CN116148623A

CN116148623A - LED intelligent testing device and testing method thereof

Info

Publication number: CN116148623A
Application number: CN202310286956.1A
Authority: CN
Inventors: 吴浩; 高海峰; 田晗
Original assignee: Shenzhen Xiwo Intelligent Control Technology Co ltd
Current assignee: Shenzhen Xiwo Intelligent Control Technology Co ltd
Priority date: 2023-03-23
Filing date: 2023-03-23
Publication date: 2023-05-23
Anticipated expiration: 2043-03-23
Also published as: CN116148623B

Abstract

The invention discloses an LED intelligent testing device and a testing method thereof, wherein the testing device comprises a testing rack and a control system, a mounting frame is arranged in the testing rack, a mounting plate is arranged at the top of the mounting frame, a telescopic cylinder is fixedly arranged on the mounting plate, the output end of the telescopic cylinder is connected with one end of a telescopic rod in a matched manner, the other end of the telescopic rod is connected with a connecting plate in a matched manner, a butt joint disc is fixedly arranged on the connecting plate, a butt joint groove is formed in the butt joint disc, a plurality of mounting holes are formed in the bottom of the butt joint groove at preset positions, and a butt joint mechanism is arranged in each mounting hole; four groups of linear bearings are further mounted on the mounting plate, limiting rods are connected to the linear bearings in a sliding mode, the LED crystal disc testing device can achieve the function of full testing or drawing testing of the LED crystal disc, testing time can be shortened to a great extent, and testing efficiency is improved.

Description

LED intelligent testing device and testing method thereof

Technical Field

The invention relates to the technical field of LED testing, in particular to an LED intelligent testing device and a testing method thereof.

Background

Light emitting diodes, simply referred to as LEDs, are increasingly being produced and demanded by LED applications, and thus, pressure is also being placed on conventional LED testing systems. LED spot measurement is an important ring in the LED production process, and penetrates through the whole LED industry chain. After the LED wafer is packaged, the packaged LED wafer needs to be tested. In the conventional LED wafer testing device, an LED wafer disc is placed on a bearing disc of the testing device in the testing process, and then the bearing disc is driven to correspondingly move, so that each LED crystal grain on the LED wafer disc is spotted by an anode testing rod and a cathode testing rod. However, in the actual testing process, the moving time of the control bearing disc is often much longer than the spot testing time of the positive electrode test rod and the negative electrode test rod, and because the number of the LED crystal grains on each LED crystal disc is numerous, the test time of the LED crystal grains on the LED crystal disc is too long, so that the test efficiency is too low, and the test device cannot meet the test yield requirement.

Disclosure of Invention

The invention overcomes the defects of the prior art and provides an LED intelligent testing device and a testing method thereof.

The technical scheme adopted by the invention for achieving the purpose is as follows:

the invention discloses an LED intelligent testing device, which comprises a testing rack and a control system, wherein a mounting frame is arranged in the testing rack, a mounting plate is arranged at the top of the mounting frame, a telescopic cylinder is fixedly arranged on the mounting plate, the output end of the telescopic cylinder is connected with one end of a telescopic rod in a matched manner, the other end of the telescopic rod is connected with a connecting plate in a matched manner, a butt joint disc is fixedly arranged on the connecting plate, a butt joint groove is formed in the butt joint disc, a plurality of mounting holes are formed in the bottom of the butt joint groove at preset positions, and a butt joint mechanism is arranged in each mounting hole; the mounting plate is also provided with four groups of linear bearings, the linear bearings are connected with a limiting rod in a sliding manner, the top end of the limiting rod is provided with a limiting plate, and the bottom end of the limiting rod is fixedly connected with the connecting plate;

the bottom of the mounting frame is provided with a bearing disc, the bearing disc is provided with a bearing groove, the side edge of the bearing groove is provided with a positioning notch, the bottom of the bearing groove is provided with a plurality of adjusting holes at preset positions, and an electric heating device is arranged in each adjusting hole;

The butt joint mechanism comprises a mounting shell, wherein the mounting shell is fixedly arranged in the mounting hole, a first cover plate and a second cover plate are respectively arranged at two ends of the mounting shell, an inductor is fixedly arranged on the first cover plate, a first butt joint plate is slidably connected in the mounting shell, the bottom end of the first butt joint plate is fixedly connected with one end of a connecting rod, a second butt joint plate is fixedly connected with the other end of the connecting rod, and a positive electrode test rod and a negative electrode test rod are arranged on the second butt joint plate;

the installation shell is internally provided with a plurality of butt joint springs, the top ends of the butt joint springs are fixedly connected with the second butt joint plate, and the bottom ends of the butt joint springs are fixedly connected with the second cover plate.

Preferably, in a preferred embodiment of the present invention, the docking mechanism includes a mounting housing, the mounting housing is fixedly mounted in the mounting hole, two ends of the mounting housing are respectively provided with a first cover plate and a second cover plate, an inductor is fixedly mounted on the first cover plate, a first docking plate is slidably connected in the mounting housing, a bottom end of the first docking plate is fixedly connected with one end of a connecting rod, a second docking plate is fixedly connected with the other end of the connecting rod, and a positive test rod and a negative test rod are mounted on the second docking plate.

