CN102486536A - Detection bench, detection method and detection system - Google Patents

Detection bench, detection method and detection system Download PDF

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Publication number
CN102486536A
CN102486536A CN201110059097XA CN201110059097A CN102486536A CN 102486536 A CN102486536 A CN 102486536A CN 201110059097X A CN201110059097X A CN 201110059097XA CN 201110059097 A CN201110059097 A CN 201110059097A CN 102486536 A CN102486536 A CN 102486536A
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China
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emitting element
light emitting
means
sensing
detection
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CN201110059097XA
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Chinese (zh)
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林文迪
谢孝樑
谢祥政
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隆达电子股份有限公司
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Priority to TW099142174A priority patent/TWI454722B/en
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Publication of CN102486536A publication Critical patent/CN102486536A/en

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Abstract

The invention discloses a detection bench, a detection method and a detection system. The detection bench can be used for the optical and electrical detection of the light-emitting component. The detection bench comprises a substrate platform, a probe mechanism, a heating device, a cooling device, an image sensing device, a temperature sensing device, and a movable platform. The probe mechanism is suitable for the contact with the light-emitting component, and is close to the substrate platform. The heating device is suitable for heating the light-emitting component to make the temperature of the light-emitting component to remain in the first temperature range. The cooling device can be used to cool the light-emitting component to make the temperature of the light-emitting component to remain in the second temperature range. The image sensing device can be used to sense the light-emitting image generated by the light-emitting component. The temperature sensing device can be used to sense the current temperature of the light-emitting component. The image sensing device is disposed on the movable platform, which is suitable for moving the image sensing device. The invention also provides a detection method and a detection system, which are suitable for the above mentioned detection bench.

Description

检测机台、检测方法与检测系统 Machine detection, detection method and detection system

技术领域 FIELD

[0001] 本发明涉及一种检测机台、检测方法与检测系统,且特别是涉及一种低成本及高合格率的检测机台、检测方法与检测系统。 [0001] The present invention relates to a method for detecting the machine, the detection methods and detection systems, and more particularly to machine detection, detection method and detection system of low cost and high yield.

背景技术 Background technique

[0002] 传统上为了对发光元件(如:发光二极管灯条)进行各种光学检测与电性检测,通常会设置各种光学检测与电性检测的机台,并通过将发光元件依序送入这些检测机台中, 便可量测发光元件的光学性质与电性表现。 [0002] For the conventional light emitting elements (eg: LED bar) and various optical detection and electrical detection, optical detection typically provided with a variety of electrical testing machine, and by sequentially transmitting the light emitting element the optical properties and electrical performance of these detector station, the light emitting element can be measured. 具体而言,发光元件经由回焊炉后的余温目检判别为一站,并利用手动调整电源供应器及探针机构点灯,之后利用目检检测LED是否点亮及外观检验,如此高温状态无法确保,且一位目检人员仅检测一组发光元件的灯条。 Specifically, the warmth of the light emitting element via visual inspection after the reflow furnace is determined as a stop, and the manual adjustment using the probe power supply and lighting means, after which visual inspection detects whether the LED lighting and appearance test, the state of such high temperatures can not be secured, a visual inspection of the art and to detect only a group of light emitting elements of the light bar.

[0003] 在高温电性检测后进行低温电性检测时,需先将发光元件冷却,其采用方式可以是通过制作工艺移动或等待的时间做冷却,或加装风机等冷却装置(如此便需一站)。 [0003] When a low temperature after high temperature electrically testing electrical testing, need to first cool the light emitting element, which may be by way of the production process by moving or waiting time to do cooling, fans, etc., or the installation of a cooling device (so it need one stop).

[0004] 再者,进行利用自动光学检测(Auto Optic Inspection, AOI)对发光元件进行外观检测时,通常是用来检测发光元件偏位缺焊等问题,其中此AOI检测通常为自动化机台。 When [0004] Further, the light emitting element to be visually inspected using automated optical inspection (Auto Optic Inspection, AOI), is typically used to detect the lack of a light emitting element misalignment problems welding, wherein the AOI detection is generally automatic machine.

[0005] 再者,进行利用自动光学检测对发光元件进行光学检测时,通常是用来检测发光元件的光学特性,其中此光学检测通常为自动化机台。 When [0005] Further, the light-emitting element for optical detection using automatic optical inspection is usually used to detect optical characteristics of the light emitting element, wherein the optical detection is generally automatic machine.

[0006] 之后,进行低温电性检测也是通过目检判别的方式,因此此部分又为一站,且电性检测的方式也是采用手动调整电源供应器及手持式探针点灯,并利用目检检测发光元件是否点亮及外观检验。 After [0006], the low-temperature electrical testing is determined by visual inspection of the way, and is therefore a part of this station, and is electrically detectable manner using manual adjustment power supply and lighting handheld probe, using visual inspection detecting whether a light emitting element lighting and visual inspection.

[0007] 基于上述可知,若欲将发光元件进行高温检测与低温检测时便需经过多个站别, 因此这些机台所占具有许多空间,意即检测发光元件的生产线便无法被缩短。 [0007] Based on the foregoing, the light emitting element To convert from high-temperature detection and a low temperature will be subject to a plurality of other stations is detected, so these machines have a number of occupied space, which means that the production line can not detect the light emitting element is shortened.

发明内容 SUMMARY

[0008] 本发明的目的在于提供一种检测机台,其具有低成本、自动化、高合格率及整体体积较小的优点。 [0008] The object of the present invention to provide a method for detecting the machine, which has a low cost, automated, high yield and a smaller overall volume of advantages.

[0009] 本发明另一目的在于提供一种检测方法,其适用于上述的检测机台。 [0009] Another object of the present invention to provide a detection method applicable to the detection of machine.

[0010] 本发明又一目的在于提供一种检测系统,其适用于上述的检测机台。 [0010] A further object of the present invention to provide a detection system which is suitable for detecting the above-described machine.

[0011] 为达上述目的,本发明提出一种检测机台,其适于对一发光元件进行光学及电性检测。 [0011] To achieve the above object, the present invention provides an inspection machine, a light emitting element which is adapted to electrically and optically testing. 此检测机台包括一基板平台、一探针机构、一加热装置、一冷却装置、一影像感测装置、一光学检测装置、一感温装置以及一移动台。 This machine comprises detecting a substrate stage, a probe mechanism, a heating device, a cooling device, an image sensing device, an optical detecting means, a temperature sensing device and a mobile station. 发光元件配置于基板平台上。 A light emitting element disposed on the substrate internet. 探针机构设置于基板平台上方,且探针机构适于往基板平台靠近而与发光元件接触。 Probe means disposed above the substrate stage, and the probe means adapted to close contact with the substrate stage light emitting element. 加热装置设置于基板平台的下方并适于加热发光元件,以使发光元件维持于一第一温度范围内。 Heating means disposed below the substrate stage and the light emitting element adapted to heat to cause the light emitting element is maintained within a first temperature range. 当发光元件处于第一温度范围内时,与发光元件接触的探针机构适于传递一第一驱动信号至发光元件,以驱动发光元件。 When the light emitting element is within a first temperature range, in contact with the probe means adapted to deliver a first light-emitting element driving signal to the light emitting element to drive the light emitting element. 冷却装置设置于基板平台的下方并适于冷却发光元件,以使发光元件维持于一第二温度范围内。 Cooling means disposed below the substrate stage and adapted to cool the light emitting element to the light emitting element is maintained within a second temperature range. 当发光元件处于第二温度范围内时,与发光元件接触的探针机构适于传递一第二驱动信号至发光元件,以驱动发光元件。 When the light emitting element is within a second temperature range, in contact with the probe means adapted to deliver a second light-emitting element driving signal to the light emitting element to drive the light emitting element. 影像感测装置设置于发光元件 Image sensing devices provided in the light emitting element

5的上方并适于感测发光元件被驱动时所产生的一发光影像及其外观。 5 and is adapted to sense the top of a light emitting image and the appearance of the light emitting element is driven timekeeping generated. 感温装置设置于发光元件的上方,用以感测发光元件目前的一温度。 Temperature sensing means disposed above the light emitting element, the light emitting element for sensing a current temperature. 移动台设置于发光元件的上方,且影像感测装置装设于移动台上,其中移动台适于移动影像感测装置。 The mobile station is provided above the light-emitting element, and the image sensing device mounted in a mobile station, wherein the mobile station is adapted to move the image sensing apparatus.

[0012] 在本发明的一实施例中,基板平台包括一输送带装置,适于承载并传送发光元件。 [0012] In an embodiment of the present invention, the substrate comprising a platform conveyor means adapted to carry and transport the light emitting element.

[0013] 在本发明的一实施例中,加热装置包括一加热块或加热板。 [0013] In an embodiment of the present invention, the heating means comprising a heating plate or heating block.

[0014] 在本发明的一实施例中,第一温度范围实质上落在摄氏120度与摄氏200度之间。 [0014] In an embodiment of the present invention, the first temperature range falls substantially between 120 degrees Celsius and 200 degrees Celsius.

[0015] 在本发明的一实施例中,冷却装置包括一循环水系统或一喷气系统 [0015] In an embodiment of the present invention, the cooling means comprises a circulating water system or jet system

[0016] 在本发明的一实施例中,第二温度范围实质上落在摄氏20度与摄氏70度之间。 [0016] In an embodiment of the present invention, the second temperature range is substantially falls between 20 and 70 degrees Celsius degrees Celsius.

