TWI759068B - Wafer pick and place device - Google Patents

Wafer pick and place device Download PDF

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Publication number
TWI759068B
TWI759068B TW110101063A TW110101063A TWI759068B TW I759068 B TWI759068 B TW I759068B TW 110101063 A TW110101063 A TW 110101063A TW 110101063 A TW110101063 A TW 110101063A TW I759068 B TWI759068 B TW I759068B
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wafer
suction cup
arm body
roller
vacuum suction
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TW110101063A
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Chinese (zh)
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TW202228234A (en
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馮傳彰
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辛耘企業股份有限公司
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Priority to KR1020210055592A priority patent/KR102488539B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

A wafer pick and place device adapting for picking up a wafer from a wafer transport box comprises a driving module and two carrying arms. The carrying arms are connected to the driving module, spaced apart from each other, and able to be driven to move between an initial position relatively far away from each other and a working position relatively close to each other by the driving module. The carrying arms are able to be operated to move into the wafer transport box in the initial position, and then the carrying arms are driven to move to the working position to carry the wafer. Each carrying arm includes an arm body, a vacuum chuck and a support convex body which are provide in the arm body. This can reduce the probability of failure to pick up and damage to the wafer.

Description

晶圓取放裝置Wafer pick and place device

本發明是有關於一種晶圓取放裝置，特別是指一種用以自晶圓運送盒取出晶圓的晶圓取放裝置。The present invention relates to a wafer pick-and-place device, in particular to a wafer pick-and-place device for taking out wafers from a wafer transport box.

參閱圖1，在半導體製程中，通常利用一晶圓運送盒B容置多片晶圓W，以將該等晶圓W傳送至下一個工作站。當進行至後段製程時，由於該等晶圓W被磨薄而降低剛性，使得該等晶圓W放置於該晶圓運送盒B內時容易產生高變形量。在該晶圓運送盒B內的晶圓W，可能有些會往上翹曲而有些會往下翹曲，導致有些相鄰晶圓W之間的間隙變小。Referring to FIG. 1 , in a semiconductor manufacturing process, a wafer carrier B is usually used to accommodate a plurality of wafers W, and the wafers W are transferred to the next workstation. When proceeding to the back-end process, the rigidity of the wafers W is reduced due to the thinning, so that the wafers W are likely to have a high deformation amount when placed in the wafer transport box B. As shown in FIG. Some of the wafers W in the wafer transport box B may be warped upward and some may be warped downward, resulting in a smaller gap between some adjacent wafers W.

目前通常以叉子狀的機械手(未圖示)自該晶圓運送盒B取出晶圓W。由於機械手伸入該晶圓運送盒B的位置相對於該晶圓運送盒B的兩側壁B1的距離固定，且大約在晶圓W中心與側壁B1之間的中間位置，當相鄰晶圓W之間的間隙太小時，即沒有足夠的空間可供機械手伸入，容易造成機械手取片失敗或碰撞晶圓W。Conventionally, a fork-shaped robot (not shown) takes out the wafer W from the wafer transport box B at present. Since the position where the robot arm extends into the wafer transport box B is fixed relative to the distance between the two side walls B1 of the wafer transport box B, and is about the middle position between the center of the wafer W and the side walls B1, when adjacent wafers The gap between W is too small, that is, there is not enough space for the manipulator to penetrate, which may easily cause the manipulator to fail to take wafers or to collide with the wafer W.

因此，本發明之一目的，即在提供一種可以解決前述問題的晶圓取放裝置。Therefore, one objective of the present invention is to provide a wafer pick-and-place device that can solve the aforementioned problems.

