WO2022191126A1

WO2022191126A1 - Electronic component inspection apparatus

Info

Publication number: WO2022191126A1
Application number: PCT/JP2022/009698
Authority: WO
Inventors: 日出夫南
Original assignee: 上野精機株式会社
Priority date: 2021-03-11
Filing date: 2022-03-07
Publication date: 2022-09-15
Also published as: JP7007677B1; JP2022139164A

Abstract

This electronic component inspection apparatus is provided with a first measuring unit that inspects an electronic component that has been heated or cooled to a first temperature (T1), a second measuring unit that inspects the electronic component inspected by the first measuring unit, at a second temperature (T2) different from the first temperature (T1), and a first transportation mechanism (P) that transports the electronic component received from the first measuring unit toward the second measuring unit. The first transportation mechanism (P) has a first temperature adjusting unit (p) that brings the electronic component closer to room temperature.

Description

Electronic component inspection equipment

The present disclosure relates to an electronic component inspection device that inspects electronic components.

　Electronic components undergo predetermined inspections, such as appearance inspections and electrical property inspections. Depending on the type of electronic component, it is required to inspect the electronic component at a predetermined temperature. A specific example thereof is disclosed in Patent Document 1. The inspection device described in Patent Document 1 has a normal temperature test unit and a high temperature test unit around a transport device that transports electronic components. The room temperature test unit inspects electronic components at room temperature (room temperature inspection). The high temperature test unit heats the electronic component to a predetermined temperature and inspects it. After the electronic component is inspected at room temperature, it is transported by a transport device and is inspected at high temperature. The high temperature test unit has a heating table and a measuring section. The heating table rotates while heating the electronic component placed in the pocket by the heat source so that the electronic component reaches a predetermined temperature at the position where the electronic component is measured by the measuring section.

The inspection apparatus of Patent Document 1 performs normal temperature inspection and high temperature inspection on electronic components, but depending on the electronic component, in addition to normal temperature inspection and high temperature inspection, low temperature inspection for inspecting the electronic component in a low temperature state is required. . In that case, for example, in order to perform a low temperature inspection after a high temperature inspection, it is necessary to lower the temperature of the electronic component to a predetermined value (room temperature) before transporting the electronic component that has finished the high temperature inspection to the low temperature inspection position.

However, if an electronic component that has reached a high temperature is to be returned to normal temperature only by being transported in a normal temperature atmosphere by a transporting device, it is necessary to secure a sufficiently long transporting time by the transporting device, and the transporting distance for returning to normal temperature is long. It becomes long, and the apparatus becomes large-sized.

Japanese Patent No. 6075663

The present disclosure relates to an electronic component inspection apparatus capable of stably bringing heated or cooled electronic components to room temperature.

According to the present disclosure, the electronic component inspection apparatus includes a first measurement unit that inspects the electronic component while it is heated or cooled to a first temperature T1, and an electronic component that has been inspected by the first measurement unit. a second measuring unit that inspects at a second temperature T2 different from the first temperature T1; a first transport mechanism P that transports the electronic component given from the first measuring unit toward the second measuring unit; Prepare. The first transport mechanism P has a first temperature control section p that brings the temperature of the electronic components closer to room temperature. Therefore, it is possible to stably bring the heated or cooled electronic component to room temperature.

FIG. 1 is an explanatory diagram of an electronic component inspection apparatus according to one embodiment of the present invention. FIG. 2 is an explanatory diagram of the component conveying unit. 3A and 3B are explanatory diagrams of an electronic component carrier of the carrier mechanism P. FIG. FIG. 4 is an explanatory diagram of a transport mechanism according to a modification.

The embodiment will be described with reference to the attached drawings. As shown in FIG. 1, an electronic component inspection apparatus 10 according to the embodiment includes a measurement unit 11, which is an example of a first measurement unit for inspecting an electronic component W heated to T1° C., and a measurement unit A measurement unit 12, which is an example of a second measurement unit that inspects the electronic component W inspected in 11 at T2° C. different from T1° C., and the electronic component W given from the measurement unit 11 are directed toward the measurement unit 12. and a transport mechanism P for transporting the substrate.

