CN114975195A

CN114975195A - Wafer cassette, wafer transfer apparatus, wafer transfer control method, electrical apparatus, and storage medium

Info

Publication number: CN114975195A
Application number: CN202210355328.XA
Authority: CN
Inventors: 张原�; 杨青峰; 潘国瑞; 崔智敏
Original assignee: Shenzhen Sking Intelligent Equipment Co Ltd
Current assignee: Shenzhen Sking Intelligent Equipment Co Ltd
Priority date: 2022-04-06
Filing date: 2022-04-06
Publication date: 2022-08-30
Anticipated expiration: 2042-04-06
Also published as: CN114975195B

Abstract

The embodiment of the application discloses a wafer box, wafer carrying equipment, a wafer carrying control method, electrical equipment and a storage medium. The wafer box comprises two bearing parts and a light source, wherein the two bearing parts are arranged oppositely, the two bearing parts are enclosed to form an accommodating space between the two bearing parts and a taking and placing opening positioned on one side of the accommodating space, the accommodating space is used for accommodating a plurality of wafers parallel to a first reference surface, the light source is arranged on one side, far away from the taking and placing opening, of the accommodating space and used for emitting light towards the accommodating space, and the purposes of accurate alignment, carrying and automatic operation of the wafers can be achieved.

Description

Wafer cassette, wafer transfer apparatus, wafer transfer control method, electrical apparatus, and storage medium

Technical Field

The present application relates to the field of semiconductor technology, and in particular, to a wafer cassette, a wafer carrying apparatus, a wafer carrying control method, an electrical apparatus, and a storage medium.

Background

In the process of semiconductor packaging and testing, wafers need to be transported among different devices to perform operations such as scribing, probe detection or die bonding, and automatic wafer transportation and detection become important links in the process flow of semiconductor manufacturing. Different wafer operation process equipment requires different sizes, surface quality and grain yield of supplied wafers, the wafers are influenced by environment and operation in the storage, transportation and carrying operation processes, and certain damage and defective rate exist, so that the problems that the conventional wafer taking and placing processes cannot carry out clear force sensing, counting and the like all bring challenges to accurate alignment, carrying and automatic operation of the wafers.

Disclosure of Invention

The embodiment of the application discloses a wafer box, wafer carrying equipment, a wafer carrying control method, electrical equipment and a storage medium, which can achieve the purposes of accurate alignment, carrying and automatic operation of wafers.

On the one hand, the embodiment of the application discloses a wafer box, wafer box includes two relatively set up hold carrier and light source, two hold carrier encloses to be located two hold carrier between the accommodation space with be located the mouth is put in getting of accommodation space one side, accommodation space is used for taking in the multi-disc wafer that is on a parallel with first reference surface, the light source sets up accommodation space keeps away from get one side of putting the mouth, be used for towards accommodation space is luminous.

Compared with the prior art, the wafer box provided by the application can emit light through the light source arranged in the accommodating space, the brightness in the wafer box can be increased, and the observation of the wafer in the wafer box can be more clear.

According to an embodiment of the application, the light source is the area source, including the orientation the light emitting area of accommodation space, the light emitting area with get and put mouthful relative setting. Through setting up the light source is the area source, just the light emitting area with get and put mouthful relative setting, can make the light that the light source sent to get and put mouthful direction and give out light to can accurately obtain the position of placing of wafer.

According to an embodiment of the application, it includes the base plate and connects to hold the carrier the base plate is close to a plurality of loading boards of one side of accommodation space, it is a plurality of the loading board sets up along first predetermined direction interval, two hold a plurality of carrier the loading board one-to-one sets up, two of relative setting the bearing subassembly that has the position of bearing is constituteed to the loading board, and is used for bearing respectively the both ends of wafer.

According to an embodiment of the application, the wafer box still includes pressure sensor, count module and communication module, pressure sensor sets up the loading board bears one side of wafer, and the electricity is connected count module reaches communication module, communication module electricity connection control module group, count module still is used for showing the count result. Through two of bearing component all be provided with on the loading board pressure sensor can acquire through pressure sensing accuracy the condition of placing of wafer in the wafer box, then pass through the count module counts and shows, simultaneously, through communication module with the count result send to the control module group is convenient for the control module group carries out control operation to the realization is to accurate transport of wafer and automation mechanized operation.

In a second aspect, an embodiment of the present application further discloses a wafer carrying apparatus, where the wafer carrying apparatus includes the wafer cassette, the carrying module, the vision sensing module, and the control module, and the carrying module is used to obtain or place the wafer from the pick-and-place opening; the visual sensing module is used for shooting the accommodating space at one side of the pick-and-place port and outputting a first shot image when the light source emits light towards the accommodating space; the control module is electrically connected with the carrying module and the visual sensing module and used for receiving and controlling the carrying module to carry out alignment according to the first shot image and controlling the carrying module to obtain or place the wafer after the alignment is finished.

Compared with the prior art, the wafer carrying equipment that this application provided is through the light source orientation control when holding the space and sending out vision sensing module and shoot and export first shooting image, make control module group basis first shooting image control carry out counterpointing of transport module, and control the transport module carries out acquireing or placing of wafer, the realization is right the accurate counterpoint and the snatch of the wafer in the wafer box to the realization is to accurate transport and automation mechanized operation of wafer.

According to an embodiment of this application, the transport module includes the removal subassembly of electricity connection the control module group and connects the wafer carrier of removal subassembly, the removal subassembly is used for driving under the control of control module group the wafer carrier motion, the vision sensing module set up in on the wafer carrier. Through will the vision sensing module set up in the transport module on the wafer carrier, make the vision sensing module can with the wafer carrier moves jointly, and then need not other device independent drive the motion of vision sensing module, and can make the vision sensing module shoots the visual angle of first shot image with the operation visual angle of wafer carrier is the same, makes control algorithm simpler, and is difficult for makeing mistakes, when realizing accurate transport of wafer and automated operation, has higher operating efficiency.

According to an embodiment of the application, remove the subassembly and include the base, set up and be in can follow the flexible first joint, one end of removing of second default direction on the base and first removal joint rotates first swinging boom, one end of connecting with the other end of first swinging boom rotates the second swinging boom of connecting, with the other end of second swinging boom rotates the connection the wafer carrier. Through setting up the removal subassembly is multi freedom robot, can realize accurate transport and automated operation to the wafer.

According to an embodiment of the present application, the wafer carrier includes a connection base disposed on the moving assembly along the second predetermined direction, and a carrying portion connected to one side of the connection base; the visual sensing module is arranged on one side, far away from the moving assembly, of the connecting base body along the second preset direction, and the visual sensing module is used for shooting towards one side where the carrying part is located. Through will remove the subassembly, visual sense module and the setting is connected to the transport portion, can make control more high-efficient, and carry more accurately.

According to an embodiment of the present application, the vision sensing module includes a camera mounting plate disposed on the connection base, a first industrial camera disposed on the camera mounting plate, and a first lens mounted on the first industrial camera.

According to an embodiment of the application, the wafer handling equipment still includes wafer sensor, wafer sensor set up in the handling portion is close to the surface of wafer one side and is located the handling portion is kept away from the one end of connecting the base member, wafer sensor electricity is connected the control module group for the sensing the wafer and output second sensing signal extremely the control module group makes the control module group count and/or get the control of putting the wafer of handling module group transport. The wafer sensor is arranged on the surface of the conveying part close to one side of the wafer and at one end, far away from the connecting base body, of the conveying part, so that the control module can sense the contact state of the wafer and the conveying part in real time through the second sensing signal, accurately sense and synchronously count the wafer taking and placing, and the reliability of the wafer taking and placing and conveying processes is ensured.

According to an embodiment of the application, the carrying part comprises two arm parts, the two arm parts are connected to the connecting base body and enclose a U shape with an opening, the opening faces to one side far away from the connecting base body, and the wafer sensor is arranged at one end of the arm parts far away from the connecting base body; one side of each arm part for bearing the wafer is provided with one wafer sensor; the wafer sensor is a pressure film sensor. The wafer sensors are respectively arranged on one sides of the two arm parts, which bear the wafers, so that pressure sensing of the wafers can be not influenced by position deviation of the wafers, the sensing is more accurate, and meanwhile, the wafer sensors are pressure film sensors, so that the pressure of the wafers can be accurately sensed without influencing the taking and placing of the wafers.

According to an embodiment of the application, the control module group is right according to the second sensing signal whether the transport module group obtains from the wafer box the wafer is monitored, when the control module group judges according to the second sensing signal that the transport module group is in no-load state, the control module group controls the vision sensing module group to take again from the access opening shoot the accommodation space and the first shooting image that is updated, and advance the counterpoint again according to the first shooting image that is updated, and accomplish after counterpointing once more the transport module group carries out the acquisition of wafer. Through the control module, whether the carrying module is in the no-load state or not is judged according to the second sensing signal, the carrying module can be aligned again when in the no-load state, the wafer is obtained again, the machine halt is avoided, and meanwhile, the operation efficiency is improved.

