KR101311652B1 - Method for manufacturing electronic device and separation apparatus used therefor - Google Patents

Abstract

This invention provides the manufacturing method of the electronic device which can peel easily and isolate | separates easily and in a short time, and does not damage the contact | adherence board | substrate and resin layer, and the peeling apparatus used for this. The support substrate 19b and the number from the electronic device 10 with the support body with which the resin layer 18b fixed to the support substrate 19b is in close contact with the substrate 12b having the electronic device member 14. When peeling the support body 17b which consists of a ground layer 18b, the main surface which is not attached to the support body 17b which peels later adheres to the fixed surface 20a of the stage 20, and the electronic device with a support body ( 10 is fixed to the interface of the resin layer 18b of the support body 17b to be peeled off and the board | substrate 12b of the end surface of the electronic device 10 with a support body fixed to the stage 20 with a knife ( The above problem is solved by inserting 30 to separate the support 17b and the electronic device 16.

Description

The manufacturing method of an electronic device, and the peeling apparatus used for this {METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND SEPARATION APPARATUS USED THEREFOR}

This invention relates to the manufacturing method of an electronic device, and the peeling apparatus used for this.

In recent years, liquid crystal display (LCD) and organic electroluminescent display (OLED) are widely used as a display apparatus. In particular, in the field of portable display devices such as mobile phones and cellular phones, display devices are required to be lighter and thinner.

Similarly, electronic devices such as solar cells, thin film secondary batteries, and semiconductor wafers with circuits formed on their surfaces are also required to be lighter and thinner.

In order to cope with this, thinning of board | substrates, such as glass, resin, and a metal used for electronic devices, such as a display apparatus, is progressing.

In the case of a glass substrate, as a method of thinning a plate | board thickness, generally, before or after forming the member for display apparatuses on the surface of a glass substrate, the outer surface of a glass substrate is etched using chemical etching, and According to this, a method of physically polishing and thinning is performed again.

However, before forming an electronic device member, such as a display apparatus, on the surface of a glass substrate, when an etching process etc. make a glass substrate thin, the intensity | strength of a glass substrate will fall and the curvature amount will also increase. This results in a problem that it cannot be processed in an existing manufacturing line.

In addition, if the glass substrate is made thin by forming the display device member on the surface of the glass substrate by performing an etching process or the like, minute scratches formed on the surface of the glass substrate in the process of forming the display device member on the surface of the glass substrate will be described. The problem of presenting, namely an edge pits, arises.

Therefore, for the purpose of solving such a problem, a thin glass substrate (hereinafter also referred to as a "thin glass substrate") with a thin plate is bonded to another supporting glass substrate to form a laminate, and for manufacturing a display device in that state. The predetermined process is performed and the method of separating a thin glass substrate and a support glass substrate after that is proposed.

For example, Patent Document 1 below discloses a method of manufacturing a display device using a glass substrate for a product by integrating a glass substrate for a product and a glass substrate for reinforcement with each other by using electrostatic adsorption force or vacuum adsorption force between the glass substrates. It is described.

Patent Document 2 below describes a method of manufacturing a liquid crystal display device in which an end portion of a substrate and a support of a liquid crystal display device is bonded using a glass frit adhesive, and then an electrode pattern or the like is formed.

The following patent document 3 describes the manufacturing method of the board | substrate for display apparatuses which has the process of fuse | laminating the said two glass substrates by irradiating a laser beam to the edge surface vicinity of the at least peripheral part of two glass substrates.

The following patent document 4 attaches a board | substrate to the board | substrate conveyance jig in which an adhesive material layer is formed on a support body, and conveys the board | substrate conveyance jig through the manufacturing process of a liquid crystal display element, and is a board | substrate attached to the board | substrate conveyance jig | tool. The manufacturing method of the liquid crystal display device which peels a board | substrate from the board | substrate conveyance jig after performing a liquid crystal display element formation process sequentially, and complete | finishes a predetermined process is described.

In the following patent document 5, after performing a predetermined | prescribed process to the electrode substrate for liquid crystal display elements using the jig | tool provided with the ultraviolet curable adhesive on the support body, the ultraviolet curable adhesive is irradiated to the said electrode substrate for liquid crystal display elements, The adhesive force of an ultraviolet curable adhesive is reduced and the electrode substrate for liquid crystal display elements is peeled from the said jig, The manufacturing method of the liquid crystal display element characterized by the above-mentioned.

The following patent document 6 describes the conveyance method of temporarily fixing a thin plate to a support plate with an adhesive material, sealing the periphery part of the said adhesive material with a sealing material, and conveying the support plate which temporarily fixed the thin plate.

The following patent document 7 is a thin glass laminated body which laminates a thin glass substrate and a support glass substrate, The said laminated glass and the said support glass are laminated | stacked through the silicone resin layer which has easy peelability and non-adhesiveness. The thin glass laminated body which is set as is described. And in order to isolate | separate a thin glass substrate and a support glass substrate, what is necessary is just to apply the force which isolate | separates a thin glass substrate from a support glass substrate in a perpendicular direction, and to give an edge | tip of peeling to an edge part with a razor blade etc., or to apply air to a laminated interface. It is described that it can be peeled more easily by injecting.

The following patent document 8 describes the peeling apparatus for peeling plate-shaped objects, such as a glass substrate, adsorbed-held by an adsorption sheet from an adsorption sheet.

Japanese Patent Laid-Open No. 2000-241804 Japanese Patent Laid-Open No. 58-54316 Japanese Patent Laid-Open No. 2003-216068 Japanese Patent Publication No. 8-86993 Japanese Patent Laid-Open No. 9-105896 Japanese Patent Laid-Open No. 2000-252342 International Publication No. 2007/018028 Pamphlet Japanese Patent Publication No. 2007-185725

However, the method of fixing the glass substrates of patent document 1 using an electrostatic adsorption force or a vacuum adsorption force, the method of fixing both ends of the glass substrate of patent document 2 with a glass frit, or the end surface of the peripheral part of patent document 3 In the method of fusing two glass substrates by irradiating a laser beam in the vicinity, the glass substrates are laminated and closely adhered to each other without any intermediate layer, so that the glass substrate is distorted by the foreign matter such as bubbles or dust mixed between the glass substrates. This happens. Therefore, it is difficult to obtain the glass substrate laminated body with a smooth surface.

In addition, in the method of arrange | positioning an adhesion layer etc. between the glass substrates of patent documents 4-6, although generation | occurrence | production of the distortion defect by mixing, such as air bubbles between above glass substrates, can be avoided, It is difficult, and there exists a possibility that a thin glass substrate may be damaged at the time of separation. Moreover, the residual of the adhesive on the thin glass substrate after separation also becomes a problem.

On the other hand, according to the thin glass laminated body of patent document 7, distortion defects by mixing, such as air bubbles, among glass substrates as mentioned above are hard to generate | occur | produce. Moreover, it is also possible to peel a thin glass substrate and a support glass substrate. In addition, the problem of the residual of the adhesive on the thin glass substrate after separation is solved. However, separation of both glass substrates is desired to be performed more easily in a shorter time. Especially when a glass substrate is large, it becomes an important point in industrial use.

Moreover, the peeling apparatus of patent document 8 is an apparatus which peels the glass substrate etc. which were adsorbed-held by the adsorption sheet from an adsorption sheet, and supports the laminated glass substrate and the support glass substrate which adheres through the resin layer, and is said thin glass It is difficult to peel without damaging a board | substrate and also not leaving the said resin layer in the said thin glass substrate.

The present invention has been made in view of the above problems. That is, the generation of substrate defects caused by foreign matter such as bubbles or dust mixed between the substrates can be suppressed, and the existing manufacturing line can be processed without generating edge pits, and these can be removed without damaging the adhered substrate and the resin layer. An object of the present invention is to provide a method for manufacturing an electronic device that can be easily peeled off and separated in a short time. Moreover, it aims at providing the peeling apparatus which can implement the manufacturing method of such an electronic device.

MEANS TO SOLVE THE PROBLEM This inventor earnestly examined and completed this invention in order to solve the said subject.

The present invention relates to the following (1) to (18).

(1) Easiness of peeling fixed to a first main surface of a substrate having a first main surface and a second main surface and having a member for an electronic device on a second main surface, and a first main surface of a supporting substrate having a first main surface and a second main surface It is a manufacturing method of the electronic device containing the said member for electronic devices, and the board | substrate including the operation which peels the support body which consists of the said support substrate and the said resin layer from the electronic device with a support body with which the resin layer which has adhered. The main surface of one of the two main surfaces of the electronic device with the support body, which is one of the main surfaces, and which is not attached to the support body to be peeled off in a later step, is brought into close contact with the planar fixed surface of the stage. And a fixing step of fixing the electronic device with the support on the fixed surface of the stage, and on the fixed surface of the stage. The manufacturing method of an electronic device provided with the peeling process of peeling the said support body and an said electronic device by inserting a knife in the interface of the said resin layer and the said board | substrate of the said support body peeled off, which is a fixed end surface of the electronic device with a said support body. .

(2) In the said peeling process, the knife inserted in the interface of the said resin layer and the said board | substrate was deformed by the action from the said resin layer and / or the said board | substrate, and moved the said knife further in the direction to insert. In the case, the said knife moves so that it may follow the surface of the said resin layer, and peels the said support body and the said electronic device, The manufacturing method of the electronic device of said (1).

(3) In the said peeling process, after inserting the said knife in the interface of the said resin layer and the said board | substrate, the said knife rotates centering on the front-end | tip part, and a rear end part is the normal in the said fixed surface of the said stage. The knife moves along the surface of the resin layer by moving in a direction parallel to the direction of the knife and also in at least one of the same parallel direction and the insertion direction. The manufacturing method of the electronic device as described in said (1) or (2) which peels.

(4) An adsorption step of adsorbing a plurality of adsorption pads on the second main surface of the support substrate to be peeled off after the fixing step and before the peeling step, wherein the peeling step further includes the water After inserting the said knife at the interface of a ground layer and the said board | substrate, the said adsorption pad is moved in the peeling direction which is a direction which peels the said resin layer and the said board | substrate, and is a process of peeling the said support body and the said electronic device, said (1 The manufacturing method of the electronic device in any one of (3)-(3).

(5) The said peeling process is further located in the vicinity of the site | part where the said knife was inserted in the end surface of the electronic device with a said support body among the some adsorption pads which adsorb | suck to the 2nd main surface of the said support substrate. The adsorption pad to be moved first in the peeling direction, and then the neighboring adsorption pad is moved in the peeling direction, and then the adsorption pads of the neighboring adsorption pads moved in the peeling direction are similarly described above. The manufacturing method of the electronic device as described in said (4) which is a process of performing the operation which moves to a peeling direction in order, and peels the said support body in the direction toward the center from the edge part which inserted the said knife, and further peels toward the extension line. .

(6) The said peeling process is an interface of the said resin layer and the said board | substrate, The process in any one of said (1)-(5) which is a process which further includes the operation which determines the site | part which inserts the knife by image processing. The manufacturing method of the described electronic device.

(7) The said (1) said peeling process is a process of peeling the said support body and the said electronic device, connecting a conductor to the said support substrate and / or arbitrary site | parts of the said board | substrate, and taking a ground and suppressing charging. The manufacturing method of the electronic device in any one of (6).

(8) Any of the above (1) to (7), wherein the peeling step is a step of peeling the support and the electronic device while injecting an antistatic agent between the support and the electronic device to control charging. The manufacturing method of the electronic device of one.

(9) The electron according to any one of the above (1) to (8), wherein the peeling step is a step of inserting the knife at an interface between the resin layer and the substrate while detecting a load weight to the knife. Method of manufacturing the device.

(10) The manufacturing method of the electronic device in any one of said (1)-(9) whose said electronic device is a panel for display apparatuses.

(11) Easiness of peeling fixed to a first main surface of a substrate having a first main surface and a second main surface and having a member for a display device on the second main surface, and a first main surface of a supporting substrate having a first main surface and a second main surface; It is a peeling apparatus which peels the support body which consists of the said support substrate and the said resin layer from the electronic device with a support body with which the resin layer which it has adhered, and adhere | attached on the main surface of the electronic device with the said support body, A stage having a planar fixing surface capable of fixing the electronic device, a knife used for peeling the support from the electronic device with the support, and an electronic device with the support fixed to the stage. The knife is inserted into an interface between the resin layer and the substrate in the support body to be peeled off at an end surface. And a normal direction moving unit for moving the knife in a normal direction which is a direction parallel to the normal in the fixed surface of the stage, and a fixed surface direction moving unit for moving the knife between the resin layer and the substrate. In addition, when the knife is inserted between the resin layer and the substrate, the knife has a property that is deformed by the action from the resin layer and / or the substrate so as to move along the surface of the resin layer. And / or an insertion angle adjusting unit having a rotating mechanism for rotating the knife about the leading end to move the rear end of the knife in the normal direction, and an insertion angle setting mechanism for setting an upper and lower limit of the insertion angle of the knife; And a peeling sheet having a normal direction moving mechanism for moving the whole of the knife in the normal direction. .

(12) a plurality of adsorption pads for adsorbing a second main surface of the support substrate of the support body to be peeled off in the electronic device with the support body fixed on the fixed surface of the stage; And a pad moving unit which moves in a peeling direction which is a direction of peeling the substrate.

(13) The pad moving unit initially has an adsorption pad positioned in the vicinity of a portion where the knife is inserted in the end face of the electronic device with the support, among the plurality of adsorption pads in the peeling direction. And then move the adsorbent pads in the neighboring direction in the peeling direction, and then move the adsorbent pads in the neighboring direction of the adsorbent pads moved in the peeling direction in the same manner as described above in order. The peeling apparatus as described in said (12) provided with the time control function which peels a support body in the direction toward the center from the edge part which inserted the said knife, and peels toward the extension line.

(14) The peeling apparatus according to any one of (11) to (13), further comprising an image processing apparatus for determining an interface between the resin layer and the substrate and inserting the knife.

(15) The peeling apparatus according to any one of (11) to (14), further comprising a grounding portion that connects a conductor to the supporting substrate and / or any portion of the substrate to suppress charging.

(16) The peeling apparatus according to any one of (11) to (15), further comprising a charging control device that controls charging by injecting an antistatic material between the support and the electronic device.

The peeling apparatus in any one of said (11)-(16) which further comprises the load weight detection apparatus which detects the load weight to the said knife.

The peeling apparatus in any one of said (11)-(17) whose said electronic device is a panel for display apparatuses.

According to the present invention, generation of substrate defects caused by foreign matter such as bubbles or dust mixed between substrates can be suppressed, and it can be processed in an existing manufacturing line without generating edge pits, and it does not damage the adherent substrate and the resin layer. The present invention can provide a method for producing an electronic device that can be easily separated and separated in a short time. Moreover, the peeling apparatus which can implement the manufacturing method of such an electronic device can be provided.

