JP2020071057A - Semiconductor device inspection apparatus - Google Patents

Abstract

To perform a high-accuracy quality inspection of a semiconductor element by reliably bringing an inspection probe into contact with an electrode of a semiconductor element and preventing a contact failure between them.SOLUTION: A semiconductor device inspection apparatus 1 includes: a rotary table 3 that absorbs and holds an LED element 2 and intermittently conveys the same; a probe unit 8 that is arranged to be movable in a horizontal direction on a lower side of a fixed table 12 at an inspection position A; and a position adjustment mechanism 36 that moves the probe unit 8 in XY directions of a horizontal plane. When the LED element 2 held in the suction hole 3A temporarily stops at the inspection position A, the entire probe unit 8 is moved in the XY directions by the required amount by the position adjustment mechanism 36, and thus an inspection probe 11 is stopped immediately below an electrode 2D of the LED element 2. When the inspection probe 11 is moved up by a lifting mechanism 26, an upper end of the inspection probe is reliably brought into contact with the electrode 2D, and the LED element 2 is energized to emit light in this state so that quality inspection may be performed.SELECTED DRAWING: Figure 2

Description

The present invention relates to a semiconductor element inspection device, and more specifically, it is possible to move an inspection probe also in the XY directions of a horizontal plane, and to reliably contact the electrode of the semiconductor element to be inspected with the inspection probe to inspect the quality of the semiconductor element. The present invention relates to a semiconductor element inspection device.

2. Description of the Related Art Conventionally, a semiconductor element inspection device that emits light from a semiconductor element to perform quality inspection is known (for example, Patent Document 1).
The semiconductor element inspection device of Patent Document 1 is provided with a rotary table as a transfer device, and the rotary table is intermittently rotated to transfer the semiconductor element held in the suction holes (holding portions) to the inspection position. At the inspection position, the inspection probe is brought into contact with the electrode of the semiconductor element from the lower side through the suction hole and the communication hole on the fixed table side, and then the power is supplied to the electrode, so that the optical quality of the semiconductor element is inspected. There is.

JP, 2017-223573, A

By the way, since recent semiconductor elements are downsized to about 2 mm on a side, the dimensions of the electrodes themselves of the semiconductor elements are also reduced. Therefore, when performing the quality inspection by the apparatus of Patent Document 1, there is a problem that the electrode of the semiconductor element and the inspection probe are displaced from each other, resulting in a contact error and poor measurement. In order to prevent such a measurement failure, it is possible to provide a mechanism for correcting the position of the electrode of the semiconductor element, but Patent Document 1 does not suggest such a mechanism.
Further, in the device of Patent Document 1, since a negative pressure is supplied to the suction hole of the rotary table, an internal space is formed in the fixed table at the inspection position, and an elevating member (moving means) attached with the inspection probe is installed. It is provided so as to be able to move up and down in the internal space. Further, in order to maintain the airtightness of the internal space, an annular seal member is attached to the outer peripheral portion of the elevating member, and the lip portion of the annular seal member is brought into close contact with the side wall of the internal space. The lip portion of the annular seal member is flexible and has a thin thickness, and the lip portion of the annular seal member is repeatedly elastically deformed as the elevating member moves up and down, and thus is easily damaged. It was necessary to replace the annular seal member frequently.

In view of the above-mentioned circumstances, the present invention provides a rotary table which is placed on a fixed table and is intermittently rotated in a predetermined direction, and a rotary table which is formed at a plurality of circumferential positions of the rotary table and is mounted on the rotary table. A suction hole for sucking and holding the lower surface of the placed semiconductor element, and the suction hole formed on the fixed table and holding the semiconductor element at the inspection position set on the moving path of the suction hole is temporarily stopped. The semiconductor element through the communication hole that communicates with the suction hole, the suction hole of the rotary table that is vertically movable to the inspection position, and temporarily stops at the inspection position, and the communication hole of the fixed table. Of the semiconductor device including an inspection probe capable of contacting the electrode exposed on the lower surface of the substrate and an elevating mechanism for elevating the inspection probe to contact the electrode of the semiconductor device temporarily stopped at the inspection position In the location,
A casing that forms an airtight space with the fixed table is provided below the fixed table at the inspection position, the inspection probe is arranged in the airtight space, and the casing is moved in the XY directions on the horizontal plane. It is characterized in that a position adjusting mechanism is provided.

  With this configuration, the position of the inspection probe can be adjusted in the XY directions by the position adjusting mechanism according to the position of the electrode of the semiconductor element temporarily stopped at the inspection position. Can be reliably contacted with. Therefore, it is possible to provide a semiconductor device inspection apparatus capable of performing a quality inspection with higher accuracy than the conventional one.

The perspective view of the whole which shows one Example of this invention. FIG. 2 is a vertical cross-sectional view of the probe unit of FIG. 1 and its periphery. FIG. 3 is a bottom view of the main part from the direction of arrow III in FIG. 2. The longitudinal cross-sectional view which shows the 2nd Example of this invention.

