TWI812550B - Separation method of bonded substrate - Google Patents

Abstract

The invention relates to a separation method of a bonded substrate. The bonded substrate is placed on a gas-permeable plate of a de-bonding device to de-bond a wafer and carrier substrate of the bonded substrate, and the separated wafer is placed on the gas-permeable plate. A robotic arm moves the wafer and the air-permeable plate to a cleaning device for cleaning, and then moves the wafer and the air-permeable plate to a relay device. Clamping units of the relay device is used to fix the air-permeable plate, and the wafer is adsorbed by the Beinoulli robot arm to separate the wafer and the air-permeable plate, and then the robot arm transports the wafer and the air-permeable plate to a storage device respectively. The invention can automatically de-bond and clean the bonded substrate, and automatically remove the wafer from the air-permeable plate, which can avoid the problem of wafer fragments caused by the process of artificially removing the wafer from the air-permeable plate.

Description

How to separate bonded substrates

The present invention relates to a method for separating bonded substrates, which can fully automatically separate the bonded substrates and avoid the possibility of fragmentation during the process of transferring wafers.

With the advancement of semiconductor technology, the thickness of wafers has been continuously reduced to facilitate subsequent wafer cutting and packaging processes. In addition, the thinning of the wafer is also beneficial to reducing the size of the chip, reducing the resistance, speeding up the computing speed and extending the service life. However, the structure of the thinned wafer is very fragile, and it is easy for the wafer to warp or break during the subsequent manufacturing process, thus reducing the product yield.

In order to avoid the above problems, the wafer is generally temporarily bonded to a carrier substrate, and the thinned wafer is supported through the carrier substrate to prevent the thinned wafer from warping or breaking during the manufacturing process.

Specifically, the adhesive can be coated on the surface of the carrier substrate, and then the carrier substrate and the wafer are moved to the bonding machine for alignment, and the temperatures of the carrier substrate and the wafer are increased for bonding. After bonding is completed, the wafer can be thinned, etched and metallized, and finally the wafer is peeled off from the carrier substrate.

After completing the thinning process, the bonding substrate is debonded to separate the wafer and the carrier substrate. However, during the debonding process, some steps are still handled manually, which not only affects the efficiency of the process, but also increases the risk of wafer breakage.

The present invention proposes a novel bonding substrate separation method. First, a debonding device is used to separate a wafer of a bonding substrate and a carrier substrate. The separated wafer will be placed on a breathable carrier tray. The robotic arm transports the separated wafers and the breathable carrier tray to the cleaning device for cleaning, and moves the cleaned wafers and the breathable carrier tray to a relay device.

A clamping unit of the relay device is used to clamp the breathable carrier tray, and absorb the wafer placed on the breathable carrier tray through a white-end mechanical arm. Baili's robotic arm will drive the wafer away from the breathable carrier tray, causing the wafer and the breathable carrier tray to separate. Then, the wafer and the breathable carrier tray are transported to the storage device respectively through the robot arm to complete the debonding and cleaning of the bonded substrate.

Through the separation method of the present invention, the debonding, cleaning and storage of the bonded substrates can be fully automatically completed through the separation machine of the bonded substrates. During the separation process, there is no need to manually debond, clean and store the bonded substrates. Specifically, the present invention not only can fully automatically separate and clean the bonded substrate, but also further integrates the function of automatically removing the wafer from the breathable carrier tray, which can effectively avoid artificially removing the wafer from the breathable carrier after debonding and cleaning. The process of removing the wafer from the carrier plate causes the problem of wafer fragmentation, and at the same time it is helpful to improve the process efficiency.

In order to achieve the above purpose, the present invention proposes a method for separating bonded substrates, which includes: a robot arm transports a bonded substrate to a debonding device, and places the bonded substrate on a breathable carrier plate in the debonding device, The bonding substrate includes a stack of a wafer and a carrier substrate; the debonding device separates the wafer of the bonded substrate and the carrier substrate, where the wafer is located on the breathable carrier tray; the robot arm moves the stacked wafer and the breathable carrier tray to A cleaning device performs cleaning; a robotic arm moves the cleaned wafers and breathable carrier tray to a relay device, where the relay device includes a clamping unit; the clamping unit fixes the breathable carrier tray; a Baidu robot arm absorbs the wafer circle, and separate the wafer and the breathable carrier tray; and the robot arm takes out the wafer and the breathable carrier tray from the relay device.