1 (a) to 1 (d) are schematic cross-sectional views showing preferred embodiments of the peeling apparatus of the present invention.
2 (a) to 2 (d) are schematic cross-sectional views showing another preferred embodiment of the peeling apparatus of the present invention.
3 is a schematic cross-sectional view showing a part of a preferred embodiment of the peeling apparatus of the present invention.
4 (a) and 4 (b) are schematic top and schematic cross-sectional views showing a preferred embodiment of the knife.
(A) is a schematic perspective view for demonstrating the support part of a knife, (b) and (c) are schematic top views.
6 (a) to 6 (c) are schematic perspective views for explaining the deformation of the knife at the time of peeling.
7 is a schematic cross-sectional view showing a preferred embodiment of a rotating mechanism.
8 is a schematic perspective view showing a preferred embodiment of the suction pad.
9 is a diagram schematically showing that an adsorption pad is adsorbed.
10 is a block diagram showing a control system of an adsorption pad.
11 is a schematic cross-sectional view showing one embodiment of a panel for a display device with a support.
12 is a schematic plan view showing another embodiment of a panel for a display device with a support;
13 is a schematic cross-sectional view showing another embodiment of a panel for a display device with a support;
14 is a schematic cross-sectional view showing yet another embodiment of a panel for a display device with a support;
15 (a) to 15 (c) are schematic cross-sectional views for explaining a peeling method when a part of the fixing surface of the stage is a curved surface;
16A to 16C are schematic cross-sectional views for explaining the peeling method in the case where the stage is a flexible member.
It is a flowchart which shows an example of the flow of the manufacturing method of the panel for display devices which is one Embodiment of the manufacturing method of the electronic device of this invention.

This invention consists of the manufacturing method and peeling apparatus of this invention.

The manufacturing method of this invention can be implemented suitably using the peeling apparatus of this invention.

First, two suitable examples are given and demonstrated about the peeling apparatus of this invention.

In addition, although the detail is mentioned later, the electronic device with a support body used in this invention has the 1st main surface and the 2nd main surface, and the 1st main surface of the board | substrate which has a member for electronic devices on a 2nd main surface is 1st. The resin layer which has the ease of peeling fixed to the 1st main surface of the support substrate which has a main surface and a 2nd main surface is in close contact.

That is, the electronic device with a support body has an electronic device member, a board | substrate, a resin layer, and a support substrate, and these are laminated | stacked in this order. In addition, the electronic device has an electronic device member and a substrate, and the electronic device member is formed on the second main surface of the substrate.

In addition, the electronic device with a support body is what laminated | stacked two laminated bodies by which the board | substrate, the resin layer, and the support substrate were laminated | stacked in this order through the member for electronic devices, ie, a support substrate, a resin layer, a board | substrate, an electronic device. The member, the substrate, the resin layer, and the support substrate may be laminated in this order.

Here, an electronic device means electronic components, such as a display panel, a solar cell, a thin film secondary battery, and a semiconductor wafer in which the circuit was formed in the surface. The display panel includes a liquid crystal panel, an organic EL panel, a plasma display panel, a field emission panel, and the like.

The suitable Example of the peeling apparatus of this invention is described.

1 is a schematic cross-sectional view of a peeling apparatus 1 which is a preferred embodiment of the peeling apparatus of the present invention.

1 (a) to 1 (d) are continuity diagrams for explaining the movement of each part in the peeling apparatus 1 at the time of peeling. FIG. It demonstrates using 1 (a). The movement of each part at the time of peeling is mentioned later.

In Fig.1 (a), the peeling apparatus 1 is equipped with the stage 20, the knife 30, the normal direction movement unit 40, and the fixed surface direction movement unit 42, and 3 The component force sensor 46 is provided.

That is, the peeling apparatus 1 is provided with the plane fixing surface which can adhere to the main surface of the display apparatus panel 10 with a support body, and can fix the display apparatus panel 10 with a support body. Of the stage 20, the knife 30 used for peeling the support from the display device panel 10 with a support, and the display device panel 10 with the support fixed to the stage 20. Normal direction which is a direction parallel to the normal line in the fixed surface of the stage 20 so that the knife 30 may be inserted in the interface of the resin layer and the thin glass substrate in the support body peeled off in an end surface. In the vertical direction in FIG. 1, a normal moving unit 40 for moving the knife 30 and a fixed surface moving unit 42 for moving the knife 30 between the resin layer and the thin glass substrate are provided. And the load load on the knife 30 can be detected. The three-component force sensor 46 is provided as a load weight detection unit.

In addition, as will be described later, when the knife 30 in the peeling apparatus 1 is inserted between the resin layer and the thin glass substrate, the resin layer and / or the thin glass so as to move along the surface of the resin layer. It is provided with the property deformed by the action from a board | substrate.

In addition, the base member 2 and the stage 20 in the peeling apparatus 1 which are a suitable Example are fixed to the floor of the room in which the peeling apparatus 1 was installed, and do not move. In addition, the fixed surface 20a (refer FIG. 3) in the stage 20 is a horizontal surface (namely, parallel to the floor of a room). Moreover, the 1st fixed side member 42b of the base member 2 and the fixed surface direction movement unit 42 is being fixed, and similarly to the 1st moving side member 42a of the fixed surface direction movement unit 42 2nd movement of the 1st moving member main body 3 of the fixed surface direction, the 1st moving member main body 3, and the 2nd fixed side member 40b of the normal moving unit 40, and the normal moving unit 40 The side member 40a, the second moving member main body 5 in the normal direction, the second moving member main body 5, the three-component force sensor 46, the third moving member main body 4 in the normal direction, and the third movement The member main body 4 and the knife 30 are being fixed.

In addition, although not shown in FIG. 1, as demonstrated later using FIG. 3, the peeling apparatus 1 is made of the support glass substrate 19b in the display apparatus panel 10 with a support body. The resin layer in the adsorption pad 60 which adsorb | sucks to two main surfaces, the camera 70 used for inserting the knife 30 in the end surface of the panel for display devices with a support body, and the support body peeled off A nozzle 73 serving as an injector for injecting an antistatic material (water, etc.) to the interface between the 18b and the thin glass substrate 12b, the display device panel 10 with a support, and the ground are connected by a conductor. An antistatic device 75 for suppressing charging of the panel 10 for a display device with a support is provided.

The other suitable Example of the peeling apparatus of this invention is described.

2 is a schematic cross-sectional view of a peeling apparatus 11 which is another preferred embodiment of the peeling apparatus of the present invention.

FIG.2 (a)-FIG.2 (d) is a continuation diagram for demonstrating the movement of each site | part in the peeling apparatus 11 at the time of peeling, About the structure of the peeling apparatus 11 FIG. It demonstrates using 2 (a). The movement of each part at the time of peeling is mentioned later.

In addition, the peeling apparatus 11 has the site | part common to the above-mentioned peeling apparatus 1. The description of the site is briefly performed. In addition, in FIG. 2, about the site | part common to the peeling apparatus 1, the same code | symbol (number) is attached | subjected to FIG.

In FIG. 2A, the peeling apparatus 11 includes a stage 20, a knife 300, a normal moving unit 40, a fixed surface moving unit 42, and a rotating mechanism 50. And an insertion angle adjustment unit 59 having a stopper 51, a normal direction moving mechanism 44, and a three-component force sensor 46.

That is, the peeling apparatus 11 uses the stage 20 similar to the peeling apparatus 1, the normal direction movement unit 40, the fixed surface direction movement unit 42, and the three-component force sensor 46. Equipped. In addition, in addition to these, the knife 300 used to peel the support from the display device panel 10 with the support, and the knife 300 are rotated by a predetermined angle (less than 180 degrees) around the leading end portion, That is, the insertion angle adjustment unit which has the rotating mechanism 50 which can rotate and move the rear end part of a knife 300 in a normal direction, and the stopper 51 as an insertion angle setting mechanism which sets the upper and lower limits of the insertion angle of the knife 300. (59) and the normal direction moving mechanism 44 which can move the whole knife 300 to the said normal direction.

Here, the knife 300 in the peeling apparatus 11 has the property different from the knife 30 in the peeling apparatus 1 mentioned above, and is not deformed. That is, the knife 300 is deformed by the action from the resin layer and / or the thin glass substrate so as to move along the surface of the resin layer when inserted between the resin layer and the thin glass substrate like the knife 30. It does not have the property to become.

In addition, the base member 2 and the stage 20 in the peeling apparatus 11 which is a suitable Example are fixed to the floor of the room which installed the peeling apparatus 11, and do not move. In addition, the fixing surface in the stage 20 is a horizontal surface (that is, parallel with the floor of a room). Moreover, the 1st fixed side member 42b of the base member 2 and the fixed surface direction movement unit 42 is being fixed, and similarly to the 1st moving side member 42a of the fixed surface direction movement unit 42 2nd movement of the 1st moving member main body 3 of the fixed surface direction, the 1st moving member main body 3, and the 2nd fixed side member 40b of the normal moving unit 40, and the normal moving unit 40 The third fixed side member 44b of the side member 40a and the normal direction moving mechanism 44, the third moving side member 44a of the normal direction moving mechanism 44 and the second moving member main body 5 in the normal direction ), The second moving member main body 5, the three-component force sensor 46, and the third moving member main body 4 in the normal direction are fixed. In addition, the knife 30 is supported so that rotation (rotational movement) is possible with respect to the 3rd moving member main body 4. As shown in FIG.

In addition, although not shown in FIG. 2, as demonstrated later using FIG. 3, the peeling apparatus 11 is the adsorption pad 60, the camera 70, and a nozzle similarly to the peeling apparatus 1. As shown in FIG. 73 and an antistatic device 75 are provided.

<Stage>

The peeling apparatus 1 and the peeling apparatus 11 (henceforth "the peeling apparatus 1, 11") are equipped with the stage 20. As shown in FIG. The stage 20 in the peeling apparatuses 1 and 11 is demonstrated using FIG.

FIG. 3 is a schematic sectional view showing that the display device panel 10 with the support is fixed on the fixing surface 20a of the stage 20 in the peeling apparatuses 1, 11. In the display device panel 10 with a support, both main surfaces of the display device member 14 are formed of the thin glass substrates 12a and 12b, the resin layers 18a and 18b, and the support glass substrates 19a and 19b. ) Sandwiched between laminates.

Here, what sandwiched both main surfaces of the display apparatus member 14 between the thin glass substrates 12a and 12b is called narrow display panel 16, and resin layers 18a and 18b and the support glass substrate ( Each laminated body of 19a and 19b is called support bodies 17a and 17b. In addition, the support body 17b to be peeled off consists of the support glass substrate 19b and the resin layer 18b. Therefore, broadly, the narrow panel 16 for display apparatuses and the support body 17a may be integrally called a panel for display apparatuses.

The peeling apparatuses 1 and 11 are for the display apparatus with the stage 20 which has the porous vacuum adsorption plate 22 which has a planar fixed surface, and the support body fixed on the fixed surface of the stage 20 was attached. Inserted into the interface between the resin layer 18b and the thin glass substrate 12b in the support body 17b to be peeled off as the end surface 10x of the panel 10 and the display device panel 10 with a support body. A knife 30 or a knife 300 is provided.

Moreover, the suction pad 60 which adsorb | sucks to the 2nd main surface of the support glass substrate 19b in the display apparatus panel 10 with a support body, and the knife 30 or the knife in the end surface 10x. A nozzle for injecting an antistatic agent to the interface between the camera 70 having an image processing apparatus used to insert the 300 and the resin layer 18b and the thin glass substrate 12b in the support to be peeled off ( 73 and a charge suppression device 75 for inhibiting charging of the display device panel 10 with a support by connecting the panel 10 for a display device with a support to the ground with a conductor.

In addition, the porous vacuum adsorption plate 22 is connected with the pump 24, and it vacuums using the pump 24, and the fixed surface of the porous vacuum adsorption plate 22 (stage 20 shown in FIG. 3). In the upper surface), the second main surface of the support glass substrate 19a in the display device panel 10 with the support is vacuum-absorbed to fix the display device panel 10 with the support. . In the peeling apparatus of this invention, the fixing surface of a stage means the plane which can adhere to the main surface of the display apparatus panel 10 with a support body, and can fix this.

In the present invention, the stage is not particularly limited as long as it can hold and fix the display panel with the support on its fixed surface. However, as shown in FIG. 3, the stage is adsorbed and fixed by vacuum adsorption. It is preferable. This is because the surface of the panel for a display device with the support is less likely to be scratched and detachable in a short time.

In addition, the stage can display a panel for a display device with a support on its fixed surface to hold the panel for a display device with a support, and a display with a support for fixing the area (area) on the fixed surface. It is preferable that it is about the same as the main surface area of the thin glass substrate in an apparatus panel.

In addition, in the present invention, as shown in Figs. 1 to 3, the fixed surface of the stage is set as a horizontal surface. However, the surface is not limited to the horizontal surface, but may be a curved surface. 15 is a schematic cross-sectional view for explaining a peeling method when a part of the fixing surface of the stage 20 is a curved surface. First, the display device panel 10 with the support is fixed to the stage 20 in which part of the fixing surface 20a is curved, and the resin layer 18b of the support 17b (see FIG. 3). And the knife 30 in the initial stage (FIG. 15A) in which the knife 30 was inserted between the thin glass substrate 12b (refer FIG. 3) of the panel 16 for display apparatuses, the resin layer 18b. 1), it moves along the surface of (), and gives the opportunity of peeling of the support body 17b and the display panel 16 (FIG. 15 (b)). After that (FIG. 15C), the support pad 17b is adsorbed using the suction pad 82, and the support 17b and the display panel 16 are peeled off. Since the fixed surface 20a of the stage 20 is a curved surface, compared with the stage 20 whose fixed surface is a horizontal surface, the deformation | transformation of the support body 17b can be suppressed small, and at the time of peeling, the support body 17b is There is no fear of destruction.

Moreover, you may peel off the whole surface, making the stage 20 into a flexible member, carrying out bending deformation sequentially. 16 is a schematic cross-sectional view for explaining a peeling method in the case where the stage 20 is a flexible member. First, the panel 10 for a display device with a support body is fixed to the flexible stage 20 with a fixed surface horizontal, and the resin layer 18b (see FIG. 3) of the support 17b and the panel for display devices. In an initial step (FIG. 16A) in which the knife 30 is inserted between the thin glass substrates 12b (see FIG. 3) of the 16, the knife 30 is along the surface of the resin layer 18b. So as to give a trigger for peeling of the support 17b and the display panel 16 (FIG. 16B). After that (FIG. 6C), the support pad 17b is adsorbed using the adsorption pad 82, and the stage 20 is adsorbed by another adsorption pad 82 provided below the stage 20. The support body 17b and the display panel 16 are peeled off while sequentially bending and deforming the support body 17b and the stage 20. Since the stage 20 is a flexible member and is peeled while being deformed in a sequential manner, the deformation of the support body 17b can be suppressed to be small compared to the stage which is not deformed while the fixed surface is a horizontal plane, and at the time of peeling the support ( 17b) does not have to be destroyed.

In addition, the angle shown by (theta) in FIG. 3 has shown the insertion angle of a knife. That is, the insertion angle θ is the upper surface of the knife (if the knife is a two-stage blade as shown in Fig. 4 to be described later, the upper surface of the middle and rear ends of the knife) and the resin layer of the support 17b to be peeled off. This is the angle formed by the surface of 18b.

