CN105359253B - Stripping starting point producing device and stripping starting point preparation method - Google Patents
Stripping starting point producing device and stripping starting point preparation method Download PDFInfo
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- CN105359253B CN105359253B CN201480037959.0A CN201480037959A CN105359253B CN 105359253 B CN105359253 B CN 105359253B CN 201480037959 A CN201480037959 A CN 201480037959A CN 105359253 B CN105359253 B CN 105359253B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
The present invention provide it is a kind of even if do not make tilt tiltedly, the stripping starting point producing device that the position relative to knife insertion position of the point of a knife of knife can also be detected and insert knife precision well.The present invention provides a kind of stripping starting point producing device, wherein, the stripping starting point producing device includes:Moving parts, it is used between the 1st substrate for making knife be inserted into layered product and the 2nd substrate;Detect position detection component, its position for being used for the 2nd main surface to the position of the point of a knife of knife and the 2nd substrate;And position regulating member, it is used to be adjusted the position of layered product and knife.
Description
Technical field
The present invention relates to stripping starting point producing device and stripping starting point preparation method.
Background technology
Slimming, lightness with electronic devices such as display panel, solar cell, thin-film secondary batteries, expecting should
The thin plate of the substrates such as glass, resin, metal for these electronic devices.
However, if the thickness of slab of substrate is thinning, the treatability of substrate deteriorates, so as to be difficult on substrate form electronic device
Functional layer is (for example, thin film transistor (TFT) (TFT:Thin Film Transistor) and colour filter (CF:Color Filter)
Deng).
It is therefore proposed that it is a kind of strengthened using reinforcing plate substrate and on substrate formed functional layer method (referring for example to
Patent document 1).In the method, on substrate fit reinforcing plate and constitute layered product, formed the layered product after substrate on
Form functional layer.Also, after functional layer is formed, by reinforcing plate from strippable substrate.
The stripping of reinforcing plate is for example by from the corner of the side in two corners being located on diagonal towards opposite side
Corner make reinforcing plate or substrate or their both sides occur flexible deformation to carry out.Now, for ease of being peeled off, people
Stripping starting point (turn into and peel off the gap started) is made for ground.Stripping is made by the way that knife is inserted between substrate and reinforcing plate
Starting point.
However, it is very difficult to knife precision is inserted between the relatively thin substrate of thickness of slab and reinforcing plate well, it is necessary to make knife
The insertion position of point of a knife and knife inserts knife (it is required that micron-sized contraposition) after accurately aligning.Also, for high accuracy
Ground carries out the contraposition, it is necessary to (be formed as the top of the blade of acute angle to the position for knife insertion position of the point of a knife of knife
The position in portion) accurately detect.
In the device disclosed in patent document 1, the knife for being possible to move horizontally is arranged on the side of layered product end, and
The rear of knife will be arranged on for the Electrofax that the point of a knife to layered product end and knife is shot.That is, shone using electronics
Camera is shot to the point of a knife of layered product end and knife in same position and the image of acquisition is handled, thus to knife
Detected insertion position.The thickness of the resin bed (Fig. 2 of patent document 1 5A, 5B) inserted for knife is several μm or so, very
Thin, therefore, Electrofax needs the positive side from layered product end to be shot in face of layered product end.
On the other hand, in the case of so configured Electrofax, the thickness of knife can be photographed, but can not shoot
To the point of a knife of knife, accordingly, it would be desirable to set knife with being slightly slanted relative to layered product as Fig. 3 of patent document 1.
Prior art literature
Patent document
Patent document 1:International Publication No. 2010/090147
The content of the invention
Problems to be solved by the invention
However, when tilt is tiltedly set, because knife is inserted with inclined posture, therefore acting on substrate and reinforcing plate
Load become big so that produce make substrate and reinforcing plate easily it is damaged so the problem of.
In order to prevent the problem, it is also considered that make the method that the posture of knife is recovered in insertion, but in this case,
Need to be corrected test position, in addition, also to enter to exercise the action of posture recovery, it is therefore possible to increase insertion error.
The present invention be in view of so the problem of and make, its object is to there is provided even if do not make tilt tiltedly, also can be right
The stripping starting point system that the position for knife insertion position of the point of a knife of knife is detected and inserts knife precision well
Make device and stripping starting point preparation method.
The solution used to solve the problem
Technical scheme for solving described problem is as follows.
The 1st technical scheme of the present invention provides a kind of stripping starting point producing device, and it is used to knife being inserted into layered product
Stripping starting point is made between 1st substrate and the 2nd substrate, the layered product is by making the with the 1st main surface and the 2nd main surface
1st main surface of 2 substrates is incorporated into the 2nd of the 1st substrate with the 1st main surface and the 2nd main surface in the way of it can peel off
Main surface is formed, wherein, the stripping starting point producing device includes:Moving parts, it is used to make layered product and knife edge and the 2nd substrate
The direction of the 2nd major surfaces in parallel relatively move and knife is inserted between the 1st substrate of layered product and the 2nd substrate;Position
Detection part, it is on the basis of the reference plane set with the 2nd major surfaces in parallel of the 2nd substrate, to the point of a knife and benchmark of knife
Detected position on the direction vertical with reference plane on the 2nd main surface of position and the 2nd substrate on the vertical direction in face;
And position regulating member, its according to the testing result of position detection component and the thickness of slab of the 2nd substrate, make layered product and knife along with
The direction that 2nd main surface of the 2nd substrate is vertical is relatively moved and the position of layered product and knife is adjusted, so that the knife of knife
Point is located between the 1st substrate and the 2nd substrate.
According to the technical program, using position detection component, with the base set with the 2nd major surfaces in parallel of the 2nd substrate
On the basis of quasi- face (for example, in the case where layered product is flatly supported, reference plane is set to horizontal face), to the knife of knife
Position and the 2nd substrate on the direction (being vertical in the case where reference plane is level) vertical with the reference plane of point
Detected position on the direction vertical with the reference plane on the 2nd main surface.Then, according to the detection of the position detection component
As a result with the thickness of slab of the 2nd substrate, the position of layered product and knife is adjusted using position regulating member, so that the point of a knife position of knife
Between the 1st substrate and the 2nd substrate.That is, by the position on the basis of reference plane on the 2nd main surface for obtaining the 2nd substrate
The information of the thickness of slab of information and the 2nd substrate, can obtain insertion position (the 1st substrate and the 2nd base of the knife on the basis of reference plane
Position between plate).Also, by learning the position, the position relative to knife insertion position of the point of a knife of knife can be obtained, from
And can obtain in order that the point of a knife of knife is located at knife insertion position and the relative amount of movement between required, layered product and knife.
According to the technical program, due to can be from the direction vertical relative to layered product to the position of resin bed, the position of the point of a knife of knife
Detected, therefore, even if not making tilt tiltedly, be also capable of detecting when the position relative to knife insertion position of the point of a knife of knife, by
This, when knife is inserted, can by knife relative to the 1st substrate the 2nd main surface and the 2nd substrate the 1st major surfaces in parallel insert
Enter.Thus, knife can be inserted not to the 1st substrate and the 2nd substrate service load.Further, since need not enter to the posture of knife
Row control, therefore insertion error can also be reduced.
In addition, reference plane is set with the 2nd major surfaces in parallel of the 2nd substrate, the 2nd main surface of the 2nd substrate and the 1st master
Surface is parallel to each other, in addition, constituting the 2nd of the 1st main surface and the 2nd main surface of the 1st substrate of layered product also with the 2nd substrate
Main surface is parallel to each other.Thus, reference plane with constitute layered product the 2nd substrate the 2nd major surfaces in parallel set and with composition
Set to 1st major surfaces in parallel of the 2nd substrate of layered product and with the 1st major surfaces in parallel of the 1st substrate for constituting layered product
Set and set with the 2nd major surfaces in parallel of the 1st substrate of composition layered product.
The 2nd technical scheme of the present invention is the stripping starting point producing device according to the 1st technical scheme, wherein, moving parts
Including:Knife moving parts, it is used to make knife move along the direction with the 2nd major surfaces in parallel of the 2nd substrate;And layered product movement
Part, it is used to make layered product move along the direction with the 2nd major surfaces in parallel of the 2nd substrate, and position detection component is with reference plane
On the basis of, the position on the direction vertical with reference plane that is pointed to the object of predetermined test position detected, utilize
Knife moving parts makes knife be moved to test position, and the position of the point of a knife of knife is detected using position detection component, utilizes
Layered product moving parts makes layered product be moved to test position, and the position on the 2nd main surface of the 2nd substrate is detected.
According to the technical program, moving parts is configured to include knife moving parts and layered product moving parts.In addition, position
Detection part is configured to include position detection component.Knife is set to be moved to test position using knife moving parts, to the point of a knife of knife
Position is detected, layered product is moved to test position using layered product moving parts, to the 2nd main surface of the 2nd substrate
Detected position.Thereby, it is possible to utilize 1 position detection component to the position of the point of a knife of knife and the 2nd main surface of the 2nd substrate
Position detected.
The 3rd technical scheme of the present invention is the stripping starting point producing device according to the 2nd technical scheme, wherein, position detection
Part is made up of laser displacement gauge.
According to the technical program, position detection component is made up of laser displacement gauge.Thereby, it is possible to right in a non-contact manner
Detected the position on the position of the point of a knife of knife and the 2nd main surface of the 2nd substrate.
In addition, being used as laser displacement gauge, additionally it is possible to use two-dimensional laser displacement meter.By using two-dimensional laser displacement meter,
The position of the point of a knife of knife can be detected without moving knife, detect the position of the point of a knife of knife well so as to precision
Put.
(the sharp of the type that is detected as the laser of a light to displacement etc. is projected using common laser displacement gauge
Light displacement meter) position of the point of a knife of knife is detected in the case of, it is preferred that knife is moved and is made the point of a knife of knife through too drastic
, the laser scanning that makes the point of a knife of knife be projected from laser displacement gauge the test position of light displacement meter, i.e., so as to the point of a knife of knife
Detected position.Detect the position of the point of a knife of knife well thereby, it is possible to precision.
The 4th technical scheme of the present invention is the stripping starting point producing device according to the 1st technical scheme, wherein, position detection
Part includes:1st position detection component, it is used for at same location upper or abreast set with reference plane with reference plane
On the basis of the 1st reference plane on the position away from reference plane preset distance, to the direction vertical with the 1st reference plane of the point of a knife of knife
On position detected;2nd position detection component, it is used for at same location upper or flat with reference plane with reference plane
On the basis of being set in the 2nd reference plane on the position away from reference plane preset distance capablely, to the 2nd main surface of the 2nd substrate with
Detected position on the vertical direction of 2nd reference plane;And arithmetic unit, it is used for according to the 1st position detection component
Testing result, the testing result of the 2nd position detection component, the information of the position relative to reference plane of the 1st reference plane, Yi Ji
The information of the position for reference plane of 2 reference planes, the point of a knife of calculating knife hangs down with reference plane on the basis of reference plane
Position on the direction vertical with reference plane on the 2nd main surface of position and the 2nd substrate on straight direction.
According to the technical program, position detection component is configured to include:1st position detection component, it is used for the 1st benchmark
The position of the point of a knife of knife is detected on the basis of face;And the 2nd position detection component, it is used on the basis of the 2nd reference plane
The position on the 2nd main surface of the 2nd substrate is detected.The position of the point of a knife of knife on the basis of reference plane is according to the 1st
Put what the information of the testing result of detection part and the position relative to reference plane of the 1st reference plane was calculated, the of the 2nd substrate
The position relative to reference plane on 2 main surfaces be according to the testing result of the 2nd position detection component and the 2nd reference plane relative to
What the information of the position of reference plane was calculated.The position on the 2nd main surface of position and the 2nd substrate thereby, it is possible to the point of a knife to knife
Put while being detected.In addition, it is possible to increase the free degree of the setting for the position detected.
The 5th technical scheme of the present invention is the stripping starting point producing device according to the 4th technical scheme, wherein, the inspection of the 1st position
Survey part and the 2nd position detection component is constituted by laser displacement gauge.
According to the technical program, the 1st position detection component and the 2nd position detection component are constituted by laser displacement gauge.By
This, the position on the 2nd main surface of position that can in a non-contact manner to the point of a knife of knife and the 2nd substrate is detected.In addition,
It is used as laser displacement gauge, additionally it is possible to use two-dimensional laser displacement meter.Especially, by the way that two-dimensional laser displacement meter is used for into the 1st
Detection part is put, the position of the point of a knife of knife can be detected, be detected well so as to precision without moving knife
The position of the point of a knife of knife.
The 6th technical scheme of the present invention is the stripping starting point producing device according to the 1st technical scheme, wherein, position detection
Part includes:Position detection component, it is used on the basis of reference plane, to the position on the direction vertical with reference plane of object
Detected;And position detection component moving parts, it is used to make position detection component along the 2nd main surface with the 2nd substrate
Parallel direction movement, makes position detection component be moved to the allocation position of knife, and profit using position detection component moving parts
The position of the point of a knife of knife is detected with position detection component, makes position detection component using position detection component moving parts
The allocation position of layered product is moved to, and the position on the 2nd main surface of the 2nd substrate is detected.
According to the technical program, position detection component is configured to include:Position detection component;And position detection component is moved
Dynamic component, it is used to make the position detection component move along the direction with the 2nd major surfaces in parallel of the 2nd substrate.Examined using position
Surveying part moving parts makes position detection component be moved to the allocation position of knife and be detected to the position of the point of a knife of knife, utilizes
Position detection component moving parts makes position detection component be moved to the allocation position of layered product and to the 2nd main table of the 2nd substrate
Detected the position in face.Thereby, it is possible to be led using 1 position detection component to the position of the point of a knife of knife and the 2nd of the 2nd substrate
Detected the position on surface.
The 7th technical scheme of the present invention is the stripping starting point producing device according to the 6th technical scheme, wherein, position detection
Part is made up of laser displacement gauge.
According to the technical program, position detection component is made up of laser displacement gauge.Thereby, it is possible to right in a non-contact manner
Detected the position on the position of the point of a knife of knife and the 2nd main surface of the 2nd substrate.In addition, being used as laser displacement gauge, additionally it is possible to make
Use two-dimensional laser displacement meter.
The 8th technical scheme of the present invention is the stripping starting point producing device according to the 1st technical scheme, wherein, position detection
Part is on the basis of reference plane, to the position and the 2nd main surface of the 2nd substrate on the direction vertical with reference plane of the point of a knife of knife
The direction vertical with reference plane on position detected that position regulating member is according to the detection knot of position detection component simultaneously
Fruit is vertical with reference plane by the position on the direction vertical with reference plane of the point of a knife of knife and the 2nd main surface of the 2nd substrate
Position adjustment on direction is same position, and the position of the point of a knife of knife is adjusted according to the information of the thickness of slab of the 2nd substrate afterwards
Point of a knife that is whole and making knife is located between the 1st substrate and the 2nd substrate.
According to the technical program, position detection component is to the position of the point of a knife of knife and the position on the 2nd main surface of the 2nd substrate
Detected simultaneously.Position regulating member is according to the testing result of position detection component by the position of the point of a knife of knife and the 2nd substrate
The 2nd main surface position adjustment be same position, the position of the point of a knife of knife is entered according to the information of the thickness of slab of the 2nd substrate afterwards
Row adjusts and the point of a knife of knife is located between the 1st substrate and the 2nd substrate.Thereby, it is possible to realize more stable insertion.
The 9th technical scheme of the present invention is the stripping starting point producing device according to the 8th technical scheme, wherein, moving parts
Including:Knife moving parts, it is used to make knife move along the direction with the 2nd major surfaces in parallel of the 2nd substrate;And layered product movement
Part, it is used to make layered product move along the direction with the 2nd major surfaces in parallel of the 2nd substrate, and position detection component is used for base
On the basis of quasi- face, the position on the direction vertical with reference plane of object that is pointed in the detection line with predetermined length enters
Row detection, makes the point of a knife and layered product of knife be moved in detection line, and using position detection component to the position of the point of a knife of knife and
Detected simultaneously the position on the 2nd main surface of the 2nd substrate.
According to the technical program, moving parts includes knife moving parts and layered product moving parts, makes the point of a knife and layer of knife
Stack is moved in the detection line of 1 position detection component, and position to the point of a knife of knife and the 2nd main surface of the 2nd substrate
Detected simultaneously position.Thus, even if the absolute value precision of position detection component is insufficient, it can also be made using feedback control
2nd main surface of the point of a knife of knife and the 2nd substrate is moved to same position.
The 10th technical scheme of the present invention is the stripping starting point producing device according to the 9th technical scheme, wherein, position detection
Part is made up of two-dimensional laser displacement meter.
According to the technical program, position detection component is made up of two-dimensional laser displacement meter.Thereby, it is possible to non-contacting side
Formula is detected simultaneously to the position on the position of the point of a knife of knife and the 2nd main surface of the 2nd substrate.Can be to knife without moving knife
The position of point of a knife detected, detect the position of the point of a knife of knife well so as to precision.
The 11st technical scheme of the present invention is the stripping starting point according to the 1st technical scheme to any one of the 10th technical scheme
Producing device, wherein, the stripping starting point producing device also includes the thickness of slab test section for being used to detect the thickness of slab of the 2nd substrate
Part.
According to the technical program, in addition to the thickness of slab detection part detected for the thickness of slab to the 2nd substrate.Thus,
The thickness of slab of the 2nd substrate can be detected in the same apparatus.
The 12nd technical scheme of the present invention is the stripping starting point producing device according to the 11st technical scheme, wherein, the 2nd substrate
With translucency, thickness of slab detection part is detected using spectral interference method to the thickness of slab of the 2nd substrate.
According to the technical program, for the 2nd substrate with translucency, thickness of slab detection part is using spectral interference method to this
The thickness of slab of 2nd substrate is detected.
