JP2018049003A - Method for measuring electrical characteristics of electronic component device, method for selecting electronic component device and electrical characteristics measurement device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for measuring electrical characteristics of an electronic component in which a measurement error arising from a difference between a reference temperature and a measured temperature is corrected.SOLUTION: The present method is constituted so as to control each of temperature areas 3S, 3T and measure the temperature with a first temperature sensor 6, a second temperature sensor 8 and a third temperature sensor 9, calculate the measurement time estimated temperature of an electronic component device X to be measured when electrical characteristics are measured, and correct a measurement error arising from a difference between a reference temperature and the measured temperature using the measurement time estimated temperature. When the electrical characteristics after correction are within a prescribed range, it is determined that the electronic component device X to be measured is good.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for measuring electrical characteristics of an electronic component device, and more particularly to a method for measuring electrical characteristics of an electronic component device having high measurement accuracy.

  The present invention also relates to a method for selecting an electronic component device to which the method for measuring electrical characteristics of the electronic component device is applied, and more particularly, to a method for selecting an electronic component device having high selection accuracy.

  The present invention also relates to an electrical property measuring device suitable for use in the electrical property measuring method of the electronic component device, and more particularly to an electrical property measuring device having high measurement accuracy.

  With higher functionality and higher precision of electronic devices, high characteristic accuracy is also required for electronic component devices used in electronic devices. In particular, electronic component devices used for medical and vehicle-mounted electronic devices are required to have higher characteristic accuracy from the viewpoint of safety. For example, in applications that require such high characteristic accuracy, there may be cases where the variation in characteristic accuracy is required to be within a range of 1/2 to 1/10 or less than that of general consumer applications.

  In order to meet such a demand for high characteristic accuracy for the electronic component device, high measurement accuracy is also required in the electrical property measurement method and the electrical property measurement device of the electronic component device. In other words, it is necessary to measure the electrical characteristics of the electronic component device with high measurement accuracy and not use an electronic component device that deviates from the target electrical characteristic value as being out of specification.

  One of the major causes of measurement errors in the measurement of electrical characteristics of electronic component devices is a reference temperature (a specific temperature required for measuring the electrical characteristics; hereinafter referred to as “reference temperature”) ) And the actual temperature of the electronic component device at the time of measurement (hereinafter referred to as “measurement temperature”). That is, for example, when the measured temperature deviates from 25 ° C. even though the electrical property must be measured at the reference temperature of 25 ° C., the measured measured electrical property is actually the electronic component. It deviates from the electrical characteristics at 25 ° C. that the device has. However, factory production lines that actually measure the electrical characteristics of electronic component devices are affected by climate, air conditioning conditions, door opening and closing, the number of workers, etc., so the measured temperature is the reference temperature. It is difficult to maintain the same temperature.

  In particular, a thermistor such as an NTC thermistor or a PTC thermistor is an electronic component device whose resistance value varies greatly depending on the temperature. Therefore, in the resistance value measurement of the thermistor, it occurs due to a difference between the reference temperature and the measurement temperature. Measurement error is a big problem.

  An electrical characteristic measurement method that addresses this problem is disclosed in Japanese Patent Laid-Open No. 7-218579.

  In the resistance value measuring method disclosed in Patent Document 1, a temperature sensor is provided in a parts feeder (conveyance path) that conveys the electronic device to be measured to a measurement point, and the parts feeder is attached according to the temperature measured by the temperature sensor. Cooling control is performed so that the electronic component device to be measured is transported to the measurement point at a stable temperature.

  That is, in the resistance value measuring method disclosed in Patent Document 1, the temperature of the parts feeder is measured with a temperature sensor in consideration of the occurrence of measurement errors due to the heat generated by the motor and the parts feeder of the electrical characteristic measuring apparatus. The measurement error is reduced by cooling the parts feeder.

  An electrical characteristic measurement method that addresses this problem by another method is disclosed in Patent Document 2 (Japanese Patent Laid-Open No. 2007-240158). The electrical characteristic measuring method disclosed in Patent Document 2 measures the resistance value of the thermistor.

  The resistance value measuring method disclosed in Patent Document 2 measures the thermistor resistance value in the following steps.

  First, a reference thermistor (reference electronic component device) is selected as a reference. Then, the resistance value is measured at the reference temperature of the reference thermistor. For example, when the reference temperature is 25 ° C., the resistance value at 25 ° C. of the reference thermistor is measured after the measurement temperature is strictly kept at 25 ° C.

  Next, a measured thermistor (measured electronic component device) for measuring the resistance value is prepared, the measurement terminal is brought into contact with the external electrode of the measured thermistor, the resistance value of the measured thermistor is measured, and the measured resistance value R1 is obtained. obtain. At the same time, the resistance value of the reference thermistor is measured in the vicinity of the place where the resistance value of the measured thermistor is measured to obtain the measured resistance value Ro.

Next, the measured resistance value Ro of the reference thermistor is expressed by the following (Equation 3).
The deviation (measurement value deviation rate) of the measured resistance value R1 of the thermistor to be measured is obtained.

  Next, a non-defective product / defective product of the measured thermistor is determined from the obtained deviation. Specifically, the measured thermistor is determined to be a non-defective product when the obtained deviation is within a predetermined allowable range, and the measured thermistor is determined to be defective when it is outside the predetermined allowable range. The allowable range of deviation is determined in consideration of the resistance value at the reference temperature of the reference thermistor described above.

  In this case, since the measured thermistor and the reference thermistor are arranged in the vicinity, when the resistance value is measured, it is assumed that the measured thermistor and the reference thermistor have the same temperature, and a deviation is obtained. The measurement thermistor is judged as good / defective.

  That is, for example, when the reference temperature is 25 ° C., it is ideal to measure the resistance value by strictly setting the measurement temperature of the measured thermistor to 25 ° C. However, as described above, in measuring the electrical characteristics of an actual electronic component device, it is difficult to keep the measurement temperature of the measured thermistor at the same temperature as the reference temperature due to various factors.

  Therefore, the resistance value measuring method disclosed in Patent Document 2 assumes that the measured thermistor and the reference thermistor are at the same temperature by arranging the measured thermistor and the reference thermistor in the vicinity, Due to the difference between the measured temperature of the measured thermistor and the reference temperature, the deviation of the measured resistance value R1 of the measured thermistor from the measured resistance value Ro of the reference thermistor is obtained and the good / defective product of the measured thermistor is judged. The measurement thermistor is judged to be non-defective / defective with a very small measurement error. That is, in the resistance value measuring method disclosed in Patent Document 2, even if the measured temperature of the measured thermistor deviates from the reference temperature, the measured temperature of the reference thermistor also deviates from the reference temperature. It is said that the measurement error caused by the difference can be corrected.

JP 7-218579 A JP 2007-240158 A

  The electrical characteristic measurement methods disclosed in Patent Document 1 and Patent Document 2 have the following problems.

  First, the electrical characteristic measurement method disclosed in Patent Document 1 is a rough temperature control of a parts feeder, and there is a limit to the measurement accuracy of electrical characteristics. For example, there is a time lag between the temperature of the parts feeder being measured by the temperature sensor and the temperature of the parts feeder being controlled, and a large measurement error may occur during that time. Further, the temperature of the parts feeder is excessively controlled (cooled more than necessary), which may cause a decrease in measurement accuracy of electrical characteristics.

  The electrical characteristic measurement method disclosed in Patent Document 2 has higher measurement accuracy of electrical characteristics than the electrical characteristic measurement method disclosed in Patent Document 1. However, the electrical characteristic measurement method disclosed in Patent Document 2 also has the following problems.

  First, the electrical characteristic measurement method disclosed in Patent Document 2 is based on the premise that the measured thermistor and the reference thermistor are at the same temperature, and if this assumption cannot be maintained, the electrical characteristics of the measured electronic component device will be described. Measurement errors may occur in the measurement. In other words, the electronic device to be measured is transported to the measurement point through the transport path and the electrical characteristics are measured, but when the electronic device to be measured is transported to the measurement point, The temperature must be the same as that of the reference electronic component device. However, the familiarity of the measured electronic component device with the ambient temperature varies depending on the heat capacity of the measured electronic component device, the reference temperature, the operating speed of the electrical characteristic measuring device, etc., and is not uniform. Then, if the measured electronic component device is adapted to the ambient temperature and the electrical characteristics of the measured electronic component device are measured before the temperature reaches the same temperature as the reference electronic component device, a measurement error may occur.

  And in order to prevent generation | occurrence | production of this measurement error, the electrical characteristic measuring method disclosed by patent document 2 had to suppress the operating speed of an electrical characteristic measuring apparatus. That is, it is necessary to adjust the measured thermistor to the ambient temperature and wait until the temperature of the measured thermistor becomes equal to the temperature of the reference thermistor. When measuring the electrical characteristics of the electronic component device in the production line of the component device, there is a possibility that the productivity of the electronic component device is reduced.

  The present invention has been made to solve the above-described problems of the prior art. As its means, the electrical property measuring method of the electronic component device of the present invention is an electrical property measuring method of the electronic component device for measuring the electrical property of the measured electronic component device, and the measured electronic component device is It is transported to the measurement point via the initial temperature specific position, the electrical characteristic is measured at the measurement point, the measured electrical characteristic is acquired, and the electronic device to be measured at the first temperature is different from the first temperature. There is a first correlation for estimating the temperature of the measured electronic component device after the elapse of time t when placed in the second temperature region of two temperatures, and the measured electronic component device when measuring electrical characteristics Due to the difference between the reference temperature and the measured temperature included in the measured electrical characteristics from the reference temperature that is the power temperature and the measured temperature that is the actual temperature of the electronic device under test when the electrical characteristics are measured To correct measurement errors caused by The initial temperature of the measured electronic component device is specified at the initial temperature specifying position, the measuring point temperature that is the temperature of the measuring point is specified, and the measured temperature is passed through the initial temperature specifying position. The elapsed time required until the electrical characteristics are measured after the measurement electronic component device enters the temperature region of the measurement point is specified. In the first correlation, the initial temperature is the first temperature, and the measurement point temperature is Estimating the estimated temperature during measurement of the measured electronic component device when measuring the electrical characteristics by setting the second temperature and the elapsed time as time t, and measuring the estimated temperature during measurement in the second correlation By setting the temperature, a corrected electrical characteristic in which a measurement error caused by a difference between the reference temperature and the measured temperature is corrected is acquired.

  A first correlation for estimating the temperature of the measured electronic component device after the elapse of time t when the measured electronic component device having the first temperature is placed in a second temperature region having a second temperature different from the first temperature. The relationship is prepared as an expression or a table, for example. The first correlation may be derived thermodynamically or may be derived in advance by actual measurement. The level of the first temperature and the second temperature is not important, and the first temperature may be higher than the second temperature, or the first temperature may be lower than the second temperature.

