CN114975195B - Wafer cassette, wafer transfer apparatus, wafer transfer control method, electric apparatus, and storage medium - Google Patents

Wafer cassette, wafer transfer apparatus, wafer transfer control method, electric apparatus, and storage medium Download PDF

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Publication number
CN114975195B
CN114975195B CN202210355328.XA CN202210355328A CN114975195B CN 114975195 B CN114975195 B CN 114975195B CN 202210355328 A CN202210355328 A CN 202210355328A CN 114975195 B CN114975195 B CN 114975195B
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Prior art keywords
wafer
module
carrying
handling
placing
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CN114975195A (en
Inventor
张原�
杨青峰
潘国瑞
崔智敏
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Shenzhen Sking Intelligent Equipment Co Ltd
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Shenzhen Sking Intelligent Equipment Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The embodiment of the application discloses a wafer box, wafer carrying equipment, a wafer carrying control method, electrical equipment and a storage medium. The wafer box comprises two bearing parts and a light source, wherein the two bearing parts are oppositely arranged, the two bearing parts are enclosed to form an accommodating space between the two bearing parts and a picking and placing opening arranged on one side of the accommodating space, the accommodating space is used for accommodating a plurality of wafers parallel to a first reference plane, and the light source is arranged on one side, away from the picking and placing opening, of the accommodating space and is used for emitting light towards the accommodating space, so that the purposes of accurate alignment, carrying and automatic operation of the wafers can be achieved.

Description

Wafer cassette, wafer transfer apparatus, wafer transfer control method, electric apparatus, and storage medium
Technical Field
The present disclosure relates to the field of semiconductor technologies, and in particular, to a wafer cassette, a wafer handling apparatus, a wafer handling control method, an electrical apparatus, and a storage medium.
Background
In the process of packaging and testing semiconductors, wafers need to be transported among different devices to carry out operations such as scribing, probe detection or die bonding, and automatic wafer transportation and detection become important links in the process flow of manufacturing semiconductors. Different wafer operation process equipment have different requirements on the size, surface quality and grain yield of incoming wafers, and the wafers are affected by the environment and operation in the processes of storage, transportation and carrying operation, so that certain damage and reject ratio exist, and the problems that the conventional wafer can not be subjected to definite force sensing and counting in the process of taking and placing all bring challenges to the accurate alignment, carrying and automatic operation of the wafers.
Disclosure of Invention
The embodiment of the application discloses a wafer box, wafer carrying equipment, a wafer carrying control method, electrical equipment and a storage medium, and can achieve the aims of accurate alignment, carrying and automatic operation of wafers.
On the one hand, the embodiment of the application discloses wafer box, the wafer box is including two bearings and the light source of relative setting, two the bearing encloses into and is located two accommodation space between the bearing with be located the mouth of getting of accommodation space one side, accommodation space is used for accomodating the wafer that the multichip is on a parallel with first reference surface, the light source sets up accommodation space is kept away from get one side of putting the mouth, be used for towards accommodation space is luminous.
Compared with the prior art, the wafer box provided by the application can increase the brightness in the wafer box by arranging the light source which emits light towards the containing space, so that the wafer box can be more clearly observed in the storage condition of the wafers.
According to an embodiment of the application, the light source is a surface light source, and the surface light source comprises a light emitting surface facing the accommodating space, and the light emitting surface is opposite to the pick-and-place opening. By setting the light source as a surface light source, and setting the light emitting surface opposite to the pick-and-place opening, the light emitted by the light source can emit light to the direction of the pick-and-place opening, so that the placement position of the wafer can be accurately obtained.
According to an embodiment of the present application, the carrier includes the base plate and connects the base plate is close to a plurality of loading boards of one side of accommodation space, a plurality of the loading boards is along first default direction interval setting, two the multiple of carrier the loading board one-to-one sets up, and two of relative setting the loading board constitutes the carrier assembly that has the loading position, and is used for bearing respectively the both ends of wafer.
According to an embodiment of the application, the wafer box further comprises a pressure sensor, a counting module and a communication module, wherein the pressure sensor is arranged on one side of the bearing plate bearing the wafer and is electrically connected with the counting module and the communication module, the communication module is electrically connected with the control module, and the counting module is further used for displaying counting results. The pressure sensors are arranged on the two bearing plates of the bearing assembly, the placement condition of the wafer in the wafer box can be accurately obtained through pressure sensing, then the counting module counts and displays the wafer, and meanwhile, the communication module sends the counting result to the control module, so that the control module can conveniently control the operation, and accurate carrying and automatic operation of the wafer are achieved.
In two aspects, the embodiment of the application also discloses a wafer handling device, which includes the wafer box, the handling module, the vision sensing module and the control module according to any one of the above embodiments, where the handling module is used to acquire or place the wafer from the pick-and-place port; the visual sensing module is used for shooting the accommodating space at one side of the pick-and-place opening and outputting a first shooting image when the light source emits light towards the accommodating space; the control module is electrically connected with the carrying module and the vision sensing module and is used for receiving and controlling the carrying module to conduct alignment according to the first shooting image and controlling the carrying module to conduct acquisition or placement of the wafer after the alignment is completed.
Compared with the prior art, the wafer handling equipment provided by the application controls the vision sensing module to shoot and output the first shooting image when the light source emits light towards the accommodating space, so that the control module controls the handling module to align according to the first shooting image, controls the handling module to acquire or place the wafer, and realizes accurate alignment and grabbing of the wafer in the wafer box, thereby realizing accurate handling and automatic operation of the wafer.
According to an embodiment of the application, the handling module comprises a moving component electrically connected with the control module and a wafer carrier connected with the moving component, wherein the moving component is used for driving the wafer carrier to move under the control of the control module, and the vision sensing module is arranged on the wafer carrier. Through with the vision sensing module set up in on the wafer carrier of transport module, make the vision sensing module can with the wafer carrier moves jointly, and then need not other devices and drive alone the vision sensing module moves, and can make the vision sensing module shoots the visual angle of first shooting image with the operation visual angle of wafer carrier is the same, makes control algorithm simpler, and is difficult for makeing mistakes, has higher operating efficiency when realizing accurate transport and automation mechanized operation to the wafer.
According to an embodiment of the present application, the moving assembly includes a base, a first moving joint that is disposed on the base and can stretch out and draw back along a second preset direction, a first rotating arm with one end rotationally connected with the first moving joint, a second rotating arm with one end rotationally connected with the other end of the first rotating arm, and a wafer carrier rotationally connected with the other end of the second rotating arm. By arranging the moving assembly to be a multi-degree-of-freedom robot, accurate carrying and automatic operation of the wafer can be realized.
According to one embodiment of the present application, the wafer carrier includes a connection base and a carrying portion, wherein the connection base is disposed on the moving assembly along the second preset direction, and the carrying portion is connected to one side of the connection base; the visual sensing module is arranged on one side of the connecting matrix away from the moving assembly along the second preset direction, and the visual sensing module is used for shooting towards one side of the carrying part. Through will remove the subassembly visual sense module with the transport portion connects the setting, can make control more high-efficient, and the transport is more accurate.
According to one embodiment of the application, the visual sensing module comprises a camera mounting plate arranged on the connecting substrate, a first industrial camera arranged on the camera mounting plate and a first lens arranged on the first industrial camera.
According to an embodiment of the present application, the wafer handling device further includes a wafer sensor, the wafer sensor set up in the handling portion is close to the surface of wafer one side and is located the handling portion is kept away from the one end of connecting the base member, the wafer sensor electricity is connected the control module, is used for the sensing the wafer and output the second sensing signal extremely the control module is made the control module is right the handling module carries the wafer is counted and/or is got and put the control. The wafer sensor is arranged at one end, close to the surface of one side of the wafer, of the carrying part and is located at the end, far away from the connecting substrate, of the carrying part, so that the control module can sense the contact state of the wafer and the carrying part in real time through the second sensing signal, accurately sense and synchronously count the wafer taking and placing, and the reliability of the wafer taking, placing and carrying process is ensured.
According to one embodiment of the present application, the handling portion includes two arm portions, where the two arm portions are connected to the connection base body and enclose a U shape with an opening, the opening faces to a side far away from the connection base body, and the wafer sensor is disposed at an end of the arm portion far away from the connection base body; one side of the two arm parts carrying the wafer is respectively provided with one wafer sensor; the wafer sensor is a pressure film sensor. The wafer sensors are respectively arranged on one sides of the two arm parts for bearing the wafers, so that the pressure sensing of the wafers is not influenced by the position deviation of the wafers, the sensing is more accurate, and meanwhile, the wafer sensors are pressure film sensors, so that the pressure of the wafers can be accurately sensed, and meanwhile, the taking and placing of the wafers are not influenced.
According to an embodiment of the application, the control module monitors whether the handling module obtains the wafer from the wafer box according to the second sensing signal, when the control module judges that the handling module is in an empty state according to the second sensing signal, the control module controls the vision sensing module to shoot the accommodating space again from the picking and placing port to update the first shooting image, and performs alignment again according to the updated first shooting image, and controls the handling module to obtain the wafer after the alignment is completed again. The control module judges whether the carrying module is in the idle state or not according to the second sensing signal, so that the carrying module can be aligned again when in the idle state, and the wafer is acquired again, thereby avoiding shutdown and improving the operation efficiency.
According to an embodiment of the present application, the wafer handling device further includes a first magazine, the handling module is configured to obtain the wafer from the wafer magazine, and transport and place the wafer to the first magazine, when the control module determines, according to the second sensing signal, that the handling module performs the placing operation of placing the wafer to the first magazine and then is still in a load-bearing state, the control module controls the handling module to perform the placing operation of placing the wafer to the first magazine again. Whether the carrying module is in a bearing state after carrying out the placing action of placing the wafer to the first material box or not is judged by the control module according to the second sensing signal, and the placing action of placing the wafer to the first material box can be carried out again when the carrying module is in the bearing state, so that the wafer is prevented from being damaged and stopped, and meanwhile, the operation efficiency is improved.