The present invention will be described below with reference to the illustrated embodiments. In FIG. 1, reference numeral 1 denotes a semiconductor element inspection apparatus. In this semiconductor element inspection apparatus 1, an LED element 2 (chip) as a semiconductor element is intermittently moved by a turntable 3. The optical quality is inspected by the inspection device 4 at the inspection position A during transportation.
When the wafer ring 5 on which a large number of LED elements 2 are mounted is supplied to the loading position B near the turntable 3, the LED elements 2 on the wafer ring 5 are sequentially transferred one by one by the robot 6 as a supply device. After being held, it is transferred to the supply position C, where it is supplied onto a pair of suction holes 3A, 3A as a holding portion formed on the rotary table 3. The suction holes 3A and 3A to be the holding portions are long holes formed in parallel, and since negative pressure acts on the suction holes 3A and 3A, a pair of suction holes 3A and 3A as the holding portions are formed. The LED element 2 is adapted to be adsorbed and held on the upper surface of the rotary table 3 at the position (see FIG. 3). In the process of holding the LED element 2 at the carry-in position B and then transferring it to the supply position C, the robot 6 rotates the held LED element 2 forward and backward by a required angle on the horizontal plane. Thus, when the robot 6 supplies the LED element 2 to the upper surface of the turntable 3 at the supply position C, the center line 2a that divides the LED element 2 into two parts, left and right, is aligned with the radial direction of the turntable 3. The direction of the LED element 2 is regulated and held in the suction hole 3A.
As the turntable 3 as the carrying device is intermittently rotated by a predetermined pitch in the arrow direction, the LED elements 2 held in the suction holes 3A are intermittently carried from the supply position C to the inspection position A. When the LED element 2 is temporarily stopped at the inspection position A, the inspection device 4 including the measuring device 7 and the probe unit 8 inspects the optical quality of the LED element 2. There is.
When the LED device 2 whose quality inspection has been completed by the inspection device 4 is transported to the discharge position D along with the intermittent rotation of the turntable 3, the holding state by the suction holes 3A is released and the LED device 2 is arranged at the discharge position D. After being held by the ejecting device 9 and removed from the suction hole 3A, it is ejected to a not-shown sorting device according to the result of the quality inspection.

As shown in FIGS. 2 to 3, the LED element 2 to be inspected by the semiconductor element inspection apparatus 1 has a substantially rectangular parallelepiped shape, and its upper surface 2A and four surrounding side surfaces 2B are light emitting surfaces. .. Further, four electrodes 2D are exposed and arranged at predetermined positions on the lower surface 2C of the LED element 2.
When the LED element 2 whose lower surface 2C is held in the suction hole 3A is temporarily stopped at the inspection position A, the probe unit 8 of the inspection device 4 attaches the four inspection probes 11 to the four electrodes 2D of the LED element 2. Light is emitted from the light emitting surface by contacting from the lower side and then energizing. At that time, an integrating sphere as the measuring device 7 arranged above the inspection position A is used to inspect the optical quality such as brightness and luminance of the LED element 2. Then, the inspection result such as the brightness by the measuring device 7 is transmitted to the control device 14, and the control device 14 determines the quality of each LED element 2 based on the inspection result transmitted from the measuring device 7. Is determined.

  The semiconductor device inspecting apparatus 1 includes a fixed table 12 that is fixed and arranged such that a flat upper surface 12A is horizontal, and is mounted on the upper surface 12A of the fixed table 12 in an airtight manner and driven by a drive mechanism 13. A rotary table 3 which is intermittently rotated in the direction of the arrow (clockwise), a robot 6 which supplies the LED elements 2 onto each suction hole 3A of the rotary table 3 at the supply position C, and a probe which is arranged at the inspection position A. An inspection device 4 including a unit 8 and a measuring device 7, an ejection device 9 arranged at the ejection position D for ejecting the LED element 2 after quality inspection from the position of the suction hole 3A and ejecting it to the sorting device, and the drive mechanism. The controller 14 controls the operations of the robot 13, the robot 6, and the like, and determines the quality of the LED element 2.

Further, the semiconductor device inspection apparatus 1 of the present embodiment includes the lower camera 16 disposed between the carry-in position B and the supply position C and the movement path of the suction hole 3A which is intermediate between the supply position C and the inspection position A. An upper camera 17 arranged on the upper side is provided.
The lower camera 16 is arranged vertically adjacent to the supply position C, and captures the lower surface of the LED element 2 held by the robot 6 and transferred from the carry-in position B to the supply position C. ing. The upper camera 17 is arranged vertically downward, and photographs the LED element 2 from above when the LED element 2 held in the suction holes 3A is intermittently conveyed from the supply position C to the inspection position A. It is like this. The images captured by the lower camera 16 and the upper camera 17 are transmitted to the control device 14.
The control device 14 recognizes the square outline of the LED element 2 and the position of the electrode 2D with respect to the square outline based on the image of the lower camera 16 and, after recognizing the position of the electrode 2D, displays the image by the upper camera 17. On the basis of this, the position of the electrode 2D in the LED element 2 held in the suction hole 3A in the XY direction on the horizontal plane is recognized.
Then, the controller 14 recognizes the positions of the LED element 2 and its electrode 2D held in the suction holes 3A, and then requires the inspection probe 11 of the probe unit 8 in the XY directions of the horizontal plane by the position adjusting mechanism 36 described later. It is designed to be moved by a certain amount. Thereby, the inspection probe 11 is surely brought into contact with the electrode 2D exposed on the lower surface 2C of the LED element 2. In the present embodiment, all the LED elements 2 which are held in the suction holes 3A as a holding portion and are conveyed to the inspection position A are photographed by the cameras 16 and 17 and are inspected based on their image data. A quality inspection is performed by adjusting the position of the probe 11 in the XY directions.

