CN112466798B - Semiconductor machine - Google Patents
Semiconductor machine Download PDFInfo
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- CN112466798B CN112466798B CN202011373446.0A CN202011373446A CN112466798B CN 112466798 B CN112466798 B CN 112466798B CN 202011373446 A CN202011373446 A CN 202011373446A CN 112466798 B CN112466798 B CN 112466798B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
The invention provides a semiconductor machine, comprising: wafer bearing platform and at least one robotic arm, each robotic arm includes: the tail end of the first fork arm part has warping degree relative to the main body part. The mechanical arm is used for grabbing the wafer and transporting the wafer to the wafer bearing platform, and the wafer bearing platform is used for bearing the wafer. Because the first fork arm part of robotic arm has the angularity for the main part, first fork arm part can be better with crooked wafer laminating together, reduce the gap between first fork arm part and the crooked wafer for robotic arm can snatch crooked wafer, and with crooked wafer transport to wafer load-bearing platform on, improve the handling efficiency of wafer.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor machine.
Background
In the semiconductor manufacturing process, a series of processes, such as a thin film deposition process, an etching process, etc., are performed on the front surface and the back surface of the wafer, and a thinning process, etc., is performed on the back surface of the wafer, which may cause the wafer to bend.
Moreover, when the wafer is processed, a robot arm is required to transfer the wafer among the process links. However, as the wafer is bent, a gap is generated between the robot arm and the wafer during the process of grabbing the wafer by the robot arm, and the wafer cannot be sucked by the robot arm, so that the wafer grabbing by the robot arm fails.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a semiconductor machine, so that a robot can grasp a curved wafer.
In order to achieve the purpose, the invention has the following technical scheme:
a semiconductor tool, comprising:
the wafer bearing platform and the at least one mechanical arm;
each of the robot arms includes: the fork arm comprises a main body part and a first fork arm part connected with a first end of the main body part, wherein the tail end of the first fork arm part has a warping degree relative to the main body part;
the mechanical arm is used for grabbing the wafer and conveying the wafer to the wafer bearing platform, and the wafer bearing platform is used for bearing the wafer.
Optionally, the end of the first fork arm portion has an upward warping degree relative to the main body portion, and the robot arm is used for grabbing the wafer with the edge warped upwards relative to the center.
Optionally, the end of the first fork arm portion has a downward warping degree relative to the main body portion, and the robot arm is used for grabbing the wafer with the edge warped downward relative to the center.
Optionally, the robot arm includes:
a second prong portion connected to a second end of the main body portion, the second prong portion being horizontally disposed relative to the main body portion.
Optionally, the first fork arm portion and the second fork arm portion are both provided with a vacuum adsorption device, and the vacuum adsorption devices are used for adsorbing the wafer.
Optionally, the robot arm includes at least a first robot arm and a second robot arm;
the tail end of the first fork arm part of the first mechanical arm has an upward warping degree relative to the main body part of the first mechanical arm;
the tail end of the first fork arm part of the second mechanical arm has downward warping degree relative to the main body part of the first mechanical arm;
the first mechanical arm is used for grabbing the wafer with the edge warped upwards relative to the center, and the second mechanical arm is used for grabbing the wafer with the edge warped downwards relative to the center.
Optionally, the first robot arm includes: a second forked arm portion connected with a second end of the main body portion of the first mechanical arm, wherein the second forked arm portion of the first mechanical arm is horizontally arranged relative to the main body portion of the first mechanical arm;
the second robot arm includes: a second prong portion of the second robotic arm disposed horizontally with respect to the body portion of the second robotic arm.
Optionally, a warpage of the distal end of the first fork arm portion with respect to the main body portion is less than or equal to 500 μm, and a warpage range of the edge of the wafer with respect to the center is 500 μm to 1000 μm.
Optionally, a vacuum adsorption device is arranged on the first fork arm portion, and the vacuum adsorption device is used for adsorbing the wafer.
Optionally, the wafer supporting platform includes:
the device comprises a supporting device, a bearing device, a fixing device and a liftable vacuum chuck;
the bearing device is positioned on the supporting device, the fixing device is positioned on the supporting device and surrounds the bearing device, and the liftable vacuum sucker is positioned on the bearing device;
the supporting device is used for supporting the bearing device, the bearing device is used for bearing the wafer, the fixing device is used for fixing the wafer, and the liftable vacuum chuck is used for adsorbing the wafer.
