JP2000079983A - Electronic component tray, electronic component tray carrier and electronic component testing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component tray, a tray carrier and a testing apparatus which can be quickly moved in an approximately vertical direction or in an approximately horizontal direction. SOLUTION: An apparatus comprises a tray end holding member 310 which can detachably hold ends of a lower end tray 110 positioned at the lower end among stacked trays 110, a tray lift member 314 for carrying the lower end tray 110 downward or upward, and an actuator member for canceling the holding of the lower end tray 110 when the lower end tray 110 can be supported by the tray lift member 314 and driving the tray end holding member 310 to hold ends of another tray which comes to the lower end position next. It further comprises a tray horizontal carrier 320 for receiving the lower end tray 110 when the tray lift member 314 moves downward, which can move in an approximately horizontal direction. The tray horizontal carrier 320 is moved by a driving wire.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tray for electronic components, a tray transport device for electronic components, and an electronic component testing device. More particularly, the present invention relates to a method for testing electronic components such as IC chips. The present invention relates to an electronic component tray and an electronic component tray transport device suitable for containing and transporting, and an electronic component test device having the tray or the tray transport device.

[0002]

2. Description of the Related Art In the course of manufacturing semiconductor devices and the like,
A test device for testing an electronic component such as an IC chip finally manufactured is required. In such a test apparatus, a component handling apparatus called a handler is used. In this handler, a large number of IC chips stored in a tray are suctioned by a component suction device and conveyed onto a test head of a test device, and each IC chip is brought into electrical contact with the test head to test the IC chips. Do. Then, when the test is completed, each IC chip is carried out of the test head by a component suction device having a suction pad, and is placed on a tray according to the test result, whereby sorting into categories such as non-defective products and defective products is performed.

[0003] In this type of test apparatus, a tray (hereinafter, referred to as a customer tray) for circulating and transporting the inside of a handler (hereinafter, also referred to as a customer tray) for storing an IC chip before a test or for storing a tested IC chip. , Test trays). In this type of handler, the IC under test is replaced between the customer tray and the test tray before and after the test, and a plurality of ICs are mounted.
The chip is transported in the handler while being mounted on the test tray, and the IC chip is protected during the transport.

[0004] Further, the upper portion of the test head is covered with a chamber, the inside is made a closed space, and the IC chip is conveyed over the test head. A test apparatus that performs a test while keeping the temperature low is also known.

In such a test apparatus, a test tray is sequentially moved in a substantially vertical direction inside the chamber,
Thermal stress is gradually applied to an IC chip mounted on a test tray. Heat stress I
The reason why the test tray is moved in the substantially vertical direction in order to gradually apply the voltage to the C chip is to reduce the size of the chamber by arranging a plurality of test trays in the substantially vertical direction.

In the conventional test apparatus, all the trays arranged in a substantially vertical direction are individually and removably held by holding members as a tray transport device for moving the test trays in a substantially vertical direction. In addition, a vertical transfer device that sequentially moves down one step at a time in the vertical direction is used.

[0007]

However, in such a conventional tray vertical transfer device in a conventional test apparatus, the mechanism is complicated because the tray is held vertically by a holding member in a vertical direction and sequentially moved downward. The problem is that In addition, it takes time corresponding to the number of trays to transfer the trays from the uppermost holding member to the lowermost holding member, and when the number of trays arranged in the vertical direction is small, the number of trays is large. It takes the same amount of time. Further, there is a problem that the operation speed of the mechanism cannot be increased due to the mechanism of such a conventional tray vertical transfer device.

Further, inside the chamber of the test apparatus, it is necessary to move the test tray not only in a substantially vertical direction but also in a substantially horizontal direction, and a tray horizontal transfer device is also provided in the chamber.

However, the conventional tray horizontal transfer device is
Since the tray is moved in the horizontal direction by the belt conveyor method, there is a problem in a mechanism for stopping the tray at a predetermined position. For example, in a conventional belt conveyor-type tray horizontal transfer device, in order to stop the tray at a predetermined position, the tray conveyed by the belt conveyor hits a stopper member to stop the tray, and the stopped tray is detected by a position sensor. After that, the belt conveyor is stopped. Then, when moving the tray to another position, after moving the stopper member backward, the belt conveyor is driven, and in the same manner as described above, the tray is stopped by the stopper member at the other stop position. I have.

Therefore, a stopper member and a sensor are required for each of a plurality of stop positions, and an actuator for driving the stopper member is also required, so that the mechanism is complicated. In addition, since the tray is abutted against the stopper member to stop the tray, the impact of the collision is applied to the tray, and the tray and the tray slip until the conveyor stops. Troubles such as occur. further,
Since the tray is stopped by hitting the stopper member, the stop position is likely to shift, and a mechanism for positioning the tray needs to be separately mounted.

The present invention has been made in view of such circumstances, and has a simple mechanism for transporting a tray for transporting electronic components such as IC chips in a substantially vertical direction.
A first object of the present invention is to provide an electronic component tray, an electronic component tray transport device, and an electronic component test device that can be moved in a substantially vertical direction particularly quickly when the operation speed is high and the number of trays is small. Aim.

A second object of the present invention is to provide, for example,
When a tray for transporting electronic components such as C chips is transported in a substantially horizontal direction, the tray can be easily stopped accurately at a predetermined stop position by a relatively simple mechanism, and acts on the tray. An object of the present invention is to provide an electronic component tray transport device and an electronic component test device with a small load and few failures.

[0013]

In order to achieve the first object, an electronic component tray according to the present invention is an electronic component tray having an accommodating portion for accommodating at least one electronic component. Are provided on the upper surface or the lower surface of the tray so that they can be stacked in a substantially vertical direction with a predetermined gap therebetween. The electronic component tray according to the present invention preferably further includes a shutter that opens and closes an opening surface of the housing portion.

In order to achieve the first object, a first electronic component tray transport device according to the present invention provides an electronic component for transporting a tray containing at least one electronic component in a substantially vertical direction. A component tray transport device, comprising: a tray end holding member capable of detachably holding an end of a lowermost tray located at a lowermost end of the stacked trays; and A tray elevating member that contacts the lower surface and conveys the lowermost tray downward or upward, and the tray elevating member contacts the lower surface of the lowermost tray, and the lowermost tray can be supported by the tray elevating member. In this case, the holding of the lowermost tray by the tray end holding member is released, and the tray end holding member is driven so as to hold the end of another tray which comes next to the lowermost position. And an actuator member.