於是，本發明晶圓取放裝置在一些實施態樣中，適用於自一晶圓運送盒取出一晶圓，該晶圓取放裝置包含：一驅動模組及兩個承載臂。該等承載臂彼此相間隔地設於該驅動模組且可受該驅動模組驅動而在一彼此相對遠離的初始位置與一彼此相對靠近的工作位置之間移動，且能受操作地在該初始位置時伸入該晶圓運送盒並自該初始位置移動至該工作位置承載該晶圓。每一承載臂包括一臂體、一真空吸盤及一支撐凸體。該臂體自該驅動模組沿一延伸方向延伸並具有一連接該驅動模組的第一端部、一位於該臂體末端的第二端部，及一由該第一端部延伸至該第二端部並朝上的上表面。該真空吸盤設於該臂體且凸出該上表面並位於靠近該第二端部處，用以在該承載臂位於該工作位置時吸附固定該晶圓。該支撐凸體設於該臂體且凸出該上表面，用以支撐該晶圓。Therefore, in some embodiments, the wafer pick-and-place device of the present invention is suitable for taking out a wafer from a wafer transport box, and the wafer pick-and-place device includes a drive module and two carrier arms. The carrying arms are spaced apart from each other on the driving module and can be driven by the driving module to move between an initial position relatively far away from each other and a working position relatively close to each other, and can be operated in the In the initial position, it extends into the wafer transport box and moves from the initial position to the working position to carry the wafer. Each carrying arm includes an arm body, a vacuum suction cup and a supporting convex body. The arm body extends from the driving module in an extending direction and has a first end portion connected to the driving module, a second end portion located at the end of the arm body, and a second end portion extending from the first end portion to the The upper surface of the second end and facing upwards. The vacuum suction cup is arranged on the arm body and protrudes from the upper surface and is located near the second end portion, and is used for sucking and fixing the wafer when the carrying arm is at the working position. The supporting protrusion is disposed on the arm and protrudes from the upper surface for supporting the wafer.

在一些實施態樣中，每一承載臂還包括一滾輪，該滾輪設於該臂體、凸出該上表面、位於靠近該真空吸盤處且可繞一平行該延伸方向的軸心轉動，用以於該承載臂自該初始位置移動至該工作位置期間支撐該晶圓並相對於該晶圓滾動。In some embodiments, each carrying arm further includes a roller, the roller is disposed on the arm body, protrudes from the upper surface, is located near the vacuum suction cup, and can rotate around an axis parallel to the extending direction, using so as to support the wafer and roll relative to the wafer during the movement of the carrier arm from the initial position to the working position.

在一些實施態樣中，該真空吸盤可浮動地設於該臂體，在未受外力作用時該真空吸盤凸出該上表面的高度低於該滾輪，且該真空吸盤能受一氣流作用浮升以使該真空吸盤凸出該上表面的高度高於該滾輪。In some embodiments, the vacuum suction cup can be floated on the arm body, and the height of the vacuum suction cup protruding from the upper surface is lower than the roller when no external force is applied, and the vacuum suction cup can be floated by an air flow. Raised so that the height of the vacuum suction cup protruding from the upper surface is higher than the roller.

在一些實施態樣中，該滾輪為長條形且在該延伸方向延伸。In some embodiments, the roller is elongated and extends in the extending direction.

在一些實施態樣中，該臂體還具有一自該第一端部延伸的基段及一自該基段延伸至該第二端部的延伸段，該上表面形成於該基段及該延伸段，該基段的寬度大於該延伸段，該真空吸盤及該滾輪位於該延伸段，該支撐凸體位於該基段且靠近該延伸段處並較該真空吸盤及該滾輪靠近另一承載臂。In some embodiments, the arm body further has a base section extending from the first end and an extension section extending from the base section to the second end, and the upper surface is formed on the base section and the second end. an extension section, the width of the base section is larger than that of the extension section, the vacuum suction cup and the roller are located in the extension section, the support protrusion is located in the base section and close to the extension section and is closer to another bearing than the vacuum suction cup and the roller arm.

本發明至少具有以下功效：藉由該等承載臂可在該初始位置時伸入該晶圓運送盒，以避免碰撞晶圓，且在該等承載臂進入該晶圓運送盒後再移動至該工作位置，能夠確實承托晶圓以將晶圓平穩地自該晶圓運送盒取出，而能降低取片失敗及損壞晶圓的機率。The present invention has at least the following effects: the carrier arms can be extended into the wafer transport box at the initial position to avoid collision with wafers, and the carrier arms can be moved to the wafer transport box after entering the wafer transport box The working position can indeed support the wafers to smoothly take out the wafers from the wafer transport box, thereby reducing the probability of failure in taking out and damaging the wafers.

參閱圖2至圖4，本發明晶圓取放裝置100之一實施例適用於自一晶圓運送盒B取出一晶圓W，該晶圓取放裝置100包含一驅動模組1及兩個承載臂2。Referring to FIGS. 2 to 4 , an embodiment of the wafer pick-and-place apparatus 100 of the present invention is suitable for taking out a wafer W from a wafer carrier B. The wafer pick-and-place apparatus 100 includes a drive module 1 and two carrying arm 2.