The electronic components W to be inspected by the electronic component inspection apparatus 10 are, for example, diodes, transistors, capacitors, inductors, and ICs (Integrated Circuits). In the present embodiment, the electronic component W is plate-shaped and rectangular in plan view, but the shape of the electronic component W is not limited.

As shown in FIG. 1, the electronic component inspection apparatus 10, in addition to the measuring unit 11, the measuring unit 12 and the transport mechanism P, transports the electronic component W to the measuring unit 11, acquires it from the measuring unit 11, and A component transport unit 14 that moves toward P, and a component transport unit 15 that transports the electronic component W that has passed through the transport mechanism P to the measurement unit 12 and acquires it from the measurement unit 12 .

In addition to this, the electronic component inspection apparatus 10 includes a transport mechanism Q that obtains from the component transport unit 15 and transports the electronic component W that the component transport unit 15 has acquired from the measurement unit 12, and an electronic component W that has passed through the transport mechanism Q. and a measuring unit 18, which is an example of a third measuring unit that inspects the electronic component W transported by the component transporting unit 17 at T3° C. and returns it to the component transporting unit 17. Prepare. However, T3°C is a temperature different from both T1°C and T2°C. In the present embodiment, T1>T3>T2, T1°C is higher than normal temperature (natural temperature without heating or cooling) (for example, 100°C or higher and 200°C or lower), and T2°C is lower than normal temperature. Temperature (eg, −80° C. or higher and −20° C. or lower), and T3° C. is normal temperature (eg, 0° C. or higher and 40° C. or lower).

Therefore, the component transport unit 14, the transport mechanism P, the component transport unit 15, the transport mechanism Q, and the component transport unit 17 are provided in the order in which the electronic components W are transported. As shown in FIGS. 1 and 2, the component transport unit 14 (the same applies to the component transport units 15 and 17) includes a horizontally arranged disk-shaped rotor 20 that rotates around a vertically arranged rotating shaft 19. , a plurality of radially arranged arms 21 each connected to a rotating body 20; vertically elongated nozzles 22 attached to each arm 21 so as to move up and down; and a motor 23 that rotates intermittently.

The nozzle 22 is capable of picking up the electronic component W at its lower end, and conveys the picked up electronic component W by repeating rotation and temporary stoppage around the rotating shaft 19 accompanying the operation of the motor 23 . At some of the stop positions of the arm 21 and the nozzle 22, as shown in FIG. A plurality of support members 26 and a movable body 28 attached to the support members 26 so as to be movable up and down are provided.

Each movable body 28 is lowered by the operation of the motor 29 fixed to the support member 26, comes into contact with the nozzle 22, and pushes down the nozzle 22. A coil spring 30 is attached to the support member 26 to raise the lowered movable body 28, and a coil spring 31 is attached to the nozzle 22 to raise the lowered nozzle 22. As shown in FIG. In FIG. 2, only two sets of arms 21, nozzles 22 and coil springs 31 are shown, and other arms 21, nozzles 22 and coil springs 31 are omitted. 2 shows one support member 26, one movable body 28, one motor 29, and one coil spring 30, but in the present embodiment, a plurality of each are provided.

As shown in FIGS. 1 and 2, a rotary table 32 provided in the measurement unit 11 is arranged below one of the stop positions of the nozzle 22 above which the movable body 28 is provided. A rotary machine 34 is provided between the stop position of the nozzle 22 and the rotary table 32 to acquire the electronic component W sucked by the nozzle 22 and store the electronic component W in a pocket 33 formed on the rotary table 32. It is 1, the description of the rotary machine 34 and other rotary machines having the same design as the rotary machine 34 is omitted.

As shown in FIG. 2, the rotary machine 34 consists of a disk-shaped rotating body 36 rotating around a horizontal rotating shaft 35 attached to a support (not shown) and a plurality of arms 37 fixed to the rotating body 36. and a plurality of chucks 38 respectively attached thereto. Each chuck 38 extending in the radial direction of the rotating body 36 is arranged radially around the rotating body 36 and can move forward and backward relative to the rotating body 36 in the radial direction of the rotating body 36 . Each chuck 38 arranged at an equal pitch can suck the electronic component W at one end (the end on the far side from the center of the rotating body 36) by a suction force.