The 13rd technical scheme of the present invention is a kind of stripping starting point preparation method, and it is used to being inserted into knife into the of layered product
Stripping starting point is made between 1 substrate and the 2nd substrate, the layered product is by making the 2nd with the 1st main surface and the 2nd main surface
1st main surface of substrate is incorporated into the 2nd master of the 1st substrate with the 1st main surface and the 2nd main surface in the way of it can peel off
Surface is formed, wherein, the stripping starting point preparation method includes following process:Process is detected in position, to be led with the 2nd of the 2nd substrate the
On the basis of the reference plane that surface is abreast set, to the position on the direction vertical with reference plane of the point of a knife of knife and the 2nd substrate
The 2nd main surface the direction vertical with reference plane on position detected;Position adjustment process, process is detected according to position
Testing result and the 2nd substrate thickness of slab information, make layered product and knife along the direction vertical with the 2nd main surface of the 2nd substrate
Relatively move and the position of layered product and knife is adjusted, so that the point of a knife of knife is located between the 1st substrate and the 2nd substrate;
And knife insertion process, layered product and knife is relatively moved along the direction with the 2nd major surfaces in parallel of the 2nd substrate, and make knife
It is inserted between the 1st substrate of layered product and the 2nd substrate.
According to the technical program, on the basis of the reference plane set with the 2nd major surfaces in parallel of the 2nd substrate, to knife
Detected the position on the position of point of a knife and the 2nd main surface of the 2nd substrate.Then, according to the testing result and the plate of the 2nd substrate
Thick information, is adjusted to the position of layered product and knife, so that the point of a knife of knife is located between the 1st substrate and the 2nd substrate.It
Afterwards, layered product and knife is relatively moved, and knife is inserted between the 1st substrate and the 2nd substrate.
The 14th technical scheme of the present invention is the stripping starting point preparation method according to the 13rd technical scheme, wherein, in position
Detect in process, the position detected on the basis of reference plane to the position on the direction vertical with reference plane of object is examined
Survey part and be arranged on predetermined test position, knife is moved to test position, and using position detection component to the point of a knife of knife
Position is detected, layered product is moved to test position, and the position on the 2nd main surface of the 2nd substrate is detected.
According to the technical program, position detection component is arranged on to predetermined test position, by making knife be moved to the inspection
Location is put and the position of the point of a knife of knife is detected.In addition, by making layered product be moved to test position to the 2nd substrate
Detected the position on the 2nd main surface.
The 15th technical scheme of the present invention is the stripping starting point preparation method according to the 13rd technical scheme, wherein, in position
Detect in process, using the 1st position detection component, with same location upper or abreast set with reference plane with reference plane
On the basis of the 1st reference plane on the position away from reference plane preset distance, to the direction vertical with the 1st reference plane of the point of a knife of knife
On position detected, using the 2nd position detection component, with same location upper or parallel with reference plane with reference plane
Ground is set on the basis of the 2nd reference plane on the position away from reference plane preset distance, to the 2nd main surface of the 2nd substrate and the 2nd
Position on the vertical direction of reference plane is detected, according to the testing result of the 1st position detection component, the 2nd position detection part
The testing result of part, the information of the position relative to reference plane of the 1st reference plane and the 2nd reference plane relative to reference plane
Position information, on the basis of reference plane calculate knife point of a knife the direction vertical with reference plane on position and the 2nd substrate
The 2nd main surface the direction vertical with reference plane on position calculated.
According to the technical program, using the 1st position detection component, to the position of the point of a knife of knife on the basis of the 1st reference plane
Detected, using the 2nd position detection component, the position on the 2nd main surface of the 2nd substrate is carried out on the basis of the 2nd reference plane
Detection.Then, according to the testing result, the testing result of the 2nd position detection component, the 1st reference plane of the 1st position detection component
The position relative to reference plane information and the 2nd reference plane the position relative to reference plane information, to reference plane
On the basis of knife the position of point of a knife and the position on the 2nd main surface of the 2nd substrate calculated.
The 16th technical scheme of the present invention is the stripping starting point preparation method according to the 13rd technical scheme, wherein, in position
Detect in process, the position for making on the basis of reference plane, being detected to the position on the direction vertical with reference plane of object
Detection part is moved to the allocation position of knife, and the position of the point of a knife of knife is detected, and is moved to position detection component
The allocation position of layered product and the position on the 2nd main surface of the 2nd substrate is detected.
According to the technical program, by position detection component is moved to the allocation position of knife and the position of point of a knife to knife
Detected.In addition, by making position detection component be moved to the allocation position of layered product to the 2nd main surface of the 2nd substrate
Position detected.
The 17th technical scheme of the present invention provides a kind of stripping starting point preparation method, and it is used to knife being inserted into layered product
It is produced between 1st substrate and the 2nd substrate by starting point when the 1st substrate and 2 strippable substrate, the layered product is by making to have
1st main surface of the 2nd substrate on the 1st main surface and the 2nd main surface be incorporated into the way of it can peel off with the 1st main surface and
2nd main surface of the 1st substrate on the 2nd main surface is formed, wherein, the stripping starting point preparation method includes following process:1st position
Process is adjusted, on the basis of the reference plane set with the 2nd major surfaces in parallel of the 2nd substrate, to the point of a knife and reference plane of knife
Examined simultaneously position on the direction vertical with reference plane on the 2nd main surface of position and the 2nd substrate on vertical direction
Survey, and by the vertical with reference plane of the position on the direction vertical with reference plane of the point of a knife of knife and the 2nd main surface of the 2nd substrate
Direction on position adjustment be same position;2nd position adjustment process, according to knife of the information of the thickness of slab of the 2nd substrate to knife
The position of point is adjusted and the point of a knife of knife is located between the 1st substrate and the 2nd substrate;And knife insertion process, make layered product
With knife along and the direction of the 2nd major surfaces in parallel of the 2nd substrate relatively move, and make knife be inserted into the 1st substrate of layered product with
Between 2nd substrate.
According to the technical program, the position on the 2nd main surface of position and the 2nd substrate to the point of a knife of knife is examined simultaneously
Survey, and the position and the position on the 2nd main surface of the 2nd substrate to the point of a knife of knife are adjusted and make the point of a knife and the 2nd substrate of knife
The 2nd main surface be located at same position.Also, after the adjustment, according to the information of the thickness of slab of the 2nd substrate to layered product and knife
Position is adjusted and the point of a knife of knife is located between the 1st substrate and the 2nd substrate.
The effect of invention
, also can be to the position for knife insertion position of the point of a knife of knife even if not making tilt tiltedly according to the present invention
Put and detected and insert knife precision well.
Brief description of the drawings
Fig. 1 is the side major part amplification of an example of the layered product 1 for representing manufacturing process's supply to electronic device
Figure.
Fig. 2 is to represent the side major part amplification in an example of the layered product 6 of the midway making of LCD manufacturing process
Figure.
Fig. 3 is the top view for the example for representing stripping off device 10.
Fig. 4 is the side view of the stripping off device 10 shown in Fig. 3.
Fig. 5 (A) and Fig. 5 (B) are the action specification figures of stripping off device 10.
Fig. 6 (A) and Fig. 6 (B) are the action specification figures for having peeled off the stripping off device 10 after reinforcing plate 3.
Fig. 7 (A)~Fig. 7 (C) is the explanation figure illustrated to the summary of the preparation method of stripping starting point.
Fig. 8 is the general of the mechanism that the offset between position and knife insertion position for the point of a knife to knife N is detected
Sketch map.
Fig. 9 is the chart for representing the relation between the knife N amount of moving horizontally and the output of laser displacement gauge 50.
(D) of Figure 10 (A)~10 is the detecting step of the offset between the position and knife insertion position of knife N point of a knife
Explanation figure.
Figure 11 is the front view for the embodiment for representing stripping starting point producing device 100.
Figure 12 is the top view of the stripping starting point producing device 100 shown in Figure 11.
Figure 13 is the front view for the 2nd embodiment for representing stripping starting point producing device 200.
Figure 14 is that the summary of the detection method of the offset for knife insertion position of knife N point of a knife is said
Bright explanation figure.
(D) of Figure 15 (A)~15 is the stripping starting point producing device 200 using the 2nd embodiment shown in Figure 13
Make the explanation figure of the making step of stripping starting point.
(C) of Figure 16 (A)~16 is the stripping starting point producing device 200 using the 2nd embodiment shown in Figure 13
Make the explanation figure of the making step of stripping starting point.
(C) of Figure 17 (A)~17 is the stripping starting point producing device 200 using the 2nd embodiment shown in Figure 13
Make the explanation figure of the making step of stripping starting point.
(C) of Figure 18 (A)~18 is the stripping starting point producing device 200 using the 2nd embodiment shown in Figure 13
Make the explanation figure of the making step of stripping starting point.
Figure 19 is the summary construction diagram of the major part of the 3rd embodiment of stripping starting point producing device.
Figure 20 is the summary construction diagram of the major part of the 4th embodiment of stripping starting point producing device.
Figure 21 is the summary construction diagram of the major part of the 5th embodiment of stripping starting point producing device.
(C) of Figure 22 (A)~22 is the position being adjusted using the 4th stripping starting point producing device come the point of a knife to knife N
Put the explanation figure of an example of method of adjustment.
(C) of Figure 23 (A)~23 is the position being adjusted using the 4th stripping starting point producing device come the point of a knife to knife N
Put the explanation figure of an example of method of adjustment.
Figure 24 is to represent that the position of the point of a knife in the back side 3Bb of the reinforcing plate 3B to the 2nd layered product 1B position and knife N is same
The chart of one example of the output of the 2nd two-dimensional laser displacement meter 300B when Shi Jinhang is detected.
Figure 25 is the explanation figure illustrated to the production location of stripping starting point.
Embodiment
Hereinafter, embodiments of the present invention are illustrated with reference to the accompanying drawings.
In addition, it is following, with the stripping starting point producing device in the manufacturing process of electronic device using the present invention and stripping
Illustrated in case of starting point preparation method.
Electronic device in this refers to the electronic components such as display panel, solar cell, thin-film secondary battery, in display surface
Plate includes panel of LCD (LCD:Liquid Crystal Display), plasma display device (PDP:
Plasma Display Panel) and organic el display panel (OELD:Organic Electro Luminescence
Display) etc..
The summary of the manufacturing process of electronic device
First, the manufacturing process of electronic device is outlined.
Electronic device by the substrates such as glass, resin, metal formed electronic device functional layer (if for example,
LCD is then thin film transistor (TFT) (TFT), colour filter (CF) etc.) manufacture.
As the substrate used in electronic device, due to requiring lightness, the slimming of electronic device, therefore plate is used
Thick relatively thin substrate.But, the treatability of the relatively thin substrate of thickness of slab is poor.Therefore, manufactured using the relatively thin substrate of thickness of slab
In the case of electronic device, to strengthen substrate using reinforcing plate and form functional layer on the substrate after this is reinforced.Due to adding
Strong plate is to be used for the purpose for strengthening substrate, thus after functional layer is formed by reinforcing plate from strippable substrate.
Thus, it is included in the manufacturing process of this electronic device and forms function using on the strengthened substrate of reinforcing plate
The functional layer formation process and the stripping process by the strippable substrate of the active ergosphere of reinforcing plate self-forming of layer.
The stripping starting point producing device and stripping starting point preparation method of the present invention are used in stripping process.
The layered product 1 supplied to the manufacturing process of electronic device
As described above, as the substrate of manufacturing process's supply to electronic device, using the strengthened substrate of reinforced plate.
That is, reinforcing plate of being fitted on substrate and as layered product, the manufacture of the layered product to manufacture electronic device is supplied.
Fig. 1 is the side major part amplification of an example of the layered product 1 for representing manufacturing process's supply to electronic device
Figure.
The layered product 1 supplied to the manufacturing process of electronic device includes substrate (the 1st substrate) 2 and for functional layer formation
Reinforcing plate (the 2nd substrate) 3 for strengthening the substrate 2, the layered product is constituted by the way that substrate 2 and reinforcing plate 3 are bonded
1.Reinforcing plate 3 has resin bed 4 on the surface 3a as the 1st main surface, and substrate 2 is pasted with the resin bed 4.That is, base
Plate 2 is pasted using the Van der Waals force or the bonding force of resin bed 4 acted between the resin bed 4 that is arranged in reinforcing plate 3 at it
In reinforcing plate 3.
In addition, in the layered product 1 of present embodiment, reinforcing plate 3 is pasted on substrate 2 across resin bed 4, but it is also possible to structure
Turn into, reinforcing plate 3 be not pasted on substrate 2 on the premise of resin bed 4.In this case, using in substrate 2 and reinforcement
Substrate 2 and reinforcing plate 3 are bonded by Van der Waals force acted between plate 3 etc. in the way of it can peel off.
Substrate 2
Substrate 2 is that, for forming the substrate of the functional layer of electronic device (the 1st substrate), it constitutes one of electronic device
Point.
Substrate 2 has the surface 2a and the back side 2b as the 2nd main surface as the 1st main surface, is formed on the 2a of surface
Active ergosphere.Reinforcing plate 3 is glued to the back side 2b of substrate 2, to strengthen substrate 2.
Substrate 2 can be by constituting such as glass substrate, ceramic substrate, resin substrate, metal substrate, semiconductor substrate.
Among these substrates, due to the chemical resistance of glass substrate, resistance to excellent moisture permeability and linear expansion coefficient is smaller, therefore, it is adapted to
It is used as the substrate 2 of electronic device.Linear expansion coefficient is smaller, and the pattern of the functional layer formed at high temperature is more difficult in cooling
Skew.
As the glass of glass substrate, can using such as alkali-free glass, pyrex, soda-lime glass, high silica glass,
Other oxide system glass by main component of silica.It is used as silica of the oxide system glass preferably in terms of oxide
Content for the mass % of 40 mass %~90 glass.
Be used as the glass of glass substrate, it is preferred that select and apply be suitable for manufactured electronic device species, its
The glass of manufacturing process.For example, being used as the glass substrate of liquid crystal board, it is preferred to use be substantially free of the glass of alkali metal component
(alkali-free glass).
The resin of resin substrate can be crystalline resin or non-crystalline resin.It is used as crystalline resin, example
Such as, it can include as the polyamide of thermoplastic resin, polyacetals, polybutylene terephthalate (PBT), poly terephthalic acid second
Diol ester, PEN or syndiotactic polytyrene etc., and the polyphenylene sulfide as thermosetting resin can be included
Ether, polyether-ether-ketone, liquid crystal polymer, fluororesin or polyethers nitrile etc..In addition, as non-crystalline resin, for example, can include
As the makrolon of thermoplastic resin, Noryl, polycyclic hexene or polynorbornene system resin etc., and it can include
It is used as the polysulfones of thermosetting resin, polyether sulfone, polyarylate, polyamidoimide, PEI or TPI.
As the resin of resin substrate, be preferably also select and apply be suitable for manufactured electronic device species,
The resin of its manufacturing process.
The thickness of slab of substrate 2 is set according to the species of substrate 2.For example, in the case where substrate 2 is using glass substrate,
Lightness, thin plate for electronic device, the thickness of slab of substrate 2 are preferably set to below 0.7mm, are more preferably set in 0.3mm
Hereinafter, further preferably it is set in below 0.1mm.In the case where the thickness of slab of substrate 2 is in below 0.3mm, glass can be assigned
Substrate good flexibility.Moreover, can be web-like by glass substrate volume in the case where the thickness of slab of substrate 2 is in below 0.1mm.
On the other hand, in substrate 2 using in the case of glass substrate, for easily fabricated glass substrate and it is easy to carry out glass substrate
The reasons such as processing, the thickness of slab of preferable substrate 2 is in more than 0.03mm.
In addition, in the present embodiment, substrate 2 is made up of a substrate, but substrate 2 can also be made up of multiple substrates.That is,
Substrate 2 can also be made up of the layered product for being laminated multiple substrates.
Reinforcing plate 3
Reinforcing plate 3 is that it is installed on substrate 2 for strengthening the substrate of substrate 2 (the 2nd substrate), to prevent the change of substrate 2
Shape, damage, breakage etc..Because the purpose of reinforcing plate 3 is to strengthen substrate 2, therefore reinforcing plate 3 is removed from substrate 2 finally.
Reinforcing plate 3 includes the surface 3a and the back side 3b as the 2nd main surface as the 1st main surface, viscous in surface 3a sides
Post substrate 2.As described above, having resin bed 4 on the surface 3a of the reinforcing plate 3 of present embodiment, reinforcing plate 3 is across the tree
Lipid layer 4 is pasted on substrate 2.
Reinforcing plate 3 can be by the structure such as glass substrate, ceramic substrate, resin substrate, metal substrate, semiconductor substrate
Into.
The species of reinforcing plate 3 is according to the species of the substrate 2 used in the species of manufactured electronic device, the electronic device
Deng being selected.If reinforcing plate 3 and substrate 2 are identical type, the warpage produced by temperature change can be reduced, peeled off.
The difference (absolute value) of average coefficient of linear expansion between reinforcing plate 3 and substrate 2 is entered according to size shape of substrate 2 etc.
The appropriate setting of row, but preferably such as 35 × 10- 7/ DEG C below.Here, " average coefficient of linear expansion " refers at 50 DEG C~300 DEG C
Within the temperature range of average coefficient of linear expansion (Japanese Industrial Standards JIS R 3102).
The thickness of slab of reinforcing plate 3 is set in such as below 0.7mm, according to the species of reinforcing plate 3, the kind of the substrate strengthened 2
Class, thickness of slab etc. are set.In addition, the thickness of slab of reinforcing plate 3 can both might be less that the thickness of substrate 2 more than the thickness of substrate 2
Degree, but in order to strengthen substrate 2, the thickness of slab of reinforcing plate 3 is preferably in more than 0.4mm.
In addition, in the present embodiment, reinforcing plate 3 is made up of a substrate, but reinforcing plate 3 can also be by multiple substrate structures
Into.That is, reinforcing plate 3 can also be made up of the layered product for being laminated multiple substrates.
Resin bed 4
Resin bed 4 is located at the surface 3a of reinforcing plate 3, for making reinforcing plate 3 and substrate 2 closely sealed.Substrate 2 is using in itself and this
The Van der Waals force or the bonding force of resin bed 4 acted between resin bed 4 is snugly installed on reinforcing plate 3.
In order to prevent layered product 1 peeling-off at undesirable position (between resin bed 4 and reinforcing plate 3) place, with resin
Adhesion between resin bed 4 and reinforcing plate 3 is set to of a relatively high by layer 4 compared with the adhesion between substrate 2.Thus,
When carrying out strip operation, layered product 1 is peeled off between resin bed 4 and substrate 2.
