JP2013055307A - Peeling device, and manufacturing method of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a peeling device capable of minimizing damage on a substrate.SOLUTION: A peeling device 10 which peels a boundary surface 8 of a substrate 2 and a reinforcing plate 3 of the substrate 2, in order, from one end side toward the other end side comprises support means 20 for supporting a first principal surface 6b of a laminate 6 including the substrate 2 and the reinforcing plate 3, a flexible plate 30 which sucks a second principal surface 6a of the laminate 6, a plurality of movable bodies 40 fixed onto the flexible plate 30 at intervals and movable independently for the support means 20, and a controller 80 which controls movement of the plurality of movable bodies 40. The controller 80 controls movement of the plurality of movable bodies 40 so that a boundary line 9 of a portion where the boundary surface 8 is peeled and a portion where the boundary surface 8 is not peeled is curved to protrude backward in the direction of movement, when the linear distance H between both ends of the boundary line 9 is longest.

Description

  The present invention relates to a peeling apparatus for peeling a substrate and a reinforcing plate, and an electronic device manufacturing method.

  As electronic devices such as display panels, solar cells, and thin-film secondary batteries are made thinner and lighter, there is a demand for thinner substrates used in electronic devices. As the substrate becomes thinner, the handling of the substrate becomes worse, and it becomes difficult to form a functional layer (for example, a thin film transistor or a color filter) for an electronic device on the substrate.

  Thus, a method has been developed in which a functional layer is formed on a substrate reinforced with a reinforcing plate, and then the substrate and the reinforcing plate are peeled off (see, for example, Patent Document 1). At least one of the substrate and the reinforcing plate is bent and deformed so that the interface between the substrate and the reinforcing plate is sequentially peeled from the one end side toward the other end side. This bending deformation is carried out by adsorbing at least one of them with a flexible plate and independently moving a plurality of movable bodies fixed on the flexible plate.

International Publication No. 11/024689 Pamphlet

  Since at least one of the substrate and the reinforcing plate is bent and deformed at the time of peeling, a load is applied to at least one of them. Due to this load, at least one of the edges may break from the edge.

  This invention is made | formed in view of the said subject, Comprising: It aims at provision of the peeling apparatus which can suppress the damage at the time of peeling, and the manufacturing method of an electronic device.

In order to solve the above object, a peeling apparatus according to an aspect of the present invention includes:
In the peeling apparatus for sequentially peeling the interface between the substrate and the reinforcing plate that reinforces the substrate from one end side to the other end side,
Support means for supporting one main surface of the laminate including the substrate and the reinforcing plate;
A flexible plate for supporting the other main surface of the laminate;
A plurality of movable bodies fixed on the flexible plate at intervals and movable independently of the support means;
A control device for controlling the movement of a plurality of movable bodies,
When the linear distance between both ends of the boundary line between the part where the interface is peeled off and the part where the interface is not peeled becomes the longest, the control device has a curved shape protruding backward in the movement direction. Thus, the movement of the plurality of movable bodies is controlled.

In addition, a method for manufacturing an electronic device according to another aspect of the present invention includes:
In a method for manufacturing an electronic device, comprising a step of forming a functional layer on a substrate reinforced with a reinforcing plate, and a step of separating the reinforcing plate and the substrate on which the functional layer is formed.
The step of peeling the substrate and the reinforcing plate includes supporting the first main surface of the laminate including the substrate and the reinforcing plate with a supporting means and flexibly adsorbing the second main surface of the laminate. In the step of sequentially peeling the interface between the substrate and the reinforcing plate from one end side to the other end side by controlling the movement of the plurality of movable bodies fixed at intervals on the plate with respect to the support means. There,
The plurality of lines are arranged such that when the linear distance between both ends of the boundary line between the part where the interface is peeled off and the part where the interface is not peeled becomes the longest, the boundary line has a curved shape protruding backward in the movement direction. Control the movement of the movable body.

  ADVANTAGE OF THE INVENTION According to this invention, the peeling apparatus which can suppress the damage at the time of peeling, and the manufacturing method of an electronic device are provided.

Side view showing an example of a laminated plate used in the manufacturing process of an electronic device Side view showing an example of a laminate manufactured in the course of the manufacturing process of an electronic device Partial sectional view showing a peeling apparatus according to the first embodiment FIG. 3 is a partial cross-sectional view showing an operation example of the peeling apparatus of FIG. The figure which shows an example of the principal part of a flexible board The top view which shows the example of arrangement | positioning of the several movable body on a flexible board The figure explaining the operation example of a several movable body Partial sectional view showing a peeling apparatus according to a second embodiment FIG. 8 is a partial cross-sectional view showing an operation example of the peeling apparatus of FIG. The figure which shows an example of the peeling process using the peeling apparatus of FIG. The figure which shows another example of the peeling process using the peeling apparatus of FIG. The top view which shows the modification of FIG. The top view which shows another modification of FIG. The top view which shows the modification of a base plate The top view which shows another modification of a base plate

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof is omitted.

[First Embodiment]
The manufacturing method of the electronic device according to the present embodiment corresponds to the thinning of the substrate used in the electronic device, and therefore the step of forming the functional layer on the substrate reinforced with the reinforcing plate, the substrate on which the functional layer is formed, and the reinforcement And a step of peeling the plate. The reinforcing plate does not become part of the electronic device.

  Here, the electronic device refers to an electronic component such as a display panel, a solar battery, or a thin film secondary battery. The display panel includes a liquid crystal panel (LCD), a plasma panel (PDP), and an organic EL panel (OLED).

(Laminated board)
FIG. 1 is a side view of a laminated plate used in an electronic device manufacturing process. The laminated plate 1 includes a substrate 2 and a reinforcing plate 3 that reinforces the substrate 2.

(substrate)
A predetermined functional layer (for example, a conductive layer) is formed on the substrate 2 during the manufacturing process of the electronic device.

  The substrate 2 is, for example, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, or a semiconductor substrate. Among these, a glass substrate is preferable because it is excellent in chemical resistance and moisture permeability and has a small linear expansion coefficient. As the linear expansion coefficient decreases, the pattern of the functional layer formed at high temperatures is less likely to shift during cooling.

