JP6104753B2 - Peeling device, peeling system and peeling method - Google Patents

Description

  The disclosed embodiments relate to a peeling apparatus, a peeling system, and a peeling method.

  In recent years, for example, in the semiconductor device manufacturing process, semiconductor substrates such as silicon wafers and compound semiconductor wafers have become larger and thinner. A large-diameter and thin semiconductor substrate may be warped or cracked during transportation or polishing. For this reason, after a support substrate is bonded to a semiconductor substrate and reinforced, a transport or polishing process is performed, and then a process of peeling the support substrate from the semiconductor substrate is performed.

  For example, in Patent Document 1, the outer periphery of the second holding unit is moved in the vertical direction while the semiconductor substrate is sucked and held by the first holding unit and the support substrate is sucked and held by the second holding unit. Thus, a technique for peeling the support substrate from the semiconductor substrate is disclosed.

JP2012-69914A

  However, the above-described conventional technology has room for further improvement in terms of increasing the efficiency of the peeling process. Such a problem is a problem that may also occur in a manufacturing process such as SOI (Silicon On Insulator) that involves peeling of the substrate.

  An object of one embodiment is to provide a peeling apparatus, a peeling system, and a peeling method that can improve the efficiency of a peeling process.

A peeling apparatus according to an aspect of the embodiment includes a first holding unit, a second holding unit, and a moving unit. The first holding unit holds the first substrate among the superposed substrates obtained by bonding the first substrate and the second substrate. The second holding unit holds the second substrate among the superposed substrates. The moving unit moves a part of the outer periphery of the first holding unit in a direction away from the second holding unit. The first holding portion includes a thin plate-like elastic member, provided on the elastic member, and a plurality of suction portion for sucking the first substrate. Further, the elastic member is connected to the annular main body portion facing the outer peripheral portion of the first substrate and the moving portion, and a part of the outer peripheral portion located on the most starting point side of the peeling among the outer peripheral portions of the main body portion. And an extending portion that extends toward the opposite side of the peeling direction. In addition, the plurality of suction portions are arranged in an annular shape with respect to the main body portion, and one of the plurality of suction portions is an outer peripheral portion located on the most starting side of the peeling in the outer peripheral portion of the main body portion. Placed in.

  According to one aspect of the embodiment, the efficiency of the peeling process can be improved.

FIG. 1 is a schematic plan view showing the configuration of the peeling system according to the present embodiment. FIG. 2 is a schematic side view of a superposed substrate held by a dicing frame. FIG. 3 is a schematic plan view of a superposed substrate held on a dicing frame. FIG. 4 is a schematic side view showing the configuration of the peeling apparatus according to this embodiment. FIG. 5 is a schematic plan view of the first holding unit. FIG. 6 is a flowchart showing a processing procedure of the peeling process. FIG. 7A is an explanatory diagram of the peeling operation. FIG. 7B is an explanatory diagram of the peeling operation. FIG. 7C is an explanatory diagram of the peeling operation. FIG. 7D is an explanatory diagram of the peeling operation. FIG. 7E is an explanatory diagram of the peeling operation. FIG. 7F is an explanatory diagram of the peeling operation. FIG. 7G is an explanatory diagram of the peeling operation. FIG. 8A is an operation explanatory diagram of the peeling attraction process. FIG. 8B is an operation explanatory diagram of the peeling attraction process. FIG. 8C is an operation explanatory diagram of the peeling attraction process. FIG. 9A is a schematic plan view illustrating a shape example of a cutting edge of a sharp member. FIG. 9B is a schematic plan view illustrating a shape example of a cutting edge of a sharp member. FIG. 9C is a schematic plan view illustrating a shape example of a cutting edge of a sharp member. FIG. 10A is a schematic plan view of a first holding unit according to a first modification. FIG. 10B is a schematic plan view of the first holding unit according to the second modification. FIG. 10C is a schematic plan view of a first holding unit according to a third modification. FIG. 10D is a schematic plan view of the first holding unit according to the fourth modification. FIG. 10E is a schematic plan view of the first holding unit according to the fifth modification. FIG. 11A is a schematic view showing a manufacturing process of the SOI substrate. FIG. 11B is a schematic view showing a manufacturing process of the SOI substrate.

  Hereinafter, embodiments of a peeling device, a peeling system, and a peeling method disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

(First embodiment)
<1. Peeling system>
First, the structure of the peeling system which concerns on 1st Embodiment is demonstrated with reference to FIGS. 1-3. FIG. 1 is a schematic plan view showing the configuration of the peeling system according to the present embodiment. FIG. 2 is a schematic side view of the superposed substrate held on the dicing frame, and FIG. 3 is a schematic plan view of the superposed substrate.

  In the following, in order to clarify the positional relationship, the X-axis direction, the Y-axis direction, and the Z-axis direction that are orthogonal to each other are defined, and the positive direction of the Z-axis is the vertically upward direction.

  The peeling system 1 according to the present embodiment shown in FIG. 1 includes a polymerization substrate T (see FIG. 2) in which a substrate to be processed W and a support substrate S are bonded with an adhesive G, a substrate to be processed W and a support substrate S. Peel off.

  In the following, as shown in FIG. 2, the plate surface of the substrate to be processed W that is bonded to the support substrate S via the adhesive G is referred to as “bonding surface Wj”, and the bonding surface Wj Is referred to as the “non-bonding surface Wn”. In addition, among the plate surfaces of the support substrate S, the plate surface on the side bonded to the substrate W to be processed via the adhesive G is referred to as “bonding surface Sj”, and the plate surface on the opposite side to the bonding surface Sj is defined as “ This is referred to as “non-joint surface Sn”.

  The substrate W to be processed is a substrate in which a plurality of electronic circuits are formed on a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, and the plate surface on the side where the electronic circuits are formed is used as a bonding surface Wj. Further, the target substrate W is thinned by polishing the non-joint surface Wn, for example. Specifically, the thickness of the substrate W to be processed is about 20 to 50 μm.

  On the other hand, the support substrate S is a substrate having substantially the same diameter as the substrate W to be processed, and supports the substrate W to be processed. The thickness of the support substrate S is about 650 to 750 μm. As this support substrate S, a glass substrate etc. other than a silicon wafer can be used. Moreover, the thickness of the adhesive G which joins these to-be-processed substrate W and the support substrate S is about 40-150 micrometers.

  Further, as shown in FIG. 2, the superposed substrate T is fixed to a dicing frame F. The dicing frame F is a substantially annular member having an opening Fa having a diameter larger than that of the superposed substrate T at the center, and is formed of a metal such as stainless steel. The thickness of the dicing frame F is, for example, about 1 mm.

  The superposed substrate T is fixed to the dicing frame F via the dicing tape P. Specifically, the superposed substrate T is disposed in the opening Fa of the dicing frame F, and the dicing tape P is pasted on the non-joint surface Wn of the substrate W to be processed and the back surface of the dicing frame F so as to close the opening Fa from the back surface. wear. As a result, the superposed substrate T is fixed to the dicing frame F.

  As shown in FIG. 1, the peeling system 1 includes two processing blocks, a first processing block 10 and a second processing block 20. The first processing block 10 and the second processing block 20 are arranged adjacent to each other.

  In the first processing block 10, the superposed substrate T is carried in, the superposed substrate T is peeled off, and the substrate W to be processed is peeled off and carried out. The first processing block 10 includes a carry-in / out station 11, a first transfer area 12, a standby station 13, an edge cut station 14, a peeling station 15, and a first cleaning station 16.

