CN112804830A

CN112804830A - Full-automatic AOI detects chip mounter

Info

Publication number: CN112804830A
Application number: CN202110117730.XA
Authority: CN
Inventors: 廖玉尚
Original assignee: Dongguan Lingyi Precision Manufacturing Technology Co ltd
Current assignee: Dongguan Lingyi Precision Manufacturing Technology Co ltd
Priority date: 2021-01-28
Filing date: 2021-01-28
Publication date: 2021-05-14

Abstract

The invention discloses a full-automatic AOI detection chip mounter, wherein the full-automatic AOI detection chip mounter comprises: a base; the feeding mechanism is arranged on the base, and a material tray for placing mounting accessories is arranged in the feeding mechanism; the conveying mechanism is arranged on the base and provided with a chip mounting station and a detection station, a second driving device is arranged in the conveying mechanism, and the second driving device can convey a product which is mounted on the chip mounting station to the detection station; the material taking mechanism comprises a first driving device and a chip mounting device, the first driving device is arranged on the base, and the chip mounting device is arranged on the first driving device; the detection device can detect each process in real time, reduce the reject ratio of the produced products, reduce the production cost and improve the production efficiency.

Description

Full-automatic AOI detects chip mounter

Technical Field

The invention relates to the technical field of chip mounters, in particular to a full-automatic AOI detection chip mounter.

Background

Chip mounter: the Surface Mount System is also called a mounter and a Surface Mount System (Surface Mount System), and is configured behind a dispensing machine or a screen printer in a production line, and is an apparatus for accurately placing Surface Mount components on a PCB pad by moving a mounting head, and the production line is divided into a manual operation and a full-automatic operation.

Some traditional full-automatic chip mounters, solid brilliant machine class equipment appear leaking easily and grab the paster to the in-process that the chip mounter pasted the dress, processing benchmark error appears during the paster, there is the uncertainty in the volume of gluing moreover, influence finished product quality easily, and the detection screening dynamics of traditional chip mounter every process is not enough, can not discover bad product in time, thereby lead to the yields of product not high, the phase change has improved manufacturing cost, extravagant productivity, production efficiency has been reduced.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the full-automatic AOI detection chip mounter can detect all the working procedures in real time, identify defective products, reduce the reject ratio of the produced products, reduce the production cost and improve the production efficiency.

The full-automatic AOI detection chip mounter according to the embodiment of the first aspect of the invention comprises:

a base; the feeding mechanism is arranged on the base, and a material tray for placing mounting accessories is arranged in the feeding mechanism; the conveying mechanism is arranged on the base and provided with a chip mounting station and a detection station, a second driving device is arranged in the conveying mechanism, and the second driving device can convey a product which is mounted on the chip mounting station to the detection station; the material taking mechanism comprises a first driving device and a chip mounting device, the first driving device is arranged on the base, the chip mounting device is arranged on the first driving device, and the first driving device is used for driving the chip mounting device to take and mount accessories on the material tray and transfer the accessories to the chip mounting station for mounting; the first detection device is positioned between the chip mounting station and the feeding mechanism and is used for detecting the mounting accessories in the chip mounting device which slides over the first detection device; and the second detection device is arranged outside the transmission mechanism and above the detection station and is used for detecting the products finished by the paster.

The full-automatic AOI detection chip mounter provided by the embodiment of the invention at least has the following beneficial effects: the chip mounting device is movably arranged on the first driving device, so that the chip mounting device can grab the chip mounting accessory under the driving of the first driving device and mount the chip mounting accessory on the wafer disc, the full-automatic AOI detection chip mounter can realize the function of full-automatic chip mounting, realize accurate chip mounting, improve the production efficiency, reduce the reject ratio of products and reduce the production cost, a transmission mechanism is arranged on the base, a second driving device is arranged in the transmission mechanism, the second driving device can transmit the products mounted on the chip mounting station to the detection station, so that automatic transmission between the stations can be realized, the whole chip mounting process is more automatic, the manual participation is reduced, the working efficiency of equipment is further improved, meanwhile, a first detection device and a second detection device are arranged on the base, and the first detection device and the second detection device can deeply learn the detection of the bad appearance items of the OCA adhesive surface, whether main test item has the hourglass to grab and pastes dress accessory, pastes the outward appearance nature such as concave-convex point in the dress accessory bad, deformation, fish tail, dirty, watermark, reduces and causes badly to the product among the manual inspection process, leaks to examine, erroneous judgement, overkill to reduce the input of personnel's quantity, use manpower sparingly, promotion production efficiency and quality that can be bigger.