  In addition, from the reference temperature, which is the temperature at which the measured electronic component device should be when measuring the electrical characteristics, and the measured temperature, which is the actual temperature of the measured electronic component device when measuring the electrical characteristics, The second correlation that corrects the measurement error caused by the difference between the reference temperature and the measurement temperature included in the target characteristic is also prepared as, for example, an equation or a table. The second correlation may be derived electrically by calculation, or may be derived by conducting actual measurement in advance.

  A first temperature sensor for measuring the temperature at the initial temperature specific position is provided, and the initial temperature of the electronic component device to be measured at the initial temperature specific position is determined when the electronic device to be measured passes through the initial temperature specific position. The temperature at the initial temperature specific position measured by the one temperature sensor may be set as the initial temperature of the electronic component device to be measured. However, in this case, the measured electronic component device stays at the initial temperature specific position for some time, and the temperature of the measured electronic component device is familiar with the temperature at the initial temperature specific position (substantially the same). It is a premise. The specification of the initial temperature of the electronic device to be measured at the initial temperature specifying position is not limited to the method using the first temperature sensor. For example, the initial temperature specifying position is maintained at a predetermined management temperature, and the initial temperature specifying is performed. Assuming that the measured electronic component device is kept at the position for a certain period of time and the temperature of the measured electronic component device is adjusted to the initial temperature specified position, the control temperature of the initial temperature specified position is set to A method of setting the initial temperature may be used.

  The electronic component device may be transported to a measurement point through a transport path, and the initial temperature specific position may be provided in the transport path. In this case, the electronic device to be measured conforms to the temperature of the conveyance path while passing through the conveyance path (substantially the same), so when the electronic component device to be measured passes the initial temperature specific position. The temperature at the initial temperature specific position can be set as the initial temperature of the electronic device to be measured.

  One intermediate temperature sensor is provided between the initial temperature specific position and the measurement point. In the first correlation, the initial temperature is the first temperature, the measurement point temperature is the second temperature, and the elapsed time is the time t. Therefore, instead of estimating the measurement estimated temperature of the measured electronic component device when measuring the electrical characteristics, the initial temperature is the first temperature in the first correlation, and the measured electronic component The temperature of the conveyance path measured by the intermediate temperature sensor when the apparatus passes the temperature range of the intermediate temperature sensor is set as the second temperature, and the intermediate temperature sensor after the electronic device to be measured enters the temperature range of the intermediate temperature sensor. The estimated temperature of the electronic device to be measured when leaving the temperature range of the intermediate temperature sensor is estimated by taking t the time required to exit the temperature range of the intermediate temperature sensor. Temperature range of temperature sensor The estimated temperature of the measured electronic component device when leaving the temperature is the first temperature, the measurement point temperature is the second temperature, and the measured electronic component device exiting the temperature range of the intermediate temperature sensor is in the temperature range of the measurement point. An estimated temperature at the time of measurement of the electronic component to be measured when the electrical characteristics are measured may be calculated by setting t as the elapsed time required until the electrical characteristics are measured after entering. In this case, first, the estimated temperature of the electronic component to be measured when it exits the temperature range of the intermediate temperature sensor is calculated, and then the estimated temperature at the time of measurement of the electronic component to be measured when the electrical characteristics are measured is calculated. Therefore, the estimated temperature during measurement of the electronic component to be measured can be calculated with higher accuracy, and the electrical characteristics of the electronic component to be measured can be measured with higher measurement accuracy. Note that the temperature of the conveyance path is measured by the intermediate temperature sensor when the measured electronic component device passes the temperature range of the intermediate temperature sensor. However, the timing at which this measurement is performed is arbitrary, and the measured electronic component device is in the middle. It may be when it passes through the temperature sensor, or when the electronic device under measurement leaves the temperature range of the intermediate temperature sensor or when the electronic device under measurement enters the temperature range of the intermediate temperature sensor. good.

  In addition, a plurality of intermediate temperature sensors are provided between the initial temperature specifying position and the measurement point. In the first correlation, the initial temperature is the first temperature, the measurement point temperature is the second temperature, and the elapsed time. In the first correlation, the initial temperature is set as the first temperature in place of estimating the measurement-time estimated temperature of the measured electronic component device when the electrical characteristics are measured. When the measurement electronic component device passes the temperature region of the first intermediate temperature sensor, the temperature of the conveyance path measured by the first intermediate temperature sensor is set as the second temperature, and one electronic device to be measured is present. When the time required to exit the temperature range of the first intermediate temperature sensor is t, and the time required to exit the temperature range of the first intermediate temperature sensor is t. Estimate the estimated temperature of the device under test In the first correlation, the estimated temperature of the electronic component device under measurement when the temperature range of the first intermediate temperature sensor exits is the first temperature, and the electronic device under measurement is the second intermediate temperature. The electronic component device under measurement that exits the temperature region of the first intermediate temperature sensor using the second temperature as the temperature of the conveyance path measured by the second intermediate temperature sensor when passing through the temperature region of the sensor T is the time required from when the second intermediate temperature sensor enters the temperature range of the second intermediate temperature sensor until the second intermediate temperature sensor exits the temperature range of the second intermediate temperature sensor. Estimate the estimated temperature of the electronic device being measured when it exits, and if there are three or more intermediate temperature sensors, measure the temperature when exiting the temperature range of the intermediate temperature sensor using the same method. Calculate the estimated temperature of the electronic component device, and In the correlation, the estimated temperature of the electronic device to be measured when it leaves the temperature range of the last intermediate temperature sensor is the first temperature, the measurement point temperature is the second temperature, and the temperature range of the last intermediate temperature sensor is The measured electronic component when the electrical characteristic is measured by setting t as the elapsed time required for the electrical characteristic to be measured after the measured electronic component device has entered the temperature range of the measurement point. The estimated temperature at the time of measurement of the component device may be calculated. In this case, first, the estimated temperature of the electronic component to be measured when it exits the temperature range of the first intermediate temperature sensor is calculated, and then the target temperature when it exits the temperature range of the second intermediate temperature sensor. To calculate the estimated temperature of the measurement electronic component, repeat the calculation of this estimated temperature according to the number of intermediate temperature sensors, and finally calculate the estimated temperature at the time of measurement of the measured electronic component when measuring the electrical characteristics, The estimated temperature at the time of measurement of the electronic component to be measured can be calculated with higher accuracy, and the electrical characteristics of the electronic component to be measured can be measured with higher measurement accuracy.

  As an electrical characteristic to be measured, for example, a resistance value can be given.

  Note that the temperature of the measurement point of the electronic device to be measured may be adjusted so as to approach a predetermined target temperature.

  Alternatively, a predetermined target temperature may be used as the reference temperature, and the measurement point temperature may be considered to be equal to the reference temperature.

  The present invention is also directed to a method for selecting an electronic component device. The electronic component device sorting method of the present invention is an application of the above-described method for measuring electrical characteristics of an electronic component device of the present invention. Specifically, the electronic component device sorting method according to the present invention measures the electrical characteristics of the measured electronic component device and sorts the measured electronic component device according to the measurement result. The measured electronic component device is transported to the measurement point via the initial temperature specific position, the electrical characteristic is measured at the measurement point, the measured electrical characteristic is acquired, and the first temperature measured is measured. When the electronic component device is placed in a second temperature region having a second temperature different from the first temperature, the first correlation for estimating the temperature of the measured electronic component device after the elapse of time t, and the electrical Included in the measured electrical characteristics from the reference temperature, which is the temperature at which the measured electronic component device should be when measuring the characteristics, and the measured temperature, which is the actual temperature of the measured electronic component device when measuring the electrical characteristics Due to the difference between the reference temperature and the measured temperature. The second correlation for correcting the generated measurement error is clarified, and a selection criterion is set for the electrical characteristics at the reference temperature of the electronic component device. The initial temperature is specified, the measurement point temperature that is the temperature of the measurement point is specified, and the electrical characteristics are measured after the electronic device under test that has passed through the initial temperature specification position enters the temperature range of the measurement point. In the first correlation, the electrical characteristics were measured by setting the initial temperature as the first temperature, the measurement point temperature as the second temperature, and the elapsed time as the time t. Measurement caused by the difference between the reference temperature and the measured temperature by estimating the estimated temperature at the time of the measurement of the electronic component device at the time and setting the estimated temperature at the time of measurement as the measured temperature in the second correlation Error corrected Get the corrected electrical characteristics which were as sorting electronic component device the corrected electrical properties compared to selection criteria.

  The selection of the electronic component device may be performed when the non-defective product / defective product of the electronic component device is classified, or may be classified (ranked) by the electronic component device. The electronic component devices are classified into, for example, a rank that does not have a large variation in electrical characteristics and a rank that is within an allowable range but has a variation in electrical characteristics. The classification of the non-defective product / defective product of the electronic component device and the classification of the electronic component device can be performed simultaneously.

  In the above-described method for selecting an electronic component device, in the second correlation, the measurement error caused by the difference between the reference temperature and the measurement temperature is corrected by using the measurement estimated temperature as the measurement temperature. Instead of selecting corrected electronic characteristics and comparing the corrected electrical characteristics with the selection criteria to sort out the electronic device, the selection criteria are correspondingly corrected corresponding to the estimated temperature during measurement. A correction selection criterion may be obtained, and the electronic component device may be selected by comparing the measured electrical characteristics with the corresponding correction selection criterion. In other words, the correction of measurement error caused by the difference between the reference temperature and the measurement temperature is not the correction of the measurement electrical characteristic to obtain the corrected electrical characteristic, but the correction of the selection standard and correction. You may carry out by acquiring a selection standard.

  The electronic component device sorting method according to the present invention selects a reference electronic component device in which a relationship between a measurement temperature in a necessary range and an electrical characteristic is specified in advance, and performs a sorting standard over the measurement temperature in the necessary range. Is set relative to the electrical characteristics of the reference electronic component device, the reference electronic component device is placed near the measurement point, and at the same time as or before or after the measurement of the electrical characteristics of the measured electronic component device. Measure the electrical characteristics of the reference electronic component device, obtain the measured electrical properties of the reference electronic component device, and select the measurement temperature of the reference electronic component device and the corresponding selection from the measured electrical characteristics of the reference electronic component device By identifying the reference, assuming that the measurement point temperature is equal to the measurement temperature of the reference electronic component device, and further replacing the reference temperature with the measurement temperature of the reference electronic component device, the measurement temperature of the reference electronic component device is Electronic It may be configured to obtain the corrected electrical characteristics of goods unit. This method is a combination of the electronic component device sorting method of the present invention and the electronic component device electrical characteristic measurement method (sorting method) described in Patent Document 2 described above, and has high accuracy. Thus, the non-defective / defective product of the electronic component device to be measured can be determined.

