CN102628735A - Device and method for testing heat resistance of light-emitting diode (LED) - Google Patents
Device and method for testing heat resistance of light-emitting diode (LED) Download PDFInfo
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- CN102628735A CN102628735A CN2012100684191A CN201210068419A CN102628735A CN 102628735 A CN102628735 A CN 102628735A CN 2012100684191 A CN2012100684191 A CN 2012100684191A CN 201210068419 A CN201210068419 A CN 201210068419A CN 102628735 A CN102628735 A CN 102628735A
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Abstract
The invention discloses a device and a method for testing heat resistance of a light-emitting diode (LED). The heat resistance testing device is used for testing the heat resistance of the LED in a connecting plate state and comprises a heating carrier plate, an electrical tester, an optical analyzer and a control host, wherein the heating carrier plate is used for bearing the LED in the connecting plate state and heating the LED in the connecting plate state; the electrical tester comprises a test probe; the test probe is electrically connected with a pin of the LED and is used for driving the LED and acquiring a feedback signal of the LED; the optical analyzer is used for performing optical analysis on the LED; the control host is connected with the electrical tester and the optical analyzer; and the control host is used for analyzing whether the LED is qualified or not according to the feedback signal acquired by the electrical tester and the data acquired by the optical analyzer, so that each LED can be detected directly in the encapsulation process and the yield of the LED products during delivery is guaranteed.
Description
Technical field
The present invention relates to the heat-resisting test of LED, relate in particular to heat-resisting test and the heat-resisting method of testing of the LED under the connecting plate state.
Background technology
In the prior art, LED is used widely at lighting field, particularly along with the fast development of lcd technology; LED has obtained using more widely as the backlight of display panels; Its reason is, compares with cold cathode ray tube, and the low in energy consumption and life-span of LED is long.
The manufacturer of LED can extract the heat-resisting test that sample segment carries out product usually after having produced large batch of LED, to confirm the yield of this LED in batches; The sample that extracts is not directly done heat-resisting test, and common way is plurality of LEDs and circuit board to be arranged in pairs or groups process the LED lamp bar of finished product; Then LED lamp bar is carried out heat-resisting test, still, thereby in the process of making LED lamp bar, might cause the damage of LED to cause test result to depart from actual yield; And; LED as specimen does to scrap processing after finishing test, so, also caused the waste of resource.
Summary of the invention
In view of this; Fundamental purpose of the present invention is to solve the above problems and the method that the heat-resisting proving installation of a kind of LED is provided and utilizes this heat-resisting proving installation that LED is carried out heat-resisting test, can examine rather than adopt the mode of draw samples test to the LED under the connecting plate state entirely.
The present invention provides the heat-resisting proving installation of a kind of LED; This heat-resisting proving installation is used for the heat-resisting test of the LED under the connecting plate state; This heat-resisting proving installation comprises: the heating support plate is used to carry the LED under this connecting plate state and the LED under this connecting plate state is heated; The testing electrical property appearance, said testing electrical property appearance comprises test probe, the pin that said test probe is used to be electrically connected this LED is to drive this LED and to obtain the feedback signal of this LED; Optical analyser is used for LED is carried out optical analysis; Main control system connects this testing electrical property appearance and this optical analyser, and whether the feedback signal that this main control system obtains according to this testing electrical property appearance and the data of this optical analyser collection are analyzed this LED qualified.
Preferably, this feedback signal is a feedback voltage.
Preferably, said heat-resisting proving installation more comprises mobile member, and said mobile member is connected with this heating support plate, can regulate the locus of this heating support plate through regulating mobile member.
Preferably, this optical analyser comprises main frame and the movably optical inductor that is connected with main frame, and said optical inductor is used for the light that sensing LED sends.
Preferably, this heat-resisting proving installation more comprises cutting agency, and when this LED of this main control system analysis was underproof LED, this main control system sent first instruction to this cutting agency, and this cutting agency is removed this underproof LED according to this first instruction.
Preferably, the heating support plate be provided with temperature inductor be used for sensing LED temperature and according to the sensing result of temperature inductor control the heating support plate heating-up temperature.
