CN112007868A - Chip capacitor detection equipment - Google Patents
Chip capacitor detection equipment Download PDFInfo
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- CN112007868A CN112007868A CN202010779185.6A CN202010779185A CN112007868A CN 112007868 A CN112007868 A CN 112007868A CN 202010779185 A CN202010779185 A CN 202010779185A CN 112007868 A CN112007868 A CN 112007868A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
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- Testing Electric Properties And Detecting Electric Faults (AREA)
- Specific Conveyance Elements (AREA)
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Abstract
本发明属于芯片电容器测试领域,具体涉及一种芯片电容器检测设备,包括用于芯片电容器上料的上料装置,用于检测芯片电容器电性能的电性能检测装置,用于收纳电性能不良品的电性能不良品料盘,用于测试芯片电容器外观的外观检测装置,用于收纳传送检测合格的芯片电容器的合格品下料装置,用于收纳外观不良品的外观不良料盘,用于吸附抓取芯片电容器,并转动变换芯片电容器的工位的转盘传送装置;其中,上料装置、电性能检测装置、电性能不良品料盘、外观检测装置、合格品下料装置、外观不良料盘成圆形依次排列在转盘传送装置的外侧。
The invention belongs to the field of chip capacitor testing, and in particular relates to a chip capacitor testing device, comprising a feeding device for chip capacitor feeding, an electrical performance testing device for testing the electrical performance of chip capacitors, and an electrical performance testing device for accommodating defective electrical performance products. Defective product tray for electrical performance, appearance inspection device for testing the appearance of chip capacitors, qualified product blanking device for receiving and conveying qualified chip capacitors, poor appearance tray for storing defective appearance products, used for adsorption and grasping Take the chip capacitor and rotate the turntable conveying device for changing the position of the chip capacitor; wherein, the feeding device, the electrical performance detection device, the electrical performance defective product tray, the appearance detection device, the qualified product blanking device, and the appearance defective material tray are formed. The circles are arranged in sequence on the outside of the carousel.
Description
技术领域technical field
本发明属于芯片电容器测试领域,具体涉及一种芯片电容器检测设备。The invention belongs to the field of chip capacitor testing, in particular to a chip capacitor testing device.
背景技术Background technique
芯片电容器在生产完成后,需要对其进行电性能检测、以及外观检测,现有的芯片电容器检测大多采用人工的方式。采用人工的缺点有:1、工作效率较低;2、人工成本费用较高。3、生产周期长。4、周转成本较高。5、能耗较高。6、人工检查标准一致性不高等。After the chip capacitor is produced, it needs to be tested for its electrical properties and appearance. Most of the existing chip capacitors are tested manually. The disadvantages of using labor are: 1. Low work efficiency; 2. High labor cost. 3. Long production cycle. 4. The turnover cost is high. 5. High energy consumption. 6. The consistency of manual inspection standards is not high.
因此,现有技术还有待于改进和发展。Therefore, the existing technology still needs to be improved and developed.
发明内容SUMMARY OF THE INVENTION
本发明要解决的技术问题在于,针对现有技术的上述缺陷,提供一种芯片电容器检测设备,以解决现有的人工检测芯片电容器导致的工作效率较低、成本费用较高、生产周期长、周转成本较高、能耗较高、检查标准一致性不高等问题。The technical problem to be solved by the present invention is to provide a chip capacitor detection device in view of the above-mentioned defects of the prior art, so as to solve the problems of low work efficiency, high cost, long production cycle, low work efficiency, high cost and high cost caused by the existing manual detection of chip capacitors. High turnover costs, high energy consumption, inconsistent inspection standards and other issues.
本发明解决其技术问题所采用的技术方案是:提供一种芯片电容器检测设备,包括用于芯片电容器上料的上料装置,用于检测芯片电容器电性能的电性能检测装置,用于收纳电性能不良品的电性能不良品料盘,用于测试芯片电容器外观的外观检测装置,用于收纳传送检测合格的芯片电容器的合格品下料装置,用于收纳外观不良品的外观不良料盘,用于吸附抓取芯片电容器,并转动变换芯片电容器的工位的转盘传送装置;其中,上料装置、电性能检测装置、电性能不良品料盘、外观检测装置、合格品下料装置、外观不良料盘成圆形依次排列在转盘传送装置的外侧。The technical solution adopted by the present invention to solve the technical problem is to provide a chip capacitor detection device, which includes a feeding device for chip capacitor feeding, an electrical performance detection device for detecting the electrical performance of the chip capacitor, and an electrical performance detection device for receiving the electrical performance of the chip capacitor. Electrically defective product tray for defective products, appearance inspection device for testing the appearance of chip capacitors, qualified product unloading device for receiving and transporting qualified chip capacitors, appearance defective tray for storing defective appearance products, A turntable conveying device used for adsorbing and grasping chip capacitors, and rotating and changing the position of chip capacitors; among them, feeding device, electrical performance testing device, electrical performance defective product tray, appearance testing device, qualified product unloading device, appearance The defective material discs are arranged in a circle on the outer side of the turntable conveying device.
