CN103223760B - Sticker and method of attaching - Google Patents
Sticker and method of attaching Download PDFInfo
- Publication number
- CN103223760B CN103223760B CN201310032362.4A CN201310032362A CN103223760B CN 103223760 B CN103223760 B CN 103223760B CN 201310032362 A CN201310032362 A CN 201310032362A CN 103223760 B CN103223760 B CN 103223760B
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- mentioned
- upper table
- rotating roller
- flex plate
- substrate
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
Abstract
The invention provides and a kind ofly can reduce the defect of plywood, the sticker of warpage and method of attaching after stickup.This sticker (10) is for pasting tabular component (2) and flex plate (3), and wherein, have: upper table (20), it is for adsorbing tabular component (2); Lower table (40), it is configured in the below of upper table (20), loads for flex plate (3); Rotating roller (50), it contacts with the lower surface of the flex plate (3) supported by lower table (40), utilizes deadweight to make flex plate (3) deflection deformation; Press section (60), flex plate (3) is pressed on the tabular component (2) adsorbed by upper table (20) by it via rotating roller (50); And travel mechanism (70), it makes rotating roller (50) and press section (60) relative to upper table (20) relative movement.
Description
Technical field
The present invention relates to a kind of sticker and method of attaching.
Background technology
Along with slimming, the lightweight of the electronic devices such as display floater, solar cell, thin-film secondary battery, require the substrate thin plate being used for electronic device.If substrate is thinning, then the treatability of substrate is deteriorated, and is therefore difficult on substrate, form functional layer (such as thin film transistor (TFT), colour filter) used for electronic device.
Therefore, propose a kind of adhesive substrate and stiffener and fabrication layer lamination, on the substrate of this plywood, form functional layer after method (for example, referring to patent document 1) that substrate and stiffener are peeled off.In patent document 1, vacuum stamping machine is used for the stickup between substrate and stiffener.
In addition, as the method for adhesive substrate and thin slice, propose a kind of utilize adsorbent from top flatly supporting substrates and utilize the method (for example, referring to patent document 2) of multiple sucker supporting sheet from below.In the method, use is lifted thin slice from below and is crimped on the rotating roller of substrate.Along with the movement of rotating roller, multiple sucker removes absorption according to the order of regulation, and keeps out of the way downwards.
Patent document 1: Japanese Laid-Open 2007-326358 publication
Patent document 2: Japanese Laid-Open 2009-040617 publication
In the method for attaching described in patent document 1, due to substrate and stiffener are pasted together abreast, therefore when vacuum is lower, the bubble and become defect of sometimes having nipped between substrate and stiffener.
In addition, in the method for attaching described in patent document 2, the multiple suckers configured owing to utilizing two-dimensional discrete carry out adsorbent sheet, and therefore under local puts on the impact of the absorption affinity of thin slice, thin slice is pasted with flat substrate mutually with the state of distortion.Because after stickup, thin slice is for returning original shape, therefore the warpage of plywood is larger.
Summary of the invention
The present invention makes in view of the above problems, its object is to provide a kind of and can reduce the defect of plywood, the sticker of warpage and method of attaching after stickup.
In order to solve the problem, the sticker of a technical scheme of the present invention is for pasting tabular component and flex plate, and wherein, this sticker has:
Upper table, it is for adsorbing above-mentioned tabular component;
Lower table, it is configured in the below of this upper table, for above-mentioned flex plate mounting;
Rotating roller, it contacts with the lower surface of the above-mentioned flex plate supported by this lower table, utilizes deadweight to make above-mentioned flex plate deflection deformation;
Press section, the above-mentioned flex plate utilizing this rotating roller to there occurs deflection deformation is pressed on the tabular component adsorbed by above-mentioned upper table by it; And
Travel mechanism, it makes above-mentioned rotating roller and above-mentioned press section relative to above-mentioned upper table relative movement.
In addition, the method for attaching of another technical scheme of the present invention is for pasting tabular component and flex plate, and wherein, this method of attaching comprises following operation:
Utilize upper table to adsorb above-mentioned tabular component and above-mentioned flex plate be placed in the operation on the lower table of the below being configured in above-mentioned upper table; And
Make rotating roller relative to the operation of above-mentioned upper table relative movement, this rotating roller contacts with the lower surface of the above-mentioned flex plate supported by above-mentioned lower table and is utilizing the above-mentioned tabular component being pressed on by above-mentioned flex plate under the state of conducting oneself with dignity and making above-mentioned flex plate deflection deformation and adsorbed by above-mentioned upper table.
Adopt the present invention, can provide a kind of and can reduce the defect of plywood, the sticker of warpage and method of attaching after stickup.
Accompanying drawing explanation
Fig. 1 is the sectional view representing the plywood utilizing the sticker of one embodiment of the present invention to manufacture.
Fig. 2 is the sectional view representing the electronic device using plywood to manufacture.
Fig. 3 is the III-III sectional view of the Fig. 4 of the sticker representing one embodiment of the present invention.
Fig. 4 is the IV-IV sectional view of Fig. 3.
Fig. 5 is the V-V sectional view of Fig. 3.
Fig. 6 is the VI-VI sectional view of Fig. 7 of the action of the conveying mechanism of the sticker representing one embodiment of the present invention.
Fig. 7 is the VII-VII sectional view of Fig. 6.
Fig. 8 is the VIII-VIII sectional view of Fig. 6.
Fig. 9 is the figure (1) of the action of the sticker represented in an embodiment.
Figure 10 is the figure (2) of the action of the sticker represented in an embodiment.
Figure 11 is the figure of the action of the sticker represented in the 1st variation.
Figure 12 is the figure of the action of the sticker represented in the 2nd variation.
Figure 13 is the figure (1) of the action of the sticker represented in the 3rd variation.
Figure 14 is the figure (2) of the action of the sticker represented in the 3rd variation.
Detailed description of the invention
Hereinafter, with reference to the accompanying drawings of for implementing mode of the present invention.In various figures, the Reference numeral same or corresponding to same or corresponding structure mark, and omit the description.