The present invention also provides the heat-resisting method of testing of a kind of LED, and this heat-resisting method of testing utilizes aforesaid heat-resisting proving installation that the LED under the connecting plate state is carried out heat-resisting test, and the method includes the steps of:
Step 3. starts this testing electrical property appearance; Plurality of LEDs under this connecting plate state is carried out testing electrical property one by one and data are sent to this main control system; And, start this optical analyser, the plurality of LEDs under this connecting plate state is carried out optical analysis one by one and data are sent to this main control system;
Whether this main control system of step 4. is analyzed this plurality of LEDs one by one according to the data that receive qualified.
Preferably, this method more comprises: step 5. analyzes a certain LED when being underproof LED when this main control system, and this main control system sends first instruction to this cutting agency, and this cutting agency is removed this underproof LED according to this first instruction.
The invention has the beneficial effects as follows and directly in encapsulation process, to carry out heat-resisting test the LED under the connecting plate state; So; Can detect each LEDs, the yield when guaranteeing the LED product export is than the mode of the sample testing of available technology adopting; The present invention both guaranteed the accuracy of test and do not had consume, need not scrap processing as in the prior art specimen being done.
Below in embodiment, be described in detail detailed features of the present invention and advantage; Its content is enough to make those skilled in the art to understand technology contents of the present invention and implements according to this; And according to content, claim and the diagram that this instructions disclosed, those skilled in the art can understand purpose and the advantage that the present invention is correlated with easily.
Description of drawings
Fig. 1 is the structural representation of heat-resisting proving installation of the LED of one embodiment of the invention;
Fig. 2 is the structural representation of the LED under the connecting plate state.
Embodiment
For making the object of the invention, structure, characteristic and function thereof there are further understanding, cooperate embodiment to specify as follows now.
Fig. 1 is the structural representation of heat-resisting proving installation of the LED of one embodiment of the invention; This heat-resisting proving installation 100 is used for the heat-resisting test of the LED under the connecting plate state; This heat-resisting proving installation 100 comprises heating support plate 1, testing electrical property appearance 2, optical analyser 3 and main control system 4; This heating support plate 1 is used to carry the LED under this connecting plate state and the LED under this connecting plate state is heated; Said testing electrical property appearance 2 comprises test probe 21, test probe 22, and the pin that said test probe 21 and test probe 22 are electrically connected this LED respectively is to drive this LED and to obtain the feedback signal of this LED, and this optical analyser 3 is used for LED is carried out optical analysis; Main control system 4 connects this testing electrical property appearance 2 and this optical analysers 3, and whether the optical data that the feedback signal that this main control system 4 is obtained according to this testing electrical property appearance 2 and this optical analyser 3 are gathered is analyzed this LED qualified.
The feedback signal that said testing electrical property appearance 2 obtains is a feedback voltage, and this testing electrical property appearance 2 utilizes pin that test probe 21 and test probe 22 be delivered to LED to drive this LED and to obtain the feedback voltage of this LED predetermined rated current usually.
The feedback signal that said testing electrical property appearance 2 obtains is not defined as feedback voltage, and also can be this testing electrical property appearance 2 utilizes pin that test probe 21 and test probe 22 be delivered to LED to drive this LED and to obtain the feedback current of this LED predetermined rated voltage.
This heat-resisting proving installation 100 more comprises mobile member 8, and said mobile member 8 is connected with this heating support plate 1, can regulate the locus of this heating support plate 1 through regulating mobile member 8, thereby the LED5 under the connecting plate state is tested one by one.
This heat-resisting proving installation 100 more comprises cutting agency 9; When this main control system 4 analyzes wherein a certain LEDs 5 for underproof LED; This main control system 4 sends first instruction to this cutting agency 9, and this cutting agency 9 is removed this underproof LED according to this first instruction.
This optical analyser 3 comprises main frame 31 and the optical inductor 32 that is connected with main frame 31; Said optical inductor 32 is used for the light that sensing LED sends; When this heat-resisting proving installation does not have mobile member 8; Can design this optical inductor 32 and be packaged type, so, convenient LED under the connecting plate state tested one by one for the test probe 21 and the test probe 22 of packaged type and this testing electrical property appearance 2.
