201224488rw 36339twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有Μ於-種檢測機台、檢測方法盘檢測系 統，且特別是有關於-種低成本及高良率的檢顯台、檢 測方法與檢測系統。 【先前技術】 傳統上為了對發光元件(如：發光二極舰條)進行各 種光學檢測與電性檢測，通常會設置各種絲檢測盘電性 檢測的機台，並透過將發光元件依序送入這些檢測機台 中，便可㈣發光元件之光學性f與電性表現。具體而言°， 發光元件經由回焊爐後之餘溫目檢判別為一站，並利用^手 動調，電源，應器及探針機構點燈，之後利用目檢檢測 LED是否點亮及外觀檢驗’如此高溫狀態無法確保，且一 位目檢人員僅檢測一組發光元件之燈條。 於高溫電性檢測後進行低溫電性檢測時，需先將發光 元件冷卻，其採用方式可以是透過製程移動或等待之bJ間 做冷卻，或加裝風機等冷卻裝置(如此便需一站）。 再者，進行利用自動光學檢測（Auto 〇ptic Inspecti〇n， AOI)對發光元件進行外觀檢測時，通常是用來檢測發光 兀件偏位缺焊等問題，其中此A〇I檢測通常為自動化機台。 再者，進行利用自動光學檢測對發光元件進行光學檢 測時，通常是用來檢測發光元件之光學特性，其中此 檢測通常為自動化機台。 干 201224488 L^szivv/v iTW 36339twf.doc/n 之後，進行低溫電性檢測亦是透過 因此此部份又為-站，且電性檢測的方式=== 件是否點亮及外㈣燈’剌用目檢檢測發先元 ，於上述可知’若欲將發光元件進行高 間，思即檢測發光元件之生產線便無法被縮短了 °二 【發明内容】 本發明提供一種檢 高良率及整體體積較小的具有低成本、自動化、 本發明另提供一種檢剩方法，其適用於上述的檢測 本發明又提供一種檢測系統，其適用於上述的檢測 本發明提出一種檢測機台，1 學及電性_。此檢_纟〃、料讀進行光一力，-冷卻裝置、 一感溫震置以及—移動4 先學檢測 —探針機構設置於基板平:广件配置於基板平 基板平台靠近而與發光元件接；方=針機構適於往 Γ㈣圍内。當發 “件接觸的探針機構適於傳遞-第===: 台 機 台 機 裝置 台上 201224488 i-ciuy/ulTW 36339twf.doc/n 件，以驅動發光元件。冷卻裝置設置於 元件，以使發光元件維持於- 構適於傳遞—第二顆動訊號至發光元件，= 發先兀件。雜❹，纽發光元狀上錢適於^ 測發光兀件被驅動時所產生的—發光影像及其外觀。感、: 2設置於發光元件的上方，用以感測發光元件目前的二 狐又。移動台設置於發光元件之上方，且影像感測裝置 設於移動台上，其巾㈣台適於義影像感測裝置。、 在本發明之-實施例中，基板平台包括一輸送帶裝置， 適於承載並傳送發光元件。 熱 板 在本發明之-實施例中，加熱裝置包括一加熱塊或加 在本發明之一實施例中 120度與攝氏2〇〇度之間。 在本發明之一實施例中 一喷氣系統 在本發明之一實施例中 2〇度與攝氏70度之間。 .在本發明之一實施例中 動訊號。 第—溫度範圍實質上落在攝氏 冷卻裝置包括一循環水系統或 第二溫度範圍實質上落在攝氏 第二驅動訊號大於小於第一驅 在本發明之一實施例中，影像感測裝置包括一線掃瞄式 電荷耦合元件(Line Scan CCD)。 在本發明之一實施例中’檢測機台更包括一電源供應裝 201224488 36339twfd〇c/n 在本:ί:機二：:第-_峨或第二驅動訊號。 置，設置於發光元件之上方並=測機台更包括-光學檢測裝 台適於移動光學檢嶋，且光;移動 元件被驅動時職生的絲雜做=裝置雜感測發光 在本發明之一實施例令，檢 、’ 置與一第二移動裳置，其中第一移機°更包括一第一移動裝 方並適於移動探針機構，錢探^機板平台之上 遠離，第二移動裝置位於其 機構彺基板平台靠近或 裝置盥冷卻f置、πί 之下方並適於移動加埶 1^冷以置’以使加熱裝置與冷卻裝置其-往基板ΐ 在本發明之-實施例中，檢測 構，位於基板平台的一侧或二側 機 一氣流於發光元H冷卻發光= 提供 一介Ht·;實施例中，檢測機台更包括—運算主_ £、介面卡，以移動探針機構、加^ 置、冷部I置、移動台至少其一，或 刀熱衷 與感溫裝置至少其一的資料。 < 疋擷取衫像感崎置 影像1 本Γ之—實施射，介*卡包括-運動控制卡或- 條二:二-實施例中’發先元件包括-發光二極體燈 -本發明另提出—種檢測方法，其適於對 、 行光學及電性檢測。此檢測方法至少包括以下步驟。$先進 201224488201224488rw 36339twf.doc/n VI. Description of the Invention: [Technical Field of the Invention] The present invention is directed to a detection machine and a detection method disk detection system, and particularly relates to a low-cost and high-yield inspection. Display station, detection method and detection system. [Prior Art] Traditionally, in order to perform various optical detection and electrical detection on a light-emitting element (such as a light-emitting diode package), a machine for detecting the electrical properties of the wire detection disk is usually provided, and the light-emitting elements are sequentially sent. Into these test machines, (4) the optical properties and electrical performance of the light-emitting elements. Specifically, the light-emitting element is discriminated by the residual temperature after the reflow oven as a station, and is manually lit, the power source, the detector, and the probe mechanism are turned on, and then the visual inspection is used to detect whether the LED is lit and the appearance. Inspection 'This high temperature condition cannot be ensured, and a visual inspection person only detects the light bar of a group of light-emitting elements. When performing low-temperature electrical detection after high-temperature electrical detection, the light-emitting element needs to be cooled first, and the method may be to perform cooling by bJ between the process moving or waiting, or to install a cooling device such as a fan (so one station is needed) . Furthermore, when the appearance of the light-emitting element is detected by automatic optical inspection (Auto 〇ptic Inspecti〇n, AOI), it is usually used to detect problems such as unevenness of the light-emitting element, and the A〇I detection is usually automated. Machine. Further, when optical detection of the light-emitting element by automatic optical detection is performed, it is usually used to detect the optical characteristics of the light-emitting element, and the detection is usually an automated machine. After 201224488 L^szivv/v iTW 36339twf.doc/n, the low-temperature electrical detection is also passed through, so this part is again - station, and the way of electrical detection === whether the piece is lit and the outside (four) lamp'目Using visual inspection to detect the first element, it can be seen from the above that if the light-emitting element is to be made high, the production line for detecting the light-emitting element cannot be shortened. [Invention] The present invention provides a high-inspection yield and overall volume. Smaller, low-cost, and automated, the present invention further provides a method for detecting the remaining, which is suitable for the above-mentioned detection. The invention further provides a detection system suitable for the above-mentioned detection. The present invention provides a detection machine, 1 Sex _. This inspection _ 纟〃 料 料 料 料 料 料 料 料 料 - - - - - - - - - - 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 冷却 探针 探针Connected; square = needle mechanism is suitable for the Γ (4) circumference. When the "contacting probe mechanism is suitable for transmission - the ===: on the table machine table 201224488 i-ciuy/ulTW 36339twf.doc/n pieces to drive the light-emitting elements. The cooling device is placed on the component to The light-emitting element is maintained in a structure suitable for transmission - the second motion signal to the light-emitting element, = the first element. The noise, the light-emitting element is suitable for measuring the light-emitting element generated when the light-emitting element is driven. Image and its appearance. Sense, 2: disposed above the light-emitting element for sensing the current two-fox of the light-emitting element. The mobile station is disposed above the light-emitting element, and the image sensing device is disposed on the mobile station, and the towel (d) a suitable image sensing device. In the embodiment of the invention, the substrate platform comprises a conveyor device adapted to carry and transport the light emitting elements. The hot plate is in the embodiment of the invention, the heating device comprises A heating block or addition between 120 degrees Celsius and 2 degrees Celsius in one embodiment of the invention. In one embodiment of the invention a jet system is 2 degrees Celsius and 70 degrees Celsius in one embodiment of the invention Between the embodiments of the present invention The first temperature range falls substantially in the Celsius cooling device including a circulating