KR102406292B1 - Peeling apparatus and peeling method for laminate, and manufacturing method of electronic device - Google Patents

Abstract

In the present invention, with respect to a laminate in which a first substrate and a second substrate are detachably attached, the first substrate and the second substrate are sequentially peeled along the peeling progress direction from one end side to the other end side at the interface. A peeling apparatus for a laminate, comprising: a support part for supporting the first substrate of the laminate; a plate-shaped first flexible member; and detachably provided on the first flexible member; A laminate comprising: a peeling unit including an adsorption unit for adsorbing a substrate; and a driving unit configured to deform the peeling unit such that the second substrate of the laminate is bent and deformed sequentially from one end side to the other end side It relates to a peeling device.

Description

The peeling apparatus and peeling method of a laminated body, and the manufacturing method of an electronic device TECHNICAL FIELD

The present invention relates to a peeling apparatus and a peeling method of a laminate, and a manufacturing method of an electronic device.

With the reduction in thickness and weight of electronic devices such as display panels, solar cells, and thin film secondary batteries, thinning of substrates (first substrates) such as glass plates, resin plates, and metal plates used in these electronic devices is desired.

However, as the thickness of the substrate decreases, the handleability of the substrate deteriorates, so it is difficult to form a functional layer for electronic devices (Thin Film Transistor (TFT), Color Filter (CF)) on the surface of the substrate. it gets difficult

Therefore, by attaching a reinforcing plate (second substrate) made of glass to the back surface of the substrate, constructing a laminate in which the substrate is reinforced with the reinforcing plate, and forming a functional layer on the surface of the substrate in the laminated state. A manufacturing method has been proposed. In this manufacturing method, since the handling property of a board|substrate improves, a functional layer can be formed favorably on the surface of a board|substrate. And a reinforcement board peels from a board|substrate after formation of a functional layer.

In the peeling method of the reinforcing plate disclosed in Patent Document 1, from one side of two corner portions positioned on a diagonal of a rectangular laminate to the other, the reinforcing plate or the substrate, or both of them are flexurally deformed in a direction spaced apart from each other. It is done by doing At this time, since peeling is performed smoothly, a peeling start part is formed in one corner part of a laminated body. The peeling start part is formed by inserting a predetermined amount of a peeling blade into the interface of a board|substrate and a reinforcement board from the end surface of a laminated body.

The peeling apparatus of patent document 1 is provided with a stage, a flexible member, a pad, etc., The stage adsorb|sucks and holds a board|substrate, The flexible member adsorb|sucks and holds the reinforcing plate, The flexible member is one side with a pad. The reinforcing plate is peeled from the substrate by bending it toward the other side.

The flexible member is composed of a rubber mounting portion (adsorption portion) and a defining portion defining the bending rigidity of the flexible member, and the groove portion of the mounting portion communicates with the through hole of the defining portion of the vacuum pump connected to the through hole. The reinforcing plate is adsorbed and held by the mounting part by the suction force.

International Publication No. 2011/024689

In the peeling apparatus of patent document 1, when the rubber-made mounting part deteriorated or an installation part was damaged by use, it had to replace|exchange the prescribed|regulated part, and it was not economical. When the regulation part is not replaced, the installation part must be removed from the regulation part and a new installation part must be installed in the regulation part, and there is also a problem in that the replacement operation takes a lot of work.

The present invention has been made in view of such a subject, and an object of the present invention is to provide a peeling apparatus and a peeling method for a laminate, and a method for manufacturing an electronic device, in which an adsorption unit for adsorbing and holding a substrate of a laminate is easy to replace.

In order to achieve the above object, the device for peeling a laminate of the present invention has, with respect to a laminate in which a first substrate and a second substrate are detachably attached, one end side at the interface between the first substrate and the second substrate. In the peeling apparatus of a laminated body which peels sequentially along the peeling progress direction toward the other end side, the support part which supports the said 1st board|substrate of the said laminated body, a plate-shaped 1st flexible member, and the said 1st flexibility a peeling unit detachably provided on a member and including an adsorption unit for adsorbing the second substrate of the laminate; It is characterized in that it is provided with a driving unit for deforming the unit.

In the laminate peeling method of the present invention, in order to achieve the above object, with respect to a laminate in which a first substrate and a second substrate are detachably attached, at the interface between the first substrate and the second substrate, from one end side In the peeling method of a laminated body which peels sequentially along the peeling advancing direction toward the other end side, the support process of supporting the said 1st board|substrate of the said laminated body with a support part, a plate-shaped 1st flexible member, and the said 1 Adsorption process of adsorbing the second substrate of the laminate by the suction unit using a peeling unit detachably provided on a flexible member and including a suction unit for adsorbing the second substrate of the laminate and a peeling process in which the peeling unit is deformed by a driving unit so that the second substrate of the laminate is bent and deformed sequentially from one end side to the other end side to be peeled off at the interface.

In order to achieve the above object, the method for manufacturing an electronic device of the present invention has a function of forming a functional layer on an exposed surface of the first substrate in a laminate in which a first substrate and a second substrate are detachably attached. A method of manufacturing an electronic device comprising: a layer forming step; and a separation step of separating the second substrate from the first substrate on which the functional layer is formed, wherein the separation step includes: using a peeling unit including a support step supported by an adsorption step of adsorbing the second substrate of the laminate by the adsorption unit; and deforming the peeling unit by a driving unit so that the second substrate of the laminate is bent and deformed sequentially from one end side to the other end side, A peeling step of peeling the second substrate from the first substrate is provided.

According to the present invention, since the suction unit is detachably provided with respect to the first flexible member, when the suction unit is exchanged, the suction unit is removed from the first flexible member and a new suction unit is provided on the first flexible member. Therefore, the exchange of the adsorption unit becomes easy. In addition, the downtime for replacing the adsorption unit can be shortened.

It is preferable that the said support part of this invention has the same structure as the said peeling unit. That is, in this invention, in the said support process, it is preferable to support the said 1st board|substrate using the said support part of the same structure as the said peeling unit in the said adsorption|suction process.