,, repeat no more for prior art instrument and equipment commonly used about testing electrical property appearance 2, optical analyser 3 and main control system 4, only describe its function in this.
Fig. 2 is the structural representation of the LED under the connecting plate state; So-called connecting plate state is meant in the encapsulation process of LED; Plurality of LEDs 5 with the arrangement mode of array be arranged in package support 6 and LED5 as yet not from the package support 6 many cut down, do not limit about the concrete encapsulating structure of LED5, in this embodiment; Package support 6 is provided with plurality of LEDs 5; Each LEDs 5 has led chip 51, and the chip electrode of led chip 51 is a plane electrode, utilizes gold thread 52 that the electrode of led chip 51 is connected to pin 54 and pin 55 respectively; When 2 pairs of LEDs 5 wherein of testing electrical property appearance carried out testing electrical property, test probe 21 on this testing electrical property appearance 2 and test probe 22 were electrically connected pin 54 and the pin 55 of LED5 respectively.
When the LED under the connecting plate state is carried out heat-resisting test; Earlier the LED under this connecting plate state is fixed on this heating support plate 1; Can utilize the location structure on the heating support plate 1 that the package support 6 of LED is fixing; Then, utilize the LED under 1 pair of this connecting plate state of this heating support plate to heat, heating can be provided with that temperature inductor is used for the temperature of sensing LED on the support plate 1 and control the heating-up temperature of heating support plate 1 according to the sensing result of temperature inductor; Start this testing electrical property appearance 2; Plurality of LEDs 5 under this connecting plate state is carried out testing electrical property one by one and data are sent to this main control system 4, start this optical analyser 3, the plurality of LEDs 5 under this connecting plate state is carried out optical analysis one by one and data are sent to this main control system 4; Whether this main control system 4 is analyzed this plurality of LEDs 5 one by one according to the data that receive qualified; When this main control system 4 analyzes a certain LEDs when being underproof LED, this main control system 4 sends first instruction to this cutting agency 9, and this cutting agency 9 is removed this underproof LED according to this first instruction.
Utilize the heat-resisting proving installation 100 of LED of the present invention directly in encapsulation process, to carry out heat-resisting test to the LED under the connecting plate state; So; Can detect each LEDs, the yield when guaranteeing the LED product export is than the mode of the sample testing of available technology adopting; The present invention both guaranteed the accuracy of test and do not had consume, need not scrap processing as in the prior art specimen being done.
The above is only notebook invention for presenting the preferred embodiments or the embodiment of the technological means that adopted of dealing with problems, and is not the scope that is used for limiting patent protection of the present invention.Be that all protection domains that is limited with claims of the present invention conform to, or change and modification, all belong within the scope of patent protection of the present invention according to the equalization that claim of the present invention is done.
Claims (8)
1. the heat-resisting proving installation of a LED is characterized in that, this heat-resisting proving installation is used for the heat-resisting test of the LED under the connecting plate state, and this heat-resisting proving installation comprises:
The heating support plate is used to carry the LED under this connecting plate state and the LED under this connecting plate state is heated;
The testing electrical property appearance, said testing electrical property appearance comprises test probe, the pin that said test probe is used to be electrically connected this LED is to drive this LED and to obtain the feedback signal of this LED;
Optical analyser is used for LED is carried out optical analysis;
Main control system connects this testing electrical property appearance and this optical analyser, and whether the feedback signal that this main control system obtains according to this testing electrical property appearance and the data of this optical analyser collection are analyzed this LED qualified.
2. the heat-resisting proving installation of LED as claimed in claim 1 is characterized in that, this feedback signal is a feedback voltage.
3. the heat-resisting proving installation of LED as claimed in claim 1 is characterized in that, said heat-resisting proving installation more comprises mobile member, and said mobile member is connected with this heating support plate, can regulate the locus of this heating support plate through regulating mobile member.
4. the heat-resisting proving installation of LED as claimed in claim 1; It is characterized in that; This optical analyser comprises main frame and the movably optical inductor that is connected with main frame, and said optical inductor is used for the light that sensing LED sends, and the test probe of this testing electrical property appearance is removable.
