JP2016130714A - Measuring device and aligning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a measuring device capable of preferably aligning a measurement stage before and after replacement.SOLUTION: A measuring device 100 comprises a measurement stage 3M, a reference stage 3S, and a table 30. An LED chip 50 is placed on the measurement stage 3M. The reference stage 3S is used to align the measurement stage 3M. The table 30 moves any of the measurement stage 3M and the reference stage 3S to a measurement position. The measuring device aligns the measurement stage 3M so that the position of the reference stage 3S when the reference stage 3S exists at the measurement position matches the position of the measurement stage 3M when the measurement stage 3M exists at the measurement position.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a measuring apparatus that measures electrical characteristics by bringing an inspection needle into contact with an electronic component.

  2. Description of the Related Art Conventionally, in order to measure each electrical characteristic of a measurement object such as a semiconductor chip, a semiconductor measurement device having a probe that measures the electrical characteristic of the measurement object with a stylus of an inspection needle has been known. Yes. Various methods have been proposed for positioning the probe inspection needle (probe needle) before the inspection. For example, in Patent Document 1, an image obtained by photographing the positional relationship between the probe needle and the electronic component is displayed on the display regarding the alignment after the replacement of the probe needle, and the user refers to the image to move the probe needle. An inspection system for performing is disclosed.

JP 2005-189239 A

  In measurement using an LED as a measurement object, measurement is performed by placing the measurement object on a stage (measurement stage) and bringing the probe needle into contact with the measurement object. In this case, since the measurement stage is a consumable item and needs to be replaced, there is a problem that the installation position of the measurement stage is shifted every time the measurement stage is replaced, and it takes time to align the probe needle.

  The present invention has been made to solve the above-described problems, and a main object of the present invention is to provide a measuring apparatus capable of suitably performing positioning of a measuring stage.

  The invention described in claim is a measurement apparatus, a measurement stage which is a stage on which a measurement object is placed, a reference stage which is a stage for aligning the measurement stage, the measurement stage, A moving unit that is installed with the reference stage and moves either the measurement stage or the reference stage to a measurement position, and the measurement stage has a position when the reference stage exists at the measurement position; Alignment is performed so that the position when the measurement stage is present at the measurement position coincides.

  In the invention described in claim, a measurement stage that is a stage on which a measurement object is placed, a reference stage that is a stage for aligning the measurement stage, the measurement stage, and the reference stage include An alignment method executed by a measurement apparatus that includes a moving unit that is installed and moves either the measurement stage or the reference stage to a measurement position, wherein the measurement stage is the measurement position. And a position alignment step for performing alignment so that the position when the measurement stage exists at the measurement position matches the position when the measurement stage exists at the measurement position.

1 shows a schematic configuration of a measuring apparatus. It is an example of arrangement | positioning of the measurement stage and reference | standard stage on a table. An image taken by a fixed point camera is shown. It is the image which image | photographed the mode of the position alignment in the XY plane of a probe needle. The state of alignment of the probe needle in the Z-axis direction is shown. The state of measuring the height of the measurement stage is shown. The state before and after the contact operation is shown. The state transition at the time of the needle alignment operation in the case where there are two electrodes on the upper surface of the LED chip is shown. The state transition at the time of the needle alignment operation in the case where there are electrodes on the front and back of the LED chip is shown. It is the example of arrangement | positioning of the measurement stage and reference | standard stage which concern on a modification. (A) shows the top view of the table which concerns on a modification. (B) shows an image displayed on the display when positioning the measurement stage.

  According to a preferred embodiment of the present invention, the measurement apparatus includes a measurement stage on which a measurement object is placed, a reference stage that is a stage for aligning the measurement stage, and the measurement stage. And a moving unit that moves the measurement stage or the reference stage to a measurement position, and the measurement stage is positioned when the reference stage exists at the measurement position. Alignment is performed so that the position when the measurement stage is present at the measurement position matches.

  The measurement apparatus includes a measurement stage, a reference stage, and a moving unit. The measurement stage is a stage on which a measurement object is placed, and the reference stage is a stage for aligning the measurement stage. The moving unit is provided with a measurement stage and a reference stage, and moves either the measurement stage or the reference stage to the measurement position. The measurement stage is aligned so that the position when the reference stage is present at the measurement position matches the position when the measurement stage is present at the measurement position. In this aspect, since the measurement stage is positioned with reference to the reference stage, it is possible to suitably suppress the displacement of the measurement stage when the measurement stage is replaced.

  In one aspect of the measurement apparatus, the measurement apparatus further includes an imaging unit having the measurement position as an imaging range, and the measurement stage is an image captured by the imaging unit when the reference stage is present at the measurement position. Position adjustment is performed so that the position of the reference stage in the image and the position of the measurement stage in the image captured by the imaging unit when the measurement stage is present at the measurement position are matched. According to this aspect, the positioning of the measurement stage can be suitably executed based on the image photographed by the photographing unit.

  In a preferred example of the measuring apparatus, the photographing unit is fixed, and the measurement position is within a photographing range of the fixed photographing unit.

  In another aspect of the measurement apparatus, the measurement apparatus further includes a display unit that displays an image captured by the imaging unit, and the display unit moves the reference stage to the measurement position and then moves the measurement stage. Is moved to the measurement position, a mark image indicating the position of the reference stage is displayed so as to overlap the image. In this aspect, the measurement apparatus can appropriately display the position of the reference stage together with the captured image of the measurement stage, so that the user can suitably adjust the position of the measurement stage.