The rotary table 3 is placed in close contact with the upper surface 12A of the fixed table 12 and is slidable while maintaining airtightness with the upper surface 12A. In the vicinity of the outer peripheral portion of the rotary table 3, a set of two suction holes 3A for holding the LED elements 2 at equal pitches in the circumferential direction is formed. A holding portion for holding the LED element 2 is configured by the pair of suction holes 3A (see FIG. 3).
When the rotary table 3 is intermittently rotated by a predetermined pitch by the drive mechanism 13, the suction holes 3A of each set as a holding portion are provided at the supply position C, the inspection position A, the discharge position D, and other predetermined positions on the moving path. It is supposed to be paused at (see Fig. 3). Then, when the LED element 2 held in the suction hole 3A is temporarily stopped at the inspection position A, the inspection device 4 performs a quality inspection.
As shown in FIGS. 1 and 2, a vertical communication hole 12B is formed in the outer peripheral portion of the fixed frame 12 at the inspection position A in accordance with the movement path of the suction hole 3A of the rotary table 3. When the rotary table 3 is intermittently rotated by the drive mechanism 13 and the suction holes 3A of each set holding the LED elements 2 are temporarily stopped at the inspection position A, the suction holes 3A communicate with the fixed frame 12. 12B is polymerized so that they communicate with each other (see FIGS. 2 and 3).
The probe unit 8 is arranged below the fixed table 12 at the inspection position A. Although the configuration of the probe unit 8 will be described in detail later, the probe unit 8 includes a casing 18 accommodating the inspection probe 11 in the upper negative pressure chamber 18A, and the top surface of the casing 18 (the negative pressure chamber 18A A circular opening 18B is formed on the top surface). An annular closing member 19 is fixed to the top surface of the casing 18 so as to surround the opening 18B. The upper surface 19A of the closing member 19 is a substantially upper end surface of the casing 18, and the upper surface 19A of the closing member 19 is kept in airtight contact with the lower surface 12C of the fixed table 12 around the communication hole 12B. ing.
As a result, the airtightness between the opening 18B of the casing 18 and the lower surface 12C of the fixed frame 12 is maintained, and the communication hole 12B and the negative pressure chamber 18A are always in communication, and in that state, they are integrally closed. The member 19 and the casing 18 are movable in the horizontal direction with respect to the fixed table 12.
A horizontal partition portion 18C is formed in the central portion of the casing 18 in the vertical direction, and an internal space of the casing 18 above the partition portion 18C is a negative pressure chamber 18A. The negative pressure chamber 18A and the communication hole 12B of the fixed table 12 above the negative pressure chamber 18A are always communicated with each other through an opening 18B. When the suction hole 3A of the rotary table 3 is not temporarily stopped at the inspection position A, the lower surface of the rotary table 3 closes the communication hole 12B.
On the other hand, when the suction hole 3A of the rotary table 3 is temporarily stopped at the inspection position A and overlaps with the communication hole 12B, the suction hole 3A as the holding portion, the communication hole 12B of the fixed frame 12 and the negative pressure chamber 18A communicate with each other. It is designed to do so (state of FIG. 2).
The negative pressure chamber 18A of the casing 18 communicates with the first negative pressure generating mechanism 21 via the conduit 20, and the operation of the first negative pressure generating mechanism 21 is controlled by the controller 14. When the rotary table 3 is intermittently rotated by the drive mechanism 13, the first negative pressure generating mechanism 21 is also operated, and at that time, the negative pressure chamber 18A and the communicating hole 12B are negatively charged via the conduit 20. It is designed to be supplied with pressure.

As shown by the broken line in FIG. 1, a first intake groove 12D and a second intake groove 12E in the circumferential direction are formed on the upper surface 12A of the fixed table 12 in accordance with the movement path of the suction holes 3A of the rotary table 3. There is.
The first intake groove 12D is formed from the supply position C via the inspection position A to a position slightly before the discharge position D, and the second intake groove 12E is formed over the discharge position D and a short region before and after the discharge position D. Has been done. Therefore, in the overlap area E slightly before the discharge position D, the first intake groove 12D and the second intake groove 12E are arranged so as to overlap each other in the circumferential direction of the fixed table 12.
The first intake groove 12D is in constant communication with the negative pressure chamber 18A via the communication hole 12B at the inspection position A. Therefore, the suction holes 3A (holding portions) of each set of the rotary table 3 in the region where the first intake groove 12D overlaps the first suction groove 12D, the communication hole 12B, the negative pressure chamber 18A, and the conduit 20 via the first suction groove 12D. 1 It communicates with the negative pressure generating mechanism 21. When the rotary table 3 is rotated, the first negative pressure generating mechanism 21 is also activated. Therefore, when the rotary table 3 is intermittently rotated, each suction position located in front of the supply position C to the discharge position D. Negative pressure is supplied to the holes 3A.
Therefore, when the rotary table 3 is intermittently rotated in the direction of the arrow and the suction holes 3A are sequentially paused at the supply position C, the LED element 2 is taken out from the wafer ring 5 by the robot 6 and the suction position C is sucked at the same time. The LED elements 2 are sequentially supplied onto the holes 3A, and the LED elements 2 are sucked and held by the suction holes 3A at the supply position C.
When the robot 6 supplies the LED element 2 to the suction hole 3A at the supply position C, the LED element 2 is photographed from the lower side by the lower camera 16, and the LED element photographed by the lower camera 16 is taken. The second image is transmitted to the control device 14.
The LED elements 2 held in the suction holes 3A at the supply position C are sequentially conveyed to the inspection position A by the intermittent rotation of the turntable 3, and in the process of being held in the suction holes 3A of each set. The formed LED element 2 is photographed from above by the upper camera 17, and the image is transmitted to the control device 14.