  The electrical property measuring device of the present invention is suitable for use in the electrical property measuring method of the electronic component device of the present invention described above. Specifically, the electrical characteristic measuring apparatus of the present invention measures the electrical characteristics of the measured electronic component device at the measurement point, and a transport mechanism that transports the measured electronic component device from the initial temperature specific position to the measurement point. And an initial temperature specifying means for specifying the initial temperature of the electronic device to be measured is provided in the vicinity of the initial temperature specifying position or in the vicinity of the initial temperature specifying position. In the vicinity, a measuring point temperature specifying means for specifying a measuring point temperature which is the temperature of the measuring point is provided.

  As the initial temperature specifying means, a first temperature sensor for measuring the temperature at the initial temperature specifying position may be provided.

  In addition, a transport path for transporting the electronic component device to the measurement point may be provided, and the initial temperature specific position may be provided in the transport path.

  Furthermore, one or a plurality of intermediate temperature sensors may be provided between the initial temperature specifying position and the measurement point. In this case, the electrical characteristics can be measured with higher measurement accuracy.

  Furthermore, temperature adjusting means for adjusting temperature so that at least the measurement point approaches a predetermined target temperature may be provided.

  Further, the measurement point of the reference electronic component may be provided in the vicinity of the measurement point of the electronic device to be measured. Also in this case, the electrical characteristics can be measured with higher measurement accuracy.

  According to the electrical characteristic measuring method for an electronic component device of the present invention, it is possible to obtain a highly accurate measurement result by correcting a measurement error caused by the difference between the measurement temperature and the reference temperature.

  In addition, according to the electronic component device sorting method of the present invention, it is possible to appropriately judge whether the electronic component device is good or defective, or classify the electronic component devices (ranking) based on the measurement result of the electrical characteristics with high accuracy. It can be performed.

  In addition, according to the electrical characteristic measuring apparatus of the present invention, it is possible to obtain a highly accurate measurement result in which a measurement error caused by the difference between the measurement temperature and the reference temperature is corrected.

It is a top view which shows the electrical property measuring apparatus 100 used in order to measure the electrical property of an electronic component apparatus in 1st Embodiment. 2 is a plan view of the main part of the electrical characteristic measuring apparatus 100. FIG. 3 is a cross-sectional view of a main part of the electrical characteristic measuring apparatus 100. FIG. 4 is a bottom view of the electronic component device X to be measured. FIG. It is a graph which shows the resistance temperature characteristic of the to-be-measured electronic device X estimated from the resistance value in 25 degreeC and 50 degreeC. It is a principal part top view which shows the electrical property measuring apparatus 200 used in order to measure the electrical property of an electronic component apparatus in 2nd Embodiment. It is a principal part top view which shows the electrical property measuring apparatus 400 used in order to measure the electrical property of an electronic component apparatus in 4th Embodiment. It is a top view which shows the electrical property measuring apparatus 500 used in order to measure the electrical property of an electronic component apparatus in 5th Embodiment. It is a top view which shows the electrical property measuring apparatus 600 used in order to measure the electrical property of an electronic component apparatus in 6th Embodiment. It is a front view (partial cross section figure) which shows the electrical property measuring apparatus 700 used in order to measure the electrical property of an electronic component apparatus in 7th Embodiment. It is a principal part perspective view which shows the electrical property measuring apparatus 800 used in order to measure the electrical property of an electronic component apparatus in 8th Embodiment, and only the conveyance body 84 is shown. It is a principal part perspective view which shows the electrical property measuring apparatus 900 used in order to measure the electrical property of an electronic component apparatus in 9th Embodiment, and only the conveyance body 94 is shown. It is a principal part front view which shows the electrical property measuring apparatus 1000 used in order to measure the electrical property of an electronic component apparatus in 10th Embodiment, and only the conveyance body 98 is shown.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  Each embodiment shows an embodiment of the present invention exemplarily, and the present invention is not limited to the content of the embodiment. Moreover, it is also possible to implement combining the content described in different embodiment, and the implementation content in that case is also included in this invention.

[First Embodiment]
1 to 3 show an electrical property measuring apparatus 100 used in the present embodiment. However, FIG. 1 is a plan view of the electrical characteristic measuring apparatus 100. FIG. 2 is a plan view of an essential part of the electrical characteristic measuring apparatus 100. FIG. 3A and 3B are cross-sectional views of the main part of the electrical characteristic measuring apparatus 100, respectively. FIG. 3A shows the YY portion of FIGS. 1 and 2, and FIG. ) Shows the ZZ portion of FIGS.

  In this embodiment, the electronic component device X to be measured is an NTC thermistor, and a resistance value is measured as an electrical characteristic. However, the type of electronic component device to be measured is arbitrary, and is not limited to the NTC thermistor. The electrical characteristics change depending on the temperature, such as a PTC thermistor, a fixed resistor, a capacitor, an inductor, a platinum resistance thermometer, etc. It may be an electronic component device. Also, the shape of the electronic component device to be measured is arbitrary, and includes electronic component devices of all shapes such as a chip-shaped electronic component device, a plate-shaped electronic component device, an electronic component device with a lead wire, and a module type electronic component device. Further, the electronic component device to be measured does not have to be a finished product, but may be a semi-finished product (manufacturing product).

  Also, the type of electrical characteristics to be measured is arbitrary, and is not limited to a resistance value, and may be a capacitance value, an inductance value, or the like. In this embodiment, the resistance value at 25 ° C. and the resistance value at 50 ° C. of the measured electronic component device (NTC thermistor) X are measured to determine the resistance temperature characteristic of the measured electronic component device X.

  The electrical property measuring apparatus 100 includes a parts feeder 1 that sequentially supplies a plurality of electronic component devices X to be measured.

  The parts feeder 1 is connected to the linear feeder 2. The linear feeder 2 conveys the measured electronic component device X supplied from the parts feeder 1 in a straight line using ultrasonic vibration or the like.

  The linear feeder 2 is connected to the measurement base 3. That is, the measured electronic component device X is sequentially transferred to the measurement base 3 by the linear feeder 2. The measurement base 3 is a rectangular table.

  The measurement base 3 is provided with a transport body 4 that is a transport mechanism. The carrier 4 is driven by driving means (not shown) and moves on the measurement base 3. The carrier 4 has a rectangular shape, and a plurality of recesses 4a for accommodating the electronic device to be measured X are formed in a comb shape on one long side. The transport body 4 moves the plurality of measured electronic component devices X accommodated in the recesses 4a linearly and intermittently from the top to the bottom in FIGS. Note that when the transport body 4 reaches the lower end of the measurement base 3, it is returned to the upper end of the measurement base 3 by the driving means as indicated by the broken arrow. At this time, the transport body 4 is configured so that the measured electronic component device X that has not been excluded or collected in the defective product exclusion area U or the measured electronic component collection areas V and W described later is placed on the measurement base 3. Are returned to the upper end of the measurement base 3 while remaining in the existing position.

  The measurement base 3 is provided with a temperature region 3S and a temperature region 3T, which are two partial regions. The main body portion of the measurement base 3, the temperature region 3S, and the temperature region 3T are thermally separated from each other by a method such as forming a groove therebetween.

  As shown in FIG. 3A, a Peltier element 5a is provided on the lower surface of the temperature region 3S as temperature adjusting means. The temperature region 3S is controlled to a target temperature of 25 ° C. by the Peltier element 5a. The Peltier element 5a controls the temperature of the entire temperature region 3S almost uniformly. Normally, the target temperature in the temperature region 3S is set to the first reference temperature (25 ° C.) at which the electrical characteristics of the electronic device to be measured X are to be measured. However, the target temperature in the temperature region 3S does not necessarily need to match the first reference temperature.

  As shown in FIG. 3B, a Peltier element 5b is provided on the lower surface of the temperature region 3T. The temperature region 3T is controlled to a target temperature of 50 ° C. by the Peltier element 5b. The Peltier element 5b controls the temperature of the entire temperature region 3T almost uniformly. Normally, the target temperature in the temperature region 3T is set to the second reference temperature (50 ° C.) at which the electrical characteristics of the electronic component device X to be measured are to be measured. However, the target temperature in the temperature region 3T does not necessarily need to match the second reference temperature. For example, the target temperature in the temperature region 3T may be set higher than the second reference temperature in order to heat the electronic device under test X quickly.

  The type of the heating element that controls the temperature in the temperature regions 3S and 3T is not limited to the Peltier elements 5a and 5b, and may be a heater, a chiller, or the like.

  In the electrical characteristic measuring apparatus 100, the linear feeder 2 is a transport path of the electronic component apparatus X to be measured, and an initial temperature specifying position is provided in the middle thereof. And the 1st temperature sensor 6 is provided as an initial temperature specific means in the vicinity of a conveyance path | route, especially the vicinity of an initial temperature specific position. The first temperature sensor 6 is for monitoring the temperature of the conveyance path of the linear feeder 2. Instead of measuring the temperature of the conveyance path with the first temperature sensor 6, the temperature of the measured electronic component device X itself arranged separately at the initial temperature specific position may be directly measured. For the first temperature sensor 6, for example, a platinum resistance thermometer is used. However, the type of the first temperature sensor 6 is arbitrary, and may be a thermocouple, a thermistor, a radiation thermometer, or the like.

  Moreover, the electrical characteristic measuring apparatus 100 has a measurement point 7P and a measurement point 7Q. The measurement point 7P is provided in the temperature region 3S. The measurement point 7Q is provided in the temperature region 3T.

  As described above, FIG. 3A shows a cross-sectional view of the main part of the measurement point 7P portion. FIG. 3B shows a cross-sectional view of the main part of the measurement point 7P.

  A second temperature sensor 8 is provided as a measurement point temperature specifying means in the vicinity of the measurement point 7P in the temperature region 3S. The second temperature sensor 8 is for monitoring the temperature in the temperature region 3S. Similarly, a third temperature sensor 9 is provided in the vicinity of the measurement point 7Q in the temperature region 3T. The third temperature sensor 9 is for monitoring the temperature in the temperature region 3T. For the second temperature sensor 8 and the third temperature sensor 9, for example, a platinum resistance thermometer is used. However, the types of the second temperature sensor 8 and the third temperature sensor 9 are arbitrary, and may be a thermocouple, a thermistor, a radiation thermometer, or the like.

  As shown in FIG. 3A, the measurement point 7P is provided with an abutting member 10 that abuts on the upper surface of the electronic component device X to be measured. The contact member 10 is not shown in FIGS. 1 and 2.

  For example, four holes are provided in the measurement base 3 (temperature region 3S) of the measurement point 7P, and two pairs of measurement terminals 11a, 11b, 12a, and 12b are arranged in the four holes. The measurement terminals 11a, 11b, 12a, and 12b are for contacting the external electrodes Xa and Xb of the electronic component device X to be measured. The measurement terminals 11a, 11b, 12a, and 12b are attached to the measurement terminal drive mechanism 13, and are intermittently brought into contact with the external electrodes Xa and Xb of the electronic device to be measured X by driving the measurement terminal drive mechanism 13. .

  As shown in FIG. 3B, the measurement point 7Q is provided with an abutting member 14 that abuts on the upper surface of the electronic component device X to be measured. The contact member 14 is not shown in FIGS. 1 and 2.

