WO2010090147A1

WO2010090147A1 - Method for manufacturing electronic device and separation apparatus used therefor

Info

Publication number: WO2010090147A1
Application number: PCT/JP2010/051281
Authority: WO
Inventors: 研一江畑; 聡近藤; 泰則伊藤
Original assignee: 旭硝子株式会社
Priority date: 2009-02-06
Filing date: 2010-01-29
Publication date: 2010-08-12
Also published as: KR20110063800A; CN102171745B; JPWO2010090147A1; TWI417939B; TW201039375A; CN102171745A; JP5360073B2; KR101311652B1

Abstract

Provided are a method for manufacturing an electronic device and a separation apparatus used therefore, wherein a substrate and a resin layer closely connected thereto can be easily separated and removed within a short space of time without damage. When a support (17b) comprised of a support substrate (19b) and a resin layer (18b) is separated from a support-provided electronic device (10) which has a substrate (12b) having an electronic device member (14) and a resin layer (18b) which is secured to a support substrate (19b) and which is closely connected to the substrate (12b), a main surface on which a substrate (17b) to be separated later is not mounted is closely connected to a securing surface (20a) of a stage (20) to secure the support-provided electronic device (10), and a knife (30) is inserted between interfaces of the resin layer (18b) and the substrate (12b) of the support (17b) to be separated, at an end surface of the support-provided electronic device (10) secured to the stage (20) to thereby separate the support (17b) and an electronic device (16).

Description

Manufacturing method of electronic device and peeling apparatus used therefor

The present invention relates to a method for manufacturing an electronic device and a peeling apparatus used therefor.

In recent years, liquid crystal display devices (LCD) and organic EL display devices (OLED) have been widely used as display devices. In particular, in the field of mobile display devices such as mobile phones and mobile phones, there is a demand for lighter and thinner display devices.
Similarly, electronic devices such as solar cells, thin film secondary batteries, and semiconductor wafers having a circuit formed on the surface are also required to be lighter and thinner.
In order to cope with this, thinning of substrates such as glass, resin, and metal used for electronic devices such as display devices has been promoted.
In the case of a glass substrate, as a method for reducing the plate thickness, it is generally necessary to etch the outer surface of the glass substrate using chemical etching before or after the display device member is formed on the surface of the glass substrate. Depending on the method, a method of further physical polishing and thinning is performed.

However, if the glass substrate is thinned by performing an etching process or the like before the electronic device member such as a display device is formed on the surface of the glass substrate, the strength of the glass substrate is reduced and the amount of deflection is increased. Therefore, the problem that it cannot process in the existing manufacturing line arises.
In addition, if the glass substrate is thinned by performing an etching process or the like after forming the display device member on the surface of the glass substrate, the fineness formed on the surface of the glass substrate in the process of forming the display device member on the surface of the glass substrate. The problem of making obvious scratches, that is, a problem called edge pit occurs.

Therefore, for the purpose of solving such problems, a thin glass substrate (hereinafter also referred to as “thin glass substrate”) is bonded to another supporting glass substrate to form a laminate, and the display is performed in that state. A method of performing a predetermined process for manufacturing the apparatus and then separating the thin glass substrate and the supporting glass substrate has been proposed.

For example, in Patent Document 1, a product glass substrate and a reinforcing glass substrate are bonded and integrated using an electrostatic adsorption force or a vacuum adsorption force between glass substrates, and a display using the product glass substrate is used. A method of manufacturing the device is described.
Patent Document 2 describes a manufacturing method of a liquid crystal display device in which end portions of a substrate and a support of a liquid crystal display device are bonded using a glass frit adhesive, and thereafter an electrode pattern or the like is formed. Yes.
Patent Document 3 describes a method for manufacturing a substrate for a display device, which includes a step of irradiating laser light to at least the vicinity of the edge surface of two glass substrates to fuse the two glass substrates.

In Patent Document 4, a substrate is attached to a substrate transport jig having an adhesive layer provided on a support, and the substrate transport jig is transported through a manufacturing process of a liquid crystal display element. A manufacturing method of a liquid crystal display device is described in which liquid crystal display element formation processing is sequentially performed on a substrate attached to a jig, and the substrate is peeled off from the substrate carrying jig after completing a predetermined process.
In Patent Document 5, an electrode substrate for a liquid crystal display element is subjected to a predetermined processing on the electrode substrate for a liquid crystal display element using a jig in which an ultraviolet curable adhesive is provided on a support, and then an ultraviolet curable type is used. A method for producing a liquid crystal display device, comprising: irradiating an adhesive with ultraviolet rays to reduce the adhesive strength of the ultraviolet curable adhesive and peeling the electrode substrate for a liquid crystal display element from the jig. Has been.
Patent Document 6 describes a transport method in which a thin plate is temporarily fixed to a support plate with an adhesive material, a peripheral portion of the adhesive material is sealed with a seal material, and the support plate on which the thin plate is temporarily fixed is transported.

Patent Document 7 discloses a thin glass laminate obtained by laminating a thin glass substrate and a supporting glass substrate, in which the thin glass and the supporting glass are easily peelable and non-adhesive silicone. A thin glass laminate characterized by being laminated via a resin layer is described. Then, in order to separate the thin glass substrate and the supporting glass substrate, it is only necessary to give a force to separate the thin glass substrate from the supporting glass substrate in the vertical direction. It is described that peeling can be performed more easily by injecting air into the interface.
Patent Document 8 describes a peeling device for peeling a plate-like body such as a glass substrate that is sucked and held on a suction sheet from the suction sheet.

Japanese Unexamined Patent Publication No. 2000-241804 Japanese Unexamined Patent Publication No. 58-54316 Japanese Unexamined Patent Publication No. 2003-216068 Japanese Patent Laid-Open No. 8-86993 Japanese Unexamined Patent Publication No. 9-105896 Japanese Unexamined Patent Publication No. 2000-252342 International Publication No. 2007/018028 Pamphlet Japanese Unexamined Patent Publication No. 2007-185725

However, a method for fixing glass substrates described in Patent Document 1 using electrostatic adsorption force or vacuum adsorption force, a method for fixing both ends of a glass substrate described in Patent Document 2 with glass frit, or Patent Document 3 In the method of merging two glass substrates by irradiating laser light near the end face of the peripheral portion described in the above, the glass substrates are laminated and adhered without any intermediate layer. Distortion defects occur in the glass substrate due to foreign matters such as dust. Therefore, it is difficult to obtain a glass substrate laminate having a smooth surface.

In addition, in the method of disposing an adhesive layer or the like between the glass substrates described in Patent Documents 4 to 6, the occurrence of distortion defects due to mixing of bubbles or the like between the glass substrates as described above can be avoided. Is difficult to separate, and the thin glass substrate may be damaged during the separation. Further, the remaining adhesive on the thin glass substrate after separation also becomes a problem.

On the other hand, according to the thin glass laminate described in Patent Document 7, a distortion defect due to mixing of bubbles or the like between the glass substrates as described above hardly occurs. It is also possible to peel the thin glass substrate and the supporting glass substrate. Furthermore, the problem of remaining adhesive on the thin glass substrate after separation is solved. However, it is desirable to separate both glass substrates more easily and in a shorter time. In particular, when the glass substrate is large, it is an important point for industrial use.
Moreover, the peeling apparatus described in Patent Document 8 is an apparatus for peeling a glass substrate or the like that is adsorbed and held on an adsorbing sheet from an adsorbing sheet, and a supporting glass substrate and a thin glass substrate that are in close contact with each other through a resin layer It is difficult to peel the resin layer without damaging the thin glass substrate and without leaving the resin layer on the thin glass substrate.

The present invention has been made in view of the above problems. In other words, it is possible to suppress the occurrence of substrate defects due to foreign matters such as bubbles and dust mixed between the substrates, and it can be processed in the existing production line without generating edge pits, and the adhered substrate and resin layer are damaged. It is an object of the present invention to provide a method for manufacturing an electronic device that can be easily separated in a short time without separation. Moreover, it aims at providing the peeling apparatus which can implement the manufacturing method of such an electronic device.

The inventor has intensively studied to solve the above-mentioned problems, and has completed the present invention.
The present invention relates to the following (1) to (18).
(1) The first of the support substrate having the first main surface and the second main surface on the first main surface of the substrate having the first main surface and the second main surface and having the electronic device member on the second main surface. The electronic device member including an operation of peeling the support substrate and the support made of the resin layer from the electronic device with a support to which the resin layer having easy peelability fixed to the main surface is in close contact A method of manufacturing an electronic device comprising a substrate, comprising one main surface of two main surfaces of the electronic device with support, and a support that is peeled off in a peeling step that is a subsequent step. A fixing step of fixing the electronic device with the support on the fixing surface of the stage, and fixing the electronic device with the support on the fixing surface of the stage; Electronic device with support A peeling step of inserting a knife into an interface between the resin layer and the substrate of the support to be peeled, and peeling the support and the electronic device. Production method.
(2) In the peeling step, the knife inserted at the interface between the resin layer and the substrate is deformed by the action from the resin layer and / or the substrate, thereby further inserting the knife. The method for manufacturing an electronic device according to (1) above, wherein when moved, the knife moves along the surface of the resin layer to separate the support and the electronic device.
(3) In the peeling step, after the knife is inserted into the interface between the resin layer and the substrate, the knife rotates around its front end, and the rear end is a method on the fixed surface of the stage. The knife is moved along the surface of the resin layer by moving in the direction parallel to the line, and the knife as a whole is also moved in at least one of the same parallel direction and the insertion direction. The manufacturing method of the electronic device as described in said (1) or (2) which peels a body and the said electronic device.
(4) Furthermore, after the fixing step and before the peeling step, the second main surface of the support substrate of the support to be peeled, comprising a suction step of adsorbing a plurality of suction pads, In the peeling step, after the knife is further inserted into the interface between the resin layer and the substrate, the suction pad is moved in a peeling direction, which is a direction in which the resin layer and the substrate are peeled, and the support body The method for manufacturing an electronic device according to any one of (1) to (3), wherein the method is a step of separating the electronic device from the electronic device.
(5) The peeling step is further closest to the place where the knife is inserted in the end face of the electronic device with support in the plurality of suction pads sucked on the second main surface of the support substrate. The suction pad located is first moved in the peeling direction, the next suction pad is moved in the peeling direction, and thereafter the suction pad next to the suction pad moved in the peeling direction in the same manner. Next, the operation of moving in the peeling direction is sequentially performed, the support is peeled in the direction from the end where the knife is inserted toward the center, and further peeled toward the extension line. The manufacturing method of the electronic device as described in (4).
(6) The above (1) to (5), wherein the peeling step further includes an operation of determining a position where the knife is inserted at an interface between the resin layer and the substrate by image processing. The manufacturing method of the electronic device in any one of.
(7) The peeling step is a step of peeling the support and the electronic device while connecting a conductor to the support substrate and / or any part of the substrate and grounding to suppress charging. A method for manufacturing an electronic device according to any one of (1) to (6) above.
(8) The above (1), wherein the peeling step is a step of peeling the support and the electronic device while spraying a charge-eliminating substance between the support and the electronic device to control charging. )-(7) The manufacturing method of the electronic device in any one of.
(9) Further, any of the above (1) to (8), wherein the peeling step is a step of inserting the knife into an interface between the resin layer and the substrate while detecting a load applied to the knife. A method for manufacturing the electronic device according to claim 1.
(10) The method of manufacturing an electronic device according to any one of (1) to (9), wherein the electronic device is a display device panel.
(11) A first support substrate having a first main surface and a second main surface on a first main surface of a substrate having a first main surface and a second main surface and having a display device member on the second main surface. A peeling device for peeling a support made of the support substrate and the resin layer from an electronic device with a support to which a resin layer having easy peelability fixed to a main surface is in close contact, the electron with a support A stage having a planar fixing surface that can be in close contact with the main surface of the device and fix the electronic device with support, a knife used to peel the support from the electronic device with support, and the stage The normal line on the fixed surface of the stage so that the knife is inserted into the interface between the resin layer and the substrate in the support to be peeled, on the end surface of the electronic device with the support fixed to When A normal direction moving unit that moves the knife in a normal direction that is a line direction, and a fixed surface direction moving unit that moves the knife between the resin layer and the substrate, and When a knife is inserted between the resin layer and the substrate, the knife is deformed by an action from the resin layer and / or the substrate so as to move along the surface of the resin layer. And / or an insertion angle having a rotation mechanism for moving the rear end of the knife in the normal direction by rotating the knife about the tip and an insertion angle setting mechanism for setting upper and lower limits of the insertion angle of the knife A peeling apparatus comprising a normal direction moving mechanism that moves the adjustment unit and the entire knife in the normal direction.
(12) Further, a plurality of suction pads for sucking the second main surface of the support substrate of the support to be peeled in the electronic device with support fixed on the fixed surface of the stage, and the suction pads The peeling apparatus according to (11), further including a pad moving unit that moves in a peeling direction, which is a direction in which the resin layer and the substrate are peeled off.
(13) The pad moving unit first moves, in the peeling direction, the suction pad located closest to the place where the knife is inserted in the end surface of the electronic device with support among the plurality of suction pads. Next, the adjacent suction pad is moved in the peeling direction, and thereafter, similarly, the operation of moving the suction pad adjacent to the suction pad moved in the peeling direction to the peeling direction is sequentially performed. The peeling device according to (12), further including a time control function of peeling the support in a direction from the end where the knife is inserted toward the center and further toward an extension line thereof.
(14) The peeling apparatus according to any one of (11) to (13), further including an image processing apparatus for determining a position where the knife is inserted at an interface between the resin layer and the substrate. .
(15) The peeling apparatus according to any one of (11) to (14), further including a ground for suppressing charging by connecting a conductor to an arbitrary portion of the support substrate and / or the substrate.
(16) The peeling apparatus according to any one of (11) to (15), further including a charge control device that controls charge by spraying a charge-removing substance between the support and the electronic device.
(17) The peeling apparatus according to any one of (11) to (16), further including a load weight detection device that detects a load weight applied to the knife.
(18) The peeling apparatus according to any one of (11) to (17), wherein the electronic device is a display panel.