[0017] 在本发明的一实施例中,第二驱动信号大于小于第一驱动信号。 [0017] In an embodiment of the invention, the second driving signal is greater than the first drive signal.

[0018] 在本发明的一实施例中,影像感测装置包括一线扫描式电荷耦合元件(Line Scan CCD) ο [0018] In an embodiment of the present invention, the image sensing device comprises a charge coupled device scanning line (Line Scan CCD) ο

[0019] 在本发明的一实施例中,检测机台还包括一电源供应装置,电连接探针机构并提供第一驱动信号或第二驱动信号。 [0019] In an embodiment of the present invention, the detecting machine further comprises a power supply device electrically connected to the probe driving mechanism and provides a first signal or the second driving signal.

[0020] 在本发明的一实施例中,检测机台还包括一光学检测装置,设置于发光元件的上方并装设于移动台上,其中移动台适于移动光学检测装置,且光学检测装置适于感测发光元件被驱动时所产生的光学特性做量测。 [0020] In an embodiment of the present invention, the machine further comprising a detection optical detection means, disposed above the light emitting element is mounted in a mobile station and wherein the mobile station is adapted to move the optical detection means, and optical detection means adapted to sense the optical characteristics of the light emitting element is generated by the drive to make measurements.

[0021] 在本发明的一实施例中,检测机台还包括一第一移动装置与一第二移动装置,其中第一移动装置位于基板平台的上方并适于移动探针机构,以使探针机构往基板平台靠近或远离,第二移动装置位于基板平台的下方并适于移动加热装置与冷却装置,以使加热装置与冷却装置其一往基板平台靠近。 [0021] In an embodiment of the present invention, the detecting machine further comprises a first mobile device and a second mobile device, wherein the mobile device is located above the first substrate stage and adapted to move the probe means, so that the probe needle means towards or away from the platform to the substrate, the substrate is positioned below the second mobile device is adapted to move the platform and the heating means and the cooling means to the heating means and cooling means near one platform to the substrate.

[0022] 在本发明的一实施例中,检测机台还包括至少一吹气机构,位于基板平台的一侧或二侧,其中吹气机构适于提供一气流于发光元件上,以冷却发光元件。 [0022] In an embodiment of the present invention, the detecting machine further comprises at least one blowing means located at one side or both sides of the substrate stage, wherein the air blowing means adapted to provide a light emitting element on the airflow to cool the light emitting element.

[0023] 在本发明的一实施例中,检测机台还包括一运算主机与一界面卡,运算主机通过界面卡,以移动探针机构、加热装置、冷却装置、移动台至少其一,或是撷取影像感测装置与感温装置至少其一的数据。 [0023] In an embodiment of the present invention, the machine further comprising detecting an operational interface card to a host, the host through the operator interface card, to move the probe means, heating means, cooling means, at least one of the mobile station, or at least one of the data capturing an image sensing device and the temperature sensing means.

[0024] 在本发明的一实施例中,界面卡包括一运动控制卡或一影像撷取卡。 [0024] In an embodiment of the present invention, a motion control interface card comprising a card or frame grabber.

[0025] 在本发明的一实施例中,发光元件包括一发光二极管灯条(LED lightbar)。 [0025] In an embodiment of the present invention, the light emitting element includes an LED light bar (LED lightbar).

[0026] 本发明另提出一种检测方法,其适于对一发光元件进行光学及电性检测。 [0026] The present invention further provides a detection method suitable for a light emitting element and the optical electrical testing. 此检测方法至少包括以下步骤。 This detection method includes at least the following steps. 首先,提供一发光元件。 First, a light emitting element. 接着,提供一探针机构,并使探针机构往基板平台靠近而与发光元件接触。 Next, there is provided a probe mechanism, and the probe means close contact with the light emitting element to the substrate stage. 然后,加热发光元件,以使发光元件维持于一第一温度范围内。 Then, heat emitting elements, so that the light emitting element is maintained within a first temperature range. 接着,利用探针机构传递一第一驱动信号至发光元件,以驱动发光元件。 Next, a first transmission mechanism with a probe driving signal to the light emitting elements to drive the light emitting element. 而后,感测并量测发光元件被第一驱动信号驱动时所产生的一第一发光影像。 Then, sensing and measuring a first image when the light emitting element emitting the first drive signal is generated. 接着,冷却发光元件,以使发光元件维持于一第二温度范围内。 Subsequently, cooling the light emitting element to the light emitting element is maintained within a second temperature range. 之后,利用探针机构传递一第二驱动信号至发光元件,以驱动发光元件。 Thereafter, a second transmission mechanism with a probe driving signal to the light emitting element to drive the light emitting element. 接着,感测并量测发光元件被第二驱动信号驱动时所产生的一第二发光影像,其中第二驱动信号大于第一驱动信号。 Next, the sensing and measuring a second light emitting element emitting a second image generated by the drive signal, wherein the second driving signal is greater than the first drive signal.

[0027] 在本发明的一实施例中,在使探针机构往基板平台靠近而与发光元件接触之前, 上述检测方法还包括利用一影像感测装置对发光元件进行定位。 [0027] In an embodiment of the present invention, the probe means in contact with the light emitting element closer to the substrate before the internet, the detection method further comprising positioning the light-emitting element using an image sensing device. 在本发明的一实施例中, 在对发光元件进行定位之前,上述检测方法更包括对发光元件进行一条码扫描。 In an embodiment of the present invention, prior to positioning the light emitting element, the detection method further comprises a bar code scanning light-emitting element.

[0028] 在本发明的一实施例中,在冷却发光元件之后以及传递第二驱动信号至发光元件 [0028] In an embodiment of the present invention, after the cooling transmitting element and a second light emitting driving signal to the light emitting element

6之前,上述检测方法还包括利用一影像感测装置,对发光元件的一外观或一位置进行检测。 Before 6, the detection method further comprises an image sensing device, or the appearance of a position of a light emitting element is detected.

[0029] 在本发明的一实施例中,在感测并量测第二发光影像之后,上述检测方法还包括对发光元件进行电性及光学检测。 [0029] In an embodiment of the present invention, after measuring the sensing and emitting a second image, the detection method further comprises a light emitting element and the electrical optical detection.

[0030] 本发明又提出一种检测系统,其适于对前述发光元件进行光学及电性检测。 [0030] The present invention further provides a detection system, which is adapted to the light emitting elements of the optical and electrical detection. 此检测系统包括前述基板平台、前述探针机构、前述加热装置、前述冷却装置以及前述影像感测装置。 This detection system comprises the substrate stage, the probe means, the heating means, the cooling means and the image sensing device. 发光元件配置于基板平台上。 A light emitting element disposed on the substrate internet. 探针机构往基板平台靠近而与发光元件接触。 Probe means close contact with the light emitting element to the substrate stage. 加热装置加热发光元件,以使发光元件维持于一第一温度范围内,并利用探针机构传递一第一驱动信号至发光元件,以驱动发光元件。 Heating means for heating the light emitting element to cause the light emitting element is maintained within a first temperature range, and transmits a first driving signal to the light emitting element with a probe mechanism to drive the light emitting element. 冷却装置冷却发光元件,以使发光元件维持于一第二温度范围内并利用探针机构传递一第二驱动信号至发光元件,以驱动发光元件。 Cooling means for cooling the light emitting element to the light emitting element is maintained within a second temperature range and with a probe mechanism for transmitting a driving signal to the second light emitting element, in order to drive the light emitting element. 影像感测装置适于感测并量测发光元件被第一驱动信号驱动时所产生的一第一发光影像,以及感测并量测发光元件被第二驱动信号驱动时所产生的一第二发光影像,其中第二驱动信号大于第一驱动信号。 Image sensing means adapted to sense and measure a first light emitting element emitting the first image generated by the driving signal, and sensing and measuring the light emitting element is driven during a second driving signal generated by a second luminescent image, wherein the second driving signal is greater than the first drive signal.

[0031] 在本发明的一实施例中,在使探针机构往基板平台靠近而与发光元件接触之前, 上述检测系统还包括利用一影像感测装置对发光元件进行定位。 [0031] In an embodiment of the present invention, the probe means in contact with the light emitting element closer to the substrate before the platform, the detection system further comprises a light-emitting element is positioned using an image sensing device. 在本发明的一实施例中, 在对发光元件进行定位之前,上述检测系统还包括对发光元件进行一条码扫描。 In an embodiment of the present invention, prior to positioning the light emitting element, the detection system further comprises a light-emitting element bar code scanning.

[0032] 在本发明的一实施例中,在冷却发光元件之后以及传递第二驱动信号至发光元件之前,上述检测系统还包括利用一影像感测装置,对发光元件的一外观或一位置进行检测。 [0032] In an embodiment of the present invention, after cooling the light emitting element and a second driving signal to pass before the light emitting element, the detection system further comprising using an image sensing device, or the appearance of a light emitting element position is a detection.

[0033] 在本发明的一实施例中,在感测并量测第二发光影像之后,上述检测系统还包括对发光元件进行电性及光学检测。 [0033] In an embodiment of the present invention, after measuring the sensing and emitting a second image, the detection system further comprises a light-emitting element electrically and optically detected.