Preferably, in a preferred embodiment of the present invention, a plurality of docking springs are further disposed in the installation housing, the top ends of the docking springs are fixedly connected with the second docking plate, and the bottom ends of the docking springs are fixedly connected with the second cover plate.

Preferably, in a preferred embodiment of the present invention, a first through hole and a second through hole are formed in the second cover plate, a first needle cleaning sleeve is fixedly installed on the first through hole, a second needle cleaning sleeve is fixedly installed on the second through hole, an axis of the first needle cleaning sleeve coincides with an axis of the positive electrode test rod, and an axis of the second needle cleaning sleeve coincides with an axis of the negative electrode test rod.

Preferably, in a preferred embodiment of the present invention, the test apparatus further includes a first power supply module, the inductors are electrically connected to the first power supply module through first wires, and power-off switches are disposed on the first wires, and the power-off switches are in signal connection with the control system.

Preferably, in a preferred embodiment of the present invention, the bottom of each of the adjusting holes is provided with a vent hole, each vent hole is connected with an air inlet pipe, the test rack is provided with an air supply tank, the air supply tank is connected with an air outlet pipe, the other end of the air outlet pipe is connected with an air collecting cavity, the other end of the air inlet pipe is connected with the air collecting cavity, each air inlet pipe is sleeved with an electric control valve, and the electric control valve is in signal connection with the control system.

Preferably, in a preferred embodiment of the present invention, a temperature sensor and an air pressure sensor are further disposed in the adjusting hole, the temperature sensor is used for detecting temperature information in the adjusting hole, and the air pressure sensor is used for detecting air pressure information in the adjusting hole.

Preferably, in a preferred embodiment of the present invention, the testing device further includes a second power supply module, the positive test bar and the negative test bar are electrically connected to the second power supply module through a second wire, and a current sensor is disposed on the second wire.

The invention also discloses a testing method of the LED intelligent testing device, which is applied to any one of the LED intelligent testing devices and comprises the following steps:

acquiring preset current values corresponding to the LED crystal grains to be tested under different testing conditions according to the big data, constructing a knowledge graph, and importing the preset current values corresponding to the LED crystal grains under different testing conditions into the knowledge graph; wherein the test conditions include a test temperature and a test voltage;

acquiring test schedule information, generating a test control instruction based on the test schedule information, and controlling the telescopic cylinder to start based on the test control instruction so as to drive the telescopic rod to move downwards by a preset distance through the telescopic cylinder;

Acquiring current test condition information, and importing the current test condition information into the knowledge graph to obtain a standard current value corresponding to the LED crystal grain to be tested under the current test condition;

controlling the power-off of a preset inductor based on the test control instruction, so that an anode test rod and a cathode test rod on a preset docking mechanism are docked with a preset LED crystal grain to be tested, so as to provide test current for the LED crystal grain to be tested, and acquiring an actual current value on a current sensor;

comparing the actual current value with a standard current value to obtain a current deviation value, and judging whether the current deviation value is larger than a preset threshold value or not; and if the current deviation value is larger than a preset threshold value, judging the LED crystal grain as a defective product, and marking the LED crystal grain as a crystal grain defective product.

Preferably, in a preferred embodiment of the present invention, the method further comprises the steps of:

if the current deviation value is not greater than a preset threshold value, applying a voltage value with a preset size to the LED crystal grain at a preset moment point, and recording the preset moment point as a first moment point;

acquiring an actual temperature value measured by a temperature sensor at each moment, comparing the actual temperature value with a preset temperature value, and recording the moment as a second moment when the actual temperature value is equal to the preset temperature value;

Performing difference value operation processing on the second moment point and the first moment point to obtain an actual heating time value; performing difference value operation processing on the actual heating time value and a preset time value to obtain a time deviation value; judging whether the time deviation value is larger than a preset threshold value or not;

if the time deviation value is not greater than a preset threshold value, judging the LED crystal grain as a qualified product;

if the time deviation value is larger than a preset threshold value, judging whether the time deviation value is positive or negative;

if the time deviation value is positive, the LED crystal grain is judged to be a defective product, and the LED crystal grain is marked to be an oversized crystal grain product; and if the time deviation value is negative, judging the LED die as a defective product, and marking the LED die as an oversized die.

The invention solves the technical defects existing in the background technology, and has the following beneficial effects: this intelligent testing device can carry out the break-make through the inductor on the corresponding docking mechanism to control and correspond anodal test rod and negative pole test rod in the docking mechanism and stretch out or withdraw, with the test rod test array of arranging different intervals, different shapes, thereby can realize full test or take out the function of surveying to the LED brilliant disc through this device, can greatly shorten test time, and then improve efficiency of software testing, and this docking mechanism's control process is simple, easily assembles, and it possesses higher using value at automatic test mill. In addition, through this intelligent testing arrangement can once only test out whether LED crystal grain is qualified at normal atmospheric temperature, low temperature, its performance under the high temperature, improved test efficiency, realized this device and realized the integration test, can further reduce test equipment's purchase cost, improve economic benefits.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other embodiments of the drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the overall structure of the present test apparatus;

FIG. 2 is a schematic diagram of the internal structure of the present test apparatus;

FIG. 3 is a schematic structural view of the docking mechanism in the present test apparatus in a fully tested state;

