CN111687078A

CN111687078A - Semiconductor test sorting machine

Info

Publication number: CN111687078A
Application number: CN202010707664.7A
Authority: CN
Inventors: 黄爱科; 金承标; 马中丽; 周磊; 李粹武
Original assignee: Shenzhen City Biaowang Industrial Equipment Co ltd
Current assignee: Shenzhen City Biaowang Industrial Equipment Co ltd
Priority date: 2020-07-21
Filing date: 2020-07-21
Publication date: 2020-09-22

Abstract

The invention discloses a semiconductor test sorting machine which comprises a first workbench, a second workbench, a feeding mechanism, a discharging mechanism, a circulating transfer mechanism and a testing mechanism, wherein the feeding mechanism is arranged on the first workbench; the feeding mechanism and the discharging mechanism are respectively arranged on two sides of the first workbench, and the testing mechanism is arranged on the second workbench; the circulating transfer mechanism comprises a circulating transfer conveying line and a plurality of peripheral turntables arranged on the circulating transfer conveying line, one end of the circulating transfer conveying line is in butt joint with the first workbench, the other end of the circulating transfer conveying line is in butt joint with the second workbench, and the circulating transfer conveying line is used for driving the peripheral turntables on the circulating transfer conveying line to circularly move between the first workbench and the second workbench in a progressive moving mode; the semiconductor testing separator with the structure realizes full-automatic operation of chip testing work through multi-station setting of feeding, circular conveying, testing, discharging separation and the like, effectively improves testing efficiency and is convenient to use.

Description

Semiconductor test sorting machine

Technical Field

The invention relates to the technical field of chip testing equipment, in particular to a full-automatic semiconductor testing sorting machine.

Background

Chips, i.e., large scale integrated circuits, are used in various circuit configurations to simplify the circuit scale. As a precision electronic device, after a chip is processed, the chip can be formally off-line and enter the market only through strict testing procedures. Although various automatic test equipment is used for testing the performance of chips, most of the existing test equipment focuses on the application of a terminal test machine, in fact, the attention on a series of intermediate processes of feeding and discharging is little, so that workers are required to carry a material tray to the terminal test machine, and the material tray which is tested is moved away after the test is finished, so that the whole test process needs to be attended to and matched with the work of the terminal test machine, therefore, the existing chip test equipment can only be regarded as semi-automatic equipment, and the innovation of a matching mechanism among multiple stations of transferring from feeding to testing and discharging to the chip test process is insufficient, and the efficiency of the chip test work is seriously influenced.

Disclosure of Invention

The invention aims to solve the technical problem and provide a semiconductor test sorting machine, which effectively connects working mechanisms among a plurality of stations for classified storage from feeding to discharging in the chip test process so as to realize the full-automatic operation of chip test analysis work.

In order to achieve the purpose, the invention discloses a semiconductor testing and sorting machine which comprises a first workbench, a second workbench, a feeding mechanism, a discharging mechanism, a circulating transfer mechanism and a testing mechanism, wherein the first workbench is connected with the second workbench through a first connecting rod;

the feeding mechanism and the discharging mechanism are respectively arranged on two sides of the first workbench, and the testing mechanism is arranged on the second workbench;

the circulating transfer mechanism comprises a circulating transfer conveying line and a plurality of peripheral turntables arranged on the circulating transfer conveying line, one end of the circulating transfer conveying line is in butt joint with the first workbench, the other end of the circulating transfer conveying line is in butt joint with the second workbench, and the circulating transfer conveying line is used for driving the peripheral turntables on the circulating transfer conveying line to circularly move between the first workbench and the second workbench in a progressive moving mode;

the feeding mechanism is used for transferring the chips to be tested to the week turntable, and the discharging mechanism is used for transferring the chips after the test is finished to different material trays from the week turntable according to the test result; the testing mechanism is used for testing the chips conveyed by the circulating transfer mechanism

Compared with the prior art, the semiconductor test sorting machine is provided with a feeding mechanism, a discharging mechanism and a circulating transfer mechanism which are matched with a testing mechanism, wherein the feeding mechanism, the discharging mechanism and the testing mechanism are respectively arranged on a first workbench and a second workbench which are separated from each other and are connected through the circulating transfer mechanism, when the testing work is carried out, a chip to be tested is moved on the first workbench through the feeding mechanism and is placed in a peripheral turntable on a circulating transfer conveying line, then the peripheral turntable is conveyed to the testing mechanism on the second workbench through the circulating transfer conveying line in a progressive moving mode, after the testing is finished, the testing mechanism automatically transfers the tested chip to the peripheral turntable on the circulating transfer conveying line, then the peripheral turntable is conveyed to the discharging mechanism at the first workbench through the circulating transfer conveying line, the tested chip in the peripheral turntable is placed into different material discs through the discharging mechanism according to the testing result, so as to complete the blanking and sorting work of the chips; therefore, the semiconductor testing separator with the structure realizes full-automatic operation of chip testing work through multi-station setting of feeding, circular conveying, testing, discharging separation and the like, effectively improves testing efficiency and is convenient to use.