According to an embodiment of the application, the wafer handling device further comprises a second magazine and a defect detection module, the defect detection module is located on a handling path from the wafer magazine to the first magazine of the handling module, the defect detection module is electrically connected with the control module, the defect detection module is used for carrying out defect detection on the wafer transported by the handling module and outputting defect detection information to the control module, and the control module is further used for controlling the handling module to place the wafer qualified in detection in the first magazine and place the wafer unqualified in detection in the second magazine according to the defect detection information. Through follow the wafer box extremely set up on the transport route of first magazine defect detection module, simultaneously right the wafer carries out defect detection can reduce the handling error that the wafer produced in the handling, saves handling time, improves detection efficiency, simultaneously, will detect unqualified the wafer is placed the second magazine can carry out the preliminary examination classification in the handling, for the follow-up processing technology of wafer provides the preliminary examination sample, avoids the waste material to get into the follow-up processing procedure, and then improves production efficiency and reduction equipment occupation space.
According to an embodiment of the present application, the vision sensing module is further configured to capture a second captured image from the receiving space of the first magazine before the handling module places the wafer to the first magazine, and the control module is further configured to control the handling module to perform a discharging alignment according to the second captured image, and control the handling module to perform a placing action of placing the wafer to the first magazine after the discharging alignment is completed; and/or the vision sensing module is further used for shooting the accommodating space of the second material box from the taking and placing opening of the second material box to obtain a third shooting image before the carrying module places the wafer to the second material box, and the control module is further used for controlling the carrying module to carry out discharging alignment according to the third shooting image and controlling the carrying module to carry out placing action of placing the wafer to the second material box after the discharging alignment is completed. Through the handling module will the wafer will before placing to first magazine get from getting of first magazine put the mouth shooting the accommodation space of first magazine obtains the second shooting image and/or before the handling module will the wafer is placed to the second magazine get from getting of second magazine put the mouth shooting the accommodation space of second magazine obtains the third shooting image, can make the handling module is at every turn acquireing and/or placing the in-process operation of wafer is more accurate, has ensured to get the reliability of putting the operation of wafer, has ensured operating efficiency simultaneously.
According to an embodiment of the application, the defect detection information includes a detection image, the defect detection module includes a camera module and a support for supporting the camera module, the camera module is used for shooting the wafer transported by the transport module to obtain the detection image, and the control module is further used for analyzing the defect proportion of the wafer according to the detection image and comparing the defect proportion with a preset proportion to judge whether the wafer is qualified or not.
According to one embodiment of the application, the bracket comprises a supporting body, a camera supporting part connected with one side of the supporting body and a light source supporting part connected with one side of the supporting body, the camera shooting module comprises a second industrial camera, a second lens and a light supplementing lamp, the second lens is installed on the second industrial camera, and the second industrial camera is arranged at one end, far away from the supporting body, of the camera supporting part; the light supplementing lamp is arranged at one end of the light source supporting part far away from the supporting main body; the wafer conveyed by the conveying module is used for being placed parallel to the first reference surface, the second industrial camera faces the wafer, and the optical axis of the second industrial camera is perpendicular to the first reference surface; the light supplementing lamp comprises an annular light emitting part, the annular light emitting part is located between the second industrial camera and the carrying module and used for emitting light towards the wafer, and the second industrial camera is used for shooting the wafer through a hollow area of the annular light emitting part so as to acquire the detection image. Through setting up the transport of transport module transport the wafer is on a parallel with first reference surface places, the second industry camera orientation the wafer just the optical axis of second industry camera is perpendicular to first reference surface can make the second industry camera perpendicular shooting the wafer, simultaneously, under the illumination of light filling lamp, can make defect detection of defect detection module is more accurate, and the precision is higher.
In three aspects, the embodiment of the application also discloses a wafer handling control method, which includes the following steps:
the wafer box comprises two bearing pieces and a light source which are oppositely arranged, wherein the two bearing pieces are enclosed to form an accommodating space between the two bearing pieces and a taking and placing opening at one side of the accommodating space, the accommodating space is used for accommodating a plurality of wafers parallel to a first reference plane, and the light source is positioned at one side of the accommodating space away from the taking and placing opening;
when the light source emits light towards the accommodating space, acquiring a first shooting image of the accommodating space shot at one side of the picking and placing opening;
controlling the carrying module to perform alignment according to the first shooting image; and
and after the alignment is finished, controlling the carrying module to acquire or place the wafer.
Compared with the prior art, the wafer carrying control method provided by the application obtains the first shooting image shot on one side of the picking and placing port and controls the carrying module to carry out alignment according to the first shooting image when the light source emits light towards the containing space, so that the wafer is obtained or placed, the wafer in the wafer box is accurately aligned and grabbed, and the wafer is accurately carried and automatically operated.
According to one embodiment of the present application, the wafer handling control method further includes the steps of:
before the first shooting image is acquired, controlling the carrying module to move to the current detection position according to the current detection position parameter; and
judging whether the wafer exists in the current material taking position or the current discharging position corresponding to the current detection position according to the first shooting image, and if the wafer does not exist in the current material taking position or the current discharging position, executing the step of controlling the carrying module to carry out contraposition according to the first shooting image.
In the above embodiment, whether the wafer is present in the current material taking position or the current material discharging position corresponding to the current material taking position is judged, and the alignment of the carrying module is controlled, so that the dislocation operation when the wafer is not present in the current material taking position or the wafer is already placed in the current material discharging position can be avoided, the damage to the wafer is avoided, the shutdown caused by the operation error can be avoided, and the reliability and the operation efficiency of the operation are improved.
According to an embodiment of the application, the step of controlling the handling module to perform alignment according to the first captured image includes:
Correcting a current sampling level parameter or a current discharging level parameter according to the first shooting image to obtain a corrected sampling level parameter or a corrected discharging level parameter, and updating the current sampling level parameter or the current discharging level parameter according to the corrected sampling level parameter or the corrected discharging level parameter;
and controlling the carrying module to move to the current material taking level or the current material discharging level according to the corrected material taking level parameter or the corrected material discharging level parameter.
In the above embodiment, the handling module is controlled to move to the current fetching level or the current discharging level by the corrected fetching level parameter or the corrected discharging level parameter obtained according to the first captured image, so that the operation is more accurate, the damage to the wafer is avoided, the shutdown caused by the operation error is avoided, and the reliability and the operation efficiency of the operation are improved.
According to one embodiment of the present application, in the step of determining whether the wafer exists at the current sampling position or the current unloading position corresponding to the current detection position according to the first captured image,
if the current material taking position does not have the wafer or the current material discharging position is used for placing the wafer, judging whether the current detection position is the maximum detection position,
If the current detection position is the maximum detection position, controlling the carrying module to return to an initial position; and if the current detection bit is not the maximum detection bit, respectively adjusting the current detection bit parameter, the current detection bit parameter or the current discharging bit parameter by preset values, and returning to execute the step of controlling the carrying module to move to the current detection bit according to the current detection bit parameter according to the adjusted current detection bit parameter.
In the above embodiment, by determining that the current detection position is the maximum detection position, the handling module may be quickly returned to the initial position for subsequent operations after reaching the maximum detection position, thereby improving the operation efficiency.
According to an embodiment of the present application, the step of controlling the handling module to perform the placement of the wafer after the alignment is completed includes: and controlling the carrying module to place and return the wafer according to preset descending and returning parameters, wherein the step is executed after the step of moving the carrying module to the current discharging position.
In the above embodiment, the operation efficiency of the wafer pick-and-place operation may be improved by performing control to place and return the wafer by the handling module according to the preset lowering and returning parameters after the step of moving the handling module to the current discharging position.
According to an embodiment of the present application, the step of controlling the handling module to acquire the wafer after the alignment is completed includes: and controlling the carrying module to lift and take out the wafer according to preset lifting and taking-out parameters, wherein the step is executed after the step of moving the carrying module to the current material taking position.
In the above embodiment, the wafer is lifted and taken out by controlling the carrying module according to the preset lifting and taking-out parameters, so that the wafer can be effectively protected, and the reliability of the taking-out operation is ensured.
According to an embodiment of the present application, the handling module includes a wafer carrier for handling the wafer and a moving assembly for driving the wafer carrier to move, a wafer sensor for sensing a contact state of the wafer carrier and the wafer is disposed on the wafer carrier, and the wafer handling control method further includes the following steps:
judging whether the carrying module is in an empty state or a bearing state according to the sensing signal output by the wafer sensor, and if the carrying module is in the empty state, returning to execute the step of controlling the carrying module to move to the current detection position according to the current detection position parameter; and if the carrying module is in the carrying state, respectively adjusting the current detection bit parameter, the current material taking bit parameter or the current material discharging bit parameter by a preset value, and placing the wafer carried by the wafer carrier.
In the above embodiment, by judging whether the carrying module is in the empty state or the load state, the movement of the carrying module can be more accurate and efficient, damage and shutdown to the wafer are avoided, and meanwhile, the operation efficiency is improved.
According to one embodiment of the present application, the step of placing the wafer carried by the wafer carrier includes:
executing the placing action of the carrying module to place the wafer in the first material box according to the preset placing parameters; and
judging whether the carrying module is in the idle state according to the sensing signal of the wafer sensor after the carrying module is in the placing action, if the carrying module is in the idle state, returning to execute the step of moving to the current detection position according to the current detection position parameter, and if the carrying module is in the carrying state, returning to execute the placing action of carrying the carrying module to place the wafer in the first material box according to the preset placing parameter.
In the above embodiment, by judging whether the carrying module is in the empty state or the load state, the movement of the carrying module can be more accurate and efficient, damage and shutdown to the wafer are avoided, and meanwhile, the operation efficiency is improved.
According to an embodiment of the present application, the wafer handling control method further includes: a step of inspecting the wafer performed before the step of placing the wafer carried by the wafer carrier, the step of inspecting the wafer comprising:
moving the wafer to a preset detection position;
performing defect detection on the wafer at the preset detection position;
if the wafer is detected to be qualified, executing the placing action of the carrying module to place the wafer in the first material box according to the preset placing parameters;
and if the wafer is not detected to be qualified, executing the placing action of the carrying module to place the wafer in the second material box, and returning to execute the step of moving to the current detection position according to the current detection position parameters.