When the LED element 2 held in the suction hole 3A is carried into the inspection position A and temporarily stopped there, the suction hole 3A overlaps with the communication hole 12B of the fixed table 12 as shown in FIG. As will be described later in detail, in this state, the inspection probe 11 of the probe unit 8 is adjusted by the position of the horizontal plane in the XY directions and then is raised by a required amount, so that the upper end of the inspection probe 11 has a communication hole of the fixed table 12. The electrode 2D of the LED element 2 is brought into contact with the inner space of 12B and the suction hole 3A (see FIGS. 2 and 3). By energizing the electrode 2D through the inspection probe 11 in this state, the LED element 2 held in the suction hole 3A is caused to emit light, and the light emitting state is measured by the measuring device 7.
At the inspection position A, the LED element 2 whose quality inspection has been completed by the inspection device 4 including the probe unit 8 and the measuring device 7 is then held in the suction holes 3A with the intermittent rotation of the turntable 3. It is conveyed toward the discharge position D.
In the overlap region E slightly before the discharge position D, the first intake groove 12D and the second intake groove 12E are formed so as to overlap each other, and the conduit 22 is formed in the second intake groove 12E in the overlap region E. The second negative pressure generating mechanism 23 is connected via the. The operation of the second negative pressure generating mechanism 23 is controlled by the control device 14.
When the suction hole 3A is moved in the overlap area E, the opening on the lower side of the suction hole 3A, which is a long hole, is overlapped with the first intake groove 12D and the second intake groove 12E at the same time. On the other hand, at the discharge position D, the opening on the lower side of the suction hole 3A overlaps only the second intake groove 12E.
When the suction hole 3A holding the LED element 2 after the inspection moves into the overlap area E, the second negative pressure generating mechanism 23 is operated and the negative pressure is also supplied to the second intake groove 12E. Therefore, when the LED element 2 moves in the overlap region E, the holding state of the LED element 2 is maintained by the negative pressure from the first intake groove 12D and the second intake groove 12E.
When the suction hole 3A holding the LED element 2 passes through the overlap region E, only the negative pressure from the second intake groove 12E is supplied to the suction hole 3A, and then the LED element 2 is held. When the suction hole 3A is moved to the discharge position D, the controller 14 stops the supply of the negative pressure by the second negative pressure generating mechanism 23.
Therefore, the holding state of the LED element 2 by the suction hole 3A at the discharge position D is released, and the discharge device 9 holds the LED element 2 at the suction hole 3A at the discharge position D at the timing and then the outside of the turntable 3. It is designed to be discharged to one of the sorting devices.
The turntable 2 as a transfer device and its periphery are configured as described above. The configuration of the robot 6 that supplies the LED element 2 from the carry-in position B to the supply position C and the configuration of the discharge device 9 that discharges the LED element 2 from the rotary table 3 at the discharge position D are known from Patent Document 1 and the like. Therefore, detailed description thereof will be omitted.

Therefore, in the present embodiment, the entire probe unit 8 of the inspection device 4 is configured to be movable in the XY directions on the horizontal plane, whereby the individual LED elements 2 held in the suction holes 3A at the inspection position A are detected. The feature is that the position of the inspection probe 11 can be adjusted in the XY directions according to the position of the electrode 2D.
As shown in FIG. 2, the inspection device 4 includes a measurement device 7 arranged above the fixed table 12 at the inspection position A, and a probe unit 8 movably provided below the fixed table 12. ing.
The probe unit 8 is slidably pierced through the casing 18 in which a negative pressure chamber 18A is formed as an airtight space and a stepped through hole 18D of the partition 18C, so that the four inspection probes 11 are connected to each other. A holding member 25 for holding, an elevating mechanism 26 provided over the side wall 18E and the bottom portion 18F of the casing 18 below the partition 18C, and elevating the inspection probe 11 via the holding member 25, an elevating mechanism 26, and the like. And a base 27 that supports the entire casing 18 (the entire probe unit 8) including.
The base 27 is supported by an X-direction table 31 that is moved in the X direction on the horizontal plane, and the X-direction table 31 is provided on a Y-direction table 32 that is moved in the Y direction on the horizontal plane. That is, the entire probe unit 8 is horizontally supported by the base 27, the X-direction table 31, and the Y-direction table 32, and is movable in the XY directions on the horizontal plane.
The X-direction table 31 is linked with an X-direction moving motor 34 that moves the X-direction table 31 in the X-direction of the horizontal plane, and the Y-direction table 32 moves the Y-direction table 32 in the Y-direction. The motor 35 for moving in the Y direction is interlocked. The operation of both motors 34, 35 is controlled by the control device 14. The control device 14 rotates both motors 34 and 35 in the forward and reverse directions by a required amount to move the casing 18 and the inspection probe 11 provided therein through the X-direction table 31 and the Y-direction table 32 in the XY directions. You can do it.
The X-direction table 31, the Y-direction table 32, and the two motors 34, 35 constitute a position adjusting mechanism 36 for adjusting the position of the inspection probe 11 of the probe unit 8 in the XY directions.
As described above, the upper surface 19A of the closing member 19 integrated with the casing 18 is airtightly adhered to the lower surface 12C of the fixed table 12 around the communication hole 12B. Therefore, the position adjusting mechanism 36 maintains airtightness between the upper surface 19A of the closing member 19 and the lower surface 12C of the fixed table 12 even when the entire probe unit 8 is moved in the XY directions, and the negative pressure of the casing 18 is maintained. The sealed state of the chamber 18A is maintained.
The closing member 19 only needs to have a smooth upper surface 19A, and for example, a metal such as aluminum whose slipperiness is improved by nitriding treatment can be used. Other materials may be used as long as they have good smoothness, for example, engineering plastics may be used.

