KR102483359B1 - Handler for testing semiconductor devices and information processing method thereof - Google Patents

Abstract

The present invention relates to a handler used to test a semiconductor device and an information processing technology thereof.
A handler for testing a semiconductor device according to the present invention includes a barcode reader for recognizing barcodes printed on semiconductor devices at a point on a movement path of semiconductor devices moving from loading by a loading portion to unloading by an unloading portion; and a control unit that controls the barcode reader, reads the barcode recognized by the barcode reader, and manages information for each semiconductor device. includes
According to the present invention, since information is managed per individual semiconductor device rather than per lot, reliability of test results and management ability for individual semiconductor devices are improved, and history management is enabled.

Description

Handler for testing semiconductor devices and its information processing method

The present invention relates to a handler for supplying a semiconductor device to a tester.

Semiconductor devices must be tested after production and prior to shipment. For this, a tester and a handler are required, and the present invention relates to the handler.

The handler supports the tester to test the semiconductor devices by electrically connecting a plurality of semiconductor devices to the tester. At this time, the handler electrically connects the semiconductor devices to the tester after stimulating the semiconductor devices in an environment according to the required test conditions. These handlers can be manufactured in various forms, such as in Korean Patent Publication Nos. 10-2011-0136440, 10-2012-0106320, and 10-2014-0121909, depending on test conditions, types of semiconductor devices to be tested, or customer requests. can

In general, the handler includes a loading element for moving a plurality of semiconductor devices together or testing them together at one time. Depending on the type of handler, the semiconductor devices may be electrically connected to the tester while being loaded on the loading element or electrically connected to the tester after being taken out of the loading element. Here, the loading element has various configurations and names such as a test tray, a shuttle, and a loading plate according to the type of handler.

On the other hand, semiconductor devices have been tested together by bundling the same type of products produced under the same production conditions in lot units, as in Korean Patent Publication No. 10-2009-0005901. The reason for this was to track when and under what conditions the product was defective by testing the products produced under the same conditions. Since the test is performed in a lot unit quantity, the handler loads or unloads the semiconductor devices from the loading elements in a first-in-first-out (FIFO) method to prevent the semiconductor devices from being mixed.

However, during the flow of logistics during the test process, a phenomenon in which semiconductor devices are separated or mixed occurs, and there are cases in which 100% first-in-first-out is not possible due to errors of handlers or workers. Therefore, it is often necessary to check whether it is managed by lot. In particular, since the production conditions have been subdivided in recent years and the number of lots is decreasing, more attention should be paid.

In addition, in order to optimize the subdivided production conditions, there is a need to compare the characteristics of semiconductor devices tested under certain production conditions and under certain environmental conditions.

However, the current method of lot-by-lot management does not solve the above-mentioned problems or meet the needs.

Therefore, it is predicted that there will come a time when individual management of semiconductor devices is required in the near future. The present invention relates to a technique that can be used when individual management of semiconductor devices is required in a handler where a large amount of semiconductor devices are supplied at once and a plurality of semiconductor devices are tested together at one time.

An object of the present invention is to provide a technique related to a handler capable of managing individual histories of semiconductor devices.

A handler for testing a semiconductor device according to the present invention for achieving the above object includes a loading element capable of loading a semiconductor device to be tested; a transporter for transporting the loading element; a loading portion for loading a semiconductor device to be tested into the loading element at a loading position; a test section for testing the semiconductor device loaded into the loading element by the loading section; an unloading part for unloading the semiconductor device, which has been tested in the test part, from the loading element in an unloading position; a barcode recognition unit recognizing barcodes printed on semiconductor devices at a point on a movement path of the semiconductor devices moving from loading by the loading unit to unloading by the unloading unit; and a control unit that controls the carrier, the loading unit, the test unit, the unloading unit, and the barcode recognition unit, and manages information for each semiconductor device by reading the barcode recognized by the barcode recognition unit. includes

A plurality of semiconductor elements may be loaded on the loading element so as to be arranged side by side at least in a direction in which the loading element moves, and the barcode recognition part sequentially recognizes the barcodes of the semiconductor elements loaded on the moving loading element. It is installed above the path on which the element moves, and the control part repeats the movement and stop of the loading element at least once when the loading element passes below the barcode recognition part, so that the barcode recognition part is moved to the loading element. The carrier is controlled to sequentially recognize barcodes printed on a plurality of semiconductor devices loaded thereon.