In the above embodiment, the step of detecting the wafer performed before the step of placing the wafer carried by the wafer carrier may perform pre-detection during the handling process, and find a defective product in time, so as to provide a pre-detection sample for a subsequent processing process of the wafer, thereby improving production efficiency.
According to one embodiment of the present application, the wafer handling control method further includes the steps of:
before the carrying module places the wafer into the first material box, obtaining a second shooting image of the accommodating space of the first material box shot by the taking and placing port of the first material box, controlling the carrying module to carry out discharging alignment according to the second shooting image, and controlling the carrying module to carry out the placing action of placing the wafer into the first material box or detecting the wafer after the discharging alignment is completed; and/or
Before the carrying module places the wafer into the second material box, a third shooting image of the accommodating space of the second material box is shot by a taking and placing port of the second material box, the carrying module is controlled to carry out discharging alignment according to the third shooting image, and after the discharging alignment is finished, the carrying module is controlled to carry out the placing action of placing the wafer into the second material box or the step of detecting the wafer.
In the above embodiment, by obtaining the second shot image before the handling module places the wafer in the first magazine and/or obtaining the third shot image before the handling module places the wafer in the second magazine, the handling module can operate more accurately during each time of obtaining and/or placing the wafer, thereby ensuring the reliability of the wafer picking and placing operation and the operation efficiency.
According to one embodiment of the present application, the step of performing defect detection on the wafer includes:
acquiring a detection image of the transported wafer on the transport module photographed by the preset detection position;
and analyzing the defect proportion of the wafer according to the detection image, and comparing the defect proportion with a preset proportion to judge whether the wafer is qualified or not.
In the above embodiment, the detection image is obtained by the carried wafer on the carrying module shot at the preset detection position, so as to determine whether the wafer is qualified, and the pre-detection classification can be performed in the carrying process, so that a pre-detection sample is provided for the subsequent processing process of the wafer, the waste is prevented from entering the subsequent processing procedure, the production efficiency is improved, and the occupied space of equipment is reduced.
In a fourth aspect, an embodiment of the present application further discloses an electrical apparatus, where the electrical apparatus includes a memory and a processor, where the memory stores computer readable instructions, and when the computer readable instructions are executed by the processor, the processor is caused to implement a wafer handling control method according to any one of the foregoing embodiments.
In a fifth aspect, embodiments of the present application further disclose a computer readable storage medium having stored thereon computer readable instructions that, when executed by a processor, implement a wafer handling control method as described in any of the above.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic perspective view of a wafer handling apparatus according to one embodiment of the present invention;
FIG. 2 is a schematic perspective view of a wafer cassette according to one embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of the wafer cassette of FIG. 2;
FIG. 4 is a schematic perspective view of a handling module according to an embodiment of the present invention;
FIG. 5 is a flow chart of a wafer handling control method according to one embodiment of the present invention;
FIG. 6 is a flowchart of a wafer handling apparatus using one of the wafer handling control methods shown in FIG. 5, in accordance with one embodiment of the present invention;
FIG. 7 is a partial workflow diagram of a wafer handling apparatus using one of the wafer handling control methods shown in FIG. 5, in accordance with one embodiment of the present invention;
FIG. 8 is a schematic diagram of an electrical device according to one embodiment of the present invention;
Fig. 9 is a schematic diagram of a storage medium according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present invention and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.
Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present invention will be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, the terms "mounted," "configured," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish between different devices, elements, or components (the particular species and configurations may be the same or different), and are not used to indicate or imply the relative importance and number of devices, elements, or components indicated. Unless otherwise indicated, the meaning of "a plurality" is two or more.
In some related technologies, the wafer handling device uses a sensor to perform positioning and handling, however, some uses a sensor to perform indirect measurement, when there is an installation error or a position deviation between the sensor position and the real wafer position, the reliability and safety of accurate positioning and handling are not easy to be guaranteed, in addition, some related technologies of devices and methods do not have a contact force sensing module in the wafer handling process, it is difficult to determine that the wafer carrier is actually contacted with the wafer, and when there is a deviation between the preset wafer taking position, a taking error judgment will be generated, that is, there is a possibility that the next step is performed when the preset taking position is reached and the material is not taken. In addition, some related art apparatuses and methods do not have the functions of pre-detecting and classifying wafers during the wafer handling process, and the wafer handling process essentially serves the front and rear process steps, and the wafer handling without detecting the classification has the possibility of processing defective wafers in the rear process step, which wastes manpower and material resources and reduces the processing and manufacturing efficiency of the wafers.
In order to improve the above problems, the embodiments of the present application disclose a wafer cassette 10, a wafer handling apparatus 1, a wafer handling control method, an electrical apparatus 2, and a storage medium 3, which can achieve the purpose of precise handling and automation operation of wafers. The following will describe in detail.
Referring to fig. 1-4, fig. 1 is a schematic perspective view of a wafer handling apparatus 1 according to an embodiment of the present invention; FIG. 2 is a schematic perspective view of a wafer cassette 10 according to one embodiment of the present invention; FIG. 3 is a schematic cross-sectional view of the wafer cassette 10 of FIG. 2; fig. 4 is a schematic perspective view of a handling module 20 according to an embodiment of the present invention. As shown in fig. 1, the embodiment of the present application discloses a wafer handling apparatus 1, where the wafer handling apparatus 1 includes a wafer box 10, a handling module 20, a vision sensing module 30, and a control module 40, in this embodiment, the wafer box 10 includes a carrier 11 and a light source 12, and the handling module 20 is used to acquire or place the wafer from the pick-and-place port 112; the vision sensing module 30 is configured to capture the accommodating space 111 at the side of the pick-and-place opening 112 and output a first captured image when the light source 12 emits light toward the accommodating space 111; the control module 40 is electrically connected to the handling module 20 and the vision sensing module 30, and is configured to receive and control the handling module 20 to perform alignment according to the first captured image, and control the handling module 20 to perform the acquisition or placement of the wafer after the alignment is completed.
It can be appreciated that the wafer handling apparatus 1 provided in the present application may acquire or place the wafer from the wafer box 10, in the process of handling the wafer, the light source 12 of the wafer box 10 emits light toward the accommodating space 111 where the wafer is picked and placed, so that a place where the wafer is not located is brighter, and a place where the wafer is placed forms a stronger contrast between the light and the shade, and meanwhile, the vision sensing module 30 captures the accommodating space 111 on the side of the pick-and-place opening 112 and outputs a first captured image, and the control module 40 controls the handling module 20 to perform alignment according to the first captured image and acquire or place the wafer. Therefore, the wafer handling apparatus 1 can realize accurate alignment and grabbing of the wafers in the wafer cassette 10, and further realize accurate handling and automation operation of the wafers.
Specifically, referring to fig. 2 and 3, in the present embodiment, the wafer box 10 includes two carriers 11 and a light source 12 that are disposed opposite to each other, the two carriers 11 enclose an accommodating space 111 between the two carriers 11 and a pick-and-place opening 112 disposed at one side of the accommodating space 111, the accommodating space 111 is configured to accommodate a plurality of wafers parallel to a first reference plane, and the light source 12 is disposed at a side of the accommodating space 111 away from the pick-and-place opening 112 and is configured to emit light toward the accommodating space 111. It will be appreciated that the wafer is flat, the first reference plane is a plane on which the wafer is placed, and the wafer may be placed into the accommodating space 111 through the pick-and-place opening 112, or taken out from the accommodating space 111 through the pick-and-place opening 112, and during the operations of placing and taking out, the light source 12 may emit light toward the accommodating space 111 to illuminate the accommodating space 111. By providing the light source 12 emitting light toward the accommodation space 111, the brightness in the wafer cassette 10 can be increased, so that the wafer in the wafer cassette 10 can be more clearly observed.
Further, the light source 12 is a surface light source, and includes a light emitting surface 121 facing the accommodating space 111, and the light emitting surface 121 is perpendicular to the first reference surface. It can be appreciated that the light source 12 is configured as a surface light source, and may have a larger and uniform light emitting surface 121, and meanwhile, the light emitting surface 121 of the light source 12 and the pick-and-place opening 112 are oppositely disposed, in this embodiment, the light emitting surface 121 of the light source 12 may be perpendicular to the first reference surface, and light rays emitted by the light source 12 may be parallel to a placing plane (i.e., the first reference surface) of the wafer, so that it is beneficial to accurately obtain the placing position of the wafer.
Further, the carrier 11 includes a substrate 113 and a plurality of carrier plates 114 connected to one side of the substrate 113 near the accommodating space 111, where the plurality of carrier plates 114 are arranged at intervals along a first preset direction, in this embodiment, the first preset direction may be perpendicular to the first reference plane, the plurality of carrier plates 114 of two carriers 11 are arranged oppositely one by one, and the two carrier plates 114 arranged oppositely form a carrier assembly 116 with carrier positions 115 and are used for carrying two ends of the wafer respectively. In this embodiment, each carrying assembly 116 includes two carrying plates 114 disposed opposite to each other and a carrying position 115 formed by the two carrying plates 114, and the wafer can be placed in the carrying position 115 and supported by the two carrying plates 114 disposed opposite to each other, so that the stability of placing the wafer is ensured.
Further, the wafer box 10 further includes a pressure sensor 13, a counting module 14, and a communication module 15, where the pressure sensor 13 is disposed on a side of the carrying plate 114 carrying the wafer, and is electrically connected to the counting module 14 and the communication module 15, and the communication module 15 is electrically connected to the control module 40, and the pressure sensor 13 is configured to sense whether the carrying position 115 is placed with the wafer and send a first sensing signal to the counting module 14, so that the counting module 14 counts the wafer in the wafer box 10 according to the first sensing signal, and the communication module 15 sends a counting result recorded by the counting module 14 to the control module 40; the counting module 14 is further configured to display the counting result; the pressure sensors 13 are disposed on both the carrying plates 114 of the carrying assembly 116, and the number of the pressure sensors 13 is twice the number of the wafers which can be accommodated in the wafer cassette 10; the pressure sensor 13 is located in a middle area of the wafer side of the carrier plate 114. Through both of the bearing plates 114 of the bearing assembly 116 are provided with the pressure sensors 13, the placement condition of the wafers in the wafer box 10 can be accurately obtained through pressure sensing, then the wafers are counted and displayed through the counting module 14, and meanwhile, the counting result is sent to the control module 40 through the communication module 15, so that the control module 40 can conveniently control the operation, and accurate carrying and automatic operation of the wafers are achieved.