The resin for constituting resin bed 4 is not particularly limited.As the resin of resin bed 4, such as acrylic compounds can be included
Resin, vistanex, polyurethane resin, polyimide resin, organic siliconresin and polyimides organic siliconresin etc..Also
Several resins can be used in mixed way.Wherein, from the viewpoint of heat resistance, fissility, preferably organic siliconresin and polyimides
Organic siliconresin.
The thickness of slab of resin bed 4 is not particularly limited, and is preferably set to 1 μm~50 μm, is more preferably set as 4 μm~20 μm.
The thickness of slab of resin bed 4 is set in more than 1 μm, so that when being mixed into bubble, foreign matter between resin bed 4 and substrate 2, Neng Gouli
The thickness of bubble, foreign matter is absorbed with the deformation of resin bed 4.On the other hand, the thickness of resin bed 4 is located at less than 50 μm, so that
The formation time of resin bed 4 can be shortened, and need not excessively use the resin of resin bed 4, thus it is more economical.
In addition, in order that reinforcing plate 3 can support whole resin bed 4, the profile of resin bed 4 is preferably and reinforcing plate 3
Profile of the profile identical or less than reinforcing plate 3.In addition, in order that resin bed 4 can be closely sealed with whole substrate 2, outside resin bed 4
Shape is preferably profile identical with the profile of substrate 2 or more than substrate 2.
In addition, in the present embodiment, resin bed 4 is constituted by one layer, but resin bed 4 can also be constituted by more than two layers.
In this case, constituting all layers of total thickness of resin bed 4 turns into the thickness of resin bed.In addition, in this case, constituting
The species of the resin of each layer can also be different.
In addition, as described above, in the layered product 1 of present embodiment, substrate 2 and reinforcing plate 3 are fitted by resin bed 4
Get up but it is also possible to be being bonded substrate 2 and reinforcing plate 3 without using the ground of resin bed 4.In this case or,
For example, by the composition surface to substrate 2 and the composition surface of reinforcing plate 3 (back side 2b of substrate 2, the surface 3a of reinforcing plate 3) respectively
Mirror ultrafinish is carried out, so as to reduce the surface roughness on mutual composition surface and be bonded substrate 2 and reinforcing plate 3.
Alternatively, it is also possible to be, resin bed 4 is substituted, is bonded substrate 2 and reinforcing plate 3 using inorganic layer, the inorganic layer
Containing from the group (WSi being made up of metal silicide, nitride and carbide2、AlN、TiN、Si3N4And SiC etc.) middle choosing
At least one selected.
It is formed with the layered product 6 of functional layer
Surface 2a via functional layer formation process in the substrate 2 of layered product 1 is formed with functional layer.
The species of functional layer is selected according to the species of electronic device.If for example, electronic device is LCD, making film brilliant
Body pipe (TFT), colour filter (CF) etc.) it is formed at surface (the 1st main surface) 2a of substrate 2., can also will be multiple as functional layer
Functional layer is stacked gradually.
As the forming method of functional layer, usual way can be used.For example, CVD (Chemical can be used
Vapor Deposition:Chemical vapor deposition) method, PVD (Physical Vapor Deposition:Physical vapour deposition (PVD))
Vapour deposition method, sputtering method of method etc. etc..Functional layer is formed as predetermined pattern using photoetching process, etching method etc..
Fig. 2 is to represent the side major part amplification in an example of the layered product 6 of the midway making of LCD manufacturing process
Figure.
As shown in Fig. 2 the layered product 6 is by reinforcing plate 3A, resin bed 4A, substrate 2A, liquid crystal layer 7, substrate 2B, resin bed 4B
And reinforcing plate 3B is so that the order is laminated and is constituted.That is, the layered product shown in Fig. 1 is symmetrically matched somebody with somebody in the way of clipping liquid crystal layer 7
Put and (configured in the mode for making the surface of mutual substrate relative) and constituted.For convenience, by a layered product (including substrate
2A, resin bed 4A, reinforcing plate 3A layered product) the 1st layered product 1A is set to, by another layered product (including substrate 2B, resin bed
4B, reinforcing plate 3B layered product) it is set to the 2nd layered product 1B.
(face of the side of liquid crystal layer 7 is leaned on the 1st layered product 1A substrate 2A surface:1st main surface) 2Aa is formed with as work(
The thin film transistor (TFT) (TFT) of ergosphere, (face of the side of liquid crystal layer 7 is leaned on the 2nd layered product 1B substrate 2B surface:1st main surface)
2Ba is formed with the colour filter (CF) as functional layer.
1st layered product 1A and the 2nd layered product 1B is by making substrate 2A surface 2Aa, substrate 2B surface 2Ba mutually coincide
And it is integrated.Thus, the 1st layered product 1A and the 2nd layered product the 1B construction of balanced configuration in the way of clipping liquid crystal layer 7 are manufactured
Layered product 6.
Layered product 6 peels off reinforcing plate 3A, 3B in stripping process, afterwards, polarizer, backlight etc. is installed, so as to manufacture
LCD as product.
In addition, in LCD manufacturing process or, forming thin film transistor (TFT) (TFT), the work(such as colour filter (CF)
Reinforcing plate 3A, 3B is peeled off after ergosphere.I.e., in the example illustrated, reinforcing plate 3A, 3B is peeled off after liquid crystal layer 7 is formed,
But it can also be configured to, peel off reinforcing plate 3A, 3B from the 1st layered product 1A and the 2nd layered product 1B before liquid crystal layer 7 is formed.
In addition, in the example of the layered product 6 shown in Fig. 2, layered product 6 is to be configured with reinforcing plate 3A, 3B on table back of the body two sides
Structure, but layered product can also only have the structure of reinforcing plate in one-sided configuration.
Stripping off device 10
Next, explanation stripping off device 10.
The structure of stripping off device 10
Fig. 3 is the top view for the example for representing stripping off device 10.In addition, Fig. 4 is the side of the stripping off device 10 shown in Fig. 3
View.
In addition, here, for convenience, to enter to the layered product 1 (particularly profile is square layered product) shown in Fig. 1
Row is illustrated in case of peeling off.
In the stripping off device 10 of present embodiment, by making reinforcing plate 3 relative to the flexible deformation of substrate 2 by reinforcing plate
3 peel off from substrate 2.Now, make to add from the corner 1D of corner 1C towards the opposite side being located on diagonal of the side of layered product 1
Strong plate 3 gradually flexible deformation, so that reinforcing plate 3 be peeled off from substrate 2.Therefore, the corner 1C courts from the side of layered product 1 are peeled off
Advanced to the corner 1D of opposite side.In addition, in this case, the boundary between the region peeled off and unstripped region is for example
Straight line is rendered as, when using the straight line as stripping forward line A, as shown in figure 3, peeling off the direction row shown in forward line A along arrow E
Enter.
Stripping off device 10, which includes adsorbing in the way of making substrate 2 not deform across the flexure strip 12 of rubber system, keeps the base
The objective table 14 of plate 2 and across the flexure strip 16 of rubber system adsorbed in the way of enabling the flexible deformation of reinforcing plate 3 holding should plus
The flex plate 18 of strong plate 3.
Objective table 14 is across the vacuum suction of flexure strip 12 and keeps surface (the 1st main surface) 2a of substrate 2.Objective table 14 is consolidated
Due to pallet 20 upper surface and be set to level.The area of objective table 14 is sufficiently above the area of substrate 2 and had along base
The shape of the profile (being in the present embodiment rectangle) of plate 2.
Flex plate 18 is across the vacuum suction of flexure strip 16 and keeps the back side (the 2nd main surface) 3b of reinforcing plate 3.Flex plate 18
Main part 18A including being capable of flexible deformation.Main part 18A area is sufficiently above the area of reinforcing plate 3 and with along adding
The shape of the profile (being in the present embodiment rectangle) of strong plate 3.
Have in main part 18A one end from the corner 1C of layered product 1 rectangles protruded in the horizontal direction towards outside
Protuberance 18B.In addition, main part 18A the other end have protruded in the horizontal direction towards outside from the corner 1D of layered product 1
Rectangle protuberance 18C.Protuberance 18B, 18C are set along the direct of travel (arrow E directions) for peeling off forward line A.
The bending stiffness of the per unit width (1mm) of flex plate 18 is preferably 1000Nmm~40000Nmm.For example,
The part for being 100mm in the width of flex plate 18, bending stiffness is 100000Nmm~4000000Nmm.By by flexibility
The bending stiffness of the per unit width (1mm) of plate 18 is set to more than 1000Nmm, can prevent flex plate 18 from adsorbing what is kept
The bending of plate (being in the present embodiment reinforcing plate 3).In addition, by by the bending of the per unit width (1mm) of flex plate 18
Rigidity is set to below 40000Nmm, and flex plate 18 can be made to adsorb the reinforcing plate 3 kept moderately flexible deformation.
As flex plate 18, except such as polyvinyl chloride (PVC can be used:Polyvinyl Chloride) resin, poly- carbon
Acid ester resin, acrylic resin, polyacetals (POM:Polyoxymethylene) beyond the resin plate of resin etc., additionally it is possible to make
Use metallic plate.
Axle 22 is provided with the horizontal direction in the protuberance 18C of flex plate 18 end.The axle 22 is in a free rotating way
It is supported on the bearing 24,24 for the upper surface for being fixed on pallet 20.Thus, flex plate 18 is set to centered on axle 22 relative to frame
Platform 20 fascinates freedom.
In addition, being equipped with the servo cylinder body 26 as driving part on flex plate 18.
Servo cylinder body 26 includes main body cylinder block 26A and piston 26B.Servo cylinder body 26 is configured to piston 26B axis in Fig. 3
Top view in be located at binder couse stack 1 corner 1C and corner 1D straight line on.That is, servo cylinder body 26 is configured to piston 26B
Stretched along the direct of travel (arrow E directions) for peeling off forward line A.
Axle 28 is provided with the horizontal direction in main body cylinder block 26A base end part.The axle 28 is supported in a free rotating way
It is fixed on the bearing 30,30 of the protuberance 18C of flex plate 18 upper surface.
In addition, piston 26B leading section is provided with axle 32 in the horizontal direction.The axle 32 be supported in a free rotating way by
It is fixed on the bearing 34,34 of the protuberance 18B of flex plate 18 upper surface.
In addition, in the present embodiment, using servo cylinder body 26 as driving part but it is also possible to be being used as drive division
Part uses linear motion device, fluid-pressure cylinder (such as air being made up of revolving servo motor and feed screw mechanism etc.
Cylinder pressure) etc..
In addition, the overall action of stripping off device 10 is uniformly controlled using control unit (not shown).
The effect of stripping off device 10
Fig. 5 (A), Fig. 5 (B) are the action specification figures of stripping off device 10.In addition, Fig. 5 (A) is represented since stripping
The state of stripping off device 10 after the scheduled time, Fig. 5 (B) represents the stripping off device 10 after just reinforcing plate 3 is peeled off
State.
The surface 2a for being installed on the substrate 2 of the layered product 1 of stripping off device 10 is held in objective table across the absorption of flexure strip 12
14.In addition, the back side 3b of reinforcing plate 3 is held in flex plate 18 across the absorption of flexure strip 16.
In original state, the piston 26B of servo cylinder body 26 is in elongation state (reference picture 4).
When the piston 26B for making servo cylinder body 26 shrinks from elongation state, protuberance 18B is acted on and draws protuberance 18B's
Power (power that protuberance 18B is drawn towards protuberance 18C).Under this force, as shown in Fig. 5 (A), flex plate 18 starts to scratch
Song deformation.
By making flex plate 18 start deflection deformation, so that the reinforcing plate 3 that absorption is held in flex plate 18 also begins to scratch
Song deformation, as a result, starting to peel off by starting point of corner 1C.
In addition, as described later, making stripping starting point on the 1C of the corner in advance.
When the piston 26B for making servo cylinder body 26 further shrinks, flex plate 18 also further carries out flexible deformation.
Here, supported because servo cylinder body 26 is rotatably mounted centered on axle 28 and axle 32 by axle 28 and axle 32, therefore,
When 18 deflection deformation of flex plate, servo cylinder body 26 is fascinated centered on axle 28.The servo cylinder body 26 fascinates and flex plate 18
Deflection deformation interlock.
So, servo cylinder body 26 gradually fascinates on one side, and the one side of flex plate 18 is from protuberance 18B sides towards protuberance 18C sides
Gradually flexible deformation, as a result, reinforcing plate 3 is gradually peeled off from the corner 1D of corner 1C towards the opposite side of side.Then, finally
As shown in Fig. 5 (B), the entire surface of reinforcing plate 3 is peeled off from substrate 2.
Fig. 6 (A), Fig. 6 (B) are the action specification figures for having peeled off the stripping off device 10 after reinforcing plate 3.In addition, Fig. 6
(A) represent to make the state that the reinforcing plate after stripping 3 is kept out of the way along vertical, Fig. 6 (B) represents to keep using output device 36
The state of reinforcing plate 3 after stripping.
When reinforcing plate 3 is completely exfoliated from substrate 2, flex plate 18 is inclined using tiling arrangement (not shown) centered on axle 22
Dynamic, flex plate 18 is located at the retreating position shown in Fig. 6 (A).
When flex plate 18 is located at retreating position, piston 26B elongations return to original state.Thus, flex plate 18 is released
Flexible deformation, shown in such as Fig. 6 (B), flex plate 18 is kept with the state vertically erected without flexure.In addition, thus, also solving
Reinforcing plate 3 is kept except the flexible deformation of reinforcing plate 3, and with the state vertically erected.
When piston 26B return action is completed, output device 36 is advanced towards reinforcing plate 3 and moved.Moreover, utilizing output
The sucker 38,38 ... that device 36 has carries out absorption holding to surface (the 1st main surface) 3a of reinforcing plate 3.Then, release by
Absorption of the flex plate 18 to the back side 3b of reinforcing plate 3, reinforcing plate 3 is exported using output device 36 from stripping off device 10.
When the output of reinforcing plate 3 is completed, then, output device (not shown) is advanced towards substrate 2 and moved.Then, it is sharp
The sucker having with the output device carries out absorption holding to the back side (the 2nd main surface) 2b of substrate 2.Afterwards, release by carrying
Absorption of the thing platform 14 to substrate 2, using output device from the output substrate 2 of stripping off device 10.
Action more than, completes the overburden operation carried out using stripping off device 10 to layered product 1.
In addition, in stripping off device 10, it is preferred that with orthogonal with the direct of travel (Fig. 3 arrow E) for peeling off forward line A
Direction on, the mode that the length of substrate 2 (reinforcing plate 3) is equal with the ratio between the length of flex plate 18 set flex plate 18
Main part 18A size.Thus, the deflection deformation amount (radius of curvature) for peeling off main part 18A when forward line A passes through turns into perseverance
It is fixed, therefore peeling action is stable.
It is further preferred, that when making the stripping forward line A of stripping forward line A changes in short-term gait of march more elongated than stripping forward line A
Stripping forward line A gait of march it is low.Thereby, it is possible to suppress to produce after firm terminate is peeled off because of the rebound effect of flex plate 18
Flex plate 18 vibration (bounce).
In addition, in the example illustrated, the substrate 2 being supported in the way of substrate 2 can not be deformed and makes the flexible deformation of reinforcing plate 3
So that reinforcing plate 3 is peeled off from substrate 2, but the reinforcing plate 3 can be also supported in the way of reinforcing plate 3 can not be deformed and makes substrate
2 flexible deformations are so that reinforcing plate 3 is peeled off from substrate 2.In this case, reinforcing plate 3 is kept to be adsorbed using objective table 14
Back side 3b and layered product 1 is installed on stripping off device 10 by the mode for adsorbing the surface 2a for keeping substrate 2 using flex plate 18.
In addition, in the example illustrated, be illustrated in case of being peeled off to the layered product 1 shown in Fig. 1, but
Layered product 6 shown in Fig. 2 also can be peeled off similarly using stripping off device 10.In this case, the 1st layered product 1A is being peeled off
Reinforcing plate 3A after, peel off the 2nd layered product 1B reinforcing plate 3B.Or, peeled off the 2nd layered product 1B reinforcing plate 3B it
Afterwards, the 1st layered product 1A reinforcing plate 3A is peeled off.
In addition, the stripping off device 10 of the structure is an example of stripping off device.Thus, it can also use other structures
Stripping off device peels off reinforcing plate 3.For example, in the stripping off device 10 of the structure, to make flex plate 18 using servo cylinder body 26
The structure of deflection deformation, but can also be, for example, as disclosed in No. 2011/024689 grade of International Publication No., to use
Multiple bars make the structure of flex plate flexible deformation.I.e., additionally it is possible to for such structure:Two-dimensionally configured on flex plate multiple
Bar, by making each bar independently stretch, so that flex plate is from a side successively flexible deformation.
The making of stripping starting point
As described above, stripping off device 10 is by making the reinforcing plate 3 of layered product 1 from one end towards the other end gradually deflection deformation
And peel off reinforcing plate 3 from substrate 2.
In the case of such peel off, when being pre-formed with gap on the point for starting to peel off, excessive power is not applied
Just reinforcing plate 3 can swimmingly be peeled off from substrate 2.
The starting point as the stripping can be made by the way that laminal knife is inserted between substrate 2 and reinforcing plate 3
Gap.That is, by the way that knife is inserted, so that substrate 2 and reinforcing plate 3 forcibly separate and are formed into the gap of stripping starting point.
The summary of the preparation method of stripping starting point
Fig. 7 is the explanation figure illustrated to the summary of the preparation method of stripping starting point.In addition, Fig. 7 (A) represents knife N
Position adjustment before state, Fig. 7 (B) represents the state after knife N position adjustment, and Fig. 7 (C) is represented after knife N is inserted
State.
As described above, stripping starting point is made by the way that the knife of thin sheet form is inserted between substrate 2 and reinforcing plate 3.
Using workbench (not shown) to the back side (the 2nd main surface) 3b progress absorption holding of such as reinforcing plate 3 by layer
The supporting of stack 1 is level.