According to some embodiments of the invention, the first driving device includes a first Y-axis driver and a first X-axis driver, the first Y-axis driver is disposed above the base, the first X-axis driver is disposed on the first Y-axis driver, and the first Y-axis driver is configured to drive the first X-axis driver to move along the Y-axis.

According to some embodiments of the invention, the patch device is disposed on a first X-axis drive for moving the patch device along an X-axis.

According to some embodiments of the present invention, the chip mounting device includes a lifting module, a third detection device, and a chip mounting head, the lifting module is disposed on the first driving device, the third detection device is disposed on the lifting module, the chip mounting head is disposed on the lifting module, and the lifting module is configured to drive the chip mounting head to move up and down.

According to some embodiments of the present invention, the conveying mechanism further includes an upper tray station and a finished product station, the second driving device includes a second X-axis driver and a second Y-axis driver, the second X-axis driver can convey the product on the upper tray station to the placement station and convey the product mounted on the placement station to the inspection station, and the second Y-axis driver can convey the product on the inspection station to the finished product station.

According to some embodiments of the present invention, the base is further provided with a third driving device, the third driving device includes a third X-axis driver and a third Y-axis driver, the third Y-axis driver is disposed on the third X-axis driver, the third X-axis driver is configured to drive the third Y-axis driver to move along the X-axis, the second detecting device is disposed on the third Y-axis driver, and the third Y-axis driver is configured to drive the second detecting device to move along the Y-axis.

According to some embodiments of the invention, the feeding mechanism comprises a support, a fourth driving device and a plurality of trays, the support is fixed on the base, the fourth driving device is arranged on the support, one side of the support, which is far away from the taking mechanism, is a tray placing side, one side of the support, which is close to the taking mechanism, is a feeding side, and the fourth driving device is used for moving the trays from the tray placing side to the feeding side and returning the trays from the feeding side to the tray placing side.

According to some embodiments of the invention, the feeding mechanism comprises a brushing device, the brushing device is arranged on the bracket, and the brushing device is used for placing the mounting accessories on the tray in the process that the tray moves from the tray placing side to the feeding side.

According to some embodiments of the invention, the base is further provided with a waste magazine for placing bad mounting accessories taken by the patch device.

According to some embodiments of the invention, the number of the material taking mechanisms, the number of the paster stations and the number of the first detection devices are two, and the two material taking mechanisms, the number of the paster stations and the number of the first detection devices are respectively arranged on two sides of the detection station.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic perspective view of an embodiment of the present invention;

FIG. 2 is a schematic illustration of a drive trajectory of the transmission mechanism shown in FIG. 1;

fig. 3 is a schematic diagram of the movement locus of the tray in the feeding mechanism shown in fig. 1.

Reference numerals:

a base 100,

A material taking mechanism 200, a first driving device 210, a chip mounting device 220, a first X-axis driver 211, a first Y-axis driver 212, a lifting module 221, a third detecting device 222, a chip mounting head 223,

A transmission mechanism 300, a chip mounting station 301, a detection station 302, an upper disc station 303, a finished product station 304, a second driving device 310, a second X-axis driver 311, a second Y-axis driver 312,

A first detection device 400,

A second detection device 500,

A third driving device 600, a third X-axis driver 610, a third Y-axis driver 620,

A feeding mechanism 700, a bracket 710, a brushing device 720, a fifth X-axis driver 721, a brushing head 722, a fourth driver 730, a tray 740,

The cartridge 800 is discarded.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.

As shown in fig. 1, the fully automatic AOI detection chip mounter according to the embodiment of the present invention includes a base 100, a material taking mechanism 200, a conveying mechanism 300, a first detection device 400, a second detection device 500, and a feeding mechanism 700.