<Knife>

The knife 30 and the knife 300 are used in order to peel the support body 17b from the display apparatus panel 10 with a support body, and are comprised from the support glass substrate 19b and the resin layer 18b. It inserts in the interface of 17b and the thin glass substrate 12b, and peels.

The shape of the knife 30 in the peeling apparatus 1 is demonstrated using FIG. In addition, although only the knife 30 is demonstrated here, the shape of the knife 300 in the peeling apparatus 11 should just be the same as the knife 30 in the peeling apparatus 1.

FIG. 4A is a schematic top view of the knife 30, and FIG. 4B is a schematic cross-sectional view.

Although the size, shape, etc. of the knife used by this invention are not specifically limited, The knife 30 which is a suitable embodiment is a size and shape as shown in FIG. In other words, as shown in Fig. 4A, the knife 30 is rectangular in shape when viewed from the top, and has a width of 10 mm and a length of 100 mm. In addition, as shown in FIG.4 (b), thickness is 0.1 mm and it becomes a two-stage blade. The tip portion 30a shown in FIG. 4B constituting the two-stage blade is pointed to form an angle of 25 degrees when viewed from the end surface, and the stop portion 30b forms an angle of 15 degrees. 30c) is flat.

As described above, the size of the knife 30 is 10 mm in width and 100 mm in length, but the size of the knife used in the present invention is preferably 5 to 50 mm in width and 30 to 200 mm in length. Moreover, it is preferable that thickness is 0.05-1.0 mm.

Moreover, it is preferable to become a two-stage blade like the knife 30. This is because the tip of the knife can be prevented from damaging the surface of the thin glass substrate or the resin layer.

In addition, the angle formed by the tip portion 30a in the knife 30 as described above is about 25 degrees, but when the knife used in the present invention is a two-stage blade, the angle formed by the tip portion is preferably 20 to 30 degrees. . In addition, it is preferable that the angle formed by the interruption portion is also 10 to 20 degrees. In addition, although the curvature of a tip is not specifically limited, It is preferable that a radius of curvature is 0.001 mm or more. In addition, although the knife used for this invention is a both blade as shown in FIG. 4, one blade may be sufficient.

Next, the material, deformation | transformation capability, etc. of a knife are demonstrated.

The material of the knife 30 and the knife 300 is not specifically limited. For example, metals, such as stainless steel, ceramics, a plastic, and hard rubber are mentioned.

In addition, it is inserted between the resin layer and the thin glass substrate, deforms when any action (force) is received from the resin layer and / or the thin glass substrate, and reversibly deforms when the action is released. It is preferred that the material is returned to. For example, an elastic body such as rubber can be preferably exemplified. However, since the metal or the like also acts as the elastic body within a range in which the action (force) applied to the knife is not large, it can be preferably used.

In addition, the Young's modulus is preferably made of a material of about 1,000 to 400,000 N / mm 2, preferably about 200,000 N / mm 2. Stainless steel has a Young's modulus of 206,000 N / mm 2 and is preferably a material that can be used.

In addition, the knife 30 of the peeling apparatus 1 is equipped with specific bending rigidity [N * mm <2>].

Specifically, when the shape of the knife 30 is, for example, as shown in FIG. 4 described above, bending rigidity (hereinafter referred to as "bending rigidity A") with respect to the load (load in the thickness direction) applied to the upper surface thereof. ) Is 5,000 N · mm 2 or less and preferably 200 N · mm 2 or less.

In addition, when the shape of the knife 30 is shown, for example in FIG. 4 mentioned above, bending rigidity with respect to the load of the width direction (bending rigidity when a load is applied to the side (surface) of a longitudinal direction) ( Hereinafter, "bending rigidity B") is 200,000 N · mm 2 or more, and preferably 1,000,000 N · mm 2 or more.

Moreover, it is more preferable that bending rigidity A is 5,000 N * mm <2> or less, and bending rigidity B is 200,000 N * mm <2> or more.

In addition, the bending stiffness (bending stiffness A and bending stiffness B) referred to here is the Young's modulus [N / mm 2] determined by the material of the knife, and the cross-sectional secondary moment [mm ⁴ ] determined by the position of the cross-sectional shape and the neutral axis. Is obtained as the product of.

Thus, since the knife 30 of the peeling apparatus 1 is equipped with the bending rigidity A and B of a specific range as mentioned above, when it is inserted between a resin layer and a thin glass substrate, it moves so that it may move along the surface of a resin layer. And deformation by the action from the resin layer and / or the thin glass substrate. As will be described later, the knife 300 of the peeling device 11 does not have to be provided with the same bending rigidity that the knife 30 includes, but may be provided.

Next, the support part which supports the knife 30 of the peeling apparatus 1 is demonstrated.

It is preferable that the knife 30 is supported by the support part 61 which has a structure as shown in FIG. FIG. 5A is a schematic perspective view of the knife 30 in the peeling apparatus 1 and the supporting portion 61 supporting the same. 5B and 5C are schematic top views illustrating the movement of one arm 611 in FIG. 5A. In FIG.5 (b), (c), the knife 30 is abbreviate | omitted and is not shown in figure.

The support part 61 in FIG. 5 has two plate-shaped arms 611, and these and the knife 30 are connected. The arm 611 can be deformed so as not to interfere with the deformation of the knife 30 itself when a certain force is applied to the knife 30.

For example, as shown in Fig. 5B, the two arms 611 can be deformed to be close to each other. For example, as shown in (c) of FIG. 5, when viewed from above, it can be deformed so that it may become S shape.

Since the knife 30 is provided with the above-mentioned bending stiffness A and B of a specific range, and is supported by the said support part, when the knife 30 is inserted between a resin layer and a thin glass substrate, the surface of the resin layer In order to move along, it is easy to deform | transform by action from a resin layer and / or a thin glass substrate.

More specifically, for example, as shown in FIG. 6 (the support part 61 is abbreviate | omitted and shown in FIG. 6 (a)-(c)), the knife is inserted between a resin layer and a thin glass substrate. In the initial stage (Fig. 6 (b)), the knife 30 is moved along the surface of the resin layer by deformation in its normal direction, and after that (Fig. 6 (c)), the insertion The combination of the rotational direction and the deformation of the rotational direction in which the knife 30 in the direction and the panel 10 for the display device with the support contact and the portion where the knife 30 and the support are connected are supported. The so-called torsional phenomenon itself can move along the surface of the resin layer.

On the other hand, the knife 300 of the peeling apparatus 11 does not have the bending rigidity which the knife 30 has, and does not have the support structure like the support part 61, either. Therefore, it does not deform | transform by the action from a resin layer or a thin glass substrate. Therefore, the peeling apparatus 11 needs to be equipped with the insertion angle adjustment unit which has a rotation mechanism which the peeling apparatus 1 does not have, and an insertion angle setting mechanism, and a normal direction moving mechanism.

In addition, the peeling apparatus of this invention does not have the thing of having the knife which has the deformability like the knife 30, and is equipped with the insertion angle adjustment unit and the normal direction moving mechanism like the peeling apparatus 11. As shown in FIG. Rather, depending on the deformability (degree of deformation), the knife may move more preferably.

<Normal Moving Unit>

The normal direction movement unit 40 in the peeling apparatus 1 is demonstrated using FIG. 1 (a). The peeling apparatus 11 also has the same normal direction moving unit 40.

In the peeling apparatus 1, the normal direction movement unit 40 has the 2nd moving side member 40a and the 2nd fixed side member 40b. The 2nd moving side member 40a and the 2nd fixed side member 40b are connected through the cross roller guide which is not shown in figure, and are driven with respect to the 2nd fixed side member 40b by driving the servo motor which is not shown in figure. 2 The moving side member 40a can be moved to a normal line direction, and the knife 30 connected to this can be moved to a normal line direction.

As described above, the normal direction means a direction parallel to the normal line on the fixed surface 20a (see FIG. 3) of the stage 20. Since the fixed surface 20a of the stage 20 in the peeling apparatus 1 is a horizontal surface, in the peeling apparatus 1 (even in the peeling apparatus 11), it is an up-down direction (vertical direction) from the normal direction Becomes

The resin layer 18b and the thin glass in the support body 17b which are peeled off as an end surface of the panel 10 for display devices with a support body fixed on the fixed surface 20a of the stage 20 in this way are attached. The position can be adjusted so that the knife 30 can be inserted in the interface of the board | substrate 12b (refer FIG. 3).

In the present invention, the normal moving unit is not particularly limited as long as it is a unit capable of moving the knife to a desired position in the normal direction.

<Insertion angle adjustment unit>

The peeling apparatus 11 is equipped with the insertion angle adjustment unit 59 which has the rotation (or rotational movement) mechanism 50 and the stopper 51 as an upper and lower setting mechanism. The peeling apparatus 1 does not have an insertion angle adjustment unit.

The rotating mechanism 50 in the peeling apparatus 11 is demonstrated using FIG. 2 (a) and FIG.

In the peeling apparatus 11, as for the rotation mechanism 50, the rotating shaft 54 and the knife 300 are connected through the bracket 52, and the rotating (or rotating motion) shaft 54 rotates by predetermined angle (or The knife 300 is also a mechanism which can rotate (or rotate) a predetermined angle by rotating.

FIG. 7 is a schematic cross-sectional view for explaining such a rotating mechanism 50. The cross section cut horizontally at the center of the rotating shaft 54 is viewed from above.

In FIG. 7, since the three sides of the rectangular knife 300 are fixedly fixed to the bracket 52, and the bracket 52 is fixed to the rotation shaft 54, the rotary shaft 54 rotates so that the knife ( 300 also rotates the same. The rotating shaft 54 is supported by the bracket 58 via the sliding bush 56 made of resin. The bracket 58 is being fixed to the 3rd moving member main body 4 shown to Fig.2 (a). As shown in FIGS. 2A and 7, the tip of the knife 300 and the center of the rotation shaft 54 substantially coincide with each other. Thus, the knife 300 can rotate about its tip.

In addition, as shown to Fig.2 (a), the peeling apparatus 11 has the stopper 51. As shown in FIG. The stopper 51 is connected to the third moving member main body 4 and can be fixed at a desired position by moving in the normal direction (up and down direction) relative to the third moving member main body 4. Therefore, when fixed, the stopper 51 moves in accordance with the movement of the third moving member main body 4 in the normal direction.

By this stopper 51, the upper limit or the lower limit of the insertion angle θ of the knife 300 can be adjusted. By determining the position of the stopper 51 so as to support the lower surface of the bracket 52, the upper limit can be set because the knife 300 does not rotate in the direction in which the insertion angle θ becomes larger. In this case, it can rotate in the reverse direction (the direction in which [theta] becomes small).

The insertion angle θ is not particularly limited, but is preferably 2 to 5 degrees.

<Moving surface direction moving unit>

The fixed surface direction movement unit 42 in the peeling apparatus 1 is demonstrated using FIG. 1 (a).

The peeling apparatus 11 also has the same fixed surface direction moving unit.

In the peeling apparatus 1, the fixed surface direction movement unit 42 has the 1st moving side member 42a and the 1st fixed side member 42b. The first moving side member 42a and the first fixed side member 42b are connected via a cross roller guide (not shown), and are driven with respect to the first fixed side member 42b by driving a servo motor (not shown). 1 The moving side member 42a is moved to the fixed surface direction (left-right direction in FIG. 1A) which is a direction parallel to the fixed surface in the stage 20, and is connected to this knife 30 Can be moved in the fixed plane direction. And the knife 30 can be moved between a resin layer and a thin glass substrate.

In the present invention, the fixed surface direction moving unit is not particularly limited as long as it is a unit capable of moving the knife to a desired position in the fixed surface direction.

<Normal travel mechanism>

The normal direction moving mechanism 44 in the peeling apparatus 11 is demonstrated using FIG. 2 (a).

In the peeling apparatus 11, the normal direction movement mechanism 44 has the 3rd moving side member 44a, the 3rd fixed side member 44b, and the stopper 44c. The 3rd moving side member 44a and the 3rd fixed side member 44b are connected through the cross roller guide which is not shown in figure, and the 3rd moving side member 44a is normal with respect to the 3rd fixed side member 44b. It can move freely in the direction (upward direction).

In addition, the stopper 44c is connected to the second moving side member 40a of the normal moving unit 40, and moved to the normal moving direction (up and down direction) relative to the second moving side member 40a. Can be fixed in position. Therefore, when it fixes, the stopper 44c will move following the movement of the normal line direction (up-down direction) of the 2nd moving side member 40a.

By this stopper 44c, the lowest position of the normal direction (up-down direction) of the knife 30 can be determined. By determining the position of the stopper 44c so as to support the lower surface of the second moving member main body 5, the knife 30 does not move below it. It can move upwards.

In the present invention, the normal direction moving mechanism is not particularly limited as long as the entire knife can move upward.

<Load Weight Detection Unit>

The load weight detection unit in the peeling apparatus 1 is demonstrated using FIG. 1 (a). The peeling apparatus 11 also has the same load weight detection unit.

The peeling apparatus 1 is equipped with the three component force sensor 46 as the load weight detection unit to the knife 30 between the 3rd moving member main body 4 and the 2nd moving member main body 5.

It is preferable that the peeling apparatus of this invention is equipped with the load weight detection unit to such a knife. Moreover, it is preferable to provide in the vicinity of a knife as much as possible. When the peeling apparatus of this invention is equipped with the load weight detection apparatus to a knife, since it can peel, without applying an excessive force when peeling a support body using a knife, it is preferable.

<Adsorption pad>

The peeling apparatuses 1 and 11 are equipped with the some adsorption pad 60 which adsorb | sucks on the 2nd main surface of the support glass substrate 19b in the display apparatus panel 10 with a support body.

In this invention, it is preferable to comprise such an adsorption pad and to peel a support body from the display apparatus panel 10 with a support body using this adsorption pad.

The adsorption pad with which the peeling apparatus 1, 11 is equipped is demonstrated using drawing.

8 is a schematic perspective view showing a part of the peeling apparatus 1, 11. 8, the peeling apparatuses 1 and 11 hold | maintain the display apparatus panel 10 with a support body substantially horizontally on the fixed surface of the stage 20, and the display apparatus panel with a support body ( Many adsorption pads 82 adsorb | suck the 2nd main surface of the support glass substrate 19b (refer FIG. 3) of the support body 17b which peels in 10).

As shown in FIG. 8, a plurality of suction pads 82 are disposed above the stage 20 to which the panel 10 for display device with a support is fixed. In the peeling apparatuses 1 and 11, although these adsorption pads 82 are arrange | positioned at the frame 84 in the shape of a checkerboard graduation, in this invention, arrangement | positioning may not necessarily be equal pitch. The frame 84 is moved downward along the guide 86 when the support is peeled off, and the upper surface of the panel 10 for display device (the second main surface of the supporting glass substrate) to which the adsorption pad 82 is attached. Its lowering movement is stopped by the elevating device (not shown) at the timing just before contacting.