  The glass of the glass substrate is not particularly limited, and examples thereof include non-alkali glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses mainly containing silicon oxide. As the oxide glass, a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.

  As the glass of the glass substrate, glass suitable for the type of electronic device and its manufacturing process is preferably employed. For example, it is preferable that the glass substrate for liquid crystal panels consists of glass (an alkali free glass) which does not contain an alkali metal component substantially. As described above, the glass of the glass substrate is appropriately selected based on the type of electronic device to be applied and the manufacturing process thereof.

  The resin of the resin substrate may be a crystalline resin or an amorphous resin, and is not particularly limited.

  Examples of the crystalline resin include thermoplastic resins such as polyamide, polyacetal, polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, or syndiotactic polystyrene. Thermosetting resins include polyphenylene sulfide and polyether ether ketone. , Liquid crystal polymer, fluororesin, or polyether nitrile.

  Examples of non-crystalline resins include polycarbonate, modified polyphenylene ether, polycyclohexene, or polynorbornene-based resins that are thermoplastic resins. Examples of thermosetting resins include polysulfone, polyethersulfone, polyarylate, polyamideimide, Examples thereof include polyetherimide and thermoplastic polyimide.

  The resin for the resin substrate is particularly preferably an amorphous thermoplastic resin.

  The thickness of the substrate 2 is set according to the type of the substrate 2. For example, in the case of a glass substrate, it is preferably 0.7 mm or less, more preferably 0.3 mm or less, and still more preferably 0.1 mm or less for reducing the weight and thickness of the electronic device. In the case of 0.3 mm or less, it is possible to give good flexibility to the glass substrate. In the case of 0.1 mm or less, the glass substrate can be wound into a roll. Further, the thickness of the glass substrate is preferably 0.03 mm or more for reasons such as easy manufacture of the glass substrate and easy handling of the glass substrate.

(Reinforcement plate)
When the reinforcing plate 3 is in close contact with the substrate 2, the reinforcing plate 3 reinforces the substrate 2 until a peeling operation is performed. The reinforcing plate 3 is peeled off from the substrate 2 during the manufacturing process of the electronic device after the functional layer is formed, and does not become a part of the electronic device.

  The reinforcing plate 3 preferably has a small absolute value of the difference in linear expansion coefficient from the substrate 2 in order to suppress warping and peeling due to temperature changes. When the substrate 2 is a glass substrate, the reinforcing plate 3 preferably includes a glass plate. The glass of this glass plate is preferably the same type as the glass of the glass substrate.

  The reinforcing plate 3 includes a support plate 4 and a resin layer 5 formed on the support plate 4. The resin layer 5 and the substrate 2 are detachably coupled to each other by van der Waals force acting between the resin layer 5 and the substrate 2 or the adhesive force of the resin layer 5.

  In addition, although the reinforcement board 3 of this embodiment is comprised with the support board 4 and the resin layer 5, you may be comprised only with the support board 4. FIG. The support plate 4 and the substrate 2 are detachably coupled to each other by van der Waals force acting between the support plate 4 and the substrate 2. An inorganic thin film may be formed on the surface of the support plate 4 so that the glass plate which is the support plate 4 and the glass substrate which is the substrate 2 are not bonded at a high temperature. In addition, a region having a different bonding force may be provided at the interface between the support plate 4 and the substrate 2 by providing a region having a different surface roughness on the surface of the support plate 4.

  Moreover, although the reinforcement board 3 of this embodiment is comprised with the support plate 4 and the resin layer 5, the support plate 4 may be plural. Similarly, a plurality of resin layers 5 may be provided.

(Support plate)
The support plate 4 supports and reinforces the substrate 2 through the resin layer 5. The support plate 4 prevents the substrate 2 from being deformed, scratched, damaged or the like in the manufacturing process of the electronic device.

  The support plate 4 is, for example, a glass plate, a ceramic plate, a resin plate, a semiconductor plate, or a metal plate. The type of the support plate 4 is selected according to the type of the electronic device, the type of the substrate 2 and the like. When the support plate 4 and the substrate 2 are of the same type, warpage and peeling due to temperature changes are reduced.

The difference (absolute value) in the average linear expansion coefficient between the support plate 4 and the substrate 2 is appropriately set according to the dimension shape and the like of the substrate 2, but is preferably, for example, 35 × 10 ⁻⁷ / ° C. or less. Here, the “average linear expansion coefficient” refers to an average linear expansion coefficient (JIS R 3102) in a temperature range of 50 to 300 ° C.

  The thickness of the support plate 4 is 0.7 mm or less, for example. Further, the thickness of the support plate 4 is preferably 0.4 mm or more in order to reinforce the substrate 2. The support plate 4 may be thicker than the substrate 2 or thinner.

  The outer shape of the support plate 4 is preferably the same as or larger than the outer shape of the resin layer 5 as shown in FIG. 1 so that the support plate 4 can support the entire resin layer 5. .

(Resin layer)
When the resin layer 5 is in close contact with the substrate 2, it prevents the substrate 2 from being displaced until a peeling operation is performed. The resin layer 5 is easily peeled from the substrate 2 by a peeling operation. By easily peeling the substrate 2, it is possible to prevent the substrate 2 from being damaged and to prevent peeling at an unintended position (between the resin layer 5 and the support plate 4).

  The resin layer 5 is formed such that the bonding force with the support plate 4 is relatively higher than the bonding force with the substrate 2. Thereby, when the peeling operation is performed, it is possible to prevent the laminated plate 1 from being peeled at an unintended position (between the resin layer 5 and the support plate 4).

  The resin of the resin layer 5 is not particularly limited. For example, the resin of the resin layer 5 includes acrylic resin, polyolefin resin, polyurethane resin, polyimide resin, silicone resin, polyimide silicone resin, and the like. Several types of resins can be mixed and used. Of these, silicone resins and polyimide silicone resins are preferred from the viewpoints of heat resistance and peelability.

  Although the thickness of the resin layer 5 is not specifically limited, Preferably it is 1-50 micrometers, More preferably, it is 4-20 micrometers. By setting the thickness of the resin layer 5 to 1 μm or more, the resin layer 5 can be deformed so as to absorb the thickness of the bubbles and foreign matter when the bubbles and foreign matter are mixed between the resin layer 5 and the substrate 2. . On the other hand, when the thickness of the resin layer 5 is 50 μm or less, it is economical because the formation time of the resin layer 5 can be shortened and the resin of the resin layer 5 is not used more than necessary.