本发明的更进一步优选方案是:所述转盘传送装置包括:第一转盘,用于驱动第一转盘转动的第一转盘驱动机构,用于吸附抓取芯片电容器的第一导电吸嘴,用于调整第一导电吸嘴位置的第一位置调整机构,用于推动第一导电吸嘴向下运动的吸嘴气缸机构,以及为第一导电吸嘴提供弹性上升力的弹性上升机构;其中,所述第一位置调整机构设置在第一转盘上,所述吸嘴上下滑动的设置在第一位置调整机构上,所述弹性上升机构设置在第一导电吸嘴和第一位置调整机构之间,所述吸嘴气缸机构设置在第一转盘上方。A further preferred solution of the present invention is that: the turntable conveying device comprises: a first turntable, a first turntable drive mechanism for driving the first turntable to rotate, a first conductive suction nozzle for sucking and grasping the chip capacitor, a first position adjustment mechanism for adjusting the position of the first conductive suction nozzle, a suction nozzle cylinder mechanism for pushing the first conductive suction nozzle downward, and an elastic lifting mechanism for providing elastic lifting force for the first conductive suction nozzle; The first position adjustment mechanism is arranged on the first turntable, the suction nozzle is arranged to slide up and down on the first position adjustment mechanism, and the elastic lifting mechanism is arranged between the first conductive suction nozzle and the first position adjustment mechanism, The suction nozzle cylinder mechanism is arranged above the first turntable.
本发明的更进一步优选方案是:所述第一位置调整机构包括第一吸嘴安装块、第一吸嘴调节块、第一调节螺杆组件、以及第二调节螺杆组件;所述第一吸嘴调节块沿第一方向滑动设置在第一转盘上,所述第一吸嘴安装块沿第二方向滑动设置在第一吸嘴调节块上,所述第一调节螺杆组件驱动第一吸嘴调节块沿第一方向滑动,所述第二调节螺杆组件驱动第一吸嘴安装块沿第二方向移动,所述第一导电吸嘴安装在第一吸嘴安装块上,所述第一方向与第二方向相互垂直;A further preferred solution of the present invention is that: the first position adjustment mechanism includes a first suction nozzle mounting block, a first suction nozzle adjustment block, a first adjustment screw assembly, and a second adjustment screw assembly; the first suction nozzle The adjustment block is slidably arranged on the first turntable along the first direction, the first suction nozzle mounting block is slidably arranged on the first suction nozzle adjustment block along the second direction, and the first adjustment screw assembly drives the first suction nozzle to adjust The block slides along the first direction, the second adjusting screw assembly drives the first suction nozzle mounting block to move along the second direction, the first conductive suction nozzle is mounted on the first suction nozzle mounting block, and the first direction is the same as that of the first suction nozzle mounting block. The second directions are perpendicular to each other;
所述弹性上升机构包括滑动穿设在第一吸嘴安装块上的吸嘴安装杆,套设在吸嘴安装杆上的第一压缩弹簧,滑动穿设在第一吸嘴安装块上且与吸嘴安装杆平行的导向杆,两端分别固定连接导向杆与吸嘴安装杆的连接块,以及套设在导向杆上第二压缩弹簧;所述第一导电吸嘴固定在吸嘴安装杆一端,所述第一压缩弹簧两端分别连接吸嘴安装杆的另一端和第一吸嘴安装块;所述第二压缩弹簧的两端分别连接第一吸嘴安装块和连接块。The elastic lifting mechanism includes a suction nozzle installation rod slidably penetrated on the first suction nozzle installation block, a first compression spring sleeved on the suction nozzle installation rod, slidably penetrated on the first suction nozzle installation block and connected with the first suction nozzle installation block. The guide rod is parallel to the suction nozzle installation rod, and the connecting blocks connecting the guide rod and the suction nozzle installation rod are respectively fixed at both ends, and a second compression spring is sleeved on the guide rod; the first conductive suction nozzle is fixed on the suction nozzle installation rod At one end, the two ends of the first compression spring are respectively connected to the other end of the suction nozzle installation rod and the first suction nozzle installation block; the two ends of the second compression spring are respectively connected to the first suction nozzle installation block and the connection block.
本发明的更进一步优选方案是:所述上料装置包括:用于放置料盒的第一料盒托盘,用于调整第一料盒托盘位置的第一XY移动平台,以及用第一料盒托盘定位的第一CCD相机组件,所述第一料盒托盘上设置有多个与料盒形状相适应的料盒槽。A further preferred solution of the present invention is: the feeding device comprises: a first material box tray for placing the material box, a first XY moving platform for adjusting the position of the first material box tray, and a first material box A first CCD camera assembly for pallet positioning, the first material box pallet is provided with a plurality of material box grooves adapted to the shape of the material box.
本发明的更进一步优选方案是:所述电性能检测装置包括测试架,设置在测试架上的第一电极测试台,设置在第一电极测试台上方可伸缩的第二电极顶针,以及用于芯片电容器电性能测试的测试仪,所述第一电极测试台、第二电极顶针与测试仪相连接,所述第二电极顶针滑动穿设在测试架上;其中,所述第一导电吸嘴吸附抓取芯片电容器且与其一电极板连接并向下移动,依次完成第一导电吸嘴的侧面与第二电极顶针接触,以及芯片电容器作为另一电极板的下端与第一电极测试台接触,形成测试回路。A further preferred solution of the present invention is that: the electrical performance detection device includes a test stand, a first electrode test stand arranged on the test stand, a retractable second electrode thimble provided above the first electrode test stand, and a A tester for testing the electrical performance of chip capacitors, the first electrode test table and the second electrode thimble are connected to the tester, and the second electrode thimble is slidably passed through the test frame; wherein, the first conductive suction nozzle Adsorbing and grabbing the chip capacitor and connecting it to one of its electrode plates and moving it downward, completing the contact between the side of the first conductive suction nozzle and the second electrode thimble, and the chip capacitor as the lower end of the other electrode plate in contact with the first electrode test table, Form a test loop.