  In another aspect of the measurement apparatus, a mark is attached to the upper surface of the reference stage, and the display unit is included in an image captured by the imaging unit when the reference stage is present at the measurement position. The mark image is superimposed on the image based on the position of the mark. According to this aspect, the measurement apparatus can appropriately recognize the position of the reference stage within the imaging range, and can accurately display the mark image for alignment of the measurement stage.

  In another aspect of the measuring apparatus, the measuring apparatus holds the probe for measuring the measurement object by supplying power to the measurement object and the position of the probe needle so as to be changeable. And the moving unit moves the measurement stage to the measurement position instead of the reference stage after the probe is aligned in a state where the reference stage exists at the measurement position. The probe is moved, and after the alignment is performed, the power is supplied in a state where the measurement stage exists at the measurement position. In this aspect, the measurement apparatus can suitably perform measurement of the measurement object placed on each measurement stage by performing probe alignment based on the reference stage used for alignment of the measurement stage. .

  In another aspect of the measuring apparatus, the holding unit is capable of moving the position of the needle in a surface direction parallel to the upper surface of the reference stage and a direction perpendicular to the surface direction. According to this aspect, the measuring apparatus can suitably execute the alignment of the probe in the three-axis directions.

  In another aspect of the measurement apparatus, a mark is attached to the upper surface of the reference stage, and the probe tip of the probe is aligned based on the position of the mark. According to this aspect, the alignment of the probe tip can be suitably performed.

  In another aspect of the measuring apparatus, the probe tip is a position detection unit of a touch sensor, and the measuring apparatus lowers the position of the probe in a state where the reference stage exists at the measurement position. The reference stage and the measurement stage based on the position where the touch sensor responds to and the position where the touch sensor reacts when the position of the probe is lowered while the measurement stage is in the measurement position. And a calculating unit for calculating a difference in height from the above. In this aspect, the measurement device calculates the height difference between the reference stage and the measurement stage based on the response of the touch sensor. Thereby, at the time of measurement of a measuring object, the probe tip can be suitably matched with the measuring object.

  In another preferred embodiment of the present invention, a measurement stage that is a stage on which a measurement object is placed, a reference stage that is a stage for aligning the measurement stage, the measurement stage, and the reference A positioning method executed by a measuring apparatus including a stage, and a moving unit that moves either the measurement stage or the reference stage to a measurement position, wherein the measurement stage is the reference stage A positioning step of performing positioning so that a position when the measurement stage exists at the measurement position and a position when the measurement stage exists at the measurement position coincide with each other; By executing this alignment method, the measurement apparatus can position the measurement stage with reference to the reference stage, and can suitably suppress the displacement of the measurement stage when the measurement stage is replaced.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

[Schematic configuration]
FIG. 1 is a schematic configuration diagram of a measuring apparatus 100 according to the present embodiment.

  A measuring apparatus 100 shown in FIG. 1 is an apparatus for inspecting electrical characteristics and optical characteristics of an LED chip 50, and mainly includes a first probe 10, a second probe 20, a table 30, and a table position adjusting unit 31. A control unit 40, a fixed point camera 41, a photodetector 42, a display 43, and an input unit 44.

  The table 30 is provided with a plurality of measurement stages 3M on which the LED chips 50 are respectively mounted, and a reference stage 3S serving as a reference for alignment when each measurement stage 3M is installed and replaced. The table position adjustment unit 31 is connected to the control unit 40 and moves the table 30 in a plane parallel to the upper surface of the table 30 and in a direction orthogonal to the upper surface of the table 30. Hereinafter, the direction orthogonal to the upper surface of the table 30 is referred to as “Z axis”, the direction in which the first probe 10 and the second probe 20 are arranged is referred to as “X axis”, and the direction orthogonal to the X axis and Z axis is referred to as “Y axis”. The positive direction of each axis is determined as shown in FIG. 1 and FIG. 2 described later. The table 30 is an example of the “moving unit” in the present invention.

  Each measurement stage 3M is aligned with the reference stage 3S as a reference when the measuring apparatus 100 is assembled or replaced due to wear. The alignment of the measurement stage 3M will be described in detail in the section [Measurement stage alignment].

  The first probe 10 is fixed by a first probe base 11 and includes a first probe needle 12, a height adjustment unit 13, a slide unit 14, and a base unit 15. The first probe needle 12 brings the LED chip 50 into an energized state by touching the electrode of the LED chip 50. The height adjusting unit 13 adjusts the position of the first probe needle 12 on the Z axis with respect to the table 30 according to the operation amount to the Z axis operating unit 1Z. The height adjusting unit 13 is an example of the “holding unit” in the present invention. The slide unit 14 slides in the X-axis direction with respect to the base unit 15 in response to an operation on the X-axis operation unit 1X. Thereby, the position of the first probe needle 112 in the X-axis direction with respect to the table 30 is adjusted. Moreover, the slide part 14 slides on the Y axis with respect to the base part 15 according to operation to the Y-axis operation part for adjusting the position of the 1st probe needle 12 of the Y-axis direction which is not shown in figure. As a result, the position of the first probe needle 12 in the Y-axis direction with respect to the table 30 is adjusted.