As for the size of the adsorption pad 82, if the size is small, the holding force on the display device panel 10 with the support is insufficient, so that the number of the adsorption pads 82 becomes large and becomes uneconomical. If the size of the adsorption pad 82 is too large, the deformation of the display device panel 10 with the support attached to the adsorption center portion becomes large due to vacuumization, so that in some cases, the display device panel with the support attached ( It may cause damage of 10). For this reason, the appropriate size (for example, φ25 to 80mm, preferably φ25 to 65mm, more preferably about φ40mm) and the number of the suction pads 82 are for the display device panel with a support. (10) is selected according to the size and thickness.

The suction pad 82 is connected to the piston 89 of the independent air cylinder 88, respectively, and the suction pad 82 is moved up and down by the expansion and contraction operation of the piston 89. By the lowering operation of the adsorption pad 82, the adsorption pad 82 is brought into pressure contact with the display device panel 10 with the support, and the support pad is attached to the adsorption pad 82. The support 17b (the support glass substrate 19b and the resin layer 18b) in the display apparatus panel 10 with the upper surface adsorb | sucked and the support body adhered by the raising operation of the adsorption pad 82 is a display apparatus. It peels from the panel 16 for cooling (refer FIG. 3).

The upward movement of the suction pad 82 does not simultaneously raise the suction pad 82 across the entire display panel 10 with the support, but rather at the end of the panel 10 for the display device with the support. It is preferable to control so that a raise operation may be performed in order according to the progress of peeling of a support body toward the center. In addition, it is preferable to adjust the climbing distance of an adsorption pad by the bending stress and magnitude | size which are accepted for a support body.

In addition, it is preferable to use the swivel structure or the like at the connection portion between the suction pad 82 and the piston 89 to support the suction pad 82 so as to be tiltable. This is because the part of the supporting glass substrate 19b (refer to FIG. 3) adsorbed on the adsorption face of the adsorption pad 82 can also be peeled off gradually from one end to stabilize the peeling.

Moreover, although it is possible to peel a support body by raising a suction pad in a normal direction, you may raise a suction pad in the direction which has an angle with respect to a normal direction. For example, as described in detail below, in the case of the upward movement in order in accordance with the progress of peeling of the support from the end of the panel 10 for a display device with a support to the center, the suction pad is moved in the center direction. When it raises so that it may incline to, since a support body can peel easily, it is preferable.

FIG. 9 is a top view showing a position where the adsorption pad 82 shown in FIG. 8 adsorbs as an upper surface (second main surface of the support glass substrate 19b) of the panel 10 for a display device with a support. 10 is a block diagram showing a control system of the suction pad 82. In FIG. 9, a knife is inserted into the lower right corner, and the suction pads closest to the corners in the plurality of suction pads 82 (42 in FIGS. 8 and 9) are pads 82a. The two suction pads of the neighbor (top left) are pad 82b, and the three suction pads 82 of the neighborhood (top left) are pad 82c to the pads 82d to 82l. Add a sign.

Electromagnetic valves 87a to 87l for each of the air cylinders 88a to 88l of the pads 82a to 82l as shown in FIG. 10 so that these pads 82a to 82l operate independently of each other (pads having the same reference numerals operate the same). Is installed, and the opening / closing timing of these electromagnetic valves 87a to 87l is time-controlled by the control unit (pad moving unit) 90. That is, by inserting the knife 30 or the knife 300, it is controlled so that the pads 82a-82l may be moved up and down at predetermined time intervals in order from the site | part (corner part) which removed the suction force. That is, it has a time control function. Thereby, damage to a support body by forcibly raising the site | part to which adsorption force remain | survives can be prevented. Then, the film can be lifted in order in accordance with the progress of the peeling of the support from the end of the panel 10 for display device with the support to the center thereof, thereby peeling.

In addition, the air cylinders 88a to 88l of the pads 82a to 82l are connected to the air pump 83 through the electromagnetic valves 87a to 87l and the electrostatic regulators 85a to 85l. The regulators 85a to 85l are respectively controlled by the control unit 90. That is, the rising force of the suction pad 82 can be gradually raised by controlling the electric regulators 85a to 85l by the control unit 90 and gradually increasing the amount of air supplied to the air cylinders 88a to 88l. . By carrying out such force control, the problem of damage to the glass substrate 10 with the support caused by raising the force that is excessively raised from the beginning can be avoided, and the required time required for peeling can be shortened to the minimum. have.

On the other hand, the suction pad 82 is connected to the vacuum pump 77 via the valve 79 and the electric regulator 78 which are controlled to be opened and closed by the control unit 90. The control of the air pressure of the suction pad 82 is performed by the regulator 78. The rising timing and the rising force of the suction pad 82 can be set by the operator to an arbitrary value by operating a switch (not shown) such as a touch panel provided in the operation panel of the control unit 90.

<Camera>

The peeling apparatuses 1 and 11 are image processing apparatuses in order to determine the site | part which inserts the knife 30 or the knife 300 in the end surface 10x of the display apparatus panel 10 with a support body. It has a camera 70 having a. The camera 70 introduces the position information of the knife 30 or the knife 300 into the image processing apparatus as image data, processes the image data, determines whether or not it is a desired position by the image processing apparatus, and By feeding back the result to the normal moving unit 40, the knife 30 or the knife 300 can be moved to a desired position.

In this invention, it is preferable to provide the camera provided with an image processing apparatus in this way, and to determine the site | part which inserts the knife in the end surface of the panel for display apparatus with a support body by image processing.

The kind of camera and image processing apparatus, etc. are not specifically limited, A conventionally well-known thing can be used.

<Injection device>

The peeling apparatus 1, 11 injects the antistatic material (water, etc.) to the interface of the resin layer 18b in the support body 17b to peel, and the thin glass substrate 12b of the panel 16 for display apparatuses. The nozzle 73 which can be provided is provided (refer FIG. 3).

When peeling using the peeling apparatus of this invention, the panel for display apparatus obtained may be charged. For example, it may show a large voltage of +10 kV. Therefore, when the substance for static elimination is injected at the time of peeling, the above charging can be suppressed.

Examples of the antistatic material include ionized liquids and / or gases such as water and water vapor. Moreover, air and other gas ionized by the pulse power supply etc. are mentioned.

In addition, in the injector, it is also possible to inject something other than an antistatic material (air or the like). In this case, the effect of promoting peeling is exerted. Even when spraying the antistatic agent, the same effect is exhibited. For example, it is preferable to exert an antistatic action and a peeling promoting action by injecting water or a mixed fluid of water and air.

In the present invention, by providing such a jetting device, the support can be peeled from the panel 10 for a display device with the support using the jetting device.

<Charge control device>

The peeling apparatuses 1 and 11 connect the display device panel 10 with a support with the ground by a conductor to suppress the charging of the display device panel 10 with a support, that is, to charge the ground. The suppressing apparatus 75 is provided (refer FIG. 3).

At the peripheral edge of the surface (main surface) of the thin glass substrate in contact with the member for display device, a guard ring made of, for example, a non-driving electrode film to which a driving voltage formed of a transparent electrode film is not applied, is formed. It is desirable to connect the conductors and take the ground.

When peeling using the peeling apparatus of this invention, the panel for display apparatus obtained may be charged. For example, it may show a large voltage of +10 kV. Thus, if the above charge suppression device is provided, the above charge can be suppressed.

In the present invention, when such an antistatic device is provided, the support can be preferably peeled from the display device panel 10 with the support.

In the peeling apparatuses 1 and 11 demonstrated above, although the fixing surface 20a of the stage 20 was a horizontal surface, in the peeling apparatus of this invention, the fixing surface is a horizontal surface, ie, the surface parallel to the floor of a room, etc. No need to. For example, the surface parallel to a perpendicular direction may be sufficient, and the surface which obliquely crosses this may be sufficient. In addition, not only the stage but also the direction in which the peeling apparatus itself of this invention is installed is not fully limited. For example, you may be provided in the arrangement | positioning which left and right and top and bottom in the peeling apparatus 1 and the peeling apparatus 11 shown in FIG. 1 and FIG. 2 were replaced.

<Peeling Method (his 1)>

Next, the peeling method using the peeling apparatus 1 is demonstrated using FIG. 1 (a)-FIG. 1 (d).

First, the main surface of the panel 10 for a display device with a support on which the support is not peeled off later is adhered to the planar fixed surface of the stage 20 in close contact with and fixed ( (A) of FIG. 1). That is, the display device panel 10 with the support body is vacuum-adsorbed onto the stage 20 so that the main surface with the support body to be peeled off is faced up and the main surface opposite thereto is downward.

Next, as shown to (b) of FIG. 1, the position of the normal direction (up-down direction) of the knife 30 is adjusted with the normal direction movement unit 40. Then, as shown to FIG. Specifically, by driving the servo motor, the second moving side member 40a is moved relative to the second fixed side member 40b in the normal direction (up and down direction) of the fixed surface of the stage 20, and the support body is peeled off. The position is adjusted so that the knife 30 can be inserted in the interface of the surface of the resin layer 18b in the surface, and the 1st main surface of the thin glass substrate 12b.

Next, as shown in FIG.1 (c) and FIG.1 (d), the knife 30 is inserted and pressed in by the fixed surface direction movement unit 42. Then, as shown in FIG. In this manner, when the knife 30 is inserted into the interface between the resin layer 18b and the thin glass substrate 12b in the insertion direction in the fixed surface direction and press-fitted, the knife 30 is explained as described with reference to FIGS. 5 and 6. And support 61 deform. Since the peeling apparatus 1 which is the suitable embodiment of the peeling apparatus of this invention can make such a movement to the knife 30, the support body and the said panel for display apparatus can be peeled preferably.

<Peeling Method (his 2)>

Next, the peeling method using the peeling apparatus 11 is demonstrated using FIG.2 (a)-FIG.2 (d).

First, the main surface of the panel 10 for a display device with a support on which the support is not peeled off later is adhered to the planar fixed surface of the stage 20 in close contact with and fixed ( (A) of FIG. 2). That is, the display device panel 10 with the support body is vacuum-adsorbed onto the stage 20 so that the main surface with the support body to be peeled off is faced up and the main surface opposite thereto is downward.

Next, as shown to Fig.2 (a), the insertion angle (theta) of the knife 300 is adjusted. Specifically, by rotating the predetermined angle (rotational movement) about the rotation axis, the insertion angle θ of the knife 300 is adjusted to a desired angle, and the stopper 51 is placed so as to contact the lower surface of the blanket 52. The insertion angle θ can be fixed.

Next, as shown to (b) of FIG. 2, the position of the normal direction (up-down direction) of the knife 300 is adjusted by the normal direction movement unit 40. Then, as shown to FIG. Specifically, by driving the servo motor, the second moving side member 40a is moved in the normal direction with respect to the second fixed side member 40b, and the surface and the thin plate of the resin layer 18b in the support body to be peeled off. The position is adjusted so that the knife 30 may be inserted in the interface of the 1st main surface of the glass substrate 12b.

Next, as shown in FIG.2 (c) and FIG.2 (d), the knife 300 is inserted and pressed in by the fixed surface direction movement unit 42. Then, as shown in FIG. In this way, when the knife 300 is inserted into the interface between the resin layer 18b and the thin glass substrate 12b and press-fitted, the knife 300 is rotated by a predetermined angle (rotational movement) about its tip portion 30a. The rear end portion 30c moves in the upward direction, and the whole of the knife 300 moves in the insertion direction in the upward direction and / or in the fixed surface direction, so that the knife 300 moves along the surface of the resin layer. It is press-fitted ((d) of FIG. 2). Since the peeling apparatus 11 which is the suitable embodiment of the peeling apparatus of this invention can make such a movement to the knife 300, a support body and the said panel for display apparatus can be peeled suitably.

In addition, in the peeling apparatus 1, 11, when peeling two support bodies 17a and 17b in the display apparatus panel 10 with a support body as shown, for example in FIG. First, for example, one support body 17b is peeled off and inverted, and then it is fixed again on the fixed surface of the same stage or on the fixed surface of the stage of the peeling apparatus of another this invention, and the other support body 17a By peeling off, the panel for display apparatuses can be obtained.

Next, the preferable peeling method using the peeling apparatuses 1 and 11 provided with a suction pad is demonstrated using FIGS. 8-10.

After the display device panel 10 with the support is fixed on the fixed surface of the stage 20, the frame 84 is moved downward, and the adsorption pad 82 is attached to the display device panel 10 with the support. Its descent movement is stopped at the timing just before contacting the surface of the &quot; Next, the piston 89 of the air cylinder 88 is extended, and the suction pad 82 is moved downward to make pressure contact with the surface of the panel 10 for a display device with a support. The air pressure of the suction pad 82 is controlled by the electrostatic regulator 78, and the air pressure of the suction pad 82 is increased to the set pressure by taking a certain amount of time. As a result, all of the adsorption pads 82 are adsorbed to the display panel 10 with the support.

Next, as shown in FIG. 9, the knife 30 (or knife 300) in the corner part of the display apparatus panel 10 with a support body attached by the knife 30 (or knife 300). Insert Here, it is preferable to insert the knife 30 (or knife 300) to just under the suction pad 82a shown in FIG. It is because peeling by a suction pad can be performed more easily preferably. Subsequently, the control unit 90 controls the electromagnetic valve 87a shown in FIG. 10 and adsorbs and holds the corner portion of the panel 10 for display device with the support shown in FIG. 9. Is moved upward in the peeling direction (the normal direction), and the corner portion of the support body 17b is peeled off from the display device panel.

Next, the control part 90 controls the opening of the electromagnetic valve 87b of FIG. 10, and raises and moves the pad 82b which adsorbs-holds the edge part of the support body 17b shown in FIG. The edge portion of 17b) is spaced apart from the display panel 16 (see FIG. 3).

Subsequently, the control part 87 opens-controls the electromagnetic valve 87c of FIG. 10, moves up the pad 82c shown in FIG. 9 in a peeling direction, and is located inward of the edge part of the support body 17b. The part is peeled off from the display panel 16.

Thereafter, the support can be completely peeled off from the display device panel.

<Panel for Display Device with Supporting Body>

Next, the panel for display apparatuses with a support body used in this invention, a support body, and a panel for display apparatuses having a thin glass substrate are demonstrated.

The display apparatus panel with a support body used in the manufacturing method of this invention has a 1st main surface on the 1st main surface of the thin glass substrate which has a 1st main surface and a 2nd main surface, and has a member for a display apparatus on a 2nd main surface. And a resin layer having easy peelability fixed to the first main surface of the supporting glass substrate having the second main surface.

In embodiment of this invention, although the electronic device was made into the panel for display apparatuses, this invention is not limited to this. As another electronic device, electronic components, such as a solar cell, a thin film secondary battery, and the semiconductor wafer in which the circuit was formed in the surface, are mentioned. The display panel includes a liquid crystal panel, an organic EL panel, a plasma display panel, a field emission panel, and the like. In particular, it is suitable for manufacture of the panel for thin display devices. In the manufacturing process, it is an advantage that the sheet type manufacturing apparatus can be used as it is.