The rotating body 36 is intermittently rotated by the operation of a motor (not shown), and repeats rotation and temporary stop for the arrangement pitch of the chuck 38 . At the 12 o'clock position, the chuck 38 picks up the electronic component W from the nozzle 22 in the lowered state. Insert part W. The lowered chuck 38 is raised by the coil spring 39 .

As shown in FIG. 1, the measurement unit 11 includes a rotary table 32 that intermittently rotates around a vertically arranged rotary shaft 32a, and also inspects ( In this embodiment, an inspection unit 40 for inspecting electrical characteristics is provided. A heater 27 is provided on the rotary table 32 . The heater 27 heats the electronic component W in the pocket 33 to a predetermined temperature (T1° C.) before it is conveyed to the position where the inspection by the inspection section 40 is performed.

The electronic component W that has been inspected by the inspection unit 40 moves to directly below the chuck 38 by the rotation of the rotary table 32 and is attracted to the chuck 38 . The chuck 38 that has acquired the electronic component W from the rotary table 32 moves to the 12 o'clock position, and the nozzle 22 that has been placed at the raised position descends to acquire the electronic component W from the chuck 38 that is located at the 12 o'clock position. Adsorb.

The electronic component W attracted to the nozzle 22 is moved together with the nozzle 22 by the operation of the motor 23, is transported in a normal temperature atmosphere to a position where a rotary machine having the same design as the rotary machine 34 is provided, and is provided to the rotary machine. . It should be noted that a mechanism different in design from the rotary machine 34 may be used to transfer the electronic component W between the component conveying unit 14 and the measuring unit 11, and the nozzle 22 of the component conveying unit 14 may rotate. It goes without saying that the electronic component W may be directly put into the pocket 33 of the table 32 and the electronic component W may be directly obtained from the pocket 33 of the rotary table 32 .

The rotary machine that has acquired the electronic component W from the nozzle 22 provides the electronic component W to the component relay section 41 of the transport mechanism P shown in FIG. As shown in FIG. 3, the transport mechanism P (the same applies to the transport mechanism Q) includes, in addition to the component relay unit 41, a plurality of (in the present embodiment, five) each of which electronic components W are sent from the component relay unit 41. , a shift section 43 that translates each electronic component carrier 42, and a component delivery section 44 that delivers the electronic component W given from the electronic component carrier 42 toward the component carrier unit 15. I have.

As shown in FIGS. 1 and 3, each electronic component carrier 42 is linear, horizontally provided, and arranged in parallel. Inside each electronic component carrier 42, as shown in FIG. An air inflow space 47 is formed. The transport space 45 is long in the longitudinal direction of the electronic component transport body 42 and is open at both longitudinal ends of the electronic component transport body 42 . The electronic component W delivered from the component relay section 41 enters the transport space 45 from the upstream end (one end in the longitudinal direction) of the transport space 45 . The temperature of the electronic component W is higher than room temperature when it enters the transfer space 45 .

Each of the plurality of air circulation passages 46 is linear, is provided below the transfer space 45 , communicates with the transfer space 45 at its upper end, and communicates with the air inflow space 47 at its lower end. Each airflow passage 46 is inclined such that the upper end is closer to the component feeding section 44 than the lower end. An air inflow space 47 formed below the air flow passage 46 is elongated in the longitudinal direction of the electronic component carrier 42 and communicates with each air flow passage 46 at the upper side.

The transport mechanism P includes an air blowing section (a vacuum pump in this embodiment) 49 connected to a tube 48 communicating with the air inflow space 47 . The air blowing unit 49 sends normal temperature air into the transfer space 45 through the tube 48 , the air inflow space 47 and the plurality of air flow passages 46 , and heats each electronic component W in the transfer space 45 to a temperature of less than T1° C. (this In the embodiment, normal temperature air is blown to move each electronic component W toward the downstream end (the other end in the longitudinal direction) of the transfer space 45, and the normal temperature air is blown to move each electronic component W. is brought close to room temperature (in this embodiment, it is lowered by 60° C. or more).