According to the present invention, it is possible to suppress the occurrence of substrate defects caused by foreign matters such as bubbles and dust mixed between substrates, and to perform processing in an existing production line without generating edge pits. It is possible to provide a method of manufacturing an electronic device that can be easily separated and separated in a short time without damaging the layers. Moreover, the peeling apparatus which can implement the manufacturing method of such an electronic device can be provided.

1 (a) to 1 (d) are schematic sectional views showing a preferred embodiment of the peeling apparatus of the present invention. 2 (a) to 2 (d) are schematic sectional views showing another preferred embodiment of the peeling apparatus of the present invention. FIG. 3 is a schematic cross-sectional view showing a part of a preferred embodiment of the peeling apparatus of the present invention. 4 (a) and 4 (b) are a schematic top view and a schematic end view showing a preferred embodiment of the knife. Fig.5 (a) is a schematic perspective view for demonstrating the support part of a knife, FIG.5 (b) and FIG.5 (c) are schematic top views. FIGS. 6A to 6C are schematic perspective views for explaining the deformation of the knife at the time of peeling. FIG. 7 is a schematic cross-sectional view showing a preferred embodiment of the rotation mechanism. FIG. 8 is a schematic perspective view showing a preferred embodiment of the suction pad. FIG. 9 is a diagram schematically showing that the suction pad is sucked. FIG. 10 is a block diagram illustrating a suction pad control system. FIG. 11: is a schematic sectional drawing which shows the one aspect | mode of the display apparatus panel with a support body. FIG. 12 is a schematic plan view showing another aspect of the display device panel with a support. FIG. 13: is a schematic sectional drawing which shows another one aspect | mode of the display apparatus panel with a support body. FIG. 14 is a schematic cross-sectional view showing still another embodiment of the display device panel with a support. FIGS. 15A to 15C are schematic cross-sectional views for explaining a peeling method when a part of the fixed surface of the stage is a curved surface. FIGS. 16A to 16C are schematic cross-sectional views for explaining a peeling method when the stage is a flexible member. FIG. 17 is a flowchart showing an example of a flow of a method for manufacturing a display device panel, which is an embodiment of the method for manufacturing an electronic device of the present invention.

The present invention comprises the production method and peeling device of the present invention.
The production method of the present invention can be preferably carried out using the peeling apparatus of the present invention.
First, the peeling apparatus of the present invention will be described with reference to two preferred embodiments.

Although details will be described later, the electronic device with a support used in the present invention is provided on the first main surface of the substrate having the first main surface and the second main surface and the electronic device member on the second main surface. The easily peelable resin layer fixed to the first main surface of the support substrate having the first main surface and the second main surface is in close contact.
That is, the electronic device with a support includes an electronic device member, a substrate, a resin layer, and a support substrate, which are laminated in this order. The electronic device has an electronic device member and a substrate, and the electronic device member is formed on the second main surface of the substrate.
In addition, the electronic device with a support is a laminate in which a substrate, a resin layer, and a support substrate are stacked in this order, and two layers are stacked via an electronic device member, that is, a support substrate, a resin layer, a substrate, and an electronic device. A member, a substrate, a resin layer, and a support substrate may be laminated in this order.
Here, the electronic device refers to an electronic component such as a display panel, a solar cell, a thin film secondary battery, or a semiconductor wafer having a circuit formed on the surface. The display device panel includes a liquid crystal panel, an organic EL panel, a plasma display panel, a field emission panel, and the like.

A preferred embodiment of the peeling apparatus of the present invention will be described.
FIG. 1 is a schematic sectional view of a peeling apparatus 1 which is a preferred embodiment of the peeling apparatus of the present invention.
FIGS. 1 (a) to 1 (d) are continuous views for explaining the movement of each part in the peeling apparatus 1 during peeling. The configuration of the peeling apparatus 1 is described with reference to FIG. 1 (a). explain. The movement of each part at the time of peeling will be described later.

In FIG. 1A, the peeling apparatus 1 includes a stage 20, a knife 30, a normal direction moving unit 40, a fixed surface direction moving unit 42, and further includes a three-component force sensor 46.
That is, the peeling device 1 is in close contact with the main surface of the display device panel 10 with a support and has a stage 20 having a flat fixing surface that can fix the display device panel 10 with a support, and the display device with a support. Interface between the resin layer and the thin glass substrate in the support to be peeled off at the end face of the panel 10 for display device with a support fixed to the stage 20 and the knife 30 used for peeling the support from the panel 10 In addition, a normal direction moving unit 40 for moving the knife 30 in a normal direction (vertical direction in FIG. 1) parallel to the normal line on the fixed surface of the stage 20 so that the knife 30 can be inserted, and the knife A fixed surface direction moving unit 42 that moves the resin 30 between the resin layer and the thin glass substrate, and further, a load applied to detect the load applied to the knife 30 And a ternary force sensor 46 as output units.
Further, as will be described later, the knife 30 in the peeling device 1 is moved between the resin layer and / or the thin glass so that the knife 30 moves along the surface of the resin layer when inserted between the resin layer and the thin glass substrate. It has the property of being deformed by the action from the substrate.
Moreover, the base member 2 and the stage 20 in the peeling apparatus 1 which is a preferred embodiment are fixed to the floor of the room where the peeling apparatus 1 is installed, and do not move. Further, the fixed surface 20a (see FIG. 3) of the stage 20 is a horizontal plane (that is, parallel to the floor of the room). Further, the base member 2 and the first fixed side member 42b of the fixed surface direction moving unit 42 are fixed, and similarly, the first moving side member 42a of the fixed surface direction moving unit 42 and the first in the fixed surface direction. The moving member main body 3, the first moving member main body 3, the second fixed side member 40b of the normal direction moving unit 40, the second moving side member 40a of the normal direction moving unit 40 and the second moving member main body 5 in the normal direction. The second moving member body 5, the three-component force sensor 46, the third moving member body 4 in the normal direction, the third moving member body 4 and the knife 30 are fixed.

Although not shown in FIG. 1, as will be described later with reference to FIG. 3, the peeling device 1 is a suction pad that sucks the second main surface of the support glass substrate 19 b in the display device panel 10 with a support. 60, a camera 70 used for inserting the knife 30 on the end face of the display device panel with a support, and a static elimination substance (water or the like) at the interface between the resin layer 18b and the thin glass substrate 12b on the support to be peeled off. And a charging suppression device 75 that suppresses charging of the display device panel 10 with a support by connecting the display device panel 10 with a support and the ground with a conductor. .

Another preferred embodiment of the peeling apparatus of the present invention will be described.
FIG. 2 is a schematic sectional view of a peeling device 11 which is another preferred embodiment of the peeling device of the present invention.
2 (a) to 2 (d) are continuous views for explaining the movement of each part in the peeling apparatus 11 when peeling, and the configuration of the peeling apparatus 11 will be described with reference to FIG. 2 (a). explain. The movement of each part at the time of peeling will be described later.
Note that the peeling device 11 has a portion in common with the peeling device 1 described above. The description of the part will be simplified. In FIG. 2, the same reference numerals (numbers) as those in FIG.

2A, the peeling apparatus 11 includes a stage 20, a knife 300, a normal direction moving unit 40, a fixed surface direction moving unit 42, an insertion angle adjusting unit 59 having a rotating mechanism 50 and a stopper 51, and a method. A linear movement mechanism 44 and a three-component force sensor 46.
That is, the peeling apparatus 11 includes the same stage 20 as the peeling apparatus 1, a normal direction moving unit 40, a fixed surface direction moving unit 42, and a three-component force sensor 46. In addition to these, the knife 300 used for peeling the support from the display device panel 10 with the support, and the knife 300 are rotated by a predetermined angle (less than 180 degrees) around the tip, that is, the rotation is performed. An insertion angle adjusting unit 59 having a rotation mechanism 50 that can move and move the rear end portion of the knife 300 in the normal direction, and a stopper 51 as an insertion angle setting mechanism that sets upper and lower limits of the insertion angle of the knife 300; Is provided with a normal direction moving mechanism 44 that can move in the normal direction.
Here, the knife 300 in the peeling apparatus 11 has a property different from that of the knife 30 in the above-described peeling apparatus 1 and is not deformed. That is, like the knife 30, the knife 300 acts from the resin layer and / or the thin glass substrate so as to move along the surface of the resin layer when inserted between the resin layer and the thin glass substrate. It does not have the property of being deformed by.
Moreover, the base member 2 and the stage 20 in the peeling apparatus 11 which is a preferred embodiment are fixed to the floor of the room where the peeling apparatus 11 is installed, and do not move. Further, the fixed surface of the stage 20 is a horizontal plane (that is, parallel to the floor of the room). Further, the base member 2 and the first fixed side member 42b of the fixed surface direction moving unit 42 are fixed. Similarly, the first moving side member 42a of the fixed surface direction moving unit 42 and the first fixed surface direction moving unit 42 are fixed. The moving member main body 3, the first moving member main body 3 and the second fixed side member 40b of the normal direction moving unit 40, the second moving side member 40a of the normal direction moving unit 40 and the third fixed side of the normal direction moving mechanism 44. Side member 44b, third moving side member 44a of normal direction moving mechanism 44, second moving member main body 5 in the normal direction, second moving member main body 5, three-component force sensor 46, and third moving member in the normal direction The main body 4 is fixed. The knife 30 is supported so as to be rotatable (turnable) with respect to the third moving member main body 4.

Although not shown in FIG. 2, as described later with reference to FIG. 3, the peeling device 11 is similar to the peeling device 1 in that the suction pad 60, the camera 70, the nozzle 73, and the charging suppression device. 75.

<Stage>
The peeling apparatus 1 and the peeling apparatus 11 (hereinafter also referred to as “peeling

apparatuses

1 and 11”) include a stage 20. The stage 20 in the peeling

apparatuses

1 and 11 will be described with reference to FIG.
FIG. 3 is a schematic cross-sectional view showing that the display device panel 10 with a support is fixed on the fixing surface 20 a of the stage 20 in the

peeling devices

1 and 11. Here, the display device-equipped panel 10 has both main surfaces of the display device member 14 formed of a thin glass substrate (12a, 12b), a resin layer (18a, 18b), and a support glass substrate (19a, 19b). It is a thing of the aspect pinched | interposed with a laminated body.
Here, what sandwiched both main surfaces of the display device member 14 between the thin glass substrates 12a and 12b is referred to as a display device panel 16 in a narrow sense, and each lamination of the resin layers 18a and 18b and the supporting glass substrates 19a and 19b. The bodies are called

supports

17a and 17b. The support 17b to be peeled consists of a support glass substrate 19b and a resin layer 18b. Therefore, in a broad sense, the display device panel 16 and the support body 17a in a narrow sense may be integrally referred to as a display device panel.

The

peeling devices

1 and 11 include a stage 20 having a porous vacuum suction plate 22 having a flat fixed surface, a display-equipped display device panel 10 fixed on the fixed surface of the stage 20, and a display with a support. A knife 30 or a knife 300 is provided on the end face 10x of the apparatus panel 10 and inserted into the interface between the resin layer 18b and the thin glass substrate 12b in the support 17b to be peeled.
Also, a suction pad 60 that sucks on the second main surface of the support glass substrate 19b in the display device panel 10 with a support, and a camera 70 that includes an image processing device that is used to insert the knife 30 or the knife 300 on the end surface 10x. A display device with a support by connecting a nozzle 73 for spraying a neutralizing substance to the interface between the resin layer 18b and the thin glass substrate 12b in the support to be peeled, the display-equipped display device panel 10 and the ground with a conductor. A charging suppression device 75 that suppresses charging of the panel 10 is provided.

Further, the porous vacuum suction plate 22 is connected to a pump 24, and is evacuated using the pump 24, and a support is provided on a fixed surface (upper surface in the stage 20 shown in FIG. 3) of the porous vacuum suction plate 22. The second main surface of the supporting glass substrate 19a in the display device panel 10 is vacuum-adsorbed to fix the display device panel 10 with support. In the peeling apparatus of the present invention, the fixing surface of the stage means a flat surface that can be in close contact with the main surface of the display device-equipped panel 10 and can be fixed.

In the present invention, the stage is not particularly limited as long as it can hold and fix the display device panel with the support on its fixed surface, but as shown in FIG. 3, it is sucked and fixed by vacuum suction. It is preferable that This is because the surface of the panel for a display device with a support is hardly scratched, and can be detached in a short time.

Further, the stage can hold the display device panel with a support by placing the support device display panel on the fixed surface, and the width (area) of the fixed surface on the support surface is fixed. It is preferable that it is the same extent as the main surface area of the thin glass substrate in a display panel for a display.

In the present invention, the fixed surface of the stage is a horizontal plane as shown in FIGS. 1 to 3, but is not limited to a horizontal plane and may be a curved surface. FIG. 15 is a schematic cross-sectional view for explaining a peeling method when a part of the fixed surface of the stage 20 is a curved surface. First, the display device panel 10 with the support is fixed to the stage 20 in which a part of the fixing surface 20a is curved, and the resin layer 18b (see FIG. 3) of the support 17b and the thin plate of the display device panel 16 are fixed. In the initial stage (FIG. 15 (a)) in which the knife 30 is inserted between the glass substrate 12b (see FIG. 3), the knife 30 moves along the surface of the resin layer 18b to display the support 17b. A trigger for separation from the device panel 16 is provided (FIG. 15B). After that (FIG. 15C), the support 17b is sucked using the suction pad 82, and the support 17b and the display device panel 16 are peeled off. Since the fixed surface 20a of the stage 20 is a curved surface, the deformation of the support 17b can be suppressed smaller than that of the stage 20 having a fixed surface, and there is no possibility that the support 17b is broken during peeling.
Alternatively, the stage 20 may be a flexible member, and the entire surface may be peeled while being sequentially bent and deformed. FIG. 16 is a schematic cross-sectional view for explaining a peeling method when the stage 20 is a flexible member. First, the display device panel 10 with the support is fixed to the flexible stage 20 whose fixing surface is horizontal, the resin layer 18b (see FIG. 3) of the support 17b and the thin glass substrate 12b of the display device panel 16 (see FIG. 3). In the initial stage (FIG. 16A) in which the knife 30 is inserted between the support member 17b and the display device panel 16 at the initial stage (FIG. 16A), the knife 30 moves along the surface of the resin layer 18b. This gives an opportunity to peel off (FIG. 16B). After that (FIG. 6C), the support 17b is sucked by using the suction pad 82, and the stage 20 is sucked by another suction pad 82 provided below the stage 20, thereby supporting the support 17b and the stage. The support body 17b and the display device panel 16 are peeled off while sequentially bending and deforming 20. Since the stage 20 is made to be a flexible member and is peeled while being sequentially bent and deformed, the deformation of the support 17b can be kept small compared to a stage that is not deformed while the fixed surface remains horizontal. There is no risk of destruction.