  The carry-in / out station 11, the standby station 13, the edge cut station 14, the peeling station 15, and the first cleaning station 16 are disposed adjacent to the first transfer region 12. Specifically, the carry-in / out station 11 and the standby station 13 are arranged side by side on the Y axis negative direction side of the first transfer region 12, and the peeling station 15 and the first cleaning station 16 are arranged in the first transfer region 12. They are arranged side by side on the Y axis positive direction side. In addition, the edge cut station 14 is disposed on the X axis positive direction side of the first transfer region 12.

  The loading / unloading station 11 is provided with a plurality of cassette mounting tables, and each cassette mounting table is loaded with a cassette Ct in which the superposed substrate T is stored or a cassette Cw in which the substrate to be processed W after peeling is stored. Placed.

  In the first transfer region 12, a first transfer device 121 that transfers the superposed substrate T or the substrate to be processed W after peeling is arranged. The first transfer device 121 includes a transfer arm unit that can move in the horizontal direction, move up and down in the vertical direction, and turn around the vertical direction, and a substrate holding unit attached to the tip of the transfer arm unit. . In the first transfer region 12, the first transfer device 121 transfers the overlapped substrate T to the standby station 13, the edge cut station 14, and the peeling station 15, and the substrate W after being peeled off to the first cleaning station 16. And the process which conveys to the carrying in / out station 11 is performed.

  For example, an ID reader that reads an ID (Identification) of the dicing frame F is disposed in the standby station 13, and the overlapped substrate T being processed can be identified by the ID reader. In the standby station 13, in addition to the ID reading process, a standby process for temporarily waiting for the superposed substrate T waiting to be processed is performed as necessary. The standby station 13 is provided with a mounting table on which the superposed substrate T transferred by the first transfer device 121 is placed. The ID reading device and the temporary standby unit are placed on the mounting table. .

  The edge cut station 14 is provided with an edge cut device. The edge cut device performs an edge cut process in which the peripheral edge of the adhesive G (see FIG. 2) is dissolved and removed with a solvent. By removing the peripheral edge portion of the adhesive G by the edge cutting process, the substrate to be processed W and the support substrate S can be easily separated in the peeling process described later. In addition, an edge cut apparatus dissolves the peripheral part of the adhesive agent G by a solvent by immersing the superposition | polymerization board | substrate T in the solvent of the adhesive agent G, for example.

  A peeling device is arranged in the peeling station 15, and a peeling process for peeling the superposed substrate T into the substrate to be processed W and the support substrate S is performed by the peeling device. The specific configuration and operation of the peeling apparatus will be described later.

  In the first cleaning station 16, the substrate to be processed W after being peeled is cleaned. The first cleaning station 16 is provided with a first cleaning device for cleaning the substrate to be processed W after being peeled off while being held by the dicing frame F. As a 1st washing | cleaning apparatus, the washing | cleaning apparatus of Unexamined-Japanese-Patent No. 2013-033925 can be used, for example.

  In the second processing block 20, the support substrate S after being peeled is cleaned and carried out. The second processing block 20 includes a delivery station 21, a second cleaning station 22, a second transfer area 23, and a carry-out station 24.

  The delivery station 21, the second cleaning station 22, and the carry-out station 24 are disposed adjacent to the second transfer area 23. Specifically, the delivery station 21 and the second cleaning station 22 are arranged side by side on the Y axis positive direction side of the second transfer area 23, and the unloading station 24 is on the Y axis negative direction side of the second transfer area 23. Arranged side by side.

  The delivery station 21 is disposed adjacent to the peeling station 15 of the first processing block 10. In the delivery station 21, a delivery process for receiving the peeled support substrate S from the peeling station 15 and delivering it to the second cleaning station 22 is performed.

  In the delivery station 21, a second transfer device 211 is arranged. The second transport device 211 has a non-contact holding unit such as a Bernoulli chuck, for example, and the peeled support substrate S is transported in a non-contact manner by the second transport device 211.

  In the second cleaning station 22, a second cleaning process for cleaning the support substrate S after peeling is performed. In the second cleaning station 22, a second cleaning device for cleaning the support substrate S after being peeled is disposed. As a 2nd washing | cleaning apparatus, the washing | cleaning apparatus of Unexamined-Japanese-Patent No. 2013-033925 can be used, for example.

  In the second transport region 23, a third transport device 231 that transports the support substrate S after peeling is disposed. The third transfer device 231 includes a transfer arm unit that can move in the horizontal direction, move up and down in the vertical direction, and turn around the vertical direction, and a substrate holding unit attached to the tip of the transfer arm unit. . In the second transfer region 23, the third transfer device 231 performs a process of transferring the peeled support substrate S to the carry-out station 24.

  The unloading station 24 is provided with a plurality of cassette mounting tables. On each cassette mounting table, a cassette Cs in which the support substrate S after peeling is stored is mounted.

  Further, the peeling system 1 includes a control device 30. The control device 30 is a device that controls the operation of the peeling system 1. The control device 30 is a computer, for example, and includes a control unit and a storage unit (not shown). The storage unit stores a program for controlling various processes such as a peeling process. The control unit controls the operation of the peeling system 1 by reading and executing the program stored in the storage unit.

  Note that such a program may be recorded on a computer-readable recording medium and may be installed in the storage unit of the control device 30 from the recording medium. Examples of the computer-readable recording medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

  In the peeling system 1 configured as described above, first, the first transport device 121 of the first processing block 10 takes out the superposed substrate T from the cassette Ct placed on the carry-in / out station 11 and takes out the superposed substrate T taken out. Is carried into the standby station 13.

  Subsequently, in the standby station 13, the ID reading device performs an ID reading process for reading the ID of the dicing frame F. The ID read by the ID reading device is transmitted to the control device 30. Thereafter, the superposed substrate T is taken out from the standby station 13 by the first transfer device 121 and carried into the edge cut station 14.

  In the edge cut station 14, the edge cut device performs an edge cut process on the superposed substrate T. By removing the peripheral edge portion of the adhesive G by the edge cutting process, the substrate to be processed W and the support substrate S are easily separated in the subsequent peeling process. Therefore, the time required for the peeling process can be shortened.

  Thus, in the peeling system 1 according to the present embodiment, since the edge cut station 14 is incorporated in the first processing block 10, the superposed substrate T carried into the first processing block 10 is transferred to the first transfer device 121. And can be directly carried into the edge cut station 14. Accordingly, the throughput of a series of substrate processing can be improved. Moreover, the time from the edge cut process to the peeling process can be easily managed, and the peeling performance can be stabilized.

  Note that, for example, when a superposed substrate T waiting for processing is generated due to a difference in processing time between apparatuses, the superposed substrate T can be temporarily kept in a standby state using a temporary standby unit provided in the standby station 13, Loss time between a series of steps can be shortened.

  Subsequently, the superposed substrate T after the edge cut processing is taken out from the edge cut station 14 by the first transfer device 121 and is carried into the peeling station 15. And the peeling apparatus arrange | positioned in the peeling station 15 performs the peeling process with respect to the superposition | polymerization board | substrate T. FIG. By the peeling process, the superposed substrate T is separated into the substrate to be processed W and the support substrate S.

  The substrate to be processed W after peeling is taken out from the peeling station 15 by the first transfer device 121 and is carried into the first cleaning station 16. In the first cleaning station 16, the first cleaning device performs a first cleaning process on the substrate W after being peeled. By the first cleaning process, the adhesive G remaining on the bonding surface Wj of the substrate W to be processed is removed.