In at least one embodiment of the present invention, a mechanical arm is included to place the breathable carrier tray into the debonding device, and then place the bonding substrate on the breathable carrier tray.

In at least one embodiment of the present invention, a debonding device is included to heat the bonded substrate, and then separate the wafer and the carrier substrate of the bonded substrate.

In at least one embodiment of the present invention, after completing the separation of the wafer of the bonded substrate and the carrier substrate, the carrier substrate is moved to a storage device through a robot arm.

In at least one embodiment of the present invention, the robot arm takes out the wafer and the breathable carrier tray from the relay device respectively, and places the wafer and the breathable carrier tray in the storage device.

In at least one embodiment of the present invention, the Baili robot arm includes a suction cup, an air outlet and a plurality of limiting units. The air outlet is located below the suction cup, and the limiting unit is located around the wafer. Through the air outlet, A negative pressure is formed below the suction cup to absorb the wafer, and the position of the wafer is limited through the limiting unit.

In at least one embodiment of the present invention, a robot arm is included to transport the bonding substrate to a positioning unit, position the bonding substrate through the positioning unit, and then place the positioned bonding substrate on the breathable carrier tray.

In at least one embodiment of the present invention, a Baidu robot arm is included to place the adsorbed wafer on a wafer placement rack of the relay device.

In at least one embodiment of the present invention, the debonding device includes a debonding device that drives the carrier substrate to displace in a direction parallel to the wafer surface, so that the carrier substrate and the wafer slide relative to each other, and the carrier substrate and the wafer are separated.

In at least one embodiment of the present invention, the relay device further includes a placement rack and a wafer placement rack, the clamping unit is located on the placement rack, and the robotic arm transports the stacked breathable carrier trays and wafers to the placement rack. The breathable carrier plate is then clamped through the clamping unit.

FIG. 1 is a schematic structural diagram of an embodiment of a bonded substrate separation machine according to the present invention. FIGS. 2 and 3 are step flow charts of an embodiment of a bonded substrate separation method. The bonded substrate separation machine 10 of the present invention includes a debonding device 11, a cleaning device 13, a relay device 15, a storage device 17, a Baidu robot arm 18 and a robot arm 19, wherein the robot arm 19 is used to transport a bonding substrate 12, a wafer 121, a carrier substrate 123 and a breathable carrier tray 14 between the debonding device 11, the cleaning device 13, the relay device 15 and the storage device 17.

First, the bonded substrate 12 is transported to the debonding device 11 through the robot arm 19 , and the bonded substrate 12 is placed on the breathable carrying tray 14 in the debonding device 11 , as shown in step 21 . As shown in FIG. 4 , the bonding substrate 12 includes a stack of a wafer 121 and a carrier substrate 123 , wherein the wafer 121 is fixed on the carrier substrate 123 through an adhesive layer 122 .

Before the bonding substrate 12 is transferred to the debonding device 11 , the breathable carrier tray 14 can be transferred to the debonding device 11 through the robot arm 19 , and then the bonded substrate 12 is placed on the breathable carrier tray 14 , for example, the breathable carrier tray 14 Can be silicon carbide.

In one embodiment of the present invention, the bonding substrate 12 and the breathable carrier tray 14 are first placed in a storage device 17, and the bonding substrate 12 and the breathable carrier tray 14 are respectively transported to the debonding device 11 through the robot arm 19, such as storage The device 17 includes a plurality of carriers for storing the bonding substrate 12 and the breathable carrier tray 14 . In addition, before the robot arm 19 moves the bonded substrate 12 to the debonding device 11 , the bonded substrate 12 may be first moved to be positioned through the positioning unit 111 , and then the positioned bonded substrate 12 may be transported to the debonding device 11 .

The debonding device 11 separates the wafer 121 of the bonded substrate 12 and the carrier substrate 123, where the wafer 121 is located on the breathable carrier tray 14, as shown in step 22

Generally speaking, the debonding device 11 will carry the bonding substrate 12 through the breathable carrier 14 , and adsorb the wafer 121 of the bonded substrate 12 through the breathable carrier 14 . For example, a first adsorption device of the debonding device 11 passes through the breathable carrier 14 The wafer 121 of the bonded substrate 12 is adsorbed. A second adsorption device located above the bonding substrate 12 adsorbs the carrier substrate 123 of the bonding substrate 12. The second adsorption device can drive the carrier substrate 123 to move relative to the wafer 121 to separate the wafer 121 and the bonding substrate 12. The carrier substrate 123, for example, the second adsorption device can drive the adsorbed carrier substrate 123 to displace in a direction parallel to the surface of the wafer 121, so that the carrier substrate 123 and the wafer 121 slide relative to each other, and separate the carrier substrate 123 and the wafer 121.