The feeding mechanism 700, the feeding mechanism 700 is arranged on the base 100, and a tray 740 for placing mounting accessories is arranged in the feeding mechanism 700; the conveying mechanism 300 is arranged on the base 100 and located below the material taking mechanism 200, a chip mounting station 301 and a detection station 302 are arranged on the conveying mechanism 300, a second driving device 310 is arranged inside the conveying mechanism 300, and the second driving device 310 can convey a product mounted on the chip mounting station 301 to the detection station 302; the material taking mechanism 200 comprises a first driving device 210 and a chip mounting device 220, the first driving device 210 is arranged on the base 100, the chip mounting device 200 is arranged on the first driving device 210, and the first driving device 210 is used for driving the chip mounting device 200 to take and mount accessories on the tray 740 and transfer the accessories to the chip mounting station for mounting; a first inspection device 400 which is located between the mounter station 301 and the feeding mechanism 700, and which inspects mounting accessories in the mounter 220 which slide over the first inspection device; and a second detection device 500 disposed outside the conveying mechanism 300 and configured to detect the patch finished products and disposed above the detection station 302 for detecting the patch finished products.

For example, as shown in fig. 1, the base 100 is a working platform providing a working platform for the whole chip mounter, the feeding mechanism 700 is mainly used for placing mounting accessories, the feeding mechanism 700 may be disposed on the base 100, the feeding mechanism 700 is provided with a tray 740 for placing mounting accessories, the conveying mechanism 300 may be disposed above the base 100 and below the taking mechanism 200, the conveying mechanism 300 may have a chip-mounting station 301 and a detection station 302, wherein the chip-mounting station 301 and the detection station 302 are fixed positions relative to the conveying mechanism 300, the chip-mounting station 301 and the detection station 302 do not move with the operation of the conveying mechanism 300, the chip-mounting device 220 in the taking mechanism 200 may mount a wafer tray in the chip-mounting station 301 of the conveying mechanism 300 below the chip-mounting station, the conveying mechanism 300 may have a second driving device 310 inside, the second driving device 310 may convey products on the chip-mounting station 301 to the detection station 302, the material taking mechanism 200 mainly functions to grab and mount the mounted component on the wafer, the material taking mechanism 200 includes a first driving device 210 and a chip mounting device 220, the first driving device 210 can be disposed on the base 100, the chip mounting device 220 can be movably disposed on the first driving device 210, the chip mounting device 220 is driven by the first driving device 210 to move above the base 100, the first detecting device 400 can be fixedly or movably disposed on the base 100, the observing direction of the first detecting device 400 is observed from bottom to top, and is mainly used for detecting the bottom surface of the chip mounting device 220 after the chip mounting device 220 absorbs the mounted component, observing and determining whether the chip mounting device 220 successfully absorbs the mounted component and determining whether the absorbed mounted component is qualified, the second detecting device 500 can be fixedly or movably disposed above the detecting station 302, the observing direction of the second detecting device 500 is observed from top to bottom, for final inspection of the finished product at inspection station 302.

Specifically, fix first drive arrangement 210 on base 100, the movably setting of paster device 220 is on first drive arrangement 210, paster device 220 drives it through first drive arrangement 210 and removes in base 100 top, make paster device 220 can snatch the dress accessory under drive arrangement 210's drive, first drive arrangement 210 continues to drive paster device 220 and will adorn the accessory dress on the wafer disc after that, full-automatic AOI detects the function that the chip mounter can realize full-automatic paster, realize accurate paster, the yield of production efficiency and product is improved.