  The second probe 20 is fixed by a second probe base 21 and includes a second probe needle 22, a height adjustment unit 23, a slide unit 24, and a base unit 15. The second probe needle 22 brings the LED chip 50 into an energized state by touching the electrode formed on the LED chip 50. The height adjusting unit 23 holds the second probe needle 22 at a predetermined height on the slide unit 24. The slide unit 24 slides in the X-axis direction with respect to the base unit 15 in response to an operation on the X-axis operation unit 2X. As a result, the position of the second probe needle 22 in the X-axis direction with respect to the table 30 is adjusted. Moreover, the slide part 24 slides on the Y axis with respect to the base part 15 according to the operation to the Y axis operation part for adjusting the position of the second probe needle 22 in the Y axis direction (not shown). Thereby, the position of the second probe needle 22 in the Y-axis direction with respect to the table 30 is adjusted. The first probe base 11 and the second probe base 21 are extendable according to a control signal from the controller 40, and adjust the position of the base portion 15 in the Z-axis direction.

  Although not shown, the first probe 10 and the second probe 20 are provided with a touch sensor that detects contact, and supplies a predetermined electrical signal to the control unit 40 when the needle tip contacts. Further, the position of the first probe needle 12 and the second probe needle 22 is adjusted so as to appropriately touch the electrodes of the LED chip 50 by manual teaching work before the measurement of the LED chip 50. Hereinafter, the position of the measurement stage 3M where the mounted LED chip 50 can be touched by the first probe needle 12 and the second probe needle 22 is also simply referred to as “measurement position”.

  The fixed point camera 41 is a camera that photographs the vicinity of the stylus position (that is, the measurement position) of the first and second probe needles 12 and 22 from above, and supplies the photographed image to the control unit 40. In this embodiment, an image captured by the fixed point camera 41 (also simply referred to as “captured image Im”) is used for alignment of the measurement stage 3M.

  The photodetector 42 receives the light of the LED chip 50 emitted when the first and second probe needles 12 and 22 and the electrode of the LED chip 50 touch each other, thereby measuring the optical characteristics of the LED chip 50. Do. In this embodiment, the photodetector 42 is aligned so that the vicinity of the stylus position of the first and second probe needles 12 and 22 can be measured, and measures the optical characteristics of the LED chip 50.

  Although the photo-detector 42 is on the fixed point camera 41 in the figure, the control unit 40 may control to move below the fixed point camera 41 (between the fixed point camera 41 and the LED chip 50) only at the time of measurement.

  The display 43 displays the captured image Im based on the control of the control unit 40. The input unit 44 receives an input for the user to instruct the measuring apparatus 100. The input unit 44 includes various forms such as a button, a switch, a voice input device, and a touch panel.

  The control unit 40 is, for example, a known processing device such as a CPU (Central Processing Unit), and includes a memory and the like, and is connected to each unit of the measurement device 100 to control its operation and acquire measurement results. Do.

  For example, the control unit 40 is connected to the table position adjustment unit 31, the first probe 10, and the second probe 20, and based on the input to each operation unit 1X, 1Z, 2X, 2Z and the input unit 44, Control the execution and amount of movement. Further, the control unit 40 acquires the measurement result of the LED chip 50 from the photodetector 42. Furthermore, the control unit 40 displays the captured image Im received from the fixed point camera 41 on the display 43, and causes the user to perform an operation of positioning the measurement stage 3M, the first probe needle 12, and the second probe needle 22.

  Next, an arrangement example of the reference stage 3S and the measurement stage 3M on the table 30 will be described with reference to FIG. FIG. 2A shows a top view of the table 30 when the reference stage 3S is present at the measurement position.

  In the example of FIG. 2A, the reference stage 3S and the three measurement stages 3M (3Ma to 3Mc) are equidistant (that is, 90 degrees) on a virtual circle Lc that connects the positions equidistant from the center of the table 30. Are arranged at intervals). Note that the line segment Lv in FIG. 2A is a virtual line segment that connects the centers of the reference stage 3S and the measurement stage 3Mb arranged to face each other, and the line segment Lh is the measurement stages 3Ma and 3Mc arranged to face each other. It is a virtual line segment that connects the centers of. A range Rtag indicated by a broken line frame indicates a shooting range by the fixed point camera 41.

  As shown in FIG. 2A, a cross mark 37 for alignment is provided at the center position of the reference stage 3S. On the other hand, suction holes 38 (38a to 38c) for fixing the LED chip 50 are provided at the center positions of the measurement stages 3Ma to 3Mc, respectively. In FIG. 2A, the LED chip 50 is not yet installed on the measurement stage 3M.

  FIG. 2B shows a top view of the table 30 when the measurement stage 3Mc is moved to the measurement position. In FIG. 2B, the control unit 40 moves the measurement stage 3Mc within the broken line frame Rtag by rotating the table 30 by 90 degrees from the state of FIG. As described above, the control unit 40 can cause the arbitrary measurement stage 3M or the reference stage 3S to transition within the imaging range of the fixed point camera 41, which is the measurement position, by rotating the table 30.

[Measurement stage alignment]
Next, alignment at the time of installation of the measurement stage 3M will be described. Schematically, first, with the reference stage 3S moved to the measurement position, the control unit 40 stores the position of the reference stage 3S in the captured image Im. Then, the control unit 40 moves the measurement stage 3M to be aligned to the measurement position, and aligns the position of the measurement stage 3M within the imaging range with the position of the reference stage 3S in the stored captured image Im.

  FIG. 3A is a display example of the display 43 that displays a captured image Im captured when the reference stage 3S is present at the measurement position (that is, in the case of FIG. 2A). In the example of FIG. 3A, the upper surface of the reference stage 3S with the cross mark 37 is displayed in the captured image Im.

