CN114029245A - Chip testing and sorting line and method - Google Patents
Chip testing and sorting line and method Download PDFInfo
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- CN114029245A CN114029245A CN202111293268.5A CN202111293268A CN114029245A CN 114029245 A CN114029245 A CN 114029245A CN 202111293268 A CN202111293268 A CN 202111293268A CN 114029245 A CN114029245 A CN 114029245A
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- 238000012360 testing method Methods 0.000 title claims abstract description 368
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 243
- 238000012546 transfer Methods 0.000 claims abstract description 239
- 230000007306 turnover Effects 0.000 claims abstract description 234
- 238000007599 discharging Methods 0.000 claims abstract description 100
- 238000004519 manufacturing process Methods 0.000 claims abstract description 23
- 238000001467 acupuncture Methods 0.000 claims description 52
- 238000005259 measurement Methods 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 238000010992 reflux Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 7
- 230000003139 buffering effect Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 239000012776 electronic material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/3412—Sorting according to other particular properties according to a code applied to the object which indicates a property of the object, e.g. quality class, contents or incorrect indication
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
- B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted
- B07C2501/0063—Using robots
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a chip intelligent test sorting line and a chip intelligent test sorting method, which are characterized by comprising a discharging machine and at least one test machine, wherein the discharging machine comprises a production line, a first material transfer mechanism, a turnover disc transfer mechanism and a plurality of material disc feeding and discharging modules; the turnover disc transfer mechanism of the testing machine transfers the turnover disc of the turnover disc transfer mechanism to the test line integrally to be conveyed to the area to be tested of each test fixture module and the like, so that the turnover disc is used as a carrier transportation center to directly transfer across the testing machine, and the turnover disc can be combined according to the time required by chip testing to form a flexible chip testing line capable of being extended in a building block type.
Description
Technical Field
The invention relates to the field of automatic testing of electronic materials, in particular to an intelligent chip testing and sorting line and an intelligent chip testing and sorting method.
Background
The existing chip testing and sorting line adopts a scheme that one chip arranging machine corresponds to one testing machine, the testing machine only has 16 jigs at most, and the productivity is low. The scheme that an existing chip arranging machine corresponds to a testing machine is limited by structure, action flow and the like, the number of jigs cannot be freely increased or other testing jigs cannot be replaced according to the time required by chip testing, and different testing combinations and flexible chip testing lines capable of being extended in a building block type cannot be formed.
Disclosure of Invention
The invention mainly aims to overcome part of defects in the prior art and provide a flexible chip test sorting line which has the advantages that a plurality of test machines share one chip arranging machine for loading, unloading and chip arranging, the number of the test machines and the number of the jigs can be freely increased, the types of the test jigs can be replaced, and the productivity can be rapidly expanded.
In order to achieve the purpose, the intelligent chip testing and sorting line is characterized by comprising a discharging machine and at least one testing machine, wherein the discharging machine comprises a production line, a first material transfer mechanism, a turnover disc transfer mechanism and a plurality of charging and discharging tray modules; the turnover disc transferring mechanism of the testing machine integrally transfers the turnover disc of the turnover disc transferring mechanism to the test line to be conveyed to a region to be tested of each test fixture module; the turnover disc wire changing mechanism transfers the turnover disc provided with the tested chip on the feeding and testing wire to the return wire to return. Based on this kind of new row of material machine and test machine structure framework like this, realize using week carousel as carrier transportation center, and week carousel not only can be at row material machine, the inside high-efficient circulation of test machine, more can directly cross the machine circulation, material loading has been improved, exchange, efficiency, avoid blockking up and waiting, combine in addition to send the test wire, the return wire, the setting of turnover dish trades line mechanism, the modular setting of unloading module and test fixture module in the charging tray, 1 row of sharing machine, the independent assortment extension of many test machines, it can make up them according to the chip test required time to have realized, form the flexible chip test wire that can the extension of building block formula extension, make the increase of productivity multiple times. And the requirements on the workshop site are also reduced.
Preferably, the turnover disc transfer mechanism can transfer the turnover disc returned by the return line to the turnover disc transfer mechanism, the turnover disc transfer mechanism returns along with the production line to the discharging machine, and the first material transfer mechanism of the discharging machine transfers the material disc of the material disc feeding and discharging module or the preset discharging position of the discharging machine is used for discharging. The material loading conveying and the recovery conveying are communicated among all machines through the turnover disc and the corresponding structure.
Preferably, the discharger further comprises an exchange frame, the exchange frame is provided with a plurality of exchange discs, the turnover disc transfer mechanism can also transfer the turnover disc returned by the return line to the turnover disc transfer mechanism, the turnover disc transfer mechanism returns the discharger along with the production line, and then the first material transfer mechanism of the discharger is transferred to the exchange disc on the exchange frame. Like this, through the setting of exchange frame and exchange dish at the sheet arranging machine, the test content of the sheet arranging machine left and right sides can be different, and the chip that has surveyed is through exchange frame and exchange dish, and the tester can exchange the material of surveying between the left and right sides and carry out another kind of test, realizes a line multiple test, can not reduce the efficiency between each other simultaneously.
Preferably, the testing machine or the testing jig module of the testing machine further includes a second material transfer mechanism, the second material transfer mechanism transfers the chips on the turnover disc in the region to be tested of the testing jig module to the acupuncture points corresponding to the testing jig module, and transfers the chips on the acupuncture points corresponding to the testing jig module to the turnover disc. Therefore, the transfer efficiency from the area to be tested of the test fixture module to the test fixture can be improved, particularly, the test fixture module is provided with the second material transfer mechanism, and the test fixture module is an independent module relative to the test machine, so that the test fixture module can be rapidly disassembled, maintained or replaced, increased or decreased without stopping production, and the like, and the productivity is further improved.