  The outer shape of the resin layer 5 is preferably the same as or larger than the outer shape of the substrate 2 as shown in FIG. 1 so that the resin layer 5 can adhere the entire substrate 2.

  In addition, the resin layer 5 may consist of two or more layers. In this case, “the thickness of the resin layer” means the total thickness of all the resin layers.

  Moreover, when the resin layer 5 consists of two or more layers, the kind of resin which forms each layer may differ.

(Laminate)
FIG. 2 is a side view showing a laminate produced in the course of the manufacturing process of the electronic device.

  The laminate 6 is formed by forming a functional layer such as a conductive layer on the substrate 2 of the laminate 1. The type of functional layer is selected according to the type of electronic device. A plurality of functional layers may be sequentially stacked on the substrate 2. As a method for forming the functional layer, a general method is used. For example, a vapor deposition method such as a CVD method or a PVD method, a sputtering method, or the like is used. The functional layer is formed in a predetermined pattern by a photolithography method or an etching method.

  For example, the laminate 6 includes a reinforcing plate 3A, a substrate 2A, a liquid crystal layer 7, a substrate 2B, and a reinforcing plate 3B in this order. This laminate 6 is produced during the manufacturing process of the LCD. A thin film transistor (TFT) (not shown) is formed on the surface of the substrate 2A on the liquid crystal layer 7 side, and a color filter (not shown) is formed on the surface of the other substrate 2B on the liquid crystal layer 7 side.

  In addition, although the laminated body 6 of this embodiment is the structure by which reinforcement board 3A, 3B is arrange | positioned at both sides, the structure by which the reinforcement board was arrange | positioned only at one side may be sufficient. For example, the liquid crystal layer 7, the substrate 2B, and the reinforcing plate 3B may not be provided.

  After the reinforcing plates 3A and 3B are peeled off, a backlight or the like is attached to obtain a product LCD. A peeling device described later is used for peeling the reinforcing plates 3A and 3B.

(Peeling device)
FIG. 3 is a partial cross-sectional view showing the peeling apparatus according to the first embodiment. FIG. 4 is a partial cross-sectional view showing an operation example of the peeling apparatus of FIG.

  The peeling apparatus 10 sequentially peels the interface 8 between the substrate 2 and the reinforcing plate 3 from one end side to the other end side. At the time of peeling, a boundary line 9 (hereinafter referred to as “pre-peeling line”) between a portion where the interface 8 is peeled and a portion where the interface 8 is not peeled moves in a predetermined direction. Hereinafter, the front of the peeling front 9 in the moving direction will be described as “front”, and the rear of the peeling front 9 in the moving direction will be described as “back”.

  The peeling device 10 holds the substrate 2 and flexes and deforms the reinforcing plate 3 to perform peeling. Note that the peeling device 10 can hold the reinforcing plate 3 and bend and deform the substrate 2 by bending.

  The peeling device 10 includes a stage 20 as a support means, a flexible plate 30, a plurality of movable bodies 40, a plurality of rods 60, a plurality of driving devices 70, a control device 80, and the like.

  The stage 20 supports the first main surface 6 b of the stacked body 6 in order to hold the substrate 2. The stage 20 vacuum-sucks the first main surface 6b of the stacked body 6. Instead of vacuum suction, electrostatic suction or magnetic suction may be used.

  The flexible plate 30 adsorbs the second main surface 6a of the stacked body 6 in order to bend and deform the reinforcing plate 3. The flexible plate 30 vacuum-sucks the second main surface 6a of the laminate 6. Instead of vacuum suction, electrostatic suction or magnetic suction may be used.

  5A and 5B are diagrams illustrating an example of a main part of the flexible plate, in which FIG. 5A is a bottom view, and FIG. 5B is a cross-sectional view taken along line BB in FIG.

  The flexible plate 30 includes an adsorption portion 31 that adsorbs the second main surface 6 a of the stacked body 6, a main body plate 32 that supports the adsorption portion 31, and an adsorption groove 33 formed on the surface of the adsorption portion 31. . An intake port 34 for sucking out the gas in the adsorption groove 33 from the outside is provided on the wall surface of the adsorption groove 33, and the intake port 34 is connected to an intake source (for example, a vacuum pump) 35 through a pipe or the like. When the suction source 35 sucks out the gas in the suction groove 33, the laminate 6 is vacuum-sucked by the flexible plate 30. When both side surfaces of the substrate 2 and the reinforcing plate 3 constituting the laminate 6 are flush with each other, unlike the case where there is a step between both side surfaces, the end portion on the peeling start side of the substrate 2 or the reinforcing plate 3 is It cannot be hooked with a jig. Therefore, it is effective to adsorb the second main surface 6a of the laminated body 6 with the flexible plate 30.

  The outer shape of the suction portion 31 may be set larger than the outer shape of the second main surface 6a of the stacked body 6 so that the suction portion 31 can support the second main surface 6a of the stacked body 6 as a whole.

  The material of the adsorption part 31 is not particularly limited, but rubber is preferable from the viewpoint of adhesion. As the rubber, silicone rubber is preferable from the viewpoint of releasability. Silicone gel can be used instead of silicone rubber. In this case, when the adsorbing portion 31 is removed from the laminate 6, the silicone gel may cohesively break down and adhere to the laminate 6.

  The surface of the adsorption part 31 may be coated for the purpose of improving peelability.

  The thickness T of the suction part 31 is preferably 1 mm or more, more preferably 2 mm or more. By making the thickness T of the suction part 31 1 mm or more, the adhesion between the suction part 31 and the laminate 6 is improved. Moreover, the excessive deformation | transformation of the adsorption | suction part 31 can be restrict | limited by setting the thickness T of the adsorption | suction part 31 to 30 mm or less.

  The main body plate 32 is the same size as the suction portion 31, and the side surface of the main body plate 32 and the side surface of the suction portion 31 are flush with each other. The main body plate 32 may be larger than the suction portion 31, and the suction portion 31 may be disposed inside the main body plate 32.