Knife N is with the relative side of the end face (such as the end face in corner) of point of a knife and the position of the making stripping starting point of layered product 1
Formula supporting is level.
Knife N is configured to move and energy along vertical (Z-direction in figure) using position regulating member (not shown)
Enough height and positions (position in vertical) to point of a knife are adjusted.
In addition, knife N and layered product 1 are configured to utilize moving parts (not shown) (X-axis side in figure in the horizontal direction
To) on relatively move and knife N can be inserted to layered product 1.
Hereinafter, the making step of stripping starting point is outlined.
Generally, in the state of not acted, such as shown in Fig. 7 (A), knife N point of a knife is located in short transverse (Z axis
Direction) on the position that offset by from knife insertion position.
Therefore, first, as shown in Fig. 7 (B), the position in short transverse (vertical) of knife N point of a knife is entered
Row adjustment.The position adjustment of knife N point of a knife is carried out in the following way:Make knife N mobile along vertical (Z-direction in figure),
And knife N point of a knife is located at and knife insertion position identical height and position.
Here, knife insertion position is set between substrate 2 and reinforcing plate 3.In the layered product 1 of present embodiment,
There is resin bed 4 between substrate 2 and reinforcing plate 3, therefore, knife insertion position is set in the position of the resin bed 4.Especially,
Knife insertion position is set in the center on the thickness direction of resin bed 4.
After being adjusted to knife N position, such as Fig. 7 (C) shown in, make knife N flatly move towards layered product 1 and
Knife N is inserted between substrate 2 and reinforcing plate 3.Because the position of knife N point of a knife is located at and knife insertion position identical height position
Put, therefore, when making knife N flatly be moved towards layered product 1, knife N is inserted between substrate 2 and reinforcing plate 3.
By the way that knife N is inserted between substrate 2 and reinforcing plate 3, so that reinforcing plate 3 separates with substrate 2 and has made work
For the stripping starting point in gap.
Knife N is inserted into scheduled volume, and knife N is flatly retracted after such insertion and knife N is returned to initial position.
So, stripping starting point is made by the way that knife N is inserted horizontally between substrate 2 and reinforcing plate 3.
The location regulation method of knife N point of a knife
Knife N is adjusted and point of a knife is located at and the mutually level position in knife insertion position.
The position adjustment of point of a knife is carried out in the following way:Obtain the position and knife insertion position of current knife N point of a knife
Both offset in vertical, and knife N is moved (relative with offset along vertical in the way of offsetting skew
Ground is answered knife N is moved along vertical.).
Can be by the knife insertion position in the information and vertical of the position in the vertical for the point of a knife for obtaining knife N
Information obtain offset.
Here, the position in the vertical of on the basis of the reference plane of certain level, knife N point of a knife can be obtained
The information of (height away from reference plane) and using the information as the position in the vertical of knife N point of a knife information.Also, it is logical
The position detection component for using the position on the basis of reference plane, on pair direction vertical with reference plane to be detected is crossed, to knife N
The position of point of a knife detected, the information can be obtained.
On the other hand, the information of the knife insertion position in vertical can pass through on the basis of reference plane, reinforcing plate 3
The back side (the 2nd main surface) 3b vertical on position (height away from reference plane) information and the thickness of slab of reinforcing plate 3
Information (in the case where surface (the 1st main surface) 3a of reinforcing plate 3 has resin bed 4, be reinforcing plate thickness of slab in itself and including
The information of thickness of slab including resin bed 4) and obtain.That is, knife insertion position is set between substrate 2 and reinforcing plate 3 and set
(in the case where reinforcing plate 3 has resin bed 4, resin bed 4 is set in surface (the 1st main surface) 3a of reinforcing plate 3 position
Position (especially, the middle position on the thickness direction of resin bed 4).).Also, the surface 3a of reinforcing plate 3 position can
(in the case where reinforcing plate 3 has resin bed 4, it is by the thickness of slab by the back side 3b of reinforcing plate 3 position plus reinforcing plate 3
Thickness of slab (tighter say, " 1/2 " thickness of slab of the thickness of thickness of slab+resin bed of reinforcing plate) including resin bed 4) and ask
Go out.Thus, if can obtain the position on the basis of reference plane, reinforcing plate 3 back side 3b vertical information and
The information of the thickness of slab of reinforcing plate 3, then can obtain the knife insertion position in vertical.
The position detection detected by using the position on the basis of reference plane, on pair direction vertical with reference plane
Part detects come the position of the back side 3b to reinforcing plate 3, can obtain the back side of reinforcing plate 3 on the basis of reference plane
Position in 3b vertical.
In addition, reinforcing plate 3 thickness of slab (reinforcing plate 3 have resin bed 4 in the case of, be the thickness of slab of reinforcing plate in itself and
Thickness of slab including resin bed 4) it can be detected and be obtained by using predetermined thickness of slab detection part.
Thus, by using position detection component on the basis of the reference plane of level, in the vertical of knife N point of a knife
Position and reinforcing plate 3 back side 3b vertical on position detected and using thickness of slab detection part to reinforcing plate 3
Thickness of slab (being the thickness of slab of reinforcing plate 3 and the thickness of resin bed 4 in the case where the surface 3a of reinforcing plate 3 has resin bed 4) enter
Row detection, can obtain the offset between the position and knife insertion position of current knife N point of a knife.
For the summary for the mechanism for detecting offset
Fig. 8 is the general of the mechanism that the offset between position and knife insertion position for the point of a knife to knife N is detected
Sketch map.
As described above, by using position detection component to the position of knife N point of a knife and the back side 3b of reinforcing plate 3 position
Detected and the thickness of slab of reinforcing plate 3 is detected using thickness of slab detection part, so as to obtain offset.
In mechanism, as position detection component, vertical side of the known laser displacement gauge 50 to knife N point of a knife is used
Detected position on upward position and the back side 3b of reinforcing plate 3 vertical.
Laser displacement gauge 50 project the laser as detection light and to untill irradiation has the surface of object of the laser
Distance is detected (to be detected, so as to detect the distance away from reference plane to the displacement from reference plane displacement of object.).
Reference plane is set to for example horizontal face.
In addition, (for example, situations such as being made up of in reinforcing plate glass substrate on the premise of reinforcing plate 3 has translucency
Under), as thickness of slab detection part, examined using the known thickness of slab detected using spectral interference method to the thickness of slab of reinforcing plate 3
Survey meter 52.
It is anti-to tegillum stack 1 using optical splitter from light source towards the examination light of layered product 1 in thickness of slab detection meter 52
The interference light penetrated carries out light splitting, and the light after light splitting is received using light-receiving device, and reception waveform is analyzed and reinforcement is calculated
The thickness of slab of plate 3.Check that light has the wavelength of predetermined width, when receive the analysis of waveform, the intensity to checking light
Change relative to wavelength is analyzed.
In addition, being used in using the thickness of slab detection meter of spectral interference method will be to the thickness of slab of the reinforcing plate 3 with resin bed 4
Situation about being detected, in the refractive index of resin bed 4 situation different from the refractive index of substrate 2.In this case, can pair plus
The thickness of slab and the thickness of slab (thickness of thickness of slab+resin bed 4 of reinforcing plate 3) of the reinforcing plate 3 including resin bed 4 of strong plate 3 itself
Detected.
It is different in the refractive index of the refractive index of of reinforcing plate 3 itself and substrate 2 itself when reinforcing plate 3 does not have resin bed 4
In the case of or interface between reinforcing plate 3 and substrate 2 refractive index it is different in the case of (for example, in substrate 2 or strengthening
It is formed with plate 3 when film), the thickness of slab detection meter using spectral interference method can be used.Using utilizing spectral interference
In the case of the thickness of slab detection meter of method, as long as the variations in refractive index at interface between substrate 2 and reinforcing plate 3.
In the thickness of slab detection carried out using spectral interference method, there is no resin, film, bubble between reinforcing plate 3 and substrate 2
And in the case of reinforcing plate 3 and the respective refractive index identical of substrate, layered product is identified as a plate.
Meter is detected as the thickness of slab beyond spectral interference method, can use and for example be detected using the thickness of slab of triangulation
Meter.In triangulation, the thickness of slab of reinforcing plate 3 is detected using the inspection light with predetermined wavelength.To adding
There is no resin, film and reinforcing plate 3 and the thickness of slab of the respective refractive index identical layered product 1 of substrate 2 to enter between plate 3 and substrate 2 by force
When row detection, the thickness of slab detection meter using such as triangulation can be used.
In addition, in the same manner as described, layered product 1 and knife N are supported to level.Thus, the back side 3b and base of reinforcing plate 3
Quasi- face is parallel.The surface 3a of reinforcing plate 3, the back side 2b of substrate 2 and substrate 2 surface 2a are similarly parallel with reference plane.
In addition, layered product 1 and knife N are configured to using moving parts is (not shown) to distinguish in the horizontal direction relatively
It is mobile.
In addition, knife N is configured to move along vertical using position regulating member (not shown).
It is arranged on as the laser displacement gauge 50 of position detection component on layered product 1 and knife N mobile route, laser position
Project laser with moving 50 verticals of meter.In addition, in the present embodiment, making layered product 1 and knife N on the same line (in figure in X-axis)
It is mobile, laser displacement gauge 50 is arranged on the straight line with the straight line parallel.
(tighter said, the injection position of laser by the set location for making layered product 1 be moved to the laser displacement gauge 50
(test position)) so that laser is radiated at the back side (the 2nd main surface) 3b of the reinforcing plate 3.Thus, to the back side of reinforcing plate 3
Detected position (away from reference plane apart from L2) in 3b vertical.
Similarly, by making knife N be moved to the set location of laser displacement gauge 50 so that laser be radiated on point of a knife and
The position (away from reference plane apart from L1) of point of a knife is detected.
Further, since the position detection carried out using laser displacement gauge 50 is accurate detection, therefore utilizing laser position
In the case that 50 couples of knife N of shifting meter point of a knife is detected, knife N is preferably set to move and make knife N point of a knife by laser scanning.
Fig. 9 is the chart for representing the relation between the knife N amount of moving horizontally and the output of laser displacement gauge 50.
As shown in figure 9, making knife N point of a knife be swept by the laser projected from laser displacement gauge 50 by moving horizontally knife N
Retouch, the position comprising the whole knife leading section including point of a knife can be detected, so as to detect knife N point of a knife exactly
Position.
In addition, therefore, moving horizontally knife N and at least making knife N's to pass through laser position comprising the fore-end including point of a knife
Move the injection position (test position) of the laser of meter 50.
Thickness of slab detection meter 52 is arranged on the mobile route of layered product 1.By making layered product 1 be moved to thickness of slab detection meter
52 set location, so as to be detected to the thickness of slab of the reinforcing plate 3.In addition, there is resin bed 4 in the surface 3a of reinforcing plate 3
In the case of, reinforcing plate thickness of slab T1 in itself and the thickness of slab T2 including resin bed 4 are detected.
The position detected to thickness of slab is preferably to be examined with the position in the vertical to the back side 3b of reinforcing plate 3
The position identical position of survey.
Figure 10 is the explanation figure of the detecting step of the offset between the position of knife N point of a knife and knife insertion position.In addition,
Figure 10 (A) represents original state, and Figure 10 (B) represents the state detected to the position of knife N point of a knife, Figure 10 (C)
The state detected to the thickness of slab of reinforcing plate 3 is represented, Figure 10 (D) represents what the position at the back side of reinforcing plate was detected
State.
As shown in Figure 10 (A), in an initial condition, knife N and layered product 1 are respectively positioned on the detection for leaving laser displacement gauge 50
The position of the test position of position and thickness of slab detection meter 52.
First, as shown in Figure 10 (B), knife N is horizontally moved into the test position of laser displacement gauge 50, (laser is penetrated
Out position) and the position of knife N point of a knife is detected.
Now, as described above, making knife N move horizontally and knife N point of a knife is swept by the laser projected from laser displacement gauge 50
Retouch, so as to be detected to the position of knife N point of a knife.
After being detected to the position of knife N point of a knife, knife N is set to return to initial position (position of Figure 10 (A)).
Next, as Figure 10 (C) shown in, make layered product 1 be horizontally moved into thickness of slab detection meter 52 test position and
The thickness of slab of reinforcing plate 3 is detected.
For the thickness of slab of reinforcing plate 3, in the case where reinforcing plate 3 has resin bed 4, to the thickness of slab T1 of reinforcing plate in itself and
Thickness of slab T2 including resin bed 4 is detected.
On the other hand, in the case where reinforcing plate 3 does not have resin bed 4, only the thickness of slab T1 of reinforcing plate 3 is detected.
In addition, as described above, carried out using spectral interference method thickness of slab detection in, in the refractive index and base of resin bed 4
In the case that the refractive index of plate 2 is different, reinforcing plate thickness of slab T1 in itself and the thickness of slab T2 including resin bed 4 are examined
Survey.
When reinforcing plate 3 does not have resin bed 4, in the case where the refractive index of reinforcing plate 3 is different with the refractive index of substrate 2
Or the interface between reinforcing plate 3 and substrate 2 refractive index it is different in the case of, only the thickness of slab T1 of reinforcing plate 3 is examined
Survey.
After being detected to the thickness of slab of reinforcing plate 3, such as shown in Figure 10 (D), layered product 1 is set to be moved to laser displacement gauge
50 test position and the back side 3b of reinforcing plate 3 position (away from reference plane apart from L2) is detected.
Now, in the back of the body of the position identical position detected using thickness of slab detection 52 pairs of thicknesss of slab of meter to reinforcing plate 3
Detected face 3b position.
Pass through the process of above series of (including the process that is detected to the position of knife N point of a knife and to reinforcing plate 3
The thickness of slab that position detection process including the process that back side 3b position is detected and the thickness of slab to reinforcing plate 3 are detected
Detection process) and complete the letter needed for the offset for obtaining and being used to calculate between the position of knife N point of a knife and knife insertion position
Breath.Afterwards, offset is calculated according to each information of acquirement.Computing is carried out to offset in the following way.
Knife insertion position (away from reference plane apart from L3) is the back side 3b in the reinforcing plate 3 detected by laser displacement gauge 50
Position on plus reinforcing plate 3 thickness of slab obtained from position.Now, in the case where reinforcing plate 3 has resin bed 4, strengthen
Plate thickness of slab T1 in itself and the thickness of slab T2 including resin bed 4 average value ((T1+T2)/2) are the thickness of slab of reinforcing plate 3,
Position obtained from the position for the back side 3b that the thickness of slab is added to reinforcing plate 3 is knife insertion position (away from reference plane apart from L3)
(L3=L2+ (T1+T2)/2).In the case where reinforcing plate 3 does not have resin bed 4, the thickness of slab T1 of reinforcing plate in itself is added and added
Position obtained from the back side 3b of strong plate 3 position is knife insertion position (away from reference plane apart from L3) (L3=L2+T1).
Offset H is knife insertion position (away from reference plane apart from L3) with the position of current knife N point of a knife (away from reference plane
Apart from L1) difference, i.e. (H=L3-L1).
Thus, reinforcing plate 3 have resin bed 4 in the case of, using H=L3-L1=[L2+ (T1+T2)/2]-L1 come
Obtain offset H.
In addition, in the case where reinforcing plate 3 does not have resin bed 4, being obtained using H=L3-L1=(L2+T1)-L1
Offset H.
Offset H is calculated by such as upper type.Also, after offset H is calculated, according to the offset of acquisition
Information, makes knife N be moved along vertical in the way of offsetting skew, and knife N point of a knife is located at the (position adjustment of knife insertion position
The implementation of process).
Stripping starting point producing device
The structure of stripping starting point producing device
Figure 11 is the front view for the embodiment for representing stripping starting point producing device 100.In addition, Figure 12 is shown in Figure 11
Stripping starting point producing device 100 top view.
In addition, here, for convenience, being illustrated in case of being peeled off to the layered product 1 shown in Fig. 1.
Stripping starting point producing device 100 is configured to include:Workbench 112, it is used for supporting stack 1;Keeper 114,
It is used to keep knife N;Workbench driver element 116, it is used to make workbench 112 flatly move;Knife driver element 118, its
For making knife N flatly move;Position adjustment unit 120, it is used for the short transverse (vertical to knife N:Z-direction in figure)
On position be adjusted;Laser displacement gauge 50, it is used for the back side of the reinforcing plate 3 of the layered product 1 to being supported on workbench 112
Detected position in the short transverse of the point of a knife of position and knife N in 3b short transverse;Thickness of slab detection meter 52, it is used for
The thickness of slab of the reinforcing plate 3 for the layered product 1 for being supported on workbench 112 is detected;And control unit (not shown), it is used for pair
Overall action is uniformly controlled and performs various calculation process.
Workbench 112 is horizontally disposed on stage support pallet 122.Workbench 112 is in order to supporting stacking
The substantially entire surface of body 1 and with the profile corresponding with the profile of layered product 1.The profile of the layered product 1 of present embodiment is
Rectangle, therefore workbench 112 is also rectangle.The upper surface of workbench 112 is the mounting surface of layered product 1 and is configured to horizontal plane.
Layered product 1 is placed in the upper surface (mounting surface) of the workbench 112.
In addition, being provided with attracting mechanism (not shown) on workbench 112.Can be using the attracting mechanism to being placed in work
The back side (being herein the back side 3b of reinforcing plate 3) for making the layered product 1 of platform 112 carries out vacuum attraction.Thus, work will be placed in
The absorption of layered product 1 of platform 112 is held in workbench 112.
Workbench 112 is configured in the mode for making the preparing department of stripping starting point relative with knife N point of a knife.Due at this
Stripping starting point is made on the corner 1C of the layered product 1 of embodiment, therefore, so that side relative with knife N point of a knife corner 1C
Formula is configured to workbench 112.
In addition, there is breach 112A in a part for workbench 112, so as to utilize 50 pairs of supportings of laser displacement gauge
Detected the position at the back side (back side 3b of reinforcing plate 3) for the layered product 1.Breach 112A is preferably formed in stripping starting point
Making position.Therefore, there is breach in the corner at the making position of the stripping starting point equivalent to layered product 1 of workbench 112
112A。
Knife N has the writing board shape of rectangle and has the blade of acute angle on unilateral long leg point.Knife N is preferably being inserted
Enter elastic deformation during between substrate 2 and reinforcing plate 3.Knife N thickness of slab also depends on the structure of layered product 1, and knife N thickness of slab is for example
For 50 μm~600 μm.