Preferably, the test device comprises more than two test machines, at least one test machine is respectively arranged at two ends of a production line of the discharging machine, and at least more than one turnover disc transfer mechanism and more than one turnover disc transfer mechanism are arranged between the discharging machine and the adjacent test machines. The discharging machine is provided with more than two assembly lines, and the turnover disc transfer mechanism is arranged on the left side and the right side of each assembly line. At least one end of the production line of the discharging machine is provided with more than two testing machines, and the measuring lines, the return lines and the return lines of the more than two testing machines on the same side are respectively connected in series.
Preferably, the tester is provided with two feeding and measuring lines parallel to the return line on two sides of the return line, and a plurality of test fixture modules are arranged along the outer side of each feeding and measuring line. The test fixture module comprises a first test fixture module, the first test fixture module is provided with the second material transfer mechanism, each fixture of the first test fixture module is provided with a plurality of acupuncture points distributed in an entire row, the second material transfer mechanism is provided with a material suction plate matched with the quantity and the distribution of the fixture acupuncture points, and the material suction plate of the second material transfer mechanism can simultaneously suck chips with the same quantity as the acupuncture points of the fixtures so as to transfer the chips between the circumference disc of the test line and the fixtures. The test fixture module comprises a second test fixture module, the second test fixture module is provided with a plurality of fixtures, each fixture is provided with an acupuncture point, the second material transfer mechanism absorbs chips from the turnover disc and puts the chips into the acupuncture points of each fixture one by one, or absorbs tested chips from each acupuncture point of each fixture one by one to put the turnover disc of the test line.
Preferably, after the transferring mechanism of the turnover disc returns to the discharging machine along with the production line, the first material transferring mechanism of the discharging machine transfers the tested chips to the exchange disc on the exchange frame, and then the testing machines on the left side and the right side of the discharging machine exchange materials through the exchange disc to perform another test.
The test fixture module comprises a first test fixture module, the first test fixture module is provided with the second material transfer mechanism, each fixture of the first test fixture module is provided with a plurality of acupuncture points distributed in an entire row, the second material transfer mechanism is provided with a material suction plate matched with the quantity and the distribution of the fixture acupuncture points, and the material suction plate of the second material transfer mechanism can simultaneously suck chips with the same quantity as the acupuncture points of the fixtures so as to transfer the chips between the circumference disc of the test line and the fixtures.
The test fixture module comprises a second test fixture module, the second test fixture module is provided with a plurality of fixtures, each fixture is provided with an acupuncture point, the second material transfer mechanism absorbs chips from the turnover disc and puts the chips into the acupuncture points of each fixture one by one, or absorbs tested chips from each acupuncture point of each fixture one by one to put the turnover disc of the test line.
Like this, when the test type is the same at the bin discharger both ends, the left and right sides both ends can form two test sorting lines that share the bin discharger, and when the test type was inequality at the bin discharger both ends, then the left and right sides test machine can make up and form a line that has different tests to satisfy different test demands. Because the tester is in butt joint and expansion in a form of one building block, the productivity is further improved.
Preferably, the turnover disc transfer mechanism is provided with a turnover disc horizontal rotating structure, the material taking directions of the first material transfer mechanism and the turnover disc transfer mechanism are horizontal and vertical, and the turnover disc horizontal rotating structure can enable the turnover disc to rotate +/-90 degrees so that the direction of the turnover disc is the same as the material taking direction of the first material transfer mechanism or the turnover disc transfer mechanism respectively. Like this, make things convenient for first material transfer mechanism and turnover dish transfer mechanism's setting, improve the efficiency of transferring.
Preferably, the testing machine further comprises a rack, at least one group of code scanners is arranged above the rack, and the code scanners can scan the codes of the chips in the turnover discs on the feeding and testing line and the return line to acquire chip information. The first material transfer mechanism and the second material transfer mechanism are provided with CCD cameras or laser height measuring instruments to detect and judge whether chips exist in acupuncture points of the material tray, the turnover disc or the test fixture module, and/or position parameters of the chips and/or appearances of the chips.
The invention also relates to an intelligent chip testing and sorting method, which is characterized by comprising the following steps of:
a feeding step, wherein a first material transfer mechanism of a discharging machine transfers the chip to be tested to a turnover disc on a turnover disc transfer mechanism;
a turnover disc transferring step, in which a turnover disc transferring mechanism of the testing machine integrally transfers the turnover disc on the turnover disc transferring mechanism of the discharging machine to a test sending line of the testing machine and conveys the turnover disc to a to-be-tested area of each testing jig module;
a material taking and testing step, wherein a second material transfer mechanism of the testing machine transfers the chips on the turnover disc in the area to be tested of the test jig module to the acupuncture points corresponding to the test jig module for testing, and transfers the chips of the acupuncture points corresponding to the test jig module to the turnover disc;
a turnover disc wire changing and refluxing step, wherein a turnover disc wire changing mechanism of the testing machine transfers a turnover disc provided with tested chips on a feeding and testing wire to the reflow wire to reflux in the direction of the discharging machine, and the turnover disc transferring mechanism transfers the turnover disc returned by the reflow wire to a turnover disc transferring mechanism in a whole;
and a blanking or material changing step, namely, a first material transfer mechanism of the discharging machine transfers the tested chips on the transferring disc transfer mechanism to a blanking position or a blanking bin preset by the discharging machine for blanking, or transfers the chips to an exchange disc of an exchange frame of the discharging machine for material changing to perform another test.
Preferably, the material conveying device further comprises a direction adjusting step of the turnover disc, and the turnover disc transferring mechanism rotates the turnover disc by +/-90 degrees so that the direction of the turnover disc is respectively the same as the material taking direction of the first material transferring mechanism or the turnover disc transferring mechanism.