In the present invention, the actuator is not particularly limited, and examples thereof include a pressure cylinder such as an air cylinder, an electromagnetic drive actuator, a piezoelectric drive actuator, and a motor actuator.

In the first electronic component tray transport device according to the present invention, the tray lifting member is disposed below the tray end holding member so that the tray lifting member does not interfere with the lifting movement of the tray lifting member. It is preferable that the lowermost tray is further provided with a tray horizontal carrier that can be transferred in a substantially horizontal direction. In the present invention, the “substantially vertical direction” is not limited to the strict sense of the vertical direction, but also includes a case where there is a slight inclination from the vertical direction. Similarly, the substantially horizontal direction means not only the horizontal direction in a strict sense, but also includes a case in which there is a slight inclination from the horizontal direction.

[0017] In the first electronic component tray transport device according to the present invention, it is preferable that the electronic component tray transport device further includes a rail that holds the tray horizontal carrier so as to be movable in a substantially horizontal direction.

In the first electronic component tray transport device according to the present invention, a drive wire connected to the tray horizontal carrier and moving the tray horizontal carrier in a substantially horizontal direction by moving the tray horizontal carrier in a longitudinal direction is further provided. It is preferred to have.

In the first electronic component tray transport device according to the present invention, the drive wire is moved or unwound to move the tray horizontal carrier in a substantially horizontal direction by the drive wire. It is preferable to further have a motor.

To achieve the second object, a second electronic component tray transport device according to the present invention is a tray for transporting a tray containing at least one electronic component in a substantially horizontal direction. An electronic component tray transfer device having a horizontal carrier, comprising a drive wire connected to the tray horizontal carrier and moving the tray horizontal carrier in a substantially horizontal direction by moving the tray horizontal carrier in a longitudinal direction.

In the second electronic component tray transport device of the present invention, it is preferable that the electronic component tray transport device further includes a rail which holds the tray horizontal carrier so as to be movable in a substantially horizontal direction.

In a second electronic component tray transport device of the present invention, a drive motor for moving the tray horizontal carrier in a substantially horizontal direction by winding or unwinding the drive wire. It is preferable to further have

An electronic component testing apparatus according to the present invention includes the above-described tray according to the present invention, the first electronic component tray transport device according to the present invention, or the second electronic component tray transport device according to the present invention. .

[0024]

The tray according to the present invention has a convex portion on the upper surface or the lower surface of the tray, which allows the trays to be stacked in a substantially vertical direction with a predetermined gap therebetween. For this reason,
When the trays are stacked substantially vertically, a predetermined gap is formed between the trays. As a result, the tray end holding member of the first electronic component tray transport device according to the present invention can easily hold the end of the next lowermost tray. In addition, since a gap is formed between the stacked trays, when these trays are arranged in the chamber, the high or low temperature atmosphere in the chamber satisfactorily transfers heat to the trays, and keeps each tray at a uniform temperature. Easy to set.

In the first electronic component tray transport device according to the present invention, the trays are sequentially stacked on the lowermost tray held by the tray end holding member. Is not held by the tray end holding member. Therefore, when the number of trays to be stacked is small, only the lowermost tray among the small number of stacked trays is held by the tray end holding member.

The lower surface of the lowermost tray of the stacked trays abuts on the tray elevating member, and when the lowermost tray can be supported by the tray elevating member, the tray end holding member is moved. Driven by the actuator member, the holding of the lowermost tray by the tray end holding member is released. Then, by driving the tray end holding member again by the actuator member, the tray end holding member holds the end of another tray which comes next to the lowermost position.

The lowermost tray held by the tray elevating member is conveyed downward or upward by the tray elevating member.
For example, it is placed on a tray horizontal carrier and transported in a substantially horizontal direction. In this way, the tray located at the lowermost end of the stacked trays is sequentially transported by the tray vertical transport device. Therefore, when the number of stacked trays is small, the trays are conveyed from the uppermost end to the lowermost end with only a waiting time corresponding to the number of stacked stacks.

Incidentally, conventionally, the tray is moved down for each number of tray end holding members regardless of the actual number of trays, so that a waiting time corresponding to the number of tray end holding members is required. And it was taking time. Also,
In the first electronic component tray transport device of the present invention, the operation speed is high because it is a simple mechanism.

In the second electronic component tray transport device according to the present invention, since the tray horizontal carrier is transported in a substantially horizontal direction by the drive wire, the tray horizontal carrier is controlled by controlling the longitudinal movement amount of the drive wire. The carrier can be stopped at an accurate position. The amount of movement of the drive wire in the longitudinal direction can be controlled relatively easily by using, for example, a step motor as the drive motor. Further, unlike the related art, the tray is not stopped by colliding the stopper member, so that the load acting on the tray is small, the durability of the tray is improved, and the failure is small. In addition, since the tray horizontal carrier can be stopped at an accurate position by controlling the longitudinal movement amount of the drive wire, there is no need to provide a stopper member or a sensor at each stop position of the tray, which is a simple configuration. In this respect, there are few failures.

The tray according to the present invention, the first electronic component tray transport device according to the present invention, or the second electronic component tray transport device according to the present invention is particularly suitable for use in a chamber of an electronic component test device. It is. In the chamber of the electronic component test equipment, it is necessary to transport the tray in the vertical direction and also in the horizontal direction, so that the operation speed of the tray transport device is improved, the failure rate is low, the durability is high, and the stop is accurate. This is because position control and the like are required.

[0031]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings. 1 to 4 are schematic perspective views of a tray vertical transfer device according to one embodiment of the present invention, FIG. 5 is a perspective view of a tray according to one embodiment of the present invention, and FIGS. 6 and 7 are one embodiment of the present invention. FIG. 8 is a cross-sectional view of a main part of the rail shown in FIG. 6, FIG. 9 is an overall perspective view of an IC testing apparatus according to an embodiment of the present invention, and FIG.
0 is a conceptual diagram showing the flow of an IC chip in the test apparatus shown in FIG. 9, and FIG.
FIG. 12 is a plan view schematically showing an IC chip transfer device for realizing the flow of C chips, and FIG. 12 is a perspective view for explaining a transfer path of a tray used in a chamber of the IC test device.

[First Embodiment] In this embodiment, a tray vertical transfer device embodying a first electronic component tray transfer device according to the present invention and an IC embodying an electronic component tray according to the present invention are described. The tray will be described.

As shown in FIGS. 1 to 4, the tray vertical transfer device 350 according to the present embodiment is a device for transferring the IC tray 110 in a substantially vertical direction. Each IC tray 11
No. 0 has convex portions 120 at the four corners of its lower end surface. These protrusions 120 are for forming a gap between the IC trays 110 when a plurality of IC trays 110 are stacked.