In addition, the conveying mechanism 300 is provided with a chip mounting station 301 and a detection station 302, the chip mounting device 220 in the material taking mechanism 200 can mount a chip on a wafer disc in the chip mounting station 301 of the conveying mechanism 300 below the chip mounting device, the conveying mechanism 300 is internally provided with a second driving device 310, and the second driving device 310 can transmit a product on the chip mounting station 301 to the detection station 302, so that automatic transmission between stations can be realized, the whole chip mounting process is more automatic, manual participation is reduced, and the working efficiency of the equipment is improved. Further, a first detection device 400 is fixedly arranged on the base 100, the first detection device 400 is a CCD detection camera, the CCD camera can deeply learn the detection of poor appearance items on the surface of OCA glue, main detection items are poor in appearance such as material shortage, concave-convex points, deformation, scratches, dirt and watermarks, the defects of poor appearance, missed detection, erroneous judgment and over-killing of products in the manual inspection process are reduced, the investment of the number of personnel is reduced, manpower is saved, and the capacity, the quality, the efficiency and the like of the two stations are greatly improved. The first detection device 400 is arranged in a platform plate on the upper surface of the base 100 in a penetrating manner, the lens of the first detection device 400 faces upwards, the observation direction is from bottom to top, the first detection device is mainly used for detecting the bottom surface of the chip mounting device 220 after the chip mounting device 220 absorbs the mounting accessories, whether the chip mounting device 220 absorbs the mounting accessories is successfully observed and judged, if the mounting accessories are not successfully absorbed, the mounting accessories cannot be attached to a wafer disc, so that the quality of finished products after the wafer disc is mounted can be better ensured, if the chip mounting device 220 absorbs the mounting accessories, the mounting accessories are missed to be absorbed, and other mounting accessories successfully absorbed are attached to the wafer disc continuously, so that the wafer disc lacking the mounting accessories can be scrapped, the production cost is increased, the production efficiency is reduced, and the quality of the absorbed mounting accessories can be detected by the first detection device 400, preventing the placement device 220 from placing bad placement components on the wafer disks. Therefore, the first detecting device 400 is fixedly disposed on the base 100, so that the production cost can be further reduced, the production efficiency can be improved, and the product quality can be improved.

Furthermore, the second detecting device 500 may be fixedly or movably disposed above the detecting station 302, the second detecting device 500 is also a CCD detecting camera, the observing direction of the second detecting device 500 is from top to bottom for performing final detection on the product processed on the detecting station 302, the second detecting device 500 mainly detects the mounting position and the mounting quality of the mounting part on the wafer, pushes out and records the unqualified wafer, photographs and records the appearance of the unqualified wafer, and performs reverse learning, thereby improving the detecting capability of the second detecting device 500, and improving the qualification rate of the finished wafer.

In some embodiments of the invention, the first driving device 210 includes a first Y-axis driver 212 and a first X-axis driver 211, the first Y-axis driver 212 is disposed above the base 100, the first X-axis driver 211 is disposed on the first Y-axis driver 212, and the first Y-axis driver 212 is configured to drive the first X-axis driver 211 to move along the Y-axis. For example, as shown in fig. 1, the first Y-axis driver 212 is disposed on the surface of the base 100, and the first X-axis driver 211 is disposed on the first Y-axis driver 212, in practical operation, the positions of the first X-axis driver 211 and the first Y-axis driver 212 may be interchanged, as long as the material taking mechanism 200 can be driven to move along the X-axis direction and the Y-axis direction on the same horizontal plane, the extending direction of the first Y-axis driver 212 is perpendicular to the extending direction of the first X-axis driver 211, the first X-axis driver 211 and the first Y-axis driver 212 are both screw rod motors, and the screw rod motors can adjust and control the device more precisely and finely. So that the material taking mechanism 200 arranged on the first driver can quickly and accurately absorb and attach the attached accessories on the wafer disk, and the production efficiency is further improved.

In some embodiments of the invention, the chip device 200 is disposed on a first X-axis driver 211, and the first X-axis driver 211 is used for driving the chip device 200 to move along the X-axis. For example, as shown in fig. 1, the chip mounting device 220 is driven by the first X-axis driver 211 to move on the X-axis, then the first Y-axis driver 212 drives the first X-axis driver 211 to move, and the chip mounting device 220 can move on the X-axis and the Y-axis, and similarly, the chip mounting device 220 can also be arranged on the first Y-axis driver 212, and then the first X-axis driver 211 drives the first Y-axis driver 212 to move, and the above effects can also be achieved, so that the material taking mechanism 200 can quickly and accurately suck and mount the mounting accessory on the wafer, thereby reducing the participation of labor and further improving the production efficiency.

In some embodiments of the invention, the die attach device 220 includes a lifting module 221, a third detection device 222, and a die attach head 223, where the lifting module 221 is disposed on the first driving device 210, the third detection device 222 is disposed on the lifting module 221, the die attach head 223 is disposed on the lifting module 221, and the lifting module 221 is configured to drive the die attach head 223 to move up and down. For example, as shown in fig. 1, the lifting module 221 is a rotary lifter, wherein a spiral groove is formed in the peripheral side surface of the mounting head 223, the lifting module 221 drives the mounting head 223 to rotate and move in the direction of the Z axis, so that the mounting head 223 can move in three directions of the X axis, the Y axis and the Z axis, the action of taking materials and mounting is realized more efficiently, and the production efficiency is further improved.