Preferably, the feeding step comprises the steps that the feeding module of the material tray feeds materials through the material tray and transmits the materials to the material placing position; the first material transfer mechanism takes the materials from the material suction heads in sequence after taking pictures of the chip through the CCD of the first material transfer mechanism; the chips on the first material transfer mechanism are photographed by a CCD arranged below and then sequentially placed on a turnover disc on the turnover disc transfer mechanism;
the material taking test step comprises the steps that a turnover disc transfer mechanism of a test machine takes the whole turnover disc and places the turnover disc to a turnover disc of a feeding and testing line; the code scanner scans each chip to acquire chip information; the test line moves the turnover disc to a to-be-tested area of the test fixture module; the laser height measuring instrument performs height measurement and rechecking on the turnover disc chip; the second material transfer mechanism presses down to take materials, then rotates to the position above the acupuncture points of the test jig module and presses down to discharge the materials; the other end of the second material transfer mechanism is pressed downwards to continue taking materials and take the materials for waiting; after the test is finished, the second material transfer mechanism takes out the tested chip and rotationally puts the tested chip into a tested area of the peripheral turntable of the test line; continuously testing the strip product; the second material transfer mechanism carries a material waiting end to rotate to the position above the acupuncture point of the test fixture module and presses down for discharging; taking out the tested chip and putting the chip into a tested area of a peripheral turntable of the test line in a rotating mode; continuously testing the strip product; and the laser height measuring instrument performs height measurement and re-judgment on the measured chip of the placed turnover disc.
Preferably, the feeding step comprises the steps that a material tray feeding and discharging module feeds materials through a material tray and transmits the materials to a material discharging position; the first material transfer mechanism takes the materials from the material suction heads in sequence after taking pictures of the chip through the CCD of the first material transfer mechanism; the chips on the first material transfer mechanism are photographed by a CCD arranged below and then sequentially placed on a turnover disc on the turnover disc transfer mechanism;
the material taking test step comprises the steps that a turnover disc transfer mechanism of the test machine takes the whole turnover disc and places the turnover disc to a turnover disc of a feeding and testing line; the code scanner scans each chip to acquire chip information; the test line moves the turnover disc to a to-be-tested area of the test fixture module; the laser height measuring instrument performs height measurement and rechecking on the turnover disc chip; the second material transfer mechanism sequentially takes materials, moves to the positions above the acupuncture points of the test jig module and discharges materials one by one at the acupuncture points of the test jig; after the test is finished, the second material transfer mechanism takes out the tested chip from the acupuncture point of the test fixture and rotationally puts the tested chip into the tested area of the peripheral turntable of the test line; and the laser height measuring instrument performs height measurement and re-judgment on the measured chip of the placed turnover disc.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1a is a schematic diagram of an overall structure of a chip intelligent test sorting line in a preferred embodiment;
FIG. 1b is a schematic diagram of the structure of FIG. 1a with the addition of a testing machine;
FIG. 1c is a schematic structural diagram of an entire chip intelligent test sorting line in a preferred embodiment;
FIG. 2 is a schematic view of the internal structure of a discharger in a preferred embodiment;
FIG. 3 is a schematic diagram of a tester rack in a preferred embodiment;
FIG. 4 is a schematic diagram of a first test fixture module according to an embodiment;
FIG. 5 is a diagram illustrating a second testing module according to an embodiment;
fig. 6 is a partial structural diagram of fig. 2.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement, etc. in a specific posture (as shown in the figure), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, when only the structures and the components related to the solution of the technical problems are described in the present invention, the technical features that are known to be necessary, the components and the connection relation, or can be determined by combining the drawings and the common general knowledge are not described below, but are not equal to the technical features that are not present in the technical solutions, and are not necessarily the reason for insufficient disclosure.
Referring to fig. 1a and 2, the chip intelligent test sorting line includes a discharger 2 and a tester 1. Wherein, the discharging machine 2 comprises an assembly line 21, a first material transfer mechanism 22, a turnover disc transfer mechanism 23 and a plurality of charging tray feeding and discharging modules 25. The testing machine 1 comprises a test wire feeding 11, a return wire 12, a turnover disc transfer mechanism 14, a turnover disc wire changing mechanism 13 and a plurality of test fixture modules 15.
For the discharger 2:
the tray loading and unloading module 25 is used for loading and unloading the chip through the tray. The discharging machine 2 can have a plurality of charging tray feeding and discharging module 25 mounting positions, namely the number of the charging tray feeding and discharging modules 25 can be designed to be a plurality as required, and the working modes of the charging tray feeding and discharging modules 25 can be defined as required, for example, some charging tray feeding and discharging modules 25 are responsible for charging the charging tray of qualified chips, and some charging tray feeding and discharging modules 25 are responsible for charging the discharging of unqualified chip charging trays. So as to realize free switching of the feeding/receiving modes and non-stop material changing. Preferably, there may be more than two tray loading and unloading modules 25 in the same operating mode to improve the loading and unloading efficiency. The turnover disc transfer mechanism 23 is arranged on the assembly line 21 and can move back and forth along with the assembly line 21 so as to reach the material taking range of the first material transfer mechanism 22 or the turnover disc transfer mechanism 14. The line 21 may be an in-track line, a belt line, or the like. The number of the pipelines 21 can be more than 1, such as two, and the transmission efficiency can be improved.