Substrate and stiffener are pasted together for the thin plate of the substrate of electronic device to correspond to by the sticker of present embodiment.After utilizing the reinforced substrate of stiffener forms functional layer, peel off substrate and stiffener, produce the electronic device with substrate and functional layer.Stiffener does not become a part for electronic device.
At this, electronic device refers to the electronic components such as display floater, solar cell, thin-film secondary battery.Display floater comprises liquid crystal panel (LCD), plasma panel (PDP), organic EL panel (OLED).
(plywood)
Fig. 1 is the sectional view representing the plywood utilizing the sticker of one embodiment of the present invention to manufacture.Plywood 1 comprises substrate 2 and the stiffener 3 for strengthening substrate 2.
(substrate)
In the midway of the manufacturing process of electronic device, form the functional layer (such as conductive layer) of regulation at substrate 2.
Substrate 2 is such as glass substrate, ceramic substrate, resin substrate, metal substrate or semiconductor substrate etc.Wherein, glass substrate is due to resistance to chemical reagents, resistance to excellent moisture permeability and linear expansion coefficient is less, so preferably.Linear expansion coefficient is less, and the pattern of the functional layer formed under high temperature is more difficult to skew when cooling.
As the glass of glass substrate, be not particularly limited, such as, there are alkali-free glass, borosilicate glass, soda-lime glass, high silica glass, other take silica as the oxide based glass etc. of main component.As oxide based glass, the content being preferably based on the silica that oxide converts is the glass of 40 quality % ~ 90 quality %.
As the glass of glass substrate, preferably adopt and be suitable for the kind of electronic device, the glass of its manufacturing process.Such as preferably, the glass substrate of liquid crystal panel is made up of the glass (alkali-free glass) in fact not containing alkali metal component.Like this, the glass of glass substrate is suitably selected according to the kind of applied electronic device and manufacturing process thereof.
The resin of resin substrate both can be crystalline resin, can be also non-crystalline resin, be not particularly limited.
As crystalline resin, such as there are as the polyamide of thermoplastic resin, polyacetals, polybutylene terephthalate (PBT), PETG, PEN or syndiotactic polytyrene etc., in thermosetting resin, there are polyphenylene sulfide, polyether-ether-ketone, liquid crystal polymer, fluororesin or polyethers nitrile etc.
As non-crystalline resin, such as there are as the Merlon of thermoplastic resin, Noryl, polycyclic hexene or polynorbornene system resin etc., in thermosetting resin, there are polysulfones, polyether sulfone, polyarylate, polyamidoimide, PEI or TPI.
As the resin of resin substrate, particularly preferably amorphism and thermoplastic resin.
The thickness of substrate 2 sets according to the kind of substrate 2.Such as, when for glass substrate, in order to the lightweight of electronic device, thin plate and preferably below 0.7mm, more preferably below 0.3mm, preferred below 0.1mm further.When for below 0.3mm, the flexibility that glass substrate is good can be given.When for below 0.1mm, glass substrate can be batched as roll.In addition, for the reason such as the process that is easy to manufacture, glass substrate of glass substrate is easy, the thickness of glass substrate is preferably more than 0.03mm.
(stiffener)
If stiffener 3 and substrate 2 close contact, then strengthen until carry out strip operation substrate 2.After formation functional layer, stiffener 3 is peeled off from substrate 2 in the midway of the manufacturing process of electronic device, does not become a part for electronic device.
In order to suppress stiffener 3 to be caused by variations in temperature warpage, stripping and linear expansion coefficient difference preferably and between substrate 2 the less stiffener of absolute value.When substrate 2 is glass substrate, preferred stiffener 3 is containing glass plate.Preferably the glass of this glass plate is the kind same with the glassy phase of glass substrate.
The resin bed 5 that stiffener 3 has support plate 4 and is formed on support plate 4.Under the effect acting on the Van der Waals force between resin bed 5 and substrate 2 etc., resin bed 5 combines in the mode that can peel off with substrate 2.
In addition, the stiffener 3 of present embodiment is made up of support plate 4 and resin bed 5, but also can only be made up of support plate 4.Under the effect acting on the Van der Waals force between support plate 4 and substrate 2 etc., support plate 4 combines in the mode that can peel off with substrate 2.Also inorganic thin film can be formed with on the surface of support plate 4, to make the glass plate as support plate 4 at high temperature not bonding with the glass substrate as substrate 2.In addition, also can by arranging different region of surface roughness etc. on the surface of support plate 4 and interface between support plate 4 from substrate 2 being provided with the different region of adhesion.
In addition, the stiffener 3 of present embodiment is made up of support plate 4 and resin bed 5, but support plate 4 also can be multiple.Similarly resin bed 5 also can be multiple.
(support plate)
Support plate 4 supports via resin bed 5 pairs of substrates 2, strengthens.Support plate 4 prevents the distortion, scuffing, breakage etc. of the substrate 2 in the manufacturing process of electronic device.
Support plate 4 is such as glass plate, ceramic wafer, resin plate, semiconductor board or metallic plate etc.The kind of support plate 4 is selected according to the kind of electronic device, the kind etc. of substrate 2.If support plate 4 and substrate 2 are identical type, then can reduce caused by variations in temperature warpage, stripping.
The difference (absolute value) of the average coefficient of linear expansion between support plate 4 and substrate 2 suitably sets according to size shape of substrate 2 etc., but preference is as being 35 × 10
-7/ DEG C below.At this, " average coefficient of linear expansion " refers to the average coefficient of linear expansion (Japanese JISR3102) in the temperature range of 50 DEG C ~ 300 DEG C.
The thickness of support plate 4 is such as below 0.7mm.In addition, in order to strengthen substrate 2, the thickness of support plate 4 is preferably more than 0.4mm.The thickness of support plate 4 both can be thicker than the thickness of substrate 2, also can be thinner than the thickness of substrate 2.