The barcode recognition unit includes a barcode recognizer for recognizing a barcode; an illuminator for radiating light to the surface of the semiconductor device in order to recognize the barcode by the barcode reader; includes

The illuminator is disposed between the barcode reader and the loading element, and the illuminator has a recognition window through which the barcode reader can recognize a barcode of a semiconductor device located below the illuminator.

The illuminator includes an installation member having a semi-cylindrical surface convex upward at a lower portion; and at least one irradiation source installed on the semi-cylindrical surface of the installation member. Including, the recognition window is provided on the installation member.

The illuminator includes a dome-shaped reflector convex upward; and at least one irradiation source installed under the reflector to indirectly illuminate the semiconductor device through the reflector. Including, the recognition window is provided on the reflector.

Since the loading element and the carrier are provided in plurality, the semiconductor element moves in a plurality of paths, and the barcode recognition part includes: a barcode reader for recognizing a barcode; and a mover for moving the barcode reader so as to selectively position the barcode reader above the plurality of paths. includes

The barcode recognition unit includes an illuminator for irradiating light to the surface of the semiconductor device for recognizing the barcode by the barcode reader; Further, the barcode reader and the illuminator are coupled to each other by a coupling member, so that the barcode reader and the illuminator move together by the operation of the mover.

To achieve the above object, an information processing method of a handler for testing a semiconductor device according to the present invention includes a recognition step of recognizing a barcode printed on a semiconductor device on a path along which the semiconductor device moves; a confirmation step of analyzing the barcode recognized in the recognition step and confirming an identifier for each semiconductor device and information on the corresponding semiconductor device; a storage step of storing identifiers and information for each semiconductor device identified in the checking step; and a transmission step of transmitting the identifier and information stored in the storage step to the tester side so that the tester side connects the test result of the semiconductor device to the corresponding semiconductor device identifier and stores it. Including, the recognition step and the transmission step are performed before or after the test of the semiconductor device.

The information processing method of the semiconductor device test handler described above includes a recording step of recording a test result of a semiconductor device coming from a tester by connecting it to an identifier of the corresponding semiconductor device; may further include.

The present invention has the following effects because individual histories of semiconductor devices can be managed using barcodes in a handler in which a plurality of semiconductor devices are tested together after a large amount of semiconductor devices are supplied.

First, even if semiconductor devices are mixed in the test process, it is possible to check information on each semiconductor device.

Second, it is possible to check what quality of semiconductor device was completed through what production conditions and what test conditions.

Third, it is possible to more elaborately establish the development direction for semiconductor devices.

Fourth, since all histories can be stored and managed, it is possible to check the history even during retest.

Fifth, since the manager's role in preventing problems such as semiconductor devices being mixed is reduced, the utilization rate of manpower can be increased.

1 and 2 are conceptual plan views of a semiconductor device test handler according to an embodiment of the present invention.
FIG. 3 is a configuration diagram of a control part applied to the handler of FIG. 1 .
FIG. 4 is a structural diagram according to a first example of a barcode recognition part that can be applied to the handler of FIG. 1 .
5 is a structural diagram according to a second example of a barcode recognition part that can be applied to the handler of FIG. 1;
FIG. 6 is a modified example of the barcode recognition part of FIG. 5 .
FIG. 7 is a structural diagram of a third example of a barcode recognition part that can be applied to the handler of FIG. 1 .
8 is a flowchart of an information processing method performed in the handler of FIG. 1 .

For conciseness of the description below, while omitting or compressing redundant descriptions as much as possible, preferred embodiments according to the present invention will be described.

<Description of the basic configuration of the handler>

1 and 2 are conceptual plan views of a semiconductor device test handler (hereinafter referred to as 'handler') according to an embodiment of the present invention.