The first material transfer mechanism 22 is used for transferring the turnover disk 3 and the discharge level of the turnover disk transfer mechanism 14 or for transferring the chips between the turnover disk 3 of the turnover disk transfer mechanism 14 and the exchange rack 24 (or the exchange disk 241) of the discharger 2. Preferably, the first material transfer mechanism 22 is provided with a plurality of suction heads, such as 8 suction heads, and is further provided with a CCD camera to identify and judge whether chips exist at the corresponding positions of the turnover plate 3 and the material tray, the positions of the chips, and the like before material taking. Similarly, the first material transfer mechanism 22 itself or nearby may be further provided with a lower CCD camera, so as to realize that the material is taken, then the material is moved to the lower CCD camera to identify and judge the chip taken, and then the chip taken is transferred to the corresponding transfer tray 3 or material tray.
The turnaround disk transfer mechanism 23 is reciprocally movable with the flow line 21 to traverse between the material taking range of the first material transfer mechanism 22 and the material taking range of the turnaround disk transfer mechanism 14. Preferably, since the material taking direction of the first material transfer mechanism 22 is different from the material taking direction of the first material transfer mechanism 22, for example, the material taking direction of the first material transfer mechanism 22 is horizontal and vertical to the material taking direction of the first material transfer mechanism 22, that is, 90 °, the turnover disc transfer mechanism 23 is provided with a rotating structure to rotate the turnover disc 3 thereon by ± 90 ° so that the direction of the turnover disc 3 is respectively corresponding to the same material taking direction as the first material transfer mechanism 22 or the turnover disc transfer mechanism 14.
For test machine 1:
the feeding line 11 is used for conveying the turnover table 3 to a corresponding conveying line of a region to be tested (i.e. a region waiting for being taken) of each test fixture module 15.
The return line 12 is a transport line for transporting the transfer plate 3 with the tested chips to the discharger 2.
Preferably, the feed line 11 and the return line 12 are parallel. The feed line 11 and the return line 12 may be track lines, belt lines, or the like. The number of the test lines 11 may be two, that is, two test lines 11 parallel to the reflow line 12 are respectively disposed on two sides of the reflow line 12, and a plurality of test fixture modules 15 are respectively disposed along the outer side of each test line 11.
The testing machine 1 can be provided with a plurality of mounting positions of the test fixture module 15 at the outer side of the test line 11. That is, the number of the test fixture modules 15 can be designed to be plural according to the requirement. Each test fixture module 15 is an independent functional structural unit, and the test fixture module 15 can be integrally separated, detached and replaced relative to the frame of the testing machine 1. Therefore, the number of the test fixture modules 15 can be increased or decreased or the types of the test fixture modules 15 can be replaced according to the test requirements, so as to realize different test types or test capacity requirements.
The turnover disc transfer mechanism 14 is arranged at one end close to the discharging machine 2, in particular at a place where the turnover disc transfer mechanism 23 can take materials from the turnover disc 3 conveniently. The transfer mechanism 14 is used for transferring the entire turntable 3 of the transfer mechanism 23 to the feeding line 11 and transferring the entire turntable 3 with the tested chips mounted on the return line 12 back to the transfer mechanism 23. The turnover disk transfer mechanism 14 is provided with a plurality of suction heads or suction plates capable of sucking the turnover disk 3, and a moving structure. Alternatively or additionally, the transfer mechanism 14 may be located at the end of the discharger 2, but should be adjacent to the testing machine 1.
The transfer plate changer 13 transfers the transfer plate 3 with the chips mounted on the feed line 11 to the return line 12, and conveys the return flow in the direction of the discharger 2. The turnover disk wire-changing mechanism 13 is provided with an action structure for transferring the turnover disk 3 with the tested chip on the feeding and testing wire 11 to the return wire 12, and the action structure comprises but is not limited to a jacking moving structure or an adsorption moving structure.
In a preferred embodiment, referring to fig. 2 and 6, the discharger 2 is further provided with an exchange rack 24, and the exchange rack 24 is provided with a plurality of exchange discs 241. The specific number of the exchanging disks 241 may be set according to practical settings, such as 5. The function of each exchanging plate 241 on the discharger 2 may be defined or configured as required, including but not limited to chip buffering for the to-be-discharged material, buffering of the tested chips from the rotating plate 3 of the rotating plate transfer mechanism 14 for exchanging by the testing machines 1 on the left and right sides of the discharger 2, buffering of the tested chips to be discharged, and the like. Based on the arrangement of the exchange frame 24 and the exchange disc 241, the turnover disc transfer mechanism 14 transfers the turnover disc 3 returned by the return line 12 to the turnover disc transfer mechanism 23, after the turnover disc transfer mechanism 23 returns to the discharger 2 along with the production line 21, the first material transfer mechanism 22 of the discharger 2 comprises the exchange disc 241 which can transfer the tested chips to the exchange frame 24, and then the tested chips are cached through the exchange disc 241 so as to be exchanged by the testing machines 1 on the left side and the right side of the discharger 2 for another test.
Referring to fig. 1a and 4, a second material transferring mechanism 1513 is further disposed on the testing machine 1, and the second material transferring mechanism 1513 is used for transferring the chips on the turnover disk 3 in the region to be tested of the test fixture module 15 to the corresponding acupuncture points of the test fixture module 15, and transferring the chips on the corresponding acupuncture points of the test fixture module 15 to the turnover disk 3. Second material transfer mechanism 1513 is provided with a plurality of suction heads or suction plates capable of sucking chips. The second material transfer mechanism 1513 may be disposed on the test fixture module 15 or on the frame of the testing machine 1. As shown in fig. 4, in order to be disposed on the test fixture module 15, as shown in fig. 1a, the testing machine 1 at the right end of the discharging machine 2 is disposed on the rack of the second material transferring mechanism 1513.