In the panel for a display device with a support body, the thin glass substrate is not particularly limited in thickness, shape, size, physical properties (heat shrinkage rate, surface shape, chemical resistance, etc.), composition, and the like. What is necessary is just to be the same as the glass substrate for display apparatuses, such as OLED.

It is preferable that the thickness of a thin glass substrate is less than 0.7 mm, It is more preferable that it is 0.5 mm or less, It is more preferable that it is 0.4 mm or less. Moreover, it is preferable that it is 0.05 mm or more, It is more preferable that it is 0.07 mm or more, It is more preferable that it is 0.1 mm or more.

Although the shape of thin glass is not limited, It is preferable that it is rectangular.

Although the size of thin glass is not limited, For example, when it is rectangular, what is necessary is just 100-2000 mm x 100-2000 mm, and it is more preferable that it is 500-1000 mm x 500-1000 mm.

Even in such a thickness and size, in the peeling process in the manufacturing method of this invention, a support glass substrate can be easily peeled and separated from a thin glass substrate.

The properties such as heat shrinkage rate, surface shape, chemical resistance and the like of the thin glass substrate are not particularly limited, and vary depending on the type of display device to be manufactured.

It is preferable that thermal contraction rate is small. Specifically, the coefficient of linear expansion, which is an index of thermal shrinkage, is preferably 500 × 10 ⁻⁷ / ° C. or less, more preferably 300 × 10 ⁻⁷ / ° C. or less, still more preferably 200 × 10 ⁻⁷ / ° C. or less, 100 × 10 ^-7 / ℃, and more preferably less than or equal to, 45 × 10 ^-7 / ℃ and more preferably not more than.

In addition, in this invention, a linear expansion coefficient means what was prescribed | regulated to JIS R3102 (1995).

In embodiment of this invention, although the board | substrate was made into the thin glass substrate, this invention is not limited to this. From a viewpoint of industrial availability, a glass plate, a silicon wafer, a metal plate, a plastic plate, etc. are shown as a suitable example.

When employ | adopting a thin glass plate (thin glass substrate) as a board | substrate, the composition of a thin glass substrate should just be the same as alkali glass and an alkali free glass, for example. Especially, since thermal contraction rate is small, it is preferable that it is an alkali free glass.

When employ | adopting a plastic board as a board | substrate, the kind in particular is not restrict | limited, For example, in the case of a transparent board | substrate, a polyethylene terephthalate resin, a polycarbonate resin, a polyether sulfone resin, a polyethylene naphthalate resin, a polyacrylic resin , Polysilicon resin, transparent fluororesin and the like. In the case of an opaque board | substrate, a polyimide resin, a fluororesin, a polyamide resin, a poly aramid resin, a polyether ketone resin, a polyether ether ketone resin, various liquid crystal polymer resins, etc. are illustrated.

When employ | adopting a metal plate as a board | substrate, the kind in particular is not restrict | limited, For example, a stainless steel plate, a copper plate, etc. are illustrated.

Although the heat resistance of a board | substrate is not specifically limited, When forming TFT array etc. of a member for display devices, it is preferable that heat resistance is high. Specifically, it is preferable that the said 5% heating weight temperature is 300 degreeC or more. Moreover, it is more preferable that it is 350 degreeC or more.

In this case, any of the above-mentioned glass plates is suitable in terms of heat resistance.

As a preferable plastic plate from a heat resistant viewpoint, a polyimide resin, a fluororesin, a polyamide resin, a polyaramid resin, a polyether sulfone resin, a polyether ketone resin, a polyether ether ketone resin, a polyethylene naphthalate resin, various liquid crystal polymer resins, etc. This is illustrated.

The substrate may be a laminate in which different materials, such as a glass plate, a silicon wafer, a metal plate, and a plastic plate, are laminated. For example, the laminated body of a glass plate and a plastic plate, the laminated body laminated | stacked in order of a plastic plate, glass, a plastic plate, two or more glass plates, or the laminated body of two or more plastic plates may be sufficient.

The display apparatus panel with a support body has a display apparatus member on the 2nd main surface of the said thin glass substrate.

The display device member is a light emitting layer, a protective layer, a TFT array (hereinafter referred to as an array) that a glass substrate for a display device such as a conventional LCD or OLED has on its surface, a color filter, a liquid crystal, a transparent electrode made of ITO, or the like. , Various circuit patterns and the like. The kind of member for display apparatuses on the 2nd main surface of the said thin glass substrate is not specifically limited.

The display device panel has such a display device member and the thin glass substrate.

The display apparatus panel with a support body adhere | attaches the support glass substrate with a resin layer fixed to the 1st main surface of the said thin glass substrate as a support body. The support glass substrate is in close contact with the thin glass substrate via the resin layer to reinforce the strength of the thin glass substrate.

In embodiment of this invention, although the support substrate was made into the support glass substrate, this invention is not limited to this. From a viewpoint of industrial availability, a glass plate, a silicon wafer, a metal plate, a plastic plate, etc. are shown as a suitable example.

When employ | adopting a glass plate as a support substrate, the thickness, shape, size, physical properties (heat shrinkage rate, surface shape, chemical resistance, etc.), composition, etc. of a support glass substrate are not specifically limited.

Although the thickness of a support glass substrate is not specifically limited, It is necessary for it to be the thickness which the panel for display apparatus with a support body can process in a current manufacturing line.

For example, it is preferable that it is 0.1-1.1 mm in thickness, It is more preferable that it is 0.3-0.8 mm, It is more preferable that it is 0.4-0.7 mm.

For example, the current production line is designed to process a substrate having a thickness of 0.5 mm, and when the thickness of the thin glass substrate is 0.1 mm, the thickness of the supporting glass substrate and the thickness of the resin layer are 0.4 mm. The current production line is most commonly designed to treat a glass substrate having a thickness of 0.7 mm, but, for example, if the thickness of the thin glass substrate is 0.4 mm, the thickness of the resin layer is 0.3 mm.

It is preferable that the thickness of a support glass substrate is thicker than the said thin glass substrate.

Although the shape of a support glass substrate is not limited, It is preferable that it is rectangular.

Although the size of a support glass substrate is not limited, It is preferable that it is the same grade as the said thin glass substrate, and it is preferable that it is slightly larger than the said thin glass substrate. For example, it is preferable that each of a longitudinal direction or a horizontal direction is large about 0.05-10 mm specifically. This is because separation of the supporting glass substrate from the thin glass substrate can be performed more easily.

The linear expansion coefficient of a support glass substrate may be substantially the same as that of the said thin glass substrate, and may differ. If it is substantially the same, it is preferable at the point that curvature hardly arises in a thin glass substrate or a support glass substrate, when it provides to the manufacturing method of this invention.

Is thin glass substrate and the supporting glass substrate and the coefficient of linear expansion of the tea preferably not more than 300 × 10 ^-7 / ℃, more preferably not more than 100 × 10 ^-7 / ℃, not more than 50 × 10 ^-7 / ℃ is more preferred.

The composition of a support glass substrate should just be the same as an alkali glass and an alkali free glass, for example. Especially, since thermal contraction rate is small, it is preferable that it is an alkali free glass.

When employ | adopting a plastic plate as a support substrate, the kind in particular is not restrict | limited, For example, a polyethylene terephthalate resin, a polycarbonate resin, a polyimide resin, a fluororesin, a polyamide resin, a polyaramid resin, a polyether Sulfone resins, polyether ketone resins, polyether ether ketone resins, polyethylene naphthalate resins, polyacrylic resins, various liquid crystal polymer resins, polysilicon resins and the like.

When employ | adopting a metal plate as a support substrate, the kind in particular is not restrict | limited, For example, a stainless steel plate, a copper plate, etc. are illustrated.

Although the heat resistance of a support substrate is not specifically limited, When forming TFT array etc. of a member for display apparatuses, it is preferable that heat resistance is high. Specifically, it is preferable that the said 5% heating weight temperature is 300 degreeC or more. Moreover, it is more preferable that it is 350 degreeC or more.

In this case, any of the above-mentioned glass plates is suitable in terms of heat resistance.

As a preferable plastic material from a heat resistant viewpoint, a polyimide resin, a fluororesin, a polyamide resin, a polyaramid resin, a polyether sulfone resin, a polyether ketone resin, a polyether ether ketone resin, a polyethylene naphthalate resin, various liquid crystal polymer resins, etc. This is illustrated.

Although the resin layer fixed to the 1st main surface of such a support glass substrate adheres and adheres to the 1st main surface of the said thin glass substrate, it can peel easily. That is, a resin layer has easy peelability with respect to the said thin glass substrate.

In the panel for a display device with a support body used in the present invention, it is considered that the resin layer and the thin glass substrate are not attached depending on the adhesive force of the adhesive, and are due to van der Waals forces in solid molecules. That is, it is considered that it adheres by adhesive force.

The thickness of the resin layer is not particularly limited. It is preferable that it is 1-100 micrometers, It is more preferable that it is 5-30 micrometers, It is more preferable that it is 7-20 micrometers. It is because the adhesiveness of a thin glass substrate and a resin layer becomes enough that the thickness of a resin layer is such a range.

Moreover, even if foam | bubble and a foreign material exist, it is because generation | occurrence | production of the distortion defect of a thin glass substrate can be suppressed. In addition, when the thickness of the resin layer is too thick, it is not economical because it requires time and materials to form.

In addition, the resin layer may consist of two or more layers. In that case, "thickness of the resin layer" shall mean the thickness of the sum total of all layers.

In addition, when a resin layer consists of two or more layers, the kind of resin which forms each layer may differ.

It is preferable that the surface tension of the surface of the resin layer with respect to the 1st main surface of the said thin glass substrate is 30 mN / m or less, It is more preferable that it is 25 mN / m or less, It is more preferable that it is 22 mN / m or less. If it is such a surface tension, it can peel more easily with a thin glass substrate, and also the adhesiveness with a thin glass substrate becomes sufficient at the same time.

Moreover, it is preferable that a resin layer consists of a material with a glass transition point lower than room temperature (about 25 degreeC), or a material which does not have a glass transition point. It is because it becomes a non-adhesive resin layer, has peelability more, can peel with a thin glass substrate more easily, and at the same time, adhesiveness with a thin glass substrate becomes sufficient.

Moreover, it is preferable that a resin layer has heat resistance. In this invention, when forming the member for display apparatuses on the 2nd main surface of the said thin glass substrate, for example, the glass laminated body of a thin glass substrate, a resin layer, and a support glass substrate may be provided to heat processing. to be.

Moreover, when the elasticity modulus of a resin layer is too high, since adhesiveness with a thin glass substrate becomes low, it is unpreferable. In addition, when the elasticity modulus is too low, since peelability becomes low, it is unpreferable.

The kind of resin which forms a resin layer is not specifically limited. For example, an acrylic resin, a polyolefin resin, a polyurethane resin, and a silicone resin is mentioned. Several kinds of resins can also be mixed and used. In the group of the said resin, silicone resin is preferable. It is because silicone resin is excellent in heat resistance and the grade of peelability with respect to a thin glass substrate is preferable. Moreover, it is because it is easy to fix to a support glass substrate by condensation reaction with the silanol group of the 1st main surface of a support glass substrate. It is also preferable that a peelability hardly deteriorates even if a silicone resin layer processes about 300 to 400 degreeC for about 1 hour, for example.

Moreover, it is preferable that a resin layer consists of silicone for release papers among silicone resins, and it is preferable that it is hardened | cured material. Silicone for release papers is based on silicone containing linear dimethylpolysiloxane in a molecule | numerator. Since the resin layer formed by hardening | curing the composition containing this subject matter and a crosslinking agent on the surface (first main surface) of the said support glass substrate using a catalyst, a photoinitiator, etc. has excellent peelability, it is preferable. Moreover, since flexibility is high, generation | occurrence | production of the distortion defect of a thin glass substrate can be suppressed even if foreign matters, such as a bubble and dust, mix between a thin glass substrate and a resin layer.

Such release paper silicone is classified into condensation reaction type silicone, addition reaction type silicone, ultraviolet curing type silicone, and electron beam curing type silicone by the curing mechanism thereof, but all can be used. Of these, addition reaction type silicon is preferable. It is because the grade of peelability is favorable, and heat resistance is also high, when the ease of hardening reaction and a resin layer are formed.

In addition, the silicone for release paper has a solvent type, an emulsion type, and a solventless type, and can be used in any form. Of these, no-solvent formulations are preferred. This is because it is excellent in terms of productivity, safety and environmental characteristics. Moreover, since it does not contain the solvent which generate | occur | produces foaming at the time of hardening at the time of forming a resin layer, ie, heating hardening, ultraviolet curing, or electron beam hardening, it is because a bubble is hard to remain in a resin layer.

Moreover, as silicone for release papers, KNS-320A, KS-847 (all are from Shin-Etsu Silicone Co., Ltd.), TPR6700 (made by GE Toshiba Silicone Co., Ltd.), vinyl silicone "8500" specifically as a commercially available product or model number Combination of (Arakawa Kagaku Kogyo Co., Ltd.) and methylhydrogen polysiloxane `` 12031 '' (made by Arakawa Kagaku Kogyo Co., Ltd.), vinyl silicone "11364" (Arakawa Kagaku Kogyo Co., Ltd.) Combination) and methylhydrogen polysiloxane "12031" (product made by Arakawa Chemical Co., Ltd.), vinyl silicone "11365" (product made by Arakawa Chemical Co., Ltd.) and methylhydrogen polysiloxane "12031" (Arakawa Kagaku Kogyo Co., Ltd. make), etc. are mentioned. In addition, KNS-320A, KS-847, and TPR6700 are silicone containing the main material and a crosslinking agent beforehand.

Moreover, it is preferable that the silicone resin which forms a resin layer has the property which components in a silicone resin are hard to transfer to a thin glass substrate, ie, low silicon transition property.

Thus, when a silicone resin layer is used as a resin layer, the support body which peeled the said support glass substrate and the said silicone resin layer can be reused preferably. When the silicone resin in the support body after such peeling has low silicon transition property, this silicone resin layer tends to have high residual adhesiveness. Therefore, reuse can be performed without a problem.

Next, the panel for display apparatus with a support body is demonstrated using drawing.

11 is a schematic cross-sectional view showing one embodiment of a panel for a display device with a support according to the present invention.

In FIG. 11, the display apparatus panel 110 with a support body consists of the display apparatus member 114, the thin glass substrate 112, the resin layer 118, and the support glass substrate 119, and these are laminated | stacked. It is. In addition, the display device panel 116 consists of a layered display device member 114 and a thin glass substrate 112, and the support 117 includes a resin layer 118 and a support glass substrate 119. Is done. In addition, the display device member 114 is formed on the second main surface of the thin glass substrate 112.

And the 1st main surface of the thin glass substrate 112 and the surface of the resin layer 118 fixed to the 1st main surface of the support glass substrate 119 adhere | attach and adhere | attach, and the display apparatus panel 110 with a support body was attached. ).

In the display device panel 110 with the support shown in FIG. 11, the thin glass substrate 112, the resin layer 118, and the support glass substrate 119 have the same size.