[0034] 基于上述,本发明的通过将基板平台、探针机构、加热装置、冷却装置、影像感测装置、感温装置以及移动台整合一起,因此将可大大缩减检测发光元件时所需的检测产线的体积与长度。 [0034] Based on the present invention, the substrate stage, the probe means, heating means, cooling means, image sensing means, temperature sensing means and the desired integration with the mobile station, thus greatly reducing the detecting light-emitting element length detection volume production line. 意即本实施例的检测机台可在不移动位于基板平台的发光元件的情况下,进行高温检测、低温检测与光学品质检测。 Detection means the machine according to the present embodiment may be made without moving the light emitting element substrate stage performs temperature detection, detection of low-temperature detection and optical quality. 因此本实施例的检测机台便可大大缩减传统检测机台的整体体积与数量。 Thus detection machine of the present embodiment can greatly reduce the overall volume and the number of the conventional detector station.

[0035] 为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合所附附图作详细说明如下。 [0035] In order to make the above features and advantages of the invention more comprehensible, several embodiments, with detailed description and accompanying drawings as follows.

附图说明 BRIEF DESCRIPTION

[0036] 图1为本发明一实施例的检测机台的简单示意图; [0036] FIG. 1 is a simplified schematic diagram detecting machine according to an embodiment of the present invention;

[0037] 图2为图1的检测机台的具体实施的局部立体示意图; [0037] FIG 2 is a specific embodiment of the machine of FIG 1 detects a partial perspective view;

[0038] 图3为图2的检测机台的局部放大示意图; [0038] FIG. 3 is a partial enlarged view of the detection machine of Figure 2;

[0039] 图4为本发明一实施例的检测方法的流程示意图。 [0039] FIG. 4 schematic flowchart of a detection method according to an embodiment of the present invention.

[0040] 主要元件符号说明 [0040] Main reference numerals DESCRIPTION

[0041] 1000:检测机台 [0041] 1000: detecting machine

[0042] 1010 :发光元件 [0042] 1010: a light emitting element

[0043] 1030 :运算主机 [0043] 1030: Host computing

[0044] 1040 :界面卡 [0044] 1040: The interface card

[0045] 1100:基板平台 [0045] 1100: substrate stage

[0046] 1200 :探针机构[0047] 1300 :加热装置 [0046] 1200: probe means [0047] 1300: heating means

[0048] 1400 :冷却装置 [0048] 1400: cooling means

[0049] 1420 :吹气机构 [0049] 1420: blow mechanism

[0050] 1500 :影像感测装置 [0050] 1500: image sensing means

[0051] 1600:感温装置 [0051] 1600: temperature sensing means

[0052] 1700 :移动台 [0052] 1700: mobile station

[0053] 1800 :电源供应装置 [0053] 1800: power supply means

[0054] 1900 :光学检测装置 [0054] 1900: optical detection means

[0055] Ml :第一移动装置 [0055] Ml: first moving means

[0056] Tl :第一温度范围 [0056] Tl: a first temperature range

[0057] SlOl 〜S108、S201 〜S208 :步骤 [0057] SlOl ~S108, S201 ~S208: Step

[0058] Sl :第一驱动信号 [0058] Sl: a first driving signal

[0059] T2 :第二温度范围 [0059] T2: second temperature range

[0060] S2 :第二驱动信号 [0060] S2: second driving signal

[0061] M2:第二移动装置 [0061] M2: second moving means

具体实施方式 Detailed ways

[0062] 图1为本发明一实施例的检测机台的简单示意图,图2则为图1的检测机台的具体实施的局部立体示意图,而图3则为图2的检测机台的局部放大示意图。 [0062] FIG. 1 is a simplified schematic diagram detecting machine according to an embodiment of the present invention, compared with FIG. 2 shows a specific embodiment a partial perspective view of the detection machine of Figure 1, compared with FIG. 3 and a partial detection of the machine of FIG. 2 an enlarged schematic view. 请同时参考图1、图2与图3,本实施例的检测机台1000适于对一发光元件1010进行光学及电性检测。 Please refer to FIG 1, FIG 2 and FIG 3, the detection machine of the present embodiment is adapted to a light emitting element 1000 1010 optical and electrical detection. 具体而言,检测机台1000包括一基板平台1100、一探针机构1200、一加热装置1300、一冷却装置1400、一影像感测装置1500、一感温装置1600以及一移动台1700。 Specifically, the detector station 1000 includes a substrate stage 1100, a probe mechanism 1200, a heater 1300, a cooling device 1400, an image sensing apparatus 1500, a temperature sensing device 1600 and a mobile station 1700. 发光元件1010配置于基板平台1100上。 The light emitting element 1010 disposed on the substrate 1100 platform. 在本实施例中,基板平台1100是以如图2与图3所绘示的输送带装置1120作为举例说明,但不限于此。 In the present embodiment, the substrate stage 2 and the conveyor apparatus 1100 is depicted in FIG. 31120 as illustrated in FIG., But not limited thereto. 具体而言,输送带装置1120可用以承载发光元件1010, 并可传送发光元件1010至固定位置上。 Specifically, the conveyor belt carrying the light emitting device 1120 may be used to element 1010, the light emitting element 1010 may transmit to the fixed position. 另外,本实施例的发光元件1010例如是一种发光二极管的灯条(LED light bar) ο Further, the light emitting element 1010 of this embodiment, for example, an LED light bar (LED light bar) ο

[0063] 探针机构1200设置于基板平台1100上方,且探针机构1200适于往基板平台1100 靠近而与发光元件1010接触。 [0063] 1200 probe means disposed above the substrate platform 1100 and the probe 1010 and the contact mechanism 1200 is adapted to close the substrate stage 1100 and the light emitting element. 具体而言,检测机台1000可包括一第一移动装置M1,其中第一移动装置Ml位于基板平台1100的上方并适于移动探针机构1200,以便使探针机构1200 可往基板平台1100靠近或远离,如图1、图2与图3所绘示。 Specifically, the machine 1000 may include detecting a first mobile device M1, wherein the first mobile device Ml platform 1100 positioned above the substrate and adapted to move the probe means 1200, so that the probe means can be close to the substrate stage 1200 1100 or away from, as shown in FIG. 1, 2 and 3 depicted in FIG. 一般来说,探针机构1200主要是来施加电压或电流于发光元件1010上,以使发光元件1010产生光束。 Generally, the probe means 1200 is mainly applied voltage or current to the light emitting element 1010, so that the light emitting element 1010 to generate a light beam. 之后便可通过所施加的电压或电流大小而检测发光元件1010的品质。 And can then be detected by the light emitting element 1010 quality voltage or current magnitude applied. 换言之,探针机构1200主要是在用来进行检测发光元件1010的步骤时,探针机构1200便会靠近基板平台1110使得探针机构1200可与发光元件1010接触并电连接,其中关于探针机构1200所施加的电压或电流信号至发光元件1010上的说明,以及探针机构的作动将会于后续的段落中进行说明。 In other words, the probe means 1200 is mainly used in the step of detecting the light emitting element 1010, the probe means 1200 will be close to the substrate stage 1110 so that the probe means 1200 may contact the light emitting element 1010 and electrically connected, wherein the mechanism on the probe voltage or current signal applied to the light emitting element 1200 described in 1010, and the probe actuating mechanism will be described in subsequent paragraphs.

[0064] 请继续参考图1、图2与图3,加热装置1300设置于基板平台1100的下方并适于加热发光元件1010,以使发光元件1010维持于一第一温度范围Tl内。 [0064] Please continue to refer to FIG 1, FIG 2 and FIG 3, the heating means provided below the substrate 1300 of the platform 1100 adapted to heat and light emitting element 1010, so that the light emitting element 1010 is maintained within a first temperature range Tl. 在本实施例中,加热装置1300可以是采用加热块或加热板。 In the present embodiment, the heating device 1300 may be a thermoblock or heating plates. 具体而言,当发光元件1010在回焊炉的制作工艺结束后,接着可先量测发光元件1010在高温时被驱动的电性及光学表现。 Specifically, when the light emitting element 1010 after the reflow furnace in the production process, can then be measured to the light emitting element 1010 is electrically and optical performance is driven at high temperature. 因此,本实施例的检测机台1000便可通过设置于基板平台1100的下方的加热装置1300对发光元件1010 进行加热,而使发光元件1010维持在第一温度范围Tl内,其中此第一温度范围Tl实质上落在摄氏120度与摄氏200度之间。 Thus, the detection machine 1000 of this embodiment can be heated by the light-emitting element 1300 is provided heating means below the substrate 1010 platform 1100, the light emitting element 1010 is maintained at a first temperature range Tl, wherein this first temperature Tl range falls substantially between 120 ° C and 200 ° C. 需要说明的是,在加热装置1300对发光元件1010进行加热之前,前述的探针机构1200便得先往靠近基板平台1100移动,使得探针机构1200 可与发光元件1010接触并电连接。 Incidentally, the light-emitting device 1300 prior to the heating element 1010 is heated, the probe means 1200 gets close to the substrate prior to moving platforms 1100, 1200 such that the light emitting element 1010 may be in contact with and electrically connected to the probe mechanism.

[0065] 接着,当加热装置1300对发光元件1010加热于第一温度范围Tl内时,探针机构1200此时便可传递一第一驱动信号Sl至发光元件1010,以驱动发光元件1010,使发光元件1010产生光线。 [0065] Next, when the light-emitting element 1300 is heated in a heating device 1010 within a first temperature range Tl, the probe 1200 is then ready for transmitting mechanism a first drive signal Sl to the light emitting element 1010, in order to drive the light emitting element 1010, so that the light emitting element 1010 generates light. 在本实施例中,检测机台1000可有包括一电源供应装置1800,其中电源供应装置1800电连接探针机构1200并提供前述第一驱动信号Si。 In the present embodiment, the machine 1000 may detect a power supply device including a 1800, wherein the electrical power supply means connected to the probe means 1200 and 1800 provides the first drive signal Si. 在本实施例中,第一驱动信号Sl例如是一电流信号,其中此电流信号的大小实质上可为50uA。 In the present embodiment, the first signal Sl, for example, a driving current signal, wherein the magnitude of this current signal may be substantially 50uA.