The main body plate 32 has higher bending rigidity than the suction portion 31, and the bending rigidity of the main body plate 32 dominates the bending rigidity of the flexible plate 30. The flexural rigidity of the flexible plate 30 is preferably 1000 to 40000 N · mm ² .

By setting the bending rigidity of the flexible plate 30 to 1000 N · mm ² or more, the bending of the plate (the reinforcing plate 3 in the present embodiment) to which the flexible plate 30 adsorbs can be prevented. Moreover, the board | plate which the flexible board 30 adsorb | sucks can be moderately bent and deformed because the bending rigidity of the flexible board 30 shall be 4000 N * mm < ² > or less.

  As the main body plate 32, for example, a resin plate such as polyvinyl chloride (PVC) resin, polycarbonate resin, acrylic resin, polyacetal (POM) resin, or a metal plate is used.

  As shown in FIGS. 3 and 4, a plurality of disk-shaped movable bodies 40 are fixed on the main body plate 32 at intervals. The plurality of movable bodies 40 are bolted to the main body plate 32. Instead of bolt fixing, adhesive fixing may be used. The plurality of movable bodies 40 can move independently of the stage 20.

  FIG. 6 is a plan view showing an arrangement example of a plurality of movable bodies on the flexible plate. FIG. 6 shows a state before the start of peeling.

  The plurality of movable bodies 40 are fixed to a surface of the flexible plate 30 opposite to the stage 20 side. The plurality of movable bodies 40 are arranged at intervals along the outer periphery of the flexible plate 30, and more than the outer periphery 8 a of the interface 8 when viewed from a direction perpendicular to the interface 8 before starting peeling. Arranged outside. In this case, the distance between the center of each movable body 40 and the outer periphery 8a is preferably 200 mm or less.

  As shown in FIGS. 3 and 4, the plurality of movable bodies 40 are respectively connected to the corresponding rods 60 via the corresponding connection mechanisms 50. Each of the plurality of movable bodies 40 can move in the axial direction of the rod 60 together with the connected rod 60, and can move toward and away from the stage 20. As the plurality of movable bodies 40 move with respect to the stage 20, the flexible plate 30 is bent and deformed.

  In order to make the flexible plate 30 bend and deform smoothly, the coupling mechanism 50 is configured so that the movable body 40 and the rod 60 can rotate around a predetermined position on the center line X of the rod 60. Are connected. The rotation center of the movable body 40 is set to a position within 15 mm (preferably within 5 mm) from the intersection P between the extended surface of the surface on the substrate 2 side on the reinforcing plate 3 and the center line X.

  Note that the intersection point P in this embodiment is an intersection point between the extended surface of the surface on the substrate 2 side on the reinforcing plate 3 and the center line X, but the flexible plate 30 replaces the reinforcing plate 3 with the substrate 2. In the case of bending deformation, this is the intersection of the extended surface of the surface on the reinforcing plate 3 side on the substrate 2 and the center X.

  The coupling mechanism 50 is formed of, for example, a spherical joint, and includes a concave spherical portion 51 that is integrated with the movable body 40 and a convex spherical portion 52 that is integrated with the rod 60. The center of curvature of the convex spherical portion 52 is the rotation center of the movable body 40. A coil spring 54 is interposed between the movable body 40 and the coupling mechanism 50 in a state where the coil spring 54 is slightly contracted from the natural state. Due to the restoring force of the coil spring 54, the concave spherical surface portion 51 and the convex spherical surface portion 52 are always in contact with each other.

  As the connecting mechanism 50, a link mechanism can be used. Further, instead of using the coupling mechanism 50, it is also possible to use a device in which the movable body 40 and the rod 60 are integrated, and the rod 60 or the driving device 70 that moves the rod 60 in the axial direction is tilted with respect to the stage 20. is there.

  The drive device 70 moves the rod 60 in the axial direction under the control of the control device 80 to bring the movable body 40 into and out of contact with the stage 20. A plurality of driving devices 70 are provided corresponding to the plurality of rods 60, and independently move the plurality of rods 60, and thus the plurality of movable bodies 40.

  Each driving device 70 is constituted by, for example, a rotary servo motor and a ball screw mechanism. The rotational motion of the servo motor is converted into linear motion by the ball screw mechanism and transmitted to the corresponding rod 60.

  Although the drive device of the present embodiment is constituted by a rotary servo motor and a ball screw mechanism, it may be constituted by a linear servo motor or a fluid pressure cylinder (for example, a pneumatic cylinder).

  Each of the plurality of driving devices 70 may be coupled to the frame 16 that can be moved up and down with respect to the stage 20 via the cushion member 14. A plurality of cushion members 14 are provided corresponding to the plurality of driving devices 70. The material of the cushion member 14 is not particularly limited, and examples thereof include urethane rubber. The cushion member 14 is elastically deformed to follow the bending deformation of the flexible plate 30 and tilts each rod 60 with respect to the stage 20.

  The control device 80 is configured as a computer including a CPU, a recording medium such as a ROM and a RAM, and the like. The control device 80 controls the plurality of driving devices 70 by causing the CPU to execute the program recorded on the recording medium, thereby controlling the movement of the plurality of rods 60 and the movement of the plurality of movable bodies 40.

  The control device 80 may include a position detection unit 81 that detects the current position of each rod 60 based on the number of rotations of each servo motor. The control device 80 independently controls the power supplied to each servo motor so that the difference between the current position of each rod 60 detected by the position detector 81 and the target position becomes small. The target position is set according to the elapsed time from the start of peeling. The target position is set for each rod 60 and is recorded in advance on the recording medium. The elapsed time from the start of peeling is measured by a timer incorporated in the control device 80. As described above, the control device 80 may perform feedback control on the position of each rod 60. The positional relationship between the plurality of rods 60 and thus the positional relationship between the plurality of movable bodies 40 can be accurately controlled.

  Further, the control device 80 may include a load detection unit 82 that detects a load torque of each servo motor (for example, a current supplied to each servo motor). The control device 80 corrects the target position of each rod 60 based on the detection result of the load detector 82 and records it on the recording medium. For example, when the load torque of one servo motor exceeds a threshold during the n-th control (n is a natural number of 1 or more), the movement start time of the rod 60 by the one servo motor is set to a predetermined time (for example, 0.06). Second) make a delay correction and record it on the recording medium. In the (n + 1) th control, each servo motor is independently controlled based on the corrected and recorded information. Thereby, the load concerning the laminated body 6 can be reduced.