water system or the second temperature range substantially falls below the Celsius second driving signal is greater than the first driving in an embodiment of the present invention, image sensing The device comprises a line scan CCD. In one embodiment of the invention, the detection machine further comprises a power supply device 201224488 36339twfd〇c/n in the present: ί: machine 2:: _ 峨 or the second driving signal. Set, above the illuminating element and = the measuring machine further includes - the optical detecting station is suitable for moving optical inspection, and the light; when the moving element is driven In one embodiment of the present invention, the device is configured to detect a second mobile device, wherein the first mobile device further includes a first mobile device and is adapted to move the probe mechanism. Moving away from the platform of the board, the second moving device is located near the mechanism 彺 substrate platform or below the device 盥 cooling, πί and is suitable for moving the heating 1 冷 cooling to set the heating device and the cooling device Substrate ΐ in the present invention - In the embodiment, the detecting structure is located on one side or two sides of the substrate platform, and a gas flow is emitted to the illuminating element H to cool the illuminating light; providing a Ht·; in the embodiment, the detecting machine further includes an operation main _ £, an interface card, Moving the probe mechanism, adding, cooling part I, moving the table at least one, or the knife is keen on the data of at least one of the temperature sensing devices. < 疋撷 衫 像 像 感 置 影像 影像 影像 影像 — — Shooting, mediation, card-including motion control card or - strip two: two - in the embodiment, 'the first component includes - the light-emitting diode lamp - the invention further proposes a detection method, which is suitable for optics, optics and electricity Sex detection. This detection method includes at least the following steps. $Advanced 201224488
iiW 36339twf.doc/n =兔光2件。接著，提供—探針機構，並使探針機構 在基板平台減而與發光元件接觸。然後，加熱發光元件， 以使發光元件轉於—第—溫度範_。料，利用探針 機構傳遞-第-驅動訊號至發光元件，轉動發光元件。 而後感測並1：測發光元件被第__驅動訊號驅動時所產生 的第發光影像。接著，冷卻發光元件，以使發光元件 維持於-第二溫度範圍内。之後，湘探針機構傳遞一第 二驅動訊號至發光元件，以驅動發光元件。接著，感測並 量測發光元件被第二驅動訊號驅動時所產生的一第二發光 影像，其中第二驅動訊號大於第一驅動訊號。 在本發明之一實施例中，在使探針機構往基板平台靠 近而與發光元件接觸之前’上述檢測方法更包括利用一影像 感測裝置對發光元件進行定位。在本發明之一實施例中， 在對發光元件進行定位之前，上述檢測方法更包括對發光元 件進行一條碼掃瞄。 在本發明之一實施例中，在冷卻發光元件之後以及傳 遞第二驅動訊號至發光元件之前，上述檢測方法更包括利用 一影像感測裝置，對發光元件的一外觀或一位置進行檢測。 在本發明之一實施例中，在感測並量測第二發光影像 之後’上述檢測方法更包括對發光元件進行電性及光學檢 測。 本發明又提出一種檢測系統’其適於對前述發光元件 進行光學及電性檢測。此檢測系統包括前述基板平台、前述 探針機構、前述加熱裝置、前述冷卻裝置以及前述影像感 201224488 …1 v w υ 1TW 3 6339twf. doc/n 測f置。發光元件配置於基板平台上。探針機構往基板平 台罪近而與發光元件接觸。加熱裝置加熱發光元件，以使 發光元件維持於-第—溫度範_，並·探針機構傳遞 一第一驅動訊號至發光元件，以驅動發光元件。冷卻裝置 冷卻發光元件，以使發光元件維持於一第二溫度範圍内並 利用探針機構傳遞一第二驅動訊號至發光元件，以驅動發 光元件。影像感測裝置適於感測並量測發光元件被第一驅 • 動訊號驅動時所產生的一第一發光影像，以及感測並量測 發光元件被第二驅動訊號驅動時所產生的一第二發光影 像，其中第二驅動訊號大於第一驅動訊號。 在本發明之一實施例中，在使探針機構往基板平台靠 近而與發光元件接觸之前，上述檢測系統更包括利用一影像 感測裝置對發光元件進行定位。在本發明之一實施例中， 在對發光元件進行定位之前，上述檢測系統更包括對發光元 件進行一條碼掃目苗。 在本發明之一實施例中，在冷卻發光元件之後以及傳 _ 遞第二驅動訊號至發光元件之前，上述檢測系統更包括利用 一影像感測裝置，對發光元件的一外觀或一位置進行檢測。 在本發明之一實施例中，在感測並量測第二發光影像 之後’上述檢測系統更包括對發光元件進行電性及光學檢 測。 基於上述’本發明之透過將基板平台、探針機構、加 熱裝置、冷卻裝置、影像感測裝置、感溫裝置以及移動台 整合一起’因此將可大大縮減檢測發光元件時所需之檢測 201224488 1 VU / \J 1TW 36339twf.doc/n 產線的體積與長度。意即本實施例之檢測機台可在不 位於基板平台的發光元件的情況下，進行高溫檢測 檢測與光學品質檢測。因此本實施例之檢測機台便可大: 縮減傳統檢測機台之整體體積與數量。 為讓本發明之上述特徵和優點能更明顯易懂，下 舉實施例，並配合所附圖式作詳細說明如下。 、 【實梅方式】 圖1為本發明-實施例之檢測機㈣簡單示意圖，圖 2則為圖1之檢測機台之具體實施之局部立體示意圖，而 圖3則為圖2之檢測機台的局部放大示意圖。請同時參考 圖卜圖2與圖3 ’本實施例之檢測機台1000適於對一發 光元件1010進行光學及電性檢測。具體而言，檢測機^ 1000包括—基板平台_、一探針機構聰、-加= 置聊、-冷卻裝置觸、一影像感測裝置1500…感 溫裝置1_以及-機e 17GG。發光元件麵配置於基 板平舍1100上。在本實施例中，基板平台11〇〇是以如圖 2與圖3_示之輸送帶裝置⑽作為舉例說明，但不限 = 言，輸送帶裝置⑽可用以承載發光元件 ’並可傳送發光元件1〇1〇至固定位置上。另外，本實 施例之發光元件麵例如是—種發光二極體之燈 light bar)。 探針機構1200設置於基板平台11〇〇上方，且探針機 構1200適於往基板平台篇靠近而與發光元件删接 201224488 Lbl00701TW 36339twf.doc/n 觸。具體而言，檢測機台1000可包括一第一移動裝置M1， 其中第一移動裝置Ml位於基板平台1100之上方並適於移 動探針機構1200,以便使探針機構12〇〇可往基板平台11〇〇 靠近或遠離，如圖1、圖2與圖3所繪示。一般來說，探 針機構1200主要是來施加電壓或電流於發光元件1〇1〇 上1以使發光元件1010產生光束。之後便可藉由所施加之 電壓或電流大小而檢測發光元件1010之品質。換言之，探 1機構1200 ^要是在用來進行檢測發光元件丨嶋之步驟 120〇H機構1200便會靠近基板平台1UG使得探針機構 機構光凡件1G1G接觸並電性連接’其中關於探針 說明，以^施加之電壓或電流訊號至發光元件1G1〇上的 於構的作動將會於後續的段落中進行說明。 基板二‘η考圖1'圖2與圖3，加熱裝置簡設置於 光元件Q_二方t適於力撕元件刪，以使發 中，加熱裝置溫度範®T1在本實施例 言，當於来开彼，可以是採用加熱塊或加熱板。具體而 測發光元件回焊爐之製程結束後，接著可先量 此，本實_^=溫時被鶴的電性及光學表現。因 1100之下麵便可透過設置於基板平台 而使發光元件置_對發光林咖進行加熱， -溫度範圍T1 ^ ΐ在第—溫度範圍T1内，其中此第 需要說明的是，I ^上洛在攝氏120度與攝氏200度之間。 熱之前，前述的探針U置測對發Μ件1_進行加 機構1200便得先往靠近基板平台移 201224488iiW 36339twf.doc/n = 2 pieces of rabbit light. Next, a probe mechanism is provided and the probe mechanism is brought into contact with the light-emitting elements on the substrate platform. Then, the light-emitting element is heated to turn the light-emitting element to the -first temperature range. The probe mechanism transmits a -first-drive signal to the light-emitting element to rotate the light-emitting element. Then, the first illuminating image generated when the illuminating element is driven by the __ drive signal is measured. Next, the light-emitting element is cooled to maintain the light-emitting element within the -second temperature range. Thereafter, the Xiang probe mechanism transmits a second driving signal to the light emitting element to drive the light emitting element. Then, a second illuminating image generated when the illuminating element is driven by the second driving signal is sensed and measured, wherein the second driving signal is greater than the first driving signal. In one embodiment of the invention, the detecting method further includes positioning the light emitting element with an image sensing device before the probe mechanism is brought closer to the substrate platform to contact the light emitting element. In an embodiment of the invention, the detecting method further comprises performing a code scan on the illuminating element before locating the illuminating element. In an embodiment of the invention, after the illuminating the illuminating element and before transmitting the second driving signal to the illuminating element, the detecting method further comprises detecting an appearance or a position of the illuminating element by using an image sensing device. In an embodiment of the invention, after sensing and measuring the second illuminating image, the detecting method further comprises electrically and optically detecting the illuminating element. The present invention further provides a detection system 'which is adapted for optical and electrical detection of the aforementioned light-emitting elements. The detection system includes the substrate platform, the probe mechanism, the heating device, the cooling device, and the image sense 201224488 ... 