WO2022191124A1

WO2022191124A1 - Electronic component inspection apparatus

Info

Publication number: WO2022191124A1
Application number: PCT/JP2022/009695
Authority: WO
Inventors: 一矢大場
Original assignee: 上野精機株式会社
Priority date: 2021-03-11
Filing date: 2022-03-07
Publication date: 2022-09-15
Also published as: JP2022139163A

Abstract

This electronic component inspection apparatus has an electrical characteristic measurement unit, a conveying machine, a measurement table, and a control unit. The electrical characteristic measurement unit has a measurement unit. The measurement unit has a probe that contacts a terminal on a first surface of an electronic component. The measurement table has a component arrangement part and a temperature control part. A second surface of the electronic component contacts the component arrangement part. The temperature control part adjusts the temperature of the electronic component on the component arrangement part. The control unit controls the temperature control part so that an electronic component conveyed to a measurement position is at a prescribed temperature.

Description

Electronic component inspection equipment

The present disclosure relates to an electronic component inspection device that inspects electrical characteristics of electronic components.

The electrical characteristics of electronic components are inspected by bringing a probe such as a probe into contact with the electronic component (see Patent Documents 1 and 2). Depending on the type of electronic component, electrical characteristics are inspected while the electronic component is heated to a predetermined temperature.

In conventional equipment, electronic components are heated or cooled by one mechanism, then transferred to another mechanism, and the electrical characteristics of the electronic components are inspected by this other mechanism. In this case, the temperature of the electronic component during the electrical characteristic test is affected by the ambient temperature. In order to suppress the influence of the ambient temperature, it is conceivable to cover the transport path of the electric parts with a heat insulating material or the like to maintain the temperature of the heated or cooled electronic parts, but the effect is limited.

Japanese Patent Application Laid-Open No. 2003-215210 Japanese Patent Application Laid-Open No. 2015-105834

The present disclosure relates to an electronic component inspection apparatus that stably heats an electronic component to a predetermined temperature when inspecting electrical characteristics.

An electronic component inspection device inspects electrical characteristics of an electronic component having a first surface and a second surface opposite to the first surface. An electronic component inspection apparatus includes an electrical property measurement unit, a carrier that transports electronic components, a measurement table, and a controller. The electrical property measurement unit has a measurement section. The measurement unit has a probe that contacts a terminal provided on the first surface side of the electronic component. The measurement table has a component placement section and a temperature control section. The component placement section is configured such that the electronic component provided from the carrier at the acquisition position is placed in the component placement section with the second surface of the electronic component in contact with the component placement section. The temperature control section is configured to heat or cool the electronic components arranged in the component placement section to adjust the temperature thereof. The measurement table is configured to transport the electronic component through the measurement position where the probe touches the terminal to the return position where the electronic component is returned to the carrier. The control unit is configured to control and adjust the temperature control unit so that the electronic component transported to the measurement position reaches a predetermined temperature. Therefore, according to the electronic component inspection apparatus of the present disclosure, it is possible to stably bring the electronic component to a predetermined temperature when inspecting the electrical characteristics.

FIG. 1 is an explanatory diagram of an electronic component inspection apparatus according to an embodiment. FIG. 2 is an explanatory diagram of an electronic component inspection apparatus. FIG. 3 is a block diagram showing connections of the control unit. FIG. 4A is an explanatory diagram of a mechanism for bringing the probe into contact with the terminal of the electronic component. FIG. 4B is an explanatory diagram of a mechanism for bringing the probe into contact with the terminal of the electronic component. FIG. 5 is an explanatory diagram of a mechanism for stably inserting an electronic component into the recess of the component placement portion. FIG. 6 is an explanatory diagram of a modification in which a plurality of measurement positions are provided. FIG. 7 is an explanatory diagram of a conveying machine in which the support member can move in a direction perpendicular to the rotation axis of the rotating body.

An embodiment of the present disclosure will be described with reference to the attached drawings. As shown in FIGS. 1 and 2, an electronic component inspection apparatus 10 according to the embodiment has an electrical property measurement unit 12. As shown in FIG. The electrical characteristic measuring unit 12 has a measuring section 11a having a probe 11 that contacts a terminal W3 provided on the surface W1 (first surface) of the electronic component W. As shown in FIG. The electronic component inspection device 10 is a device that inspects the electrical characteristics of the electronic component W. As shown in FIG. The electronic component inspection apparatus 10 has a transporter 13 that transports the electronic component W and a measurement table 14 . The measurement table 14 moves the electronic component W given from the carrier 13 at the acquisition position P1 to the return position P3 where the electronic component W is returned to the carrier 13 via the measurement position P2 where the probe 11 contacts the terminal W3. transport to.