  For example, four holes are provided in the measurement base 3 (temperature region 3T) of the measurement point 7Q, and two pairs of measurement terminals 15a, 15b, 16a, and 16b are arranged in the four holes. The measurement terminals 15a, 15b, 16a, and 16b are for contacting the external electrodes Xa and Xb of the electronic component device X to be measured. The measurement terminals 15a, 15b, 16a, and 16b are attached to the measurement terminal drive mechanism 17, and are intermittently brought into contact with the external electrodes Xa and Xb of the electronic component device X to be measured by driving the measurement terminal drive mechanism 17. .

  As shown in FIG. 1, the electrical characteristic measuring apparatus 100 includes a measuring device 18. Measuring terminals 11a, 11b, 12a, and 12b are connected to the measuring instrument 18. Further, measurement terminals 15a, 15b, 16a and 16b are also connected to the measuring instrument 18. The measuring instrument 18 is used to measure the electrical characteristics of the electronic device X to be measured at the measurement point 7P and the measurement point 7Q.

  FIG. 4 shows a bottom surface of the electronic component device X to be measured. Further, in FIG. 4, the measurement terminals 11a, 11b, 12a, and 12b abut on the external electrodes Xa and Xb of the electronic component device X to be measured at the measurement point 7P, and the measurement terminals 15a, 15b, 16a, and The part with which 16b contacts is shown by the broken line.

  For example, the measuring instrument 18 causes a predetermined value of current to flow between the measurement terminals 11a and 11b at the measurement point 7P, and measures the voltage between the measurement terminals 12a and 12b, whereby the resistance value of the electronic component device X to be measured is measured. Can be measured.

  Similarly, for example, the measuring instrument 18 causes a current of a predetermined value to flow between the measurement terminals 15a and 15b at the measurement point 7Q, and measures the voltage between the measurement terminals 16a and 16b. Can be measured.

  As shown in FIG. 1, the electrical characteristic measuring apparatus 100 includes a personal computer (hereinafter referred to as “PC”) 19. The PC 19 includes at least a storage device, an arithmetic device, an input interface, an output interface, and the like.

  The PC 19 is connected to the respective drive systems of the parts feeder 1, the linear feeder 2, the transport body 4, the measurement terminal drive mechanism 13, and the measurement terminal drive mechanism 17. The storage device of the PC 19 stores a predetermined computer program for controlling the parts feeder 1, the linear feeder 2, the carrier 4, the measurement terminal drive mechanism 13, and the measurement terminal drive mechanism 17, and the PC 19 1, the linear feeder 2, the conveyance body 4, the measurement terminal drive mechanism 13, and the measurement terminal drive mechanism 17 are each controlled.

  The PC 19 is connected to the measuring instrument 18.

  The PC 19 is connected to the first temperature sensor 6, the second temperature sensor 8, and the third temperature sensor 9, respectively.

  The measurement base 3 of the electrical characteristic measuring apparatus 100 includes a defective product exclusion area U that excludes the measured electronic component device X determined to be defective after measuring the electrical characteristics. The defective product exclusion area U is provided with a rejection mechanism (not shown) that excludes the measured electronic component device X determined to be defective from the recess 4 a of the transport body 4. The exclusion mechanism is connected to the PC 19, and excludes the measured electronic component device X determined as a defective product by the computing device of the PC 19 from the recess 4 a of the transport body 4.

  Furthermore, the measurement base 3 of the electrical characteristic measuring apparatus 100 varies in electrical characteristics among the measured electronic component devices X determined to be non-defective after removing the measured electronic component devices X determined to be defective. A measured electronic component collection area V for collecting the measured electronic component device X of rank 1 with few is provided. The collection of the electronic device to be measured X of rank 1 is also controlled by the PC 19.

  Further, the measurement base 3 of the electrical characteristic measuring apparatus 100 collects the electronic component device X with rank 1 and then the electronic device X with rank 2 within the allowable range but having a variation in electrical characteristics. The measured electronic component recovery area W is recovered. The collection of the electronic device for measurement X of rank 2 is also controlled by the PC 19.

  Next, an electrical property measuring method for an electronic component device using the electrical property measuring apparatus 100 will be described. In the present embodiment, as described above, an NTC thermistor is used as the measured electronic component device X, and the resistance value of the measured electronic component device X is measured as an electrical characteristic. In the electrical characteristic measuring method of the electronic component device of the present embodiment, the following (Formula 1) is used. According to (Formula 1), when this NTC thermistor having the specific temperature Ta is placed on a different temperature region having a temperature Tb different from the specific temperature Ta, the estimated temperature Tx of the NTC thermistor after the elapse of time t is calculated. be able to.

Tx: Estimated temperature of NTC thermistor after elapse of time t Ta: Specific temperature of NTC thermistor Tb: Temperature in a different temperature region
t: elapsed time τ: thermal time constant of NTC thermistor The thermal time constant τ is a coefficient that can be obtained from the heat capacity of the NTC thermistor.

  (Equation 1) is stored in the storage device of the PC 19.

  Moreover, in the electrical property measurement method of the electronic component according to the present embodiment, the reference temperature Tw and the measurement temperature To are caused by a difference between the reference temperature Tw and the measurement temperature To included in the measurement resistance value Ro. (Equation 2) is used to correct the generated measurement error.

Rw: Resistance value of NTC thermistor in which measurement error caused by deviation between reference temperature Tw and measurement temperature To is corrected Ro: Measurement resistance value of NTC thermistor B: Temperature change coefficient of NTC thermistor Tw: Reference temperature
To: Measurement temperature The temperature change coefficient B is a coefficient specific to this NTC thermistor. The temperature change coefficient B can be calculated by measuring the resistance value of the NTC thermistor a plurality of times while forcibly shifting the temperature slightly from the reference temperature in the plus or minus direction.

  (Equation 2) is stored in the storage device of the PC 19.

  Further, the target temperature of the Peltier element 5a provided in the temperature region 3S controlled by the PC 19 is set to 25 ° C. That is, in this embodiment, the resistance value at 25 ° C. of the measured electronic component device (NTC thermistor) X is measured at the measurement point 7P.

  Further, the target temperature of the Peltier element 5b provided in the temperature region 3T, which is controlled by the PC 19, is set to 50 ° C. That is, in the present embodiment, the resistance value at 50 ° C. of the electronic component device to be measured (NTC thermistor) X is measured at the measurement point 7Q.

  After the above preparation, measurement is started.

  First, a plurality of measured electronic component devices X are put into the parts feeder 1.

  Next, based on the control of the PC 19, the parts feeder 1, the linear feeder 2, and the transport body 4 each start driving.

  As a result, the measured electronic component device X is sequentially conveyed from the parts feeder 1 to the linear feeder 2.

  Next, when the first (first) electronic device X to be measured passes near the initial temperature specifying position provided in the transfer path, the first temperature sensor 6 serving as the initial temperature specifying means causes the transfer path (linear). Measure the temperature of the feeder 2).

  Since the parts feeder 1 and the linear feeder 2 are kept at room temperature (room temperature), and the measured electronic component device X reaches the first temperature sensor 6 which is the initial temperature specific position over a sufficiently long time, the measured device The electronic component device X is sufficiently adapted to the temperature of the conveyance path (linear feeder 2). Therefore, when the first electronic device to be measured X passes the first temperature sensor 6 which is the initial temperature specific position, the temperature of the conveyance path (linear feeder 2) measured by the first temperature sensor 6 is set to 1 This can be regarded as the initial temperature of the second measured electronic component device X. When the first temperature sensor 6 can directly measure the temperature of the electronic device X to be measured, it is not necessary to be particularly familiar with the temperature of the conveyance path, and the measurement value of the first temperature sensor 6 is used as it is. The initial temperature of the first measured electronic component device X can be set. The initial temperature of the first measured electronic component device X is transmitted to the PC 19 and stored in the storage device of the PC 19.

  Instead of measuring the temperature of the conveyance path (linear feeder 2) with the first temperature sensor 6, the room temperature is strictly controlled, and the first electronic device to be measured X passes the initial temperature specifying position. The separately measured room temperature may be used as the initial temperature of the first electronic component device X to be measured.

  The initial temperature of the electronic device X to be measured may be lower than 25 ° C. or higher than 25 ° C., which is the target temperature of the temperature region 3S of the measurement base 3 to be transported thereafter, and may be 25 ° C. In some cases.

  Next, the first electronic device to be measured X is transported to the measurement base 3 by the linear feeder 2. Specifically, the first electronic device to be measured X is transported by the linear feeder 2 to the temperature region 3S of the measurement base 3 controlled at the target temperature of 25 ° C. Unless the initial temperature of the first measured electronic component device X is 25 ° C., it takes time for the temperature of the first measured electronic component device X reaching the temperature region 3S to reach 25 ° C. The time when the first electronic device to be measured X is conveyed to the measurement base 3 is transmitted to the PC 19 and stored in the storage device of the PC 19.

  Next, the first electronic component apparatus X to be measured is changed in the 90 ° conveyance direction and is conveyed downward by the conveyance body 4 in FIGS. 1 and 2. In addition, the conveyance body 4 moves intermittently as mentioned above.

  Next, the first measured electronic component device X reaches the measurement point 7P.

  When the first measured electronic component device X reaches the measurement point 7P, the measurement terminal drive mechanism 13 is driven based on the control of the PC 19. Then, the resistance value of the first measured electronic component device X is measured by the measuring instrument 18 via the measurement terminals 11a, 11b, 12a, and 12b, and the measured resistance value of the first measured electronic component device X is calculated. can get. The measured resistance value of the first electronic device X to be measured is transmitted from the measuring device 18 to the PC 19 and stored in the storage device of the PC 19. Further, the time when the resistance value of the first measured electronic component device X is measured is also stored in the storage device of the PC 19.

  At the same time, the temperature of the temperature region 3S is measured by the second temperature sensor 8. Then, the temperature measured by the second temperature sensor 8 is transmitted to the PC 19 as the temperature of the temperature region 3S when the resistance value of the first measured electronic component device X is measured at the measurement point 7P, and the PC 19 Stored in the storage device. The temperature region 3S is controlled at a target temperature of 25 ° C., but the temperature measured by the second temperature sensor 8 deviates from 25 ° C. due to various factors (change in room temperature, heat generation of the device, etc.). There may be cases.

  Next, the following calculation is performed in the calculation device of the PC 19.

  First, a specific numerical value other than the already obtained thermal time constant τ is substituted into the above-described (Equation 1) to obtain the measurement estimated temperature Tx of the first measured electronic component device X.