As shown in FIG. 2, a stepped through hole 18D having a larger diameter on the lower side than on the upper side is formed in the partition 18C of the casing 18C, and a columnar holding member 25 is vertically formed therein. It is provided so as to slide freely in the direction.
The four inspection probes 11 are supported vertically upward by the holding member 25 and are housed in the negative pressure chamber 18A. The inspection probe 11 is made of a metal wire rod, and its upper end (tip) is supported by the holding member 25 at the same height. When the suction hole 3A as the holding portion does not temporarily stop at the position of the communication hole 12B at the inspection position A (when it does not overlap), the holding member 25 is located at the lower end, and at that time, the upper end of the inspection probe 11 is It is supported at a lower end position in the communication hole 12B, which is slightly lower than the upper surface 12A.
On the other hand, when the suction hole 3A holding the LED element 2 temporarily stops at the inspection position A and overlaps with the communication hole 12B, the lifting mechanism 26 raises the holding member 25 by a predetermined amount to the rising end position. Therefore, the inspection probe 11 is also raised to the ascending end, and the upper end of the inspection probe 11 comes into contact with the electrode 2D on the lower surface of the LED element 2 held by the inspection probe 11 via the suction hole 3A (FIG. 2). , See FIG. 3).

Next, the elevating mechanism 26 for elevating the inspection probe 11 via the holding member 25 will be described.
Below the partitioning portion 18C of the casing 18, only the side wall 18E that is the outer side in the radial direction and the bottom portion 18F connected to the lower end thereof are arranged, and the remaining side wall portion and about half of the bottom portion are external. It is exposed to.
A nut member 41 is connected to a lower end portion of the holding member 25 penetrating the stepped through hole 18D via a connecting tool, and a linear slider 42 is connected to the nut member 41 in a vertical direction. .. A linear rail 43 is vertically fixed to the inner surface of the side wall 18E, and a linear slider 42 is slidably engaged with the linear rail 43.
The motor 44 is arranged on the bottom portion 18F on the lower side of the holding member 25, and the ball screw 45 connected to the drive shaft of the motor 44 is screwed into the nut member 41.
The operation of the motor 44 is controlled by the control device 14, and the control device 14 rotates the motor 44 forward and backward by a required amount to move the holding member 25 and the inspection probe 11 to the rising end and the falling end. It is designed to be raised and lowered.
When the suction hole 3A holding the LED element 2 is temporarily stopped at the inspection position A, the control device 14 causes the motor 44 to rotate in the normal direction by a required amount, so that the holding member 25 and the inspection probe 11 provided therein are moved from the lower end to the upper end. Then, the upper end (tip) of the inspection probe 11 rises above the upper surface 12A of the fixed table 12 and comes into contact with the electrode 2D exposed on the lower surface of the LED element 2 via the suction holes 3A. In this state, the LED element 2 is energized to emit light through the inspection probe 11, and the light emitting state is inspected by the measuring device 7.
On the other hand, when the checked LED element 2 held in the suction hole 3A is moved toward the discharge position D, the control device 14 reverses the motor 44 by a required amount, so that the holding member 25 and the inspection probe 11 are It descends from the ascending end to the descending end and stops there. At that time, the upper end of the inspection probe 11 is located in the communication hole 12B which is slightly lower than the upper surface 12A of the fixed table 12. The lifting mechanism 26 includes a motor 44, a ball screw 45, a nut member 41, a holding member 25, a linear slider 42, and a linear rail 43.