As shown in FIG. 1, the handler 100 according to an embodiment of the present invention includes two loading plates 111 and 112, two first carriers 121 and 122, two unloading plates 131 and 132, It includes two second carriers 141 and 142, a loading part 150, a test part 160, an unloading part 170, a barcode recognition part 180 and a control part 190.

The loading plates 111 and 112 are moved between the loading positions LP ₁ and LP ₂ and the test position TP by the first carriers 121 and 122, and have a loading groove in which eight semiconductor devices can be loaded. LS) have Here, the eight loading grooves LS are arranged in a 2×4 matrix. Accordingly, the semiconductor elements are loaded so that two are arranged side by side in the front-back direction and four are arranged side by side in the left-right direction in which the loading plates 111 and 112 move. That is, the loading plates 111 and 112 function as loading elements on which semiconductor devices are loaded.

The first carriers 121 and 122 transport the loading plates 111 and 112 so that the loading plates 111 and 112 can be selectively positioned at the loading positions LP ₁ and LP ₂ and the test position TP.

The unloading plates 131 and 132 are moved between the test position TP and the unloading positions UP ₁ and UP ₂ by the second carriers 141 and 142, and are loaded with eight semiconductor devices. It has grooves (LS).

The second carriers 141 and 142 have the unloading plates 131 and 132 so that the unloading plates 131 and 132 can be selectively positioned at the test position TP and the unloading positions UP ₁ and UP ₂ . carry

The loading part 150 loads the semiconductor devices to be tested from the customer tray to the loading plates 111 and 112 at the loading positions LP ₁ and LP ₂ .

The test part 160 electrically connects eight semiconductor devices loaded to the loading plates 111 and 112 by the loading part 150 to the tester. The test part 160 may include a test chamber 161 to block an external environment to a certain extent in order to maintain a stimulation state of the semiconductor devices. Also, as referred to in Korean Patent Publication No. 10-2014-0121909, the test part 160 is implemented to extract semiconductor devices from the loading plates 111 and 112 and electrically connect them to the tester. Of course, depending on the implementation, the semiconductor device loaded on the loading plates 111 and 112 may be electrically connected to the tester.

The unloading part 170 unloads the tested semiconductor devices from the unloading plates 131 and 132 at the unloading positions UP ₁ and UP ₂ to an empty customer tray.

The barcode recognition part 180 is installed above the moving path of the loading plates 111 and 112, and the loading plates 111 and 112 move from the loading positions LP ₁ and LP ₂ to the test position TP. In the process, barcodes of semiconductor devices loaded on the loading plates 111 and 112 passing below the barcode recognition part 180 are recognized. In this embodiment, the barcode recognition part 180 is provided between the loading positions LP ₁ and LP ₂ and the test position TP. However, depending on the implementation, from loading to unloading in the handler 100, if the barcode printed on the semiconductor device can be recognized on the moving path of the moving semiconductor device and the corresponding semiconductor device can be specified, the barcode recognition unit 180 ) may be provided at any point on the movement path of the semiconductor device.

In this embodiment, since the barcode recognition part 180 is provided between the loading positions LP ₁ and LP ₂ and the test position TP, the movement distance of the loading plates 111 and 112 and the unloading plates 131 and 132 ) has a different travel distance. As a result, as mentioned above, the first carriers 121 and 122 for moving the loading plates 111 and 112 and the second carriers 141 and 142 for moving the unloading plates 131 and 132 are configured separately. do. However, if the barcode recognition part 180 is provided at a position other than between the loading position (LP ₁ , LP ₂ ) and the test position (TP) or between the test position (TP) and the unloading position (UP ₁ , UP ₂ ) It may be configured to move the loading plates 111 and 112 and the unloading plates 131 and 132 together with only two carriers.

In addition, in the handler 100 according to the present embodiment, as shown in FIG. 2 , since the loading plates 111 and 112 and the unloading plates 131 and 132 are provided in pairs, the movement path of the semiconductor device (C ₁ , C ₂ ) is two Therefore, the barcode recognition unit 180 must be configured to recognize both barcodes of semiconductor devices loaded on the front loading plate 111 and barcodes of semiconductor devices loaded on the rear loading plate 112.

Since the above barcode recognition part 180 is the most important feature of the present invention, it will be separately described for each embodiment in a separate table of contents.

The control part 190 includes the first carriers 121 and 122, the second carriers 141 and 142, the loading part 150, the test part 160, the unloading part 170 and the barcode recognition part 180. control, reads the barcode recognized by the barcode recognition unit 180, and manages information for each semiconductor device. This control unit 190 includes a confirmation unit 191, a storage unit 192, and a communication unit 193 as shown in the configuration diagram of FIG.

The checking unit 191 analyzes the barcode recognized by the barcode recognition unit 180 to check an identifier for each semiconductor device and information about the corresponding semiconductor device.

The storage unit 192 stores identifiers and information for each semiconductor device identified by the verification unit 191 or stores information received from the tester.

The communication unit 193 transmits identifiers and information for each semiconductor device stored or to be stored in the storage unit 192 to the tester or receives information from the tester.

Meanwhile, in this embodiment, barcodes are used as a medium for individual management of semiconductor devices. The barcode includes an identifier for a corresponding semiconductor device and information about production conditions when the corresponding semiconductor device is produced, and is printed on the semiconductor device by a manufacturer that produces the semiconductor device. Therefore, any type of media should be interpreted as a barcode as referred to in this specification and claims if it includes information about the identifier of the corresponding semiconductor device and the production conditions when the corresponding semiconductor device is produced.

Next, the operation of the handler 100 having the above structure will be described.

The loading part 150 loads the semiconductor devices loaded on the customer tray onto the loading plates 111 and 112 at the loading positions LP ₁ and LP ₂ . Then, the first carriers 121 and 122 are operated to move the loading plates 111 and 112 from the loading positions LP ₁ and LP ₂ to the test position TP. At this time, while the loading plates 111 and 112 move from the loading positions LP ₁ and LP ₂ to the test position TP, the barcode recognition part 180 is loaded on the loading plates 111 and 112. The semiconductor device recognize the barcode of Then, the control unit 190 reads the recognized barcode, confirms the identifier and information, stores the identifier and information, and transmits the identifier and information to the tester. At this time, both loading plates 111 and 112 are implemented to be moved alternately from the loading positions LP ₁ and LP ₂ to the test position TP if necessary for barcode recognition by the barcode recognition part 180 It can be.

Continuously, the test part 160 takes out the semiconductor devices from the loading plates 111 and 112 at the test position (TP), electrically connects them to the tester side, and then, when the test is finished, moves the pulled out semiconductor devices to the test position (TP). ) to be loaded onto the unloading plates 131 and 132 waiting. In addition, the unloading plates 131 and 132 loaded with the semiconductor devices on which the test is completed move from the test position TP to the unloading positions UP ₁ and UP ₂ . Finally, the unloading part 170 unloads the semiconductor device from the unloading plates 131 and 132 at the unloading positions UP ₁ and UP ₂ to the empty customer tray.

<Description of the barcode recognition part>

1. When a barcode reader is applied

The barcode recognition part 180 may include two barcode readers 181a and 182a and a mover 184a, as shown in the structural diagram of FIG. 4 .

The barcode readers 181a and 182a are provided as barcode readers and recognize barcodes of semiconductor devices loaded on the loading plates 111 and 112 . In this example, since the barcode reading speed is slow and only one barcode can be recognized by the barcode reader, it is necessary for the loading plates 111 and 112 to temporarily stop for barcode recognition. Therefore, the control unit 190 controls the first carrier 121 to repeat the movement and stop of the loading plates 111 and 112 four times when the loading plates 111 and 112 pass below the barcode readers 181a and 182a. , 122) should be controlled. Of course, the front barcode reader 181a recognizes the barcodes of the semiconductor elements in the front row of the loading plates 111 and 112, and the rear barcode reader 182a recognizes the barcodes of the semiconductor elements in the back row of the loading plates 111 and 112. recognize their barcodes.

The mover 184a moves the two barcode readers 181a and 182a in the forward and backward directions and may be provided as a cylinder. Accordingly, the barcode readers 181a and 182a may be positioned above the loading plate 111 at the front or above the loading plate 112 at the rear. Due to the configuration of the mover 184a, barcodes of semiconductor elements loaded on the front loading plate 111 and the rear loading plate 112 can be read with only two barcode readers 181a and 182a. Of course, even if there are three or more moving paths of semiconductor devices, barcodes of all semiconductor elements moving through three or more paths can be read by two barcode readers 181a and 182a under the control of the mover 184a.

In addition, since the distance between the front loading plate 111 and the rear loading plate 112 can be narrowed regardless of the front and rear widths of the barcode readers 181a and 182a, there is also an advantage in that the front and rear width of the equipment can be reduced.

2. When an area camera is applied

The barcode recognition unit 180 according to the present example may include a barcode reader 181b, an illuminator 183b, and a mover 184b, as shown in the structure diagram of FIG. 5 .

The barcode reader 181b is provided as an area camera, and simultaneously captures barcodes of four semiconductor devices loaded on the loading plates 111 and 112 and arranged in a 2x2 matrix form. Accordingly, the control unit 190 can obtain barcodes of 8 semiconductor devices by stopping the loading plates 111 and 112 only twice. If an area camera with a wide imaging area is provided, barcodes of 8 semiconductor devices may be obtained with only one stop of the loading plates 111 and 112. Of course, as the captured barcodes are read by the control unit 190, identifiers and information on the corresponding semiconductor devices are obtained.

The illuminator 183b is mounted under the barcode reader 181b to be disposed between the barcode reader 181b and the loading plates 111 and 112, and includes a reflector RP and irradiation sources IS.

The reflector RP has an upwardly convex dome shape, and reflects the light irradiated by the irradiation sources IS to the surface of the semiconductor device below. The reflector RP has a disc-shaped recognition window RW in order to open the surface of the semiconductor device to the area camera so as not to interfere with the shooting of the barcode reader 181b.

The irradiation sources IS radiates light toward the reflector RP. That is, in this example, an indirect illumination method is followed in which light irradiated by the irradiation sources IS is incident on the surface of the semiconductor device after being reflected by the reflector RP. These irradiation sources IS are preferably arranged in a ring shape under the reflector RP to balance lighting. In addition, it is preferable that the irradiation sources (IS) are provided to irradiate light of various colors. This is because the barcode recognizer 181b can perform recognition optimized for lighting of a specific color according to recognition conditions such as the color of the barcode or the background color. For example, when 100 irradiation sources IS are provided, it is preferable to properly arrange 25 irradiation sources IS emitting blue light, red light, green light, and transparent color light by dividing them into 25 pieces.

The mover 184b moves the barcode reader 181b forward and backward. Accordingly, the illuminator 183b mounted on the barcode reader 181b is also moved by the mover 184b.

Meanwhile, according to a modified example, as shown in the structural diagram of FIG. 6 , the illuminator 184b' may be composed of two reflection mirrors RM and an irradiation source IS.

3. When a line scan camera is applied

The barcode recognition unit 180 according to the present example may include a barcode reader 181c, an illuminator 183c, and a mover 184c as shown in the structural diagram of FIG. 7 .

The barcode reader 181c is provided as a line scan camera and scans the barcodes of the semiconductor devices loaded on the loading plates 111 and 112 . Therefore, the control unit 190 can obtain barcodes of eight semiconductor devices while continuously moving the loading plates 111 and 112 without stopping them.

The illuminator 183c is provided under the barcode reader 181c and includes an installation member IE and irradiation sources IS.

The mounting member (IE) has a shape having a semi-cylindrical surface convex upward at the bottom. These installation members (IE) are elongated in the front-back direction perpendicular to the direction in which the loading plates 111 and 112 move in order to open the surface of the semiconductor device to the line scan camera so as not to interfere with the scanning of the barcode reader 181c. A recognition window RW is provided. In addition, the installation member IE is coupled to the barcode reader 181c by the coupling member JE, so it can move together with the barcode reader 181c.

The irradiation sources IS are installed on the semi-cylindrical surface of the installation member IE to irradiate light to the surface of the semiconductor device. Here, it is also preferable that the irradiation sources IS are provided to irradiate light of various colors.

The mover 184c moves the barcode reader 181a forward and backward.

<Description of information processing method>

Subsequently, the information processing method performed in the handler 100 having the above configurations will be described with reference to the flowchart of FIG. 8 .

1. Recognize<S801>

The barcode recognition part 180 recognizes barcodes of semiconductor devices loaded on the loading plates 111 and 112 when the loading plates 111 and 112 move from the loading positions LP ₁ and LP ₂ to the test position TP. .

2. Confirm <S802>

The confirmation unit 191 of the control unit 190 analyzes the barcode recognized in step S801 to check the identifier of each semiconductor device and information about the corresponding semiconductor device. Therefore, the confirmation unit 191 can confirm under what production conditions the corresponding semiconductor device was produced.

3. Save<S803>

The storage unit 192 stores the identifier and information for each semiconductor device identified in step S802.

4. Send<S804>

The communication unit 193 of the control unit 190 transmits the stored identifier and information to the tester in step S803. Therefore, the tester side may connect the test result of a specific semiconductor device to the identifier of the specific semiconductor device and store it.

Of course, steps S803 and S804 may be performed simultaneously or sequentially depending on implementation.

5. Receive <S805>

The communication unit 193 receives information about a test result of a specific semiconductor device from the tester side.

6. Record <S806>

The storage unit 192 records and stores the information on the test result received in step S805 by connecting it to the identifier of a specific semiconductor device.

In this embodiment, since step S804 is performed before the test, the tester can know the identifier and information of the semiconductor device to be tested. However, depending on the implementation, the barcode recognition part 180 may be provided between the test position TP and the unloading position UP ₁ , UP ₂ . In this case, the tester receives the identifier and information of the tested semiconductor device. come to know Of course, in any case, the tester can accurately specify the semiconductor device to be tested or tested.

In addition, information about the test condition of the current handler 100 is also transmitted together with the information transmitted to the tester side in step S804. Information on the test condition of the current handler 100 is also recorded and stored in step S806.

The information recorded and stored in step S806 can be used in a later retest of the semiconductor device, and when the retest is performed, the retest result is stored in the storage unit 192 .

On the other hand, since the above-described embodiment is merely one example of various types of handlers, it should not be construed that the present invention is limited to the above-mentioned handlers. That is, the present invention can be applied to any type of handler.

Therefore, although the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, it is understood that the present invention is limited only to the above-described embodiments, since the above-described embodiments have only been described with reference to preferred examples of the present invention. It should not be, and the scope of the present invention should be understood as the following claims and their equivalents.

100: Handler
111, 112: loading plate
121, 122: first carrier
150: loading part
160: test part
170: unloading part
180: barcode recognition part
181a, 182, 181b, 181c: barcode reader
183b, 183c: illuminator
RP: Reflector
IE: installation member
IS: Investigator
RW: recognition window
184a, 184b, 184c: mover
190: control part

Claims (11)

a loading element capable of loading a semiconductor device to be tested;
a transporter for transporting the loading element;
a loading portion for loading a semiconductor device to be tested into the loading element at a loading position;
a test section for testing the semiconductor device loaded into the loading element by the loading section;
an unloading part for unloading the semiconductor device, which has been tested in the test part, from the loading element in an unloading position;
a barcode recognition unit recognizing barcodes printed on semiconductor devices at a point on a movement path of the semiconductor devices moving from loading by the loading unit to unloading by the unloading unit; and
a control unit that controls the carrier, the loading unit, the test unit, the unloading unit, and the barcode recognition unit, and manages information for each semiconductor device by reading the barcode recognized by the barcode recognition unit; including,
The barcode recognition part is provided between the loading position of the loading part and the test position of the test part
Handler for testing semiconductor devices. a loading element capable of loading a semiconductor device to be tested;
a transporter for transporting the loading element;
a loading portion for loading a semiconductor device to be tested into the loading element at a loading position;
a test section for testing the semiconductor device loaded into the loading element by the loading section;
an unloading part for unloading the semiconductor device, which has been tested in the test part, from the loading element in an unloading position;
a barcode recognition unit recognizing barcodes printed on semiconductor devices at a point on a movement path of the semiconductor devices moving from loading by the loading unit to unloading by the unloading unit; and
a control unit that controls the carrier, the loading unit, the test unit, the unloading unit, and the barcode recognition unit, and manages information for each semiconductor device by reading the barcode recognized by the barcode recognition unit; including,
The barcode recognition part is provided between the test position of the test part and the unloading position of the unloading part
Handler for testing semiconductor devices. According to claim 1 or 2,
A plurality of semiconductor elements may be loaded on the loading element so as to be arranged side by side at least in a direction in which the loading element moves;
The barcode recognition part is installed above the moving path of the loading element to sequentially recognize the barcodes of the semiconductor elements loaded on the moving loading element,
When the loading element passes below the barcode recognition part, the control part repeats the movement and stop of the loading element at least once, so that the barcode recognition part is printed on the plurality of semiconductor elements loaded on the loading element. Controlling the carrier to sequentially recognize barcodes
Handler for testing semiconductor devices. According to claim 1 or 2,
The barcode recognition part,
Barcode reader for recognizing barcodes;
an illuminator for radiating light to the surface of the semiconductor device in order to recognize the barcode by the barcode reader; containing
Handler for testing semiconductor devices. According to claim 4,
The illuminator is disposed between the barcode reader and the loading element,
The illuminator has a recognition window through which the barcode reader can recognize the barcode of the semiconductor device located below the illuminator.
Handler for testing semiconductor devices. According to claim 5,
the illuminator,
An installation member having a semi-cylindrical surface convex upward at the bottom; and
at least one irradiation source installed on the semi-cylindrical surface of the installation member; Including,
The recognition window is provided on the installation member
Handler for testing semiconductor devices. According to claim 5,
the illuminator,
a dome-shaped reflector convex upward; and
at least one irradiation source installed under the reflector to indirectly illuminate the semiconductor device through the reflector; Including,
The recognition window is provided on the reflector
Handler for testing semiconductor devices. According to claim 1 or 2,
Since the loading elements and carriers are provided in plurality, the semiconductor device moves in a plurality of paths,
The barcode recognition part,
Barcode reader for recognizing barcodes; and
a mover for moving the barcode reader to selectively position the barcode reader above the plurality of paths; containing
Handler for testing semiconductor devices. According to claim 8,
The barcode recognition unit includes an illuminator for irradiating light to the surface of the semiconductor device for recognizing the barcode by the barcode reader; Including more,
The barcode reader and the illuminator are coupled to each other by a coupling member, so that the barcode reader and the illuminator move together by the operation of the mover.
Handler for testing semiconductor devices. A recognition step of recognizing the barcode printed on the semiconductor device on the path along which the semiconductor device moves;
a confirmation step of analyzing the barcode recognized in the recognition step and confirming an identifier for each semiconductor device and information on the corresponding semiconductor device;
a storage step of storing identifiers and information for each semiconductor device identified in the checking step;
a transmission step of transmitting the identifier and information stored in the storage step to the tester side so that the tester side connects the test result of the semiconductor device to the identifier of the corresponding semiconductor device and stores it; and
a receiving step of receiving information about a test result of a specific semiconductor device from the tester side; Including,
The recognition step and the transmission step are performed before or after the test of the semiconductor device.
Information processing method of handler for semiconductor device test. According to claim 10,
a recording step of recording a test result of a semiconductor device coming from the tester by connecting it to an identifier of the corresponding semiconductor device; further comprising
Information processing method of handler for semiconductor device test.

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