As shown in FIG. 1, the electronic component W whose electrical characteristics are to be inspected is plate-shaped and has a surface W1 and a surface W2. A plurality of terminals W3 are provided on the surface W1. A surface W2 (second surface) arranged on the opposite side of the surface W1 is parallel to the surface W1 and formed flat. Electronic components W are, for example, diodes, transistors, capacitors, inductors, and ICs (Integrated Circuits). In addition, the electronic component W does not need to be plate-shaped as long as terminals are provided on one surface (first surface). For example, it may be a cubic electronic component.

As shown in FIGS. 1 and 2, the conveying machine 13 includes a plate-like rotating body 16 to which a plurality of supporting members 15 are attached so as to be able to move up and down, and a plurality of pressing portions 17 that press down the supporting members 15 respectively. The rotating body 16 is horizontally arranged. As shown in FIG. 2 , a rotating shaft 18 arranged vertically is connected to the center of the rotating body 16 . A driving force is applied to the rotating body 16 from a servomotor (not shown) through a rotating shaft 18, and the rotating body 16 rotates intermittently.

Support members 15 that are long in the vertical direction are provided at regular intervals along the circumferential direction of the outer peripheral portion of the rotating body 16 . The support member 15 sucks the surface W2 of the electronic component W at the lower end portion of the support member 15 by vacuum pressure, and releases the sucked electronic component W by breaking the vacuum or releasing it to the atmosphere. A coil spring 19 is attached to each supporting member 15 attached to the rotating body 16 so as to be able to move up and down. The interval between the support members 15 attached to the rotating body 16 is set to X°, and the rotating body 16 repeats rotation of X° and pause.

In a horizontal state in which the surface W2 of the electronic component W is attracted to the support member 15 and the surface W1 is placed downward, the electronic component W intermittently moves together with the support member 15 due to the intermittent rotation of the rotor 16. . Depressing portions 17 are provided above the rotor 16 at some of the positions where the support member 15 temporarily stops. A turner 20 for acquiring the electronic component W from the rotating body 16 is provided below the rotating body 16 at one of the positions where the pressing portion 17 is provided at the temporary stop position of the supporting member 15 .

The pressing portion 17 has a pusher 22 attached to the guide 21 so as to be able to move up and down, and a drive source (servo motor in this embodiment), not shown, for moving the pusher 22 up and down. The pusher 22 descends to contact the support member 15 , push down the electronic component W supported by the support member 15 together with the support member 15 , and deliver the electronic component W to the turner 20 . The turner 20 has a suction portion 23 that suctions the surface W1 of the electronic component W. As shown in FIG. , the turner 20 is supported around a horizontal shaft 24, which is an example of a shaft member. The turner 20 rotates intermittently to transfer the electronic component W acquired from the support member 15 to the rotating body 16 and the cylindrical measurement table 14 provided at a position lower than the turner 20 . Therefore, the measuring table 14 receives the electronic component W from the carrier 13 via the turner 20 .

The measurement table 14 has a component placement section 26 , a temperature control section 27 and a temperature detection section 28 . The electronic component W provided from the transfer machine 13 via the turner 20 is placed on the component placement section 26 with the surface W2 in contact with the component placement section 26 . The temperature control unit 27 heats the electronic components W arranged in the component placement unit 26 to adjust the temperature. The temperature detection unit 28 measures the temperature. Therefore, the turner 20 transfers the electronic component W whose surface W2 is sucked to the support member 15 to the component placement unit 26 so that the component placement unit 26 acquires the electronic component W with the surface W2 sucked. That is, the turner 20 is an example of a repeater that acquires the electronic component W from the transfer machine 13 by sucking the surface W<b>1 and provides the electronic component W to the component placement section 26 .

In this embodiment, the electronic component inspection device 10 has N component placement sections 26 . One temperature control section 27 is provided below each component placement section 26 . A temperature detection section 28 is provided in each component placement section 26 . However, N is an integer of 2 or more. Therefore, there are N temperature control units 27 and N temperature detection units 28 . The N component placement portions 26 , the N temperature control portions 27 and the N temperature detection portions 28 are fixed to the outer peripheral portion of the rotating body 29 of the measurement table 14 . The rotating body 29 is circular in plan view.