In this embodiment, since the cylindrical holding member 25 is slidably passed through the stepped through hole 18D, it is necessary to maintain the airtightness between the outer peripheral surface of the holding member 25 and the through hole 18D. is there. Therefore, a rubber annular seal member 29 is attached to the outer peripheral portion of the holding member 25, and a stopper ring 30 is fitted to the lower side of the annular seal member 29 so as to be in close contact with the annular seal member 29. This prevents the annular seal member 29 from being displaced in the axial direction (vertical direction) of the holding member 25.
The lower half of the annular seal member 29 is a main body having a rectangular cross section, and the upper half of the annular seal member 29 is a lip portion 29A having a C-shaped cross section. Then, the upper end (tip) of the lip portion 29A is brought into contact with the step end surface 18Da of the through hole 18D from below. In this way, the lower end of the through hole 18D is surrounded by the upper end of the lip portion 29A, thereby maintaining airtightness between the outer peripheral surface of the holding member 25 and the inner peripheral surface of the stepped through hole 18D.
Since the lip portion 29A can be easily elastically deformed in the vertical direction (axial direction), even when the holding member 25 is moved up and down by the elevating mechanism 26, the holding member 25 is moved up and down. The upper end of the lip portion 29A is in close contact with the stepped end surface 18Da of the through hole 18D, so that the airtightness between the outer peripheral surface of the holding member 25 and the through hole 18D is always maintained.
Since the outer peripheral surface of the main body of the annular seal member 29 is separated from the inner peripheral surface of the through hole 18D, even if the holding member 25 is moved up and down, the main body of the annular seal member 29 becomes the inner peripheral surface of the through hole 18D. It does not slide.
Since the annular seal member 29 of this embodiment is attached to the holding member 25 as described above, even if the lip portion 29A is repeatedly elastically deformed as the holding member 25 moves up and down, the lip portion 29A is also deformed. It can delay damage to itself. As a result, the life of the annular seal member 29 can be extended and the frequency of replacement of the annular seal member 29 can be reduced as compared with the annular seal member of Patent Document 1 described above.

Next, the measuring device 7 arranged at the inspection position A is a dome-shaped integrating sphere and includes a light receiving element (not shown). When the inspection probe 11 is brought into contact with the electrode 2D of the LED element 2 which is temporarily stopped at the inspection position A, and the current is applied to the electrodes, the five light emitting surfaces of the LED element 2 emit light. It is supposed to be done. The measurement result such as the amount of light received from the LED element 2 measured by the measuring device 7 is transmitted to the control device 14, and the control device 14 controls the LED device 2 based on the measurement result by the measuring device 7. Optical qualities such as brightness, luminance, tint, and defective light emission are determined. Note that the configuration of the measuring device 7 using the integrating sphere is known in the related art, and therefore further description will be omitted.
In this way, the LED device 2 is inspected by the inspection device 8 including the probe unit 8 and the measurement device 7, and the control device 14 determines the optical quality of the LED device 2 based on the measurement result of the measurement device 7. The judgment result is stored.