  The substrate W to be processed after the first cleaning process is taken out from the first cleaning station 16 by the first transfer device 121 and stored in the cassette Cw placed on the carry-in / out station 11. Thereafter, the cassette Cw is taken out from the carry-in / out station 11 and collected. Thus, the process for the substrate to be processed W is completed.

  On the other hand, in the 2nd processing block 20, the process with respect to the support substrate S after peeling is performed in parallel with the process in the 1st processing block 10 mentioned above.

  In the second processing block 20, first, the second transfer device 211 disposed at the delivery station 21 takes out the support substrate S after peeling from the peeling station 15 and carries it into the second cleaning station 22.

  Here, the support substrate S after peeling is in a state in which the upper surface side, that is, the non-joint surface Sn side is held by the peeling device, and the second transport device 211 does not move the joint surface Sj side of the support substrate S from below. Hold in contact. Thereafter, the second transfer device 211 inverts the held support substrate S and places it on the second cleaning device of the second cleaning station 22. As a result, the support substrate S is placed on the second cleaning device with the bonding surface Sj where the adhesive G remains remaining facing upward. Then, the second cleaning device performs a second cleaning process for cleaning the bonding surface Sj of the support substrate S. By the second cleaning process, the adhesive G remaining on the bonding surface Sj of the support substrate S is removed.

  The support substrate S after the second cleaning process is taken out from the second cleaning station 22 by the third transfer device 231 disposed in the second transfer region 23 and accommodated in the cassette Cs placed on the carry-out station 24. . Thereafter, the cassette Cs is taken out from the carry-out station 24 and collected. Thus, the process for the support substrate S is also completed.

  As described above, the peeling system 1 according to the present embodiment has a front end (the carry-in / out station 11 and the first transfer device 121) for the substrate (the superposed substrate T and the target substrate W after being peeled) fixed to the dicing frame F. ) And a front end (unloading station 24 and third transfer device 231) for a substrate (support substrate S after peeling) that is not held by the dicing frame F. This makes it possible to perform in parallel the process of transporting the substrate to be processed W to the carry-in / out station 11 and the process of transporting the support substrate S to the carry-out station 24. Therefore, a series of substrate processing is performed efficiently. be able to.

  In the peeling system 1 according to the present embodiment, the peeling station 15 and the second cleaning station 22 are connected via the delivery station 21. As a result, it is possible to directly carry the peeled support substrate S from the peeling station 15 to the second cleaning station 22 without going through the first transfer area 12 and the second transfer area 23. The support substrate S can be transported smoothly.

  The first processing block 10 may include a mount device for attaching the dicing frame F to the superposed substrate T. In such a case, the superposed substrate T to which the dicing frame F is not attached is taken out from the cassette Ct and loaded into the mounting device. After the dicing frame F is attached to the superposed substrate T in the mounting device, the superposed substrate fixed to the dicing frame F is used. T is sequentially transferred to the edge cut station 14 and the peeling station 15. Note that the mounting device may be arranged, for example, by moving the edge cut station 14 to the second processing block 20 and placing it at the place where the edge cut station 14 was provided.

<2. Configuration of peeling apparatus>
Next, the structure of the peeling apparatus installed in the peeling station 15 will be described with reference to FIG. FIG. 4 is a schematic side view showing the configuration of the peeling apparatus according to this embodiment.

  As shown in FIG. 4, the peeling device 5 includes a processing chamber 100. A loading / unloading port (not shown) is provided on the side surface of the processing chamber 100. The carry-in / out port is provided on each of the first transfer area 12 side and the delivery station 21 side.

  The peeling apparatus 5 includes a first holding unit 50, a moving unit 60, a second holding unit 70, a frame holding unit 80, and a peeling attraction unit 90, which are arranged inside the processing chamber 100.

  The peeling device 5 sucks and holds the support substrate S side of the superposed substrate T from above by the first holding unit 50 and holds the target substrate W side of the superposed substrate T by sucking and holding from below by the second holding unit 70. Then, the peeling device 5 moves the support substrate S in the direction away from the plate surface of the substrate W to be processed by the moving unit 60. Thereby, the support substrate S held by the first holding unit is continuously peeled from the substrate W to be processed from one end to the other end. Hereinafter, each component will be specifically described.

  The first holding unit 50 includes an elastic member 51 and a plurality of suction units 52. The elastic member 51 is a thin plate-like member and is formed of a metal such as a sheet metal. The elastic member 51 is disposed above the support substrate S so as to face the support substrate S.

  The plurality of suction portions 52 are provided on the surface of the elastic member 51 facing the support substrate S. Each suction portion 52 includes a main body portion 521 that is fixed to the elastic member 51 and a suction pad 522 that is provided below the main body portion 521.

  Each adsorption part 52 is connected to an intake device 524 such as a vacuum pump via an intake pipe 523. The first holding unit 50 sucks the non-joint surface Sn of the support substrate S by the plurality of suction units 52 by the suction force generated by the intake device 524. As a result, the support substrate S is sucked and held by the first holding unit 50.

  In addition, as the suction pad 522 with which the adsorption | suction part 52 is provided, a thing with a little deformation amount is preferable. This is because if the suction pad 522 is greatly deformed when the moving unit 60 described later pulls the first holding unit 50, the attracted portion of the support substrate S is greatly deformed along with the deformation, and the support substrate S or the object to be processed is processed. This is because the substrate W may be damaged. Specifically, it is preferable to use, for example, a suction pad having a rib on the suction surface or a flat pad having a space height of 0.5 mm or less.

  Here, the configuration of the first holding unit 50 will be described more specifically with reference to FIG. FIG. 5 is a schematic plan view of the first holding unit 50.

  As shown in FIG. 5, the plurality of suction portions 52 included in the first holding portion 50 are arranged in an annular shape with respect to the elastic member 51, face the outer peripheral portion of the support substrate S, and Each outer peripheral part is adsorbed. Here, an example in which eight suction parts 52 are provided for the elastic member 51 is shown, but the number of suction parts 52 provided in the elastic member 51 is not limited to eight.

  Among these plural adsorbing parts 52, the adsorbing part 52 arranged on the most peeling start side (here, the X-axis negative direction side) is a peeling start site formed on the polymerization substrate T by the peeling inducing part 90 described later. It is arranged at a position corresponding to M.

  The elastic member 51 includes a main body portion 511 and an extending portion 512. The main body 511 is an annular frame having an outer diameter substantially the same as that of the support substrate S and a hollow central portion. The plurality of suction portions 52 are arranged in an annular shape along the shape of the main body portion 511 on the lower surface of the main body portion 511, that is, the surface facing the support substrate S.

  The extending part 512 is a part of the outer peripheral part (here, the outer peripheral part on the X axis negative direction side) located on the most starting side of the peeling of the outer peripheral part of the main body part 511 on the side opposite to the progressing direction of the peeling. The column member 61 extends toward the (X-axis negative direction side), and the column member 61 of the moving unit 60 is connected to the tip of the extending portion 512.

  Returning to FIG. 4, the other structure of the peeling apparatus 5 is demonstrated. The moving unit 60 includes a support member 61, a moving mechanism 62, and a load cell 63.

  The column member 61 is a member that extends in the vertical direction (Z-axis direction), one end of which is connected to the extension 512 (see FIG. 5) of the elastic member 51, and the other end via the upper base 103. Connected to the moving mechanism 62.