In FIG. 3, the angle indicated by θ represents the knife insertion angle. That is, the insertion angle (θ) means the upper surface of the knife (if the knife is a two-stage blade as shown in FIG. 4 described later), and the support to be peeled off. This is an angle formed by the surface of the resin layer 18b of the body 17b.

<Knife>
The knife 30 and the knife 300 are used for peeling the support 17b from the display device panel 10 with a support. Insert into the interface and peel off.

The shape of the knife 30 in the peeling apparatus 1 is demonstrated using FIG. Although only the knife 30 will be described here, the shape of the knife 300 in the peeling device 11 may be the same as that of the knife 30 in the peeling device 1.
4A is a schematic top view of the knife 30, and FIG. 4B is a schematic end view.
The size, shape and the like of the knife used in the present invention are not particularly limited, but the knife 30 which is a preferred embodiment has a size and shape as shown in FIG. That is, as shown in FIG. 4A, when viewed from above, the knife 30 has a rectangular shape with a width of 10 mm and a length of 100 mm. Moreover, as shown in FIG.4 (b), thickness is 0.1 mm and it is a two-stage blade. The tip portion 30a shown in FIG. 4 (b) constituting the two-stage blade is sharp and has an angle of 25 degrees when viewed from the end face, and the middle step portion 30b has an angle of 15 degrees, and the rear end portion 30c. Is flat.

As described above, the size of the knife 30 is 10 mm in width and 100 mm in length, but the size of the knife used in the present invention is preferably 5 to 50 mm in width and 30 to 200 mm in length. The thickness is preferably 0.05 to 1.0 mm.
Moreover, it is preferable that it is a two-stage blade like the knife 30. This is because the tip of the knife can be prevented from damaging the surface of the thin glass substrate or the resin layer.
Further, as described above, the angle formed by the tip 30a of the knife 30 is about 25 degrees, but when the knife used in the present invention is a two-stage blade, the angle formed by the tip is 20 to 30 degrees. preferable. Similarly, the angle formed by the middle step is preferably 10 to 20 degrees. Further, the curvature of the tip is not particularly limited, but the curvature radius is preferably 0.001 mm or more. Furthermore, the knife used in the present invention is preferably a double-edged blade as shown in FIG. 4, but may be a single-edged blade.

Next, the material and deformability of the knife will be described.
The material of the knife 30 and the knife 300 is not particularly limited. Examples thereof include metals such as stainless steel, ceramics, plastics, and hard rubber.
Also, it is inserted between the resin layer and the thin glass substrate and deforms when it receives some action (force) from the resin layer and / or thin glass substrate, and reversibly when the action is released. It is preferable that the material be released from the original shape after being deformed. For example, an elastic body such as rubber can be preferably exemplified, but a metal or the like behaves as an elastic body in a range where the action (force) applied to the knife is not large, and therefore can be preferably used.
Further, it is preferable that the material is made of a material having a Young's modulus of about 1,000 to 400,000 N / mm ² , preferably about 200,000 N / mm ² . Stainless steel has a Young's modulus of 206,000 N / mm ² and can be preferably used.

Moreover, the knife 30 of the peeling apparatus 1 is provided with specific bending rigidity [N · mm ² ].
Specifically, when the shape of the knife 30 is, for example, as shown in FIG. 4 above, the bending rigidity (hereinafter referred to as “bending rigidity A”) with respect to the load applied to the upper surface (load in the thickness direction). to.) is a 5,000 N · mm ² or less and preferably 200 N · mm ² or less.
Further, when the shape of the knife 30 is, for example, as shown in FIG. 4 above, the bending rigidity with respect to the load in the width direction (the bending rigidity when a load is applied to the side (surface) in the length direction) ( hereinafter referred to as "bending stiffness B".) is a 200,000N · mm ² or more, it is preferable that the 1,000,000N · mm ² or more.
Furthermore, it is more preferable that the bending rigidity A is 5,000 N · mm ² or less and the bending rigidity B is 200,000 N · mm ² or more.
Note that the bending stiffness (bending stiffness A and bending stiffness B) here is the Young's modulus [N / mm ² ] determined by the material of the knife, and the sectional moment [mm ⁴ ] determined by the sectional shape and the position of the neutral axis. As the product of
Thus, since the knife 30 of the peeling apparatus 1 is provided with the bending rigidity A and B in the specific range as described above, when inserted between the resin layer and the thin glass substrate, along the surface of the resin layer. As it moves, it is deformed by the action from the resin layer and / or the thin glass substrate. As will be described later, the knife 300 of the peeling apparatus 11 does not need to have the bending rigidity as the knife 30 has, but may have it.

Next, the support part which supports the knife 30 of the peeling apparatus 1 is demonstrated.
It is preferable that the knife 30 is supported by the support part 61 provided with a structure as shown in FIG. FIG. 5A is a schematic perspective view of the knife 30 and the support portion 61 that supports the knife 30 in the peeling apparatus 1. FIGS. 5B and 5C are schematic top views showing the movement of one arm 611 in FIG. 5A. In FIGS. 5B and 5C, the knife 30 is omitted and not shown.
The support part 61 in FIG. 5 has two plate-like arms 611, and these are connected to the knife 30. The arm 611 can be deformed so as not to disturb the deformation of the knife 30 itself when some force is applied to the knife 30.
For example, as shown in FIG. 5B, the two arms 611 can be deformed so as to approach each other. Further, for example, as shown in FIG. 5C, it can be deformed so as to have an S shape when viewed from above.

In addition to providing the bending rigidity A and B in the specific range as described above, the knife 30 is further supported by the support portion as described above, and therefore when the knife 30 is inserted between the resin layer and the thin glass substrate. In order to move along the surface of the resin layer, it is more easily deformed by the action from the resin layer and / or the thin glass substrate.
More specifically, for example, as shown in FIG. 6 (in FIGS. 6A to 6C, the support portion 61 is omitted), a knife is provided between the resin layer and the thin glass substrate. In the initial stage of insertion (FIG. 6B), the knife 30 moves along the surface of the resin layer by deformation in its normal direction, and thereafter (FIG. 6C), the insertion direction. The deformation of the rotation direction and the so-called twisting phenomenon combined with the rotation direction with the portion where the knife 30 and the display device panel 10 with the support come into contact with each other and the portion where the knife 30 and the support portion are connected to each other as a fulcrum Can move along the surface of the resin layer.

On the other hand, the knife 300 of the peeling apparatus 11 does not have the bending rigidity that the knife 30 has, and does not have the support structure such as the support portion 61. Therefore, it is not deformed by the action from the resin layer or the thin glass substrate. Therefore, the peeling device 11 needs to include an insertion angle adjusting unit having a rotation mechanism and an insertion angle setting mechanism that the peeling device 1 does not have, and a normal direction moving mechanism.
In addition, the peeling apparatus of this invention has a knife provided with a deformability like the knife 30, and does not exclude having an insertion angle adjustment unit and a normal direction moving mechanism like the peeling apparatus 11. . Rather, depending on the deformability (degree of deformation), the knife may move more favorably.

<Normal direction moving unit>
The normal direction moving unit 40 in the peeling apparatus 1 will be described with reference to FIG. The peeling apparatus 11 also has a similar normal direction moving unit 40.
In the peeling apparatus 1, the normal direction moving unit 40 includes a second moving side member 40a and a second fixed side member 40b. The second moving side member 40a and the second fixed side member 40b are connected via a cross roller guide (not shown), and a second moving side with respect to the second fixed side member 40b is driven by driving a servo motor (not shown). The member 40a can be moved in the normal direction, and the knife 30 connected thereto can be moved in the normal direction.
As described above, the normal direction means a direction parallel to the normal on the fixed surface 20a of the stage 20 (see FIG. 3). Since the fixing surface 20a of the stage 20 in the peeling apparatus 1 is a horizontal plane, in the peeling apparatus 1 (also in the peeling apparatus 11), the normal direction is the vertical direction (vertical direction).
In this way, the knife 30 is provided at the interface between the resin layer 18b and the thin glass substrate 12b of the support 17b to be peeled, which is the end face of the display device panel 10 with the support fixed on the fixed surface 20a of the stage 20. The position can be adjusted so that can be inserted (see FIG. 3).

In the present invention, the normal direction moving unit is not particularly limited as long as it can move the knife to a desired position in the normal direction.

<Insertion angle adjustment unit>
The peeling apparatus 11 includes an insertion angle adjustment unit 59 having a rotation (or rotation) mechanism 50 and a stopper 51 as an upper / lower limit setting mechanism. The peeling apparatus 1 does not have an insertion angle adjustment unit.
The rotation mechanism 50 in the peeling apparatus 11 is demonstrated using FIG. 2 (a) and FIG.
In the peeling device 11, the rotation mechanism 50 is configured such that the rotation shaft 54 and the knife 300 are connected via the bracket 52, and the rotation (or rotation) shaft 54 rotates (or rotates) by a predetermined angle. It is a mechanism that can rotate (or rotate) a predetermined angle.
FIG. 7 is a schematic cross-sectional view for explaining such a rotation mechanism 50, and is a view of a cross-section cut horizontally from the center of the rotation shaft 54.
In FIG. 7, the rectangular knife 300 has three sides fixed to the bracket 52, and the bracket 52 is also fixed to the rotating shaft 54. Therefore, the knife 300 is the same when the rotating shaft 54 rotates. Rotate to. The rotating shaft 54 is supported by a bracket 58 via a resin sliding bush 56. The bracket 58 is fixed to the third moving member main body 4 shown in FIG. Further, as shown in FIGS. 2A and 7, the tip of the knife 300 and the center of the rotating shaft 54 substantially coincide with each other. Therefore, the knife 300 can rotate around its tip.

Further, as shown in FIG. 2A, the peeling device 11 has a stopper 51. The stopper 51 is connected to the third moving member main body 4, and can be fixed in a desired position by moving in the normal direction (vertical direction) relative to the third moving member main body 4. Therefore, if fixed, the stopper 51 moves following the movement of the third moving member body 4 in the normal direction.

With such a stopper 51, the upper limit or lower limit of the insertion angle (θ) of the knife 300 can be adjusted. By determining the position of the stopper 51 so as to support the lower surface of the bracket 52, the knife 300 does not rotate further in the direction in which the insertion angle (θ) becomes larger, so an upper limit can be set. In this case, it is possible to rotate in the reverse direction (direction in which θ decreases).
The insertion angle (θ) is not particularly limited, but is preferably 2 to 5 degrees.

<Fixed surface direction moving unit>
The fixed surface direction moving unit 42 in the peeling apparatus 1 will be described with reference to FIG.
The peeling apparatus 11 also has a similar fixed surface direction moving unit.
In the peeling apparatus 1, the fixed surface direction moving unit 42 includes a first moving side member 42a and a first fixed side member 42b. The first moving side member 42a and the first fixed side member 42b are connected via a cross roller guide (not shown), and a first moving side with respect to the first fixed side member 42b is driven by driving a servo motor (not shown). The member 42a can be moved in the fixed surface direction (the left-right direction in FIG. 1A) that is parallel to the fixed surface of the stage 20, and the knife 30 connected thereto can be moved in the fixed surface direction. Then, the knife 30 can be moved between the resin layer and the thin glass substrate.

In the present invention, the fixed surface direction moving unit is not particularly limited as long as it can move the knife to a desired position in the fixed surface direction.

<Normal direction moving mechanism>
The normal direction moving mechanism 44 in the peeling apparatus 11 will be described with reference to FIG.
In the peeling apparatus 11, the normal direction moving mechanism 44 includes a third moving side member 44a, a third fixed side member 44b, and a stopper 44c. The third moving side member 44a and the third fixed side member 44b are connected via a cross roller guide (not shown), and the third moving side member 44a is in the normal direction (upward direction) with respect to the third fixed side member 44b. Can move freely.
The stopper 44c is connected to the second moving side member 40a of the normal direction moving unit 40, and is moved in the normal direction (vertical direction) relative to the second moving side member 40a to a desired position. It can be fixed with. Therefore, if fixed, the stopper 44c moves following the movement in the normal direction (vertical direction) of the second moving side member 40a.
With such a stopper 44c, the lowest position in the normal direction (vertical direction) of the knife 30 can be determined. By determining the position of the stopper 44c so as to support the lower surface of the second moving member main body 5, the knife 30 does not move downward. You can move up.

In the present invention, the normal direction moving mechanism is not particularly limited as long as the entire knife can move upward.

<Load weight detection unit>
The load weight detection unit in the peeling apparatus 1 will be described with reference to FIG. The peeling apparatus 11 also has a similar load weight detection unit.
The peeling apparatus 1 includes a three-component force sensor 46 as a load-weighted detection unit for the knife 30 so as to be sandwiched between the third moving member body 4 and the second moving member body 5.
The peeling apparatus of the present invention preferably includes a load weight detection unit for such a knife. Moreover, it is preferable to prepare as close to the knife as possible. It is preferable that the peeling device of the present invention is provided with a load load detection device for a knife, since it can be peeled without applying an excessive force when the support is peeled off using the knife.

<Suction pad>
The

peeling devices

1 and 11 include a plurality of suction pads 60 that are sucked to the second main surface of the supporting glass substrate 19b in the display device panel 10 with a support.
In this invention, it is preferable to provide such a suction pad and to peel a support body from the display apparatus panel 10 with a support body using this.

The suction pads provided in the

peeling devices

1 and 11 will be described with reference to the drawings.
FIG. 8 is a schematic perspective view showing a part of the peeling

apparatuses

1 and 11. 8, the

peeling devices

1 and 11 fix the display device panel 10 with a support substantially horizontally on the fixed surface of the stage 20, and the support 17b to be peeled off from the display device panel 10 with a support. A number of suction pads 82 are sucking the second main surface of the support glass substrate 19b (see FIG. 3).