According to an embodiment of this application, wafer handling equipment still includes first magazine, the transport module be used for certainly the wafer box acquires the wafer, and the transportation is placed extremely first magazine, work as the control module basis the second sensing signal is judged the transport module carries out will the wafer is placed extremely still be in when bearing the weight of state after the action of placing of first magazine, control module control the transport module carries out once more the wafer is placed extremely the action of placing of first magazine. Through the control module group basis the second sensing signal is judged the transport module group carries out will the wafer is placed to whether be in the bearing state after the action of placing of first magazine, can carry out once more when the transport module group is in the bearing state will the wafer is placed to the action of placing of first magazine, avoided right the wafer damages, shut down, simultaneously, promoted operating efficiency.

According to an embodiment of the application, wafer handling equipment still includes second magazine and defect detection module, the defect detection module is located the follow of transport module the wafer box extremely on the transport route of first magazine, defect detection module electricity is connected the control module group, the defect detection module is used for right the transport module transportation the wafer carries out defect detection and exports defect detection information extremely the control module group, the control module group still is used for the foundation defect detection information control the transport module will detect qualified the wafer place in first magazine will detect unqualified the wafer place the second magazine. The defect detection module is arranged on the conveying path from the wafer box to the first material box, meanwhile, the defect detection is carried out on the wafer, so that the conveying error of the wafer in the conveying process can be reduced, the conveying time is saved, the detection efficiency is improved, meanwhile, the wafer which is unqualified to be detected is placed in the second material box, the pre-detection classification can be carried out in the conveying process, a pre-detection sample is provided for the subsequent processing technological process of the wafer, the waste material is prevented from entering the subsequent processing procedure, the production efficiency is improved, and the occupied space of equipment is reduced.

According to an embodiment of the application, the vision sensing module is further configured to shoot an accommodating space of the first magazine from a pick-and-place port of the first magazine to obtain a second shot image before the carrying module places the wafer to the first magazine, and the control module is further configured to control the carrying module to perform a placing alignment according to the second shot image, and control the carrying module to perform a placing action of placing the wafer to the first magazine after the placing alignment is completed; and/or the visual sensing module is also used for shooting the wafer from the taking and placing opening of the second material box before the second material box is placed by the carrying module to obtain a third shot image, the control module is also used for controlling the carrying module to carry out emptying alignment according to the third shot image, and after the emptying alignment is finished, the carrying module is controlled to carry out the wafer placing action of the second material box. Through the transport module will the wafer is placed to before the first magazine from the mouth of getting of first magazine is shot the accommodation space of first magazine obtains the second and shoots the image and/or the transport module will the wafer is placed to before the second magazine from the mouth of getting of second magazine is shot the accommodation space of second magazine obtains the third image of shooing, can make the transport module is acquireed at every turn and/or is placed the in-process operation of wafer is more accurate, has ensured right the reliability of wafer is got and is put the operation, has ensured operating efficiency simultaneously.

According to an embodiment of the application, the defect detection information is including detecting the image, the defect detection module is including making a video recording the module and supporting the support of making a video recording the module, the module of making a video recording is used for shooting the transport module transportation the wafer obtains detect the image, the control module still is used for the basis detect image analysis the defect proportion of wafer, and will the defect proportion is compared with the ratio of predetermineeing and is judged whether the wafer is qualified.

According to an embodiment of the application, the bracket comprises a supporting main body, a camera supporting part connected with one side of the supporting main body, and a light source supporting part connected with one side of the supporting main body, the camera shooting module comprises a second industrial camera, a second lens and a light supplementing lamp, the second lens is installed on the second industrial camera, and the second industrial camera is arranged at one end, far away from the supporting main body, of the camera supporting part; the light supplement lamp is arranged at one end of the light source supporting part far away from the supporting main body; the wafer conveyed by the conveying module is used for being placed in parallel to the first reference surface, the second industrial camera faces the wafer, and the optical axis of the second industrial camera is perpendicular to the first reference surface; the light filling lamp comprises an annular light emitting piece, the annular light emitting piece is located between the second industrial camera and the carrying module and used for facing the wafer to emit light, and the second industrial camera is used for shooting the wafer to obtain the detection image through a hollow area of the annular light emitting piece. Through setting up the transport module transport the wafer is on a parallel with first reference surface is placed, the orientation of second industry camera the wafer just the optical axis of second industry camera perpendicular to first reference surface can make the perpendicular shooting of second industry camera the wafer, simultaneously, under the shining of light filling lamp, can make the defect detection of defect detection module is more accurate, and the precision is higher.

In three aspects, the embodiment of the application also discloses a wafer handling control method, which comprises the following steps:

providing a wafer box, wherein the wafer box comprises two bearing pieces and a light source which are oppositely arranged, the two bearing pieces enclose an accommodating space between the two bearing pieces and a pick-and-place opening positioned at one side of the accommodating space, the accommodating space is used for accommodating a plurality of wafers parallel to a first reference surface, and the light source is positioned at one side of the accommodating space far away from the pick-and-place opening;

acquiring a first shot image of the accommodating space shot at one side of the pick-and-place port when the light source emits light towards the accommodating space;

controlling the carrying module to carry out alignment according to the first shot image; and

and after the alignment is finished, controlling the carrying module to acquire or place the wafer.

Compared with the prior art, the wafer carrying control method provided by the application can be used for acquiring the first shooting image of the accommodating space shot on one side of the taking and placing port when the light source faces the accommodating space to emit light, controlling the carrying module to align according to the first shooting image, completing the acquisition or placement of the wafer, realizing the accurate alignment and grabbing of the wafer in the wafer box, and realizing the accurate carrying and automatic operation of the wafer.

According to an embodiment of the present application, the wafer handling control method further includes:

before the first shot image is obtained, controlling the carrying module to move to a current detection position according to current detection position parameters; and

and judging whether the current material taking position or the current blanking position corresponding to the current detection position has the wafer or not according to the first shot image, and if the current material taking position has the wafer or the current blanking position does not place the wafer, executing the step of controlling the carrying module to carry out alignment according to the first shot image.

In the above embodiment, judge whether the current material level of getting that the current detection position corresponds or current blanking level have the wafer, control the counterpoint of transport module, can avoid the current material level of getting does not the wafer or current blanking level has been placed dislocation operation during the wafer, thereby avoid right the damage of wafer can also avoid the shut down that the mistake of operation brought, promotes the reliability and the operating efficiency of operation.

According to an embodiment of the present application, the step of controlling the carrying module to perform alignment according to the first captured image includes:

correcting the current material taking position parameter or the current blanking position parameter according to the first shot image to obtain a corrected material taking position parameter or a corrected blanking position parameter, and updating the current material taking position parameter or the current blanking position parameter according to the corrected material taking position parameter or the corrected blanking position parameter;

and controlling the carrying module to move to the current material taking position or the current material discharging position according to the corrected material taking position parameter or the corrected material discharging position parameter.

In the above embodiment, through according to the basis the first image of shooing obtains the material level parameter is got in the correction or the control of material level parameter is got in the correction the transport module removes and gets the material level or the material level is got at present, can make the operation more accurate, thereby avoid right the damage of wafer can also avoid the shut down that the operation mistake brought, promotes the reliability and the operating efficiency of operation.

According to an embodiment of the present application, in the step of determining whether the wafer exists at the current material taking position or the current material discharging position corresponding to the current detection position according to the first captured image,

if the wafer is not placed at the current material taking position or the wafer is not placed at the current material discharging position, whether the current detection position is the maximum detection position or not is judged,

if the current detection position is the maximum detection position, controlling the carrying module to return to the initial position; if the current detection position is not the maximum detection position, respectively adjusting preset values of the current detection position parameter, the current material taking position parameter or the current blanking position parameter, and returning to execute the step of controlling the carrying module to move to the current detection position according to the current detection position parameter after adjustment.

In the above embodiment, by determining that the current detection position is the maximum detection position, the carrying module can be quickly returned to the initial position to perform subsequent operations after reaching the maximum detection position, so that the operation efficiency is improved.

According to an embodiment of the present application, the step of controlling the carrying module to place the wafer after the alignment includes: and controlling the carrying module to place and return the wafer according to preset descending and returning parameters after the step of moving the carrying module to the current discharging position.

In the above embodiment, the handling module is controlled to place and return the wafer according to the preset lowering and returning parameters after the step of moving the handling module to the current lowering position, so that the operation efficiency of the wafer taking and placing operation can be improved.

According to an embodiment of the present application, the step of controlling the carrying module to acquire the wafer after the alignment includes: and controlling the carrying module to lift and take out the wafer according to preset lifting and taking-out parameters after the carrying module moves to the current material taking position.

In the above embodiment, the wafer is lifted and taken out by controlling the carrying module according to the preset lifting and taking-out parameters, so that the wafer can be effectively protected, and the reliability of the taking-out operation is ensured.

According to an embodiment of the present application, the carrying module includes a wafer carrier for carrying the wafer and a moving component for driving the wafer carrier to move, a wafer sensor is disposed on the wafer carrier for sensing a contact state between the wafer carrier and the wafer, and the wafer carrying control method further includes the following steps:

judging whether the carrying module is in an idle load state or a bearing state according to the sensing signal output by the wafer sensor, and if the carrying module is judged to be in the idle load state, returning to the step of controlling the carrying module to move to the current detection position according to the current detection position parameter; if the carrying module is judged to be in the bearing state, adjusting the current detection position parameter, the current material taking position parameter or the current blanking position parameter to preset values respectively, and placing the wafer borne by the wafer carrier.