According to the above configuration, the first substrate is adsorbed and held by the support portion having the same configuration as the peeling unit, and the first substrate and the second substrate are bent and deformed sequentially from one end side to the other end side, the peeling unit and The support portion is deformed to separate the first substrate and the second substrate. In this case, since the first substrate and the second substrate are curved at the same time, the peeling force can be reduced as compared with the configuration in which only one substrate is curved.

The adsorption unit of the present invention includes a plate-shaped second flexible member provided on one side detachably from the first flexible member, and provided on the other side of the second flexible member, the second substrate It is preferable to have a breathable sheet for vacuum adsorbing an inner surface, and a seal frame member provided on the other surface of the second flexible member to surround the air-permeable sheet and contacting an outer peripheral surface of the second substrate excluding the inner surface. do.

According to the above configuration, when the inner surface of the second substrate is vacuum-adsorbed by the air-permeable sheet, the outer peripheral surface of the second substrate is in close contact with the seal frame member, so that the second substrate can be reliably vacuum-adsorbed to the air-permeable sheet. In addition, since the air-permeable sheet and the seal frame member are supported on the other side of the second flexible member, the air-permeable sheet and the seal frame member can be assembled with high precision outside the peeling device with respect to the second flexible member. . In addition, since the flexible air permeable sheet and the seal frame member are supported by the second flexible member having higher rigidity than those, their respective functions can be stably exhibited. In addition, although electrostatic adsorption and adhesion may be used instead of vacuum adsorption, since strong adsorption force is obtained, vacuum adsorption is preferable.

The suction unit of the present invention is provided to be detachably attached to the first flexible member via a double-sided adhesive tape, and the adhesive force of the double-sided adhesive tape to the suction unit is the adhesive force to the first flexible member. A higher one is preferable.

According to the above structure, when replacing the suction unit, the double-sided adhesive tape is taken out together with the suction unit, so that when the adhesive force of the double-sided adhesive tape decreases, it can be easily replaced with a new one. As a double-sided adhesive tape, a single-sided re-peelable type having a strong adhesive surface on one side and a re-peelable surface on the other side is used, and the re-peelable surface is adhered to the first flexible member, and the strong adhesive surface is adhered to the adsorption part. it is preferable

It is preferable that the adsorption unit of the present invention includes a plurality of sizes according to the size of the laminate, and that one adsorption unit selected based on the size of the laminate is detachably attached to the first flexible member. do.

According to the above characteristics, a plurality of adsorption units of a size corresponding to the size of the laminate are provided, and when the size of the laminate is changed, one adsorption unit corresponding to the size of the laminate is selected and replaced. Also at the time of replacement of the adsorption|suction part accompanying such a size change, replacement|exchange of an adsorption|suction part becomes easy, and the non-operation time for replacing|exchanging an adsorption|suction part can be shortened.

ADVANTAGE OF THE INVENTION According to the peeling apparatus and peeling method of the laminated body which concern on this invention, and the manufacturing method of an electronic device, exchange of the adsorption|suction part which adsorb|sucks and holds the board|substrate of a laminated body becomes easy.

BRIEF DESCRIPTION OF THE DRAWINGS It is a principal part enlarged side view which shows an example of the laminated body provided to the manufacturing process of an electronic device.
Fig. 2 is an enlarged side view of a main part showing an example of a laminate produced during the manufacturing process of an LCD;
3A to 3E are explanatory views showing a peeling start part forming method by a peeling start part forming apparatus.
It is a top view of the laminated body in which the peeling initiation part was formed by the peeling initiation part formation method.
Fig. 5 is a longitudinal sectional view showing the configuration of the peeling device according to the embodiment.
Fig. 6 is a plan view of a flexible plate schematically showing an arrangement position of a plurality of movable bodies with respect to a peeling unit;
7A to 7C are explanatory views showing the configuration of a peeling unit.
Fig. 8 is a longitudinal sectional view of a peeling device for peeling a reinforcing plate at an interface of a laminate.
9A to 9C are explanatory views showing a peeling method in time series for peeling the reinforcement plate of the laminate in which the peeling start part was formed by the peeling start part forming method.
10(A) to 10(C) are explanatory views showing in time series the peeling method of peeling the reinforcement plate of the laminated body following FIG. 9;
11(A) and 11(B) are explanatory views showing another form of the adsorption unit of the peeling unit;

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described according to an accompanying drawing.

Below, the case where the peeling apparatus and peeling method of the laminated body which concern on this invention are used in the manufacturing process of an electronic device are demonstrated.

An electronic device means electronic components, such as a display panel, a solar cell, and a thin film secondary battery. As the display panel, a liquid crystal display (LCD) panel, a plasma display panel (PDP), and an organic electroluminescence display (OELD) panel can be exemplified.

[Manufacturing process of electronic device]

Electronic devices are manufactured by forming functional layers for electronic devices (thin film transistors (TFTs) and color filters (CFs) in the case of LCDs) on the surface of a substrate made of glass, resin, metal, or the like.

Before the formation of the functional layer, the back surface of the substrate is attached to a reinforcing plate to constitute a laminate. Thereafter, a functional layer is formed on the surface of the substrate in the state of the laminate. And after formation of a functional layer, a reinforcing plate peels from a board|substrate.

That is, the manufacturing process of an electronic device is equipped with the functional layer formation process of forming a functional layer on the surface of a board|substrate in the state of a laminated body, and the separation process of isolate|separating a reinforcement plate from the board|substrate on which the functional layer was formed. In this separation process, the peeling apparatus and peeling method of the laminated body which concern on this invention are applied.

[Laminate (1)]

1 : is a principal part enlarged side view which shows an example of the laminated body 1. As shown in FIG.

The laminated body 1 is equipped with the board|substrate (1st board|substrate) 2 on which a functional layer is formed, and the reinforcing plate (2nd board|substrate) 3 which reinforces the board|substrate 2 . Moreover, as for the reinforcement board 3, the resin layer 4 as an adsorption|suction layer is equipped on the surface 3a, and the back surface 2b of the board|substrate 2 is attached to the resin layer 4 . That is, the substrate 2 can be peeled from the reinforcing plate 3 through the resin layer 4 by the van der Waals force acting between the resin layer 4 and the adhesive force of the resin layer 4 . is attached

[Substrate (2)]

As for the board|substrate 2, the functional layer is formed in the surface 2a. As the substrate 2, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be exemplified. Among these board|substrates, since a glass substrate is excellent in chemical-resistance and moisture permeability-resistance, and also has a small coefficient of linear expansion, it is suitable as the board|substrate 2 for electronic devices. In addition, as the coefficient of linear expansion decreases, there is also an advantage in that the pattern of the functional layer formed under high temperature is less likely to shift at the time of cooling.