  Next, operation | movement of the peeling apparatus 10 of the said structure is demonstrated. The operation of the peeling device 10 is performed under the control of the control device 80.

  The stacked body 6 is placed on the stage 20 with the reinforcing plate 3A facing upward. When the stacked body 6 is vacuum-sucked by the stage 20, the control device 80 lowers the frame 16 to a predetermined position and presses the flexible plate 30 against the reinforcing plate 3A. Next, the control device 80 vacuum-sucks the reinforcing plate 3 </ b> A with the flexible plate 30. In this state, as shown in FIG. 3, the flexible plate 30 has a flat plate shape.

  In addition, although the peeling apparatus 10 of this embodiment was set as the structure which the stage 20 is fixed and the flame | frame 16 raises / lowers, what is necessary is just the structure which the stage 20 and the flame | frame 16 move relatively.

  Next, the control device 80 bends and deforms the flexible plate 30 so that the interface 8 between the substrate 2A and the reinforcing plate 3A is sequentially peeled from one end side to the other end side as shown in FIG. The state of the flexible plate 30 is determined by the positional relationship of the plurality of movable bodies 40.

  7A and 7B are diagrams for explaining an example of the operation of the plurality of movable bodies 40, where FIG. 7A is a plan view, FIG. 7B is a cross-sectional view taken along line B-B in FIG. It is sectional drawing along CC line of a). The cross section is a cross section perpendicular to the peeling front 9.

  The plurality of movable bodies 40 perform an operation of separating from the stage 20 in order to bend and deform the flexible plate 30. First, the movable body 40A located behind the peeling start end 8b of the interface 8 starts operating. As a result, the interface 8 is peeled off at the peeling start end 8b. The peeling start end 8b is preferably set at one corner of the interface 8 as shown in FIG. 6 in order to reduce peeling resistance. Before the flexible plate 30 is bent and deformed, a thin blade such as a razor may be inserted into the peeling start end 8b to create a trigger for peeling. Instead of inserting a thin blade into the peeling start end 8b, a high-speed fluid such as compressed gas may be sprayed toward the peeling start end 8b.

  Next, the movable bodies 40-2 to 40-7 located in front of the peeling start end 8b start operation. The movable bodies 40-2 to 40-7 located in front of the peeling start end 8b start operation in the order corresponding to the distance from the peeling start end 8b. When the moving direction of the peeling front 9 (the direction perpendicular to the direction connecting both ends of the peeling front 9) is the M direction, a movable body (for example, a movable body) having a short distance N in the M direction from the peeling start end 8b of the interface 8 40-2) starts operation before a movable body having a long distance N (for example, movable body 40-3). The movable bodies 40-2 to 40-7 are arranged at an equal pitch in the M direction, but may be arranged at an unequal pitch. The movable bodies 40-2 to 40-7 are at least one on each outer side (left outer side and right outer side) of the outer periphery 8a of the interface 8 when viewed from the direction perpendicular to the interface 8 before starting peeling (in FIG. 7, One by one). Two movable bodies having the same distance N (for example, movable bodies 40-2 and 40-2) start operation at substantially the same timing. The distance N is a distance from the peeling start end 8b to the center of the movable body 40 in the M direction.

  Since the movable bodies 40-2 to 40-7 located in front of the peeling start end 8b are arranged outside the outer periphery 8a of the interface 8, after the operation of the movable body 40-2 having the shortest distance N is started, the peeling is performed. The front line 9 has a shape in which both end portions precede the center portion, and has a curved shape that is convex backward in the movement direction. This shape is maintained until peeling is completed.

  When the peeling front 9 has a convex curved shape rearward in the moving direction, the radius of curvature of the plate (in this embodiment, the reinforcing plate 3A) that bends and deforms together with the flexible plate 30 is peeled as shown in FIG. It is large at both ends of the front line 9 and is small at the center of the peeling front line 9 as shown in FIG. The radius of curvature is a radius of curvature in a cross section perpendicular to the peeling front 9, and is a radius of curvature in the vicinity of the back of the peeling front 9.

  In the reinforcing plate 3A that bends and deforms together with the flexible plate 30, the larger the radius of curvature, the smaller the deformation and thus the smaller the load. On the other hand, the greater the radius of curvature, the smaller the peel angle, so the peel resistance (force required for peel) increases.

  In this embodiment, since the peeling front 9 has a curved shape that is convex backward in the movement direction, the radius of curvature of the reinforcing plate 3A is large at both ends of the peeling front 9 and small at the center. Therefore, it is possible to reduce the load applied to the edge of the reinforcing plate 3A while suppressing the peeling resistance from increasing, and to prevent the reinforcing plate 3A from breaking from the edge. This effect is remarkable because the peeling resistance increases as the linear distance H between both ends of the peeling front increases. In the present embodiment, as shown in FIG. 7A, when the distance H becomes maximum, the peeling front 9 has a curved shape that protrudes backward in the movement direction, so that the reinforcing plate 3A can be effectively broken from the edge. Can be suppressed.

  In this embodiment, the plate that bends and deforms together with the flexible plate 30 is the reinforcing plate 3A, but may be the substrate 2A. In this case, the substrate 2A can be prevented from breaking from the edge.

  After the separation of the substrate 2A and the reinforcing plate 3A is completed, the control device 80 raises the frame 16 to a predetermined position. Next, the control device 80 releases the vacuum suction by the flexible plate 30 and the vacuum suction by the stage 20. Thereafter, the reinforcing plate 3A is removed from the flexible plate 30, and the laminate 6 from which the reinforcing plate 3A is removed is removed from the stage 20.

  The laminated body 6 without the reinforcing plate 3A is placed on the stage 20 so that the remaining reinforcing plate 3B is on the upper side. Thereafter, the control device 80 performs the above operation again to separate the reinforcing plate 3B and the substrate 2B.

  In this way, after the reinforcing plates 3A and 3B are peeled off from the laminate 6, a backlight or the like is incorporated, and a product LCD is obtained.