Of course, separating the carrier substrate 123 and the wafer 121 by transverse movement is only one embodiment of the present invention. In different embodiments, the second adsorption device can also be used to drive the adsorbed carrier substrate 123 away along the axial direction of the parallel wafer 121 wafer 121 to separate the wafer 121 and the carrying substrate 123 .

The debonding device 11 heats the bonding substrate 12 before separating the wafer 121 and the carrier substrate 123 of the bonding substrate 12 . In practical applications, the first adsorption device or the second adsorption device of the debonding device 11 can be provided with a heating unit, where the heating unit is used to heat the bonding substrate 12, and the adhesive layer 122 of the bonding substrate 12 is softened by heat before separation. The substrate 123 and the wafer 121 are carried. After the separation of the bonding substrate 12 is completed, the carrier substrate 123 will be separated from the wafer 121, where the wafer 121 is located on the gas-permeable carrier 14, and the carrier substrate 123 is located on the side of the wafer 121 and the gas-permeable carrier 14, as shown in Figure 5 shown. In different embodiments, the adhesive layer 122 can be irradiated with laser first to facilitate separation of the carrier substrate 123 and the wafer 121 .

The robot arm 19 takes out the stacked wafer 121 and the gas-permeable carrier 14 from the debonding device 11 , and transfers the wafer 121 and the gas-permeable carrier 14 to the cleaning device 13 for cleaning, as shown in step 23 .

In one embodiment of the present invention, the cleaning device 13 can spray chemical cleaning liquid and water onto the surface of the wafer 121 and rotate the breathable carrier plate 14 and the wafer 121 so that the chemical cleaning liquid and water are evenly distributed on the wafer 121 surface to remove the adhesive layer 122 remaining on the surface of the wafer 121 . Of course, the above method of cleaning the wafer 121 is only an embodiment of the present invention and does not limit the scope of the present invention.

After the robot arm 19 takes the breathable carrier tray 14 and the wafer 121 out of the debonding device 11, it can further take out the carrier substrate 123 in the debonder device 11, and place the carrier substrate 123 in the storage device 17, for example, in the third position of the storage device 17. Within a vehicle (Cassette) 171.

After completing the cleaning step, the robot arm 19 can take the stacked wafers 121 and the breathable carrier tray 14 out of the cleaning device 13 and transport them to the relay device 15 , as shown in step 24 .

As shown in FIG. 6 , the relay device 15 includes at least one clamping unit 151 , and the breathable carrier plate 14 is clamped and fixed through the clamping unit 151 . For example, the clamping unit 151 can be disposed on a placement rack 155 , and the breathable carrier tray 14 and the wafer 121 are placed on the placement rack 155 and between the two clamping units 151 , where the wafer 121 is located above the breathable carrier tray 14 . The clamping unit 151 can be displaced relative to the breathable carrying tray 14. When the clamping unit 151 approaches and contacts the breathable carrying tray 14, it will clamp and fix the breathable carrying tray 14, as shown in step 25.

As shown in FIG. 7 , the Baili robot arm 18 approaches and adsorbs the wafer 121 on the breathable carrier tray 14 , and drives the wafer 121 away from the breathable carrier tray 14 to separate the wafer 121 and the breathable carrier tray 14 , as shown in step 26 Show.

As shown in FIG. 8 , the relay device 15 also includes a wafer placement rack 153 , and the Baili robot arm 18 is used to place the adsorbed wafer 121 on the wafer placement rack 153 . In an embodiment of the present invention, the wafer placing rack 153 can be located above or below the placing rack 155 and the clamping unit 151 and is used to carry the wafer 121 . The Baili robot arm 18 adsorbs the wafer 121 in a non-contact manner, which can effectively avoid damage to the wafer 121 during the process of separating the wafer 121 and the breathable carrier tray 14 . Compared with manually picking up the wafer 121, the present invention can effectively improve the speed and yield of the process.