FIG. 4 is a schematic structural view of a docking mechanism in a testing device in a spot test state;

FIG. 5 is a schematic view of a carrier tray;

FIG. 6 is a schematic view of a positioning slot;

FIG. 7 is a schematic structural view of the air converging chamber;

FIG. 8 is a schematic overall structure of the docking structure;

FIG. 9 is a schematic view of the internal structure of the docking mechanism;

FIG. 10 is a schematic view of the internal structure of the docking mechanism when the inductor is in the power-off state;

FIG. 11 is a schematic view of the internal structure of the docking mechanism when the inductor is in an energized state;

the reference numerals are explained as follows: 101. a test rack; 102. a control system; 103. a mounting frame; 104. a telescopic cylinder; 105. a telescopic rod; 106. a connecting plate; 107. a butt joint disc; 108. a butt joint groove; 109. a docking mechanism; 201. a linear bearing; 202. a limit rod; 203. a limiting plate; 204. a carrying tray; 205. a carrying groove; 206. positioning the notch; 207. LED crystal disc; 208. a positioning strip; 209. a mounting shell; 301. a first cover plate; 302. a second cover plate; 303. an inductor; 304. a first butt plate; 305. a connecting rod; 306. a second butt plate; 307. a positive electrode test bar; 308. a negative electrode test bar; 309. a butt-joint spring; 401. a first needle cleaning sleeve; 402. a second needle cleaning sleeve; 403. an adjustment aperture; 404. an electric heating device; 405. a vent hole; 406. an air inlet pipe; 407. a gas supply tank; 408. an air outlet pipe; 409. an air converging cavity; 501. an electric control valve.

Detailed Description

In order that the above objects, features and advantages of the invention will be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings and detailed description thereof, which are simplified schematic drawings which illustrate only the basic structure of the invention and therefore show only those features which are relevant to the invention, it being noted that embodiments and features of the embodiments may be combined with each other without conflict.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may include one or more of the feature, either explicitly or implicitly. In the description of the invention, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application can be understood by those of ordinary skill in the art in a specific context.

In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

As shown in fig. 1 and 2, the invention discloses an intelligent LED testing device, the testing device comprises a testing machine frame 101 and a control system 102, a mounting frame 103 is arranged in the testing machine frame 101, a mounting plate is arranged at the top of the mounting frame 103, a telescopic cylinder 104 is fixedly arranged on the mounting plate, the output end of the telescopic cylinder 104 is matched and connected with one end of a telescopic rod 105, the other end of the telescopic rod 105 is matched and connected with a connecting plate 106, a docking tray 107 is fixedly arranged on the connecting plate 106, as shown in fig. 3 and 4, a docking groove 108 is formed in the docking tray 107, a plurality of mounting holes are formed in the bottom of the docking groove 108 at preset positions, and docking mechanisms 109 are arranged in the plurality of mounting holes; four groups of linear bearings 201 are further mounted on the mounting plate, limiting rods 202 are connected to the linear bearings 201 in a sliding mode, limiting plates 203 are arranged on the top ends of the limiting rods 202, and the bottom ends of the limiting rods 202 are fixedly connected with the connecting plates 106. It should be noted that the diameter of the docking slot 108 is equal to the diameter of the LED die disc 207.

As shown in fig. 5 and 6, a bearing plate 204 is disposed at the bottom of the mounting frame 103, a bearing groove 205 is formed on the bearing plate 204, and a positioning notch 206 is formed on a side edge of the bearing groove 205.

It should be noted that, when the die on the LED die disc 207 needs to be tested, the LED die disc 207 to be tested may be placed in the carrying groove 205 of the carrying disc 204 by means of a manual or industrial manipulator, and the positioning strip 208 of the LED die disc 207 needs to be embedded in the positioning slot 206 of the carrying disc 204 during the placement process, so as to position the LED die disc 207, so that the test bars of the subsequent docking mechanisms 109 are precisely docked with the corresponding die on the LED die disc 207, so as to ensure that the positive test bars 307 and the negative test bars 308 can be precisely docked at the preset test positions of the LED die disc 207 during the test, so as to improve the reliability of the test result.

When the LED crystal disc 207 is placed in the bearing groove 205, the telescopic cylinder 104 is controlled to be started, so that the telescopic rod 105 is driven to move downwards by a preset distance through the telescopic cylinder 104, and the docking disc 107 is driven to move downwards by a preset distance, so that the docking groove 108 is covered on the LED crystal disc 207 to be tested; then the control system 102 obtains the position information of the LED die to be tested on the LED die disc 207, then the control system 102 generates corresponding test information such as test position, test interval, test current or voltage according to the position information of the LED die to be tested, and after the test information is generated, the corresponding inductors 303 in the docking mechanisms 109 are controlled to be turned on and off correspondingly, so that the positive test bars 307 and the negative test bars 308 in the docking mechanisms 109 extend or retract to arrange the test bar array of the test interval generated by the control system 102, and the specific LED die on the LED die disc 207 is tested; then, inputting required test current or test voltage to the positive electrode test bar 307 and the negative electrode test bar 308 in the corresponding docking mechanism 109 in sequence, and further performing spot measurement on preset LED crystal grains on the LED crystal disc 207; and then corresponding signals are acquired through a current sensor and a temperature sensor, so that whether the preset LED crystal grains are qualified or not is detected, and the testing process of the LED crystal disc 207 is finished. To sum up, when needs carry out the test to LED brilliant disc 207, this intelligent testing arrangement can be through the inductor 303 on the corresponding docking mechanism 109 of control switching on and off, with control positive pole test stick 307 and negative pole test stick 308 stretch out or withdraw in the corresponding docking mechanism 109, with the test stick test array of arranging different intervals, different shapes, thereby can realize full test or take out the function of surveying to LED brilliant disc 207 through this device, can greatly shorten test time, and then improve efficiency of software testing, and can arrange different test stick test arrays, with satisfying more test situation demands, the test range is wider, the practicality is better.