In the above embodiment, by determining whether the carrying module is in the no-load state or the loading state, the carrying module can be moved more accurately and more efficiently, damage to the wafer and shutdown are avoided, and the operation efficiency is improved.

According to an embodiment of the present application, the step of placing the wafers carried by the wafer carrier includes:

the carrying module is used for carrying out a placing action of placing the wafer in the first material box according to preset placing parameters; and

and judging whether the carrying module is in the no-load state or not according to the sensing signal of the wafer sensor after the placing action is executed, if so, returning to the step of executing the movement to the current detection position according to the current detection position parameter, and if so, returning to the step of executing the placing action of placing the wafer in the first material box by the carrying module according to the preset placing parameter.

According to an embodiment of the present application, the wafer handling control method further includes: a step of inspecting the wafer, which is performed before the step of placing the wafer carried by the wafer carrier, the step of inspecting the wafer including:

moving the wafer to a preset detection position;

carrying out defect detection on the wafer at the preset detection position;

if the wafer is qualified, executing the step of placing the wafer in the first material box by the carrying module according to preset placing parameters;

and if the wafer is unqualified in detection, executing the step of placing the wafer in a second material box by the carrying module, and returning to execute the step of moving to the current detection position according to the current detection position parameters.

In the above embodiment, the step of detecting the wafer, which is performed before the step of placing the wafer carried by the wafer carrier, can be performed in advance during the transportation process, so that defective products can be found in time, a pre-detection sample is provided for the subsequent processing process of the wafer, and the production efficiency is further improved.

before the wafer is placed to the first material box by the carrying module, acquiring a second shot image of the accommodating space of the first material box shot from a pick-and-place opening of the first material box, controlling the carrying module to carry out material placing alignment according to the second shot image, and controlling the carrying module to carry out placing action of placing the wafer to the first material box or detecting the wafer after the material placing alignment is finished; and/or

Before the carrying module places the wafer to the second material box, acquiring a third shot image of a containing space of the second material box shot from a taking and placing opening of the second material box, controlling the carrying module to carry out discharging alignment according to the third shot image, and controlling the carrying module to carry out the step of placing the wafer to the second material box or detecting the wafer after the discharging alignment is finished.

In the above embodiment, the second shot image is obtained before the wafer is placed in the first magazine by the carrying module, and/or the third shot image is obtained before the wafer is placed in the second magazine by the carrying module, so that the operation of the carrying module in the process of obtaining and/or placing the wafer each time can be more accurate, the reliability of the wafer taking and placing operation is guaranteed, and the operation efficiency is also guaranteed.

According to an embodiment of the present application, the step of performing defect detection on the wafer includes:

the wafers carried on the carrying module and shot at the preset detection position obtain a detection image;

and analyzing the defect proportion of the wafer according to the detection image, and comparing the defect proportion with a preset proportion to judge whether the wafer is qualified.

In the above embodiment, the detection image is obtained on the wafer carried on the carrying module shot at the preset detection position, so as to determine whether the wafer is qualified, and the wafer can be subjected to pre-detection classification in the carrying process, so that a pre-detection sample is provided for the subsequent processing process of the wafer, waste materials are prevented from entering the subsequent processing procedure, and thus the production efficiency is improved and the occupied space of equipment is reduced.

In a fourth aspect, an embodiment of the present application further discloses an electrical device, where the electrical device includes a memory and a processor, where the memory stores computer-readable instructions, and the computer-readable instructions, when executed by the processor, cause the processor to implement the wafer handling control method according to any one of the above aspects.

In a fifth aspect, an embodiment of the present application further discloses a computer-readable storage medium, on which computer-readable instructions are stored, and when the computer-readable instructions are executed by a processor, the method for controlling wafer handling according to any one of the above aspects is implemented.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic perspective view of a wafer handling apparatus according to one embodiment of the present invention;

fig. 2 is a schematic perspective view of a wafer cassette according to an embodiment of the present invention;

FIG. 3 is a schematic cross-sectional view of the wafer pod of FIG. 2;

fig. 4 is a perspective view of a carrying module according to an embodiment of the present invention;

FIG. 5 is a flowchart illustrating a wafer handling control method according to an embodiment of the present invention;

FIG. 6 is a flowchart illustrating operation of a wafer handling apparatus using the wafer handling control method of FIG. 5 according to one embodiment of the present disclosure;

FIG. 7 is a partial flowchart of a wafer handling apparatus employing the wafer handling control method of FIG. 5 in accordance with one embodiment of the present disclosure;

FIG. 8 is a schematic structural diagram of an electrical apparatus disclosed in one embodiment of the present invention;

fig. 9 is a schematic structural diagram of a storage medium according to an embodiment of the disclosure.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.

Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.

In some related technologies, wafer carrying equipment is positioned and carried in a sensor mode, however, some sensor-based methods are indirect measurement, and when there is an installation error or a position deviation between a sensor position and a real wafer position, reliability and safety of accurate alignment carrying are not easily guaranteed. In addition, some related art apparatuses and methods do not have the functions of wafer pre-inspection and classification during the wafer transportation process, the wafer transportation process essentially serves the previous and subsequent process steps, and the subsequent process steps of wafer transportation without detection and classification may process the defective wafer, which wastes manpower and material resources and reduces the wafer processing and manufacturing efficiency.

In order to solve the above problem, the embodiment of the present application discloses a wafer cassette 10, a wafer carrying apparatus 1, a wafer carrying control method, an electrical apparatus 2, and a storage medium 3, which can achieve the purpose of accurately carrying and automatically operating wafers. The following are detailed below.

Referring to fig. 1 to 4, fig. 1 is a schematic perspective view of a wafer handling apparatus 1 according to an embodiment of the present invention; fig. 2 is a perspective view of a wafer cassette 10 according to an embodiment of the present invention; fig. 3 is a schematic cross-sectional view of the wafer cassette 10 shown in fig. 2; fig. 4 is a perspective view of a carrying module 20 according to an embodiment of the present invention. As shown in fig. 1, an embodiment of the present application discloses a wafer carrying apparatus 1, where the wafer carrying apparatus 1 includes a wafer cassette 10, a carrying module 20, a vision sensing module 30 and a control module 40, in this embodiment, the wafer cassette 10 includes a carrying member 11 and a light source 12, and the carrying module 20 is configured to obtain or place the wafer from the pick-and-place port 112; the vision sensing module 30 is configured to shoot the accommodating space 111 at a side of the pick-and-place opening 112 and output a first shot image when the light source 12 emits light toward the accommodating space 111; the control module 40 is electrically connected to the carrying module 20 and the vision sensing module 30, and is configured to receive and control the carrying module 20 to perform alignment according to the first captured image, and control the carrying module 20 to perform the wafer acquisition or placement after the alignment is completed.

It can be understood that the wafer carrying apparatus 1 provided by the present application can obtain or place the wafer from the wafer box 10, in the process of carrying the wafer, the light source 12 of the wafer box 10 emits light towards the accommodating space 111 for picking and placing the wafer, so that the place without the wafer is brighter and forms stronger light and shade contrast with the place for placing the wafer, meanwhile, the vision sensing module 30 shoots the accommodating space 111 on the side of the picking and placing port 112 and outputs a first shot image, and the control module 40 controls the carrying module 20 to perform alignment according to the first shot image, and obtains or places the wafer. Therefore, the wafer carrying device 1 can realize accurate alignment and grabbing of the wafers in the wafer cassette 10, and further realize accurate carrying and automatic operation of the wafers.

Specifically, referring to fig. 2 and 3, in this embodiment, the wafer cassette 10 includes two carriers 11 and a light source 12 that are disposed opposite to each other, an accommodating space 111 located between the two carriers 11 and a pick-and-place opening 112 located on one side of the accommodating space 111 are enclosed by the two carriers 11, the accommodating space 111 is used for accommodating a plurality of wafers parallel to a first reference plane, and the light source 12 is disposed on one side of the accommodating space 111 away from the pick-and-place opening 112 and is used for emitting light toward the accommodating space 111. It is understood that the wafer is a flat plate, the first reference surface is a plane on which the wafer is placed, the wafer can be placed into the accommodating space 111 through the placing and taking opening 112, or can be taken out from the accommodating space 111 through the placing and taking opening 112, and during the placing and taking operation, the light source 12 can emit light toward the accommodating space 111 to illuminate the accommodating space 111. By providing the light source 12 emitting light toward the accommodating space 111, the brightness inside the wafer box 10 can be increased, which facilitates a clearer observation of the wafer storage in the wafer box 10.

Further, the light source 12 is a surface light source, and includes a light emitting surface 121 facing the accommodating space 111, and the light emitting surface 121 is perpendicular to the first reference surface. It can be understood that, the light source 12 is a surface light source, and may have a larger and uniform light emitting surface 121, and meanwhile, the light emitting surface 121 of the light source 12 is disposed opposite to the pick-and-place port 112, in this embodiment, the light emitting surface 121 of the light source 12 may be perpendicular to the first reference surface, and light emitted by the light source 12 may be parallel to the placement plane of the wafer (i.e., the first reference surface), so as to be beneficial to accurately obtaining the placement position of the wafer.

