KR20160124965A - Wafer Transferring Apparatus - Google Patents

Wafer Transferring Apparatus Download PDF

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Publication number
KR20160124965A
KR20160124965A KR1020150055253A KR20150055253A KR20160124965A KR 20160124965 A KR20160124965 A KR 20160124965A KR 1020150055253 A KR1020150055253 A KR 1020150055253A KR 20150055253 A KR20150055253 A KR 20150055253A KR 20160124965 A KR20160124965 A KR 20160124965A
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KR
South Korea
Prior art keywords
wafer
image
wafers
wafer carrier
unit
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KR1020150055253A
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Korean (ko)
Inventor
김승환
Original Assignee
에스케이하이닉스 주식회사
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Priority to KR1020150055253A priority Critical patent/KR20160124965A/en
Publication of KR20160124965A publication Critical patent/KR20160124965A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line

Abstract

The present invention relates to a wafer transfer apparatus. The wafer transfer apparatus comprises: a transfer member which transfers multiple wafers in the gap between a wafer carrier and a wafer boat in a substrate processing device; and a transfer monitoring block which monitors the images of the transfer member, the wafers, the inside of the wafer carrier, and the inside of the wafer boat in real-time, and stops the operation of the transfer member in the case that at least one from the transfer member, the wafers, the wafer carrier, and the wafer boat has an error to inspect the error.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a wafer transfer apparatus for loading and unloading wafers to and from a substrate processing apparatus without wafer breakage.

Semiconductor devices can be constructed by depositing, heat treating, and patterning multiple layers of a layer on a wafer. In general, the deposition, diffusion and heat treatment processes of the layers can be carried out in a substrate processing apparatus such as a furnace. A general furnace is configured in a batch type, and a large number of wafers are processed at a time in a state in which a plurality of wafers are loaded on a kind of wafer boat called a front opening unified pod (FOUP). A plurality of wafers are temporarily transferred to a wafer boat such as a FOUP through a wafer transfer apparatus having a plurality of robot arms such as blades.

However, due to a long process, the position between the wafer transfer blades may be deformed or a part thereof may be broken, the guide slot of the FOUP provided in the substrate processing apparatus may be distorted, or the wafer may be wiped Problems such as warpage may occur.

At present, the wafer transfer is progressing without consideration of the state of the transferring apparatus, the state of the wafer, and the state of the FOUP, and thus the wafer is often damaged when the wafer is transferred. Further, since the wafer transfer device is required to stop the operation of the apparatus and to check and repair the cause of the error only after the wafer is broken, the manufacturing time and cost are increased.

An object of the present invention is to provide a wafer transfer apparatus for transferring wafers while monitoring the abnormality of the transfer apparatus, the abnormality of the substrate processing apparatus, and the abnormality of the wafers during wafer transfer.

A wafer transfer apparatus according to an embodiment of the present invention includes a transfer member for transferring a plurality of wafers between a wafer carrier and a wafer boat in a substrate processing apparatus, and a transfer member for transferring the transfer member, the plurality of wafers, The image of the inside of the boat is monitored in real time so as to stop the operation of the conveying member when an error occurs in at least one of the conveying member, the plurality of wafers, the wafer carrier, and the wafer boat, And a conveyance monitoring block configured to check the conveyance.

According to another aspect of the present invention, there is provided a wafer transfer apparatus including: a transfer member for transferring a plurality of wafers between a wafer carrier and a wafer boat in a substrate processing apparatus; An image pickup member positioned adjacent to the transfer member and configured to image the transfer member, the plurality of wafers, the inside of the wafer carrier, and the inside of the wafer boat; A wafer transfer controller configured to receive image data from the imaging member, compare the set normal data with the image data, and output an error control signal; An operation stop unit for temporarily stopping the conveying member in response to the error control signal; And a correction unit configured to correct a portion where an error has occurred in response to the error control signal.

The wafer transfer apparatus according to the present invention includes a high-speed transferable imaging member for monitoring a wafer carrier within a wafer transfer member and a processing apparatus, The abnormality of the wafer housed in the wafer carrier, the abnormality of the wafer housed in the wafer boat such as the FOUP in the substrate processing apparatus, the fluctuation of the position of the wafer carrier and the wafer boat, Changes, etc. are taken at the same time as the transfer process, and the cause of the error is accurately recognized and corrected. Further, in the case of a slight error, after the temporary stop, correction is performed by the correcting unit, so that the manufacturing time and cost can be greatly reduced.