1 v w υ 1TW 3 6339 twf. doc/n. The light emitting element is disposed on the substrate platform. The probe mechanism is in close proximity to the substrate platform and is in contact with the light-emitting element. The heating means heats the light emitting element to maintain the light emitting element at - the first temperature range, and the probe mechanism transmits a first driving signal to the light emitting element to drive the light emitting element. The cooling device cools the light emitting element to maintain the light emitting element in a second temperature range and transmit a second driving signal to the light emitting element by the probe mechanism to drive the light emitting element. The image sensing device is adapted to sense and measure a first illuminating image generated when the illuminating element is driven by the first driving signal, and to sense and measure the one generated when the illuminating element is driven by the second driving signal The second illuminating image, wherein the second driving signal is greater than the first driving signal. In one embodiment of the invention, the detection system further includes positioning the illuminating element with an image sensing device prior to bringing the probe mechanism closer to the substrate platform and contacting the illuminating element. In one embodiment of the invention, prior to positioning the illuminating element, the detection system further includes performing a one-step sweep of the illuminating element. In an embodiment of the invention, after the illuminating the illuminating element and before transmitting the second driving signal to the illuminating element, the detecting system further comprises: detecting an appearance or a position of the illuminating element by using an image sensing device. . In one embodiment of the invention, after sensing and measuring the second illuminating image, the detection system further includes electrically and optically detecting the illuminating element. Based on the above-mentioned 'integration of the substrate platform, the probe mechanism, the heating device, the cooling device, the image sensing device, the temperature sensing device, and the mobile station together', the detection required for detecting the light-emitting element can be greatly reduced 201224488 1 VU / \J 1TW 36339twf.doc/n Volume and length of the production line. That is, the detecting machine of the embodiment can perform high temperature detection detection and optical quality detection without the light emitting elements of the substrate platform. Therefore, the detection machine of the embodiment can be large: the overall volume and quantity of the conventional inspection machine are reduced. The above described features and advantages of the present invention will be more apparent from the following description. Fig. 1 is a simplified schematic view of a detecting machine (four) according to the present invention, and Fig. 2 is a partial perspective view of the specific embodiment of the detecting machine of Fig. 1, and Fig. 3 is a detecting machine of Fig. 2. A partial enlarged view of the figure. Please refer to FIG. 2 and FIG. 3 at the same time. The detecting machine 1000 of the present embodiment is suitable for optical and electrical detection of a light-emitting element 1010. Specifically, the detecting machine 1000 includes a substrate platform _, a probe mechanism Cong, a plus = chat, a cooling device touch, an image sensing device 1500, a temperature sensing device 1_, and a machine e 17GG. The light-emitting element surface is disposed on the substrate board 1100. In the present embodiment, the substrate platform 11 is illustrated by the conveyor belt device (10) as shown in FIG. 2 and FIG. 3, but not limited to, the conveyor belt device (10) can be used to carry the light-emitting element and transmit light. The component is 1〇1〇 to a fixed position. Further, the light-emitting element surface of the present embodiment is, for example, a light bar of a light-emitting diode. The probe mechanism 1200 is disposed above the substrate platform 11A, and the probe mechanism 1200 is adapted to be close to the substrate platform and is connected to the light-emitting component 201224488 Lbl00701TW 36339twf.doc/n. Specifically, the detecting machine 1000 can include a first moving device M1, wherein the first moving device M1 is located above the substrate platform 1100 and is adapted to move the probe mechanism 1200 so that the probe mechanism 12 can be moved to the substrate platform. 11〇〇 is close to or away from, as shown in Fig. 1, Fig. 2 and Fig. 3. In general, the probe mechanism 1200 primarily applies a voltage or current to the light-emitting element 1〇1〇1 to cause the light-emitting element 1010 to generate a light beam. The quality of the light-emitting element 1010 can then be detected by the magnitude of the applied voltage or current. In other words, the probe mechanism 1200 ^ is in the step 120 for detecting the light-emitting element 〇, the H mechanism 1200 will be close to the substrate platform 1UG, so that the probe mechanism mechanism light member 1G1G contacts and is electrically connected. The operation of the applied voltage or current signal to the light-emitting element 1G1〇 will be described in the following paragraphs. The substrate 2'ηFig. 1'Fig. 2 and Fig. 3, the heating device is simply disposed on the optical element Q_ two squares t is suitable for the force tearing element to be removed, so that the heating device temperature range T1 is in this embodiment, When it comes to the other, it can be a heating block or a heating plate. Specifically, after the process of measuring the reflowing furnace of the light-emitting device is finished, the amount can be measured first, and the actual _^= is the electrical and optical performance of the crane. Since the underside of the 1100, the illuminating element can be placed on the substrate platform to heat the illuminating forest coffee, and the temperature range T1 ^ ΐ is in the first temperature range T1, wherein the first requirement is that Between 120 degrees Celsius and 200 degrees Celsius. Before the heat, the aforementioned probe U is placed on the substrate 1 and the substrate 1200 is moved to the substrate platform.