As shown in FIG. 5, each IC tray 110 is composed of an elongated plate 11 and has eight concave portions 12 on the upper surface thereof, and an IC for mounting an IC chip under test in each of these concave portions 12. Two accommodating portions 14 are formed.

The IC accommodating portion 14 of this embodiment is screwed into the concave portion 12 of the plate 11 in a state where two blocks 13 having the same shape face each other. , 13 facing each other. Here, 16 IC accommodating portions 14 for mounting the IC chips under test are formed along the longitudinal direction of the plate 11, and the mounting pitch of the IC chips under test in the longitudinal direction of the plate 11 is set at equal intervals. .

The mounting positions of the blocks 13 and 13 with respect to the concave portions 12 of the plate 11 are appropriately determined according to the size and shape of the IC to be mounted.

The IC tray 110 according to the present embodiment has a shutter 15 for opening and closing an opening on the upper surface of the IC under test stored in the IC accommodating portion 14 of the IC tray 110 in order to prevent the IC from shifting or popping out. Is provided.

The shutter 15 is openable and closable with respect to the plate 11 by a spring 16. When the IC under test is housed in or taken out of the IC housing 14, an external shutter opening / closing mechanism is provided. By using the shutter 15 to open, the IC under test is accommodated or taken out. When the external shutter opening / closing mechanism is released, the shutter 15 returns to the original state by the elastic force of the spring 16, and the opening surface of the IC accommodating portion 14 of the plate 11 is covered by the shutter 15. The IC under test accommodated in 14 is held without displacement or jumping out even during high-speed conveyance.

The shutter 15 of the present embodiment is
1 is supported by three pulleys 112 provided on the upper surface of the shutter 1, the central pulley 112 engages with a long hole 152 formed in the shutter 15, and the two pulleys 11 provided on both ends
Reference numerals 2 and 112 respectively hold both end edges of the shutter 15.

However, the center pulley 112 and the shutter 15
Engagement with the long hole 152 is such that there is almost no backlash in the longitudinal direction of the plate 11, whereas a slight gap is provided between the pulleys 112 at both ends and both end edges of the shutter 15. Is provided. In this way, even if thermal stress acts on the IC tray 110, expansion or contraction due to the thermal stress is distributed to both ends around the central pulley 112, and is appropriately absorbed by gaps provided at both ends. Therefore, the amount of expansion or contraction of the entire length of the shutter 15 in the longitudinal direction is halved even at both ends where the shutter 15 expands or contracts the most, whereby a difference between the amount of expansion and contraction of the plate 11 can be reduced. Therefore, the IC tray 110 of the present embodiment is compatible with the IC testing apparatus 1 described later.
It is suitable for use in the chamber 300 of FIG. Chamber 30
This is because the inside of 0 is maintained at a high or low temperature.

Further, in the IC tray 110 of the present embodiment,
A plurality of sliding members are attached to the shutter 15 in order to prevent the interference between the shutter 15 and the upper surface of the plate 11 when opening and closing the shutter 15 and to smoothly open and close the shutter 15. This sliding body is made of a material having a lower hardness than the metal constituting the plate 11, for example, various resins such as engineering plastics, and is mounted in a through hole formed in the shutter 15.

By providing such a sliding member between the shutter 15 and the plate 11, the opening and closing operation of the shutter 15 can be smoothly performed, and the shutter 15 and the plate 11 can be opened and closed.
Since mutual damage can be prevented, the life of the IC tray 110 itself can be extended.

The IC tray 110 according to the present embodiment can accommodate and remove the IC under test only by opening and closing the shutter 15 without having a complicated shape and structure, so that the operation time is significantly reduced.

Further, in the IC tray 110 of the present embodiment, since both ends of the shutter 15 are supported by the springs 16, 16, the balance of the shutter 15 at the time of opening / closing is improved, and the center of the shutter 15 is opened as described above. It is easy to open and close only by gripping only.

As shown in FIG. 1, the tray vertical transfer device 350 according to this embodiment includes a pair of tray end holding members 3.
10 and a tray elevating member 314. The tray end holding member 310 is a rail capable of detachably holding both ends in the longitudinal direction of the lowermost IC tray 110 disposed at the lowermost end.

The tray elevating member 314 has a tray lower surface holding plate 316 and an elevating rod 318 whose upper end is connected to the tray lower surface holding plate 316. Lifting rod 318
Is vertically movable by an actuator such as a pressure cylinder (not shown).

As shown in FIG. 2, the tray end holding members 310 are each provided with an actuator 3 such as a pressure cylinder.
12, the tray elevating member 314 contacts the lower surface of the lowermost tray 110, and the lowermost tray 110 can be supported by the tray elevating member 314. 11
It is possible to release the holding of 0. As shown in FIG. 3, the tray end holding member 310 is
12, and can hold both ends of another IC tray 110 which comes to the next lowermost position.

As shown in FIG. 4, the tray end holding member 3
Below 10, a horizontal carrier 320 having an opening 322 through which the tray elevating member 314 can pass is arranged so as not to interfere with the elevating movement of the tray elevating member 314. When the tray elevating member 314 moves downward with the lowermost IC tray 110 placed thereon, the horizontal carrier 3
On top of the IC tray 20, an IC tray 110 can be mounted. When the tray elevating member 314 moves sufficiently downward through the opening 322, the tray horizontal carrier 320 can move in the horizontal direction along the longitudinal direction of the IC tray 110 with the IC tray 110 placed thereon. 110 is then transported horizontally. Note that even if the tray elevating member 314 does not necessarily move downward sufficiently through the opening 322, the tray
By providing the notch 323 communicating with the tray 2, the horizontal movement of the tray horizontal carrier 320 can be allowed. Notch 323
Is passed through the lifting rod 318 of the tray lifting member 314.

In this embodiment, the tray horizontal carrier 32
The driving means for transporting 0 in the horizontal direction is not particularly limited, and a belt conveyor or the like is used. In addition,
Driving means such as a belt conveyor is also used for the tray elevating member 31.
4 must be provided so as not to interfere with the vertical movement.

Tray vertical transfer device 35 according to this embodiment
0, the IC trays 110 are sequentially placed on the lowermost IC tray 110 held by the tray end holding member 310.
Are stacked, and unlike the conventional case, each of the stacked I
Each C tray 110 is not held by the tray end holding member. Therefore, when the number of IC trays to be stacked is small, only the lowermost IC tray 110 of the IC trays 110 stacked in a small number is held by the tray end holding member 310.