  The moving mechanism 62 is fixed to the upper part of the upper base part 103 and moves the column member 61 connected to the lower part in the vertical direction. The load cell 63 detects a load applied to the column member 61.

  The moving unit 60 pulls up the first holding unit 50 connected to the column member 61 by moving the column member 61 vertically upward using the moving mechanism 62. At this time, the moving unit 60 can pull the first holding unit 50 while controlling the force applied to the support substrate S based on the detection result by the load cell 63.

  Here, as shown in FIG. 5, the column member 61 that serves as a lifting force point is disposed on the suction portion 52 that serves as a lifting fulcrum, that is, the most peeling side (here, the X-axis negative direction side). It arrange | positions on the opposite side of the advancing direction of peeling rather than the adsorption | suction part 52. FIG.

  Accordingly, a clockwise rotational force (moment) in FIG. 4 is generated at the outer edge portion (the peeling start position, which corresponds to a “peeling start site M” described later) of the superposed substrate T that serves as a pulling action point. . Accordingly, the moving unit 60 can pull the support substrate S so as to be turned up from the outer edge portion thereof, and can efficiently peel the support substrate S from the substrate W to be processed.

  The first holding unit 50 is supported by the moving unit 60, and the moving unit 60 is supported by the upper base unit 103. Further, the upper base portion 103 is supported by the fixing member 101 attached to the ceiling portion of the processing chamber 100 via the support column 102.

  The second holding unit 70 is disposed below the first holding unit 50 and holds the substrate to be processed W side of the superposed substrate T by suction through the dicing tape P. The second holding unit 70 includes a disc-shaped main body 71 and a support member 72 that supports the main body 71.

  The main body 71 is made of a metal member such as aluminum. An adsorption surface 73 is provided on the upper surface of the main body 71. The adsorption surface 73 is a porous body, and is formed of a resin member such as PCTFE (polychlorotrifluoroethylene).

  A suction space 74 that communicates with the outside through the suction surface 73 is formed inside the main body 71. The suction space 74 is connected to an intake device 712 such as a vacuum pump via an intake pipe 711. The second holding unit 70 uses the negative pressure generated by the intake air of the intake device 712, and adsorbs the non-joint surface Wn of the substrate W to be processed to the adsorption surface 73 via the dicing tape P. Adsorb and hold.

  The suction surface 73 of the main body 71 is formed to have a slightly larger diameter than the substrate W to be processed. Thereby, since the suction leakage at the peripheral edge of the substrate to be processed W can be prevented, the superposed substrate T can be more securely attracted and held.

  In addition, if a non-adsorption portion such as a groove is formed on the adsorption surface with the substrate W to be processed, there is a possibility that a crack may occur in the substrate W to be processed in the non-adsorption portion. Therefore, the suction surface 73 of the main body 71 is a flat surface having no non-suction part such as a groove. Thereby, it is possible to prevent the generation of cracks in the substrate W to be processed. Furthermore, since the adsorption surface 73 is formed of a resin member such as PCTFE, damage to the substrate W to be processed can be further suppressed.

  A frame holding unit 80 that holds the dicing frame F from below is disposed outside the second holding unit 70. The frame holding unit 80 includes a plurality of suction pads 81 that suck and hold the dicing frame F, a support member 82 that supports the suction pad 81, and a moving mechanism 83 that moves the support member 82 in the vertical direction.

  The suction pads 81 are formed of an elastic member such as rubber, and are provided at positions corresponding to, for example, the four corners of the dicing frame F shown in FIG. The suction pad 81 is formed with a suction port (not shown), and an intake device 822 such as a vacuum pump is connected to the suction port via a support member 82 and an intake pipe 821.

  The frame holding unit 80 holds the dicing frame F by adsorbing the dicing frame F using the negative pressure generated by the intake air of the intake device 822. The frame holding unit 80 moves the dicing frame F sucked and held by the suction pad 81 in the vertical direction by moving the support member 82 and the suction pad 81 in the vertical direction by the moving mechanism 83.

  The second holding part 70 and the frame holding part 80 are supported from below by the lower base part 104. Further, the lower base portion 104 is supported by a rotary lifting mechanism 105 fixed to the floor surface of the processing chamber 100.

  The rotation raising / lowering mechanism 105 rotates the lower base part 104 around the vertical axis to integrally rotate the second holding part 70 and the frame holding part 80 supported by the lower base part 104. Further, the rotary lifting mechanism 105 moves the lower base portion 104 in the vertical direction, thereby lifting and lowering the second holding portion 70 and the frame holding portion 80 supported by the lower base portion 104 integrally.

  A peeling inducement 90 is disposed outside the second holding unit 70. The peeling attraction part 90 forms a part on the side surface of the superposed substrate T that causes the support substrate S to be peeled off from the substrate W to be processed.

  The peeling attraction unit 90 includes a sharp member 91, a moving mechanism 92, and an elevating mechanism 93. The sharp member 91 is, for example, a flat blade, and is supported by the moving mechanism 92 such that the blade edge protrudes toward the superposed substrate T.

  The moving mechanism 92 moves the sharp member 91 along a rail extending in the X-axis direction. The elevating mechanism 93 is fixed to the upper base portion 103, for example, and moves the moving mechanism 92 in the vertical direction. Thereby, the height position of the sharp member 91, that is, the contact position with the side surface of the superposed substrate T is adjusted.

  The peeling attraction portion 90 adjusts the height position of the sharp member 91 using the lifting mechanism 93 and then moves the sharp member 91 in the horizontal direction (here, the X-axis positive direction) using the moving mechanism 92. Thus, the sharp member 91 is brought into contact with the side surface of the support substrate S near the adhesive G. As a result, a portion (hereinafter referred to as a “peeling start portion”) that causes the support substrate S to be peeled off from the substrate W is formed on the superposed substrate T.

<3. Operation of peeling device>
Next, a specific operation of the peeling apparatus 5 will be described with reference to FIGS. 6 and 7A to 7G. FIG. 6 is a flowchart showing a processing procedure of the peeling process. 7A to 7G are explanatory diagrams of the peeling operation. The peeling device 5 executes each processing procedure shown in FIG. 6 based on the control of the control device 30.

  When the superposed substrate T fixed to the dicing frame F is carried into the processing chamber 100, the peeling device 5 first connects the second substrate 70 and the dicing frame F to the second substrate 70 and the dicing frame F, respectively. The frame holding unit 80 is used to suck and hold from below (step S101). At this time, as shown in FIG. 7A, the substrate to be processed W and the dicing frame F are held by the second holding unit 70 and the frame holding unit 80 with the dicing tape P stretched horizontally.

  Subsequently, the peeling device 5 lowers the frame holding unit 80 by using the moving mechanism 83 (see FIG. 4) of the frame holding unit 80, and lowers the dicing frame F held by the frame holding unit 80 (step S102). ). Thereby, the space for making the sharp member 91 of the peeling induction part 90 advance toward the superposition | polymerization board | substrate T is ensured (refer FIG. 7B).

  Subsequently, the peeling device 5 performs a peeling attraction process using the peeling attraction unit 90 (step S103). In the peeling attraction process, a portion (peeling start portion M) that causes the support substrate S to peel from the substrate to be processed W is formed on the superposed substrate T (see FIG. 7C).

  Here, the content of the peeling attraction process will be specifically described with reference to FIGS. 8A to 8C. 8A to 8C are operation explanatory diagrams of the peeling attraction process.