該等承載臂2彼此相間隔地設於該驅動模組1且可受該驅動模組1驅動而在一彼此相對遠離的初始位置(如圖2所示)與一彼此相對靠近的工作位置(如圖3所示)之間移動，且能受操作地在該初始位置時伸入該晶圓運送盒B並自該初始位置移動至該工作位置承載該晶圓W。該驅動模組1可以利用例如氣壓缸、螺桿、皮帶輪、齒輪、齒條等一般機械結構來驅動該等承載臂2。The carrying arms 2 are disposed on the driving module 1 at a distance from each other and can be driven by the driving module 1 to an initial position relatively far away from each other (as shown in FIG. 2 ) and a working position relatively close to each other ( As shown in FIG. 3 ), it can be operated to extend into the wafer transport box B at the initial position and move from the initial position to the working position to carry the wafer W. The driving module 1 can use general mechanical structures such as pneumatic cylinders, screws, pulleys, gears, racks and the like to drive the carrying arms 2 .

每一承載臂2包括一臂體21、一真空吸盤22、一滾輪23及一支撐凸體24。該臂體21自該驅動模組1沿一延伸方向D1延伸並具有一連接該驅動模組1的第一端部211、一位於該臂體21末端的第二端部212，及一由該第一端部211延伸至該第二端部212並朝上的上表面213。該真空吸盤22設於該臂體21且凸出該上表面213並位於靠近該第二端部212處，用以在該承載臂2位於該工作位置時吸附固定該晶圓W。該滾輪23設於該臂體21、凸出該上表面213、位於靠近該真空吸盤22處且可繞一平行該延伸方向D1的軸心A轉動，用以於該承載臂2自該初始位置移動至該工作位置期間支撐該晶圓W並相對於該晶圓W滾動。在本實施例中，該滾輪23為長條形且在該延伸方向D1延伸，以增加與該晶圓W的接觸面積。該支撐凸體24設於該臂體21且凸出該上表面213，用以支撐該晶圓W。Each carrying arm 2 includes an arm body 21 , a vacuum suction cup 22 , a roller 23 and a supporting protrusion 24 . The arm body 21 extends from the driving module 1 along an extending direction D1 and has a first end portion 211 connected to the driving module 1 , a second end portion 212 located at the end of the arm body 21 , and a The first end portion 211 extends to the upper surface 213 of the second end portion 212 and faces upward. The vacuum chuck 22 is disposed on the arm body 21 and protrudes from the upper surface 213 and is located near the second end portion 212 , for sucking and fixing the wafer W when the carrier arm 2 is at the working position. The roller 23 is disposed on the arm body 21 , protrudes from the upper surface 213 , is located near the vacuum suction cup 22 and can rotate around an axis A parallel to the extending direction D1 , so as to allow the carrying arm 2 to move from the initial position The wafer W is supported and rolled relative to the wafer W during movement to the working position. In this embodiment, the roller 23 is elongated and extends in the extending direction D1 to increase the contact area with the wafer W. As shown in FIG. The support protrusion 24 is disposed on the arm body 21 and protrudes from the upper surface 213 for supporting the wafer W.

在本實施例中，該臂體21還具有一自該第一端部211延伸的基段214及一自該基段214延伸至該第二端部212的延伸段215，該上表面213形成於該基段214及該延伸段215，該基段214的寬度大於該延伸段215。該真空吸盤22及該滾輪23位於該延伸段215，該支撐凸體24位於該基段214且靠近該延伸段215處並較該真空吸盤22及該滾輪23靠近另一承載臂2。亦即，該基段214具有一相鄰另一承載臂2的內側214a，而該支撐凸體24位於靠近該內側214a處。In this embodiment, the arm body 21 further has a base section 214 extending from the first end 211 and an extension section 215 extending from the base section 214 to the second end 212 , and the upper surface 213 is formed For the base section 214 and the extension section 215 , the width of the base section 214 is larger than that of the extension section 215 . The vacuum suction cup 22 and the roller 23 are located at the extension section 215 , the support protrusion 24 is located at the base section 214 and close to the extension section 215 and is closer to the other carrying arm 2 than the vacuum suction cup 22 and the roller 23 . That is, the base section 214 has an inner side 214a adjacent to the other carrying arm 2, and the supporting protrusion 24 is located near the inner side 214a.