As glass of a glass substrate, alkali-free glass, borosilicate glass, soda-lime glass, high silica glass, and oxide type glass which has other silicon oxide as a main component can be illustrated. As oxide type glass, glass whose content of silicon oxide by oxide conversion is (40)-(90) mass % is preferable.

It is preferable that the glass of a glass substrate selects and employ|adopts the glass suitable for the kind of the electronic device to manufacture, and the glass suitable for the manufacturing process. For example, it is preferable to employ|adopt glass (alkali free glass) which does not contain an alkali metal component substantially for the glass substrate for liquid crystal panels.

The thickness of the substrate 2 is set according to the type of the substrate 2 . For example, when adopting a glass substrate for the substrate 2, the thickness thereof is preferably 0.7 mm or less, more preferably 0.3 mm or less, still more preferably 0.1 mm for weight reduction and thinning of the electronic device. is set below. When thickness is 0.3 mm or less, favorable flexibility can be provided to a glass substrate. Moreover, when thickness is 0.1 mm or less, although a glass substrate can be wound up in roll shape, it is preferable from a viewpoint of glass substrate manufacture and a viewpoint of handling a glass substrate that the thickness is 0.03 mm or more.

In addition, although the board|substrate 2 is comprised from one board|substrate in FIG. 1, the board|substrate 2 may be comprised with the board|substrate of several sheets. That is, the board|substrate 2 can also be comprised by the laminated body which laminated|stacked multiple board|substrates. In this case, the thickness of the sum total of all the board|substrates which comprise the board|substrate 2 turns into the thickness of the board|substrate 2 .

[Reinforcement plate (3)]

As the reinforcing plate 3, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be illustrated.

The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is set according to the type, thickness, etc. of the substrate 2 to be reinforced. Moreover, although the thickness of the reinforcement board 3 may be thicker than the board|substrate 2, and may be thin, in order to reinforce the board|substrate 2, it is preferable that it is 0.4 mm or more.

In addition, although the reinforcing plate 3 is comprised from one board|substrate in this example, the reinforcing board 3 can also be comprised with the laminated body which laminated|stacked the multiple board|substrate. In this case, the thickness of the sum total of all the board|substrates which comprise the reinforcement board 3 turns into the thickness of the reinforcement board 3 .

[Resin Layer (4)]

In order to prevent the resin layer 4 from peeling between the resin layer 4 and the reinforcing plate 3 , the bonding force with the reinforcing plate 3 is higher than the bonding force with the substrate 2 . is set Thereby, in a peeling process, the board|substrate 2 peels at the interface of the resin layer 4 and the board|substrate 2 .

Although resin which comprises the resin layer 4 is not specifically limited, An acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a silicone resin, and a polyimide silicone resin can be illustrated. Several types of resins may be mixed and used. Especially, a silicone resin and a polyimide silicone resin are preferable from a viewpoint of heat resistance or peelability.

Although the thickness of the resin layer 4 is not specifically limited, Preferably it is set to 1-50 micrometers, More preferably, it is set to 4-20 micrometers. By making the thickness of the resin layer 4 into 1 micrometer or more, when a bubble or a foreign material mixes between the resin layer 4 and the board|substrate 2, by deformation|transformation of the resin layer 4, a bubble or a foreign material thickness can be absorbed. On the other hand, by making the thickness of the resin layer 4 into 50 micrometers or less, the formation time of the resin layer 4 can be shortened and since resin of the resin layer 4 is not used more than necessary, it is economical.

In addition, the outer shape of the resin layer 4 is the same as the outer shape of the reinforcing plate 3 or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entire resin layer 4 . it is preferable In addition, the outer shape of the resin layer 4 is preferably the same as the outer shape of the substrate 2 or larger than the outer shape of the substrate 2 so that the resin layer 4 can adhere the entire substrate 2 . .

In addition, although the resin layer 4 is comprised by one layer in FIG. 1, the resin layer 4 can also be comprised by two or more layers. In this case, the thickness of the sum total of all the layers which comprise the resin layer 4 turns into the thickness of the resin layer 4 . In addition, in this case, the kind of resin which comprises each layer may differ.

In addition, in embodiment, although the resin layer 4 which is an organic film was used as an adsorption layer, you may use an inorganic layer instead of the resin layer 4 . The inorganic film which comprises an inorganic layer contains at least 1 sort(s) chosen from the group which consists of metal silicide, nitride, carbide, and carbonitride, for example.

In addition, although the laminated body 1 of FIG. 1 is equipped with the resin layer 4 as an adsorption|suction layer, it is good also as a structure which removes the resin layer 4 and contains the board|substrate 2 and the reinforcement board 3. In this case, the substrate 2 and the reinforcing plate 3 are detachably attached by a van der Waals force or the like acting between the substrate 2 and the reinforcing plate 3 . In addition, when the substrate 2 and the reinforcing plate 3 are glass substrates, an inorganic thin film is applied to the surface 3a of the reinforcing plate 3 so that the substrate 2 and the reinforcing plate 3 do not adhere at a high temperature. It is preferable to form

[Laminate body 6 of embodiment in which a functional layer was formed]

A functional layer is formed in the surface 2a of the board|substrate 2 of the laminated body 1 by passing through a functional layer formation process. As a formation method of a functional layer, vapor deposition methods, such as a CVD (Chemical Vapor Deposition) method, a PVD (Physical Vapor Deposition) method, and a sputtering method are used. The functional layer is formed in a predetermined pattern by a photolithography method or an etching method.

Fig. 2 is an enlarged side view of a main part showing an example of a rectangular laminate 6 produced during the manufacturing process of LCD.