Further, the carrier 11 includes a substrate 113 and a plurality of carrier plates 114 connected to one side of the substrate 113 close to the accommodating space 111, the plurality of carrier plates 114 are disposed at intervals along a first predetermined direction, in this embodiment, the first predetermined direction may be perpendicular to the first reference plane, the plurality of carrier plates 114 of the two carriers 11 are disposed opposite to each other, and the two carrier plates 114 disposed opposite to each other form a carrier assembly 116 having a carrier location 115 and are used for respectively carrying two ends of the wafer. In this embodiment, each of the bearing assemblies 116 includes two oppositely disposed bearing plates 114 and the bearing position 115 formed by the two bearing plates 114, and the wafer can be placed in the bearing position 115 and supported by the two oppositely disposed bearing plates 114, thereby ensuring the stability of the wafer placement.

Further, the wafer cassette 10 further includes a pressure sensor 13, a counting module 14 and a communication module 15, the pressure sensor 13 is disposed on one side of the carrier plate 114 carrying the wafers and electrically connected to the counting module 14 and the communication module 15, the communication module 15 is electrically connected to the control module 40, the pressure sensor 13 is configured to sense whether the wafer is placed on the carrying position 115 and send a first sensing signal to the counting module 14, so that the counting module 14 counts the wafers in the wafer cassette 10 according to the first sensing signal, and the communication module 15 sends a counting result recorded by the counting module 14 to the control module 40; the counting module 14 is further configured to display the counting result; the pressure sensors 13 are disposed on both of the carrier plates 114 of the carrier assembly 116, and the number of the pressure sensors 13 is twice the number of the wafers that can be accommodated by the wafer cassette 10; the pressure sensor 13 is located in the middle region of the wafer-carrying side of the carrier plate 114. Through two of carrier assemblies 116 all be provided with on the loading board 114 pressure sensor 13 can acquire through pressure sensing accuracy the condition of placing of wafer in the wafer box 10, then pass through count module 14 counts and shows, simultaneously, through communication module 15 with the count result send to control module 40, be convenient for control module 40 carries out control operation to the realization is to accurate transport of wafer and automation mechanized operation.

Further, referring to fig. 4, the carrying module 20 includes a moving module 21 electrically connected to the control module 40 and a wafer carrier 22 connected to the moving module 21, the moving module 21 is used for driving the wafer carrier 22 to move under the control of the control module 40, the vision sensing module 30 is disposed on the wafer carrier 22, and the vision sensing module 30 can move together with the wafer carrier 22. Through will vision sensing module 30 sets up in transport module 20 on the wafer carrier 22 for vision sensing module 30 can with wafer carrier 22 moves jointly, and then need not other device and drive alone vision sensing module 30 moves, and can make vision sensing module 30 shoot the visual angle of the first picture of shooing is the same with the operation visual angle of wafer carrier 22, makes the control algorithm simpler, and difficult mistake, when realizing accurate transport of wafer and automated operation, has higher operating efficiency.

Specifically, the moving assembly 21 includes a base 211, a first moving joint 212 disposed on the base 211 and capable of extending and retracting along a second preset direction, a first rotating arm 213 having one end rotatably connected to the first moving joint 212, a second rotating arm 214 having one end rotatably connected to the other end of the first rotating arm 213, and the wafer carrier 22 rotatably connected to the other end of the second rotating arm 214. In this embodiment, the first predetermined direction and the second predetermined direction may be the same direction, it can be understood that the moving assembly 21 is a multi-degree-of-freedom robot, the second rotating arm 214 and the wafer carrier 22 may be integrally connected or rotatably connected, and the moving assembly 21 may be used to implement precise wafer transportation and automation.

Further, the wafer carrier 22 includes a connection base 221 and a carrying portion 222, the connection base 221 is disposed on the moving assembly 21 along the second predetermined direction, and the carrying portion 222 is connected to one side of the connection base 221; the vision sensing module 30 is disposed on a side of the connection base 221 away from the moving assembly 21 along the second predetermined direction, and the vision sensing module 30 is used for shooting towards a side where the carrying portion 222 is located. It can be understood that the first moving joint 212, the connecting base 221 and the vision sensing module 30 are all disposed along the second predetermined direction, so that position conversion is not required during the picking and placing process, and the positioning accuracy and efficiency during the picking and placing process of the wafer are improved.

Further, the vision sensing module 30 includes a camera mounting plate 31 disposed on the connection base 221, a first industrial camera 32 disposed on the camera mounting plate 31, and a first lens 33 mounted on the first industrial camera. In this embodiment, the first lens 33 may be a telecentric lens.

Further, the wafer handling apparatus 1 further includes a wafer sensor 50, the wafer sensor 50 is disposed on a surface of the handling portion 222 close to one side of the wafer and located at an end of the handling portion 222 away from the connection substrate 221, the wafer sensor 50 is electrically connected to the control module 40 for sensing the wafer and outputting a second sensing signal to the control module 40, so that the control module 40 counts and/or monitors the wafer handled by the handling module 20. By arranging the wafer sensor 50 on the surface of the carrying part 222 close to the wafer and at the end of the carrying part 222 far from the connection substrate 221, the control module 40 can sense the contact state of the wafer and the carrying part 222 in real time through the second sensing signal, and accurately sense and synchronously count the wafer picking and placing, so as to ensure the reliability of the wafer picking and placing and carrying processes.

Specifically, the carrying unit 222 includes two arm portions 222a, each of the two arm portions 222a is connected to the connection substrate 221 and is enclosed into a U shape having an opening facing a side away from the connection substrate 221, and the wafer sensor 50 is disposed at an end of the arm portion 222a away from the connection substrate 221; one side of the two arm portions 222a carrying the wafer is respectively provided with one wafer sensor 50; the wafer sensor 50 is a pressure membrane sensor. In this embodiment, the optical axis direction of the first industrial camera and the first lens 33 coincides with the axial direction of the U-shaped opening surrounded by the two arm portions 222 a. The wafer sensors 50 are respectively arranged on one sides of the two arm parts 222a for bearing the wafer, so that pressure sensing of the wafer is not influenced by the position deviation of the wafer, and the sensing is more accurate.

Further, the control module 40 monitors whether the carrying module 20 obtains the wafer from the wafer cassette 10 according to the second sensing signal, when the control module 40 determines that the carrying module 20 is in an idle state according to the second sensing signal, the control module 40 controls the vision sensing module 30 to capture the first captured image of the accommodating space 111 from the pick-and-place port 112 again to perform further alignment again according to the updated first captured image, and controls the carrying module 20 to obtain the wafer after the further alignment is completed. It can be understood that, after each operation of acquiring the wafer by the carrying module 20, the control module 40 detects the acquiring operation, and when it is detected that the carrying module 20 is in an idle state, it proves that the acquiring operation of the wafer is failed at this time, the control module 40 may control the vision sensing module 30 to shoot the first shot image updated by the accommodating space 111 from the pick-and-place port 112 again, and perform the alignment again according to the updated first shot image, and perform the acquiring of the wafer again, so as to avoid that the subsequent accurate acquiring operation cannot be performed due to an erroneous operation, and even the whole wafer carrying apparatus 1 is stopped. Through the judgment that the control module 40 judges whether the carrying module 20 is in the no-load state according to the second sensing signal, the alignment can be performed again when the carrying module 20 is in the no-load state, and the wafer is obtained again, so that the shutdown is avoided, and meanwhile, the operation efficiency is improved.

Further, it is understood that the wafer transporting apparatus 1 having the wafer cassette 10, the transporting module 20 and the vision sensing module 30 can be applied to transporting the wafers in the wafer cassette 10 to other cassettes (such as the first cassette 60 or the second cassette 70), and also can be applied to transporting the wafers in other cassettes to the wafer cassette 10 for storage. The following description will mainly take the wafer transfer apparatus 1 as an example to transfer the wafers in the wafer cassette 10 to another magazine.

Specifically, in an embodiment, the wafer transporting apparatus 1 further includes a first magazine 60, the transporting module 20 is configured to obtain the wafer from the wafer cassette 10 and transport the wafer to the first magazine 60, and when the control module 40 determines that the transporting module 20 is still in the carrying state after performing the placing operation of placing the wafer to the first magazine 60 according to the second sensing signal, the control module 40 controls the transporting module 20 to perform the placing operation of placing the wafer to the first magazine 60 again. It can be understood that, after the wafer is placed in the first magazine 60, the control module 40 detects the placing operation, and when it is detected that the carrying module 20 is still in the carrying state, it proves that the placing operation of the wafer fails at this time, the control module 40 may control the carrying module 20 to perform the placing operation of placing the wafer in the first magazine 60 again, so as to avoid damage to the wafer caused by the dislocation operation, and even cause the shutdown of the entire wafer carrying apparatus 1. Through the control module 40 judges according to the second sensing signal whether the carrying module 20 executes to place the wafer to the placing action of the first material box 60 is in a bearing state, the carrying module 20 can execute again when in the bearing state to place the wafer to the placing action of the first material box 60, thereby avoiding the damage and the shutdown of the wafer and simultaneously improving the operation efficiency.