參閱圖4，在本實施例中，該等承載臂2的初始位置是對應於該晶圓運送盒B的兩側壁B1之間的距離設定，以使該等承載臂2伸入該晶圓運送盒B時，該等承載臂2分別靠近該等側壁B1。由於該等側壁B1共同支撐該晶圓W，因此該晶圓W兩側受該等側壁B1支撐的部分，不會因為翹曲變形而偏離預設位置。如此在靠近該等側壁B1的位置，相鄰晶圓W之間的間距仍能維持足夠的空間以供該等承載臂2伸入，而能避免碰撞到相鄰的晶圓W。當該等承載臂2在位於初始位置並伸入該晶圓運送盒B到達定位後，先將該等承載臂2略微往上移動，使該等承載臂2由下往上靠抵於該晶圓W，再使該等承載臂2相向移動至該工作位置。當該等承載臂2到達該工作位置時，該等真空吸盤22才開始運作以真空吸附該晶圓W，而將該晶圓W吸附固定於該等承載臂2上。當該晶圓W被固定後，再使該等承載臂2退出該晶圓運送盒B並將該晶圓W傳送至欲處理該晶圓W的製程設備(未圖示)。Referring to FIG. 4 , in this embodiment, the initial positions of the carrying arms 2 are set corresponding to the distance between the two side walls B1 of the wafer transport box B, so that the carrying arms 2 extend into the wafer transport In the case of box B, the carrying arms 2 are respectively close to the side walls B1. Since the sidewalls B1 jointly support the wafer W, the portions of the wafer W supported by the sidewalls B1 on both sides of the wafer W will not deviate from the preset position due to warping deformation. In this way, at the positions close to the side walls B1, the distance between the adjacent wafers W can still maintain sufficient space for the carrying arms 2 to extend into, so as to avoid collision with the adjacent wafers W. As shown in FIG. When the carrier arms 2 are at the initial position and extend into the wafer transport box B to reach the positioning, first move the carrier arms 2 slightly upward, so that the carrier arms 2 abut against the wafer from bottom to top circle W, and then move the carrying arms 2 toward the working position. When the carrier arms 2 reach the working position, the vacuum chucks 22 start to operate to vacuum suck the wafer W, and the wafer W is sucked and fixed on the carrier arms 2 . After the wafer W is fixed, the carrier arms 2 are withdrawn from the wafer transport box B and transport the wafer W to the process equipment (not shown) for processing the wafer W.

在本實施例中，在該等承載臂2移動至該工作位置的過程中，可進一步利用該等滾輪23減少該等承載臂2與該晶圓W的摩擦阻力，且中心往下彎曲的晶圓W可順著該等滾輪23被漸漸往上抬升，而能平穩地被該等承載臂2所支撐。然而，若未設置滾輪23，亦能達到使該等承載臂2自該晶圓運送盒B取出晶圓W時避免碰撞到相鄰晶圓W的功效。In this embodiment, in the process of moving the carrying arms 2 to the working position, the rollers 23 can be used to further reduce the frictional resistance between the carrying arms 2 and the wafer W, and the center of the wafer W is bent downward. The circle W can be gradually lifted up along the rollers 23 , and can be supported by the supporting arms 2 smoothly. However, if the rollers 23 are not provided, the effect of preventing the carrier arms 2 from colliding with adjacent wafers W when taking out the wafers W from the wafer transport box B can also be achieved.