In the above structure, the wafer ring 5 on which a large number of LED elements 2 are mounted is placed in a state in which the rotary table 12 is intermittently rotated in the arrow direction by the drive mechanism 13 and the first negative pressure generating mechanism 21 is operated. Are supplied to the carry-in position B near the turntable 3.
Then, the LED elements 2 on the wafer ring 5 are sequentially held by the robot 6 one by one and then transferred to the supply position C, where they are placed at the positions of the suction holes 3A and 3A on the upper surface of the rotary table 3. .. At that time, the robot 6 supplies the LED element 2 onto the turntable 3 so that the centerline 2a of the LED element 2 coincides with the radiation direction of the turntable 3. Since the negative pressure is supplied to the suction hole 3A as the holding portion, the LED element 2 supplied from the robot 6 to the supply position C is sucked and held by the suction hole 3A as the holding portion.
The LED element 2 transferred from the carry-in position B to the supply position C by the robot 6 is photographed by the lower camera 16 from the lower side, and the image photographed by the lower camera 16 is transmitted to the control device 14. The control device 14 recognizes the outline of the LED element 2 and the positions of the electrodes 2D based on the image from the lower camera 16 (see FIG. 3).
As the rotary table 3 is intermittently rotated in the direction of the arrow, the LED elements 2 held in the suction holes 3A are intermittently transported from the supply position C to the inspection position A. In this process, each LED element 2 is photographed from the upper side by the upper camera 17, and the image photographed by the upper camera 17 is transmitted to the control device 14. Based on the images transmitted from the lower camera 16 and the upper camera 17, the control device 14 recognizes the position of the electrode 2D in the XY direction on the horizontal plane of each LED element 2 that is sucked and conveyed by the suction hole 3A. To do.
Then, when the LED element 2 held in the suction holes 3A is temporarily stopped at the inspection position A due to the intermittent rotation of the turntable 3, the control device 14 causes the images from the cameras 16 and 17 for the LED element 2 to be captured. The position shift amount in the XY direction of the inspection probe 11 of the probe unit 8 is calculated with respect to the position of the electrode 2D in the XY direction based on The direction table 31 and the Y direction table 32 are moved in the XY directions. As a result, the stop position of the inspection probe 11 in the XY directions on the horizontal plane is adjusted, and the upper ends of the four inspection probes 11 stop immediately below the four electrodes 2D of the LED element 2.
After that, the control device 14 causes the motor 44 of the elevating mechanism 26 to rotate in the normal direction by a predetermined amount, so that the holding member 25 and the inspection probe 11 provided on the holding member 25 are raised to the rising end and surely come into contact with the electrode 2D of the LED element 2. (See Figure 3).
After that, when the control device 14 applies a current to the electrode 2D via the inspection probe 11, the LED element 2 emits light from the five light emitting surfaces, and the light emitting state is measured by the measuring device 7.
Then, the measurement device 7 receives the light emitted from the LED element 2 and transmits the measurement result to the control device 14. The control device 14 determines the optical quality of the LED element 2, such as the brightness, the brightness, the tint, and the light emission failure, based on the measurement result from the measuring device 7, and stores the optical quality.
When the probe unit 8 of the inspection device 4 and the measuring device 7 perform the quality inspection on the LED element 2 temporarily stopped at the inspection position A as described above, the control device 14 controls the motor 44 of the lifting mechanism 26. Is reversed to lower the holding member 25 and the inspection probe 1 from the ascending end to the descending end.
Although the holding member 25 is moved up and down by the elevating mechanism 26 in order to move the inspection probe 11 up and down as described above, the lip portion 29A of the annular seal member 29 attached to the holding member 25 can be easily moved in the axial direction (vertical direction). Since it is elastically deformed, the upper end of the lip portion 29 is kept in close contact with the step end surface 18Da of the through hole 18D. Therefore, the airtightness between the holding member 25 and the through hole 18 is maintained, and the negative pressure state of the negative pressure chamber 18A is not destroyed by the outside air entering the negative pressure chamber 18A from between them.
After that, as the turntable 3 is intermittently rotated, the LED element 2 that has been inspected at the inspection position A is conveyed toward the discharge position D on the downstream side, while the next new LED element 2 is conveyed. Is temporarily stopped at the inspection position A.
Then, the controller 14 rotates the motors 34 and 35 of the position adjusting mechanism 36 in the forward and reverse directions by a required amount in accordance with the position of the electrode 2D of the LED element 2 as described above. The inspection probe 11 provided stops just below the electrode 2D of the LED element 2.
After that, the control device 14 causes the motor 44 of the elevating mechanism 26 to rotate in the normal direction by a required amount, so that the holding member 25 and the inspection probe 11 are raised to the rising end, and the inspection probe 11 is surely attached to the electrode 2D of the LED element 2. Contact.
In this state, the LED element 2 is energized as described above, the light emitted from the LED element 2 is measured by the measuring device 7, and the control device 14 determines the optical quality of the LED element 2.
In this way, for each LED element 2 that is temporarily stopped at the inspection position A, the controller 14 based on the measurement result of the light emission state of the LED element 2 by the probe unit 8 and the light emission state by the measuring device 7. The quality inspection by
When the LED element 2 that has undergone the quality inspection by the inspection device 4 is transported to the discharge position D with the intermittent rotation of the turntable 3, the holding state by the suction holes 3A is released as described above. After being held by the discharging device 9 and removed from the rotary table 3 at the position of the suction hole 3A, the discharging device 9 discharges it to a classification device (not shown) according to the classification of the quality judgment result by the control device 14.

As described above, in this embodiment, when the quality inspection of the LED element 2 is performed at the inspection position A, first, the electrode 2D of the LED element 2 temporarily stopped at the inspection position A is aligned with the position in the XY direction. The position adjusting mechanism 36 moves the inspection probe 11 in the XY directions of the horizontal plane by a required amount and positions it under the electrode 2D. Then, after that, the inspection probe 11 is raised by the elevating mechanism 26 and brought into contact with the electrode 2D, and then the quality inspection is performed.
Therefore, the inspection probe 11 can be surely brought into contact with the electrode 2D of the LED element 2, and the quality inspection can be performed by causing the LED element 2 to emit light in that state. Therefore, the contact failure between the inspection probe 11 and the electrode 2D can be reliably prevented, and the LED element 2 can be subjected to a highly accurate quality inspection.
Further, the annular seal member 29 mounted on the holding member 25 has the upper end of its lip portion 29A brought into contact with the step end surface 18Da of the through hole 18D from below, so that the annular seal member 29 is annular compared to the annular seal member of Patent Document 1. The life of the seal member 29 is extended, and the frequency of replacement of the annular seal member 29 can be reduced.

Next, FIG. 4 shows a second embodiment of the inspection device 4. In the second embodiment, the upper portion of the casing 18 of FIG. 2 above the partition 18C is formed as a cylindrical side wall 51 separated from the partition 18C. The upper end of the side wall 51 is integrally connected to the lower surface 12C of the fixed table 12 while keeping airtightness. That is, the side wall 51 constitutes a part of the fixed table 12. On the other hand, the end surface 51A on the lower side of the side wall 51 is slidable while maintaining airtightness with the upper surface 18Ca of the partitioning portion 18C. In the second embodiment, the inside of the side wall 51 above the partition 18C serves as the negative pressure chamber 18A as an airtight space. The other structure is the same as that of the first embodiment shown in FIG. 2, and the same numbers are given to the respective members corresponding to those in FIG.
In the second embodiment, the casing 18 located below the partition 18C is moved in the XY directions on the horizontal plane, whereby the inspection probe 11 is moved in the XY directions on the horizontal plane. There is. Further, at this time, the lower end surface 51A of the side wall 51 and the upper surface 18Ca of the partitioning portion 18C slide while maintaining airtightness. Even in such a second embodiment, the same action and effect as those of the first embodiment can be obtained.