Further, referring to fig. 4, the handling module 20 includes a moving assembly 21 electrically connected to the control module 40 and a wafer carrier 22 connected to the moving assembly 21, the moving assembly 21 is used for driving the wafer carrier 22 to move under the control of the control module 40, the vision sensing module 30 is disposed on the wafer carrier 22, and the vision sensing module 30 and the wafer carrier 22 can move together. Through with vision sensing module 30 set up in transport module 20 on the wafer carrier 22, make vision sensing module 30 can with wafer carrier 22 joint movement, and then need not other devices alone drive vision sensing module 30 motion, and can make vision sensing module 30 shoot the visual angle of first shooting image with the operational view angle of wafer carrier 22 is the same, makes control algorithm simpler, and is difficult for makeing mistakes, has higher operating efficiency when realizing accurate transport and automation mechanized operation to the wafer.
Specifically, the moving assembly 21 includes a base 211, a first moving joint 212 disposed on the base 211 and capable of extending and contracting along a second preset direction, a first rotating arm 213 with one end rotatably connected to the first moving joint 212, a second rotating arm 214 with one end rotatably connected to the other end of the first rotating arm 213, and the wafer carrier 22 rotatably connected to the other end of the second rotating arm 214. In this embodiment, the first preset direction and the second preset direction may be the same direction, and it is to be understood that the moving assembly 21 is a robot with multiple degrees of freedom, the second rotating arm 214 and the wafer carrier 22 may be integrally connected or may be rotatably connected, and precise wafer handling and automation operations may be realized through the moving assembly 21.
Further, the wafer carrier 22 includes a connection base 221 and a carrying portion 222, the connection base 221 is disposed on the moving assembly 21 along the second preset direction, and the carrying portion 222 is connected to one side of the connection base 221; the vision sensing module 30 is disposed on a side of the connection substrate 221 away from the moving assembly 21 along the second preset direction, and the vision sensing module 30 is configured to take a photograph toward a side of the carrying portion 222. It can be appreciated that the first movable joint 212, the connection base 221 and the vision sensing module 30 are all arranged along the second preset direction, so that position conversion is not required in the process of picking and placing, the accuracy and the positioning efficiency of positioning the wafer in the process of picking and placing are improved, and the control can be more efficient and the transportation is more accurate by connecting the movable assembly 21, the vision sensing module 30 and the transportation portion 222.
Further, the vision sensing module 30 includes a camera mounting plate 31 disposed on the connection substrate 221, a first industrial camera 32 disposed on the camera mounting plate 31, and a first lens 33 mounted on the first industrial camera. In this embodiment, the first lens 33 may be a telecentric lens.
Further, the wafer handling apparatus 1 further includes a wafer sensor 50, where the wafer sensor 50 is disposed on a surface of the handling portion 222 near one side of the wafer and is located at an end of the handling portion 222 far away from the connection substrate 221, and the wafer sensor 50 is electrically connected to the control module 40, and is configured to sense the wafer and output a second sensing signal to the control module 40, so that the control module 40 counts and/or monitors the wafer handled by the handling module 20. By disposing the wafer sensor 50 on the surface of the carrying portion 222 near one side of the wafer and on the end of the carrying portion 222 far away from the connection substrate 221, the control module 40 may sense the contact state between the wafer and the carrying portion 222 in real time through the second sensing signal, and accurately sense and synchronously count the picking and placing of the wafer, so as to ensure the reliability of the picking, placing and carrying processes of the wafer.
Specifically, the carrying portion 222 includes two arm portions 222a, where the two arm portions 222a are connected to the connection base 221 and enclose a U shape with an opening, the opening faces to a side far away from the connection base 221, and the wafer sensor 50 is disposed at an end of the arm portion 222a far away from the connection base 221; one side of the two arm parts 222a carrying the wafer is respectively provided with one wafer sensor 50; the wafer sensor 50 is a pressure membrane sensor. In this embodiment, the optical axis directions of the first industrial camera and the first lens 33 are consistent with the axial direction of the U-shaped opening surrounded by the two arm portions 222 a. The wafer sensors 50 are respectively arranged on one sides of the two arm parts 222a carrying the wafers, so that the pressure sensing of the wafers is not influenced by the position deviation of the wafers, the sensing is more accurate, and meanwhile, the wafer sensors 50 are pressure film sensors, so that the pressure of the wafers can be accurately sensed, and meanwhile, the taking and placing of the wafers are not influenced.
Further, the control module 40 monitors whether the handling module 20 obtains the wafer from the wafer box 10 according to the second sensing signal, when the control module 40 determines that the handling module 20 is in the idle state according to the second sensing signal, the control module 40 controls the vision sensing module 30 to capture the first captured image updated by the accommodating space 111 again from the pick-and-place opening 112, and perform alignment again according to the updated first captured image, and control the handling module 20 to obtain the wafer after the alignment is completed again. It can be appreciated that, after each operation of acquiring the wafer by the handling module 20, the control module 40 detects the acquisition operation, and when detecting that the handling module 20 is in the idle state, the control module 40 proves that the acquisition operation of the wafer fails at this time, the control module 40 may control the vision sensing module 30 to capture the first captured image updated by the accommodating space 111 again from the pick-and-place opening 112, and perform alignment again according to the updated first captured image, and perform acquisition of the wafer again, so that the subsequent failure of accurate acquisition operation caused by incorrect operation is avoided, and even the whole wafer handling apparatus 1 is stopped. The control module 40 determines whether the carrying module 20 is in the idle state according to the second sensing signal, so that the alignment can be performed again when the carrying module 20 is in the idle state, and the wafer is acquired again, thereby avoiding shutdown and improving the operation efficiency.
Further, it is understood that the wafer handling apparatus 1 having the wafer cassette 10, the handling module 20 and the vision sensing module 30 can be applied to both handling the wafers in the wafer cassette 10 to other cassettes (such as the first cassette 60 or the second cassette 70) and handling the wafers in the other cassettes to the wafer cassette 10 for storage. The wafer handling apparatus 1 will be mainly described below as an example of handling wafers in the wafer cassette 10 to other cassettes.
Specifically, in one embodiment, the wafer handling apparatus 1 further includes a first magazine 60, the handling module 20 is configured to obtain the wafer from the wafer cassette 10 and transport and place the wafer to the first magazine 60, and when the control module 40 determines that the handling module 20 is still in a loading state after performing the placing operation of placing the wafer to the first magazine 60 according to the second sensing signal, the control module 40 controls the handling module 20 to perform the placing operation of placing the wafer to the first magazine 60 again. It will be appreciated that after the placing operation of the wafer into the first magazine 60, the control module 40 detects the placing operation, and when it is detected that the handling module 20 is still in the loading state, the placing operation of the wafer is proved to fail at this time, the control module 40 may control the handling module 20 to perform the placing operation of the wafer into the first magazine 60 again, so as to avoid damage caused by the dislocation operation of the wafer, and even stop the whole wafer handling apparatus 1. By determining, by the control module 40 according to the second sensing signal, whether the carrying module 20 is in the carrying state after performing the placing operation of placing the wafer into the first magazine 60, the placing operation of placing the wafer into the first magazine 60 can be performed again when the carrying module 20 is in the carrying state, so that damage and shutdown to the wafer are avoided, and meanwhile, operation efficiency is improved.
Further, the wafer handling apparatus 1 may further include a second magazine 70 and a defect detection module 80, the defect detection module 80 is located on a handling path from the wafer cassette 10 to the first magazine 60 of the handling module 20, the defect detection module 80 is electrically connected to the control module 40, the defect detection module 80 is configured to perform defect detection on the wafer transported by the handling module 20 and output defect detection information to the control module 40, and the control module 40 is further configured to control the handling module 20 to place the wafer qualified for detection in the first magazine 60 and place the wafer unqualified for detection in the second magazine 70 according to the defect detection information. It will be appreciated that, on the carrying path from the wafer cassette 10 to the first magazine 60, the carrying module 20 will first pass through the defect detecting module 80 and detect defects at the defect detecting module 80, and the control module 40 controls the carrying module 20 to place the qualified wafer in the first magazine 60 and place the unqualified wafer in the second magazine 70 according to the defect detecting information detected by the defect detecting module 80. Through set up from wafer box 10 to on the transport route of first magazine 60 defect detection module 80, simultaneously right carry out defect detection to the wafer can reduce the handling error that the wafer produced in the handling, save handling time, improve detection efficiency, simultaneously, will detect unqualified the wafer is placed second magazine 70 can carry out the preliminary test classification in the handling, for the follow-up course of working of wafer provides the preliminary test sample, avoids the waste material to get into the follow-up processing procedure, and then improves production efficiency and reduction equipment occupation space.
It is understood that the first and second cartridges 60 and 70 may have the same structure as the wafer cassette 10, and the specific structure of the first and second cartridges 60 and 70 will not be repeated herein.
Further, the vision sensing module 30 is further configured to capture a second captured image from the receiving space 111 of the first magazine 60 before the handling module 20 places the wafer in the first magazine 60, and the control module 40 is further configured to control the handling module 20 to perform a placement operation of placing the wafer in the first magazine 60 or a step of inspecting the wafer after the placement operation is completed according to the second captured image by the vision sensing module 30; and/or the vision sensing module 30 is further configured to capture a third captured image from the receiving space 111 of the second magazine 70 before the handling module 20 places the wafer in the second magazine 70, and the control module 40 is further configured to control the handling module 20 to perform a placement operation of placing the wafer in the second magazine 70 or a step of detecting the wafer after the placement operation is completed according to the third captured image. By photographing the accommodating space 111 of the first magazine 60 from the pick-and-place opening 112 of the first magazine 60 before the handling module 20 places the wafer in the first magazine 60 to obtain a second photographing image and/or photographing the accommodating space 111 of the second magazine 70 from the pick-and-place opening 112 of the second magazine 70 before the handling module 20 places the wafer in the second magazine 70 to obtain a third photographing image, the handling module 20 can operate more accurately during each time of picking up and/or placing the wafer, the reliability of the wafer pick-and-place operation is ensured, and the operation efficiency is also ensured.