1 is a block diagram of a wafer transfer apparatus according to an embodiment of the present invention.
2 is a perspective view showing a transfer member and an imaging member of a wafer transfer apparatus according to an embodiment of the present invention.
3 is a view showing a process of picking up intervals of blades by an image pickup member according to an embodiment of the present invention.
FIG. 4 is a view showing a process of picking up a blade gap and a gap between guide slots of a wafer boat by an imaging member according to an embodiment of the present invention.
5 is a view showing a process of picking up a gap between guide slots of a wafer carrier by an imaging member according to an embodiment of the present invention.
6 is a view showing a process of picking up a wafer state mounted on a wafer carrier or a wafer boat by an imaging member according to an embodiment of the present invention.
7 is an internal block diagram of a wafer transfer controller according to an embodiment of the present invention.
FIG. 8 is a view in which an image of a sensed blade is overlapped with a blade reference line in a steady state according to an embodiment of the present invention.
9 is a view showing reference lines indicating line widths of blades in a steady state according to an embodiment of the present invention.
FIG. 10 is a view in which the reference lines of FIG. 9 and the image of the upper surface of the sensed blade are overlapped according to an embodiment of the present invention.
11 is a view showing an outer reference line and a guide slot reference line of a wafer boat in a steady state according to an embodiment of the present invention.
Figure 12 is an overlapping image of the captured wafer boat with the baselines of Figure 11 according to one embodiment of the present invention.
13 is a view showing a reference line indicating the position of a normally received wafer according to an embodiment of the present invention.
FIG. 14 is a view in which the reference lines of FIG. 13 and an image of a picked-up wafer are overlapped according to an embodiment of the present invention.
15 is a flowchart illustrating a process of detecting a blade error according to an embodiment of the present invention.
16 is a flowchart illustrating a process of detecting wafer wafers according to an embodiment of the present invention.
17 is a flowchart illustrating a process of detecting errors in a wafer boat or a wafer carrier according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

Referring to FIG. 1, the wafer transfer apparatus 100 of the present invention may include a transfer member 110 and a transfer monitoring block 115.

The transfer monitoring block 115 monitors in real time the images of the transfer member 110 and the plurality of wafers, the inside of the wafer carrier and the inside of the wafer boat, and transfers the transferred image to at least one of the transfer member, the plurality of wafers, the wafer carrier, And in the event of an error, the operation of the conveying member is stopped so as to check the error occurrence portion. The monitoring block 115 may include an imaging member 120, a wafer transfer controller 130, a warning unit 140, an operation stop unit 150, and a correction unit 160.

The transfer member 110 may include a plurality of stacked blades 115, as shown in FIG. Each blade 115 may have a body portion 112 and at least one branch 114a, 114b separated from the body portion 112. [ For example, the blade 115 of the present embodiment may be configured to include two branches 114a, 114b, and may have a fork shape. The body portion 112 is bound by the fixing member 117 and the portions of the branches 114a and 114b are opened so that the wafer is mounted on the branches 114a and 114b. Although not shown in the drawing, a plurality of vacuum holes for generating vacuum pressure in the branches 114a and 114b may be provided so that vacuum adsorption may be performed between the mounted wafer and the branches 114a and 114b. Since the blades 115 are configured to be stacked at equal intervals, one wafer can be mounted for each blade, so that a plurality of wafers can be transferred at a time. The transfer member 110 and the fixing member 117 can be positioned on the support member 105 of the wafer transfer apparatus.

At least one or more image pickup members 120 may be provided on the fixing member 117. The image pickup member 120 is configured to store the state of the blade 115 and the gap between the blades 115 as well as the state of the wafer to be mounted as well as the wafer boat (for example, FOUP) in the vacuum processing apparatus, To the state of the wafer carrier being processed. The imaging member 120 of the present embodiment may include, for example, first to third imaging members 120a, 120b, and 120c so as to capture both right and left and up and down directions.

The first imaging member 120a may be configured to image one side branches 114a of the blade 115 and corresponding portions thereof as shown in Figures 2 and 3 and the second imaging member 120b, May be configured to image the other branches 114b of the blade 115 and corresponding portions thereof. The first and second image pickup members 120a and 120b can secure a wide angle capable of capturing all of the blades 115 that are laminated or rotatably installed so that all the blades 115 are sequentially picked up Or < / RTI >

The third imaging member 120c is positioned on the upper surface of the first and second imaging members 120a and 120b to pick up the surface of the blade 115 and the wafer surface to detect the twisting and tilting of the blade 115 A rotation drive error can be detected. The image pickup member 120 can capture a snapshot or a moving image, transmit the captured image to the wafer transfer controller 130, and transmit the data to the wafer transfer controller 130.