在本實施例中，該等真空吸盤22、該等滾輪23及該等支撐凸體24用以與該晶圓W接觸的部分皆為軟質材料製成，而不會損傷該晶圓W。在操作該晶圓取放裝置100自該晶圓運送盒B取出該晶圓W的過程中，可以依據不同晶圓W的狀態調整該等承載臂2在該初始位置時伸入該晶圓運送盒B的深度。例如，當該晶圓W的變形程度較大時，可先將該等承載臂2較為深入該晶圓運送盒B，再將該等承載臂2移動至該工作位置可較容易將該晶圓W中間部分往上抬升，然後再使該等承載臂2後退至一適當位置，以使該等真空吸盤22及該等支撐凸體24相對於該晶圓W的位置能夠均勻支撐該晶圓W，此時才使該等真空吸盤22開始運作以將該晶圓W吸附固定。In this embodiment, the parts of the vacuum chucks 22 , the rollers 23 and the supporting protrusions 24 for contacting the wafer W are all made of soft materials, so that the wafer W will not be damaged. In the process of operating the wafer pick-and-place device 100 to take out the wafer W from the wafer transport box B, the carrier arms 2 can be adjusted to extend into the wafer transport at the initial position according to different states of the wafer W Depth of Box B. For example, when the deformation of the wafer W is relatively large, the carrier arms 2 can be deeper into the wafer transport box B first, and then the carrier arms 2 can be moved to the working position so that the wafer can be more easily The middle part of W is lifted upwards, and then the carrying arms 2 are retracted to an appropriate position, so that the vacuum chucks 22 and the supporting protrusions 24 can evenly support the wafer W relative to the position of the wafer W , at this time, the vacuum chucks 22 start to operate to suck and fix the wafer W.

此外，參閱圖5與圖6，在本實施例中，每一承載臂2的真空吸盤22可浮動地設於該臂體21，如圖5所示，在未受外力作用(常態)時該真空吸盤22凸出該上表面213的高度低於該滾輪23，且如圖6所示該真空吸盤22能受一氣流作用浮升以使該真空吸盤22凸出該上表面213的高度高於該滾輪23。藉此，在該真空吸盤22未運作時，使該真空吸盤22位於常態而高度低於該滾輪23，可使該真空吸盤22不接觸該晶圓W，以進一步減少該承載臂2與該晶圓W的摩擦阻力。具體而言，每一承載臂2的臂體21還具有一用以容置該真空吸盤22的吸盤容置槽216及一連通該吸盤容置槽216的氣體流道217。該真空吸盤22可在該吸盤容置槽216內上下移動，且該氣體流道217連接一充氣及吸氣裝置(未圖示)。在該等真空吸盤22未運作時，使該等真空吸盤22位於常態。而要使該等真空吸盤22運作時，先對該等氣體流道217充氣，以藉由氣流推動該等真空吸盤22浮升而使該等真空吸盤22接觸該晶圓W，待該等真空吸盤22接觸並吸附該晶圓W後再對該等氣體流道217抽氣，以進一步使該等真空吸盤22形成真空吸附該晶圓W。In addition, referring to FIGS. 5 and 6 , in this embodiment, the vacuum suction cup 22 of each carrying arm 2 can be floated on the arm body 21 . As shown in FIG. 5 , when no external force is applied (normal state), the vacuum suction cup 22 The height of the vacuum suction cup 22 protruding from the upper surface 213 is lower than that of the roller 23, and as shown in FIG. The roller 23. Therefore, when the vacuum chuck 22 is not in operation, the vacuum chuck 22 is in a normal state and the height is lower than the roller 23, so that the vacuum chuck 22 does not contact the wafer W, so as to further reduce the amount of the carrier arm 2 and the wafer W. Frictional resistance of circle W. Specifically, the arm body 21 of each carrying arm 2 also has a suction cup accommodating groove 216 for accommodating the vacuum suction cup 22 and a gas flow channel 217 communicating with the suction cup accommodating groove 216 . The vacuum suction cup 22 can move up and down in the suction cup accommodating groove 216 , and the gas flow channel 217 is connected to an inflation and suction device (not shown). When the vacuum suction cups 22 are not in operation, the vacuum suction cups 22 are in a normal state. When the vacuum chucks 22 are to be operated, the gas flow channels 217 are first inflated, so that the vacuum chucks 22 are lifted by the air flow so that the vacuum chucks 22 contact the wafer W, and wait for the vacuum After the suction cups 22 contact and suck the wafer W, the gas flow channels 217 are pumped, so that the vacuum suction cups 22 form a vacuum to suck the wafer W further.

綜上所述，藉由該等承載臂2可在該初始位置時伸入該晶圓運送盒B，以避免碰撞晶圓W，且在該等承載臂2進入該晶圓運送盒B後再移動至該工作位置，能夠確實承托晶圓W以將晶圓W平穩地自該晶圓運送盒B取出，而能降低取片失敗及損壞晶圓W的機率。In summary, the carrier arms 2 can extend into the wafer transport box B at the initial position to avoid collision with the wafer W, and the carrier arms 2 can be inserted into the wafer transport box B after the carrier arms 2 enter the wafer transport box B. By moving to the working position, the wafer W can be reliably supported so that the wafer W can be smoothly taken out from the wafer transport box B, and the probability of failure in taking out and damage to the wafer W can be reduced.