Keeper 114 keeps knife N in the way of it can load and unload knife N.Keeper 114 is held and incited somebody to action to knife N two ends
Knife N remains level.Kept by being kept part 114, knife N is set to (set parallel with the layered product 1 for being supported on workbench 112
It is set to the surface of the back side 3b with the reinforcing plate 3 of layered product 1, the surface 3a of reinforcing plate 3, the back side 2b of substrate 2 and substrate 2
2a is parallel.).
Workbench driver element 116 constitutes layered product moving parts, and it passes through the workbench branch that makes to be provided with workbench 112
Bolster platform 122 moves horizontally and moves horizontally the layered product 1 for being supported on workbench 112.Workbench driver element 116 is configured to
Including:Main body frame 132;Track 134, it is arranged at main body frame 132;Sliding part 136, it can be slided on track 134;Spiral shell
Rasp bar 138, it is configured along track 134;And motor 140, it is used to rotate threaded rod 138.
Main body frame 132 is horizontally disposed on the pedestal 102 of stripping starting point producing device 100.
Track 134 is located at main body frame 132.Track 134 is linearly, for sliding part 136 to be guided along straight line.It is main
Body framework 132 is arranged at pedestal 102 in the way of the track 134 is flatly configured.
Sliding part 136 is moved along a straight line by being slided along track 134.Stage support pallet 122 is arranged at this
On sliding part 136.Thus, stage support pallet 122 is supported to free along the rectilinear movement of level.
Sliding part 136 has the screwed hole (not shown) parallel with track 134.Threaded rod 138 threadingly engages in the slip
The screwed hole of part 136.Thus, when rotating threaded rod 138, sliding part 136 can be corresponding with the rotation amount of the threaded rod 138
Moved along track 134 on ground.
Threaded rod 138 is abreast configured with track 134, and the both ends of threaded rod 138 are supported in a free rotating way
Located at the bearing (not shown) of main body frame 132.
Motor 140 is located at main body frame 132, and the threaded rod 138 is rotated for driving threaded rod 138.Motor 140 by
For example servo motor is constituted.
When drive motor 140 rotates threaded rod 138, sliding part 136 moves linearly along track 134.Thus, make
Stage support pallet 122 moves linearly in the horizontal direction, and makes the workbench that is arranged on the stage support pallet 122
112 move linearly in the horizontal direction.
Knife driver element 118 constitutes knife moving parts, and it is used to move horizontally the keeper 114 for keeping knife N
And move horizontally knife N.Knife driver element 118 is arranged on the pallet 104 set on pedestal 102.
Knife driver element 118 is configured to include:Main body frame 142;Track 144, it is located at main body frame 142;Sliding part
146, it is slided on track 144;Threaded rod 148, it is configured along track 144;And motor 140, it is used to make threaded rod
148 rotations.
Main body frame 142 is horizontally disposed on pallet 104.
Track 144 is located at main body frame 142.Track 144 is linearly, for sliding part 146 to be guided along straight line.It is main
Body framework 142 is arranged at pallet 104 in the way of the track 144 is flatly configured.
Sliding part 146 is moved along a straight line by being slided along track 144.Keeper 114 is by position adjustment unit
120 are arranged on the sliding part 146.Thus, keeper 114 is supported to free along the rectilinear movement of level.
Sliding part 146 has the screwed hole (not shown) parallel with track 144.Threaded rod 148 threadingly engages in the slip
The screwed hole of part 146.Thus, when rotating threaded rod 148, sliding part 146 can be corresponding with the rotation amount of the threaded rod 148
Moved along track 144 on ground.
Threaded rod 148 is abreast configured with track 144, and the both ends of threaded rod 148 are supported in a free rotating way
Located at the bearing (not shown) of main body frame 142.
Motor 140 is located at main body frame 142, and the threaded rod 148 is rotated for driving threaded rod 148.Motor 140 by
For example servo motor is constituted.
When drive motor 140 rotates threaded rod 148, sliding part 146 moves linearly along track 144.Thus, make
Keeper 114 moves linearly in the horizontal direction, and the knife N kept by the keeper 114 is moved linearly in the horizontal direction.
Here, the track 144 of knife driver element 118 with the track 134 of workbench driver element 116 turn into parallel side
Formula is set.Thus, making workbench 112 and knife N, (Figure 11 X-direction) moves linearly in same direction in the horizontal plane.Especially
It is, in the stripping starting point producing device 100 of present embodiment, as shown in figure 12, the track 144 and work of knife driver element 118
The track 134 for making platform driver element 116 is set on the same line.Thus, layered product 1 and knife N are configured to always
Line is enterprising retire it is dynamic.
Position adjustment unit 120 constitutes position regulating member, and it is used to making the keeper 114 that is kept to knife N along lead
Vertical direction (Figure 11 Z-direction) is mobile and knife N is moved along vertical.It is single that position adjustment unit 120 is arranged on knife driving
On the sliding part 146 of member 118.
Position adjustment unit 120 is configured to include:Main body frame 152;Track 154, it is located at main body frame 152;Slide
Part 156, it is slided on track 154;Threaded rod 158, it is configured along track 154;And motor 150, it is used to make screw thread
Bar 158 rotates.
Main body frame 152 is vertically arranged on the sliding part 146 of knife driver element 118 with erecting.
Track 154 is located at main body frame 152.Track 154 is linearly, for sliding part 156 to be guided along straight line.It is main
Body framework 152 is located at pallet 104 with being erected in the way of the track 154 is configured along vertical.
Sliding part 156 is moved along a straight line by being slided along track 154.Keeper 114 is installed on the sliding part
156.Thus, keeper 114 is supported to free along the rectilinear movement of vertical.That is, keeper 114 is supported to along vertical side
To lifting freely.
Sliding part 156 has the screwed hole (not shown) parallel with track 154.Threaded rod 158 threadingly engages in the slip
The screwed hole of part 156.Thus, when rotating threaded rod 158, sliding part 156 can be corresponding with the rotation amount of the threaded rod 158
Moved along track 154 on ground.
Threaded rod 158 is abreast configured with track 154, and the both ends of threaded rod 158 are supported in a free rotating way
Located at the bearing (not shown) of main body frame 152.
Motor 160 is located at main body frame 152, and the threaded rod 158 is rotated for driving threaded rod 158.Motor 160 by
For example servo motor is constituted.
When drive motor 160 rotates threaded rod 158, sliding part 156 moves linearly along track 154.Thus, make
Keeper 114 moves linearly along vertical, and the knife N that remain by the keeper 114 is moved linearly along vertical.
As described above, the workbench 112 of supporting stack 1 flatly slides movement using workbench driver element 116,
Knife N flatly slides movement using knife driver element 118.
Here, as shown in figure 12, workbench 112 is arranged along the corner for being used to make stripping starting point of layered product 1
The straight line S that the corner 1D of 1C and the opposite side on corner 1C diagonal is connected slides movement.In addition, knife N matches somebody with somebody
Put on straight line S, and knife N blade be configured to it is orthogonal relative to straight line S.Thus, the position when the point of a knife for making knife N and stacking
When the knife insertion position (between substrate 2 and reinforcing plate 3) of body 1 alignedly moves horizontally knife N, knife N can be made to be inserted into substrate 2
Between reinforcing plate 3.
Laser as detection light is projected as the laser displacement gauge 50 of position detection component and to having the laser to irradiation
Object surface untill distance detected (to enter object from the displacement of the reference plane displacement set as horizontal plane
Row detection, and detect the distance from reference plane untill the surface of object.).
Laser displacement gauge 50 is arranged on pedestal 102 by bracket (not shown), and vertical projects laser upward.Separately
Outside, laser displacement gauge 50 is arranged in the way of being moved using layered product 1 and knife N on the laser displacement gauge 50 and is used as stacking
On the straight line S of body 1 and knife N mobile route.
By making the layered product 1 for being supported on workbench 112 be moved to the set location (test position) of laser displacement gauge 50,
So as to irradiate laser to the back side (back side 3b of reinforcing plate 3) of layered product 1, detect in the back side 3b short transverse of reinforcing plate 3
Position (away from reference plane apart from L2 in vertical).
In addition, by making knife N be moved to the set location of laser displacement gauge 50 so that laser be radiated on its point of a knife and
Position (away from reference plane apart from L1 in vertical) in the short transverse of point of a knife is detected.
Thickness of slab detection meter 52 is detected using spectral interference method to the thickness of slab of reinforcing plate 3.Thus, constitute layered product 1
Reinforcing plate 3 has translucency.
Thickness of slab detection meter 52 is arranged on pedestal 102 by bracket (not shown), and vertical projects inspection light upward.Separately
Outside, thickness of slab detection meter 52 is arranged in the way of being moved using layered product 1 in terms of thickness of slab detection on 52 and is used as layered product 1
On the straight line S of mobile route.
By making the layered product 1 for being supported on workbench 112 be moved to set location (the thickness of slab detecting position of thickness of slab detection meter 52
Put), light is checked so as to be projected towards the back side (back side 3b of reinforcing plate 3) of layered product 1, thickness of slab is detected.
In addition, in the case where reinforcing plate 3 has resin bed 4, as the thickness of slab of reinforcing plate 3, to the plate of reinforcing plate in itself
Thick T1 and the thickness of slab T2 of the reinforcing plate 3 including resin bed 4 (thickness of thickness of slab+resin bed 4 of reinforcing plate 3) are detected.
In the case where reinforcing plate 3 does not have resin bed 4, the thickness of slab T1 of reinforcing plate in itself is detected.
The control unit overall action (not shown) being used for stripping starting point producing device 100 is uniformly controlled and performed
Various calculation process.Control unit is made up of such as microcomputer, its control program predetermined by performing and perform various places
Reason.Specifically, the driving of control unit control workbench driver element 116 and control the movement of workbench 112, and control knife to drive
The driving of moving cell 118 and the movement for controlling knife N.In addition, inspection of the control unit according to laser displacement gauge 50 and thickness of slab detection meter 52
Survey result to calculate the offset for knife insertion position of knife N point of a knife, according to the result of calculation control bit
The driving of adjustment unit 120 is put, implements knife N position adjustment.
The effect of stripping starting point producing device
Peeled off next, explanation is made using the stripping starting point producing device 100 of the present embodiment constituted as described above
The preparation method of starting point.
In an initial condition, knife N is located at predetermined knife position of readiness, and workbench 112 is located at predetermined workbench standby position
Put, knife N and workbench 112 are separated from each other (reference picture 11).
First, the layered product 1 of process object is arranged on workbench 112.That is, by layered product 1 be positioned in workbench 112 it
On, absorption holding is carried out to the back side of layered product 1 using workbench 112.In order to which the back side 3b of reinforcing plate 3 absorption is maintained at into work
Make on platform 112, layered product 1 is positioned on workbench 112 in the side of reinforcing plate 3 mode directed downwardly.
It is installed on by layered product 1 after workbench 112, under the control of control unit, proceeds by the system of stripping starting point
Deal with.
First, knife driver element 118 is driven and makes set location (test position) water of knife N towards laser displacement gauge 50
Move ((B) of reference picture 10) in level land.In addition, at the same time, the laser as detection light is projected from laser displacement gauge 50, start
The position of point of a knife is detected.When knife N point of a knife have passed through the set location of laser displacement gauge 50 with scheduled volume, stop knife
N movement.Thus, being swept comprising the fore-end including point of a knife to knife N using the laser projected from laser displacement gauge 50
Retouch, so as to be detected to the position (height L1) in the vertical of on the basis of reference plane, knife N point of a knife.
When the detection carried out in the position of the point of a knife to knife N is completed, stop the injection of laser.In addition, knife driver element 118
Driven, knife N is flatly moved, return to knife position of readiness ((A) of reference picture 10).
Next, the set location that workbench driver element 116 is driven and makes layered product 1 detect meter 52 towards thickness of slab
(test position of thickness of slab) is flatly moved.In the attached of the corner 1C for being used to make stripping starting point for making to be set at layered product 1
Near predetermined detection object position is located at thickness of slab when detecting the set location of meter, stop layered product 1 movement (reference picture 10
(C)).After movement is stopped, being projected from thickness of slab detection meter 52 and check light, the thickness of slab of reinforcing plate 3 is detected.
Here, in the case where the surface 3a of reinforcing plate 3 has resin bed 4, as the thickness of slab of reinforcing plate 3, utilizing thickness of slab
The thickness of slab T1 and the thickness of slab T2 including resin bed 4 of detection 52 pairs of reinforcing plates 3 of meter itself are detected.
In addition, in the case where the surface 3a of reinforcing plate 3 does not have resin bed 4, as the thickness of slab of reinforcing plate 3, utilizing plate
The thickness of slab T1 of thickness detection 52 pairs of reinforcing plates 3 of meter itself is detected.
When the detection of the thickness of slab progress to reinforcing plate 3 is completed, workbench driver element 116 is driven and makes layered product 1
Flatly moved towards the set location (test position) of laser displacement gauge 50.At the detection object position for making layered product 1
During positioned at the set location of laser displacement gauge 50, stop the movement ((D) of reference picture 10) of layered product 1.After movement is stopped, from
Laser displacement gauge 50 projects the laser as detection light, to the position (height L2) in the back side 3b of reinforcing plate 3 vertical
Detected.
Pass through above process (including the process that is detected to the position of knife N point of a knife and to the back side 3b's of reinforcing plate 3
The thickness of slab detection work that position detection process including the process that position is detected and the thickness of slab to reinforcing plate 3 are detected
Sequence) and completing to obtain is used to calculate the letter needed for the offset for knife insertion position of the position of knife N point of a knife
Breath.
It is used as the position of the control unit of the arithmetic unit point of a knife (not shown) according to the knife N detected by laser displacement gauge 50
Information (L1), the back side 3b of the same reinforcing plate 3 detected by laser displacement gauge 50 positional information (L2) and examined by thickness of slab
The thickness of slab information (T1, T2) of reinforcing plates 3 that meter 52 detects is surveyed to the position of knife N point of a knife for knife insertion position
Offset calculated.
That is, in the case where reinforcing plate 3 has resin bed 4, following formulas are utilized:H=L3-L1=[L2+ (T1+T2)/
2]-L1, is calculated offset H.
In addition, in the case where reinforcing plate 3 does not have resin bed 4, utilizing following formulas:H=L3-L1=(L2+T1)-
L1, is calculated offset H.
After calculating offset H, implement the position of adjustment knife N point of a knife according to the information of the offset calculated
The process (position adjustment process) put.That is, position adjustment unit 120 is driven and knife N is moved along vertical, so that knife N
Point of a knife be located at and knife insertion position identical height and position ((B) of reference picture 7).
After the position adjustment of knife N point of a knife is completed, implement process knife N being inserted between substrate 2 and reinforcing plate 3
(knife insertion process).That is, knife driver element 118 is driven and knife N is flatly moved towards layered product 1, and knife N is inserted into base
Between plate 2 and reinforcing plate 3.
Because knife N point of a knife is located between knife insertion position, i.e. substrate 2 and reinforcing plate 3, therefore, make knife N towards stacking
When body 1 is flatly moved, knife N point of a knife is inserted between in the corner 1C of layered product 1, substrate 2 and reinforcing plate 3.Thus,
In corner, 1C makes stripping starting point.
When knife N is inserted into scheduled volume to layered product 1, stop movement.After movement is stopped, making knife N (remote round about
The direction of absciss layer stack 1) move and return to knife position of readiness.
When knife N returns to knife position of readiness, workbench driver element 116 is driven and workbench 112 is returned to work
Make platform position of readiness.After workbench 112 returns to workbench position of readiness, the suction by workbench 112 to layered product 1 is released
It is attached, layered product 1 is reclaimed from workbench 112.
The making of stripping starting point is completed by the process of above series of.
According to the stripping starting point producing device 100 of present embodiment, due to not by knife N be obliquely inserted into substrate 2 with
Between reinforcing plate 3, therefore, stripping starting point can be made without applying excessive power to substrate 2 and reinforcing plate 3.
Further, since also not changing knife N posture to carry out the position of point of a knife to detect etc., therefore, error is produced
Factor it is less, accurately knife N can be inserted between substrate 2 and reinforcing plate 3.
In addition, in said embodiment, being said in case of being peeled off to the layered product 1 shown in Fig. 1
It is bright, but for the layered product 6 of the structure shown in Fig. 2, also can similarly carry out lift-off processing.In this case, first, with
1 layered product 1A be located at downside mode layered product 6 is positioned on workbench 112, the 1st layered product 1A substrate 2A with plus
Stripping starting point is made between strong plate 3A.Afterwards, layered product 6 is overturn and is positioned on workbench 112 (with the 2nd layered product 1B
Layered product 6 is positioned on workbench 112 by the mode positioned at downside.), in the 2nd layered product 1B substrate 2B and reinforcing plate 3B
Between make stripping starting point.
2nd embodiment of stripping starting point producing device
Structure
Figure 13 is the front view for the 2nd embodiment for representing stripping starting point producing device 200.
There is reinforcing plate 3A, 3B on the surface and the back side of layered product 6 like that in the layered product 6 of structure as shown in Figure 2
In the case of, it is necessary to enter to be about to the processing of the upset of layered product 6 in the stripping starting point producing device 100 of the embodiment.
The stripping starting point producing device 200 of present embodiment is configured to, even in the layered product 6 of structure as shown in Figure 2
In the case of there is reinforcing plate 3A, 3B on the surface and the back side of layered product 6 like that, without making the processing of the upset of layered product 6 just
Stripping starting point can be made on overlapping two layered products (the 1st layered product 1A and the 2nd layered product 1B).
In addition, for the structure common with the stripping starting point producing device 100 of the embodiment, marking common accompanying drawing
Mark and the description thereof will be omitted.
As shown in figure 13, the stripping starting point producing device 200 of present embodiment, which includes two, is used for the position to knife N point of a knife
Put detected with reinforcing plate 3A back side 3Ab, reinforcing plate 3B back side 3Bb position, swashing as position detection component
Light displacement meter 50A, 50B.It is used in addition, the stripping starting point producing device 200 of present embodiment includes two to reinforcing plate 3A, 3B
Thickness of slab detected, as thickness of slab detection part thickness of slab detection meter 52A, 52B.
