CN114975195B - Wafer cassette, wafer transfer apparatus, wafer transfer control method, electric apparatus, and storage medium - Google Patents

Abstract

Embodiments of the present application disclose a wafer box, wafer handling equipment, a wafer handling control method, electrical equipment, and a storage medium. The wafer box includes two supporting parts and a light source arranged oppositely, and the two supporting parts enclose an accommodating space between the two supporting parts and a pick-and-place opening located on one side of the accommodating space. The accommodating space is used to accommodate a plurality of wafers parallel to the first reference plane, and the light source is arranged on a side of the accommodating space away from the pick-and-place opening, and is used to emit light toward the accommodating space, which can achieve wafer alignment. The purpose of round precise alignment, handling and automatic operation.

Description

Wafer box, wafer handling equipment, wafer handling control method, electrical equipment, and storage medium

technical field

The present application relates to the technical field of semiconductors, and in particular to a wafer box, wafer handling equipment, a wafer handling control method, electrical equipment, and a storage medium.

Background technique

During the packaging and testing process of semiconductors, wafers need to be transported between different equipment for scribing, probe detection or die bonding. Automatic wafer handling and testing has become an important link in the semiconductor manufacturing process. Different wafer operation process equipment has different requirements on the size, surface quality and grain yield of incoming wafers. The wafers are affected by the environment and operation during storage, transportation and handling operations, and there are certain damages and defects. Therefore, problems such as the inability to perform clear force sensing and counting during the traditional wafer pick-and-place process have brought challenges to the precise alignment, handling and automated operation of wafers.

Contents of the invention

The embodiment of the present application discloses a wafer box, wafer handling equipment, wafer handling control method, electrical equipment and storage medium, which can achieve the purpose of precise wafer alignment, handling and automatic operation.

On the one hand, the embodiment of the present application discloses a wafer box. The wafer box includes two supporting parts and a light source that are arranged oppositely. space and a pick-and-place opening located on one side of the accommodation space, the accommodation space is used to accommodate a plurality of wafers parallel to the first reference plane, and the light source is arranged on a side of the accommodation space away from the pick-and-place opening side, for emitting light toward the containing space.

Compared with the prior art, the wafer box proposed by the present application can increase the brightness in the wafer box by setting the light source that emits light toward the accommodation space, so as to facilitate a clearer observation of all the wafer boxes in the wafer box. The storage conditions of the described wafers.

According to an embodiment of the present application, the light source is a surface light source, including a light emitting surface facing the accommodating space, and the light emitting surface is disposed opposite to the pick-and-place opening. By setting the light source as a surface light source, and the light-emitting surface is arranged opposite to the pick-and-place opening, the light emitted by the light source can be made to emit light in the direction of the pick-and-place opening, so that the placement of the wafer can be accurately obtained. Location.

According to an embodiment of the present application, the carrier includes a substrate and a plurality of carrier plates connected to one side of the substrate close to the accommodation space, the plurality of carrier plates are arranged at intervals along a first preset direction, and the two A plurality of the carrying plates of each of the carrying members are arranged oppositely one by one, and the two oppositely arranged carrying plates form a carrying assembly with carrying positions, and are used to carry two ends of the wafer respectively.

According to an embodiment of the present application, the wafer box further includes a pressure sensor, a counting module, and a communication module, the pressure sensor is arranged on the side of the carrier plate carrying the wafer, and is electrically connected to the counting module. module and the communication module, the communication module is electrically connected to the control module, and the counting module is also used to display the counting result. The pressure sensors on both of the carrying plates of the carrying assembly can accurately obtain the placement of the wafers in the cassette through pressure sensing, and then count and display through the counting module, and at the same time The counting result is sent to the control module through the communication module, which facilitates the control operation of the control module, thereby realizing precise wafer handling and automatic operation.

On the other hand, the embodiment of the present application also discloses a wafer handling device, which includes the wafer cassette described in any one of the above embodiments, a handling module, a visual sensing module and a control module , the handling module is used to obtain or place the wafer from the pick-and-place port; taking a side shot of the accommodation space and outputting a first shot image; the control module is electrically connected to the handling module and the visual sensing module, and is used to receive and control the handling module according to the first shot image The group performs alignment, and controls the handling module to acquire or place the wafer after the alignment is completed.

Compared with the prior art, the wafer handling equipment proposed in this application controls the visual sensing module to capture and output the first captured image when the light source emits light toward the accommodation space, so that the control module can The first captured image controls the alignment of the transport module, and controls the transport module to acquire or place the wafer, so as to achieve precise alignment and positioning of the wafer in the wafer cassette. Grabbing, so as to realize the precise handling and automatic operation of the wafer.

According to an embodiment of the present application, the handling module includes a moving assembly electrically connected to the control module and a wafer carrier connected to the moving assembly, and the moving assembly is used for The wafer carrier is driven to move under control, and the visual sensing module is arranged on the wafer carrier. By arranging the visual sensing module on the wafer carrier of the handling module, the visual sensing module can move together with the wafer carrier, and no other device is required to drive separately The visual sensing module moves, and the viewing angle of the first photographed image taken by the visual sensing module is the same as the operating viewing angle of the wafer carrier, so that the control algorithm is simpler and less prone to errors, While realizing precise handling and automatic operation of wafers, it has higher operating efficiency.

According to an embodiment of the present application, the moving assembly includes a base, a first moving joint arranged on the base that can expand and contract along a second preset direction, and a joint that is rotatably connected to the first moving joint at one end. a first rotary arm, a second rotary arm with one end rotatably connected to the other end of the first rotary arm, and the wafer carrier rotatably connected to the other end of the second rotary arm. By setting the mobile component as a multi-degree-of-freedom robot, precise handling and automatic operation of the wafer can be realized.

According to an embodiment of the present application, the wafer carrier includes a connection base and a transfer part, the connection base is arranged on the moving assembly along the second predetermined direction, and the transfer part is connected to the One side of the connecting base; the visual sensing module is arranged on the side of the connecting base away from the moving assembly along the second preset direction, and the visual sensing module is used to face the moving part side to shoot. By connecting and setting the moving assembly, the visual sensing module and the conveying part, the control can be more efficient and the conveying can be more accurate.

According to an embodiment of the present application, the visual sensing module includes a camera mounting plate set on the connection base, a first industrial camera set on the camera mounting plate, and a camera mounted on the first industrial First shot on camera.

According to an embodiment of the present application, the wafer handling equipment further includes a wafer sensor, the wafer sensor is arranged on the surface of the handling part close to the wafer and is located at the part far away from the end of the connection base, the wafer sensor is electrically connected to the control module for sensing the wafer and outputting a second sensing signal to the control module, so that the control The module performs counting and/or pick-and-place monitoring on the wafers transported by the transporting module. By arranging the wafer sensor on the surface of the transfer part close to the wafer and at the end of the transfer part away from the connection base, the control module can pass through the second sensor The detection signal senses the contact state between the wafer and the transfer unit in real time, accurately senses the wafer pick-and-place and counts them synchronously, thereby ensuring the reliability of the wafer pick-and-place and handling process.

According to an embodiment of the present application, the carrying part includes two arm parts, both of which are connected to the connecting base and form a U-shape with an opening, and the opening faces away from the connecting base. One side of the arm, the wafer sensor is arranged at the end of the arm part far away from the connecting base; one of the wafer sensors is respectively arranged on the side of the two arm parts carrying the wafer ; The wafer sensor is a pressure film sensor. By respectively arranging the wafer sensors on the sides of the two arm parts carrying the wafer, the pressure sensing of the wafer can be prevented from being affected by the positional deviation of the wafer, so that Sensing is more accurate, and at the same time, the wafer sensor is a pressure film sensor, which can accurately sense the pressure of the wafer without affecting the pick-and-place of the wafer.

According to an embodiment of the present application, the control module monitors whether the handling module obtains the wafer from the wafer cassette according to the second sensing signal, and when the control module according to When the second sensing signal determines that the conveying module is in an unloaded state, the control module controls the visual sensing module to re-photograph the storage space from the pick-and-place port and update the second 1. Taking an image, performing alignment again according to the updated first captured image, and controlling the transfer module to acquire the wafer after the re-alignment is completed. Through the control module judging whether the conveying module is in an unloaded state according to the second sensing signal, the alignment can be performed again when the conveying module is in an unloaded state, and the Wafer acquisition avoids downtime and at the same time improves operational efficiency.

According to an embodiment of the present application, the wafer handling equipment further includes a first magazine, and the handling module is used to obtain the wafer from the wafer magazine, and transport and place it on the first magazine. box, when the control module judges according to the second sensing signal that the handling module is still in the carrying state after performing the placing action of placing the wafer in the first magazine, the control module The group controls the transfer module to perform the placing action of placing the wafer into the first magazine again. Through the control module judging whether the handling module is in a loading state after performing the placing action of placing the wafer into the first magazine according to the second sensing signal, the handling module can The placing action of placing the wafer into the first magazine is performed again when it is in the loading state, which avoids damage to the wafer and shutdown, and at the same time, improves operating efficiency.

According to an embodiment of the present application, the wafer handling equipment further includes a second magazine and a defect detection module, and the defect detection module is located in the transport module from the wafer box to the second On the transport path of a magazine, the defect detection module is electrically connected to the control module, and the defect detection module is used to perform defect detection on the wafer transported by the transport module and output defect detection information To the control module, the control module is further configured to control the handling module to place the wafers that have passed the inspection in the first magazine according to the defect detection information, and place the wafers that have failed the inspection The wafer is placed in the second magazine. By setting the defect detection module on the transport path from the wafer cassette to the first magazine, and performing defect detection on the wafer at the same time, the transport error generated during the transport process of the wafer can be reduced , save the handling time, improve the detection efficiency, and at the same time, place the unqualified wafers in the second magazine, and perform pre-detection classification during the handling process, and provide preliminary information for the subsequent processing of the wafers. Test samples to prevent waste from entering subsequent processing procedures, thereby improving production efficiency and reducing equipment footprint.

According to an embodiment of the present application, the visual sensing module is also used for picking and placing the wafer from the first magazine before the handling module places the wafer into the first magazine. Taking a picture of the accommodation space of the first magazine to obtain a second photographed image, the control module is also used to control the handling module to perform the alignment of the material according to the second photographed image, and After the bit is completed, control the handling module to perform the placing action of placing the wafer into the first magazine; and/or the visual sensing module is also used to place the wafer in the handling module Before the circle is placed in the second magazine, the receiving space of the second magazine is photographed from the pick-and-place opening of the second magazine to obtain a third photographed image, and the control module is also used to obtain a third photographed image according to the third Taking an image to control the transfer module to perform alignment, and controlling the transfer module to perform a placement action of placing the wafer into the second magazine after the alignment is completed. Obtaining a second photographed image and/or by photographing an accommodating space of the first magazine from a pick-and-place opening of the first magazine before the handling module places the wafer into the first magazine Before the handling module puts the wafer into the second magazine, the receiving space of the second magazine is photographed from the pick-and-place opening of the second magazine to obtain a third photographed image, which can make all The operation of the handling module is more accurate during each process of obtaining and/or placing the wafer, which ensures the reliability of the wafer pick-and-place operation, and at the same time ensures the operation efficiency.

According to an embodiment of the present application, the defect detection information includes detection images, the defect detection module includes a camera module and a bracket supporting the camera module, and the camera module is used to photograph the transport model The inspection image is obtained from the wafers transported in a group, and the control module is also used to analyze the defect ratio of the wafer according to the inspection image, and compare the defect ratio with a preset ratio to judge the defect ratio of the wafer. Whether the above wafer is qualified.

According to an embodiment of the present application, the bracket includes a support body, a camera support portion connected to one side of the support body, and a light source support portion connected to one side of the support body, and the camera module includes a second industrial A camera, a second lens and a supplementary light, the second lens is installed on the second industrial camera, and the second industrial camera is arranged at an end of the camera support part away from the supporting body; the supplementary light The lamp is arranged at one end of the light source supporting part away from the supporting body; the wafer transported by the transport module is used to be placed parallel to the first reference plane, and the second industrial camera faces the wafer And the optical axis of the second industrial camera is perpendicular to the first reference plane; the supplementary light includes a ring-shaped light-emitting part, and the ring-shaped light-emitting part is located between the second industrial camera and the transport module and used to emit light toward the wafer, and the second industrial camera is used to photograph the wafer through the hollow area of the ring-shaped light member to obtain the detection image. The wafer transported by the transport module is placed parallel to the first reference plane, the second industrial camera faces the wafer and the optical axis of the second industrial camera is perpendicular to the first The reference plane allows the second industrial camera to vertically photograph the wafer, and at the same time, under the illumination of the fill light, the defect detection of the defect detection module can be more accurate and precise.

In three aspects, the embodiment of the present application also discloses a wafer handling control method, which includes the following steps:

A wafer box is provided, the wafer box includes two supporting parts and a light source arranged oppositely, and the two supporting parts enclose an accommodation space between the two supporting parts and a side of the accommodation space a pick-and-place opening, the accommodating space is used to accommodate a plurality of wafers parallel to the first reference plane, and the light source is located on a side of the accommodating space away from the pick-and-place opening;

When the light source emits light toward the storage space, acquiring a first photographed image of the storage space on the side of the pick-and-place opening;

Controlling the alignment of the transport module according to the first captured image; and

After the alignment is completed, the transfer module is controlled to acquire or place the wafer.

Compared with the prior art, the wafer handling control method proposed in this application obtains the first captured image of the storage space on the side of the pick-and-place opening when the light source emits light toward the storage space, and Controlling the alignment of the handling module according to the first captured image, completing the acquisition or placement of the wafer, and realizing the precise alignment and grasping of the wafer in the wafer cassette, thereby realizing the alignment of the wafer Round precise handling and automatic operation.

According to an embodiment of the present application, the wafer handling control method further includes the following steps:

Before acquiring the first photographed image, controlling the transfer module to move to the current detection position according to the current detection position parameter; and

According to the first captured image, it is judged whether there is the wafer in the current feeding level or the current discharging level corresponding to the current detection position, if the current feeding level has the wafer or the current discharging level If the wafer is not placed, the step of controlling the alignment of the transfer module according to the first captured image is performed.

In the above-mentioned embodiment, it is judged whether there is the wafer in the current fetching level or the current unloading level corresponding to the current detection position, and the alignment of the handling module can be controlled to avoid that the current fetching level does not have the wafer. The dislocation operation when the wafer or the current loading level has placed the wafer avoids damage to the wafer, avoids downtime caused by operational errors, and improves operational reliability and operational efficiency.

According to an embodiment of the present application, the step of controlling the alignment of the transport module according to the first captured image includes:

Correcting the current feeding level parameter or the current feeding level parameter according to the first captured image to obtain the corrected feeding level parameter or the corrected lowering level parameter, and according to the corrected feeding level parameter or the corrected feeding The bit parameter updates the current fetching level parameter or the current unloading level parameter;

Controlling the transfer module to move to the current fetching level or the current discharging position according to the corrected material fetching level parameter or the corrected material discharging level parameter.

In the above-mentioned embodiment, by controlling the transfer module to move to the current material fetching level or the current material discharge level according to the corrected material intake level parameter or the corrected material discharge level parameter obtained from the first captured image, it can be The operation is made more accurate, thereby avoiding damage to the wafer, and also avoiding downtime caused by operation errors, and improving operation reliability and operation efficiency.

According to an embodiment of the present application, in the step of judging according to the first captured image whether there is the wafer at the current pick-up level or the current unloading level corresponding to the current detection position,

If the current pick-up level does not have the wafer or the current unloading level places the wafer, then judging whether the current detection position is the maximum detection position,

If the current detection position is the maximum detection position, control the transfer module to return to the initial position; if the current detection position is not the maximum detection position, set the current detection position parameter, the current The material level parameter or the current lower material level parameter is adjusted to a preset value respectively, and the step of controlling the transfer module to move to the current detection position according to the current detection position parameter is returned and executed according to the adjusted current detection position parameter .

In the above embodiment, by judging that the current detection position is the maximum detection position, the transfer module can quickly return to the initial position after reaching the maximum detection position for subsequent operations, thereby improving operation efficiency.

According to an embodiment of the present application, the step of controlling the transfer module to place the wafer after the alignment is completed includes: executing after the step of the transfer module moving to the current unloading position A step of controlling the transfer module to place and return the wafer according to preset descending and returning parameters.

In the above-mentioned embodiment, by controlling the handling module to place and return the wafer according to the preset descending and returning parameters after the step of moving the handling module to the current unloading position, the described method can be improved. Operational efficiency of wafer pick and place operations.

According to an embodiment of the present application, the step of controlling the transfer module to obtain the wafer after the alignment is completed includes: executing after the step of the transfer module moving to the current pick-up position A step of controlling the handling module to lift and take out the wafer according to preset lifting and taking out parameters.

In the above embodiment, by controlling the transfer module to lift and take out the wafer according to the preset lifting and taking out parameters, the wafer can be effectively protected and the reliability of taking out operation can be ensured.

According to an embodiment of the present application, the handling module includes a wafer carrier for carrying the wafer and a moving assembly for driving the movement of the wafer carrier, and the wafer carrier is provided with a A wafer sensor for sensing the contact state between the wafer carrier and the wafer, the wafer handling control method further includes the following steps:

According to the sensing signal output by the wafer sensor, it is judged that the transfer module is in the no-load state or the load state, and if it is judged that the transfer module is in the no-load state, then return to execute the parameter control the step of moving the handling module to the current detection position; The bit parameters are respectively adjusted to preset values, and the wafer carried by the wafer carrier is placed.

In the above-mentioned embodiment, by judging whether the transfer module is in the no-load state or in the load state, the movement of the transfer module can be made more accurate and efficient, avoiding damage to the wafer Damage, downtime, while improving operational efficiency.

According to an embodiment of the present application, the step of placing the wafer carried by the wafer carrier includes:

Executing the placement action of placing the wafer in the first magazine by the handling module according to preset placement parameters; and

After performing the placement action, it is judged whether the transfer module is in the no-load state according to the sensing signal of the wafer sensor, and if the transfer module is in the no-load state, return to execute the The step of moving to the current detection position according to the current detection position parameter, if the transfer module is in the loading state, return to execute the transfer module according to the preset placement parameters to place the wafer on the Steps for the placement action in the first magazine.

In the above-mentioned embodiment, by judging whether the transfer module is in the no-load state or in the load state, the movement of the transfer module can be made more accurate and efficient, avoiding damage to the wafer Damage, downtime, while improving operational efficiency.

According to an embodiment of the present application, the wafer handling control method further includes: detecting the wafer performed before the step of placing the wafer carried by the wafer carrier Step, the described step of detecting described wafer comprises:

moving the wafer to a preset detection position;

performing defect detection on the wafer at the preset detection position;

If the wafer is detected to be qualified, the step of performing the placement action of placing the wafer in the first magazine by the handling module according to the preset placement parameters is executed;

If the wafer detection is unqualified, the step of placing the wafer in the second magazine by the handling module will be executed, and the step of moving to the current detection position according to the current detection position parameter will be executed. bit steps.

In the above embodiment, by performing the step of detecting the wafer before the step of placing the wafer carried by the wafer carrier, pre-detection can be performed during the handling process, and timely Defective products are found, and pre-test samples are provided for the subsequent wafer processing process, thereby improving production efficiency.

According to an embodiment of the present application, the wafer handling control method further includes the following steps:

Before the handling module places the wafer into the first magazine, acquiring a second captured image of the accommodation space of the first magazine taken from the pick-and-place opening of the first magazine, Controlling the handling module to perform discharging alignment according to the second captured image, and controlling the handling module to execute the process of placing the wafer into the first magazine after the discharging alignment is completed a step of placing or inspecting said wafer; and/or

Before the handling module places the wafer into the second magazine, a third captured image of the accommodation space of the second magazine is captured from the pick-and-place opening of the second magazine, according to The third captured image controls the conveying module to perform discharge alignment, and controls the conveyance module to place the wafer into the second magazine after the discharge alignment is completed. Action or the step of detecting the wafer.

In the above embodiment, by obtaining the second captured image before the handling module places the wafer in the first magazine and/or placing the wafer in the handling module in the Obtaining the third captured image before the second magazine can make the operation of the handling module more accurate in each process of acquiring and/or placing the wafer, ensuring the reliability of the wafer pick-and-place operation , while ensuring operational efficiency.

According to an embodiment of the present application, the step of performing defect detection on the wafer includes:

Obtaining a detection image of the wafer transported on the transport module captured at the preset detection position;

Analyzing the defect ratio of the wafer according to the inspection image, and comparing the defect ratio with a preset ratio to determine whether the wafer is qualified.

In the above embodiment, the detection image is obtained by obtaining the detection image of the wafer carried on the transfer module captured at the preset detection position, so as to determine whether the wafer is qualified, and a preliminary inspection can be carried out during the transfer process. The detection and classification provide pre-test samples for the subsequent processing of the wafer, avoiding waste from entering the subsequent processing, thereby improving production efficiency and reducing the space occupied by equipment.

In four aspects, the embodiment of the present application also discloses an electrical device, the electrical device includes a memory and a processor, the memory stores computer-readable instructions, and when the computer-readable instructions are executed by the processor, The processor is made to implement the method for controlling wafer transport as described in any one of the above.

In the fifth aspect, the embodiment of the present application also discloses a computer-readable storage medium, on which computer-readable instructions are stored, and when the computer-readable instructions are executed by a processor, the wafer handling described in any one of the above is realized. Control Method.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings that need to be used in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For Those of ordinary skill in the art can also obtain other drawings based on these drawings without making creative efforts.

FIG. 1 is a schematic perspective view of a wafer handling device disclosed in an embodiment of the present invention;

Fig. 2 is a schematic perspective view of a wafer cassette disclosed by an embodiment of the present invention;

Fig. 3 is a schematic cross-sectional view of the wafer box shown in Fig. 2;

Fig. 4 is a three-dimensional schematic diagram of a handling module disclosed by an embodiment of the present invention;

FIG. 5 is a flow chart of a wafer handling control method disclosed by an embodiment of the present invention;

FIG. 6 is a work flow diagram of a wafer handling device using a wafer handling control method shown in FIG. 5 disclosed by an embodiment of the present invention;

FIG. 7 is a partial workflow diagram of a wafer handling device using a wafer handling control method shown in FIG. 5 disclosed by an embodiment of the present invention;

Fig. 8 is a schematic structural diagram of an electrical device disclosed in an embodiment of the present invention;

Fig. 9 is a schematic structural diagram of a storage medium disclosed by an embodiment of the present invention.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", The orientations or positional relationships indicated by "vertical", "horizontal", "horizontal", and "longitudinal" are based on the orientations or positional relationships shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not intended to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation.

Moreover, some of the above terms may be used to indicate other meanings besides orientation or positional relationship, for example, the term "upper" may also be used to indicate a certain attachment relationship or connection relationship in some cases. Those skilled in the art can understand the specific meanings of these terms in the present invention according to specific situations.

Furthermore, the terms "installed", "disposed", "provided", "connected", "connected" are to be interpreted broadly. For example, it may be a fixed connection, a detachable connection, or an integral structure; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediary; internal connectivity. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply that the indicated devices, elements Or the relative importance and number of components. Unless otherwise specified, "plurality" means two or more.

In some related technologies, the wafer handling equipment uses sensors for positioning and handling. However, some use sensors for indirect measurement. When there is an installation error or position deviation between the sensor position and the real wafer position, the precise positioning The reliability and safety of bit handling are not easy to guarantee. In addition, some related technology equipment and methods do not have a contact force sensing module in the process of wafer handling, so it is difficult to determine the actual contact between the wafer carrier and the wafer. When the preset When there is a deviation in the wafer pick-up position, a misjudgment of the pick-up will occur, that is, there is a possibility that the next step will continue if the preset pick-up position is not picked up. In addition, the equipment and methods of some related technologies do not have the functions of wafer pre-detection and classification during the wafer handling process. It is possible to process the defective wafer in the subsequent process, which wastes manpower and material resources and reduces the efficiency of wafer processing and manufacturing.

In order to improve the above problems, the embodiment of the present application discloses a wafer cassette 10, wafer handling equipment 1, wafer handling control method, electrical equipment 2, and storage medium 3, which can achieve the purpose of precise wafer handling and automatic operation . Each will be described in detail below.

Please refer to FIGS. 1-4 together. FIG. 1 is a perspective view of a wafer handling device 1 disclosed in an embodiment of the present invention; FIG. 2 is a perspective view of a wafer cassette 10 disclosed in an embodiment of the present invention ; FIG. 3 is a schematic cross-sectional view of the wafer box 10 shown in FIG. 2; FIG. 4 is a perspective view of a handling module 20 disclosed in an embodiment of the present invention. As shown in FIG. 1 , the embodiment of the present application discloses a wafer handling device 1 , the wafer handling device 1 includes a wafer cassette 10 , a handling module 20 , a visual sensing module 30 and a control module 40 , In this embodiment, the wafer cassette 10 includes a carrier 11 and a light source 12, and the handling module 20 is used to obtain or place the wafer from the pick-and-place opening 112; the visual sensing module 30 When the light source 12 emits light toward the accommodation space 111, photograph the accommodation space 111 at the side of the pick-and-place opening 112 and output a first photographed image; the control module 40 is electrically connected to the transport module The group 20 and the visual sensing module 30 are used to receive and control the alignment of the handling module 20 according to the first captured image, and control the handling module 20 after the alignment is completed. Picking or placing of the wafer is performed.

It can be understood that the wafer handling equipment 1 proposed in the present application can acquire or place the wafer from the wafer box 10, and during the process of handling the wafer, the light source 12 of the wafer box 10 Lighting towards the accommodation space 111 where the wafer is picked and placed can make the place without the wafer brighter and form a stronger light and dark contrast with the place where the wafer is placed. At the same time, the visual sensing The module 30 photographs the accommodating space 111 on the side of the pick-and-place port 112 and outputs a first photographed image, and the control module 40 controls the alignment of the transport module 20 according to the first photographed image, and the acquisition or placement of the wafer. Therefore, the wafer handling equipment 1 can realize precise positioning and grasping of the wafers in the wafer cassette 10 , and further realize precise handling and automatic operation of the wafers.

Specifically, please refer to Fig. 2 and Fig. 3. In this embodiment, the wafer cassette 10 includes two oppositely arranged carriers 11 and a light source 12, and the two carriers 11 enclose a The accommodation space 111 between the parts 11 and the pick-and-place opening 112 located on one side of the accommodation space 111, the accommodation space 111 is used to accommodate a plurality of wafers parallel to the first reference plane, and the light source 12 is arranged on the The side of the accommodation space 111 away from the access opening 112 is used to emit light toward the accommodation space 111 . It can be understood that the wafer is in the shape of a flat plate, the first reference plane is the plane on which the wafer is placed, and the wafer can be put into the accommodation space 111 through the pick-and-place opening 112, or through the The pick-and-place opening 112 is taken out from the accommodating space 111 , and the light source 12 can emit light toward the accommodating space 111 to illuminate the accommodating space 111 during the operation of putting in and taking out. By arranging the light source 12 that emits light toward the accommodation space 111 , the brightness in the wafer cassette 10 can be increased, so as to facilitate a clearer observation of the storage conditions of the wafers in the wafer cassette 10 .

Further, the light source 12 is a surface light source, including a light emitting surface 121 facing the accommodating space 111 , and the light emitting surface 121 is perpendicular to the first reference plane. It can be understood that if the light source 12 is set as a surface light source, it may have a large and uniform light emitting surface 121, and at the same time, the light emitting surface 121 of the light source 12 is arranged opposite to the pick-and-place opening 112. In this embodiment, The light-emitting surface 121 of the light source 12 can be perpendicular to the first reference plane, and the light emitted by the light source 12 can be parallel to the placement plane of the wafer (ie, the first reference plane), thereby facilitating Accurately obtain the placement position of the wafer.

Further, the carrier 11 includes a base plate 113 and a plurality of carrier plates 114 connected to a side of the base plate 113 close to the accommodation space 111, and the plurality of carrier plates 114 are arranged at intervals along a first preset direction. In an embodiment, the first preset direction may be perpendicular to the first reference plane, and the plurality of bearing plates 114 of the two bearing members 11 are arranged opposite one by one, and the two bearing plates arranged oppositely 114 constitutes a carrying assembly 116 with a carrying position 115, and is used to carry two ends of the wafer respectively. In this embodiment, each of the carrying components 116 includes two oppositely arranged carrying plates 114 and the carrying position 115 composed of the two carrying plates 114, and the wafer can be placed in the carrying position. In 115, it is supported by the two oppositely arranged carrying plates 114, which ensures the stability of placing the wafer.

Further, the wafer cassette 10 also includes a pressure sensor 13, a counting module 14 and a communication module 15, the pressure sensor 13 is arranged on the side of the carrier plate 114 carrying the wafer, and is electrically connected to the counting module 14 and the communication module 15, the communication module 15 is electrically connected to the control module 40, and the pressure sensor 13 is used to sense whether the wafer is placed on the carrying position 115 and send a first sensing signal to The counting module 14 is such that the counting module 14 counts the wafers in the wafer cassette 10 according to the first sensing signal, and the communication module 15 records the count recorded by the counting module 14 The result is sent to the control module 40; the counting module 14 is also used to display the counting result; the pressure sensor 13 is arranged on the two bearing plates 114 of the bearing assembly 116, and the pressure The number of sensors 13 is twice the number of wafers that the cassette 10 can accommodate; the pressure sensors 13 are located in the middle area of the side of the carrier plate 114 that carries the wafers. The pressure sensors 13 are provided on the two carrying plates 114 of the carrying assembly 116 to accurately obtain the placement of the wafers in the wafer cassette 10 through pressure sensing, and then the counting module 14 performs Counting and displaying, at the same time, the counting result is sent to the control module 40 through the communication module 15, which facilitates the control operation of the control module 40, thereby realizing precise wafer handling and automatic operation.

Further, referring to FIG. 4, the transfer module 20 includes a moving assembly 21 electrically connected to the control module 40 and a wafer carrier 22 connected to the moving assembly 21, and the moving assembly 21 is used for Drive the movement of the wafer carrier 22 under the control of the control module 40, the visual sensing module 30 is arranged on the wafer carrier 22, and then the visual sensing module 30 can be connected with the Wafer carriers 22 move together. By arranging the visual sensing module 30 on the wafer carrier 22 of the handling module 20, the visual sensing module 30 can move together with the wafer carrier 22, and then There is no need for other devices to separately drive the movement of the visual sensing module 30, and the angle of view of the first captured image taken by the visual sensing module 30 can be the same as the operating angle of view of the wafer carrier 22, so that the control The algorithm is simpler and less error-prone. It achieves precise handling and automatic operation of wafers, and at the same time has higher operating efficiency.

Specifically, the moving assembly 21 includes a base 211, a first moving joint 212 arranged on the base 211 that can expand and contract along a second preset direction, and a first moving joint 212 that is rotatably connected to the first moving joint 212 at one end. A rotating arm 213 , a second rotating arm 214 rotatably connected at one end to the other end of the first rotating arm 213 , and the wafer carrier 22 rotatably connected to the other end of the second rotating arm 214 . In this embodiment, the first preset direction and the second preset direction may be the same direction. It can be understood that the moving assembly 21 is a multi-degree-of-freedom robot, and the second rotating arm 214 and the crystal The circular carrier 22 can be integrally connected or connected by rotation, and the precise handling and automatic operation of the wafer can be realized through the moving component 21 .

Further, the wafer carrier 22 includes a connection base 221 and a transfer part 222, the connection base 221 is arranged on the moving assembly 21 along the second predetermined direction, and the transfer part 222 is connected to the One side of the connecting base 221; the visual sensing module 30 is arranged on the side of the connecting base 221 away from the moving assembly 21 along the second preset direction, and the visual sensing module 30 is used to face The side where the conveyance unit 222 is located takes pictures. It can be understood that the first moving joint 212, the connecting base 221 and the visual sensing module 30 are all arranged along the second preset direction, so there is no need to perform position conversion during the pick-and-place process, which improves the accuracy of the operation. The positioning accuracy and positioning efficiency during the wafer pick-and-place process, by connecting the moving assembly 21, the visual sensing module 30 and the handling part 222, can make the control more efficient and the handling more efficient. precise.

Further, the visual sensing module 30 includes a camera mounting plate 31 disposed on the connecting base 221, a first industrial camera 32 disposed on the camera mounting plate 31, and a first industrial camera mounted on the first industrial camera. 33 on the first shot. In this embodiment, the first lens 33 may be a telecentric lens.

Further, the wafer handling equipment 1 further includes a wafer sensor 50, the wafer sensor 50 is arranged on the surface of the handling part 222 close to the wafer and is located in the handling part 222 One end far away from the connection base 221, the wafer sensor 50 is electrically connected to the control module 40 for sensing the wafer and outputting a second sensing signal to the control module 40, so that The control module 40 counts and/or picks and places the wafers transported by the transport module 20 . By setting the wafer sensor 50 on the surface of the carrying part 222 close to the wafer and at the end of the carrying part 222 away from the connection base 221, the control module 40 can pass The second sensing signal senses the contact state between the wafer and the transfer unit 222 in real time, accurately senses the wafer pick-and-place and counts them synchronously, thereby ensuring the reliability of the wafer pick-and-place and handling process sex.

Specifically, the carrying part 222 includes two arm parts 222a, and the two arm parts 222a are connected to the connection base 221 and form a U-shape with an opening, and the opening faces away from the connection base 221. On one side, the wafer sensor 50 is arranged at the end of the arm portion 222a away from the connecting base 221; one side of the two arm portions 222a carrying the wafer is respectively provided with a wafer Sensor 50; the wafer sensor 50 is a pressure film sensor. In this embodiment, the optical axis direction of the first industrial camera and the first lens 33 is consistent with the axial direction of the U-shaped opening surrounded by the two arm parts 222a. By respectively disposing the wafer sensors 50 on the sides of the two arm parts 222a carrying the wafer, the pressure sensing of the wafer can not be affected by the positional deviation of the wafer. , to make the sensing more accurate, and at the same time, the wafer sensor 50 is a pressure film sensor, which can accurately sense the pressure of the wafer without affecting the pick-and-place of the wafer.

Further, the control module 40 monitors whether the transport module 20 obtains the wafer from the wafer cassette 10 according to the second sensing signal, when the control module 40 according to the When the second sensing signal determines that the conveying module 20 is in an unloaded state, the control module 40 controls the visual sensing module 30 to re-photograph the receiving space 111 from the pick-and-place opening 112 and update it. The first captured image is re-aligned according to the updated first captured image, and the transfer module 20 is controlled to acquire the wafer after the re-alignment is completed. It can be understood that, after each operation of acquiring the wafer by the handling module 20, the control module 40 will detect the acquisition operation, and when it is detected that the handling module 20 is in an empty state, it is proved that At this time, the obtaining operation of the wafer fails. At this time, the control module 40 can control the visual sensing module 30 to re-photograph the receiving space 111 from the pick-and-place port 112 and update the The first captured image, and according to the updated first captured image, carry out the alignment again, and re-acquire the wafer, avoiding the wrong operation that causes the subsequent inability to accurately perform the acquisition operation, and even causing the entire wafer Shutdown of the circular handling device 1 . Through the control module 40 judging whether the conveying module 20 is in the unloaded state according to the second sensing signal, the alignment can be performed again when the conveying module 20 is in the unloaded state, and again Performing the acquisition of the wafers avoids downtime and at the same time improves operational efficiency.

Further, it can be understood that the above-mentioned wafer handling equipment 1 having the wafer cassette 10, the handling module 20 and the visual sensing module 30 can be applied to transport the wafers in the wafer cassette 10 to other The magazine (such as the first magazine 60 or the second magazine 70 ) can also be used to transport the wafers in other magazines to the wafer magazine 10 for storage. The following mainly takes the wafer transport equipment 1 transporting the wafers in the wafer cassette 10 to other cassettes as an example for illustration.

Specifically, in one embodiment, the wafer handling equipment 1 further includes a first magazine 60, and the handling module 20 is used to obtain the wafer from the wafer box 10, transport and place the wafer to The first magazine 60, when the control module 40 judges according to the second sensing signal that the handling module 20 performs the placing action of placing the wafer on the first magazine 60, still When in the loading state, the control module 40 controls the handling module 20 to perform the placing action of placing the wafer on the first magazine 60 again. It can be understood that after placing the wafer on the first magazine 60, the control module 40 will detect the placing operation, and when it is detected that the handling module 20 is still in the loading state, It proves that the placing operation of the wafer fails at this time, and at this time, the control module 40 can control the handling module 20 to perform the placing action of placing the wafer in the first magazine 60 again, The damage caused by the dislocation operation of the wafer is avoided, and even the stoppage of the entire wafer handling equipment 1 is caused. Through the control module 40 judging whether the handling module 20 is in the loading state after performing the placing action of placing the wafer on the first magazine 60 according to the second sensing signal, it can be in the When the handling module 20 is in the carrying state, the placing action of placing the wafer into the first magazine 60 is performed again, which avoids damage to the wafer and stops the operation, and improves the operation efficiency at the same time.

Further, the wafer handling equipment 1 may also include a second magazine 70 and a defect detection module 80, the defect detection module 80 is located in the transport module 20 from the wafer box 10 to the On the conveyance path of the first magazine 60, the defect detection module 80 is electrically connected to the control module 40, and the defect detection module 80 is used to detect defects on the wafers transported by the conveyance module 20. Detect and output defect detection information to the control module 40, and the control module 40 is also used to control the handling module 20 to place the wafers that have passed the inspection on the first wafer according to the defect detection information. The magazine 60 is used to place the wafers that fail the inspection in the second magazine 70 . It can be understood that, on the transport path where the transport module 20 transports the wafer from the wafer cassette 10 to the first magazine 60, it will first pass through the defect detection module 80, and The detection module 80 performs defect detection, and the control module 40 controls the handling module 20 to place the wafers that pass the detection on the The first magazine 60 places the wafers that fail the inspection in the second magazine 70 . By setting the defect detection module 80 on the transport path from the wafer cassette 10 to the first magazine 60, and performing defect detection on the wafer at the same time, it is possible to reduce the generation of the wafer during the transport process. handling error, save handling time, improve detection efficiency, and at the same time, place the unqualified wafers in the second magazine 70, which can be pre-detected and classified during the handling process, for subsequent processing of the wafers The process provides pre-test samples to prevent waste from entering the subsequent processing procedures, thereby improving production efficiency and reducing equipment footprint.

It can be understood that the structure of the first magazine 60 and the second magazine 70 may be the same as that of the wafer box 10, and the description of the first magazine 60 and the second magazine will not be repeated here. The specific structure of the box 70.

Further, the visual sensing module 30 is also used to take pictures from the pick-and-place port 112 of the first magazine 60 before the handling module 20 places the wafer into the first magazine 60 The accommodating space 111 of the first magazine 60 obtains a second photographed image, and the control module 40 is also used to control the conveying module 20 to carry out discharging alignment according to the second photographed image, and After the discharge alignment is completed, control the handling module 20 to perform the placing action of placing the wafer into the first magazine 60 or the step of detecting the wafer; and/or the visual sensing The module 30 is also used to take pictures of the second magazine 70 from the pick-and-place port 112 of the second magazine 70 before the handling module 20 places the wafer into the second magazine 70 The accommodating space 111 obtains the third photographed image, and the control module 40 is also used to control the conveying module 20 to perform the discharging alignment according to the third photographed image, and control the The handling module 20 executes the placing action of placing the wafer into the second magazine 70 or the step of inspecting the wafer. The second is obtained by photographing the receiving space 111 of the first magazine 60 from the pick-and-place opening 112 of the first magazine 60 before the handling module 20 places the wafer into the first magazine 60 . 2. Take an image and/or take a picture of the second magazine 70 from the pick-and-place port 112 of the second magazine 70 before the handling module 20 places the wafer into the second magazine 70 The receiving space 111 obtains the third photographed image, which can make the operation of the handling module 20 more accurate in each process of acquiring and/or placing the wafer, and ensure the reliability of the wafer pick-and-place operation. At the same time, the operating efficiency is guaranteed.

Further, the defect detection information includes detection images, the defect detection module 80 includes a camera module 81 and a bracket 82 supporting the camera module 81, and the camera module 81 is used to photograph the transport module 20. The inspection image is obtained from the wafer transported, and the control module 40 is also used to analyze the defect ratio of the wafer according to the inspection image, and compare the defect ratio with a preset ratio to judge Whether the wafer is good or bad.

Further, the bracket 82 includes a support body 821, a camera support portion 822 connected to one side of the support body 821, and a light source support portion 823 connected to one side of the support body 821, and the camera module 81 includes a second An industrial camera 811, a second lens 812 and a supplementary light 813, the second lens 812 is installed on the second industrial camera 811, and the second industrial camera 811 is arranged on the camera support part 822 away from the support One end of the main body 821; the supplementary light 813 is arranged on the end of the light source support portion 823 away from the supporting main body 821; the wafer transported by the transport module 20 is used to be parallel to the first reference plane placed, the second industrial camera 811 faces the wafer and the optical axis of the second industrial camera 811 is perpendicular to the first reference plane; Located between the second industrial camera 811 and the handling module 20 and used to emit light toward the wafer, the second industrial camera 811 is used to photograph the wafer through the hollow area of the ring-shaped light emitting member to obtain the detection image. In this embodiment, the second lens 812 may be a telecentric lens. The wafer carried by the handling module 20 is placed parallel to the first reference plane, the second industrial camera 811 faces the wafer and the optical axis of the second industrial camera 811 is perpendicular to the wafer. The first reference plane can make the second industrial camera 811 vertically photograph the wafer, and at the same time, under the illumination of the supplementary light 813, the defect detection of the defect detection module 80 can be made more accurate. Higher precision.

Please refer to FIG. 5. FIG. 5 is a flow chart of a wafer handling control method disclosed in an embodiment of the present invention. In an embodiment of the present application, the wafer handling equipment 1 is performing the picking and placing of the wafer During operation, the picking and placing of the wafer can be completed by executing the wafer handling control method, and the wafer handling control method includes the following steps:

Step S101: providing a wafer box 10, the wafer box 10 includes two oppositely disposed carriers 11 and a light source 12, and the two carriers 11 enclose an accommodating space between the two carriers 11 111 and a pick-and-place opening 112 located on one side of the accommodation space 111, the accommodation space 111 is used to accommodate a plurality of wafers parallel to the first reference plane, and the light source 12 is located in the accommodation space 111 away from the pick-and-place opening 112 side. Specifically, after the wafer handling equipment 1 is turned on, the light source 12 can emit light. When the light source 12 emits light on a side far away from the pick-and-place opening 112, when viewed from the pick-and-place mouth 112 side, , there will be relatively bright stripes in the place where the wafer is not placed, which can form a stronger contrast with the dark stripes caused by the wafer blocking light in the place where the wafer is placed, so that it is convenient to know the location of the wafer. Location.

Step S102 : when the light source 12 emits light toward the accommodation space 111 , acquire a first photographed image of the accommodation space 111 on the side of the pick-and-place opening 112 .

It can be understood that when multiple wafers are placed in the wafer cassette 10, the first photographed image in step S102 is the light and dark image formed by the wafer cassette 10 under the illumination of the light source 12. Image of contrasting stripes.

It can be understood that the wafer handling control method may also include the following steps:

Step S301: Before acquiring the first captured image, control the transport module 20 to move to the current detection position according to the current detection position parameters.

Wherein, the current detection position may be a position for detecting the pick-and-place position of the wafer. In this embodiment, the current detection position may be a position for capturing the first photographed image.

Step S302: According to the first captured image, it is judged whether there is the wafer at the current pick-up level or the current unloading level corresponding to the current detection position, if the current pick-up level has the wafer or the current If the wafer is not placed at the unloading position, step S103 is performed.

Wherein, it can be understood that the above-mentioned wafer handling control method can be applied to the picking up or The blanking can also be applied to the blanking of transferring wafers in other magazines and placing them in the wafer cassette 10 . In the following, an example will be described in which the wafer handling equipment 1 transports the wafers in the wafer cassette 10 to other magazines for picking and unloading.

In step S302, during the unloading operation, if the current unloading position has the wafer, the unloading operation is performed after alignment, and during the unloading operation, if the current unloading position does not place the wafer For the above-mentioned wafer, the unloading operation is performed after alignment. By judging whether the current fetching level or the current unloading level corresponding to the current detection position has the wafer, and controlling the alignment of the handling module 20, it can be avoided that the current fetching level does not have the wafer or the wafer. The dislocation operation when the wafer has been placed at the current loading level is described above, so as to avoid damage to the wafer, avoid shutdown caused by operation errors, and improve operation reliability and operation efficiency.

In this embodiment, in step S302, if the current pick-up level does not have the wafer or the current unloading level places the wafer, it is judged whether the current detection position is the maximum detection position, if the If the current detection position is the maximum detection position, control the handling module 20 to return to the initial position; adjust the preset value of the position parameter or the current discharge level parameter respectively, and return to execute the step of controlling the transfer module 20 to move to the current detection position according to the current detection position parameter according to the adjusted current detection position parameter .

It should be noted that the wafer cassette 10 has limited wafer storage locations, and each storage location is separated by a preset distance. In this embodiment, the preset distance can be Δz, and the maximum detection position is the The wafer cassette 10 is the last detection position corresponding to the storage position of the wafer. When the current detection position is the maximum detection position, the handling module 20 is controlled to return to the initial position. The initial position can be set to default position; when the current detection position is not the maximum detection position, the current detection position parameter, the current fetching level parameter or the current discharge level parameter are respectively adjusted to preset values to obtain an update After the current detection level parameter, the current fetching level parameter or the current unloading level parameter, in this embodiment, the preset value may be the preset interval distance of the wafer cassette 10, that is Δz. By judging that the current detection position is the maximum detection position, the transfer module 20 can quickly return to the initial position after reaching the maximum detection position for subsequent operations, thereby improving operation efficiency.

Step S103: Control the alignment of the conveying module 20 according to the first captured image.

Perform image analysis on the first captured image acquired in step S102, wherein, in the first captured image, the position where the dark stripe is located is the position where there is a wafer, and the wafer box 10 can be obtained The storage information of the above-mentioned wafer can be used to control the alignment of the transfer module 20 .

It can be understood that the current retrieving level parameter or the current unloading level parameter may be stored in the control module 40 of the wafer handling device 1. Specifically, step S102 may include the following steps:

Step S201: Correct the current material intake level parameter or the current material discharge level parameter according to the first captured image to obtain the corrected material intake level parameter or the corrected material discharge level parameter, and obtain the corrected material intake level parameter or the corrected material discharge level parameter according to the corrected material intake level parameter or the Correcting the lower material level parameter and updating the current fetching level parameter or the current lower material level parameter;

It can be understood that the current retrieving level parameter is the position parameter of the wafer that currently needs to be reclaimed in the wafer cassette 10, and the current unloading level parameter is that the wafer that currently needs to be unloaded should be placed on the The position parameters in the wafer cassette 10, the current fetching level parameter or the current unloading level parameter can be obtained by calculation. In this embodiment, the wafers in the wafer cassette 10 are stored at intervals, and the interval distance can be It is the preset interval Δz. After the current retrieving level or the current unloading level completes retrieving or unloading, the current retrieving level parameter is updated to the last retrieving level parameter + Δz, and the current unloading level parameter is updated to the upper One time material level parameter +Δz. In order to ensure the accuracy of the operation, before performing the feeding or unloading operation, image analysis can be performed on the first photographed image, so as to obtain the corrected feeding level parameters or corrected unloading level parameters, and finally according to the corrected The material fetching level parameter or the corrected material discharging level parameter is updated to update the current material fetching level parameter or the current discharging level parameter. After the material fetching or discharging operation is completed, the updated current material fetching level parameter or the current discharging level parameter Respectively +Δz, you can get the current material level parameter or the current material level parameter for the next material extraction or discharge.

Step S202: Control the transfer module 20 to move to the current material fetching level or the current material discharge level according to the corrected material fetching level parameter or the corrected material discharging level parameter.

It can be understood that by controlling the transfer module 20 to move to the current material intake level or the current material discharge level according to the corrected material intake level parameter or the corrected material discharge level parameter obtained from the first captured image, the operation can be made It is more accurate, thereby avoiding damage to the wafer, and also avoiding downtime caused by operation errors, and improving operation reliability and operation efficiency.

Step S104: Control the transfer module 20 to acquire or place the wafer after the alignment is completed.

Controlling the transfer module 20 to move to the current fetch position or the current discharge position according to the corrected material intake level parameter or the corrected discharge level parameter, that is, the transport module 20 extends into the wafer cassette 10 When the current retrieving level or the current unloading level is reached, the handling module 20 can perform the retrieving or unloading operation.

Specifically, controlling the transfer module 20 to place the wafer after the alignment is completed may include controlling the transfer module 20 to be executed after the step of moving the transfer module 20 to the current unloading position. The group 20 performs the steps of placing and returning the wafer according to preset descending and returning parameters. It can be understood that, after the transfer module 20 moves to the current unloading position, it descends according to a preset lowering parameter, so that the wafer is placed on the carrier 11, and the preset lowering parameter can be a preset Then, the transfer module 20 returns according to the return parameter, and the return parameter can be the default return position, or the operation position for the next operation. By moving the transfer module 20 to the current blanking After the first step, control the handling module 20 to place and return the wafer according to preset descending and returning parameters, which can improve the operational efficiency of the wafer pick-and-place operation.

The controlling the transfer module 20 to obtain the wafer after the alignment is completed may include controlling the transfer module 20 to be executed after the step of moving the transfer module 20 to the current pick-up position. The step of lifting and taking out the wafer by preset lifting and taking out parameters. It can be understood that, after the transfer module 20 moves to the current pick-up position, it is lifted according to a preset lifting parameter, so that the wafer is placed on the transfer module 20, and the preset lifting parameter can be a preset Then, the handling module 20 takes out the wafer according to the taking-out parameters, and by controlling the handling module 20 to lift and take out the wafer according to the preset lifting and taking-out parameters, it can effectively protect the The above-mentioned wafers ensure the reliability of the removal operation.

The wafer transfer control method proposed in this application obtains the first captured image of the storage space 111 on the side of the pick-and-place opening 112 when the light source 12 emits light toward the storage space 111, and according to the The first captured image controls the alignment of the handling module 20, completes the acquisition or placement of the wafer, and realizes the precise alignment and grasping of the wafer in the wafer cassette 10, thereby realizing the alignment of the wafer. Precise handling and automatic operation.

Further, in some embodiments, the handling module 20 includes a wafer carrier 22 for handling the wafer and a moving assembly 21 that drives the movement of the wafer carrier 22, and the wafer carrier 22 is provided with a wafer sensor 50 for sensing the contact state between the wafer carrier 22 and the wafer, and the wafer handling control method further includes the following steps:

Step S401: According to the sensing signal output by the wafer sensor 50, it is judged that the transfer module 20 is in the no-load state or the load state, and if it is judged that the transfer module 20 is in the no-load state, return to execution In step S301, if it is determined that the transport module 20 is in the carrying state, then step S402 is executed.

Step S402: Adjusting the current detection level parameter, the current pick-up level parameter or the current unloading level parameter to preset values respectively, and placing the wafer carried by the wafer carrier 22 .

Through the sensing of the pressure of the wafer placed on the wafer carrier 22 by the wafer sensor 50, it can be judged whether there is the wafer on the wafer carrier 22, when the There is no wafer on the wafer carrier 22, that is, the transfer module 20 is in the no-load state, and the wafer has been placed at this time, and the transfer module 20 moves to the current position according to the current detection position parameter. The detection position is carried out for the next transportation. When the wafer is on the wafer carrier 22, that is, the transportation module 20 is in the carrying state, step S402 is executed to place the wafer, and at the same time according to the The preset value is used to update the current detection level parameter, the current fetching level parameter or the current discharging level parameter.

In the above embodiment, by judging whether the transfer module 20 is in the no-load state or in the loaded state, the movement of the transfer module 20 can be made more accurate and efficient, avoiding the Wafer damage, downtime, and, at the same time, increased operational efficiency.

Specifically, the step of placing the wafer carried by the wafer carrier 22 includes the following steps:

Step S501: Execute the placement action of the handling module 20 to place the wafer in the first magazine 60 according to preset placement parameters.

Step S502: After performing the placement action, judge whether the transfer module 20 is in the no-load state according to the sensing signal of the wafer sensor 50, if the transfer module 20 is in the no-load state , return to step S301, and return to step S501 if the transport module 20 is in the carrying state.

It can be understood that the first magazine 60 may be a magazine for storing the wafer after the wafer is taken out of the wafer cassette 10 . After the wafer is taken out from the wafer cassette 10, it is put into the first magazine 60 according to the placement parameters. If the placement is successful, the handling module 20 is in the empty state, and it can return to Execute the next fetch, if the placement is unsuccessful, continue the placement operation. By judging whether the transfer module 20 is in the no-load state or in the load state, the movement of the transfer module 20 can be made more accurate and more efficient, avoiding damage to the wafer, shutdown, At the same time, the operating efficiency is improved.

Further, before the step of placing the wafer carried by the wafer carrier 22, the step of detecting the wafer may also be included, and the step of detecting the wafer includes the following steps :

Step S601: moving the wafer to a preset detection position.

It should be noted that the preset detection position may be a fixed detection position, and the handling module 20 may move the wafer to the preset detection position each time the wafer is obtained.

Step S602: Perform defect detection on the wafer at the preset detection position; if the wafer is detected to be qualified, step S501 will be executed; if the wafer is not detected to be qualified, step S603 will be executed.

Specifically, the defect detection of the wafer may include the following steps:

Step S701: Obtain a detection image of the wafer transported on the transport module 20 photographed at the preset detection position.

Step S702: Analyze the defect ratio of the wafer according to the inspection image, and compare the defect ratio with a preset ratio to determine whether the wafer is qualified.

In this embodiment, the defect detection is performed on the wafer, and the defect ratio of the wafer is analyzed according to the detection image, which may be the wear defect ratio of the wafer, and the preset ratio may be a preset wear defect Ratio η, when the wear defect ratio of the wafer is less than the preset wear defect ratio η, it is considered that the wafer inspection is qualified, and the qualified wafer is placed into the first magazine 60, when the wafer If the wear defect ratio of the circle is greater than or equal to the preset wear defect ratio η, it is considered that the wafer inspection is unqualified, and the inspection is obtained by the wafer transported on the transfer module 20 photographed at the preset inspection position. image, so as to judge whether the wafer is qualified, pre-test classification can be carried out during the handling process, and pre-test samples can be provided for the subsequent processing process of the wafer, so as to prevent waste from entering the subsequent processing process, thereby improving production efficiency and reducing equipment take up space.

Step S603: Execute the step of placing the wafer in the second magazine 70 by the handling module 20, and return to the step of moving to the current detection position according to the current detection position parameter.

The second material box 70 can be a recovery box for unqualified products, and the unqualified wafers can be recycled through the second material box 70. When the wear defect ratio of the wafer is greater than or equal to the preset wear When the defect ratio is η, the wafer inspection is unqualified, and the unqualified wafers are placed into the second magazine 70 . By performing the step of detecting the wafer before the step of placing the wafer carried by the wafer carrier 22, pre-detection can be carried out during the handling process, and defective products can be found in time, for The wafer subsequent processing process provides pre-test samples, thereby improving production efficiency.

In order to ensure the operation accuracy and reliability of placing the wafer into the first magazine 60 and the second magazine 70 by the handling module 20, the wafer handling control method may further include the following steps :

Step S801: Before the handling module 20 puts the wafer into the first magazine 60, obtain the image of the first magazine 60 photographed from the pick-and-place opening 112 of the first magazine 60 The second captured image of the accommodation space 111, according to the second captured image, the conveying module 20 is controlled to carry out the discharging alignment, and after the discharging and aligning is completed, the conveying module 20 is controlled to carry out the A placing action of placing wafers into the first magazine 60 .

Step S802: Before the handling module 20 puts the wafer into the second magazine 70, take pictures of the storage of the second magazine 70 from the pick-and-place opening 112 of the second magazine 70 The third captured image of the space 111, according to the third captured image, the transfer module 20 is controlled to carry out the alignment of the material, and after the alignment of the discharge is completed, the transfer module 20 is controlled to carry out the alignment of the wafer. A circular placing action to the second magazine 70 is placed.

In step S801 and step S802, the second captured image and the third captured image are acquired, and the handling module 20 is controlled to carry out the alignment of the material according to the second captured image and the third captured image, and the discharging After the alignment is completed, control the handling module 20 to perform the process of placing the wafer on the first magazine 60 and the second magazine 70 and acquire the first captured image, according to the second A captured image controls the handling module 20 to carry out the discharge alignment, and controls the handling module 20 to perform the steps of placing the wafer into the wafer cassette 10 after the completion of the discharge alignment. , which will not be repeated here. By obtaining the second captured image before the handling module 20 places the wafer into the first magazine 60 and/or placing the wafer into the second magazine 60 in the handling module 20 Obtaining the third captured image before the box 70 can make the operation of the handling module 20 more accurate in each process of acquiring and/or placing the wafer, ensuring the reliability of the wafer pick-and-place operation, At the same time, the operating efficiency is guaranteed.

Please refer to FIG. 6 . FIG. 6 is a working flowchart of the wafer handling equipment 1 using the wafer handling control method shown in FIG. 5 disclosed by an embodiment of the present invention. The wafer handling equipment 1 starts to work, the light source is turned on, and the control module 40 implements various preset parameters (including the current fetching level parameter, the current unloading level parameter, the maximum detection level parameter, preset values, wear Defect ratio η, etc.), then, the control module 40 controls the handling module 20 and the visual sensing module 30 to move to the current detection position for visual inspection according to the current detection position parameters, that is, the visual The sensing module 30 captures the first captured image, and further, the control module 40 judges whether there is a wafer at the current detection position according to the first captured image, and if there is a wafer at the current detection position, according to the first Taking an image to correct the current fetching level parameter, and controlling the transfer module to align with the current detection position and perform wafer acquisition according to the current detection position parameter, if there is no wafer at the current detection position, then Judging whether the current detection bit is the maximum detection bit, if so, the cycle ends, the work is stopped, and the work is to be restarted, if not, the current detection bit parameter is adjusted to a preset value, and the control module 40 is based on the adjusted The parameter of the current detection position is returned to the step of performing visual detection, that is, controlling the moving module 20 and the visual sensing module 30 to move to the next current detection position for visual detection.

Further, after the transfer module 20 performs the operation of obtaining the wafer, the control module 40 judges according to the second sensing signal output by the wafer sensor 50 on the transfer module 20 Whether the transfer module 20 is in the load state or the no-load state, if it is the no-load state, then return to the step of performing visual inspection, if it is the load state, then the transfer module 20 will transfer the wafer to the predetermined The detection bit is set to perform defect detection. Specifically, the defect detection module acquires a detection image, and the control module 40 judges whether the defect ratio of the wafer is less than a preset value according to the detection image, and if it is less than the preset value If the value is set, the handling module 20 can perform the placing action of placing the wafer into the first magazine 60 . In addition, the detection image can also be saved by the control module 40 for subsequent reference.