As for the laminated body 6, the reinforcement board 3A, the resin layer 4A, the board|substrate 2A, the functional layer 7, the board|substrate 2B, the resin layer 4B, and the reinforcement board 3B are this order. stacked and constructed. That is, the laminated body 6 of FIG. 2 corresponds to the laminated body 1 shown in FIG. 1 is arrange|positioned symmetrically with the functional layer 7 interposed therebetween. Hereinafter, the laminated body containing the board|substrate 2A, the resin layer 4A, and the reinforcement board 3A is called the 1st laminated body 1A, and the board|substrate 2B, the resin layer 4B, and the reinforcement board 3B. A laminate including the is called a second laminate 1B.

A thin film transistor TFT as a functional layer 7 is formed on the surface 2Aa of the substrate 2A of the first laminate 1A, and the surface 2Ba of the substrate 2B of the second laminate 1B. ), the color filter CF as the functional layer 7 is formed.

The 1st laminated body 1A and the 2nd laminated body 1B are integrated with the surfaces 2Aa, 2Ba of the board|substrates 2A, 2B overlapping with each other. Thereby, the laminated body 6 of the structure in which the 1st laminated body 1A and the 2nd laminated body 1B was arrange|positioned symmetrically across the functional layer 7 is manufactured.

After the peeling start part is formed with a knife in the peeling start part forming process of the separation process, the reinforcing plates 3A and 3B are sequentially peeled off in the peeling process of the separation process, after which a polarizing plate, a backlight, etc. It is installed, and the product, LCD, is manufactured.

[Peeling initiation part forming apparatus 10]

3(A) to 3(E) are explanatory views showing a peeling start part forming method by the peeling start part forming apparatus 10, and FIG. 3(A) is a laminate 6 and a knife (B) is an explanatory view showing the positional relationship with (N), FIG. 3(B) is an explanatory view of forming the peeling start part 26 in the interface 24 with the knife N, FIG. 3(C) is the interface An explanatory view showing the state immediately before forming the peeling start part 30 at (28), FIG. 3(D) is an explanation of forming the peeling start part 30 on the interface 28 with the knife N Fig. 3(E) is an explanatory view of the laminate 6 in which the peeling start portions 26 and 30 are formed. Moreover, FIG. 4 is a top view of the laminated body 6 in which the peeling initiation parts 26 and 30 were formed.

When the peeling start portions 26 and 30 are formed, the laminate 6 is held by the back surface 3Bb of the reinforcing plate 3B adsorbed on the table 12 as shown in FIG. 3A , It is supported horizontally (X-axis direction in the drawing).

The knife N is horizontally supported by the holder 14 so that a blade edge|tip may oppose to the end surface of 6 A of corner parts of the laminated body 6 . In addition, as for the knife N, the position of the height direction (Z-axis direction in a figure) is adjusted by the height adjustment device 16. As shown in FIG. Moreover, the knife N and the laminated body 6 are relatively moved in a horizontal direction by the conveying apparatus 18, such as a ball screw device. The transfer apparatus 18 should just move at least one of the knife N and the table 12 in a horizontal direction, and the knife N is moved in embodiment. In addition, a liquid supply device 22 for supplying the liquid 20 to the upper surface of the knife N before or during engraving is disposed above the knife N.

[Method for forming the peeling initiation part]

In the peeling start part formation method by the peeling start part forming apparatus 10, the cut-in position of the knife N is the corner part 6A of the laminated body 6, In the thickness direction of the laminated body 6, It sets in the overlapping position, and the amount of cutting of the knife N is set differently for every interface 24 and 28.

The formation procedure will be described.

In an initial state, the blade edge of the knife N exists in the position shifted|deviated from the height direction (Z-axis direction) with respect to the interface 24 of the board|substrate 2B and the resin layer 4B which are a 1st magnetic-graining position. Therefore, first, as shown in FIG.3(A), the knife N is moved in the height direction, and the height of the blade edge|tip of the knife N is set to the height of the interface 24. As shown in FIG.

Thereafter, as shown in FIG. 3B , the knife N is horizontally moved toward the corner portion 6A of the laminate 6 , and a predetermined amount of the knife N is inserted into the interface 24 . In addition, the liquid 20 is supplied to the upper surface of the knife N from the liquid supply device 22 at the time of magnetic insertion of the knife N or before magnetic cutting. Thereby, since the board|substrate 2B of the corner part 6A peels from the resin layer 4B, the peeling start part 26 of planar view triangular shape is formed in the interface 24 like FIG. In addition, although supply of the liquid 20 is not essential, if the liquid 20 is used, the liquid 20 remains in the peeling initiation portion 26 even after the knife N is removed, so that the peeling initiation portion that is not reattachable is (26) can be formed.

Next, the knife N is removed from the corner portion 6A in the horizontal direction, and as shown in Fig. 3(C), the blade edge of the knife N is placed at the second magnetic insertion position of the substrate 2A and the resin layer 4A. ) is set to the height of the interface 28 .

Thereafter, as shown in FIG. 3D , the knife N is horizontally moved toward the laminate 6 , and a predetermined amount of the knife N is inserted into the interface 28 . Similarly, the liquid 20 is supplied to the upper surface of the knife N from the liquid supply device 22 . Thereby, the peeling start part 30 is formed in the interface 28 like FIG.3(E). Here, the cutting amount of the knife N with respect to the interface 28 is made into small amount with respect to the interface 24. The above is the peeling initiation part formation method. In addition, it is good also considering the amount of cutting of the knife N with respect to the interface 24 smaller than the amount of cutting with respect to the interface 28.

The laminate 6 in which the peeling initiation parts 26 and 30 were formed is taken out from the peeling initiation part forming apparatus 10, it is conveyed to the peeling apparatus mentioned later, and is reinforced at the interfaces 24 and 28 by the peeling apparatus. The plates 3B and 3A are peeled off in sequence.

Although the details of the peeling method will be described later, as shown by the arrow A in FIG. 4 , the layered product 6 is bent from the corner portion 6A toward the corner portion 6B opposite to the corner portion 6A, so that the peeling start portion It is peeled first with the peeling start part 26 of the interface 24 with a large area of 26 as a starting point. Thereby, the reinforcing plate 3B peels. Then, by bending the laminated body 6 again from the corner part 6A toward the corner part 6B, the peeling start part 30 of the interface 28 where the area of the peeling start part 30 is small is a starting point. to be peeled off Thereby, 3 A of reinforcement boards peel.