  In addition, although the peeling apparatus 10 of this embodiment is used in the manufacturing process of LCD, this invention is not limited to this, It can be used in the manufacturing process of another electronic device.

[Second Embodiment]
In the first embodiment, the flexible plate 30, the plurality of movable bodies 40, the plurality of rods 60, the plurality of driving devices 70, and the like are disposed on one side of the stacked body 6.

  On the other hand, in this embodiment, the flexible plate 30, the plurality of movable bodies 40, the plurality of rods 60, the plurality of driving devices 70, and the like are disposed on both sides of the stacked body 6.

  FIG. 8 is a partial cross-sectional view showing the peeling apparatus of the second embodiment. FIG. 9 is a partial cross-sectional view showing an operation example of the peeling apparatus of FIG. FIG. 10 is a diagram illustrating an example of a peeling process using the peeling apparatus of FIG.

  The peeling device 110 according to the present embodiment is arranged on one side of the laminated body 6. The first flexible plate 30A, the plurality of first movable bodies 40A, the plurality of first rods 60A, and the plurality of first driving devices 70A. Etc. Further, the peeling device 110 is disposed on the opposite side of the stacked body 6, such as a second flexible plate 30 </ b> B, a plurality of second movable bodies 40 </ b> B, a plurality of second rods 60 </ b> B, and a plurality of second driving devices 70 </ b> B. Have The second flexible plate 30B, the plurality of second movable bodies 40B, the plurality of second rods 60B, the plurality of second driving devices 70B, the second frame 16B, and the like constitute support means. Further, the peeling device 110 includes a control device 80 that controls the plurality of first driving devices 70A and the plurality of second driving devices 70B.

  Next, based on FIG. 10, operation | movement of the peeling apparatus 110 of the said structure is demonstrated. The operation of the peeling device 110 is performed under the control of the control device 80.

  The laminate 6 is placed on the second flexible plate 30B with the reinforcing plate 3A on the upper side. When the laminated body 6 is vacuum-sucked by the second flexible plate 30B, the control device 80 lowers the first frame 16A that can be raised and lowered relative to the second frame 16B to a predetermined position, and moves the first flexible plate 30A. Press against the reinforcing plate 3A. Next, the control device 80 vacuum-sucks the reinforcing plate 3A with the first flexible plate 30A. In this state, as shown to Fig.10 (a) and FIG. 8, 1st and 2nd flexible board 30A, 30B is flat form.

  The peeling device 110 according to the present embodiment has a configuration in which the second frame 16B is fixed and the first frame 16A moves up and down. However, as long as the second frame 16B and the first frame 16A are relatively moved. Good.

  Next, as shown in FIGS. 10B and 10C and FIG. 9, the control device 80 causes the first interface so that the interface between the substrate 2A and the reinforcing plate 3A is sequentially peeled from one end side to the other end side. The second flexible plates 30A and 30B are simultaneously bent and deformed.

  Before the first and second flexible plates 30A and 30B are bent and deformed, a thin blade such as a razor may be inserted into the peeling start end to create a trigger for peeling. Instead of inserting a thin blade at the peeling start end, a high-speed fluid such as compressed gas may be sprayed toward the peeling start end.

  The state of bending deformation of the first flexible plate 30A is determined by the positional relationship of the plurality of first movable bodies 40A and the like. Similarly, the state of bending deformation of the second flexible plate 30B is determined by the positional relationship of the plurality of second movable bodies 40B and the like.

  In the present embodiment, the plurality of first movable bodies 40A are arranged at intervals along the outer periphery of the first flexible plate 30A, and when viewed from a direction perpendicular to the interface before starting peeling. It is arranged outside the outer periphery of the interface. In addition, the plurality of second movable bodies 40B are arranged at intervals along the outer periphery of the second flexible plate 30B, and when viewed from a direction perpendicular to the interface before starting peeling, It is arranged outside the outer periphery.

  The control device 80 controls the movement of the plurality of first movable bodies 40A and the movement of the plurality of second movable bodies 40B, and the separation front 9 moves when the linear distance between both ends of the separation front 9 becomes maximum. The curved shape is convex backward in the direction. Therefore, the load applied to the edge of the reinforcing plate 3A can be reduced while suppressing the peeling resistance from increasing as in the first embodiment, and the reinforcing plate 3A can be prevented from breaking from the edge.

  After the separation of the substrate 2A and the reinforcing plate 3A is completed, the control device 80 raises the first frame 16A to a predetermined position. Next, the control device 80 releases the vacuum suction by the first flexible plate 30A. Thereafter, the reinforcing plate 3A is removed from the first flexible plate 30A.

  Next, the control device 80 lowers the first frame 16A to a predetermined position and presses the first flexible plate 30A against the substrate 2A. Next, the control device 80 vacuum-sucks the substrate 2A with the first flexible plate 30A. In this state, as shown in FIG. 10D, the first and second flexible plates 30A and 30B are flat.

  Thereafter, as shown in FIGS. 10 (e) and 10 (f), the control device 80 causes the interface between the substrate 2B and the reinforcing plate 3B to be sequentially peeled from one end side toward the other end side. The flexible plates 30A and 30B are simultaneously bent and deformed.

  Before the first and second flexible plates 30A and 30B are bent and deformed, a thin blade such as a razor may be inserted into the peeling start end to create a trigger for peeling. Instead of inserting a thin blade at the peeling start end, a high-speed fluid such as compressed gas may be sprayed toward the peeling start end.

  In this way, after the reinforcing plates 3A and 3B are peeled off from the laminate 6, a backlight or the like is incorporated, and a product LCD is obtained.

  In the present embodiment, both the substrate 2A and the reinforcing plate 3A are bent and deformed in directions opposite to each other, so that it is possible to avoid a load from being concentrated on one of them.

[Third Embodiment]
In the present embodiment, as in the second embodiment, peeling is performed using the peeling apparatus shown in FIG. 8, but the operation of the peeling apparatus is different.

  FIG. 11 is a diagram showing another peeling process using the peeling apparatus of FIG.