Preferably, the feeding mechanism comprises a plurality of first positioning grooves and a feeding manipulator which are arranged on the first workbench and located on one side of the circulating transfer conveying line, and the discharging mechanism comprises a plurality of second positioning grooves and a discharging manipulator which are arranged on the first workbench and located on the other side of the circulating transfer conveying line;

the first positioning groove is used for placing a material tray filled with chips to be tested, and the feeding manipulator is used for moving the chips in the material tray positioned in the first positioning groove into a turnover disc positioned on the circulating transfer conveying line and moving the chips to the second workbench; the second constant head tank is used for placing empty trays, the unloading manipulator is used for moving chips in the turnover table returned by the second workbench on the circulating transfer conveying line to the empty trays in the second constant head tank.

Preferably, the testing mechanism includes at least one testing machine and a testing manipulator, and the testing manipulator is used for transferring the chip to be tested in the turnover table to the testing machine and transferring the chip which is tested in the testing machine to the turnover table.

Preferably, the feeding mechanism further comprises a plurality of feeding bins, a feeding turnover manipulator and a plurality of feeding lifting platforms which are arranged below the first workbench and are respectively right opposite to each first positioning groove, and the discharging mechanism further comprises a plurality of discharging bins, a discharging turnover manipulator and a plurality of discharging lifting platforms which are arranged below the first workbench and are respectively right opposite to each second positioning groove; the feeding and discharging bins are used for accommodating a plurality of charging trays in a stacking mode, the feeding turnover manipulator is used for transferring the charging tray in any one feeding bin to the feeding lifting platform, and the discharging turnover manipulator is used for transferring the charging tray on the discharging lifting platform to any one discharging bin; the feeding lifting platform is used for lifting the material tray into the first positioning groove in an up-and-down moving mode, and the discharging lifting platform is used for transferring the material tray in the second positioning groove to the position below the second positioning groove in an up-and-down moving mode so as to be grabbed by the discharging turnover manipulator.

Preferably, the upper bin and the lower bin both comprise a base station, a base and a plurality of stop rods, the stop rods are vertically arranged at different positions on the base station, and an accommodating space for accommodating a material tray is positioned between the stop rods; the base platform is connected with the base in a sliding mode through a drawing structure, so that the base platform can enter and exit below the first workbench.

Preferably, material loading turnover manipulator with unloading turnover manipulator all include one with the base plate of charging tray looks adaptation, four edges of base plate are provided with a pivot axis respectively, be provided with at least one hook portion in the pivot axis, hook portion is used for the hook the border department of charging tray, still be provided with on the base plate with the link drive mechanism of pivot axis connection, link drive mechanism is used for driving four the synchronous rotation of pivot axis is with hook or release the charging tray.

Preferably, the circulating transfer conveying line comprises a feeding line, a returning line, a front turnover mechanism and a rear turnover mechanism which are arranged in parallel; the feeding line is used for transferring the turnover disc from the first workbench to the second workbench, and the returning line is used for transferring the turnover disc from the second workbench to the first workbench; the front turnover mechanism is arranged at one end of the feeding line and the returning line close to the first workbench, and the rear turnover mechanism is arranged at one end of the feeding line and the returning line close to the second workbench; the front turnover mechanism comprises a first turnover platform butted with the material feeding line and the material returning line, a side pushing mechanism and a front pushing mechanism are arranged on the first turnover platform, the side pushing mechanism is used for pushing a turnover disc to a position corresponding to the material feeding line from a position corresponding to the material returning line on the first turnover platform, and the front pushing mechanism is used for pushing the turnover disc to the material feeding line from the first turnover platform; the rear revolving mechanism comprises a lifting table, a revolving table, a translation mechanism and a second revolving platform, the lifting table is mounted on the translation mechanism, the revolving table is mounted on the lifting table, the second revolving platform is connected with the revolving table, the translation mechanism is used for driving the lifting table to move between the feeding line and the returning line so as to enable the first revolving platform to be in butt joint with the feeding line or the returning line, the revolving table is used for driving the second revolving platform to rotate in a horizontal plane, and the lifting table is used for driving the second revolving platform to move up and down.

Preferably, the material feeding line and the material returning line each include a guide rail set and a pushing mechanism installed below the guide rail set, the guide rail set extends from the first workbench to the second workbench, and the peripheral turntable can slide back and forth on the guide rail set; the propelling mechanism comprises a push rod, a slide rail, a rotary driver and a displacement driver; a plurality of supporting rods extending towards the same direction are arranged on the push rod at intervals, and the distance between the two supporting rods is equal to the length of the peripheral turntable; the push rod with slide rail sliding connection, the displacement driver is used for driving the push rod along slide rail front and back slip, the rotary actuator is used for driving the push rod to be in on the slide rail use the long axis of push rod is the rotary motion of rotation axis, so that branch stretches out or breaks away from in between two week carousel.

