CN104502829A - Flip LED (light emitting diode) chip on-line detecting method - Google Patents
Flip LED (light emitting diode) chip on-line detecting method Download PDFInfo
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- CN104502829A CN104502829A CN201410853302.3A CN201410853302A CN104502829A CN 104502829 A CN104502829 A CN 104502829A CN 201410853302 A CN201410853302 A CN 201410853302A CN 104502829 A CN104502829 A CN 104502829A
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Abstract
The invention discloses a flip LED chip on-line detecting method. The method comprises that, when in work, enabling a conveying system to convey a disc worktable to an appropriate working area; after adjusting the pose of the disc worktable, starting a detecting alignment system to control a probe worktable, enabling a probe to be in contact with a chip to be test to power on the chip and accordingly enabling the chip to emit light, then detecting the chip through a light receiving testing module. The flip LED chip on-line detecting method can successfully solve the problem that the electrode and the light emitting surface of a flip LED chip electrode are on different sides; meanwhile, by means of the precise image movement control technology, high-speed and precise testing of flip LED chips can be achieved, and the chip detecting efficiency can be improved. The flip LED chip on-line detecting method solves the problem that the electrode and the light emitting surface of the flip LED chip electrode are on the different sides, and through cooperation with high-precision control parts, can achieve rapid on-line detection of the flip LED chips.
Description
Technical field
The invention belongs to flip LED chips field tests, more specifically, relate to a kind of flip LED chips online test method.
Background technology
Flip LED chips is than traditional packed LED chip, light efficiency and production cost all have improvement in various degree, the importance of flip LED chips is also more outstanding, simultaneously also new requirement is proposed to the detection technique of its correspondence and equipment, flip LED chips online detection instrument is for completing the detection of flip LED chips photoelectric parameter and generating unified data file by parametric classification, cooperated with LED screening installation realizes the classification to flip LED chips, improving product added value.
Existing LED chip checkout equipment spininess is to packed LED chip, and along with the large-scale application of flip LED chips, and the checkout equipment of conventional packed LED chip also can not simply indiscriminately imitate use, therefore, detection testing apparatus and the method for developing new flip LED chips also seem very important thereupon, such as patent documentation CN103149524A of the prior art discloses a kind of test machine and method of testing thereof of flip LED chips, but this kind of test machine and method of testing have following technological deficiency: (1) does not consider the quick-fit realizing each building block how better, (2) do not consider how the efficiency how improving and receive optical tests and measuring accuracy improve.Along with the fast development of LED industry and the raising of flip LED chips production technology, must research and develop better for the quick online detection equipment of flip LED chips.
Summary of the invention
For above defect or the Improvement requirement of prior art, the invention provides a kind of flip LED chips online test method, solve intelligent, the quick and accurate test problem of flip LED chips thus.
For achieving the above object, according to one aspect of the present invention, provide a kind of flip LED chips online test method, this online test method comprises following step:
(I) transport transmission assembly and the chip to be tested on objective table is moved to scanning area, the camera in Precision alignment systems scans the pose of flip LED chips to be tested in described disc;
(II) after completing steps (I), transport transmission assembly by objective table namely will be tested chip to be tested move to the top of the receipts light mouth of the integrating sphere received in optical tests assembly;
(III) the integrating sphere jacking gear in described receipts optical tests assembly moves upward and drives described integrating sphere to rise, and makes the receipts light mouth of this integrating sphere aim at the emission side of flip LED chips to be tested and press close to described disc;
(IV) the probe jacking gear in probe test platform controls probe and moves downward and aim at the two poles of the earth of flip LED chips, after aligning, probe base on described probe test platform is energized and lights flip LED chips to described probe, and after described receipts optical tests assembly receipts light, transmission is given follow-up optical parametric analytical equipment and completed test;
(V) after completing above-mentioned testing procedure, described integrating sphere moves downward, described probe moves upward, whole flip LED chips proving installation drives described disc due to the point of next flip LED chips to be tested under the motion of described transport transmission assembly, again complete completing steps (I)-(V) thus, until complete the test of the upper all flip LED chips of described disc (111).