Lmuu/uiTW 36339twf.doc/n 動’使得探針機構1200可與發光元件i〇10接觸並電性連 接。 接著’當加熱裝置1300對發光元件1〇1〇加熱於第一 溫度範圍T1内時，探針機構1200此時便可傳遞一第一驅 動訊號S1至發光元件1〇1〇，以驅動發光元件1〇1〇，使發 光元件1010產生光線。在本實施例中，檢測機台1〇〇〇可 有包括一電源供應裝置1800，其中電源供應裝置180〇電 性連接採針機構1200並提供前述第一驅動訊號si。在本 實施例中，第一驅動訊號S1例如是一電流訊號，其中此 電流訊號的大小實質上可為50uA。 另外，影像感測裝置1500設置於發光元件1010之上 方並適於感測發光元件1010被驅動時所產生的一發光影 像，如圖1、圖2與圖3所繪示。具體而言，當探針機構 1200於前述第一溫度範圍T1内驅動發光元件1〇1〇，並使 發光元件1010產生光線時，本實施例之檢測機台1〇〇〇便 可透過影像感測裝置15〇〇感測發光元件1〇1〇被驅動時所 產生的光線，並同時快速檢測發光二極體燈條上之發光二 極體是否皆有被點亮，從而判斷在高溫的狀態下發光元件 1010是否為有效之發光元件。在本實施例中，影像感測裝 置1500可採用一種線掃瞄式電荷耦合元件152〇(LineScan CCD)，其可快速地掃瞄與感測發光元件1〇1〇之發光狀 況。相較於傳統採用人工視覺來判斷發光二極體燈條上之 複數個發光二極體是否有被點亮，本實施例之檢測機台 1000具有快速且精準化之優點。 12 201224488The Lmuu/uiTW 36339twf.doc/n actuator enables the probe mechanism 1200 to be in contact with and electrically connected to the light-emitting element i〇10. Then, when the heating device 1300 heats the light-emitting element 1〇1〇 in the first temperature range T1, the probe mechanism 1200 can transmit a first driving signal S1 to the light-emitting element 1〇1〇 to drive the light-emitting element. 1〇1〇 causes the light-emitting element 1010 to generate light. In this embodiment, the detecting machine 1A may include a power supply device 1800, wherein the power supply device 180 is electrically connected to the needle picking mechanism 1200 and provides the first driving signal si. In this embodiment, the first driving signal S1 is, for example, a current signal, wherein the current signal has a size of substantially 50 uA. In addition, the image sensing device 1500 is disposed above the light emitting device 1010 and is adapted to sense a light emitting image generated when the light emitting device 1010 is driven, as shown in FIG. 1 , FIG. 2 and FIG. 3 . Specifically, when the probe mechanism 1200 drives the light-emitting element 1〇1〇 in the first temperature range T1 and the light-emitting element 1010 generates light, the detection machine 1 of the embodiment can transmit the image sense. The measuring device 15 〇〇 senses the light generated when the light-emitting element 1〇1〇 is driven, and simultaneously detects whether the light-emitting diodes on the light-emitting diode light bar are all lit, thereby judging the state at a high temperature. Whether or not the lower light-emitting element 1010 is an effective light-emitting element. In the present embodiment, the image sensing device 1500 can employ a line scan type charge coupled device 152 (LineScan CCD) that can quickly scan and sense the light-emitting state of the light-emitting element 1〇1〇. Compared with the conventional use of artificial vision to determine whether or not a plurality of light-emitting diodes on the light-emitting diode strip are illuminated, the detecting machine 1000 of the present embodiment has the advantages of being fast and precise. 12 201224488
Ltiuu/uiTW 36339twf.doc/n 請繼續參考圖1、圖2與圖3，感溫裝置1600設置於 發光元件1010的上方，用以感測發光元件1〇1〇目前的溫 度。具體而言，感溫裝置16〇〇例如是一紅外線熱 置二其可在不接觸發光元件1〇1〇之情況下，直接地感ί發 光元件目前之溫度。因此，本實施例之檢測機台1〇〇〇便可 透過感溫裝置1600而隨時監控前述之加熱裝置13〇〇是否 將發光兀件1010加熱至第一溫度範圍T1内，其中倘若未Ltiuu/uiTW 36339twf.doc/n Referring to FIG. 1, FIG. 2 and FIG. 3, the temperature sensing device 1600 is disposed above the light emitting element 1010 for sensing the current temperature of the light emitting element 1〇1〇. Specifically, the temperature sensing device 16 is, for example, an infrared heat sensor which directly senses the current temperature of the light-emitting element without contacting the light-emitting element 1〇1〇. Therefore, the detecting machine 1 of the present embodiment can monitor whether the heating device 13 is heated to the first temperature range T1 by the heating device 1600 through the temperature sensing device 1600, wherein if
加熱至第—溫度範圍T1内則可使加熱裝置1300繼續加 熱。 在檢測機台1000中，冷卻裝置1400是設置於基板平 台1100之下方並適於冷卻發光元件1〇1〇，以使發光元件 1010維持於一第二溫度範圍T2内，如圖丨、圖2與圖3 所繪示。在本實施例中，冷卻裝置_包括一循環水系統 或-噴氣系統。具體而言’當發光元件簡G於高溫狀能下 檢測發光元件誦之發綠況後，接著可麵發光^件 1010於低溫時被麟的電性及光學表現。目此，本實 之檢測機台1_便可透過設置於基板平台膽之下 丨姻對發光元件1G1G進行冷卻，域發光元件 1010維持於第二溫度範圍T2内，其中此第二溫度範圍Τ2 實質上落在攝氏20度與攝氏70度之間。同樣地，在 ，置1勘對發光元件丨⑽進行冷卻前，前述的探針赌 須先與發光元件1010接觸並電性連接。也就是說 在前述高溫檢職，探針機構12⑽其實可以仍保持與發光 7L件1010接觸，以；5Γ便進行後續的低溫制時可直接地便 13 201224488 UW 36339twf.doc/n 施加”電壓或電流訊號於發光元件l〇1〇上。於其他實施例 中，板針機構1200亦可於高溫檢測後先暫時離開基板平台 1100而不與發光元件接觸，此部份可視使用者的需求而 定。 ，著，當加熱裝置1300將發光元件1〇1〇冷卻於第二 溫度範圍T2内時，探針機構12〇〇此時便可傳遞一第二驅 動§fl號S2至發光元件ι〇1〇，以驅動發光元件1〇1〇，使發 光二件1010產生光線，其中第二驅動訊號S2大於小於第 一驅動sfl號S1。同樣地，亦可透過與探針機構12〇〇電性 連接的電源供應裝置18〇〇提供前述第二驅動訊號S2。在 本貫施例中，第二驅動訊號S2例如是一電流訊號，其中 此電流訊號的大小實質上可為12〇mA。 類似地，當探針機構1200於前述第二溫度範圍T1内 驅動發光元件1010，並使發光元件1〇1〇產生光線時，本 貫施例之檢測機台1〇〇〇便可透過影像感測裝置15〇〇感測 發光元件1010被驅動時所產生的光線，並可同時快速檢測 發光二極體燈條上之發光二極體於低溫條件下是否有被點 亮，從而判斷在低溫的狀態下發光元件1〇1〇是否為有效之 發光元件。 特別的是，為了可提高冷卻的速度，檢測機台1000 更包括至少一吹氣機構1420 ’其位於基板平台1100的一 側或二側，其中吹氣機構1420適於提供一氣流於發光元件 1010上，以冷卻發光元件1010。 在本實施例中’檢測機台1000可包括一第二移動裝 201224488Heating to the first temperature range T1 allows the heating device 1300 to continue to heat. In the testing machine 1000, the cooling device 1400 is disposed below the substrate platform 1100 and is adapted to cool the light emitting element 1〇1〇 to maintain the light emitting element 1010 within a second temperature range T2, as shown in FIG. It is shown in Figure 3. In the present embodiment, the cooling device_ includes a circulating water system or a jet system. Specifically, when the light-emitting element G is detected at a high temperature, the green light of the light-emitting element is detected, and then the surface light-emitting element 1010 is electrically and optically expressed by the light at a low temperature. Therefore, the detection device 1_ can cool the light-emitting element 1G1G through the substrate platform, and the domain light-emitting element 1010 is maintained in the second temperature range T2, wherein the second temperature range Τ2 It essentially falls between 20 degrees Celsius and 70 degrees Celsius. Similarly, before the light-emitting element 丨 (10) is cooled, the aforementioned probe bet is first brought into contact with and electrically connected to the light-emitting element 1010. That is to say, in the aforementioned high temperature inspection, the probe mechanism 12 (10) can actually remain in contact with the light-emitting 7L member 1010, and the subsequent low-temperature system can be directly applied to the current voltage of 201224488 UW 36339twf.doc/n. The current signal is on the light-emitting element 110. In other embodiments, the plate mechanism 1200 can temporarily leave the substrate platform 1100 without contacting the light-emitting element after the high-temperature detection, and this part can be determined according to the needs of the user. When the heating device 1300 cools the light emitting element 1〇1〇 in the second temperature range T2, the probe mechanism 12〇〇 can transmit a second driving §fl number S2 to the light emitting element ι〇1 at this time. 