Moreover, according to the size of the laminated body 6, the amount of cutting of the knife N becomes like this. Preferably it is 7 mm or more, More preferably, it is set to about 15-20 mm.

[Peeling device (40)]

5 : is a longitudinal sectional view which shows the structure of the peeling apparatus 40 of embodiment, and FIG. 6 is the arrangement position of the some movable body 44 with respect to the peeling unit 42 of the peeling apparatus 40 typically. It is a top view of the peeling unit 42 shown. 5 corresponds to a cross-sectional view taken along the line B-B in FIG. 6 , and in FIG. 6 , the laminate 6 is shown by a solid line.

As shown in FIG. 5 , the peeling device 40 includes a pair of movable devices 46 and 46 arranged vertically with the laminate 6 interposed therebetween. Since the movable devices 46 and 46 have the same configuration, the movable device 46 disposed on the lower side of Fig. 5 will be described here, and the movable device 46 disposed on the upper side will be given the same reference numerals for explanation. omit

The movable device 46 includes a plurality of movable bodies 44 , a plurality of drive devices (drive units) 48 that move the movable body 44 up and down for each movable body 44 , and a drive device for each drive device 48 . It is comprised by the controller 50 (drive part) etc. which control 48.

The peeling unit 42 adsorbs and holds the reinforcing board 3B in a vacuum in order to bend and deform the reinforcing board 3B. Further, instead of vacuum adsorption, electrostatic adsorption or magnetic adsorption may be used.

[Peeling unit 42]

FIG. 7A is a plan view of the peeling unit 42, and FIG. 7B is an enlarged longitudinal sectional view of the peeling unit 42 taken along line C-C of FIG. 7A. 7C shows that, with respect to the rectangular plate-shaped flexible plate (first flexible member) 52 constituting the peeling unit 42 , the adsorption unit 54 constituting the peeling unit 42 is It is an enlarged longitudinal cross-sectional view of the peeling unit 42 which shows what was provided detachably via the double-sided adhesive tape 56.

As described above, the peeling unit 42 is configured such that the suction unit 54 is detachably attached to the flexible plate 52 via the double-sided adhesive tape 56 .

The suction unit 54 includes a flexible plate (second flexible member) 58 that is thinner than the flexible plate 52 . The lower surface (one side) of the flexible plate 58 is detachably attached to the upper surface of the flexible plate 52 via a double-sided adhesive tape 56 .

Moreover, the suction part 54 is equipped with the rectangular air-permeable sheet 60 which adsorb|sucks and holds the inner surface of the reinforcing plate 3B of the laminated body 6 . The thickness of the air permeable sheet 60 is 2 mm or less, Preferably it is 1 mm or less for the purpose of reducing the tensile stress which generate|occur|produces in the reinforcement board 3B at the time of peeling, and 0.5 mm is used in embodiment.

Moreover, the adsorption|suction part 54 is provided with the seal|sticker frame member 62 which surrounds the air permeable sheet|seat 60, and the outer peripheral surface of the reinforcing plate 3B contacts. The seal frame member 62 and the air permeable sheet 60 are adhered to the upper surface (the other side) of the flexible plate 58 via a double-sided adhesive tape 64 . Further, the seal frame member 62 is a closed-cell sponge having a Shore E hardness of 20 degrees or more and 50 degrees or less, and the thickness thereof is 0.3 mm to 0.5 mm thicker than the thickness of the air permeable sheet 60 .

A frame-shaped groove 66 is provided between the air permeable sheet 60 and the seal frame member 62 . In addition, a plurality of through-holes 68 are opened in the flexible plate 52, one end of these through-holes 68 communicates with the groove 66, and the other end is connected via a suction pipe not shown in the figure. It is connected to an intake air source (for example, a vacuum pump).

Therefore, when the intake source is driven, the air in the suction pipe, the through hole 68 and the groove 66 is sucked, so that the inner surface of the reinforcing plate 3B of the laminate 6 is vacuum applied to the air permeable sheet 60 . Since the outer peripheral surface of the reinforcing plate 3B is in press-contact with the seal frame member 62 , the sealing property of the adsorption space surrounded by the seal frame member 62 can be improved.

The flexible plate 52 has a higher flexural rigidity than the flexible plate 58 , the air-permeable sheet 60 and the seal frame member 62 , so that the flexural rigidity of the flexible plate 52 dominates the flexural rigidity of the peeling unit 42 . . It is preferable that the bending rigidity per unit width (1 mm) of the peeling unit 42 is 1000-40000 N*mm<2>/mm. For example, in the part where the width|variety of the peeling unit 42 is 100 mm, bending rigidity becomes 100000-4000000N*mm<2>. By making the bending rigidity of the peeling unit 42 into 1000 N·mm 2 /mm or more, bending of the reinforcing plate 3B adsorbed to and held by the peeling unit 42 can be prevented. Moreover, by making the bending rigidity of the peeling unit 42 into 40000 N*mm<2>/mm or less, the reinforcing plate 3B adsorb|sucked by the peeling unit 42 and hold|maintained can be flexibly deformed appropriately.

The flexible plates 52 and 58 are resin members having a Young's modulus of 10 GPa or less, for example, a resin member such as polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, polyacetal (POM) resin, or the like. to be.

[Moveable Device (46)]

A plurality of disk-shaped movable bodies 44 shown in FIG. 5 are fixed to the lower surface of the flexible plate 52 in a checkerboard shape as shown in FIG. 6 . These movable bodies 44 are fixed to the flexible plate 52 by fastening members such as bolts, but may be adhesively fixed instead of bolts. These movable bodies 44 are independently moved up and down by the drive device 48 driven by the controller 50 .

That is, the controller 50 controls the drive device 48, and in the direction of peeling progress indicated by an arrow A from the movable body 44 located on the corner portion 6A side of the laminate 6 in FIG. 6 . The movable body 44 positioned on the corner portion 6B side is moved downward in order. By this operation|movement, like the longitudinal sectional view of FIG. 8, the reinforcement board 3B of the laminated body 6 is peeled from the interface 24 with the peeling start part 26 (refer FIG. 4) as a starting point. In addition, the laminated body 6 shown in FIGS. 5 and 8 is the laminated body 6 in which the peeling start parts 26 and 30 were formed by the peeling start part formation method demonstrated with FIG.