Further, the wafer carrying equipment 1 may further include a second material box 70 and a defect detecting module 80, the defect detecting module 80 is located on a carrying path of the carrying module 20 from the wafer box 10 to the first material box 60, the defect detecting module 80 is electrically connected to the control module 40, the defect detecting module 80 is used for performing defect detection on the wafer transported by the carrying module 20 and outputting defect detection information to the control module 40, the control module 40 is further used for controlling the carrying module 20 to place the qualified wafer in the first material box 60 and place the unqualified wafer in the second material box 70 according to the defect detection information. It can be understood that the carrying module 20 carries the wafer from the wafer cassette 10 to the first magazine 60 on the carrying path, and passes through the defect detecting module 80 first, and performs defect detection at the defect detecting module 80, and the control module 40 controls the carrying module 20 to place the wafer qualified for detection in the first magazine 60 and place the wafer unqualified for detection in the second magazine 70 according to the defect detection information detected by the defect detecting module 80. The defect detection module 80 is arranged on the conveying path from the wafer box 10 to the first material box 60, meanwhile, the defect detection is carried out on the wafer, so that the conveying error of the wafer in the conveying process can be reduced, the conveying time is saved, the detection efficiency is improved, meanwhile, the wafer which is unqualified in detection is placed in the second material box 70, the pre-detection classification can be carried out in the conveying process, a pre-detection sample is provided for the subsequent processing technological process of the wafer, the waste material is prevented from entering the subsequent processing procedure, the production efficiency is improved, and the occupied space of equipment is reduced.

It is understood that the first and

second cartridges

60 and 70 may have the same structure as the wafer cassette 10, and a detailed description of the first and

second cartridges

60 and 70 will not be repeated here.

Further, the vision sensing module 30 is further configured to shoot an accommodating space 111 of the first magazine 60 from an access opening 112 of the first magazine 60 to obtain a second shot image before the wafer is placed on the first magazine 60 by the carrying module 20, and the control module 40 is further configured to control the carrying module 20 to perform an emptying alignment according to the second shot image, and control the carrying module 20 to perform a placing operation of placing the wafer on the first magazine 60 or a step of detecting the wafer after the emptying alignment is completed; and/or the vision sensing module 30 is further configured to shoot a third shot image from the receiving and placing opening 112 of the second material box 70 before the carrying module 20 places the wafer into the second material box 70, and the control module 40 is further configured to control the carrying module 20 to perform the placing operation of placing the wafer into the second material box 70 or the step of detecting the wafer according to the third shot image, and after the placing operation is completed, the carrying module 20 is controlled to perform the placing operation of placing the wafer into the second material box 70. By shooting the accommodating space 111 of the first material box 60 from the taking and placing opening 112 of the first material box 60 before the wafer is placed on the first material box 60 by the carrying module 20 to obtain a second shot image and/or shooting the accommodating space 111 of the second material box 70 from the taking and placing opening 112 of the second material box 70 before the wafer is placed on the second material box 70 by the carrying module 20 to obtain a third shot image, the operation of the carrying module 20 in the process of obtaining and/or placing the wafer at each time can be more accurate, the reliability of the wafer taking and placing operation is guaranteed, and the operation efficiency is also guaranteed.

Further, the defect detection information includes a detection image, the defect detection module 80 includes a camera module 81 and a support 82 supporting the camera module 81, the camera module 81 is used for shooting the wafer transported by the carrying module 20 obtains the detection image, the control module 40 is further used for analyzing the defect proportion of the wafer according to the detection image, and comparing the defect proportion with a preset proportion to judge whether the wafer is qualified.

Further, the bracket 82 includes a support main body 821, a camera support part 822 connected to one side of the support main body 821, and a light source support part 823 connected to one side of the support main body 821, the image pickup module 81 includes a second industrial camera 811, a second lens 812 and a light supplement lamp 813, the second lens 812 is mounted on the second industrial camera 811, and the second industrial camera 811 is disposed at one end of the camera support part 822 far away from the support main body 821; the light supplement lamp 813 is disposed at one end of the light source supporting portion 823 away from the supporting body 821; the wafer carried by the carrying module 20 is for being placed parallel to the first reference plane, the second industrial camera 811 faces the wafer and the optical axis of the second industrial camera 811 is perpendicular to the first reference plane; the light supplement lamp 813 includes an annular light emitting member, the annular light emitting member is located between the second industrial camera 811 and the carrying module 20 and is used for facing the wafer to emit light, and the second industrial camera 811 is used for shooting the wafer through a hollow area of the annular light emitting member to acquire the detection image. In this embodiment, the second lens 812 may be a telecentric lens. Through setting up the wafer of transport module 20 transport is on a parallel with the first reference surface is placed, second industry camera 811 orientation the wafer just the optical axis of second industry camera 811 is perpendicular to the first reference surface, can make second industry camera 811 shoot perpendicularly the wafer, simultaneously, under the shining of light filling lamp 813, can make the defect detection of defect detection module 80 is more accurate, and the precision is higher.

Referring to fig. 5, fig. 5 is a flowchart of a wafer transportation control method according to an embodiment of the present invention, in an embodiment of the present application, when the wafer transportation apparatus 1 performs the picking and placing operation of the wafer, the wafer transportation control method may be executed to complete the picking and placing of the wafer, and the wafer transportation control method includes the following steps:

step S101: providing a wafer cassette 10, wherein the wafer cassette 10 includes two carriers 11 and a light source 12 which are arranged oppositely, the two carriers 11 enclose an accommodating space 111 between the two carriers 11 and a pick-and-place opening 112 located on one side of the accommodating space 111, the accommodating space 111 is used for accommodating a plurality of wafers which are parallel to a first reference plane, and the light source 12 is located on one side of the accommodating space 111 away from the pick-and-place opening 112. Specifically, after the wafer carrying device 1 is turned on, the light source 12 may emit light, and when the light source 12 emits light at a side far away from the pick-and-place port 112, a place without the wafer may have bright stripes when observed from the pick-and-place port 112 side, and may form a strong light-dark contrast with dark stripes in a place where the wafer is placed due to the fact that the wafer blocks light, so as to be convenient for knowing the position of the wafer.

Step S102: when the light source 12 emits light toward the accommodating space 111, a first captured image of the accommodating space 111 captured at the pick-and-place port 112 side is acquired.

It is understood that, when a plurality of wafers are placed in the wafer cassette 10, the first captured image in step S102 is an image with bright-dark contrast stripes formed by the wafer cassette 10 under the irradiation of the light source 12.

It is understood that the wafer handling control method may further include the steps of:

step S301: before the first shot image is obtained, the carrying module 20 is controlled to move to the current detection position according to the current detection position parameters.

In this embodiment, the current detection position may be a position at which the wafer is taken or placed is detected, and the current detection position may be a position at which the first captured image is captured.

Step S302: and judging whether the current material taking position or the current blanking position corresponding to the current detection position has the wafer or not according to the first shot image, and if the current material taking position has the wafer or the current blanking position does not place the wafer, executing the step S103.

It should be understood that the method with wafer handling control described above may be applied to material taking or material unloading when the wafers in the wafer cassette 10 are handled to other cassettes (such as the first cassette 60 or the second cassette 70), and may also be applied to material unloading when the wafers in other cassettes are handled and placed in the wafer cassette 10. The following description will be given by taking a magazine for unloading wafers from the wafer cassette 10 by the wafer transfer device 1.

In step S302, during material taking, if the current material taking position has the wafer, material taking is performed after alignment, and during material discharging, if the current material discharging position does not have the wafer placed therein, material discharging is performed after alignment. Through judging whether the current material level of getting that the current detection position corresponds or the current material level of unloading have the wafer, whether control transport module 20 counterpoints, can avoid the current material level of getting does not the wafer or the current material level of unloading has been placed dislocation operation during the wafer, thereby avoid right the damage of wafer can also avoid the shut down that the mistake in operation brought, promotes the reliability and the operating efficiency of operation.

In this embodiment, in step S302, if there is no wafer at the current material taking position or the wafer is placed at the current material discharging position, it is determined whether the current detection position is the maximum detection position, and if the current detection position is the maximum detection position, the carrying module 20 is controlled to return to the initial position; if the current detection position is not the maximum detection position, respectively adjusting the current detection position parameter, the current material taking position parameter or the current blanking position parameter to preset values, and returning to execute the step of controlling the carrying module 20 to move to the current detection position according to the current detection position parameter after adjustment.

It should be noted that the wafer cassette 10 has limited wafer storage positions, and each storage position is separated by a preset separation distance, in this embodiment, the preset separation distance may be Δ z, the maximum detection position is a detection position corresponding to the last storage position of the wafer cassette 10 for placing the wafer, and when the current detection position is the maximum detection position, the carrying module 20 is controlled to return to the initial position, which may be a set default position; when the current detection position is not the maximum detection position, adjusting preset values of the current detection position parameter, the current material taking position parameter, or the current blanking position parameter respectively to obtain updated current detection position parameter, current material taking position parameter, or current blanking position parameter, where in this embodiment, the preset value may be a preset interval distance, that is, Δ z, of the wafer cassette 10. By judging that the current detection position is the maximum detection position, the carrying module 20 can be quickly returned to the initial position for subsequent operation after reaching the maximum detection position, and the operation efficiency is improved.

Step S103: and controlling the carrying module 20 to perform alignment according to the first shot image.

And analyzing the first shot image obtained in step S102, wherein the position of the dark stripe in the first shot image is a position where a wafer is located, so as to obtain the storage information of the wafer in the wafer cassette 10, thereby controlling the carrying module 20 to perform alignment.