Preferably, a section of pretreatment tank is arranged on the feeding line and used for heating or freezing the chips in the turnover disc passing through the feeding line.

Preferably, the test board includes a supporting bench, be provided with the chamber that holds that is used for holding the chip that awaits measuring on the supporting bench, the top that holds the chamber is provided with an apron, the apron can hold chamber top horizontal slip to open or be closed hold the chamber, be provided with the heat block on the diapire of apron, be provided with the drive on the diapire of apron the lift driver that the heat block reciprocated, the heat block is used for with the test temperature of setting for and the chip butt that awaits measuring.

Drawings

Fig. 1 is a schematic plan view of a semiconductor test handler according to an embodiment of the present invention.

Fig. 2 is a schematic perspective view of a station chip testing sorter according to an embodiment of the present invention.

Fig. 3 is a schematic perspective view of a station chip testing handler according to an embodiment of the present invention, in which a robot is removed.

Fig. 4 is a schematic view of a feeding and discharging turnover mechanism in the embodiment of the invention.

Fig. 5 is a schematic perspective view of an upper bin and a lower bin in the embodiment of the invention.

Fig. 6 is a schematic perspective view of a feeding turnover manipulator and a discharging turnover manipulator in the embodiment of the invention.

Fig. 7 is a perspective view of the rotating shaft in fig. 6.

Fig. 8 is a schematic view of the installation structure of the circulating transfer conveying line in the embodiment of the invention.

Fig. 9 is a schematic perspective view of the front revolving mechanism mounted in fig. 8.

Fig. 10 is a perspective view of the rear transfer mechanism installed in fig. 8.

Fig. 11 is a perspective view of the pushing mechanism installed in the feeding line of fig. 8.

Fig. 12 is a perspective view of the propulsion mechanism installed in the loop back line of fig. 8.

FIG. 13 is a schematic view of the installation structure of the suction head in the embodiment of the present invention.

Fig. 14 is a schematic perspective view of a testing machine according to an embodiment of the invention.

Fig. 15 is an exploded view of fig. 14.

Detailed Description

In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.

The invention discloses a semiconductor test sorting machine which is used for testing manufactured chips. As shown in fig. 1 to 3, the semiconductor test handler in the present embodiment includes a first table 1, a second table 2, a feeding mechanism 10, a discharging mechanism 11, a circulating transport mechanism 3, and a testing mechanism 20.

The first workbench 1 is located at a front end station, the second workbench 2 is located at a rear end station, the feeding mechanism 10 and the discharging mechanism 11 are respectively arranged on two sides of the first workbench 1, and the testing mechanism 20 is arranged on the second workbench 2. The circulating transfer mechanism 3 comprises a circulating transfer conveying line 30 and a plurality of week rotary tables 31 arranged on the circulating transfer conveying line 30, one end of the circulating transfer conveying line 30 is in butt joint with the first workbench 1, the other end of the circulating transfer conveying line is in butt joint with the second workbench 2, the circulating transfer conveying line 30 is used for driving the week rotary tables 31 on the circulating transfer conveying line to move circularly between the first workbench 1 and the second workbench 2 in a progressive moving mode, so that a chip to be tested is conveyed to the testing mechanism 20 through the feeding mechanism 10, and the chip which is tested is conveyed to the blanking mechanism 11 through the testing mechanism 20. Feed mechanism 10 is arranged in transferring the chip that awaits measuring to turnover dish 31, and unloading mechanism 11 is arranged in moving the chip after the test is accomplished to different charging trays 4 from turnover dish 31 according to the test result, and in this embodiment, feed mechanism 10 and unloading mechanism 11 are located the relative both sides of circulation transportation transfer conveyor line 30 respectively to make things convenient for material loading and unloading, test mechanism 20 is used for testing the chip that circulation transfer mechanism 3 carried. Therefore, the semiconductor testing separator with the structure realizes full-automatic operation of chip testing work through multi-station setting of feeding, circular conveying, testing, discharging separation and the like, effectively improves testing efficiency and is convenient to use.

As shown in fig. 2 and 3, the feeding mechanism 10 includes a plurality of first positioning grooves 100 and a feeding manipulator 101 which are disposed on the first work table 1 and located on one side of the circulating transfer line 30, and the discharging mechanism 11 includes a plurality of second positioning grooves 110 and a discharging manipulator 111 which are disposed on the first work table 1 and located on the other side of the circulating transfer line 30.