本发明的更进一步优选方案是:所述外观测试机构包括依次设置在第一转盘一侧的第一上端面检测组件、第二上端面检测组件、第二转盘,设置在第二转盘上的第二导电吸嘴,设置在第二转盘一侧的第一下端面检测组件、第二下端面检测组件;所述第一转盘上第一导电吸嘴吸附抓取芯片电容器经过第一上端面检测组件或第二上端面检测组件后,由第二转盘上的第二导电吸嘴吸附抓取第一导电吸嘴上的芯片电容器并传送至第一下端面检测组件、第二下端面检测组件。A further preferred solution of the present invention is that: the appearance testing mechanism includes a first upper end surface detection component, a second upper end surface detection component, and a second turntable arranged on one side of the first turntable in sequence, and the first upper end surface detection component arranged on the second turntable is arranged on the second turntable. Two conductive suction nozzles, a first lower end surface detection component and a second lower end surface detection component disposed on one side of the second turntable; the first conductive suction nozzle on the first turntable adsorbs and grabs the chip capacitor through the first upper end surface detection component Or after the second upper end surface detection component, the second conductive suction nozzle on the second turntable sucks and grabs the chip capacitor on the first conductive suction nozzle and transmits it to the first lower end surface detection component and the second lower end surface detection component.
本发明的更进一步优选方案是:所述合格品下料装置包括:用于放置且调整料盒高度的升降料盒机构,用于调节料盒位置的第二XY移动平台,用于料盒下料的传送带机构,以及用于抓取料盒的夹爪机构;所述第一转盘、传送带机构分别设置在第二XY移动平台的两端,所述升降料盒机构设置在传送带机构和第二XY移动平台之间,所述夹爪机构可移动至传送带机构、第二XY移动平台、升降料盒机构上方取放料盒。A further preferred solution of the present invention is that: the qualified product unloading device includes: a lifting and lowering box mechanism for placing and adjusting the height of the material box, a second XY moving platform for adjusting the position of the material box, for lowering the material box The conveyor belt mechanism for the material, and the jaw mechanism for grabbing the material box; the first turntable and the conveyor belt mechanism are respectively arranged at both ends of the second XY moving platform, and the lifting and lowering material box mechanism is arranged on the conveyor belt mechanism and the second Between the XY moving platforms, the gripper mechanism can move to the top of the conveyor belt mechanism, the second XY moving platform, and the lifting and lowering material box mechanism to pick up and place the material box.
本发明的更进一步优选方案是:所述第二XY移动平台包括:用于放置料盒的第二料盒托盘,设置在第二料盒托盘上用于固定料盒的第一料盒夹爪,用于驱动第二料盒托盘平移往返于第一导电吸嘴和传送带机构的第一平移电缸,以及设置在第二料盒托盘和第一平移电缸之间用于调整第二料盒托盘位置的第二平移电缸;所述第一平移电缸的运动方向与第二平移电缸的运动方向相互垂直。A further preferred solution of the present invention is that: the second XY moving platform includes: a second material box tray for placing the material box, and a first material box gripper disposed on the second material box tray for fixing the material box , a first translation electric cylinder for driving the second material box tray to move back and forth between the first conductive suction nozzle and the conveyor belt mechanism, and a first translation electric cylinder arranged between the second material box tray and the first translation electric cylinder for adjusting the second material box The second translation electric cylinder at the tray position; the movement direction of the first translation electric cylinder and the movement direction of the second translation electric cylinder are perpendicular to each other.
本发明的更进一步优选方案是:所述芯片电容器检测设备还包括设置在电性能检测装置和电性能不良品料盘之间的电性能良品下料装置,所述电性能良品下料装置包括用于装载芯片电容器的电性能良品料盘,以及用于驱动电性能良品料盘调整位置的第三XY移动平台。A further preferred solution of the present invention is that: the chip capacitor testing equipment further includes a material blanking device for good electrical properties disposed between the electrical property testing device and the material tray for products with poor electrical properties, and the material blanking device for good electrical properties includes a It is used for loading the good electrical performance tray for chip capacitors, and the third XY moving platform for driving the adjustment position of the good electronic performance tray.
本发明的更进一步优选方案是:所述吸嘴气缸机构包括气缸安装盘,设置在第一转盘一侧的用于支撑气缸安装盘的安装支架,至少五个设置在气缸安装盘上的吸嘴驱动气缸,以及固定在气缸安装盘上的旋转辅助件,所述第一转盘与旋转辅助件转动连接,所述五个吸嘴驱动气缸分别设置在与上料装置、电性能良品下料装置、电性能检测装置、合格品下料装置、第二转盘相对应的位置。A further preferred solution of the present invention is that: the suction nozzle cylinder mechanism includes a cylinder mounting plate, a mounting bracket arranged on one side of the first turntable for supporting the cylinder mounting plate, and at least five suction nozzles arranged on the cylinder mounting plate A driving cylinder and a rotating auxiliary piece fixed on the cylinder mounting plate, the first turntable is rotatably connected with the rotating auxiliary piece, and the five suction nozzle driving cylinders are respectively arranged on the feeding device, the unloading device with good electrical performance, The corresponding position of the electrical performance detection device, the qualified product blanking device, and the second turntable.