Preferably, the profile of support plate 4 is identical with the profile of resin bed 5 or larger than the profile of resin bed 5 as shown in Figure 1, overall to make support plate 4 can support resin bed 5.
(resin bed)
If resin bed 5 and substrate 2 close contact, then prevent the position offset straight of substrate 2 to carrying out strip operation.By strip operation, resin bed 5 is easily peeled off from substrate 2.By easily peeling off substrate 2, thus substrate 2 can be prevented damaged, and the stripping of less desirable position (between resin bed 5 and support plate 4) can be prevented.
The adhesion that resin bed 5 is formed as between adhesion ratio between support plate 4 and substrate 2 is relative high.Thus, when carrying out strip operation, can peel off at less desirable position (between resin bed 5 and support plate 4) by preventing layer lamination 1.
The resin of resin bed 5 is not particularly limited.Such as the resin of resin bed 5, there are acrylic resin, vistanex, polyurethane resin, polyimide resin, silicones, polyimides silicones etc.Also can several resin used in combination.Wherein, based on the viewpoint of heat resistance, fissility, preferred silicones, polyimides silicones.
The thickness of resin bed 5 is not particularly limited, but preferably 1 μm ~ 50 μm, more preferably 4 μm ~ 20 μm.By the thickness of resin bed 5 is set to more than 1 μm, thus when being mixed into bubble, foreign matter between resin bed 5 and substrate 2, resin bed 5 can be out of shape the thickness absorbing bubble, foreign matter.On the other hand, if the thickness of resin bed 5 is less than 50 μm, then can shorten the formation time of resin bed 5, and then owing to not using the resin of required above resin bed 5, therefore be economical.
Preferably, the profile of resin bed 5 is identical with the profile of substrate 2 or larger than the profile of substrate 2 as shown in Figure 1, with make resin bed 5 can close contact substrate 2 overall.
In addition, resin bed 5 also can be formed more than two-layer.In this case, " thickness of resin bed " refers to the aggregate thickness of all resin beds.
In addition, at resin bed 5 by when forming more than two-layer, the kind forming the resin of each layer also can be different.
(duplexer)
Fig. 2 is the sectional view representing the duplexer using plywood to manufacture.
Duplexer 6 forms the functional layers such as conductive layer on the substrate 2 of plywood 1.The kind of functional layer is selected according to the kind of electronic device.Also can be that multiple functional layer stacks gradually on a substrate 2.As the formation method of functional layer, use usual way, such as, use vapour deposition method, the sputtering method etc. such as CVD, PVD method.The pattern that functional layer utilizes photoetching process, etching method is formed as regulation.
Such as, duplexer 6 has stiffener 3A, the substrate 2A, liquid crystal layer 7, the substrate 2B that comprise support plate 4A and resin bed 5A successively and comprises the stiffener 3B of support plate 4B and resin bed 5B.This duplexer 6 is made in the midway of the manufacturing process of LCD.The face of liquid crystal layer 7 side on a substrate 2A is formed with not shown thin film transistor (TFT) (TFT), and the face of liquid crystal layer 7 side on another substrate 2B is formed with not shown colour filter (CF).
After having peeled off stiffener 3A, 3B, Polarizer, backlight etc. are installed, have obtained the LCD as product.Use stripping off device described later to peel off stiffener 3A, 3B.
In addition, in the present embodiment, the stripping of stiffener 3A, 3B is carried out after formation liquid crystal layer 7, but also can carry out before formation liquid crystal layer 7 after formation TFT, CF.
(sticker)
Fig. 3 is the III-III sectional view of the Fig. 4 of the sticker representing one embodiment of the present invention.Fig. 4 is the IV-IV sectional view of Fig. 3, and Fig. 5 is the V-V sectional view of Fig. 3.Fig. 6 is the VI-VI sectional view of Fig. 7 of the action of the conveying mechanism of the sticker representing one embodiment of the present invention.Fig. 7 is the VII-VII sectional view of Fig. 6, and Fig. 8 is the VIII-VIII sectional view of Fig. 6.Fig. 9 ~ Figure 10 is the figure of the action (method of attaching) of the sticker represented in an embodiment.In addition, in Fig. 3 ~ Figure 12, for ease of observing accompanying drawing, omit the diagram of the resin bed 5 included by stiffener 3.In addition, in Fig. 3, Fig. 4, Fig. 6, Fig. 7 and Fig. 9 ~ Figure 12, for convenience of explanation, the diagram of limiting unit 80 is omitted.In addition, because the internal structure of various cylinder main body described later is common structure, therefore diagram is omitted.
As shown in Fig. 3 ~ Fig. 5, sticker 10 is for pasting as the substrate 2 of tabular component and the device as the stiffener 3 of flex plate.Sticker 10 has for the upper table 20 of sorbing substrate 2 and the below being configured in upper table 20, the lower table 40 that loads for stiffener 3.In addition, substrate 2 also can be contrary with the configuration of stiffener 3, and also can be that substrate 2 is placed in lower table 40, stiffener 3 be adsorbed by upper table 20.
As shown in figs. 6-9, sticker 10 has the conveying mechanism 11 joining substrate 2 and stiffener 3 relative to upper table 20 and lower table 40.Conveying mechanism 11 has the retaining member 12 for keeping substrate 2 or stiffener 3.As shown in Figure 7, retaining member 12 has the multiple arms 13 being separated with compartment of terrain arrangement in the horizontal direction and the multiple suckers 14 being located at each arm 13.
As shown in Figure 9 and Figure 10, sticker 10 have rotating roller 50 and as press section by cylinder pressure 60, this rotating roller 50 contacts with the lower surface of the stiffener 3 supported by lower table 40, utilizes deadweight to make flex plate 3 deflection deformation; The stiffener 3 of rotating roller 50 and deflection deformation will should be utilized by being pressed in the substrate 2 being adsorbed on upper table 20 by cylinder pressure 60.Formed by by cylinder pressure main body 61 with the bar 62 that the mode self-pressing cylinder main body 61 that can stretch is outstanding by cylinder pressure 60.The supporting frame 63 supporting rotating roller 50 in the mode that can rotate freely centered by the central shaft of rotating roller 50 is fixed with on the top of bar 62.