FIG. 12 is a schematic front view showing another form of a panel for a display device with a support, and FIG. 13 is a sectional view taken along the line A-A 'of FIG.

In FIG. 12 and FIG. 13, the display device panel 120 with the support is composed of a display device member 124, a thin glass substrate 122, a resin layer 128, and a support glass substrate 129. These are laminated | stacked. In addition, the display panel 126 is composed of a layered display device member 124 and a thin glass substrate 122, and the support 127 is formed of a resin layer 128 and a support glass substrate 129. Is done. In addition, the display device member 124 is formed on the second main surface of the thin glass substrate 122.

Then, the first main surface of the thin glass substrate 122 and the resin layer 128 fixed to the first main surface of the supporting glass substrate 129 are closely attached to each other, and the display device panel 120 with the support is attached. To form.

The panel 120 for a display device with the support body of the form shown in FIG. 12 and FIG. 13 has a larger main surface area of the supporting glass substrate 129 than the thin glass substrate 122.

In addition, the panel 120 for display devices with a support body of the form shown in FIG. 12 and FIG. 13 has an area (hereinafter, referred to as a resin layer) of the surface of the resin layer 128 (the surface in contact with the thin glass substrate 122). The area of the first main surface of the thin glass substrate 122 is larger than the &quot; surface area &quot; As long as the gap portion 125 is formed, the surface area of the resin layer 128 is smaller than the area of the first main surface of the thin glass substrate 122. And the part (alpha) which is not in contact with the resin layer 128 in the 1st main surface of the thin glass substrate 122, and the part (beta) of the support glass substrate 129 which oppose it, the support body of this invention The gap portion 125 is formed to be connected to the end surfaces γ ₁ and γ ₂ of the panel 120 for display device to which the display device is attached.

If such a gap part 125 is formed, since the thin glass substrate 122 and the resin layer 128 can be peeled more easily in the peeling process in the manufacturing method of this invention, it is preferable.

It is preferable that it is 0.1-5.0 mm, and, as for FIG. 12 and FIG. 13, it is more preferable that it is about 2.5 mm.

In addition, in the display apparatus panel with a support body, as shown in a schematic sectional view of FIG. 14, both main surfaces of the display apparatus member 134 are laminated glass substrates 132a and 132b and resin layers 138a and 138b. And a form sandwiched between the laminates of the support glass substrates 139a and 139b. At this time, the display panel 136 consists of a layered display device member 134 and both thin glass substrates 132a and 132b, and the support bodies 137a and 137b are resin layers 138a and 138b, respectively. ) And supporting glass substrates 139a and 139b. Even in such a form, it is a panel for display apparatus with a support body which can be used by this invention.

Next, the manufacturing method of the display apparatus panel with a support body which can be used by this invention is demonstrated.

The manufacturing method of a thin glass substrate and a support glass substrate is not specifically limited. For example, it can manufacture by a conventionally well-known method. For example, after melt | dissolving a conventionally well-known glass raw material into molten glass, it can shape | mold and obtain it in plate shape by the float method, the fusion method, the down draw method, the slot down method, the reed method.

The method of forming a resin layer in the surface (first main surface) of the support glass substrate manufactured in this way is not specifically limited, either.

For example, the method of adhering a film to the surface of a support glass substrate is mentioned. Specifically, in order to give a high adhesive force to the surface of a film, the surface modification process is performed and the method of sticking to the 1st main surface of a support glass substrate is mentioned. As the surface modification treatment method, a chemical method such as a silane coupling agent may be used to improve the adhesion, a physical method such as a flame (flame) treatment to increase surface active groups, or a sandblast treatment may increase the surface roughness. Mechanical methods of increasing and the like are exemplified.

Moreover, the method of coating the resin composition used as a resin layer on a 1st main surface of a support glass substrate by a well-known method, for example is mentioned. Known methods include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. Among these methods, it can select suitably according to the kind of resin composition.

For example, when the non-solvent type release paper silicone is used as the resin composition, a die coating method, a spin coating method or a screen printing method is preferable.

In addition, when manufacturing the display apparatus panel with a support body which has a clearance part as demonstrated using FIG. 12, FIG. 13, it is preferable to mask previously to the site | part which forms a clearance part, and then to coat a resin composition. . Masking is a method of attaching a removable film or the like to a portion where a gap portion is to be formed before coating the resin composition so that the resin composition is not coated on the portion and peeling the film later.

Moreover, when coating a resin composition on the 1st main surface of a support glass substrate, it is preferable that the coating amount is 1-100 g / m <2>, and it is more preferable that it is 5-20 g / m <2>.

As another method, for example, in the case of forming a resin layer with addition-reaction type silicone, the above-described spray coating of a resin composition comprising a silicone (topic), a crosslinking agent and a catalyst containing linear dimethylpolysiloxane in a molecule thereof It coats on a support glass substrate by well-known methods, such as a method, and it heat-cures after that. Although the heat-hardening conditions differ also with the compounding quantity of a catalyst, when 2 mass parts of platinum-type catalysts are mix | blended with respect to 100 mass parts of total amounts of a main body and a crosslinking agent, it is 50 degreeC-250 degreeC in air | atmosphere, Preferably React at 100 ° C to 200 ° C. In addition, the reaction time in this case is 5 to 60 minutes, Preferably it is 10 to 30 minutes. In order to obtain a silicone resin layer having a low silicone transferability, it is preferable to advance the curing reaction as much as possible so that unreacted silicone components remain in the silicone resin layer. Since the silicone component of can be made to remain, it is preferable. In the case where the reaction time is too long or the reaction temperature is too high, oxidative decomposition of the silicone resin occurs at the same time to generate a low molecular weight silicon component, which may increase the silicon transferability. It is preferable to advance hardening reaction as much as possible so that unreacted silicone component may not remain in a silicone resin layer, in order to make the peelability after heat processing favorable.

After forming a resin layer on the 1st main surface of a support glass substrate by this method, a thin glass substrate is laminated | stacked on the surface of a resin layer.

When a resin layer is manufactured using silicone for release paper, after heat-hardening the silicone for release paper coated on the support glass substrate, and forming a silicone resin layer, a thin glass substrate is laminated | stacked on the silicone resin formation surface of a support glass substrate. . By heat-hardening silicone for release paper, a silicone resin hardened | cured material bonds chemically with a support glass. Moreover, a silicone resin layer couple | bonds with a support glass by the anchor effect. By these actions, the silicone resin layer is firmly fixed to the supporting glass substrate.

The thin glass substrate and the resin layer are in close contact with the resin layer by a force attributable to van der Waals forces between the adjacent solid molecules, that is, adhesion. In this case, it can hold | maintain in the state which laminated | stacked the support glass substrate and the thin glass substrate.

The method of laminating | stacking a thin glass substrate on the surface of the resin layer fixed to the support glass substrate is not specifically limited. For example, it can carry out using a well-known method. For example, after laminating a thin glass substrate on the surface of a resin layer in an atmospheric pressure environment, the method of crimping | bonding a resin layer and a thin glass substrate using a roll or a press is mentioned. Since a resin layer and a thin glass substrate contact more closely by crimping | bonding with a roll or a press, it is preferable. Moreover, since the bubble mixed in between a resin layer and a thin glass substrate is easily removed by crimping | bonding by a roll or a press, it is preferable.

When it crimps | bonds by the vacuum lamination method or the vacuum press method, since mixing of a bubble and ensuring good adhesion are performed more preferable, it is more preferable. By compressing under vacuum, even in the case where microbubbles remain, bubbles do not grow due to heating, and there is an advantage that it is difficult to lead to distortion defects of the thin glass substrate.

When lamination | stacking a thin glass substrate on the surface of the resin layer of a support glass substrate, it is preferable to fully wash | clean the surface of a thin glass substrate, and to laminate | stack in an environment with high cleanness. The presence of foreign matter does not affect the flatness of the surface of the thin glass substrate due to the deformation of the resin layer. However, the higher the cleanliness, the better the flatness becomes, which is preferable.

After obtaining the glass laminated body (henceforth a "thin glass laminated body") which laminated | stacked the thin glass substrate, the resin layer, and the support glass substrate in this way, the 2nd main surface of the thin glass substrate in this thin glass laminated body A member for display device is formed on the substrate.

In forming the member for a display device, it is also preferable to improve the flatness by grinding the second main surface of the thin glass substrate as necessary.

The member for display apparatuses is not specifically limited. For example, the array and color filter which LCD has can be mentioned. Moreover, the transparent electrode, a hole injection layer, a hole transport layer, a light emitting layer, and an electron carrying layer which OLED has, for example are mentioned.

The method of forming such a display device member is not specifically limited, What is necessary is just to be the same as a conventionally well-known method.

For example, when manufacturing an LCD as a display device, the process of forming an array on a conventionally well-known glass substrate, the process of forming a color filter, the process of bonding the glass substrate in which the array was formed, and the glass substrate in which the color filter was formed (array What is necessary is just the same as various processes, such as a color filter bonding process). More specifically, as the process performed in these processes, pure water washing | cleaning, drying, film-forming, resist coating, exposure, image development, etching, and resist removal are mentioned, for example. Moreover, as a process performed after performing the bonding process of an array side board | substrate and a color filter side board | substrate, there exists a liquid crystal injection process and the sealing process of the injection hole performed after implementation of the said process, The process performed by these processes is mentioned.

Moreover, as an example of manufacturing OLED, as a process for forming an organic EL structure on the 1st main surface of a thin glass substrate, the process of forming a transparent electrode, a hole injection layer, a hole transport layer, a light emitting layer, an electron carrying layer, etc. Various processes, such as the process of vapor deposition and a sealing process, are included, As a process performed by these processes, a film-forming process, vapor deposition process, the adhesion process of a sealing plate, etc. are mentioned specifically ,.

In this way, a panel for a display device with a support that can be used in the present invention can be manufactured.

Next, the production method of the present invention will be described.

The manufacturing method of this invention is the 1st of the support glass substrate which has a 1st main surface and a 2nd main surface on the 1st main surface of the thin glass substrate which has a 1st main surface and a 2nd main surface, and has a member for display apparatuses on a 2nd main surface. It is a manufacturing method of the panel for display apparatuses which includes the operation of peeling the support body which consists of the said support glass substrate and the said resin layer from the panel for display apparatuses with a support body with which the resin layer which has easy peelability fixed to the main surface adhered. The planar fixed surface which a stage has as a main surface of one of the two main surfaces which the said display panel with a support body with is attached, the main surface of which the support body peeled off in the peeling process of a post process is not affixed. On the fixed surface of the stage, the fixing step of fixing the panel for the display device with the support attached thereto to the fixed surface of the stage. A peeling step of peeling the support and the display device panel by inserting a knife at an interface between the resin layer of the support and the thin glass substrate of the support to be peeled off as an end surface of the panel for the display device with the determined support. It is a manufacturing method of the panel for display apparatuses provided.

Thus, although the manufacturing method of this invention comprises the said fixing process and the said peeling process, this fixing process and a peeling process can be performed suitably by the peeling apparatus of this invention mentioned above. By the above-mentioned peeling method, the said fixing process and the said peeling process can be implemented.

In the manufacturing method of this invention, the panel for display apparatuses can be obtained by applying the said fixing process and the said peeling process to the panel for display apparatuses with a support body obtained by said method.

It is a flowchart which shows an example of the flow of the manufacturing method of the panel for display devices which is one Embodiment of the manufacturing method of the electronic device of this invention.

The manufacturing method of the panel for display devices of this invention shown in FIG. 17 is demonstrated based on the case where the peeling apparatus of this invention shown in FIGS. 1 and 2 is used.

As shown in FIG. 17, in the manufacturing method of the display apparatus panel of this invention, first, in step S100, the display apparatus panel 10 with a support body is prepared, for example as mentioned above. To manufacture.

Next, the process proceeds to the fixing process of the panel for display device with the support of step S110.

In the fixing step S110, the display device panel 10 with the step support body is brought into close contact with the fixing surface of the stage 20 in step S112. Next, in step S114, the panel 10 for display device with the adhered step support is fixed to the fixed surface of the stage 20 by vacuum suction.

Next, the process proceeds to the peeling process of the panel for display device with the support of step 120.

Two 1st and 2nd peeling methods of the above-mentioned peeling method (its 1) and peeling method (its 2) are applied to this peeling process S120. Of course, only one peeling method may be performed.

In the 1st peeling method (refer FIG. 1) of peeling process S120, first, in step S122, the interface of the resin layer of the support body of the panel 10 for display apparatuses with a step support body, and the thin glass substrate of the panel for display apparatuses. , The insertion position (height) of the knife 30 is adjusted. Next, in step S124, the knife 30 is inserted and pressed in at the interface of a resin layer and a thin glass substrate.

Subsequently, in step S126, the knife 30 is moved in the insertion direction to peel off the support.

On the other hand, in the 2nd peeling method (refer FIG. 2) of peeling process S120, first in step S132, the resin layer of the support body of the display apparatus panel 10 with a step support body, and the thin glass substrate of the panel for display apparatuses. The insertion angle and insertion position (height) of the knife 300 are adjusted with respect to the interface of. Next, in step S134, the knife 300 is inserted and pressed in at the interface of a resin layer and a thin glass substrate. Subsequently, in step S136, the knife 300 is rotated by a predetermined angle (rotational movement) about the tip center thereof, and further, the support member is peeled off by moving in the upward direction and / or the insertion direction.

In this way, in the peeling process S120, the support body is peeled from the display apparatus panel 10 with a step support body, and a display device panel is manufactured in step S140.

According to the said peeling process with which the manufacturing method of this invention is equipped, when a support glass substrate is large, even if it is 730x920 mm, the said support glass substrate can be easily isolate | separated.

Moreover, after providing to the said peeling process, it can provide to a desired process again. The desired process is, for example, in the case of LCD, a process of dividing into a cell of a desired size, a process of injecting a liquid crystal and then sealing the injection hole, a process of attaching a polarizing plate, and a module forming process. For example, in the case of OLED, in addition to the process applicable to the case of LCD, the process of assembling the thin glass substrate and the opposing board | substrate with which the organic electroluminescent structure was formed is mentioned. Moreover, since the intensity | strength of a thin glass substrate does not fall by the cutting process, and the cullet does not come out in the process of dividing | segmenting into the cell of a desired size, cutting by a laser cutter is preferable.

After obtaining the panel for display apparatuses by such a manufacturing method of this invention, a display apparatus can be obtained by providing to a conventionally well-known process again.

Such a manufacturing method of a display device is suitable for manufacture of the small display device used for mobile terminals, such as a mobile telephone and a PDA. The display device is mainly an LCD or an OLED, and the LCD includes TN type, STN type, FE type, TFT type, MIM type, IPS type, VA type and the like. Basically, the present invention can be applied to any display device of passive driving type and active driving type.

The suitable example of the manufacturing method of this invention is demonstrated.

First, the manufacturing method of the panel for display devices with a support body which can be used by this invention is demonstrated.

First, a thin glass substrate and a supporting glass substrate are prepared and these surfaces are washed. As washing | cleaning, pure water washing | cleaning and UV washing | cleaning are mentioned, for example.