The driving device 48 is constituted of, for example, a rotary servo motor and a ball screw mechanism. The rotational motion of the servomotor is converted into linear motion in the ball screw mechanism, and is transmitted to the rod 70 of the ball screw mechanism. A movable body 44 is provided at the distal end of the rod 70 via a ball joint 72 . Thereby, as shown in FIG. 8 , the movable body 44 can be tilted to follow the bending deformation of the peeling unit 42 . Accordingly, the peeling unit 42 can be bent and deformed from the corner portion 6A toward the corner portion 6B, without applying an excessive force to the peeling unit 42 . In addition, as the drive device 48, it is not limited to a rotary servomotor and a ball screw mechanism, A linear servomotor or a fluid pressure cylinder (for example, a pneumatic cylinder) may be sufficient.

It is preferable that the plurality of driving devices 48 be installed on the frame 74 that can be moved up and down through a cushion member 76 . The cushion member 76 is elastically deformed to follow the bending deformation of the peeling unit 42 . As a result, the rod 70 tilts with respect to the frame 74 .

The frame 74 is moved downward by a driving unit (not shown) when the peeled reinforcing plate 3B is removed from the peeling unit 42 .

The controller 50 is configured as a computer including a recording medium such as a CPU, ROM and RAM, and the like. The controller 50 controls the plurality of drive devices 48 for each drive device 48 by executing the program recorded on the recording medium on the CPU, and controls the lifting and lowering movement of the plurality of movable bodies 44 .

[The peeling method of the reinforcement boards 3A, 3B by the peeling apparatus 40]

9(A) to 9(C) and FIG. 10(A) to 10(C) show the peeling initiation part ( A method of peeling the laminate 6 on which 26 , 30 is formed is shown. That is, the peeling method of peeling the reinforcing plates 3A, 3B of the laminated body 6 is shown time-sequentially by the same figure.

In addition, the carrying-in operation|work of the laminated body 6 to the peeling apparatus 40, and the carrying-out operation|work of the peeled reinforcing plates 3A, 3B, and the panel P are the suction pad 78 shown to Fig.9 (A). It is performed by the conveying apparatus 80 provided with. In addition, in FIGS. 9 and 10, illustration of the movable device 46 is abbreviate|omitted in order to avoid the complication of drawing. In addition, the panel P is a product panel to which 2A of board|substrates except reinforcement board 3A, 3B, and board|substrate 2B were affixed via the functional layer 7 .

FIG. 9(A) is a side view of the peeling apparatus 40 in which the laminate 6 is mounted on the lower peeling unit 42 by the operation shown by the arrows E and F of the conveying device 80 . In this case, the lower peeling unit 42 and the upper peeling unit 42 are relatively sufficiently retracted so that the conveying device 80 is inserted between the lower peeling unit and the upper peeling unit 42 . moved in advance And when the laminated body 6 is mounted on the lower peeling unit 42, the reinforcement board 3B of the laminated body 6 is adsorb|sucked by vacuum by the lower peeling unit 42, and is hold|maintained. That is, the adsorption|suction process in which the reinforcing plate 3B which is a 2nd board|substrate is adsorb|sucked by the peeling unit 42 at the lower side is shown in FIG.9(A).

9B shows that the lower peeling unit 42 and the upper peeling unit 42 move in a relatively close direction, and the reinforcing plate 3A of the laminate 6 is moved in the upper peeling unit 42 . ) is a side view of the peeling device 40 in a state in which it was adsorbed and held in a vacuum. That is, the adsorption|suction process in which the reinforcing plate 3A which is a 2nd board|substrate is adsorb|sucked by the upper peeling unit 42 and is hold|maintained is shown by FIG.9(B).

In addition, when peeling the board|substrate 2 of the laminated body 1 shown in FIG. 1 from the reinforcement board 3 with the peeling apparatus 40, the board|substrate 2 which is a 1st board|substrate is removed by the upper peeling unit. It is supported by 42 (support process), and the reinforcing plate 3 which is a 2nd board|substrate is adsorb|sucked by the lower peeling unit 42, and is hold|maintained (adsorption process). In this case, the support part which supports the board|substrate 2 is not limited to the peeling unit 42, What is necessary is just to be able to support the board|substrate 2 detachably. However, by using the peeling unit 42 as a support part, since the board|substrate 2 and the reinforcing plate 3 can be simultaneously curved and peeled, compared with the form in which only the board|substrate 2 or the reinforcing plate 3 is curved, peeling is possible. There is an advantage that the force can be reduced.

Returning to Fig. 9, Fig. 9C shows the laminate 6 while bending and deforming the lower peeling unit 42 downward from the corner portion 6A of the laminate 6 toward the corner portion 6B. ) is a side view showing a state in which the reinforcing plate 3B is peeled off from the peeling start portion 26 (refer to FIG. 4 ) of the interface 24 as a starting point. That is, in the plurality of movable bodies 44 of the lower peeling unit 42 shown in FIG. 8 , the corner portions 6B from the movable body 44 positioned on the corner portion 6A side of the laminate 6 . ), the movable body 44 located on the side is moved downward in order to peel the reinforcing plate 3B at the interface 24 (a peeling process). Further, in conjunction with this operation, in the plurality of movable bodies 44 of the upper peeling unit 42, from the movable body 44 located on the corner 6A side of the laminate 6 to the corner part ( 6B) The movable body 44 located on the side may be moved upward in order, and the reinforcing plate 3B may be peeled off. Thereby, compared with the form which curves only the reinforcement board 3B, peeling force can be made small.

Fig. 10(A) is a side view of the peeling device 40 in a state in which the reinforcing plate 3B is completely peeled off. According to the same figure, the peeled reinforcing plate 3B is vacuum-adsorbed and held by the lower peeling unit 42, and the laminate 6 (reinforcing plate 3A) and the panel (reinforcing plate 3A) excluding the reinforcing plate 3B P) containing the laminated body) is adsorbed and held by the upper peeling unit 42 in a vacuum.

In addition, the lower peeling unit 42 and the upper peeling unit 42 are relatively sufficiently retracted so that the conveying device 80 shown in FIG. 9A is inserted between the upper and lower peeling units 42 . moved to the designated position.