4, the image pickup member 120, for example, the first and second image pickup members 120a and 120b may be arranged to be spaced apart from the wafer 115, The interval between the guide slots 210 of the blades 115 can be sensed at the same time or separately with the interval imaging of the blades 115. [ The image pick-up member 120 can provide image data obtained by imaging the interval between the blades 115 and image data of the interval between the guide slots 210 of the wafer boat 200 to the wafer transfer controller 130 have.

5, at least one of the imaging members 120 images the guide slot 310 of the wafer carrier 300 housing the wafer before it is loaded into the substrate processing apparatus, 310 can be detected. The wafer carrier 300 of FIG. 5 may also be interpreted as a wafer boat 200 that holds the wafer in the substrate processing apparatus of the present invention.

6, the imaging member 120, for example, the first and second imaging members 120a and 120b may be mounted on the blade 115, the wafer boat 200, and the wafer carrier 300 The state of the mounted wafers w1 and w2 can be picked up. Reference numeral w1 designates a normal wafer, and w2 designates a wafer on which a wipe is generated.

The wafer transfer controller 130 may include an image storage unit 132, an image comparison unit 134, and a determination unit 136, as shown in FIG.

The image storage unit 132 may be a medium for capturing and storing a reference image. The image storage unit 132 may further include at least one reference line providing unit 132a for comparing images taken by the imaging member 120. [ The reference line feeder 132a may include a reference line feeder for setting the interval of the blades 115, a reference line feeder for setting a slot interval of the wafer boat, and a reference line providing unit for setting a wafer loading position.

The reference line providing section 132a provides the image comparing section 134 with a portion picked up by the image pick-up member 120 and a reference line corresponding thereto to overlap the picked-up portion with the reference line, As described above, it is possible to check the abnormality of the wafer w and the interval between the guide slots of the wafer boat (or wafer carrier).

For example, FIG. 8 is an overlapping view of an image of the sensed blade 114a, 114b with the reference line a where the blade is located in a steady state. 8, the image comparing unit 134 overlaps the image of the picked blade 115 with the blade reference line (a) in the steady state, and compares the result of the comparison to determine whether the position of the blade 115 is abnormal or damaged And provides it to the determination unit 136. [

9 shows the reference lines b1 and b2 indicating the line width s1 of the blade 115 in the steady state and Fig. 10 is a view showing the reference lines b1 and b2 and the captured blade 115 in Fig. The upper surface is overlapped.

9 and 10, when the width s1 of the blade 115 is accurately located between the reference lines b1 and b2, the determination unit 136 determines that the image is normal from the image comparison data. However, if the width of the blade 115 is smaller than the interval between the reference lines b1 and b2, the determination unit 136 may determine that the blades 115 are rotated without being balanced from the image comparison data have.

11 is a view showing an outer reference line c and a guide slot reference line d of the wafer boat 200 and Fig. 12 is a view showing an image of the captured wafer boat 200 and the outer reference line c of Fig. And the guide slot reference line (d). The determination unit 136 determines whether the wafer boat 200 is positioned at an accurate position or not by comparing the reference lines and the sensed image in the image comparison unit 134, It can be determined whether or not the guide slots of the guide grooves are in place.

13 shows the positional reference line e of the normally received wafer. Here, the wafer reference line e may be, for example, the wafers mounted on each of the upper portions of the blades 115, the wafers housed in the wafer carrier 300, or the wafers housed in the wafer boat 200 of the substrate processing apparatus As shown in FIG.

Fig. 14 is a view in which the image of the captured wafers w overlaps the reference line e in Fig. Through the overlap image, it is possible to detect a phenomenon of the wafer itself, for example, a phenomenon in which both ends of the wafer are warped.

The image storage unit 132 further stores a screen capturing errors of the guide slots 310 of the wafer carrier 300 and the guide slots 210 of the blades 115, the wafer w and the wafer boat 200 Media.

Such error images are then transmitted to the manager, which can be used as a data for accurately determining which part of the error has occurred.

The image comparison unit 134 compares the image data provided from the image pickup members 120 or the image data provided from the image pickup members 120 and the image data stored in the image storage unit 120 132 of the reference data.

The determination unit 136 may be configured to output an error control signal when the comparison result of the image comparison unit 134 is out of a predetermined error range.