The lower surface of the lowermost IC tray 110 of the stacked IC trays 110 is
When the lowermost IC tray 110 can be supported by the tray elevating member 314, the tray end holding member 310 is driven by the actuator member 312, and the lowermost IC tray by the tray end holding member 310 is contacted. Release the hold. Then, the actuator member 31
By driving the tray end holding member 310 again by 2, the tray end holding member 310 holds both ends of another IC tray 110 that comes to the next lowermost position.

The lowermost IC tray 110 held by the tray elevating member 314 is conveyed downward by the tray elevating member 314, for example, placed on a tray horizontal carrier 320, and conveyed in a substantially horizontal direction. The IC tray 110 located at the lowermost end of the stacked IC trays 110 is sequentially conveyed by the tray elevating member 314. Therefore, the stacked IC trays 1
When the number of the IC trays 110 is small, the IC tray 110 is conveyed from the uppermost end to the lowermost end only with a waiting time corresponding to the number of stacks in the stack.

Further, the tray vertical transfer device 3 of the present embodiment
Since 50 is a simple mechanism, its operation speed is high. In the example described above, an example is shown in which the lowermost tray 110 of the stacked IC trays 110 is sequentially conveyed downward by using the tray vertical conveyance device 350. However, in the present invention, the above-described operation is performed. The operation of reversing may be performed. That is, the IC tray 110 conveyed from the horizontal direction by the tray horizontal carrier 320 is moved to the tray elevating member 3.
14, the IC trays 110 may be successively added to the lowermost position of the stacked IC trays 110. In that case,
The tray end holding member 310 releases the holding of the tray end in a state where the upper surface of the IC tray 110 lifted by the tray elevating member 314 is held in contact with the projection 120 of the stacked IC trays 110. I do. afterwards,
All of the stacked IC trays 110 are moved up and down by the elevating member 31.
4, the tray end holding member 310 holds both ends of the IC tray 110 at the next lowermost position. Thereafter, the elevating member 314 moves downward. The IC tray 110 located at the uppermost end of the stacked IC trays 110 held and stacked by the tray end holding member 310 is transported to another position by another transfer device.

[Second Embodiment] In the present embodiment, a tray horizontal transfer device embodying a second electronic component tray transfer device according to the present invention will be described.

As shown in FIGS. 6 and 7, the tray horizontal transfer device 360 according to the present embodiment includes an IC tray 110a.
And a tray horizontal carrier 320a in the form of an elongated plate on which the tray can be detachably mounted.
Has a driving wire 330 for moving the H.sub.1 in the horizontal direction along the longitudinal direction. In FIG. 6, a pair of tray horizontal carriers 320a, 320a are illustrated as being substantially parallel and adjacent to each other, but in FIG. 7, only a single tray horizontal carrier 320a is illustrated for ease of explanation. is there.

As shown in FIG. 7, the tray horizontal carrier 3
An opening 322a may be formed in 20a. For example, as shown in FIG. 4, the opening 322 a allows the tray elevating member 314 to pass when the tray horizontal transfer device 360 is used in combination with the tray vertical transfer device 350.

As shown in FIG. 6, the tray horizontal carrier 3
The IC tray 110a placed on the 20a may be the same as or different from the IC tray 110 shown in FIG. In any case, the IC tray 110a contains one or more IC chips, preferably a plurality of IC chips.

As shown in FIGS. 6 and 8, a plurality of roller bearings 32 are provided on the lower surface of the tray horizontal carrier 320a.
4 and the roller bearings 324 are engaged with the rails 326 so that the tray horizontal carrier 32 is
0a is movable in a substantially horizontal direction along the longitudinal direction of the rail 326.

As shown in FIGS. 6 and 7, both ends of the driving wire 330 are connected to both ends in the longitudinal direction of the tray horizontal carrier 320a. The drive wire 330 is wound around the drive drum 344 of the drive motor 342 via a pulley 340, for example,
4 in the direction of the arrow R1, the drive wire 33
In the case where 0 moves in the direction of the arrow L1 and in the opposite rotational direction R2, it moves in the opposite direction of the arrow L2. As a result, the tray horizontal carrier 320a can reciprocate along the rail 326 shown in FIG. Although omitted in FIG. 7, the driving wire 330
In order to prevent loosening, a tensioner for applying tension to the drive wire 330 may be mounted.

The tray horizontal transfer device 36 according to the present embodiment
0, the tray horizontal carrier 320a is
0, so that the drive wire 3
By controlling the longitudinal movement amount of the tray 30, the tray horizontal carrier can be stopped at an accurate position. The amount of movement of the drive wire in the longitudinal direction is determined by, for example, the drive motor 34.
As 2, the motor can be controlled relatively easily by using a motor such as a step motor that can control the rotation angle or the number of rotations. Also, unlike the related art, the tray horizontal transfer device 360 according to the present embodiment is not configured to stop the IC tray 110 by colliding the stopper member, so that the load acting on the IC tray 110 is small, and the IC
The durability of the tray 110 is improved, and the number of failures is small. Further, by controlling the amount of movement of the drive wire 330 in the longitudinal direction, the tray horizontal carrier 320a can be stopped at an accurate position, so that it is not necessary to provide a stopper member or a sensor at each stop position of the IC tray 110. , The structure is simple, and there are few failures in this respect as well.

[Third Embodiment] In this embodiment, a tray vertical transfer device embodying the first electronic component tray transfer device according to the present invention, and a second electronic component tray transfer device according to the present invention are described. And a tray horizontal transfer device that embodies
An IC test apparatus arranged in the chamber of the C test apparatus will be described.

The IC test apparatus 1 according to the present embodiment shown in FIG. 9 tests whether an IC chip as an electronic component to be tested operates properly under high or low temperature stress. (Inspection), and classifies IC chips according to the test results. The operation test under such a temperature stress is performed by replacing the IC chip under test from the customer tray on which a large number of IC chips under test are mounted to the IC tray conveyed in the IC test apparatus 1. Will be implemented.

For this reason, the IC test apparatus 1 of the present embodiment
As shown in FIG. 9 and FIG. 10, an IC storage unit 100 for storing an IC chip to be tested from now on, and for classifying and storing tested IC chips, Test IC chip in chamber 300
200, a chamber 300 including a test head, and an unloader 400 for classifying and extracting tested IC chips tested in the chamber 300
It is composed of

The IC storage unit 100 stores the pre-test IC stocker 101 for storing the IC chips to be tested before the test and the tested ICs for storing the IC chips to be tested classified according to the test results. A stocker 102 is provided.