The first positioning groove 100 is used for placing a tray 4 containing chips to be tested, and the feeding manipulator 101 is used for moving the chips in the tray 4 in the first positioning groove 100 to a turnover disc 31 which is positioned on the circulating transfer conveying line 30 and moves to the second workbench 2. The second positioning groove 110 is used for placing the empty tray 4, and the blanking manipulator 111 is used for moving the chips in the turnover tray 31 returned from the second workbench 2 on the circulating transfer conveying line 30 into the empty tray 4 in the second positioning groove 110. In operation, the feeding manipulator 101 takes the material from the material tray 4 in the two first positioning grooves 100 adjacent to the circulating transfer line 30, and the discharging manipulator 111 temporarily and completely transfers the chips in the turnover disc 31 to the material tray 4 in the two second positioning grooves 110 adjacent to the circulating transfer line 30, so for convenience of description, the two first positioning grooves 100 adjacent to the circulating transfer line 30 are defined as the material loading position, and the two second positioning grooves 110 adjacent to the circulating transfer line 30 are defined as the material discharging position.

As shown in fig. 2 and 13, the feeding robot 101 and the discharging robot 111 in the above embodiments have the same mechanical structure, and each of them sucks a chip by arranging a row of a plurality of suckers 5, and the feeding robot 101 and the discharging robot 111 share a gantry assumed to be above the first table 1. It should be noted that, because the distances between the tray 4 and the cavities in the turnover plate 31 (one chip is placed in each cavity) are different, the feeding manipulator 101 and the discharging manipulator 111 are both provided with a variable pitch structure for changing the distance between the suction heads 5 on the feeding manipulator 101 and the discharging manipulator 111, for example, when the feeding manipulator 101 is to suck chips from the tray 4, the distance between the suction heads 5 is changed to correspond to the distance between the cavities in the tray 4 by the variable pitch structure, and when the feeding manipulator 101 is to suck chips from the turnover plate 31, the distance between the suction heads 5 is changed to correspond to the distance between the cavities in the turnover plate 31 by the variable pitch structure. The specific composition of the pitch structure is common knowledge in the art and will not be described herein.

In this embodiment, two (not limited to the number of times) first positioning grooves 100 are provided, ten (not limited to the number of times) second positioning grooves 110 are provided, before the test work starts, trays 4 filled with chips to be tested are placed in each of the two first positioning grooves 100, empty trays 4 are placed in each of the ten second positioning grooves 110, two of the ten second positioning grooves 110 can be used for a blanking level, and the rest are used for a sorting level, and can be divided into a first-level chip level, a second-level chip level, a third-level chip level … … and the like according to the test result, and an NG level can be provided, when the turnover tray 31 is conveyed to the second working table 2 by the circulating transfer conveyor line 30, all chips are quickly placed in the empty trays 4 in the blanking level in sequence by the blanking manipulator 111, and after the turnover tray 31 is removed, the chips with different test performances are placed in the empty trays 4 in different positions according to the test result in sequence by the blanking manipulator 111, is convenient for classified storage. In addition, as shown in fig. 3, because the distances between the cavities in the tray 4 and the turnover disc 31 are different, in order to facilitate the fast blanking of the blanking manipulator 111 and to match the fast operation of the testing mechanism 20, an intermediate rotating disc 6 can be arranged on the second workbench 2 near the blanking position, the distance between the cavities in the intermediate rotating disc 6 is the same as that of the turnover disc 31, the blanking manipulator 111 can quickly place the chips of the turnover disc 31 into the intermediate rotating disc 6, the distance change is not required in each transferring process, and after the blanking of the turnover disc 31 is finished, the blanking manipulator 111 places the different chips in the empty trays 4 at different positions in a classified manner from the intermediate rotating disc 6.

Preferably, as shown in fig. 2, the testing mechanism 20 includes at least one testing machine 200 and a testing manipulator 201, and the testing manipulator 201 is used for transferring the chips to be tested in the turnover disk 31 to the testing machine 200 and transferring the tested chips in the testing machine 200 to the turnover disk 31. In this embodiment, six sets of test tools 200 are placed on two sides of the circulating conveyor 30, and the six sets of test tools 200 can work simultaneously to improve the test efficiency.

Further, referring to fig. 3 and 4, the feeding mechanism 10 further includes a plurality of feeding bins 102 disposed below the first working platform 1, a feeding turnover manipulator 103, and a plurality of feeding lifting platforms 104 respectively opposite to each first positioning slot 100. The discharging mechanism 11 further includes a plurality of discharging bins 112 disposed below the first working platform 1, a discharging turnover manipulator 113, and a plurality of discharging lifting platforms 114 respectively opposite to each second positioning groove 110. In this embodiment, the upper bin 102 is located on the same side of the first workbench 1 as the first positioning groove 100, the lower bin 112 is located on the same side of the first workbench 1 as the second positioning groove 110, and both the upper bin 102 and the lower bin 112 are used for accommodating a plurality of trays 4 in a stacking manner. The loading turnover manipulator 103 is used for transferring the material tray 4 in any loading bin 102 to the loading lifting platform 104, and the unloading turnover manipulator 113 is used for transferring the material tray 4 on the unloading lifting platform 114 to any unloading bin 112. The feeding lifting platform 104 is used for lifting the tray 4 into the first positioning groove 100 in an up-and-down moving manner, and the discharging lifting platform 114 is used for transferring the tray 4 in the second positioning groove 110 to the lower side of the second positioning groove 110 in an up-and-down moving manner so as to be grabbed by the discharging turnover manipulator 113.

