CN113324739A - Using method of MiniLED detection equipment with point-to-point multi-optical-path optical component - Google Patents

Using method of MiniLED detection equipment with point-to-point multi-optical-path optical component Download PDF

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Publication number
CN113324739A
CN113324739A CN202110622493.2A CN202110622493A CN113324739A CN 113324739 A CN113324739 A CN 113324739A CN 202110622493 A CN202110622493 A CN 202110622493A CN 113324739 A CN113324739 A CN 113324739A
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array
leds
point
led
probe
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魏伟
黄飞
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Yancheng Dongzi Optoelectronics Technology Co ltd
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Yancheng Dongzi Optoelectronics Technology Co ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02Testing optical properties
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02Testing optical properties
    • G01M11/0207Details of measuring devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor

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  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)

Abstract

The invention discloses a using method of MiniLED detection equipment with a point-to-point multi-optical-path optical component, which comprises the following steps: tiling a blue film with an array of LEDs onto a platform member; step two: adjusting the LED array to be adaptive to the probe array; step three: pricking array probes to corresponding electrodes of the array LEDs; step four: controlling the power supply to be electrified through a computer program, measuring the photoelectric parameters of the array LED at the same time, and positioning the measured position of the LED; step five: controlling a moving motor to prick the probe on the electrode of the next batch of LEDs through a computer program and measuring; step six: and repeating the fourth step, the fifth step, the fourth step and the fifth step to measure the LED photoelectric parameters of all the arrays once and store the measured LED photoelectric parameters by combining the positioning data. The scheme introduces the use method of the MiniLED detection equipment with the point-to-point multi-light-path optical component, and the detection of the array LED can be quickly realized through the use method, so that the working efficiency is improved, the measurement time is shortened, the cost is reduced, and the profit is increased.