It is understood that the current material taking level parameter or the current material discharging level parameter may be stored in the control module 40 of the wafer handling apparatus 1, and specifically, the step S102 may include the following steps:

step S201: correcting the current material taking position parameter or the current blanking position parameter according to the first shot image to obtain a corrected material taking position parameter or a corrected blanking position parameter, and updating the current material taking position parameter or the current blanking position parameter according to the corrected material taking position parameter or the corrected blanking position parameter;

it can be understood that the current material taking position parameter is a position parameter of the wafer in the wafer box 10, which needs to take the material currently, the current material discharging position parameter is a position parameter of the wafer, which needs to be discharged currently, to be placed in the wafer box 10, and the current material taking position parameter or the current material discharging position parameter can be obtained through calculation. In order to ensure the accuracy of the operation, before the material taking or discharging operation is carried out, the image analysis can be carried out on the shot first shot image, so that a corrected material taking level parameter or a corrected discharging level parameter is obtained, finally, the current material taking level parameter or the current discharging level parameter is updated according to the corrected material taking level parameter or the corrected discharging level parameter, after the material taking or discharging operation is completed, the updated current material taking level parameter or the current discharging level parameter is respectively plus delta z, and then the current material taking level parameter or the current discharging level parameter of the next material taking or discharging can be obtained.

Step S202: and controlling the carrying module 20 to move to the current material taking position or the current material discharging position according to the corrected material taking position parameter or the corrected material discharging position parameter.

It can be understood that through the basis first shooting image obtains the material level parameter is got in the correction or material level parameter control is got down in the correction the transport module 20 removes and gets the material level or the material level is got down at present, can make the operation more accurate, thereby avoid right the damage of wafer can also avoid the shut down that the operation mistake brought, promotes the reliability and the operating efficiency of operation.

Step S104: and after the alignment is completed, controlling the carrying module 20 to acquire or place the wafer.

According to the material level parameter is got in the correction or material level parameter control is got down in the correction the transport module 20 moves to the present material level of getting or the present material level of unloading, promptly the transport module 20 stretches into in the wafer box 10, reach the present material level of getting or the present material level of unloading, the transport module 20 just can get the material or the unloading operation.

Specifically, the step of controlling the carrying module 20 to place the wafer after the alignment is completed may include the step of controlling the carrying module 20 to place and return the wafer according to preset descending and returning parameters, which is executed after the step of moving the carrying module 20 to the current discharging position. It can be understood that, after the carrying module 20 moves to the current blanking position, it descends according to the preset descending parameter, so that the wafer is placed on the bearing member 11, the preset descending parameter may be a preset descending distance, then, the carrying module 20 returns according to the returning parameter, the returning parameter may be a default returning position or an operation position of the next operation, and by executing control after the step of moving to the current blanking position by the carrying module 20, the carrying module 20 places and returns the wafer according to the preset descending and returning parameter, the operation efficiency of the wafer taking and placing operation can be improved.

The step of controlling the carrying module 20 to acquire the wafer after the alignment may include the step of controlling the carrying module 20 to lift and take out the wafer according to preset lifting and taking-out parameters, which is executed after the step of moving the carrying module 20 to the current material taking position. It can be understood that, transport module 20 makes according to predetermineeing the lifting parameter lifting after moving to the present material level of getting the wafer place on the transport module 20, predetermine the lifting parameter and can be predetermined rise distance, then, transport module 20 takes out according to taking out the parameter the wafer, through control transport module 20 is right according to predetermineeing the lifting and taking out the parameter the wafer carries out the lifting and takes out, can effectively protect the wafer ensures to take out the reliability of operation.

According to the wafer carrying control method, when the light source 12 faces the accommodating space 111 emits light, the first shooting image of the accommodating space 111 is shot on one side of the taking and placing opening 112, the wafer is obtained or placed according to the first shooting image to control the carrying module 20 to align, and the wafer in the wafer box 10 is accurately aligned and grabbed, so that the wafer is accurately carried and automatically operated.

Further, in some embodiments, the carrying module 20 includes a wafer carrier 22 for carrying the wafer and a moving component 21 for driving the wafer carrier 22 to move, a wafer sensor 50 is disposed on the wafer carrier 22 for sensing a contact state between the wafer carrier 22 and the wafer, and the wafer carrying control method further includes the following steps:

step S401: judging whether the carrying module 20 is in an idle state or a carrying state according to the sensing signal output by the wafer sensor 50, returning to step S301 if the carrying module 20 is judged to be in the idle state, and executing step S402 if the carrying module 20 is judged to be in the carrying state.

Step S402: adjusting the current detection position parameter, the current material taking position parameter or the current blanking position parameter to preset values respectively, and placing the wafer carried by the wafer carrier 22.

Whether the wafer is on the wafer carrier 22 can be determined by sensing the pressure of the wafer placed on the wafer carrier 22 by the wafer sensor 50, when the wafer is not on the wafer carrier 22, that is, the carrying module 20 is in the idle state, the wafer is already placed at this time, the carrying module 20 moves to the current detection position according to the current detection position parameter for carrying out the next carrying, and when the wafer is on the wafer carrier 22, that is, the carrying module 20 is in the carrying state, step S402 is executed to place the wafer, and the current detection position parameter, the current material taking position parameter or the current material discharging position parameter is updated according to the preset value.

In the above embodiment, by determining whether the carrying module 20 is in the no-load state or the loading state, the carrying module 20 can be moved more accurately and more efficiently, damage to the wafer and shutdown of the wafer are avoided, and the operation efficiency is improved.

Specifically, the step of placing the wafers carried by the wafer carrier 22 includes the following steps:

step S501: the placing operation of the carrying module 20 for placing the wafer in the first magazine 60 is performed according to the preset placing parameters.

Step S502: after the placing operation is performed, whether the carrying module 20 is in the idle state is determined according to the sensing signal of the wafer sensor 50, if the carrying module 20 is in the idle state, the step S301 is executed, and if the carrying module 20 is in the loading state, the step S501 is executed.

It is understood that the first magazine 60 may be a magazine for storing the wafers after the wafers are taken out of the wafer cassette 10. And after the wafer is taken out of the wafer box 10, the wafer is placed into the first material box 60 according to the placement parameters, if the wafer is placed successfully, the carrying module 20 is in the no-load state, the next material taking can be executed, and if the wafer is not placed successfully, the placing operation is continued. By judging whether the carrying module 20 is in the no-load state or the bearing state, the carrying module 20 can move more accurately and more efficiently, damage and halt to the wafer are avoided, and meanwhile, the operation efficiency is improved.

Further, before the step of placing the wafers carried by the wafer carrier 22, the step of inspecting the wafers may further include the following steps:

step S601: and moving the wafer to a preset detection position.

It should be noted that the preset detection position may be a fixed detection position, and the carrying module 20 may move the wafer to the preset detection position each time the wafer is obtained.

Step S602: carrying out defect detection on the wafer at the preset detection position; if the wafer is qualified, executing step S501; if the wafer is not qualified, step S603 is executed.

Specifically, the defect detection of the wafer may include the following steps:

step S701: and the wafers conveyed on the conveying module 20 shot at the preset detection position obtain a detection image.

Step S702: and analyzing the defect proportion of the wafer according to the detection image, and comparing the defect proportion with a preset proportion to judge whether the wafer is qualified.

In this embodiment, the defect detection is performed on the wafer, the defect ratio of the wafer is analyzed according to the detection image, which may be a wear defect ratio of the wafer, the preset ratio may be a preset wear defect ratio η, when the wear defect ratio of the wafer is smaller than the preset wear defect ratio η, the wafer is qualified for detection, the qualified wafer is placed in the first magazine 60, when the wear defect ratio of the wafer is greater than or equal to the preset wear defect ratio η, the wafer is not qualified for detection, the detection image is obtained through the wafer carried on the carrying module 20 photographed at the preset detection position, so as to determine whether the wafer is qualified or not, perform the pre-detection classification during the carrying process, provide a pre-detection sample for the subsequent processing process of the wafer, and prevent the waste material from entering the subsequent processing process, thereby improving the production efficiency and reducing the occupied space of the equipment.

Step S603: and executing the step of placing the wafer in the second magazine 70 by the carrying module 20, and returning to the step of moving to the current detection position according to the current detection position parameters.

The second material box 70 can be a recovery box of unqualified products, the wafers which are detected to be unqualified can be recovered through the second material box 70, when the wear defect proportion of the wafers is more than or equal to the preset wear defect proportion eta, the wafers are detected to be unqualified, and the unqualified wafers are placed into the second material box 70. Through the step of detecting the wafers carried by the wafer carrier 22 before the step of placing the wafers, the wafers can be detected in advance in the carrying process, defective products can be found in time, a pre-detection sample is provided for the subsequent processing process of the wafers, and the production efficiency is further improved.

In order to ensure the operation accuracy and reliability of the carrying module 20 for placing the wafers into the first magazine 60 and the second magazine 70, the wafer carrying control method may further include the following steps:

step S801: before the wafer is placed in the first magazine 60 by the carrying module 20, a second shot image of the accommodating space 111 of the first magazine 60 shot from the pick-and-place port 112 of the first magazine 60 is obtained, the carrying module 20 is controlled to carry out the placing and aligning according to the second shot image, and after the placing and aligning is completed, the carrying module 20 is controlled to carry out the placing action of placing the wafer in the first magazine 60.