Optionally, the number of the liftable vacuum chucks is multiple.
Optionally, each liftable vacuum chuck has a corresponding telescoping device, the telescoping device is used for driving the corresponding liftable vacuum chuck to move up and down.
Optionally, the retractable device is a stepper motor.
The embodiment of the invention provides a semiconductor machine, which comprises: wafer bearing platform and at least one robotic arm, each robotic arm includes: the tail end of the first fork arm part has warping degree relative to the main body part. The mechanical arm is used for grabbing the wafer and transporting the wafer to the wafer bearing platform, and the wafer bearing platform is used for bearing the wafer. Because the first fork arm part of robotic arm has the angularity for the main part, first fork arm part can be better with crooked wafer laminating together, reduce the gap between first fork arm part and the crooked wafer for robotic arm can snatch crooked wafer, and with crooked wafer transport to wafer load-bearing platform on, improve the handling efficiency of wafer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a robot according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another robot arm according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a robot according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a wafer;
FIG. 5 shows a schematic structural view of another wafer;
FIG. 6 is a schematic diagram of a wafer platform according to an embodiment of the present invention;
fig. 7 is a schematic diagram illustrating a top view of a wafer platform according to an embodiment of the invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background, since the wafer is bent, a gap is generated between the robot arm and the wafer during the process of grabbing the wafer by the robot arm, and the wafer cannot be sucked by the robot arm, so that the wafer grabbing by the robot arm fails.
In order to solve the above problem, the inventor firstly adjusts the relative level between the normal wafer and the robot arm, i.e. the relative level between the wafer without or with small bending degree and the robot arm is adjusted to be consistent as much as possible. Simultaneously, the vacuum suction force of the mechanical arm to the wafer is increased, when the mechanical arm grabs the wafer, the vacuum adsorption device on the mechanical arm is started in advance, the vacuum adsorption device is used for adsorbing the wafer, and then when the mechanical arm grabs the wafer, the time for the vacuum adsorption device on the mechanical arm to adsorb the wafer is prolonged. Although the method can improve the probability of grabbing the curved wafer by the mechanical arm to a certain extent, the wafer with larger curvature cannot be grabbed effectively, for example, when the curvature of the wafer is larger than 500 μm, even if the time for the vacuum adsorption device on the mechanical arm to adsorb the wafer is prolonged, the mechanical arm still cannot grab the wafer effectively to a great extent.
To this end, an embodiment of the present invention provides a semiconductor apparatus, as shown in fig. 1 and 6, including:
a wafer platform 200 and at least one robot 100;
each of the robot arms 100 includes: a main body part 102 and a first fork arm part 106 connected with a first end of the main body part 102, wherein the tail end of the first fork arm part 106 has a warping degree relative to the main body part 102;
the robot arm 100 is used for grabbing a wafer and transporting the wafer to the wafer platform 200, and the wafer platform 200 is used for carrying the wafer.
During semiconductor processing, wafers are transferred between process steps, usually by a robot. For example, in the chemical vapor deposition process, a robot arm grabs a wafer from a Front opening unified pod (FOUR), and then the robot arm moves the wafer out of the FOUR under the driving of a transmission device, and transports the wafer to a wafer carrying platform in a reaction chamber to complete the chemical vapor deposition in the reaction chamber, and then the robot arm grabs the wafer in the reaction chamber that has completed the chemical vapor deposition, and transports the wafer back to the Front opening FOUR under the driving of the transmission device.
