to the position EXT2 outside the test chamber 301.

Hereinafter, this operation is repeated, but these two suction heads 3 are applied to one contact portion 302a.
04c are alternately accessed, and one waits for the other test to end, so that the time for attracting the IC under test to one suction head 304c is absorbed by the other test time, The index time can be reduced.

The empty IC carrier CR from which the IC under test is taken out at the pair of positions CR5 is sent to the position CR6, and the bar code mark BC of the IC carrier CR set at one (rear side) position CR6 is displayed. , As shown in FIGS. 13A and 13B,
1 and then, as shown in FIGS. 14A and 14B, a barcode reader 311
Is rotated 180 degrees by the rotating device, and the other side (front side)
The barcode mark BC of the IC carrier CR set at the position CR6 is read by the barcode reader 311 and each piece of information is transferred to the control device. When the reading of the barcode mark BC is completed, the IC carrier CR is positioned at the position CR.
6 to the position CR1 to prepare for loading the next IC under test.

On the other hand, the ICs to be tested which have completed the test with the test head 302 described above are alternately moved to the test chamber 30 by two exit carriers EXT by eight.
It is paid out to the position EXT2 outside the position 1.

As shown in FIG. 19, the eight tested ICs discharged to the right position EXT2 by the exit carrier EXT are connected to the suction head 4 of the fourth transfer device 404.
04c is collectively adsorbed on the hot plate 401c.
On one of the two areas. In the following description of the present embodiment, it is assumed that a low-temperature thermal stress is applied. However, when a high-temperature thermal stress is applied, the buffer section 40 is directly transmitted from the exit carrier EXT.
It is carried to 2.

The suction head 404c of the fourth transfer device 404, which has carried the tested IC to one area of the hot plate 401, does not return to the original position, and is located in the tested IC placed on the hot plate 401 until then. Then, the eight ICs with the longest elapsed time are sucked at that position, and the heated tested ICs are replaced on the lifting table 405 (here, the right side) of the buffer unit 402 at the lower position.

As shown in FIG. 19, the fourth transfer device 40
The lifting table 405 on the left on which the eight tested ICs are mounted by the previous operation of Step 4 moves to the lifting position, and accordingly, the lifting table 405 on the right.
Moves to the lowered position. Eight tested ICs are mounted on the left elevating table 405 that has moved to the ascending position, and these tested ICs are stored in the fifth and sixth transfer devices 406 and 407 as test result storage contents. Is transferred to the customer tray KT of the corresponding category according to FIG. 19 shows a test I
An example in which C is replaced on the customer tray KT is shown.

The above operation is repeated, and the tested I
C is reloaded to the customer tray KT of the corresponding category.
04 and the fifth or sixth transfer device 406, 407 at different levels, the fourth transfer device 404
And the fifth and sixth transfer devices 406 and 407 can be operated simultaneously, thereby increasing the throughput.

According to the above-described embodiment, the bar code mark BC is displayed on the IC carrier CR via the mark member 19 (or directly) and read by the bar code reader 311. Since the BC can display a large amount of information in a relatively small area, the amount of information to be set can be set larger than before, and the bar code reader 311 can collectively read the bar code mark BC. Therefore, the time required for detection can be greatly reduced.

Further, since the positional relationship between the bar code reader 311 and the bar code mark BC may be relatively rough, the occurrence of erroneous detection is reduced, and it is not necessary to perform positioning for information detection with a very high accuracy. In addition, cost can be reduced.

Further, in the above-described embodiment, the bar code marks BC of the IC carrier CR at a pair of positions CR 6 in the transport path in the chamber section 300 of the IC carrier CR are read by the bar code reader 311 by the rotating devices 312 and 313. Is rotated so that a single bar code reader 311 can be used. Therefore, the configuration is simpler than that of a configuration in which a bar code reader is provided to read each bar code mark BC. The size and cost can be reduced.

The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, in the above embodiment,
The thermal stress on the IC under test is
Although the case where the present invention is applied to an IC test apparatus 1 of the type given by using the present invention has been described as an example, the present invention can be applied to an IC test apparatus other than a so-called chamber type. It is not limited in any way to the type of device.

Further, in the above-described embodiment, the rotating device for rotating the bar code reader 311 is such that the rotary table 312 is rotated by the motor 313. However, a linear device such as a pneumatic cylinder or a hydraulic cylinder is used. A motion type actuator that converts the motion into a rotational motion may be employed.

Further, a barcode mark is attached to the customer tray KT instead of the IC carrier CR, and a barcode detection unit similar to the above is provided near the transport path of the customer tray KT, and the barcode mark is read. You may do so. In this case, unlike the above-mentioned IC carrier CR, the customer tray KT is used under a normal environment.
Bar code detector 3 to protect against temperature stress
It is not necessary to house 10 in case 320 or the like.

[0138]

As described above, according to the present invention, I
At a plurality of different places in the transport path of the C tray, IC
There is an effect that various information relating to the tray can be detected efficiently and without erroneous detection.
Further, there is an effect that the size and cost of the device can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of an IC test apparatus showing an embodiment of the present invention.

FIG. 2 is a conceptual diagram showing a method of routing an IC under test in the IC test apparatus of FIG.