  In this case, the control unit 40 detects and stores the position of the cross mark 37 provided at the center position of the reference stage 3S within the shooting range of the fixed point camera 41 in the shot image Im. In this case, for example, the control unit 40 detects the position of the cross mark 37 by performing a known image recognition process on the captured image Im. The control unit 40 executes this process in advance before the alignment of each measurement stage 3M.

At this time, the user may adjust the position of the reference stage 3S or the shooting range of the fixed point camera 41 so that the center position of the captured image Im or the position desired by the user matches the center position of the reference stage 3S. Good. In this case, the control unit 40 can handle the center position of the captured image Im as the center position of the reference stage 3S in the subsequent processing.
In this case, this position is defined as “the origin of the measurement position”.

  FIG. 3B shows a display example of the display 43 that displays a photographed image Im photographed when the table 30 is rotated 90 degrees from the state of FIG. 3A and the measurement stage 3Mc is moved to the measurement position. Show.

  In this case, in the captured image Im, the measurement stage 3Mc temporarily fixed with a screw or the like is displayed on the table 30 before alignment, and the mark 37A generated by the control unit 40 is superimposed and displayed. In this case, the control unit 40 places the mark 37A at the same position as the cross mark 37 in the captured image Im shown in FIG. 3A based on the position information of the cross mark 37 stored in the state of FIG. The image is displayed on the captured image Im. If the position of the reference stage 3S or the shooting range of the fixed point camera 41 has been adjusted in advance so that the center position of the captured image Im and the center position of the reference stage 3S coincide with each other, the control unit 40 sets the mark 37A. Is displayed at the center position of the captured image Im.

  Here, in the example of FIG. 3B, the suction hole 38c at the center of the measurement stage 3Mc is displaced from the position of the cross mark 37 in the captured image Im stored by the control unit 40. Therefore, in this case, while referring to the display 43 on which the captured image Im shown in FIG. 3B is displayed, the user positions the measurement stage 3Mc so that the center of the suction hole 38c is aligned with the intersection of the mark 37A. Perform operations to adjust. In this case, for example, the measurement apparatus 100 has a mechanism that allows the position of each measurement stage 3M to be adjusted manually, and the control unit 40 moves the measurement stage 3Mc according to the detected operation amount. Then, after the measurement stage 3Mc is moved, the temporarily fixed measurement stage 3Mc is fixed.

  And the control part 40 performs the process demonstrated in FIG. 3 similarly with respect to the other measurement stages 3Ma-3Mb at the time of the assembly of the measuring apparatus 100 which installs each measurement stage 3M. In addition, at the time of replacement of an arbitrary measurement stage 3M due to wear, the control unit 40 executes the processing described with reference to FIG. 3 for the measurement stage 3M that has been replaced and temporarily fixed. Specifically, the control unit 40 moves the temporarily replaced measurement stage 3M after replacement to the measurement position, and then the center position of the measurement stage 3M in the captured image Im is the center position of the stored reference stage 3S. To adjust the position of the measurement stage 3M. Since the control unit 40 stores the position information of the reference stage 3S when the measuring apparatus 100 is assembled, the process of storing the position of the reference stage 3S in the photographed image Im is not performed when the measurement stage 3M is replaced. Also good.

  Thus, in the present embodiment, the position adjustment of each measurement stage 3M is executed with reference to the reference stage 3S. Thereby, the measurement stage 3M before and after replacement | exchange can be installed in a substantially the same position. Further, by installing each measurement stage 3M with reference to the reference stage 3S, it is not necessary to store the variation (error) of the installation position for each measurement stage 3M, and accumulation of errors can be suitably suppressed.

[Probe needle alignment]
Next, alignment of the first probe needle 12 and the second probe needle 22 using the reference stage 3S will be described. The alignment described below is performed after the alignment of the measurement stage 3M and before the measurement of the LED chip 50.

(1) Positioning on the XY plane First, positioning on the XY plane of the first probe needle 12 and the second probe needle 22 will be described.

  The alignment of the first probe needle 12 and the second probe needle 22 on the XY plane is executed with the cross mark 37 of the reference stage 3S as a reference in a state where the reference stage 3S is moved to the measurement position. At this time, the control unit 40 displays the captured image Im on the display 43 to guide a user operation for adjusting the positions of the first probe needle 12 and the second probe needle 22.

  Here, a processing example in which the tips of the first probe needle 12 and the second probe needle 22 are aligned with the intersection position of the cross mark 37 of the reference stage 3S will be described with reference to FIG.

  FIG. 4A shows a display example of the display 43 that displays a photographed image Im photographed before execution of alignment of the first probe needle 12 and the second probe needle 22 on the XY plane. 4A and FIGS. 4B to 4D described later, the central portion of the range Rtag in FIGS. 2A and 2B is enlarged by changing the magnification of the fixed point camera 41.

  In FIG. 4A, the tip positions of the first probe needle 12 and the second probe needle 22 are shifted from the intersection of the cross marks 37 corresponding to the center of the reference stage 3S. Therefore, in this case, the user refers to the captured image Im shown in FIG. 4A displayed on the display 43, and performs an X-axis operation for adjusting the first and second probe needles 12 and 22 in the X-axis direction. The units 1X and 2X and the Y-axis operation unit for adjusting the first and second probe needles 12 and 22 in the Y-axis direction are appropriately operated. In this case, the control unit 40 adjusts the positions of the first probe needle 12 and the second probe needle 22 on the XY plane according to the operation unit and the operation amount operated by the user.