The chip intelligent test sorting line comprises a discharging machine 2 and a testing machine 1, and the specific number of the testing machines 1, the types of the testing jig modules 15 on the testing machine 1 and the like can be set or replaced according to actual conditions. For example, referring to fig. 4, the testing jig module 15 is a first testing jig module 151, the first testing jig module 151 is provided with a second material transfer mechanism 1513, and the testing jig module 15 is provided with a plurality of jigs, each of which is provided with a plurality of acupuncture points distributed in an array manner, such as 16 testing acupuncture points divided into two rows. The second material transfer mechanism 1513 is provided with a material suction plate matched with the number and distribution of the acupuncture points of the jig, and the material suction plate of the second material transfer mechanism 1513 can simultaneously suck chips with the same number as the acupuncture points of the jig so as to transfer between the turnover disc 3 of the feeding and measuring line 11 and the jig. Referring to fig. 5, the second test fixture module 152 is another type of test fixture module, the second test fixture module 152 does not have a second material transfer mechanism 1513, the second material transfer mechanism 1513 is disposed on the frame of the testing machine 1 (e.g., the testing machine 1 at the right end of the discharging machine 2 in fig. 1 a), the second test fixture module 152 is provided with a plurality of fixtures, each fixture is provided with an acupuncture point, the second material transfer mechanism 1513 sucks chips from the turnover plate 3 and places the chips into the acupuncture points of each fixture one by one, or sucks tested chips from each acupuncture point of each fixture one by one to place the chips into the turnover plate 3 of the test feeding line 11. In addition, each acupoint can be provided with a cover opening and closing structure.
The specific number of test machines 1 may be set to 1, 2, or even a combination of a plurality of machines. The method comprises the following steps:
as shown in fig. 1a, there are two testing machines 1, and the types of the testing tool modules of the two testing machines 1 are different, wherein the left side of the discharging machine 2 is a first testing tool module 151 corresponding to a first test; the right side of the discharging machine 2 is provided with a second testing tool module 152 corresponding to the second test. Thus, the chip intelligent test sorting line can simultaneously have two tests, after the transfer disc transfer mechanism 23 returns to the discharging machine 2 along with the production line 21, the first material transfer mechanism 22 of the discharging machine 2 transfers the tested chips to the exchange disc 241 on the exchange frame 24, and the testing machines 1 on the left side and the right side of the discharging machine 2 perform another test after performing material exchange through the exchange disc 241. Preferably, two production lines 21 are arranged on the discharging machine 2, and the turnover disc transfer mechanism 23 is arranged on the left side and the right side of each production line 21.
Referring to fig. 1b, on the basis of the scheme of fig. 1a, the number of the testing machines 1 on each side of the discharging machine 2 can be set to be different according to the time required by testing different chips, so as to improve the testing efficiency. The feeding line 11 and the feeding line 11, and the return line 12 of two or more testing machines 1 on the same side are respectively connected in series, that is, the peripheral turntable 3 on the feeding line 11 of the adjacent testing machine 1 can be conveyed to the feeding line 11 of the other testing machine 1, and the peripheral turntable 3 on the return line 12 of the adjacent testing machine 1 can be conveyed to the return line 12 of the other testing machine 1. Therefore, the testing machine 1 forms a flexible testing line through building block combination, the productivity can be doubled and increased continuously, the testing time can be combined according to different chips, the utilization rate of the machine can be improved, the waiting time is reduced, and the operating efficiency is improved. Because a plurality of test equipment share a chip arranging machine, different tests share a chip arranging machine, on the one hand, the production space can be saved, the requirement on the field is reduced, on the other hand, the detachable modular structure is adopted by the charging and discharging module 25 and the test fixture module 15 on the charging tray, the number and the types of the chip arranging machine and the test fixture module can be quickly adjusted or switched, the test work can be enabled to be in better efficiency, and the adjustment or the switching can be realized only by simply increasing and decreasing the number on the aspect of a matched central control system and selecting a corresponding mode without carrying out brand new integral customization development, the difficulty in laying implementation can be obviously reduced, the laying in different automation workshop fields and the implementation efficiency can be obviously improved.
As shown in fig. 1c, the testing machines 1 on the left and right sides of the discharging machine 2 are of the same testing type, i.e. the testing jig modules 15 of the testing machine 1 are the first testing jig module 151 or the second testing jig module 152. After the test machine 1 on the same side is finished, the test machine flows back to the sheet arranging machine to perform blanking, and the mode is equivalent to that two identical test lines are formed on the left side and the right side of the sheet arranging machine 2 and share one sheet arranging machine.
Referring to fig. 2, 3 and 4, in a preferred embodiment, a laser height measuring instrument or a CCD camera is also provided on the second material transfer mechanism 1513, so as to identify and judge whether there are chips, positions of the chips, appearances of the chips, and the like at positions corresponding to the circumferential turntable 3 and the jig acupuncture points before and after the material taking. The testing machine 1 further comprises a rack, at least one group of code scanners 16 are arranged above the rack, and the code scanners 16 can scan the chips in the peripheral rotating disk 3 on the feeding line 11 and the return line 12 to obtain chip information.