As shown in Figure 3 and Figure 6, sticker 10 has and makes rotating roller 50 and by the travel mechanism 70 of cylinder pressure 60 relative to upper table 20 relative movement.Travel mechanism 70 have the two guide rail Gd be laid on frame Fr, can along the glide base Sb of guide rail Gd movement with for driving the drive division 71(of glide base Sb with reference to Fig. 3).Drive division 71 is by being such as fixed on the movement motor 72 of frame Fr and the rotary motion of movement motor 72 being converted to rectilinear motion and forming to the ball-screw 73 etc. that glide base Sb transmits.Glide base Sb is fixed with by cylinder pressure 60.Movement motor 72 can be servomotor, forms by motor body portion 74 with for the encoder portion 75 of the rotation amount that detects motor body portion 74 and direction of rotation.If movement motor 72 rotates, then glide base Sb is mobile along the length direction (being left and right directions in Fig. 3, Fig. 6, Fig. 9, Figure 10) of guide rail Gd, by cylinder pressure 60 and rotating roller 50 relative to upper table 20 relative movement.Movement motor 72 is fed control according to the testing result in encoder portion 75, to make to become target location by cylinder pressure 60 grade relative to the relative position of upper table 20.
As shown in Fig. 3 etc., upper table 20 sorbing substrate 2 from top supporting substrates 2.Upper table 20 by for sorbing substrate 2 adsorption plate 21, be formed with the main frame 24 that makes to be formed through the groove 23 that the multiple adsorption holes 22 in adsorption plate 21 are connected and the stiffener 26 that main frame 24 is strengthened formed.The groove 23 being formed at main frame 24 is connected with source of suction such as vavuum pumps.If source of suction work, be then depressurized in adsorption hole 22, substrate 2 is fixed on upper table 20.Main frame 24 supports multiple cylinder 25.Each cylinder 25 has the cylinder main body 27 being fixed on main frame 24 and the bar 28 given prominence to from cylinder main body 27 in the mode that can stretch.The multiple rod aperture corresponding with multiple bar 28 are formed through in adsorption plate 21 and main frame 24.Cylinder 25 also can be fixed on stiffener 26.
As shown in figs. 4 and 7, upper table 20 is connected with switching mechanism 30, and this switching mechanism 30 makes upper table 20 reverse, and is switched in the direction of the adsorption plane of the sorbing substrate 2 of upper table 20 between upward and down.Switching mechanism 30 has multiple (such as two) the upper table supporting member 31 supporting upper table 20 in the mode that can rotate and the elevating mechanism 32 that multiple upper table supporting member 31 is elevated.The rotation motor 33 that upper table 20 is rotated is provided with at a upper table supporting member 31.Elevating mechanism 32 is made up of the multiple elevating levers 34 be connected with multiple upper table supporting member 31, the lifting motor 35 etc. that makes multiple elevating lever 34 be elevated.Upper table 20 can move up and down relative to frame Fr by means of elevating mechanism 32.
Upper table 20, when receiving substrate 2 from conveying mechanism 11, as shown in Figure 7 after rising to assigned position by means of elevating mechanism 32, reverses by means of rotation motor 33, and the adsorption plane of upper table 20 becomes level upward.The substrate 2 kept by retaining member 12 is carried in top to adsorption plane, removes the absorption undertaken by the sucker 14 of each retaining member 12.The bar 28 of multiple cylinder 25 extends and gives prominence to from the adsorption plane of upper table 20, lifts substrate 2 from retaining member 12.Then, retaining member 12 is extracted from the gap be formed between substrate 2 and upper table 20.Afterwards, the bar 28 of multiple cylinder 25 shrinks and the adsorption plane that submerges, and substrate 2 is positioned on adsorption plane, and substrate 2 is adsorbed on upper table 20.Then, rotation motor 33 makes upper table 20 reverse, and the adsorption plane of upper table 20 becomes level down.Finally, elevating mechanism 32 makes upper table 20 drop to assigned position.In the present embodiment, due to after on adsorption plane substrate 2 being placed in upper table 20 and flatly supporting substrates 2, substrate 2 is adsorbed, therefore, it is possible to prevent substrate 2 to be out of shape, can the residual stress of reduction layer lamination 1.In addition, because retaining member 12 does not contact with the face of the side that contacts with stiffener 3 of substrate 2, when therefore there is the foreign matters such as dust on retaining member 12, can prevent foreign matter from entering between substrate 2 and stiffener 3.
As shown in Figure 4 and Figure 5, sticker 10 also have to when adhesive substrate 2 and stiffener 3, align member 15 that the relative position of upper table 20 and lower table 40 positions.Align member 15 is such as fixed on frame Fr, by contacting with the lower surface of upper table 20, thus positions the relative position of upper table 20 and lower table 40.Now, the mounting surface loaded for stiffener 3 of the adsorption plane of upper table 20 and lower table 40 is better almost parallel.
Align member 15 can along the interval G(between upper table 20 and lower table 40 with reference to Fig. 5) direction (being above-below direction in figures 4 and 5) that changes is flexible.Align member 15 is made up of the main part 16 being such as fixed on frame Fr and the bolt 17 that contacts with the lower surface of upper table 20.The bolt hole inserted in the axle portion 18 for bolt 17 is formed at the upper surface of main part 16.By making the bolt 17 being inserted into this bolt hole rotate ormal weight, thus making the head 19 of bolt 17 move up and down ormal weight, the interval G between upper table 20 and lower table 40 contacted with the head 19 of bolt 17 can be adjusted.Interval G is according to the material of substrate 2, stiffener 3, thickness and setting.Such as, interval G is set as that the distance L between the substrate 2 that adsorbed by upper table 20 and the stiffener 3 being placed in lower table 40 is 0.5mm ~ 8mm.The position sensor IS such as laser displacement gauge are utilized to detect the position of upper table 20.Position sensor IS both can be contactless also can be contact.