In the above embodiment, the semiconductor element 2 is temporarily stopped at the inspection position A and then the inspection probe 11 is moved in the XY directions on the horizontal plane. However, before the semiconductor element 2 is carried into the inspection position A. Alternatively, the inspection probe 11 may be moved in the XY directions. That is, regarding the next semiconductor element 2 carried in to the inspection position A, before the semiconductor element 2 is carried in to the inspection position A, the inspection is performed according to the displacement amount of the inspection probe 11 in the XY directions with respect to the electrode 2D of the semiconductor element 2. The probe 11 is moved in the XY directions by a required amount and stopped. After that, as soon as the semiconductor element 2 is carried into the inspection position A and temporarily stopped, the inspection probe 11 may be raised by the elevating mechanism 26 so as to come into contact with the electrode 2D of the semiconductor element 2.
Further, in the above-mentioned embodiment, the holding portion for holding the semiconductor element 2 is constituted by the pair of suction holes 3A, 3A, but the holding portion may be constituted by the single suction hole 3A. ..
Further, in the above embodiment, the negative pressure is supplied from the first negative pressure generating mechanism mechanism 21 to the first suction groove 12D via the negative pressure chamber 18A, but the negative pressure dedicated to the first suction groove 12D is used. A supply mechanism may be separately provided, and the negative pressure may be directly supplied from the negative pressure supply mechanism to the first suction groove 12D.
Further, in each of the embodiments described above, a stepped through hole 18D having a larger diameter on the lower side than on the upper side is formed in the partition portion 18C, and the outer periphery of the holding member 25 on the lower side of the step portion end surface 18Da. Although the annular seal member 29 is provided in the portion, the through hole 18D in FIG. 2 may be upside down and the annular seal member 29 may be attached to the outer peripheral portion of the holding member 25 inside the negative pressure chamber 18A. good.
Further, in each of the above embodiments, only one measuring device 7 of the inspection device 4 is arranged, but two or more measuring devices 4 may be provided.
In the above embodiment, the elevating mechanism 26 is arranged so as to be exposed below the partition 18C, but the elevating mechanism 26 may be arranged in the negative pressure chamber 18A. That is, although the lifting mechanism 26 is exposed in FIGS. 2 and 4, the side wall 18E is extended so as to surround the lifting mechanism 26, and the bottom portion 18F has the same dimension as the partition portion 18C. The lifting mechanism 26 may be entirely covered with the casing 18 by being connected to the lower end.
Further, in the above embodiment, when the robot 6 supplies the LED element 2 onto the rotary table 3, the direction is regulated so that the center line 2a of the LED element 2 coincides with the radiation direction of the rotary table 3. However, a rotation mechanism for rotating the LED element 2 in the horizontal plane by a required angle is provided at the position of the adsorption hole 3A on the turntable 3 side to rotate the LED element 2 held in the adsorption hole 3A as a holding portion by the required angle. Then, the direction of the LED element 2 held in the suction hole 3A may be restricted.

1. Semiconductor element inspection device 2. LED element (semiconductor element)
3 ... Rotary table 3A ... Suction hole (holding part)
8 ... Probe unit 11 ... Inspection probe 12 ... Fixed table 12B ... Communication hole 18 ... Casing 18A ... Negative pressure chamber (airtight space)
26 Elevating mechanism 31 X direction table 32 Y direction table 36 Position adjustment mechanism A Inspection position C Supply position

Claims (3)

A rotary table mounted on a fixed table and intermittently rotated in a predetermined direction, and a lower surface of a semiconductor element mounted on the rotary table, which is formed at a plurality of circumferential positions of the rotary table. And a suction hole formed on the fixed table and communicating with the suction hole when the suction hole holding the semiconductor element at the inspection position set on the moving path of the suction hole is temporarily stopped. The hole is provided so as to be able to move up and down to the inspection position, and the electrode exposed on the lower surface of the semiconductor element can be contacted via the suction hole of the rotary table temporarily stopped at the inspection position and the communication hole of the fixed table. In a semiconductor element inspection device comprising an inspection probe and an elevating mechanism for elevating and lowering the inspection probe to contact an electrode of a semiconductor element temporarily stopped at the inspection position,
A casing that forms an airtight space with the fixed table is provided below the fixed table at the inspection position, the inspection probe is arranged in the airtight space, and the casing is moved in the XY directions on the horizontal plane. An apparatus for inspecting a semiconductor device, which is provided with a position adjusting mechanism. A holding member is slidably pierced through a vertical through hole formed in the casing, the inspection probe is provided on the holding member, and the lifting mechanism inspects via the holding member. It is designed to raise and lower the probe,
Further, the annular seal member is attached to the holding member, and the lip portion provided on the annular seal member is brought into close contact with the casing so as to surround the through hole, thereby maintaining the airtightness of the airtight space. The semiconductor device inspection apparatus according to claim 1, wherein A detection mechanism that detects the position of the electrode of the semiconductor element, and a control device that controls the operation of the position adjustment mechanism based on the detection result of the detection mechanism,
The semiconductor device according to claim 1, wherein the control device moves the inspection probe by a required amount in the XY directions of a horizontal plane based on the detection result of the detection mechanism via the position adjustment mechanism. Element inspection device.

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