CN113493114A - Taking and placing device for testing high-frequency electronic element - Google Patents
Taking and placing device for testing high-frequency electronic element Download PDFInfo
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- CN113493114A CN113493114A CN202010248987.4A CN202010248987A CN113493114A CN 113493114 A CN113493114 A CN 113493114A CN 202010248987 A CN202010248987 A CN 202010248987A CN 113493114 A CN113493114 A CN 113493114A
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- unit
- frequency electronic
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- driven
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/917—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers control arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
Abstract
The invention relates to a pick-and-place device for testing high-frequency electronic elements, which is used for picking and placing at least one high-frequency electronic element into a sealed environment chamber for electrical testing, and the pick-and-place device comprises a horizontal displacement unit, a vertical movement unit and a vacuum adsorption unit, wherein the horizontal displacement unit is controlled to move below the sealed environment chamber, the vertical movement unit is driven by the horizontal displacement unit and can be controlled to move up and down, and the vacuum adsorption unit is controlled to suck and place at least one high-frequency electronic element in a negative pressure mode.
Description
Technical Field
The present invention relates to a pick-and-place device, and more particularly, to a pick-and-place device for testing the package of electronic components in the 5G era.
Background
Referring to fig. 1, after being packaged (packaged), the electronic component 800 is transported to the material moving base 911 to be stacked in order, then is picked from the material moving base 911 by a pick-and-place device and then is placed in the testing base 924, and is tested (testing) in the testing base 924 by another testing machine (not shown) to check whether the electrical performance of the electronic component 800 meets the shipment specification.
The conventional pick-and-place apparatus generally includes a set of rails 801 disposed between a material-moving base 911 and a testing base 924, a set of moving components 802 capable of moving along the rails 801 near the material-moving base 911 and the testing base 924, and a set of suction arms 803 connected to a negative pressure system, wherein the suction arms 803 can be controlled to suck the electronic components 800 placed in the material-moving base 911 under negative pressure when the moved components 802 are brought close to the material-moving base 911, and then are controlled to place the electronic components 800 in the testing base 924 when the moved components 802 are brought close to the testing base 924, so that the electronic components 800 placed in the testing base 924 can be electrically tested by matching with a testing machine.
The design concept of the pick-and-place device is mainly based on the consideration of the inertia of the mechanical device, and the electronic component 800 is sucked and separated from the upper side of the material moving base 911 and the testing seat 924 and placed into the material moving base 911 or the testing seat 924 by the suction arm 803 in the most convenient and reliable manner, and the pick-and-place device can also meet the requirement of testing a plurality of electronic components 800, and can stably pick and place the electronic component 800 to be tested between the material moving base 911 and the testing seat 924.
However, with the advent of the 5G era, the electrical test of the 5G high frequency electronic device 900 is mainly performed by "antenna system packaging test", i.e., the high frequency electronic device 900 to be tested must be placed in a sealed environment chamber 921 (see fig. 6), and the electrical test is performed by, for example, including a plurality of antennas for receiving electrical signals. Since the antenna for receiving the electrical signal in the sealed environment chamber 921 must be designed on the top or around the top to effectively simulate the use requirement for the receiving and transmitting test of the electrical signal, the conventional pick-and-place device cannot correctly place the high frequency electronic component 900 to be tested on the test socket 924 for testing without affecting the electrical signal reception of the plurality of antennas disposed in the sealed environment chamber 921.
Therefore, the conventional pick-and-place device for electrical testing must be redesigned and improved to meet the requirement of testing the high frequency electronic device 900.
Disclosure of Invention
The invention aims to provide a pick-and-place device for electrical test of a 5G high-frequency electronic element.
The invention relates to a taking and placing device for testing high-frequency electronic elements, which is used for taking and placing at least one high-frequency electronic element between a material moving base and a sealed environment chamber for electrical testing so as to carry out electrical testing.