  In this peeling attraction process, the substrate W to be processed among the superposed substrates T is held by the second holding unit 70, the dicing frame F is held by the frame holding unit 80, and This is performed before the support substrate S is held by the first holding unit 50. That is, the peeling attraction process is performed in a state where the support substrate S is free.

  The peeling apparatus 5 adjusts the height position of the sharp member 91 using the lifting mechanism 93 (see FIG. 4), and then moves the sharp member 91 toward the side surface of the superposed substrate T using the moving mechanism 92. Specifically, as shown in FIG. 8A, the sharp member 91 is moved substantially horizontally toward the side surface of the support substrate S near the adhesive G among the side surfaces of the superposed substrate T.

  Here, the “side surface of the support substrate S near the adhesive G” is the side surface of the support substrate S that is closer to the bonding surface Sj than the position h that is half the thickness of the support substrate S. Specifically, the side surface of the support substrate S is formed in a substantially arc shape in a sectional view, and the “side surface of the support substrate S near the adhesive G” is an angle formed with the inclined surface 91 a of the cutting edge of the sharp member 91. It is a side surface where θ is 0 degree or more and less than 90 degrees.

  The sharp member 91 is a single flat blade, and is supported by the moving mechanism 92 with the inclined surface 91a facing upward. As described above, when the single flat blade with the inclined surface 91a facing the support substrate S side is used as the sharp member 91, the sharp member 91 enters the superposed substrate T as compared with the case where both flat blades are used. The load received by the substrate to be processed W can be suppressed.

  The peeling apparatus 5 first advances the sharp member 91 to a predetermined position (preliminary advance). Thereafter, the peeling device 5 further advances the sharp member 91 to bring the sharp member 91 into contact with the side surface of the support substrate S near the adhesive G. For example, a load cell (not shown) is provided in the peeling attraction unit 90, and the peeling device 5 detects the load applied to the sharp member 91 using the load cell, so that the sharp member 91 is supported by the support substrate. Detecting contact with S.

  As described above, the side surface of the support substrate S is formed in a substantially arc shape in a sectional view. Therefore, when the sharp member 91 contacts the side surface of the support substrate S near the adhesive G, an upward force is applied to the support substrate S.

  Subsequently, as shown in FIG. 8B, the peeling device 5 further advances the sharp member 91. Thereby, the support substrate S is pushed upward along the curvature of the side surface. As a result, a part of the support substrate S is peeled off from the adhesive G, and a peeling start site M is formed.

  Since the support substrate S is not yet held by the first holding unit 50 and is in a free state, the upward movement of the support substrate S is not hindered. In the process shown in FIG. 8B, the distance d1 for moving the sharp member 91 forward is, for example, about 2 mm.

  The peeling apparatus 5 may include a confirmation device that confirms that the peeling start site M has been formed. For example, an IR (Infrared) camera installed above the support substrate S can be used as the confirmation device.

  The reflectance of infrared rays varies depending on whether the support substrate S is peeled off from the substrate W to be processed or not. Therefore, by first imaging the support substrate S with an IR camera, image data showing the difference in the reflectance of infrared rays on the support substrate S is obtained. Such image data is transmitted to the control device 30, and the control device 30 can detect a part of the support substrate S peeled from the substrate W to be processed, that is, a peeling start part M.

  When the peeling start site M is detected, the peeling device 5 proceeds to the next process described later. On the other hand, when the peeling start site M is not detected in the control device 30, the peeling device 5 further advances the sharp member 91, for example, or retracts the sharp member 91 once to separate it from the support substrate S, and thereafter, FIG. The peeling start site M is formed by performing the operation shown in FIG. 8B again. Thus, the peeling start part M can be reliably formed by providing the confirmation apparatus which confirms the peeling state of the support substrate S, and operating the peeling apparatus 5 according to a peeling state.

  When the peeling start site M is formed, the peeling device 5 sharpens while lowering the second holding unit 70 and the frame holding unit 80 using the rotary lifting mechanism 105 (see FIG. 4) as shown in FIG. 8C. The member 91 is further advanced. As a result, a downward force is applied to the substrate W and the adhesive G, and an upward force is applied to the support substrate S supported by the sharp member 91. Thereby, the peeling start site | part M expands.

  In the process shown in FIG. 8C, the distance d2 for moving the sharp member 91 forward is, for example, about 1 mm.

  In this way, the peeling device 5 makes the peeling start site M that causes the support substrate S to be peeled off from the substrate W to be processed by overlapping the sharp substrate 91 against the side surface of the support substrate S near the adhesive G. It can be formed on the side surface.

  The support substrate S has a thickness of about 5 to 15 times that of the adhesive G. Therefore, compared with the case where the sharp member 91 is brought into contact with the adhesive G to form the peeling start portion, the vertical position control of the sharp member 91 is easy.

  Further, the sharp member 91 is brought into contact with the side surface of the support substrate S near the adhesive G, whereby a force in the direction of peeling the support substrate S from the substrate W to be processed (that is, an upward force) is applied to the support substrate S. be able to. In addition, since the portion near the outermost edge portion of the support substrate S is lifted, a force in the direction of peeling the support substrate S from the substrate W can be efficiently applied to the support substrate S.

  Further, as compared with the case where the sharp member 91 is abutted against the adhesive G, the possibility that the sharp member 91 contacts the substrate W to be processed can be reduced. Therefore, damage to the substrate W to be processed by the sharp member 91 can be prevented.

  The “side surface of the support substrate S near the adhesive G” is more preferably the side surface from the bonding surface Sj of the support substrate S to the position of ¼ of the thickness of the support substrate S, that is, the sharp member 91. It is preferable that the angle θ to be formed is a side face of 0 ° to 45 °. This is because as the angle θ formed with the sharp member 91 is smaller, the force for lifting the support substrate S can be increased.

  Further, when the adhesive force between the support substrate S and the adhesive G is relatively weak, as shown in FIG. 8A, peeling is started by simply bringing the sharp member 91 into contact with the side surface of the support substrate S near the adhesive G. The site M can be formed. In this case, the operation shown in FIGS. 8B and 8C can be omitted.

  When the adhesive force between the support substrate S and the adhesive G is relatively strong, the peeling device 5 further rotates the superposed substrate T around the vertical axis by using the rotary lifting mechanism 105 from the state shown in FIG. 8C, for example. You may let them. Thereby, since the peeling start site | part M expands in the circumferential direction of the superposition | polymerization board | substrate T, it can make it easy to peel the support substrate S from the to-be-processed substrate W. FIG.

  Here, the shape of the cutting edge of the sharp member 91 will be described with reference to FIGS. 9A to 9C. 9A to 9C are schematic plan views showing examples of the shape of the cutting edge of the sharp member 91. FIG.

  As shown in FIG. 9A, the cutting edge 911 of the sharp member 91 may be formed in a straight line in a plan view. However, as shown in FIG. 9A, the peripheral edge of the support substrate S (polymerized substrate T) has an arc shape. For this reason, when the cutting edge of the sharp member 91 is linearly formed in a plan view, the load is likely to concentrate on two points (P1 and P2 in FIG. 9A) of the cutting edge that intersect with the support substrate S in a plan view. Blade spillage may occur.

  Therefore, for example, as shown in FIG. 9B, the cutting edge 911 of the sharp member 91 may have a shape recessed in an arc shape along the shape of the outer peripheral portion of the support substrate S. Thereby, since the whole blade edge | tip 911 contacts the support substrate S equally, it can prevent that load concentrates on the specific location of the blade edge | tip 911. FIG.