In the above embodiment, two loading lifting platforms 104 are provided, and are respectively disposed under the first positioning grooves 100 corresponding to two loading levels, the loading turnover manipulator 103 moves the trays 4 in each loading bin 102 below the loading lifting platform 104 onto the loading lifting platform 104 through up-down and left-right translation movements, and then lifts the trays 4 to the loading level through the loading lifting platform 104 for the loading manipulator 101 to grab, so that batches of trays 4 filled with chips can be placed in each loading bin 102, and batch automated testing is realized. In addition, the blanking lifting platform 114 is arranged below each second positioning groove 110 except the blanking position, when the charging tray 4 is loaded with chips, the charging tray 4 is moved to the lower part of the second workbench 2 through the blanking lifting platform 114, and then the charging tray 4 is transferred to each blanking bin 112 through the blanking turnover manipulator 113, so that batch blanking is realized.

As shown in fig. 5, each of the upper bin 102 and the lower bin 112 includes a base 120, a base 121, and a plurality of blocking rods 122, the blocking rods 122 are vertically disposed at different positions on the base 120, and an accommodating space 123 for accommodating the tray 4 is located between the blocking rods 122. The base table 120 is slidably connected to the base 121 through a drawing structure (drawer type), so that the base table 120 can enter and exit below the first working table 1, thereby facilitating loading. In addition, in order to fix the base 120 conveniently, a limit hole 124 is formed on the base 121 engaged with the base 120, a limit post (not shown) and a rotation handle 125 connected with the limit post are formed on the base 120, and the limit post is rotated by rotating the rotation handle 125, so that the limit post is locked or unlocked with the limit hole 124.

As shown in fig. 6, each of the feeding turnover manipulator 103 and the discharging turnover manipulator 113 includes a base plate 130 adapted to the tray 4, a rotating shaft 131 is disposed at each of four corners of the base plate 130, at least one hooking portion 132 is disposed on the rotating shaft 131, the hooking portion 132 is configured to hook an edge of the tray 4, a link driving mechanism 133 connected to the rotating shaft 131 is further disposed on the base plate 130, and the link driving mechanism 133 is configured to drive the four rotating shafts 131 to synchronously rotate so as to hook or release the tray 4. In this embodiment, please refer to fig. 7 in combination, an upper hook portion 132 and a lower hook portion 132 are disposed on each rotating shaft 131, the hook directions of the two hook portions 132 are opposite, and the distance between the two hook portions 132 is the thickness of one material tray 4, so that the feeding turnover manipulator 103 and the discharging turnover manipulator 113 can grab two material trays 4 at each time, and the specific working principle is as follows: when the base plate 130 is located right above the front tray 4 and attached to the tray 4, the link driving mechanism 133 drives the rotating shaft 131 to rotate, when the hooking part 132 above is rotated by 90 degrees (clockwise) to the lower part of the tray 4 on the upper layer, one tray 4 can be taken out, and when the hooking part 132 below is rotated by 90 degrees (counterclockwise) to the lower part of the tray 4 on the second layer, two trays 4 can be taken out at a time.

Further, as shown in fig. 8, the circulating transfer line 30 includes a feed line 300, a return line 301, a front turnaround mechanism 302, and a rear turnaround mechanism 303, which are arranged in parallel.

The material feeding line 300 is used for transferring the turnover disc 31 from the first workbench 1 to the second workbench 2, the material returning line 301 is used for transferring the turnover disc 31 from the second workbench 2 to the first workbench 1, the front turnover mechanism 302 is arranged at one end of the material feeding line 300 and the material returning line 301 close to the first workbench 1, and the rear turnover mechanism 303 is arranged at one end of the material feeding line 300 and the material returning line 301 close to the second workbench 2.

Referring to fig. 8 and 9, the front revolving mechanism 302 includes a first revolving platform 3020 abutting against the feeding line 300 and the returning line 301, and a side pushing mechanism 3021 and a front pushing mechanism 3022 are disposed on the first revolving platform 3020. The side pushing mechanism 3021 is configured to push the turnover disk 31 from a position corresponding to the feed back line 301 to a position corresponding to the feed line 300 on the first turnover platform 3020, and the forward pushing mechanism 3022 is configured to push the turnover disk 31 from the first turnover platform 3020 to the feed line 300. When the tray 4 is conveyed to a position on the first circulation platform 3020 corresponding to the feed back line 301, the side pushing mechanism 3021 operates to push the current tray 4 to a position corresponding to the feed line 300, and the forward pushing mechanism 3022 operates to push the current tray 4 to the feed line 300 to participate in the circulation again.