[0066] 另外,影像感测装置1500设置于发光元件1010的上方并适于感测发光元件1010 被驱动时所产生的一发光影像,如图1、图2与图3所绘示。 [0066] Further, the image sensing apparatus 1500 is provided above the light emitting element 1010 and a light emitting driving image generated is adapted to sense the light emitting element 1010 is, as shown in FIG. 1, 2 and 3 depicted in FIG. 具体而言,当探针机构1200于前述第一温度范围Tl内驱动发光元件1010,并使发光元件1010产生光线时,本实施例的检测机台1000便可通过影像感测装置1500感测发光元件1010被驱动时所产生的光线,并同时快速检测发光二极管灯条上的发光二极管是否皆有被点亮,从而判断在高温的状态下发光元件1010是否为有效的发光元件。 Specifically, when the probe means 1200 in the first temperature range Tl driving the light emitting element 1010, and generates light emitting element 1010, detector stage 1000 can be an example of image sensing devices 1500 by sensing a light emitting embodiment of the present element is driven rays 1010 generated, and rapid detection of whether the light emitting diode on the light bar is lit Jie, 1010 to determine whether a valid emitting element emitting element at a high temperature state. 在本实施例中,影像感测装置1500可采用一种线扫描式电荷耦合元件1520 (Line Scan (XD),其可快速地扫描与感测发光元件1010的发光状况。相较于传统采用人工视觉来判断发光二极管灯条上的多个发光二极管是否有被点亮, 本实施例的检测机台1000具有快速且精准化的优点。 In the present embodiment, the image sensing apparatus 1500 may employ one kind of line scan charge coupled device type 1520 (Line Scan (XD), which can quickly scan the sensing condition-emitting elements 1010. Compared with the conventional artificial visually determining whether a plurality of light emitting diodes on the light bar has been lit, the machine according to the present embodiment detects the embodiment of 1000 with fast and precise advantages.

[0067] 请继续参考图1、图2与图3,感温装置1600设置于发光元件1010的上方,用以感测发光元件1010目前的温度。 [0067] Please continue to refer to FIG. 1, FIG. 2 and FIG. 3, the temperature sensing means 1600 provided above the light-emitting element 1010, 1010 to sense the temperature of the current measuring light-emitting element. 具体而言,感温装置1600例如是一红外线热感应装置, 其可在不接触发光元件1010的情况下,直接地感测发光元件目前的温度。 Specifically, the temperature sensing apparatus 1600, for example, an infrared heat sensing device, which may be in contact with the light emitting element 1010 without directly sensing the temperature of the sense current light-emitting element. 因此,本实施例的检测机台1000便可通过感温装置1600而随时监控前述的加热装置1300是否将发光元件1010加热至第一温度范围Tl内,其中倘若未加热至第一温度范围Tl内则可使加热装置1300继续加热。 Thus, the machine of the present embodiment detects the temperature sensing means 1000 through 1600 can be at any time to monitor whether the heating means is heated 1300 to 1010 into the first light emitting element Tl temperature range, wherein if not heated to a first temperature within the range of Tl 1300 will enable the heating apparatus and heating continued.

[0068] 在检测机台1000中,冷却装置1400是设置于基板平台1100的下方并适于冷却发光元件1010,以使发光元件1010维持于一第二温度范围T2内,如图1、图2与图3所绘示。 [0068] In the detector 1000 machine, the cooling apparatus 1400 is disposed below the substrate stage 1100 and adapted to cool the light emitting element 1010, so that the light emitting element 1010 is maintained within a second temperature range T2, as shown in FIG 1, FIG 2 3 depicted in FIG. 在本实施例中,冷却装置1400包括一循环水系统或一喷气系统。 In the present embodiment, the apparatus 1400 comprises a circulating cooling water system or jet system. 具体而言,当发光元件1010于高温状态下检测发光元件1010的发光状况后,接着可量测发光元件1010于低温时被驱动的电性及光学表现。 Specifically, the light emitting element when the light emitting condition detector 1010 in the light emitting element 1010 at a high temperature, then the light emitting element 1010 can measure electrical and optical performance at low temperatures is driven. 因此,本实施例的检测机台1000便可通过设置于基板平台1100 的下方的冷却装置1400对发光元件1010进行冷却,而使发光元件1010维持于第二温度范围T2内,其中此第二温度范围T2实质上落在摄氏20度与摄氏70度之间。 Thus, the detection machine 1000 of this embodiment can be cooled by the light-emitting element 1400 is provided cooling apparatus 1010 platform below the substrate 1100, the light emitting element 1010 is maintained in the second temperature range T2, in which the second temperature T2 falls between the range of substantially 20 degrees Celsius and 70 degrees Celsius. 同样地,在冷却装置1400对发光元件1010进行冷却前,前述的探针机构1200须先与发光元件1010接触并电连接。 Similarly, the light-emitting element 1010 1400 cooling means before cooling, 1010 and 1200 must first light emitting element contacting the probe means and electrically connected. 也就是说,在前述高温检测后,探针机构1200其实可以仍保持与发光元件1010 接触,以方便进行后续的低温检测时可直接地便施加电压或电流信号于发光元件1010上。 That is, after the high-temperature detection, the probe means 1200 may in fact remain in contact with the light emitting element 1010, to facilitate the light emitting element 1010 may be directly applied to it when the detected voltage or current signal to the subsequent low temperature. 在其他实施例中,探针机构1200也可于高温检测后先暂时离开基板平台1100而不与发光元件接触,此部分可视使用者的需求而定。 In other embodiments, the probe mechanism 1200 to high temperatures may be temporarily away from the substrate stage is detected without contacting with the light emitting element 1100, this portion of the visual needs of the user may be.

[0069] 接着,当冷却装置1400将发光元件1010冷却于第二温度范围T2内时,探针机构1200此时便可传递一第二驱动信号S2至发光元件1010,以驱动发光元件1010,使发光元件1010产生光线,其中第二驱动信号S2大于小于第一驱动信号Si。 [0069] Next, the cooling device 1400 when the light emitting element 1010 is cooled in the second temperature range T2, the probe means 1200 is then ready for a second driving signal S2 is transmitted to the light emitting element 1010, in order to drive the light emitting element 1010, so that 1010 generates light emitting element, wherein the second drive signal is less than the first drive signal S2 is greater than Si. 同样地,也可通过与探针机构1200电连接的电源供应装置1800提供前述第二驱动信号S2。 Similarly, the second drive signal may be provided by the power supply device S2 is electrically connected to the probe mechanism 1200 1800. 在本实施例中,第二驱动信号S2例如是一电流信号,其中此电流信号的大小实质上可为120mA。 In the present embodiment, for example, the second driving signal S2 is a current signal, wherein the magnitude of this current signal may be substantially 120mA.

[0070] 类似地,当探针机构1200于前述第二温度范围T2内驱动发光元件1010,并使发光元件1010产生光线时,本实施例的检测机台1000便可通过影像感测装置1500感测发光元件1010被驱动时所产生的光线,并可同时快速检测发光二极管灯条上的发光二极管于低温条件下是否有被点亮,从而判断在低温的状态下发光元件1010是否为有效的发光元件。 [0070] Similarly, when the probe mechanism driving the light emitting element 1200 in the second temperature range T2 1010, 1010 and the light emitting element generating light detection machine embodiment 1000 can be sensed by the image sensing apparatus embodiment 1500 when measuring the light emitting element 1010 is driven generated, and rapid detection of the light-emitting diode light bar under a low temperature condition if there is illuminated, the light emitting element to determine whether a low temperature in a state of emitting a valid 1010 element.

[0071] 特别的是,为了可提高冷却的速度,检测机台1000还包括至少一吹气机构1420, 其位于基板平台1100的一侧或二侧,其中吹气机构1420适于提供一气流于发光元件1010 上,以冷却发光元件1010。 [0071] In particular, to improve the speed of cooling machine 1000 further comprises detecting at least one blowing system 1420, 1100 located at the substrate side of the platform or two sides, wherein the air blowing means adapted to provide an airflow to 1420 1010 on the light emitting element, for cooling the light emitting element 1010.

[0072] 在本实施例中,检测机台1000可包括一第二移动装置M2,其中第二移动装置M2是位于基板平台1100的下方,其主要是用来移动加热装置1300与冷却装置1400,以于高温检测状态下可将加热装置1300往基板平台1100靠近,或是在低温检测状态下可将冷却装置1400往基板平台1100靠近。 [0072] In the present embodiment, the machine 1000 may include detecting a second mobile device M2, wherein M2 is a second mobile device 1100 is located below the substrate stage, which is mainly used for the cooling device 1300 moving the heating device 1400, may be heated to a high temperature in the state detecting device 1300 is close to the substrate stage 1100, or 1400 may be cooled to a substrate stage apparatus 1100 close detection state at a low temperature. 也就是说,第二移动装置M2主要是用来在不同温度检测状态下,移动加热装置1300与冷却装置1400之其一。 That is, the second mobile device M2 is mainly used in the detection state at different temperatures, one of the cooling device 1300 and the mobile device 1400 is heated.