Next, a resin layer is formed on the 1st main surface of a support glass substrate. For example, a silicone resin is coated on a 1st main surface of a support glass substrate using a screen printing machine. And it heat-hardens, a resin layer is formed on the 1st main surface of a support glass substrate, and the support glass substrate to which the resin layer was fixed is obtained.

Next, the first main surface of the resin layer and the thin glass is attached and bonded. For example, a resin layer and a thin glass substrate can be vacuum-pressed at room temperature, and can be bonded. And the glass laminated body which is a laminated body of a support glass substrate, a resin layer, and a thin glass substrate can be obtained.

Here, if necessary, the second main surface of the thin glass substrate in the glass laminate may be polished or washed. As washing | cleaning, pure water washing | cleaning and UV washing | cleaning are mentioned, for example.

After manufacturing two glass laminated bodies by such a method, the member for display apparatuses is formed in the 2nd main surface of the thin glass substrate in each glass laminated body. One glass laminated body forms a color filter array in the 2nd main surface of the thin glass substrate by providing it to a well-known color filter formation process. And another glass laminated body forms a TFT array in the 2nd main surface of the thin glass substrate by providing it to a well-known array formation process.

By this method, two panels for display devices with a support body can be manufactured.

In addition, below, the panel for display apparatuses with a support body which has a color filter array obtained here is called "panel with a support body x", and the panel with a support body with a TFT array is also called "panel with a support body." .

In the manufacturing method of this invention, the panel x with a support body manufactured in this way, and the panel y with a support body are processed again by the method of the case 1 thru | or case 4 demonstrated below, for example, and the display panel To prepare.

(Case 1)

In case 1, the color filter array and the TFT array in each of the panel x with the support and the panel y with the support are opposed as described above, and a sealant such as an ultraviolet curable sealant for cell formation is used. Bond. The panel for display apparatus with a support body obtained here is also called "panel z1 with a support body" hereafter. Panel z1 with a support body is a state in which liquid crystal is not yet sealed.

Next, the liquid crystal injection hole of panel z1 with a support body is sealed. For example, an ultraviolet curable water-soluble sealant or the like may be used to further seal the outside thereof.

And the panel z1 with a support body after sealing is provided to the peeling process in the manufacturing method of this invention. Specifically, the main surface to which the support body to be peeled off is fixed to the stage 20 in the peeling apparatus 1 or the peeling apparatus 11 which is the peeling apparatus of this invention so that the main surface opposite to it may be fixed downward. The knife is inserted in an arbitrary part of the edge part of the 1st main surface of a thin glass substrate, and the contact interface of a resin layer, and a clearance gap is formed. And a support body and a thin glass substrate can be peeled and isolate | separated by adsorbing and holding a some adsorption pad on the 2nd main surface of the support glass substrate in a support body, and moving to an upward direction (peeling direction).

Next, the two supports can be peeled off by subjecting the panel z1 with the support to the upper and lower sides in a similar manner.

The panel for display devices thus obtained is also referred to as "panel w1" below. Two support bodies which peeled and isolate | separated can be reused in manufacture of the panel with another support body.

Next, the panel w1 is cut into individual cells.

Next, a liquid crystal is injected into the cut individual cell, and it seals after that, and forms a liquid crystal cell.

In addition, a polarizing plate may be attached, and a backlight or the like may be formed to obtain LCD1.

(Case 2)

In the case 2, the color filter array and the TFT array in each of the panel x with the support and the panel y with the support are opposed as described above to enclose the liquid crystal, and then the UV curable sealing for cell formation. It joins using sealing agents, such as agent. The panel with a support body of this invention obtained here is hereafter called "panel z2 with a support body."

Next, the panel z2 with a support body is provided to the peeling process in the manufacturing method of this invention. Specifically, the main surface to which the support body to be peeled off is fixed to the stage 20 in the peeling apparatus 1 or the peeling apparatus 11 which is the peeling apparatus of this invention so that the main surface opposite to it may be fixed downward. The knife is inserted in an arbitrary part of the edge part of the 1st main surface of a thin glass substrate, and the contact interface of a resin layer, and a clearance gap is formed. And a support body and a thin glass substrate can be peeled and isolate | separated by adsorbing and holding a some adsorption pad on the 2nd main surface of the support glass substrate in a support body, and moving to an upward direction (peeling direction).

Next, the two supports can be peeled off by subjecting the panel z2 with the support to the upper and lower sides in a similar manner.

The panel for display devices thus obtained is also referred to as "panel w2" below. Two support bodies which peeled and isolate | separated can be reused in manufacture of the panel with another support body.

Next, panel w2 is cut into individual cells.

Then, the polarizing plate is attached again, a backlight other than that can be formed, and LCD2 can be obtained.

(Case 3)

In the case 3, the color filter array and the TFT array in each of the panel x with the support and the panel y with the support are opposed as described above to enclose the liquid crystal, and then the UV curable sealing for cell formation. It joins using sealing agents, such as agent. And it cuts into individual cells with a support body. The panel for display apparatus with a support body obtained by cutting | disconnecting here is also called "panel z3 with a support body" below.

Next, the panel z3 to which the support body is attached is provided to a peeling process. Specifically, the main surface to which the support body to be peeled off is fixed to the stage 20 in the peeling apparatus 1 or the peeling apparatus 11 which is the peeling apparatus of this invention so that the main surface opposite to it may be fixed downward. The knife is inserted in an arbitrary part of the edge part of the 1st main surface of a thin glass substrate, and the contact interface of a resin layer, and a clearance gap is formed. And a support body and a thin glass substrate can be peeled and isolate | separated by adsorbing and holding a some adsorption pad on the 2nd main surface of the support glass substrate in a support body, and moving to an upward direction (peeling direction).

Next, the two supports can be peeled off by subjecting the panel z3 with the support to the upper and lower sides in a similar manner.

The panel for a display device thus obtained is also referred to as "panel w3" in the following.

And further, a polarizing plate can be affixed, backlight other than that can be formed, and LCD3 can be obtained.

(Case 4)

In case 4, the color filter array and the TFT array in each of the panel x with the support and the panel y with the support are opposed as described above, and a sealant such as an ultraviolet curable sealant for cell formation is used. Bond. And it cuts into individual cells with a support body. The panel with a support body of this invention obtained by cutting here is also called "panel z4 with a support body" below. Panel z4 with a support body is a state in which liquid crystal is not yet enclosed.

Next, the liquid crystal injection hole of panel z4 with a support body is sealed. For example, an ultraviolet curable water-soluble sealant or the like may be used to further seal the outside thereof.

And the panel z4 with a support body after sealing is provided to a peeling process. Specifically, the main surface to which the support body to be peeled off is fixed to the stage 20 in the peeling apparatus 1 or the peeling apparatus 11 which is the peeling apparatus of this invention so that the main surface opposite to it may be fixed downward. The knife is inserted in an arbitrary part of the edge part of the 1st main surface of a thin glass substrate, and the contact interface of a resin layer, and a clearance gap is formed. And a support body and a thin glass substrate can be peeled and isolate | separated by adsorbing and holding a some adsorption pad on the 2nd main surface of the support glass substrate in a support body, and moving to an upward direction (peeling direction).

Next, the two supports can be peeled off by subjecting the panel z4 with the support to the upper and lower sides in a similar manner.

The panel obtained by separating two support bodies here is also called "panel w4" hereafter.

Next, a liquid crystal is injected into the cell of panel w4, and it seals after that.

And further, a polarizing plate can be attached, a backlight other than that can be formed and LCD4 can be obtained.

As mentioned above, although the display device panel which has a display device member on the surface (2nd main surface) of a board | substrate was demonstrated as a representative example as the electronic device of this invention, as mentioned above, this invention is not limited to this and displays Instead of the device member, a solar cell, a thin film secondary battery and an electronic component each having a member for an electronic device such as a solar cell member, a thin film secondary battery member, and a circuit for an electronic component, on the surface (second main surface) of the substrate. Of course, the electronic device may be.

For example, as a solar cell member, as a silicon type, the transparent electrode, such as a tin oxide of a positive electrode, the silicon layer represented by a p layer / i layer / n layer, the metal of a negative electrode, etc. are mentioned, In addition, a compound type And various members corresponding to the dye-sensitized type, the quantum dot type, and the like.

Moreover, as a lithium ion type | mold as a lithium ion type | mold, transparent electrodes, such as a metal or metal oxide of a positive electrode and a negative electrode, the lithium compound of an electrolyte layer, the metal of a current collector layer, resin as a sealing layer, etc. are mentioned as a lithium ion type, The In addition, various members etc. which correspond to a nickel hydrogen type, a polymer type, a ceramic electrolyte type, etc. are mentioned.

Examples of circuits for electronic components include metals in the conductive portion, silicon oxide and silicon nitride in the insulating portion, and various sensors such as pressure sensors and acceleration sensors, rigid printed circuit boards, flexible printed circuit boards, and rigid circuits. Various members etc. corresponding to a flexible printed board etc. are mentioned.

Example  One

An embodiment of the present invention will be described.

Initially, the support glass substrate (A100 made by Asahi Glass Co., Ltd., AN100, an alkali free glass substrate) of 720 mm in length, 600 mm in width, 0.4 mm in thickness, and a linear expansion coefficient of 38x10 <^-7> / degreeC is purely washed and UV-protected. It was washed and cleaned.

Next, on a support glass substrate, silicone for solvent-free addition reaction type release paper (made by Shin-Etsu Silicone Co., Ltd., KNS-320A, viscosity: 0.40 Pa.s, 100 mass parts and a platinum-type catalyst (made by Shin-Etsu Silicone Co., CAT- PL-56) The mixture of 2 parts by mass was coated with a screen printing machine in a size of 705 mm in length and 595 mm in width (coating amount 30 g / m 2).

Next, this was heat-hardened in air | atmosphere for 30 minutes at 180 degreeC, and the silicone resin layer of 20 micrometers in thickness was obtained on the surface of a support glass substrate.

Next, the silicone resin layer of the thin glass substrate (Asahi Glass Co., Ltd. make, AN100, an alkali free glass substrate) of 715 mm long, 595 mm wide, 0.3 mm thick, and a linear expansion coefficient of 38x10 <^-7> / degreeC After the surface on the side to contact was cleaned with pure water, UV-cleaned, and cleaned, the silicone resin layer and the thin glass substrate were bonded by vacuum press at room temperature, and the glass laminated body (glass laminated body A1) was obtained.

In addition, formation of the resin layer and lamination | stacking of the thin glass substrate were performed so that the clearance part of depth 15mm may be formed in the edge part of a glass laminated body.

In the obtained glass laminated body A1, both glass substrates were closely_contact | adhered without generating a silicone resin layer and foam | bubble, and there was no distortion-like defect and smoothness was also favorable.

Next, apart from the glass laminated body A1 obtained as mentioned above, the glass substrate A1 was heat-processed again at 300 degreeC in air for 1 hour, and glass laminated body A2 was obtained. There was no deterioration by the heat of the resin layer of glass laminated body A2, and it was confirmed that heat resistance is favorable.

Next, glass laminated bodies A1 and A2 were provided to the following peel tests 1-6.

<Peel Test 1>

Using the peeling apparatus 1 demonstrated using FIG. 1 mentioned above, the 2nd main surface side of the thin glass substrate of glass laminated body A1 was fixed on the porous vacuum adsorption plate, and the opposite surface, ie, the 2nd of a support glass substrate, was A vacuum suction pad (40 mmΦ) was adsorbed and held on the main surface side.

Next, a knife (thickness: 0.10 mm, length: 100 mm, width: 10 mm, stainless steel, bending stiffness A: 170 N · mm 2, bending stiffness B: 1,720,000 N · mm 2) was placed at the corners of the glass laminate A1 (four One of the corners) is also mounted on the end face, and the knife is inserted into the interface with the first main surface of the thin glass substrate while sliding the surface of the resin layer by slightly touching the surface of the resin layer by the fixed surface direction moving unit, and about 20 mm Insertion was made to form voids.

Next, the vacuum adsorption pad was raised in order according to the progress of peeling of a support body toward the center from the edge part of the display apparatus panel with a support body. The pulling distance of the suction pad at this time was 10 mm.

In this peeling test 1, the knife itself deform | transformed and moved so that it might follow the surface of the resin layer. And peeling was possible without damaging a support body and a thin glass substrate.

<Peel test 2>

Using the peeling apparatus 11 demonstrated using FIG. 2 mentioned above, the 2nd main surface side of the thin glass substrate of glass laminated body A1 was fixed on the porous vacuum adsorption plate, and the opposite surface, ie, the 2nd of a support glass substrate, was A vacuum suction pad (40 mm Φ) was adsorbed and held on the main surface side.

Next, a knife (thickness: 0.40 mm, length: 100 mm, width: 10 mm, made of stainless steel, bending rigidity A: 11000 N · mm 2, bending rigidity B: 6,870,000 N · mm 2) was placed on the corner portion of the glass laminate A1 (four One of the corners) is also mounted on the end face, and the knife is inserted into the interface with the first main surface of the thin glass substrate while sliding the surface of the resin layer by slightly touching the surface of the resin layer by the fixed surface direction moving unit, and about 20 mm Insertion was made to form voids.

Next, the vacuum adsorption pad was raised in order according to the progress of peeling of a support body toward the center from the edge part of the display apparatus panel with a support body. The pulling distance of the suction pad at this time was 10 mm.

In this peeling test 2, the knife rotated about the front end part, the rear end part moved freely upward, and the whole knife moved upwards, and it moved so that the knife might follow the surface of the resin layer. And peeling was possible without damaging a support body and a thin glass substrate.

<Peel Test 3>

Using the peeling apparatus 11, the 2nd main surface side of the thin glass substrate of glass laminated body A1 was fixed on the porous vacuum adsorption plate, and a vacuum adsorption pad (40 mm) was provided on the opposite surface, ie, the 2nd main surface side of a support glass substrate. Φ) was adsorbed and maintained.

Next, a knife (thickness: 0.10 mm, length: 100 mm, width: 10 mm, made of stainless steel) is loaded on the corner portion (one of four corner portions) of the glass laminate A1 to the end surface, and the knife is fixed. It inserted in the interface with the 1st main surface of a thin glass substrate, making it slide, making the surface of a resin layer contact a little by the direction moving unit, and inserted about 20 mm, and formed the space | gap. The insertion was performed while injecting an antistatic fluid into the interface from the ionizer (manufactured by Giens).

Next, the vacuum adsorption pad was pulled up while continuing to inject the antistatic fluid from the ionizer toward the formed void. As a result, the support body and the thin glass could be peeled off without damaging the glass laminate A1. The large voltage of the thin glass substrate after peeling was +0.2 kV.

<Peel Test 4>

Using the peeling apparatus 11, the 2nd main surface side of the thin glass substrate of glass laminated body A1 was fixed on the porous vacuum adsorption plate, and the vacuum adsorption pad 40 was provided on the opposite surface, ie, the 2nd main surface side of a support glass substrate. MmΦ) was adsorbed and held.