Referring to fig. 8 and 10, the rear revolving mechanism 303 includes a lifting table 3030, a rotating table 3031, a translating mechanism 3032, and a second revolving platform 3033. The lifting platform 3030 is mounted on a translation mechanism 3032, the rotating platform 3031 is mounted on the lifting platform 3030, the second revolving platform 3033 is connected with the rotating platform 3031, the translation mechanism 3032 is used for driving the lifting platform 3030 to move between the feeding line 300 and the return line 301, so that the first revolving platform 3020 is in butt joint with the feeding line 300 or the return line 301, the rotating platform 3031 is used for driving the second revolving platform 3033 to rotate in a horizontal plane, and the lifting platform 3030 is used for driving the second revolving platform 3030 to move up and down. When the tray 4 is transported to the testing machine 200 at the end position thereof by the feeding line 300, first, the translation mechanism 3032 is operated to make the second revolving platform 3033 opposite to the feeding line 300, then the lifting platform 3030 moves up and down to make the working surface of the second revolving platform 3033 flush with the feeding line 300, so that the front revolving disc 31 is transported to the second revolving platform 3033, then the lifting platform 3030 ascends to make the revolving disc 31 flush with the testing machine 200, then the revolving stage 3031 rotates to adjust the direction of the front revolving disc 31 to match the work of the testing manipulator 201, after the testing manipulator 201 finishes taking materials, the translation mechanism 3032 is operated again to make the second revolving platform 3033 translate to the material returning line 301, then the revolving stage 3031 and the lifting platform 3030 operate again to make the height of the second revolving platform 3033 flush with the material returning line 301, at this time, the revolving disc 31 on the second revolving platform 3033 can be moved to the material returning line 301 by a separately arranged pushing mechanism or a driving mechanism of the material returning line 301 301, the transfer plate 31 is moved to the blanking mechanism 11 through the return line 301.

Further, as shown in fig. 8, 11 and 12, the feeding line 300 and the returning line 301 each include a guide rail set 40 and a pushing mechanism 41 installed below the guide rail set 40, the guide rail set 40 extends from the first working platform 1 to the second working platform 2, and the turnover disc 31 can slide back and forth on the guide rail set 40. The pushing mechanism 41 includes a push rod 410, a slide rail 411, a rotation driver 412, and a displacement driver 413. The push rod 410 is provided with a plurality of support rods 414 which extend towards the same direction at intervals, and the distance between the two support rods 414 is equal to the length of the turnover disc 31. The push rod 410 is slidably connected to the slide rail 411, the displacement driver 413 is configured to drive the push rod 410 to slide back and forth along the slide rail 411, and the rotation driver 412 is configured to drive the push rod 410 to rotate on the slide rail 411 with a long axis of the push rod 410 as a rotation axis, so that the supporting rod 414 extends out of or is separated from the two-circumference turntable 31. When the epicyclic disc 31 is pushed to advance to a position, the rotating driver 412 rotates the push rod 410 to make the strut 414 on the push rod 410 change from the vertical state to the horizontal state, so as to be separated from between two epicyclic discs 31, then the displacement driver 413 drives the push rod 410 to move backwards to a position, then the rotating driver 412 rotates reversely to make the strut 414 on the push rod 410 change from the horizontal state to the vertical state and be positioned between two epicyclic discs 31 again, then the displacement driver 413 operates reversely to make the push rod 410 move forwards, at this time, each strut 414 on the push rod 410 pushes the adjacent epicyclic disc 31 to move forwards, and the operation flow of moving the epicyclic disc 31 backwards is the same as that of moving the epicyclic disc 31 forwards, which is not described again. It should be noted that in this embodiment, the rotary driver 412 in the pushing mechanism 41 on the feeding line 300 is installed at the end of the pushing rod 410 (as shown in fig. 11), since the pushing mechanism 41 installed on the material returning line 301 is also used for pushing the peripheral disks 31 on the second peripheral platform 3033 back to the feeding line 300, the rotary driver 412 in the pushing mechanism 41 installed on the material returning line 301 is located in the middle of the pushing rod 410 (as shown in fig. 12) to facilitate the arrangement of the supporting rod 414 at one end of the pushing rod 410 close to the second worktable 2, and when the second peripheral platform 3033 is butted against the material returning line 301, the peripheral disks 31 on the second peripheral platform 3033 are pushed into the guide rail set 40 on the material returning line 301 by one cycle of the pushing rod 410.

Further, referring to fig. 1 and 8 again, in order to better test the high temperature or low temperature resistance of the chips, a section of the pretreatment tank 304 is disposed on the feeding line 300, and the pretreatment tank 304 is used for heating or freezing the chips in the turnover plate 31 passing through the feeding line 300. In this embodiment, by setting the pretreatment tank 304, the chip can be heated or frozen in advance before being sent to the testing machine 200, so that the high temperature or low temperature resistance of the chip can be better tested, the testing time of the testing machine 200 can be reduced, and the testing efficiency can be effectively improved.