In some embodiments of the invention, the transfer mechanism 300 further has a tray loading station 303 and a product station 304, the second driving device 310 includes a second X-axis driver 311 and a second Y-axis driver 312, the second X-axis driver 311 can transfer the wafer tray in the tray loading station 303 to the pick-up station 301 and transfer the product in the pick-up station 301 to the detection station 302, and the second Y-axis driver 312 can transfer the product in the detection station 302 to the product station 304. For example, as shown in fig. 1 and fig. 2, the second X-axis driver 311 and the second Y-axis driver 312 are both lead screw motors, the upper tray station 303 is disposed at the beginning of the whole production line, the main function of the upper tray station 303 is that a worker can manually place a wafer tray on the upper tray station 303, move the wafer tray on the upper tray station 303 to the mounting station 301 along with the movement of the second X-axis driver 311, then move the wafer tray mounted on the mounting station 301 to the detection station 302 along with the movement of the second X-axis driver 311 for detection, then the second Y-axis driver 312 moves the wafer tray detected on the detection station 302 to the finished product station 304, and finally, under the prompt of the detection device, the worker takes off the wafer tray on the finished product station 304 and sorts and stores the wafer tray according to good products and bad products, so that under the cooperation work of the second X-axis driver 311 and the second Y-axis driver 312, the crystal disc is moved in each station and becomes a finished product, manual transportation is omitted, production efficiency is greatly improved, errors considered in the production process are reduced, and product quality is improved.

In some embodiments of the invention, a third driving device 600 is further disposed on the base 100, the third driving device 600 includes a third X-axis driver 610 and a third Y-axis driver 620, the third Y-axis driver 620 is disposed on the third X-axis driver 610, the third X-axis driver 610 is configured to drive the third Y-axis driver 620 to move along the X-axis, the second detecting device 500 is disposed on the third Y-axis driver 620, and the third Y-axis driver 620 is configured to drive the second detecting device 500 to move along the Y-axis. For example, as shown in fig. 1, the third X-axis driver 610 and the third Y-axis driver 620 are both screw motors, the second detection device 500 is also a CCD camera, the second detection device 500 performs final detection on a wafer tray mounted below from top to bottom, and the second detection device 500 is disposed on the third driving device 600, so that the detection efficiency of the second detection device 500 can be effectively improved, and the production efficiency of the whole production line can be indirectly improved.

In some embodiments of the invention, the feeding mechanism 700 includes a support 710, a fourth driving device 730 and a plurality of trays 740, the support 710 is fixed on the base 100, the fourth driving device 730 is disposed on the support 710, a side of the support 710 away from the material taking mechanism 200 is a tray placing side, a side of the support close to the material taking mechanism 700 is a feeding side, and the fourth driving device 730 is configured to move the trays 740 from the tray placing side to the feeding side and return the trays 740 from the feeding side to the tray placing side. For example, as shown in fig. 1, a plurality of trays 740 are disposed on the support 710, and the fourth driving device 730 drives the plurality of trays 740 to move in order, so that the trays 740 with the placement accessories laid thereon are automatically transferred in the feeding process, the placement accessories are automatically provided for the placement device 220, and the trays 740 with the completed loading are automatically returned to the working position of the worker.

Specifically, as shown in fig. 3, 6 positions for placing the tray 740 are provided on the support 710, the support 710 is divided into a feeding side and a tray placing side, the feeding side and the tray placing side both have 2 positions, the middle of the feeding side and the tray placing side also has 2 positions, the two positions on the tray placing side include a tray placing station and a tray discharging station, the tray placing station is used for placing the tray 740 by a worker, the tray discharging station is used for taking down the tray 740 after the feeding is completed by the worker, the left position in the two positions on the feeding side is a material taking station, the fourth driving device 730 includes a fourth X-axis driver and a fourth Y-axis driver, and the fourth X-axis driver and the fourth Y-axis driver are both provided on the support 710. The movement sequence of the tray 740 is: firstly, the material tray 740 fully paved with the mounting accessories is manually put in from the upper tray station, the fourth Y-axis driver drives the material tray 740 on the upper tray station to move to the material taking station, at the moment, the fourth Y-axis driver can continuously put a new material tray 740 fully paved with the mounting accessories to provide the mounting accessories on the upper tray station, then, after the mounting accessories of the material tray 740 on the material taking station are emptied, the empty material tray 740 on the material taking station is moved to the right side of the material feeding side through the fourth X-axis driver, then, the empty material tray 740 is driven to move to the lower tray station through the fourth Y-axis driver, the empty material tray 740 is manually taken out from the lower tray station, the empty material tray is fully paved with the mounting accessories again, and then, the empty material tray is put into the upper tray station to continue to circulate. The material discs 740 full of the mounting accessories can be automatically transmitted to the disc loading station to enable the mounting device 720 to take the materials, and the materials are automatically conveyed back to the working position of a worker after emptying, so that the worker is prevented from painstaking removal of the material discs 740, and the production efficiency of the whole full-automatic AOI detection mounting machine is further improved.