The pre-test IC stocker 101 includes:
While the customer trays storing the IC chips to be tested to be tested are stacked and held, the tested IC stocker 102 has a customer tray in which the IC chips to be tested are appropriately classified. Laminated and held.

Since the pre-test IC stocker 101 and the tested IC stocker 102 have the same structure, the pre-test IC stocker 101 and the tested IC stocker 1 have the same structure.
02 can be set to an appropriate number as needed.

In the examples shown in FIGS. 9 and 10, one stocker LD is provided in the pre-test stocker 101, and one empty stocker EMP sent to the unloader unit 400 is provided next to the stocker LD.
In addition, the tested IC stocker 102 is provided with five stockers UL1, UL2,..., UL5 so that the stockers can be sorted into up to five categories according to the test results and stored. In other words, besides the non-defective products and the defective products, the non-defective products are classified into those having a high operation speed, medium-speed ones, low-speed ones, and some of the defective ones requiring retesting.

Loader 200 The above-described customer tray is placed on the window 202 of the loader 200 by a tray transfer arm (not shown) provided between the IC storage unit 100 and the device substrate 201.
01 is carried from below. Then, the loader unit 200
In the above, the IC chips to be tested loaded on the customer tray are once transferred to the pitch conversion stage 203 by the first transfer device 204, where the mutual positions of the IC chips to be tested are corrected and the pitch is changed. , And this pitch conversion stage 2
03 is transferred to the second transfer device 2
10, the position CR1 in the chamber 300 (FIG. 10)
And FIG. 12).
Transfer to C tray 110. At that time, the shutter at the entrance 303 of the chamber 300 shown in FIG. 9 is open.

The pitch conversion stage 203 provided on the device substrate 201 between the window 202 and the chamber 300 has a relatively deep recess, and the periphery of the recess is surrounded by an inclined surface. Means for correcting the position of the IC chip and changing the pitch of the IC chip. When the IC chip to be tested sucked by the first transfer device 204 is dropped into the concave portion, the drop position of the IC chip to be tested is corrected on the inclined surface. become. Thereby, for example, the mutual positions of the four IC chips under test are accurately determined, and even if the mounting pitch between the customer tray and the IC tray in the chamber is different, the IC chips under test whose position has been corrected and the pitch has been changed can be obtained. Second
Is transferred to the IC tray in the chamber by suction by the transfer device 205 of I.
The IC chip under test can be reloaded in the C storage recess with high accuracy.

As shown in FIG. 11, the first transfer device 204 for transferring the IC chips under test from the customer tray to the pitch conversion stage 203 is provided on the device substrate 20.
1 and a rail 204a erected above the
A movable arm 204b capable of reciprocating between the customer tray and the pitch conversion stage 203 (this direction is defined as a Y direction) by 04a, supported by the movable arm 204b, and extending in the X direction along the movable arm 204b. And a movable head 204c that can move.

The movable head 2 of the first transfer device 204
The suction head 204d is mounted downward on the head 04c. The suction head 204d moves while sucking air to suck the IC chip under test from the customer tray, and the IC chip under test is pitch-converted. Drop it into the stage 203. Such a suction head 20
4d is mounted on the movable head 204c, for example, about four, so that four IC chips under test can be dropped into the pitch conversion stage 203 at a time.

On the other hand, the pitch conversion stage 20
The second transfer device 205 for transferring the IC chips to be tested from the IC chip 3 to the IC tray in the chamber 300 has the same configuration, and as shown in FIGS. 9 and 11, a rail 205a provided on the upper portion of the device substrate 201. And this rail 205
a and pitch conversion stage 203 and IC
Movable arm 205 that can reciprocate with the tray
b and a movable head 205c supported by the movable arm 205b and capable of moving in the X direction along the movable arm 205b.

The movable head 2 of the second transfer device 205
A suction head 205d is mounted downward on the head 05c. The suction head 205d moves while sucking air to suck the IC chip under test from the pitch conversion stage 203, and
The IC chip under test is transferred to the IC tray in the chamber via 3. For example, about four such suction heads 205d are mounted on the movable head 205c, and four IC chips to be tested can be transferred to the IC tray at a time.

The chamber 300 according to the present embodiment has an IC at a position CR1.
It has a constant temperature function of applying a desired high or low temperature stress to the IC chips to be tested loaded on the tray, and contacts the IC chips to be tested under the thermal stress to the test head 302 in a constant temperature state. Part 3
02a (see FIG. 10).

In the IC test apparatus 1 of this embodiment, when a low-temperature stress is applied to the IC chip under test, the heat is removed by a hot plate 401 described later. , Heat is removed by natural heat radiation. However, if a separate heat removal tank or heat removal zone is provided and the high temperature is applied, the IC chip under test is cooled by blowing air to return to room temperature, and if the low temperature is applied, the IC chip under test is heated or cooled. The temperature may be returned to a temperature at which dew condensation does not occur by heating with a heater or the like.

The test head 302 having the contact portion 302a shown in FIG. 10 is provided below the center of the test chamber 301, and the stationary position CR5 of the IC tray 110 is provided on both sides of the test head 302. Then, the IC chip to be tested placed on the IC tray conveyed to the position CR5 is moved to the third position shown in FIG.
The test is performed by directly transferring the IC chip under test to the contact portion 302a by directly transporting the IC chip under test to the test head 302 by the transfer device 304.

After the test, the IC chip under test is returned to the IC tray 101 without being returned to the test head 1.
02 is placed on the exit tray EXT1 that moves to and from the position CR5 on both sides of the chamber 02, and is carried out of the chamber 300. When a high temperature stress is applied, the heat is naturally removed after being carried out of the chamber 300.
FIG. 12 shows the IC tray 110 in the chamber 300.
(Or 110a) is shown three-dimensionally. As shown in FIG. 12, inside the chamber 300,
The two sets of IC trays 110 circulate from position CR1 to position CR6, respectively, and return to position CR1.

Strictly speaking, the position for receiving the IC under test from the second transfer device 205 shown in FIG. 9 is slightly higher than the position CR1 shown in FIG.
2 is indicated by a two-dot chain line). This is because the IC tray 110 faces the entrance 303 opened on the ceiling of the chamber 300 from below, and the entrance 303 is shielded by the IC tray 110 to prevent heat release in the chamber section 300. Therefore, when receiving the IC under test, the IC tray 110 slightly rises from the position CR1. Then I
The C tray 110 is returned to the position CR1, and is slid to the position CR2 by a slide moving device (not shown).