Preferably, as shown in fig. 14 and fig. 15, the testing machine 200 includes a supporting table 2000, an accommodating cavity 2001 for accommodating a chip to be tested is disposed on the supporting table 2000, a cover plate 2002 is disposed above the accommodating cavity 2001, the cover plate 2002 can horizontally slide above the accommodating cavity 2001 to open or close the accommodating cavity 2001, a heating block 2003 is disposed on a bottom wall of the cover plate 2002, a lifting driver 2004 for driving the heating block 2003 to move up and down is disposed on a bottom wall of the cover plate 2002, and the heating block 2003 is used for abutting against the chip to be tested at a set testing temperature.

In another preferred embodiment of the semiconductor test handler of the present invention, as shown in fig. 2 and 3, an open/short circuit test machine 140, an open/short circuit carrying robot 141, a secondary interactive positioning platform 142 and a plurality of third positioning slots 143 are further disposed on the first worktable 1 near the first positioning slot 100. The open-short circuit testing machine 140 is used for conducting open-short circuit testing on the chip, the secondary interactive positioning platform 142 is used for moving the chip between the loading position and the open-short circuit testing machine 140 in a turnover interactive mode, and the open-short circuit carrying manipulator 141 is used for carrying the chip in or out of the secondary interactive positioning platform 142. The third positioning groove 143 is used for placing the NG tray 4 carrying the short-circuit test result which does not reach the standard. In this embodiment, as shown in fig. 3, the secondary interactive positioning platform 142 includes a mounting groove 1420 formed on the first working platform 1, two movable exchanging platforms 1421 are disposed in the mounting groove 1420, two rows of acupoints for placing chips are disposed on the two exchanging platforms 1421, respectively, one row of acupoints is used for placing chips to be tested, the other row of acupoints is used for placing chips after testing, the two exchanging platforms 1421 can be alternately moved between the loading position and the open/short circuit testing machine 140, so that the two exchanging platforms 1421 do not affect each other during the moving process, and one of the two exchanging platforms 1421 is higher than the other exchanging platform 1421.

In summary, as shown in fig. 1 to 15, the semiconductor test handler disclosed in the present invention has a loading position, a unloading position, a transferring position, and an open/short test position on the first table 1, a test position and a transferring position on the second table 2, and a circulating moving position between the first table 1 and the second table 2, and specifically, the semiconductor test handler is used for performing a chip test handler according to the following steps:

firstly, placing a plurality of trays 4 containing chips to be tested into each upper bin 102, and placing a plurality of empty trays 4 into a lower bin 112; then, the open-short circuit test machine platform 140, the open-short circuit carrying manipulator 141 and the secondary interactive positioning platform 142 are used for carrying out open-short circuit test on the chips in the loading position (the step can be optionally skipped), after the open-short circuit test is finished, the chips passing the test are placed into the loading plate 4 of the loading position again, and the chips failing the test are placed into the NG loading plate 4; then, the chips in the tray 4 in the loading position are moved into the turnover disc 31 in the feeding line 300 by the loading manipulator 101, the turnover disc 31 is conveyed to the second workbench 2 by the feeding line 300 to be butted with the second turnover platform 3033, and in addition, during the process of conveying the chips by the feeding line 300, a heating switch of the pretreatment tank 304 can be opened to heat the passed chips in advance; then, the second revolving platform 3033 is butted with the test machine table 200 through the lifting and rotating operation of the second revolving platform 3033, the chip is moved into the test machine table 200 through the test manipulator 201, and after the test is finished, the chip is moved into the revolving disc 31 on the second revolving platform 3033 through the test manipulator 201; next, the second transfer platform 3033 is butted with the feed back line 301 through the operations of lifting, rotating and translating the second transfer platform 3033; then, the revolving disc 31 on the second revolving platform 3033 is moved into the material returning line 301 through the pushing mechanism 41 on the material returning line 301, and the revolving disc 31 is conveyed to the material discharging position of the first workbench 1 through the material returning line 301; then, the chips tested on the turnover disc 31 are respectively put into different empty trays 4 through the blanking manipulator 111 according to the test result, or put into the middle turntable firstly, and then are moved into different empty trays 4 from the middle turntable after the current turnover disc 31 is moved away; when the material tray 4 in the second positioning groove 110 is full, the material tray is received into the discharging bin 112 by the discharging lifting platform 114 and the discharging turnover manipulator 113; the above processes are executed in a circulating reciprocating mode, manual watching is not needed in the whole testing process, and the working efficiency is high.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.

Claims

1. A semiconductor testing and sorting machine is characterized by comprising a first workbench, a second workbench, a feeding mechanism, a discharging mechanism, a circulating transfer mechanism and a testing mechanism;

the feeding mechanism is used for transferring the chips to be tested to the week turntable, and the discharging mechanism is used for transferring the chips after the test is finished to different material trays from the week turntable according to the test result; the testing mechanism is used for testing the chips conveyed by the circulating transfer mechanism.

2. The semiconductor test handler of claim 1, wherein the feeding mechanism includes a plurality of first positioning grooves and a feeding manipulator provided on the first table at one side of the circulating transfer line, and the discharging mechanism includes a plurality of second positioning grooves and a discharging manipulator provided on the first table at the other side of the circulating transfer line;

3. The semiconductor test handler of claim 1, wherein the test mechanism comprises at least one test station and a test manipulator, and the test manipulator is configured to move the chips to be tested in the peripheral table to the test station and move the tested chips in the test station to the peripheral table.