本发明的有益效果在于,通过上料装置、电性能检测装置、电性能不良品料盘、外观检测装置、合格品下料装置、外观不良料盘,可以分别完成芯片电容器的上料、电性能测试、电性能不良品下料、外观检测、合格品下料、以及外观不良品下料,再通过转盘传送装置可实现芯片电容器在各个装置之间的传送,整个检测挑选过程均通过机械完成,有效的提高检测效率、降低检测成本、缩短生产周期长、降低周转成本较高、缩小能耗、保证了检查标准的一致性。The beneficial effect of the present invention is that, through the feeding device, the electrical performance detection device, the material tray for poor electrical performance, the appearance detection device, the unloading device for qualified products, and the poor appearance tray, the feeding and electrical performance of the chip capacitor can be completed respectively. Testing, unloading of defective electrical properties, appearance inspection, unloading of qualified products, and unloading of unqualified products, and then the transfer of chip capacitors between various devices can be realized through the turntable transfer device. The entire testing and selection process is completed by machinery. Effectively improve inspection efficiency, reduce inspection cost, shorten production cycle, reduce high turnover cost, reduce energy consumption, and ensure the consistency of inspection standards.
附图说明Description of drawings
下面将结合附图及实施例对本发明作进一步说明,附图中:The present invention will be further described below in conjunction with the accompanying drawings and embodiments, in which:
图1是本发明的芯片电容器检测设备的结构示意图;1 is a schematic structural diagram of a chip capacitor detection device of the present invention;
图2是本发明的芯片电容器检测设备(转盘传送装置)的结构示意图;2 is a schematic structural diagram of a chip capacitor detection device (turntable conveying device) of the present invention;
图3是本发明的转盘传送装置的结构示意图;Fig. 3 is the structural representation of the turntable conveying device of the present invention;
图4是本发明的转盘传送装置(省略吸嘴气缸机构)的结构示意图;4 is a schematic structural diagram of the turntable conveying device of the present invention (with the suction nozzle cylinder mechanism omitted);
图5是图4中A部位的局部放大图;Fig. 5 is the partial enlarged view of A part among Fig. 4;
图6是本发明的第一位置调整机构和弹性上升机构的结构示意图;6 is a schematic structural diagram of the first position adjustment mechanism and the elastic lifting mechanism of the present invention;
图7是本发明的上料装置的结构示意图;Fig. 7 is the structural representation of the feeding device of the present invention;
图8是本发明的电性能检测装置的平面结构示意图;8 is a schematic plan view of the electrical performance detection device of the present invention;
图9是图8中B部位的局部放大图;Fig. 9 is a partial enlarged view of part B in Fig. 8;
图10是本发明的外观检测装置的结构示意图;Fig. 10 is the structural representation of the appearance detection device of the present invention;
图11是本发明的合格品下料装置的结构示意图;Fig. 11 is the structural representation of the qualified product blanking device of the present invention;