The central side of the rotor 29 protrudes upward. The rotating body 29 intermittently rotates around a vertical axis (not shown). The rotating body 29 rotates to return the electronic components W placed in the component placement section 26 together with the component placement section 26, the temperature control section 27, and the temperature detection section 28 from the acquisition position P1 via the measurement position P2. The electronic component W is conveyed to the position P3 (the position where the electronic component W is returned to the conveyor 13 via the turner 20). The acquisition position P<b>1 is a position where the component placement unit 26 acquires the electronic component W from the turner 20 . That is, the measurement table 14 has a rotating body 29 that rotates and moves the electronic component W to the return position P3 via the measurement position P2. Each temperature control section 27 moves together with each component placement section 26 as the rotor 29 rotates. Although the acquisition position P1 and the return position P3 are the same in this embodiment, they may be different.

A recess 30 for housing the electronic component W is formed on the upper surface side of the component placement portion 26 . The component placement section 26 sucks the surface W2 of the electronic component W housed in the recess 30 by vacuum pressure, and releases the sucked electronic component W by breaking the vacuum or releasing it to the atmosphere. In this embodiment, the temperature control section 27 is a heater. The temperature control section 27 is arranged in the vicinity of the recess 30 directly below the recess 30 of the component placement section 26 .

The temperature detection section 28 is arranged adjacent to each component placement section 26 and the temperature control section 27 . Therefore, the temperature detection section 28 can stably measure the temperature of the electronic component W placed in each component placement section 26 . That is, each of the N temperature control sections 27 corresponds to the N component placement sections 26 on a one-to-one basis. Here, that the temperature control portion 27 corresponds to the component placement portion 26 means that the electronic component W whose temperature is to be adjusted by the temperature control portion 27 is placed in the component placement portion 26 . Further, when it is necessary to test the electrical characteristics of the electronic component W at a temperature lower than the ambient temperature, a temperature control unit (for example, a Peltier element) that cools the electronic component W is adopted instead of the temperature control unit 27. .

Each temperature control unit 27 and each temperature detection unit 28, as shown in FIG. , which controls the temperature control unit 27). The control unit 31 can continuously or intermittently detect the measured value of each temperature detection unit 28, controls the heating level of each temperature control unit 27 based on the measurement value of each temperature detection unit 28, and reaches the measurement position P2. The temperature of the conveyed electronic component W is adjusted to a predetermined temperature.

The power supply and control unit 31 that supply power to each temperature control unit 27 and each temperature detection unit 28 are provided so as not to rotate together with the rotating body 29. It is electrically connected to the portion 28 using a slip ring. As a result, while the rotating body 29 is rotating, power supply to each temperature control unit 27 and each temperature detection unit 28 and signal transmission between each temperature control unit 27 and each temperature detection unit 28 and the control unit 31 are stable. is performed on

At the measurement position P2, as shown in FIG. 1, the temperature control section 27 is arranged below (one side) of the electronic component W arranged in the component placement section 26, and the temperature control section 27 is arranged above (the other side). A child 11 is placed. The measuring section 11a of the electrical property measuring unit 12 has a probe 11 and a movable member 32 movably attached to a member (not shown). The probe 11 is fixed to the movable member 32 . In the electrical characteristic measuring unit 12, the movable member 32 (measuring section 11a) descends toward the electronic component W attracted to the component placement section 26 arranged directly below the probe 11, and the probe 11 moves downward toward the electronic component W. An electrical characteristic test of the electronic component W is performed by contacting the terminal W3 of W.

In this way, by inspecting the electrical characteristics of the electronic component W on the temperature-adjustable measurement table 14 for the electronic component W, when inspecting the electrical characteristics of the electronic component W, the electronic component W can be stably measured at a predetermined level. temperature can be. After the electrical property inspection of the electronic component W is completed, the movable member 32 and the probe 11 are lifted before the electronic component W is moved, and the probe 11 is brought out of contact with the terminal W3. After completion of the electrical property inspection, the electronic component W is transferred from the component placement section 26 to the support member 15 by the turner 20 at the return position P3.