The warning unit 140 informs the manager of the device abnormality (blade abnormality, wafer boat abnormality, guide slot error in the wafer boat, wafer carrier abnormality, guide slot error in the wafer carrier, , And wafer anomalies), or the like. By the operation of the warning unit 140, the administrator can recognize the device abnormality and check the device. At this time, depending on the type of the error, another type of alarm or light can be set so that the manager can be informed of the error of the specific part.

The operation stopping unit 150 stops the operation of the conveying member 110 in accordance with the error control signal of the determining unit 136. [ Thereafter, the manager can repair the error so that the error can be corrected and replaced through the error image, thereby preventing the wafer from being damaged due to wafer transfer in an abnormal state.

The wafer transfer apparatus having such a configuration can perform the following operations.

First, as shown in Fig. 15, an error of the conveying member 110, for example, the blade 115 is checked through the imaging member 120 (S11). The error of the blade 115 can be confirmed by a combination (comparison) of the captured blade image with the predetermined reference line, as shown in FIG. 8, or by comparing the blade image in the steady state with the blade- ≪ / RTI >

If the blade 115 is normal, the wafer is carried on each blade 115 (S11).

On the other hand, if there is an abnormality in the picked-up blade 115, it is determined that, for example, the blade 115 has been broken or the blade has been tilted and rotated so that the wafer transfer controller 130 can stop the warning unit 140, And transmits the error control signal to the controller 150, the conveying member 110, and the corrector 160. [

The warning unit 140 receiving the error control signal informs the device manager of the abnormality of the blade 115 in a specific manner and the operation stopping unit 150 responds to the error control signal to detect the operation of the conveying member 110 Stop. In the state where the operation is temporarily stopped, the blade of the transfer apparatus can be repaired or replaced by the manager, or the position of the blade 115 or the like can be corrected through the corrector 160 (S13).

Thereafter, it can be returned to the blade error check step again by the image pickup member 120.

Referring to Fig. 16, the image pickup member 120 checks the wafer abnormality (S21). As shown in Fig. 14, the abnormality check (S21) of the wafer is based on whether the wafer is mounted on the blade 115, housed in the wafer carrier, or housed in the wafer boat 200, Can be determined.

If it is determined from the wafer transfer controller 130 that the wafer is in a normal state, the next process is performed.

On the other hand, when the wafer transfer controller 130 receives an image when the wafer is not balanced from the imaging member 120 or when the wafer is broken, the warning unit 140, the operation stop unit 150, (110) and the correcting unit (160). Accordingly, the alarm unit 140 transmits an alarm (or light) unique to the wafer abnormality to the manager, and the operation stop unit 150 stops the operation of the transfer member 110. Thereafter, the position of the wafer can be changed by the corrector 160 or the manager, or the broken wafer can be replaced.

When the wafer error is a wafer wipe, the operation of the transfer member 110 is temporarily stopped in a state in which the manager is warned of the abnormality of the wafer. The correcting unit 160 elapses the wafer for a predetermined time so that the wafers having the wafers are restored to a normal state. After a predetermined time has elapsed, a correction completion command is transmitted to the wafer transfer controller 130 to drive the transfer member 110 again. Generally, when the wafer wafers are processed at a high temperature, the edge of the wafers are bent, and the wafer wafers are returned to their original positions when they are left at room temperature for a certain time. The correction unit 160 transmits a correction completion command to the wafer transfer controller 130 so that the transfer unit 110 can be driven after a predetermined time elapses, including a timer (not shown) for which a wafer recovery time is set .

Next, as shown in Fig. 17, an abnormality of the wafer boat or the wafer carrier is checked by the imaging member 120 (S31). The abnormality of the wafer boat 200 or the wafer carrier 300 can be detected by comparing the sensed image data with the preset reference line or comparing the sensed data with the currently sensed data as shown in Fig. have.

When the wafer boat 200 or the wafer carrier 300 is in a position and the guide slots 210 inside the wafer boat 200 are positioned at a predetermined position while being spaced apart from each other, Is loaded into the wafer boat 200 or the wafer carrier 300 (S32).

On the other hand, when the wafer boat 200 or the wafer carrier 300 is not in the position or the guide slots 210 therein are not spaced apart, the wafer transfer controller 130 transfers the warning portion 140 The operation stop unit 150, the conveying member 110, and the correcting unit 160, as shown in FIG. The warning unit 140 suspends the operation of the conveying member 110 through the operation stopping unit 150 after a specific alarm (or lightening) corresponding to the abnormality of the wafer boat 200 or the wafer carrier 300 . Subsequently, the wafer boat 200 or the wafer carrier 300 is repaired (S33).