In the embodiment of the present application, the semiconductor machine includes at least one robot 100, and specifically, the semiconductor machine may include one robot or a plurality of robots, one robot may grab a wafer during one grabbing operation, and the semiconductor machine includes a plurality of robots, and may grab a plurality of wafers simultaneously, so as to transport the plurality of wafers simultaneously, thereby improving the transport efficiency of the wafers. Each robot arm 100 includes: the fork arm assembly comprises a main body part 102 and a first fork arm part 106 connected with a first end of the main body part 102, wherein the tail end of the first fork arm part 106 has a warping degree relative to the main body part 102. The warpage is used to describe the degree of bending of the distal end of the first yoke arm portion 106 in space with respect to the main body portion 102, and may be understood as the distance in the height direction of the distal end of the first yoke arm portion 106 with respect to the main body portion 102. Because the end of the first fork arm 106 has a warping degree relative to the main body 102, the first fork arm 106 can better adhere to the curved wafer, and a gap between the first fork arm 106 and the curved wafer is reduced, so that the robot arm 100 can grab the curved wafer and convey the curved wafer onto the wafer supporting platform 200, thereby improving the wafer conveying efficiency. The tip of the first fork arm 106 has an upward warp with respect to the main body 102, and the first fork arm 106 is used to grab the wafer with its edge warped upward with respect to the center. Since the end of the first fork arm 106 has an upward warping degree relative to the main body 102, when the first fork arm 106 grabs a wafer with an edge warped upward relative to the center, that is, a wafer in a bowl-shaped (bowl-shaped) structure, as shown in fig. 4, it is obvious that the first fork arm 106 and the wafer in the bowl-shaped structure can better fit together at this time, the gap between the first fork arm 106 and the wafer in the bowl-shaped structure is reduced, and the robot can grab the wafer in the bowl-shaped structure.
The distal end of the first fork arm portion 106 may also have a downward warp with respect to the main body portion 102, and the first fork arm portion 106 is used to grab a wafer with its edge warped downward with respect to the center. Since the end of the first fork arm 106 has a downward warping degree relative to the main body 102, when the first fork arm 106 grabs a wafer with an edge warped downward relative to the center, i.e., a dome-shaped wafer, as shown in fig. 5, it is obvious that the first fork arm 106 and the roof-shaped wafer can better fit together, and the gap between the first fork arm 106 and the roof-shaped wafer is reduced, so that the robot arm can grab the roof-shaped wafer.
The robot arm 100 further includes: a second prong portion 104 connected to a second end of main portion 102, second prong portion 104 being horizontally disposed with respect to main portion 102, as shown with reference to fig. 2. Second prong portion 104 is disposed horizontally with respect to main body portion 102, and since second prong portion 104 is connected to the second end of main body portion 102, there is no height difference between second prong portion 104 and main body portion 102 in the direction of extension of main body portion 102 or second prong portion 104. In this embodiment, when the wafer is grabbed, the second fork arm 104 may be used to grab the wafer, and if the wafer is failed to grab, the wafer may have a certain curvature, and the wafer may be bent to form a large gap between the wafer and the robot arm 100, which may result in the failure of the robot arm 100 to grab the wafer. At this time, the robot arm 100 may be rotated such that the first fork arm portion 106 of the robot arm is close to the wafer, and specifically, the robot arm 100 may be rotated by using the rotating device on the main body portion 102, for example, by 180 ° in the extending direction of the main body portion 102 and the second fork arm portion 104. The wafer is then grasped by the first prong portion 106, and the gap between the second prong portion 104 and the bent wafer is made smaller due to the warping of the tip of the first prong portion 106 with respect to the main body portion 102, thereby enabling the second prong portion 104 to grasp the bent wafer.
In a specific application, a vacuum suction device may be disposed on both the first fork arm portion 106 and the second fork arm portion 104, and the vacuum suction device is used for sucking a wafer. When the first fork arm part 106 is in contact with the wafer, the vacuum adsorption device on the first fork arm part 106 is started to adsorb the wafer, and because the first fork arm part 106 and the wafer are attached together, the gap between the first fork arm part 106 and the wafer is small, so that the vacuum adsorption device can firmly adsorb the wafer, and when the vacuum adsorption device can adsorb the wafer, it indicates that the robot arm successfully grabs the wafer, and then the wafer can be carried out. When the second fork arm portion 104 is in contact with the wafer, the vacuum suction device on the second fork arm portion 104 is activated to suck the wafer.
In the present embodiment, the robot arm includes at least a first robot arm 110 and a second robot arm 120, and referring to fig. 3, a distal end of the first fork arm 116 of the first robot arm 110 has an upward warping degree relative to the main body 112 of the first robot arm 110, and a distal end of the first fork arm 126 of the second robot arm 120 has a downward warping degree relative to the main body 122 of the second robot arm 120. It can be appreciated that since the end of the first fork arm 116 of the first robot 110 has an upward warp relative to the main body 112 of the first robot 110, the end of the first fork arm 126 of the second robot 120 has a downward warp relative to the main body 122 of the second robot 120, thereby enabling the robot to simultaneously grasp wafers with edges warped upward relative to the center and wafers with edges warped downward relative to the center. In a specific application, after the grabbing is completed, the mechanical arm can be driven by the transmission device to simultaneously carry the wafer with the edge warped upwards relative to the center and the wafer with the edge warped downwards relative to the center, so that the carrying efficiency of the wafer is improved.