As shown in FIG. 8, a plurality of suction pads 82 are arranged above the stage 20 to which the support-equipped display device panel 10 is fixed. In the peeling

apparatuses

1 and 11, these suction pads 82 are arranged in a grid pattern on the frame 84. However, in the present invention, the arrangements are not necessarily equal pitches. The frame 84 is moved down along the guide 86 when the support is peeled off, and at a timing immediately before the suction pad 82 comes into contact with the upper surface of the support-equipped display device panel 10 (second main surface of the support glass substrate). The downward movement is stopped by a lifting device (not shown).

Regarding the size of the suction pad 82, if the size is small, the holding force to the display device panel 10 with the support is insufficient and the number of the suction pads 82 increases, which is uneconomical. Further, if the suction pad 82 is too large, the deformation of the display device panel 10 with the support in the central portion of the suction due to evacuation becomes large, which may cause damage to the display device panel 10 with the support in some cases. Become. For these reasons, the appropriate size (for example, φ25 to 80 mm, preferably φ25 to 65 mm, more preferably φ40 mm) and the number of the suction pads 82 are the size and thickness of the display device panel 10 with the support. It is selected by etc.

The suction pad 82 is connected to a piston 89 of an independent air cylinder 88, and the suction pad 82 is moved up and down by the expansion and contraction of the piston 89. By the lowering operation of the suction pad 82, the suction pad 82 is pressed and brought into contact with the display device panel 10 with the support, and the upper surface of the display device panel 10 with the support is sucked to the suction pad 82, and the suction pad 82 is lifted. As a result, the support 17b (support glass substrate 19b and resin layer 18b) in the display device panel 10 with the support is peeled from the display device panel 16 (see FIG. 3).

Such an ascending operation of the suction pad 82 does not cause the suction pads 82 in the entire region of the display device panel 10 with the support to be lifted all at once, but from the end of the display device panel 10 with the support toward the center. As the peeling of the support progresses, it is preferably controlled so as to move up in order. Moreover, it is preferable to adjust the raising distance of the suction pad according to the bending stress and size allowed for the support.
Further, it is preferable to support the suction pad 82 so that the suction pad 82 can be tilted by using a swivel structure or the like at the connecting portion between the suction pad 82 and the piston 89. This is because even the portion of the supporting glass substrate 19b (see FIG. 3) adsorbed by the adsorption surface of the adsorption pad 82 can be gradually exfoliated from one end to stabilize the exfoliation.

Although it is possible to lift the suction pad in the normal direction and peel the support, the suction pad may be raised in a direction having an angle with respect to the normal direction. For example, as will be described in detail below, when the ascending operation is performed sequentially from the end of the support-equipped display device panel 10 toward the center as the support peels off, the suction pad is moved toward the center. It is preferable that the support is lifted so that the support can be peeled off more easily.

9 is a top view of the upper surface of the display device panel with a support 10 (second main surface of the support glass substrate 19b), and shows a position where the suction pad 82 shown in FIG. 8 is sucked. FIG. 4 is a block diagram showing a control system for the suction pad 82. In FIG. 9, it is assumed that a knife is inserted in the lower right corner, and in the plurality (42 in FIGS. 8 and 9) of suction pads 82, the suction pad closest to the corner is the pad 82a, and the next (upper left) 2 Pads 82d to 82l are also labeled, such that one suction pad is the pad 82b and the three adjacent suction pads 82 (upper left) are the pads 82c.

As shown in FIG. 10, the electromagnetic valves 87a to 87l are provided for the air cylinders 88a to 88l of the pads 82a to 82l as shown in FIG. Is provided, and the opening / closing timing of the electromagnetic valves 87a to 87l is time-controlled by the control unit (pad moving unit) 90. That is, the pads 82a to 82l are controlled so as to be moved upward at predetermined time intervals in order from the portion (corner) where the suction force is lost by inserting the knife 30 or the knife 300. That is, it has a time control function. As a result, it is possible to prevent the support from being damaged by forcibly raising the portion where the adsorption force remains. And it can raise and peel in order with progress of peeling of a support body from the edge part of the panel 10 for display apparatuses with a support toward the center, and can peel.

The air cylinders 88a to 88l of the pads 82a to 82l are connected to the air pump 83 via electromagnetic valves 87a to 87l and electropneumatic regulators 85a to 85l. These electropneumatic regulators 85a to 85l are respectively controlled by the control unit 90. It is controlled. That is, the controller 90 controls each of the electropneumatic regulators 85a to 85l to gradually increase the amount of air supplied to the air cylinders 88a to 88l, thereby gradually increasing the ascending force of the suction pad 82. By executing such force control, it is possible to avoid the problem of damage to the glass substrate 10 with the support caused by increasing the force that is forcibly increased from the beginning, and to minimize the time required for peeling. be able to.

On the other hand, the suction pad 82 is connected to a vacuum pump 77 via a valve 79 that is controlled to open and close by the control unit 90 and an electropneumatic regulator 78. The regulator 78 controls the air pressure of the suction pad 82. The timing of raising the suction pad 82 and the rising force can be set to an arbitrary value by the operator by operating a switch (not shown) such as a touch panel provided on the operation panel of the control unit 90.

<Camera>
The

peeling devices

1 and 11 include a camera 70 equipped with an image processing device in order to determine a position where the knife 30 or the knife 300 is inserted in the end surface 10x of the display device panel 10 with a support. The camera 70 captures the position information of the knife 30 or knife 300 as image data into the image processing apparatus, processes the image data, determines whether the position is a desired position, and moves the result in the normal direction. By feeding back to the unit 40, the knife 30 or the knife 300 can be moved to a desired position.
In the present invention, it is preferable that the camera including the image processing apparatus as described above is provided, and the position where the knife is inserted on the end face of the display device-equipped panel is determined by image processing.
The types of the camera and the image processing apparatus are not particularly limited, and conventionally known ones can be used.

<Blowing device>
The peeling

apparatuses

1 and 11 include a nozzle 73 that can spray a charge-removing substance (water or the like) on the interface between the resin layer 18b of the support 17b to be peeled and the thin glass substrate 12b of the display device panel 16. (See FIG. 3).
When peeling is performed using the peeling device of the present invention, the resulting display panel may be charged. For example, a charged voltage of +10 kV may be exhibited. Therefore, the above-described charging can be suppressed by spraying a neutralizing substance at the time of peeling.
Examples of the neutralizing substance include ionized liquids and / or gases such as water and water vapor. Moreover, the air ionized with the pulse power supply device etc. and other gas are mentioned.

Moreover, in a spraying apparatus, things (air etc.) other than the substance for static elimination can also be sprayed. In this case, there is an effect of promoting peeling. The same effect can be obtained even when the neutralizing substance is sprayed. For example, spraying water or a mixed fluid of water and air is preferable because it provides a static elimination action and a peeling promotion action.
In this invention, by providing such a spraying apparatus, a support body can be peeled from the panel 10 for display apparatuses with a support body using this.

<Charging control device>
The

peeling devices

1 and 11 include a charging suppression device 75 for connecting the display device panel with support 10 and the ground with a conductor to suppress charging of the display device panel 10 with support, that is, for grounding. (See FIG. 3).
On the periphery of the surface (main surface) of the thin glass substrate in contact with the display device member, for example, a guard ring made of a non-driving electrode film formed with a transparent electrode film to which a driving voltage is not applied is formed. It is preferable to connect the ring and the conductor for grounding.
When peeling is performed using the peeling device of the present invention, the resulting display panel may be charged. For example, a charged voltage of +10 kV may be exhibited. Therefore, when the above-described charging suppression device is provided, the above charging can be suppressed.
In the present invention, when such a charge suppressing device is provided, the support can be preferably peeled from the display device panel 10 with the support.

In the peeling

apparatuses

1 and 11 described above, the fixing surface 20a of the stage 20 is a horizontal plane. However, in the peeling apparatus of the present invention, the fixing surface may not be a horizontal plane, that is, a plane parallel to the floor of the room. Good. For example, the surface may be a surface parallel to the vertical direction, or may be a surface that intersects obliquely therewith. Further, not only the stage but also the direction in which the peeling apparatus of the present invention is installed is not limited at all. For example, the left and right and the top and bottom of the peeling device 1 and the peeling device 11 shown in FIGS. 1 and 2 may be interchanged.

<Peeling method (part 1)>
Next, a peeling method using the peeling apparatus 1 will be described with reference to FIGS.
First, the main surface of the display device-equipped panel 10 without a support to be peeled later is brought into close contact with and fixed to a planar fixed surface provided in the stage 20 (FIG. 1A). . That is, the display device panel 10 with the support is fixed by vacuum suction on the stage 20 so that the main surface with the support to be peeled is on the top and the opposite main surface is on the bottom.

Next, as shown in FIG. 1B, the normal direction moving unit 40 adjusts the position of the knife 30 in the normal direction (vertical direction). Specifically, by driving the servo motor, the second moving side member 40a is moved in the normal direction (vertical direction) of the fixed surface of the stage 20 with respect to the second fixed side member 40b, and is peeled off. The position is adjusted so that the knife 30 can be inserted into the interface between the surface of the resin layer 18b in the support and the first main surface of the thin glass substrate 12b.

Next, as shown in FIGS. 1C and 1D, the knife 30 is inserted by the fixed surface direction moving unit 42 and pushed in. Thus, when the knife 30 is inserted into the interface between the resin layer 18b and the thin glass substrate 12b in the insertion direction of the fixed surface and pushed in, as described with reference to FIGS. Is deformed. Since the peeling apparatus 1 which is a suitable embodiment of the peeling apparatus of this invention can make the knife 30 perform such a motion, it can peel preferably a support body and the said panel for display apparatuses.

<Peeling method (part 2)>
Next, a peeling method using the peeling apparatus 11 will be described with reference to FIGS.
First, in the panel 10 for a display device with a support, the main surface on which the support to be peeled later is not attached is brought into close contact with and fixed to a planar fixing surface provided in the stage 20 (FIG. 2A). . That is, the display device panel 10 with the support is fixed by vacuum suction on the stage 20 so that the main surface with the support to be peeled is on the top and the opposite main surface is on the bottom.

Next, as shown in FIG. 2A, the insertion angle (θ) of the knife 300 is adjusted. Specifically, the insertion angle (θ) of the knife 300 is adjusted to a desired angle by rotating (turning) a predetermined angle around the rotation axis, and the stopper 51 is placed so as to contact the lower surface of the blanket 52. Thus, the insertion angle (θ) can be fixed.

Next, as shown in FIG. 2B, the normal direction moving unit 40 adjusts the position of the knife 300 in the normal direction (vertical direction). Specifically, by driving the servo motor, the second moving side member 40a is moved in the normal direction relative to the second fixed side member 40b, and the surface of the resin layer 18b and the thin plate in the support to be peeled off The position is adjusted so that the knife 30 can be inserted into the interface with the first main surface of the glass substrate 12b.

Next, as shown in FIGS. 2C and 2D, the knife 300 is inserted by the fixed surface direction moving unit 42 and pushed in. When the knife 300 is inserted and pushed into the interface between the resin layer 18b and the thin glass substrate 12b in this way, the knife 300 rotates (rotates) by a predetermined angle around the front end 30a, and the rear end 30c rises. The knife 300 is moved in the upward direction and / or the insertion direction of the fixed surface direction, and the knife 300 is moved along the surface of the resin layer and further pushed in (FIG. 2D). ). Since the peeling device 11 which is a preferred embodiment of the peeling device of the present invention can cause the knife 300 to move in this manner, the support and the display device panel can be preferably peeled off.

In the

peeling devices

1 and 11, for example, when peeling the two

supports

17 a and 17 b in the display device panel 10 with a support as shown in FIG. 3, first, for example, one of the supports 17 b is peeled, After reversing, the display device panel can be obtained by fixing again on the fixed surface of the same stage or on the fixed surface of the stage of another peeling apparatus of the present invention and peeling the other support 17a. it can.

Next, a preferred peeling method using the

peeling devices

1 and 11 provided with suction pads will be described with reference to FIGS.

After the display device panel 10 with the support is fixed on the fixed surface of the stage 20, the frame 84 is moved downward, and the suction pad 82 is immediately before contacting the surface of the display device panel 10 with the support. Stop descending movement. Next, the piston 89 of the air cylinder 88 is extended, and the suction pad 82 is moved downward to be brought into pressure contact with the surface of the display device panel 10 with the support. Then, the air pressure of the suction pad 82 is controlled by the electropneumatic regulator 78, and the air pressure of the suction pad 82 is increased to the set pressure over a certain period of time. Thereby, all the suction pads 82 are attracted | sucked to the display apparatus panel 10 with a support body.

Next, as shown in FIG. 9, the knife 30 (or knife 300) is inserted into the corner of the display device panel 10 with a support by the knife 30 (or knife 300). Here, it is preferable to insert the knife 30 (or knife 300) to a position just below the suction pad 82a shown in FIG. This is because peeling with the suction pad can be performed more easily and preferably. After that, the control unit 90 controls the electromagnetic valve 87a shown in FIG. 10, and the pad 82a that sucks and holds the corner portion of the support-equipped display device panel 10 shown in FIG. 9 is peeled off (in the normal direction). The corners of the support 17b are peeled off from the display device panel.

Next, the control unit 90 controls the opening of the electromagnetic valve 87b in FIG. 10, and moves the pad 82b that sucks and holds the edge of the support 17b shown in FIG. 9 in the peeling direction to display the edge of the support 17b. Separated from the device panel 16 (see FIG. 3).
Next, the controller 87 controls the opening of the electromagnetic valve 87c of FIG. 10, moves the pad 82c shown in FIG. 9 upward in the peeling direction, and places the portion located inside the edge of the support 17b at the display device panel 16. Peel from.
Thereafter, the support can be completely peeled from the display device panel in the same manner.