The material moving machine seat comprises a material placing unit for placing high-frequency electronic elements and a mechanical arm for placing the high-frequency electronic elements in the material placing unit, wherein the sealed environment chamber comprises a hollow shell with an opening formed at the bottom and a test seat which is arranged in the hollow shell corresponding to the opening and is used for performing electrical test on at least one high-frequency electronic element.
The taking and placing device comprises a horizontal displacement unit, a vertical moving unit and a vacuum adsorption unit.
The horizontal displacement unit is arranged between the material moving base and the sealed environment chamber and is controlled to move between a first position adjacent to the material placing unit and a second position below the opening.
The vertical moving unit is driven by the horizontal moving unit and can be driven to move up and down to any one of the first position and the second position in a controlled manner.
The vacuum adsorption unit is arranged on the vertical moving unit and is used for sucking and releasing at least one high-frequency electronic element in a negative pressure mode in a controlled mode, when the vertical moving unit is driven to the second position by the horizontal moving unit and the vertical moving unit is driven to move upwards in a controlled mode, the vacuum adsorption unit is driven to penetrate into the hollow shell from the opening and suck and release at least one high-frequency electronic element to the test seat in a negative pressure mode.
Preferably, the horizontal displacement unit includes a rail disposed between the material moving base and the sealed environment chamber, and a stage controllably driven to move on the rail to any one of the first position and the second position.
Preferably, the vertical movement unit includes a transfer arm mounted on the stage, and a lifting unit that can be controlled to drive the transfer arm to move up and down.
Preferably, the vacuum suction unit includes a base mounted on the transfer arm, and a vacuum assembly connected to an external negative pressure system and having at least one suction nozzle.
The invention has the beneficial effects that: the vacuum adsorption unit sends at least one high-frequency electronic element into the sealed environment chamber from the lower part of the sealed environment chamber for electrical test through the mutual matching of the horizontal displacement unit, the vertical movement unit and the vacuum adsorption unit on the installation position.
Drawings
FIG. 1 is a schematic diagram illustrating a conventional pick-and-place apparatus for electrical testing;
FIG. 2 is a schematic top view illustrating an embodiment of the pick-and-place apparatus for high frequency electronic device testing according to the present invention, and further illustrating that the horizontal displacement unit drives the vertical moving unit and the vacuum absorption unit to a first position;
fig. 3 is a schematic top view illustrating the horizontal displacement unit driving the vertical movement unit and the vacuum absorption unit at a second position in cooperation with fig. 2;
FIG. 4 is a partial side view illustrating the vacuum suction unit being lifted up above the material placement unit by the vertical moving unit when the horizontal moving unit of the embodiment of the present invention is at the first position;
fig. 5 is a partial side view illustrating the vertical moving unit lowering the vacuum adsorption unit below the material placing unit when the horizontal moving unit of the embodiment of the present invention is in the first position;
FIG. 6 is a side view illustrating the vacuum suction unit being driven by the vertical moving unit to penetrate into the sealed environmental chamber when the horizontal moving unit of the embodiment of the present invention is at the second position;
fig. 7 is a side view illustrating the vacuum suction unit being withdrawn from the sealed environmental chamber by the vertical moving unit when the horizontal moving unit of the embodiment of the present invention is in the second position.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and examples.
Referring to fig. 2, fig. 3 and fig. 4, an embodiment of the pick-and-place apparatus for testing high frequency electronic devices according to the present invention is used for picking and placing at least one high frequency electronic device 900 between a material moving base 911 and a sealed environment chamber 921 for electrical testing, and in particular, can reliably and stably feed the high frequency electronic device 900 to be tested into the sealed environment chamber 921 for subsequent testing without disturbing the testing condition of the antenna for receiving electrical testing signals in the sealed environment chamber 921.
The material moving base 911 includes a material placing unit 912 for placing the high frequency electronic component 900, and a robot 913 for placing the high frequency electronic component 900 in the material placing unit 912.
As shown in fig. 6, the sealed environment chamber 921 is used for electrical testing of 5G high-frequency electronic devices 900, such as electrical testing suitable for "antenna system package testing", and includes a hollow housing 922 having an opening 923 formed at a bottom thereof, and a testing seat 924 disposed in the hollow housing 922 corresponding to the opening 923 for electrical testing of at least one high-frequency electronic device 900.