In one embodiment of the present invention, the wafer placing rack 153 can be a trifurcated carrying device, such as an E-shape, which can prevent the wafer 121 placed on the wafer placing rack 153 from sagging, in which the central protruding portion 1531 is located in the middle. The length may be smaller than the protrusions on both sides and used to support the central area of the wafer 121 .

Please refer to FIG. 9 . One end of the Baili robot arm 18 includes a suction cup 181 . An air outlet 183 can be provided in the central area below the suction cup 181 , and a plurality of limiting units 185 are provided around the suction cup 181 . The gas ejected from the air outlet 183 will form a rotating air flow in the space below the suction cup 181 and create a negative pressure to absorb the wafer 121 . The limiting unit 185 may have an L-shaped cross section and include a connecting portion 1851 and a protruding portion 1853. The connecting portion 1851 of the limiting unit 185 is used to connect the suction cup 181 and can extend along the radial direction of the suction cup 181 to The outside of the suction cup 181. One end of the protruding portion 1853 of the limiting unit 185 is connected to the connecting portion 1851 , and the other end protrudes parallel to the axial direction of the suction cup 181 , for example, protrudes toward the bottom of the suction cup 181 .

When the Baili robot arm 18 absorbs the wafer 121 , the protruding portion 1853 of the limiting unit 185 will be located outside the wafer 121 and protrude from the lower surface of the wafer 121 . The limiting unit 185 can be used to limit the position of the wafer 121 to prevent the wafer 121 from rotating relative to the Baidu robot arm 18 when the Baidu robot arm 18 absorbs the wafer 121 .

In one embodiment of the present invention, the Baidu robot arm 18 can be connected to a rotation mechanism, so that the Baidu robot arm 18 can drive the adsorbed wafer 121 to flip, for example, 180 degrees, and then place the flipped wafer 121 on The wafer is placed on the rack 153 .

After the wafer 121 and the breathable carrier tray 14 are separated by the Baidu robot arm 18 and the clamping unit 151, the wafer 121 and the breathable carrier tray 14 placed in the relay device 15 can be taken out respectively through the robot arm 19, as shown in step 27. Show. The robot arm 19 can transport the wafer 121 and the breathable carrier tray 14 to the storage device 17 respectively, as shown in step 28 .

As shown in FIG. 10 , the robotic arm 19 can extend under the wafer 121 and take out the wafer 121 placed on the wafer placing rack 153 . Then the robotic arm 19 can place the wafer 121 on the second loader of the storage device 17 . Tool 173. In one embodiment of the present invention, the wafer placement rack 153 may be a trifurcated bearing seat, and one end of the robotic arm 19 may be of a bifurcated structure, such as a U-shape. When the robotic arm 19 extends under the wafer 121 , the bifurcated robot arm 19 will intersect with the trifurcated wafer placement rack 153 , for example, the central protruding portion 1531 of the wafer placement rack 153 will be located between the bifurcated robot arms 19 .

In addition, the robot arm 19 supports the wafer 121 from below and drives the wafer 121 away from the wafer placement rack 153 . When the robot arm 19 moves the wafer 121, it will not pull or press the wafer 121, which can effectively prevent the wafer 121 from being broken.

As shown in FIG. 11 , the clamping unit 151 leaves the breathable carrier tray 14 , the robot arm 19 extends under the breathable carrier tray 14 , and takes out the breathable carrier tray 14 on the placement rack 155 , and then the robot arm 19 can remove the breathable carrier tray 14 Placed in the third carrier 175 of the storage device 17 .

In another embodiment of the present invention, the robot arm 19 may first transfer the taken-out breathable carrier tray 14 to the storage device 17 , and then transfer the taken-out wafer 121 to the storage device 17 . In practical applications, the order in which the robot arm 19 transports the gas-permeable carrier tray 14 and the wafer 121 can be adjusted according to needs. Therefore, the order in which the gas-permeable carrier tray 14 and the wafer 121 are taken out and transported is not limited to the scope of the present invention.

The above is only one of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. That is, all changes in shape, structure, characteristics and spirit described in the patent scope of the present invention may be equal to those described above. Modifications should be included in the patentable scope of the present invention.