Next, a knife (thickness: 0.10 mm, length: 100 mm, width: 10 mm, made of stainless steel) is loaded on the corner portion (one of four corner portions) of the glass laminate A1 to the end surface, and the knife is fixed. It inserted in the interface with the 1st main surface of a thin glass substrate, making it slide, making the surface of a resin layer contact a little by the direction moving unit, and inserted about 20 mm, and formed the space | gap.

Next, high pressure water (2 MPa) was injected from the trimming nozzle (1 mm Φ manufactured by Ikeuchi Co., Ltd.) toward the formed voids. As a result, the support body and the thin glass could be peeled off without damaging the glass laminate A1. The large voltage of the thin glass substrate after peeling was +0.2 kV.

<Peel Test 5>

The peeling test 4 was performed by the method similar to said peeling test 1 except having used glass laminated body A2. The support glass substrate and the thin glass substrate were peeled off and separated without damaging the glass laminated body A2.

<Peel Test 6>

Two glass laminates A2 are used, and the first main surface side of each thin glass substrate is coated with an ultraviolet curable sealant (manufactured by Sekisui Kagaku Co., Ltd.) in a region of 5 mm inward from the glass end in a rectangular shape and then joined. The peeling test 5 was implemented by the method similar to the peeling test 1 except having used what was used.

From the laminated body which bonded two thin glass substrates, ie, a panel, two support bodies could be isolate | separated without damaging a panel.

<Exfoliation test 7>

Peeling was performed without using both the peeling apparatus 1 and the peeling apparatus 11.

With respect to the glass laminate A1 described above, a knife (length 650 mm, 1 mm thick) of a resin layer manually loaded on the corner portion and the end of the glass laminate A1 and formed on the first main surface of the support glass substrate While sliding while making the surface contact a little, it inserted in the interface with the 1st main surface of a thin glass substrate, and moved as it was, and isolate | separated the support glass from the thin glass without damaging the glass laminated body A1. The large voltage of the thin glass after separation was +10 kV.

Example  2

In Example 2, the laminated body B was created like Example 1 except having changed the board | substrate into the polyethylene terephthalate resin substrate of thickness 0.1mm, and the test similar to the peeling test 3 was done. As a result, the support body and the polyethylene terephthalate resin substrate could be peeled off without damaging the laminate B. The large voltage of the polyethylene terephthalate resin board | substrate after peeling was +0.3 kV.

Example  3

In Example 3, the laminated body C was created like Example 1 except having changed the board | substrate into the stainless steel (SUS304) board | substrate which performed the mirror surface treatment of thickness 0.1mm, and the test similar to the peeling test 3 was done. As a result, the support body and the stainless steel substrate were peeled off without damaging the laminated body C. The large voltage of the stainless steel substrate after peeling was +0.02 kV.

Example  4

In Example 4, laminated body D was created similarly to Example 1 except having changed the support substrate into the polyethylene terephthalate resin substrate of thickness 1mm, and the board | substrate into the polyethylene terephthalate resin substrate of thickness 0.1mm, and peeling off The simulation experiment which performed the test similar to the test 3 was done. As a result, the support body and the polyethylene terephthalate resin substrate could be peeled off without damaging the laminate D. The large voltage of the polyethylene terephthalate resin board | substrate after peeling was +0.5 kV.

Example  5

In Example 5, the laminated body E was carried out similarly to Example 1 except having changed the support substrate into the silicon wafer substrate of thickness 1mm and 6 inches in diameter, and changing the board | substrate into the silicon wafer substrate of thickness 0.1mm and 6 inches in diameter. The simulation experiment which created and performed the test similar to peeling test 3 was performed. As a result, the support body and the silicon wafer substrate could be peeled off without damaging the laminate E. The large voltage of the silicon wafer substrate after peeling was +0.05 kV.

Example  6

In Example 6, laminated body F was created like Example 1 except having changed the support substrate into the polyethylene terephthalate resin substrate of thickness 1mm, and the board | substrate into the thin glass substrate of thickness 0.1mm, and peeling test 3 The simulation experiment which performed the test similar to this was done. As a result, the support body and the thin glass substrate could be peeled off without damaging the laminate F. The large voltage of the thin glass resin substrate after peeling was +0.2 kV.

Example  7

In Example 7, the laminated body G was created like Example 1 except having changed the board | substrate into the polyimide resin substrate (made by Toray Dupont, Kapton 200HV) of thickness 0.05mm, and it is the same as the peeling test (3). Was tested. As a result, the support body and the polyimide resin substrate could be peeled off without damaging the laminate G. The large voltage of the polyimide resin substrate after peeling was +0.2 kV.

Example  8

First, a glass apparatus (made by Asahi Glass Co., Ltd., AN100, an alkali-free glass substrate) of 350 mm long, 300 mm wide, 0.08 mm thick, and a coefficient of linear expansion 38 × 10 ^-7 / ° C. Was washed with an alkaline detergent to clean the surface, and then sprayed with 0.1% methanol solution of γ-mercaptopropyl trimethoxysilane on the surface, and then dried at 80 ° C. for 3 minutes as a laminated glass film. Ready. On the other hand, the thing which carried out the plasma processing of the surface of the polyimide substrate (Toray DuPont company, Kapton 200HV) of 350 mm long, 300 mm wide, and 0.05 mm thick was prepared. And both were laminated | stacked using the press apparatus heated at 320 degreeC overlapping with the previous glass substrate, and it was set as the glass / resin laminated substrate.

In Example 8, except that the thin glass substrate was changed to the above-described glass / resin laminated substrate, and the surface on the side opposite to the laminated surface of the resin substrate with the glass substrate was set as the laminated surface with the support. Similarly, laminated body H was created and the test similar to peeling test 3 was done. As a result, the support body and the glass / resin laminated film substrate could be peeled off without damaging the laminate H. The large voltage of the glass / resin laminated film substrate after peeling was +0.2 kV.

Although this invention was detailed also demonstrated with reference to the specific embodiment, it is clear for those skilled in the art that various changes and correction can be added without deviating from the mind and range of this invention.

This application is based on Japanese Patent Application No. 2009-026196 for which it applied on February 6, 2009, and Japanese Patent Application No. 2009-198992 for which it applied on August 28, 2009, The content is taken in here as a reference. do.

According to the present invention, generation of substrate defects caused by foreign matter such as bubbles or dust mixed between substrates can be suppressed, and it can be processed in an existing manufacturing line without generating edge pits, and it does not damage the adherent substrate and the resin layer. The present invention can provide a method for producing an electronic device that can be easily separated and separated in a short time. Moreover, the peeling apparatus which can implement the manufacturing method of such an electronic device can be provided.

1, 11: peeling device
2: absence of expectations
3: first moving member main body
4: third moving member main body
5: second moving member main body
10: panel for display device with a support
10x: end face of the panel for a display device with a support
12a, 12b: thin glass substrate
16, 116, 126, 136: panel for display device
17a, 17b, 117, 127, 137a, 137b: support
18a, 18b: resin layer
19a, 19b: supporting glass substrate
20: stage
22: porous vacuum adsorption plate
24: pump
26: stage frame
30: knife
30a: Tip of knife
30b: End of knife
30c: rear end of knife
40: vertical movement unit
40a: second moving side member
40b: second fixed side member
42: fixed surface moving unit
42a: first moving side member
42b: first moving side member
44: upward movement mechanism
44a: third moving side member
44b: third fixed side member
44c: stopper
46: three component force sensor
50: rotary mechanism
51: stopper
52: blanket
54: axis of rotation
56: bush
58: blanket
59: insertion angle adjustment unit
60: adsorption pad
61: support
611: arm
70: camera
73: nozzle
75: antistatic device
θ: insertion angle
77: vacuum pump
78: major regulator
79: valve
82: adsorption pad
83: air pump
84: frame
85: major regulator
86: guide
87: electromagnetic valve
88: air cylinder
89: piston
90:
110: panel for display device with a support
112: thin glass substrate
114: member for display device
118: resin layer
119: support glass substrate
120: panel for display device with a support
122: thin glass substrate
124: member for display device
125: gap
128: resin layer
129: support glass substrate
132a, 132b: thin glass substrate
134: member for display device
138a and 138b: resin layer
139a, 139b: support glass substrate

Claims (18)

Resin layer which has the 1st main surface and the 2nd main surface, and the peelability fixed to the 1st main surface of the support substrate which has a 1st main surface and a 2nd main surface on the 1st main surface of the board | substrate which has a member for electronic devices on the 2nd main surface. It is a manufacturing method of the electronic device containing the said electronic device member and the said board | substrate including the operation which peels the support body which consists of the said support substrate and the said resin layer from the electronic device with a close_contact | adherence support body,
The main surface of the two main surfaces which the said electronic device with a support body has is one main surface, and the support body peeled off in the peeling process which is a post process is not adhered to the planar fixed surface which a stage is equipped with, A fixing step of fixing the electronic device with the support on the fixed surface of the stage;
Peeling process of peeling the said support body and the said electronic device by inserting a knife in the interface of the said resin layer of the said support body and the board | substrate which are peeled off and are the end surface of the said electronic device with the support body fixed on the fixed surface of the said stage. And
The knife is deformed by the action from the resin layer and / or the substrate so as to move along the surface of the resin layer when the knife is inserted between the resin layer and the substrate,
And /
A rotation mechanism for rotating the knife about the leading end to move the rear end of the knife in a normal direction which is a direction parallel to the normal on the fixed surface of the stage, and an insertion for setting an upper and lower limit of the insertion angle of the knife An insertion angle adjusting unit having an angle setting mechanism, and a normal direction moving mechanism for moving the entirety of the knife in the normal direction. The direction in which the said knife is further inserted by deforming by the action | action from the said resin layer and / or the said board | substrate in the said peeling process WHEREIN: The said knife inserted in the interface of the said resin layer and the said board | substrate in the said peeling process. And the knife moves so as to follow the surface of the resin layer in the case of moving to the surface of the resin layer, thereby peeling the support body and the electronic device. The said peeling process WHEREIN: After inserting the knife in the interface of the said resin layer and the said board | substrate in the said peeling process, the said knife rotates around the front-end | tip part, and a rear end part of the said stage The knife moves along the surface of the resin layer by moving in a direction parallel to the normal line on the fixed surface, and also moving the whole of the knife in at least one of the same parallel direction and the insertion direction. The manufacturing method of the electronic device which peels the said support body and the said electronic device. The adsorption process of Claim 1 or 2 which further includes the adsorption process of adsorb | sucking a some adsorption pad on the 2nd main surface of the said support substrate of the said support body peeled after the said fixing process and before the said peeling process,
After the peeling step inserts the knife at the interface between the resin layer and the substrate, the adsorption pad is moved in the peeling direction, which is a direction in which the resin layer and the substrate are peeled off, so that the support and the electronic device are moved. The manufacturing method of an electronic device which is a process of peeling. The said peeling process is the edge of the site | part which inserted the said knife in the end surface of the electronic device with a said support body among the some adsorption pads which adsorb | sucked on the 2nd main surface of the said support substrate further, The adsorption pad located in the vicinity is first moved in the peeling direction, then the neighboring adsorption pad is moved in the peeling direction, and then, similarly, the adsorption pad in the neighborhood of the adsorption pad moved in the peeling direction is Next, the method of moving to the said peeling direction is performed in order, and the said support body is a process of peeling in the direction toward the center from the edge part which inserted the said knife, and peeling toward the extension line. The manufacturing method of the electronic device of Claim 1 or 2 whose said peeling process is a process which further includes the operation which determines the site | part which inserts the knife which is an interface of the said resin layer and the said board | substrate by image processing. The said peeling process peels the said support body and the said electronic device, Furthermore, the said peeling process connects a conductor to arbitrary parts of the said support substrate and / or the said board | substrate, and takes a ground and suppresses charging, The manufacturing method of an electronic device which is a process. The manufacturing method of an electronic device according to claim 1 or 2, wherein said peeling step is a step of peeling said support body and said electronic device while also charging control by injecting an antistatic material between said support body and said electronic device. . The manufacturing method of the electronic device of Claim 1 or 2 whose said peeling process is a process of inserting the said knife in the interface of the said resin layer and the said board | substrate, also detecting the load weight to the said knife. The manufacturing method of the electronic device of Claim 1 or 2 whose said electronic device is a panel for display apparatuses. Resin layer which has the 1st main surface and the 2nd main surface, and the peelability fixed to the 1st main surface of the support substrate which has a 1st main surface and a 2nd main surface on the 1st main surface of the board | substrate which has a member for display apparatuses on a 2nd main surface. It is a peeling apparatus which peels the support body which consists of the said support substrate and the said resin layer from this electronic device with a support body in close contact,
A stage in close contact with a main surface of the electronic device to which the support is attached, the stage having a planar fixing surface to fix the electronic device to which the support is attached;
A knife used to peel the support from the electronic device to which the support is attached;
In the fixed surface of the stage, the knife is inserted into an interface between the resin layer and the substrate in the support body to be peeled off in the end face of the electronic device with the support fixed to the stage. A normal direction moving unit for moving the knife in a normal direction which is a direction parallel to the normal of
And a fixed surface direction moving unit for moving the knife between the resin layer and the substrate,
The knife is deformed by the action from the resin layer and / or the substrate so as to move along the surface of the resin layer when the knife is inserted between the resin layer and the substrate,
And /
An insertion angle adjusting unit having a rotating mechanism for rotating the knife about the leading end to move the rear end of the knife in the normal direction, and an insertion angle setting mechanism for setting an upper and lower limit of the insertion angle of the knife; Peeling apparatus provided with the normal direction movement mechanism which moves to the said normal direction. A plurality of adsorption pads for adsorbing a second main surface of the support substrate of the support body to be peeled off in the electronic device with the support fixed on the fixed surface of the stage, and the adsorption pad according to claim 11. The peeling apparatus further equipped with the pad movement unit which moves to the peeling direction which is a direction which peels the said resin layer and the said board | substrate. The said pad moving unit is a said 2nd adsorption pad initially a suction pad located in the vicinity of the site | part which inserted the said knife in the end surface of the electronic device with a support body among the said some adsorption pads. Operation in which the adsorbent pads of the neighboring adsorbent pads moved in the peeling direction are moved next to the peeling direction is moved in the same manner after moving the adsorbent pads in the peeling direction and then moving in the peeling direction. And a time control function for peeling the support body in the direction toward the center from the end where the knife is inserted and further peeling the film toward the extension line thereof. The peeling apparatus of any one of Claims 11-13 further equipped with the image processing apparatus for determining the site | part which inserts the knife which is an interface of the said resin layer and the said board | substrate. The peeling apparatus of any one of Claims 11-13 further equipped with the ground part which connects a conductor to the said support substrate and / or arbitrary site | parts of the said board | substrate, and suppresses charging. The peeling apparatus according to any one of claims 11 to 13, further comprising a charging control device for controlling charging by injecting an antistatic material between the support and the electronic device. The peeling apparatus as described in any one of Claims 11-13 further equipped with the load weight detection apparatus which detects the load weight to the said knife. The peeling apparatus according to any one of claims 11 to 13, wherein the electronic device is a panel for a display device.

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