In some other embodiments of the present invention, the feeding mechanism 700 also includes a brushing device 720, the brushing device 720 is disposed on the bracket 710, and the brushing device 720 is used for placing the mounting accessory on the tray 740 during the movement of the tray 740 from the tray placing side to the feeding side. For example, as shown in fig. 1, a brushing station is provided between the upper disc station and the material taking station, the process of manually laying the mounting accessories for the hole tray 740 in the previous embodiment can be eliminated by providing a brushing device 720 at the brushing station of the material feeding mechanism 700, the workload of workers can be reduced, the brushing device includes a brushing device 720 including a fifth X-axis driver 721 and a brushing head 722, the fifth X-axis driver 721 is fixed on the bracket 710, in this embodiment, the brushing head 722 is a brush, the mounting accessories are set out in the brushing device 720, then the brush can lay the mounting accessories flat on the tray 740, the brushing device 720 brushes the product onto the tray 740 of the brushing station, the brushing head 722 is provided on the fifth X-axis driver 721, the fifth X-axis driver 721 is used for driving the brushing head 722 to automatically brush the material in the X-axis direction of the tray 740, the fifth X-axis driver 721 is provided at the brushing station, when the worker puts the empty tray 740 at the feeding position, the fifth X-axis driver 721 drives the material brushing head 722 to brush the empty tray 740 with the mounting accessories, and the tray 740 filled with the mounting accessories is conveyed to the material taking station to perform the next process.

In some embodiments of the invention, the base 100 is further provided with a waste magazine 800, and the waste magazine 800 is used for placing bad mounting accessories taken from the chip device 720. For example, as shown in fig. 1, by providing the waste material box 800, when the first detecting device 400 detects that a bad mounting component is sucked on the material taking mechanism 200, a signal can be directly output to drive the material taking mechanism 200 through the first driving device 210, and the bad mounting component is thrown into the waste material box 800 without manual operation, thereby saving time and improving production efficiency.

In some embodiments of the present invention, the number of the material taking mechanisms 200, the placement station 301, and the first detecting device 400 is two, and the two material taking mechanisms 200, the placement station 301, and the first detecting device 400 are respectively arranged on two sides of the detecting station 302 in a mirror image manner. For example, as shown in fig. 1 and fig. 2, the two material taking mechanisms 200, the two conveying mechanisms 300, and the first detection device 400 may operate simultaneously, and products mounted at the mounting stations 301 of the two conveying mechanisms 300 are all conveyed to the middle detection station 302, so that the whole full-automatic AOI detection mounting machine realizes double-station work, and the production efficiency is improved twice.

The working principle of the full-automatic AOI detection chip mounter is as follows:

firstly, manually placing an empty tray 740 on the tray loading station, then moving the empty tray 740 to the material brushing station and brushing the mounting accessories on the empty tray 740 through the material brushing device 720, then moving the material tray 740 with the material brushing to the material taking station to wait for the first driving device 210 to drive the material taking mechanism 200 to move to the material taking station and absorb the mounting accessories, then driving the material taking mechanism 200 to move above the first detecting device 400 through the first driving device 210 to detect the absorbed mounting accessories, if the mounting accessories are found to be poor mounting accessories, directly placing the absorbed mounting accessories into the waste material box 800, at the moment, manually transferring the wafer tray placed from the tray loading station 303 to the mounting station 301, if the mounting accessories are detected to be no problem, moving the material taking mechanism 200 to the mounting station 301 and mounting the mounting accessories in the wafer tray, then, the mounted wafer is transported to the detection station 302 through the second driving device 310 on the transmission mechanism 300, then, the third driving device 600 moves the second detection device 500 to detect the wafer on the detection station 302, and finally, if the detection result of the second detection device 500 is good, the wafer on the detection station 302 is directly pushed out through the second Y-axis driver 312, and if the detection result is bad, a signal is sent to inform a worker while the wafer is pushed out.