<Panel for display device with support>
Next, the display device panel having the support, the support and the thin glass substrate used in the present invention will be described.
The display device-equipped panel used in the manufacturing method of the present invention has a first main surface, a second main surface, and a first main surface of a thin glass substrate having a display device member on the second main surface. The easily peelable resin layer fixed to the first main surface of the supporting glass substrate having the first main surface and the second main surface is in close contact.
In the embodiment of the present invention, the electronic device is a display device panel, but the present invention is not limited to this. Other electronic devices include electronic components such as solar cells, thin film secondary batteries, and semiconductor wafers having a circuit formed on the surface. The display device panel includes a liquid crystal panel, an organic EL panel, a plasma display panel, a field emission panel, and the like. In particular, it is suitable for manufacturing a panel for a thin display device. In the manufacturing process, it is an advantage that a single wafer manufacturing apparatus can be used as it is.

The thickness, shape, size, physical properties (thermal shrinkage, surface shape, chemical resistance, etc.), composition, etc. of the thin glass substrate in the display device panel with a support are not particularly limited. For example, a conventional LCD, It may be the same as a glass substrate for a display device such as an OLED.

The thickness of the thin glass substrate is preferably less than 0.7 mm, more preferably 0.5 mm or less, and further preferably 0.4 mm or less. Further, it is preferably 0.05 mm or more, more preferably 0.07 mm or more, and further preferably 0.1 mm or more.

The shape of the thin glass is not limited, but is preferably rectangular.

The size of the thin glass is not limited, but for example, in the case of a rectangle, it may be 100 to 2000 mm × 100 to 2000 mm, and more preferably 500 to 1000 mm × 500 to 1000 mm.

Even with such a thickness and size, the supporting glass substrate can be easily peeled off from the thin glass substrate in the peeling step in the production method of the present invention.

Properties of the thin glass substrate such as thermal shrinkage, surface shape, chemical resistance, etc. are not particularly limited, and vary depending on the type of display device to be manufactured.
The heat shrinkage rate is preferably small. Specifically, the linear expansion coefficient, which is an index of the thermal shrinkage rate, is preferably 500 × 10 ⁻⁷ / ° C. or less, more preferably 300 × 10 ⁻⁷ / ° C. or less, and 200 × 10 ⁻⁷ / ° C. More preferably, it is 100 ° C. ⁻⁷ / ° C. or less, and further preferably 45 × 10 ⁻⁷ / ° C. or less.
In addition, in this invention, a linear expansion coefficient means a thing prescribed | regulated to JISR3102 (1995).

In the embodiment of the present invention, the substrate is a thin glass substrate, but the present invention is not limited to this. From the viewpoint of industrial availability, glass plates, silicon wafers, metal plates, plastic plates and the like are preferable examples.
When a thin glass plate (thin glass substrate) is employed as the substrate, the composition of the thin glass substrate may be the same as that of alkali glass or non-alkali glass, for example. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.
When adopting a plastic plate as the substrate, the type is not particularly limited, for example, in the case of a transparent substrate, polyethylene terephthalate resin, polycarbonate resin, polyethersulfone resin, polyethylene naphthalate resin, polyacrylic resin, polysilicone resin, Examples thereof include transparent fluororesins. In the case of an opaque substrate, polyimide resin, fluorine resin, polyamide resin, polyaramid resin, polyether ketone resin, polyether ether ketone resin, various liquid crystal polymer resins, and the like are exemplified.
When a metal plate is employed as the substrate, the type is not particularly limited, and examples thereof include a stainless steel plate and a copper plate.
The heat resistance of the substrate is not particularly limited, but it is preferable that the heat resistance is high when forming a TFT array of a display device member. Specifically, the 5% heating weight loss temperature is preferably 300 ° C. or higher. Furthermore, it is more preferable that it is 350 degreeC or more.
In this case, any of the above glass plates is applicable in terms of heat resistance.
Preferred plastic plates from the viewpoint of heat resistance include polyimide resin, fluororesin, polyamide resin, polyaramid resin, polyethersulfone resin, polyetherketone resin, polyetheretherketone resin, polyethylene naphthalate resin, and various liquid crystal polymer resins. Illustrated.
The substrate may be a laminate in which different materials are laminated, such as a glass plate, a silicon wafer, a metal plate, and a plastic plate. For example, a laminated body of a glass plate and a plastic plate, a laminated body in which plastic plates, glass, and a plastic plate are laminated in order, two or more glass plates, or a laminated body of two or more plastic plates may be used.

The display device panel with a support has a display device member on the second main surface of the thin glass substrate.
The display device member is composed of a light emitting layer, a protective layer, a TFT array (hereinafter referred to as an array), a color filter, a liquid crystal, and ITO that are provided on the surface of a conventional glass substrate for a display device such as an LCD or OLED. It means various circuit patterns such as transparent electrodes. The kind of member for display apparatuses on the 2nd main surface of the said thin glass substrate is not specifically limited.
The display device panel has such a display device member and the thin glass substrate.

In the panel for a display device with a support, a support glass substrate having a resin layer fixed thereon is in close contact with the first main surface of the thin glass substrate as a support. The supporting glass substrate is in close contact with the thin glass substrate through the resin layer, and reinforces the strength of the thin glass substrate.

In the embodiment of the present invention, the supporting substrate is a supporting glass substrate, but the present invention is not limited to this. From the viewpoint of industrial availability, glass plates, silicon wafers, metal plates, plastic plates and the like are preferable examples.
When a glass plate is employed as the support substrate, the thickness, shape, size, physical properties (thermal shrinkage, surface shape, chemical resistance, etc.), composition, etc. of the support glass substrate are not particularly limited.
The thickness of the supporting glass substrate is not particularly limited, but it is necessary that the supporting glass substrate has a thickness that can be processed by the current production line.
For example, the thickness is preferably 0.1 to 1.1 mm, more preferably 0.3 to 0.8 mm, and still more preferably 0.4 to 0.7 mm.
For example, when the current production line is designed to process a substrate having a thickness of 0.5 mm and the thickness of the thin glass substrate is 0.1 mm, the thickness of the supporting glass substrate and the resin layer Together with the thickness, it is 0.4 mm. In addition, the current production line is most commonly designed to process a glass substrate having a thickness of 0.7 mm. For example, if the thickness of a thin glass substrate is 0.4 mm, the resin layer The thickness is 0.3 mm.
The thickness of the supporting glass substrate is preferably thicker than that of the thin glass substrate.

The shape of the supporting glass substrate is not limited, but is preferably rectangular.

Although the size of the supporting glass substrate is not limited, it is preferably about the same as the thin glass substrate, and is preferably slightly larger than the thin glass substrate. For example, specifically, it is preferable that each of the vertical direction or the horizontal direction is larger by about 0.05 to 10 mm. This is because the supporting glass substrate can be more easily separated from the thin glass substrate.

The supporting glass substrate may have a linear expansion coefficient that is substantially the same as or different from that of the thin glass substrate. Substantially the same is preferable in that the thin glass substrate or the supporting glass substrate is less likely to warp when subjected to the production method of the present invention.
The difference in linear expansion coefficient between the thin glass substrate and the supporting glass substrate is preferably 300 × 10 ⁻⁷ / ° C. or less, more preferably 100 × 10 ⁻⁷ / ° C. or less, and 50 × 10 ⁻⁷ / ° C. More preferably, it is not higher than ° C.

The composition of the supporting glass substrate may be the same as that of alkali glass or non-alkali glass, for example. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.
When a plastic plate is used as the support substrate, the type is not particularly limited. For example, polyethylene terephthalate resin, polycarbonate resin, polyimide resin, fluororesin, polyamide resin, polyaramid resin, polyethersulfone resin, polyetherketone resin, poly Examples include ether ether ketone resins, polyethylene naphthalate resins, polyacrylic resins, various liquid crystal polymer resins, and polysilicon resins.
When a metal plate is employed as the support substrate, the type is not particularly limited, and examples thereof include a stainless steel plate and a copper plate.
The heat resistance of the support substrate is not particularly limited, but it is preferable that the heat resistance is high when forming a TFT array of a display device member. Specifically, the 5% heating weight loss temperature is preferably 300 ° C. or higher. Furthermore, it is more preferable that it is 350 degreeC or more.
In this case, any of the above glass plates is applicable in terms of heat resistance.
Preferred plastic materials from the viewpoint of heat resistance include polyimide resins, fluororesins, polyamide resins, polyaramid resins, polyethersulfone resins, polyetherketone resins, polyetheretherketone resins, polyethylene naphthalate resins, and various liquid crystal polymer resins. Illustrated.

The resin layer fixed to the first main surface of the supporting glass substrate is attached to and closely adhered to the first main surface of the thin glass substrate, but can be easily peeled off. That is, the resin layer has easy peelability from the thin glass substrate.
In the display panel with a support used in the present invention, it is considered that the resin layer and the thin glass substrate are not attached due to the adhesive force that the adhesive has, and the force caused by van der Waals force between solid molecules. That is, it is thought that it is attached by adhesion.

The thickness of the resin layer is not particularly limited. The thickness is preferably 1 to 100 μm, more preferably 5 to 30 μm, and even more preferably 7 to 20 μm. This is because when the thickness of the resin layer is in such a range, the thin glass substrate and the resin layer are sufficiently adhered.
Moreover, even if bubbles or foreign substances are present, it is possible to suppress the occurrence of distortion defects in the thin glass substrate. On the other hand, if the resin layer is too thick, it takes time and materials to form the resin layer, which is not economical.

In addition, the resin layer may consist of two or more layers. In this case, “the thickness of the resin layer” means the total thickness of all the layers.
Moreover, when a resin layer consists of two or more layers, the kind of resin which forms each layer may differ.

In the resin layer, the surface tension of the surface of the resin layer relative to the first main surface of the thin glass substrate is preferably 30 mN / m or less, more preferably 25 mN / m or less, and 22 mN / m or less. Further preferred. This is because such surface tension can be more easily peeled off from the thin glass substrate, and at the same time, the close contact with the thin glass substrate becomes sufficient.
The resin layer is preferably made of a material having a glass transition point lower than room temperature (about 25 ° C.) or a material having no glass transition point. This is because it becomes a non-adhesive resin layer, is more easily peelable, can be more easily peeled off from the thin glass substrate, and at the same time is sufficiently adhered to the thin glass substrate.
Moreover, it is preferable that the resin layer has heat resistance. In the present invention, for example, when a member for a display device is formed on the second main surface of the thin glass substrate, the glass laminate of the thin glass substrate, the resin layer, and the supporting glass substrate may be subjected to heat treatment. is there.
Moreover, since the adhesiveness with a thin glass substrate will become low when the elasticity modulus of a resin layer is too high, it is unpreferable. On the other hand, if the elastic modulus is too low, the easy peelability is lowered, which is not preferable.

The type of resin forming the resin layer is not particularly limited. For example, acrylic resin, polyolefin resin, polyurethane resin, and silicone resin can be used. Several types of resins can be mixed and used. Of the group of resins, silicone resins are preferred. This is because the silicone resin is excellent in heat resistance and preferably has a degree of easy peeling from a thin glass substrate. Moreover, it is because it is easy to fix to a support glass substrate by the condensation reaction with the silanol group of the 1st main surface of a support glass substrate. The silicone resin layer is also preferable in that the easy peelability does not substantially deteriorate even when it is treated at, for example, about 300 to 400 ° C. for about 1 hour.

The resin layer is preferably made of silicone for release paper among silicone resins, and is preferably a cured product thereof. The silicone for release paper is mainly composed of silicone containing linear dimethylpolysiloxane in the molecule. The resin layer formed by curing the composition containing the main agent and the crosslinking agent on the surface (first main surface) of the supporting glass substrate using a catalyst, a photopolymerization initiator, etc. has excellent easy peelability. Since it has, it is preferable. Moreover, since the flexibility is high, even if foreign matters such as bubbles and dust are mixed between the thin glass substrate and the resin layer, the occurrence of distortion defects of the thin glass substrate can be suppressed.

Such release paper silicones are classified into condensation reaction type silicones, addition reaction type silicones, ultraviolet ray curable silicones, and electron beam curable silicones depending on the curing mechanism, and any of them can be used. Among these, addition reaction type silicone is preferable. This is because the curing reaction is easy, the degree of easy peeling is good when the resin layer is formed, and the heat resistance is also high.

Moreover, the silicone for release paper is classified into a solvent type, an emulsion type, and a solventless type, and any type can be used. Among these, a solventless type is preferable. This is because productivity, safety, and environmental characteristics are excellent. Further, since a solvent that causes foaming is not included at the time of curing when forming the resin layer, that is, at the time of heat curing, ultraviolet curing, or electron beam curing, bubbles are unlikely to remain in the resin layer.

Further, as release paper silicone, specifically, commercially available products or model numbers are KNS-320A, KS-847 (both manufactured by Shin-Etsu Silicone), TPR6700 (manufactured by GE Toshiba Silicone), vinyl silicone. A combination of “8500” (Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane “12031” (Arakawa Chemical Industries, Ltd.), vinyl silicone “11364” (Arakawa Chemical Industries, Ltd.) and methylhydrogenpoly Combination with siloxane “12031” (Arakawa Chemical Industries), combination of vinyl silicone “11365” (Arakawa Chemical Industries) and methylhydrogenpolysiloxane “12031” (Arakawa Chemical Industries), etc. Is mentioned. KNS-320A, KS-847, and TPR6700 are silicones that contain a main agent and a crosslinking agent in advance.

Further, it is preferable that the silicone resin forming the resin layer has a property that the components in the silicone resin do not easily migrate to the thin glass substrate, that is, low silicone migration.

Thus, when the silicone resin layer is used as the resin layer, the peeled support glass substrate and the support made of the silicone resin layer can be preferably reused. When the silicone resin in such a support after peeling has low silicone migration, this silicone resin layer tends to have a high residual adhesion rate. Therefore, reuse can be performed without problems.