FIG. 3 is a plan view schematically showing a transfer unit provided in the IC test apparatus of FIG.

FIG. 4 is a perspective view showing a structure of an IC stocker of the IC test apparatus of FIG.

FIG. 5 is a perspective view showing a customer tray used in the IC test apparatus of FIG. 1;

FIG. 6 is a perspective view illustrating a transfer path of an IC carrier (IC tray) of the IC test apparatus of FIG. 1;

FIG. 7 is a perspective view of an IC carrier according to the embodiment of the present invention.

8A and 8B are plan views of the IC carrier according to the embodiment of the present invention, wherein FIG. 8A shows a state where a shutter is closed, and FIG. 8B shows a state where the shutter is opened.

FIG. 9 is a sectional view taken along the line IX-IX in FIG.

FIG. 10 is a sectional view taken along line XX of FIG. 8;

FIG. 11 is a diagram showing an example of a barcode mark provided on the IC carrier according to the embodiment of the present invention.

FIG. 12 is a diagram showing variations in the position of a barcode mark on the IC carrier according to the embodiment of the present invention.

13A and 13B are cross-sectional views illustrating a configuration of a barcode detection unit and its vicinity in a state where one of the IC carriers according to the embodiment of the present invention is directed, FIG. 13A is a cross-sectional view cut along a horizontal plane, and FIG. It is sectional drawing cut | disconnected by the vertical surface.

14A and 14B are cross-sectional views illustrating a configuration of a barcode detection unit and its vicinity in a state where the other IC carrier according to the embodiment of the present invention is directed, FIG. 14A is a cross-sectional view cut along a horizontal plane, and FIG. It is sectional drawing cut | disconnected by the vertical surface.

FIGS. 15A and 15B are views showing an IC accommodating portion of the IC carrier according to the embodiment of the present invention, wherein FIGS.
(C) is a sectional view.

FIG. 16 is a diagram showing another example of the barcode mark of the IC carrier according to the embodiment of the present invention.

FIG. 17 is a plan view for explaining a test order of an IC under test in a test chamber of the IC test apparatus of FIG. 1;

18 is a cross-sectional view (corresponding to line XVIII-XVIII in FIG. 3) for describing a method of arranging an IC under test in a test chamber of the IC test apparatus in FIG. 1;

19 is a cross-sectional view (corresponding to line XIX-XIX in FIG. 3) for explaining a method of handling an IC under test in an unloader section of the IC test apparatus in FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... IC test apparatus 100 ... IC storage part 101 ... IC pre-test IC stocker 102 ... Tested IC stocker 103 ... Tray support frame 104 ... Elevator 200 ... Loader part 201 ... Device substrate 202 ... Loader part window 203 ... Pitch conversion Stage 204 First transfer device 205 Second transfer device 300 Chamber section 301 Test chamber 302 Test head 302a Contact section 303 Entrance of chamber section 304 Third transfer apparatus 310 Barcode detection section 311 bar code reader 312 rotary table 313 motor 320 case 321 window 400 unloader 401 hot plate 402 buffer 403 window 404 fourth transfer device 405 lifting table 406 fifth Transfer device 407: Sixth transfer Apparatus KT: Customer tray CR: IC carrier (IC tray, test tray) 11: Plate 111: Through hole (penetrating part) 112: Pulley 113: Positioning hole 12: Depression 13: Block 14: IC housing part 15: Shutter 151 ... Sliding body 152 ... Elongated hole 153 ... Opening part 154 ... Through hole (penetrating part) 16 ... Spring 17 ... Guide plate 171 ... Guide hole (guide means, penetrating part) 18 ... Shutter opening / closing mechanism (opening / closing drive means) 181 ... Opening / closing block 182: Fluid pressure cylinder 19: Mark member BC: Bar code mark EXT: Exit carrier

Continued on front page F term (reference) 2G003 AA07 AG11 AG14 AH01 2G032 AA00 AE01 AE08 AE12 AK01 AL01 4M106 AA04 BA14 CA62 DG02 DG03 DG20 DG30 5B072 AA03 CC12 CC16 CC24 JJ04 JJ06 LL12 LL19 LL19

Claims (5)

[Claims] 1. A plurality of IC trays for transporting an IC under test are provided with barcode marks in which various information is set, and bars of the IC trays at first and second positions different from each other are provided. An IC test apparatus wherein a code mark is read by a single bar code reader. 2. An attitude of the barcode reader is changed so that the barcode reader selectively points to one of barcode marks of an IC under test at the first position and the second position. 2. The IC test apparatus according to claim 1, further comprising a supporting means. 3. The barcode reader according to claim 1, wherein the first position and the second position are disposed on both sides of the barcode reader, and the support means is means for rotating the barcode reader. The IC test apparatus according to claim 2, which performs the test. 4. The information set in the bar code mark includes identification information for identifying the IC tray from other IC trays, type information of an IC to be tested accommodated in the IC tray, and testing at the same time. The IC test apparatus according to any one of claims 1 to 3, wherein the IC test apparatus includes at least one of pieces of information on the number of ICs to be tested. 5. The IC tray according to claim 1, wherein the barcode mark is displayed on a member detachable from the IC tray, and is attached to the IC tray. IC testing equipment.