  Further, as shown in FIG. 9C, the cutting edge 911 of the sharp member 91 may have a shape in which the central portion protrudes in an arc shape toward the support substrate S. Thereby, compared with the case where the blade edge 911 is formed in a straight line shape, a larger portion of the blade edge 911 can enter the superposed substrate T. Therefore, when an upward force is applied to the support substrate S, The load applied to the sharp member 91 can be received in a wider area, and concentration of the load can be prevented.

  When the shape of the blade edge 911 is the shape shown in FIG. 9B, the support substrate S receives a force in an equal direction from the sharp member 91. On the other hand, when the shape of the blade edge 911 is the shape shown in FIG. 9C, the support substrate S receives a force in the direction of spreading starting from the center of the blade edge 911 of the sharp member 91.

  When the peeling attraction process in step S103 is completed, the peeling device 5 raises the second holding unit 70 and the frame holding unit 80 by using the rotary elevating mechanism 105 (see FIG. 4), so that the superposed substrate T side of the support substrate S side. Are brought into contact with the plurality of suction parts 52 of the first holding part 50 (see FIG. 7D). Then, the peeling device 5 starts the suction operation by the suction device 524, and holds the support substrate S by suction with the first holding unit 50 (step S104).

  Subsequently, the peeling device 5 operates the moving unit 60 (see FIG. 4) (step S105), and a part of the outer peripheral portion of the first holding unit 50, specifically, the extending portion 512 of the elastic member 51 is obtained. (See FIG. 5) is moved away from the second holding unit 70. As a result, the suction portion 52 arranged closest to the starting point of peeling is pulled, and the support substrate S starts to peel from the substrate W to be processed starting from the peeling start site M (see FIG. 7E).

  Here, since the elastic member 51 of the first holding unit 50 has elasticity, when the moving unit 60 pulls the first holding unit 50, the elastic member 51 is flexibly deformed along with the pulling. For this reason, the supporting substrate S can be peeled from the substrate to be processed W without applying a large load to the substrate to be processed W. In addition, since the elastic member 51 has flexibility, it is possible to apply “stickiness” to the force for peeling the support substrate S from the substrate W, so that the support substrate S can be efficiently peeled from the substrate W. Can do.

  In addition, as described above, the extending portion 512 is provided in the elastic member 51, and the support member 61 of the moving unit 60 is connected to the extending portion 512. Therefore, a rotational force (moment) is included in the force pulling the support substrate S. Can be added. Therefore, since the support substrate S can be pulled up from the outer edge portion, the support substrate S can be efficiently separated from the substrate W to be processed.

  Thereafter, the peeling device 5 further pulls up the first holding unit 50 using the moving unit 60. As a result, the peeling proceeds continuously from the end on the X axis negative direction side to the end on the X axis positive direction side of the support substrate S (see FIG. 7F). The support substrate S is peeled off (see FIG. 7G). Thereafter, the peeling device 5 ends the peeling process.

  As described above, the peeling device 5 according to this embodiment includes the first holding unit 50, the second holding unit 70, and the moving unit 60. The first holding unit 50 holds the support substrate S in the superposed substrate T in which the support substrate S (corresponding to an example of the first substrate) and the target substrate W (corresponding to an example of the second substrate) are bonded. The second holding unit 70 holds the substrate W to be processed among the superposed substrates T. The moving unit 60 moves a part of the outer periphery of the first holding unit 50 in a direction away from the second holding unit 70. In addition, the first holding unit 50 includes a thin plate-like elastic member 51 connected to the moving unit 60 and a plurality of adsorbing units 52 that are provided on the elastic member 51 and adsorb the support substrate S. Therefore, according to the peeling apparatus 5 which concerns on this embodiment, efficiency improvement of a peeling process can be achieved.

<4. Other Embodiments>
By the way, the structure of the 1st holding | maintenance part 50 is not limited to the structure shown in embodiment mentioned above. Therefore, in the following, another configuration example of the first holding unit 50 will be described with reference to FIGS. 10A to 10E. 10A to 10E are schematic plan views of the first holding unit according to the first to fifth modifications. In the following description, parts that are the same as those already described are given the same reference numerals as those already described, and redundant descriptions are omitted.

  For example, as shown in FIG. 10A, the elastic member 51A of the first holding portion 50A according to the first modification is a disc-shaped member that does not have a hollow portion instead of the annular main body portion 511 (see FIG. 5). A main body 511A is provided.

  The main body portion 511A includes a suction portion 52A, a first suction portion group including two suction portions 52A2, a second suction portion group including three suction portions 52A3, and three A third suction unit group including the suction unit 52A4 is provided. The first to third adsorption unit groups are arranged in the order of the first adsorption unit group, the second adsorption unit group, and the third adsorption unit group along the peeling progress direction.

  The two suction portions 52A2 included in the first suction portion group are arranged side by side in a direction (Y-axis direction) orthogonal to the advancing direction of peeling (X-axis positive direction) (see the imaginary line L1 shown in FIG. 10A). ). Similarly, the three suction portions 52A3 included in the second suction portion group and the three suction portions 52A4 included in the third suction portion group are also arranged side by side in a direction orthogonal to the advancing direction of the peeling (Y-axis direction). (See virtual lines L2 and L3 shown in FIG. 10A).

  As described above, among the plurality of suction portions 52A1, 52A2, 52A3, and 52A4 provided in the first holding portion 50A, the suction portions 52A2, 52A3, and 52A4 other than the suction portion 52A1 provided on the most starting side of the separation are respectively separated. They are arranged in a direction perpendicular to the traveling direction and arranged in multiple stages with respect to the traveling direction of peeling.

  That is, since the plurality of suction portions 52A2, 52A3, and 52A4 are arranged in accordance with the peeling progress direction, the support substrate S can be efficiently peeled from the substrate W to be processed.

  In addition, by disposing the suction portion 52A1 at the position corresponding to the peeling start site M, that is, the position corresponding to the peeling start site M, it is possible to reliably start the peeling of the support substrate S starting from the peeling start site M.

  As shown in FIG. 10B, the first holding unit 50B according to the second modified example includes a first adsorbing part including one adsorbing part 52B1 and three adsorbing parts 52B2 on the main body part 511A of the elastic member 51A. A group, a second adsorption unit group including three adsorption units 52B3, and a third adsorption unit group including three adsorption units 52B4. The adsorbing part 52B1 is arranged corresponding to the peeling start site M on the most starting side of the peeling, and the first to third adsorbing part groups are a first adsorbing part group and a second adsorbing part group along the advancing direction of the peeling. And it arrange | positions in order of a 3rd adsorption | suction part group.

  The three adsorbing parts 52B2 included in the first adsorbing part group are arranged side by side in an arc shape that swells in the advancing direction (X-axis positive direction) (see the imaginary line L4 in FIG. 10B). Similarly, the three adsorbing parts 52B3 included in the second adsorbing part group and the three adsorbing parts 52B4 included in the third adsorbing part group are also arranged side by side in an arc shape that swells in the peeling progress direction (shown in FIG. 10B). (See virtual lines L5 and L6).

  In this way, the suction portions 52B2, 52B3, 52B4 other than the suction portion 52B1 provided on the most starting side of peeling are arranged in an arc shape that swells in the peeling progress direction, and arranged in multiple stages with respect to the peeling progress direction. Is done.