Next, the panel for a display device with a support will be described with reference to the drawings.
FIG. 11: is a schematic sectional drawing which shows the one aspect | mode of the display apparatus panel with a support body of this invention.
In FIG. 11, a display device panel 110 with a support body includes a display device member 114, a thin glass substrate 112, a resin layer 118, and a support glass substrate 119, which are laminated. The display device panel 116 includes a layered display device member 114 and a thin glass substrate 112, and the support member 117 includes a resin layer 118 and a support glass substrate 119. The display device member 114 is formed on the second main surface of the thin glass substrate 112.
Then, the first main surface of the thin glass substrate 112 and the surface of the resin layer 118 fixed to the first main surface of the support glass substrate 119 are adhered to each other to form a display device panel 110 with a support. ing.
In the display device-equipped panel 110 shown in FIG. 11, the thin glass substrate 112, the resin layer 118, and the support glass substrate 119 have the same size.

FIG. 12 is a schematic front view showing another aspect of the display device panel with a support, and FIG. 13 is a cross-sectional view (schematic cross-sectional view) taken along line AA ′.
12 and 13, the display device-equipped panel 120 includes a display device member 124, a thin glass substrate 122, a resin layer 128, and a support glass substrate 129, which are laminated. The display device panel 126 includes a layered display device member 124 and a thin glass substrate 122, and the support 127 includes a resin layer 128 and a support glass substrate 129. The display device member 124 is formed on the second main surface of the thin glass substrate 122.
The first main surface of the thin glass substrate 122 and the resin layer 128 fixed to the first main surface of the support glass substrate 129 are in close contact with each other to form a display device panel 120 with a support. Yes.

12 and 13 has a main surface area of the supporting glass substrate 129 larger than that of the thin glass substrate 122.
12 and 13 is also referred to as the “surface area” of the resin layer 128 (hereinafter referred to as the “surface area”). ) The area of the first main surface of the thin glass substrate 122 is larger. Since the gap portion 125 is formed, the surface area of the resin layer 128 is smaller than the area of the first main surface of the thin glass substrate 122. And the part (alpha) which is not in contact with the resin layer 128 in the 1st main surface of the thin glass substrate 122, and the part (beta) of the supporting glass substrate 129 which opposes it are the end surfaces of the display apparatus panel 120 with a support body of this invention ( A gap portion 125 connected to γ ₁ , γ ₂ ) is formed.

It is preferable that such a gap portion 125 is formed because the thin glass substrate 122 and the resin layer 128 can be more easily peeled in the peeling step in the manufacturing method of the present invention.
Α shown in FIGS. 12 and 13 is preferably 0.1 to 5.0 mm, more preferably about 2.5 mm.

As shown in the schematic cross-sectional view of FIG. 14, the display device panel with support supports both main surfaces of the display device member 134 with the thin glass substrates (132a, 132b) and the resin layers (138a, 138b). A mode of sandwiching with a laminated body with glass substrates (139a, 139b) may be employed. At this time, the display device panel 136 includes a layered display device member 134 and

thin glass substrates

132a and 132b on both sides, and the

supports

137a and 137b include

resin layers

138a and 138b and

support glass substrates

139a and 139b, respectively. Become. Even if it is such an aspect, it is a display apparatus-equipped panel which can be used by this invention.

Next, the manufacturing method of the panel for display apparatuses with a support body which can be used by this invention is demonstrated.
The manufacturing method of a thin glass substrate and a support glass substrate is not specifically limited. For example, it can be produced by a conventionally known method. For example, it can be obtained by melting a conventionally known glass raw material to form a molten glass and then forming it into a plate shape by a float method, a fusion method, a down draw method, a slot down method, a redraw method or the like.

The method for forming the resin layer on the surface (first main surface) of the support glass substrate thus produced is not particularly limited.
For example, the method of adhering a film to the surface of a support glass substrate is mentioned. Specifically, a method of performing a surface modification treatment to give a high adhesive force to the surface of the film and adhering to the first main surface of the supporting glass substrate can be mentioned. Surface modification treatment methods include chemical methods such as silane coupling agents that chemically improve adhesion, physical methods such as flame (flame) treatment that increase surface active groups, and sandblast treatment. Examples thereof include a mechanical method for increasing the catch by increasing the surface roughness.

Moreover, the method of coating the resin composition used as a resin layer on the 1st main surface of a support glass substrate by a well-known method, for example is mentioned. Known methods include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. From such a method, it can select suitably according to a kind to a resin composition.
For example, when a solventless release paper silicone is used as the resin composition, a die coating method, a spin coating method or a screen printing method is preferred.

In addition, when manufacturing the panel for a display device with a support having a gap as described with reference to FIGS. 12 and 13, a portion where the gap is formed is masked in advance, and the resin composition is coated thereon. It is preferable to do. Masking means that when a resin composition is coated, a removable film or the like is pasted on a portion where a gap is formed in advance so that the resin composition is not coated on that portion, and the film is peeled off later. Is the method.

When the resin composition is coated on the first main surface of the supporting glass substrate, the coating amount is preferably 1 to 100 g / m ² , and more preferably 5 to 20 g / m ² .

As another method, for example, when a resin layer is formed from an addition reaction type silicone, a resin composition containing a silicone (main agent) containing linear dimethylpolysiloxane in the molecule, a crosslinking agent and a catalyst, It coats on a support glass substrate by well-known methods, such as a spray coat method, and makes it heat-harden after that. The heating and curing conditions vary depending on the blending amount of the catalyst. For example, when 2 parts by weight of a platinum-based catalyst is blended with respect to 100 parts by weight of the total amount of the main agent and the cross-linking agent, The reaction is preferably carried out at 100 ° C to 200 ° C. In this case, the reaction time is 5 to 60 minutes, preferably 10 to 30 minutes. In order to obtain a silicone resin layer having a low silicone migration property, it is preferable to allow the curing reaction to proceed as much as possible so that an unreacted silicone component does not remain in the silicone resin layer, but at such a reaction temperature and reaction time. When it exists, it is possible to prevent an unreacted silicone component from remaining in the silicone resin layer, which is preferable. If the reaction time is too long or the reaction temperature is too high, the silicone resin is simultaneously oxidized and decomposed to produce a low molecular weight silicone component, which may increase the silicone transferability. It is preferable to allow the curing reaction to proceed as much as possible so that an unreacted silicone component does not remain in the silicone resin layer in order to improve the peelability after the heat treatment.

After the resin layer is formed on the first main surface of the supporting glass substrate by such a method, a thin glass substrate is laminated on the surface of the resin layer.
When the resin layer is manufactured using the release paper silicone, the release paper silicone coated on the support glass substrate is heat-cured to form a silicone resin layer, and then the thin glass is formed on the silicone resin formation surface of the support glass substrate. Laminate the substrates. By curing the silicone for release paper by heating, the cured silicone resin is chemically bonded to the supporting glass. Further, the silicone resin layer is bonded to the supporting glass by the anchor effect. By these actions, the silicone resin layer is firmly fixed to the supporting glass substrate.

The thin glass substrate and the resin layer are in close contact with the resin layer by a force caused by Van der Waals force between the solid molecules that are very close to each other, that is, an adhesive force. In this case, the supporting glass substrate and the thin glass substrate can be held in a laminated state.

The method for laminating the thin glass substrate on the surface of the resin layer fixed to the supporting glass substrate is not particularly limited. For example, it can implement using a well-known method. For example, after laminating a thin glass substrate on the surface of the resin layer under a normal pressure environment, a method of pressure bonding the resin layer and the thin glass substrate using a roll or a press can be mentioned. It is preferable because the resin layer and the thin glass substrate are more closely adhered by pressure bonding with a roll or a press. Further, it is preferable because bubbles mixed between the resin layer and the thin glass substrate are easily removed by pressure bonding with a roll or a press.
When pressure bonding is performed by a vacuum laminating method or a vacuum pressing method, it is more preferable because suppression of bubble mixing and securing of good adhesion are more preferably performed. By pressure bonding under vacuum, there is an advantage that even if a minute bubble remains, the bubble does not grow by heating, and it is difficult to cause a distortion defect of the thin glass substrate.

When laminating a thin glass substrate on the surface of the resin layer of the supporting glass substrate, it is preferable that the surface of the thin glass substrate is sufficiently washed and laminated in a clean environment. This is because even if foreign matter is present, the flatness of the surface of the thin glass substrate is not affected by the deformation of the resin layer, but the higher the cleanness, the better the flatness and the better.

Thus, after obtaining the glass laminated body (henceforth "thin glass laminated body") which laminated | stacked the thin glass substrate, the resin layer, and the support glass substrate, it is the 1st of the thin glass substrate in this thin glass laminated body. (2) A display device member is formed on the main surface.
In forming the display device member, it is also preferable to improve the flatness by polishing the second main surface of the thin glass substrate as necessary.
The display device member is not particularly limited. For example, an array or a color filter included in the LCD can be mentioned. Further, for example, a transparent electrode, a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer included in the OLED can be given.

A method for forming such a display device member is not particularly limited, and may be the same as a conventionally known method.
For example, when manufacturing an LCD as a display device, a process of forming an array on a conventionally known glass substrate, a process of forming a color filter, and a glass substrate on which the array is formed and a glass substrate on which the color filter is formed are bonded together. It may be the same as various steps such as a step (array color filter bonding step). More specifically, examples of the processing performed in these steps include pure water cleaning, drying, film formation, resist coating, exposure, development, etching, and resist removal. Further, as a process performed after performing the bonding process of the array side substrate and the color filter side substrate, there are a liquid crystal injection process and an injection port sealing process performed after the process, and these processes are performed. Processing.

Taking the case of manufacturing an OLED as an example, as a process for forming an organic EL structure on the first main surface of a thin glass substrate, a process of forming a transparent electrode, a hole injection layer, a hole transport layer, Various processes such as a process for depositing a light emitting layer / electron transport layer and the like, a sealing process, and the like are performed. Specifically, for example, a film forming process, a vapor deposition process, and an adhesion of a sealing plate are performed. Processing and the like.

Thus, a panel for a display device with a support that can be used in the present invention can be manufactured.

Next, the manufacturing method of this invention is demonstrated.
In the manufacturing method of the present invention, a first main surface and a second main surface are formed on a first main surface of a thin glass substrate having a first main surface and a second main surface and having a display device member on the second main surface. The operation of peeling the support made of the support glass substrate and the resin layer from the panel for a display device with a support, to which the resin layer having easy peelability fixed to the first main surface of the support glass substrate has A display device panel manufacturing method, comprising: one main surface of the two main surfaces of the support-equipped display device panel, wherein the support is peeled off in a subsequent peeling step A fixing step of closely attaching a main surface, which is not attached to a body, to a flat fixing surface provided in the stage, and fixing the panel for a display device with a support on the fixing surface of the stage; and a fixing surface of the stage Display device with support fixed on top A peeling step of separating the support and the display device panel by inserting a knife at an interface between the resin layer of the support to be peeled and the thin glass substrate, which is an end face of the panel for use. A method for manufacturing a panel for a display device.

Thus, although the manufacturing method of this invention comprises the said fixing process and the said peeling process, this fixing process and the peeling process can be preferably implemented with the above-mentioned peeling apparatus of this invention. The fixing step and the peeling step can be performed by the above-described peeling method.
In the manufacturing method of this invention, the panel for display apparatuses can be obtained by applying the said fixing process and the said peeling process to the panel for display apparatuses with a support body obtained by said method.

FIG. 17 is a flowchart showing an example of a flow of a method for manufacturing a display device panel, which is an embodiment of the method for manufacturing an electronic device of the present invention.
The manufacturing method of the display device panel of the present invention shown in FIG. 17 will be described based on the case where the peeling device of the present invention shown in FIGS. 1 and 2 is used.
As shown in FIG. 17, in the method for manufacturing a display device panel according to the present invention, first, in step S100, the support-equipped display device panel 10 is prepared, for example, as described above.
Next, the process proceeds to step 110 for fixing the display device-equipped panel.
In this fixing step S110, the panel for display device with a step support 10 is brought into close contact with the fixing surface of the stage 20 in step S112. Next, in step S114, the display device panel 10 with the step support, which is in close contact, is fixed to the fixed surface of the stage 20 by vacuum suction.

Next, the process proceeds to the step 120 for peeling the display device-equipped panel.
In the peeling step S120, two first and second peeling methods of the peeling method (No. 1) and the peeling method (No. 2) described above are applied. Of course, it is needless to say that only one peeling method may be performed.
In the first peeling method (see FIG. 1) of the peeling step S120, first, in step S122, the interface between the resin layer of the support for the display device panel 10 with a step support and the thin glass substrate of the display device panel is provided. The insertion position (height) of the knife 30 is adjusted. Next, in step S124, the knife 30 is inserted and pushed into the interface between the resin layer and the thin glass substrate.
Subsequently, in step S126, the knife 30 is moved in the insertion direction to peel off the support.

On the other hand, in the second peeling method (see FIG. 2) of the peeling step S120, first, in step S132, the resin layer of the support body of the display device panel 10 with the step support body and the thin glass substrate of the display device panel are used. The insertion angle and insertion position (height) of the knife 300 are adjusted with respect to the interface. Next, in step S134, the knife 300 is inserted and pushed into the interface between the resin layer and the thin glass substrate. Subsequently, in step S136, the knife 300 is rotated (rotated) by a predetermined angle about the center of the tip, and moved upward and / or in the insertion direction to peel off the support.
Thus, the display device panel is manufactured in step S140 by peeling the support from the display device-equipped display device panel 10 in the peeling step S120.

According to the peeling step included in the production method of the present invention, the supporting glass substrate can be easily separated even when the supporting glass substrate is large, for example, 730 × 920 mm.

Further, after being subjected to the peeling step, it can be further subjected to a desired step. For example, in the case of LCD, the desired process includes a process of dividing into cells of a desired size, a process of injecting liquid crystal and then sealing the injection port, a process of attaching a polarizing plate, and a module forming process. It is done. For example, in the case of OLED, in addition to the steps applicable to the case of LCD, there is a step of assembling a thin glass substrate on which an organic EL structure is formed and a counter substrate. Note that the step of dividing into cells of a desired size is preferably performed by a laser cutter because the strength of the thin glass substrate is not reduced by the cutting process and no cullet is produced.

After obtaining the display device panel by the manufacturing method of the present invention as described above, the display device can be obtained by further subjecting it to a conventionally known process.

Such a method for manufacturing a display device is suitable for manufacturing a small display device used for a mobile terminal such as a mobile phone or a PDA. The display device is mainly an LCD or an OLED, and the LCD includes a TN type, STN type, FE type, TFT type, MIM type, IPS type, VA type, and the like. Basically, the present invention can be applied to both passive drive type and active drive type display devices.