Further, the mode of this pose of scanning in described step (1) is: utilize image identifying and processing, calculate the motion vector coordinate that flip LED chips each to be tested that array on described disc puts moves to the transport transmission assembly in region to be tested, and the testing sequence of flip LED chips each to be tested on the good described disc of planning.
In general, the above technical scheme conceived by the present invention compared with prior art, can obtain following beneficial effect:
(1) according to the on-line checkingi that the present invention realizes, the problem of flip LED chips electrode and light-emitting area not homonymy can successfully be solved;
(2) simultaneously, the present invention adopts precision profile movement control technology, realizes worktable High-speed precision positioning, accelerates chip detection efficiency.
In a word, adopt design of the present invention, there is the outstanding features such as design is ingenious, positioning precision is high, complete machine stability is good.
Accompanying drawing explanation
Fig. 1 is the general illustration of the device of the online test method performing flip LED chips of the present invention;
Fig. 2 is the partial schematic diagram of the device of the online test method performing flip LED chips of the present invention;
Fig. 3 is the integrally-built vertical view of the device of the online test method performing flip LED chips of the present invention.
In all of the figs, identical Reference numeral is used for representing identical element or structure, wherein:
1-bench top module 2-receives optical tests assembly 3-and transports 8-detection zone, transmission assembly 4-probe test platform 5-Precision alignment systems 6-quartz glass 7-scanning area 9-base 10-support 11-objective table 111-disc 12-shaft rotating motor 21-integrating sphere assembly 211-integrating sphere module 212-integrating sphere fixture 213-integrating sphere jacking gear 2131-air cylinder fixed plate 2132-propulsion cylinder 2111-integrating sphere 2112-integrating sphere 90 ° of adapter 22-optic test assembly 221-brightness probe 222-optical fiber 223-anti-dazzling screen 31-X axle module 32-Y axle module 311-X axle pedestal 312-X axis rail 313-X axial brake device 321-Y axle pedestal 322-Y axis rail 323-Y axial brake device 41-probe base 42-probe base jacking gear 43-probes
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.In addition, if below in described each embodiment of the present invention involved technical characteristic do not form conflict each other and just can mutually combine.
Online test method based on the LED flip LED chips of on-line measuring device of the present invention comprises following step:
(1) top that the upper chip to be tested of objective table 11 is moved to the receipts light mouth of integrating sphere 2111 by transmission assembly 3 is transported;
(2) integrating sphere jacking gear 213 moves upward and makes integrating sphere 2111 increase and as far as possible close to disc 111, make integrating sphere 2111 aim at the emission side of flip LED chips to be tested;
(3) probe test platform 4 controls probe 43 and moves downward and the two poles of the earth aiming at flip LED chips;
(4) probe base 41 is energized and lights flip LED chips to probe 43, and integrating sphere 2111 is received light and sent and give follow-up optical parametric analytical equipment and complete test.
Take turns after test completes at this, integrating sphere 2111 moves downward, probe test platform 4 moves upward, thus adjust the position of disc 111 further, next flip LED chips to be tested is made to move to the top of integrating sphere 2111, thus completing steps (1)-(4) again, until complete the test of flip LED chips all on disc 111.
The flip LED chips LED on-line measuring device performing flip LED chips online test method of the present invention comprises:
Bench top module 1, receipts optical tests assembly 2, transport transmission assembly 3, probe test platform 4, Precision alignment systems 5,
Wherein bench top module 1 comprises objective table 11, shaft rotating motor 12;
Wherein receive optical tests assembly 2 and comprise integrating sphere module 21 and optic test assembly 22, wherein integrating sphere module 21 comprises integrating sphere module 211, integrating sphere fixture 212, integrating sphere jacking gear 213;
Wherein integrating sphere module 211 comprises integrating sphere 2111, integrating sphere 90 ° of adapters 2112; Optic test assembly 22 comprises brightness probe 221, optical fiber 222 and follow-up optical parametric analytical equipment; Integrating sphere jacking gear 213 comprises air cylinder fixed plate 2131, propulsion cylinder 2132;
Transport transmission assembly 3 comprises X-axis module 31, Y-axis module 32; Wherein X-axis module 31 comprises X-axis pedestal 311, X-axis guide rail 312, and drives described X-axis pedestal 311 along the reciprocating X-axis drive unit 313 of X-axis guide rail 312, and this X-axis drive unit can be motor etc.; Y-axis module 32 comprises Y-axis pedestal 321, Y-axis guide rail 322, and drives described Y-axis pedestal 321 along the reciprocating X-axis drive unit 323 of Y-axis guide rail 322, and this Y-axis drive unit can be motor etc.