After that, first, the vacuum adsorption of the lower peeling unit 42 is released. Next, the reinforcing plate 3B is adsorbed and held by the suction pad 78 of the conveying device 80 via the resin layer 4B. Then, the reinforcing plate 3B is carried out from the peeling apparatus 40 by operation|movement of the conveyance apparatus 80 shown by arrow G, H of FIG.10(A).

Fig. 10B is a side view in which the laminate 6 except for the reinforcing plate 3B is adsorbed and held in a vacuum by the lower peeling unit 42 and the upper peeling unit 42 . That is, the lower peeling unit 42 and the upper peeling unit 42 are moved in a relatively close direction, and the substrate 2B is vacuum-adsorbed and held by the lower peeling unit 42 (support). process).

Fig. 10(C) shows the reinforcing plate 3A of the laminate 6 while bending and deforming the upper peeling unit 42 upward from the corner portion 6A of the laminate 6 to the corner portion 6B. ) is a side view showing a state in which the peeling starts at the interface 28 with the peeling start portion 30 (refer to FIG. 4 ) as a starting point. That is, in the some movable body 44 of the upper peeling unit 42 shown in FIG. 8, the corner part 6B from the movable body 44 located in the corner part 6A side of the laminated body 6 . ) The movable body 44 located on the side is moved upward one after another to peel the reinforcing plate 3A at the interface 28 (a peeling process). Further, in conjunction with this operation, in the plurality of movable bodies 44 of the lower peeling unit 42, from the movable body 44 located on the corner 6A side of the laminate 6 to the corner part ( 6B) The movable body 44 located on the side may be moved downward in order to peel the reinforcing plate 3A at the interface 28 . Thereby, compared with the form which curves only 3 A of reinforcing plates, peeling force can be made small.

Thereafter, the reinforcing plate 3A completely peeled from the panel P is taken out from the upper peeling unit 42 , and the panel P is taken out from the lower peeling unit 42 . The above is the peeling method of the laminated body 6 in which the peeling start parts 26 and 30 were formed in 6 A of corner parts.

[Features of the peeling device 40]

First, as shown in FIG. 7(C), the suction part 54 was provided with respect to the flexible board 52 via the double-sided adhesive tape 56 so that attachment and detachment was possible, It is characterized by the above-mentioned.

Thereby, when replacing|exchanging the adsorption|suction part 54 with respect to the flexible board 52, the adsorption|suction part 54 is removed from the flexible board 52, and the new adsorption|suction part 54 is attached to the flexible board 52. Just do it. Therefore, replacement of the adsorption|suction part 54 becomes easy. In addition, the downtime for replacing the adsorption unit 54 can be shortened. The adsorption unit 54 is attached or fixed to the flexible plate 52 in a detachable state. By preparing the various adsorption|suction parts which changed the shape of the seal frame member 62, it can respond|correspond to the laminated body of various sizes and shapes. In particular, it is preferable that the upper suction part 54 is replaceable because the assembly precision of the suction part 54 can be improved and the laminated body of various sizes and shapes can be peeled off in a short time.

It is preferable that the adhesive force of the double-sided adhesive tape 56 to the adsorption|suction part 54 is higher than the adhesive force with respect to the flexible board 52. As shown in FIG.

Thereby, when replacing the suction part 54, since the double-sided adhesive tape 56 is taken out together with the suction part 54, when the adhesive force of the double-sided adhesive tape 56 falls, it is easy to replace with a new one. can do. As the double-sided adhesive tape 56, a single-sided re-peelable type having a strong adhesive surface on one side and a re-peelable surface on the other is used, the re-peelable surface is adhered to the flexible plate 52, and the strongly adhesive surface is attached to the suction part 54 ), it is preferable to use it by adhering to it. As the double-sided adhesive tape 56, the double-sided tape (product name #7686UR) made from Ebisukasei Co., Ltd. can be illustrated, for example. In addition, the means for detachably attaching the adsorption|suction part 54 with respect to the flexible board 52 is not limited to the double-sided adhesive tape 56, You may make it detachable by a vacuum adsorption|suction means.

Next, as shown in FIG. 7(A) and FIG. 7(B), the suction part 54 is comprised by the flexible plate 58, the air permeable sheet|seat 60, and the seal|sticker frame member 62, It is characterized by the above-mentioned.

That is, when the inner surface of the reinforcing plate 3B is vacuum-adsorbed by the air permeable sheet 60 , the outer circumferential surface of the reinforcing plate 3B is in close contact with the seal frame member 62 , so that air leakage can be prevented, and thus the reinforcement The plate 3B can be reliably vacuum-adsorbed to the air permeable sheet 60 .

In addition, since the air permeable sheet 60 and the seal frame member 62 are supported by the flexible plate 58, the air permeable sheet 60 and the seal frame member 62 are separated from the flexible plate 58 by a peeling device ( 40) can be assembled from the outside with high precision.

Further, since the flexible air permeable sheet 60 and the seal frame member 62 are supported by the flexible plate 58 having higher rigidity than these, their respective functions can be stably exhibited.

Next, paying attention to the fact that the adsorption|suction part 54 can be replaced|exchanged, it is made to exchange with the adsorption|suction part 54 of the size corresponding to the size of the laminated body 6, It is characterized by the above-mentioned.

That is, the adsorption unit 54 is pre-equipped with a plurality of sizes according to the size of the laminate 6 , and one suction unit selected based on the size of the laminate 6 is detachably attached to the flexible plate 52 . is mounted

Fig. 11A is a plan view of the peeling unit 42, and Fig. 11B is an enlarged longitudinal cross-sectional view of the peeling unit 42 taken along line D-D in Fig. 11A.

A rectangular reinforcing plate 8 smaller in size than the reinforcing plate 3B shown in FIG. 7 is adsorbed and held by the adsorption portion 82 of the peeling unit 42 of FIG. 11 . For this reason, the size of the adsorption|suction part 82 is smaller than the air permeable sheet 60 shown in FIG. 7, and the air permeable sheet 84 of the size corresponding to the size of the reinforcing plate 8 is used. In addition, the seal|sticker frame member 86 whose size is larger than the seal|sticker frame member 62 shown in FIG. 7 is used for the adsorption|suction part 82. As shown in FIG.