The suitable example of the manufacturing method of this invention is demonstrated.
First, a method for producing a panel for a display device with a support that can be used in the present invention will be described.
First, a thin glass substrate and a supporting glass substrate are prepared, and these surfaces are cleaned. Examples of cleaning include pure water cleaning and UV cleaning.
Next, a resin layer is formed on the first main surface of the supporting glass substrate. For example, a silicone resin is coated on the first main surface of the supporting glass substrate using a screen printer. And it heat-hardens, forms a resin layer on the 1st main surface of a support glass substrate, and obtains the support glass substrate to which the resin layer was fixed.

Next, the resin layer and the first main surface of the sheet glass are attached and bonded together. For example, the resin layer and the thin glass substrate can be bonded together by vacuum pressing at room temperature. And the glass laminated body which is a laminated body of a supporting glass substrate, a resin layer, and a thin glass substrate can be obtained.
Here, the 2nd main surface of the thin glass substrate in a glass laminated body may be grind | polished as needed, and you may wash | clean. Examples of cleaning include pure water cleaning and UV cleaning.

After manufacturing two glass laminated bodies by such a method, the member for display apparatuses is formed in the 2nd main surface of the thin glass substrate in each glass laminated body. One glass laminate is subjected to a known color filter forming step to form a color filter array on the second main surface of the thin glass substrate. Then, the other glass laminate is subjected to a known array forming process to form a TFT array on the second main surface of the thin glass substrate.
Two panels for a display device with a support can be manufactured by such a method.
Hereinafter, the panel for a display device with a support having the color filter array obtained here is also referred to as “panel x with support”, and the panel with a support having the TFT array is also referred to as “panel y with support”.

In the manufacturing method of the present invention, the panel x with support and the panel y with support manufactured as described above are further processed by, for example, the following methods 1 to 4 to manufacture a panel for a display device. .

(Case 1)
In case 1, as described above, the color filter array and the TFT array in each of the support-equipped panel x and the support-equipped panel y are opposed to each other and attached using a sealing agent such as an ultraviolet curable sealing agent for cell formation. Match. The panel for a display device with a support obtained here is also referred to as “panel with support z1” below. The panel with support z1 is in a state where liquid crystal is not yet sealed.

Next, the liquid crystal injection hole of the support-equipped panel z1 is sealed. For example, the outer side may be further sealed using an ultraviolet curable water-soluble sealant or the like.
And the panel z1 with a support after sealing is used for the peeling process in the manufacturing method of this invention. Specifically, the stage 20 in the peeling apparatus 1 or the peeling apparatus 11 which is the peeling apparatus of the present invention is fixed so that the main surface with the support to be peeled is on the top and the opposite main surface is on the bottom. A knife is inserted into an arbitrary portion at the end of the adhesion interface between the first main surface of the thin glass substrate and the resin layer to form a gap. And by adsorbing and holding a plurality of suction pads on the second main surface of the support glass substrate in the support and moving it upward (peeling direction), the support and the thin glass substrate are peeled and separated. be able to.
Next, two support bodies can be peeled by changing the upper and lower sides of the panel z1 with a support body and processing similarly.
The display device panel thus obtained is also referred to as “panel w1” below. The two supports separated by separation can be reused for the production of another panel with support.

Next, the panel w1 is cut into individual cells.
Next, liquid crystal is injected into the cut individual cells and then sealed to form a liquid crystal cell.
Then, a polarizing plate is further attached to form a backlight and the like, and the LCD 1 can be obtained.

(Case 2)
In case 2, as described above, the color filter array and the TFT array in each of the support-equipped panel x and the support-equipped panel y are opposed to each other, liquid crystal is sealed, and thereafter, an ultraviolet curable sealant for cell formation, etc. Bond together using the sealant. The panel with support of the present invention obtained here is also referred to as “panel with support z2” below.

Next, the panel with support z2 is subjected to a peeling step in the production method of the present invention. Specifically, the stage 20 in the peeling apparatus 1 or the peeling apparatus 11 which is the peeling apparatus of the present invention is fixed so that the main surface with the support to be peeled is on the top and the opposite main surface is on the bottom. A knife is inserted into an arbitrary portion at the end of the adhesion interface between the first main surface of the thin glass substrate and the resin layer to form a gap. And by adsorbing and holding a plurality of suction pads on the second main surface of the support glass substrate in the support and moving it upward (peeling direction), the support and the thin glass substrate are peeled and separated. be able to.
Next, two support bodies can be peeled by changing the upper and lower sides of panel z2 with a support body, and processing similarly.
The display device panel thus obtained is hereinafter also referred to as “panel w2”. The two supports separated by separation can be reused for the production of another panel with support.

Next, the panel w2 is cut into individual cells.
Then, a polarizing plate is further attached to form a backlight and the like, and the LCD 2 can be obtained.

(Case 3)
In case 3, as described above, the color filter array and the TFT array in each of the support-equipped panel x and the support-equipped panel y are made to face each other, liquid crystal is sealed, and then an ultraviolet curable sealant for cell formation, etc. Bond together using the sealant. And it cut | disconnects to an individual cell with a support body. The panel for a display device with a support obtained by cutting here is also referred to as a “panel with support z3” below.

Next, the panel z3 with a support is subjected to a peeling process. Specifically, the stage 20 in the peeling apparatus 1 or the peeling apparatus 11 which is the peeling apparatus of the present invention is fixed so that the main surface with the support to be peeled is on the top and the opposite main surface is on the bottom. A knife is inserted into an arbitrary portion at the end of the adhesion interface between the first main surface of the thin glass substrate and the resin layer to form a gap. And by adsorbing and holding a plurality of suction pads on the second main surface of the support glass substrate in the support and moving it upward (peeling direction), the support and the thin glass substrate are peeled and separated. be able to.
Next, two support bodies can be peeled by changing the upper and lower sides of panel z3 with a support body, and processing similarly.
The display device panel thus obtained is also referred to as “panel w3” below.
Then, a polarizing plate is further attached to form a backlight and the like, and the LCD 3 can be obtained.

(Case 4)
In case 4, as described above, the color filter array and the TFT array in each of the support-equipped panel x and the support-equipped panel y are opposed to each other and attached using a sealing agent such as an ultraviolet curable sealing agent for cell formation. Match. And it cut | disconnects to an individual cell with a support body. Hereinafter, the panel with a support of the present invention obtained by cutting is also referred to as “panel with support z4”. The panel with support z4 is in a state where liquid crystal is not yet sealed.

Next, the liquid crystal injection hole of the support-equipped panel z4 is sealed. For example, the outer side may be further sealed using an ultraviolet curable water-soluble sealant or the like.
And the panel z4 with a support body after sealing is used for a peeling process. Specifically, the stage 20 in the peeling apparatus 1 or the peeling apparatus 11 which is the peeling apparatus of the present invention is fixed so that the main surface with the support to be peeled is on the top and the opposite main surface is on the bottom. A knife is inserted into an arbitrary portion at the end of the adhesion interface between the first main surface of the thin glass substrate and the resin layer to form a gap. And by adsorbing and holding a plurality of suction pads on the second main surface of the support glass substrate in the support and moving it upward (peeling direction), the support and the thin glass substrate are peeled and separated. be able to.
Next, two support bodies can be peeled by changing the upper and lower sides of panel z4 with a support body, and processing similarly.
Hereinafter, the panel obtained by separating the two supports is also referred to as “panel w4”.

Next, liquid crystal is injected into the cell of the panel w4 and then sealed.
Further, an LCD 4 can be obtained by attaching a polarizing plate and forming a backlight and the like.

As described above, the display device panel having the display device member on the surface (second main surface) of the substrate has been described as a representative example of the electronic device of the present invention. However, as described above, the present invention is not limited to this. In addition to the display device member, the solar cell having the surface (second main surface) of the substrate, the member for a solar cell, the member for a thin film secondary battery, and the member for an electronic device such as an electronic component circuit, the thin film 2 Of course, it may be an electronic device such as a secondary battery or an electronic component.
For example, as the solar cell member, in the silicon type, a transparent electrode such as positive electrode tin oxide, a silicon layer represented by p layer / i layer / n layer, a metal of the negative electrode, and the like can be cited. And various members corresponding to the dye-sensitized type, the quantum dot type, and the like.
Moreover, as a member for a thin film secondary battery, in the lithium ion type, a transparent electrode such as a metal or a metal oxide of a positive electrode and a negative electrode, a lithium compound of an electrolyte layer, a metal of a current collecting layer, a resin as a sealing layer, etc. In addition, various members corresponding to nickel hydrogen type, polymer type, ceramic electrolyte type and the like can be mentioned.
In addition, as a circuit for an electronic component, in a CCD or CMOS, a metal of a conductive part, a silicon oxide or a silicon nitride of an insulating part, and the like, various sensors such as a pressure sensor and an acceleration sensor, a rigid printed board, a flexible printed board And various members corresponding to a rigid flexible printed circuit board.

Embodiments of the present invention will be described.

First, a supporting glass substrate (Asahi Glass Co., Ltd., AN100, non-alkali glass substrate) having a length of 720 mm, a width of 600 mm, a thickness of 0.4 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. is washed with pure water and UV washed. And cleaned.
Next, a solvent-free addition reaction type release paper silicone (manufactured by Shin-Etsu Silicone, KNS-320A, viscosity: 0.40 Pa · s, 100 parts by mass and a platinum-based catalyst (manufactured by Shin-Etsu Silicone, CAT) -PL-56) The mixture with 2 parts by mass was coated with a screen printer with a size of 705 mm in length and 595 mm in width (coating amount 30 g / m ² ).
Next, this was heat-cured at 180 ° C. for 30 minutes in the air to obtain a silicone resin layer having a thickness of 20 μm on the surface of the supporting glass substrate.

Next, the side to be brought into contact with the silicone resin layer of a thin glass substrate (Asahi Glass Co., Ltd., AN100, alkali-free glass substrate) having a length of 715 mm, a width of 595 mm, a thickness of 0.3 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. After the surface was cleaned by pure water cleaning and UV cleaning, the silicone resin layer and the thin glass substrate were bonded together by a vacuum press at room temperature to obtain a glass laminate (glass laminate A1).
In addition, formation of the resin layer and lamination | stacking of the thin glass substrate were performed so that the clearance gap of 15 mm in depth might be formed in the edge part of a glass laminated body.
In the obtained glass laminate A1, both glass substrates were in close contact with the silicone resin layer without generating bubbles, and there was no distortion defect and smoothness was good.

Next, apart from the glass laminate A1 obtained as described above, the glass substrate A1 was further heat-treated in the atmosphere at 300 ° C. for 1 hour to obtain a glass laminate A2. It was confirmed that the resin layer of the glass laminate A2 was not deteriorated by heat and the heat resistance was good.

Next, the glass laminates A1 and A2 were subjected to the following peel tests 1 to 6.

<Peel test 1>
The second main surface side of the thin glass substrate of the glass laminate A1 is fixed on the porous vacuum suction plate by using the peeling apparatus 1 described with reference to FIG. 1, and the second surface of the opposite surface, that is, the supporting glass substrate is fixed. A vacuum suction pad (40 mmφ) was sucked and held on the main surface side.
Next, a knife (thickness: 0.10 mm, length: 100 mm, width: 10 mm, made of stainless steel, bending rigidity A: 170 N · mm ² , bending rigidity B: 1,720,000 N · mm ² ) is used for the glass laminate A1. The first main surface of the thin glass substrate is placed on the end surface (one of the four corners) and the end surface, and the knife is slid while the surface of the resin layer is slightly in contact with the fixed surface direction moving unit. And was inserted at an interface of approximately 20 mm to form a void.
Next, the vacuum suction pad was raised in order from the end of the display device panel with a support toward the center, along with the progress of the peeling of the support. At this time, the pull-up distance of the suction pad was 10 mm.

In such peeling test 1, the knife itself deformed and moved along the surface of the resin layer. And it was able to peel, without damaging a support body and a thin glass substrate.

<Peeling test 2>
The second main surface side of the thin glass substrate of the glass laminate A1 is fixed on the porous vacuum suction plate using the peeling device 11 described with reference to FIG. A vacuum suction pad (40 mmφ) was sucked and held on the main surface side.
Next, a knife (thickness: 0.40 mm, length: 100 mm, width: 10 mm, made of stainless steel, bending rigidity A: 11000 N · mm ² , bending rigidity B: 6,870,000 N · mm ² ) is used for the glass laminate A1. The first main surface of the thin glass substrate is placed on the end surface (one of the four corners) and the end surface, and the knife is slid while the surface of the resin layer is slightly in contact with the fixed surface direction moving unit. And was inserted at an interface of approximately 20 mm to form a void.
Next, the vacuum suction pad was raised in order from the end of the display device panel with a support toward the center, along with the progress of the peeling of the support. At this time, the pull-up distance of the suction pad was 10 mm.

In such a peeling test 2, the knife rotates about the front end, the rear end moves freely upward, and the entire knife moves further upward, so that the knife follows the surface of the resin layer. Moved. And it was able to peel, without damaging a support body and a thin glass substrate.

<Peeling test 3>
Using the peeling device 11, the second main surface side of the thin glass substrate of the glass laminate A1 is fixed on the porous vacuum adsorption plate, and the vacuum adsorption pad (40 mmφ on the opposite main surface, that is, the second main surface side of the supporting glass substrate). ) Was adsorbed and held.
Next, a knife (thickness: 0.10 mm, length: 100 mm, width: 10 mm, made of stainless steel) was placed on the corner (one of the four corners) and end face of the glass laminate A1, and the knife Was inserted into the interface with the first main surface of the thin glass substrate while sliding the surface of the resin layer slightly in contact with the fixed surface direction moving unit, and was inserted approximately 20 mm to form a void. Here, the insertion was performed while spraying a static eliminating fluid on the interface from an ionizer (manufactured by Keyence Corporation).
Next, the vacuum suction pad was pulled up while spraying a static eliminating fluid continuously from the ionizer toward the formed gap. As a result, the support and the thin glass could be peeled without damage to the glass laminate A1. The charged voltage of the thin glass substrate after peeling was +0.2 kV.