Based on the chip intelligent test sorting, the chip intelligent test sorting method can be formed during working, and in summary, the chip intelligent test sorting method comprises the following steps:
a feeding step, wherein a first material transfer mechanism 22 of a discharging machine 2 transfers the chip to be tested to a turnover disc 3 on a turnover disc transfer mechanism 23;
a turnover disc transferring step, in which a turnover disc transferring mechanism 14 of the testing machine 1 transfers the whole turnover disc 3 on a turnover disc transferring mechanism 23 of the discharging machine 2 to a test conveying line 11 of the testing machine 1 and conveys the whole turnover disc to a to-be-tested area of each testing jig module 15;
a material taking test step, in which a second material transfer mechanism 1513 of the test machine 1 transfers the chips on the turnover disc 3 in the region to be tested of the test fixture module 15 to the acupuncture points corresponding to the test fixture module 15 for testing, and transfers the chips of the acupuncture points corresponding to the test fixture module 15 to the turnover disc 3;
a turnover disk changing/returning step in which a turnover disk changing mechanism 13 of the testing machine 1 transfers the turnover disk 3 with the tested chips mounted on the feeding/testing line 11 to the return line 12 to return the chips in the direction of the discharging machine 2, and the turnover disk transfer mechanism 14 transfers the whole turnover disk 3 returned by the return line 12 to a turnover disk transfer mechanism 23;
and a blanking or material changing step, wherein the first material transfer mechanism 22 of the discharging machine 2 transfers the tested chips on the transferring disc transfer mechanism 23 to a blanking position preset by the discharging machine 2 for blanking, or transfers the tested chips to the exchange disc 241 of the exchange frame 24 of the discharging machine 2 for material changing, and then another test is carried out.
Preferably, the method further comprises a rotating disc direction adjusting step, wherein the rotating disc transferring mechanism 23 rotates the rotating disc 3 by +/-90 degrees so that the direction of the rotating disc 3 is respectively the same as the material taking direction of the first material transferring mechanism 22 or the rotating disc transferring mechanism 14.
Specifically, as shown in fig. 1a, two testing machines 1 are respectively disposed on two sides of the discharging machine 2, the testing jig module 15 of the testing machine 1 on the left side is the first testing jig module 151, and the testing jig module 15 of the testing machine 1 on the right side is the second testing jig module 152.
The specific flow of the test and sorting of the left testing machine 1 is as follows:
the material tray feeding and discharging module 25 feeds materials through a material tray and transmits the materials to a material discharging position;
the first material transfer mechanism 22 takes the materials from the material suction heads in sequence after taking the pictures of the chips through the CCD of the first material transfer mechanism;
the chips on the first material transfer mechanism 22 are photographed by a CCD arranged below and then sequentially placed on the turnover disc 3 on the turnover disc transfer mechanism 23;
the turnover disc transferring mechanism 23 rotates by 90 degrees and moves to the turnover disc transferring mechanism 14 of the testing machine 1 along with the production line 21;
the turnover disc transfer mechanism 14 of the testing machine 1 takes the whole turnover disc 3 and places the whole turnover disc 3 to the turnover disc 3 of the feeding and testing line 11;
the code scanner 16 scans each chip to acquire chip information;
the test line 11 moves the turnover disc 3 to a region to be tested of the test fixture module 15;
the laser height measuring instrument performs height measurement and rechecking on the turnover disc 3 chip;
the second material transfer mechanism 1513 presses down to take the material, rotates to the position above the acupuncture point of the test fixture module 15 and presses down to discharge the material;
the other end of the second material transfer mechanism 1513 is pressed downwards to continue taking materials and take materials to wait;
after the test is finished, the second material transfer mechanism 1513 takes out the tested chip and rotates to put the tested chip into the tested area of the turnover disc 3 of the test line 11; continuously testing the strip product;
the second material transfer mechanism 1513 rotates the material carrying waiting end to the position above the acupuncture point of the test fixture module 15 and presses down for discharging;
taking out the tested chip and putting the chip into the tested area of the turnover disc 3 of the test feeding line 11 in a rotating mode; continuously testing the strip product;
the laser height measuring instrument carries out height measurement and re-judgment on the tested chips of the placed turnover disc 3;
the turnover disc wire changing mechanism 13 transfers the turnover disc 3 provided with the tested chip on the wire feeding and measuring line 11 to the return wire 12 and moves to the turnover disc transferring mechanism 14 along with the return wire 12;
the turnover disc transfer mechanism 14 integrally transfers the turnover disc 3 to the turnover disc transfer mechanism 23 of the discharging machine 2;
the turnover disc transferring mechanism 23 rotates the turnover disc 3 by 90 degrees and moves the turnover disc to a discharging area of the discharging machine 2 through the production line 21;
the first material transfer mechanism 22 takes the materials from the material suction heads in sequence after the tested chips of the material placing area turnover disc 3 are photographed through the CCD;
the first material transfer mechanism 22 transfers the tested chips to the exchanging tray 241 of the exchanging rack 24 of the discharger 2 according to the test result to perform another test after exchanging.
The specific flow of the test and sorting of the testing machine 1 on the right side is as follows:
the material tray feeding and discharging module 25 feeds materials through a material tray and transmits the materials to a material discharging position;
the first material transfer mechanism 22 takes the materials from the material suction heads in sequence after taking the pictures of the chips through the CCD of the first material transfer mechanism;
the chips on the first material transfer mechanism 22 are photographed by a CCD arranged below and then sequentially placed on the turnover disc 3 on the turnover disc transfer mechanism 23;
the turnover disc transferring mechanism 23 rotates by 90 degrees and moves to the turnover disc transferring mechanism 14 of the testing machine 1 along with the production line 21;
the turnover disc transfer mechanism 14 of the testing machine 1 takes the whole turnover disc 3 and places the whole turnover disc 3 to the turnover disc 3 of the feeding and testing line 11;
the code scanner 16 scans each chip to acquire chip information;
the test line 11 moves the turnover disc 3 to a region to be tested of the test fixture module 15;
the laser height measuring instrument performs height measurement and rechecking on the turnover disc 3 chip;
the second material transfer mechanism 1513 sequentially takes the materials, moves to the positions above the acupuncture points of the test fixture module 15 and discharges the materials one by one at the acupuncture points of the test fixture;
after the test is finished, the second material transfer mechanism 1513 takes out the tested chip from the acupuncture point of the test fixture and puts the tested chip into the tested area of the turnover disc 3 of the test wire 11 in a rotating manner;
the laser height measuring instrument carries out height measurement and re-judgment on the tested chips of the placed turnover disc 3;
the turnover disc wire changing mechanism 13 transfers the turnover disc 3 provided with the tested chip on the wire feeding and measuring line 11 to the return wire 12 and moves to the turnover disc transferring mechanism 14 along with the return wire 12;
the turnover disc transfer mechanism 14 integrally transfers the turnover disc 3 to the turnover disc transfer mechanism 23 of the discharging machine 2;
the turnover disc transferring mechanism 23 rotates the turnover disc 3 by 90 degrees and moves the turnover disc to a discharging area of the discharging machine 2 through the production line 21;
the first material transfer mechanism 22 takes the materials from the material suction heads in sequence after the tested chips of the material placing area turnover disc 3 are photographed through the CCD;
the first material transfer mechanism 22 transfers the tested chips to the exchanging tray 241 of the exchanging rack 24 of the discharger 2 according to the test result to perform another test after exchanging.