Step S802: before the wafer is placed in the second material box 70 by the carrying module 20, a third shot image of the accommodating space 111 of the second material box 70 shot from the pick-and-place port 112 of the second material box 70 is acquired, the carrying module 20 is controlled to carry out emptying alignment according to the third shot image, and after the emptying alignment is finished, the carrying module 20 is controlled to carry out a placing action of placing the wafer in the second material box 70.

Step S801 and step S802 obtain a second shot image and a third shot image, control the carrying module 20 to perform the placing operation of placing the wafer in the first material box 60 and the second material box 70 according to the second shot image and the third shot image, control the carrying module 20 to perform the placing operation of placing the wafer in the first material box 60 and the second material box 70 after the placing operation is completed, and obtain the first shot image, control the carrying module 20 to perform the placing operation according to the first shot image, and control the carrying module 20 to perform the placing operation of placing the wafer in the wafer box 10 after the placing operation is completed, which is not repeated herein. By obtaining the second shot image before the carrying module 20 places the wafer into the first magazine 60 and/or obtaining the third shot image before the carrying module 20 places the wafer into the second magazine 70, the operation of the carrying module 20 in the process of obtaining and/or placing the wafer at each time can be more accurate, the reliability of the wafer taking and placing operation is guaranteed, and the operation efficiency is also guaranteed.

Referring to fig. 6, fig. 6 is a flowchart illustrating a wafer handling apparatus 1 according to an embodiment of the present invention, which uses the wafer handling control method shown in fig. 5. The wafer carrying equipment 1 starts to work, the light source is turned on, the control module 40 initializes each preset parameter (including a current material taking level parameter, a current material discharging level parameter, a maximum detection level parameter, a preset value, an abrasion defect proportion eta, and the like), then, the control module 40 controls the carrying module 20 and the vision sensing module 30 to move to a current detection level for vision detection according to the current detection level parameter, namely, the vision sensing module 30 shoots and obtains a first shot image, further, the control module 40 judges whether a wafer exists in the current detection level according to the first shot image, if the current detection level has a wafer, the current material taking level parameter is corrected according to the first shot image, and controls the carrying module to align with the current detection level and perform the action of obtaining the wafer according to the current material taking level parameter, if the current detection position has no wafer, determining whether the current detection position is the maximum detection position, if so, finishing the cycle, stopping the work, and waiting to start the work again, otherwise, adjusting the current detection position parameter by a preset value, and the control module 40 returning to the step of performing the visual detection according to the adjusted current detection position parameter, that is, controlling the carrying module 20 and the visual sensing module 30 to move to the next current detection position for the visual detection.

Further, after the carrying module 20 obtains the wafer, the control module 40 determines whether the carrying module 20 is in a load state or an idle state according to a second sensing signal output by the wafer sensor 50 on the carrying module 20, if the carrying module is in the idle state, the step of performing visual inspection is returned, if the carrying module is in the load state, the carrying module 20 carries the wafer to a preset inspection position for defect inspection, specifically, the defect inspection module obtains an inspection image, the control module 40 determines whether a defect proportion of the wafer is smaller than a preset value according to the inspection image, and if the defect proportion of the wafer is smaller than the preset value, the carrying module 20 may place the wafer on the first magazine 60. In addition, the detection image can be saved by the control module 40 for later reference.

Specifically, before the wafer is discharged to the first magazine 60, the carrying module 20 may be controlled to move to the current detection position of the first magazine 60 according to the prestored current detection position parameter of the first magazine 60, and then the accommodating space of the first magazine 60 is photographed by the vision sensing module 30 to obtain a second photographed image, so as to determine whether the wafer is present at the current discharge position of the first magazine 60 according to the second photographed image, and correct the current discharge position parameter of the first magazine 60 according to the second photographed image, so that the carrying module 20 performs accurate alignment and performs an action of placing the wafer to the first magazine 60 according to the corrected current discharge position parameter of the first magazine 60; similarly, before the wafers are fed to the second material box 70, the carrying module 20 may move to the current detection position of the second material box 70 according to the prestored current detection position parameter of the second material box 70, and then may shoot through the visual sensing module 30 the receiving space of the second material box 70 acquires a third shot image, so as to judge whether the current blanking position of the second material box 70 has the wafers according to the third shot image, and correct the current blanking position parameter of the second material box 70 according to the third shot image, so that the carrying module accurately aligns and executes the action of placing the wafers to the second material box 70 according to the corrected current blanking position parameter of the second material box 70.

Further, after the carrying module 20 performs the placing operation, the control module 40 further determines whether the carrying module 20 is in a loading state or an idle state according to the second sensing signal output by the wafer sensor 50, if the carrying module is in the idle state, updates the pre-stored current detection position parameter of the first magazine 60, such as adjusting a preset value, so as to correspond to a next detection position of the first magazine 60, and updates the pre-stored current detection position parameter of the second magazine 70, such as adjusting a preset value, so as to correspond to a next detection position, and returns to perform the next wafer obtaining operation of the wafer cassette 10; if the carrying state is the carrying state, the control module controls the carrying module 20 to return to perform the step of detecting the defect again according to the detected image, so as to further repeat the steps of detecting the defect detection module 80 to capture the second captured image or the third captured image, and the actions of placing the second captured image or the third captured image, and in other embodiments, as shown in fig. 7, if the carrying state is the carrying state, the control module 40 may also control the carrying module 20 to return to perform the steps of detecting the defect detection module 80 to capture the second captured image or the third captured image, and the actions of placing the second captured image or the third captured image, again.

In summary, in the wafer carrying apparatus 1 and the wafer carrying control method provided in the embodiments of the present application,

1. the light source 12 and the first industrial camera 32 are directly used for detecting the wafer and the wafer box 10, are not affected by assembly errors between actual bearing positions of the wafer, can achieve automatic alignment and accurate taking and placing in the wafer carrying process, can also accurately judge whether the wafer has composite functions such as counting and the like in real time, has certain self-adaptive adjustment capability on positioning errors caused by environmental disturbance, and has good flexibility, flexibility and reliability.

2. According to the wafer carrying equipment 1 and the wafer carrying method, the pressure sensors 13 and the wafer sensors 50 are symmetrically arranged on each layer of the bearing plate 114 of the wafer box 10 and at the tail end of the wafer carrier 22, so that the contact state of the wafer and the bearing plate 114 of the wafer box 10 and the contact state of the wafer and the wafer carrier 22 are sensed in real time, the wafer taking and placing are accurately sensed and synchronously counted, and the reliability of the wafer taking, placing and carrying process is ensured.

3. According to the wafer carrying equipment 1 and the wafer carrying method, the second industrial camera 811 is adopted to carry out wafer pre-detection on a path where wafers need to be taken and placed, the pre-detection classification process in the carrying process can provide pre-detection samples for the subsequent processing technological process of the wafers, waste materials are prevented from entering the subsequent processing procedure, and therefore production efficiency is improved.

Referring to fig. 8, fig. 8 is a schematic structural diagram of an electrical device 2 according to an embodiment of the disclosure, where the electrical device 2 includes a memory 91 and a processor 92.

The memory 91 stores computer readable instructions 93, and when executed by the processor 92, the computer readable instructions 93 cause the processor 92 to implement the wafer handling control method as described in any one of the above.

Referring to fig. 9, fig. 9 is a schematic structural diagram of a storage medium according to an embodiment of the disclosure, the computer-readable storage medium 3 has computer-readable instructions 93 stored thereon, and the computer-readable instructions 93 are executed by a processor 92 to implement the wafer handling control method according to any of the above embodiments.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also appreciate that the embodiments described in this specification are all alternative embodiments and that the acts and modules involved are not necessarily required for this application.

In various embodiments of the present application, it should be understood that the size of the serial number of each process described above does not mean that the execution sequence is necessarily sequential, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.

The integrated units, if implemented as software functional units and sold or used as a stand-alone product, may be stored in a computer accessible memory. Based on such understanding, the technical solution of the present application, which is a part of or contributes to the prior art in essence, or all or part of the technical solution, can be embodied in the form of a software product, stored in a memory, including several requests for causing an electrical device (which may be a personal computer, a server, or a network device, etc., and may specifically be a processor in the electrical device) to execute part or all of the steps of the above-mentioned method of the embodiments of the present application.

It will be understood by those skilled in the art that all or part of the steps in the methods of the embodiments described above may be implemented by hardware instructions of a program, and the program may be stored in a computer-readable storage medium, where the storage medium includes Read-Only Memory (ROM), Random Access Memory (RAM), Programmable Read-Only Memory (PROM), Erasable Programmable Read-Only Memory (EPROM), One-time Programmable Read-Only Memory (OTPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Compact Disc Read-Only Memory (CD-ROM), or other Memory, such as a magnetic disk, or a combination thereof, A tape memory, or any other medium readable by a computer that can be used to carry or store data.

The above detailed descriptions of the wafer cassette 10, the wafer transfer apparatus 1, the wafer transfer control method, the electrical apparatus 2 and the storage medium 3 disclosed in the embodiments of the present application are provided, and specific examples are applied herein to explain the principles and embodiments of the present application, and the above descriptions of the embodiments are only used to help understanding the method and the core ideas of the present application. Meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A wafer cassette, comprising:

the wafer picking and placing device comprises two bearing pieces which are oppositely arranged, wherein the two bearing pieces enclose an accommodating space between the two bearing pieces and a picking and placing opening positioned on one side of the accommodating space, and the accommodating space is used for accommodating a plurality of wafers parallel to a first reference surface; and

the light source is arranged on one side, far away from the taking and placing opening, of the accommodating space and used for emitting light towards the accommodating space.