Laser displacement gauge 50A, 50B are arranged on layered product 6 and knife N mobile route (on straight line S:Reference picture 12).Swash
Light displacement meter 50A, 50B are configured relative to one another, configure laser displacement gauge 50A (hereinafter referred to as the 1st laser displacements in upside
Count 50A.) vertical projects laser as detection light facing downward.In addition, laser displacement gauge 50B (following, title of the configuration in downside
Make the 2nd laser displacement gauge 50B.) vertical projects laser as detection light upward.
1st laser displacement gauge 50A is upper to being located at for the position of knife N point of a knife and the layered product 6 for being placed in workbench 112
The layered product of side, the i.e. position of the 1st layered product 1A reinforcing plate 3A back side 3Ab are detected.
In addition, the 2nd laser displacement gauge 50B is to the position of knife N point of a knife and the layered product 6 for being placed in workbench 112
Layered product, the i.e. position of the 2nd layered product 1B reinforcing plate 3B back side 3Bb positioned at downside are detected.
Thickness of slab detection meter 52A, 52B are arranged on the mobile route of layered product 6 (on straight line S:Reference picture 12).Thickness of slab is detected
Meter 52A, 52B are configured relative to one another, configure thickness of slab detection meter 52A (hereinafter referred to as the 1st thickness of slab detection meter 52A in upside.)
Vertical projects inspection light facing downward.In addition, thickness of slab detection meter 52B (hereinafter referred to as 2nd thickness of slab detection meter of the configuration in downside
52B.) vertical projects inspection light upward.
1st thickness of slab detects layered product, i.e. the 1st positioned at upside for counting 52A to being placed in the layered product 6 of workbench 112
Layered product 1A reinforcing plate 3A thickness of slab is detected.
In addition, the 2nd thickness of slab detection meter 52B to be placed in workbench 112 layered product 6 positioned at downside layered product,
That is the thickness of slab of the 2nd layered product 1B reinforcing plate 3B is detected.
The summary of the detection method of offset
Figure 14 is that the summary of the detection method of the offset relative to knife insertion position to knife N point of a knife is illustrated
Illustrate figure.
For the 1st layered product 1A positioned at upside of layered product 6, detected using the 1st laser displacement gauge 50A and the 1st thickness of slab
52A is counted to the position of knife N point of a knife relative to the 1st knife insertion position (between the 1st layered product 1A substrate 2A and reinforcing plate 3A
Position) offset detected.In addition, for the 2nd layered product 1B positioned at downside of layered product 6, using the 2nd laser position
Move meter 50B and the 2nd thickness of slab detection meter 52B to the position of knife N point of a knife relative to the 2nd knife insertion position (the 2nd layered product 1B's
Position between substrate 2B and reinforcing plate 3B) offset detected.
That is, using the 1st laser displacement gauge 50A to (being entered with the 1st reference plane using the 1st laser displacement gauge 50A to displacement
Face as benchmark during row detection) on the basis of, the position (distance away from the 1st reference plane in the vertical of knife N point of a knife
LA1) and the 1st layered product 1A reinforcing plate 3A back side 3Ab vertical on position (away from the 1st reference plane apart from LA2)
Detected, the 1st layered product 1A reinforcing plate 3A thickness of slab is detected (in reinforcing plate 3A using the 1st thickness of slab detection meter 52A
Surface 3Aa there is resin bed 4 in the case of, including the thickness of slab TA1 of reinforcing plate 3A in itself and the thickness comprising resin bed 4
Thickness of slab TA2 is detected, in the case where reinforcing plate 3A surface 3Aa does not have resin bed 4, to the thicknesss of slab of reinforcing plate 3A in itself
TA1 is detected.).Then, according to the position (away from the 1st reference plane apart from LA1) of the knife N detected point of a knife, the 1st stacking
Body 1A reinforcing plate 3A back side 3Ab position (away from the 1st reference plane apart from LA2) and the 1st layered product 1A reinforcing plate 3A
Thickness of slab the offset HA relative to the 1st knife insertion position of the position of knife N point of a knife is calculated.That is, in reinforcing plate 3A
In the case of with resin bed 4A, following formulas are utilized:HA=[LA2+ (TA1+TA2)/2]-LA1, to obtain offset HA.
In addition, in the case where reinforcing plate 3 does not have resin bed 4, utilizing following formulas:HA=(LA2+TA1)-LA1, to obtain partially
Shifting amount HA.
In addition, using the 2nd laser displacement gauge 50B to (utilizing the 2nd laser displacement gauge 50B to displacement with the 2nd reference plane
Face as benchmark when being detected) on the basis of, the position (distance away from the 2nd reference plane in the vertical of knife N point of a knife
LB1), the position (away from the 2nd reference plane apart from LB2) in the 2nd layered product 1B reinforcing plate 3B back side 3Bb vertical is entered
Row detection, is detected (reinforcing plate 3B's using the 2nd thickness of slab detection meter 52B to the 2nd layered product 1B reinforcing plate 3B thickness of slab
In the case that surface 3Ba has resin bed 4, to the thickness of slab TB1 of reinforcing plate 3B in itself and the plate including the thickness of resin bed 4
Thick TB2 is detected, in the case where reinforcing plate 3B surface 3Ba does not have resin bed 4, to the thicknesss of slab of reinforcing plate 3B in itself
TB1 is detected.).Then, according to the position (away from the 2nd reference plane apart from LB1) for the point of a knife for detecting knife N, the 2nd layered product
1B reinforcing plate 3B back side 3Bb position (away from the 2nd reference plane apart from LB2) and the 2nd layered product 1B reinforcing plate 3B's
Thickness of slab is calculated the offset HB relative to the 2nd knife insertion position of the position of knife N point of a knife.That is, have in reinforcing plate 3B
In the case of having resin bed 4B, following formulas are utilized:HB=[LB2+ (TB1+TB2)/2]-LB1, obtains offset HB.In addition,
In the case where reinforcing plate 3 does not have resin bed 4, following formulas are utilized:HB=(LB2+TB1)-LB1, obtains offset HB.
Use the preparation method of the stripping starting point of the stripping starting point producing device 200 of the 2nd embodiment
Figure 15~Figure 18 is to make stripping using the stripping starting point producing device 200 of the 2nd embodiment shown in Figure 13
The explanation figure of the making step of starting point.
In addition, Figure 15 (A) represents original state, Figure 15 (B) represents the shape detected to the position of knife N point of a knife
State, Figure 15 (C) represents the state detected to the 2nd layered product 1B reinforcing plate 3B thickness of slab, and Figure 15 (D) expression is to the
The state that 2 layered product 1B reinforcing plate 3B back side 3Bb position is detected.
In addition, Figure 16 (A) represents the shape adjusted relative to the 2nd knife insertion position to the position of knife N point of a knife
State, Figure 16 (B) represents to be inserted into knife N into the state of the 2nd knife insertion position, and Figure 16 (C) represents to be directed to the 2nd layered product 1B systems
Make the state after the completion of the making processing of stripping starting point.
In addition, Figure 17 (A) represents the state detected to the position of knife N point of a knife, Figure 17 (B) is represented to the 1st
The state that layered product 1A reinforcing plate 3A thickness of slab is detected, Figure 17 (C) is represented to the 1st layered product 1A reinforcing plate 3A's
The state that back side 3Ab position is detected.
In addition, Figure 18 (A) represents the shape adjusted relative to the 1st knife insertion position to the position of knife N point of a knife
State, Figure 18 (B) represents to be inserted into knife N into the state of the 1st knife insertion position, and Figure 18 (C) represents to be directed to the 1st layered product 1A systems
Make the state after the completion of the making processing of stripping starting point.
As shown in Figure 15~Figure 18, in the case of there is reinforcing plate 3A, 3B on the table back of the body two sides of layered product 6, insert in order
Enter knife N to make stripping starting point.Order for making stripping starting point, both first can make stripping starting point in upside, can also
Stripping starting point first is made in downside, here, to make stripping starting point, then to the layered product (the 2nd layered product 1B) of downside first
Illustrated in case of making stripping starting point to the layered product (the 1st layered product 1A) of upside.
As shown in Figure 15 (A), in an initial condition, knife N is located at predetermined knife position of readiness.In addition, being provided with stacking
The workbench 112 of body 6 is (not shown) to be located at predetermined workbench position of readiness.
First, as Figure 15 (B) shown in, make knife N towards laser displacement gauge 50 set location (test position) flatly
It is mobile.In addition, at the same time, since the 2nd laser displacement gauge 50B project laser and the position of point of a knife is detected.In knife N
Point of a knife when have passed through the 2nd laser displacement gauge 50B set location with scheduled volume, stop knife N movement.Thus, using from the 2nd
The laser that laser displacement gauge 50B is projected is scanned to knife N's comprising the fore-end including point of a knife, so as to the 2nd benchmark
Detected position (height LB1) in the vertical of on the basis of face, knife N point of a knife.
After the detection carried out to the position of knife N point of a knife is completed, stop the injection of laser.In addition, such as Figure 15 (C)
It is shown, knife N is flatly moved, return to knife position of readiness.
Next, making layered product 6 detect meter 52B set location (test position of thickness of slab) flatly towards the 2nd thickness of slab
It is mobile.As shown in Figure 15 (C), setting for meter 52B is detected making the predetermined detection object position of layered product 6 be located at the 2nd thickness of slab
During seated position, stop the movement of layered product 6.After movement is stopped, being projected from the 2nd thickness of slab detection meter 52B and check light, to the 2nd layer
Stack 1B reinforcing plate 3B thickness of slab is detected.
Here, in the case where reinforcing plate 3B surface 3Ba has resin bed 4B, as reinforcing plate 3B thickness of slab, utilizing
2nd thickness of slab detection meter 52B is detected to reinforcing plate 3B thickness of slab TB1 in itself and the thickness of slab TB2 including resin bed 4B.
In addition, in the case where reinforcing plate 3B surface 3Ba does not have resin bed 4B, being used as reinforcing plate 3B thickness of slab, profit
The thickness of slab TB1 of reinforcing plate 3B in itself are detected with the 2nd thickness of slab detection meter 52B.
When the detection carried out in the thickness of slab of the reinforcing plate 3B to the 2nd layered product 1B is completed, make layered product 6 towards the 2nd laser
Displacement meter 50B set location (test position) is flatly moved.As shown in Figure 15 (D), make the detection of layered product 6
When object position is located at the 2nd laser displacement gauge 50B set location, stop the movement of layered product 6.After movement is stopped, from the 2nd
Laser displacement gauge 50B projects laser, to the position (height in the 2nd layered product 1B reinforcing plate 3B back side 3Bb vertical
LB2) detected.
In addition, the stripping starting point that the position (reinforcing plate 3B back side 3Bb test position) turns into the 2nd layered product 1B makes
Knife N, is inserted between substrate 2B and reinforcing plate 3B by position in the position.
More than, complete the offset HB relative to the 2nd knife insertion position for the position for obtaining the point of a knife for being used to calculate knife N
Required information.
The positional information (LB1) of the control unit point of a knife (not shown) according to by the 2nd laser displacement gauge 50B knife N detected,
The same reinforcing plate 3B by the 2nd laser displacement gauge 50B the 2nd layered product 1B detected back side 3Bb positional information (LB2),
And the reinforcing plate 3B for the 2nd layered product 1B that meter 52B is detected thickness of slab information (TB1, TB2) is detected by the 2nd thickness of slab, to knife N
The offset HB relative to the 2nd knife insertion position of position of point of a knife calculated.
After offset HB is calculated, such as Figure 16 (A) shown in, to knife N point of a knife in the way of eliminating the skew
Position is adjusted.That is, knife N is made to be moved along vertical according to the offset calculated, so that knife N point of a knife is located at and the 2nd
The mutually level position in knife insertion position.
When the adjustment carried out in the position of the point of a knife to knife N is completed, shown in such as Figure 16 (B), make knife N towards layered product 6
Flatly move.Here, because knife N point of a knife is located at the 2nd knife insertion position, i.e. the 2nd layered product 1B substrate 2B and reinforcing plate
Between 3B, therefore, when making knife N flatly be moved towards layered product 6, knife N point of a knife is inserted into the 2nd layered product 1B substrate
Between 2B and reinforcing plate 3B.Thus, stripping starting point is made in the 2nd layered product 1B.
When knife N is inserted into scheduled volume to the 2nd layered product 1B, stop movement.After movement is stopped, such as Figure 16 (C) institute
Show, making knife N, (direction away from layered product 6) is mobile round about, returns to knife position of readiness.
When knife N returns to knife position of readiness, shown in such as Figure 16 (C), workbench 112 is set to return to workbench standby position
Put.
Process more than makes stripping starting point in the 2nd layered product 1B.Then, carry out making the 1st layered product 1A shelling
Making from starting point is handled.
First, as Figure 17 (A) shown in, make knife N towards laser displacement gauge 50 set location (test position) flatly
It is mobile.In addition, at the same time, projecting laser from the 1st laser displacement gauge 50A, starting to detect the position of point of a knife.In knife N
Point of a knife when have passed through the 1st laser displacement gauge 50A set location with scheduled volume, stop knife N movement.Thus, using from the 1st
The laser that laser displacement gauge 50A is projected is scanned to knife N's comprising the fore-end including point of a knife, so as to the 1st benchmark
Detected position (height LA1) in the vertical of on the basis of face, knife N point of a knife.
When the detection carried out in the position of the point of a knife to knife N is completed, stop the injection of laser.In addition, such as Figure 17 (B) institute
Show, knife N is flatly moved, return to knife position of readiness.
Next, making layered product 6 detect meter 52A set location (test position of thickness of slab) flatly towards the 1st thickness of slab
It is mobile.As shown in Figure 17 (B), setting for meter 52A is detected making the predetermined detection object position of layered product 6 be located at the 1st thickness of slab
During seated position, stop the movement of layered product 6.After movement is stopped, being projected from the 1st thickness of slab detection meter 52A and check light, to the 1st layer
Stack 1A reinforcing plate 3A thickness of slab is detected.
Here, in the case where reinforcing plate 3A surface 3Aa has resin bed 4A, as reinforcing plate 3A thickness of slab, utilizing
1st thickness of slab detection meter 52A is detected to reinforcing plate 3A thickness of slab TA1 in itself and the thickness of slab TA2 including resin bed 4A.
In addition, in the case where reinforcing plate 3A surface 3Aa does not have resin bed 4A, being used as reinforcing plate 3A thickness of slab, profit
The thickness of slab TA1 of reinforcing plate 3A in itself are detected with the 1st thickness of slab detection meter 52A.
When the detection carried out in the thickness of slab of the reinforcing plate 3A to the 1st layered product 1A is completed, make layered product 6 towards the 1st laser
Displacement meter 50A set location (test position) is flatly moved.As shown in Figure 17 (C), make the detection of layered product 6
When object position is located at the 1st laser displacement gauge 50A set location, stop the movement of layered product 6.After movement is stopped, from the 1st
Laser displacement gauge 50A projects laser, to the position (height in the 1st layered product 1A reinforcing plate 3A back side 3Ab vertical
LA2) detected.
In addition, the stripping starting point that the position (reinforcing plate 3A back side 3Ab test position) turns into the 1st layered product 1A makes
Knife N, is inserted between substrate 2A and reinforcing plate 3A by position in the position.
More than, complete the offset relative to the 1st knife insertion position for the position for obtaining the point of a knife for being used to calculate knife N
Information needed for HA.
The positional information (LA1) of the control unit point of a knife (not shown) according to by the 1st laser displacement gauge 50A knife N detected,
The same reinforcing plate 3A by the 1st laser displacement gauge 50A the 1st layered product 1A detected back side 3Ab positional information (LA2),
And the reinforcing plate 3A for the 1st layered product 1A that meter 52A is detected thickness of slab information (TA1, TA2) is detected by the 1st thickness of slab, to knife N
The offset HA relative to the 1st knife insertion position of position of point of a knife calculated.
After offset HA is calculated, such as Figure 18 (A) shown in, to knife N point of a knife in the way of eliminating the skew
Position is adjusted.That is, knife N is made to be moved along vertical according to the offset calculated, so that knife N point of a knife is located at and the 1st
The mutually level position in knife insertion position.
When the adjustment carried out in the position of the point of a knife to knife N is completed, shown in such as Figure 18 (B), make knife N towards layered product 6
Flatly move.Here, because knife N point of a knife is located at the 1st knife insertion position, i.e. the 1st layered product 1A substrate 2A and reinforcing plate
Between 3A, therefore, when making knife N flatly be moved towards layered product 6, knife N point of a knife is inserted into the 1st layered product 1A substrate
Between 2A and reinforcing plate 3A.Thus, stripping starting point is made in the 1st layered product 1A.
When knife N is inserted into scheduled volume to the 1st layered product 1A, stop movement.After movement is stopped, such as Figure 18 (C) institute
Show, making knife N, (direction away from layered product 6) is mobile round about, returns to knife position of readiness.
When knife N returns to knife position of readiness, shown in such as Figure 18 (C), workbench 112 is set to return to workbench standby position
Put.
Process more than makes stripping starting point in the 1st layered product 1A.Afterwards, release by workbench 112 to layered product 6
Absorption, layered product 6 is reclaimed from workbench 112.
By the process of above series of, complete and made for the layered product 6 that there is reinforcing plate 3A, 3B on table back of the body two sides
The operation of stripping starting point.
According to the stripping starting point producing device 200 of present embodiment, even there is reinforcing plate 3A, 3B on table back of the body two sides
Layered product 6, all stripping starting points can be just made without overturning operation of once-through operation.
In addition, in the example illustrated, so that there is the progress overburden operation of layered product 6 of reinforcing plate 3A, 3B to carrying on the back two sides in table
In case of be illustrated, but layered product 1 as shown in Figure 1 is like that, also can be by the stripping starting point system of present embodiment
Make device 200 to be applied to peel off the layered product 1 that only there is reinforcing plate 3 in one side.