Finally, it is worth mentioning that although the subject of the invention is the intelligent test sorting line and method for chips, the invention is not limited to the test sorting of chips, and is also applicable to the test sorting of other electronic materials. The overall structure, the action flow and the like of the discharging machine and the testing machine do not need to be changed, and the intelligent testing sorting line can be realized only by replacing the material disc, the turnover disc and the jig with the acupuncture points matched with the materials, so that the universality of the intelligent testing sorting line is further improved.
Claims (19)
1. The intelligent chip testing and sorting line is characterized by comprising a discharging machine and at least one testing machine, wherein the discharging machine comprises a production line, a first material transfer mechanism, a turnover disc transfer mechanism and a plurality of charging and discharging tray modules; the turnover disc transferring mechanism of the testing machine integrally transfers the turnover disc of the turnover disc transferring mechanism to the test line to be conveyed to a region to be tested of each test fixture module; the turnover disc wire changing mechanism transfers the turnover disc provided with the tested chip on the feeding and testing wire to the return wire to return.
2. The intelligent chip testing and sorting line according to claim 1, further comprising a turnover plate transfer mechanism capable of transferring the turnover plate returned by the return line to the turnover plate transfer mechanism, wherein the turnover plate transfer mechanism returns to the discharging machine along with the production line, and the turnover plate transfer mechanism is transferred to the charging plate of the charging and discharging module or the discharging position preset by the discharging machine through the first material transfer mechanism of the discharging machine for discharging.
3. The intelligent chip test sorting line according to claim 1, wherein the discharging machine further comprises an exchange rack, the exchange rack is provided with a plurality of exchange disks, the turnover disk transfer mechanism is further capable of transferring the turnover disks returned by the return lines to the turnover disk transfer mechanism, the turnover disk transfer mechanism returns to the discharging machine along the production line, and then the first material transfer mechanism of the discharging machine is transferred to the exchange disks on the exchange rack.
4. The intelligent chip testing and sorting line according to claim 2 or 3, wherein the testing machine or the testing jig module of the testing machine further comprises a second material transferring mechanism, the second material transferring mechanism transfers the chips on the transferring plate in the region to be tested of the testing jig module to the acupuncture points corresponding to the testing jig module, and transfers the chips on the acupuncture points corresponding to the testing jig module to the transferring plate.
5. The intelligent chip testing and sorting line according to claim 4, comprising more than two testing machines, wherein at least one testing machine is disposed at each end of the production line of the discharging machine, and at least one transferring mechanism are disposed between the discharging machine and the adjacent testing machines.
6. The intelligent chip testing and sorting line according to claim 5, wherein the discharging machine has more than two flow lines, and each flow line has one turnover disc transfer mechanism on each of the left and right sides.
7. The intelligent chip test sorting line according to claim 5, wherein at least one end of the production line of the discharging machine is provided with more than two testing machines, and the test feeding line, and the return line of the more than two testing machines on the same side are respectively connected in series.
8. The intelligent test sorting line for chips as claimed in claim 5, wherein the testing machine is provided with two test lines parallel to the reflow line on both sides of the reflow line, and a plurality of test fixture modules are respectively provided along the outer side of each test line.
9. The intelligent chip testing and sorting line according to claim 8, wherein the testing jig modules include a first testing jig module, the first testing jig module is provided with the second material transferring mechanism, each jig of the first testing jig module is provided with a plurality of acupuncture points distributed in an array manner, the second material transferring mechanism is provided with a material sucking plate matched with the number and distribution of the acupuncture points of the jig, and the material sucking plate of the second material transferring mechanism can simultaneously suck chips with the same number as the acupuncture points of the jig so as to transfer between the peripheral disc of the testing line and the jig.
10. The intelligent chip test sorting line according to claim 9, wherein the test fixture modules further comprise a second test fixture module, the second test fixture module is provided with a plurality of fixtures, each fixture is provided with an acupoint, the second material transfer mechanism sucks chips from the turnover disc and places the chips into the acupoints of each fixture one by one, or sucks tested chips from the acupoints of each fixture one by one to place the turnover disc of the test line.
11. The intelligent chip test sorting line according to claim 2 or 3, wherein the testing machine further comprises a rack, at least one set of code scanners is arranged above the rack, and the code scanners can scan the codes of the chips in the turnover disks on the feeding line and the return line to obtain chip information.
12. The intelligent chip testing and sorting line according to claim 2 or 3, wherein the first material transfer mechanism and the second material transfer mechanism are provided with CCD cameras or laser height measuring instruments for detecting and judging whether chips exist in the points of the material tray, the week rotary table or the test fixture module, and/or position parameters of the chips, and/or appearances of the chips.