IC tray 110 transported to position CR2
Are vertically conveyed to the position CR3 by the tray vertical conveying device 350 shown in FIGS. Mainly during this transportation, a high or low temperature stress is applied to the IC under test. In the IC tray 110 according to the present embodiment, the convex portion 120 is formed, and since a gap is formed between the IC trays, a temperature stress is uniformly applied to the stacked IC trays 110, The time until the temperature of the IC becomes uniform is short. Thereafter, after waiting until the IC tray at the position CR5 becomes empty, the sheet is conveyed from the lowermost position CR3 to a position CR4 substantially at the same level as the test head 302 by the tray horizontal conveying device 360 shown in FIGS.

Further, the sheet is conveyed from the position CR4 toward the test head 302 side to a position CR5 in the horizontal direction by the tray horizontal transfer device 360 shown in FIGS.
Here, only the IC under test is sent to the contact portion 302a of the test head 302 (see FIG. 10). IC tray 11 after IC under test is sent to contact portion 302a
0 is from position CR5 to horizontal position CR6,
It is transported by the tray horizontal transport device 360 shown in FIGS. Thereafter, the sheet is transported vertically upward by the tray vertical transport device 350 shown in FIGS. 1 to 4, and returns from the position CR6 to the original position CR1. The tray vertical transfer device 350 according to the present embodiment can easily cope with the case where the number of stacked IC trays 110 in the path from the position CR6 to the position CR1 is small, as described in the first embodiment, and reduces the moving time. Can be shorter. When the number of stacked layers is small, the position CR1 is lower than when the number is large. In that case, the uppermost IC tray 110 may be lifted up using the tray elevating member 314 shown in FIG. 1 to transfer the IC chips.

As described above, since the IC tray 110 is circulated and conveyed only in the chamber section 300, once the temperature is increased or decreased, the temperature of the IC tray itself is maintained as it is. The thermal efficiency in the part 300 will be improved.

In the route of the IC tray 110 shown in FIG. 12, the position where the shutter 15 of the IC tray 110 shown in FIG. 5 needs to be opened is the second position shown in FIG.
CR1 for receiving the IC under test from the transfer means 205
(Strictly, slightly above it) and the IC under test
Are transferred to the contact portion 302a of the test head 302 by the transfer device 304 of the first embodiment.

Although not particularly limited, in the present embodiment, at the position CR1, the opening / closing block 181 provided on the upper surface of the shutter 15 of the IC tray 110 shown in FIG.
Is opened and closed by being hooked by a fluid pressure cylinder 182 shown in FIG. The fluid pressure cylinder 182 is connected to the test chamber 3
01 side. Then, by retracting the rod of the fluid pressure cylinder 182 with respect to the IC tray 110 in the stopped state, the shutter 15 is opened while the opening / closing block 181 provided on the shutter 15 is hooked. When the mounting of the IC under test is completed, the shutter 15 is closed by moving the rod of the fluid pressure cylinder 182 forward.

On the other hand, at the position CR5 near the test head 302, the IC tray 110 itself
And the IC tray 110 is moved by the tray horizontal transfer device 360 shown in FIG.
Can be opened and closed. For example, as shown in FIG. 12, the IC tray 110 is conveyed horizontally from the position CR4 to the position CR5. A stopper for opening and closing the shutter 15 is provided in the middle of the IC tray 110. From position CR4 to position CR
5, the opening / closing block 181 of the shutter 15
Contact. The position where this stopper is provided is
When the tray 110 stops at the position CR5, it is also the position where the shutter 15 is fully opened. In the IC tray 110 shown in FIG. 5, since the shutter 15 is provided with two opening / closing blocks 181, it is preferable to also provide two stoppers.

The test head 3 of this embodiment shown in FIG.
02, eight contact portions 302a are provided at a constant pitch, and suction heads of the contact arms are also provided at the same pitch. The IC tray accommodates 16 IC chips under test at a predetermined pitch.

The IC chips to be tested which are connected to the test head 302 at one time are, for example, IC chips to be tested arranged in one row × 16 columns.
C chip.

That is, in the first test, 1, 3, 5,
The eight IC chips under test arranged in rows 7, 9, 11, 13, and 15 are connected to the contact portions 302 of the test head 302.
a, and in the second test, the IC tray was moved by one row pitch, and 2, 4, 6, 8, 10,
The IC chips to be tested arranged in 12, 14, and 16 rows are similarly tested. For this reason, although not shown, a moving device for moving the IC tray 101 conveyed to the position CR5 on both sides of the test head 302 by a predetermined pitch in the longitudinal direction is provided. The moving device may be the tray horizontal transfer device 360 shown in FIGS.

Incidentally, the result of this test is stored in an address determined by, for example, the identification number given to the IC tray and the number of the IC chip to be tested assigned inside the IC tray.

In the IC test apparatus 1 of this embodiment, the IC under test is applied to the contact portion 302a of the test head 302.
A third transfer device 304 shown in FIG. 11 is provided near the test head 302 in order to transfer a chip and perform a test. The third transfer device 304 includes a rail 304a provided along the stationary position CR5 of the IC tray and the extending direction (Y direction) of the test head 302, and the stationary position of the test head 302 and the IC tray by the rail 304a. A movable head 304b capable of reciprocating with the CR5 and a suction head provided downward on the movable head 304b are provided. The suction head is
It is configured to be able to move in the vertical direction by a drive device (not shown) (for example, a hydraulic cylinder). By moving the suction head up and down, the IC chip under test can be sucked and the contact portion 302a (see FIG. 10).
Can be pressed against the IC chip under test.

In the third transfer device 304 of the present embodiment,
Two movable heads 304b are provided on one rail 304a, and the distance between them is the distance between the test head 302 and the IC.
It is set equal to the interval between the tray and the stationary position CR5. These two movable heads 304b are simultaneously driven by one driving source (for example, a ball screw device).
, While each suction head is moved vertically by an independent driving device. Therefore, one movable head 304b makes contact with the IC chip at the test head 302, and at the same time, the other movable head 304b makes the IC at the position CR5.
The IC chip can be sucked from the tray.

As described above, each suction head can suction and hold eight IC chips under test at a time, and the interval between them is set equal to the interval between the contact portions 302a. The details of the operation of the third transfer device 304 will be omitted.