图12是本发明的第二XY移动平台的结构示意图;Fig. 12 is the structural representation of the second XY moving platform of the present invention;
图13是本发明的升降料盒机构的结构示意图;13 is a schematic structural diagram of the lifting and lowering material box mechanism of the present invention;
图14是本发明的传送带机构的结构示意图;Fig. 14 is the structural representation of the conveyor belt mechanism of the present invention;
图15是本发明的电性能良品下料装置的结构示意图。FIG. 15 is a schematic structural diagram of the feeding device for good electrical properties of the present invention.
具体实施方式Detailed ways
本发明提供一种芯片电容器检测设备,为使本发明的目的、技术方案及效果更加清楚、明确,以下参照附图并举实施例对本发明进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。The present invention provides a chip capacitor detection device. In order to make the purpose, technical solutions and effects of the present invention clearer and clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
如图1-14所示,本实施例的芯片电容器检测设备,包括用于芯片电容器91上料的上料装置1,用于检测芯片电容器91电性能的电性能检测装置2,用于收纳电性能不良品的电性能不良品料盘3,用于测试芯片电容器91外观的外观检测装置4,用于收纳传送检测合格的芯片电容器91的合格品下料装置5,用于收纳外观不良品的外观不良料盘6,用于吸附抓取芯片电容器91,并转动变换芯片电容器91工位的转盘传送装置7;其中,上料装置1、电性能检测装置2、电性能不良品料盘3、外观检测装置4、合格品下料装置5、外观不良料盘6成圆形依次排列在转盘传送装置7的外侧。As shown in FIGS. 1-14 , the chip capacitor testing device of this embodiment includes a
通过上料装置1、电性能检测装置2、电性能不良品料盘3、外观检测装置4、合格品下料装置5、外观不良料盘6,可以分别完成芯片电容器91的上料、电性能测试、电性能不良品下料、外观检测、合格品下料、以及外观不良品下料,再通过转盘传送装置可实现芯片电容器91在各个装置之间的传送,整个检测挑选过程均通过机械完成,有效的提高检测效率、降低检测成本、缩短生产周期长、降低周转成本较高、缩小能耗、保证了检查标准的一致性。Through the
进一步的,如图1、图3、图4、图5、图6所示,所述转盘传送装置7包括:第一转盘71,用于驱动第一转盘转动的第一转盘驱动机构72,用于吸附抓取芯片电容器91的第一导电吸嘴73,用于调整第一导电吸嘴73位置的第一位置调整机构74,用于推动第一导电吸嘴73向下运动的吸嘴气缸机构75,以及为第一导电吸嘴73提供弹性上升力的弹性上升机构76;其中,所述第一位置调整机构74设置在第一转盘71上,所述吸嘴上下滑动的设置在第一位置调整机构74上,所述弹性上升机构76设置在第一导电吸嘴73和第一位置调整机构74之间,所述吸嘴气缸机构75设置在第一转盘71上方。Further, as shown in FIG. 1 , FIG. 3 , FIG. 4 , FIG. 5 , and FIG. 6 , the
其中,所述第一转盘驱动机构72包括电机和分割器。Wherein, the first
通过第一位置调整机构74可用于调整第一导电吸嘴73的位置,有效的降低第一导电吸嘴73与第一转盘71之间的装配精度要求,降低生产成本。通过吸嘴气缸机构75与弹性上升机构76的配合,可以驱动第一导电吸嘴73的上下运动,实现机械化的抓取芯片电容器91,方便快捷。The first
进一步的,如图1、图3、图4、图5、图6所示,所述第一位置调整机构74包括第一吸嘴安装块741、第一吸嘴调节块742、第一调节螺杆组件743、以及第二调节螺杆组件744;所述第一吸嘴调节块742沿第一方向滑动设置在第一转盘71上,所述第一吸嘴安装块741沿第二方向滑动设置在第一吸嘴调节块742上,所述第一调节螺杆组件743驱动第一吸嘴调节块742沿第一方向滑动,所述第二调节螺杆组件744驱动第一吸嘴安装块741沿第二方向移动,所述第一导电吸嘴73安装在第一吸嘴安装块741上,所述第一方向与第二方向相互垂直;Further, as shown in FIG. 1 , FIG. 3 , FIG. 4 , FIG. 5 , and FIG. 6 , the first
其中,所述第一调节螺杆组件743转动设置在第一转盘71上,一端与第一吸嘴调节块742螺纹连接,通过转动第一调节螺杆组件743即可调整第一吸嘴调节块742的位置;所述第二调节螺杆组件744转动设置在第一吸嘴调节块742上,一端与第一吸嘴安装块741螺纹连接,通过转动第二调节螺杆组件744即可调整第一吸嘴安装块741的位置。The first adjusting
通过第一调节螺杆组件743、以及第二调节螺杆组件744分别调节第一吸嘴安装块741、第一吸嘴调节块742的位置,即可调节安装在第一吸嘴安装块741上的第一导电吸嘴73的位置,方便快捷。By adjusting the positions of the first suction
其中,第一吸嘴调节块742和第一转盘71之间设置有用于引导第一吸嘴调节块742沿第一方向滑动的凹槽与凸起,所述第一吸嘴调节块742和第一吸嘴安装块741之间设置有用于引导第一吸嘴安装块741沿第二方向滑动的凹槽与凸起。所述第一导电吸嘴73的位置调整完成后,通过螺栓对第一位置调整机构74进行固定。Wherein, grooves and protrusions are provided between the first suction