Wherein probe test platform 4 comprises probe base 41, probe base jacking gear 42, probe 43; The controlled manufacturing probe seat 41 of probe base jacking gear 42 moves up and down, thus control probe 43 contacts with the pin of flip LED chips to be tested and departs from, and probe base 41 is energized to probe 43, thus realize the optical parametric test under the energising illuminating state of LED chip.
Precision alignment systems 5 comprises two vision systems, and one is positioned at 7, one, scanning area and is positioned at detection zone 8;
The whole installation situation of flip LED chips on-line measuring device involved in the present invention is as follows:
Flip LED chips LED on-line measuring device of the present invention is arranged on a base 9, base is arranged a support 10; Transport transmission assembly 3 is for loading LED flip LED chips to be tested, and it is arranged at the below of support 10, and receive optical tests assembly 2 and be arranged on the Y-axis pedestal 321 of Y-axis module 32, probe test platform 4 is arranged on support 10.
Objective table 11 is transported to detection zone by the motion being arranged at the transport transmission assembly 3 under support 10, the probe test platform 4 be arranged on support 10 controls probe 43 and contacts with the pin of LED flip LED chips to be tested, LED luminescence chip is lighted in energising, the emission side of flip LED chips to be tested aimed at by the receipts optical tests assembly 3 be arranged on base 9, and then detects its optical parametric.
Wherein objective table 11 is arranged on Y-axis pedestal 321, can along with Y-axis pedestal 321 to-and-fro movement in the Y direction under the effect of Y-axis drive unit, wherein objective table 11 is provided with disc 111, it is used for loading flip LED chips to be tested, wherein also be provided with electric rotating machine 12, its transmission shaft is arranged at the below of objective table 11, realizes the rotary motion of objective table thus realizes the rotary motion of disc 111, reaching the object of the pose adjusting LED flip LED chips to be tested;
In the present invention, the principle of work of on-line checkingi single unit system is as follows:
First by the transmission X-axis module 31 of transport assembly 3, Y-axis module 32, objective table 11 is moved to the below of the vision system of scanning area 7, the attitude of disc is adjusted by electric rotating machine 12, carry out vision setting, vision setting comprises the attitude on disc 111, and disc 111 moves to the coordinate transmitting transport assembly 3 motion time test section carries out testing.
Disc 111 after having scanned is transported to the below of the vision system of detection zone 8 by transmission transport assembly 3, after completing, the probe base jacking gear 42 of probe test platform 4 is elevated, treat that the needle point of the probe 43 in probe base 41 touches chip, the adjustment integrating sphere 2111 received in optical tests assembly 2 rises and pushes up the flip LED chips to be tested of placement on nearly disc 111, and carry out examination inspection, examination inspection is by starting the detection carrying out optical parametric afterwards, after completing on-line checkingi, probe 43 rises, the X-axis module 31 of transport transmission assembly 3, Y-axis module 32 and shaft rotating motor 12 coordinate adjustment bench top module 1, the probe 43 on probe base 41 is made to aim at LED flip LED chips next to be tested, carry out the detection of next chip, so repeatedly.
Wherein the concrete facilities of receipts optical tests assembly 2 of the present invention is as follows:
Wherein receive optical tests assembly 2 part and be positioned at bench top module 1, the end of integrating sphere fixture 212 arranges integrating sphere jacking gear 213, integrating sphere jacking gear 213 comprises air cylinder fixed plate 2131, propulsion cylinder 2132, air cylinder fixed plate 2131 is fixed on the bottom surface of support 10, propulsion cylinder 2132 main body is fixed on the bottom surface of air cylinder fixed plate 2131, the telescopic shaft of propulsion cylinder is connected with integrating sphere fixture 212, thus realizes the elevating movement of integrating sphere 2111.
