CN218664208U

CN218664208U - Loading and unloading device with high stability for semiconductor surface detection

Info

Publication number: CN218664208U
Application number: CN202222753291.4U
Authority: CN
Inventors: 刘康; 刘淑琳
Original assignee: Suzhou Sihang Semiconductor Technology Co ltd
Current assignee: Suzhou Sihang Semiconductor Technology Co ltd
Priority date: 2022-10-19
Filing date: 2022-10-19
Publication date: 2023-03-21
Anticipated expiration: 2032-10-19

Abstract

The utility model provides a last unloader that is used for semiconductor surface to detect with high stability belongs to the wafer detection area, and this last unloader includes the magazine, detects microscope carrier, transport module. The material box is used for loading a plurality of wafers; the detection carrying platform is used for placing the wafer so that the detection mechanism can detect the wafer on the detection carrying platform; the carrying module is used for picking up and carrying the wafer; the carrying module comprises a moving arm, a pickup head, an adsorption piece and a driving assembly, one end of the moving arm is connected with the driving assembly, the other end of the moving arm is connected with the pickup head, the adsorption piece is installed on the upper surface of the pickup head, the pickup head picks up a wafer under the driving force of the driving assembly, the wafer is adsorbed on the surface of the pickup head under the action of the adsorption piece, and the wafer picked up by the pickup head moves along with the moving arm so as to be picked up and carried. The utility model discloses an unloader avoids the wafer to break away from or the offset takes place to remove the in-process, improves the stability and the security of wafer in handling.

Description

Loading and unloading device with high stability for semiconductor surface detection

Technical Field

The utility model relates to a wafer detection area especially relates to a last unloader that is used for semiconductor surface to detect who has high stability.

Background

In the semiconductor industry, due to the characteristics of complex process, multiple working procedures, small device size and the like, defects of wafers are easily caused in the production process. These defects not only seriously affect the chip performance, but also cause increased costs. Therefore, the inspection process is critical in various processes of semiconductor production.

What is needed is how to safely and stably perform loading and unloading in the process of detecting the wafer.

SUMMERY OF THE UTILITY MODEL

In view of this, an object of the present invention is to provide a loading and unloading apparatus capable of transporting wafers safely and stably.

In order to solve the technical problem, the utility model adopts the following technical scheme:

according to the utility model discloses last unloader that is used for semiconductor surface to detect with high stability, last unloader includes:

a magazine for loading a plurality of wafers;

the detection platform is used for placing a wafer so that the detection mechanism detects the wafer on the detection platform;

the carrying module is used for picking up and carrying the wafer in the material box to the detection carrying platform or picking up and putting the wafer which is detected on the detection carrying platform back into the material box;

the carrying module comprises a moving arm, a pickup head, an adsorption piece and a driving assembly, one end of the moving arm is connected with the driving assembly, the other end of the moving arm is connected with the pickup head, the adsorption piece is installed on the upper surface of the pickup head, the pickup head picks up the wafer under the driving force of the driving assembly, the wafer is adsorbed on the surface of the pickup head under the action of the adsorption piece, and the wafer picked up by the pickup head is moved along with the moving arm so as to be picked up and carried.

Furthermore, the adsorption part comprises a plurality of vacuum adsorption discs, and the vacuum adsorption discs are uniformly arranged on the upper surface of the pickup head.

Further, the pickup head includes a first insertion rod and a second insertion rod, a space exists between the first insertion rod and the second insertion rod, and the plurality of vacuum adsorption discs are mounted on the surfaces of the first insertion rod and the second insertion rod.

Further, the removal arm includes the swinging boom, drive assembly includes first driving piece, the one end of swinging boom is connected the pickup head, and the other end is connected first driving piece, the pickup head is in follow under the drive power of first driving piece the swinging boom carries out rotary motion along the horizontal direction.

Furthermore, the movable arm further comprises a lifting piece, the driving assembly further comprises a second driving piece, one end of the lifting piece is connected with the first driving piece, the other end of the lifting piece is connected with the second driving piece, and the picking head is driven by the driving force of the second driving piece to move up and down along with the lifting piece.

Further, the swinging boom includes first swinging boom and second swinging boom, the pickup head includes first pickup head and second pickup head, first pickup head is connected first swinging boom, the second pickup head is connected the second swinging boom, first swinging boom all is connected with the second swinging boom first driving piece.

Furthermore, the first rotating arm comprises a first rotating shaft, a second rotating shaft and a third rotating shaft, one end of the first rotating shaft is connected with the first pickup head, the other end of the first rotating shaft is connected with the second rotating shaft, the second rotating shaft is connected with the third rotating shaft, and the third rotating shaft is connected with the first driving piece.