Further, the defect detection information includes a detection image, the defect detection module 80 includes a camera module 81 and a bracket 82 for supporting the camera module 81, the camera module 81 is configured to capture the wafer transported by the handling module 20 to obtain the detection image, and the control module 40 is further configured to analyze a defect ratio of the wafer according to the detection image, and compare the defect ratio with a preset ratio to determine whether the wafer is qualified.
Further, the stand 82 includes a support body 821, a camera support part 822 connected to a side of the support body 821, and a light source support part 823 connected to a side of the support body 821, the image pickup module 81 includes a second industrial camera 811, a second lens 812, and a light supplement lamp 813, the second lens 812 is mounted on the second industrial camera 811, and the second industrial camera 811 is disposed at an end of the camera support part 822 away from the support body 821; the light compensating lamp 813 is disposed at an end of the light source support 823 away from the support body 821; the wafer handled by the handling module 20 is placed parallel to the first reference plane, the second industrial camera 811 faces the wafer and the optical axis of the second industrial camera 811 is perpendicular to the first reference plane; the light supplementing lamp 813 includes an annular light emitting member located between the second industrial camera 811 and the handling module 20 for emitting light toward the wafer, and the second industrial camera 811 is for photographing the wafer via a hollow region of the annular light emitting member to acquire the inspection image. In this embodiment, the second lens 812 may be a telecentric lens. By setting the wafer carried by the carrying module 20 to be parallel to the first reference plane, the second industrial camera 811 faces the wafer and the optical axis of the second industrial camera 811 is perpendicular to the first reference plane, so that the second industrial camera 811 can vertically shoot the wafer, and meanwhile, under the irradiation of the light compensating lamp 813, the defect detection of the defect detecting module 80 can be more accurate and has higher precision.
Referring to fig. 5, fig. 5 is a flowchart of a wafer handling control method according to an embodiment of the present invention, in an embodiment of the present application, when the wafer handling apparatus 1 performs the wafer handling operation, the wafer handling control method may be executed to complete the wafer handling operation, and the wafer handling control method includes the following steps:
step S101: the wafer box 10 is provided, the wafer box 10 comprises two bearing pieces 11 and a light source 12 which are oppositely arranged, the two bearing pieces 11 are surrounded to form a containing space 111 between the two bearing pieces 11 and a picking and placing port 112 positioned at one side of the containing space 111, the containing space 111 is used for containing a plurality of wafers parallel to a first reference plane, and the light source 12 is positioned at one side of the containing space 111 away from the picking and placing port 112. Specifically, after the wafer handling apparatus 1 is turned on, the light source 12 may emit light, when the light source 12 emits light on a side far away from the pick-and-place opening 112, a bright stripe is formed at a place where no wafer is observed from the pick-and-place opening 112, so that a dark stripe caused by light shielding of the wafer at the place where the wafer is placed can form a strong contrast between the bright stripe and the dark stripe, so that the position of the wafer can be conveniently known.
Step S102: when the light source 12 emits light toward the accommodation space 111, a first photographed image of the accommodation space 111 photographed at the pickup opening 112 side is acquired.
It will be appreciated that, when a plurality of wafers are placed in the wafer cassette 10, the first captured image in step S102 is an image with light-dark contrast stripes formed by the wafer cassette 10 under the irradiation of the light source 12.
It will be appreciated that the wafer handling control method may further comprise the steps of:
step S301: before the first captured image is obtained, the handling module 20 is controlled to move to the current detection position according to the current detection position parameter.
The current detection position may be a position for detecting a position for picking and placing the wafer, and in this embodiment, the current detection position may be a position for capturing the first captured image.
Step S302: and judging whether the current material taking position or the current material discharging position corresponding to the current detection position has the wafer or not according to the first shooting image, and executing step S103 if the current material taking position has the wafer or the current material discharging position does not place the wafer.
It should be understood that the above method with wafer handling control may be applied to material taking or material discharging when the wafers in the wafer cassette 10 are handled to other cassettes (such as the first cassette 60 or the second cassette 70), and may also be applied to material discharging when the wafers in the other cassettes are handled and placed in the wafer cassette 10. The wafer handling apparatus 1 will be described below by taking a material taking box for taking a material from a material taking box for handling wafers in the wafer box 10 to other material boxes.
In step S302, when the material taking operation is performed, if the current material taking position has the wafer, the material taking operation is performed after alignment, and when the material discharging operation is performed, if the current material taking position does not place the wafer, the material discharging operation is performed after alignment. By judging whether the wafer is in the current material taking position or the current material discharging position corresponding to the current material taking position, the carrying module 20 is controlled to carry out contraposition, dislocation operation when the wafer is not in the current material taking position or the wafer is placed in the current material discharging position can be avoided, damage to the wafer is avoided, shutdown caused by operation errors can be avoided, and reliability and operation efficiency of operation are improved.
In this embodiment, in step S302, if the current material taking position does not have the wafer or the current material discharging position is used for placing the wafer, whether the current detection position is a maximum detection position is determined, and if the current detection position is the maximum detection position, the handling module 20 is controlled to return to an initial position; if the current detection bit is not the maximum detection bit, respectively adjusting the current detection bit parameter, the current detection bit parameter or the current blanking bit parameter by a preset value, and returning to execute the step of controlling the carrying module 20 to move to the current detection bit according to the current detection bit parameter after the adjustment according to the current detection bit parameter.
It should be noted that, the wafer cassette 10 has a limited wafer storage position, and each storage position is spaced by a preset spacing distance, in this embodiment, the preset spacing distance may be Δz, the maximum detection position is the detection position corresponding to the storage position where the wafer is placed last in the wafer cassette 10, and when the current detection position is the maximum detection position, the handling module 20 is controlled to return to the initial position, where the initial position may be a default position; when the current detection bit is not the maximum detection bit, respectively adjusting the current detection bit parameter, the current sampling bit parameter or the current discharging bit parameter by a preset value to obtain the updated current detection bit parameter, the current sampling bit parameter or the current discharging bit parameter, wherein in this embodiment, the preset value may be a preset interval distance of the wafer cassette 10, that is, Δz. By determining that the current detection position is the maximum detection position, the carrying module 20 can be quickly returned to the initial position for subsequent operation after reaching the maximum detection position, and the operation efficiency is improved.
Step S103: and controlling the carrying module 20 to perform alignment according to the first shot image.
And (3) performing image analysis on the first shot image obtained in the step (S102), wherein the position of the dark stripe in the first shot image is the position with the wafer, so that the storage information of the wafer in the wafer box 10 can be obtained, and the carrying module 20 can be controlled to perform alignment.
It may be appreciated that the current pick-up level parameter or the current blanking level parameter may be stored in the control module 40 of the wafer handling apparatus 1, and specifically, the step S102 may include the following steps:
step S201: correcting a current sampling level parameter or a current discharging level parameter according to the first shooting image to obtain a corrected sampling level parameter or a corrected discharging level parameter, and updating the current sampling level parameter or the current discharging level parameter according to the corrected sampling level parameter or the corrected discharging level parameter;
it may be understood that the current material taking position parameter is a position parameter of the wafer to be taken currently in the wafer box 10, the current material taking position parameter or the current material taking position parameter may be obtained through calculation, in this embodiment, the wafers in the wafer box 10 are stored at intervals, the interval distance may be a preset interval Δz, and after the current material taking position or the current material taking position finishes taking or discharging, the current material taking position parameter is updated to be the last material taking position parameter+Δz, and the current material taking position parameter is updated to be the last material taking position parameter+Δz. In order to ensure the accuracy of the operation, before the material taking or discharging operation is performed, the first shot image may be subjected to image analysis, so as to obtain a corrected material taking level parameter or a corrected discharging level parameter, and finally, the current material taking level parameter or the current discharging level parameter is updated according to the corrected material taking level parameter or the corrected discharging level parameter, after the material taking or discharging operation is completed, the updated current material taking level parameter or the current discharging level parameter is respectively +Δz, so that the current material taking level parameter or the current discharging level parameter of the next material taking or discharging can be obtained.
Step S202: the handling module 20 is controlled to move to the current fetching level or the current discharging level according to the corrected fetching level parameter or the corrected discharging level parameter.
It can be appreciated that by controlling the handling module 20 to move to the current fetching position or the current discharging position according to the corrected fetching position parameter or the corrected discharging position parameter obtained by the first captured image, the operation can be more accurate, so that damage to the wafer is avoided, shutdown caused by an operation error can be avoided, and the reliability and the operation efficiency of the operation are improved.
Step S104: and after the alignment is completed, controlling the carrying module 20 to acquire or place the wafer.
According to the corrected material taking level parameter or the corrected material discharging level parameter, the carrying module 20 is controlled to move to the current material taking level or the current material discharging level, that is, the carrying module 20 stretches into the wafer box 10 to reach the current material taking level or the current material discharging level, and the carrying module 20 can perform material taking or material discharging operation.
Specifically, the controlling the handling module 20 to place the wafer after the alignment is completed may include controlling the handling module 20 to place and return the wafer according to preset lowering and returning parameters, which is performed after the step of moving the handling module 20 to the current discharging position. It can be appreciated that after the handling module 20 moves to the current discharging position, the wafer is placed on the carrier 11 by descending according to a preset descending parameter, the preset descending parameter may be a preset descending distance, then, the handling module 20 returns according to a return parameter, the return parameter may be a default return position or an operation position of the next operation, and by performing control on the handling module 20 to place and return the wafer according to the preset descending and return parameter after the step of moving the handling module 20 to the current discharging position, the operation efficiency of the wafer taking and placing operation can be improved.
The controlling the handling module 20 to acquire the wafer after the alignment is completed may include controlling the handling module 20 to lift and take out the wafer according to preset lifting and taking out parameters, which is performed after the step of moving the handling module 20 to the current taking-out position. It can be appreciated that after the carrying module 20 moves to the current material taking position, the wafer is placed on the carrying module 20 according to the preset lifting parameter, the preset lifting parameter can be a preset lifting distance, then, the carrying module 20 takes out the wafer according to the taking-out parameter, and the carrying module 20 lifts and takes out the wafer according to the preset lifting and taking-out parameter by controlling the carrying module 20, so that the wafer can be effectively protected, and the reliability of the taking-out operation is ensured.
According to the wafer carrying control method, when the light source 12 emits light towards the accommodating space 111, a first shooting image of the accommodating space 111 is shot at one side of the picking and placing port 112, and the carrying module 20 is controlled to carry out alignment according to the first shooting image, so that the wafer is obtained or placed, the wafer in the wafer box 10 is accurately aligned and grabbed, and the wafer is accurately carried and automatically operated.
Further, in some embodiments, the handling module 20 includes a wafer carrier 22 for handling the wafer and a moving assembly 21 for driving the wafer carrier 22 to move, the wafer carrier 22 is provided with a wafer sensor 50 for sensing a contact state between the wafer carrier 22 and the wafer, and the wafer handling control method further includes the following steps:
step S401: and determining that the carrying module 20 is in an idle state or a carrying state according to the sensing signal output by the wafer sensor 50, if the carrying module 20 is determined to be in the idle state, returning to the step S301, and if the carrying module 20 is determined to be in the carrying state, executing the step S402.
Step S402: the current detection bit parameter, the current taking bit parameter or the current discharging bit parameter are respectively adjusted to preset values, and the wafer carried by the wafer carrier 22 is placed.
By sensing the pressure of the wafer placed on the wafer carrier 22 by the wafer sensor 50, it may be determined whether the wafer is on the wafer carrier 22, when the wafer is not on the wafer carrier 22, that is, the handling module 20 is in the empty state, and the placement of the wafer is completed, the handling module 20 moves to the current detection position according to the current detection position parameters to carry out the next handling, and when the wafer is on the wafer carrier 22, that is, the handling module 20 is in the load state, step S402 is executed to place the wafer, and the current detection position parameters, the current taking position parameters, or the current blanking position parameters are updated according to the preset value.
In the above embodiment, by judging whether the handling module 20 is in the empty state or the load state, the handling module 20 can be moved more accurately and more efficiently, damage and stoppage to the wafer are avoided, and meanwhile, the operation efficiency is improved.
Specifically, the step of placing the wafer carried by the wafer carrier 22 includes the following steps:
step S501: the placing operation of the handling module 20 to place the wafer in the first magazine 60 is performed according to a predetermined placement parameter.
Step S502: after the placing operation is performed, whether the carrying module 20 is in the idle state is determined according to the sensing signal of the wafer sensor 50, if the carrying module 20 is in the idle state, the step S301 is executed, and if the carrying module 20 is in the loading state, the step S501 is executed.
It is understood that the first magazine 60 may be a magazine for storing the wafers after the wafers are removed from the wafer cassette 10. After the wafer is taken out from the wafer box 10, the wafer is placed into the first material box 60 according to the placement parameters, if the placement is successful, the carrying module 20 is in the empty state, the next material taking can be performed, and if the placement is unsuccessful, the placement operation is continued. By judging whether the carrying module 20 is in the idle state or the carrying state, the carrying module 20 can be moved more accurately and more efficiently, damage and stoppage to the wafer are avoided, and meanwhile, the operation efficiency is improved.
Further, before the step of placing the wafer carried by the wafer carrier 22, the step of inspecting the wafer may further include the steps of:
step S601: and moving the wafer to a preset detection position.
It should be noted that the predetermined inspection position may be a fixed inspection position, and the handling module 20 may move the wafer to the predetermined inspection position after each time the wafer is obtained.
Step S602: performing defect detection on the wafer at the preset detection position; if the wafer is detected to be qualified, step S501 is executed; if the wafer inspection is not qualified, step S603 is performed.
Specifically, the defect detection on the wafer may include the following steps:
step S701: and obtaining a detection image of the wafer conveyed on the conveying module 20 shot at the preset detection position.
Step S702: and analyzing the defect proportion of the wafer according to the detection image, and comparing the defect proportion with a preset proportion to judge whether the wafer is qualified or not.
In this embodiment, defect detection is performed on the wafer, the defect proportion of the wafer may be the abrasion defect proportion of the wafer is analyzed according to the detection image, the preset proportion may be the preset abrasion defect proportion η, when the abrasion defect proportion of the wafer is smaller than the preset abrasion defect proportion η, the wafer is considered to be detected to be qualified, and the qualified wafer is placed into the first magazine 60, when the abrasion defect proportion of the wafer is greater than or equal to the preset abrasion defect proportion η, the wafer is considered to be detected to be unqualified, a detection image is obtained through the carried wafer on the carrying module 20 shot at the preset detection position, so as to determine whether the wafer is qualified, and perform pre-detection classification in the carrying process, so as to provide a pre-detection sample for the subsequent processing technological process of the wafer, avoid waste materials from entering the subsequent processing procedure, further improve the production efficiency and reduce the occupied space of equipment.
Step S603: the step of placing the wafer in the second magazine 70 by the handling module 20 is performed, and the step of moving to the current detection position according to the current detection position parameter is performed.
The second magazine 70 may be a recovery magazine for reject products, the wafer with failed detection may be recovered by the second magazine 70, and when the abrasion defect ratio of the wafer is greater than or equal to the preset abrasion defect ratio η, the wafer is detected as reject, and the failed wafer is placed into the second magazine 70. By performing the step of inspecting the wafer before the step of placing the wafer carried by the wafer carrier 22, the defective product can be detected in advance during the handling process, so as to provide a pre-inspection sample for the subsequent processing process of the wafer, thereby improving the production efficiency.
In order to ensure the accuracy and reliability of the operation of the handling module 20 to place the wafer into the first and second cassettes 60 and 70, the wafer handling control method may further include the steps of:
step S801: before the handling module 20 places the wafer in the first magazine 60, a second shot image of the accommodating space 111 of the first magazine 60, which is shot from the pick-and-place port 112 of the first magazine 60, is obtained, the handling module 20 is controlled to perform a discharging alignment according to the second shot image, and after the discharging alignment is completed, the handling module 20 is controlled to perform a placing action of placing the wafer in the first magazine 60.
Step S802: before the handling module 20 places the wafer in the second magazine 70, the pick-and-place port 112 of the second magazine 70 captures a third captured image of the accommodating space 111 of the second magazine 70, and controls the handling module 20 to perform the discharging alignment according to the third captured image, and controls the handling module 20 to perform the placing operation of placing the wafer in the second magazine 70 after the discharging alignment is completed.
In step S801 and step S802, a second shot image and a third shot image are acquired, the handling module 20 is controlled to perform discharging alignment according to the second shot image and the third shot image, and after the discharging alignment is completed, the handling module 20 is controlled to perform the process of placing the wafer into the first material box 60 and the placing action of the second material box 70, and the first shot image is acquired, the handling module 20 is controlled to perform the discharging alignment according to the first shot image, and after the discharging alignment is completed, the handling module 20 is controlled to perform the step of placing the wafer into the wafer box 10, which is not repeated herein. By obtaining the second shot image before the handling module 20 places the wafer in the first magazine 60 and/or obtaining the third shot image before the handling module 20 places the wafer in the second magazine 70, the handling module 20 can operate more accurately during each time of obtaining and/or placing the wafer, thereby ensuring the reliability of the wafer taking and placing operation and the operation efficiency.
Referring to fig. 6, fig. 6 is a flowchart illustrating a wafer handling apparatus 1 using a wafer handling control method shown in fig. 5 according to an embodiment of the present invention. The wafer handling apparatus 1 starts to operate, the light source is turned on, the control module 40 initializes each preset parameter (including a current sampling position parameter, a current discharging position parameter, a maximum detecting position parameter, a preset value, a wear defect proportion η, etc.), then, the control module 40 controls the handling module 20 and the vision sensing module 30 to move to a current detecting position according to the current detecting position parameter for visual detection, that is, the vision sensing module 30 photographs to obtain a first photographed image, further, the control module 40 determines whether the current detecting position has a wafer according to the first photographed image, if the current detecting position has a wafer, correcting the current material taking position parameter according to the first shooting image, controlling the carrying module to align with the current detection position and performing the action of acquiring the wafer according to the current material taking position parameter, judging whether the current detection position is the maximum detection position if the current detection position is not provided with the wafer, if so, ending the cycle, stopping the work and waiting for restarting the work, if not, adjusting the current detection position parameter by a preset value, and controlling the carrying module 20 and the visual sensing module 30 to move to the next current detection position for visual detection by the control module 40 according to the adjusted current detection position parameter.
Further, after the carrying module 20 performs the operation of obtaining the wafer, the control module 40 determines, according to the second sensing signal output by the wafer sensor 50 on the carrying module 20, whether the carrying module 20 is in a carrying state or an empty state, if the carrying module 20 is in the empty state, the step of performing visual inspection is returned, if the carrying module is in the carrying state, the carrying module 20 carries the wafer to a preset inspection position to perform defect inspection, specifically, the defect inspection module obtains an inspection image, the control module 40 determines, according to the inspection image, whether the defect ratio of the wafer is smaller than a preset value, and if the defect ratio is smaller than the preset value, the carrying module 20 may perform the placing operation of placing the wafer to the first material box 60. In addition, the detected image may be stored by the control module 40 for subsequent review.