The above is the working principle in the operation process of one station, the working principle on the two stations of the full-automatic AOI detection chip mounter is the same, and the detailed description of the other station is not provided here.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims

1. The utility model provides a full-automatic AOI detects chip mounter which characterized in that includes:

a base;

the feeding mechanism is arranged on the base, and a material tray for placing mounting accessories is arranged in the feeding mechanism;

the conveying mechanism is arranged on the base and provided with a chip mounting station and a detection station, a second driving device is arranged in the conveying mechanism, and the second driving device can convey a product which is mounted on the chip mounting station to the detection station;

the material taking mechanism comprises a first driving device and a chip mounting device, the first driving device is arranged on the base, the chip mounting device is arranged on the first driving device, and the first driving device is used for driving the chip mounting device to take and mount accessories on the material tray and transfer the accessories to the chip mounting station for mounting;

the first detection device is positioned between the chip mounting station and the feeding mechanism and is used for detecting the mounting accessories in the chip mounting device which slides over the first detection device;

and the second detection device is arranged outside the transmission mechanism and above the detection station and is used for detecting the products finished by the paster.

2. The automatic AOI inspection placement machine of claim 1, wherein the first driving device comprises a first Y-axis driver and a first X-axis driver, the first Y-axis driver is disposed above the base, the first X-axis driver is disposed on the first Y-axis driver, and the first Y-axis driver is configured to drive the first X-axis driver to move along a Y-axis.

3. The fully automatic AOI inspection placement machine of claim 2, wherein the placement device is mounted on a first X-axis drive, the first X-axis drive configured to move the placement device along an X-axis.

4. The automatic AOI detection chip mounter according to claim 1, wherein the chip mounter includes a lifting module, a third detection device, and a chip mounter head, the lifting module is disposed on the first driving device, the third detection device is disposed on the lifting module, the chip mounter head is disposed on the lifting module, and the lifting module is configured to drive the chip mounter head to move up and down.

5. The automatic AOI inspection placement machine according to claim 1, wherein the transport mechanism further includes a tray loading station and a product loading station, the second driving device includes a second X-axis driver and a second Y-axis driver, the second X-axis driver transports the products on the tray loading station to the placement station and transports the products on the placement station to the inspection station, and the second Y-axis driver transports the products on the inspection station to the product loading station.

6. The automatic AOI inspection placement machine according to claim 1, wherein a third driving device is further disposed on the base, the third driving device includes a third X-axis driver and a third Y-axis driver, the third Y-axis driver is disposed on the third X-axis driver, the third X-axis driver is configured to drive the third Y-axis driver to move along the X-axis, the second inspection device is disposed on the third Y-axis driver, and the third Y-axis driver is configured to drive the second inspection device to move along the Y-axis.

7. The automatic AOI detection chip mounter according to claim 1, wherein the feeding mechanism includes a support, a fourth driving device, and a plurality of trays, the support is fixed on the base, the fourth driving device is disposed on the support, a side of the support away from the material taking mechanism is a tray placing side, a side of the support close to the material taking mechanism is a feeding side, and the fourth driving device is configured to move the trays from the tray placing side to the feeding side and return the trays from the feeding side to the tray placing side.

8. The full-automatic AOI detection chip mounter according to claim 7, wherein the feeding mechanism includes a brushing device, the brushing device is disposed on the bracket, and the brushing device is configured to place mounting accessories on the tray during movement of the tray from the tray placing side to the feeding side.

9. The automatic AOI detection chip mounter according to claim 1, wherein a waste material box is further arranged on the base, and the waste material box is used for placing bad mounting accessories taken by the chip mounter.

10. The full-automatic AOI detection chip mounter according to any one of claims 1 to 9, wherein the number of the material taking mechanisms, the chip mounting station and the first detection device is two, and the two material taking mechanisms, the chip mounting station and the first detection device are respectively arranged on two sides of the detection station.