The first robot arm 110 may further include a second fork arm portion 114, the second fork arm portion 114 of the first robot arm 110 is connected to the second end of the main body portion 112 of the first robot arm 110, that is, two ends of the main body portion 112 of the first robot arm 110 are respectively connected to the first fork arm portion 116 and the second fork arm portion 114, and the second fork arm portion 114 of the first robot arm 110 is horizontally disposed with respect to the main body portion 112 of the first robot arm 110. The second robot arm 120 may further include a second fork arm portion 124, the second fork arm portion 124 of the second robot arm 120 is connected to the main body portion 122 of the second robot arm 120, that is, two ends of the main body portion 122 of the second robot arm 120 are respectively connected to the first fork arm portion 126 and the second fork arm portion 124, and the second fork arm portion 124 of the second robot arm 120 is horizontally disposed with respect to the main body portion 122 of the second robot arm 120, as shown in fig. 3.
Specifically, the second fork arm 114 of the first robot arm 110 may be used to grasp the wafer, if the grasping fails, the wafer may have a certain curvature, the first robot arm 110 may be rotated to grasp the wafer using the first fork arm 116 of the first robot arm 110, and if the grasping still fails, the wafer may be a roof-shaped wafer, the first robot arm 110 may be moved away, the second robot arm 120 may be moved close to the wafer, and the first fork arm 126 of the second robot arm 120 may be used to grasp the wafer. The wafer may be grasped by the second fork arm 124 of the second robot 120, and if the grasping fails, the wafer may have a certain curvature, the second robot 120 may be rotated, and the wafer may be grasped by the first fork arm 126 of the second robot 120, and if the grasping fails, the wafer may be a bowl-shaped wafer, and the second robot 120 may be moved to bring the first robot 110 close to the wafer, and the wafer may be grasped by the first fork arm 116 of the first robot 110.
In a specific application, the warpage of the distal end of the first fork arm portion relative to the main body portion is less than or equal to 500 μm, that is, the distance between the distal end of the first fork arm portion and the main body portion in the height direction is less than or equal to 500 μm, and the robot arm can grab a wafer with the warpage of the edge relative to the center in a range of 500 μm to 1000 μm. Specifically, when the upward warping degree of the tail end of the first fork arm part relative to the main body part is less than or equal to 500 microns, the mechanical arm can grab the wafer with the edge warped upwards relative to the center in the range of 500 microns to 1000 microns, and when the downward warping degree of the tail end of the first fork arm part relative to the main body part is less than or equal to 500 microns, the mechanical arm can grab the wafer with the edge warped downwards relative to the center in the range of 500 microns to 1000 microns.
In addition, the inventor finds that, when the wafer is bent, and the wafer is placed on the wafer bearing platform by the mechanical arm, a gap exists between the wafer bearing platform and the wafer, the vacuum adsorption device on the wafer bearing platform cannot adsorb the wafer, the wafer is offset in the process of carrying out process treatment, and the like, so that the process treatment effect is poor.
The inventor firstly adjusts the relative level between the normal wafer and the wafer bearing platform, namely, the relative level between the wafer without bending or with small bending and the wafer bearing platform is adjusted to be consistent as much as possible. Meanwhile, the vacuum suction force of the wafer bearing platform is increased, and the time for releasing the vacuum after the wafer is transferred to the wafer bearing platform by the mechanical arm is prolonged. Generally, after the mechanical arm moves above the wafer bearing platform, vacuum needs to be released, so that the wafer falls on the wafer bearing platform, the time for the mechanical arm to release vacuum is prolonged, the bent wafer can be forced to be leveled, the curvature of the wafer is reduced, gaps between the wafer and the wafer bearing platform are reduced, and the vacuum adsorption device on the wafer bearing platform can effectively adsorb the wafer. However, the inventors have found that when the robot arm is used to level the wafer, there is a risk of damaging the wafer, which may lead to wafer breakage, etc.