13. The intelligent chip testing and sorting line according to claim 2 or 3, wherein the first material transfer mechanism is provided with a plurality of material suction heads, and the material suction heads of the first material transfer mechanism can sequentially suck chips from the material discs of the material disc feeding and discharging module or the material disc turnover disc transfer mechanism.
14. The intelligent chip test sorting line according to claim 2 or 3, wherein the turnover disc transfer mechanism is provided with a turnover disc horizontal rotation structure, the material taking directions of the first material transfer mechanism and the turnover disc transfer mechanism are horizontally vertical, and the turnover disc horizontal rotation structure can rotate the turnover disc by +/-90 degrees so that the turnover disc direction is the same as the material taking direction of the first material transfer mechanism or the turnover disc transfer mechanism respectively.
15. The intelligent chip testing and sorting line according to claim 10, wherein after the turnover disc transfer mechanism returns to the discharging machine along the production line, the first material transfer mechanism of the discharging machine transfers the tested chips to the exchange disc on the exchange rack, and the exchange disc allows the testing machines on the left and right sides of the discharging machine to exchange materials for another test.
16. An intelligent chip testing and sorting method is characterized by comprising the following steps:
a feeding step, wherein a first material transfer mechanism of a discharging machine transfers the chip to be tested to a turnover disc on a turnover disc transfer mechanism;
a turnover disc transferring step, in which a turnover disc transferring mechanism of the testing machine integrally transfers the turnover disc on the turnover disc transferring mechanism of the discharging machine to a test sending line of the testing machine and conveys the turnover disc to a to-be-tested area of each testing jig module;
a material taking and testing step, wherein a second material transfer mechanism of the testing machine transfers the chips on the turnover disc in the area to be tested of the test jig module to the acupuncture points corresponding to the test jig module for testing, and transfers the chips of the acupuncture points corresponding to the test jig module to the turnover disc;
a turnover disc wire changing and refluxing step, wherein a turnover disc wire changing mechanism of the testing machine transfers a turnover disc provided with tested chips on a feeding and testing wire to the reflow wire to reflux in the direction of the discharging machine, and the turnover disc transferring mechanism transfers the turnover disc returned by the reflow wire to a turnover disc transferring mechanism in a whole;
and a blanking or material changing step, namely, a first material transfer mechanism of the discharging machine transfers the tested chips on the transferring disc transfer mechanism to a blanking position or a blanking bin preset by the discharging machine for blanking, or transfers the chips to an exchange disc of an exchange frame of the discharging machine for material changing to perform another test.
17. The method for intelligently testing and sorting chips as claimed in claim 16, further comprising a step of adjusting the direction of the rotating disk, wherein the rotating disk transferring mechanism rotates the rotating disk by ± 90 ° so that the direction of the rotating disk is the same as the material taking direction of the first material transferring mechanism or the rotating disk transferring mechanism, respectively.
18. The intelligent test and sorting method for the chips as claimed in claim 17, wherein the feeding step comprises feeding the material by a material tray feeding and discharging module and transferring the material to a material discharging position; the first material transfer mechanism takes the materials from the material suction heads in sequence after taking pictures of the chip through the CCD of the first material transfer mechanism; the chips on the first material transfer mechanism are photographed by a CCD arranged below and then sequentially placed on a turnover disc on the turnover disc transfer mechanism;
the material taking test step comprises the steps that a turnover disc transfer mechanism of a test machine takes the whole turnover disc and places the turnover disc to a turnover disc of a feeding and testing line; the code scanner scans each chip to acquire chip information; the test line moves the turnover disc to a to-be-tested area of the test fixture module; the laser height measuring instrument performs height measurement and rechecking on the turnover disc chip; the second material transfer mechanism presses down to take materials, then rotates to the position above the acupuncture points of the test jig module and presses down to discharge the materials; the other end of the second material transfer mechanism is pressed downwards to continue taking materials and take the materials for waiting; after the test is finished, the second material transfer mechanism takes out the tested chip and rotationally puts the tested chip into a tested area of the peripheral turntable of the test line; continuously testing the strip product; the second material transfer mechanism carries a material waiting end to rotate to the position above the acupuncture point of the test fixture module and presses down for discharging; taking out the tested chip and putting the chip into a tested area of a peripheral turntable of the test line in a rotating mode; continuously testing the strip product; and the laser height measuring instrument performs height measurement and re-judgment on the measured chip of the placed turnover disc.
19. The intelligent test and sorting method for the chips as claimed in claim 17, wherein the feeding step comprises feeding the chips through a tray by a tray feeding and discharging module and transferring the chips to a discharging position; the first material transfer mechanism takes the materials from the material suction heads in sequence after taking pictures of the chip through the CCD of the first material transfer mechanism; the chips on the first material transfer mechanism are photographed by a CCD arranged below and then sequentially placed on a turnover disc on the turnover disc transfer mechanism;
the material taking test step comprises the steps that a turnover disc transfer mechanism of the test machine takes the whole turnover disc and places the turnover disc to a turnover disc of a feeding and testing line; the code scanner scans each chip to acquire chip information; the test line moves the turnover disc to a to-be-tested area of the test fixture module; the laser height measuring instrument performs height measurement and rechecking on the turnover disc chip; the second material transfer mechanism sequentially takes materials, moves to the positions above the acupuncture points of the test jig module and discharges materials one by one at the acupuncture points of the test jig; after the test is finished, the second material transfer mechanism takes out the tested chip from the acupuncture point of the test fixture and rotationally puts the tested chip into the tested area of the peripheral turntable of the test line; and the laser height measuring instrument performs height measurement and re-judgment on the measured chip of the placed turnover disc.
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