In addition, in the present embodiment, the measurement table 14 has a cylindrical member 33 that is provided near the rotating body 29 and covers the entire side surface of the rotating body 29 and part of the upper surface of the rotating body 29 . Most of the inside of the tubular member 33 is composed of a heat insulating material 34 , and the rotating body 29 has a heat insulating material 35 in the vicinity of each component placement portion 26 and each temperature control portion 27 . The electronic component W attracted to the component placement portion 26 is in a heat insulating state by the tubular member 33 and the rotor 29 together with the component placement portion 26 and the temperature control portion 27 .

Here, depending on the material or the like of the component placement portion 26, the electronic component W placed in the component placement portion 26 is heated by the temperature control portion 27, and the component placement portion 26 and the like expand (when the electronic component W cools down). contract), and the position of the electronic component W placed in the component placement section 26 with respect to the reference position of the measurement table 14 (for example, the center position of the measurement table 14) may change. Depending on the change level of the position of the electronic component W, the probe 11 cannot contact the terminal W3 of the electronic component W at the measurement position P2.

Therefore, as shown in FIGS. 4A and 4B, an image pickup unit 37 (first image pickup unit) that picks up an image of the electronic component W placed at the measurement position P2, and a terminal W3 of the electronic component W from the image pickup image of the image pickup unit 37. A position determination unit 38 for detecting the position and determining the position of the probe 11 for contacting the probe 11 with the terminal W3 at the measurement position P2 is provided to ensure that the probe 11 is brought into contact with the terminal W3 at the measurement position P2. may be brought into contact with the

The position determination unit 38, which can be configured by a microchip or the like, is connected to a drive source (not shown) for moving the probe 11 together with the movable member 32 of the electrical property measurement unit 12, and the imaging unit 37, as shown in FIG. 4A. there is The imaging unit 37 captures an image of the electronic component W placed at the measurement position P2 while the stylus 11 is not in contact with the terminal W3, and sends the captured image to the position determination section 38 . The position determination unit 38 determines the positions of the movement destinations of the probe 11 and the movable member 32 based on the captured image acquired from the imaging unit 37, and moves the probe 11 and the movable member 32 by transmitting command signals to the drive source. to bring the probe 11 into contact with the terminal W3 of the electronic component W as shown in FIG. 4B.

Here, the image capturing unit 37 captures an image of the component placement section 26 on which the electronic component W is placed in a state where the electronic component W is placed at the measurement position P2, and the position determination section 38 captures the component placement section 26. The position of the terminal W3 of the electronic component W may be detected from the captured image (for example, by detecting the position of the recess 30). Further, the imaging unit 37 images the electronic component W heading from the acquisition position P1 to the measurement position P2 (that is, the electronic component W before reaching the measurement position P2), and the position determination unit 38 determines the electronic component W from the captured image. and detecting (estimating) the position of the terminal W3 of the electronic component W, and placing the electronic component W in a state where the imaging unit 37 is arranged at a position facing the measurement position P2 from the acquisition position P1. It is also possible to pick up an image of the placed component placement section 26 and have the position determining section 38 detect (estimate) the position of the terminal W3 of the electronic component W from the captured image.

Also, depending on the expansion (or contraction) of the component placement section 26 and the like caused by heating (or cooling) by the temperature control section 27 and the difference in the positions of the recesses 30 formed in the component placement section 26, the turner at the acquisition position P1 may When the electronic component W is put into the depression 30 of the component placement portion 26 by the electronic component 20 , the electronic component W contacts the periphery of the depression 30 of the component placement portion 26 . The contact of the electronic component W with the periphery of the recess 30 of the component placement portion 26 is not preferable because the electronic component W may be damaged.

Therefore, in order to prevent the electronic component W from contacting the periphery of the recess 30, as shown in FIG. Unit 36 (second imaging unit) and positional deviation of recess 30 (i.e., component placement location where electronic component W is placed in component placement section 26) is detected based on the captured image of imaging unit 36, and component placement section A position adjusting unit 36a for adjusting the positions of the 26 depressions 30 may be provided.

The position adjustment unit 36a that adjusts the position of the depression 30 of the component placement section 26 includes, for example, an information processing section that detects the position of the depression 30 from the captured image of the imaging unit 36, and a motor that rotates the rotating body 29. Then, the information processing unit determines the rotation angle of the rotating body 29 by the motor, and at the acquisition position P1, the depression 30 is made to match or approach the reference position, and in addition to the motor rotating the rotating body 29, the rotating body 29 in the X-axis and the Y-axis. In addition, in the example shown in FIG. 5, the imaging unit 36 images the dent 30 via a prism (an example of the optical path adjustment unit) 36b.