In addition, as long as stretch in the direction that align member 15 can change along interval G, structure can be varied.Such as, align member 15 also and can make the convert rotational motion of turning motor be that the ball-screw etc. of rectilinear motion is formed by turning motor.Turning motor by control part 90 FEEDBACK CONTROL, becomes setting to make distance L according to the testing result of position sensor IS.
Lower table 40 can with rotating roller 50 with press together with cylinder pressure 60 better relative to upper table 20 relative movement.Lower table 40 is such as fixed on glide base Sb, can be upper mobile in the direction (among Fig. 3, Fig. 6, Fig. 9, Figure 10 be left and right directions) parallel with the adsorption plane of upper table 20.
Lower table 40 with the mode support reinforced plate 3 that can slide with make lower table 40 relative to upper table 20 relative movement time, the position be adsorbed between the substrate 2 of upper table 20 and the stiffener 3 supported by lower table 40 can not misplace.Lower table 40 has lower table main body 42 and is fixed in lower table main body 42 resin bed 41 in order to the coefficient of friction reduced between stiffener 3, resin bed 41 loads stiffener 3.Because the mounting surface of lower table 40 is formed by resin, therefore compared with situation about being formed by metal, pottery, the friction between lower table 40 and stiffener 3 can be reduced.UltraHighMolecularWeightPolyethylene), ABS resin etc. as resin, be not particularly limited, but such as use UPE(ultra high molecular polyethylene:.Resin also can form plate, film or overlay film.
As shown in Figure 3 and Figure 6, be lower table main body 42 in detail at lower table 40() and glide base Sb between be folded with separator 43.Lifter plate 44 is had, for guiding the guiding piece 45 of lifter plate 44 up and down, for driving the telescoping cylinder 46 of lifter plate 44 at the space matching formed by separator 43.As shown in Figure 6, telescoping cylinder 46 has the cylinder main body 47 being fixed on glide base Sb and the bar 48 given prominence to from cylinder main body 47 in the mode that can stretch.Be fixed with lifter plate 44 on the top of bar 48, lifter plate 44 be separated with compartment of terrain two-dimensionally and be arranged in the prominent part of multiple lifter pin 49.The multiple pin-and-holes corresponding with multiple lifter pin 49 run through and are formed at lower table 40.
When lower table 40 receives stiffener 3 from conveying mechanism 11, the stiffener 3 kept by retaining member 12 is carried in the top as shown in Figure 6 to lower table 40, removes the absorption undertaken by the sucker 14 of each retaining member 12.The bar 48 of telescoping cylinder 46 extends, and lifter plate 44 rises.The lifter pin 49 outstanding from the mounting surface of lower table 40 lifts stiffener 3 from retaining member 12.Then, retaining member 12 is pulled out from the gap be formed between stiffener 3 and lower table 40.Afterwards, the bar 48 of telescoping cylinder 46 shrinks, and lifter plate 44 declines.Its result, lifter pin 49 submerges the mounting surface of level of lower table 40, and stiffener 3 is placed on lower table 40.
As shown in Figure 9 and Figure 10, rotating roller 50 contacts with the lower surface of the stiffener 3 supported by lower table 40, makes stiffener 3 because of deadweight deflection deformation.In order to suppress the damage of stiffener 3, rotating roller 50 is made up of the sheet rubber of such as metal roller main body with the outer peripheral face being fixed on roller main body, utilizes sheet rubber to contact with the lower surface of stiffener 3.
Rotating roller 50 rotates freely centered by the rotating shaft vertical with the moving direction of glide base Sb.Rotating roller 50 contacts with the lower surface of stiffener 3, and the both sides to stiffener 3 are outstanding.
In the below of rotating roller 50 or oblique below, as shown in Figure 9 and Figure 10, in order to reduce the flexure of rotating roller 50, the backing roll 55 being provided with supporting rotating roller 50 is better.Backing roll 55 contacts with the outer peripheral face of rotating roller 50, can rotate together with rotating roller 50.
As shown in figs. 4 and 7, backing roll 55 is supported as rotating freely centered by the central shaft of backing roll 55 by supporting frame 63.Backing roll 55 is separated with compartment of terrain and arranges multiple and formed and arrange on the direction parallel with the rotating shaft of rotating roller 50.In order to reduce the flexure of backing roll 55, be provided with the axle support 57 in the axle portion 56 of each backing roll 55 of supporting each other at backing roll 55.Axle support 57 is fixed on supporting frame 63, supports the axle portion 56 of each backing roll 55 in the mode that can rotate freely centered by the central shaft in axle portion 56.In addition, axle support 57 also can support the axle portion 56 of each backing roll 55 in the mode that can not rotate, in this case, in the main part of each backing roll 55, bearing is equipped with the main part of each backing roll 55 relative to the mode that axle portion 56 rotates freely better.Multiple backing roll 55 both can rotate integratedly, also can rotate individually.
Backing roll 55 is respectively provided with 1 row, from tiltedly supporting rotating roller 50 in below is better the moving direction both sides of rotating roller 50 (being the left and right sides in Fig. 3, Fig. 6, Fig. 9, Figure 10) respectively.Rotating roller 50 can be suppressed to the less desirable distortion of moving direction.
As shown in Figure 4, the supporting frame 63 supporting rotating roller 50 and backing roll 55 in the mode rotated freely can move up and down along the guiding piece 64 being fixed on glide base Sb.Arrange between supporting frame 63 and glide base Sb be used for topmast support frame 63 by cylinder pressure 60.
By cylinder pressure 60 stiffener 3 by means of rotating roller 50 deflection deformation pressed and be crimped on the substrate 2 adsorbed by upper table 2.As shown in Figure 3, by rotating roller 50 and the crimping cell location that forms by cylinder pressure 60 between two lower tables 40.