[0073] 此外,为了可使影像感测装置1500快速地扫描与感测发光元件1010的发光状况, 因此移动台1700是设置于发光元件1010的上方,且影像感测装置1500装设于移动台1700 上,如此一来,移动台1700便可适于移动影像感测装置1500而快速地扫描与感测发光元件1010的发光状况。 [0073] Further, in order to make the image sensing apparatus 1500 to quickly scan the sensing condition-emitting elements 1010, the mobile station 1700 is disposed above the light emitting element 1010, and the image sensing apparatus 1500 is mounted on the mobile station 1700, Thus, the mobile station 1700 can be adapted to move the image sensing apparatus 1500 and quickly scan the sensing condition 1010-emitting elements. 此外,感温装置1600也可装设于移动台1700上,如此,移动台1700便可移动感温装置1600而使得感温装置1600可感测灯条上每颗发光二极管的温度,但不限于此。 Further, the temperature sensing device 1600 may be mounted on mobile station 1700, so the mobile station 1700 can be a mobile device 1600 such that the temperature sensing means sensing the temperature of each segment LED 1600 in the temperature on the sensing light bar may be, but are not limited to, this.

[0074] 在前述高温检测与低温检测中,影像感测装置1500主要是用来感测发光元件1010是否可在不同温度下进行点亮的动作,而非检测发光元件1010的发光品质。 [0074] In the low-temperature detection and temperature detection, the image sensing apparatus 1500 is mainly used for sensing whether the light emitting element 1010 can be lit at different temperatures of operation, rather than detecting light-emitting quality of the light emitting element 1010. 因此,检测机台1000还可包括一光学检测装置1900,其设置于所述发光元件的上方并可装设于移动台1700上,其中移动台1700适于移动光学检测装置1900,且光学检测装置1900适于感测发光元件1010被驱动时所产生的光学特性做量测。 Thus, detection of the machine 1000 may also include an optical detecting means 1900, which is disposed above the light emitting element can be mounted on a mobile station 1700, 1700 where the mobile station is adapted to move the optical detection apparatus 1900, and the optical detection means 1900 is adapted to sense the light emitting element 1010 is made of the optical properties measured driving generated. 具体而言,光学检测装置1900可以是量测MCD (光强度单位mcd)的套筒或积分球,二者的作用分别是用来量测发光元件1010 的光学强度及光通量。 Specifically, the optical detection means may be a measurement of the MCD 1900 (light intensity per unit mcd) a sleeve or an integrating sphere, the roles of the two are used to measure the intensity of the light emitting element and the optical flux of 1010.

[0075] 在本实施例中,检测机台1000可以是一种自动化机台。 [0075] In the present embodiment, the machine 1000 may be detected is an automated machine. 具体而言,检测机台1000 也可包括一运算主机1030与一界面卡1040,其中运算主机1030可通过界面卡1040,而操作前述的第一移动装置Ml、第二移动装置Ml及移动台1700,如此一来,探针机构1200、力口热装置1300、冷却装置1400、移动台1700至少其一便可通过运算主机的操作而被移动。 Specifically, the detector station 1000 may also include a host 1030 and a computing interface card 1040, wherein calculating the first mobile device Ml host 1030 may be operated by the interface card 1040, the second mobile station 1700 and mobile device Ml , Thus, the probe means 1200, means 1300 thermal power port, a cooling device 1400, at least one of the mobile station 1700 can be moved by the operation of the host operation. 此夕卜,运算主机也可通过界面卡1040而可撷取影像感测装置1500与感温装置1600至少其一的数据,如:影像数据或温度数据。 Bu this evening, the host operation may also be capable of capturing an image sensing apparatus 1040 via an interface card of at least one temperature sensing device data 1500 and 1600, such as: video data or temperature data. 换言之,此界面卡1040例如是一运动控制卡或一影像撷取卡。 In other words, the interface card 1040, for example, a motion control card or a video capture card.

[0076] 基于上述可知,本实施例的检测机台1000通过将基板平台1100、探针机构1200、 加热装置1300、冷却装置1400、影像感测装置1500、感温装置1600以及移动台1700整合一起,因此将可大大缩减检测发光元件1100时所需的检测产线的体积与长度。 [0076] Based on the foregoing, the present embodiment detects machine 1000 of the platform 1100 by the substrate, the probe means 1200, 1300 heating means, cooling device 1400, image sensing devices 1500, 1600 and temperature sensing means integrated with the mobile station 1700 , thus greatly reducing the volume of the production line length detector 1100 detects the time required for the light emitting element. 具体而言,传统上为了对发光元件(如:发光二极管灯条)进行各种光学检测与电性检测,通常会设置各 Specifically, for the conventional light emitting elements (eg: LED bar) and various optical detection and electrical detection, each typically set

10种光学检测与电性检测的机台,并通过将发光元件依序送入这些检测机台中,便可量测发光元件的光学性质与电性表现。 10 kinds of optical detection and electrical detection of a machine, and the light emitting element sequentially fed by the detector stations, optical properties and electrical performance can be measured in the light emitting element. 然而,这些机台所占的空间便无法有效地被缩减,意即检测发光元件的产线便无法被缩短。 However, the space occupied by these machines can not be effectively reduced, which means of detecting the light emitting element production line can not be shortened.

[0077] 反观本实施例的检测机台1000所揭露的结构,发光元件可设置于基板平台上,且在进行高温检测、低温检测与光学品质检测时无须移动发光元件,仅需移动所需的检测装置便可达到检测发光元件的目的。 [0077] In contrast detecting machine of the present embodiment 1000 of the disclosed structure, the light emitting element may be disposed on the substrate stage, and the high-temperature detection is performed without moving the light emitting element at a low temperature is detected with the optical quality inspection, only movement required detecting means can achieve the purpose of detecting the light emitting element. 因此本实施例的检测机台1000便可大大缩减传统检测机台的整体体积与数量。 Thus detection machine of the present embodiment can greatly reduce the overall volume of 1000 with the number of conventional detector station. 再者,本实施例的检测机台1000通过第一移动装置Ml、第二移动装置M2及移动台1700的使用,并搭配运算主机的控制,而具有自动化的优点。 Moreover, the machine according to the present embodiment detects the mobile device 1000 by the first of Ml, M2 and the second mobile device using a mobile station 1700, and with the control operation of the host, and has the advantage of automation. 另外,本实施例的检测机台1000通过影像感测装置1500的使用可取代人工目测检查发光二极管灯条上的多个发光二极管是否有被点亮,因此本实施例的检测机台1000具有快速、低人力成本且精准化的优点。 Further, the detection machine 1000 of the present embodiment by using the image sensing device 1500 may be substituted if a plurality of light emitting diodes on manual visual inspection of the LED bar has been lit, the present embodiment therefore detects machine embodiment 1000 of a fast low labor costs and precision of advantages.

[0078] 基于上述,本实施例也可提出一种检测方法,其适于对前述的发光元件1010进行光学及电性检测,如图4所示。 [0078] Based on the above, the present embodiment can also be provided a detection method which is suitable for the light emitting element 1010 is electrically and optically detected, as shown in FIG. 具体而言,此检测方法至少包括以下步骤。 More specifically, this detection method includes at least the following steps. 请参考图4的步骤SlOl,首先,提供前述的发光元件1010,其中发光元件1010例如是发光二极管灯条。 Please refer to FIG step SlOl 4, first, to provide the light-emitting element 1010, the light emitting element 1010, for example, wherein the light bar.

[0079] 接着,进行步骤S102,提供前述的探针机构1200,并使探针机构1200往前述的基板平台1100靠近而与发光元件1010接触,其中关于探针机构1200的作动方式可参考前述说明。 Probe means [0079] Next, step S102, provide the aforementioned 1200 and 1200 to probe the mechanism of the substrate stage 1100 close contact with the light emitting element 1010, on which the actuating mechanism embodiment probe 1200 may refer to the instructions.

[0080] 然后,进行步骤S103,加热发光元件1010,以使发光元件1010维持于前述的第一温度范围Tl内,其中加热方式可采用加热装置1300所提及的方法,在此不再赘述。 [0080] Then, the step S103, the heating light emitting element 1010, so that the light emitting element 1010 is maintained within the range of a first temperature Tl, wherein said heating means heating means may be employed 1300 mentioned methods, not described herein again. 具体而言,在加热发光元件1010的过程中,可利用前述的感温装置1600感测发光元件1010是否处于第一温度范围内Tl,如图4的步骤S301所示。 Specifically, during the heating of the light emitting element 1010 may be utilized in the temperature sensing means 1600 senses the light emitting element 1010 is within the range of a first temperature Tl, as shown in step S301 of FIG 4. 详细来说,若感温装置感测发光元件1010已处于第一温度范围内Tl时,便可继续后续的步骤S104;反之,若感温装置感测发光元件1010尚未处于第一温度范围内Tl时,便可加热发光元件1010。 In detail, if the temperature sensing device sensing the light emitting element 1010 is within the first temperature range is Tl, can continue the subsequent step S104; the other hand, if the temperature sensing device sensing the light emitting element 1010 is not already in a first temperature range Tl when, the light emitting element 1010 can be heated.

[0081] 接着,进行步骤S104,利用探针机构1200传递前述的第一驱动信号Sl至发光元件1010,以驱动发光元件1010。 [0081] Next, step S104, using the probe transfer mechanism 1200 of the first drive signal Sl to the light emitting element 1010, 1010 in order to drive the light emitting element. 其中第一驱动信号Sl可以是使用前述的电源供应装置来实施,请参考前述,在此不再说明。 Wherein the first drive signal Sl may use the power supply apparatus embodiment, please refer to the above, it will not be described herein.