Here, instead of the position adjustment unit 36a, a position adjustment unit that adjusts the position of the electronic component W before placement within the recess 30 of the component placement section 26 may be used. Therefore, the position adjustment unit may adjust the position of at least one of the electronic component W before placement in the recess 30 of the component placement section 26 and the recess 30 of the component placement section 26 . As a position adjustment unit for adjusting the position of the electronic component W, for example, an information processing unit that detects the position of the recess 30 from the captured image of the imaging unit 36, and an electronic component W attracted to the turner 20 together with the turner 20 are moved. It is possible to employ a device having a drive unit that allows In this case, an imaging unit for imaging the electronic component W attracted to the turner 20 is provided separately from the imaging unit 36, and an image captured by the imaging unit (an image obtained by imaging the positional deviation of the electronic component W with respect to the turner 20) and The direction and length of movement of the turner 20 may be determined from the captured image of the imaging unit 36 .

Further, in the present embodiment, the temperature control section 27 is attached to the rotating body 29, but the measurement table 14 is attached to the cylindrical member 33 instead of (or in addition to) the temperature control section 27. A temperature control section may be provided to heat or cool the electronic component W arranged in the component placement section 26 by the temperature control section. The temperature control unit is provided, for example, on the upper side of the measurement table 14 so as to cover the electronic component W from above. When the temperature control section is provided on the upper side of the measurement table 14, the acquisition position P1, the return position P3, the position where the electronic component W or the component placement section 26 is imaged by the imaging unit J, and the component placement section 26 by the imaging unit K. The temperature control unit can be provided in an area excluding locations corresponding to respective positions where the is imaged. A temperature control section can be provided at a location corresponding to the measurement position P2 by forming a through hole in the temperature control section through which the probe 11 can be inserted.

Although the embodiments have been described above, the present invention is not limited to the above-described forms, and all changes in conditions that do not deviate from the gist of the invention are within the scope of the present invention. For example, the temperature detection unit may not be provided. When the temperature detection unit is not provided, the electronic component can be brought to a predetermined temperature by, for example, the following procedure. 1) Create a graph showing the relationship between the temperature and the electrical resistance from the values of the temperature and the electrical resistance of the electronic component that are measured in advance based on a sample of the electronic component. 2) Heating or cooling an electronic component with an electronic component inspection device, measuring the resistance of the electronic component, deriving the temperature of the electronic component using a graph based on the measured resistance value, and bringing the electronic component to a predetermined temperature. determine the heating or cooling level for

In addition, when providing the temperature detection part, it is possible to provide the temperature detection part in the vicinity of the component arrangement part. Furthermore, it is not necessary to adopt a component placement section that sucks the electronic component, and for example, a component placement section that clamps and fixes the electronic component may be employed. When adopting a component placement section that attracts an electronic component, it is possible to select a component placement section that statically attracts the electronic component. Also, there may be one component placement section, one temperature control section, and one temperature detection section. Furthermore, it is also possible to provide a plurality of measurement tables for one transfer machine. For example, two measurement tables may be provided, one measuring table cooling the electronic component to inspect the electrical characteristics, and the other measuring table heating the electronic component to inspect the electrical characteristics.

Also, the number of measurement positions is not limited to one. For example, as shown in FIG. 6, a plurality of measurement positions P2, P2′, and P2″ are provided for one measurement table 14, and electrical characteristic measurement units corresponding to the measurement positions P2, P2′, and P2″ are provided. 12, 12', 12''. In addition, in FIG. 6, the same code|symbol is attached|subjected to the structure similar to the electronic component inspection apparatus 10 (it is the same below). At the measurement positions P2, P2', and P2'', different electrical characteristic tests (for example, Rg measurement, L load characteristic, and DC test) are performed.

Further, the carrier does not have to have a rotating body that rotates around a vertically arranged rotating shaft. For example, a carrier having a rotating body that rotates around a horizontally arranged rotating shaft is used. Adoptable. When a carrier having a rotating body that rotates about a horizontal axis of rotation is employed, the turner 20 in the electronic component inspection apparatus 10 is set at the 3 o'clock position instead of the 12 o'clock position to obtain the electronic component from the carrier. It should be adjusted so that it is delivered to the measurement table at the 6 o'clock position.