As shown in Figure 5, sticker 10 can also have the limiting unit 80 that restriction upper table 20 is moved upward, and can not float to make upper table 20 under the effect of the pressing force by cylinder pressure 60 from align member 15.In addition, when upper table 20 weighs very much, limiting unit 80 can be there is no yet.
Limiting unit 80 comprises the clamping cylinder 81 such as upper table 20 being pressed on align member 15.Clamping cylinder 81 by be fixed on frame Fr cylinder main body 82, in the mode that can stretch from the outstanding axle portion 83 of cylinder main body 82, the arm 84 that is fixed on axle portion 83 formed.
If upper table 20 contacts with align member 15, then clamping cylinder 81 makes axle portion 83 retract on the basis making the axle portion 83 being rotatably supported on cylinder main body 82 rotate, and utilizes arm 84 that upper table 20 is pressed on align member 15.
Sticker 10 also has the control part 90 of the various actions for controlling sticker 10.Control part 90 controls the cylinder 25 of such as conveying mechanism 11, upper table 20, source of suction, switching mechanism 30, the telescoping cylinder 46 of lifter pin 49, the action by cylinder pressure 60, travel mechanism 70, limiting unit 80.Control part 90 is configured to the computer comprising the storage mediums such as CPU, ROM, RAM etc.By making CPU perform the program be recorded in storage medium, thus control the various actions of sticker 10.
Then, according to Fig. 9 ~ Figure 10, the action (method of attaching) of the sticker of said structure is described.The various actions of sticker carry out under the control of control part 90.
As shown in Figure 9, rotating roller 50 is pressed cylinder 60 jack-up upward at adhesive substrate 2 with during stiffener 3, makes stiffener 3 deflection deformation being placed in lower table 40, is pressed by stiffener 3 from below and be crimped on the substrate 2 adsorbed by upper table 20.Owing to making it paste with substrate 2 phase under the state making stiffener 3 deflection deformation, therefore between substrate 2 and stiffener 3, be difficult to bubble of nipping, can the defect of reduction layer lamination 1.Now, the adsorption plane (lower surface) of upper table 20 and the mounting surface (upper surface) of lower table 40 almost parallel.
In this condition, as shown in Figure 10, rotating roller 50 relative to upper table 20 relative movement, makes substrate 2 paste with stiffener 3 phase by means of travel mechanism 70.Rotating roller 50 moves to the right in figure, after the right half part of the right half part and stiffener 3 of having pasted substrate 2, moves to the left in figure, the left-half of adhesive substrate 2 and the left-half of stiffener 3.The mode that rotating roller 50 can not misplace with the position between substrate 2 with stiffener 3 is while contact while rotate with the lower surface of stiffener 3.
Now, as shown in Figure 10, lower table 40 can relative to upper table 20 relative movement together with rotating roller 50.Because the interval W on the moving direction between the rotating shaft of rotating roller 50 and lower table 40 can not expand, therefore, it is possible to reduce the deflection deformation of the stiffener 3 between rotating roller 50 and lower table 40.Lower table 40 can not misplace to make the position between substrate 2 and stiffener 3 with the mode support reinforced plate 3 that can slide.
Like this, adopt present embodiment, when adhesive substrate 2 and stiffener 3 during fabrication layer lamination 1, owing to not adsorbing fixing stiffener 3, therefore, it is possible to paste stiffener 3 and substrate 2 under the state that the strain of stiffener 3 is less, the warpage of the plywood 1 after stickup can be reduced.This effect is more obvious when both substrate 2 and stiffener 3 comprise glass plate.Such as, when the resin plate that sticking glass plate and rigidity are lower than the rigidity of glass plate, because the rigidity of resin plate is lower than the rigidity of glass plate, therefore the situation of strain profiling glass plate is produced relative to the resin plate after stickup, glass plate does not almost produce strain, therefore be easy to become tabular, plywood is warpage not easily.On the other hand, when sticking glass plate each other, after stickup both glass plate produce strain, a side is difficult to profiling the opposing party, the easy warpage of plywood.
In addition, the lower table 40 of present embodiment adhesive substrate 2 with stiffener 3 time move together with rotating roller 50 grade, but also can with rotating roller 50 movement separately, can not also move.As long as rotating roller 50 moves, just can adhesive substrate 2 and stiffener 3.
In addition, as shown in Figure 9, when starting to paste, in the upper end of rotating roller 50, stiffener 3 deflection deformation is that the curved shape of projection is upward better.Because substrate 2 and stiffener 3 are pasted together smoothly, therefore, it is possible to suppress substrate 2, stiffener 3 damaged.
Control part 90 controls travel mechanism 70, adjusts the position loading stiffener 3 on lower table 40, and to make the upper end when starting to paste in rotating roller 50, stiffener 3 deflection deformation is the curved shape of projection upward.This adjustment was carried out before conveying mechanism 11 pays stiffener 3 to lower table 40.
In addition, in the example shown in Fig. 9, when starting to paste, rotating roller 50 is configured in the position of the both sides of the edge equidistance apart from stiffener 3, but as shown in figure 11, also can be configured in a near side edges of stiffener 3.
Above, describe one embodiment of the present invention, but the present invention is not limited to above-mentioned embodiment, can various distortion, change be carried out.
Such as, the sticker 10 of above-mentioned embodiment is for the manufacture of the plywood 1 used in the manufacturing process of LCD, but the purposes of sticker 10 can be varied.
In addition, in the above-described embodiment, when adhesive substrate 2 and stiffener 3, the adsorption plane of upper table 20 is parallel with the mounting surface of lower table 40, but also can tilt.In addition, the adsorption plane of upper table 20, the mounting surface of lower table 40 also can be inclined relative to horizontal.
In addition, as shown in figure 12, in order to reduce the friction between lower table 40 and stiffener 3, the gas squit hole 40a being formed with gas jet upward in the mounting surface of lower table 40 is better.Gas squit hole 40a is separated with compartment of terrain arrangement two-dimensionally.Multiple gas squit hole 40a is connected with supplies for gas GS via pipe arrangement.Supplies for gas GS under the control of control part 90 to gas squit hole 40a supply gas.