Unloader 400 The unloader 400 is provided with an exit tray for dispensing the tested IC chips from the chamber 300. As shown in FIGS. 10 and 11, the exit tray has a position EXT1 on each side of the test head 302 and a position EX1 of the unloader unit 400.
It is configured to be able to reciprocate in the X direction between T2. At positions EXT1 on both sides of the test head 302,
In order to avoid interference with the IC tray, the third transfer device 304 protrudes and retracts slightly above the stationary position CR5 of the IC tray and slightly below the suction head of the third transfer device 304.

Although the specific structure of the exit tray is not particularly limited, it can be constituted by a plate having a plurality of (here, eight) concave portions capable of accommodating the IC chip under test, like an IC tray.

This exit tray is used for the test head 3
02 is provided on each side of the test chamber 301, and while one is moving to the position EXT1 of the test chamber 301, the other is moving to the position EXT2 of the unloader unit 400. I do.

A hot plate 401 is provided near the exit tray position EXT2. The hot plate 401 is for heating the IC chip under test to a temperature at which dew condensation does not occur when a low-temperature stress is applied to the IC chip under test. Plate 401 need not be used.

The hot plate 401 of the present embodiment has a capacity of 2 columns × 16 rows and a capacity of 32, corresponding to the fact that the suction head 404c of the fourth transfer device 404 described later can hold eight IC chips under test at a time. A plurality of IC chips to be tested can be accommodated. And the fourth transfer device 4
The hot plate 401 is divided into four areas corresponding to the suction heads 404c of No. 04, and eight tested IC chips sucked and held from the exit tray at the position EXT2 are sequentially placed in those areas and heated for the longest. The eight IC chips to be tested are sucked by the suction head 404c as they are and transferred to the buffer unit 402.

In the vicinity of the hot plate 401, two buffer units 402 each having a lifting table are provided. The lifting table of each buffer unit 402 moves between the same level position (Z direction) as the exit tray and the hot plate 401 at the position EXT2 and a level position above it, specifically, the level position of the device substrate 201. Move in the Z direction. The specific structure of the buffer section 402 is not particularly limited. For example, like the IC tray or the exit tray, the buffer section 402 may be formed of a plate having a plurality of recesses (eight in this case) capable of accommodating the IC chip under test. it can.

The pair of lifting tables constituting the buffer section 402 perform substantially symmetrical operations such that while one is stationary at the ascending position, the other is stationary at the descending position.

The unloader section 400 in the range from the exit tray at the position EXT2 to the buffer section 402 has:
A fourth transfer device 404 (see FIG. 11) is provided. As shown in FIGS. 9 and 11, the fourth transfer device 404 includes a rail 404a provided on the upper portion of the device substrate 201, and a position EXT2 provided by the rail 404a.
Arm 404b capable of moving in the Y direction between the movable arm 404b and the buffer section 402, and a suction head 404c supported by the movable arm 404b and capable of moving up and down in the Z direction with respect to the movable arm 404b.
4c moves in the Z direction and the Y direction while sucking air, thereby sucking the IC chip under test from the exit tray at the position EXT2, dropping the IC chip under test onto the hot plate 401, and Adsorb IC chip under test and
The C chip is dropped into the buffer unit 402. The eight suction heads 404c of this embodiment are mounted on the movable arm 404b, and can transfer eight IC chips under test at a time.

Incidentally, the movable arm 404b and the suction head 404c are set at positions where they can pass through the level position between the raised position and the lowered position of the buffer unit 402, whereby one buffer unit 402 is moved to the raised position. Even if there is no interference, the other buffer unit 402
The IC chip under test can be transferred to the IC chip.

Further, a fifth transfer device 406 and a sixth transfer device 407 are provided in the unloader unit 400, and the test device transferred to the buffer unit 402 by the fifth and sixth transfer devices 406 and 407 is provided. The IC chips to be tested are reloaded on the customer tray.

For this reason, the device board 201 has a window for arranging an empty customer tray carried from the empty stocker EMP (see FIG. 10) of the IC storage unit 100 so as to face the upper surface of the device board 201. 403 are opened for convenience.

The fifth transfer device 406 is similar to that shown in FIGS.
As shown in FIG. 1, a rail 406a provided on the upper portion of the device substrate 201, a movable arm 406b capable of moving in the Y direction between the buffer section 402 and the window section 403 by the rail 406a, and supported by the movable arm 406b The movable head 406c includes a movable head 406c that can move in the X direction with respect to the movable arm 406b, and a suction head 406d that is attached downward to the movable head 406c and that can move up and down in the Z direction. Then, the suction head 40
6d moves in the X, Y, and Z directions while sucking air, thereby sucking the IC chip under test from the buffer unit 402 and transferring the IC chip under test to the customer tray of the corresponding category. Suction head 406 of the present embodiment
Two d are mounted on the movable head 406c and can transfer two IC chips under test at a time.

The fifth transfer device 406 of this embodiment
The movable arm 406b is formed to be short so that the IC chip under test is transferred only to the customer tray set in the two rightmost windows 403. It is effective to set a customer tray of a category with a high category.

On the other hand, the sixth transfer device 406
As shown in FIGS. 9 and 11, two rails 407a, 407a provided on the upper portion of the device substrate 201, and the rails 407a, 407a can move between the buffer section 402 and the window section 403 in the Y direction. Movable arm 40
7b, a movable head 407c supported by the movable arm 407b and movable in the X direction with respect to the movable arm 407b, and a suction head 407d attached downward to the movable head 407c and movable vertically in the Z direction. . Then, the suction head 407d moves in the X, Y and Z directions while sucking air,
The IC chip under test is sucked from the buffer unit 402, and the IC chip under test is transferred to a customer tray of a corresponding category. Two suction heads 407d of this embodiment are mounted on the movable head 407c, and can transfer two IC chips under test at a time.

While the fifth transfer device 406 transfers the IC chip under test only to the customer tray set in the two rightmost windows 403, the sixth transfer device 407 controls all the windows. The IC chip under test can be transferred to the customer tray set in the unit 403. Therefore, the IC under test in the category that frequently occurs
The chips are transferred to the fifth transfer device 406 and the sixth transfer device 40.
7, and the IC chips to be tested in the category with a low occurrence frequency can be classified only by the sixth transfer device 407.

These two transfer devices 406 and 407
9 and 11, these rails 406a and 407a are provided at different heights so that the suction heads 406d and 407d do not interfere with each other even if the two suction heads 406d and 407d operate simultaneously. It is configured to hardly interfere. In this embodiment,
The fifth transfer device 406 is provided at a position lower than the sixth transfer device 407.