进一步的,如图1、图3、图4、图5、图6所示,所述弹性上升机构76包括滑动穿设在第一吸嘴安装块741上的吸嘴安装杆761,套设在吸嘴安装杆761上的第一压缩弹簧762,滑动穿设在第一吸嘴安装块741上且与吸嘴安装杆761平行的导向杆763,两端分别固定连接导向杆763与吸嘴安装杆761的连接块764,以及套设在导向杆763上第二压缩弹簧765;所述第一导电吸嘴73固定在吸嘴安装杆761一端,所述第一压缩弹簧762两端分别连接吸嘴安装杆761的另一端和第一吸嘴安装块741;所述第二压缩弹簧765的两端分别连接第一吸嘴安装块741和连接块764。Further, as shown in FIG. 1 , FIG. 3 , FIG. 4 , FIG. 5 , and FIG. 6 , the
通过增加第一压缩弹簧762可为第一导电吸嘴73提供弹性上升力,结构简单,有效的降低生产成本。再通过增加导向杆763、连接块764可以用于引导吸嘴安装杆761的运动方向,保证第一导电吸嘴73运动的稳定性。By adding the
进一步的,如图1、图3所示,所述吸嘴气缸机构75包括气缸安装盘751,设置在第一转盘71一侧的用于支撑气缸安装盘751的安装支架752,至少五个设置在气缸安装盘751上的吸嘴驱动气缸753,以及固定在气缸安装盘751上的旋转辅助件754,所述第一转盘71与旋转辅助件754转动连接,所述五个吸嘴驱动气缸753分别设置在与上料装置1、电性能良品下料装置8、电性能检测装置2、合格品下料装置5、第二转盘43相对应的位置。Further, as shown in FIG. 1 and FIG. 3 , the suction
通过吸嘴驱动气缸753可推动吸嘴安装杆761向下运动,即推动第一导电吸嘴73向下运动,跟弹性上升机构76配合即可实现第一导电吸嘴73的高度调整。本实施例中,所述第一导电吸嘴73设置有16个,所述吸嘴驱动气缸753设置有5个,通过在上料装置1、电性能良品下料装置8、电性能检测装置2、合格品下料装置5、第二转盘43等需要调节高度的位置设置吸嘴安装杆761即可实现高度的调整,无需将吸嘴安装杆761与第一导电吸嘴73的数量一一对应,可以有效的降低生产成本。通过增加旋转辅助件754,可以用于辅助第一转盘71的旋转,提高第一转盘71转动时的稳定性。The suction
进一步的,如图1、图7所示,所述上料装置1包括:用于放置料盒92的第一料盒托盘11,用于调整第一料盒托盘11位置的第一XY移动平台12,以及用第一料盒托盘11定位的第一CCD相机组件13,所述第一料盒托盘11上设置有多个与料盒92形状相适应的料盒槽(图中未示出)。Further, as shown in FIGS. 1 and 7 , the
本实施例中,所述料盒槽设置有6个,所述第一XY移动平台12驱动第一料盒托盘11在平面内运动,即可将料盒92传送至第一导电吸嘴73下方,由第一导电吸嘴73抓取料盒92中的芯片电容器91,实现上料。其中,所述第一CCD相机组件13可用于检测料盒92的位置,保证芯片电容器91的正常进行。In this embodiment, there are 6 material box slots, and the first
进一步的,如图1、图2、图8、图9所示,所述电性能检测装置2包括测试架21,设置在测试架21上的第一电极测试台22,设置在第一电极测试台22上方可伸缩的第二电极顶针23,以及用于芯片电容器91电性能测试的测试仪24,所述第一电极测试台22、第二电极顶针23与测试仪24相连接,所述第二电极顶针23滑动穿设在测试架21上;其中,所述第一导电吸嘴73吸附抓取芯片电容器91且与其一电极板连接并向下移动,依次完成第一导电吸嘴73的侧面与第二电极顶针接触23,以及芯片电容器91作为另一电极板的下端与第一电极测试台22接触,形成测试回路。Further, as shown in FIG. 1 , FIG. 2 , FIG. 8 , and FIG. 9 , the electrical performance detection device 2 includes a
通过第一导电吸嘴73抓取固定芯片电容器91并与芯片电容器91的其一电极板连接,其中第二电极顶针23可伸缩的设置在第一电极测试台22上方,当第一导电吸嘴73向下运动时,碰到到第一导电吸嘴73的第二电极顶针23会收缩并抵靠在第一导电吸嘴73侧面,直至第一导电吸嘴73上的芯片电容器91的另一电极板的下端接触第一电极测试台22形成测试回路,即可配合测试仪24进行电性能测试,方便快捷,有效的缩短测试时间,提高测试效率。The chip capacitor 91 is grasped and fixed by the first
进一步的,如图1、图2、图10所示,所述外观测试机构4包括依次设置在第一转盘71一侧的第一上端面检测组件41、第二上端面检测组件42、第二转盘43,设置在第二转盘43上的第二导电吸嘴44,设置在第二转盘43一侧的第一下端面检测组件45、第二下端面检测组件46;所述第一转盘71上第一导电吸嘴73吸附抓取芯片电容器91经过第一上端面检测组件41或第二上端面检测组件42后,由第二转盘43上的第二导电吸嘴44吸附抓取第一导电吸嘴73上的芯片电容器91并传送至第一下端面检测组件45或第二下端面检测组件46。Further, as shown in FIG. 1 , FIG. 2 , and FIG. 10 , the appearance testing mechanism 4 includes a first upper end
其中,所述第一上端面检测组件41、第二上端面检测组件42、第一下端面检测组件45、第二下端面检测组件46均为CCD相机组件,两者的检测焦距不同;其中,所述第一上端面检测组件41、第一下端面检测组件45用于配合检测一种尺寸的芯片电容器91;所述第二上端面检测组件42、第二下端面检测组件46用于配合检测另一种尺寸的芯片电容器91。Wherein, the first upper end
其中,所述第二导电吸嘴44的抓取方向与第一导电吸嘴73的抓取方向相反,通过第二导电吸嘴44、第一导电吸嘴73的配合,即可实现芯片电容器91两个端面的检测,方便快捷。The grasping direction of the second