In addition, as shown in figure 13, elevating lever 34 runs through upper table supporting member 31, and the bottom that the supporting member 36 supporting upper table supporting member 31 is from below fixed on elevating lever 34 is better.Elevating lever 34 declines from the state shown in Figure 13, after upper table 20 is supported in align member 15, when elevating lever 34 continues to decline, supporting member 36 leaves upper table supporting member 31 as shown in figure 14, keeps the depth of parallelism between upper table 20 and lower table 40.
On the other hand, if elevating lever 34 rises under the state shown in Figure 14, then supporting member 36 lifts upper table supporting member 31 as shown in figure 13, and upper table 20 rises and leaves align member 15.The retainer piece 37 of bearing supporting member 36 is fixed with at the lower surface of upper table supporting member 31.The top 36a of supporting member 36 is in shape upwardly, and the bottom 37a of retainer piece 37 is in the shape upwards caved in.The top 36a of the supporting member 36 and bottom 37a of retainer piece 37 is that the shape that axis is advanced upward, radius is less more along elevating lever 34 is better respectively, such as, can be the shape of the part having cut ball, truncated cone shape or cone shape.When elevating lever 34 rises, supporting member 36 is determined with the position in the horizontal direction of retainer piece 37, and upper table 20 is determined relative to the position in the horizontal direction of frame Fr, therefore, it is possible to substrate 2 is positioned in the assigned position of upper table 20.
In addition, retainer piece 37 and upper table supporting member 31 are formed independently, but also can be formed as a part for upper table supporting member 31.
In addition, the top 36a of supporting member 36 also can be contrary with the concavo-convex of the bottom 37a of retainer piece 37.Also can be the top 36a of supporting member 36 in the shape of lower recess, the bottom 37a of retainer piece 37 is in the shape to lower process.In this case, the top 36a of the supporting member 36 and bottom 37a of retainer piece 37 is that the shape that axis is advanced downwards, radius is less more along elevating lever 34 is better respectively.
In addition, as shown in Figure 13 and Figure 14, be fixed with at the lower surface of upper table 20 mounting portion 29 being placed in align member 15 better.The bottom 29a of mounting portion 29 such as, in the shape upwards caved in (more advance upward along vertical direction, shape that radius is less, cut the shape of a part for ball, truncated cone shape or cone shape).The bight chamfering on the top (being the top 19a of the head 19 of bolt 17 in detail) of align member 15, such as, in shape (more advance upward along vertical direction, shape that radius is less, cut the shape of a part for ball, truncated cone shape or cone shape) upwardly.Mounting portion 29 is directed to assigned position by the head 19 of bolt 17, thus upper table 20 is determined relative to the position in the horizontal direction of frame Fr.Therefore, the substrate 2 adsorbed by upper table 20 is determined with the position of the stiffener 3 supported by lower table 40, therefore, it is possible to the alignment outward flange of substrate 2 and the outward flange of stiffener 3.
In addition, mounting portion 29 and upper table 20 are formed independently, but also can be formed as a part for upper table 20.
In addition, the bottom 29a of mounting portion 29 also can be contrary with the concavo-convex of the top 19a of align member 15.
The application is the application based on the Japanese Patent application 2012-014509 filed an application on January 26th, 2012, and its content is introduced in this as reference.
description of reference numerals
1, plywood; 2, substrate (tabular component); 3, stiffener (flex plate); 6, duplexer; 7, liquid crystal layer; 10, sticker; 20, upper table; 30, switching mechanism; 40, lower table; 40a, gas squit hole; 41, resin bed; 42, lower table main body; 50, rotating roller; 55, backing roll; 56, axle portion; 57, axle support; 60, by cylinder pressure (press section); 70, travel mechanism.
Claims (19)
1. a sticker, for pasting tabular component and flex plate, wherein, has:
Upper table, it is for adsorbing above-mentioned tabular component;
Lower table, it is configured in the below of this upper table, for above-mentioned flex plate mounting;
Rotating roller, it contacts with the lower surface of the above-mentioned flex plate supported by this lower table, utilizes deadweight to make above-mentioned flex plate deflection deformation;
Press section, the above-mentioned flex plate utilizing this rotating roller to there occurs deflection deformation is pressed on the tabular component adsorbed by above-mentioned upper table by it; And
Travel mechanism, it makes above-mentioned rotating roller and above-mentioned press section relative to above-mentioned upper table relative movement.
2. sticker according to claim 1, wherein,
Above-mentioned travel mechanism makes above-mentioned lower table and above-mentioned rotating roller together with above-mentioned press section relative to above-mentioned upper table relative movement.
3. sticker according to claim 2, wherein,
The face of the above-mentioned flex plate mounting of confession of above-mentioned lower table is formed by resin.
4. the sticker according to Claims 2 or 3, wherein,
The gas squit hole of gas jet is upward formed in the face of the above-mentioned flex plate mounting of the confession of above-mentioned lower table.
5. sticker according to claim 1 and 2, wherein,
Also there is the backing roll of the from below or tiltedly above-mentioned rotating roller of below supporting.
6. sticker according to claim 5, wherein,
Above-mentioned backing roll is separated with compartment of terrain and is configured with multiple on the direction parallel with the axis of above-mentioned rotating roller,
The axle support in the axle portion of each backing roll of supporting is equipped each other at above-mentioned backing roll.
7. sticker according to claim 5, wherein,
Above-mentioned backing roll is disposed in the moving direction both sides of above-mentioned rotating roller respectively, below tiltedly, support above-mentioned rotating roller.
8. sticker according to claim 1 and 2, wherein,
Also have and above-mentioned upper table is reversed, by the switching mechanism towards switching between facing upward or downward in the face of above-mentioned for the absorption of above-mentioned upper table tabular component.