In addition, in the making step, thickness of slab and the 2nd layered product 1B to the 1st layered product 1A reinforcing plate 3A plus
Strong plate 3B thickness of slab is detected respectively, but it is also possible to is configured to, is examined in the thickness of slab of the reinforcing plate 3A to the 1st layered product 1A
While survey, the 2nd layered product 1B reinforcing plate 3B thickness of slab is detected.That is, dress is made in the stripping starting point of the structure
Put in 200, because the 1st thickness of slab detection meter 52A and the 2nd thickness of slab detection meter 52B is set on the same axis, therefore, it is possible to utilize
While 1st thickness of slab detection meter 52A is detected to the 1st layered product 1A reinforcing plate 3A thickness of slab, detected and counted using the 2nd thickness of slab
52B is detected to the 2nd layered product 1B reinforcing plate 3B thickness of slab.Thus, it can also be configured to, to the 1st layered product 1A's
While reinforcing plate 3A thickness of slab is detected, the 2nd layered product 1B reinforcing plate 3B thickness of slab is detected.
3rd embodiment of stripping starting point producing device
Figure 19 is the summary construction diagram of the major part of the 3rd embodiment of stripping starting point producing device.
In the stripping starting point producing device 100,200 of the embodiment, the laser position of position detection component will be used as
Move 50 (50A, 50B) of meter and be fixedly provided in constant position as 52 (52A, 52B) of thickness of slab detection meter of thickness of slab detection part,
Layered product 1,6, knife N is set to be moved to the set location and carry out detection of the position of knife N point of a knife etc., but it is also possible to be configured to,
Laser displacement gauge 50 (50A, 50B) and thickness of slab is set to detect that 52 (52A, 52B) of meter are mobile and carry out the detection of the position of knife N point of a knife
Deng.
Figure 19, which is shown, makes laser displacement gauge 50A, 50B and thickness of slab detect that meter 52A, 52B move and carried out knife N point of a knife
One example of the structure of the detection of position etc..
1st laser displacement gauge 50A and the 1st thickness of slab detection meter 52A may be contained within the 1st moving body 310A flatly moved
(position detection component moving parts) and be set to move in the horizontal direction.
In addition, the 2nd laser displacement gauge 50B and the 2nd thickness of slab detection meter 52B may be contained within the 2nd moving body flatly moved
310B (position detection component moving parts) and be set to move in the horizontal direction.
In the case where being detected using the 1st laser displacement gauge 50A to the position of knife N point of a knife, make the 1st laser displacement
Meter 50A is horizontally moved into knife N set location, and the position of knife N point of a knife is detected.Now, the 1st laser displacement gauge is made
The laser scanning that 50A is moved and made knife N point of a knife be projected from the 1st laser displacement gauge 50A, so that the position of the point of a knife to knife N
Detected.
Similarly, the 1st layered product 1A reinforcing plate 3A back side 3Ab position is entered using the 1st laser displacement gauge 50A
In the case of row detection, the 1st laser displacement gauge 50A is set to be moved to reinforcing plate 3A detection object position, to the 1st layered product 1A's
Detected reinforcing plate 3A back side 3Ab position.
In addition, in the case where to be detected using the 2nd laser displacement gauge 50B to the position of knife N point of a knife, making the 2nd
Laser displacement gauge 50B is horizontally moved into knife N set location and the position of knife N point of a knife is detected.Now, the 2nd is made
The laser scanning that laser displacement gauge 50B is moved and made knife N point of a knife be projected from the 2nd laser displacement gauge 50B, so as to knife N's
Detected the position of point of a knife.
Similarly, the 2nd layered product 1B reinforcing plate 3B back side 3Bb position is entered using the 2nd laser displacement gauge 50B
In the case of row detection, the 2nd laser displacement gauge 50B is set to be moved to reinforcing plate 3B detection object position and to the 2nd layered product 1B
Reinforcing plate 3B back side 3Bb position detected.
In addition, in this example, be configured to, the 1st laser displacement gauge 50A and the 1st thickness of slab detection meter 52A are arranged at same the
1 moving body 310A and the 1st laser displacement gauge 50A and the 1st thickness of slab is detected that meter 52A is moved simultaneously, but the 1st laser displacement gauge 50A
Detect that meter 52A can also turn into the structure separately moved with the 1st thickness of slab.2nd laser displacement gauge 50B and the inspection of the 2nd thickness of slab
Survey meter 52B be also likewise, the 2nd laser displacement gauge 50B and the 2nd thickness of slab detection meter 52B can also turn into separately move
Structure.
In addition, so making laser displacement gauge 50 (50A, 50B) and thickness of slab detect the mobile structures of 52 (52A, 52B) of meter
In, due to layered product 1,6 and knife N need not be made to be moved to the test position and thickness of slab detection meter of laser displacement gauge 50 (50A, 50B)
52 (52A, 52B) test position, therefore, as long as at least one of layered product 1,6 and knife N are to move in the horizontal direction
Structure.That is, it is the structure that relatively can be moved in the horizontal direction between layered product 1,6 and knife N that both can be, also may be used
To be that at least one of layered product 1,6 and knife N can be moved in the horizontal direction.
In the stripping starting point producing device 100,200 of the embodiment, as make layered product 1,6 and knife N it
Between the moving parts that relatively moves, provided with workbench driver element 116 (layered product moving parts) and knife driver element 118
(knife moving parts), but in laser displacement gauge 50 (50A, 50B) and thickness of slab is detected the mobile structures of 52 (52A, 52B) of meter,
As moving parts, as long as provided with for making the moving parts of any one movement in layered product 1,6 and knife N.
In addition, in the stripping starting point producing device 100,200 of the embodiment, in order to adjust the point of a knife of knife relative to
The position of knife insertion position, is configured to, and knife N is moved along vertical, but it is also possible to be configured to, so that layered product 1,6 can
The mode supporting stack 1,6 moved along vertical is (for example, in the way of enabling workbench 112 to be moved along vertical
Supporting table 112.) and layered product 1,6 is moved along vertical, so as to adjust the point of a knife of knife relative to knife insertion position
Position.Or, it can also be configured to, both knife N and layered product 1,6 is moved along vertical, so as to adjust the point of a knife of knife
Relative to the position of knife insertion position.
4th embodiment of stripping starting point producing device
Figure 20 is the summary construction diagram of the major part of the 4th embodiment of stripping starting point producing device.
In the stripping starting point producing device 100,200 of the embodiment, it is configured to, utilizes same laser displacement gauge 50
(50A, 50B) is detected to the position of the position of knife N point of a knife and the back side 3b (3Ab, 3Bb) of reinforcing plate 3 (3A, 3B), but
It can also be configured to, as shown in figure 20, utilize positions of other laser displacement gauges 50Aa, 50Ab, 50Ba, 50Bb to knife N point of a knife
Detected the position put with the back side 3Ab, 3Bb of reinforcing plate 3A, 3B.
In fig. 20, the laser displacement gauge 50Aa (the 1st position detection component of upside) of the 1st point of a knife detection is arranged on knife
On N mobile route, it is used for when in the 1st layered product 1A making stripping starting points to predetermined reference plane (the 1st base of upside
Quasi- face) on the basis of, the position in the vertical of knife N point of a knife detected.In addition, the laser position of the 1st back side detection
Move meter 50Ab (the 2nd position detection component of upside) to be arranged on the mobile route of layered product 6, it is used for predetermined benchmark
Position on the basis of face (the 2nd reference plane of upside), the 1st layered product 1A reinforcing plate 3A back side 3Ab vertical
Detected.In addition, the laser displacement gauge 50Ba (the 1st position detection component of downside) of the 2nd point of a knife detection is arranged on knife N's
On mobile route, it is used for when in the 2nd layered product 1B making stripping starting points to predetermined reference plane (the 1st benchmark of downside
Face) on the basis of, the position in the vertical of knife N point of a knife detected.In addition, the laser displacement of the 2nd back side detection
Meter 50Bb (the 2nd position detection component of downside) is arranged on the mobile route of layered product 6, and it is used for predetermined reference plane
Position on the basis of (the 2nd reference plane of downside), the 2nd layered product 1B reinforcing plate 3B back side 3Bb vertical is entered
Row detection.
In addition, utilizing other laser displacement gauges 50Aa, 50Ab, 50Ba, 50Bb as described above to knife N point of a knife
In the case that position and reinforcing plate 3A back side 3Ab, reinforcing plate 3B back side 3Bb position are detected, implement with the described 3rd
Similarly, laser displacement gauge 50Aa, 50Ab, 50Ba, 50Bb can also be the structure moved horizontally to mode.
In addition, laser displacement gauge 50Aa, 50Ba (the 1st position detection component) of point of a knife detection reference plane (the 1st benchmark
Face) and laser displacement gauge 50Ab, 50Bb (the 2nd position detection component) reference plane (the 2nd reference plane) of back side detection may not
Mutually level position is set in, but in the case where being set in different height and positions, them are obtained in advance in height side
To the position in (vertical) poor information and calculate offset.
5th embodiment of stripping starting point producing device
Figure 21 is the summary construction diagram of the major part of the 5th embodiment of stripping starting point producing device.
In the stripping starting point producing device 100,200 of the embodiment, as the position for the point of a knife to knife N and
The position detection component that the back side 3b (3Ab, 3Bb) of reinforcing plate 3 (3A, 3B) position is detected, point light is used as using projecting
Laser laser displacement gauge 50 (50A, 50B) but it is also possible to be, using project with constant width banding laser known in
Two-dimensional laser displacement meter 300A, 300B come the position to knife N point of a knife and the back side 3b (3Ab, 3Bb) of reinforcing plate 3 (3A, 3B)
Position detected.
By using two-dimensional laser displacement meter 300A, 300B, when being detected in the position of the point of a knife to knife N, even if
Do not utilize laser to be scanned knife N point of a knife, also can precision detect well knife N point of a knife position.That is, such as Figure 20
It is shown, by projecting the banding laser as detection light from two-dimensional laser displacement meter 300B (300A) and being located at knife N point of a knife
In the range of exposures of the banding laser, the position of knife N point of a knife can be detected.Thereby, it is possible to prevent with knife N water
The evaluated error that translation is dynamic and produces.
In addition, by using two-dimensional laser displacement meter 300A, 300B, additionally it is possible to position and reinforcement to knife N point of a knife
Detected simultaneously the back side 3b (3Ab, 3Bb) of plate 3 (3A, 3B) position.Knife N point of a knife is calculated thereby, it is possible to cripetura
Time needed for the offset of position, so as to shorten the overall activity duration.
Also, due to can be to the position of knife N point of a knife and the back side 3b (3Ab, 3Bb) of reinforcing plate 3 (3A, 3B) position
Detected simultaneously, therefore, it is possible to the position adjustment for the point of a knife for carrying out knife N as follows.
Figure 22 and Figure 23 are the position adjustment sides being adjusted using the 4th stripping starting point producing device come the point of a knife to knife N
The explanation figure of one example of method.
In addition, Figure 22 (A) represents original state, Figure 22 (B) represents the thickness of slab to the 2nd layered product 1B reinforcing plate 3B
The state detected, Figure 22 (C) represents the position of the point of a knife to representing knife N and the 2nd layered product 1B reinforcing plate the 3B back of the body
The state that face 3Bb position is detected.
In addition, Figure 23 (A) represents the back side 3Bb's of the reinforcing plate 3B to the position of knife N point of a knife and the 2nd layered product 1B
The state that position is aligned, Figure 23 (B) represents that the position of the point of a knife relative to the 2nd knife insertion position to knife N is carried out
State after adjustment, Figure 23 (C) is represented knife N relative to the state that the 2nd layered product 1B is inserted.
As shown in Figure 22 (A), in an initial condition, knife N is located at predetermined knife position of readiness.In addition, being provided with stacking
The workbench 112 of body 6 is (not shown) to be located at predetermined workbench position of readiness.
First, as shown in Figure 22 (B), layered product 6 is made to detect the meter 52B set location (inspection of thickness of slab towards the 2nd thickness of slab
Location is put) flatly move.It is located at the setting position that the 2nd thickness of slab detects meter 52B making the predetermined detection object position of layered product 6
When putting, stop the movement of layered product 6.After movement is stopped, being projected from the 2nd thickness of slab detection meter 52B and check light, to the 2nd layered product
1B reinforcing plate 3B thickness of slab is detected.
Here, in the case where reinforcing plate 3B surface 3Ba has resin bed 4B, as reinforcing plate 3B thickness of slab, utilizing
2nd thickness of slab detection meter 52B is detected to reinforcing plate 3B thickness of slab TB1 in itself and the thickness of slab TB2 including resin bed 4B.
In addition, in the case where reinforcing plate 3B surface 3Ba does not have resin bed 4B, being used as reinforcing plate 3B thickness of slab, profit
The thickness of slab TB1 of reinforcing plate 3B in itself are detected with the 2nd thickness of slab detection meter 52B.
When the detection carried out in the thickness of slab of the reinforcing plate 3B to the 2nd layered product 1B is completed, make layered product 6 towards the 2nd two dimension
Laser displacement gauge 300B set location (test position) is flatly moved.As shown in Figure 22 (C), make the institute of layered product 6
State detection object position and be located in the 2nd two-dimensional laser displacement meter 300B detection range (the irradiation model of the laser projected in banding
In enclosing) when, stop the movement of layered product 6.
In addition, at the same time, making knife N towards two-dimensional laser displacement meter 300B set location (test position) flatly move
It is dynamic.As Figure 22 (C) shown in, knife N include point of a knife including fore-end be located at the 2nd two-dimensional laser displacement meter 300B inspection
When in the range of survey, stop knife N movement.
After layered product 6 and knife N movement is stopped, the laser of banding is projected from the 2nd two-dimensional laser displacement meter 300B, to the
Detected simultaneously the position of the point of a knife of position and knife N in 2 layered product 1B reinforcing plate 3B back side 3Bb vertical.
Figure 24 is to represent that the position of the point of a knife in the back side 3Bb of the reinforcing plate 3B to the 2nd layered product 1B position and knife N is same
The chart of one example of the output of the 2nd two-dimensional laser displacement meter 300B when Shi Jinhang is detected.
As shown in figure 24, can be to reinforcing plate by making layered product 6 and knife N point of a knife be located in the range of exposures of laser
3B back side 3Bb position and the position of knife N point of a knife are detected simultaneously.
As shown in Figure 23 (A), control unit is (not shown) to be obtained by adding that the 2nd two-dimensional laser displacement meter 300B is detected
The information of the position of the information of strong plate 3B back side 3Bb position and knife N point of a knife simultaneously makes knife N be moved along vertical, so that
Knife N point of a knife is located at the back side 3Bb identicals height and position (the 1st position adjustment process) with reinforcing plate 3B.
After knife N is moved, control unit makes knife N be moved and adding for being detected by the 2nd thickness of slab detection meter 52B along vertical
The corresponding amount (the 2nd position adjustment process) of strong plate 3B thickness of slab.
Here, in the case where reinforcing plate 3B surface 3Ba has resin bed 4, making knife N move (T1+ along vertical
T2)/2。
In addition, in the case where reinforcing plate 3B surface 3Ba does not have resin bed 4, making knife N move T1 along vertical
(knife insertion process).
Thus, as shown in Figure 23 (B), knife N point of a knife is made to be located at the 2nd knife insertion position.
Afterwards, as shown in Figure 24 (C), knife N is made flatly to be moved towards layered product 6.Thus, knife N point of a knife is inserted
To between the 2nd layered product 1B substrate 2B and reinforcing plate 3B, so as to make stripping starting point in the 2nd layered product 1B.
Inserted by knife N to the 2nd layered product 1B after scheduled volume, stop movement.Stop it is mobile after, make knife N to opposite
Direction (direction away from layered product 6) is mobile, returns to knife position of readiness.
For the layered product (the 1st layered product 1A) of opposite side, the position that knife N point of a knife is also carried out with identical step is adjusted
It is whole, to make stripping starting point.
As described above, by using two-dimensional laser displacement meter 300A, 300B the position to knife N point of a knife and reinforcing plate 3
The back side 3b (3Ab, 3Bb) of (3A, 3B) position is detected simultaneously, can carry out having used the knife N of so-called feedback control
Position adjustment.Thus, even if the absolute value precision of laser displacement gauge is insufficient, it can also move using feedback control knife N
To the height and position equal with the back side of reinforcing plate, knife N can be stably inserted into.
If in addition, can simultaneously be detected to the position of knife N point of a knife and reinforcing plate 3B back side 3Bb position,
It can just implement to have used the knife N of feedback control position adjustment, it is thus possible to enough use beyond two-dimensional laser displacement meter
Position detection component implement to have used knife N that the feedback control is carried out position adjustment.Thus, it can also be configured to,
For example, being detected using other positions detection part to the position of the position of knife N point of a knife and reinforcing plate 3B back side 3Bb
(as the structure that can be simultaneously detected to the position of knife N point of a knife and reinforcing plate 3B back side 3Bb position, for example, sharp
The position of knife N point of a knife is detected with the 1st laser displacement gauge (the 1st position detection component), the 2nd laser displacement gauge is utilized
(the 2nd position detection component) is detected to reinforcing plate 3B back side 3Bb position.).
The other embodiment of stripping starting point producing device
In a series of embodiment, it is configured to, reinforcing plate 3 (3A, 3B) is assembled to stripping starting point producing device
Thickness of slab detection part, but it is also possible to be configured to, detected and obtained the thickness of slab of reinforcing plate 3 to the thickness of slab of reinforcing plate 3 in advance.
In this case, it need not detect and count as the thickness of slab of thickness of slab detection part in stripping starting point producing device.
In addition, in the case where being detected in advance to the thickness of slab of reinforcing plate 3, it is right outside stripping starting point producing device
Thickness of slab is detected, in such a situation it is preferred that position (the detection object portion of the back side 3b (3Ab, 3Bb) in detection reinforcing plate 3
Position) or neighbouring position in the position thickness of slab is detected.
In addition, there is reinforcing plate 3A, 3B and to it on the table back of the body two sides of layered product 1 like that in layered product 6 as shown in Figure 2
In the case that two sides are peeled off, it is preferred that a stripping starting point is made in a corner, in the diagonal positioned at the corner
On corner make another stripping starting point.
Figure 25 is the explanation figure illustrated to the production location of stripping starting point.