Therefore, in the present embodiment, the transport mechanism P has the air blowing section 49 as a temperature adjusting section p that brings the temperature of the electronic component W closer to room temperature (in this embodiment, room temperature). Here, the electronic components W moved from the electronic component transporter 42 to the component delivery unit 44 are transported to the measurement unit 12 through the rotary mechanism and the component transport unit 15 having the same design as the rotary mechanism 34 (Fig. 1 ), the transport mechanism P also uses the blowing of air to the electronic component W by the air blowing section 49 to move the electronic component W toward the measurement unit 12 . The electronic component carrier 42 also has a stopper 50 that closes the downstream side of the transport space 45 so that the electronic components W arranged in the transport space 45 do not come out of the transport space 45 .

As shown in FIG. 3, the shift portion 43 includes

linear guides

51 and 52 arranged orthogonally to each electronic component carrier 42 in a plan view, and screw shafts parallel to the

guides

51 and 52. 53, a movable block 54 attached to the lower portion of each electronic component carrier 42 and moving along the guide 51, and a movable block 55 attached to the lower portion of each electronic component carrier 42 and moving along the guide 52. , a nut block 56 fixed to the lower portion of each electronic component carrier 42 and mounted on the screw shaft 53 , and a drive unit 57 for rotating the screw shaft 53 .

The drive unit 57 can rotate the screw shaft 53 clockwise and counterclockwise, and rotates the screw shaft 53 to move the nut block 56 along the screw shaft 53 . As the nut block 56 moves, each electronic component carrier 42 moves (transversely) in a direction orthogonal to the longitudinal direction of each electronic component carrier 42 together with the

movable blocks

54 and 55 . The drive unit 57 moves the plurality of electronic component transport bodies 42 so that the upstream end of one electronic component transport body 42 is moved to the component feeding position (that is, the measurement unit 11 is placed at a position where the electronic component W from 11 can be obtained.

In the electronic component conveying body 42 whose upstream end is arranged at the component delivery position, the electronic components W are intermittently transferred from the component relay section 41 to the conveying space 45 while the downstream side of the conveying space 45 is closed by the stopper 50 . Sent. The electronic component W sent into the transport space 45 is moved within the transport space 45 by the air from the air blower 49 . At the timing when the electronic components W are filled in the transport space 45 of one electronic component transport body 42 upstream of the stopper 50, the drive unit 57 is operated to move each electronic component transport body 42 to move another electronic component transport body. The upstream end of 42 is arranged at the component feeding position, and the electronic component W is fed from the component relay section 41 into the transporting space 45 of the electronic component transporter 42 .

This process is repeated until the electronic components W are filled in the transport spaces 45 of all the electronic component transport bodies 42 upstream of the stoppers 50 . During this time, the electronic components W in the transport space 45 of each electronic component transport body 42 are continuously cooled by the air from the air blower 49 sent to the transport space 45 . After that, the electronic component conveying body 42 to which the electronic components W are first sent from the component relay section 41 to the conveying space 45 is placed in a state where the downstream end thereof is arranged at the component sending position, and the stopper 50 of the electronic component conveying body 42 is moved. is opened so that the electronic component W is delivered from the downstream end of the transfer space 45 to the component delivery section 44 . The electronic component W is at room temperature by the time it is sent out from the downstream end of the transfer space 45 by air blowing.

In this way, by arranging the electronic component carriers 42 in parallel, the electronic components W can be brought closer to room temperature (the temperature of the electronic components W can be lowered by a predetermined value or more) without increasing the transport distance of one electronic component carrier. (or raised) can be secured, and an increase in the size of the electronic component inspection apparatus for bringing the electronic component W closer to room temperature can be prevented.

As shown in FIG. 1, the electronic components W sent out from the transfer space 45 to the component sending unit 44 are sent to a rotary machine having the same design as the rotary machine 34, the component transfer unit 15, and a rotary machine having the same design as the rotary machine 34. to the measurement unit 12 . The measurement unit 12 includes a rotary table 60 in which pockets 59 are formed at equal pitches, and an inspection section 61 that inspects the electrical characteristics of the electronic components W in the pockets 59 . The rotary table 60 has a Peltier element 62 and cools the electronic component W in the pocket 59 to a predetermined temperature (T2° C.) before it is transported to the position where the inspection section 61 inspects it.