Specific numerical values are as follows.
Tx: Estimated temperature at the time of measurement of the first measured electronic component device X Ta: Estimated temperature (initial temperature) of the first measured electronic component device X when passing through the first temperature sensor 6
Tb: temperature measured by the second temperature sensor 8 when the resistance value of the first electronic device to be measured X is measured (temperature in the temperature region 3S)
t: Time until the resistance value is measured after the measured electronic component device X reaches the temperature region 3S τ: Thermal time constant of this NTC thermistor

  Next, by substituting specific numerical values other than the already obtained temperature change coefficient B into (Equation 2), the measurement error caused by the difference between the reference temperature Tw and the measurement temperature To is corrected. The resistance value Rw of the first measured electronic component device X is calculated.

Specific numerical values are as follows.
Rw: resistance value of the first measured electronic component device X in which the measurement error caused by the difference between the reference temperature Tw and the measured temperature To is corrected Ro: the measured resistance of the first measured electronic component device X Value B: Temperature change coefficient of this NTC thermistor Tw: Reference temperature (25 ° C. which is the target temperature in the temperature region 3S)
To: Estimated temperature Tx (measurement temperature) of the first measured electronic component device X

  Next, the first measured electronic component device X that has finished the measurement at the measurement point 7 </ b> P is transported to the temperature region 3 </ b> T by the transport body 4. Further, the first measured electronic component device X is transported to the measurement point 7Q by the transport body 4.

  When the first measured electronic component device X reaches the measurement point 7Q, the measurement terminal drive mechanism 17 is driven based on the control of the PC 19. Then, the resistance value of the first measured electronic component device X is measured by the measuring device 18 via the measurement terminals 15a, 15b, 16a, and 16b, and the measured resistance value of the first measured electronic component device X is calculated. can get. The measured resistance value of the first electronic device X to be measured is transmitted from the measuring device 18 to the PC 19 and stored in the storage device of the PC 19. Further, the time when the resistance value of the first measured electronic component device X is measured is also stored in the storage device of the PC 19.

  At the same time, the temperature of the temperature region 3T is measured by the third temperature sensor 9. Then, the temperature measured by the third temperature sensor 9 is transmitted to the PC 19 as the temperature in the temperature region 3T when the resistance value of the first measured electronic component device X is measured at the measurement point 7Q, and the PC 19 Stored in the storage device. Although the temperature region 3T is controlled at the target temperature of 50 ° C., the temperature measured by the third temperature sensor 9 may be deviated from 50 ° C. due to various factors.

  Next, as in the case of measurement at the measurement point 7P, the first electronic component to be measured using the above-described (Equation 1) in the measurement at the measurement point 7Q in the arithmetic unit of the PC 19 as well. The measurement-time estimated temperature Tx of the apparatus X is obtained, and the measurement error caused by the difference between the reference temperature Tw and the measurement temperature To is corrected using the above-described (Equation 2). Note that, when the measured electronic component device X is transported to the temperature region 3T relatively quickly after the measurement at the measurement point 7P, the initial temperature of the first measured electronic component device X that is substituted into (Equation 1). The estimated temperature Tx at the time of measurement of the first measured electronic component device X at the measurement point 7P can be used as Ta. However, in the case where it takes time to carry to the temperature region 3T, it is better to recalculate the initial temperature Ta taking into account the elapsed time.

  As described above, the resistance values at 25 ° C. and 50 ° C. of the first electronic device to be measured X are measured very accurately. FIG. 5 shows the resistance values of the first measured electronic component device X at 25 ° C. and 50 ° C. (resistance values corrected for measurement errors) and the estimated resistance temperature of the first measured electronic component device X. Show properties.

  Next, based on the resistance values at 25 ° C. and 50 ° C. of the first electronic device X to be measured, in which the measurement error caused by the difference between the reference temperature and the measured temperature is corrected, The non-defective / defective product of the electronic device X to be measured is selected. Further, when the first electronic device to be measured X is a non-defective product, rank 1 and rank 2 are selected in the PC 19. Then, the defective electronic device to be measured X is excluded in the defective product exclusion area U, the electronic device to be measured X of rank 1 is recovered in the electronic device recovery area V to be measured, and the electronic device to be measured of rank 2 is measured. X is collected in the measured electronic component collection area W.

  By the above method, the resistance value of the first electronic component apparatus X to be measured is measured and further selected. Thereafter, the resistance value of the second and subsequent measured electronic component devices X is measured and selected in the same manner.

[Second Embodiment]
FIG. 6 shows an electrical characteristic measuring apparatus 200 used in the present embodiment. However, FIG. 6 is a plan view of an essential part of the electrical characteristic measuring apparatus 200.

  The electrical characteristic measuring apparatus 200 is a simplified version of the electrical characteristic measuring apparatus 100 used in the first embodiment. That is, the electrical characteristic measuring apparatus 100 has two measurement points, that is, the measurement point 7P and the measurement point 7Q, but the electrical characteristic measurement apparatus 200 has only the measurement point 7P, omitting the measurement point 7Q. doing.

  The electrical characteristic measuring apparatus 200 includes the temperature region 3T, the Peltier element 5b, the measurement terminals 15a, 15b, 16a, and 16b, the contact member 14, the measurement terminal drive mechanism 17, and the third component included in the electrical characteristic measurement apparatus 100. The temperature sensor 9 is omitted.

  Using the electrical characteristic measuring device 200, the resistance value at 25 ° C. of the electronic component device X to be measured was measured according to the method implemented in the first embodiment. Based on the result, the electronic component device X to be measured was selected.

[Third Embodiment]
In the third embodiment, the electrical characteristic measuring device 200 used in the second embodiment is used. However, in the third embodiment, the measurement-time estimated temperature Tx of the electronic component device X to be measured is obtained by a method different from that of the second embodiment, and is generated due to a difference between the reference temperature Tw and the measured temperature To. Correct the measured error. The third embodiment will be described with reference to FIG.

  In the first and second embodiments described above, the estimated temperature Tx at the time of measurement of the first measured electronic component device X is obtained using (Equation 1), and further, the reference temperature Tw is obtained using (Equation 2). And the measurement error caused by the difference between the measurement temperature To and the measurement temperature To were corrected. In the third embodiment, (Equation 1) and (Equation 2) are not used, and (Table 1) shown below is used as the first correlation and (Table 2) is used as the second correlation. did. These tables are prepared in advance by actual measurement before measuring the resistance value.

  (Table 1) shows the estimated temperature Tx during measurement at the measurement point 7P of the measured electronic component device X. The measurement estimated temperature Tx is determined by the initial temperature of the measured electronic component device X and the measured temperature of the second temperature sensor 8 when the measured electronic component device X is measured at the measurement point 7P. However, it is assumed that the time t from when the measured electronic component device X reaches the temperature region 3S until the resistance value is measured is constant at a predetermined value.

  (Table 2) shows the resistance value Rw in which the measurement error caused by the deviation between the reference temperature Tw and the measurement temperature To of the electronic component device X to be measured is corrected. The corrected resistance value Rw is determined by the measurement estimated temperature Tx and the measured resistance value Ro.

  In the third embodiment, the corrected resistance value Rw is 9.98 kΩ or more and 10.02 kΩ or less as the non-defective product G, and the other is determined as the defective product NG. For reference, the classification of non-defective product G / defective product NG is shown in (Table 3).

  Thus, the correlation for deriving the estimated temperature Tx during measurement and the resistance value Rw in which the measurement error is corrected can be prepared not as an equation but as a table.

[Fourth Embodiment]
FIG. 7 shows an electrical characteristic measuring apparatus 400 used in this embodiment. However, FIG. 7 is a plan view of the electrical characteristic measuring apparatus 400.

  The electrical characteristic measuring apparatus 400 used in the present embodiment is a significant change from the electrical characteristic measuring apparatus 100 used in the first embodiment and the electrical characteristic measuring apparatus 200 used in the second embodiment. Has been made.

  The electrical characteristic measuring apparatus 400 includes the same parts feeder 1 and linear feeder 2 as the electrical characteristic measuring apparatuses 100 and 200. The linear feeder 2 is provided with a first temperature sensor 6. There is no change in these parts.

  The electrical characteristic measurement device 400 includes a measurement base 43.

  The measurement base 43 is provided with a disk-shaped transport body 44 instead of the rectangular transport body 4 of the electrical characteristic measuring devices 100 and 200. On the outer periphery of the transport body 44, a large number of recesses 44a for accommodating the electronic device X to be measured are formed. The transport body 44 is intermittently rotated by a motor in a state where the measured electronic component device X is accommodated in the recess 44a.

  The measurement base 43 of the electrical property measuring device 400 is provided with a measurement point 57P for measuring the electrical property (resistance value) of the measured electronic component device X.

  In the measurement base 43 of the electrical characteristic measuring apparatus 400, for example, a Peltier device (not shown) is embedded in a region including the measurement point 57P, and a temperature control region H is provided. In the temperature control region H, the temperature is controlled using a reference temperature (for example, 25 ° C.) at which the electrical characteristics of the electronic component device X to be measured are to be measured as a target temperature. Further, the temperature control region H controls the temperature of the entire measurement base 43.

  In the electrical characteristic measuring apparatus 400, the path through which the measured electronic component device X is transported from the parts feeder 1 to the measurement point 57P by the linear feeder 2 and the transport body 44 is the transport path of the measured electronic component device X. is there.

  A second temperature sensor 47 is provided in the vicinity of the measurement point 57P on the measurement base 43 of the electrical characteristic measuring apparatus 400. In addition, the measurement base 43 of the electrical property measuring apparatus 400 is provided with seven intermediate temperature sensors 48a, 48b, 48c, 48d, 48e, 48f, and 48g in the transport path of the electronic device to be measured X. Note that the boundary between the temperature ranges of two adjacent intermediate temperature sensors can be considered to be at the intermediate point between the two intermediate temperature sensors.

  In this embodiment, when the measured electronic component device X passes the first temperature sensor, the temperature of the linear feeder 2 measured by the first temperature sensor is specified as the initial temperature of the measured electronic component device X.

  Also, the initial temperature of the measured electronic component device X, the time from when the measured electronic component device X arrives at the measurement base 43 until it leaves the temperature region of the first intermediate temperature sensor 48a, the measured electronic component By substituting the measured temperature of the first intermediate temperature sensor 48a measured when the device X passes the temperature range of the first intermediate temperature sensor 48a into the above-described (Equation 1), An estimated temperature when the measured electronic component device X leaves the temperature region of the first intermediate temperature sensor 48a is obtained.

  Next, the estimated temperature when the measured electronic component device X leaves the temperature range of the first intermediate temperature sensor 48a is set as an initial temperature, and the initial temperature of the measured electronic component device X and the measured electronic component device X are measured. From the time when the first intermediate temperature sensor 48a exits the temperature region of the second intermediate temperature sensor 48b until the time when the electronic device X to be measured is the second intermediate temperature sensor 48b. By substituting the measured temperature of the second intermediate temperature sensor 48b measured while passing through the above temperature range into the above-described (Equation 1), the electronic component device X to be measured becomes the second The estimated temperature when the temperature of the intermediate temperature sensor 48b is exited is obtained. Hereinafter, an estimated temperature when the electronic device under test X exits the third to seventh intermediate temperature sensors 48c, 48d, 48e, 48f, and 48g is obtained by the same method.