4. The semiconductor test handler of claim 2, wherein the feeding mechanism further comprises a plurality of feeding bins, a feeding turnover manipulator, and a plurality of feeding lifting platforms respectively disposed under the first work table and directly opposite to each of the first positioning slots, and the discharging mechanism further comprises a plurality of discharging bins, a discharging turnover manipulator, and a plurality of discharging lifting platforms respectively disposed under the first work table and directly opposite to each of the second positioning slots; the feeding and discharging bins are used for accommodating a plurality of charging trays in a stacking mode, the feeding turnover manipulator is used for transferring the charging tray in any one feeding bin to the feeding lifting platform, and the discharging turnover manipulator is used for transferring the charging tray on the discharging lifting platform to any one discharging bin; the feeding lifting platform is used for lifting the material tray into the first positioning groove in an up-and-down moving mode, and the discharging lifting platform is used for transferring the material tray in the second positioning groove to the position below the second positioning groove in an up-and-down moving mode so as to be grabbed by the discharging turnover manipulator.

5. The semiconductor test handler of claim 4, wherein the upper bin and the lower bin each comprise a base, and a plurality of bars, the bars are vertically disposed at different positions on the base, and a receiving space for receiving a tray is located between the bars; the base platform is connected with the base in a sliding mode through a drawing structure, so that the base platform can enter and exit below the first workbench.

6. The semiconductor testing and sorting machine according to claim 4, wherein the loading turnover manipulator and the unloading turnover manipulator each comprise a base plate adapted to the material tray, a rotating shaft is disposed at each of four corners of the base plate, at least one hooking portion is disposed on the rotating shaft, the hooking portion is used for hooking the edge of the material tray, a link driving mechanism is further disposed on the base plate and connected to the rotating shaft, and the link driving mechanism is used for driving the four rotating shafts to rotate synchronously so as to hook or release the material tray.

7. The semiconductor test handler of claim 1, wherein the circulating transfer conveyor line includes a feed line, a return line, a front turnaround mechanism, and a rear turnaround mechanism, which are arranged in parallel; the feeding line is used for transferring the turnover disc from the first workbench to the second workbench, and the returning line is used for transferring the turnover disc from the second workbench to the first workbench; the front turnover mechanism is arranged at one end of the feeding line and the returning line close to the first workbench, and the rear turnover mechanism is arranged at one end of the feeding line and the returning line close to the second workbench; the front turnover mechanism comprises a first turnover platform butted with the material feeding line and the material returning line, a side pushing mechanism and a front pushing mechanism are arranged on the first turnover platform, the side pushing mechanism is used for pushing a turnover disc to a position corresponding to the material feeding line from a position corresponding to the material returning line on the first turnover platform, and the front pushing mechanism is used for pushing the turnover disc to the material feeding line from the first turnover platform; the rear revolving mechanism comprises a lifting table, a revolving table, a translation mechanism and a second revolving platform, the lifting table is mounted on the translation mechanism, the revolving table is mounted on the lifting table, the second revolving platform is connected with the revolving table, the translation mechanism is used for driving the lifting table to move between the feeding line and the returning line so as to enable the first revolving platform to be in butt joint with the feeding line or the returning line, the revolving table is used for driving the second revolving platform to rotate in a horizontal plane, and the lifting table is used for driving the second revolving platform to move up and down.

8. The semiconductor test handler of claim 7, wherein the feed line and the return line each include a rail set extending from the first table to the second table and an urging mechanism mounted below the rail set, the peripheral table being slidable back and forth on the rail set; the propelling mechanism comprises a push rod, a slide rail, a rotary driver and a displacement driver; a plurality of supporting rods extending towards the same direction are arranged on the push rod at intervals, and the distance between the two supporting rods is equal to the length of the peripheral turntable; the push rod with slide rail sliding connection, the displacement driver is used for driving the push rod along slide rail front and back slip, the rotary actuator is used for driving the push rod to be in on the slide rail use the long axis of push rod is the rotary motion of rotation axis, so that branch stretches out or breaks away from in between two week carousel.

9. The semiconductor test handler of claim 7, wherein the feed line is provided with a section of a pre-treatment tank for heating or freezing the chips in the turnover table passing through the feed line.

10. The semiconductor test separator according to claim 3, wherein the test machine comprises a support table, the support table is provided with an accommodating cavity for accommodating a chip to be tested, a cover plate is arranged above the accommodating cavity, the cover plate can horizontally slide above the accommodating cavity to open or close the accommodating cavity, a heating block is arranged on the bottom wall of the cover plate, a lifting driver for driving the heating block to move up and down is arranged on the bottom wall of the cover plate, and the heating block is used for abutting against the chip to be tested at a set test temperature.