Here, since the Peltier element 62 cools the electronic component W from a normal temperature state, the electronic component W is located at a position where the inspection by the inspection unit 61 is performed, compared to cooling the electronic component W from a temperature higher than the normal temperature. The temperature of the electronic component W can be stably lowered to a predetermined value by the time it is transported. The electronic component W that has been inspected by the inspection unit 61 is returned from the rotary table 60 to the component conveying unit 15 via the rotary machine of the same design as the rotary machine 34, and is returned to the conveying mechanism Q via the rotary machine of the same design as the rotary machine 34. transported to

The conveying mechanism Q has the same design as the conveying mechanism P, and brings the electronic components W supplied from the measurement unit 12 through the rotary machine, the component conveying unit 15 and the rotary machine in this order closer to room temperature (in the present embodiment, the electronic components W temperature control section q (air blowing section in the present embodiment) for increasing the temperature of 20° C. or more. The electronic component W brought to near room temperature (in this embodiment, at room temperature) by the transport mechanism Q is sent to the component transport unit 17 via a rotary machine having the same design as the rotary machine 34, whereupon the component transport unit 17, the measurement unit 18 provided near the component conveying unit 17 inspects the electrical characteristics at T3° C. (normal temperature in the present embodiment) (that is, the measurement The unit 18 inspects the electronic component W inspected by the measuring unit 12 at T3° C.). Therefore, the transport mechanism Q moves the electronic component W toward the measuring unit 18 .

As described above, according to the present disclosure, the electronic component inspection apparatus 10 includes the first measurement unit 11 that heats or cools the electronic component W to the first temperature T1 ° C., and the first a second measuring unit that inspects the electronic component W inspected by the measuring unit 11 at a second temperature T2° C. different from the first temperature T1° C.; 2, and a transport mechanism P that transports the sample toward the second measurement unit. The transport mechanism P includes an air blowing unit that blows air having a temperature different from the first temperature T1° C. to the electronic component W to bring the temperature of the electronic component W closer to room temperature, and a plurality of electronic components W moving in the same direction. A component conveying body 42 and a plurality of electronic component conveying bodies 42 arranged in parallel in a direction perpendicular to the moving direction of the electronic component W are moved in a direction perpendicular to the moving direction of the electronic component W to perform one electronic component conveying. and a drive unit 57 that arranges the upstream end of the body 42 in the movement direction of the electronic component W at a position where the electronic component W from the first measurement unit 11 can be obtained.

Although the embodiments have been described above, the present invention is not limited to the above-described forms, and all changes in conditions that do not deviate from the gist of the invention are within the scope of the present invention. For example, the transport mechanism P (the same applies to the transport mechanism Q) may have only one electronic component transport body. When the transport mechanism P (the same applies to the transport mechanism Q) has a plurality of electronic component transport bodies, the plurality of electronic component transport bodies need not be arranged in parallel. Also, as shown in FIG. 4, a plurality of electronic component transport bodies 64 are attached to the side surface of a cylindrical rotating body 65 whose axis is horizontally arranged. , the electronic component W from the first measuring unit may be placed in a position where it can be obtained. The electronic component carrier is not limited to a linear shape, and may be arc-shaped, for example.

Further, it is not necessary to adopt an air blowing part as the temperature adjusting part p (the same applies to the temperature adjusting part q). For example, as shown in FIG. A heat sink 66 may be employed. In other words, the temperature adjusting part p (the same applies to the temperature adjusting part q) does not simply bring the electronic parts W in a state of being higher or lower than the room temperature to the room temperature in a room temperature atmosphere, but actively dissipates the heat from the electronic parts W. Alternatively, any material that actively absorbs heat from the electronic component W to bring it closer to room temperature may be used.

Furthermore, the transport mechanisms P, Q may not be of identical design, nor may the first, second and third measuring units be of identical design. Needless to say, the first measurement unit (the same applies to the second and third measurement units) is not limited to the one in the above embodiment. It may also be one that rotates to

The first, second, and third measuring units do not need to be arranged at the same height position. For example, the second measuring unit is arranged directly below the first measuring unit, A third measurement unit may be placed directly below the unit. In this case, transport mechanisms P and Q having electronic component transports that are long in the vertical direction are employed.