Further, an estimated temperature of the measured electronic component device X when the electrical characteristics of the measured electronic component device X are measured at the measurement point 57P is obtained by the same method. Specifically, the initial temperature (estimated temperature when leaving the temperature range of the seventh intermediate temperature sensor 48g) Ta of the measured electronic component device X and the seventh intermediate temperature of the measured electronic component device X are measured. The time t until the measurement at the measurement point 57P after the temperature range of the sensor 48g (after entering the temperature range of the measurement point 57P) and the electrical characteristics of the electronic component device X to be measured are measured at the measurement point 57P. The measured temperature Tb of the second temperature sensor 47 at the time of measurement is substituted into the above-described (Equation 1) to obtain the estimated temperature T _X at the time of measurement of the electronic component device X to be measured.

In the present embodiment, the estimated temperature T _X at the time of measurement of the electronic device X to be measured obtained by the above method is substituted into (Equation 2) described above as the measurement temperature To, and the reference temperature Tw and the measurement temperature To The resistance value Rw of the measured electronic component device X in which the measurement error caused by the deviation is corrected is obtained.

  Also in the measurement method according to the present embodiment using the electrical property measuring apparatus 400, the electrical property (resistance value) of the electronic component device X to be measured can be measured with high measurement accuracy.

[Fifth Embodiment]
FIG. 8 shows an electrical characteristic measuring apparatus 500 used in this embodiment. However, FIG. 8 is a plan view of the electrical characteristic measuring apparatus 500.

  The electrical characteristic measuring apparatus 500 used in the present embodiment has a new configuration added to the above-described electrical characteristic measuring apparatus 400 used in the fourth embodiment.

  The electrical characteristic measuring apparatus 500 is newly provided with a reference electronic component Y, and a measurement point 57Q of the reference electronic component Y is provided in the vicinity of the measurement point 57P. In addition, since the measurement point 57P and the measurement point 57Q are at a very close distance, it can be considered that the temperature of both is the same.

  (Equation 1) and (Equation 2) described above are stored in the storage device of the PC 19.

Further, in the present embodiment, in advance, shown below, for measuring the resistance value Ro of the reference electronic component Y, the measured electronic component device (NTC Thermistor) X measured resistance value R ₁ of the deviation (measured value deviation rate) (Equation 3) shown is stored in the storage device of the PC 19.

Further, in the present embodiment, the storage device of the PC 15, is determined to be nondefective, stores the tolerance of deviation of the measured resistance value R ₁ of the measured electronic component device (NTC thermistor) X.

  After the above preparation, measurement is started.

  First, a plurality of measured electronic component devices X are put into the parts feeder 1.

  Next, based on the control of the PC 19, the parts feeder 1, the linear feeder 2, and the transport body 44 each start driving. As a result, the electronic device to be measured X is sequentially transferred to the measurement point 57P of the measurement base 43.

  Then, the electrical characteristics of the measured electronic component device X are measured at the measurement point 57P, and at the same time, the electrical characteristics of the reference electronic component Y are measured at the measurement point 57Q. If the temperature of the measurement point 57Q is relatively stable over time, the measurement of the electrical characteristics of the reference electronic component Y may be slightly different from the measurement of the electrical characteristics of the measured electronic component device X. good.

  Also in the present embodiment, as in the fourth embodiment described above, the first temperature sensor 6, the intermediate temperature sensor 48 a, and the measurement target electronic component device X are transported along the transport path at the necessary timing. The temperature is measured by 48 b, 48 c, 48 d, 48 e, 48 f, 48 g and the second temperature sensor 47.

  Then, the measurement estimated temperature Tx of the measured electronic component device X is obtained by the above-described (Equation 1). Further, the measurement error generated due to the difference between the reference temperature Tw and the measurement temperature To is corrected by the above-described (Equation 2) using the obtained estimated temperature Tx of the measured electronic component device X. The resistance value Rw of the measured electronic component device X is obtained.

  Since the temperature of the reference electronic component Y is the same as the measured temperature Tb of the second temperature sensor 47, the resistance value Rw of the measured electronic component device X after correction according to (Equation 2) described above is obtained. It is also preferable to use the measurement temperature Tb of the second temperature sensor 47 instead of the reference temperature Tw.

Next, in the present embodiment, the measured resistance value R ₁ of the measured electronic component device X with respect to the measured resistance value Ro of the reference electronic component Y (the measured electron whose measurement error is corrected) according to (Equation 3) described above. The deviation of the resistance value Rw) of the component device X is obtained.

Then, the determined, for measuring the resistance value Ro of the reference electronic component Y, the deviation of the corrected measured resistance value R ₁ of the measured electronic component device X is to be measured electronic component device if it is within a predetermined range X is determined to be a non-defective product, and if the measured electronic component device X is out of a predetermined range, the measured electronic component device X is determined to be defective. The allowable deviation range is determined in consideration of the resistance value at the reference temperature of the reference electronic component Y described above.

In the present embodiment, the measurement resistance value Ro of the reference electronic component Y is not only corrected from the measurement resistance value of the electronic component device X to be measured, but the measurement error caused by the difference between the reference temperature and the measurement temperature is corrected. for, a deviation of the corrected measured resistance value R ₁ of the measured electronic component device X, because doing good / defective determination of the measured electronic component device X, a more appropriate non-defective / defective determination It can be carried out.

[Sixth Embodiment]
FIG. 9 shows an electrical characteristic measuring apparatus 600 used in the sixth embodiment. However, FIG. 9 is a plan view of the electrical characteristic measuring apparatus 600.

  The electrical property measuring device 600 used in the present embodiment is a modification of the electrical property measuring device 100 used in the first embodiment described above.

  The electrical characteristic measuring apparatus 100 was provided with a parts feeder 1 and a linear feeder 2. The electrical property measuring device 600 omits the parts feeder 1 and the linear feeder 2 of the electrical property measuring device 100, and instead of these, as an initial temperature specifying position and a conveying means, respectively, a parts tray 61, A pickup nozzle 65 is provided. Further, in the electrical characteristic measuring apparatus 100, the first temperature sensor 6 is provided in the linear feeder 2, but in the electrical characteristic measuring apparatus 600, the first temperature sensor 66 is provided in the parts tray 61. Further, in the electrical characteristic measuring apparatus 600, the transport body 4 is omitted. The other configuration of the electrical characteristic measuring apparatus 600 is the same as that of the electrical characteristic measuring apparatus 100.

  In the present embodiment, first, a plurality of measured electronic component devices X are put into the parts tray 61. Then, after a while, the temperature of the measured electronic component device X is adjusted to the temperature of the parts tray 61 (the same temperature is set).

  Next, one of the measured electronic component devices X is sucked by the pickup nozzle 65, and the sucked measured electronic component device X is moved to the measurement point 7 </ b> P in the temperature region 3 </ b> S of the measurement base 3. In the present embodiment, the temperature of the part tray 61 measured by the first temperature sensor 66 when the pickup nozzle 65 sucks the electronic component device X to be measured is regarded as the initial temperature of the electronic component device X to be measured.

  Next, the electrical characteristics of the electronic component device X to be measured are measured at the measurement point 7P. The measurement result of the electrical characteristics is corrected by the same method as in the first embodiment.

  Next, the measured electronic component device X is sucked by the pickup nozzle 65, and the sucked measured electronic component device X is moved to the measurement point 7Q in the temperature region 3T. Note that a pickup nozzle used here may be different from the pickup nozzle 65 described above.

  Next, the electrical characteristics of the measured electronic component device X are measured at the measurement point 7Q. The measurement result of the electrical characteristics is corrected by the same method as in the first embodiment.

  Next, based on the measurement result of the electrical characteristics at the measurement point 7P and the measurement point 7Q, the electronic component device X to be measured is a defective product, rank 1 with little variation in electrical characteristics, and within the allowable range, but electrical Classify into rank 2 with variations in characteristics. Then, the electronic device to be measured X is picked up by the pickup nozzle 65, and based on the above classification result, the picked-up electronic device X is measured as a defective product exclusion region U, a measured electronic component recovery region V, and a measured electronic device. It is moved to one of the parts collection area W and removed or collected.

  Also in this embodiment, it is possible to sort the electronic device to be measured X with high accuracy.

[Seventh Embodiment]
FIG. 10 shows an electrical characteristic measuring apparatus 700 used in the seventh embodiment. However, FIG. 10 is a front view (partially sectional view) of the electrical characteristic measuring apparatus 700.

  The electrical characteristic measuring device 700 used in the present embodiment includes a thermostatic chamber 71. The thermostat 71 contains a liquid 72. The liquid 72 is controlled to a constant temperature, and the temperature is constantly measured.

  The electrical characteristic measuring apparatus 700 includes an annular electronic component fixing jig 73. The electronic component fixing jig 73 is attached to the motor 74 and is driven by the motor 74 to rotate.

  The electrical characteristic measuring device 700 includes a measuring device 78.

  In the present embodiment, first, a plurality of radial lead type NTC thermistors are attached to the electronic component fixing jig 73 as the electronic component device X to be measured.

  Next, the electronic component fixing jig 73 is rotated by the motor 74, and the main body portion of the measured electronic component device X is immersed in the liquid 72 in order. Then, the measuring device 78 measures the electrical characteristics (resistance value) of the measured electronic component device X in which the main body portion is immersed in the liquid 72.

  In the present embodiment, the room temperature is the initial temperature Ta of the electronic component device X to be measured. Further, the temperature of the liquid 72 is defined as a measurement temperature Tb. Then, the initial temperature Ta, the measurement temperature Tb, the time t from when the body part of the measured electronic component device X is immersed in the liquid 72 until the electrical characteristics are measured, and the heat of the measured electronic component device X By substituting the time constant τ into the above-described (Expression 1), the measurement estimated temperature Tx of the measured electronic component device X is obtained. Moreover, the measurement error generated due to the difference between the reference temperature Tw and the measurement temperature To according to the above (Equation 2), where the measured estimated temperature Tx of the measured electronic component device X is the measurement temperature To. The corrected resistance value Rw of the measured electronic component device X is obtained.

[Eighth Embodiment]
FIG. 11 shows an electrical characteristic measuring apparatus 800 used in the eighth embodiment. However, FIG. 11 is a principal part perspective view of the electrical characteristic measuring apparatus 800, and shows only the carrier 84 described later.

  In the electrical characteristic measuring apparatus 100 and the like used in the first embodiment, the rectangular transport body 4 is used as a means for transporting the measured electronic component device X. Further, in the electrical characteristic measuring apparatus 400 used in the fourth embodiment, the circular transport body 44 is used as a means for transporting the measured electronic component device X. The electrical property measuring apparatus 800 includes a drum-shaped transport body 84 instead of these.