Specifically, before the wafer is unloaded into the first magazine 60, the handling module 20 can be controlled to move to the first magazine 60 according to the pre-stored current detection position parameters of the first magazine 60. 60 of the current detection position, and then through the visual sensing module 30 to capture the accommodating space of the first material box 60 to obtain the second captured image, and then judge the current position of the first material box 60 according to the second captured image. Whether there is a wafer in the material level, and correct the current material level parameter of the first material box 60 according to the second captured image, so that the handling module 20 The current blanking level parameter is accurately aligned and the action of placing the wafer into the first magazine 60 is performed; similarly, before the wafer is blanked into the second magazine 70, it can be According to the pre-stored current detection position parameters of the second material box 70, the handling module 20 is controlled to move to the current detection position of the second material box 70, and then the second material can be photographed by the visual sensing module 30. The accommodation space of the box 70 acquires a third captured image, and then judges whether there is a wafer at the current loading level of the second magazine 70 according to the third captured image, and determines whether there is a wafer at the current loading level of the second magazine 70 according to the third captured image The current loading level parameter of the magazine 70 is corrected, so that the handling module performs accurate alignment and executes placing the wafer on the The action of the second cartridge 70.

Further, after the transfer module 20 performs the placing action, the control module 40 further judges whether the transfer module 20 is in the loading state or not according to the second sensing signal output by the wafer sensor 50 . No-load state, if it is the no-load state, update the current detection bit parameter of the first magazine 60 stored in advance, such as adjusting the preset value, so as to correspond to the next detection of the first magazine 60 position, and update the pre-stored current detection position parameter of the second magazine 70, such as adjusting the preset value, so as to correspond to the next detection position, and return to perform the acquisition action of the next wafer of the wafer cassette 10 ; if it is in the carrying state, the control module controls the handling module 20 to return to the step of performing defect detection according to the detection image again, so that the detection can be further repeated by the defect detection module 80 to take pictures and obtain The steps of taking the second image or the third image, and placing the material again, etc. In addition, as shown in FIG. 7, in some other embodiments, if it is the loading state, the control module 40 also The handling module 20 can be controlled to return to the step of detecting the defect detection module 80 to capture the second captured image or the third captured image, as well as actions such as cutting and placing again.

To sum up, in the wafer handling equipment 1 and the wafer handling control method provided in the embodiment of the present application,

1. The light source 12 and the first industrial camera 32 directly detect the wafer and the wafer cassette 10, without being affected by the assembly error between the real loading positions of the wafer, and can realize automatic alignment and precision in the wafer handling process Pick and place can also accurately determine the presence or absence of wafers and count in real time. It has certain adaptive adjustment capabilities for positioning errors introduced by environmental disturbances, and has good flexibility, compliance and reliability.

2. The wafer handling equipment 1 and the wafer handling method are arranged symmetrically on each carrier plate 114 of the wafer cassette 10 with a pressure sensor 13 and a symmetrically arranged wafer sensor 50 at the end of the wafer carrier 22, Real-time perception of the contact status between the wafer and the carrier plate 114 of the wafer cassette 10, and the wafer and the wafer carrier 22, accurate sensing and synchronous counting of the wafer pick-and-place, thereby ensuring the reliability of the wafer pick-and-place and handling process.

3. The wafer handling equipment 1 and the wafer handling method use the second industrial camera 811 to perform pre-detection of the wafer on the path that must be passed through when the wafer is picked and placed. The processing process provides pre-test samples to prevent waste from entering the subsequent processing process, thereby improving production efficiency.

Please refer to FIG. 8 . FIG. 8 is a schematic structural diagram of an electrical device 2 disclosed by an embodiment of the present invention, and the electrical device 2 includes a memory 91 and a processor 92 .

Computer-readable instructions 93 are stored in the memory 91 , and when the computer-readable instructions 93 are executed by the processor 92 , the processor 92 implements the method for controlling wafer handling described in any one of the above.

Please refer to FIG. 9, FIG. 9 is a schematic structural diagram of a storage medium disclosed in an embodiment of the present invention, the computer-readable storage medium 3 stores computer-readable instructions 93, and the computer-readable instructions 93 are executed by a processor 92 When realizing the wafer transfer control method as described in any one of the above.

It should be understood that reference throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic related to the embodiment is included in at least one embodiment of the present application. Thus, appearances of "in one embodiment" or "in an embodiment" in various places throughout the specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also know that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required by this application.

In various embodiments of the present application, it should be understood that the sequence numbers of the above-mentioned processes do not necessarily mean the order of execution. The implementation of the examples constitutes no limitation.

The units described above as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, located in one place, or distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit. The above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.

If the above-mentioned integrated units are realized in the form of software function units and sold or used as independent products, they can be stored in a computer-accessible memory. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product, and the computer software product is stored in a memory , including several requests to make an electrical device (which may be a personal computer, a server, or a network device, etc., specifically, a processor in the electrical device) execute some or all of the steps of the above-mentioned methods in various embodiments of the present application.

Those of ordinary skill in the art can understand that all or part of the steps in the various methods of the above-mentioned embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium, and the storage medium includes read-only Memory (Read-Only Memory, ROM), Random Access Memory (Random Access Memory, RAM), Programmable Read-Only Memory (Programmable Read-only Memory, PROM), Erasable Programmable Read-Only Memory (Erasable Programmable Read Only Memory, EPROM), One-time Programmable Read-Only Memory (OTPROM), Electronically Erasable Programmable Read-Only Memory (EEPROM), Compact Disc Read-Only Memory (CompactDisc Read -Only Memory, CD-ROM) or other optical disk storage, magnetic disk storage, tape storage, or any other computer-readable medium that can be used to carry or store data.

A wafer cassette 10, wafer handling equipment 1, wafer handling control method, electrical equipment 2 and storage medium 3 disclosed in the embodiment of the present application have been described above in detail. In this paper, specific examples are applied to the principles and principles of the present application. The implementation modes have been described, and the descriptions of the above embodiments are only used to help understand the method and the core idea of the present application. At the same time, for those skilled in the art, based on the idea of this application, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be construed as limiting the application.

Claims (25)