Also, if the inspection of the electronic parts only needs to be performed at T1° C. and T2° C., the third measuring unit and the transport mechanism Q are omitted. In this case, for example, there are a pattern of T1°C>normal temperature>T2°C and a pattern of T2°C>normal temperature>T1°C. In this respect, when the electronic component is inspected at T1°C, T2°C, and T3°C, in addition to the pattern of T1°C>T3°C (=room temperature)>T2°C, for example , T2°C>T3°C (=room temperature)>T1°C. In the case of the pattern of T2°C>T3°C (=normal temperature)>T1°C, the first measurement unit cools the electronic component to T1°C and inspects it. Further, by setting the temperature of the air blown onto the electronic component by the air blowing unit to be higher than T1° C., the electronic component can be brought close to room temperature. Therefore, the air blowing section blows air having a temperature different from T1° C. to the electronic component, thereby bringing the electronic component closer to room temperature.

Here, for example, in the order in which the electronic components are conveyed, measurement unit a for normal temperature inspection, transport mechanism j, measurement unit b for inspection at temperatures higher than normal temperature, transport mechanism k, measurement for measurement at temperatures lower than normal temperature When the unit c is provided, the measurement units b and c are the first and second measurement units respectively, the transport mechanism k is the transport mechanism P, and the measurement unit a is the first, second and third measurement units. It does not correspond to any of the units, and the transport mechanism j does not correspond to any of the transport mechanisms P and Q.

This application is based on a Japanese patent application (Japanese Patent Application No. 2021-039426) filed on March 11, 2021, the contents of which are incorporated herein by reference.

10: Electronic component inspection device, 11, 12: Measuring unit, 14, 15: Parts conveying unit, 17: Parts conveying unit, 18: Measuring unit, 19: Rotating shaft, 20: Rotating body, 21: Arm, 22: Nozzle , 23: motor, 24: support, 25: plate, 26: support member, 27: heater, 28: movable body, 29: motor, 30, 31: coil spring, 32: rotary table, 32a: rotary shaft, 33 : pocket, 34: rotary machine, 35: rotating shaft, 36: rotating body, 37: arm, 38: chuck, 39: coil spring, 40: inspection unit, 41: parts relay unit, 42: electronic parts carrier, 43 : shift part, 44: parts delivery part, 45: transfer space, 46: air flow path, 47: air inflow space, 48: tube, 49: air blowing part, 50: stopper, 51, 52: guide, 53: screw Shaft 54: Movable block 55: Movable block 56: Nut block 57: Drive unit 59: Pocket 60: Rotary table 61: Inspection unit 62: Peltier element 64: Electronic component carrier 65: Rotating body, 66: heat sink, P: transport mechanism, Q: transport mechanism, W: electronic component

Claims

a first measurement unit that heats or cools the electronic component to a first temperature (T1) for inspection;
a second measuring unit that tests the electronic component tested by the first measuring unit at a second temperature (T2) different from the first temperature (T1);
a first transport mechanism (P) transporting the electronic component provided from the first measurement unit toward the second measurement unit;
with
The first transport mechanism (P) has a first temperature adjustment section (p) that brings the temperature of the electronic component close to normal temperature,
Electronic component inspection equipment.
The first transport mechanism (P) has, as the first temperature adjustment unit (p), an air blowing unit that blows air having a temperature different from the first temperature (T1) onto the electronic component,
The first transport mechanism (P) also uses the air blowing by the air blowing unit to move the electronic component toward the second measurement unit.
The electronic component inspection apparatus according to claim 1.
The first transport mechanism (P) moves a plurality of electronic component transport bodies arranged in parallel, and laterally moves the plurality of electronic component transport bodies to move the upstream end of one electronic component transport body to a drive unit that positions the electronic component from the first measurement unit in a retrievable position;
3. The electronic component inspection device according to claim 1 or 2.
Furthermore,
a third measurement of inspecting the electronic component inspected by the second measuring unit at a third temperature (T3) different from both the first temperature (T1) and the second temperature (T2); a unit;
A second transfer mechanism (Q) having a second temperature adjustment section (q) for bringing the electronic component supplied from the second measuring unit closer to room temperature, and for moving the electronic component toward the third measuring unit. When,
The electronic component inspection device according to any one of claims 1 to 3, comprising: