CN201522545U - Independent testing machine station for testing semiconductor elements and test sorting system - Google Patents

Independent testing machine station for testing semiconductor elements and test sorting system Download PDF

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Publication number
CN201522545U
CN201522545U CN 200920074075 CN200920074075U CN201522545U CN 201522545 U CN201522545 U CN 201522545U CN 200920074075 CN200920074075 CN 200920074075 CN 200920074075 U CN200920074075 U CN 200920074075U CN 201522545 U CN201522545 U CN 201522545U
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test
semiconductor element
bogey
testing
board
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曾一士
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Chroma ATE Suzhou Co Ltd
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Chroma ATE Suzhou Co Ltd
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Abstract

The utility model discloses an independent testing machine station for testing semiconductor elements. The testing machine station comprises a base, a group of transporting and testing devices and a group of processing devices; the testing machine station tests a plurality of semiconductor elements accommodated in a bearing device; the transporting and testing device conveys in/out the semiconductor elements to be tested by one testing position and carries out the test; the processing device receives the testing results of the transporting and testing device and outputs the testing results as well as the position records of the tested semiconductor elements so that the subsequent sorting machine station can easily match with different testing machine stations; therefore, the sorting operation of other independent testing machine stations is carried out continuously, and the test sorting system has more flexible configurations. The utility model also discloses a test sorting system which adopts the independent testing machine station for testing the semiconductor elements.

Description

Semiconductor element independent test board and testing classification system
Technical field
The utility model relates to a kind of semiconductor element independent test board; The utility model also relates to a kind of testing classification system that adopts this independent test board.
Background technology
Semiconductor element has become core indispensable in most electronic equipments, for example the microprocessor in each electronic product, CMOS (complementary matal-oxide semiconductor) element or charge coupled device (CCD) that digital camera includes; And be used for the automatically testing machine platform of measuring semiconductor element at present, except that found fast by electrical detection that element under test opens circuit, short circuit or misconnection manufacturing mistake lose, also semiconductor element to be measured is inserted in the actual environment for use and operate through the test of real border, obtain the reactiveness of this element under test under actual environment for use, learn whether it can be for actual installation.
If the element that institute's desire measures is CCD, the testing circuit board of above-mentioned real border test is for example circuit board of camera cell phone, if the element of surveying is the IC that display card is used, promptly can display card as testing circuit board, in like manner, radio frequency (RF) IC that is applied to for example gate inhibition's control identification also answers so.
A kind of common IC detects the classification board as shown in Figure 1, the charging tray that materials device 110 holds splendid attire IC to be measured is put with first by system, and put in the charging tray of materials device 110 from first by moving materials device 160, draw single IC to be measured with suction nozzle, move to loading and transmitting device 140 along graphic X-Y plane, loading and transmitting device 140 is again with fetching device 132 places of IC transverse moving left and right to be measured to correspondence; Be supplied to the test of corresponding tester 131 again by the fetching device 133 of the correspondence in three groups of fetching devices 132, and will finish the IC taking-up of survey, put back to loading and transmitting device 140; Fetched the IC that surveys by moving materials device 160 from carrying device 140 places again, the intactlyest surveyed IC, be moved to second and put that materials device 150 is punished classes or take in not qualified district 120 according to testing result.
Because pan feeding and discharging move materials device 160 by single group and carry out, even for promoting detection efficiency, additionally move be provided with on the materials device 160 a plurality of for example with four suction nozzles of square arrangement, and at proving installation 130 corresponding plural groups tester 131 is set, attempts many IC to be measured of synchronous detection; But detailed consideration testing process, test if draw four IC to be measured at every turn, amount to 80 IC with 10 row even the hypothesis charging tray just can hold 8 row, therefore can be by chance with 20 sucking actions of integer, institute holds IC in the detection one whole biscuit dish, thereby accelerates pan feeding speed.
Yet, in follow-up assorting process, owing to certainly lead to part sub-quality products, defective products or the product that need resurvey, make each intact four IC that survey all to be placed into second and put materials device 150, putting materials device 150 as if second also is to be listed as totally 80 storage tank structures as aforesaid 8 row with 10, according to present common for example 95% yield is example, and 80 IC to be measured in each charging tray have 4 can not pass through smoothly to detect approximately; To cause in the discharging assorting process, can't all fill up second each of putting materials device 150 just goes at every turn, in case there is the vacancy of odd number to occur, in the time of will forcing next time classified placing, move the odd number vacancy that materials device 160 must fill up previous row earlier, continue line feed again and put remaining IC, delay the processing speed of the process of putting.
Especially consider in the intact IC of survey of certain a collection of 4, if there is one to belong to defective products, then moving materials device 160 also needs successively materials device 150 to be put in 3 qualified storings to the second, and defective products is put into not qualified district 120 separately, makes that to move materials device 160 track routes complicated more and slow.Be subject to the complicated flow process of this kind, detection efficiency can't further be promoted, and board wants to carry out this kind compound action, and manufacturing cost also can't significantly reduce; Especially everything all need be dependent on same group and move materials device 160, and the speed of moving materials device 160 will become the bottleneck of whole detection efficient; In addition, when the testing process of tested person IC need expend the long period, moving materials device 160 will be forced to vacant wait, and follow-up sorting operations does not also have independent running and need stop.
Moreover, when tested IC is RFIC or WiMAX one series products, owing to be subject to the external electromagnetic wave interference, must before detecting, outside board, sets up the isolated shielding electromagnetic waves device of a cover, and confirm through good ground connection and shielding, could accurately carry out and detect.Yet, be subject to the limited amount of this series products, and the tester table price is very high, many packaging and testing manufacturer often can't provide exclusive board to carry out this type of IC check, but changing when detecting production line, just installs shield assembly additional temporarily.In each installing process, in the reasonable time of all can wasting,, will there be idle situation to take place again if establish the exclusive detection classification of RFIC board, cause the awkward predicament of IC packaging and testing manufacturer.
The utility model content
Technical problem to be solved in the utility model provides the intact IC of survey of a kind of simplification and puts approach and can promote speed, and simple in structure, and manufacturing cost decreases, and is easy to a batch semiconductor element independent test board that detects semiconductor element.
Another technical matters to be solved in the utility model provides a kind of the simplification respectively and surveys IC storing approach and divide classpath, thereby significantly promote testing efficiency, and can be according to test speed and classification speed difference, change two kinds of board ratios easily, increase system efficiency, can also simplify tester table and classification board structure respectively, thereby significantly reduce cost, make exclusive tester table become possible semiconductor element test categorizing system.
In order to solve the problems of the technologies described above, the semiconductor element independent test board that the utility model provides, be used for testing the semiconductor element that plural number is placed in the plural corresponding storage tank of a bogey respectively, its innovative point feature is, this tester table comprises pedestal, moves proving installation and treating apparatus, wherein:
This pedestal is formed with pan feeding position and discharging position, and the pan feeding position is used to put the bogey that is equipped with semiconductor element to be measured, and the discharging position is used to put the bogey of the semiconductor element that has been equipped with survey;
This is moved proving installation and has at least one test position, is used for that semiconductor element to be measured is moved to this test position and tests, and will finish the survey semiconductor element and shift out this test position;
This treating apparatus is used to receive the test result that this moves proving installation, and this test result and tested semiconductor element are also exported in the storage tank position of bogey co-registered.
Preferably, the above-mentioned bogey of the utility model has an identification mark.
Preferably, the above-mentioned proving installation of moving of the utility model comprises mechanical arm and test port, mechanical arm draws semiconductor element to be measured and puts to this test position from the storage tank of bogey, and will finish the survey semiconductor element from test position and put back the identical storage tank, test port is positioned at the semiconductor element to be measured of test position in order to test.Preferably, this mechanical arm has the suction nozzle that plural number is used for drawing respectively semiconductor element to be measured, and above-mentioned test port has the test cell of number corresponding to the suction nozzle number.
Preferably, the above-mentioned proving installation of moving of the utility model comprises Conveyer and measuring head, Conveyer moves to the discharging position from test position again in order to this bogey is moved to test position from the pan feeding position, and measuring head is contained in semiconductor element in the bogey in order to batch test.
Preferably, the above-mentioned semiconductor element to be measured of the utility model is housed inside in the storage tank in the contact mode of making progress, and measuring head is set at down the pressure arm below.
Preferably, the utility model more comprises this at least one test position of a set of shield, makes the isolated shield assembly of this test position and external electromagnetic.
The semiconductor element test categorizing system that the utility model provides, being used for testing the plural semiconductor element that is placed in the plural corresponding storage tank of at least one bogey is respectively also classified, its innovative point is: this system comprises plural groups above-mentioned semiconductor element independent test board and classification board, the number of classification board lacks one than the independent test board at least, this classification board comprises base portion, displacement apparatus and drive unit, wherein:
This base portion is formed with receiving position and the position of getting the raw materials ready, and receiving position receives the bogey from the independent test board, the qualified semiconductor element that put the position has plural number to be used to replace of getting the raw materials ready;
This drive unit receives from independent test board treating apparatus output signal, and according to output signal driving displacement apparatus, with the qualified semiconductor element of the intact survey semiconductor element of test failure in the bogey and the position of getting the raw materials ready double replacement mutually, make the qualified intact survey semiconductor element that is that is held in the storage tank of bogey.
Preferably, the utility model more comprises one group for the shifting apparatus that bogey is moved to this receiving position of classification board by the discharging position of independent test board.
Preferably, the above-mentioned classification board of the utility model comprises one group of identification mark that is used to read bogey and the output signal reading device to drive unit, and above-mentioned drive unit receives the signal from this reading device simultaneously.
The utility model is by tester table independently, only is responsible for detecting and record testing result and temporarily do not carry out classification, makes each mobile efficient optimization, not only simplifies one-piece construction, and can promote the flow process speed of detection itself; Moreover, because classification speed generally is higher than test rate, consider the speed difference of this kind test and classification board, the system configuration that can cooperate plural tester table by a classification board, obtain the optimum efficiency of bulk treatment system, and after tester table and classification board cutting and separating, system has reduced the space that is provided with of taxon, and reduces unnecessary classified part acquisition cost; More because of acquisition cost is significantly reduced, thereby make that exclusive special tester table is easy to realize, provide test manufacturer better selection elasticity.
Description of drawings
Fig. 1 is the schematic top plan view of a common semiconductor element test categorizing system;
Fig. 2 is the schematic perspective view of the semiconductor element independent test board of the utility model first embodiment;
Fig. 3 is the block schematic diagram of the semiconductor element test categorizing system of the utility model first embodiment;
Fig. 4 is the schematic top plan view of the semiconductor element test categorizing system of the utility model first embodiment;
Fig. 5 is the schematic perspective view of the semiconductor element independent test board of the utility model second embodiment;
Fig. 6 is the schematic top plan view of the semiconductor element test categorizing system of the utility model second embodiment;
Fig. 7 is the bogey storehouse synoptic diagram after the semiconductor element test categorizing system classification of the utility model the 3rd embodiment is finished.
Wherein: 110 is first to put materials device; 120 is not qualified district; 130 is proving installation; 131 is tester; 132 is fetching device; 133 is fetching device; 140 is loading and transmitting device; 150 is second to put materials device; 160 for moving materials device; 2,2 ' is the testing classification system; 20,20 ' is the independent test board; 200 is pedestal; 23,23 " be treating apparatus; 241 is mechanical arm; 242,243 is test port; 244 is shield assembly; 2413 is suction nozzle; 2423,2433 is test cell; 251 ' is Conveyer.252 ' is measuring head; 253 ' is following pressure arm; 3,3 ' is the classification board; 300 is base portion; 32,32 ' is reading device; 33,33 " be drive unit; 34,34 ' is displacement apparatus; 35,35 ' is shifting apparatus; 51, be bogey 51 ', 52,52 "; 520 is storage tank; 53 is identification mark; 61 is the pan feeding position; 62 are the discharging position; 63 is test position; 65,65 ' is the position of getting the raw materials ready; 66 is receiving position; 91,92,91 ' is semiconductor element; 93 ' is contact.
Embodiment
Below in conjunction with the drawings and specific embodiments, further set forth the utility model, avoid the drawing disorder in the specific embodiment for convenience of description, comprise that the structure that linkage unit and support circuit etc. are easy to understand all gives omission.。These embodiment be interpreted as only being used to the utility model is described and be not used in the restriction protection domain of the present utility model.After the content of having read the utility model record, those skilled in the art can make various changes or modifications the utility model, and these equivalences change and modification falls into the utility model claims institute restricted portion equally.
The semiconductor element independent test board that the utility model first embodiment provides is to be example with the test of real border as shown in Figure 2; As the charging tray of bogey, it is example that its storage tank number then amounts to 32 with 4 * 8; And utilize one group to move the test action that proving installation carries out semiconductor element.
Be formed with a pan feeding position and a discharging position on the pedestal 200 of independent test board 20, and ccontainingly respectively semiconductor element 91 to be measured is housed has reached two bogeys 51 surveying semiconductor element 92,52, the proving installation of moving in the present embodiment comprises that is then moved a semiconductor element 91,92 mechanical arm 241, and for promoting single batch of amount detection, these group mechanical arm 241 examples are interpreted as has four suction nozzles 2413, to draw four semiconductor elements 91 to be measured simultaneously, and be positioned at the test port 242 of test position 63,243 also example be interpreted as and have four corresponding test cells 2423,2433, make each test port 242,243 all can detect by batch four semiconductor elements 91 to be measured of acceptance.
Please in the lump with reference to Fig. 3, after semiconductor element 91 to be measured had detected, testing result reached treating apparatus 23 by test port 242,243 and is handled; The special character of present embodiment is: regardless of the intact test result of surveying semiconductor element 92, all still move all intact semiconductor element 92 to discharging positions of surveying with mechanical arm 241 and be placed in same intact survey semiconductor element 92 bogeys 52.
Especially as shown in this embodiment, when tested semiconductor element 91 bogeys 51 are identical with intact survey semiconductor element 92 bogeys 52 configuration structures, more can be fully survey semiconductor element 92 and be placed in same position when to be measured finishing, thus, 32 elements can be finished whole test processs with the form of 8 times (each 4) merely, that is, the test of 32 elements of whole dish, only need spend 8 simple pan feeding actions, and 8 simple dischargings are moved, significantly simplify the mechanical action of mechanical arm, thereby quicken the testing process of whole disc elements.
Test result for ease of each element of identification, each intact semiconductor element 92 bogey 52 of surveying is provided with the identification mark 53 that is illustrated as bar code, and by the identification mark 53 for the treatment of apparatus 23 difference recording carrying devices 52, the position of each intact survey semiconductor element 92 storage tank 520 in bogey 52 and test result of every element.Certainly, as be familiar with present technique field person and can understand easily, test port 242,243 herein also can be in response to testing requirement, be designed to be responsible for two groups of different each other different testing processs respectively and successively operate, two kinds of testing procedures are carried out in single tester table, promote the elasticity that board uses; Or install shield assembly 244 additional to carry out for example detection of RFIC.
When test rate is suitable with classification speed, then can be in the lump with reference to shown in Figure 4, first embodiment that forms the utility model semiconductor element test categorizing system 2, classification board 3 is to be set at tester table 20 to carry the runner downstream position in the present embodiment, above-mentioned semiconductor element 91 to be measured is moved to test port 242 by the bogey 51 at 61 places, tester table 20 pan feeding positions, finished after tested and place the bogey 52 at 62 places, discharging position; And the bogey 52 and the semiconductor element 92 of intact surveys are moved to the receiving position 66 of the board 3 of classifying with shifting apparatus 35, read identification mark 53 by the reading device 32 that is illustrated as barcode reader, thereby make drive unit 33 learn pending bogey 52 why.
Thereby drive unit 33 is obtained the corresponding informance of the semiconductor element 92 of all each storage tanks 520 in the bogey 52, and instruction displacement apparatus 34 removes the defective element in the bogey 52, again in the bogey of getting the raw materials ready by 65 places, position that get the raw materials ready on classification board 3 base portions 300, take out a qualified intact survey element and mend the vacancy that expires in the bogey 52, but make bogey 52 finish sorting operations rapidly and shipment.
On the other hand, as be familiar with present technique field person and can understand easily, according to present technology, testing semiconductor element to be measured might not take out element from charging tray, second embodiment of the utility model as shown in Figure 5, wherein, all semiconductor elements 91 ' to be measured are to be housed inside in the storage tank of bogey 51 ' in the contact 93 ' mode that makes progress, tester table 20 ' then transports bogey 51 ' to test position with the Conveyer 251 ' that one group of example is interpreted as belt and belt pulley, and utilize the below to be provided with the following pressure arm 253 ' of plural measuring head 252 ' to bottom offset, directly contact the contact 93 ' of each semiconductor element 91 ' to be measured, for promoting detection efficiency, be the storage tank number that the number of measuring head 252 ' is designed to be equal to bogey 51 ' in the present embodiment, use whole dish element under test has once been surveyed.Certainly, no matter whether measuring head 252 ' number is equal to storage tank, and it is all is familiar with present technique field person and can understands easily.
Continue aforementioned, number minute when test speed costs, and classification speed is during far above test speed, the semiconductor element test categorizing system 2 ' of second embodiment of the utility model will be as shown in Figure 6, two tester tables 20 ' in left side are respectively by carrying runner among the figure, and the bogey that will finish survey transfers to the receiving position of right side classification board 3 ' shifting apparatus 35 ' among the figure.Bogey from different tester tables 20 ' will read its identification mark by reading device 32 ' respectively, and by drive unit with reference in each bogey storage tank, the detecting information of each counter element, drive displacement apparatus 34 ' by picking qualified component in the position 65 ' loading plate of getting the raw materials ready, replace the defective element in the bogey; Because a dish is for example in 32 elements, on average only 1 to 2 do not meet standard, after the board 3 ' of therefore classifying can be changed this 1 to 2 element rapidly, the output and finish all tests and sorting operations fast of the bogey that will fill qualified component.
As be familiar with present technique field person and can understand easily, brought forward literary composition institute example, drive unit reads bar code to confirm pending bogey carrier model by barcode reader; On the other hand, the 3rd embodiment of the utility model as shown in Figure 7, at bogey 52 " layout that also can omit bar code; illustration has three platform independent tester tables in the present embodiment; after the board test port detects and finishes; testing result is reached treating apparatus 23 " handled, successively deliver to the classification board according to a preset order, again by drive unit 33 " according to this preset order classify.
Via above-mentioned exposure, the intact survey IC in the test jobs puts flow process thereby simplification, thereby test speed improves, and makes batch testing process more smooth and easy; Therefore the tester table one-piece construction is also simplified, and cost decreases, and making special testing process have exclusive tester table becomes feasible.The finish classification process of back of test also is simplified synchronously, tests or sorting operations all can be accelerated respectively, significantly promotes and detects the usefulness of classifying; Especially the user can consider self product test speed and classification speed difference, changes two kinds of board ratios easily, the elevator system whole efficiency.And when tester table and classification board are not must take the example that makes a comparison to be provided with as prior art, reduce unnecessary classification board number undoubtedly, reduce the consumption of meaningless cost and space by this, more increase manufacturer's competitive power.

Claims (11)

1. a semiconductor element independent test board is used for testing the semiconductor element that plural number is placed in the plural corresponding storage tank of a bogey respectively, it is characterized in that this tester table comprises pedestal, moves proving installation and treating apparatus, wherein:
This pedestal is formed with pan feeding position and discharging position, and the pan feeding position is used to put the bogey that is equipped with semiconductor element to be measured, and the discharging position is used to put the bogey of the semiconductor element that has been equipped with survey;
This is moved proving installation and has at least one test position, is used for that semiconductor element to be measured is moved to this test position and tests, and will finish the survey semiconductor element and shift out this test position;
This treating apparatus is used to receive the test result that this moves proving installation, and this test result and tested semiconductor element are also exported in the storage tank position of bogey co-registered.
2. independent test board according to claim 1 is characterized in that, this bogey has an identification mark.
3. independent test board according to claim 1, it is characterized in that, this is moved proving installation and comprises mechanical arm and test port, mechanical arm draws semiconductor element to be measured and puts to this test position from the storage tank of bogey, and will finish the survey semiconductor element from test position and put back the identical storage tank, test port is positioned at the semiconductor element to be measured of test position in order to test.
4. independent test board according to claim 3 is characterized in that this mechanical arm has the suction nozzle that plural number is used for drawing respectively semiconductor element to be measured, and above-mentioned test port has the test cell of number corresponding to the suction nozzle number.
5. independent test board according to claim 1, it is characterized in that, this is moved proving installation and comprises Conveyer and measuring head, Conveyer is in order to move to test position with this bogey from the pan feeding position, move to the discharging position from test position again, measuring head is contained in semiconductor element in the bogey in order to batch test.
6. independent test board according to claim 5 is characterized in that semiconductor element to be measured is housed inside in the storage tank in the contact mode of making progress, and measuring head is set at down the pressure arm below.
7. according to any one described independent test board of claim 1-6, it is characterized in that, more comprise this at least one test position of a set of shield, make the isolated shield assembly of this test position and external electromagnetic.
8. semiconductor element test categorizing system, being used for testing the plural semiconductor element that is placed in the plural corresponding storage tank of at least one bogey is respectively also classified, it is characterized in that, this system comprises any one described semiconductor subassembly independent test board and at least one classification board among the plural groups claim 2-7, and the number of classification board is less than the independent test board, this classification board comprises base portion, displacement apparatus and drive unit, wherein:
This base portion is formed with receiving position and the position of getting the raw materials ready, and receiving position receives the bogey from the independent test board, the qualified semiconductor element that put the position has plural number to be used to replace of getting the raw materials ready;
This drive unit receives from independent test board treating apparatus output signal, and according to output signal driving displacement apparatus, with the qualified semiconductor element of the intact survey semiconductor element of test failure in the bogey and the position of getting the raw materials ready double replacement mutually, make the qualified intact survey semiconductor element that is that is held in the storage tank of bogey.
9. testing classification according to claim 8 system is characterized in that, more comprises one group for the shifting apparatus that bogey is moved to this receiving position of classification board by the discharging position of independent test board.
10. testing classification according to claim 8 system is characterized in that, this classification board comprises one group of identification mark that is used to read bogey and the output signal reading device to drive unit; Above-mentioned drive unit receives the signal from this reading device simultaneously.
11. testing classification according to claim 10 system it is characterized in that this identification mark is a bar code, and this reading device is a barcode reader.
CN 200920074075 2009-06-11 2009-06-11 Independent testing machine station for testing semiconductor elements and test sorting system Expired - Lifetime CN201522545U (en)

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