  The transport body 84 includes a cylindrical drum 85. The drum 85 is provided with a plurality of penetrating cavities 85a. In the electrical characteristic measuring apparatus 800, the electronic device to be measured X is held and transported inside the cavity 85a.

  If the electrical property measuring device 800 is used, the electrical property of the electronic component device can be measured and selected with high accuracy.

[Ninth Embodiment]
FIG. 12 shows an electrical characteristic measuring apparatus 900 used in the ninth embodiment. However, FIG. 11 is a principal part perspective view of the electrical characteristic measuring apparatus 900, and shows only a carrier 94 described later.

  In the electrical characteristic measuring apparatus 100 and the like used in the first embodiment, the rectangular transport body 4 is used as a means for transporting the measured electronic component device X. Further, in the electrical characteristic measuring apparatus 400 used in the fourth embodiment, the circular transport body 44 is used as a means for transporting the measured electronic component device X. In place of these, the electrical characteristic measuring apparatus 900 includes a belt conveyor-like transport body 94.

  The carrier 94 includes a belt 95. The belt 95 is provided with a plurality of cavities 95a. In the electrical characteristic measuring apparatus 900, the electronic component apparatus X to be measured is transported while being held inside the cavity 95a.

  If the electrical characteristic measuring apparatus 900 is used, the electrical characteristics of the electronic component apparatus can be measured and selected with high accuracy.

[Tenth embodiment]
FIG. 13 shows an electrical characteristic measuring apparatus 1000 used in the tenth embodiment. However, FIG. 13 is a front view of an essential part of the electrical characteristic measuring apparatus 1000, and shows only a carrier 98 described later.

  In the electrical characteristic measuring apparatus 400 and the like used in the fourth embodiment, a circular transport body 44 is used as a means for transporting the measured electronic component device X. The transport body 44 has a plurality of recesses 44a formed on the outer periphery.

  The electrical characteristic measuring apparatus 1000 also includes a circular transport body 98. However, in the transport body 98, a plurality of cavities 98a penetrating in the surface, not the outer periphery, are formed. In the present embodiment, a plurality of cavities 98a are formed in the transport body 98 so as to be arranged in three rows concentrically.

  In the electrical characteristic measuring apparatus 1000, the electronic device to be measured X is transported while being held inside the cavity 98a. The transport body 98 can be used in an upright state, that is, installed perpendicular to the ground plane.

  If the electrical characteristic measuring apparatus 1000 is used, the electrical characteristics of the electronic component apparatus can be measured and selected with high accuracy.

  The first to seventh embodiments have been described above. However, the present invention is not limited to the contents described above, and various modifications can be made in accordance with the spirit of the invention.

  For example, in the first to seventh embodiments, the resistance value of the NTC thermistor is measured, but the type of electronic component is not limited to the NTC thermistor, and the measured electrical characteristics are not limited to the resistance value. For example, the resistance value of a PTC thermistor or a fixed resistor may be measured, or the capacitance value of a capacitor or the inductance value of an inductor may be measured.

  In the first embodiment, the second embodiment, and the fourth to seventh embodiments, the electronic component device to be measured having the first temperature is placed in the second temperature region having the second temperature different from the first temperature. As the first correlation for estimating the temperature of the measured electronic component device after the elapse of time t, (Equation 1) described above was used. However, (Equation 1) is an example, and other correlation equations may be used. Moreover, you may use the table | surface which showed the 1st correlation like 3rd Embodiment.

  In the first embodiment, the second embodiment, and the fourth to seventh embodiments, when measuring the electrical characteristics, the reference temperature, which is the temperature at which the measured electronic component device should be, and the electrical characteristics are measured. A measurement error that is caused by a deviation between the reference temperature and the measurement temperature, which is included in the measurement electrical characteristics, from the measurement temperature that is the actual temperature of the measured electronic component device at the time of the measurement. As the correlation, (Equation 2) described above was used. However, (Equation 2) is an example, and other correlation equations may be used. For example, the Steinhrt-Hart equation, which is an approximate equation of the temperature resistance characteristic of the NTC thermistor, may be used. Moreover, you may use the table | surface which showed 2nd correlation like 3rd Embodiment.

  In the electronic component device sorting method of the present invention, corrected electrical characteristics obtained by correcting a measurement error caused by a difference between the reference temperature and the measured temperature are acquired, and the corrected electrical characteristics are sorted. Instead of sorting the electronic component device compared to the standard, the sorting standard is correspondingly corrected corresponding to the estimated temperature at the time of measurement, the corresponding corrected sorting standard is obtained, and the measured electrical characteristic is the corresponding corrected sorting standard. The electronic component devices may be selected by comparison.

  In order to confirm the effectiveness of the present invention, the following experiment was conducted.

[Experimental Example 1]
Experiments of Comparative Example 1, Comparative Example 2, Example 1, and Example 2 were performed to compare measurement accuracy. In this experiment, an NTC thermistor was used as an electronic component to be measured, and a resistance value was measured as an electrical characteristic. The reference temperature was 25 ° C. and the room temperature was controlled at 24 ° C.

  In Comparative Example 1, the method disclosed in Patent Document 1 was used. In other words, the temperature of the transport path is measured with a temperature sensor (platinum sensor), and when the measured temperature deviates from the reference temperature, the transport path is controlled to approach the reference temperature, and then the resistance value of the electronic component to be measured is adjusted. It was measured.

  In Comparative Example 2, the method disclosed in Patent Document 2 was used. That is, simultaneously with the measurement of the resistance value of the measured electronic component, the resistance value of the reference electronic component was measured, and the deviation of the measured resistance value of the measured electronic component from the measured resistance value of the reference electronic component was calculated. Then, based on the deviation, the resistance value (real number) of the electronic component to be measured was obtained.

  In Example 1, the method of the fourth embodiment described above was used. That is, the temperature of the conveyance path is measured by the first temperature sensor 6, the intermediate temperature sensors 48a, 48b, 48c, 48d, 48e, 48f, 48g, and the second temperature sensor 47, and at the time of measuring the electronic component to be measured. The estimated temperature was calculated to obtain a corrected resistance value in which the measurement error caused by the difference between the reference temperature and the measured temperature was corrected.

  In Example 2, the method of the fifth embodiment described above was used. That is, the temperature of the conveyance path is measured by the first temperature sensor 6, the intermediate temperature sensors 48a, 48b, 48c, 48d, 48e, 48f, 48g, and the second temperature sensor 47, and at the time of measuring the electronic component to be measured. The estimated temperature is calculated to obtain a corrected resistance value in which the measurement error caused by the difference between the reference temperature and the measured temperature is corrected, and the resistance of the reference electronic component is measured simultaneously with the measurement of the resistance value of the measured electronic component. The value was measured, and the deviation of the corrected resistance value of the measured electronic component relative to the measured resistance value of the reference electronic component was calculated. Then, based on the deviation, the resistance value (real number) of the electronic component to be measured was obtained.

  By changing the operating speed of the electrical characteristic measuring device, three types of measurement results were obtained for each of Comparative Example 1, Comparative Example 2, Example 1, and Example 2. Specifically, measurement results were obtained for each of a low speed (100 pieces / minute), a medium speed (1000 pieces / minute), and a high speed (3000 pieces / minute).

  The measurement accuracy was obtained from the following (Equation 4) by putting the same sample 10 times into the electrical characteristic measuring device in each of Comparative Example 1, Comparative Example 2, Example 1, and Example 2. Note that the maximum resistance value is the maximum resistance value among the 10 times applied, and the minimum resistance value is the minimum resistance value among the 10 times input. The reference resistance value is a resistance value guaranteed by the supplier of the measured electronic component to the user of the measured electronic component.

  Table 4 shows the measurement results of Comparative Example 1, Comparative Example 2, Example 1, and Example 2.

  When the measurement results of Comparative Example 1, Comparative Example 2, Example 1, and Example 2 are compared, as can be seen from (Table 4), when the operating speed of the electrical characteristic measuring device is the same, the operating speed The measurement accuracy of Comparative Example 1 is the worst, and the measurement accuracy of Example 2 is the highest, regardless of whether the speed is low (100 / min), medium (1000 / min), or high (3000 / min). Was good.

  When Comparative Example 2 and Example 1 were compared, Comparative Example 2 was superior to Example 1 at low speeds and medium speeds, but Example 1 was superior to Comparative Example 2 at high speeds.

  As described above, as in the fifth embodiment, the resistance value of the reference electronic component is measured simultaneously with the measurement of the resistance value of the measured electronic component, and the corrected resistance value of the measured electronic component with respect to the measured resistance value of the reference electronic component is calculated. It was found that the resistance value can be measured with high accuracy if the present invention is implemented by the method of calculating the deviation.

  Moreover, even when the deviation is not calculated as in the fourth embodiment, the resistance value can be measured with sufficiently higher accuracy than the conventional method when the electrical characteristic measuring apparatus is operated at high speed. I understood.

[Experiment 2]
In Experimental Example 2, the experiments of Comparative Example 3, Comparative Example 4, Example 3, and Example 4 were performed, and the measurement accuracy was compared. Also in this experiment, an NTC thermistor was used for the electronic component to be measured, and the resistance value was measured as an electrical characteristic.

  In Experimental Example 1 described above, the reference temperature was 25 ° C., but in Experimental Example 2, the reference temperature was 50 ° C. The other items in Experimental Example 2 were the same as in Experimental Example 1.

  In Comparative Example 3, the same method as in Comparative Example 1 of Experimental Example 1 was used.

  In Comparative Example 4, the same method as in Comparative Example 2 of Experimental Example 1 was used.

  In Example 3, the same method as in Example 1 of Experimental Example 1 was used.

  In Example 4, the same method as in Example 2 of Experimental Example 1 was used.

  Table 5 shows the measurement results of Comparative Example 3, Comparative Example 4, Example 3, and Example 4.

  As can be seen from (Table 5), in Experimental Example 2, the same results as in Experimental Example 1 were obtained. From this result, it was found that the present invention is effective regardless of the reference temperature.

  As described above, it has been found from Experimental Examples 1 and 2 that according to the present invention, the electrical characteristics of the electronic component can be measured with high accuracy.