9. sticker according to claim 1 and 2, wherein,
Also have to when pasting above-mentioned tabular component and above-mentioned flex plate, align member that the relative position of above-mentioned upper table and above-mentioned lower table positions,
This align member can be flexible on the direction that changes, the interval between above-mentioned upper table and above-mentioned lower table.
10. the sticker according to Claims 2 or 3, wherein,
Also there is the control part for controlling above-mentioned travel mechanism,
This control part controls above-mentioned travel mechanism, adjusts the mounting position of above-mentioned flex plate on above-mentioned lower table.
11. 1 kinds of method of attaching, for pasting tabular component and flex plate, wherein, comprise following operation:
Utilize upper table to adsorb above-mentioned tabular component and above-mentioned flex plate be placed in the operation on the lower table of the below being configured in above-mentioned upper table; And
Make rotating roller relative to the operation of above-mentioned upper table relative movement, this rotating roller contacts with the lower surface of the above-mentioned flex plate supported by above-mentioned lower table and is utilizing the above-mentioned tabular component being pressed on by above-mentioned flex plate under the state of conducting oneself with dignity and making above-mentioned flex plate there occurs deflection deformation and adsorbed by above-mentioned upper table.
12. method of attaching according to claim 11, wherein,
Make above-mentioned lower table together with above-mentioned rotating roller relative to above-mentioned upper table relative movement.
13. method of attaching according to claim 12, wherein,
The face of the above-mentioned flex plate mounting of confession of above-mentioned lower table is formed by resin.
14. method of attaching according to claim 12 or 13, wherein,
The gas squit hole of gas jet is upward formed in the face of the above-mentioned flex plate mounting of the confession of above-mentioned lower table.
15. method of attaching according to claim 11 or 12, wherein,
The backing roll supporting above-mentioned rotating roller is equipped in the below of above-mentioned rotating roller or oblique below.
16. method of attaching according to claim 15, wherein,
Above-mentioned backing roll is separated with compartment of terrain and is configured with multiple on the direction parallel with the axis of above-mentioned rotating roller,
The axle support in the axle portion of each backing roll of supporting is equipped each other at above-mentioned backing roll.
17. method of attaching according to claim 15, wherein,
Above-mentioned backing roll is disposed in the moving direction both sides of above-mentioned rotating roller respectively, below tiltedly, support above-mentioned rotating roller.
18. method of attaching according to claim 11 or 12, wherein,
There is following operation: make the adsorption plane of the above-mentioned tabular component of the absorption of above-mentioned upper table upward, after above-mentioned tabular component is positioned on this adsorption plane, above-mentioned upper table is utilized to adsorb above-mentioned tabular component, then, make above-mentioned upper table reverse and make above-mentioned upper table adsorption plane down.
19. method of attaching according to claim 11 or 12, wherein,
Above-mentioned tabular component and above-mentioned flex plate comprise glass plate respectively.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-014509 | 2012-01-26 | ||
| JP2012014509A JP5821664B2 (en) | 2012-01-26 | 2012-01-26 | Bonding apparatus and bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103223760A CN103223760A (en) | 2013-07-31 |
| CN103223760B true CN103223760B (en) | 2016-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310032362.4A Active CN103223760B (en) | 2012-01-26 | 2013-01-28 | Sticker and method of attaching |
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| JP (1) | JP5821664B2 (en) |
| KR (1) | KR101996090B1 (en) |
| CN (1) | CN103223760B (en) |
| TW (1) | TW201334961A (en) |
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| CN104625997B (en) * | 2013-11-12 | 2017-06-30 | 珠海格力电器股份有限公司 | Positioning tool |
| CN107148667B (en) * | 2014-10-29 | 2020-05-05 | Ａｇｃ株式会社 | Substrate suction device, substrate bonding device and bonding method, and method for manufacturing electronic device |
| CN104669762B (en) | 2015-03-24 | 2017-03-29 | 京东方科技集团股份有限公司 | A kind of vacuum forming apparatus |
| JP6631785B2 (en) * | 2015-12-21 | 2020-01-15 | 日本電気硝子株式会社 | Method and apparatus for manufacturing glass film laminate |
| CN105739235A (en) * | 2016-03-23 | 2016-07-06 | 常州鸿开电子科技有限公司 | Multifunctional suction cup device with backlight for mask plate detection |
| CN109863029A (en) * | 2016-10-26 | 2019-06-07 | Ａｇｃ株式会社 | The manufacturing method of laminated body |
| CN106989090B (en) * | 2017-04-28 | 2019-02-15 | 歌尔股份有限公司 | Cutting part pastes tooling |
| CN107414979A (en) * | 2017-08-01 | 2017-12-01 | 合肥英源新材料科技有限公司 | A kind of manufacture method of the Multifunctional plate pressing of sheet material laminator |
| KR102021669B1 (en) * | 2017-11-29 | 2019-09-16 | 우순 테크놀로지 컴퍼니, 리미티드 | Laminating machine |
| WO2021145226A1 (en) * | 2020-01-16 | 2021-07-22 | ソニーセミコンダクタソリューションズ株式会社 | Manufacturing device, manufacturing method, and semiconductor element |
| CN114407494B (en) * | 2022-03-11 | 2023-12-29 | 新疆钢之盛建筑科技有限公司 | Composite board processing equipment and processing method thereof |
| CN115366522B (en) * | 2022-10-21 | 2023-01-03 | 北京玻钢院复合材料有限公司 | Multifunctional layer spreading device for composite sandwich board |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2013155053A (en) | 2013-08-15 |
| TWI561376B (en) | 2016-12-11 |
| TW201334961A (en) | 2013-09-01 |
| KR101996090B1 (en) | 2019-07-03 |
| JP5821664B2 (en) | 2015-11-24 |
| CN103223760A (en) | 2013-07-31 |
| KR20130086985A (en) | 2013-08-05 |
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Address after: Tokyo, Japan, Japan Patentee after: AGC Corporation Address before: Tokyo, Japan, Japan Patentee before: Asahi Glass Co., Ltd. |