  FIG. 4B shows a display example of the display 43 that displays the captured image Im after the position adjustment of the first probe needle 12 and the second probe needle 22. In this case, as a result of the movement of the first probe needle 12 and the second probe needle 22 based on the user operation, the tip positions of the first probe needle 12 and the second probe needle 22 substantially coincide with the intersection of the cross marks 37. Yes. In this case, the user finishes the operation to each operation unit, and performs an input to the effect that the position adjustment of the first and second probe needles 12 and 22 has been completed through the input unit 44.

  FIG. 4C shows a display example of the display 43 when the table 30 is rotated so that an arbitrary measurement stage 3M is at the measurement position. In this case, as described in the section “Measurement Stage Positioning”, the center of the arbitrary measurement stage 3M moved to the measurement position is the same as the center of the reference stage 3S and the captured image Im when the measurement stage 3M is present at the measurement position. The alignment is performed so as to match. Accordingly, even when the arbitrary measurement stage 3M is shifted to the measurement position by rotating the table 30, as shown in FIG. 4C, the suction hole 38 positioned at the center of the measurement stage 3M to be imaged is provided. The tips of the first probe needle 12 and the second probe needle 22 overlap at the “origin of measurement position”.

  FIG. 4D is a display example of the display 43 that displays a captured image Im captured when the LED chip 50 is inspected. As shown in FIG. 4D, when the LED chip 50 is inspected, the suction hole 38 becomes negative pressure by the exhaust pump (vacuum pump), and the LED chip 50 is sucked and sucked. The tip of the first probe needle 12 is in contact with the electrode pad 51, the tip of the second probe needle 22 is in contact with the electrode pad 52, and the LED chip 50 is energized.

  At this time, since the LED chip 50 is attached so that the center of the LED chip 50 overlaps the suction hole 38, the electrode pads 51 and 52 and the suction hole 38 are located in the vicinity on the XY plane.

In FIG. 4, the size of the LED chip 50 is 1 mm × 0.6 mm, the suction hole 38 is 0.2 mm in diameter, and the electrode pads 51 and 52 are slightly over 0.2 mm in diameter. The probe tip is less than 0.1 mm in diameter. It is.
Therefore, in this case, the movement amount of the first probe needle 12 and the second probe needle 22 from the state where the alignment shown in FIGS. 4B and 4C is performed is short. Specifically, in FIG. 4D, the first probe needle 12 moves from the state of FIG. 4C in the X-axis negative direction by the width of the arrow 70, and the second probe needle 22 moves to the position shown in FIG. It has moved from the state of C) by the width of the arrow 71 in the positive direction of the X axis.

  In FIG. 4, the size of the LED chip 50 is 1 mm × 0.6 mm, the suction hole 38 is 0.2 mm in diameter, and the electrode pads 51 and 52 are slightly more than 0.2 mm in diameter, and the probe tip is less than 0.1 mm in diameter. It is.

  As described above, the position adjustment of the first probe needle 12 and the second probe needle 22 is performed so that the position shown in FIG. Thereby, at the time of the inspection of the LED chip 50, the position adjustment of the first probe needle 12 and the second probe needle 22 on the XY plane can be preferably simplified, and the fixed point camera 41 can be set at a high magnification with a narrow angle of view. Even if it is set, the needle tips of the first probe needle 12 and the second probe needle 22 do not deviate from the imaging range. Further, the control unit 40 stores the positions of the electrode pads 51 and 52 on the LED chip 50 in advance, so that the first probe needle 12 and the second probe needle 22 are moved to the electrode pads 51 and 52 at the time of inspection. It can also be moved automatically to the position.

(2) Positioning on the Z-axis Next , the positioning of the first probe needle 12 and the second probe needle 22 in the Z-axis direction will be described with reference to FIG.

  5A to 5D show transitions of the first probe 10 and the second probe 20 accompanying the alignment of the first probe needle 12 and the second probe needle 22 in the Z-axis direction. In FIG. 5 and the like, the first probe base 11 and the second probe base 21 are not shown for convenience of explanation.

  FIG. 5A shows the first probe 10 and the second probe 20 immediately before the first probe needle 12 and the second probe needle 22 are aligned in the Z-axis direction. In the state shown in FIG. 5A, the first probe 10 and the second probe 20 have a predetermined height at which the first probe needle 12 and the second probe needle 22 do not contact the reference stage 3S (“probe standby height”). Also called). Further, as shown in FIG. 5A, the first probe needle 12 held by the height adjusting unit 13 capable of adjusting the position in the Z-axis direction is provided by the height adjusting unit 23 having no height adjusting function. It is held in advance at a position higher than the second probe needle 22 to be held. 5A, the control unit 40 controls the first probe base 11 and the second probe base 21 to lower the base unit 15 at a constant speed.

  FIG. 5B shows the first probe 10 and the second probe 20 when the tip of the second probe needle 22 contacts the upper surface of the reference stage 3S. In this case, since the tip of the second probe needle 22 contacts the upper surface of the reference stage 3S, the touch sensor provided at the tip of the second probe needle 22 transmits a detection signal indicating that the contact has been made to the control unit 40. To do. The control unit 40 that has received the detection signal stops the movement of the first probe base 11 and the second probe base 21. Accordingly, in this case, the movement of the base portion 15 stops with only the tip of the second probe needle 22 in contact with the upper surface of the reference stage 3S. Then, the control unit 40 recognizes that the positions of the first probe 10 and the second probe 20 in this case are the reference height for the inspection of the LED chip 50 (also referred to as “probe reference height”). And remember.