Furthermore, a first gap and a second gap are arranged on the detection carrier, the first inserted link and the second inserted link can be respectively inserted into the first gap and the second gap, and a space exists at the edge of the first inserted link and the first gap and at the edge of the second inserted link and the second gap.

Furthermore, a plurality of liftable bosses are arranged on the detection carrier, and can protrude out of the surface of the detection carrier to lift the wafer, so that the pickup head is inserted into a space between the wafer and the surface of the detection carrier.

The above technical scheme of the utility model one of following beneficial effect has at least:

the utility model discloses a last unloader for semiconductor surface detection with high stability, this last unloader utilizes the pickup head to hold the wafer and utilizes the absorption piece on the pickup head to adsorb fixedly to the wafer, avoids the wafer to break away from or the offset takes place in the removal process, improves the stability and the security of wafer in the handling process; in addition, the moving arm is used for adjusting the position and the posture of the pick-up head so as to improve the pick-up convenience of the pick-up head on wafers at different positions and further improve the feeding and discharging efficiency of the feeding and discharging device.

Drawings

Fig. 1 is a schematic view of an overall structure of a feeding and discharging device for semiconductor surface inspection with high stability according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a first rotating arm and a first pick-up head in a loading and unloading device with high stability for semiconductor surface inspection according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a detection carrier in a feeding and discharging device for semiconductor surface detection with high stability according to an embodiment of the present invention;

fig. 4 is a schematic structural view of a detection stage and a wafer in the feeding and discharging device for semiconductor surface detection with high stability according to an embodiment of the present invention.

Reference numerals:

a. a wafer;

20. detecting a carrying platform; 201. a first notch; 202. a second notch; 203. the boss can be lifted; 21. a carrying module; 211. a rotating arm; 2111. a first rotating arm; 2112. a second rotating arm; 212. a pickup head; 2121. a first pick-up head; 2122. a second pick-up head; 213. a second driving member; 2141. a vacuum adsorption pan; 21a, a first rotation axis; 21b, a second rotation axis; 21c, a third rotation axis; 215. a lifting member.

Detailed Description

In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined below to clearly and completely describe the technical solution of the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived from the description of the embodiments of the present invention by a person skilled in the art, are within the scope of the present invention.

The embodiment of the utility model provides a go up unloader for wafer a detects, this go up unloader is through being equipped with the adsorption part at pickup head 212 upper surface for wafer a can remain stable on pickup head 212, avoids pickup head 212 to appear the position removal at removal in-process wafer a and breaks away from the phenomenon even, further improves the stability and the security of wafer a's last unloading.

The following description specifically describes a loading and unloading device for wafer a inspection according to an embodiment of the present invention with reference to the accompanying drawings.

Specifically, as shown in fig. 1 and fig. 2, an embodiment of the utility model provides a go up unloader for wafer a detects, go up unloader and include magazine, detection microscope carrier 20 and transport module 21.

The magazine is used to load a plurality of wafers a, and the magazine is preferably a slot-type magazine, and a plurality of wafers a can be loaded in one magazine, although not limited thereto.

The detection stage 20 is used for placing the wafer a so that the detection mechanism detects the wafer a on the detection stage 20.

The carrying module 21 is configured to pick up and carry the wafer a in the magazine to the detection stage 20 or pick up and place the wafer a detected on the detection stage 20 back into the magazine.

The carrying module 21 includes a moving arm, a pick-up head 212, an adsorbing member and a driving assembly, wherein one end of the moving arm is connected to the driving assembly, the other end of the moving arm is connected to the pick-up head 212, the adsorbing member is mounted on the upper surface of the pick-up head 212, the pick-up head 212 picks up the wafer a under the driving force of the driving assembly, the wafer a is adsorbed on the surface of the pick-up head 212 under the action of the adsorbing member, and the wafer a picked up by the pick-up head 212 moves along with the moving arm to pick up and carry the wafer a.

That is, the pick-up head 212 moves down into the magazine by the driving force of the driving component and lifts the end of the wafer a, the wafer a with the lifted end is attracted to the surface of the pick-up head 212 by the attraction member, and the wafer a moves down onto the detection stage 20 by the conveying module 21, so that the loading operation of the wafer a is realized. For the blanking operation of the wafer a, the drive assembly is also used to make the pick-up head 212 pick up and transfer the end of the wafer a which is detected on the detection stage 20 into the magazine, so as to complete the blanking operation of the wafer a.

In one embodiment, as shown in fig. 2, the suction member includes a plurality of vacuum suction pads 2141, and the plurality of vacuum suction pads 2141 are uniformly mounted on the upper surface of the pickup head 212.

After the pick-up head 212 lifts the wafer a from the lower side thereof, the wafer a falls on the vacuum suction pads 2141, and the vacuum suction pads 2141 are sucked on the lower surface of the wafer a, so that the wafer a is fixed on the upper surface of the pick-up head 212, thereby improving the stability and safety of the wafer a during the movement of the pick-up head 212.

In one embodiment, as shown in fig. 2, the pick-up head 212 includes a first insertion rod and a second insertion rod, a space exists between the first insertion rod and the second insertion rod, and a plurality of vacuum suction discs 2141 are mounted on the surfaces of the first insertion rod and the second insertion rod.

Regardless of whether wafer a is placed in a magazine or on inspection stage 20, space needs to be left below wafer a to facilitate insertion of pickup head 212 below wafer a to lift it. The first and second insertion rods reduce the reserved space of the magazine or the carrier for placing the wafer a, that is, the magazine or the detection carrier 20 only needs to be reserved with the space capable of inserting the first and second insertion rods, and meanwhile, the quality of the pickup head 212 is also reduced, and the driving pressure of the driving module is reduced.

As shown in fig. 3, a first notch 201 and a second notch 202 are provided on the detection stage 20, the first insert rod and the second insert rod can be inserted into the first notch 201 and the second notch 202, respectively, and there is a space at the edge of the first insert rod and the first notch 201 and at the edge of the second insert rod and the second notch 202.

That is, the first notch 201 and the second notch 202 on the detection stage 20 are also provided on the partition board for placing the wafer a in the magazine (not shown). When the first and second pins are inserted into the first and

second notches

201 and 202, there are spaces between the first and

second notches

201 and 202, which are convenient for the pick-up head 212 to insert under the wafer a to lift it.

Alternatively, as shown in fig. 4, a plurality of liftable bosses 203 are provided on the detection stage 20, and the plurality of liftable bosses 203 can protrude from the surface of the detection stage 20 to lift the wafer a, so that the pickup head 212 is inserted into a space between the wafer a and the surface of the detection stage 20.

That is, after the wafer a is inspected, the wafer a is lifted by the liftable platform 203, so that the pick-up head 212 can be inserted under the wafer a to lift the wafer a, the liftable platform 203 includes a lifting/contracting rod and a driving motor, the driving motor drives the lifting/contracting rod to perform lifting movement, and the driving motor is installed in the inspection stage 20.

In an embodiment, as shown in fig. 1 and fig. 2, the moving arm includes a rotating arm 211, the driving assembly includes a first driving member, one end of the rotating arm 211 is connected to the pickup head 212, and the other end of the rotating arm is connected to the first driving member, and the pickup head 212 performs a rotating motion along a horizontal direction along with the rotating arm 211 under the driving force of the first driving member. The first driving member is preferably a screw drive, although not limited thereto.

Based on the carrying module 21, not only the loading operation but also the unloading operation are performed on the wafer a, the posture of the pick-up head 212 in the horizontal direction is adjusted by the rotating arm 211, so that the pick-up head is suitable for the wafer a with different positions and postures, and the convenience of the pick-up head 212 for picking up the wafer a is improved.

Further, the moving arm further includes a lifting member 215, the driving assembly further includes a second driving member 213, one end of the lifting member 215 is connected to the first driving member, the other end is connected to the second driving member 213, and the pick-up head 212 performs a lifting motion along with the lifting member 215 under the driving force of the second driving member 213. The second driving member 213 is preferably driven by a motor, but is not limited thereto.

The lifter 215 is used to facilitate the pick-up head 212 to pick up the wafer a in the cassette based on the stacked placement of the wafer a in the cassette, i.e., at different heights. The rotating arm 211 is connected to the lifting member 215, that is, the lifting member 215 drives the rotating arm 211 and the pickup head 212 to perform lifting movement, so as to satisfy position and posture adjustment of the pickup head 212 in the horizontal direction and the vertical direction, and improve adaptability.

In one embodiment, as shown in fig. 2, the first rotating arm 2111 includes a first rotating shaft 21a, a second rotating shaft 21b and a third rotating shaft 21c, one end of the first rotating shaft 21a is connected to the first pick-up head 2121, the other end is connected to the second rotating shaft 21b, the second rotating shaft 21b is connected to the third rotating shaft 21c, and the third rotating shaft 21c is connected to the first driving element.

The first, second, and

third rotation axes

21a, 21b, and 21c increase the rotation angle of the pickup head 212, further improving the convenience and efficiency of the pickup head 212 in picking up the wafer a. The second rotating arm 2112 is of course identical in structure to the first rotating arm 2111.

In an embodiment, as shown in fig. 1, the rotating arm 211 includes a first rotating arm 2111 and a second rotating arm 2112, the pick-up head 212 includes a first pick-up head 2121 and a second pick-up head 2122, the first pick-up head 2121 is connected to the first rotating arm 2111, the second pick-up head 2122 is connected to the second rotating arm 2112, and the first rotating arm 2111 and the second rotating arm 2112 are both connected to the first driving unit.

That is, the lifting member 215 is provided with the first rotating arm 2111 and the second rotating arm 2112, when the wafer a on the detecting stage 20 is detected, the first pick-up head 2121 is used to pick up the wafer a on the detecting stage 20 and then place the wafer a to be detected picked up by the second pick-up head 2122 on the detecting stage 20, and when the first pick-up head 2121 moves to the magazine, the first pick-up head 2121 immediately picks up the wafer a to be detected in the magazine by using the second pick-up head 2122 and moves to the detecting stage 20, so as to repeat the above steps.

The first rotating arm 2111 and the second rotating arm 2112 are utilized to reduce the loading and unloading times of the pick-up head 212, thereby improving the loading and unloading efficiency of the wafer a.

The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims

1. A loading and unloading device with high stability for semiconductor surface detection is characterized in that the loading and unloading device comprises:

a magazine for loading a plurality of wafers;

a detection stage (20) for placing a wafer so that a detection mechanism detects the wafer on the detection stage (20);

a conveying module (21) for picking up and conveying the wafer in the material box to the detection carrying platform (20) or picking up and returning the wafer detected on the detection carrying platform (20) to the material box;

the carrying module (21) comprises a moving arm, a pickup head (212), an adsorption piece and a driving assembly, one end of the moving arm is connected with the driving assembly, the other end of the moving arm is connected with the pickup head (212), the adsorption piece is installed on the upper surface of the pickup head (212), the pickup head (212) picks up the wafer under the driving force of the driving assembly, the wafer is adsorbed on the surface of the pickup head (212) under the action of the adsorption piece, and the wafer picked up by the pickup head (212) is moved along with the moving arm so as to pick up and carry the wafer.

2. The loading and unloading apparatus with high stability for semiconductor surface inspection according to claim 1, wherein the suction member includes a plurality of vacuum suction pads (2141), and the plurality of vacuum suction pads (2141) are uniformly mounted on the upper surface of the pick-up head (212).

3. The loading and unloading apparatus with high stability for semiconductor surface inspection according to claim 2, wherein the pick-up head (212) includes a first plunger and a second plunger, a space exists between the first plunger and the second plunger, and a plurality of vacuum chuck plates (2141) are mounted on the surfaces of the first plunger and the second plunger.

4. The loading and unloading device with high stability for semiconductor surface inspection according to claim 1, wherein the moving arm includes a rotating arm (211), the driving assembly includes a first driving member, one end of the rotating arm (211) is connected to the pick-up head (212), and the other end is connected to the first driving member, the pick-up head (212) performs a rotating motion along a horizontal direction along with the rotating arm (211) under the driving force of the first driving member.

5. The loading and unloading device with high stability for semiconductor surface inspection according to claim 4, wherein the moving arm further comprises an elevating member (215), the driving assembly further comprises a second driving member (213), one end of the elevating member (215) is connected to the first driving member, the other end is connected to the second driving member (213), and the pick-up head (212) follows the elevating member (215) to perform elevating movement under the driving force of the second driving member (213).

6. The loading and unloading apparatus with high stability for semiconductor surface inspection according to claim 4, wherein the rotating arm (211) comprises a first rotating arm (2111) and a second rotating arm (2112), the pick-up head (212) comprises a first pick-up head (2121) and a second pick-up head (2122), the first pick-up head (2121) is connected with the first rotating arm (2111), the second pick-up head (2122) is connected with the second rotating arm (2112), and the first rotating arm (2111) and the second rotating arm (2112) are both connected with the first driving unit.

7. The loading and unloading apparatus with high stability for semiconductor surface inspection according to claim 6, wherein the first rotating arm (2111) includes a first rotating shaft (21 a), a second rotating shaft (21 b) and a third rotating shaft (21 c), one end of the first rotating shaft (21 a) is connected to the first pick-up head (2121), the other end is connected to the second rotating shaft (21 b), the second rotating shaft (21 b) is connected to the third rotating shaft (21 c), and the third rotating shaft (21 c) is connected to the first driving member.

8. The loading and unloading device with high stability for semiconductor surface inspection according to claim 3, wherein a first notch (201) and a second notch (202) are disposed on the inspection stage (20), the first insertion rod and the second insertion rod can be inserted into the first notch (201) and the second notch (202), respectively, and there is a space at the edge of the first insertion rod and the first notch (201) and at the edge of the second insertion rod and the second notch (202).

9. The loading and unloading device with high stability for semiconductor surface inspection according to claim 3, wherein a plurality of liftable bosses (203) are provided on the inspection stage (20), and the plurality of liftable bosses (203) can protrude out of the surface of the inspection stage (20) to lift the wafer, so that the pick-up head (212) is inserted into a space between the wafer and the surface of the inspection stage (20).