In addition, it should be noted that in the process of driving the docking tray 107 to descend through the telescopic cylinder 104, the docking tray 107 can be limited through the linear bearing 201 and the limiting rod 202, so that the situation that the docking tray 107 is offset in the descending process is avoided, the docking tray 107 can be accurately embedded in the LED crystal disc 207, the docking precision of each positive electrode test rod 307 and each negative electrode test rod 308 in subsequent docking with the LED crystal grains is improved, and the reliability of the testing device is further improved. In addition, the descending position of the limiting rod 202 is limited by a limiting block, so that the descending travel of the telescopic rod 105 is limited, and collision accidents are avoided.

As shown in fig. 8 and 9, the docking mechanism 109 includes a mounting housing 209, the mounting housing 209 is fixedly mounted in the mounting hole, two ends of the mounting housing 209 are respectively provided with a first cover plate 301 and a second cover plate 302, an inductor 303 is fixedly mounted on the first cover plate 301, a first docking plate 304 is slidably connected to the mounting housing 209, a bottom end of the first docking plate 304 is fixedly connected with one end of a connecting rod 305, a second docking plate 306 is fixedly connected with the other end of the connecting rod 305, and a positive test rod 307 and a negative test rod 308 are mounted on the second docking plate 306. It should be noted that the first butt plate 304 is made of a ferrous material; the second butt plate 306 is made of hard rubber insulating material; the positive electrode test bar 307 and the negative electrode test bar 308 are made of copper conductive materials; the inductor 303 is capable of generating a magnetic force when the inductor 303 is energized, and the inductor 303 loses the magnetic force when the inductor 303 is de-energized.

A plurality of docking springs 309 are further disposed in the mounting housing 209, a top end of the docking springs 309 is fixedly connected with the second docking plate 306, and a bottom end of the docking springs 309 is fixedly connected with the second cover plate 302. Note that the docking springs 309 are provided in four, respectively provided on four sides of the second docking plate 306.

The testing device further comprises a first power supply module, the inductors 303 are electrically connected with the first power supply module through first wires, and power-off switches are arranged on the first wires and are in signal connection with the control system 102.

The testing device further comprises a second power supply module, the positive electrode testing rod 307 and the negative electrode testing rod 308 are electrically connected with the second power supply module through second wires, and current sensors are arranged on the second wires.

It should be noted that, by controlling the inductor 303 on the corresponding docking mechanism 109 to turn on and off, the positive test rod 307 and the negative test rod 308 in the corresponding docking mechanism 109 are controlled to extend or retract, so as to arrange test rod test arrays with different intervals and different shapes, and the implementation principle and implementation process are as follows: when the positive test bar 307 and the negative test bar 308 on a certain docking mechanism 109 are required to be retracted into the mounting housing 209, as shown in fig. 11, the power-off switch corresponding to the first wire on the docking mechanism 109 is controlled to be closed, so that the current of the first power supply module is conducted to the inductor 303 on the docking mechanism 109, so that the inductor 303 on the docking mechanism 109 is electrified, the inductor 303 generates magnetic force, the inductor 303 after generating the magnetic force absorbs the first docking plate 304, and the docking spring 309 is in a stretched state when the first docking plate 304 is absorbed by the inductor 303; and in the process that the first butt-joint plate 304 is absorbed by the inductor 303, the first butt-joint plate 304 pulls the connecting rod 305 to slide upwards along the mounting shell 209 together, so as to pull the second butt-joint plate 306 to slide upwards along the mounting shell 209, at this time, the positive test rod 307 and the negative test rod 308 are retracted into the mounting shell 209, at this time, during testing, the positive test rod 307 and the negative test rod are not in butt joint with corresponding crystal grains on the LED crystal disc 207, at this time, the crystal grains on the position of the LED crystal disc 207 are not subjected to conduction testing, and therefore, the selective conduction testing of crystal grains on certain positions on the LED crystal disc 207 is realized, so that more testing requirements are met.