Referring to fig. 6, the wafer platform 200 of the present embodiment includes: the vacuum chuck device comprises a supporting device, a bearing device 202, a fixing device 204 and a liftable vacuum chuck 206, wherein the bearing device 202 is positioned on the supporting device, the fixing device 204 is positioned on the supporting device and surrounds the bearing device 202, and the liftable vacuum chuck 206 is positioned on the bearing device 202. The supporting device is used for supporting the carrier 202, the carrier 202 is used for carrying the wafer 208, the fixing device 204 is used for fixing the wafer 208, and the liftable vacuum chuck 206 is used for adsorbing the wafer 208. When the curved wafer is loaded on the carrier 202, the gap between the wafer and the carrier 202 is large, so that the vacuum suction device on the carrier 202 cannot effectively suck the wafer. When the liftable vacuum chuck 206 is disposed on the carrier 202, the liftable vacuum chuck 206 can move up and down along the vertical direction of the carrier 202, for example, the liftable vacuum chuck 206 moves up along the vertical direction of the carrier 202 to be close to the wafer 208, thereby effectively adsorbing the wafer.
In this embodiment, the number of the liftable vacuum chucks 206 is plural, and referring to fig. 7, when the wafer carried on the carrying device 202 is a curved wafer, the sizes of the gaps between different positions of the wafer and the carrying device 202 are different, and the suction capability to the wafer can be increased by arranging the liftable vacuum chucks 206 at different positions of the carrying device 202. Specifically, one liftable vacuum chuck 206 may be disposed at a central position of the carrying device 202, and a plurality of liftable vacuum chucks 206 may be disposed around the central position. Each liftable vacuum chuck 206 can have a corresponding telescoping device, the telescoping device can be a stepper motor, the telescoping device drives the liftable vacuum chuck 206 to move up and down, because each telescoping device is independent motion, each liftable vacuum chuck 206 can have different rise heights, the liftable vacuum chuck 206 can be selectively moved according to the gap with the wafer, the adsorption capacity of the liftable vacuum chuck 206 is improved, and meanwhile damage to the wafer is avoided. For example, the gap between the carrier 202 and the center of the wafer is large, the elevation height of the vacuum chuck 206 at the center of the carrier 202 is large, the gap between the carrier 202 and the edge of the wafer is small, and the elevation height of the vacuum chuck 206 at the edge of the carrier 202 is small.
In a specific application, after the robot 100 transfers the wafer to the carrier 202 on the wafer carrier 200, the fixing device 204 is moved to push the wafer to the center of the carrier 202, and after the wafer is moved to the center, the fixing device 204 fixes the wafer to prevent the wafer from deviating from the center of the carrier 202. Then, the vacuum adsorption device on the carrying device 202 is started, if the vacuum adsorption device cannot effectively adsorb the wafer, the wafer may have a certain curvature, and the curvature of the wafer makes a gap between the wafer and the carrying device 202 larger, so that the vacuum adsorption device cannot effectively adsorb the wafer. At this time, the vacuum chuck apparatus may be turned off, and the vacuum chuck 208 may be turned on, so that the vacuum chuck 206 may move toward the wafer along the vertical direction of the carrier 202, and the gap between the wafer and the vacuum chuck apparatus is reduced, so as to effectively chuck the wafer. The carrier 202 may be provided with a plurality of liftable vacuum chucks 206, each liftable vacuum chuck 206 is driven by its corresponding retractable device to slowly ascend, and when the liftable vacuum chuck 206 reaches a vacuum value meeting requirements, that is, when the liftable vacuum chuck 206 successfully adsorbs a wafer, the liftable vacuum chuck 206 stops moving until all the liftable vacuum chucks 206 reach the vacuum value meeting the requirements, indicating that the wafer carrier platform and the wafer are fixed together. The fixture 204 may then be removed.
The semiconductor machine station provided by the embodiment of the present application is described in detail above, because the first yoke portion of the robot arm in the machine station has a warping degree relative to the main body portion, the first yoke portion can be better attached to the curved wafer together, a gap between the first yoke portion and the curved wafer is reduced, so that the robot arm can grab the curved wafer and convey the curved wafer to the wafer bearing platform, and the conveying efficiency of the wafer is improved.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments.
The foregoing is only a preferred embodiment of the present invention, and although the present invention has been disclosed in the preferred embodiments, it is not intended to limit the present invention. Those skilled in the art can make numerous possible variations and modifications to the present teachings, or modify equivalent embodiments to equivalent variations, without departing from the scope of the present teachings, using the methods and techniques disclosed above. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention, unless the contents of the technical solution of the present invention are departed.