其中,所述第一转盘71通过第一导电吸嘴73带动芯片电容器91经过第一上端面检测组件41或第二上端面检测组件42上方,完成芯片电容器91上端面的检测后,由第二转盘43上的第二导电吸嘴44吸附抓取第一导电吸嘴73上的芯片电容器91(此时芯片电容器91的下端面露出)。再经过第一下端面检测组件45或第二下端面检测组件46即可完成芯片电容器91两个端面的检测。The
进一步的,如图1、图2、图11所示,所述合格品下料装置5包括:用于放置且升降调整料盒92位置的升降料盒机构51,用于调节料盒92位置的第二XY移动平台52,用于料盒92下料的传送带机构53,以及用于抓取料盒92的夹爪机构54;所述第一转盘71、传送带机构53分别设置在第二XY移动平台52的两端,所述升降料盒机构51设置在传送带机构53和第二XY移动平台52之间,所述夹爪机构54可移动至传送带机构53、第二XY移动平台52、升降料盒机构51上方取放料盒92。Further, as shown in FIG. 1 , FIG. 2 , and FIG. 11 , the qualified
通过升降料盒机构51可用于提供料盒92,再通过夹爪机构54可将空的料盒92抓取到第二XY移动平台52上,由第二XY移动平台52将空料盒92传送至第一导电吸嘴73下方,由第一导电吸嘴73进行装盒,完成装盒的料盒92在第二XY移动平台52的带动到达传送带机构53的一端,通过夹爪机构54抓取料盒92传送至传送带机构53上完成下料。本合格品下料装置5无需人工介入即可实现芯片电容器91的装盒下料,下料时间短,生产效率高。The lifting and lowering
其中,如图1、图2、图11、图13所示,所述升降料盒机构51包括:用于放置料盒92的料盒架511,设置在料盒架511内用于驱动料盒92上下运动的升降架512,以及驱动升降架512上下运动的升降电缸513。通过增加料盒架511即可用于放置空料盒92,为芯片电容器91的下料提供保护的载体。通过升降架512、升降电缸513可以用于调整料盒92的高度,方便夹爪机构54进行夹取,提高工作效率。本实施例中,所述料盒架511上部设置有感应料盒92高度的传感器514,可与升降电缸513配合自动调节料盒92的高度。Among them, as shown in FIGS. 1 , 2 , 11 , and 13 , the lifting and lowering
其中,如图1、图2、图11、图14所示,所述夹爪机构54包括:用于夹取料盒92的第二料盒夹爪541,用于驱动第二料盒夹爪541平移的的第三平移电缸542,以及用于驱动第二料盒夹爪541上下运动的第二升降电缸543。通过第二升降电缸543和第二料盒夹爪541的配合可对料盒92进行夹取或放下的动作,再通过第三平移电缸542可带动料盒92往返于传送带机构53、第二XY移动平台52、升降料盒机构51上方,实现料盒92的传递。Wherein, as shown in FIGS. 1 , 2 , 11 and 14 , the
其中,如图1、图2、图11、图12所示,所述第二XY移动平台52包括:用于放置料盒92的第二料盒托盘521,设置在第二料盒托盘521上用于固定料盒92的第一料盒夹爪522,用于驱动第二料盒托盘521平移往返于第一导电吸嘴73和传送带机构53的第一平移电缸523,以及设置在第二料盒托盘521和第一平移电缸523之间用于调整第二料盒托盘521位置的第二平移电缸524;所述第一平移电缸523的运动方向与第二平移电缸524的运动方向相互垂直。Among them, as shown in FIGS. 1 , 2 , 11 and 12 , the second
通过第一平移电缸523、第二平移电缸524可以用于移动第二料盒托盘521,即调整料盒92的位置方便第一导电吸嘴73进行芯片电容器91的下料,同时也可以带动料盒92往返于吸嘴1和传送带机构5之间。再通过增加第一料盒夹爪522,可用于固定第二料盒托盘521上的料盒92,防止在移动过程中料盒92松动掉落。The first translating
进一步的,如图1、图2、图15所示,所述芯片电容器91检测设备还包括设置在电性能检测装置2和电性能不良品料盘3之间的电性能良品下料装置8,所述电性能良品下料装置8包括用于装载芯片电容器91的电性能良品料盘81,以及用于驱动电性能良品料盘调整位置的第三XY移动平台82。Further, as shown in FIG. 1 , FIG. 2 and FIG. 15 , the chip capacitor 91 detection equipment also includes an electrical performance good
通过第三XY移动平台82可驱动电性能良品料盘81调整位置至第一导电吸嘴73下方,进行芯片电容器91的下料。在芯片电容器91的生产过程中,由于客户对不同产品的要求不同,会导致芯片电容器91的检测过程不同。其中,增加电性能良品下料装置8是为了满足对外观要求不高的芯片电容器91的生产需求,在进行电学性能测试后可直接进行下料。The third
应当理解的是,以上实施例仅用以说明本发明的技术方案,而非对其限制,对本领域技术人员来说,可以对上述实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而所有这些修改和替换,都应属于本发明所附权利要求的保护范围。It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them. For those skilled in the art, the technical solutions recorded in the above embodiments can be modified, or some of the technical features can be modified. Equivalent replacements are made; and all such modifications and replacements shall fall within the protection scope of the appended claims of the present invention.