Similarly, when the positive test bar 307 and the negative test bar 308 on a certain docking mechanism 109 need to be extended out of the mounting housing 209, as shown in fig. 10, the power-off switch corresponding to the first wire on the docking mechanism 109 is controlled to be turned off, so that the current of the first power supply module is disconnected from the inductor 303 on the docking mechanism 109, so that the inductor 303 on the docking mechanism 109 is powered off, the inductor 303 loses magnetic force, the inductor 303 loses adsorption action on the first docking plate 304 after losing magnetic force, the docking spring 309 in a stretched state is rebound and reset, and when the docking spring 309 is rebound and reset, the second docking plate 306 is pulled to slide downwards along the mounting housing 209, so that the positive test bar 307 and the negative test bar 308 are pulled to move downwards along the mounting housing 209, at this time, the positive test bar 307 and the negative test bar 308 extend out of the mounting housing, at this time, the positive test bar 307 and the negative test bar 303 are in butt joint with corresponding crystal grains on the LED crystal disc 207, at this time, the crystal grains on the LED crystal disc 207 can be tested by the positive test bar 307 and the negative test bar 308, and the crystal test disc 207 can be tested at some crystal grains on the position of the LED crystal disc 207 can be tested, and the crystal position of the LED crystal disc 207 can be tested more than the crystal disc can be tested, and the requirement of the crystal position of the crystal is more can be met. It should be noted that, when the positive test bar 307 and the negative test bar 308 are in butt joint with a certain die on the LED die disc 207, the current on the second power supply module is conducted to the die, and the testing process can be implemented on the die by obtaining the photoelectric characteristic parameters of the die.

In summary, the inductors 303 on the corresponding docking mechanism 109 are controlled to be powered on and powered off, so that the positive test bars 307 and the negative test bars 308 in the corresponding docking mechanism 109 are controlled to extend or retract, so that test bar test arrays with different intervals and different shapes are arranged, and the full test or extraction test function of the LED crystal disc 207 can be realized through the device, so that the test time can be greatly shortened, and the test efficiency is further improved. In addition, the number of the docking mechanisms 109 required to be used in the device is large, so that the docking mechanisms 109 adopt the inductors 303 and the docking springs 309 as power components, compared with power elements such as cylinders or motors, the total manufacturing cost of the device can be greatly reduced, the control process of the docking mechanisms 109 is simple, the assembly is easy, and the docking mechanisms have higher application value in an automatic test factory.

As shown in fig. 8 and 9, the second cover plate 302 is provided with a first through hole and a second through hole, a first needle cleaning sleeve 401 is fixedly installed on the first through hole, a second needle cleaning sleeve 402 is fixedly installed on the second through hole, the axis of the first needle cleaning sleeve 401 coincides with the axis of the positive electrode test rod 307, and the axis of the second needle cleaning sleeve 402 coincides with the axis of the negative electrode test rod 308.

It should be noted that, in the process of testing the LED wafer, after the positive electrode test bar 307 and the negative electrode test bar 308 are tested for a long time, the needle tip will adsorb pollutants (various fragments), so as to greatly increase the resistance of the needle tip, thereby reducing the current that the needle tip can bear, and if the load is larger, the energy accumulated by the needle tip is too large, the needle burning phenomenon will be caused, so that the service lives of the positive electrode test bar 307 and the negative electrode test bar 308 are reduced; in addition, after the burn-in phenomenon occurs, if the pollutants adhered to the needle point area are not removed completely, the phenomenon of 'cut-off' is further caused, so that the current of the second power supply module cannot be conducted with the tested crystal grain, and further the misjudgment phenomenon is caused, and the test result is seriously influenced. Therefore, how to automatically, effectively and efficiently "purge the needle" for the positive test stick 307 and the negative test stick 308 during the test has been a constant disturbance to the technician. In view of this, be provided with first clear needle sleeve 401 and the clear needle sleeve 402 of second in the docking mechanism 109 of this device, and first clear needle sleeve 401 and the clear needle sleeve 402 of second adopt elastic rubber material to make, when carrying out the circular telegram through the inductor 303 on control docking mechanism 109, in order to drive anodal test rod 307 and the inside in process of installation casing 209 of anodal test rod 308 withdrawal, can strike off the pollutant that adheres to anodal test rod 307 and negative pole test rod 308 through first clear needle sleeve 401 and clear needle sleeve 402 of second, thereby realized automatic "clear needle" process, and "clear needle" process is the process that utilizes just needs to withdraw anodal test rod 307 and negative pole test rod 308 to install casing 209 in originally, realized that the needle is clear while testing, do not need additionally to add clear needle device, resource utilization degree has been improved.

As shown in fig. 6, a plurality of adjusting holes 403 are formed at the bottom of the bearing groove 205 at preset positions. An electric heating device 404 is arranged in the adjusting hole 403. It should be noted that the electric heating device 404 may be an existing device such as a heating wire. It should be noted that, the spacing positions of the plurality of adjusting holes 403 are corresponding to the die spacing positions on the LED wafer one by one, and the sizes and shapes of the adjusting holes 403 are equal to the corresponding die sizes and shapes.

As shown in fig. 6 and 7, the bottom of the adjusting hole 403 is provided with a vent hole 405, the vent holes 405 are all connected with an air inlet pipe 406, the test rack 101 is provided with an air supply tank 407, the air supply tank 407 is connected with an air outlet pipe 408, the other end of the air outlet pipe 408 is connected with an air collecting cavity 409, the other end of the air inlet pipe 406 is connected with the air collecting cavity 409, the air inlet pipe 406 is sleeved with an electric control valve 501, and the electric control valve 501 is in signal connection with the control system 102. Note that the gas supply tank 407 is used for storing a cooling gas such as low-temperature nitrogen gas or the like. Note that a suction pump may be provided on the gas outlet pipe 408 to suck out the cooling gas in the gas supply tank 407 by the suction pump.