2. The wafer cassette according to claim 1, wherein the light source is a surface light source including a light emitting surface facing the accommodating space, the light emitting surface being disposed opposite to the access opening.

3. The wafer cassette according to claim 1, wherein the carrier comprises a substrate and a plurality of carrier plates connected to a side of the substrate close to the accommodating space, the plurality of carrier plates are spaced apart along a first predetermined direction, the plurality of carrier plates of two carriers are disposed opposite to each other, and the two carrier plates disposed opposite to each other constitute a carrier assembly having a carrier position for respectively carrying two ends of the wafer.

4. The wafer cassette according to claim 3, further comprising a pressure sensor, a counting module and a communication module, wherein the pressure sensor is disposed on a side of the carrier plate carrying the wafers and electrically connected to the counting module and the communication module, the communication module is electrically connected to the control module, and the counting module is further configured to display counting results.

5. A wafer handling apparatus, comprising:

the wafer pod of any of claims 1-4;

the carrying module is used for acquiring or placing the wafer from the pick-and-place port;

the visual sensing module is used for shooting the accommodating space at one side of the pick-and-place port and outputting a first shot image when the light source emits light towards the accommodating space; and

and the control module is electrically connected with the carrying module and the visual sensing module and used for receiving and controlling the carrying module to align according to the first shot image and controlling the carrying module to obtain or place the wafer after the alignment is finished.

6. The wafer handling apparatus of claim 5, wherein the handling module comprises a moving assembly electrically connected to the control module and a wafer carrier connected to the moving assembly, the moving assembly is configured to drive the wafer carrier to move under the control of the control module, and the vision sensing module is disposed on the wafer carrier.

7. The wafer handling device of claim 6, wherein the moving assembly comprises a base, a first moving joint disposed on the base and capable of extending and retracting along a second predetermined direction, a first rotating arm having one end rotatably connected to the first moving joint, a second rotating arm having one end rotatably connected to the other end of the first rotating arm, and the wafer carrier rotatably connected to the other end of the second rotating arm.

8. The wafer handling apparatus of claim 7, wherein the wafer carrier comprises a connection base disposed on the movable assembly along the second predetermined direction and a handling portion connected to a side of the connection base; the visual sensing module is arranged on one side, far away from the moving assembly, of the connecting base body along the second preset direction, and the visual sensing module is used for shooting towards one side where the carrying part is located.

9. The wafer handling apparatus of claim 8, wherein the vision sensing module comprises a camera mounting plate disposed on the connection substrate, a first industrial camera disposed on the camera mounting plate, and a first lens mounted on the first industrial camera.

10. The wafer handling apparatus according to claim 8, further comprising a wafer sensor disposed on a surface of the handling portion near a side of the wafer and at an end of the handling portion away from the connection substrate, the wafer sensor being electrically connected to the control module for sensing the wafer and outputting a second sensing signal to the control module, so that the control module counts and/or monitors the wafer handled by the handling module.

11. The wafer handling apparatus of claim 10, wherein the handling portion comprises two arms, both of the arms are connected to the connection substrate and enclose a U-shape having an opening facing a side away from the connection substrate, and the wafer sensor is disposed at an end of the arms away from the connection substrate; one side of each arm part for bearing the wafer is provided with one wafer sensor; the wafer sensor is a pressure film sensor.

12. The wafer carrier apparatus as claimed in claim 10, wherein the control module monitors whether the carrier module obtains the wafer from the wafer cassette according to the second sensing signal, and when the control module determines that the carrier module is in an idle state according to the second sensing signal, the control module controls the vision sensing module to capture the updated first captured image of the accommodating space from the pick-and-place port again, performs the alignment again according to the updated first captured image, and controls the carrier module to obtain the wafer after completing the alignment again.

13. The wafer handling device of claim 10, further comprising a first magazine, wherein the handling module is configured to pick up the wafer from the first magazine and transport the wafer to the first magazine, and wherein the control module controls the handling module to re-place the wafer to the first magazine when the control module determines that the handling module is still in a loading state after the second sensing signal indicates that the handling module is performing the placing of the wafer to the first magazine.

14. The wafer handling apparatus of claim 13, further comprising a second magazine and a defect detection module located on a handling path of the handling module from the wafer magazine to the first magazine, the defect detection module being electrically connected to the control module, the defect detection module being configured to perform defect detection on the wafers transported by the handling module and output defect detection information to the control module, the control module being further configured to control the handling module to place the wafers that are qualified for detection in the first magazine and place the wafers that are unqualified for detection in the second magazine according to the defect detection information.

15. The wafer handling apparatus of claim 14,

the visual sensing module is further used for shooting the accommodating space of the first material box from the taking and placing opening of the first material box to obtain a second shot image before the carrying module places the wafer to the first material box, and the control module is further used for controlling the carrying module to carry out discharging and aligning according to the second shot image and controlling the carrying module to carry out the placing action of placing the wafer to the first material box after the discharging and aligning is finished; and/or

The visual sensing module is also used for shooting the accommodating space of the second material box from the taking and placing opening of the second material box before the carrying module places the wafer to the second material box to obtain a third shot image, the control module is also used for controlling the carrying module to carry out emptying alignment according to the third shot image, and after the emptying alignment is finished, the carrying module is controlled to carry out the wafer placing to the placing action of the second material box.

16. The wafer handling apparatus of claim 14, wherein the defect detection information comprises a detection image, the defect detection module comprises a camera module and a support for supporting the camera module, the camera module is configured to capture the wafer transported by the handling module to obtain the detection image, and the control module is further configured to analyze a defect rate of the wafer according to the detection image and compare the defect rate with a predetermined rate to determine whether the wafer is qualified.

17. The wafer handling device of claim 16, wherein the frame comprises a support body, a camera support coupled to a side of the support body, and a light source support coupled to a side of the support body, the camera module comprises a second industrial camera, a second lens mounted on the second industrial camera, and a fill-in light mounted on an end of the camera support remote from the support body; the light supplement lamp is arranged at one end of the light source supporting part far away from the supporting main body; the wafer conveyed by the conveying module is used for being placed in parallel to the first reference surface, the second industrial camera faces the wafer, and the optical axis of the second industrial camera is perpendicular to the first reference surface; the light filling lamp comprises an annular light emitting piece, the annular light emitting piece is located between the second industrial camera and the carrying module and used for facing the wafer to emit light, and the second industrial camera is used for shooting the wafer to obtain the detection image through a hollow area of the annular light emitting piece.

18. A wafer transfer control method is characterized by comprising the following steps:

19. The wafer handling control method of claim 18, further comprising:

20. The method as claimed in claim 19, wherein the step of controlling the transport module to perform the alignment according to the first captured image comprises:

21. The wafer handling control method of claim 20,

in the step of judging whether the current material taking position or the current material discharging position corresponding to the current detection position has the wafer according to the first shot image,

22. The method as claimed in claim 21, wherein the step of controlling the transfer module to place the wafer after the alignment step comprises: and controlling the carrying module to place and return the wafer according to preset descending and returning parameters after the step of moving the carrying module to the current discharging position.

23. The method as claimed in claim 20, wherein the step of controlling the transfer module to obtain the wafer after the completion of the alignment comprises: and controlling the carrying module to lift and take out the wafer according to preset lifting and taking-out parameters after the carrying module moves to the current material taking position.

24. The wafer conveying control method as claimed in claim 23, wherein the conveying module includes a wafer carrier for conveying the wafer and a moving component for driving the wafer carrier to move, a wafer sensor is disposed on the wafer carrier for sensing a contact state between the wafer carrier and the wafer, and the wafer conveying control method further includes the following steps:

25. The method as claimed in claim 24, wherein the step of placing the wafers carried by the wafer carrier comprises:

and judging whether the carrying module is in the no-load state or not according to the sensing signal of the wafer sensor after the placing action is executed, if so, returning to the step of executing the step of moving to the current detection position according to the current detection position parameter, and if so, returning to the step of executing the placing action of placing the wafer in the first material box by the carrying module according to the preset placing parameter.

26. The wafer handling control method of claim 25, further comprising: a step of inspecting the wafer, which is performed before the step of placing the wafer carried by the wafer carrier, the step of inspecting the wafer including:

moving the wafer to a preset detection position;

carrying out defect detection on the wafer at the preset detection position;

and if the wafer is unqualified in detection, executing the step of placing the wafer in the second material box by the carrying module, and returning to execute the step of moving to the current detection position according to the current detection position parameters.

27. The wafer handling control method of claim 26, further comprising:

28. The wafer handling control method of claim 26, wherein the step of performing defect detection on the wafer comprises:

29. An electrical device comprising a memory and a processor, the memory having stored therein computer-readable instructions that, when executed by the processor, cause the processor to carry out the method of any one of claims 18-28.

30. A computer-readable storage medium having computer-readable instructions stored thereon, wherein the computer-readable instructions, when executed by a processor, implement the method of any one of claims 18-28.