The air-permeable sheet 84 and the seal frame member 86 are attached to the upper surface of the flexible plate 58 via a double-sided adhesive tape 64 . When replacing the suction unit, the double-sided adhesive tape 56 is peeled from the flexible plate 52 . A frame-shaped groove 88 is provided between the air permeable sheet 84 and the seal frame member 86 , and the groove 88 communicates with the through hole 68 . Accordingly, the inner surface of the reinforcing plate 8 is vacuum-adsorbed and held by the air permeable sheet 84 , and the outer peripheral surface of the reinforcing plate 8 is pressed into contact with the seal frame member 86 .

Thus, also at the time of exchange of the adsorption|suction part accompanying the size change of a reinforcing plate, replacement|exchange of an adsorption|suction part becomes easy, and the non-operation time for replacement|exchange of an adsorption|suction part can be shortened.

Although this invention was detailed also demonstrated with reference to the specific embodiment, it is clear for those skilled in the art that various changes and correction can be added without deviating from the mind and range of this invention.

This application is based on the JP Patent application 2014-116464 for which it applied on June 5, 2014, The content is taken in here as a reference.

N: knife
P: panel
1: Laminate
1A: first laminate
1B: second laminate
2: Substrate
2a: the surface of the substrate
2b: the back side of the substrate
2A: substrate
2Aa: the surface of the substrate
2B: substrate
2Ba: the surface of the substrate
3: reinforcing plate
3a: surface of reinforcing plate
3A: reinforcing plate
3B: reinforcing plate
3Bb: back side of reinforcing plate
4: resin layer
4A: resin layer
4B: resin layer
6: Laminate
6A, 6B: Corner
7: functional layer
8: reinforcing plate
10: Peeling start part forming apparatus
12: table
14: holder
16: height adjustment device
18: transfer device
20: liquid
22: liquid supply device
24: interface
26: peeling start part
28: interface
30: peeling start part
40: peeling device
42: peeling unit
44: movable body
46: movable device
48: drive device
50: controller
52: flexible board
54: adsorption unit
56: double-sided adhesive tape
58: flexible board
60: breathable sheet
62: seal frame member
64: double-sided adhesive tape
66: home
68: through hole
70: load
72: ball joint
74: frame
76: cushion member
78: suction pad
80: conveying device
82: adsorption unit
84: breathable sheet
86: seal frame member
88: home

Claims (11)

With respect to a laminate in which a first substrate and a second substrate are detachably attached to each other, at the interface between the first substrate and the second substrate, the laminate is sequentially peeled along the peeling progress direction from one end side to the other end side. A peeling device comprising:
a support part for supporting the first substrate of the laminate;
a peeling unit including a plate-shaped first flexible member and a suction unit detachably provided on the first flexible member for adsorbing the second substrate of the laminate;
and a driving unit configured to deform the peeling unit so that the second substrate of the laminate is bent and deformed sequentially from one end side to the other end side. According to claim 1,
The said support part is the peeling apparatus of the laminated body which has the same structure as the said peeling unit. 3. The method of claim 1 or 2,
The adsorption unit,
a plate-shaped second flexible member having one side detachably provided on the first flexible member;
a breathable sheet provided on the other surface of the second flexible member and vacuum adsorbing the inner surface of the second substrate;
and a seal frame member provided on the other surface of the second flexible member to surround the air-permeable sheet and contacting an outer circumferential surface of the second substrate excluding the inner surface. 3. The method of claim 1 or 2,
The adsorption unit is provided detachably from the first flexible member via a double-sided adhesive tape,
The adhesive force of the said double-sided adhesive tape to the said adsorption|suction part is higher than the adhesive force with respect to the said 1st flexible member. 3. The method of claim 1 or 2,
The said adsorption|suction part is equipped with the thing of several sizes according to the size of the said laminated body, The one adsorption|suction part selected based on the size of the said laminated body is detachably attached to the said 1st flexible member. With respect to a laminate in which a first substrate and a second substrate are detachably attached to each other, at the interface between the first substrate and the second substrate, the laminate is sequentially peeled along the peeling progress direction from one end side to the other end side. In the peeling method,
a supporting step of supporting the first substrate of the laminate by a supporting unit;
Using a peeling unit including a plate-shaped first flexible member and an adsorption unit detachably provided on the first flexible member and adsorbing the second substrate of the laminate, the lamination unit is performed by the adsorption unit an adsorption step of adsorbing the second substrate of a sieve;
and a peeling process in which the peeling unit is deformed by a driving unit so that the second substrate of the laminate is bent and deformed sequentially from one end side to the other end side to be peeled off at the interface. 7. The method of claim 6,
The said support process WHEREIN: The peeling method of the laminated body which supports the said 1st board|substrate using the said support part of the same structure as the said peeling unit in the said adsorption|suction process. 8. The method according to claim 6 or 7,
The said adsorption|suction part is equipped with the thing of several sizes according to the size of the said laminated body, The peeling method of the laminated body in which one adsorption|suction part selected based on the size of the said laminated body is detachably attached to the said 1st flexible member. A functional layer forming step of forming a functional layer on an exposed surface of the first substrate with respect to a laminate in which a first substrate and a second substrate are detachably attached thereto; 2 A method for manufacturing an electronic device having a separation step of separating a substrate, the method comprising:
The separation process is
a supporting step of supporting the first substrate of the laminate by a supporting unit;
Using a peeling unit including a plate-shaped first flexible member and an adsorption unit detachably provided on the first flexible member and adsorbing the second substrate of the laminate, the lamination unit is performed by the adsorption unit an adsorption step of adsorbing the second substrate of a sieve;
and a peeling process of peeling the second substrate from the first substrate by deforming the peeling unit by a driving unit so that the second substrate of the laminate is bent and deformed sequentially from one end side to the other end side. A method for manufacturing an electronic device. 10. The method of claim 9,
In the said support process, the manufacturing method of the electronic device which supports the said 1st board|substrate using the said support part of the same structure as the said peeling unit in the said adsorption|suction process. 11. The method of claim 9 or 10,
The said adsorption|suction part is equipped with the thing of several sizes according to the size of the said laminated body, The manufacturing method of the electronic device in which one adsorption|suction part selected based on the size of the said laminated body is detachably attached to the said 1st flexible member.

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