  FIG. 5C shows a state in which the first probe needle 12 is lowered by operating the Z-axis operation unit 1Z. After the first probe 10 and the second probe 20 are stopped, the height adjusting unit 13 lowers the first probe needle 12 according to the operation amount of the user to the Z-axis operation unit 1Z. In this case, the user moves the first probe needle 12 until the first probe needle 12 contacts the upper surface of the reference stage 3S.

  FIG. 5D shows a state when the first probe needle 12 contacts the upper surface of the reference stage 3S. In FIG. 5D, since the first probe needle 12 has contacted the upper surface of the reference stage 3S, the touch sensor provided at the tip of the first probe needle 12 sends a detection signal indicating that the contact has been made to the control unit 40. Send. In this case, the control unit 40 notifies the user that the tip of the first probe needle 12 has come into contact, and stops the operation by the Z-axis operation unit 1Z. Note that the control unit 40 may regard the operation by the Z-axis operation unit 1Z after receiving the detection signal from the touch sensor as invalid. Thereafter, when a predetermined button is pressed, the control unit 40 moves the first probe 10 and the second probe 20 again to the probe standby height.

  As described above, the measurement apparatus 100 can suitably perform the alignment of the first probe needle 12 and the second probe needle 22 in the Z-axis direction based on the operation of the Z-axis operation unit 1Z.

[Measurement stage height measurement]
Next, a process for measuring the height of each measurement stage 3M, which is executed after the alignment of the first probe needle 12 and the second probe needle 22, will be described. The control unit 40 gradually lowers the first probe 10 and the second probe 20 from the probe standby height, and the first probe needle 12 and the second probe needle 22 or the second probe needle 22 come into contact with the measurement stage 3M. Is recognized as the height of the measurement stage 3M.

  FIG. 6A shows a state in which the measurement stage 3M that measures the height is moved to the measurement position. In this case, since the first probe needle 12 and the second probe needle 22 have been aligned in the Z-axis direction, the tip positions of the first probe needle 12 and the second probe needle 22 on the Z-axis are substantially the same. I'm doing it. In the state of FIG. 6B, the control unit 40 controls the first probe base 11 and the second probe base 21 to lower the base unit 15 at a constant speed.

  FIG. 6B shows a state where the first probe needle 12 and / or the second probe needle 22 are in contact with the upper surface of the measurement stage 3M to be measured. In this case, the first probe needle 12 and the second probe needle 22 or the tip of the second probe needle 22 contacts the upper surface of the measurement stage 3M, and the corresponding touch sensor transmits a detection signal to the control unit 40. In this case, the control unit 40 stops the movement of the first probe 10 and the second probe 20, and recognizes the height at the time of stop as the height of the measurement stage 3M to be measured.

  Then, the control unit 40 determines the difference in height between the height of the reference stage 3S recognized by the process shown in FIG. 5 (that is, the probe reference height) and the height of the measurement stage 3M recognized by the process shown in FIG. It is calculated and stored as an offset value related to the height of the measurement stage 3M. Then, the control unit 40 takes into account the probe reference height and the offset value of the height of the measurement stage 3M at the measurement position when inspecting the LED chip 50 described later, and the first probe needle 12 and the second probe. The stop position of the needle 22 in the Z-axis direction is determined.

[Operation during inspection]
Next, the operation of the measuring apparatus 100 that is executed when the LED chip 50 is inspected will be described.

(1) Contact Operation First, a contact operation that is an operation of pressing the needle tips of the first probe needle 12 and the second probe needle 22 against the LED chip 50 will be described with reference to FIG. 7A and 7B show the state of the measuring apparatus 100 before and after the execution of the contact operation.

  First, before executing the contact operation, the control unit 40 recognizes the measurement stage 3M on which the LED chip 50 is placed, and also uses the input unit 44 to determine the height of the LED chip 50, the first probe needle 12, and the second probe needle 12. The input of the pushing amount of the probe needle 22 into the LED chip 50 (so-called overdrive) is accepted. Then, when the input unit 44 detects an input indicating that the contact operation should be started, the control unit 40 lowers the base unit 15 as shown in FIG.

  Thereafter, the control unit 40 is higher by the height of the input LED chip 50 than the height of the measurement stage 3M recognized in the section [Measurement of Height of Measurement Stage], and by the input push amount. Lower the base 15 to a lower position. In this case, as shown in FIG. 7B, the first probe needle 12 and the second probe needle 22 stop at the position where they are pushed in by the pushing amount input to the surface of the LED chip 50.

  The height of the LED chip 50 is detected and recognized by the first probe needle 12 and the second probe needle 22 or the second probe needle 22 in the same procedure as described in the section “Measurement of the height of the measurement stage”. Then, the base portion 15 may be lowered to a position lower by the input push amount.

  In these cases, the touch sensors provided on the first probe needle 12 and the second probe needle 22 detect contact and transmit a detection signal to the control unit 40.

(2) Needle alignment operation Next, a needle alignment operation, which is an operation of aligning the needle tips of the first probe needle 12 and the second probe needle 22 with each electrode of the LED chip 50, will be described.

  First, a needle alignment operation in the case where both of the two electrodes that contact the first probe needle 12 and the second probe needle 22 are formed on the upper surface of the LED chip 50 will be described with reference to FIG. 8A to 8C show the transition of the measuring apparatus 100 during the needle alignment operation.

  First, before executing the needle alignment operation, the control unit 40 recognizes the measurement stage 3M on which the LED chip 50 is placed, and inputs the height of the LED chip 50 and the position where the needle alignment is performed by the input unit 44. Accept. Then, when the input unit 44 detects an input indicating that the needle alignment operation should be started, the control unit 40 lowers the base unit 15 as illustrated in FIG.