The pick-and-place device is used for adsorbing at least one high-frequency electronic component 900 to be tested from the material placing unit 912 and transferring the high-frequency electronic component to the test seat 924 for electrical test, and comprises a horizontal displacement unit 1, a vertical movement unit 2 and a vacuum adsorption unit 3.
Referring to fig. 4, 5, 6, and 7, the horizontal displacement unit 1 is disposed between the material transfer base 911 and the sealed environment chamber 921, and is controlled to move between a first position adjacent to the material placing unit 912 and a second position below the opening 923, in this embodiment, the horizontal displacement unit 1 includes a rail 11 disposed between the material transfer base 911 and the sealed environment chamber 921, and a stage 12 that can be controlled and driven to move on the rail 11 to either the first position or the second position.
The vertical moving unit 2 is driven by the horizontal moving unit 1 and can be controlled to move up and down when being driven to any one of the first position and the second position, in this embodiment, the vertical moving unit 2 includes a transfer arm 21 mounted on the stage 12, and a lifting assembly 22 capable of controlling and driving the transfer arm 21 to move up and down.
The vacuum suction unit 3 is mounted on the vertical moving unit 2, and is used for controllably sucking and discharging the at least one high-frequency electronic component 900 in a negative pressure manner, and comprises a base 31 mounted on the transfer arm 21, and a vacuum assembly 32 connected with an external negative pressure system and provided with at least one suction nozzle 321. When the vertical moving unit 2 is driven to the second position by the horizontal moving unit 1 and the vertical moving unit 2 is controlled to move upward, the vacuum absorbing unit 3 is driven to penetrate into the hollow housing 922 from the opening 923 and absorb and release the at least one high frequency electronic component 900 to the testing seat 924 in a negative pressure manner. In addition, when the vacuum suction unit 3 is driven to penetrate into the hollow housing 922, the vacuum suction unit 3 can further be driven to move along with the horizontal displacement unit 1 driving the vertical movement unit 2 to be driven to a third position above the testing seat 924 to suck and discharge the at least one high-frequency electronic component 900.
Referring to fig. 4 and 5, when the pick-and-place device for testing high frequency electronic components of the present invention is used in an electrical testing process, the robot 913 is used to place a high frequency electronic component 900 to be electrically tested on the material placing unit 912, then the carrier 12 is controlled to bring the vertical moving unit 2 and the vacuum adsorption unit 3 together to the first position close to the material placing unit 912 through the rail 11, then the lifting assembly 22 controls the transfer arm 21 to bring the vacuum adsorption unit 3 upwards to above the material placing unit 912, and the vacuum adsorption unit 3 is then indirectly brought to place the high frequency electronic component 900 by the carrier 12. By activating the external negative pressure system, the vacuum assembly 32 sucks the high-frequency electronic component 900 to be tested through the at least one suction nozzle 321, and then the vacuum sucking unit 3 moves downward along with the transfer arm 21 to return to the position below the material placing unit 912 to prepare for sending the high-frequency electronic component 900 to be tested to the sealed environment chamber 921 for electrical testing.
Referring to fig. 6 and 7, after the suction nozzle 321 sucks the high-frequency electronic component 900 to be tested from the material placing unit 912, the vertical moving unit 2 and the vacuum sucking unit 3 are driven by the carrier 12 along the rail 11 to the second position below the opening 923, and at this time, the transfer arm 21 is controlled to move upward, so that the vacuum sucking unit 3 penetrates into the hollow housing 922 from the opening 923. In the hollow housing 922, the vacuum suction unit 3 moves to the third position above the test seat 924 in cooperation with the movement of the stage 12, releases the high-frequency electronic component 900 to be tested from the suction nozzle 321 and places the high-frequency electronic component on the test seat 924, and then the vacuum suction unit 3 is driven by the transfer arm 21 to exit the hollow housing 922, so that the sealed environment chamber 921 starts to perform an electrical test on the high-frequency electronic component 900 to be tested.