Claims (10)
1. A semiconductor machine, comprising:
the wafer bearing platform and the at least one mechanical arm;
each of the robot arms includes: the fork arm comprises a main body part and a first fork arm part connected with a first end of the main body part, wherein the tail end of the first fork arm part has a downward warping degree relative to the main body part;
the mechanical arm is used for grabbing the wafer with the edge warped downwards relative to the center and conveying the wafer to the wafer bearing platform, and the wafer bearing platform is used for bearing the wafer.
2. The machine station of claim 1, wherein the robotic arm comprises:
a second prong portion connected to a second end of the main body portion, the second prong portion being horizontally disposed relative to the main body portion.
3. The machine table as claimed in claim 2, wherein the first fork arm portion and the second fork arm portion are each provided with a vacuum suction device thereon, and the vacuum suction devices are configured to suck the wafer.
4. The machine station of claim 1, wherein the robotic arms include at least a first robotic arm and a second robotic arm;
the tail end of the first fork arm part of the first mechanical arm has an upward warping degree relative to the main body part of the first mechanical arm;
the tail end of the first fork arm part of the second mechanical arm has downward warping degree relative to the main body part of the first mechanical arm;
the first mechanical arm is used for grabbing the wafer with the edge warped upwards relative to the center, and the second mechanical arm is used for grabbing the wafer with the edge warped downwards relative to the center.
5. The machine station of claim 4, wherein the first robot comprises: a second forked arm portion connected with a second end of the main body portion of the first mechanical arm, wherein the second forked arm portion of the first mechanical arm is horizontally arranged relative to the main body portion of the first mechanical arm;
the second robot arm includes: a second prong portion of the second robotic arm disposed horizontally with respect to the body portion of the second robotic arm.
6. The machine table as claimed in any one of claims 1 to 5, wherein a warpage of the distal end of the first fork arm portion with respect to the main body portion is less than or equal to 500 μm, and a warpage of the edge of the wafer with respect to the center is in a range from 500 μm to 1000 μm.
7. The apparatus of claim 1, wherein the wafer support platform comprises:
the device comprises a supporting device, a bearing device, a fixing device and a liftable vacuum chuck;
the bearing device is positioned on the supporting device, the fixing device is positioned on the supporting device and surrounds the bearing device, and the liftable vacuum sucker is positioned on the bearing device;
the supporting device is used for supporting the bearing device, the bearing device is used for bearing the wafer, the fixing device is used for fixing the wafer, and the liftable vacuum chuck is used for adsorbing the wafer.
8. The machine table of claim 7, wherein the number of the liftable vacuum chucks is plural.
9. The machine platform of claim 8, wherein each of the vacuum suction cups has a corresponding retractable device for moving the corresponding vacuum suction cup up and down.
10. The machine station of claim 9, wherein the retractable device is a stepper motor.
Priority Applications (1)
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Citations (3)
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| JP2001077171A (en) * | 1999-08-31 | 2001-03-23 | Kyocera Corp | Ceramic converter arm and its manufacture |
| CN104690641A (en) * | 2013-12-04 | 2015-06-10 | 台湾积体电路制造股份有限公司 | Transfer Module for Bowed Wafers |
| CN110197805A (en) * | 2019-07-05 | 2019-09-03 | 德淮半导体有限公司 | Semiconductor equipment and operational method |
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| KR20070047494A (en) * | 2005-11-02 | 2007-05-07 | 삼성전자주식회사 | Wafer transfer apparatus having three adsorbing fingers |
| JP6298099B2 (en) * | 2016-05-18 | 2018-03-20 | キヤノントッキ株式会社 | Substrate transfer device |
| CN209658147U (en) * | 2019-03-26 | 2019-11-19 | 上海华力集成电路制造有限公司 | A kind of antislip ring and mechanical arm |
| CN112002665A (en) * | 2020-08-07 | 2020-11-27 | 武汉华星光电半导体显示技术有限公司 | Vacuum robot arm for transferring substrate and vacuum equipment |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001077171A (en) * | 1999-08-31 | 2001-03-23 | Kyocera Corp | Ceramic converter arm and its manufacture |
| CN104690641A (en) * | 2013-12-04 | 2015-06-10 | 台湾积体电路制造股份有限公司 | Transfer Module for Bowed Wafers |
| CN110197805A (en) * | 2019-07-05 | 2019-09-03 | 德淮半导体有限公司 | Semiconductor equipment and operational method |
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