<Peel test 4>
Using the peeling device 11, the second main surface side of the thin glass substrate of the glass laminate A1 is fixed on the porous vacuum adsorption plate, and the vacuum adsorption pad (40 mmφ on the opposite main surface, that is, the second main surface side of the supporting glass substrate). ) Was adsorbed and held.
Next, a knife (thickness: 0.10 mm, length: 100 mm, width: 10 mm, made of stainless steel) is placed on the corner (one of the four corners) and end face of the glass laminate A1, The knife was inserted into the interface with the first main surface of the thin glass substrate while sliding the surface of the resin layer slightly in contact with the fixed surface direction moving unit, and was inserted approximately 20 mm to form a void.
Next, high-pressure water (2 MPa) was sprayed from a trimming nozzle (Ikeuchi 1 mmφ) toward the formed gap. As a result, the support and the thin glass could be peeled without damage to the glass laminate A1. The charged voltage of the thin glass substrate after peeling was +0.2 kV.

<Peeling test 5>
Exfoliation test 4 was done by the same method as above-mentioned exfoliation test 1 except having used glass layered product A2. Without damage to the glass laminate A2, the supporting glass substrate and the thin glass substrate were separated and separated.

<Peel test 6>
Two glass laminates A2 were used, and the first main surface side of each thin glass substrate was coated with a UV curable sealant (manufactured by Sekisui Chemical Co., Ltd.) in an area 5 mm inside from the glass edge in a linear and square shape Exfoliation test 5 was carried out in the same manner as exfoliation test 1 except that the bonded ones were used.
It was possible to separate the two supports from the laminate obtained by bonding two thin glass substrates, that is, the panel, without damaging the panel.

<Peel test 7>
Peeling was performed without using any of the peeling device 1 and the peeling device 11.
About said glass laminated body A1, on the surface of the resin layer formed in the corner | angular part and edge part of glass laminated body A1 with a knife (blade span 650mm, 1mm thickness) manually, and was formed in the 1st main surface of a support glass substrate The glass was inserted into the interface with the first main surface of the thin glass substrate while being slightly slid and moved as it was to separate the supporting glass from the thin glass without damaging the glass laminate A1. The charged voltage of the thin glass plate after the separation was +10 kV.

In Example 2, a laminate B was prepared in the same manner as in Example 1 except that the substrate was changed to a polyethylene terephthalate resin substrate having a thickness of 0.1 mm, and a test similar to the peel test 3 was performed. As a result, the support body and the polyethylene terephthalate resin substrate could be peeled without damage to the laminate B. The charged voltage of the polyethylene terephthalate resin substrate after peeling was +0.3 kV.

In Example 3, a laminate C was prepared in the same manner as in Example 1 except that the substrate was changed to a stainless steel (SUS304) substrate having a mirror finish with a thickness of 0.1 mm, and a test similar to the peel test 3 was performed. went. As a result, the support and the stainless steel substrate could be peeled off without damaging the laminate C. The charged voltage of the stainless steel substrate after peeling was +0.02 kV.

In Example 4, a laminate D was prepared and peeled in the same manner as in Example 1 except that the support substrate was changed to a polyethylene terephthalate resin substrate having a thickness of 1 mm and the substrate was changed to a polyethylene terephthalate resin substrate having a thickness of 0.1 mm. A simulation experiment was performed in which the same test as test 3 was performed. As a result, the support and the polyethylene terephthalate resin substrate could be peeled without damage to the laminate D. The charged voltage of the polyethylene terephthalate resin substrate after peeling was +0.5 kV.

In Example 5, the laminated body is the same as in Example 1 except that the supporting substrate is changed to a silicon wafer substrate having a thickness of 1 mm and a diameter of 6 inches, and the substrate is changed to a silicon wafer substrate having a thickness of 0.1 mm and a diameter of 6 inches. A simulation experiment was performed in which E was prepared and the same test as the peel test 3 was performed. As a result, the support body and the silicon wafer substrate could be peeled off without damaging the laminate E. The charged voltage of the silicon wafer substrate after peeling was +0.05 kV.

In Example 6, a laminate F was prepared in the same manner as in Example 1 except that the support substrate was changed to a polyethylene terephthalate resin substrate having a thickness of 1 mm and the substrate was changed to a thin glass substrate having a thickness of 0.1 mm, and a peel test was performed. A simulation experiment was performed in which the same test as in No. 3 was performed. As a result, the support and the thin glass substrate could be peeled off without damaging the laminate F. The charged voltage of the thin glass resin substrate after peeling was +0.2 kV.

In Example 7, a laminate G was prepared in the same manner as in Example 1 except that the substrate was changed to a polyimide resin substrate having a thickness of 0.05 mm (manufactured by Toray DuPont, Kapton 200HV). The test was conducted. As a result, the support body and the polyimide resin substrate could be peeled without damage to the laminate G. The charged voltage of the polyimide resin substrate after peeling was +0.2 kV.

First, a glass substrate (Asahi Glass Co., Ltd., AN100, non-alkali glass substrate) having a length of 350 mm, a width of 300 mm, a thickness of 0.08 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. Clean the surface by washing with an alkaline detergent, and spray the surface with a 0.1% methanol solution of γ-mercaptopropyltrimethoxysilane, followed by drying at 80 ° C for 3 minutes to prepare a glass film for lamination did. Meanwhile, a plasma-treated surface of a polyimide substrate (manufactured by Toray DuPont, Kapton 200HV) having a length of 350 mm, a width of 300 mm, and a thickness of 0.05 mm was prepared. And it laminated | stacked on the previous glass substrate, both were laminated | stacked using the press apparatus heated at 320 degreeC, and it was set as the glass / resin laminated substrate.
In Example 8, the thin glass substrate was changed to the glass / resin laminated substrate described above, and the surface opposite to the laminated surface of the resin substrate with the glass substrate was changed to the laminated surface with the support. A laminate H was prepared in the same manner as described above, and the same test as the peel test 3 was performed. As a result, the support and the glass / resin laminate film substrate could be peeled off without damaging the laminate H. The charged voltage of the glass / resin laminated film substrate after peeling was +0.2 kV.

Although the invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
This application is based on Japanese Patent Application No. 2009-026196 filed on Feb. 6, 2009 and Japanese Patent Application No. 2009-198992 filed on Aug. 28, 2009, the contents of which are incorporated herein by reference.

DESCRIPTION OF

SYMBOLS

1, 11 Peeling device 2 Base member 3 1st moving member main body 4 3rd moving member main body 5 2nd moving member main body
DESCRIPTION OF SYMBOLS 10 Display device panel with support 10x End surface 12a, 12b of display device panel with support Thin glass substrate 16, 116, 126, 136 Display panel 17a, 17b, 117, 127, 137a, 137b Support 18a, 18b Resin layer 19a, 19b Support glass substrate 20 Stage 22 Porous vacuum adsorption plate 24 Pump 26 Stage frame 30 Knife 30a Knife tip 30b Knife middle stage 30c Knife rear 40 40 Vertical movement unit 40a Second movement side Member 40b Second fixed side member 42 Fixed surface direction moving unit 42a First moving side member 42b First moving side member 44 Upward moving mechanism 44a Third moving side member 44b Third fixed side member 44c Stopper 46 Three component force sensor 5 Rotation mechanism 51 Stopper 52 Blanket 54 Rotating shaft 56 Bush 58 Blanket 59 Insertion angle adjustment unit 60 Suction pad 61 Support part 611 Arm 70 Camera 73 Nozzle 75 Charge suppression device θ Insertion angle 77 Vacuum pump 78 Electropneumatic regulator 79 Valve 82 Suction pad 83 Air pump 84 Frame 85 Electropneumatic regulator 86 Guide 87 Solenoid valve 88 Air cylinder 89 Piston 90 Control unit 110 Display device panel with support 112 Thin glass substrate 114 Display device member 118 Resin layer 119 Support glass substrate 120 Display with support Device panel 122 Thin glass substrate 124 Display device member 125 Gap portion 128 Resin layer 129 Support glass Substrate 132a, 132b thin glass substrate 134 for display device members 138a, 138b resin layer 139a, 139b supporting glass substrate

Claims

On the first main surface of the substrate having the first main surface and the second main surface and having the electronic device member on the second main surface, on the first main surface of the support substrate having the first main surface and the second main surface It consists of the said member for electronic devices and the said board | substrate including operation which peels the support body which consists of the said support substrate and the said resin layer from the electronic device with a support body which the resin layer which has the fixed easy peelability adhere | attached An electronic device manufacturing method comprising:
The main surface of one of the two main surfaces of the electronic device with the support, the main surface on which the stage is not provided with a support that is peeled off in a subsequent peeling step, is provided in a planar shape. A fixing step of closely attaching the electronic device with the support onto the fixing surface of the stage;
An end face of the electronic device with the support fixed on the fixed surface of the stage, and a knife is inserted into an interface between the resin layer and the substrate of the support to be peeled, and the support and the The manufacturing method of an electronic device which comprises the peeling process which peels an electronic device.
In the peeling step, the knife inserted at the interface between the resin layer and the substrate is deformed by the action from the resin layer and / or the substrate, thereby moving the knife in a further insertion direction. The method for manufacturing an electronic device according to claim 1, wherein the knife moves along the surface of the resin layer to peel the support and the electronic device.
In the peeling step, after the knife is inserted into the interface between the resin layer and the substrate, the knife rotates about its front end, and the rear end is a normal line on the fixed surface of the stage. The knife is moved along the surface of the resin layer by moving in the parallel direction, and the knife as a whole is also moved in at least one of the same parallel direction and the insertion direction. The manufacturing method of the electronic device of Claim 1 or 2 which peels the said electronic device.
Furthermore, after the fixing step and before the peeling step, the second main surface of the support substrate of the support to be peeled, comprising a suction step of adsorbing a plurality of suction pads,
In the peeling step, after the knife is further inserted into the interface between the resin layer and the substrate, the suction pad is moved in a peeling direction, which is a direction in which the resin layer and the substrate are peeled, and the support body The method for manufacturing an electronic device according to any one of claims 1 to 3, wherein the electronic device is a step of separating the electronic device from the electronic device.
The peeling step is further performed by the suction located closest to the place where the knife is inserted in the end face of the electronic device with the support among the plurality of suction pads sucked on the second main surface of the support substrate. The pad is first moved in the peeling direction, then the adjacent suction pad is moved in the peeling direction, and thereafter the suction pad next to the suction pad moved in the peeling direction is then The operation of sequentially moving in the peeling direction is a step of peeling the support in the direction from the end where the knife is inserted toward the center, and further peeling toward the extension line. The manufacturing method of the electronic device of description.
The process according to any one of claims 1 to 5, wherein the peeling step further includes an operation of determining, by image processing, a position where the knife is inserted at an interface between the resin layer and the substrate. Electronic device manufacturing method.
The peeling step is a step of further peeling the support and the electronic device while connecting the conductor to the support substrate and / or any part of the substrate and grounding to suppress charging. Item 7. A method for manufacturing an electronic device according to any one of Items 1 to 6.
8. The peeling process according to claim 1, wherein the peeling step is a step of peeling the support and the electronic device while spraying a charge-eliminating substance between the support and the electronic device while controlling charging. The manufacturing method of the electronic device in any one.
The electronic device according to any one of claims 1 to 8, wherein the peeling step is a step of further inserting the knife into an interface between the resin layer and the substrate while detecting a load applied to the knife. Manufacturing method.
10. The method of manufacturing an electronic device according to claim 1, wherein the electronic device is a display device panel.
On the first main surface of the substrate having the first main surface and the second main surface and having the display device member on the second main surface, on the first main surface of the support substrate having the first main surface and the second main surface A peeling device for peeling a support made of the support substrate and the resin layer from an electronic device with a support to which a fixed easily peelable resin layer is adhered,
A stage provided with a planar fixing surface capable of fixing the electronic device with a support in close contact with the main surface of the electronic device with the support;
A knife used to peel the support from the electronic device with the support;
In the fixed surface of the stage, the knife is inserted into the interface between the resin layer and the substrate in the support to be peeled, at the end surface of the electronic device with the support fixed to the stage. A normal direction moving unit that moves the knife in a normal direction that is parallel to the normal,
A fixed surface direction moving unit for moving the knife between the resin layer and the substrate;
When the knife is inserted between the resin layer and the substrate, the knife is deformed by an action from the resin layer and / or the substrate so as to move along the surface of the resin layer. ,
And / or
An insertion angle adjusting unit having a rotation mechanism for rotating the knife about the tip and moving the rear end of the knife in a normal direction, an insertion angle setting mechanism for setting upper and lower limits of the insertion angle of the knife, and A peeling apparatus comprising a normal direction moving mechanism for moving the entire knife in the normal direction.
A plurality of suction pads for adsorbing the second main surface of the support substrate of the support to be peeled in the electronic device with the support fixed on the fixed surface of the stage; and The peeling apparatus according to claim 11, further comprising a pad moving unit that moves in a peeling direction that is a direction in which the substrate is peeled off.
The pad moving unit first moves, in the peeling direction, a suction pad located closest to a position where the knife is inserted on the end surface of the electronic device with the support among the plurality of suction pads, Next, move the adjacent suction pad in the peeling direction, and then, in the same manner, sequentially move the suction pad adjacent to the suction pad moved in the peeling direction in the peeling direction, The peeling apparatus of Claim 12 provided with the time control function which peels a support body in the direction which goes to the center from the edge part which inserted the said knife, and also peels it toward the extension line.
The peeling apparatus according to any one of claims 11 to 13, further comprising an image processing apparatus for determining a position where the knife is inserted at an interface between the resin layer and the substrate.
15. The peeling apparatus according to claim 11, further comprising a ground for suppressing charging by connecting a conductor to an arbitrary portion of the support substrate and / or the substrate.
The peeling apparatus according to any one of claims 11 to 15, further comprising a charge control device that performs charge control by spraying a substance for neutralization between the support and the electronic device.
The peeling apparatus according to any one of claims 11 to 16, further comprising a load weight detection device that detects a load weight applied to the knife.
The peeling apparatus according to any one of claims 11 to 17, wherein the electronic device is a display device panel.