  Thereafter, as shown in FIG. 8 (B), the control unit 40 stops the base unit 15 at a position higher than the surface of the LED chip 50 by a predetermined length, and the X-axis operation units 1X and 2X can An operation for adjusting the position of the first probe needle 12 and the second probe needle 22 is accepted. In this case, the control unit 40 displays the captured image Im generated by the fixed point camera 41 on the display 43, so that the user can determine the positions of the needle tips of the first probe needle 12 and the second probe needle 22 and the positions of the electrodes. Recognize

  Thereafter, the control unit 40 detects the end of position adjustment of the first probe needle 12 and the second probe needle 22 by the X-axis operation units 1X and 2X by detecting a predetermined input. In this case, the control unit 40 contacts the first probe needle 12 and the height adjusting unit 23 with the upper surface of the LED chip 50 based on the input LED height and the stored height of the measurement stage 3M ( (See FIG. 8C). In the state of FIG. 8C, the first probe needle 12 and the second probe needle 22 are in contact with the electrodes of the LED chip 50, respectively, so that the LEDs can be energized.

  Next, a needle alignment operation in the case where the electrodes for contacting the first probe needle 12 and the second probe needle 22 are formed on the front surface and the back surface of the LED chip 50 will be described with reference to FIG.

  9A to 9C show the transition of the measuring apparatus 100 in the needle alignment operation in this case. In the example of FIG. 9, a conductive plate 39 is formed on the upper surface of each measurement stage 3M, the tip of the first probe needle 12 is brought into contact with the conductive plate 39, and the tip of the second probe needle 22 is placed on the LED chip 50. The LED chip 50 is brought into an energized state by being brought into contact with the electrode formed thereon.

  First, similarly to the example of FIG. 8, the control unit 40 receives input related to the height of the LED chip 50 and the position to perform needle alignment by the input unit 44 before executing the needle alignment operation. Then, the base part 15 is lowered. Thereafter, as shown in FIG. 9B, the control unit 40 stops the first probe needle 12 and the second probe needle 22 at a position higher by a predetermined length than the upper surface of the LED chip 50, and the X-axis operation unit 1X. An operation for adjusting the position of the first probe needle 12 and the second probe needle 22 in the X-axis direction by 2X is received. In this case, the control unit 40 causes the user to display the captured image Im generated by the fixed point camera 41 on the display 43 so that the user can adjust the positions of the first probe needle 12 and the second probe needle 22 and the position of the LED chip 50. Recognize In FIG. 9B, since the user brings the conductive plate 39 and the first probe needle 12 into contact, the user moves the first probe needle 12 to the position where the first probe needle 12 does not come into contact with the LED chip 50. Move in the direction.

  And the control part 40 recognizes completion | finish of position adjustment of the 1st probe needle 12 and the 2nd probe needle 22 by X-axis operation part 1X, 2X by detecting a predetermined input, for example. The control unit 40 then contacts the height adjusting unit 23 with the surface of the LED chip 50 based on the input information about the height of the LED chip 50 and the stored height of the measurement stage 3M (that is, FIG. 9 (C).

The height of the LED chip 50 may be detected and recognized by the second probe needle 22 and the height adjusting unit 23 may be moved.
9C, the second probe needle 22 is in contact with the electrode on the surface of the LED chip 50.

  Next, as shown in FIG. 9D, the control unit 40 lowers the first probe needle 12 based on the operation on the Z-axis operation unit 1Z. And control part 40 notifies a user that the 1st probe needle 12 contacted, when a detection signal is received from a touch sensor provided in the 1st probe needle 12. Thereafter, the user further operates the Z-axis operation unit 1Z to push the first probe needle 12 into the LED chip 50 by a predetermined push amount. In the state of FIG. 9D, the first probe needle 12 and the second probe needle 22 are electrically connected to the electrodes of the LED chip 50, respectively, so that the LEDs can be energized.

[Modification]
Hereinafter, each modification suitable for the above-described embodiment will be described. Each of these modified examples can be applied to the above-described embodiments in any combination.

(Modification 1)
The measurement stages 3Ma to 3Mc and the reference stage 3S shown in FIG. 2 are arranged at positions rotated by 90 degrees with respect to the center of the table 30, respectively. However, the arrangement to which the present invention is applicable is not limited to this.

  FIG. 10 shows a top view of a table 30 according to a modification. In the example of FIG. 10, the measurement stages 3Ma to 3Mc are equidistant from the center of the table 30 and are arranged at intervals of 120 degrees with respect to the center. The reference stage 3S is disposed at a position rotated 60 degrees counterclockwise from the measurement stage 3Mc with respect to the center of the table 30.

  Even in this case, the control unit 40 stores the arrangement information of the measurement stages 3Ma to 3Mc and the reference stage 3S, and rotates the table 30 based on the arrangement information, so that the object to be the shooting range of the fixed point camera 41 Switch. Thereby, the alignment of each measurement stage 3M can be performed suitably like an Example.

(Modification 2)
In the description of the section [Measurement Stage Positioning], the control unit 40 sets the position of each measurement stage 3M on the XY plane as an adjustment target. In addition to this, the control unit 40 may also adjust the direction (rotation angle) of each measurement stage 3M.