On the other hand, in the case of an insufficient error, the wafer boat 200 and the wafer carrier 300 are repaired by the correcting unit 160 after temporarily stopping the transferring member 110. Then, the corrector 160 provides the correction completion command to the wafer transfer controller 130, so that the operation of the transfer member 110 is resumed.

On the other hand, in the case of a serious error, after the operation of the transferring member 110 is stopped, the wafer boat 200 or the wafer carrier 300 can be replaced by the manager.

As described in detail above, the wafer transfer apparatus according to the present invention includes a high-speed transferable imaging member for monitoring the wafer transfer member and the wafer carrier in the processing apparatus. Such an imaging member may be an abnormality of the blade for transferring the wafer, The abnormality of the wafer placed in the wafer carrier, the abnormality of the wafer housed in the wafer carrier such as the wafer boat in the substrate processing apparatus, the variation of the position of the wafer carrier and the wafer boat, Position change, and the like are photographed simultaneously with the process so that the cause of the error is accurately recognized and corrected. Further, in the case of a slight error, the correction may be made to proceed after the temporary stop, so that the manufacturing time and cost can be greatly reduced. While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but variations and modifications may be made without departing from the scope of the present invention. Do.

100: wafer transfer device 110: transfer member
120: imaging member 130: wafer transfer controller
140: warning part 150:
160:

Claims (20)