惟以上所述者，僅為本發明之實施例而已，當不能以此限定本發明實施之範圍，凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。However, the above are only examples of the present invention, and should not limit the scope of the present invention. All simple equivalent changes and modifications made according to the scope of the application for patent of the present invention and the contents of the patent specification are still within the scope of the present invention. within the scope of the invention patent.

100:晶圓取放裝置 1:驅動模組 2:承載臂 21:臂體 211:第一端部 212:第二端部 213:上表面 214:基段 214a:內側 215:延伸段 216:吸盤容置槽 217:氣體流道 22:真空吸盤 23:滾輪 24:支撐凸體 A:軸心 B:晶圓運送盒 B1:側壁 D1:延伸方向 W:晶圓 100: Wafer pick and place device 1: drive module 2: carrying arm 21: Arm body 211: First End 212: Second End 213: Upper surface 214: base segment 214a: Inside 215: Extension 216: Suction cup accommodating slot 217: Gas runner 22: Vacuum suction cup 23: Roller 24: Support convex body A: Axis B: Wafer carrier B1: Sidewall D1: extension direction W: Wafer

本發明之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中： 圖1是說明現有的一晶圓運送盒容置晶圓的狀態的一不完整示意圖； 圖2是本發明晶圓取放裝置之一實施例的兩個承載臂在初始位置的一示意圖； 圖3是該等承載臂在工作位置的一示意圖； 圖4是說明該實施例自一晶圓運送盒取出一晶圓的動作流程示意圖； 圖5是說明該承載臂的一真空吸盤位於常態時的一不完整的剖視示意圖；及 圖6說明該真空吸盤浮升時的一不完整的剖視示意圖。 Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, wherein: FIG. 1 is an incomplete schematic diagram illustrating a state in which wafers are accommodated in a conventional wafer carrier; 2 is a schematic diagram of two carrying arms in an initial position of an embodiment of the wafer pick-and-place device of the present invention; Fig. 3 is a schematic diagram of the carrying arms in the working position; FIG. 4 is a schematic diagram illustrating the operation flow of taking out a wafer from a wafer carrier according to the embodiment; 5 is an incomplete cross-sectional view illustrating a vacuum chuck of the carrier arm in a normal state; and FIG. 6 illustrates an incomplete cross-sectional schematic diagram of the vacuum chuck when it floats up.

100:晶圓取放裝置 100: Wafer pick and place device

1:驅動模組 1: drive module

2:承載臂 2: carrying arm

21:臂體 21: Arm body

211:第一端部 211: First End

212:第二端部 212: Second End

213:上表面 213: Upper surface

214:基段 214: base segment

214a:內側 214a: Inside

215:延伸段 215: Extension

22:真空吸盤 22: Vacuum suction cup

23:滾輪 23: Roller

24:支撐凸體 24: Support convex body

A:軸心 A: Axis

D1:延伸方向 D1: extension direction

Claims (4)