  FIG. 11A shows a top view of a table 30 according to a modification. In the example of FIG. 11A, cross marks 36a to 36c are attached to the centers of the measurement stages 3Ma to 3Mc, similarly to the reference stage 3S. FIG. 11B is a display example of the display 43 when the measurement stage 3Mc is aligned. In FIG. 11B, similarly to the example of FIG. 3B, the control unit 40 displays a mark 37A indicating the position of the cross mark 37 on the reference stage 3S, superimposed on the captured image Im. In this case, the user refers to the display 43 on which the photographed image Im shown in FIG. 11B is displayed, and the measurement stage 3C on the measurement stage 3Mc overlaps the mark 37A displayed on the photographed image Im. The position and orientation on the 3Mc XY plane are adjusted.

  Thus, in this modification, the direction of the measurement stage 3M can be suitably adjusted according to the reference stage 3S.

(Modification 3)
In the description of the section “Measurement Stage Height Measurement”, the control unit 40 measures and stores the height (that is, the position in the Z-axis direction) of each measurement stage 3M. Instead, when the height of each measurement stage 3M can be adjusted, the control unit 40 may adjust the height of each measurement stage 3M so as to coincide with the height of the reference stage 3S. . In this case, for example, the control unit 40 adjusts the height of each measurement stage 3M by an offset value corresponding to the height difference between each measurement stage 3M and the reference stage 3S, thereby matching the height of the reference stage 3S. .

(Modification 4)
The measuring apparatus 100 may measure the electrical characteristics by using the other arbitrary chip as an inspection target instead of the LED chip 50 and causing the first probe needle 12 and the second probe needle 22 to touch.

  The number of probe needles is not limited to two.

(Modification 5)
In the description of FIG. 3, the control unit 40 adjusts the position of the measurement stage 3Mc so that the center of the suction hole 38c is aligned with the intersection of the mark 37A based on the user operation. Instead of this, the control unit 40 may adjust the position of the measurement stage 3Mc without depending on the user operation.

  In this case, the measurement apparatus 100 has a mechanism that can adjust the position of each measurement stage 3M, and the control unit 40 acquires the captured image Im shown in FIG. Recognize the position of Then, the control unit 40 moves the measurement stage 3Mc so that the center of the suction hole 38c overlaps the center position of the reference stage 3S in the captured image Im that has already been stored.

(Modification 6)
In the description of the section “Operation at the time of inspection”, the measuring apparatus 100 may have a mechanism capable of adjusting the position of the LED 50 and move the LED 50 to the “origin of measurement position”.

DESCRIPTION OF SYMBOLS 10 1st probe 20 2nd probe 30 Table 31 Table position adjustment part 40 Control part 41 Fixed point camera 42 Photo detector 43 Display 44 Input part 50 LED chip 100 Measuring apparatus

Claims (10)

A measurement stage on which a measurement object is placed;
A reference stage that is a stage for aligning the measurement stage;
The measurement stage and the reference stage are installed, and includes a moving unit that moves either the measurement stage or the reference stage to a measurement position.
The measurement stage is aligned so that a position when the reference stage is present at the measurement position and a position when the measurement stage is present at the measurement position are matched. measuring device. It further includes a photographing unit having the measurement position as a photographing range,
The measurement stage includes: a position of the reference stage in an image captured by the imaging unit when the reference stage is present at the measurement position; and the imaging unit when the measurement stage is present at the measurement position. The measurement apparatus according to claim 1, wherein alignment is performed so that the position of the measurement stage in a captured image matches. The photographing unit is fixed,
The measurement apparatus according to claim 2, wherein the measurement position is within a fixed imaging range of the imaging unit. A display unit for displaying an image captured by the imaging unit;
The display unit displays a mark image indicating the position of the reference stage superimposed on the image when the measurement stage moves to the measurement position after the reference stage has moved to the measurement position. The measuring apparatus according to claim 2 or 3. The upper surface of the reference stage is marked,
The display unit displays the mark image superimposed on the image based on a position of the mark in an image captured by the imaging unit when the reference stage is present at the measurement position. The measuring apparatus according to claim 4. A probe for measuring the measurement object by supplying power to the measurement object;
A holding part for holding the position of the probe needle in a freely changeable manner,
The moving unit moves the measurement stage to the measurement position instead of the reference stage after the probe is aligned in a state where the reference stage exists at the measurement position,
The said probe supplies the said electric power in the state in which the said measurement stage exists in the said measurement position after the said alignment is performed, The Claim 1 characterized by the above-mentioned. measuring device.   The measuring apparatus according to claim 6, wherein the holding unit is capable of moving the position of the needle in a surface direction parallel to an upper surface of the reference stage and a direction perpendicular to the surface direction. The upper surface of the reference stage is marked,
The measuring apparatus according to claim 6, wherein the alignment of the probe tip is performed based on the position of the mark. The probe tip is a position detector of a touch sensor,
The position where the touch sensor reacted when the position of the probe was lowered while the reference stage was present at the measurement position, and the position of the probe was lowered while the measurement stage was present at the measurement position. 9. The apparatus according to claim 6, further comprising a calculating unit that calculates a difference in height between the reference stage and the measurement stage based on a position at which the touch sensor reacts when the touch sensor is activated. Measuring device. A measurement stage on which a measurement object is placed;
A reference stage that is a stage for aligning the measurement stage;
A positioning method executed by a measuring apparatus, wherein the measuring stage and the reference stage are installed, and a moving unit that moves either the measuring stage or the reference stage to a measuring position,
A positioning step of aligning the measurement stage so that a position when the reference stage is present at the measurement position and a position when the measurement stage is present at the measurement position are the same; Alignment method characterized by