Specifically, before the wafer is fed into the first magazine 60, the handling module 20 may be controlled to move to the current detection position of the first magazine 60 according to the pre-stored current detection position parameter of the first magazine 60, then a second shot image is obtained by shooting the accommodating space of the first magazine 60 through the vision sensing module 30, and further whether the current feeding position of the first magazine 60 has the wafer is determined according to the second shot image, and the current feeding position parameter of the first magazine 60 is corrected according to the second shot image, so that the handling module 20 performs accurate alignment and performs the action of placing the wafer into the first magazine 60 according to the corrected current feeding position parameter of the first magazine 60; similarly, before the wafer is discharged into the second magazine 70, the handling module 20 may be controlled to move to the current detection position of the second magazine 70 according to the pre-stored current detection position parameter of the second magazine 70, and then a third shot image may be obtained by shooting the accommodation space of the second magazine 70 through the vision sensing module 30, further, whether the wafer is present at the current discharge position of the second magazine 70 is judged according to the third shot image, and the current discharge position parameter of the second magazine 70 is corrected according to the third shot image, so that the handling module performs accurate alignment and performs the action of placing the wafer into the second magazine 70 according to the corrected current discharge position parameter of the second magazine 70.
Further, after the carrying module 20 performs the placing action, the control module 40 further determines whether the carrying module 20 is in a carrying state or an idle state according to a second sensing signal output by the wafer sensor 50, if the carrying module is in the idle state, updates the current detection bit parameter of the first pre-stored magazine 60, such as by adjusting a preset value, so as to correspond to the next detection bit of the first magazine 60, and updates the current detection bit parameter of the second pre-stored magazine 70, such as by adjusting a preset value, so as to correspond to the next detection bit, and returns to perform the next wafer acquiring action of the wafer magazine 10; if the carrying state is the carrying state, the control module controls the carrying module 20 to return to perform the step of performing defect detection according to the detection image again, so that the steps of detecting that the defect detection module 80 captures the second captured image or the third captured image, and performing blanking placement again may be further repeated, and in other embodiments, as shown in fig. 7, if the carrying state is the carrying state, the control module 40 may also control the carrying module 20 to return to perform the steps of detecting that the defect detection module 80 captures the second captured image or the third captured image, and performing blanking placement again.
In view of the foregoing, in the wafer handling apparatus 1 and the wafer handling control method provided in the embodiments of the present application,
1. the light source 12 and the first industrial camera 32 directly detect the wafer and the wafer box 10, are not affected by assembly errors between the actual bearing positions of the wafer, can realize automatic alignment and accurate picking and placing in the wafer carrying process, can accurately judge whether the wafer exists or not in real time, count and other composite functions, has certain self-adaptive adjustment capability on positioning errors caused by environmental disturbance, and has good flexibility, compliance and reliability.
2. In the wafer handling apparatus 1 and the wafer handling method, the pressure sensors 13 are symmetrically arranged on each layer of the carrier plate 114 of the wafer box 10 and the wafer sensors 50 are symmetrically arranged at the tail end of the wafer carrier 22, so that the contact states of the wafer and the carrier plate 114 of the wafer box 10 and the contact states of the wafer and the wafer carrier 22 are sensed in real time, and the wafer taking and placing are accurately sensed and counted synchronously, thereby ensuring the reliability of the wafer taking, placing and handling processes.
3. The wafer handling device 1 and the wafer handling method adopt the second industrial camera 811 to perform the wafer pre-detection on the path through which the wafers are taken and placed, and the pre-detection classification process in the handling process can provide pre-detection samples for the subsequent processing process of the wafers, so that the waste materials are prevented from entering the subsequent processing process, and the production efficiency is further improved.
Referring to fig. 8, fig. 8 is a schematic structural diagram of an electrical device 2 according to an embodiment of the present invention, wherein the electrical device 2 includes a memory 91 and a processor 92.
The memory 91 stores computer readable instructions 93, which when executed by the processor 92, cause the processor 92 to implement the wafer handling control method according to any one of the above.
Referring to fig. 9, fig. 9 is a schematic structural diagram of a storage medium according to an embodiment of the present invention, where the computer readable storage medium 3 stores computer readable instructions 93, and the computer readable instructions 93 implement the wafer handling control method according to any one of the above when executed by the processor 92.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art will also appreciate that the embodiments described in the specification are all alternative embodiments and that the acts and modules referred to are not necessarily required in the present application.
In various embodiments of the present application, it should be understood that the size of the sequence numbers of the above processes does not mean that the execution sequence of the processes is necessarily sequential, and the execution sequence of the processes should be determined by the functions and internal logic thereof, and should not constitute any limitation on the implementation process of the embodiments of the present application.
The units described above as separate components may or may not be physically separate, and components shown as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiment.
In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The integrated units described above, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer-accessible memory. Based on such understanding, the technical solution of the present application, or a part contributing to the prior art or all or part of the technical solution, may be embodied in the form of a software product stored in a memory, comprising several requests for an electric device (which may be a personal computer, a server or a network device, etc., in particular may be a processor in the electric device) to perform part or all of the steps of the above-mentioned method of the embodiments of the present application.
Those of ordinary skill in the art will appreciate that all or part of the steps of the various methods of the above embodiments may be implemented by a program that instructs associated hardware, the program may be stored in a computer readable storage medium including Read-Only Memory (ROM), random access Memory (Random Access Memory, RAM), programmable Read-Only Memory (Programmable Read-Only Memory, PROM), erasable programmable Read-Only Memory (Erasable Programmable Read Only Memory, EPROM), one-time programmable Read-Only Memory (OTPROM), electrically erasable programmable Read-Only Memory (EEPROM), compact disc Read-Only Memory (Compact Disc Read-Only Memory, CD-ROM) or other optical disk Memory, magnetic disk Memory, tape Memory, or any other medium that can be used for carrying or storing data that is readable by a computer.
The wafer cassette 10, the wafer handling apparatus 1, the wafer handling control method, the electrical apparatus 2 and the storage medium 3 disclosed in the embodiments of the present application have been described in detail, and specific examples are applied herein to illustrate the principles and embodiments of the present application, and the description of the above examples is only for helping to understand the methods and core ideas of the present application. Meanwhile, as those skilled in the art will have modifications in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.

Claims (25)

1. A wafer handling apparatus, comprising:
a wafer cassette, the wafer cassette comprising:
the two bearing pieces are oppositely arranged, an accommodating space between the two bearing pieces and a picking and placing opening at one side of the accommodating space are defined by the two bearing pieces, and the accommodating space is used for accommodating a plurality of wafers parallel to a first reference plane; and
the light source is arranged on one side of the accommodating space away from the picking and placing port and is used for emitting light towards the accommodating space;
the carrying module comprises a wafer carrier, wherein the wafer carrier comprises a carrying part and a connecting matrix, the carrying part is connected to one side of the connecting matrix, and the carrying part is used for acquiring or placing the wafer from the pick-and-place opening;
the visual sensing module is used for shooting the accommodating space at one side of the pick-and-place opening and outputting a first shooting image when the light source emits light towards the accommodating space;
the control module is electrically connected with the carrying module and the visual sensing module, and is used for receiving the first shooting image, controlling the carrying module according to the first shooting image so as to enable the carrying module to conduct alignment, and controlling the carrying module to conduct acquisition or placement of the wafer after the alignment is completed; and
The wafer sensor is arranged on the surface of the carrying part, which is close to one side of the wafer, and is positioned at one end of the carrying part, which is far away from the connecting matrix, and is electrically connected with the control module and used for sensing the wafer and outputting a second sensing signal to the control module, so that the control module counts and/or monitors the wafer carried by the carrying module;
the control module monitors whether the carrying module acquires the wafer from the wafer box according to the second sensing signal, when the control module judges that the carrying module is in an empty state according to the second sensing signal, the control module controls the vision sensing module to shoot the accommodating space again from the picking and placing port to update the first shooting image, performs re-alignment according to the updated first shooting image, and controls the carrying module to acquire the wafer after the re-alignment is completed;
the bearing piece comprises a plurality of bearing plates, the plurality of bearing plates of the two bearing pieces are arranged oppositely one by one, and the two bearing plates which are arranged oppositely form a bearing assembly with bearing positions and are used for bearing the two ends of the wafer respectively;
The wafer box further comprises a pressure sensor, a counting module and a communication module, wherein the pressure sensor is arranged on one side of the bearing plate bearing the wafer and is electrically connected with the counting module and the communication module, the communication module is electrically connected with the control module, and the counting module is further used for displaying a counting result;
the carrying part comprises two arm parts, the two arm parts are connected with the connecting base body and enclose a U shape with an opening, the opening faces to one side far away from the connecting base body, and the wafer sensor is arranged at one end of the arm part far away from the connecting base body; one side of the two arm parts carrying the wafer is respectively provided with one wafer sensor; the wafer sensor is a pressure film sensor.
2. The wafer handling apparatus of claim 1, wherein the light source is a surface light source comprising a light emitting surface facing the receiving space, the light emitting surface being disposed opposite the pick-and-place port.
3. The wafer handling apparatus of claim 1, wherein the carrier comprises a substrate, a plurality of the carrier plates are connected to a side of the substrate adjacent to the accommodating space, and the plurality of carrier plates are disposed at intervals along a first predetermined direction.
4. The wafer handling apparatus of claim 1, wherein the handling module comprises a moving assembly electrically coupled to the control module, the moving assembly coupled to the wafer carrier, the moving assembly configured to drive the wafer carrier to move under control of the control module, the vision sensing module disposed on the wafer carrier.
5. The wafer handling apparatus of claim 4, wherein the moving assembly comprises a base, a first moving joint provided on the base and extendable along a second predetermined direction, a first rotating arm having one end rotatably coupled to the first moving joint, a second rotating arm having one end rotatably coupled to the other end of the first rotating arm, and the wafer carrier rotatably coupled to the other end of the second rotating arm.
6. The wafer handling apparatus of claim 5, wherein said connection substrate is disposed on said moving assembly along said second predetermined direction; the visual sensing module is arranged on one side of the connecting matrix away from the moving assembly along the second preset direction, and the visual sensing module is used for shooting towards one side of the carrying part.
7. The wafer handling apparatus of claim 6, wherein the vision sensing module comprises a camera mount plate disposed on the connection substrate, a first industrial camera disposed on the camera mount plate, and a first lens mounted on the first industrial camera.
8. The wafer handling apparatus of claim 1, further comprising a first magazine, wherein the handling module is configured to acquire the wafer from the wafer magazine and transport the wafer to the first magazine, and when the control module determines that the handling module is still in a load-bearing state after performing the placing operation of the wafer to the first magazine according to the second sensing signal, the control module controls the handling module to perform the placing operation of the wafer to the first magazine again.