5. the heat-resisting proving installation of LED as claimed in claim 1; It is characterized in that; This heat-resisting proving installation more comprises cutting agency; When this LED of this main control system analysis was underproof LED, this main control system sent first instruction to this cutting agency, and this cutting agency is removed this underproof LED according to this first instruction.
6. the heat-resisting proving installation of LED as claimed in claim 1 is characterized in that, the heating support plate be provided with temperature inductor be used for sensing LED temperature and according to the sensing result of temperature inductor control the heating support plate heating-up temperature.
7. the heat-resisting method of testing of a LED is characterized in that, the described heat-resisting proving installation of any claim of this heat-resisting method of testing utilization such as claim 1-4 carries out heat-resisting test to the LED under the connecting plate state, and the method includes the steps of:
Step 1. is fixed in the LED under this connecting plate state on this heating support plate;
Step 2. utilizes this heating support plate that the LED under this connecting plate state is heated;
Step 3. starts this testing electrical property appearance; Plurality of LEDs under this connecting plate state is carried out testing electrical property one by one and data are sent to this main control system; And, start this optical analyser, the plurality of LEDs under this connecting plate state is carried out optical analysis one by one and data are sent to this main control system;
Whether this main control system of step 4. is analyzed this plurality of LEDs one by one according to the data that receive qualified.
8. the heat-resisting method of testing of LED as claimed in claim 6 is characterized in that, this method more comprises:
Step 5. analyzes a certain LED when being underproof LED when this main control system, and this main control system sends first instruction to this cutting agency, and this cutting agency is removed this underproof LED according to this first instruction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100684191A CN102628735A (en) | 2012-03-15 | 2012-03-15 | Device and method for testing heat resistance of light-emitting diode (LED) |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012100684191A CN102628735A (en) | 2012-03-15 | 2012-03-15 | Device and method for testing heat resistance of light-emitting diode (LED) |
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| CN102628735A true CN102628735A (en) | 2012-08-08 |
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| CN2012100684191A Pending CN102628735A (en) | 2012-03-15 | 2012-03-15 | Device and method for testing heat resistance of light-emitting diode (LED) |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103529373A (en) * | 2013-10-24 | 2014-01-22 | 四川虹视显示技术有限公司 | Defect detection device for OLED |
| CN103558538A (en) * | 2013-07-31 | 2014-02-05 | 深圳清华大学研究院 | Light-emitting diode test device |
| CN103592590A (en) * | 2013-11-12 | 2014-02-19 | 上海大学 | System and method for testing light-electricity-heat integration of LED device |
| CN104181450A (en) * | 2014-09-02 | 2014-12-03 | 中国科学院半导体研究所 | System and method for testing light-emitting diode response characteristics |
| CN104422817A (en) * | 2013-09-09 | 2015-03-18 | 太白Hitech公司 | Device for detecting LED module |
| CN105300660A (en) * | 2015-09-18 | 2016-02-03 | 成都虹昇光电科技有限公司 | Method for testing reliability of laser projector |
| CN106842072A (en) * | 2017-03-22 | 2017-06-13 | 前海多谱科技（深圳）有限公司 | A kind of LED light multistation batch detection automatic equipment |
| CN108332949A (en) * | 2018-01-22 | 2018-07-27 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Luminescent device reliability test case, test device and method |
| CN116148623A (en) * | 2023-03-23 | 2023-05-23 | 深圳市西渥智控科技有限公司 | LED intelligent testing device and testing method thereof |
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| CN105300660A (en) * | 2015-09-18 | 2016-02-03 | 成都虹昇光电科技有限公司 | Method for testing reliability of laser projector |
| CN106842072A (en) * | 2017-03-22 | 2017-06-13 | 前海多谱科技（深圳）有限公司 | A kind of LED light multistation batch detection automatic equipment |
| CN108332949A (en) * | 2018-01-22 | 2018-07-27 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Luminescent device reliability test case, test device and method |
| CN116148623A (en) * | 2023-03-23 | 2023-05-23 | 深圳市西渥智控科技有限公司 | LED intelligent testing device and testing method thereof |
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Application publication date: 20120808 |