10:Separation machine for bonded substrates

11:Debonding device

111: Positioning unit

12:Bonding substrate

121:wafer

122: Adhesive layer

123: Carrying substrate

13:Cleaning device

14: Breathable carrying tray

15:Relay device

151: Clamping unit

153:Wafer placement rack

1531:Central protrusion

155:Placement rack

17: Storage device

171:First vehicle

173:Second vehicle

175:Third vehicle

18:Bai Lili’s robotic arm

181:Suction cup

183: vent

185:Limiting unit

1851:Connection Department

1853:Protrusion

19:Robotic arm

[Fig. 1] is a schematic structural diagram of an embodiment of a bonded substrate separation machine according to the present invention.

[Fig. 2] and [Fig. 3] are step flow charts of an embodiment of the bonded substrate separation method of the present invention.

[Fig. 4] is a schematic cross-sectional view of an embodiment of the bonding substrate of the present invention placed on a breathable carrier tray.

[Fig. 5] is a schematic cross-sectional view of an embodiment of the bonded substrate and the breathable carrier plate after debonding according to the present invention.

[Fig. 6] is an operational schematic diagram of an embodiment of the bonded substrate separation method of the present invention.

[Fig. 7] is an operational schematic diagram of an embodiment of the bonded substrate separation method of the present invention.

[Fig. 8] is an operational schematic diagram of an embodiment of the bonded substrate separation method of the present invention.

[Fig. 9] is a schematic cross-sectional view of an embodiment of the Baili robot arm for bonding substrates according to the present invention.

[Fig. 10] is an operational schematic diagram of an embodiment of the bonded substrate separation method of the present invention.

[Fig. 11] is an operational schematic diagram of an embodiment of the bonded substrate separation method of the present invention.

Claims (10)

A method for separating bonded substrates, including: a robot arm transports a bonded substrate to a debonding device, and places the bonded substrate on a breathable carrier tray in the debonding device, wherein the bonded substrate includes a The stacking of wafers and a carrier substrate; the debonding device separates the wafer of the bonded substrate and the carrier substrate, wherein the wafer is located on the breathable carrier tray; the robotic arm separates the stacked wafer and the breathable carrier The tray is moved to a cleaning device for cleaning; the robot arm moves the cleaned wafer and the breathable carrier tray to a relay device, wherein the relay device includes a clamping unit; the clamping unit fixes the breathable carrier the tray; a Baidu robot arm absorbs the wafer and separates the wafer and the breathable carrier tray; and the robot arm takes out the wafer and the breathable carrier tray from the relay device. The method for separating bonded substrates as described in claim 1 includes placing the mechanical arm into the air-permeable carrier tray into the debonding device, and then placing the bonded substrate on the air-permeable carrier tray. The method for separating a bonded substrate as claimed in claim 1 includes the debonding device heating the bonded substrate, and then separating the wafer and the carrier substrate of the bonded substrate. The method for separating the bonded substrate as described in claim 1 includes, after completing the separation of the wafer of the bonded substrate and the carrier substrate, moving the carrier substrate to a storage device through the robot arm. The method for separating bonded substrates according to claim 4, wherein the robot arm takes out the wafer and the breathable carrier tray from the relay device respectively, and places the wafer and the breathable carrier tray in the storage device . The method for separating bonded substrates as described in claim 1, wherein the Baidu robot arm includes a suction cup, an air outlet and a plurality of limiting units, the air outlet is located below the suction cup, and the limiting unit is located Around the wafer, a negative pressure is formed under the suction cup through the air outlet to absorb the wafer, and the position of the wafer is limited through the limiting unit. The method for separating a bonded substrate as described in claim 1 includes the robot arm transporting the bonded substrate to a positioning unit, positioning the bonded substrate through the positioning unit, and then positioning the bonded substrate Place on this breathable carrier tray. The method for separating a bonded substrate as described in claim 1, including the debonding device driving the carrier substrate to displace in a direction parallel to the wafer surface, so that the carrier substrate and the wafer slide relative to each other, and separating the carrier substrate and the wafer. the wafer. The method for separating bonded substrates according to claim 1, wherein the relay device further includes a placement rack and a wafer placement rack, the clamping unit is located on the placement rack, and the robot arm stacks the breathable carrier The tray and the wafer are transported to the placement rack, and then the breathable carrier tray is clamped through the clamping unit. The method for separating bonded substrates as described in claim 9 includes the Baidu robot arm placing the adsorbed wafer on the wafer placement rack of the relay device.

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