[0082] 而后,进行步骤S105,感测并量测发光元件1010被第一驱动信号驱动Sl时所产生的第一发光影像。 [0082] Then, a step S105, sensing and measuring a first light-emitting light-emitting element 1010 is the first image driving signal Sl generated. 其中感测并量测发光元件1010的方式可采用前述的影像感测装置1500 所提及的方法,在此不再赘述。 Wherein the sensing and measuring the light emitting element 1010 can be the above-described embodiment of the image sensing apparatus 1500 mentioned methods, not described herein again. 至此,则完成一种高温检测的检测方法。 Thus, the detection method of the high-temperature detection is completed.

[0083] 接着,进行步骤S106,冷却发光元件1010,以使发光元件1010维持于前述的第二温度范围T2内,其中冷却的方式可采用冷却装置1400所提及的方法,在此不再赘述。 [0083] Next, step S106, cooling the light emitting element 1010, so that the light emitting element 1010 is maintained in the second temperature range T2, which can be cooled and the way the cooling device 1400 mentioned method, not described herein again . 具体而言,在冷却发光元件1010的过程中,可利用前述的感温装置1600感测发光元件1010是否处于第二温度范围内T2,如图4的步骤S302所示。 Specifically, in the process of cooling the light emitting element 1010 may be utilized in the temperature sensing means 1600 senses the light emitting element 1010 is within the second temperature range T2, as shown in step S302 in FIG 4. 详细来说,若感温装置感测发光元件1010已处于第一温度范围内Tl时,便可继续后续的步骤S107 ;反之,若感温装置感测发光元件1010尚未处于第二温度范围内T2时,便可冷却发光元件1010。 In detail, if the temperature sensing device sensing the light emitting element 1010 is within the first temperature range is Tl, can continue the subsequent step S107; the other hand, if the temperature sensing device sensing the light emitting element 1010 is not yet in a second temperature range T2 when, the light emitting element 1010 can be cooled.

[0084] 之后,进行步骤S107,利用探针机构1010传递前述的第二驱动信号S2至发光元件1010,以驱动发光元件1010。 After [0084], for step S107, the second driving signal 1010 is transmitted using the aforementioned probe means to the light emitting element S2 1010, 1010 to drive the light emitting element. 其中第二驱动信号S2同样地可使用前述的电源供应装置来实施,请参考前述,在此不再说明。 Wherein the second drive signal S2 in the same manner using the above-described embodiment to the power supply device, please refer to the above, it will not be described herein.

[0085] 接着,进行步骤S108,感测并量测发光元件1010被第二驱动信号S2驱动时所产生的第二发光影像,其中第二驱动信号S2大于第一驱动信号Si。 [0085] Next, step S108, and the amount of the second sensed image sensing light emission driving the light emitting element 1010 is generated by the second drive signal S2, wherein the second driving signal S2 is greater than the first drive signal Si. 同样地,感测并量测发光元件1010的方式可采用前述的影像感测装置1500所提及的方法,在此不再赘述。 Similarly, the sensing and measuring the light emitting element 1010 can be the above-described embodiment of the image sensing apparatus 1500 mentioned methods, not described herein again. 至此,则完成为一种低温检测的检测方法。 Thus, as a method for detecting low-temperature detection is completed.

[0086] 在图4的检测方法中,在使探针机构1200往基板平台1100靠近而与发光元件1010接触之前,上述检测方法还可包括利用前述的影像感测装置1500对发光元件1010进行定位,如步骤S201所示。 [0086] In the detection method of FIG. 4, before the probe means 1200 to 1100 is close to the substrate in contact with the platform, the light emitting element 1010, the detection method may comprise using the image sensing apparatus 1500 of the light-emitting element 1010 is positioned , as shown in step S201. 在本实施例中,在对发光元件1010进行定位之前,还可对发光元件1010进行一条码扫描,步骤S202所示。 In the present embodiment, the light emitting element 1010 prior to positioning, the light-emitting element 1010 can also performing a bar code scanning, as shown in step S202.

[0087] 需要说明的是,在冷却发光元件1010之后以及传递第二驱动信号S2至发光元件1010之前,上述检测方法还包括利用前述的影像感测装置1500,对发光元件1010的一外观或一位置进行检测,如步骤S203所示。 [0087] Incidentally, after the cooling before the light emitting element 1010 and 1010 a second driving signal S2 is transmitted to the light emitting element, the method further comprises detecting by the aforementioned image sensing device 1500, a light emitting element 1010, or the appearance of a detecting the position, as shown in step S203. 另外,在进行感测并量测第二发光影像的步骤后,上述检测方法还可对发光元件1010进行电性检测,如步骤S204所示,其中电性检测可以是Vf 检测、AVf检测及漏电流检测。 Further, the step of performing sensing and measuring a second emission image, the detection method described above may also be a light-emitting element 1010 is electrically detected, as shown in step S204, in which the electrical detection may be detected Vf, leakage detection and AVF Current Detection. 更进一步来说,在对发光元件1010进行电性检测的步骤后, 上述检测方法还可利用前述的光学检测装置1900对发光元件1010被驱动时所产生的光学特性进行量测,如步骤S205所示,其中光学特性的量测可以是量测发光元件1010的光学强度及光通量。 Still further, in the light emitting element 1010 is electrically detecting step, the detection method described above may also utilize an optical detection device 1900 of the optical characteristics of the light emitting element 1010 is driven by generated by measuring, as the step S205 shown, wherein the measured optical characteristics may be measured and the intensity of the optical flux of 1010 light emitting element.

[0088] 基于上述,本发明也可提供一种检测系统,其适于对前述发光元件进行光学及电性检测。 [0088] The present invention also provides a detection system based on which the light emitting element adapted to electrically and optically detected. 此检测系统包括前述基板平台、前述探针机构、前述加热装置、前述冷却装置以及前述影像感测装置。 This detection system comprises the substrate stage, the probe means, the heating means, the cooling means and the image sensing device. 发光元件配置于基板平台上。 A light emitting element disposed on the substrate internet. 探针机构往基板平台靠近而与发光元件接触。 Probe means close contact with the light emitting element to the substrate stage. 加热装置加热发光元件,以使发光元件维持于一第一温度范围内,并利用探针机构传递一第一驱动信号至发光元件,以驱动发光元件。 Heating means for heating the light emitting element to cause the light emitting element is maintained within a first temperature range, and transmits a first driving signal to the light emitting element with a probe mechanism to drive the light emitting element. 冷却装置冷却发光元件,以使发光元件维持于一第二温度范围内并利用探针机构传递一第二驱动信号至发光元件,以驱动发光元件。 Cooling means for cooling the light emitting element to the light emitting element is maintained within a second temperature range and with a probe mechanism for transmitting a driving signal to the second light emitting element, in order to drive the light emitting element. 影像感测装置适于感测并量测发光元件被第一驱动信号驱动时所产生的一第一发光影像,以及感测并量测发光元件被第二驱动信号驱动时所产生的一第二发光影像,其中第二驱动信号大于第一驱动信号。 Image sensing means adapted to sense and measure a first light emitting element emitting the first image generated by the driving signal, and sensing and measuring the light emitting element is driven during a second driving signal generated by a second luminescent image, wherein the second driving signal is greater than the first drive signal.

[0089] 在检测系统中,探针机构往基板平台靠近而与发光元件接触之前,检测系统还包括利用一影像感测装置对发光元件进行定位。 Before [0089] In the detection system, the probe mechanism close contact with the light emitting element to the substrate stage, the detection system further comprises a light-emitting element is positioned using an image sensing device. 此外,在对发光元件进行定位之前,检测系统还包括对发光元件进行一条码扫描。 Further, prior to positioning the light emitting element, the detection system further comprises a light emitting element performing a bar code scanning.

[0090] 在检测系统中,在冷却发光元件之后以及传递第二驱动信号至发光元件之前,检测系统还包括利用一影像感测装置,对发光元件的一外观或一位置进行检测。 [0090] In the detection system, and after cooling the light emitting element prior to transmitting a second light-emitting element driving signal, using the detection system further comprises an image sensing device, or the appearance of a position of a light emitting element is detected. 此外,在感测并量测第二发光影像之后,检测系统还包括对发光元件进行电性检测。 Further, after measuring the sensing and emitting a second image, the detection system further comprises a light-emitting element is electrically detected.

[0091] 在检测系统中,在冷却发光元件之后以及传递第二驱动信号至发光元件之前,检测系统还包括利用一影像感测装置,对发光元件的一外观或一位置进行检测。 [0091] In the detection system, and after cooling the light emitting element prior to transmitting a second light-emitting element driving signal, using the detection system further comprises an image sensing device, or the appearance of a position of a light emitting element is detected. 此外,在感测并量测第二发光影像之后,检测系统还包括对发光元件进行电性检测。 Further, after measuring the sensing and emitting a second image, the detection system further comprises a light-emitting element is electrically detected.

[0092] 在检测系统中,在对发光元件进行电性检测之后,检测系统还包括利用一光学检测装置对发光元件被驱动时所产生的光学特性进行量测。 [0092] In the detection system, after the light emitting element is electrically detected, the detection system further comprises an optical characteristic when the light emitting element is driven by generated by a measurement using optical detection means. 此外,在加热发光元件之后以及驱动发光元件之前,检测系统还包括利用一感温装置感测发光元件是否维持于第一温度范围内。 Further, in the drive before and after the heating element emitting the light emitting element, utilizing the detection system further comprises a temperature sensing means sensing the light emitting elements are sensing maintained within the first temperature range.