DESCRIPTION OF SYMBOLS 1 ... Parts feeder 2 ... Linear feeder 3 ... Measurement base 3S ... Temperature range (25 degreeC)
3T ... temperature range (50 ° C)
4 ... Conveyer (rectangular)
4a: Recess 44: Conveying body (circular)
44a ... concave portions 5a, 5b ... Peltier elements 7P, 7Q, 57P, 57Q ... measurement points 6, 66 ... first temperature sensors 8, 47 ... second temperature sensor 9 ... first 3 temperature sensors 10, 14 ... contact members 11a, 11b, 12a, 12b, 15a, 15b, 16a, 16b ... measurement terminals 13, 17 ... measurement terminal drive mechanisms 18, 78 ... measuring instruments 19 ... Personal computer (PC)
48a, 48b, 48c, 48d, 48e, 48f, 48g ... Intermediate temperature sensor 61 ... Parts tray 65 ... Pickup nozzle 71 ... Constant temperature bath 72 ... Liquid 73 ... Electronic component fixing treatment Tool H ... Temperature control means U ... Defective product exclusion region V, W ... Measured electronic component recovery region X ... Measured electronic component (NTC thermistor)
Y ... Reference electronic component (NTC thermistor)
100, 200, 400, 500, 600, 700... Electrical characteristics measuring device

Claims (17)

An electrical property measurement method for an electronic component device for measuring an electrical property of an electronic component device to be measured,
The measured electronic component device is transported to a measurement point via an initial temperature specific position, where the electrical characteristic is measured and the measured electrical characteristic is obtained at the measurement point,
When the electronic component device to be measured having the first temperature is placed in a second temperature region having a second temperature different from the first temperature, the temperature of the electronic component device to be measured after the elapse of time t is estimated. 1 correlation,
From the reference temperature that is the temperature at which the measured electronic component device should be when measuring the electrical characteristics, and the measured temperature that is the actual temperature of the measured electronic component device when measuring the electrical characteristics, A second correlation for correcting a measurement error caused by a deviation between the reference temperature and the measured temperature, included in the measured electrical characteristics, respectively,
Specify the initial temperature of the electronic device to be measured at the initial temperature specifying position,
Identify the measurement point temperature that is the temperature of the measurement point,
Specify the elapsed time required until the electrical characteristics are measured after the measured electronic component device via the initial temperature specifying position enters the temperature region of the measurement point,
In the first correlation, the initial temperature is the first temperature, the measurement point temperature is the second temperature, and the elapsed time is the time t, so that the electrical characteristics are measured. Estimate the estimated temperature during measurement of the measured electronic component device,
In the second correlation, a corrected electrical characteristic in which a measurement error caused by a deviation between the reference temperature and the measured temperature is corrected by setting the estimated temperature at the time of measurement as the measured temperature. A method for measuring electrical characteristics of an electronic component device. A first temperature sensor for measuring the temperature of the initial temperature specific position is provided;
Specifying the initial temperature of the measured electronic component device at the initial temperature specifying position,
When the measured electronic component device passes through the initial temperature specific position, the temperature at the initial temperature specific position measured by the first temperature sensor is used as the initial temperature of the measured electronic component device. The method for measuring electrical characteristics of an electronic component device according to claim 1.   The electrical characteristic measurement of the electronic component device according to claim 1, wherein the electronic component device is transported to the measurement point through a transport route, and the initial temperature specific position is provided in the transport route. Method. One intermediate temperature sensor is provided between the initial temperature specific position and the measurement point,
In the first correlation, the initial temperature is the first temperature, the measurement point temperature is the second temperature, and the elapsed time is the time t, so that the electrical characteristics are measured. Instead of estimating the estimated temperature during measurement of the measured electronic component device,
In the first correlation, the initial temperature is set as the first temperature, and the transport path measured by the intermediate temperature sensor when the measured electronic component device passes the temperature range of the intermediate temperature sensor. By setting the temperature to be the second temperature, and the time required for the measured electronic component device to enter the temperature range of the intermediate temperature sensor and exit the temperature range of the intermediate temperature sensor is set to t. Estimating the estimated temperature of the measured electronic component device when leaving the temperature range of the temperature sensor,
Further, in the first correlation, the estimated temperature of the measured electronic component device when it exits the temperature range of the intermediate temperature sensor is the first temperature, the measurement point temperature is the second temperature, By letting t be the elapsed time required from when the measured electronic component device exiting the temperature range of the intermediate temperature sensor enters the temperature range of the measurement point until the electrical characteristics are measured, The method for measuring an electrical property of an electronic component device according to claim 3, wherein an estimated temperature during measurement of the electronic component to be measured when the electrical property is measured is calculated. A plurality of intermediate temperature sensors are provided between the initial temperature specific position and the measurement point,
In the first correlation, the initial temperature is the first temperature, the measurement point temperature is the second temperature, and the elapsed time is the time t, so that the electrical characteristics are measured. Instead of estimating the estimated temperature during measurement of the measured electronic component device,
In the first correlation, the initial temperature is the first temperature, and the first intermediate temperature sensor when the measured electronic component device passes the temperature range of the first intermediate temperature sensor. The temperature of the conveyance path measured in step 2 is set as the second temperature, and the temperature range of the first intermediate temperature sensor after the measured electronic component device enters the temperature range of the first intermediate temperature sensor Estimating the estimated temperature of the measured electronic component device when exiting the temperature range of the first intermediate temperature sensor by taking the time required to exit as t,
Furthermore, in the first correlation, the estimated temperature of the measured electronic component device when the temperature range of the first intermediate temperature sensor is exited is the first temperature, and the measured electronic component device is The temperature of the conveyance path measured by the second intermediate temperature sensor when passing through the temperature range of the second intermediate temperature sensor is the second temperature, and the first intermediate temperature sensor The time required for the measured electronic component device exiting the temperature region to enter the temperature region of the second intermediate temperature sensor and then exit the temperature region of the second intermediate temperature sensor is defined as t. Accordingly, the estimated temperature of the electronic device to be measured when leaving the temperature range of the second intermediate temperature sensor is estimated,
When three or more intermediate temperature sensors are provided, a similar method is used to calculate an estimated temperature of the measured electronic component device when the temperature range of the intermediate temperature sensor is exited,
Further, in the first correlation, the estimated temperature of the electronic device to be measured when the temperature range of the last intermediate temperature sensor leaves is the first temperature, and the measurement point temperature is the second temperature. And t is the elapsed time required from when the measured electronic component device that has left the temperature range of the intermediate temperature sensor enters the temperature range of the measurement point until the electrical characteristics are measured. The method for measuring electrical characteristics of an electronic component device according to claim 3, wherein an estimated temperature during measurement of the measured electronic component device when the electrical characteristics are measured is calculated.   6. The method for measuring an electrical property of an electronic component device according to claim 1, wherein the electrical property is a resistance value.   The method for measuring electrical characteristics of an electronic component device according to any one of claims 1 to 6, wherein temperature adjustment is performed so that at least the measurement point approaches a predetermined target temperature. The predetermined target temperature as the reference temperature,
The method for measuring electrical characteristics of an electronic component device according to claim 7, wherein the measurement point temperature is considered to be equal to the reference temperature. An electronic component device sorting method that measures electrical characteristics of the measured electronic component device and sorts the measured electronic component device according to the measurement result,
The measured electronic component device is transported to a measurement point via an initial temperature specific position, where the electrical characteristic is measured and the measured electrical characteristic is obtained at the measurement point,
When the electronic component device to be measured having the first temperature is placed in a second temperature region having a second temperature different from the first temperature, the temperature of the electronic component device to be measured after the elapse of time t is estimated. 1 correlation,
From the reference temperature that is the temperature at which the measured electronic component device should be when measuring the electrical characteristics, and the measured temperature that is the actual temperature of the measured electronic component device when measuring the electrical characteristics, A second correlation for correcting a measurement error caused by a deviation between the reference temperature and the measured temperature, included in the measured electrical characteristics, respectively,
For the electrical characteristics at the reference temperature of the electronic component device, set a selection criterion,
Specify the initial temperature of the electronic device to be measured at the initial temperature specifying position,
Identify the measurement point temperature that is the temperature of the measurement point,
Specify the elapsed time required until the electrical characteristics are measured after the measured electronic component device via the initial temperature specifying position enters the temperature region of the measurement point,
In the first correlation, the initial temperature is the first temperature, the measurement point temperature is the second temperature, and the elapsed time is the time t, so that the electrical characteristics are measured. Estimate the estimated temperature during measurement of the measured electronic component device,
In the second correlation, a corrected electrical characteristic in which a measurement error caused by a deviation between the reference temperature and the measured temperature is corrected by setting the estimated temperature at the time of measurement as the measured temperature. A method for selecting an electronic component device, wherein the electronic component device is selected by acquiring and comparing the corrected electrical characteristic with the selection criterion. In the second correlation, a corrected electrical characteristic in which a measurement error caused by a deviation between the reference temperature and the measured temperature is corrected by setting the estimated temperature at the time of measurement as the measured temperature. Instead of obtaining and sorting the electronic component device by comparing the corrected electrical characteristics with the sorting criteria,
Correspondingly correcting the selection criterion corresponding to the estimated temperature at the time of measurement, obtaining a corresponding correction selection criterion, and comparing the measured electrical characteristics with the corresponding correction selection criterion to select the electronic component device. Item 10. A method for selecting an electronic component device according to Item 9. A reference electronic component device in which a relationship between a measurement temperature in a necessary range and an electrical characteristic is specified in advance is selected, and the selection criterion is used as an electrical characteristic of the reference electronic component device over the measurement temperature in the necessary range. Set the relative value of
The reference electronic component device is arranged in the vicinity of the measurement point, and the electrical characteristics of the reference electronic component device are measured simultaneously with or before or after the measurement of the electrical characteristics of the measured electronic component device. To obtain the measured electrical characteristics of the reference electronic component device,
From the measured electrical characteristics of the reference electronic component device, specify the measurement temperature of the reference electronic component device and the selection criteria corresponding thereto,
By assuming that the measurement point temperature is equal to the measurement temperature of the reference electronic component device, and further replacing the reference temperature with the measurement temperature of the reference electronic component device, the measurement of the reference electronic component device The method of selecting an electronic component device according to claim 9 or 10, wherein the corrected electrical characteristic of the electronic component device at a temperature is acquired. A transport mechanism for transporting the measured electronic component device from the initial temperature specific position to the measurement point;
An electrical characteristic measuring device comprising: a measuring instrument for measuring electrical characteristics of the electronic component device to be measured at the measurement point;
In the vicinity of the initial temperature specifying position or the initial temperature specifying position, initial temperature specifying means for specifying an initial temperature of the electronic component device to be measured is provided,
An electrical characteristic measuring device provided with a measuring point temperature specifying means for specifying a measuring point temperature which is a temperature of the measuring point in the vicinity of the measuring point or the measuring point.   The electrical characteristic measuring device according to claim 12, wherein a first temperature sensor for measuring a temperature at the initial temperature specifying position is provided as the initial temperature specifying means.   The electrical property measuring device according to claim 12 or 13, wherein a transport path for transporting the electronic component device to the measurement point is provided, and the initial temperature specific position is provided in the transport path.   Furthermore, the electrical characteristic measuring apparatus of Claim 14 with which the one or several intermediate temperature sensor was provided between the said initial temperature specific position and the said measurement point.   The electrical characteristic measuring device according to any one of claims 12 to 15, further comprising temperature adjusting means for adjusting temperature so that at least the measurement point approaches a predetermined target temperature. The electrical characteristic measuring device according to any one of claims 12 to 16, wherein a measuring point of a reference electronic component is provided in the vicinity of the measuring point of the measured electronic component device.

Images