  The separation of the support substrate S from the target substrate W proceeds in an arc shape in plan view. Therefore, the support substrate S can be efficiently peeled from the substrate W to be processed by arranging the plurality of suction portions 52B2, 52B3, 52B4 in an arc shape that swells in the peeling progress direction. Further, the supporting substrate S in the middle of peeling can be more appropriately attracted and held.

  In addition, the boundary line of separation between the support substrate S and the substrate W to be processed has an arc shape in the initial stage of separation, but as the separation progresses, the direction perpendicular to the progressing direction of the separation (Y-axis direction) ) Gradually changes to a straight line extending to.

  For this reason, the curvature of the circular arcs (imaginary lines L4 to L6 shown in FIG. 10B) drawn by each of the plurality of adsorbing portions 52B2, 52B3, 52B4 gradually decreases (that is, approaches a straight line) as it approaches the terminal end side of peeling. Is preferred.

  Further, as shown in FIG. 10C, the first holding unit 50C according to the third modified example includes a first adsorbing unit including one adsorbing unit 52C1 and three adsorbing units 52C2 on the main body 511A of the elastic member 51A. A group, a second adsorption unit group including three adsorption units 52C3, and a third adsorption unit group including three adsorption units 52C4. The adsorbing part 52C1 is arranged corresponding to the peeling start site M on the most starting side of peeling, and the first to third adsorbing part groups are a first adsorbing part group and a second adsorbing part group along the advancing direction of peeling. And it arrange | positions in order of a 3rd adsorption | suction part group.

  The first holding unit 50C according to the third modification is arranged on the most end point side of the peeling among the plurality of suction parts 52B1, 52B2, 52B3, 52B4 provided in the first holding unit 50B according to the second modification. The arrangement of the three adsorbing portions 52B4 is changed in a direction orthogonal to the advancing direction of peeling.

  That is, the three adsorbing parts 52C2 included in the first adsorbing part group and the three adsorbing parts 52C3 included in the second adsorbing part group are arranged side by side in an arc shape that swells in the advancing direction of peeling (imaginary line L7 in FIG. 10C). , L8), the three adsorbing portions 52C4 included in the third adsorbing portion group are arranged side by side in a direction orthogonal to the advancing direction of the peeling (see an imaginary line L9 shown in FIG. 10C).

  As described above, the boundary line between the support substrate S and the substrate to be processed W changes from an arc shape to a linear shape as the separation progresses. Therefore, among the plurality of suction portions 52C1, 52C2, 52C3, and 52C4, the suction portion group (here, the suction portions 52C2 and 52C3) disposed on the separation start side is arranged in an arc shape that swells in the progress direction of separation. At the same time, the adsorption unit group (here, adsorption unit 52C4) arranged closer to the end point of separation than these adsorption units 52C2 and 52C3 may be arranged side by side in a direction orthogonal to the advancing direction of separation. .

  In addition, the first holding unit 50D according to the fourth modification includes a main body portion 511A of the elastic member 51A, a first suction portion group including one suction portion 52D1, two suction portions 52D2, and three suction portions. A second adsorption unit group including 52D3 and a third adsorption unit group including three adsorption units 52D4. The adsorbing part 52D1 is arranged corresponding to the peeling start site M on the most starting side of peeling, and the first to third adsorbing part groups are a first adsorbing part group and a second adsorbing part group along the advancing direction of the peeling. And it arrange | positions in order of a 3rd adsorption | suction part group.

  The first holding unit 50D is configured such that the suction area of each of the suction parts 52D1, 52D2, 52D3, and 52D4 gradually increases as it approaches the end point of peeling. That is, the adsorption area of the adsorption part 52D1 arranged on the most starting point side of the peeling is the smallest, and the adsorption area of the three adsorption parts 52D4 arranged on the most end point side of the peeling is the largest.

  As described above, the plurality of suction portions 52D1, 52D2, 52D3, and 52D4 may be configured such that the suction area gradually increases as the end point of peeling is approached.

  Moreover, the 1st holding | maintenance part 50E which concerns on a 5th modification equips the main-body part 511A of 51 A of elastic members with a some adsorption | suction part. Of the plurality of suction parts provided in the first holding part 50E, the suction part 52E disposed on the most starting point side of the peeling is a part 525 located on the outer edge side of the main body part 511A, that is, on the outer edge side of the support substrate S. Are formed in an arc shape along the outer edge of the support substrate S.

  Thereby, the adsorption | suction part 52E can be arrange | positioned to the area | region nearer the outermost edge part of the support substrate S. FIG. Therefore, a force in the direction of peeling the support substrate S from the substrate W can be efficiently applied to the support substrate S.

  Further, in the embodiment described above, an example in which the superposed substrate to be peeled is the superposed substrate T in which the substrate to be processed W and the support substrate S are bonded by the adhesive G has been described. However, the superposition | polymerization board | substrate used as the peeling object of a peeling apparatus is not limited to this superposition | polymerization board | substrate T. FIG. For example, in the peeling apparatus 5, in order to generate an SOI substrate, a superposed substrate in which a donor substrate on which an insulating film is formed and a substrate to be processed are bonded to each other can be a peeling target.

  Here, a method for manufacturing an SOI substrate will be described with reference to FIGS. 11A and 11B. FIG. 11A and FIG. 11B are schematic views showing the manufacturing process of the SOI substrate. As shown in FIG. 11A, the polymerization substrate Ta for forming the SOI substrate is formed by bonding the donor substrate K and the handle substrate H.

  The donor substrate K is a substrate in which the insulating film 6 is formed on the surface and the hydrogen ion implantation layer 7 is formed at a predetermined depth near the surface to be bonded to the handle substrate H. As the handle substrate H, for example, a silicon wafer, a glass substrate, a sapphire substrate, or the like can be used.

  In the peeling apparatus 5, for example, in a state where the donor substrate K is held by the first holding unit 50 and the handle substrate H is held by the second holding unit 70, a part of the outer peripheral portion of the superposed substrate Ta using the moving unit 60. Is applied to the hydrogen ion implantation layer 7 formed on the donor substrate K. Thereby, as shown in FIG. 11B, the silicon-silicon bond in the hydrogen ion implantation layer 7 is cut, and the silicon layer 8 is peeled from the donor substrate K. As a result, the insulating film 6 and the silicon layer 8 are transferred onto the upper surface of the handle substrate H, and the SOI substrate Wa is formed. The handle substrate H may be held by the first holding unit 50, and the donor substrate K may be held by the second holding unit 70.

  Further, in the embodiment described above, an example in the case where the target substrate W and the support substrate S are bonded using the adhesive G has been described. However, the bonding surfaces Wj and Sj are divided into a plurality of regions, and each region is divided. Adhesives with different adhesive strengths may be applied.

  In the above-described embodiment, an example in which the superposed substrate T is held by the dicing frame F has been described. However, the superposed substrate T is not necessarily held by the dicing frame F.