[0093] 另外,在冷却发光元件之后以及驱动发光元件之前,检测系统还包括利用一感温装置感测发光元件是否维持于第二温度范围内。 [0093] Further, before driving the light emitting element and a light emitting element after cooling, using a detection system further comprises sensing the temperature sensing means sensing whether a light emitting element maintained in the second temperature range. [0094] 需要说明的是,在检测系统中,加热装置与冷却装置的配置方式除了可以是采用如图1所绘示的共存于同一检测机台内,在其它可能的实施例中,加热装置与冷却装置也可以是分别位于不同机台内,以进行独立加热或冷却发光元件。 [0094] Incidentally, in the detection system, the arrangement of the heating means and the cooling means may be employed except that depicted in FIG. 1 coexist within the same machine is detected, in other possible embodiments, the heating means and cooling means may be located in different machines, for independently heating or cooling the light emitting element.

[0095] 综上所述,本发明的检测机台、检测方法与检测系统至少具有下列优点。 [0095] In summary, the detection machine, the detection methods and detection systems of the present invention has at least the following advantages. 通过将基板平台、探针机构、加热装置、冷却装置、影像感测装置、光学检测装置、感温装置以及移动台整合一起,因此将可大大缩减检测发光元件时所需的检测产线的体积与长度。 By integrating with the substrate stage, the probe means, heating means, cooling means, image sensing apparatus, an optical detecting means, temperature sensing means and the mobile station, thus greatly reducing the volume required for detection of the detection light emitting element production line and length. 意即本实施例的检测机台可在不移动位于基板平台的发光元件的情况下,进行高温检测、低温检测与光学品质检测。 Detection means the machine according to the present embodiment may be made without moving the light emitting element substrate stage performs temperature detection, detection of low-temperature detection and optical quality. 因此本实施例的检测机台便可大大缩减传统检测机台的整体体积与数量。 Thus detection machine of the present embodiment can greatly reduce the overall volume and the number of the conventional detector station.

[0096] 再者,本实施例的检测机台通过第一移动装置、第二移动装置及移动台的使用,并搭配运算主机的控制,而具有自动化的优点。 [0096] Furthermore, the detection machine of the present embodiment by the first mobile device, the second mobile device and the mobile station to use and control operation with the host computer, and has the advantage of automation.

[0097] 另外,本实施例的检测机台通过影像感测装置的使用可取代人工目测检查发光二极管灯条上的多个发光二极管是否有被点亮,因此本实施例的检测机台具有快速、低人力成本且精准化的优点。 [0097] Further, the present embodiment detects the machine by using the image sensing device may be substituted if a plurality of light emitting diodes on manual visual inspection of the LED bar has been lit, the detection machine of the present embodiment has a rapid low labor costs and precision of advantages.

[0098] 以上所述的仅为本发明的较佳实施例而已,不能以此限定本发明实施的范围,即大凡依本发明权利要求及发明说明内容所作的简单的等效变化与修饰,皆仍属本发明专利涵盖的范围内。 [0098] The above are merely preferred embodiments of the present invention only, not limiting the scope of this embodiment of the present invention, i.e., almost all under this invention and the claims of the invention described simple modifications and equivalent content made, are still within the scope of the present invention is covered by the patent. 另外本发明的任一实施例或权利要求不需达成本发明所揭露的全部目的或优点或特点。 Further according to the present invention according to any one embodiment or embodiments as claimed in claim need not achieve all the advantages or features disclosed by the present invention. 此外,摘要部分和标题仅是用来辅助专利文件搜寻之用,并非用来限制本发明的权利范围。 Further, the abstract and the headings are merely used to aid in searches of patent files, and is not intended to limit the scope of the present invention.

Claims (32)