〇, in order to drive the light-emitting element 1〇1〇, the light-emitting two-piece 1010 generates light, wherein the second driving signal S2 is greater than the first driving sfl number S1. Similarly, it can also be electrically connected to the probe mechanism 12 The power supply device 18 〇〇 provides the second driving signal S2. In the present embodiment, the second driving signal S2 is, for example, a current signal, wherein the current signal can be substantially 12 mA in size. Similarly, Probe When the structure 1200 drives the light-emitting element 1010 in the second temperature range T1 and causes the light-emitting element to generate light, the detection machine 1 of the present embodiment can pass through the image sensing device 15 Detecting the light generated when the light-emitting element 1010 is driven, and simultaneously detecting whether the light-emitting diode on the light-emitting diode strip is illuminated under low temperature conditions, thereby judging that the light-emitting element is in a low temperature state. In particular, in order to increase the speed of cooling, the inspection machine 1000 further includes at least one air blowing mechanism 1420' which is located on one side or two sides of the substrate platform 1100, wherein the air blowing mechanism 1420 It is suitable to provide a gas flow on the light-emitting element 1010 to cool the light-emitting element 1010. In this embodiment, the 'detection machine 1000 can include a second mobile device 201224488
LblUU/DlTW 36339twf.doc/n 置M2，其中第二移動裝置M2是位於基板平台贈之下 方，其主要是用來移動加熱裝置13〇〇與冷卻裝置14⑻， 以於高溫檢測狀態下可將加熱裝置13〇〇往基板平台ιι〇〇 靠近，或是於低溫檢難H下可將冷卻裝置i彻往^板平 台1100靠近。也就是說，第二移動裝£M2主要是用來在 不同溫度檢測狀態下，移動加熱裝置1300與冷卻裝置1400 之其一。 此外，為了可使影像感概置15⑻快速地掃猫與感 測發光元件1010之發光狀況，因此移動台1700是設置於 發光元件1010之上方’且影像感測裝置15〇〇裝設於移動 台1700上，如此一來，移動台17〇〇便可適於移動影像感 測裝置1500而快速地掃瞄與感測發光元件1〇1〇之發光狀 況。此外，感溫裝置1600亦可裝設於移動台17〇〇上如 此移動σ 1700便可移動感溫裝置16〇〇而使得感溫裝置 1600可感測燈條上每顆發光二極體之溫度，但不限於此。 於前述高溫制與低溫檢财，影像❹设置15〇〇 • 纟要是用來感測發光元件1〇1〇是否可於不同溫度下進行 點亮之動作，而非檢測發光元件1010之發光品質。因此， 檢測機台1000更可包括一光學檢測裝置19〇〇，其設置於 該發光元件之上方並可裝設於移動台17〇〇上，苴中移動a 1700適於移動光學檢測裝置测，且光學檢測裝置i9〇口〇 適於感測發光元件1010被驅動時所產生的光學特性做量 測:具體而言，光學檢測裝置19〇〇可以是量測MCD(光強 度早位mcd)之套筒或積分球，二者的作用分別是用來量測 15 201224488LblUU/DlTW 36339twf.doc/n sets M2, wherein the second mobile device M2 is located below the substrate platform, which is mainly used to move the heating device 13 and the cooling device 14 (8), so that the heating can be performed under the high temperature detection state. The device 13 is placed close to the substrate platform ιι, or the cooling device i can be moved closer to the plate platform 1100 under low temperature detection H. That is to say, the second mobile device £M2 is mainly used to move one of the heating device 1300 and the cooling device 1400 under different temperature detection states. In addition, in order to enable the image sensing 15 (8) to quickly scan the cat and the sensing light emitting device 1010, the mobile station 1700 is disposed above the light emitting device 1010 and the image sensing device 15 is mounted on the mobile station. In 1700, the mobile station 17 can be adapted to move the image sensing device 1500 to quickly scan and sense the illumination condition of the light-emitting element 1〇1〇. In addition, the temperature sensing device 1600 can also be mounted on the mobile station 17 such that the movement of the temperature sensing device 16 can be performed by moving the σ 1700 so that the temperature sensing device 1600 can sense the temperature of each of the light emitting diodes on the light bar. , but not limited to this. In the above-mentioned high-temperature system and low-temperature detection, the image is set to 15 〇〇 • 感 to sense whether the light-emitting element 1〇1〇 can be illuminated at different temperatures, instead of detecting the light-emitting quality of the light-emitting element 1010. Therefore, the detecting machine 1000 further includes an optical detecting device 19〇〇 disposed above the light emitting element and mounted on the moving table 17〇〇, wherein the moving a 1700 is suitable for moving the optical detecting device, And the optical detecting device i9 is adapted to sense the optical characteristics generated when the light emitting element 1010 is driven: specifically, the optical detecting device 19 can measure the MCD (light intensity early mcd) Sleeve or integrating sphere, the role of the two is used to measure 15 201224488
Lmw/ulTW 36339twf.doc/n 發光元件1010之光學強度及光通量。 在本實施例中，檢測機台1000可以是一種自動化機 台。具體而言’檢測機台1000亦可包括一運算主機1030 與一介面卡1040’其中運算主機1〇3〇可透過介面卡1〇4〇, 而操作前述之第一移動裝置Ml、第二移動裝置Ml及移動 台W00 ’如此一來，探針機構1200、加熱裝置1300、冷 部裝置1400、移動台1700至少其一便可透過運算主機的 操作而被移動。此外’運算主機亦可透過介面卡1〇4〇而可 擷取影像感測裝置1500與感溫裝置1600至少其一的資 料，如.影像資料或溫度資料。換言之，此介面卡1040 例如是一運動控制卡或一影像擷取卡。 基於上述可知，本實施例之檢測機台1000透過將基 板平台1100、探針機構1200、加熱裝置1300、冷卻裝置 MOO、衫像感測裳置15〇〇、感溫裝置以及移動台poo 整&起’因此將可大大縮減檢測發光元件1000時所需之 檢測產線的體積與長度。具體而言，傳統上為了對發光元 件(如.發光二極體燈條)進行各種光學檢測與電性檢測， 通常會設置各種光學檢測與電性檢測的機台，並透過將發 光元件依序送入這些檢測機台中，便可量測發光元件之光 學性質與電性表現。然而，這些機台所佔的空間便無法有 效地被縮減，意即檢測發光元件之產線便無法被縮短。 _反觀本實施例之檢測機台1000所揭露之結構，發光 7L件可設置於基板平台上，且在進行高溫檢測、低溫檢測 與光學品質檢測時無須移動發光元件，僅需移動所需之檢 201224488Lmw/ulTW 36339twf.doc/n Optical intensity and luminous flux of the light-emitting element 1010. In the present embodiment, the inspection machine 1000 can be an automated machine. Specifically, the detecting machine 1000 can also include a computing host 1030 and an interface card 1040. The computing host 1〇3〇 can pass through the interface card 1〇4〇, and operate the first mobile device M1 and the second mobile device. In this manner, the device M1 and the mobile station W00' can be moved by at least one of the probe mechanism 1200, the heating device 1300, the cold device 1400, and the mobile station 1700 through the operation of the computing host. In addition, the computing host can also capture at least one of the image sensing device 1500 and the temperature sensing device 1600, such as image data or temperature data, through the interface card. In other words, the interface card 1040 is, for example, a motion control card or an image capture card. Based on the above, the detecting machine 1000 of