As shown in figure 25, in the case where there is the layered product 6 of reinforcing plate 3A, 3B for table back of the body two sides, at the angle of layered product 6
Portion 6C makes the 1st layered product 1A stripping starting point (the 1st stripping starting point), the corner 6D systems on the diagonal positioned at corner 6C
Make the 2nd layered product 1B stripping starting point (the 2nd stripping starting point).
In this case, overburden operation is also the stripping of the reinforcing plate 3A similarly, for the 1st layered product 1A, makes reinforcement
Plate 3A peels off reinforcing plate 3A from corner 6C towards corner 6D deflection deformations, for the 2nd layered product 1B reinforcing plate 3B stripping
From making reinforcing plate 3B peel off reinforcing plate 3B from corner 6D towards corner 6C deflection deformations.
In addition, in said embodiment, for convenience, make layered product is shaped as rectangle, in particular square, but makees
For peel off object layered product shape and be not particularly limited.In addition, the production location of stripping starting point is also not particularly limited.
But, in the case where layered product is rectangle, preferably make stripping starting point in corner.
In addition, for the peeling direction (direction for making reinforcing plate deflection deformation) when reinforcing plate is peeled off, in rectangle
In the case that the corner of layered product makes stripping starting point, preferably the peeling direction is set as relative on the orthogonal each side in corner
In 45 degree of directions (being diagonal in the case where the profile of layered product is square).
In addition, in the stripping starting point producing device of the embodiment, layered product and knife both of which are configured to
Move in the horizontal direction, as long as but layered product and knife are the structure that can relatively be moved horizontally.That is, as long as being to make
At least one of layered product and knife for being supported parallel to each other are mobile and knife is inserted into the substrate and reinforcing plate of layered product
Between structure.Thus, layered product can also be fixed.
In addition, in said embodiment, being configured to enable layered product diagonally to move horizontally, but make stacking
Direction that body is moved horizontally simultaneously is not particularly limited.As long as that finally layered product can be made to be moved to predetermined stripping starting point system
Make the structure of position (position for being inserted and being made stripping starting point by knife).
In addition, in said embodiment, being configured to be utilized respectively at making of the different devices to implement stripping starting point
Reason and actual lift-off processing, but it is also possible to be configured to, implement to be fabricated into actual stripping from stripping starting point using 1 table apparatus
From processing.This can be for example, by the stripping off device 10 that is assembled in the stripping starting point producing device 100 shown in Figure 11 shown in Fig. 3
To realize.In this case, substitute workbench 112 and using objective table 14 come supporting stack.
In addition, in the case where stripping starting point producing device integratedly is assembled in into stripping off device, can continuously carry out
Actual lift-off processing is fabricated into from stripping starting point.In this case or, for example, with the state after knife is inserted
Start lift-off processing.
In addition, in said embodiment, carried out as the position of the point of a knife to knife N and the position at the back side of reinforcing plate 3
The position detection component of detection, has used laser displacement gauge, but position detection component is not limited to this.If for predetermined
Reference plane (reference plane abreast set with the back side 3b of reinforcing plate 3) on the basis of, be pointed to the thing of predetermined test position
The part that position on the direction vertical with the reference plane of body is detected (is especially detected in a non-contact manner
Part), then it can also use other detection parts.
In addition, for two-dimensional laser displacement meter, similarly, as long as identical detection can be carried out (with predetermined reference plane
On the basis of, the position on the direction vertical with reference plane for the object being pointed in the detection line with predetermined length is examined
Survey), then it can use other detection parts.
In addition, in said embodiment, the thickness of slab detection part detected as the thickness of slab to reinforcing plate is used
The thickness of slab detected using spectral interference method to thickness of slab detects meter, but it is also possible to use the thickness of slab detection part of other structures.
Alternatively, it is also possible to be, implement the detection of the thickness of slab of reinforcing plate before by substrate and reinforcing plate laminating.
Illustrate the present invention with reference to detailed or specific embodiment, but those skilled in the art it is clear that, Neng Gou
Apply various amendments, change on the premise of without departing from the scope and spirit of the present invention.
The application goes out to be willing to 2013-138223 based on Japanese Patent filed in 1 day July in 2013, and its content is used as with reference to compiling
Enter into this specification.
Description of reference numerals
N, knife;1st, layered product;1A, the 1st layered product;1B, the 2nd layered product;1C, layered product corner;1D, layered product angle
Portion;2nd, substrate;2a, substrate surface;2b, the substrate back side;2A, substrate;2Aa, substrate surface;2Ab, the substrate back side;
2B, substrate;2Ba, substrate surface;2Bb, the substrate back side;3rd, reinforcing plate;3a, reinforcing plate surface;3b, the reinforcing plate back of the body
Face;3A, reinforcing plate;3Aa, reinforcing plate surface;3Ab, the reinforcing plate back side;3B, reinforcing plate;3Ba, reinforcing plate surface;
3Bb, the reinforcing plate back side;4th, resin bed;4A, resin bed;4B, resin bed;6th, layered product;6C, layered product corner;6D, layer
The corner of stack;7th, liquid crystal layer;10th, stripping off device;12nd, flexure strip;14th, objective table;16th, flexure strip;18th, flex plate;18A、
The main part of flex plate;18B, flex plate protuberance;18C, flex plate protuberance;20th, pallet;22nd, axle;24th, bearing;
26th, servo cylinder body;26A, servo cylinder body main body cylinder block;26B, servo cylinder body piston;28th, axle;30th, bearing;32nd, axle;34、
Bearing;36th, output device;38th, sucker;50th, laser displacement gauge;50A, the 1st laser displacement gauge;50B, the 2nd laser displacement gauge;
50Aa, the laser displacement gauge of the 1st point of a knife detection;50Ab, the laser displacement gauge of the 1st back side detection;50Ba, the inspection of the 2nd point of a knife
The laser displacement gauge of survey;50Bb, the laser displacement gauge of the 2nd back side detection;52nd, thickness of slab detection meter;52A, the detection of the 1st thickness of slab
Meter;52B, the 2nd thickness of slab detection meter;100th, stripping starting point producing device;102nd, pedestal;104th, pallet;112nd, workbench;114th, protect
Gripping member;116th, workbench driver element;118th, knife driver element;120th, position adjustment unit;122nd, stage support pallet;
132nd, the main body frame of workbench driver element;134th, the track of workbench driver element;136th, the cunning of workbench driver element
Moving part;138th, the threaded rod of workbench driver element;140th, the motor of workbench driver element;142nd, the main body of knife driver element
Framework;144th, the track of knife driver element;146th, the sliding part of knife driver element;148th, the threaded rod of knife driver element;150、
The motor of knife driver element;152nd, the main body frame of position adjustment unit;154th, the track of position adjustment unit;156th, position is adjusted
The sliding part of whole unit;158th, the threaded rod of position adjustment unit;160th, the motor of position adjustment unit;200th, stripping starting point system
Make device;300A, the 1st two-dimensional laser displacement meter;300B, the 2nd two-dimensional laser displacement meter;310A, the 1st moving body;310B, the 2nd
Moving body.
Claims (17)
1. a kind of stripping starting point producing device, it is used to knife is inserted between the 1st substrate of layered product and the 2nd substrate and made
Stripping starting point, the layered product by make the 1st main surface of the 2nd substrate with the 1st main surface and the 2nd main surface with
The 2nd main surface that the mode that can be peeled off is incorporated into the 1st substrate with the 1st main surface and the 2nd main surface is formed,
Wherein,
The stripping starting point producing device includes:
Moving parts, it is used to make the layered product and the knife along the side with the 2nd major surfaces in parallel of the 2nd substrate
The knife is set to be inserted between the 1st substrate of the layered product and the 2nd substrate to relatively moving;
Position detection component, it is right on the basis of the reference plane set with the 2nd major surfaces in parallel of the 2nd substrate
The 2nd main surface of position and the 2nd substrate on the direction vertical with the reference plane of the point of a knife of the knife with
Detected position on the vertical direction of the reference plane;And position regulating member, it is according to the position detection component
Testing result and the 2nd substrate thickness of slab, make the layered product and the knife along and the 2nd substrate the 2nd master
The vertical direction in surface is relatively moved and the position of the layered product and the knife is adjusted, so that the point of a knife of the knife
Between the 1st substrate and the 2nd substrate.
2. stripping starting point producing device according to claim 1, wherein,
The moving parts includes:
Knife moving parts, it is used to make the knife move along the direction with the 2nd major surfaces in parallel of the 2nd substrate;With
And
Layered product moving parts, it is used to make the layered product along the direction with the 2nd major surfaces in parallel of the 2nd substrate
It is mobile,
The position detection component on the basis of the reference plane, be pointed to predetermined test position object with the base
Position on the vertical direction in quasi- face detected,
The knife is set to be moved to the test position using the knife moving parts, and using the position detection component to described
The position of the point of a knife of knife detected,
The layered product is set to be moved to the test position using the layered product moving parts, and to the institute of the 2nd substrate
Detected the position for stating the 2nd main surface.
3. stripping starting point producing device according to claim 2, wherein,
The position detection component is made up of laser displacement gauge.
4. stripping starting point producing device according to claim 1, wherein,
The position detection component includes:
1st position detection component, its be used for with the reference plane it is at same location upper or with the reference plane abreast
On the basis of being set in the 1st reference plane on the position away from the reference plane preset distance, to the point of a knife of the knife and the described 1st
Detected position on the vertical direction of reference plane;
2nd position detection component, its be used for with the reference plane it is at same location upper or with the reference plane abreast
On the basis of being set in the 2nd reference plane on the position away from the reference plane preset distance, to the 2nd master of the 2nd substrate
Detected position on the direction vertical with the 2nd reference plane on surface;And
Arithmetic unit, it is used for testing result according to the 1st position detection component, the inspection of the 2nd position detection component
Survey result, the information of the position relative to the reference plane of the 1st reference plane and the 2nd reference plane relative to
The information of the position of the reference plane, calculated on the basis of the reference plane knife point of a knife it is vertical with the reference plane
Position on the direction vertical with the reference plane on the 2nd main surface of position and the 2nd substrate on direction.
5. stripping starting point producing device according to claim 4, wherein,
1st position detection component and the 2nd position detection component are constituted by laser displacement gauge.
6. stripping starting point producing device according to claim 1, wherein,
Also include position detection component moving parts, the position detection component moving parts makes the position detection component edge and institute
The direction movement of the 2nd major surfaces in parallel of the 2nd substrate is stated,
The position detection component is on the basis of the reference plane, to the position on the direction vertical with the reference plane of object
Detected,
The position detection component is set to be moved to the allocation position of the knife, and profit using the position detection component moving parts
The position of the point of a knife of the knife is detected with the position detection component,
The position detection component is set to be moved to the allocation position of the layered product using the position detection component moving parts,
And the position on the 2nd main surface of the 2nd substrate is detected.
7. stripping starting point producing device according to claim 6, wherein,
The position detection component is made up of laser displacement gauge.
8. stripping starting point producing device according to claim 1, wherein,
The position detection component is on the basis of the reference plane, to the direction vertical with the reference plane of the point of a knife of the knife
On position and the 2nd substrate the 2nd main surface the direction vertical with the reference plane on position carry out simultaneously
Detection,
The position regulating member is according to the testing result of the position detection component by the point of a knife of the knife and the benchmark
On the direction vertical with the reference plane on the 2nd main surface of position and the 2nd substrate on the vertical direction in face
Position adjustment is same position, and the position of the point of a knife of the knife is adjusted according to the information of the thickness of slab of the 2nd substrate afterwards
Point of a knife that is whole and making the knife is located between the 1st substrate and the 2nd substrate.
9. stripping starting point producing device according to claim 8, wherein,
The moving parts includes:
Knife moving parts, it is used to make the knife move along the direction with the 2nd major surfaces in parallel of the 2nd substrate;With
And
Layered product moving parts, it is used to make the layered product along the direction with the 2nd major surfaces in parallel of the 2nd substrate
It is mobile,
The object that the position detection component is used on the basis of the reference plane, is pointed in the detection line with predetermined length
The position on the direction vertical with the reference plane detected,
The point of a knife and the layered product of the knife is set to be moved in the detection line, and using the position detection component to described
Detected simultaneously the position on the position of the point of a knife of knife and the 2nd main surface of the 2nd substrate.
10. stripping starting point producing device according to claim 9, wherein,
The position detection component is made up of two-dimensional laser displacement meter.
11. stripping starting point producing device according to any one of claim 1 to 10, wherein,
The stripping starting point producing device also includes the thickness of slab detection part for being used to detect the thickness of slab of the 2nd substrate.
12. stripping starting point producing device according to claim 11, wherein,
2nd substrate has translucency,
The thickness of slab detection part is detected using spectral interference method to the thickness of slab of the 2nd substrate.
13. a kind of stripping starting point preparation method, it is used to knife is inserted between the 1st substrate of layered product and the 2nd substrate and made
Make stripping starting point, the layered product is by making the 1st main surface of the 2nd substrate with the 1st main surface and the 2nd main surface
Be incorporated into the way of it can peel off the 1st substrate with the 1st main surface and the 2nd main surface the 2nd main surface and
Into, wherein,
The stripping starting point preparation method includes following process:
Process is detected in position, on the basis of the reference plane set with the 2nd major surfaces in parallel of the 2nd substrate, to institute
The 2nd main surface of position and the 2nd substrate on the direction vertical with the reference plane for the point of a knife for stating knife with institute
Detected the position stated on the vertical direction of reference plane;
Position adjustment process, the information of the testing result of process and the thickness of slab of the 2nd substrate is detected according to the position, makes institute
State layered product and the knife along the direction vertical with the 2nd main surface of the 2nd substrate relatively move and to the layer
The position of stack and the knife is adjusted, so that the point of a knife of the knife is located between the 1st substrate and the 2nd substrate;
And
Knife inserts process, makes the layered product and the knife along the direction phase with the 2nd major surfaces in parallel of the 2nd substrate
Move over the ground, and the knife is inserted between the 1st substrate of the layered product and the 2nd substrate.
14. stripping starting point preparation method according to claim 13, wherein,
In position detection process,
The position that will be detected on the basis of the reference plane to the position on the direction vertical with the reference plane of object
Detection part is arranged on predetermined test position,
The knife is moved to the test position, and the position of the point of a knife of the knife is carried out using the position detection component
Detection,
The layered product is moved to the test position, the position on the 2nd main surface of the 2nd substrate is examined
Survey.
15. stripping starting point preparation method according to claim 13, wherein,
In position detection process,
Using the 1st position detection component, with same location upper or abreast set with the reference plane with the reference plane
It is scheduled on the basis of the 1st reference plane on the position away from the reference plane preset distance, to the point of a knife of the knife and the 1st base
Position on the vertical direction in quasi- face detected,
Using the 2nd position detection component, with same location upper or abreast set with the reference plane with the reference plane
It is scheduled on the basis of the 2nd reference plane on the position away from the reference plane preset distance, to the 2nd main table of the 2nd substrate
Position on the direction vertical with the 2nd reference plane in face detected,
According to the testing result, the testing result of the 2nd position detection component, the 1st base of the 1st position detection component
The position relative to the reference plane of the information of the position relative to the reference plane in quasi- face and the 2nd reference plane
Information, position and institute on the direction vertical with the reference plane for the point of a knife that the knife is calculated on the basis of the reference plane
Position on the direction vertical with the reference plane on the 2nd main surface for stating the 2nd substrate.
16. stripping starting point preparation method according to claim 13, wherein,
In position detection process,
The position for making on the basis of the reference plane, being detected to the position on the direction vertical with the reference plane of object
Detection part is moved to the allocation position of the knife, and the position of the point of a knife of the knife is detected, and examines the position
Part is surveyed to be moved to the allocation position of the layered product and detect the position on the 2nd main surface of the 2nd substrate.
17. a kind of stripping starting point preparation method, it is used to knife is inserted between the 1st substrate of layered product and the 2nd substrate and made
Make starting point when by the 1st substrate and 2 strippable substrate, the layered product is by making have the 1st main surface and the 2nd master
The 1st main surface of 2nd substrate on surface is incorporated into the way of it can peel off with the 1st main surface and the 2nd main table
The 2nd main surface of 1st substrate in face is formed, wherein,
The stripping starting point preparation method includes following process:
1st position adjustment process is right on the basis of the reference plane set with the 2nd major surfaces in parallel of the 2nd substrate
The 2nd main surface of position and the 2nd substrate on the direction vertical with the reference plane of the point of a knife of the knife with
Position on the vertical direction of the reference plane detected simultaneously, and the point of a knife of the knife is vertical with the reference plane
Position adjustment on the direction vertical with the reference plane on the 2nd main surface of position and the 2nd substrate on direction
For same position;
2nd position adjustment process, the position of the point of a knife of the knife is adjusted according to the information of the thickness of slab of the 2nd substrate and
The point of a knife of the knife is set to be located between the 1st substrate and the 2nd substrate;And
Knife inserts process, makes the layered product and the knife along the direction phase with the 2nd major surfaces in parallel of the 2nd substrate
Move over the ground, and the knife is inserted between the 1st substrate of the layered product and the 2nd substrate.
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JP6436389B2 (en) * | 2015-02-18 | 2018-12-12 | Agc株式会社 | Peel start part creating apparatus, peel start part creating method, and electronic device manufacturing method |
CN105047589B (en) * | 2015-07-08 | 2018-05-29 | 浙江中纳晶微电子科技有限公司 | Wafer solution bonding apparatus |
JP6519951B2 (en) * | 2015-07-24 | 2019-05-29 | 日本電気硝子株式会社 | METHOD FOR MANUFACTURING GLASS FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE INCLUDING GLASS FILM |
CN109211128A (en) * | 2017-07-03 | 2019-01-15 | 东丽先端材料研究开发(中国)有限公司 | A kind of film degree of sag on-line testing and battery diaphragm |
JP6975314B2 (en) * | 2018-03-22 | 2021-12-01 | 株式会社Fuji | Inspection device for auto-loading feeder and electronic component mounting machine |
CN114986250B (en) * | 2022-05-23 | 2024-05-03 | 西门子(中国)有限公司 | Stepping control method and stepping control system of battery pole piece cutting equipment |
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