1. A wafer handling equipment, characterized in that the wafer handling equipment comprises: Wafer box, described wafer box comprises: Two supporting parts arranged oppositely, the two supporting parts enclose a storage space located between the two bearing parts and a pick-and-place opening located on one side of the storage space, and the storage space is used to accommodate a plurality of pieces a wafer parallel to the first datum; and a light source, arranged on a side of the accommodation space away from the access opening, for emitting light toward the accommodation space; A transport module, the transport module includes a wafer carrier, the wafer carrier includes a transport part and a connecting base, the transport part is connected to one side of the connecting base, and the transport part is used for The pick-and-place port picks up or places the wafer; A visual sensing module, configured to photograph the accommodation space on the side of the pick-and-place opening when the light source emits light toward the accommodation space and output a first photographed image; A control module electrically connected to the handling module and the visual sensing module, the control module is used to receive the first captured image, and the control module is used to Image-controlling the transfer module so that the transfer module performs alignment, and controlling the transfer module to acquire or place the wafer after the alignment is completed; and A wafer sensor, the wafer sensor is arranged on the surface of the transfer part close to the wafer and is located at the end of the transfer part away from the connection base, the wafer sensor is electrically connected to the control module for sensing the wafer and outputting a second sensing signal to the control module, so that the control module counts and counts the wafers transported by the transport module / or pick and place monitoring; The control module monitors whether the handling module obtains the wafer from the wafer cassette according to the second sensing signal, and when the control module judges the wafer according to the second sensing signal When the conveying module is in an unloaded state, the control module controls the visual sensing module to re-photograph the storage space from the pick-and-place opening to update the first captured image, and based on the updated performing re-alignment on the first captured image, and controlling the handling module to obtain the wafer after the re-alignment is completed; The bearing member includes a plurality of bearing plates, and the plurality of bearing plates of the two bearing members are arranged oppositely one by one, and the two bearing plates arranged oppositely form a bearing assembly with a bearing position, and are used for carrying both ends of the wafer; The wafer box also includes a pressure sensor, a counting module and a communication module, the pressure sensor is arranged on the side of the carrier plate carrying the wafer, and is electrically connected to the counting module and the communication module, the The communication module is electrically connected to the control module, and the counting module is also used to display the counting result; The handling part includes two arm parts, both of which are connected to the connection base and form a U-shape with an opening, the opening faces to the side away from the connection base, and the wafer sensor The detector is arranged at the end of the arm part away from the connecting base; one wafer sensor is respectively arranged on the side of the two arm parts carrying the wafer; the wafer sensor is Pressure membrane sensor. 2 . The wafer handling device according to claim 1 , wherein the light source is a surface light source, comprising a light-emitting surface facing the accommodation space, and the light-emitting surface is disposed opposite to the pick-and-place opening. 3 . 3. The wafer handling device according to claim 1, wherein the carrier includes a substrate, a plurality of the carrier plates are connected to one side of the substrate close to the accommodation space, and a plurality of the carrier plates set at intervals along the first preset direction. 4. The wafer handling equipment according to claim 1, wherein the handling module includes a moving assembly electrically connected to the control module, the moving assembly is connected to the wafer carrier, and the moving assembly The component is used to drive the movement of the wafer carrier under the control of the control module, and the visual sensing module is arranged on the wafer carrier. 5. The wafer handling equipment according to claim 4, wherein the moving assembly comprises a base, a first moving joint arranged on the base that can expand and contract along a second preset direction, one end and The first rotating arm is rotatably connected to the first moving joint, the second rotating arm is rotatably connected to the other end of the first rotating arm, and the wafer is rotatably connected to the other end of the second rotating arm. vehicle. 6. The wafer handling device according to claim 5, wherein the connection base is arranged on the moving assembly along the second preset direction; the visual sensing module is arranged along the second preset direction; The preset direction is set on the side of the connecting base away from the moving component, and the visual sensing module is used to take pictures towards the side where the carrying part is located. 7. The wafer handling equipment as claimed in claim 6, wherein the visual sensing module includes a camera mounting plate arranged on the connection base, a first industry mounted on the camera mounting plate A camera and a first lens mounted on the first industrial camera. 8. The wafer handling equipment according to claim 1, wherein the wafer handling equipment further comprises a first magazine, and the handling module is used to obtain the wafer from the wafer box, and transported to the first magazine, when the control module judges according to the second sensing signal that the handling module performs the placement action of placing the wafer into the first magazine, it still When in the loading state, the control module controls the transfer module to perform the placing action of placing the wafer into the first magazine again. 9. The wafer handling equipment as claimed in claim 8, wherein the wafer handling equipment further comprises a second material box and a defect detection module, and the defect detection module is located at the slave side of the handling module. On the transport path from the wafer cassette to the first magazine, the defect detection module is electrically connected to the control module, and the defect detection module is used to transport the wafers transported by the transport module. Perform defect detection and output defect detection information to the control module, and the control module is also used to control the handling module to place the wafers that pass the inspection on the first wafer according to the defect detection information. magazine, placing the unqualified wafers in the second magazine. 10. The wafer handling apparatus according to claim 9, wherein: The visual sensing module is also used to photograph the accommodation of the first magazine from the pick-and-place opening of the first magazine before the handling module places the wafer into the first magazine. space to obtain a second captured image, and the control module is also used to control the conveying module to carry out the alignment according to the second photographed image, and control the conveying module after the alignment is completed. performing a placing action of placing the wafer into the first magazine; and/or The visual sensing module is also used to photograph the storage of the second magazine from the pick-and-place opening of the second magazine before the handling module places the wafer into the second magazine. Obtain a third captured image in space, and the control module is also used to control the conveying module to carry out the alignment according to the third photographed image, and control the conveying module after the alignment is completed. performing a placement action of placing the wafer into the second magazine. 11. The wafer handling equipment according to claim 9, wherein the defect detection information includes a detection image, the defect detection module includes a camera module and a bracket supporting the camera module, the camera module The module is used to photograph the wafer transported by the handling module to obtain the detection image, and the control module is also used to analyze the defect ratio of the wafer according to the detection image, and calculate the defect ratio Compared with the preset ratio to judge whether the wafer is qualified or not. 12. The wafer handling equipment according to claim 11, wherein the bracket comprises a support body, a camera support portion connected to one side of the support body, and a light source support portion connected to one side of the support body, The camera module includes a second industrial camera, a second lens and a supplementary light, the second lens is mounted on the second industrial camera, and the second industrial camera is arranged on the camera support part away from the supporting one end of the main body; the supplementary light is arranged at the end of the light source support part away from the supporting main body; the wafer transported by the transport module is used to be placed parallel to the first reference plane, the The second industrial camera faces the wafer and the optical axis of the second industrial camera is perpendicular to the first reference plane; Between the transport module and for emitting light towards the wafer, the second industrial camera is used for photographing the wafer through the hollow area of the ring-shaped light member to obtain the inspection image. 13. A wafer handling control method, comprising the following steps: A wafer box is provided, the wafer box includes two supporting parts and a light source arranged oppositely, and the two supporting parts enclose an accommodation space between the two supporting parts and a side of the accommodation space a pick-and-place opening, the accommodating space is used to accommodate a plurality of wafers parallel to the first reference plane, and the light source is located on a side of the accommodating space away from the pick-and-place opening; When the light source emits light toward the storage space, acquiring a first photographed image of the storage space on the side of the pick-and-place opening; Controlling the alignment of the transport module according to the first captured image; controlling the handling module to acquire or place the wafer after the alignment is completed; and The handling module is provided with a wafer sensor, and the wafer sensor is used to sense the contact state between the wafer and the handling module and output a sensing signal, and the control module outputs a signal according to the wafer sensor. According to the sensing signal, it is judged whether the acquisition or placement operation of the wafer by the handling module is successful, and if it is judged that the acquisition or placement operation of the wafer by the handling module fails, the execution is completed again. After the alignment, control the handling module to acquire or place the wafer; The bearing member includes a plurality of bearing plates, and the plurality of bearing plates of the two bearing members are arranged oppositely one by one, and the two bearing plates arranged oppositely form a bearing assembly with a bearing position, and are used for carrying both ends of the wafer; The wafer box also includes a pressure sensor, a counting module and a communication module, the pressure sensor is arranged on the side of the carrier plate carrying the wafer, and is electrically connected to the counting module and the communication module, the The communication module is electrically connected to the control module, and the counting module is also used to display the counting result; The transfer module includes a wafer carrier, the wafer carrier includes a transfer part and a connection base, the transfer part is connected to one side of the connection base, and the transfer part is used for removing from the pick-up port. Acquiring or placing the wafer, the wafer sensor is located at the end of the handling part away from the connection base; The handling part includes two arm parts, both of which are connected to the connection base and form a U-shape with an opening, the opening faces to the side away from the connection base, and the wafer sensor The detector is arranged at the end of the arm part away from the connecting base; one wafer sensor is respectively arranged on the side of the two arm parts carrying the wafer; the wafer sensor is Pressure membrane sensor. 14. The wafer handling control method according to claim 13, wherein the wafer handling control method further comprises the following steps: Before acquiring the first photographed image, controlling the transfer module to move to the current detection position according to the current detection position parameter; and According to the first captured image, it is judged whether there is the wafer in the current feeding level or the current discharging level corresponding to the current detection position, if the current feeding level has the wafer or the current discharging level If the wafer is not placed, the step of controlling the alignment of the transfer module according to the first captured image is performed. 15. The wafer handling control method according to claim 14, wherein the step of controlling the alignment of the handling module according to the first captured image comprises: Correcting the current feeding level parameter or the current feeding level parameter according to the first captured image to obtain the corrected feeding level parameter or the corrected lowering level parameter, and according to the corrected feeding level parameter or the corrected feeding The bit parameter updates the current fetching level parameter or the current unloading level parameter; Controlling the transfer module to move to the current fetching level or the current discharging position according to the corrected material fetching level parameter or the corrected material discharging level parameter. 16. The wafer transfer control method according to claim 15, wherein: In the step of judging according to the first captured image whether there is the wafer at the current pick-up level or the current unloading level corresponding to the current detection position, If the current pick-up level does not have the wafer or the current unloading level places the wafer, then judging whether the current detection position is the maximum detection position, If the current detection position is the maximum detection position, control the transfer module to return to the initial position; if the current detection position is not the maximum detection position, set the current detection position parameter, the current The material level parameter or the current lower material level parameter is adjusted to a preset value respectively, and the step of controlling the transfer module to move to the current detection position according to the current detection position parameter is returned and executed according to the adjusted current detection position parameter . 17. The wafer handling control method according to claim 16, wherein the step of controlling the handling module to place the wafer after the alignment is completed comprises: The step of controlling the handling module to place and return the wafer according to the preset descending and returning parameters is performed after the step of moving to the current unloading position. 18. The wafer transport control method according to claim 15, wherein the step of controlling the transport module to obtain the wafer after the alignment is completed comprises: The step of controlling the handling module to lift and take out the wafer according to the preset lifting and taking out parameters is executed after the step of moving to the current picking position. 19. The wafer handling control method according to claim 18, wherein the handling module includes a wafer carrier for handling the wafer and a moving assembly for driving the movement of the wafer carrier, The wafer carrier is provided with the wafer sensor for sensing the contact state between the wafer carrier and the wafer, and the wafer handling control method further includes the following steps: According to the sensing signal output by the wafer sensor, it is judged that the transfer module is in the no-load state or the load state, and if it is judged that the transfer module is in the no-load state, then return to execute the parameter control the step of moving the handling module to the current detection position; The bit parameters are respectively adjusted to preset values, and the wafer carried by the wafer carrier is placed. 20. The wafer handling control method according to claim 19, wherein the step of placing the wafer carried by the wafer carrier comprises: Executing the placement action of placing the wafer in the first magazine by the handling module according to preset placement parameters; and After performing the placement action, it is judged whether the transfer module is in the no-load state according to the sensing signal of the wafer sensor, and if the transfer module is in the no-load state, return to execute the The step of moving to the current detection position according to the current detection position parameter, if the transfer module is in the loading state, return to execute the transfer module according to the preset placement parameters to place the wafer on the Steps for the placement action in the first magazine. 21. The wafer handling control method according to claim 20, wherein the wafer handling control method further comprises: before the step of placing the wafer carried by the wafer carrier The step of performing detection on the wafer, the step of detecting the wafer includes: moving the wafer to a preset detection position; performing defect detection on the wafer at the preset detection position; If the wafer is detected to be qualified, the step of performing the placement action of placing the wafer in the first magazine by the handling module according to the preset placement parameters is executed; If the wafer detection is unqualified, the step of placing the wafer in the second magazine by the handling module will be executed, and the step of moving to the current detection position according to the current detection position parameter will be executed. bit steps. 22. The wafer handling control method according to claim 21, wherein the wafer handling control method further comprises the following steps: Before the handling module places the wafer into the first magazine, acquiring a second captured image of the accommodation space of the first magazine taken from the pick-and-place opening of the first magazine, Controlling the handling module to perform discharging alignment according to the second captured image, and controlling the handling module to execute the process of placing the wafer into the first magazine after the discharging alignment is completed a step of placing or inspecting said wafer; and/or Before the handling module places the wafer into the second magazine, a third captured image of the accommodation space of the second magazine is captured from the pick-and-place opening of the second magazine, according to The third captured image controls the conveying module to perform discharge alignment, and controls the conveyance module to place the wafer into the second magazine after the discharge alignment is completed. Action or the step of detecting the wafer. 23. The wafer handling control method according to claim 21, wherein the step of performing defect detection on the wafer comprises: Obtaining a detection image of the wafer transported on the transport module captured at the preset detection position; Analyzing the defect ratio of the wafer according to the inspection image, and comparing the defect ratio with a preset ratio to determine whether the wafer is qualified. 24. An electrical device, comprising a memory and a processor, wherein computer-readable instructions are stored in the memory, and when the computer-readable instructions are executed by the processor, the processor implements the method according to claims 13-23. The method described in any one of the items. 25. A computer-readable storage medium, on which computer-readable instructions are stored, wherein, when the computer-readable instructions are executed by a processor, the method according to any one of claims 13-23 is implemented.

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