In the process of performing an electrical test on the high-frequency electronic component 900 to be tested, the vertical moving unit 2 and the vacuum absorbing unit 3 move to the first position along with the carrier 12, the vacuum assembly 32 cooperates with the transfer arm 21 to move upward, and after another high-frequency electronic component 900 to be tested is absorbed from the material placing unit 912, the vacuum absorbing unit 3 is indirectly driven by the carrier 12 to bring another high-frequency electronic component 900 to be tested to the second position. After the electrical test of the high-frequency electronic component 900 located in the sealed environment chamber 921 is completed, the vacuum adsorption unit 3 is again driven upward by the transfer arm 21 to enter the hollow housing 922, the tested high-frequency electronic component 900 is first retrieved from the test seat 924, and after the tested high-frequency electronic component 900 is retrieved, another high-frequency electronic component 900 to be tested is placed on the test seat 924 to wait for the electrical test.
After the tested high frequency electronic component 900 is retrieved and the high frequency electronic component 900 to be tested is placed, the transfer arm 21 drives the vacuum suction unit 3 to exit the hollow housing 922, the stage 12 brings the vertical moving unit 2 and the vacuum suction unit 3 to the first position, the tested high frequency electronic component 900 is placed on the material placing unit 912, and the robot 913 retrieves the tested high frequency electronic component 900. Then, the above mentioned process is repeated to pick and place the high frequency electronic device 900 to be tested and the tested high frequency electronic device 900 back and forth between the material placing unit 912 and the sealed environment chamber 921 until the high frequency electronic devices 900 are tested.
In summary, the pick-and-place device for testing high frequency electronic components of the present invention enables the vertical moving unit 2 and the vacuum absorbing unit 3 to move back and forth between the material transferring base 911 and the lower side of the sealed environment chamber 921 through the arrangement of the horizontal moving unit 1; after the vacuum suction unit 3 is further brought to the second position by the carrier 12, the transfer arm 21 extends the vacuum suction unit 3 from bottom to top through the opening 923 into the hollow housing 922, and places at least one high-frequency electronic component 900 on the suction nozzle 321 on the test socket 924. Through the cooperation of the above components, the present invention can provide a new pick-and-place means for the electrical testing process of the 5G high frequency electronic device 900 without being limited by the location of the antenna for receiving electrical signals around the sealed environmental chamber 921, especially at the top, so as to achieve the objective of the present invention.
Claims (4)
1. A pick-and-place device for testing high-frequency electronic elements is used for picking and placing at least one high-frequency electronic element between a material moving base and a sealed environment chamber for electrical testing, the material moving base comprises a material placing unit for placing the high-frequency electronic element and a mechanical arm for placing the high-frequency electronic element on the material placing unit, the sealed environment chamber comprises a hollow shell with an opening formed at the bottom, and a testing seat which is arranged in the hollow shell corresponding to the opening and is used for the electrical testing of the at least one high-frequency electronic element; the method is characterized in that:
the taking and placing device comprises a horizontal displacement unit, a vertical movement unit and a vacuum adsorption unit, wherein the horizontal displacement unit is arranged between the material moving base and the sealed environment chamber and is controlled to move between a first position adjacent to the material placing unit and a second position below the opening, the vertical movement unit is driven by the horizontal displacement unit and can be controlled to move up and down when being driven to any one of the first position and the second position, the vacuum adsorption unit is arranged on the vertical movement unit and is used for controlling to suck and place at least one high-frequency electronic element in a negative pressure mode, the vertical movement unit is driven to the second position by the horizontal displacement unit, and when the vertical movement unit is controlled to move upwards, the vacuum adsorption unit is driven to penetrate into the hollow shell from the opening, and sucking and releasing at least one high-frequency electronic element to the test seat in a negative pressure mode.
2. The pick-and-place device for high-frequency electronic component testing of claim 1, wherein: the horizontal displacement unit comprises a rail arranged between the material moving base and the sealed environment chamber, and a carrier which can be driven to move to any one of the first position and the second position on the rail in a controlled manner.
3. The pick-and-place device for high-frequency electronic component testing of claim 2, wherein: the vertical moving unit comprises a transfer arm arranged on the carrier and a lifting component which can drive the transfer arm to move up and down in a controlled manner.
4. The pick-and-place device for high-frequency electronic component testing of claim 3, wherein: the vacuum adsorption unit comprises a base arranged on the transfer arm and a vacuum component connected with an external negative pressure system and provided with at least one suction nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010248987.4A CN113493114A (en) | 2020-04-01 | 2020-04-01 | Taking and placing device for testing high-frequency electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010248987.4A CN113493114A (en) | 2020-04-01 | 2020-04-01 | Taking and placing device for testing high-frequency electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113493114A true CN113493114A (en) | 2021-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010248987.4A Pending CN113493114A (en) | 2020-04-01 | 2020-04-01 | Taking and placing device for testing high-frequency electronic element |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07287049A (en) * | 1994-04-15 | 1995-10-31 | Fujitsu Ltd | Testing device for semiconductor chip |
| WO2002064323A1 (en) * | 2001-02-13 | 2002-08-22 | Centre De Recherche Industrielle Du Quebec | Tool compliance device and method |
| JP2003075505A (en) * | 2001-09-05 | 2003-03-12 | Yamaha Motor Co Ltd | Parts tester |
| JP2003185521A (en) * | 2001-12-14 | 2003-07-03 | Noa Eng:Kk | Test gas filler into electronic component |
| CN101472459A (en) * | 2007-12-26 | 2009-07-01 | 鸿劲科技股份有限公司 | Movable loading device capable of ensuring accurate contraposition of electronic element |
| CN201522545U (en) * | 2009-06-11 | 2010-07-07 | 致茂电子(苏州)有限公司 | Independent testing machine station for testing semiconductor elements and test sorting system |
| US20160116503A1 (en) * | 2014-10-24 | 2016-04-28 | Advantest Corporation | Electronic device handling apparatus and electronic device testing apparatus |
| CN105983543A (en) * | 2015-02-04 | 2016-10-05 | 鸿劲科技股份有限公司 | Testing and sorting device for electronic elements |
| CN212639132U (en) * | 2020-04-01 | 2021-03-02 | 百尼尔机械股份有限公司 | Taking and placing device for testing high-frequency electronic element |
-
2020
- 2020-04-01 CN CN202010248987.4A patent/CN113493114A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07287049A (en) * | 1994-04-15 | 1995-10-31 | Fujitsu Ltd | Testing device for semiconductor chip |
| WO2002064323A1 (en) * | 2001-02-13 | 2002-08-22 | Centre De Recherche Industrielle Du Quebec | Tool compliance device and method |
| JP2003075505A (en) * | 2001-09-05 | 2003-03-12 | Yamaha Motor Co Ltd | Parts tester |
| JP2003185521A (en) * | 2001-12-14 | 2003-07-03 | Noa Eng:Kk | Test gas filler into electronic component |
| CN101472459A (en) * | 2007-12-26 | 2009-07-01 | 鸿劲科技股份有限公司 | Movable loading device capable of ensuring accurate contraposition of electronic element |
| CN201522545U (en) * | 2009-06-11 | 2010-07-07 | 致茂电子(苏州)有限公司 | Independent testing machine station for testing semiconductor elements and test sorting system |
| US20160116503A1 (en) * | 2014-10-24 | 2016-04-28 | Advantest Corporation | Electronic device handling apparatus and electronic device testing apparatus |
| CN105983543A (en) * | 2015-02-04 | 2016-10-05 | 鸿劲科技股份有限公司 | Testing and sorting device for electronic elements |
| CN212639132U (en) * | 2020-04-01 | 2021-03-02 | 百尼尔机械股份有限公司 | Taking and placing device for testing high-frequency electronic element |
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Application publication date: 20211012 |