1. 一种检测机台,适于对发光元件进行光学及电性检测,所述检测机台包括: 基板平台,其中所述发光元件配置于所述基板平台上;探针机构,设置于所述基板平台上方,且所述探针机构适于往所述基板平台靠近而与所述发光元件接触;加热装置,设置于所述基板平台的下方并适于加热所述发光元件,以使所述发光元件维持于一第一温度范围内,其中当所述发光元件处于所述第一温度范围内时,与所述发光元件接触的所述探针机构适于传递一第一驱动信号至所述发光元件,以驱动所述发光元件;冷却装置,设置于所述基板平台的下方并适于冷却所述发光元件,以使所述发光元件维持于一第二温度范围内,其中当所述发光元件处于所述第二温度范围内时,与所述发光元件接触的所述探针机构适于传递一第二驱动信号至所述发光元件,以驱动所述发光 1. A method for detecting the machine, the light emitting element adapted to electrically and optically detected, the detecting machine comprising: a substrate stage, wherein said light emitting element is disposed on the substrate stage; probe means, provided to the said platform above the substrate, and the probe means is adapted to contact the substrate with the platform near the light emitting element; heating means provided below said platform and adapted to heat the substrate to the light emitting element, so that the said light emitting element is maintained within a first temperature range, wherein when said light emitting element is within the first temperature range, the probe means in contact with the light emitting element is adapted to transfer a driving signal to the first said light emitting element to drive said light emitting element; a cooling device disposed below the substrate stage and adapted to cool the light emitting element to cause the light emitting element is maintained within a second temperature range, wherein when said when the light emitting element is within the second temperature range, the probe means in contact with the light emitting element is adapted to deliver a second driving signal to the light emitting element to drive said light emitting 元件;影像感测装置,设置于所述发光元件的上方并适于感测所述发光元件被驱动时所产生的一发光影像;感温装置,设置于所述发光元件的上方,用以感测所述发光元件目前的一温度;以及移动台,设置于所述发光元件的上方,且所述影像感测装置装设于所述移动台上,其中所述移动台适于移动所述影像感测装置。 Element; image sensing means, disposed above the light emitting element and emitting a light emitting element of the image sensor is driven adapted generated; temperature sensing means, disposed above the light emitting element, for sensing sensing the temperature of a light emitting element current; and a mobile station, disposed above the light emitting element, and the image sensing device mounted to said mobile station, wherein the mobile station is adapted to move the image sensing means.
2.如权利要求1所述的检测机台,其中所述基板平台包括输送带装置,适于承载并传送所述发光元件。 2. The detecting machine according to claim 1, wherein the substrate stage comprises a conveyor means adapted to carry and transmit said light emitting element.
3.如权利要求1所述的检测机台,其中所述加热装置包括加热块或加热板。 Detecting machine according to claim 1, wherein said heating means comprises a heating plate or heating block.
4.如权利要求1所述的检测机台,其中所述第一温度范围实质上落在摄氏120度与摄氏200度之间。 4. The detecting machine according to claim 1, wherein the first temperature range falls substantially between 120 ° C and 200 ° C.
5.如权利要求1所述的检测机台,其中所述冷却装置包括一循环水系统或一喷气系统。 5. The detecting machine according to claim 1, wherein said cooling means comprises a circulating water system or jet system.
6.如权利要求1所述的检测机台,其中所述第二温度范围实质上落在摄氏20度与摄氏70度之间。 The detecting machine as claimed in claim 1, wherein the second temperature range is substantially falls between 20 and 70 degrees Celsius degrees Celsius.
7.如权利要求1所述的检测机台,其中所述第二驱动信号大于小于所述第一驱动信号。 7. The detecting machine according to claim 1, wherein said second driving signal is greater than the first drive signal is less than.
8.如权利要求1所述的检测机台,其中所述影像感测装置包括一线扫描式电荷耦合元件(Line Scan CCD)0 8. The detecting machine according to claim 1, wherein said image sensing device comprises a charge coupled device scanning line (Line Scan CCD) 0
9.如权利要求1所述的检测机台,还包括一电源供应装置,电连接所述探针机构并提供所述第一驱动信号或所述第二驱动信号。 9. The detecting machine according to claim 1, further comprising a power supply device electrically connected to the probe means and providing the first drive signal or the second drive signal.
10.如权利要求1所述的检测机台,还包括一光学检测装置,设置于所述发光元件的上方并装设于所述移动台上,其中所述移动台适于移动所述光学检测装置,且所述光学检测装置适于感测所述发光元件被驱动时所产生的光学特性做量测。 10. The detecting machine according to claim 1, further comprising an optical detection means, disposed above the light emitting element on and mounted to said movable stage, wherein said mobile station is adapted to move said optical detection means and said optical detection means adapted to sense the optical characteristics of the light emitting element is generated by the drive to make measurements.
11.如权利要求1所述的检测机台,还包括一第一移动装置与一第二移动装置,其中所述第一移动装置位于所述基板平台的上方并适于移动所述探针机构,以使所述探针机构往所述基板平台靠近或远离,所述第二移动装置位于所述基板平台的下方并适于移动所述加热装置与所述冷却装置,以使所述加热装置与所述冷却装置其一往所述基板平台靠近。 11. The detecting machine according to claim 1, further comprising a first mobile device and a second mobile device, wherein the mobile device is located above the first substrate stage and adapted to move the probe means , so that the probe means towards or away from the substrate near the platform, the second moving means positioned below said platform and adapted to move the substrate with the cooling device of the heating apparatus, so that the heating means one close to the cooling device with the substrate stage.
12.如权利要求1所述的检测机台,还包括至少一吹气机构,位于所述基板平台的一侧或二侧,其中所述吹气机构适于提供一气流于所述发光元件上,以冷却所述发光元件。 12. The detecting machine according to claim 1, further comprising at least one blow mechanism, located on one side or both sides of the substrate stage, wherein said air blowing means adapted to provide an airflow on the light emitting element to cool the light emitting element.
13.如权利要求1所述的检测机台,还包括运算主机与界面卡,所述运算主机通过所述界面卡,以移动所述探针机构、所述加热装置、所述冷却装置、所述移动台至少其一,或是撷取所述影像感测装置与所述感温装置至少其一的数据。 13. The detecting machine according to claim 1, further comprising calculating a host interface card, the operation by the host interface card, to move the probe means, said heating means, said cooling means, the said one mobile station, or data of at least the image capturing device and the sensing of the temperature sensing means at least one.
14.如权利要求13所述的检测机台,其中所述界面卡包括运动控制卡或影像撷取卡。 14. The detecting machine according to claim 13, wherein said interface card comprises a motion control card or frame grabber.
15.如权利要求1所述的检测机台,其中所述发光元件包括发光二极管灯条(LED light bar)ο 15. The detecting machine according to claim 1, wherein said light emitting element comprises an LED light bar (LED light bar) ο
16. 一种检测方法,适于对一发光元件进行光学及电性检测,所述检测方法包括: 提供一发光元件;提供一探针机构,并使所述探针机构往所述基板平台靠近而与所述发光元件接触; 加热所述发光元件,以使所述发光元件维持于一第一温度范围内; 利用所述探针机构传递一第一驱动信号至所述发光元件,以驱动所述发光元件; 感测并量测所述发光元件被所述第一驱动信号驱动时所产生的一第一发光影像; 冷却所述发光元件,以使所述发光元件维持于一第二温度范围内; 利用所述探针机构传递一第二驱动信号至所述发光元件,以驱动所述发光元件;以及感测并量测所述发光元件被所述第二驱动信号驱动时所产生的一第二发光影像,其中所述第二驱动信号大于所述第一驱动信号。 16. A detection method, a light emitting element adapted to electrically and optically detecting the detection method comprising: providing a light emitting element; providing a probe means, said probe means and the substrate stage close to contact with the light emitting element; heating the light emitting element to cause the light emitting element is maintained within a first temperature range; means the probe is transmitted using a first drive signal to the light emitting element to drive the said light emitting element; sensing and measuring a first light emitting image of the light emitting element driven by the first drive signal generated; cooling the light emitting element to cause the light emitting element is maintained in a second temperature range inside; means the probe is transmitted using a second driving signal to the light emitting element to drive said light emitting element; and a sensing and measuring the light emitting element is generated by said second drive signal is a emitting a second image, wherein said second driving signal is greater than the first drive signal.
17.如权利要求16所述的检测方法,在使所述探针机构往所述基板平台靠近而与所述发光元件接触之前,还包括:利用一影像感测装置对所述发光元件进行定位。 17. The detecting method according to claim 16, said probe means in contact with said light emitting element into the substrate close to the platform, the method further comprising: positioning the light-emitting element using an image sensing device .
18.如权利要求17所述的检测方法,在对所述发光元件进行定位之前,还包括: 对所述发光元件进行一条码扫描。 18. The detecting method according to claim 17, before the light emitting element is positioned, further comprising: performing a light-emitting element of the bar code scanning.
19.如权利要求16所述的检测方法,在冷却所述发光元件之后以及传递所述第二驱动信号至所述发光元件之前,还包括:利用一影像感测装置,对所述发光元件的一外观或一位置进行检测。 19. Before The detection method according to claim 16, after cooling the light emitting element and transmitting the second driving signal to the light emitting element, further comprising: an image sensing device, said light-emitting element an appearance or a detection position.
20.如权利要求16所述的检测方法,在感测并量测所述第二发光影像之后,还包括: 对所述发光元件进行电性检测。 20. The detecting method according to claim 16, after the sensing and measuring the second emission image, further comprising: the light emitting element is electrically detected.
21.如权利要求20所述的检测方法,在对所述发光元件进行电性检测之后,还包括: 利用一光学检测装置对所述发光元件被驱动时所产生的光学特性进行量测。 21. The detecting method according to claim 20, after the light emitting element is electrically detected, further comprising: when the optical characteristics of the light emitting element is generated by driving of a measurement using optical detection means.
22.如权利要求16所述的检测方法,在加热所述发光元件之后以及驱动所述发光元件之前,还包括:利用一感温装置感测所述发光元件是否维持于第一温度范围内。 22. The detecting method according to claim 16, after the heating and before the light-emitting element driving the light emitting element, further comprising: sensing whether a temperature sensing means sensing said light emitting element is maintained within the first temperature range.
23.如权利要求16所述的检测方法,在冷却所述发光元件之后以及驱动所述发光元件之前,还包括:利用一感温装置感测所述发光元件是否维持于第二温度范围内。 23. The detecting method according to claim 16, after cooling and prior to the light emitting element driving the light emitting element, further comprising: sensing whether a temperature sensing means sensing said light emitting element is maintained within a second temperature range.
24. 一种检测系统,适于对一发光元件进行光学及电性检测,所述检测系统包括: 基板平台,其中所述发光元件配置于所述基板平台上;探针机构,往所述基板平台靠近而与所述发光元件接触;加热装置,加热所述发光元件,以使所述发光元件维持于一第一温度范围内,并利用所述探针机构传递一第一驱动信号至所述发光元件,以驱动所述发光元件;冷却装置,冷却所述发光元件,以使所述发光元件维持于一第二温度范围内并利用所述探针机构传递一第二驱动信号至所述发光元件,以驱动所述发光元件;以及影像感测装置,感测并量测所述发光元件被所述第一驱动信号驱动时所产生的一第一发光影像,并感测并量测所述发光元件被所述第二驱动信号驱动时所产生的一第二发光影像,其中所述第二驱动信号大于所述第一驱动信号。 24. A detection system, a light emitting element adapted to electrically and optically detecting the detection system comprising: a substrate stage, wherein said light emitting element is disposed on the substrate stage; probe means into said substrate internet close contact with the light emitting element; heating means for heating the light emitting element to cause the light emitting element is maintained within a first temperature range, and using the probe drive mechanism for transmitting a first signal to the a light emitting element to drive said light emitting element; a cooling means for cooling the light emitting element to cause the light emitting element is maintained within a second temperature range by said probe means and a second driving signal is transmitted to the light emitting element for driving the light emitting element; and an image sensing device, the sensing and emitting an amount of a first image sensing when the light emitting element driven by the first drive signal generated, and said sensing and measuring emitting a second image of the second light emitting element drive signal is generated, wherein said second driving signal is greater than the first drive signal.
25.如权利要求24所述的检测系统,其中在使所述探针机构往所述基板平台靠近而与所述发光元件接触之前,还包括利用影像感测装置对所述发光元件进行定位。 25. The detection system according to claim 24, wherein said probe means in contact with said light emitting element into the substrate close to the platform, the method further comprising positioning the light emitting element using the image sensing apparatus.
26.如权利要求25所述的检测系统,其中在对所述发光元件进行定位之前,还包括对所述发光元件进行一条码扫描。 26. The detection system according to claim 25, wherein prior to positioning the light emitting element, the light emitting element further comprising performing a bar code scanning.
27.如权利要求M所述的检测系统,其中在冷却所述发光元件之后以及传递所述第二驱动信号至所述发光元件之前,还包括利用影像感测装置,对所述发光元件的一外观或一位置进行检测。 27. The detection system of claim M, wherein after cooling the light emitting element and the second drive signal is transmitted to the light emitting element, the method further comprising using an image sensing device, a pair of said light emitting element appearance or a detection position.
28.如权利要求M所述的检测系统,其中在感测并量测所述第二发光影像之后,还包括对所述发光元件进行电性检测。 28. The detection system of claim M, wherein after the sensing and measuring the second emission image, further comprising the light emitting element is electrically detected.
29.如权利要求观所述的检测系统,其中在对所述发光元件进行电性检测之后,还包括利用一光学检测装置对所述发光元件被驱动时所产生的光学特性进行量测。 Concept 29. The detection system of claim, wherein after the light emitting element is electrically detected, further comprising an optical characteristic when the driving of the light emitting element is generated by a measurement using optical detection means.
30.如权利要求M所述的检测系统,其中在加热所述发光元件之后以及驱动所述发光元件之前,还包括利用一感温装置感测所述发光元件是否维持于第一温度范围内。 M of the detecting system as claimed in claim 30., wherein after heating the light emitting element and the light emitting element prior to driving, further comprising temperature sensing using a sensing device sensing whether the light emitting element is maintained within the first temperature range.
31.如权利要求M所述的检测系统,其中在冷却所述发光元件之后以及驱动所述发光元件之前,还包括利用一感温装置感测所述发光元件是否维持于第二温度范围内。 M detection system according to claim 31, wherein after cooling the light emitting element and the light emitting element prior to driving, further comprising using a temperature sensing means sensing whether a light emitting element sensing the temperature maintained within the second range.
32.如权利要求M所述的检测系统,其中所述加热装置与所述冷却装置共存于同一检测机台内,或者是分别位于不同机台内,以独立加热或冷却所述发光元件。 M of the detecting system as claimed in claim 32., wherein said heating means and said cooling means detecting coexist within the same machine or machines are located in different, independent heating or cooling the light emitting element.
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