the present embodiment transmits the substrate platform 1100, the probe mechanism 1200, the heating device 1300, the cooling device MOO, the shirt image sensing, the temperature sensing device, and the mobile station poo & From the beginning, the volume and length of the test line required for detecting the light-emitting element 1000 can be greatly reduced. Specifically, in order to perform various optical detection and electrical detection on a light-emitting element (such as a light-emitting diode light bar), various optical detection and electrical detection machines are usually provided, and the light-emitting elements are sequentially arranged. By feeding into these test machines, the optical and electrical performance of the light-emitting elements can be measured. However, the space occupied by these machines cannot be effectively reduced, meaning that the production line for detecting the light-emitting elements cannot be shortened. _In contrast to the structure disclosed in the testing machine 1000 of the embodiment, the light-emitting 7L piece can be disposed on the substrate platform, and does not need to move the light-emitting element when performing high-temperature detection, low-temperature detection and optical quality detection, and only needs to move the required inspection. 201224488
Ltiuu/UITW 36339twf.d〇c/n 測裝置便可達到檢測發光元件之目的。因此本實施例之檢 測機台1000便可大大縮減傳統檢測機台之整體體積與數 量。再者’本實施例之檢測機台1〇〇〇透過第一移動裝置 Ml、第二移動裝置Ml及移動台1700的使用，並搭配運 算主機之控制’而具有自動化之優點。另外，本實施例之 檢測機台1000透過影像感測裝置1500的使用可取代人工 目測檢查發光二極體燈條上之複數個發光二極體是否有被 φ 點党，因此本實施例之檢測機台1000具有快速、低人力成 本且精準化之優點。 基於上述，本實施例亦可提出一種檢測方法，其適於 對前述的發光元件1010進行光學及電性檢測，如圖4所 示。具體而言，此檢測方法至少包括以下步驟。請參考圖 4之步驟S101，首先，提供前述的發光元件1〇1〇，其中發 光元件1010例如是發光二極體燈條。 接著，進行步驟S102，提供前述的探針機構12〇〇， 並使探針機構1200往前述的基板平台11〇〇靠近而與發光 • 元件1010接觸，其中關於探針機構1200之作動方式可表 考前述說明。 > 然後，進行步驟S103，加熱發光元件丨，以使發 光元件1010維持於前述的第一溫度範圍T1内，其中加熱 方式可採用加熱裝置1300所提及的方法，在此不再贅述 具體而言，於加熱發光元件1〇10的過程中，可利用前述的 感溫裝置1600感測發光元件13〇〇是否處於第一溫产範圍 内T卜如圖4之步驟S301所示。詳細來說，若置 17 201224488 ^ιυυ,ν1Τ\ν 36339twf.doc/n 感測發光元件1300已處於第一溫度範圍内ΤΙ時，便可繼 續後續的步驟S104;反之，若感溫裝置感測發光元件1300 尚未處於第一溫度範圍内Τ1時，便可加熱發光元件1010。 接著，進行步驟S104，利用探針機構1200傳遞前述 的第一驅動訊號S1至發光元件1〇1〇,以驅動發光元件 1010。其中第一驅動訊號S1可以是使用前述的電源供應 裝置來實施’請參考前述，在此不再說明。 而後’進行步驟S105 ’感測並量測發光元件1010被 第一驅動訊號驅動S1時所產生的第一發光影像。其中感 測並量測發光元件1010的方式可採用前述的影像感測裝 置1500所提及的方法，在此不再贅述。至此，則完成一種 南溫檢測的檢測方法。 接著，進行步驟S106，冷卻發光元件丨〇1〇，以使發 光元件1010維持於前述的第二溫度範圍T2内，其中冷卻 的方式可採用冷卻裝置14〇〇所提及的方法，在此不再贅 述。具體而言，於冷卻發光元件1〇1〇的過程中，可利用前 述的感溫裝置16〇〇感測發光元件13〇〇是否處於第二溫度 範圍内T2，如圖4之步驟S3〇2所示。詳細來說，若感溫 裝置i感測發光元件1300已處於第一溫度範圍内T1時 可繼續後續的步驟S107;反之，若感溫二測發先夸元: 1300尚未處於第二溫度範_们時，便可冷卻 1010。 之後，進行步驟S107，利用探針機構1〇1〇傳遞前述 的第二驅動訊號S2至發光元件麵，以驅動發光元件 18 201224488 ^*W,V1TW 36339twf.d〇c/n 1〇10。其巾第二驅動訊號S2同樣地可使用前述的電源供 應裝置來實施，請參考前述，在此不魏明。 ΜThe Ltiuu/UITW 36339twf.d〇c/n measuring device can achieve the purpose of detecting the light-emitting elements. Therefore, the inspection machine 1000 of the present embodiment can greatly reduce the overall volume and number of the conventional inspection machine. Furthermore, the detecting machine 1 of the present embodiment has the advantage of automation through the use of the first mobile device M1, the second mobile device M1, and the mobile station 1700, and with the control of the computing host. In addition, the use of the image sensing device 1500 of the present embodiment can replace the manual inspection of the plurality of light-emitting diodes on the light-emitting diode strip by the use of the image sensing device 1500. Therefore, the detection of the embodiment is performed. The machine 1000 has the advantages of fast, low labor cost and precision. Based on the above, the present embodiment can also provide a detection method suitable for optically and electrically detecting the aforementioned light-emitting element 1010, as shown in FIG. Specifically, the detection method includes at least the following steps. Referring to step S101 of Fig. 4, first, the foregoing light-emitting element 1〇1〇 is provided, wherein the light-emitting element 1010 is, for example, a light-emitting diode light bar. Next, in step S102, the probe mechanism 12A is provided, and the probe mechanism 1200 is brought close to the substrate platform 11 to contact the light-emitting element 1010, wherein the manner of the probe mechanism 1200 can be displayed. Test the above instructions. > Then, step S103 is performed to heat the light-emitting element 丨 to maintain the light-emitting element 1010 within the aforementioned first temperature range T1, wherein the heating method may adopt the method mentioned in the heating device 1300, and details are not described herein again. In the process of heating the light-emitting element 1 〇 10, the temperature sensing device 1600 can be used to sense whether the light-emitting element 13 is in the first temperature range T. As shown in step S301 of FIG. In detail, if 17 201224488 ^ιυυ, ν1Τ\ν 36339twf.doc/n senses that the light-emitting element 1300 is already in the first temperature range, the subsequent step S104 can be continued; otherwise, if the temperature sensing device senses When the light-emitting element 1300 is not in the first temperature range Τ1, the light-emitting element 1010 can be heated. Next, in step S104, the first driving signal S1 to the light-emitting element 1〇1〇 are transmitted by the probe mechanism 1200 to drive the light-emitting element 1010. The first driving signal S1 may be implemented by using the foregoing power supply device. Please refer to the foregoing, and will not be described here. Then, the step S105 is performed to sense and measure the first illuminating image generated when the illuminating element 1010 is driven by the first driving signal S1. The method for sensing and measuring the light-emitting element 1010 can adopt the method mentioned in the foregoing image sensing device 1500, and details are not described herein again. At this point, a detection method for the south temperature detection is completed. Next, proceeding to step S106, cooling the light-emitting element 丨〇1〇 to maintain the light-emitting element 1010 within the aforementioned second temperature range T2, wherein the cooling method may adopt the method mentioned by the cooling device 14〇〇, Let me repeat. Specifically, in the process of cooling the light-emitting element 1〇1〇, the sensing device 16〇〇 can be used to sense whether the light-emitting element 13〇〇 is in the second temperature range T2, as shown in step S3〇2 of FIG. Shown. In detail, if the temperature sensing device i senses that the light-emitting element 1300 is already in the first temperature range T1, the subsequent step S107 may be continued; otherwise, if the temperature-sensing second measurement is first boasted: 1300 is not yet in the second temperature range _ When we can, we can cool 1010. Then, in step S107, the second driving signal S2 is transmitted to the surface of the light emitting element by the probe mechanism 1〇1〇 to drive the light emitting element 18 201224488 ^*W, V1TW 36339twf.d〇c/n 1〇10. The second driving signal S2 of the towel can be similarly implemented using the aforementioned power supply device. Please refer to the foregoing, and it is not here. Μ