9. The wafer handling apparatus of claim 8, further comprising a second magazine and a defect detection module, the defect detection module being located on a handling path of the handling module from the wafer magazine to the first magazine, the defect detection module being electrically connected to the control module, the defect detection module being configured to detect defects in the wafers transported by the handling module and output defect detection information to the control module, the control module being further configured to control the handling module to place the wafers that are qualified for inspection in the first magazine and to place the wafers that are unqualified for inspection in the second magazine based on the defect detection information.
10. The wafer handling apparatus of claim 9, wherein,
the vision sensing module is further used for shooting the accommodating space of the first material box from the taking and placing opening of the first material box before the carrying module places the wafer to the first material box to obtain a second shooting image, and the control module is further used for controlling the carrying module to carry out discharging alignment according to the second shooting image and controlling the carrying module to carry out placing action of placing the wafer to the first material box after the discharging alignment is completed; and/or
The vision sensing module is further used for shooting the accommodating space of the second material box from the taking and placing opening of the second material box to obtain a third shooting image before the carrying module places the wafer to the second material box, and the control module is further used for controlling the carrying module to carry out discharging alignment according to the third shooting image and controlling the carrying module to carry out placing actions of placing the wafer to the second material box after the discharging alignment is completed.
11. The wafer handling apparatus of claim 9, wherein the defect detection information includes a detection image, the defect detection module includes a camera module and a bracket supporting the camera module, the camera module is configured to capture the wafer transported by the handling module to obtain the detection image, and the control module is further configured to analyze a defect ratio of the wafer according to the detection image, and compare the defect ratio with a preset ratio to determine whether the wafer is qualified.
12. The wafer handling apparatus of claim 11, wherein the stand includes a support body, a camera support portion connected to a side of the support body, and a light source support portion connected to a side of the support body, the camera module including a second industrial camera, a second lens, and a light supplement lamp, the second lens being mounted on the second industrial camera, the second industrial camera being disposed at an end of the camera support portion remote from the support body; the light supplementing lamp is arranged at one end of the light source supporting part far away from the supporting main body; the wafer conveyed by the conveying module is used for being placed parallel to the first reference surface, the second industrial camera faces the wafer, and the optical axis of the second industrial camera is perpendicular to the first reference surface; the light supplementing lamp comprises an annular light emitting part, the annular light emitting part is located between the second industrial camera and the carrying module and used for emitting light towards the wafer, and the second industrial camera is used for shooting the wafer through a hollow area of the annular light emitting part so as to acquire the detection image.
13. A wafer handling control method, comprising the steps of:
The wafer box comprises two bearing pieces and a light source which are oppositely arranged, wherein the two bearing pieces are enclosed to form an accommodating space between the two bearing pieces and a taking and placing opening at one side of the accommodating space, the accommodating space is used for accommodating a plurality of wafers parallel to a first reference plane, and the light source is positioned at one side of the accommodating space away from the taking and placing opening;
when the light source emits light towards the accommodating space, acquiring a first shooting image of the accommodating space shot at one side of the picking and placing opening;
controlling the carrying module to perform alignment according to the first shooting image;
after the alignment is completed, the carrying module is controlled to acquire or place the wafer; and
the carrying module is provided with a wafer sensor, the wafer sensor is used for sensing the contact state of the wafer and the carrying module and outputting a sensing signal, the control module judges whether the carrying module successfully acquires or places the wafer according to the sensing signal output by the wafer sensor, and if the carrying module is judged to fail to acquire or place the wafer, the control module controls the carrying module to acquire or place the wafer after the alignment is finished again;
The bearing piece comprises a plurality of bearing plates, the plurality of bearing plates of the two bearing pieces are arranged oppositely one by one, and the two bearing plates which are arranged oppositely form a bearing assembly with bearing positions and are used for bearing the two ends of the wafer respectively;
the wafer box further comprises a pressure sensor, a counting module and a communication module, wherein the pressure sensor is arranged on one side of the bearing plate bearing the wafer and is electrically connected with the counting module and the communication module, the communication module is electrically connected with the control module, and the counting module is further used for displaying a counting result;
the carrying module comprises a wafer carrier, the wafer carrier comprises a carrying part and a connecting matrix, the carrying part is connected to one side of the connecting matrix, the carrying part is used for acquiring or placing the wafer from the picking and placing port, and the wafer sensor is positioned at one end of the carrying part far away from the connecting matrix;
the carrying part comprises two arm parts, the two arm parts are connected with the connecting base body and enclose a U shape with an opening, the opening faces to one side far away from the connecting base body, and the wafer sensor is arranged at one end of the arm part far away from the connecting base body; one side of the two arm parts carrying the wafer is respectively provided with one wafer sensor; the wafer sensor is a pressure film sensor.
14. The wafer handling control method according to claim 13, further comprising the steps of:
before the first shooting image is acquired, controlling the carrying module to move to the current detection position according to the current detection position parameter; and
judging whether the wafer exists in the current material taking position or the current discharging position corresponding to the current detection position according to the first shooting image, and if the wafer does not exist in the current material taking position or the current discharging position, executing the step of controlling the carrying module to carry out contraposition according to the first shooting image.
15. The wafer handling control method according to claim 14, wherein the step of controlling the handling module to perform alignment according to the first captured image comprises:
correcting a current sampling level parameter or a current discharging level parameter according to the first shooting image to obtain a corrected sampling level parameter or a corrected discharging level parameter, and updating the current sampling level parameter or the current discharging level parameter according to the corrected sampling level parameter or the corrected discharging level parameter;
and controlling the carrying module to move to the current material taking level or the current material discharging level according to the corrected material taking level parameter or the corrected material discharging level parameter.
16. The wafer handling control method according to claim 15, wherein,
in the step of judging whether the wafer exists in the current sampling position or the current discharging position corresponding to the current detection position according to the first shooting image,
if the current material taking position does not have the wafer or the current material discharging position is used for placing the wafer, judging whether the current detection position is the maximum detection position,
if the current detection position is the maximum detection position, controlling the carrying module to return to an initial position; and if the current detection bit is not the maximum detection bit, respectively adjusting the current detection bit parameter, the current detection bit parameter or the current discharging bit parameter by preset values, and returning to execute the step of controlling the carrying module to move to the current detection bit according to the current detection bit parameter according to the adjusted current detection bit parameter.
17. The wafer handling control method according to claim 16, wherein the step of controlling the handling module to perform the placement of the wafer after the alignment is completed comprises: and controlling the carrying module to place and return the wafer according to preset descending and returning parameters, wherein the step is executed after the step of moving the carrying module to the current discharging position.
18. The wafer handling control method according to claim 15, wherein the step of controlling the handling module to perform the wafer acquisition after the alignment is completed includes: and controlling the carrying module to lift and take out the wafer according to preset lifting and taking-out parameters, wherein the step is executed after the step of moving the carrying module to the current material taking position.
19. The wafer handling control method according to claim 18, wherein the handling module includes a wafer carrier for handling the wafer and a moving assembly for driving the wafer carrier to move, the wafer carrier being provided with the wafer sensor for sensing a contact state of the wafer carrier with the wafer, the wafer handling control method further comprising the steps of:
judging whether the carrying module is in an empty state or a bearing state according to the sensing signal output by the wafer sensor, and if the carrying module is in the empty state, returning to execute the step of controlling the carrying module to move to the current detection position according to the current detection position parameter; and if the carrying module is in the carrying state, respectively adjusting the current detection bit parameter, the current material taking bit parameter or the current material discharging bit parameter by a preset value, and placing the wafer carried by the wafer carrier.
20. The wafer handling control method of claim 19, wherein the step of placing the wafer carried by the wafer carrier comprises:
executing the placing action of the carrying module to place the wafer in the first material box according to the preset placing parameters; and
judging whether the carrying module is in the idle state according to the sensing signal of the wafer sensor after the carrying module is in the placing action, if the carrying module is in the idle state, returning to execute the step of moving to the current detection position according to the current detection position parameter, and if the carrying module is in the carrying state, returning to execute the placing action of carrying the carrying module to place the wafer in the first material box according to the preset placing parameter.
21. The wafer handling control method of claim 20, further comprising: a step of inspecting the wafer performed before the step of placing the wafer carried by the wafer carrier, the step of inspecting the wafer comprising:
moving the wafer to a preset detection position;
Performing defect detection on the wafer at the preset detection position;
if the wafer is detected to be qualified, executing the placing action of the carrying module to place the wafer in the first material box according to the preset placing parameters;
and if the wafer is not detected to be qualified, executing the placing action of the carrying module to place the wafer in the second material box, and returning to execute the step of moving to the current detection position according to the current detection position parameters.
22. The wafer handling control method according to claim 21, wherein the wafer handling control method further comprises the steps of:
before the carrying module places the wafer into the first material box, obtaining a second shooting image of the accommodating space of the first material box shot by the taking and placing port of the first material box, controlling the carrying module to carry out discharging alignment according to the second shooting image, and controlling the carrying module to carry out the placing action of placing the wafer into the first material box or detecting the wafer after the discharging alignment is completed; and/or
Before the carrying module places the wafer into the second material box, a third shooting image of the accommodating space of the second material box is shot by a taking and placing port of the second material box, the carrying module is controlled to carry out discharging alignment according to the third shooting image, and after the discharging alignment is finished, the carrying module is controlled to carry out the placing action of placing the wafer into the second material box or the step of detecting the wafer.
23. The wafer handling control method of claim 21, wherein the step of performing defect detection on the wafer comprises:
acquiring a detection image of the transported wafer on the transport module photographed by the preset detection position;
and analyzing the defect proportion of the wafer according to the detection image, and comparing the defect proportion with a preset proportion to judge whether the wafer is qualified or not.
24. An electrical device comprising a memory and a processor, the memory having stored therein computer readable instructions that, when executed by the processor, cause the processor to implement the method of any of claims 13-23.
25. A computer readable storage medium having computer readable instructions stored thereon, which when executed by a processor, implement the method of any of claims 13-23.
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