  The laminate 6 is placed on the second flexible plate 30B with the reinforcing plate 3A on the upper side. The control device 80 lowers the first frame 16A to a predetermined position and presses the first flexible plate 30A against the reinforcing plate 3A. Next, the control device 80 vacuum-sucks the reinforcing plate 3A with the first flexible plate 30A. In this state, as shown to Fig.11 (a) and FIG. 8, 1st and 2nd flexible board 30A, 30B is flat form.

  Next, as shown in FIGS. 11B and 11C, the control device 80 causes the first flexibility so that the interface between the substrate 2A and the reinforcing plate 3A is sequentially peeled from one end side to the other end side. The plate 30A is bent and deformed.

  Before the first flexible plate 30A is bent and deformed, a thin blade such as a razor may be inserted into the peeling start end to create a trigger for peeling. Instead of inserting a thin blade at the peeling start end, a high-speed fluid such as compressed gas may be sprayed toward the peeling start end.

  The state of bending deformation of the first flexible plate 30A is determined by the positional relationship of the plurality of first movable bodies 40A and the like.

  In the present embodiment, as in the first embodiment, the plurality of first movable bodies 40A are arranged at intervals along the outer periphery of the first flexible plate 30A, and are separated from the interface before starting peeling. When viewed from a perpendicular direction, the outer periphery of the interface is disposed outside. The control device 80 controls the movement of the plurality of first movable bodies 40A so that when the linear distance between both ends of the peeling front 9 is maximized, the peeling front 9 has a curved shape protruding backward in the movement direction. Therefore, as in the first embodiment, the load applied to the edge of the reinforcing plate 3A can be reduced while suppressing an increase in peeling resistance, and the reinforcing plate 3A can be prevented from breaking from the edge. .

  After the separation of the substrate 2A and the reinforcing plate 3A is completed, the control device 80 raises the first frame 16A to a predetermined position. Next, the control device 80 releases the vacuum suction by the first flexible plate 30A. Thereafter, the reinforcing plate 3A is removed from the first flexible plate 30A.

  Next, the control device 80 lowers the first frame 16A to a predetermined position and presses the first flexible plate 30A against the substrate 2A. Next, the control device 80 vacuum-sucks the substrate 2A with the first flexible plate 30A. In this state, as shown in FIG. 11D, the first flexible plate 30A and the second flexible plate 30B are flat.

  Thereafter, the control device 80 performs the second flexibility so that the interface between the substrate 2B and the reinforcing plate 3B is sequentially peeled from one end side to the other end side as shown in FIGS. 11 (e) and 11 (f). The plate 30B is bent and deformed.

  Before the second flexible plate 30B is bent and deformed, a thin blade such as a razor may be inserted into the peeling start end to create a trigger for peeling. Instead of inserting a thin blade at the peeling start end, a high-speed fluid such as compressed gas may be sprayed toward the peeling start end.

  The state of bending deformation of the second flexible plate 30B is determined by the positional relationship of the plurality of second movable bodies 40B.

  In the present embodiment, as in the first embodiment, the plurality of second movable bodies 40B are arranged at intervals along the outer periphery of the second flexible plate 30B, and are separated from the interface before starting peeling. When viewed from a perpendicular direction, the outer periphery of the interface is disposed outside. The control device 80 controls the movement of the plurality of second movable bodies 40B so that when the linear distance H between both ends of the peeling front becomes the maximum, the peeling front has a curved shape protruding backward in the movement direction. Therefore, as in the first embodiment, the load applied to the edge of the reinforcing plate 3B can be reduced while suppressing the peeling resistance from increasing, and the reinforcing plate 3B can be prevented from breaking from the edge. .

  In this way, after the reinforcing plates 3A and 3B are peeled off from the laminate 6, a backlight or the like is incorporated, and a product LCD is obtained.

  As mentioned above, although 1st-3rd embodiment of this invention was described, this invention is not restrict | limited to the said embodiment. Various modifications and substitutions can be made to the above embodiment without departing from the scope of the present invention.

  For example, the peeling apparatuses 10 and 110 of the above embodiment are used in the manufacturing process of the electronic device, but may be used in other processes. For example, the peeling apparatuses 10 and 110 may be used in a process of reattaching the substrate and the reinforcing plate before being used in the manufacturing process of the electronic device.

  Moreover, although the some movable body 40 of the said embodiment is arrange | positioned only outside the outer periphery 8a of the interface 8 as shown in FIG. 6, when the interface 8 is a large area, as shown to FIG. 12A, for example. You may arrange | position also inside the outer periphery 8a of the interface 8. FIG. When the distance N (see FIG. 8) is the same, the movable bodies at both ends (for example, the movable bodies 40-3A and 40-3B) disposed outside the outer periphery 8a of the interface 8 are located inside the outer periphery 8a of the interface 8. The operation is started before the remaining movable body (for example, movable body 40-3C) to be arranged. Also in this case, the peeling front 9 has a curved shape protruding backward in the movement direction.

  Moreover, although the some movable body 40 of the said embodiment is arrange | positioned only outside the outer periphery 8a of the interface 8 as shown in FIG. 6, it exists in the inner vicinity of the outer periphery 8a of the interface 8 as shown in FIG. It may be arranged and may be arranged at intervals along the outer periphery 8a. In this case, the distance between the center of each movable body 40 and the outer periphery 8a may be 50 mm or less. Moreover, the some movable body 40 may be arrange | positioned at intervals on the outer periphery 8a. In these cases, the movable body 40 may also be disposed inside the outer periphery 8a of the interface 8.

  Further, the base plate 132 shown in FIG. 13 or the base plate 232 shown in FIG. 14 may be used as the base plate 32 of the flexible plate 30. FIG. 13 is a plan view showing a modification of the base plate. 14A and 14B are diagrams showing another modification of the base plate, in which FIG. 14A is a plan view and FIG. 14B is a cross-sectional view taken along line BB in FIG.

  A convex curved groove 132a is formed on the surface of the base plate 132 shown in FIG. 13 on the rear side in the moving direction of the peeling front 9 (see FIG. 7). A plurality of the curved grooves 132a may be provided at intervals in the moving direction of the peeling front 9. The curved groove 132 a may be formed on either of the main surfaces of the base plate 132. The shape of the peeling front 9 becomes a convex convex shape rearward so as to follow the shape of the curved groove 132a.