A temperature sensor and an air pressure sensor are further arranged in the adjusting hole 403, the temperature sensor is used for detecting temperature information in the adjusting hole 403, and the air pressure sensor is used for detecting air pressure information in the adjusting hole 403.

It should be noted that, the photoelectric characteristics of the LED die at different temperatures (such as the characteristics of charge defects and carriers under different temperature conditions) are different, so that the working performances of the LED die at different working temperature environments are different, and in order to test whether the working performances of the LED die at different temperature conditions reach the standard or not, so as to test whether the performances of the LED die at different working temperatures can reach the use standard or not, a temperature change testing mechanism is provided in the device. Specifically, if the working performance of a certain LED die is tested to be unqualified under the normal temperature condition, the electric heating device 404 in the adjusting hole 403 corresponding to the LED die can be controlled to be started at this time, so that the air in the adjusting hole 403 is heated by the electric heating device 404, and when the temperature sensor in the adjusting hole 403 detects that the internal temperature reaches the preset temperature value (simulates the high-temperature working environment of the LED die), the corresponding docking mechanism 109 is controlled to conduct the conduction test on the LED die, if the performance of the LED die measured under the high-temperature working environment is qualified, the LED die is unqualified under the normal temperature working environment, but the performance of the LED die is qualified under the high-temperature working environment, and the LED die is marked as a high Wen Gege product at this time.

If the performance of the LED die is also not acceptable in the high temperature working environment, the electronic control valve 501 of the air inlet pipe 406 of the corresponding adjusting hole 403 may be controlled to be opened, and the air pump may be controlled to be started, so as to convey the cooling air stored in the air supply tank 407 into the adjusting hole 403, to lower the temperature of the adjusting hole 403 to a preset temperature (simulate the low temperature working environment of the LED die) by the cooling air, and then to continuously control the corresponding docking mechanism 109 to conduct the conduction test on the LED die, if the performance of the LED die measured in the low temperature working environment is acceptable, it is indicated that the LED die is not acceptable in the normal temperature and high temperature working environment, but the performance is acceptable in the low temperature working environment, and the LED die is marked as a low temperature acceptable product. It should be noted that if the measured LED die fails in performance at normal temperature, low temperature, and high temperature, the die is marked as a reject.

In summary, through this intelligent testing device can once only test out whether LED die is qualified at normal atmospheric temperature, low temperature, high temperature its performance, for traditional normal atmospheric temperature, low temperature, high temperature extension and segmentation testing arrangement, can save unnecessary last unloading step, improved test efficiency to realized this device and realized the integration test, can further reduce test equipment's purchase cost, improve economic benefits.

It should be noted that, the present device may also perform an airtight performance test on an LED die, specifically, when the airtight performance of a certain grain on the LED die disc 207 needs to be tested, control the electronic control valve 501 on the air inlet pipe 406 corresponding to the bottom of the LED die to be opened, and control the air pump to start, so that the air stored in the air supply tank 407 is pumped into the air collecting cavity 409 along the air outlet pipe 408 by the air pump, then the air flows into the corresponding air inlet pipe 406 from the air collecting cavity 409, then flows into the adjusting hole 403 along the air inlet pipe 406, and in this process, the air pressure value information inside the adjusting hole 403 is detected and fed back in real time by the air pressure sensor, after the air pressure value reaches the preset air pressure value, the electronic control valve 501 on the corresponding air inlet pipe 406 is controlled to be closed, and the air pump is controlled to stop, and then the actual air pressure value inside the adjusting hole 403 is obtained by the air pressure sensor after the preset time; and comparing the actual air pressure value with a preset air pressure value to obtain an air pressure difference value, and if the air pressure difference value is larger than a preset threshold value, determining that the air tightness of the LED crystal grain is unqualified.

It should be noted that, the test schedule information is formulated in advance by a designer, and the test schedule information includes specific test schedule information, such as a test position, a test current, a test voltage, and the like, for the LED wafer to be tested. The current test condition information is the ambient temperature of the current test machine, the actual test voltage when the LED crystal grain is tested, and the like.

The on-current and the test temperature of the LED die are related to the test voltage, and the larger the test voltage applied to the LED die in a certain range, the larger the current flowing through the LED die. In addition, when the working environment of the LED crystal grain is increased, the electric conduction performance of the LED crystal grain is enhanced, because the LED crystal grain is positive in temperature coefficient, valence electrons acquire more energy when the temperature is increased, and break loose constraint to become free electrons, so that the electric conduction performance is enhanced. In order to eliminate the influence of the temperature of the test environment on the test result, firstly, obtaining a preset current value corresponding to the LED crystal grain to be tested under different test conditions according to big data, and constructing a corresponding knowledge graph, so that a current deviation value is obtained by comparing the actual current value with a standard current value, and whether the current deviation value is larger than a preset threshold value is judged; if the current deviation value is greater than the preset threshold value, it can be stated that when the positive electrode test bar is in butt joint with the negative electrode test bar and the LED crystal grain, the deviation between the loop current of the crystal grain and the normal value is too large, and it is stated that the inside of the crystal grain has too many defects such as impurities, cracks, air holes and the like, the LED crystal grain is judged to be a defective product, and the defective product is marked as a crystal grain defective product. The method can test whether the internal structure of the LED crystal grain is qualified or not.