接著」進行步驟Sl〇8，感測並量測發光元件ι〇ι〇被 一一驅動訊號S2驅動時所產生的第二發光影像，1中第 =動訊號S2大於第—驅動訊號S卜雜地，感測並量 2光几件1G1G的方式可採用前述的影像感測裝置_ 檢二=法在此不再費述。至此’則完成為-種低溫 台在®之檢測方法中，在使探針機構12〇〇往基板平 *近而與發光元件1〇1〇接觸之前上述檢測方法 進1 =括利用前述的影像感測裝置150。對發光元件1010 元如步驟S201所示。縣實施例中，在對發光 進行定位之前，更可對發光元件1010進行一條 馬掃瞄，步驟S2〇2所示。 需要㈣的是’在冷卻發光元件麵讀以及傳遞 包=動，S2至發光元件_之前，上述檢測方法更 1二用月,J述的影像感測裝* 1500，對發光元件1010的 卜，或-位置進行檢測，如步驟_所示。另外，在 可並量測第二發光影像之步驟後，上述檢測方法更 中^發光轉麵進行檢測，如㈣S2G4所示，其 進—^測可以疋W檢測、ΛνΤ檢測及漏電流檢測。更 =來說，在對發光元件丨麵進行電性檢測之步驟後， ^測方法更可_前述㈣學檢職置灣對發光 件麵被驅動時所產生的光學特性進行量測，如步驟 201224488 L,r,iuu/uiTW 36339twf.doc/n 以是量測發光元件1〇1〇 S205所示’其中光學特性的量測可 之光學強度及光通量。 f於上述，本發明亦可提供—種檢測系統，其適於對 則述發光元件進行光學及電性檢測。此檢齡統包括前述基 板平台、前麟針機構、前述加熱裝置、前述冷卻裝置以 及刖述影像制裝置。發光元件配置於基板平台上。探針 機構往基板平自靠近與發光元件賴。加歸置加熱發 光70件，以使發光元件維持於一第一溫度範圍内，並利用 探針機構傳遞-第-驅動訊號至發光元件，以驅動發光元 件。冷卻裝置冷卻發光元件，以使發光元件維持於一第二 溫度範圍内並利用探針機構傳遞一第二驅動訊號至發光元 件，以驅動發光元件。影像感測裝置適於感測並量測發光 元件被第一驅動訊號驅動時所產生的一第一發光影像，以 及感測並量測發光元件被第二驅動訊號驅動時所產生的一 第二發光影像，其中第二驅動訊號大於第一驅動訊號。 在檢測系統中，探針機構往基板平台靠近而與發光元 件接觸之前’檢測系統更包括利用一影像感測裝置對發光 元件進行定位。此外，在對發光元件進行定位之前，檢測 系統更包括對發光元件進行一條碼掃瞄。 在檢測系統中，在冷卻發光元件之後以及傳遞第二驅 動訊號至發光元件之前，檢測系統更包括利用一影像感測裝 置，對發光元件的一外觀或一位置進行檢測。此外，在感 測並量測第二發光影像之後，檢測系統更包括對發光元件進 行電性檢測。 20 201224488 36339twf.d〇c/nThen, step S1 is performed to sense and measure the second illuminating image generated when the illuminating element ι 〇 〇 is driven by the driving signal S2. The first semaphore S2 is greater than the first driving signal S. The method of sensing and measuring a few pieces of 1G1G can be performed by the aforementioned image sensing device _ Detective = method is not mentioned here. So far, the detection method of the low-temperature stage is completed, and the detection method is performed before the probe mechanism 12 is brought close to the substrate and is in contact with the light-emitting element 1〇1. Sensing device 150. The light emitting element 1010 is as shown in step S201. In the embodiment of the prefecture, before the illuminating is positioned, the illuminating element 1010 can be scanned in a single step, as shown in step S2 〇 2. It is required that (4) is that before the surface reading of the cooling light-emitting element and the transmission of the packet = motion, S2 to the light-emitting element _, the above-mentioned detection method is more than two months, and the image sensing device * 1500 described in J, the light-emitting element 1010, Or - position detection, as shown in step _. In addition, after the step of measuring the second illuminating image, the detecting method further detects the illuminating surface, as shown in (4) S2G4, and the —W test can detect W, ΛνΤ and leak current. In other words, after the step of electrically detecting the surface of the light-emitting element, the method of measuring can further measure the optical characteristics generated when the surface of the light-emitting element is driven, such as the step. 201224488 L, r, iuu/uiTW 36339twf.doc/n is to measure the optical intensity and luminous flux of the optical characteristics measured by the light-emitting elements 1〇1〇S205. In the above, the present invention can also provide a detection system suitable for optical and electrical detection of the light-emitting elements. The ageing system includes the aforementioned substrate platform, the front needle mechanism, the aforementioned heating device, the aforementioned cooling device, and the image forming device. The light emitting element is disposed on the substrate platform. The probe mechanism is flat from the substrate and close to the light-emitting element. The heating and illuminating 70 pieces are arranged to maintain the illuminating element within a first temperature range, and the -first driving signal is transmitted to the illuminating element by the probe mechanism to drive the illuminating element. The cooling device cools the light emitting element to maintain the light emitting element in a second temperature range and transmit a second driving signal to the light emitting element by the probe mechanism to drive the light emitting element. The image sensing device is adapted to sense and measure a first illuminating image generated when the illuminating element is driven by the first driving signal, and to sense and measure a second generated when the illuminating element is driven by the second driving signal The illuminating image, wherein the second driving signal is greater than the first driving signal. In the detection system, the detection mechanism further includes positioning the illuminating element with an image sensing device before the probe mechanism approaches the substrate platform and contacts the illuminating element. In addition, the detection system further includes a one-pass scan of the light-emitting elements prior to positioning the light-emitting elements. In the detection system, after cooling the illuminating element and before transmitting the second driving signal to the illuminating element, the detecting system further includes detecting an appearance or a position of the illuminating element by means of an image sensing device. In addition, after sensing and measuring the second illuminating image, the detecting system further includes electrically detecting the illuminating element. 20 201224488 36339twf.d〇c/n
Lt]00701TW 在檢測糸統中，在冷卻發光元件之後以及傳遞第二驅 動訊號至發光元件之前，檢測系統更包括利用一影像感測裝 置’對發光元件的一外觀或一位置進行檢測。此外’在感 測並量測第二發光影像之後，檢測系統更包括對發光元件進 行電性檢測。In the detection system, after cooling the illuminating element and before transmitting the second driving signal to the illuminating element, the detecting system further comprises detecting an appearance or a position of the illuminating element by means of an image sensing device. Further, after sensing and measuring the second illuminating image, the detecting system further includes electrically detecting the illuminating element.
在檢測系統中，在對發光元件進行電性檢測之後，檢測 系、、統i包括利用一光學檢測裝置對發光元件被驅動時所產 生的光學特性進行量測。此外，在加熱發光元件之後以及 驅動發光元件之前’檢測系統更包括利用一感溫裝置感測 發光元件是否維持於第一溫度範圍内。 另外’在冷卻發光元件之後以及驅動發光元件之前， 檢測系統更包括利用一感溫裝置感測發光元件是杳維持於 第一溫度範圍内。 氣 T、上所述，本發明之檢測機台、檢測方法與檢測系統 至少具有下列優點。透過將基板平台、探針機構、加熱裝 置、冷卻裝置、影像感測裝置、光學檢測裝置、感溫裝置 以及移動台整合一起，因此將可大大縮減檢測發光元件時 ，需之檢測產線的體積與長度。意即本實施例之檢測機台 可在不移動位於基板平台的發光元件的情況下，進行高& ，測、低溫檢測與光學品質檢測。因此本實施例之檢 台便可大大縮減傳統檢測機台之整體體積與數量。 再者，本實施例之檢測機台透過第一移動裝置、第二 移動裴置及移動台的使用，並搭配運算主機之控制，而且 有自動化之優點。 /、 21 201224488 Tw 36339twf.doc/n 另外，本實施例之檢測機台透過影像感測裝置的使用 代人工目?檢查發光二極體燈條上之複數個發光二極 -疋否有被點亮’ m此本實施例之檢測機 人力成本且精準化之優點。 力『、疋低 &惟以上所述者，僅為本發明之較佳實施例而已，當不 此以此限林㈣實施之制，即纽 範圍内。另外本發明的任-實施例或 月 ν、達成本發明所揭露之全部目的戍優點咬 =°此外’摘要部分和標題僅是絲_專利文件搜尋 之用，並非用來Ρ艮制本發明之權利範圍。 【圖式簡單說明】 圖1為本發明—實施例之檢測機台的簡單示意圖。 圏。圖2貝】為圖1之檢測機台之具體實施之局部立體示意 圖3則為圖2之檢測機台的局部放大示意圖。 圖4為本翻—實關之檢·法的流程示意圖。 【主要元件符號說明】 1000 :檢測機台 1010 :發光元件 1030:運算主機 1040 :介面卡 22 201224488 i^jciuu /uiTW 36339twf.doc/n 1100 :基板平台 1200 :探針機構 1300 :加熱裝置 1400 :冷卻裝置 1420 :吹氣機構 1500 :影像感測裝置 1600 :感溫裝置 1700 :移動台 ® 1800:電源供應裝置 1900 :光學檢測裝置 Ml :第一移動裝置 T1 :第一溫度範圍 S101 〜S108、S201 〜S208 :步驟 51 :第一驅動訊號 T2:第二溫度範圍 52 :第二驅動訊號 · ❿ M2:第二移動裝置 23In the detection system, after electrically detecting the light-emitting element, the detection system includes measuring the optical characteristics generated when the light-emitting element is driven by an optical detecting device. Further, the detecting system further includes, after heating the light emitting element and before driving the light emitting element, a sensing device for sensing whether the light emitting element is maintained within the first temperature range. Further, after cooling the light-emitting element and before driving the light-emitting element, the detecting system further comprises sensing, by the temperature sensing device, that the light-emitting element is maintained within the first temperature range. Gas T. As described above, the detecting machine, the detecting method and the detecting system of the present invention have at least the following advantages. By integrating the substrate platform, the probe mechanism, the heating device, the cooling device, the image sensing device, the optical detecting device, the temperature sensing device, and the mobile station, it is possible to greatly reduce the volume of the detection line when detecting the light-emitting element With length. That is, the detecting machine of the embodiment can perform high & measurement, low temperature detection and optical quality detection without moving the light-emitting elements located on the substrate platform. Therefore, the inspection platform of this embodiment can greatly reduce the overall volume and number of the conventional inspection machine. Furthermore, the detecting machine of the embodiment transmits the use of the first mobile device, the second mobile device and the mobile station, and is matched with the control of the computing host, and has the advantage of automation. /, 21 201224488 Tw 36339twf.doc/n In addition, the detection machine of the present embodiment passes through the use of the image sensing device to manually check the plurality of light-emitting diodes on the light-emitting diode light bar - whether or not there is a point Brightness is the advantage of the labor cost and precision of the detector of this embodiment. The above is only the preferred embodiment of the present invention, and is not limited to the implementation of the system (4). Further, any embodiment or month of the present invention achieves all the objects disclosed in the present invention. Advantages bite = ° In addition, the 'summary portion and the title are only for the purpose of searching for patent documents, and are not intended to be used for the purpose of the present invention. The scope of rights. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a simplified schematic view of a detecting machine of the present invention. Hey. 2 is a partial perspective view of a specific embodiment of the detecting machine of FIG. 1. FIG. 3 is a partially enlarged schematic view of the detecting machine of FIG. Fig. 4 is a schematic flow chart of the method of detecting and turning over the real-time. [Main component symbol description] 1000 : Detection machine 1010 : Light-emitting element 1030 : Calculation host 1040 : Interface card 22 201224488 i^jciuu /uiTW 36339twf.doc/n 1100 : Substrate platform 1200 : Probe mechanism 1300 : Heating device 1400 : Cooling device 1420: air blowing mechanism 1500: image sensing device 1600: temperature sensing device 1700: mobile station® 1800: power supply device 1900: optical detecting device M1: first mobile device T1: first temperature range S101 to S108, S201 ~S208: Step 51: First drive signal T2: Second temperature range 52: Second drive signal · ❿ M2: Second mobile device 23