Description

Using method of MiniLED detection equipment with point-to-point multi-optical-path optical component
Technical Field
The invention relates to the technical field of photoelectricity, in particular to a using method of MiniLED detection equipment with a point-to-point multi-optical-path optical component.
Background
The traditional LED test equipment adopts a multi-array test mode, photoelectric parameters of a batch of LEDs are measured one by adding pulse current one by one, and because the LEDs need to be electrified one by one, the consumed time is long, the cost is high, and a low-cost detection method is lacked. The MiniLED detection equipment with the point-to-point multi-optical-path optical component can realize the simultaneous measurement of the photoelectric parameters of a batch of LEDs through the point-to-point multi-optical-path optical component without measuring the photoelectric parameters of each LED one by one.
In order to solve the technical problems, the invention provides a using method of a MiniLED detection device with a point-to-point multi-optical-path optical component.
Disclosure of Invention
The invention aims to provide a using method of MiniLED detection equipment with a point-to-point multi-optical-path optical component, which aims to solve the problems that the conventional optical detection efficiency proposed by the background technology is low and damaged LEDs cannot be picked up simultaneously.
In order to achieve the purpose, the invention provides the following technical scheme: a method for using a MiniLED detection device with a point-to-point multi-optical-path optical component comprises the following steps: tiling a blue film with an array of LEDs onto a platform member; step two: adjusting the LED array to be adaptive to the probe array; step three: pricking array probes to corresponding electrodes of the array LEDs; step four: controlling the power supply to be electrified through a computer program, measuring the photoelectric parameters of the array LED at the same time, and positioning the measured position of the LED; step five: controlling a moving motor to prick the probe on the electrode of the next batch of LEDs through a computer program and measuring; step six: and repeating the fourth step and the fifth step, measuring the photoelectric parameters of the LEDs of all the arrays once, and storing the measured photoelectric parameters by combining the positioning data.
Further, the first step: the blue film with the LED array is laid on the platform component, and the distance between the positioning components on the platform component is at least one group larger than the diameter of the LED array.
Further, the second step: and adjusting the LED array to be adaptive to the probe array, wherein the adjustment of the direction of the LED array to be parallel to the direction of the probe array is included, and the adjustment of the distance between the LED array and the probe array is equal.
Further, step three: the array probes are punched onto the corresponding electrodes of the array LEDs, a step that requires the probes not to penetrate the electrodes.
Further, step four: the power supply is controlled to be electrified through a computer program, photoelectric parameters of the array LEDs are measured at the same time, the positions of the LEDs are measured through positioning, light rays emitted after the array LEDs are electrified enter the array detector through the point-to-point multi-light-path optical component to be detected, the multi-light-path optical component does not influence each other, the photoelectric parameters of the array LEDs are detected by different detectors at the same time, and the positions of the LEDs are measured through the positioning component and the positioning system.
Further, step five: and controlling a moving motor to prick the probe on the electrode of the next batch of LEDs through a computer program and measuring, wherein the moving motor firstly moves downwards to separate the electrode from the electrode, then moves horizontally to make the probe pair the next batch of LEDs, then moves upwards to prick the probe on the electrode of the next batch of LEDs, and then measures.
Further, step six: and repeating the fourth step and the fifth step to measure the LED photoelectric parameters of all the arrays once and store the measured photoelectric parameters by combining with the positioning data, wherein the measured photoelectric parameters are stored by combining with the corresponding positioning data when a batch of array LEDs are measured.
Compared with the prior art, the invention has the beneficial effects that: the detection of the array LED can be realized quickly, the working efficiency is improved, the measuring time is shortened, the cost is reduced, and the profit is increased.
Drawings
Fig. 1 is a schematic structural diagram of an LED device with both detecting and picking functions according to the present invention.
Fig. 2 is a schematic flow chart of a method for using a MiniLED inspection apparatus with a point-to-point multi-optical-path optical component according to the present invention.
In the figure: 1. the point-to-point array light path optical component comprises a point-to-point array light path optical component, 2, an array probe, 3, a moving platform, 4, a moving motor, 5, a shading and light transmitting component, 6, a circuit control system, 7, an array spectrometer, 71, an integrating sphere, 72, an optical fiber, 8, a MiniLED chip point light source, 9, an array LED, 10, a special CCD, 11, a special light source, 12, a positioning component, 21, a hollow light transmitting part and 22, a light transmitting part emitted by the LED is not transmitted.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a MiniLED detection device with a point-to-point multi-light-path optical component comprises a point-to-point array light-path optical component 1, an array probe 2, a moving platform 3, a moving motor 4, a shading and light-transmitting component 5, a circuit control system 6, an array spectrometer 7, a special CCD10, a special light source 11 and a positioning component 12.
A method for using a MiniLED detection device with a point-to-point multi-optical-path optical component comprises the following steps: tiling the blue film with the LED array on top of the platform part 3; step two: adjusting the LED array to be adaptive to the probe array 2; step three: pricking the array probe 2 to a corresponding electrode of the array LED; step four: controlling the power supply to be electrified through a computer program, measuring the photoelectric parameters of the array LED at the same time, and positioning the measured position of the LED; step five: controlling a moving motor to prick the probe on the electrode of the next batch of LEDs through a computer program and measuring; step six: and repeating the fourth step and the fifth step, measuring the photoelectric parameters of the LEDs of all the arrays once, and storing the measured photoelectric parameters by combining the positioning data.
Further, the first step: the blue film with the LED array is laid on top of the platform part 3, the distance between the positioning parts on the platform part being at least one set larger than the diameter of the LED array.
Further, the second step: and adjusting the LED array to be adaptive to the probe array 2, wherein the adjustment of the direction of the LED array to be parallel to the direction of the probe array 2 is included, and the adjustment of the distance between the LED array and the probe array 2 is equal.
Further, step three: the array probes 2 are stuck to the corresponding electrodes of the array LED, which requires that the probes do not penetrate the electrodes.
Further, step four: the power supply is controlled to be electrified through a computer program, photoelectric parameters of the array LED9 are measured at the same time, the position of the LED9 is measured through positioning, light rays emitted by the array LED9 after being electrified enter the array detector through the point-to-point multi-light-path optical component 1 to be detected, the photoelectric parameters of the array LED9 are detected by different detectors at the same time due to the fact that the multi-light-path optical component does not influence each other, and the positions of the LEDs are measured through the positioning component 12 and the positioning system.
Further, step five: and controlling a moving motor to prick the probe on the electrode of the next batch of LEDs through a computer program and measuring, wherein the moving motor firstly moves downwards to separate the electrode from the electrode, then moves horizontally to make the probe pair the next batch of LEDs, then moves upwards to prick the probe on the electrode of the next batch of LEDs, and then measures.
Further, step six: and repeating the fourth step and the fifth step to measure the LED photoelectric parameters of all the arrays once and store the measured photoelectric parameters by combining with the positioning data, wherein the measured photoelectric parameters are stored by combining with the corresponding positioning data when a batch of array LEDs are measured.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes, modifications, equivalents and improvements may be made without departing from the spirit and scope of the invention.

Claims (6)

1. A method for using a MiniLED detection device with a point-to-point multi-optical-path optical component comprises the following steps: tiling a blue film with an array of LEDs onto a platform member; step two: adjusting the LED array to be adaptive to the probe array; step three: pricking array probes to corresponding electrodes of the array LEDs; step four: controlling the power supply to be electrified through a computer program, simultaneously measuring the photoelectric parameters of the array LEDs and positioning the positions of the measured LEDs, wherein light rays emitted by the electrified array LEDs enter the array detector through the point-to-point multi-light-path optical component for detection, the photoelectric parameters of the array LEDs are simultaneously detected by different detectors due to mutual noninterference of the multi-light paths, and the positions of the LEDs are measured through the positioning component and the positioning system; step five: controlling a moving motor to prick the probe on the electrode of the next batch of LEDs through a computer program and measuring; step six: and repeating the fourth step and the fifth step, measuring the photoelectric parameters of the LEDs of all the arrays once, and storing the measured photoelectric parameters by combining the positioning data.
2. The method of using a MiniLED inspection apparatus with point-to-point multi-optical path optics as claimed in claim 1, wherein: the method comprises the following steps: the blue film with the LED array is laid on the platform component, and the distance between the positioning components on the platform component is at least one group larger than the diameter of the LED array.
3. The method of using a MiniLED inspection apparatus with point-to-point multi-optical path optics as claimed in claim 2, wherein: step two: and adjusting the LED array to be adaptive to the probe array, wherein the adjustment of the LED array direction is parallel to the probe array direction, and the adjustment of the LED array interval is equidistant to the probe array interval.
4. The method of using a MiniLED inspection apparatus with point-to-point multi-optical path optics as claimed in claim 3, wherein: step three: the array probes are punched onto the corresponding electrodes of the array LEDs, a step that requires the probes not to penetrate the electrodes.
5. The method of using a MiniLED inspection apparatus with point-to-point multi-optical path optics as claimed in claim 4, wherein: step five: and controlling a moving motor to prick the probe on the electrode of the next batch of LEDs through a computer program and measuring, wherein the moving motor firstly moves downwards to separate the electrode from the electrode, then moves horizontally to make the probe pair the next batch of LEDs, then moves upwards to prick the probe on the electrode of the next batch of LEDs, and then measures.
6. The method of using a MiniLED inspection apparatus with point-to-point multi-optical path optics as claimed in claim 5, wherein: step six: and repeating the fourth step and the fifth step to measure the LED photoelectric parameters of all the arrays once and store the measured photoelectric parameters by combining with the positioning data, wherein the measured photoelectric parameters are stored by combining with the corresponding positioning data when a batch of array LEDs are measured.
CN202110622493.2A 2021-06-04 2021-06-04 Using method of MiniLED detection equipment with point-to-point multi-optical-path optical component Pending CN113324739A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113791326A (en) * 2021-09-08 2021-12-14 严群 Equipment for realizing photoelectric performance test of LED device by injecting current into dielectric layer

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CN103323762A (en) * 2013-06-07 2013-09-25 华南理工大学 Detection device and method for LED chip and device
CN104502829A (en) * 2014-12-31 2015-04-08 华中科技大学 Flip LED (light emitting diode) chip on-line detecting method
CN205786991U (en) * 2016-04-05 2016-12-07 天津三安光电有限公司 A kind of LED wafer chip test system
CN106206352A (en) * 2016-08-24 2016-12-07 北京信息科技大学 A kind of micro-nano semiconductor light electrical characteristics three-dimensional detection system
CN206248310U (en) * 2016-12-01 2017-06-13 深圳市标谱半导体科技有限公司 Tiny electronic elements test light-dividing device
CN207300546U (en) * 2017-09-29 2018-05-01 东莞商铌孚自动化设备科技有限公司 A kind of light source filtration apparatus of the bright test of LED COB microdots
CN210040133U (en) * 2019-06-10 2020-02-07 义乌臻格科技有限公司 Huge detection system for photoelectric performance of micro surface-emitting photoelectric chip array
CN111610177A (en) * 2020-06-11 2020-09-01 北京大学 Raman enhancement detection method and device for micro LED chip

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201216391A (en) * 2010-10-11 2012-04-16 Ind Tech Res Inst Detection method and detection device for LED chips on wafer and transparent probe card thereof
US20120105836A1 (en) * 2010-11-01 2012-05-03 Samsung Led Co., Ltd. Apparatus for measuring optical properties of led package
CN103323762A (en) * 2013-06-07 2013-09-25 华南理工大学 Detection device and method for LED chip and device
CN104502829A (en) * 2014-12-31 2015-04-08 华中科技大学 Flip LED (light emitting diode) chip on-line detecting method
CN205786991U (en) * 2016-04-05 2016-12-07 天津三安光电有限公司 A kind of LED wafer chip test system
CN106206352A (en) * 2016-08-24 2016-12-07 北京信息科技大学 A kind of micro-nano semiconductor light electrical characteristics three-dimensional detection system
CN206248310U (en) * 2016-12-01 2017-06-13 深圳市标谱半导体科技有限公司 Tiny electronic elements test light-dividing device
CN207300546U (en) * 2017-09-29 2018-05-01 东莞商铌孚自动化设备科技有限公司 A kind of light source filtration apparatus of the bright test of LED COB microdots
CN210040133U (en) * 2019-06-10 2020-02-07 义乌臻格科技有限公司 Huge detection system for photoelectric performance of micro surface-emitting photoelectric chip array
CN111610177A (en) * 2020-06-11 2020-09-01 北京大学 Raman enhancement detection method and device for micro LED chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113791326A (en) * 2021-09-08 2021-12-14 严群 Equipment for realizing photoelectric performance test of LED device by injecting current into dielectric layer

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