  In the above-described embodiment, an example in which the sharp member 91 included in the peeling attraction part 90 is a flat blade has been described. However, the sharp member 91 may be a razor blade, a roller blade, an ultrasonic cutter, or the like. Good.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

F Dicing frame P Dicing tape S Support substrate T Superposition substrate W Substrate 1 Peeling system 5 Peeling device 10 Peeling device 10 Peeling station 20 Peeling station 20 Second treatment block 30 Control device 50 First holding part 51 Elastic member 52 Adsorption part 60 Moving part 61 Strut member 62 Moving mechanism 63 Load cell 70 Second holding part 80 Frame holding part 90 Peeling and attracting part 91 Sharp member 511 Main body part 512 Extension part 521 Main body part 522 Suction pad

Claims (8)

A first holding unit for holding the first substrate among the superposed substrates in which the first substrate and the second substrate are bonded;
A second holding unit for holding the second substrate among the superposed substrates;
A moving part that moves a part of the outer peripheral part of the first holding part in a direction away from the second holding part,
The first holding part is
A thin plate-shaped elastic member,
A plurality of adsorbing portions provided on the elastic member and adsorbing the first substrate ;
The elastic member is
An annular main body facing the outer periphery of the first substrate;
An extension part connected to the moving part and extending a part of the outer peripheral part located on the most starting side of the peeling to the opposite side of the peeling progress direction, of the outer peripheral part of the main body part;
With
The plurality of suction portions are arranged in an annular shape with respect to the main body portion, and one of the plurality of suction portions is positioned on the outermost peripheral portion of the main body portion on the most starting side of peeling. A peeling apparatus, which is disposed on an outer peripheral portion . A first holding unit for holding the first substrate among the superposed substrates in which the first substrate and the second substrate are bonded;
A second holding unit for holding the second substrate among the superposed substrates;
A moving part that moves a part of the outer peripheral part of the first holding part in a direction away from the second holding part,
The first holding part is
A thin plate-shaped elastic member,
A plurality of adsorbing portions provided on the elastic member and adsorbing the first substrate ;
The elastic member is
A disc-shaped main body,
An extension part connected to the moving part and extending a part of the outer peripheral part located on the most starting side of the peeling to the opposite side of the peeling progress direction, of the outer peripheral part of the main body part;
With
The plurality of adsorption portions are
One adsorbing portion arranged on the most starting side of peeling;
A plurality of adsorption unit groups arranged in a direction orthogonal to the advancing direction of peeling and arranged in multiple stages with respect to the advancing direction;
The peeling apparatus characterized by including . A first holding unit for holding the first substrate among the superposed substrates in which the first substrate and the second substrate are bonded;
A second holding unit for holding the second substrate among the superposed substrates;
A moving part that moves a part of the outer peripheral part of the first holding part in a direction away from the second holding part,
The first holding part is
A thin plate-shaped elastic member,
A plurality of adsorbing portions provided on the elastic member and adsorbing the first substrate ;
The elastic member is
A disc-shaped main body,
An extension part connected to the moving part and extending a part of the outer peripheral part located on the most starting side of the peeling to the opposite side of the peeling progress direction, of the outer peripheral part of the main body part;
With
The plurality of adsorption portions are
One adsorbing portion arranged on the most starting side of peeling;
A plurality of adsorbing part groups arranged in an arc shape that swells in the advancing direction of separation and arranged in multiple stages in the advancing direction
The peeling apparatus characterized by including . A first holding unit for holding the first substrate among the superposed substrates in which the first substrate and the second substrate are bonded;
A second holding unit for holding the second substrate among the superposed substrates;
A moving part that moves a part of the outer peripheral part of the first holding part in a direction away from the second holding part,
The first holding part is
A thin plate-shaped elastic member,
A plurality of adsorbing portions provided on the elastic member and adsorbing the first substrate ;
The elastic member is
A disc-shaped main body,
An extension part connected to the moving part and extending a part of the outer peripheral part located on the most starting side of the peeling to the opposite side of the peeling progress direction, of the outer peripheral part of the main body part;
With
The plurality of adsorption portions are
One adsorbing portion arranged on the most starting side of peeling;
A plurality of adsorption unit groups arranged in multiple stages with respect to the direction of peeling
Including
Among the plurality of suction part groups, the suction part group arranged on the starting side of the peeling is
Arranged in an arc shape that swells in the direction of peeling,
Among the plurality of adsorption unit groups, the adsorption unit group disposed on the end point side of the separation than the adsorption unit group disposed on the start side of the separation,
A peeling apparatus characterized by being arranged side by side in a direction perpendicular to the advancing direction of peeling. A first holding unit for holding the first substrate among the superposed substrates in which the first substrate and the second substrate are bonded;
A second holding unit for holding the second substrate among the superposed substrates;
A moving part that moves a part of the outer peripheral part of the first holding part in a direction away from the second holding part,
The first holding part is
A thin plate-shaped elastic member,
A plurality of adsorbing portions provided on the elastic member and adsorbing the first substrate ;
The elastic member is
A disc-shaped main body,
An extension part connected to the moving part and extending a part of the outer peripheral part located on the most starting side of the peeling to the opposite side of the peeling progress direction, of the outer peripheral part of the main body part;
With
The plurality of adsorption portions are
Including one adsorbing portion arranged on the most starting point side of peeling, and a plurality of adsorbing portion groups arranged in multiple stages with respect to the traveling direction, arranged in a direction orthogonal to the traveling direction of peeling, And the peeling apparatus comprised so that an adsorption | suction area may become large as it approaches the end point side of peeling. Among the plurality of suction portions, the suction portion disposed on the most starting side of peeling is
The peeling apparatus according to claim 1, wherein a portion corresponding to the outer edge of the first substrate is formed in an arc shape along the outer edge. A loading / unloading station on which a superposed substrate in which the first substrate and the second substrate are bonded is placed;
A substrate transfer device for transferring the superposed substrate placed on the carry-in / out station;
A peeling station where a peeling device for peeling the superposed substrate transferred by the substrate transfer device into the first substrate and the second substrate is disposed;
The peeling device is
A first holding unit for holding the first substrate among the superposed substrates;
A second holding unit for holding the second substrate among the superposed substrates;
A moving part that moves a part of the outer peripheral part of the first holding part in a direction away from the second holding part,
The first holding part is
A thin plate-shaped elastic member,
A plurality of adsorbing portions provided on the elastic member and adsorbing to the plate surface of the first substrate ;
The elastic member is
An annular main body facing the outer periphery of the first substrate;
An extension part connected to the moving part and extending a part of the outer peripheral part located on the most starting side of the peeling to the opposite side of the peeling progress direction, of the outer peripheral part of the main body part;
With
The plurality of suction portions are arranged in an annular shape with respect to the main body portion, and one of the plurality of suction portions is positioned on the outermost peripheral portion of the main body portion on the most starting side of peeling. A peeling system characterized in that it is arranged on the outer periphery . A thin plate-like elastic member, and a plurality of adsorbing portions that are provided on the elastic member and adsorb the first substrate among the superposed substrates in which the first substrate and the second substrate are joined , An annular main body portion facing the outer peripheral portion of the first substrate, and a part of the outer peripheral portion located closest to the starting point of the peeling of the outer peripheral portion of the main body portion is directed to the side opposite to the peeling progress direction. And the plurality of suction portions are arranged in an annular shape with respect to the main body portion, and one of the plurality of suction portions is an outer periphery of the main body portion. A first holding step of holding the first substrate among the superposed substrates by a first holding portion disposed on the outer peripheral portion located on the most starting side of the peeling among the portions ;
A second holding step of holding the second substrate of the superposed substrates by a second holding unit that holds the second substrate of the superposed substrates;
The moving unit that moves in a direction away said extending portion of the first holding portion from said second holding unit, the mobile that moves in the direction to separate the part of the outer peripheral portion of the first holding portion from the second holding portion The peeling method characterized by including these processes.

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