Further, the conveying machine is not limited to one in which the support member that supports the electronic component moves parallel to the rotating shaft of the rotating body. For example, as shown in FIG. 7, the support member 39 supporting the electronic component W is positioned perpendicular to the rotating shaft 41 of the rotating body 40 (in this example, the rotating shaft 41 is arranged horizontally). A carrier 50 attached to the rotating body 40 via an arm 42 so as to be movable radially with respect to 40 can be employed. When the carrier 50 is employed, the carrier 50 may place the electronic components directly on the component placement section of the measurement table, or may place the electronic components via a repeater.

When no repeater is provided, for example, the support member of the conveying machine that has adsorbed the first surface of the electronic component directly provides the electronic component to the component placement section, causing the second surface of the electronic component to come into contact with the component placement section. state can be made. And when a repeater is provided, it is possible to employ a repeater that grips the electronic component instead of a repeater that sucks the electronic component.

This application is based on a Japanese patent application (Japanese Patent Application No. 2021-039424) filed on March 11, 2021, the contents of which are incorporated herein by reference.

10: Electronic component inspection device, 11: Probe, 11a: Measuring part, 12, 12', 12'': Electrical property measuring unit, 13: Conveyor, 14: Measuring table, 15: Supporting member, 16: Rotating body , 17: pressing portion, 18: rotating shaft, 19: coil spring, 20: turner, 21: guide, 22: pusher, 23: adsorption portion, 24: horizontal shaft, 26: component placement portion, 27: temperature control portion, 28: temperature detection unit, 29: rotating body, 30: recess, 31: control unit, 32: movable member, 33: cylindrical member, 34, 35: heat insulating material, 36: imaging unit, 36a: position adjustment unit, 36b: Prism, 37: Imaging unit, 38: Positioning unit, 39: Supporting member, 40: Rotator, 41: Rotating shaft, 42: Arm, 50: Conveyor, P1: Acquisition position, P2, P2', P2'' : measurement position, P3: return position, W: electronic component, W1: first surface, W2: second surface, W3: terminal

Claims

An electronic component inspection apparatus for inspecting electrical characteristics of an electronic component having a first surface and a second surface opposite to the first surface,
an electrical property measurement unit;
a conveying machine that conveys the electronic component;
a measuring table;
a control unit;
and
The electrical property measurement unit includes a measurement section,
The measurement unit includes a probe that contacts a terminal provided on the first surface side of the electronic component,
The measurement table includes a component placement section and a temperature control section,
The component placement section is configured such that the electronic component provided from the carrier at the acquisition position is placed in the component placement section with the second surface of the electronic component in contact with the component placement section. ,
The temperature control unit is configured to heat or cool the electronic components arranged in the component placement unit to adjust the temperature thereof,
The measurement table is configured to convey the electronic component to a return position where the electronic component is returned to the conveying machine via a measurement position where the probe contacts the terminal,
A control unit is configured to control and adjust the temperature control unit so that the electronic component transported to the measurement position reaches a predetermined temperature,
Electronic component inspection equipment.
Furthermore,
a first imaging unit;
a positioning unit;
and
The first imaging unit includes: the electronic component placed at the measurement position; the component placement section on which the electronic component placed at the measurement position is placed; , or configured to capture an image of the component placement unit on which the electronic component is placed from the acquisition position toward the measurement position,
The position determination unit detects the position of the terminal of the electronic component from the captured image of the first imaging unit, and determines the position of the probe for bringing the probe into contact with the terminal. consists of
The electronic component inspection apparatus according to claim 1.
The measurement table has a rotating body,
The temperature control section and the component placement section are attached to the rotating body,
the rotating body is configured to rotate to move the electronic component to the return position via the measurement position;
The temperature control section is configured to move together with the component placement section as the rotating body rotates.
3. The electronic component inspection device according to claim 1 or 2.
Furthermore,
a second imaging unit;
a positioning unit;
and
the second imaging unit is configured to capture an image of the component placement section in which the electronic component is not placed;
The position adjustment unit detects a positional deviation of a component placement location where the electronic component is placed in the component placement section based on the captured image of the second imaging unit, and detects the electronic component before placement in the component placement section. and configured to adjust the position of at least one of the component placement locations,
The electronic component inspection apparatus according to any one of claims 1 to 3.