Objective table 11 is the rack form of a hollow, be provided with the disc 111 loading flip LED chips array to be tested, be fixedly installed on the pedestal 321 of Y-axis under it, integrating sphere 2111 is positioned at the hollow space of objective table 11, it can move up and down at hollow space, and objective table 11 carries out the pose rotating flip LED chips to be tested on adjustment disc 111 under the effect of shaft rotating motor 12.
The side of integrating sphere 2111 is connected to follow-up optical parametric analytical equipment by optical fiber 222, the other side of integrating sphere 2111 is provided with brightness probe 221, the light-emitting window of integrating sphere 2111 is provided with anti-dazzling screen 223, wherein the bottom of the light-emitting window of integrating sphere 2111 is also provided with integrating sphere 90 ° of adapters 2112, the optical routing vertical direction receiving light is converted into the direction of level by it, even if thus integrating sphere 2111 is when vertical side moves upward, also the impact of bending etc. can not be brought on the optical fiber 222 of the test transmission light signal of the follow-up connection of integrating sphere 2111, thus cause the loss of test light signal.
Those skilled in the art will readily understand; the foregoing is only preferred embodiment of the present invention; not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (2)
1. a flip LED chips online test method, is characterized in that, this online test method comprises following step:
(I) transport transmission assembly (3) and the chip to be tested on objective table (11) is moved to scanning area (7), the camera in Precision alignment systems (5) scans the pose of flip LED chips to be tested in described disc (111);
(II) after completing steps (I), transport transmission assembly (3) by objective table (11) namely will be tested chip to be tested move to the top of the receipts light mouth of the integrating sphere (2111) received in optical tests assembly (2);
(III) the integrating sphere jacking gear (213) in described receipts optical tests assembly (2) moves upward and drives described integrating sphere (2111) to rise, and makes the receipts light mouth of this integrating sphere (2111) aim at the emission side of flip LED chips to be tested and press close to described disc (111);
(IV) the probe jacking gear (43) in probe test platform (4) controls probe (43) and moves downward and aim at the two poles of the earth of flip LED chips, after aligning, probe base (41) on described probe test platform (4) is energized to described probe (43) and lights flip LED chips, and after described receipts optical tests assembly (2) receipts light, transmission is given follow-up optical parametric analytical equipment and completed test;
(V) after completing above-mentioned testing procedure, described integrating sphere (2111) moves downward, described probe (43) moves upward, whole flip LED chips proving installation drives described disc (111) to move to the point of next flip LED chips to be tested under the motion of described transport transmission assembly (3), again complete completing steps (I)-(V) thus, until complete the test of the upper all flip LED chips of described disc (111).
2. flip LED chips online test method as claimed in claim 1, it is characterized in that, the mode of this pose of scanning in described step (1) is: utilize image identifying and processing, calculate the motion vector coordinate that described disc (111) flip LED chips each to be tested that above array is put moves to the transport transmission assembly (3) in region to be tested, and plan the testing sequence of the flip LED chips each to be tested on good described disc (111).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410853302.3A CN104502829B (en) | 2014-12-31 | 2014-12-31 | A kind of flip LED chips online test method |
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| CN201410853302.3A CN104502829B (en) | 2014-12-31 | 2014-12-31 | A kind of flip LED chips online test method |
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| CN104502829A true CN104502829A (en) | 2015-04-08 |
| CN104502829B CN104502829B (en) | 2018-06-12 |
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| CN108445378A (en) * | 2018-06-06 | 2018-08-24 | 广州市雅江光电设备有限公司 | A kind of LED drive board test device |
| WO2018161239A1 (en) * | 2017-03-06 | 2018-09-13 | 邹霞 | Automatic chip testing apparatus |
| CN113324739A (en) * | 2021-06-04 | 2021-08-31 | 盐城东紫光电科技有限公司 | Using method of MiniLED detection equipment with point-to-point multi-optical-path optical component |
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| CN104502829B (en) | 2018-06-12 |
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Effective date of registration: 20151222 Address after: 430074 Hubei Province, Wuhan city Hongshan District Luoyu Road No. 1037 Applicant after: Huazhong University of Science and Technology Address before: 430074 Hubei Province, Wuhan city Hongshan District Luoyu Road No. 1037 Applicant before: Huazhong University of Science and Technology Applicant before: Guangdong Zhicheng Huake Photoelectric Equipment Co., Ltd. |
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