Incidentally, although not shown, a lifting table for raising and lowering the customer tray is provided below the device substrate 201 of each window 403.
A customer tray filled with the tested IC chips to be tested is loaded and lowered, and the full tray is transferred to a tray transfer arm, and the corresponding stocker UL1 to UL of the IC storage unit 100 is transferred by the tray transfer arm.
5 (see FIG. 10). Further, the empty customer tray is delivered from the empty stocker EMP by the tray transfer arm to the empty window portion 403 where the customer tray has been paid out, and is set on the window portion 403 after being replaced on the elevating table.

One buffer section 402 of this embodiment can store 16 IC chips under test, and stores the category of the IC chip under test stored at each IC chip storage position of the buffer section 402. A memory is provided.

The category and position of the IC chip under test deposited in the buffer unit 402 are stored for each IC chip under test, and the category and position of the IC chip under test deposited in the buffer unit 402 are stored. The customer tray is called from the IC storage unit 100 (UL1 to UL5), and the third and sixth transfer devices 406 and 407 described above are called up.
Then, the tested IC chip is stored in the corresponding customer tray.

Other Embodiments The present invention is not limited to the above-described embodiments, and can be variously modified within the scope of the present invention.

For example, in the electronic component testing apparatus according to the present invention, the method of handling IC chips in the handler 4 is not limited to the illustrated embodiment. The electronic components handled by the electronic component tray, the electronic component tray transport device, and the electronic component test device according to the present invention are not limited to IC chips.

[0113]

As described above, according to the electronic component tray, the electronic component tray transport device and the electronic component test device according to the present invention, the tray for transporting electronic components such as IC chips can be provided. When transporting in the substantially vertical direction, it can be moved in a substantially vertical direction by a simple mechanism, particularly when the operating speed is high and the number of trays is small, particularly quickly.

Further, according to the electronic component tray transport device and the electronic component test device according to the present invention, when a tray for transporting an electronic component such as an IC chip is transported in a substantially horizontal direction, a relatively simple method is employed. With a simple mechanism, it is easy to accurately stop the tray at a predetermined stop position,
The load acting on the tray is small and there are few failures.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a tray vertical transfer device according to an embodiment of the present invention.

FIG. 2 is a view showing the tray vertical transfer device in FIG.
FIG. 19 is a schematic perspective view showing the next movement of FIG.

FIG. 3 is a view showing the tray vertical transfer device in FIG.
FIG. 19 is a schematic perspective view showing the next movement of FIG.

FIG. 4 is a view showing the tray vertical transfer device in FIG.
FIG. 19 is a schematic perspective view showing the next movement of FIG.

FIG. 5 is a perspective view of a tray according to one embodiment of the present invention.

FIG. 6 is a perspective view of a main part of a tray horizontal transfer device according to an embodiment of the present invention.

FIG. 7 is an overall configuration diagram of a tray horizontal transfer device according to the embodiment.

FIG. 8 is a sectional view of a main part of the rail shown in FIG. 6;

FIG. 9 is an overall perspective view of an IC test apparatus according to one embodiment of the present invention.

FIG. 10 shows an IC in the test apparatus shown in FIG.
It is a conceptual diagram which shows the flow of a chip.

FIG. 11 is a plan view schematically showing an IC chip transfer device for realizing the flow of the IC chips shown in FIG. 10 in the test apparatus.

FIG. 12 is a perspective view illustrating a transfer path of a tray used in a chamber of the IC test apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... IC test apparatus 15 ... Shutter 16 ... Spring 100 ... IC storage part 110, 110a ... IC tray (tray for electronic components) 120 ... Convex part 200 ... Loader part 300 ... Chamber 301 ... Test chamber 302 ... Test head 302a ... Contact Section 303 Entrance of chamber section 310 Tray end holding device 312 Actuator 314 Tray elevating member 316 Tray lower surface holding plate 318 Elevating rod 320, 320a Tray horizontal carrier 322, 322a Opening 326 Rail 330 Drive wire 342 Drive motor 344 Drive drum 350 Tray vertical transfer device 360 Tray horizontal transfer device 400 Unloader section

Claims (12)

[Claims] 1. An electronic component tray having an accommodating portion for accommodating at least one electronic component, wherein a protrusion capable of stacking the trays in a substantially vertical direction via a predetermined gap is provided on an upper surface of the tray or on the tray. Electronic component tray provided on the lower surface. 2. The electronic component tray according to claim 1, further comprising a shutter that opens and closes an opening surface of the housing portion. 3. An electronic component tray transport device for transporting a tray containing at least one electronic component in a substantially vertical direction, wherein the lowermost edge is located at the lowermost edge of the stacked trays. A tray end holding member capable of detachably holding an end of the tray, a tray elevating member that abuts on a lower surface of the lowermost tray, and conveys the lowermost tray downward or upward; When the member abuts on the lower surface of the lowermost tray and the lowermost tray is supported by the tray elevating member, the holding of the lowermost tray by the tray end holding member is released, and An electronic component tray transport device, comprising: an actuator member that drives the tray end holding member so as to hold an end of another tray at the lowermost position. 4. The tray lowering member is disposed below the tray end holding member so as not to interfere with the raising and lowering movement of the tray raising and lowering member. The tray transport device for electronic components according to claim 1, further comprising a tray horizontal carrier movable in a direction. 5. The electronic component tray transporter according to claim 4, further comprising a rail that holds the tray horizontal carrier so as to be movable in a substantially horizontal direction. 6. The electronic component tray according to claim 4, further comprising a drive wire connected to the tray horizontal carrier and moving the tray horizontal carrier in a substantially horizontal direction by moving the tray horizontal carrier in a longitudinal direction. Transport device. 7. The electronic component according to claim 6, further comprising a drive motor that moves the tray horizontal carrier in a substantially horizontal direction with the drive wire by winding or unwinding the drive wire. Tray transport device. 8. A tray transport device for electronic components having a tray horizontal carrier for transporting a tray containing at least one electronic component in a substantially horizontal direction, wherein the tray transport device is connected to the tray horizontal carrier and extends in a longitudinal direction. An electronic component tray transfer device having a drive wire for moving the tray horizontal carrier in a substantially horizontal direction by moving the tray horizontal carrier. 9. The electronic component tray transport device according to claim 8, further comprising a rail that holds the tray horizontal carrier so as to be movable in a substantially horizontal direction. 10. The electronic device according to claim 8, further comprising a drive motor for moving the tray horizontal carrier in a substantially horizontal direction by the drive wire by winding or unwinding the drive wire. Tray transport device for parts. 11. An electronic component test apparatus having the tray according to claim 1. 12. An electronic component test apparatus having the tray transport device for electronic components according to claim 3.