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| CN112742745A (en) * | 2021-01-21 | 2021-05-04 | 金动力智能科技(深圳)有限公司 | Product implanter |
| CN112742749A (en) * | 2020-12-16 | 2021-05-04 | 扬州日精电子有限公司 | Energizing wire-breaking detection device of metallized film capacitor welding machine |
| CN113053765A (en) * | 2021-03-08 | 2021-06-29 | 常州雷射激光设备有限公司 | Detection equipment for semiconductor diode chip |
| CN113589146A (en) * | 2021-07-29 | 2021-11-02 | 武汉云岭光电有限公司 | Method and system for testing edge-emitting semiconductor laser chip |
| CN113640314A (en) * | 2021-10-14 | 2021-11-12 | 深圳市赛元微电子有限公司 | A semiconductor quality detection device and method |
| CN113857083A (en) * | 2021-10-14 | 2021-12-31 | 肇庆华鑫隆自动化设备有限公司 | A capacitor high voltage tester |
| CN114011751A (en) * | 2021-10-27 | 2022-02-08 | 光子(深圳)精密科技有限公司 | Automatic detection equipment for ceramic core of electronic cigarette |
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| CN114289339A (en) * | 2021-12-10 | 2022-04-08 | 郑州信大捷安信息技术股份有限公司 | Automatic chip detection method and device |
| CN114560292A (en) * | 2022-01-26 | 2022-05-31 | 福州派利德电子科技有限公司 | Automatic detection device and detection method for integrated circuit chip translation type sorting machine |
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| CN115365172A (en) * | 2022-09-14 | 2022-11-22 | 湖北航天技术研究院计量测试技术研究所 | Sieving device and sieving method for patch tantalum capacitor detection |
| CN115555297A (en) * | 2022-10-13 | 2023-01-03 | 宏齐光电子(深圳)有限公司 | Full-automatic chip detection equipment |
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Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112742749A (en) * | 2020-12-16 | 2021-05-04 | 扬州日精电子有限公司 | Energizing wire-breaking detection device of metallized film capacitor welding machine |
| CN112742749B (en) * | 2020-12-16 | 2022-08-09 | 扬州日精电子有限公司 | Energizing wire-breaking detection device of metallized film capacitor welding machine |
| CN112742745A (en) * | 2021-01-21 | 2021-05-04 | 金动力智能科技(深圳)有限公司 | Product implanter |
| CN113053765A (en) * | 2021-03-08 | 2021-06-29 | 常州雷射激光设备有限公司 | Detection equipment for semiconductor diode chip |
| CN113589146A (en) * | 2021-07-29 | 2021-11-02 | 武汉云岭光电有限公司 | Method and system for testing edge-emitting semiconductor laser chip |
| CN114130686A (en) * | 2021-10-09 | 2022-03-04 | 美的集团股份有限公司 | Detection system |
| CN113640314A (en) * | 2021-10-14 | 2021-11-12 | 深圳市赛元微电子有限公司 | A semiconductor quality detection device and method |
| CN113857083A (en) * | 2021-10-14 | 2021-12-31 | 肇庆华鑫隆自动化设备有限公司 | A capacitor high voltage tester |
| CN114011751B (en) * | 2021-10-27 | 2023-04-07 | 光子(深圳)精密科技有限公司 | Automatic detection equipment for ceramic core of electronic cigarette |
| CN114011751A (en) * | 2021-10-27 | 2022-02-08 | 光子(深圳)精密科技有限公司 | Automatic detection equipment for ceramic core of electronic cigarette |
| CN114289339A (en) * | 2021-12-10 | 2022-04-08 | 郑州信大捷安信息技术股份有限公司 | Automatic chip detection method and device |
| CN114289339B (en) * | 2021-12-10 | 2023-09-26 | 郑州信大捷安信息技术股份有限公司 | Automatic chip detection method and device |
| CN114560292B (en) * | 2022-01-26 | 2023-11-14 | 福州派利德电子科技有限公司 | Automatic detection device and detection method for integrated circuit chip translation type sorting machine |
| CN114560292A (en) * | 2022-01-26 | 2022-05-31 | 福州派利德电子科技有限公司 | Automatic detection device and detection method for integrated circuit chip translation type sorting machine |
| CN115291031A (en) * | 2022-07-29 | 2022-11-04 | 深圳市标谱半导体股份有限公司 | Electrical property test equipment |
| CN115365172A (en) * | 2022-09-14 | 2022-11-22 | 湖北航天技术研究院计量测试技术研究所 | Sieving device and sieving method for patch tantalum capacitor detection |
| CN115555297B (en) * | 2022-10-13 | 2024-08-20 | 宏齐光电子(深圳)有限公司 | Full-automatic chip detection equipment |
| CN115555297A (en) * | 2022-10-13 | 2023-01-03 | 宏齐光电子(深圳)有限公司 | Full-automatic chip detection equipment |
| CN115672768A (en) * | 2022-11-10 | 2023-02-03 | 长园半导体设备(珠海)有限公司 | Chip detection device |
| CN115744277A (en) * | 2022-11-23 | 2023-03-07 | 苏州艾方芯动自动化设备有限公司 | Chip detection and collection equipment |
| CN116605639A (en) * | 2023-07-19 | 2023-08-18 | 江苏海纳电子科技有限公司 | Material receiving equipment for chip test |
| CN116605639B (en) * | 2023-07-19 | 2023-09-12 | 江苏海纳电子科技有限公司 | Material receiving equipment for chip test |
| CN116944074B (en) * | 2023-07-27 | 2024-01-02 | 佛山市通宝华龙控制器有限公司 | Discharging device of temperature controller processing equipment |
| CN116944074A (en) * | 2023-07-27 | 2023-10-27 | 佛山市通宝华龙控制器有限公司 | Discharging device of temperature controller processing equipment |
| CN117066128A (en) * | 2023-10-16 | 2023-11-17 | 广东昭信智能装备有限公司 | Fingerprint chip test equipment |
| CN117066128B (en) * | 2023-10-16 | 2024-01-16 | 广东昭信智能装备有限公司 | Fingerprint chip test equipment |
| CN119774267A (en) * | 2024-12-04 | 2025-04-08 | 长园半导体设备(苏州)有限公司 | Chip picking and placing mechanism, control method and device thereof, and medium |
| CN119774267B (en) * | 2024-12-04 | 2025-11-14 | 长园半导体设备(苏州)有限公司 | Chip pick-and-place mechanism and its control method, device, and medium |
| CN120587146A (en) * | 2025-07-31 | 2025-09-05 | 广东黄宝石电子科技有限公司 | A visual inspection device and method for aluminum electrolytic capacitors |
| CN120587146B (en) * | 2025-07-31 | 2025-11-21 | 广东黄宝石电子科技有限公司 | A visual inspection device and method for aluminum electrolytic capacitors |
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