A transferring member for transferring a plurality of wafers between the wafer carrier and the wafer boat in the substrate processing apparatus; And
The wafer carrier, the wafer carrier, the wafer carrier, the inside of the wafer carrier, and the wafer boat in real time to detect an error in at least one of the transferring member, the plurality of wafers, the wafer carrier, And a transfer monitoring block configured to check the error occurrence portion in a state in which the operation of the transfer member is stopped. The method according to claim 1,
Wherein,
A blade having a body portion and a plurality of branches extending from the body portion; And
And a fixing member configured to bind the body portion of the stacked blades. 3. The method of claim 2,
Wherein the transport monitoring block comprises:
An image pickup member positioned adjacent to the transfer member and configured to image the transfer member, the plurality of wafers, the inside of the wafer carrier, and the inside of the wafer boat;
A wafer transfer controller configured to receive image data from the imaging member, compare the set normal data with the image data, and output an error control signal; And
And an operation stop unit for temporarily stopping the conveying member in response to the error control signal. The method of claim 3,
Wherein a plurality of image pickup members are provided,
Wherein the selected one of the imaging members is positioned to image the inter-branch spacing of the stacked blades, the spacing between guide slots in the wafer carrier, and the spacing between guide slots in the wafer boat. The method of claim 3,
Wherein a plurality of image pickup members are provided,
Wherein the selected one of the imaging members is positioned to photograph the side of the wafer mounted in the wafer carrier or the wafer boat to take a picture of whether or not wafers of the wafer are generated. The method of claim 3,
Wherein a plurality of image pickup members are provided,
Wherein one of said imaging members is positioned to image an upper surface of said blade to detect twist and tilt of said blade. The method of claim 3,
And the image pick-up member is positioned above the fixing member of the conveying member. 8. The method of claim 7,
Wherein a plurality of image pickup members are provided,
Wherein some of the imaging members are positioned in correspondence with the branches of the blade, and have a wide angle at which the entire stacked branches can be photographed,
And the other of the imaging members is provided at a position where the entire top surface of the blade can be photographed. The method of claim 3,
The wafer transfer controller includes:
An image storage unit for receiving the image data from the image pickup member and storing the received image data;
An image comparison unit comparing the image data provided from the image storage unit with the set normal data; And
And a determination unit for determining an error from the comparison result of the image comparison unit. 10. The method of claim 9,
Wherein the image storage unit further comprises an additional storage unit for storing the set data. 11. The method of claim 10,
Wherein the additional storage comprises a reference line for indicating the position and spacing of the blade in the steady state, a reference line for indicating the distance between the guide slot and the position of the wafer carrier, a reference line for indicating the distance between the guide slot and the position of the wafer boat, A wafer carrier, and a reference line indicative of the position of the wafers mounted on the wafer boat. 12. The method of claim 11,
Wherein the image comparing unit overlaps the image photographed from the image pick-up member with a reference line corresponding to the image and outputs the comparison result. The method of claim 3,
An alarm unit driven in response to the error control signal and configured to inform the manager of errors in the transfer member, the wafer, the wafer carrier, or the wafer boat; And
And a correction unit configured to correct a portion where an abnormality has occurred in response to the error control signal. 14. The method of claim 13,
Wherein the correcting unit causes the wafers to elapse for a predetermined time in a state in which the wafers are generated on the wafers and the operation of the carrying member is stopped when an error control signal for the wafer abnormality is generated, To restart the operation of the wafer transfer apparatus. A transferring member for transferring a plurality of wafers between the wafer carrier and the wafer boat in the substrate processing apparatus;
An image pickup member positioned adjacent to the transfer member and configured to image the transfer member, the plurality of wafers, the inside of the wafer carrier, and the inside of the wafer boat;
A wafer transfer controller configured to receive image data from the imaging member, compare the set normal data with the image data, and output an error control signal;
An operation stop unit for temporarily stopping the conveying member in response to the error control signal; And
And a correction unit configured to correct a portion where an abnormality has occurred in response to the error control signal. 16. The method of claim 15,
Wherein a plurality of imaging members are provided,
Wherein one of the imaging members is positioned to image the inter-branch spacing of the stacked blades, the spacing between guide slots in the wafer carrier, and the spacing between guide slots in the wafer boat,
And the other of the imaging members is positioned to photograph the side of the wafer mounted in the wafer carrier or the wafer boat for taking a picture of whether or not wafers have been generated on the wafer,
And another one of the imaging members is positioned to photograph an upper surface of the blade. 16. The method of claim 15,
The wafer transfer controller includes:
An image storage unit for receiving the image data from the image pickup member and storing the received image data;
An image comparison unit comparing the image data provided from the image storage unit with the set normal data; And
And a determination unit for determining an error from the comparison result of the image comparison unit. 18. The method of claim 17,
Wherein the additional storage comprises a reference line for indicating the position and spacing of the blade in the steady state, a reference line for indicating the distance between the guide slot and the position of the wafer carrier, a reference line for indicating the distance between the guide slot and the position of the wafer boat, A wafer carrier, and a further storage configured to store a reference line indicative of a position of the wafer mounted on the wafer carrier and the wafer boat, 16. The method of claim 15,
Further comprising a warning unit driven in response to the error control signal and configured to inform the manager of an error in the transfer member, the wafer, the wafer carrier, or the wafer boat. 16. The method of claim 15,
Wherein the correcting unit causes the wafers to elapse for a predetermined time in a state in which the wafers are generated on the wafers and the operation of the carrying member is stopped when an error control signal for the wafer abnormality is generated, To restart the operation of the wafer transfer apparatus.
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108878329A (en) * 2018-07-19 2018-11-23 深圳市捷佳伟创新能源装备股份有限公司 For detecting the detection device, silicon wafer processing system and detection method of position of silicon wafer
CN113764321A (en) * 2021-08-10 2021-12-07 天津爱旭太阳能科技有限公司 Quartz boat loading and unloading device, processing system and control method
US20220044947A1 (en) * 2020-08-05 2022-02-10 Winbond Electronics Corp. Transportation monitoring method and system thereof
WO2023210561A1 (en) * 2022-04-27 2023-11-02 川崎重工業株式会社 Semiconductor manufacturing device system
WO2023210560A1 (en) * 2022-04-27 2023-11-02 川崎重工業株式会社 Semiconductor manufacturing device system
CN117352441A (en) * 2023-12-06 2024-01-05 华芯(武汉)智能装备有限公司 Wafer scanning device and scanning method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108878329A (en) * 2018-07-19 2018-11-23 深圳市捷佳伟创新能源装备股份有限公司 For detecting the detection device, silicon wafer processing system and detection method of position of silicon wafer
US20220044947A1 (en) * 2020-08-05 2022-02-10 Winbond Electronics Corp. Transportation monitoring method and system thereof
CN113764321A (en) * 2021-08-10 2021-12-07 天津爱旭太阳能科技有限公司 Quartz boat loading and unloading device, processing system and control method
WO2023210561A1 (en) * 2022-04-27 2023-11-02 川崎重工業株式会社 Semiconductor manufacturing device system
WO2023210560A1 (en) * 2022-04-27 2023-11-02 川崎重工業株式会社 Semiconductor manufacturing device system
CN117352441A (en) * 2023-12-06 2024-01-05 华芯(武汉)智能装备有限公司 Wafer scanning device and scanning method thereof
CN117352441B (en) * 2023-12-06 2024-02-09 华芯(武汉)智能装备有限公司 Wafer scanning device and scanning method thereof

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