If the current deviation value is not greater than the preset threshold, it can be stated that the loop current of the die is normal, the internal structure of the die is normal, the die is further tested, specifically, a strong voltage is applied to the LED die at a preset moment, the LED die has a strong current to pass through, the LED die continuously generates heat at the moment, in the process, the actual temperature value measured by the temperature sensor in the adjusting hole corresponding to the die at each moment is obtained, so as to obtain the actual heating time value, and further the time deviation value is calculated; if the time deviation value is not greater than the preset threshold value, it can be stated that after the strong voltage is applied to the crystal grain, the temperature rising time range of the crystal grain is normal, and the resistance value of the LED crystal grain is normal, and the LED crystal grain is judged to be a qualified product; if the time deviation value is larger than a preset threshold value, further judging whether the time deviation value is positive or negative; if the time deviation value is positive, it can be stated that, after the strong voltage is applied to the LED die, the temperature rise time of the LED die is too fast, and the resistance value of the LED die is too large, the LED die is determined as a defective product, and is marked as a die oversize product; if the time deviation value is a negative value, it may be stated that, after a strong voltage is applied to the LED die, the temperature rise time of the LED die is too slow, and that the resistance value of the LED die is too small, the LED die is determined to be a defective product, and is marked as a die too small product. The method can test whether the outline dimension of the LED crystal grain is qualified or not.

In addition, the testing method of the LED intelligent testing device further comprises the following steps:

acquiring eddy current characteristic information fed back by an LED crystal grain to be tested in the test process, and carrying out numerical simulation analysis on the eddy current characteristic signal to obtain a defect eddy current signal;

determining the type of the defect, the length of the defect, the depth of the defect and the width of the defect based on the defect eddy current signal; constructing a simulated grain three-dimensional model diagram according to the type of the defect, the length of the defect, the depth of the defect and the width of the defect;

extracting a total volume value of the defect from the simulated crystal grain three-dimensional model diagram, and calculating a defect concentration value based on the total volume value of the defect;

judging whether the defect concentration value is larger than a preset defect concentration value, if not, judging the LED crystal grain as a qualified product, and if so, further judging the LED crystal grain.

In the process of processing and producing the LED wafer disc, defects such as cracks, pores, pits, impurities and the like are inevitably generated in the LED crystal grains, and when the defect concentration value in the LED crystal grains is too large in the LED crystal grains, the photoelectric performance of the LED crystal grains is greatly influenced, so that the defect concentration of the LED crystal grains needs to be detected.

In the process of conducting the test on the LED crystal grain through the positive electrode test rod and the negative electrode test rod, eddy current characteristic information of the LED crystal grain can be obtained through an eddy current probe, and the eddy current characteristic information comprises the conductivity of the crystal grain, the conductivity of the defect and scalar potential component values of the defect position. The larger the size of the defect, the larger the scalar potential component value thereof, and the smaller the conductivity. When the eddy current characteristic signals are subjected to numerical simulation analysis to obtain defect eddy current signals, information such as defect type, defect length, defect depth and defect width can be obtained, and then a simulated crystal grain three-dimensional model diagram is constructed by utilizing three-dimensional modeling software such as SolidWorks, UG, proe based on the information, wherein the simulated crystal grain three-dimensional model diagram can be understood as a three-dimensional model diagram capable of standardizing the external and internal structures of the LED crystal grains; then comparing the total volume value of the defects with the total volume value of the LED crystal grains to obtain the defect concentration value of the LED crystal grains; if the defect concentration value is smaller than the preset defect concentration value, the defect concentration of the LED crystal grain is in an allowable range, and the LED crystal grain is qualified.

If the LED crystal grain is larger than the preset threshold value, the LED crystal grain is further judged, and the method specifically comprises the following steps of:

acquiring processing engineering drawing information of the LED crystal grain, and constructing a simulated and processed crystal grain three-dimensional model drawing based on the processing engineering drawing information;

constructing an integrated coordinate system, importing the simulated grain three-dimensional model graph and the simulated processed grain three-dimensional model graph into the integrated coordinate system, reserving a superposition part in the model graph, and removing a non-superposition part in the model graph to obtain an integrated model three-dimensional model graph;

obtaining a second total volume value of the defect from the integrated model three-dimensional model diagram, and calculating a second defect concentration value according to the second total volume value of the defect;

judging whether the second defect concentration is larger than a preset defect concentration, if not, judging the LED crystal grain as a qualified product, and if so, judging the LED crystal grain as a waste product.