一種晶圓取放裝置，適用於自一晶圓運送盒取出一晶圓，該晶圓取放裝置包含：一驅動模組；及兩個承載臂，彼此相間隔地設於該驅動模組且可受該驅動模組驅動而在一彼此相對遠離的初始位置與一彼此相對靠近的工作位置之間移動，且能受操作地在該初始位置時伸入該晶圓運送盒並自該初始位置移動至該工作位置承載該晶圓，每一承載臂包括一臂體，自該驅動模組沿一延伸方向延伸並具有一連接該驅動模組的第一端部、一位於該臂體末端的第二端部，及一由該第一端部延伸至該第二端部並朝上的上表面，一真空吸盤，設於該臂體且凸出該上表面並位於靠近該第二端部處，用以在該承載臂位於該工作位置時吸附固定該晶圓，一支撐凸體，設於該臂體且凸出該上表面，用以支撐該晶圓，及一滾輪，該滾輪設於該臂體、凸出該上表面、位於靠近該真空吸盤處且可繞一平行該延伸方向的軸心轉動，用以於該承載臂自該初始位置移動至該工作位置期間支撐該晶圓並相對於該晶圓滾動。 A wafer pick-and-place device is suitable for taking out a wafer from a wafer transport box, the wafer pick-and-place device comprises: a driving module; and two carrying arms, which are spaced apart from each other and arranged on the driving module and Can be driven by the driving module to move between an initial position relatively far away from each other and a working position relatively close to each other, and can be operated to extend into the wafer transport box at the initial position and from the initial position Move to the working position to carry the wafer, each carrying arm includes an arm body extending from the drive module along an extension direction and having a first end connected to the drive module, a first end portion located at the end of the arm body A second end portion, and an upper surface extending from the first end portion to the second end portion and facing upward, a vacuum suction cup, disposed on the arm body and protruding from the upper surface and located close to the second end portion is used for adsorbing and fixing the wafer when the carrying arm is at the working position, a support protrusion, disposed on the arm body and protruding from the upper surface, to support the wafer, and a roller, the roller is provided with The arm body protrudes from the upper surface, is located near the vacuum chuck and can be rotated around an axis parallel to the extending direction, so as to support the wafer during the movement of the carrier arm from the initial position to the working position and roll relative to the wafer. 如請求項1所述晶圓取放裝置，其中，該真空吸盤可浮 動地設於該臂體，在未受外力作用時該真空吸盤凸出該上表面的高度低於該滾輪，且該真空吸盤能受一氣流作用浮升以使該真空吸盤凸出該上表面的高度高於該滾輪。 The wafer pick-and-place device of claim 1, wherein the vacuum chuck can float It is movably installed on the arm body, and the height of the vacuum suction cup protruding from the upper surface is lower than the roller when not acted by external force, and the vacuum suction cup can be lifted by an air flow to make the vacuum suction cup protrude from the upper surface is higher than the wheel. 如請求項1所述晶圓取放裝置，其中，該滾輪為長條形且在該延伸方向延伸。 The wafer pick-and-place device according to claim 1, wherein the roller is elongated and extends in the extending direction. 如請求項1所述晶圓取放裝置，其中，該臂體還具有一自該第一端部延伸的基段及一自該基段延伸至該第二端部的延伸段，該上表面形成於該基段及該延伸段，該基段的寬度大於該延伸段，該真空吸盤及該滾輪位於該延伸段，該支撐凸體位於該基段且靠近該延伸段處並較該真空吸盤及該滾輪靠近另一承載臂。 The wafer pick-and-place device of claim 1, wherein the arm body further has a base section extending from the first end and an extension section extending from the base section to the second end, the upper surface is formed on the base section and the extension section, the width of the base section is larger than the extension section, the vacuum suction cup and the roller are located in the extension section, the support protrusion is located in the base section and close to the extension section and is wider than the vacuum suction cup And the roller is close to the other carrying arm.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114834891A (en) * 2022-05-19 2022-08-02 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Carrier gripper and wafer transfer device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050017529A1 (en) * 2003-07-21 2005-01-27 Rogers Theodore W. Active edge gripping end effector
US20090096229A1 (en) * 2007-10-11 2009-04-16 Bonora Anthony C Ultra low contact area end effector
US20160218030A1 (en) * 2015-01-27 2016-07-28 Lam Research Corporation End effector for wafer transfer system and method of transferring wafers

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001179672A (en) * 1999-12-21 2001-07-03 Mitsubishi Electric Corp Robot hand
KR100720415B1 (en) * 2002-03-08 2007-05-22 엘지.필립스 엘시디 주식회사 conveyance device for liquid crystal display
KR20040084005A (en) * 2003-03-26 2004-10-06 주식회사 이오테크닉스 Robot arm end effector and using method thereof
JP4310222B2 (en) * 2004-03-26 2009-08-05 シャープ株式会社 Substrate transfer device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050017529A1 (en) * 2003-07-21 2005-01-27 Rogers Theodore W. Active edge gripping end effector
US20090096229A1 (en) * 2007-10-11 2009-04-16 Bonora Anthony C Ultra low contact area end effector
US20160218030A1 (en) * 2015-01-27 2016-07-28 Lam Research Corporation End effector for wafer transfer system and method of transferring wafers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114834891A (en) * 2022-05-19 2022-08-02 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Carrier gripper and wafer transfer device
CN114834891B (en) * 2022-05-19 2023-09-22 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Carrier gripper and wafer transfer device

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