  The base plate 232 shown in FIG. 14 integrally includes a plate-like portion 232a and an outer frame portion 232b surrounding the plate-like portion 232a. The thickness D2 of the outer frame part 232b is thicker than the thickness D1 of the plate-like part 232a. Since the bending rigidity of the outer frame portion 232b is higher than the bending rigidity of the plate-like portion 232a, the radius of curvature R of the plate (for example, the reinforcing plate 3A) that is bent and deformed together with the flexible plate 30 is as shown in FIG. It is large at both ends of the peeling front 9, and is small at the center of the peeling front 9, as shown in FIG.

DESCRIPTION OF SYMBOLS 1 Laminated board 2 Board | substrate 3 Reinforcement board 4 Support board 5 Resin layer 6 Laminated body 6a 2nd main surface 6b 1st main surface 7 Liquid crystal layer (functional layer)
8 Interface 9 Boundary line (Peeling front)
10 Peeling device 20 Stage (support means)
DESCRIPTION OF SYMBOLS 30 Flexible board 31 Adsorption part 32 Main body board 132 Main body board 132a Curved groove 232 Main body board 232a Plate-shaped part 232b Outer frame part 40 Movable body 50 Connection mechanism 60 Rod 70 Drive apparatus 80 Control apparatus

Claims (10)

In the peeling apparatus for sequentially peeling the interface between the substrate and the reinforcing plate that reinforces the substrate from one end side to the other end side,
Support means for supporting the first main surface of the laminate including the substrate and the reinforcing plate;
A flexible plate that adsorbs the second main surface of the laminate;
A plurality of movable bodies fixed on the flexible plate at intervals and movable independently of the support means;
A control device for controlling the movement of the plurality of movable bodies,
When the linear distance between both ends of the boundary line between the part where the interface is peeled off and the part where the interface is not peeled becomes the longest, the control device has a curved shape protruding backward in the movement direction. As described above, a peeling apparatus that controls movement of the plurality of movable bodies. The plurality of movable bodies are disposed near the inner periphery of the outer periphery of the interface, on the outer periphery, or outside the outer periphery when viewed from a direction perpendicular to the interface before starting peeling.
Among the plurality of movable bodies, in the plurality of movable bodies arranged in front of the peeling start end of the interface, the movable body having a short distance in a predetermined direction from the peeling start end of the interface has a long distance. The peeling apparatus according to claim 1, wherein the peeling apparatus is separated from the support means before the movable body. When viewed from a direction perpendicular to the interface before the start of peeling, among the three or more movable bodies having the same distance from the peeling start end of the interface in the predetermined direction, the movable bodies at both ends are Near the inside of the outer periphery, on the outer periphery, or arranged outside the outer periphery, the remaining movable body is arranged inside the outer periphery,
The peeling apparatus according to claim 1, wherein the movable bodies at both ends are separated from the support means before the remaining movable bodies. The flexible plate includes an adsorbing portion that adsorbs the second main surface of the laminate and a main body plate that supports the adsorbing portion, and the bending rigidity of the main body plate is higher than the bending rigidity of the adsorbing portion. ,
The peeling apparatus as described in any one of Claims 1-3 with which a convex curved groove is provided in the surface of the said main body board at the back of the movement direction of the said boundary line. The flexible plate includes an adsorbing portion that adsorbs the second main surface of the laminate and a main body plate that supports the adsorbing portion, and the bending rigidity of the main body plate is higher than the bending rigidity of the adsorbing portion. ,
The said main body plate has a plate-shaped part and the outer frame part surrounding this plate-shaped part integrally, and the thickness of the said outer frame part is thicker than the thickness of the said plate-shaped part. The peeling apparatus according to item. In a method for manufacturing an electronic device, comprising a step of forming a functional layer on a substrate reinforced with a reinforcing plate, and a step of separating the reinforcing plate and the substrate on which the functional layer is formed.
The step of peeling the substrate and the reinforcing plate includes supporting the first main surface of the laminate including the substrate and the reinforcing plate with a supporting means and flexibly adsorbing the second main surface of the laminate. In the step of sequentially peeling the interface between the substrate and the reinforcing plate from one end side to the other end side by controlling the movement of the plurality of movable bodies fixed at intervals on the plate with respect to the support means. There,
The plurality of lines are arranged such that when the linear distance between both ends of the boundary line between the part where the interface is peeled off and the part where the interface is not peeled becomes the longest, the boundary line has a curved shape protruding backward in the movement direction. Of manufacturing an electronic device for controlling movement of a movable body. The plurality of movable bodies are disposed near the inner periphery of the outer periphery of the interface, on the outer periphery, or outside the outer periphery when viewed from a direction perpendicular to the interface before starting peeling.
Among the plurality of movable bodies, in the plurality of movable bodies arranged in front of the peeling start end of the interface, the movable body having a short distance in a predetermined direction from the peeling start end of the interface has a long distance. The method for manufacturing an electronic device according to claim 6, wherein the electronic device is separated from the support means before the movable body. When viewed from a direction perpendicular to the interface before the start of peeling, among the three or more movable bodies having the same distance from the peeling start end of the interface in the predetermined direction, the movable bodies at both ends are Near the inside of the outer periphery, on the outer periphery, or arranged outside the outer periphery, the remaining movable body is arranged inside the outer periphery,
The method of manufacturing an electronic device according to claim 6, wherein the movable bodies at both ends are separated from the support means before the remaining movable bodies. The flexible plate includes an adsorbing portion that adsorbs the second main surface of the laminate and a main body plate that supports the adsorbing portion, and the bending rigidity of the main body plate is higher than the bending rigidity of the adsorbing portion. ,
The method of manufacturing an electronic device according to any one of claims 6 to 8, wherein a convex curved groove is provided on a surface of the main body plate on a rear side in a moving direction of the boundary line. The flexible plate includes an adsorbing portion that adsorbs the second main surface of the laminate and a main body plate that supports the adsorbing portion, and the bending rigidity of the main body plate is higher than the bending rigidity of the adsorbing portion. ,
The said main body plate has a plate-shaped part and the outer frame part surrounding this plate-shaped part integrally, and the thickness of the said outer frame part is thicker than the thickness of the said plate-shaped part. The manufacturing method of the electronic device as described in a term.

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