The engineering drawing information is designed in advance by a designer, and the engineering drawing comprises a series of processing step information of the LED crystal grain, such as film coating, exposure, development, etching, semi-finished product detection, ion implantation, cutting, finished product detection and the like. The processing engineering drawing information also comprises finished product drawing information of the LED crystal grains after a series of processing step information. After the processing engineering drawing information is obtained, a three-dimensional model drawing of the crystal grain after simulation processing is constructed through three-dimensional modeling software, wherein the three-dimensional model drawing of the crystal grain after simulation processing can be understood as a finished product three-dimensional model drawing of the LED crystal grain after a series of processing steps; then constructing an integrated coordinate system, importing the simulated grain three-dimensional model graph and the simulated processed grain three-dimensional model graph into the integrated coordinate system, reserving a superposition part in the model graph, and removing a non-superposition part in the model graph to obtain an integrated model three-dimensional model graph; the integrated model three-dimensional model diagram can be understood as a three-dimensional model diagram of the current LED feeding to be detected after the steps of ion implantation, cutting and the like; obtaining a second total volume value of the defect from the integrated model three-dimensional model diagram, and carrying out ratio processing on the second total volume value of the defect and the total volume of the LED crystal grain after subsequent simulation processing to obtain a second defect concentration value; if the second defect concentration is not greater than the preset defect concentration, it may be stated that, although the defect concentration of the die is too great in the current semi-finished product detection step, most of defects of the LED die are cut off after the steps of subsequent cutting and the like, so that the defect concentration of the LED die is reduced, and it is stated that the defect concentration of the LED die is qualified after the steps of subsequent cutting and the like, and the LED die is determined to be a qualified product; if the second defect concentration is greater than the preset defect concentration, the defect concentration of the finished product processed by the LED crystal grain is still too high even if the subsequent processing step is continued, and the LED crystal grain is marked at the moment and immediately scrapped to avoid flowing into the subsequent processing step. The method can prevent unqualified semi-finished LED crystal grains from flowing into subsequent processing steps and being scrapped in time, and can reduce processing cost.

The foregoing description of the preferred embodiments according to the present invention is provided as illustration and description, and is not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims

1. An LED intelligent testing device which is characterized in that: the testing device comprises a testing machine frame and a control system, wherein a mounting frame is arranged in the testing machine frame, a mounting plate is arranged at the top of the mounting frame, a telescopic cylinder is fixedly arranged on the mounting plate, the output end of the telescopic cylinder is connected with one end of a telescopic rod in a matched manner, the other end of the telescopic rod is connected with a connecting plate in a matched manner, a butt joint disc is fixedly arranged on the connecting plate, a butt joint groove is formed in the butt joint disc, a plurality of mounting holes are formed in the bottom of the butt joint groove at preset positions, and a butt joint mechanism is arranged in each mounting hole; the mounting plate is also provided with four groups of linear bearings, the linear bearings are connected with a limiting rod in a sliding manner, the top end of the limiting rod is provided with a limiting plate, and the bottom end of the limiting rod is fixedly connected with the connecting plate;

2. The LED intelligent test apparatus of claim 1, wherein: the butt joint mechanism comprises a mounting shell, wherein the mounting shell is fixedly arranged in a mounting hole, a first cover plate and a second cover plate are respectively arranged at two ends of the mounting shell, an inductor is fixedly arranged on the first cover plate, a first butt joint plate is connected in the mounting shell in a sliding mode, the bottom end of the first butt joint plate is fixedly connected with one end of a connecting rod, a second butt joint plate is fixedly connected with the other end of the connecting rod, and a positive electrode test rod and a negative electrode test rod are arranged on the second butt joint plate.

3. The LED intelligent test apparatus of claim 2, wherein: the installation shell is internally provided with a plurality of butt joint springs, the top ends of the butt joint springs are fixedly connected with the second butt joint plate, and the bottom ends of the butt joint springs are fixedly connected with the second cover plate.

4. An LED intelligent test apparatus according to claim 3, wherein: the first through hole and the second through hole are formed in the second cover plate, the first needle cleaning sleeve is fixedly arranged on the first through hole, the second needle cleaning sleeve is fixedly arranged on the second through hole, the axis of the first needle cleaning sleeve coincides with the axis of the positive electrode test rod, and the axis of the second needle cleaning sleeve coincides with the axis of the negative electrode test rod.

5. The LED intelligent test apparatus of claim 2, wherein: the testing device further comprises a first power supply module, the inductors are electrically connected with the first power supply module through first leads, power-off switches are arranged on the first leads, and the power-off switches are in signal connection with the control system.

6. The LED intelligent test apparatus of claim 1, wherein: the bottom of regulation hole has all been seted up the air vent, all be connected with the intake pipe on the air vent, be provided with the air feed jar in the test frame, be connected with the outlet duct on the air feed jar, the other end of outlet duct is connected with the air converging chamber, the other end of intake pipe with the air converging chamber is connected, all be equipped with automatically controlled valve in the intake pipe, automatically controlled valve with control system signal connection.

7. The LED intelligent test apparatus of claim 6, wherein: the temperature sensor is used for detecting temperature information in the adjusting hole, and the air pressure sensor is used for detecting air pressure information in the adjusting hole.

8. The LED intelligent test apparatus of claim 2, wherein: the testing device further comprises a second power supply module, the positive electrode testing rod and the negative electrode testing rod are electrically connected with the second power supply module through second conducting wires, and current sensors are arranged on the second conducting wires.

9. A testing method of an LED intelligent testing device, applied to the LED intelligent testing device according to any one of claims 1 to 8, comprising the steps of:

10. The method for testing an LED intelligent test apparatus of claim 9, further comprising the steps of: