KR102406894B1 - Peeling apparatus and peeling method for laminate, and manufacturing method of electronic device - Google Patents

Abstract

The present invention relates to a direction of peeling progress from one end of the second substrate to the other in a rectangular laminate having a side length of 600 mm or more, in which a first substrate and a second glass substrate are detachably attached. In the laminate peeling apparatus for peeling the second substrate from the first substrate by bending the second substrate along the , wherein the flexible member includes a body portion and a porous member, the second substrate is adsorbed and held on the body portion via the porous member, and the porous member is a sheet-like member having a thickness of 2 mm or less, characterized in that It relates to the peeling apparatus of the laminated body which says.

Description

The peeling apparatus and peeling method of a laminated body, and the manufacturing method of an electronic device TECHNICAL FIELD

The present invention relates to a peeling apparatus and a peeling method of a laminate, and a manufacturing method of an electronic device.

With the reduction in thickness and weight of electronic devices such as display panels, solar cells, and thin film secondary batteries, thinning of substrates (first substrates) such as glass plates, resin plates, and metal plates used in these electronic devices is desired.

However, as the thickness of the substrate decreases, the handling property of the substrate deteriorates, so it is not recommended to form a functional layer for electronic devices (Thin Film Transistor (TFT), Color Filter (CF)) on the surface of the substrate. it gets difficult

Accordingly, a method is proposed in which a glass reinforcing plate (second substrate) is attached to the back surface of the substrate, a laminate is formed in which the substrate is reinforced with the reinforcing plate, and a functional layer is formed on the surface of the substrate in the state of the laminate. (refer to Patent Document 1). In this method, since the handling property of a board|substrate improves, a functional layer can be formed favorably on the surface of a board|substrate. And the reinforcing plate is peeled from a board|substrate after formation of a functional layer.

The peeling method of the reinforcing plate is performed by bending and deforming the reinforcing plate or the substrate, or both of them in a direction spaced apart from each other, from one side to the other of the two corner portions located on the diagonal of a rectangular laminate as an example. . At this time, in order to perform peeling smoothly, a peeling start part is produced in one corner part of a laminated body. A peeling start part is produced by inserting a predetermined amount of a peeling blade into the interface of a board|substrate and a reinforcing plate from the end surface of a laminated body like patent document 1.

The peeling apparatus of patent document 1 is provided with a stage, a flexible member, a pad, etc., The board|substrate is adsorbed and held by the stage, the reinforcing plate is adsorbed and held by the flexible member, and the reinforcing plate is moved from one side to the other with the pad. By bending and deforming, the reinforcing plate is peeled from the substrate.

The flexible member is composed of a rubber mounting portion and a defining portion (body portion) defining the bending rigidity of the flexible member, the groove portion of the mounting portion and the through hole of the defining portion communicate with each other, and the vacuum pump connected to the through hole. The reinforcing plate is adsorbed and held in the installation part by the suction force.

Patent Document 1 discloses that the thickness of the mounting portion is 1 mm or more and 30 mm or less.

In addition, as for the regulation part, it is disclosed that the flexural rigidity per unit width (1 mm) is 1000 to 40000 N mm2 / mm, and in addition to resin plates such as polyvinyl chloride, acrylic resin, polyacetal resin, and the like, a metal plate is used. that is disclosed.

International Publication No. 2011/024689

In the peeling apparatus of patent document 1, in the case of the reinforcing plate whose length of one side is less than 600 mm, it can peel smoothly without a problem. However, in the case of a reinforcing plate having a length of one side of 600 mm or more, the reinforcing plate may be damaged during peeling. Moreover, in the reinforcing plate whose length of one side is 1000 mm or more, there existed a problem that the occurrence frequency of a breakage became high. In addition, the length of one side of a reinforcing plate and the length of one side of a laminated body are equivalent.

The present invention has been made in view of such a subject, and in particular, it is a laminate having a length of 600 mm or more on one side. It aims at providing the peeling apparatus and peeling method of the laminated body which can prevent the breakage of 2 board|substrates, and the manufacturing method of an electronic device.

The present invention has been made based on the following first and second findings by earnestly examining the problems of the prior art.

[First knowledge]

When a glass reinforcing plate is warped, in the vicinity of the peeling front (the boundary between the peeled portion and the non-peelable portion), tensile stress is generated in the outer circumferential portion (the surface attached to the substrate), and compressive stress is generated in the inner circumferential portion. Glass has the characteristic that although it is strong in compressive stress with respect to breakage, it is weak in tensile stress.

The in-plane holding force (adsorption force per unit area x adsorption area x friction coefficient) of the reinforcing plate with respect to the flexible member increases as the size of the reinforcing plate increases.

Based on the said premise, when a reinforcing plate is bent with a flexible member, the stress which generate|occur|produces in a reinforcing board will also rise. At this time, when the reinforcing plate is bent while sliding with respect to the flexible member, only a tensile stress corresponding to the bending occurs in the outer circumferential portion of the reinforcing plate.

However, since the said in-plane holding force increases as the size of a reinforcing plate becomes large, the phenomenon that the sliding of the reinforcing plate with respect to a flexible member worsens remarkably (or slipping disappears completely) arises.

When the sliding of the reinforcing plate with respect to the flexible member worsens, excessive tensile stress is generated in the outer circumferential portion of the reinforcing plate. That is, the sum of the tensile stress generated by bending the reinforcing plate alone and the tensile stress generated in the neutral plane of the reinforcing plate by partially or all restraining the sliding between the reinforcing plate and the flexible member acts on the outer circumference of the reinforcing plate. do. Even when it was a case where this was a cause and the reinforcement board was bent with the same radius of curvature, it discovered that the reinforcing board with a large size became more easily damaged than the reinforcing board with a small size. That is, the first knowledge is a point focusing on the sliding of the reinforcing plate with respect to the flexible member.

[Second knowledge]

When the reinforcing plate is bent at a position away from the main body of the flexible member in a state where the reinforcing plate has poor sliding with respect to the flexible member, the tensile stress generated in the outer circumferential portion of the reinforcing plate is compared with the case where the reinforcing plate is bent at an adjacent position It becomes large and causes damage. That is, the second knowledge is a point focused on the distance between the main body of the flexible member and the face of the reinforcing plate. In addition, the tensile stress is obtained by a known stress calculation formula based on the radius of curvature of the main body of the flexible member and the reinforcing plate, Young's modulus, and the thickness of the reinforcing plate.

Based on the 1st and 2nd knowledge, this invention which solves the conventional subject is provided below.

In order to achieve the above object, the laminate peeling apparatus of the present invention is a rectangular laminate having a side length of 600 mm or more, in which a first substrate and a glass second substrate are peelably attached to each other. In a laminate peeling apparatus for peeling the second substrate from the first substrate by bending the second substrate along the peeling proceeding direction from one end side of the substrate to the other end side, the second substrate is held and the a flexible member for bending in a peeling proceeding direction, wherein the flexible member has a main body and a porous member, the second substrate is adsorbed and held in the main body with the porous member interposed therebetween, the porous member comprising: It is a sheet-like member with a thickness of 2 mm or less, It is characterized by the above-mentioned.

The peeling method of the laminate of the present invention is a peeling method of a rectangular laminate having a side length of 600 mm or more, in which a first substrate and a glass second substrate are detachably attached to each other in order to achieve the above object, a holding step of adsorbing and holding the second substrate of the laminate to the main body via the porous member of a flexible member including a porous member having a thickness of 2 mm or less and a main body; and a peeling step of peeling the second substrate from the first substrate by bending the flexible member along a peeling proceeding direction from the to the other end side.

In the manufacturing method of the electronic device of this invention, in order to achieve the said objective, in the rectangular laminated body with one side length of 600 mm or more which a 1st board|substrate and a glass-made 2nd board|substrate are attached so that peeling is possible, it said 1st A method of manufacturing an electronic device comprising: a functional layer forming process of forming a functional layer on an exposed surface of a substrate; and a separating process of separating the second substrate from the first substrate on which the functional layer is formed, wherein the separating process comprises: a holding step of adsorbing and holding the second substrate of the laminate to the main body via the porous member of a flexible member including a porous member having a thickness of 2 mm or less and a main body; and a peeling step of peeling the second substrate from the first substrate by bending the flexible member along a peeling advancing direction toward the other end side.

In the present invention, a rectangular laminate having a side length of 600 mm or more with a high frequency of breakage during peeling is targeted, and a porous member corresponding to the distance between the body portion of the flexible member and the surface of the laminate. The thickness was defined to be 2 mm or less. Then, by adsorbing and holding the second substrate of the laminate to the main body through the porous member, bending the flexible member, and bending the second substrate from one end side to the other end side, the second substrate is formed into the first peel off from the substrate.

According to the present invention, even in a rectangular laminate having a side length of 600 mm or more, that is, even in a laminate that does not slide with respect to the body portion of the flexible member during bending deformation, since the thickness of the porous member is 2 mm or less, the second The tensile stress generated on the neutral plane of the substrate is significantly reduced. Thereby, since the tensile stress generated in the outer circumferential portion of the second substrate is also greatly reduced, it is possible to prevent damage to the second substrate. The lower limit of the adsorption force for bending the glass-made second substrate with high rigidity is prescribed, and even when the second substrate is adsorbed and bent with the lower limit of the adsorption force, slip is suppressed in the second substrate having one side of 600 mm or more. .

This invention is suitable when the length of one side of the said laminated body is 1000 mm or more.

According to the present invention, it has been confirmed by experiment that the second substrate can be smoothly peeled from the first substrate even in a laminate having a length of 1000 mm or more on one side in which breakage occurs remarkably. For example, it was confirmed through experiments that even a laminate having a long side of 1250 mm and a short side of 1050 mm was peeled off without damaging the second substrate.

In this invention, it is preferable that the said porous member is 1 mm or less in thickness.

When the porous member has a thickness of 1 mm or less, the distance between the main body of the flexible member and the second substrate becomes shorter, so that the tensile stress generated in the second substrate can be further reduced.

In the present invention, the body portion of the flexible member is preferably a resin member having a Young's modulus of 10 GPa or less.

When the body portion of the flexible member is made of a material that is about the same as or larger than the Young's modulus (70 GPa to 80 GPa) of the second substrate made of glass, the effect of bearing the tensile stress of the second substrate generated during bending deformation in the body portion is reduced. It is not preferable because it does not obtain enough, and the effect|action which bears the tensile stress of a main body part on the 2nd board|substrate on the contrary arises.

Therefore, when the main body of the flexible member is made of a resin member having a Young's modulus of 10 GPa or less, the main body can bear the tensile stress of the second substrate that occurs during bending deformation. Thereby, the tensile stress which generate|occur|produces in a 2nd board|substrate can be reduced further.

In the present invention, the body portion of the flexible member is provided with a frame-shaped member that surrounds the porous member and is in contact with the second substrate, wherein the frame-shaped member has a Shore E hardness of 20 degrees or more and 50 degrees or less. It is preferable that it is a closed-cell sponge.

According to such a configuration, all the edge portions of the second substrate are in close contact with the frame-shaped member, and since the inner airtightness of the frame-shaped member is maintained, the leakage of suction air when the second substrate is vacuum-adsorbed to the porous member is reduced in the frame shape. absence can be prevented.

In addition, when the frame-shaped member is a closed-cell sponge having a Shore E hardness of 20 degrees or more and 50 degrees or less, even if a local slight deformation occurs in the body portion of the flexible member during peeling, the deformation is absorbed by the elasticity of the sponge can do. Therefore, since the adhesiveness of the edge part of a sponge and a 2nd board|substrate can be maintained, leakage of the suction air at the time of peeling can be prevented.

According to the laminated body peeling apparatus and peeling method of this invention, and the manufacturing method of an electronic device, especially in a laminated body whose length of one side is 600 mm or more, the flexible member with which the reinforcing plate was adsorbed and held is bent and deformed, and a reinforcing plate is peeled from a board|substrate. When doing this, it is possible to prevent damage to the reinforcing plate.

BRIEF DESCRIPTION OF THE DRAWINGS It is a principal part enlarged side view which shows an example of the laminated body provided to the manufacturing process of an electronic device.
Fig. 2 is an enlarged side view of a main part showing an example of a laminate produced during the manufacturing process of an LCD;
3(A) to 3(E) are explanatory views showing a peeling start part manufacturing method by a peeling start part manufacturing apparatus.
It is a top view of the laminated body in which the peeling initiation part was produced by the peeling initiation part manufacturing method.
Fig. 5 is a longitudinal sectional view showing the configuration of the peeling device according to the embodiment.
Fig. 6 is a plan view of a flexible plate schematically showing an arrangement position of a plurality of movable bodies with respect to the flexible plate;
7A and 7B are a plan view and a cross-sectional view showing the configuration of the flexible plate.
Fig. 8 is a longitudinal cross-sectional view of a peeling device for peeling a reinforcing plate at an interface of a laminate.
9(A) to 9(C) are explanatory views showing in time series the peeling method of peeling the reinforcement plate of the laminate in which the peeling initiation part was produced by the peeling initiation part manufacturing method.
10(A) to 10(C) are explanatory views showing in time series the peeling method of peeling the reinforcement plate of the laminated body following FIG. 9;
11 is a graph showing the relationship between the tensile stress generated in the reinforcing plate with respect to the thickness of the porous sheet.
Fig. 12 is a longitudinal sectional view of a main part of the flexible plate according to the embodiment;
Fig. 13 is a sectional view of an essential part of a conventional flexible plate;
Fig. 14(A) and Fig. 14(B) are side views of the conventional flexible plate and the flexible plate of the embodiment.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described according to an accompanying drawing.

Hereinafter, the case where the peeling apparatus and peeling method of the laminated body which concern on this invention are used in the manufacturing process of an electronic device are demonstrated.

An electronic device means electronic components, such as a display panel, a solar cell, and a thin film secondary battery. As the display panel, a liquid crystal display (LCD) panel, a plasma display panel (PDP), and an organic electroluminescence display (OELD) panel can be exemplified.

[Electronic device manufacturing process]

Electronic devices are manufactured by forming functional layers for electronic devices (thin film transistors (TFTs) and color filters (CFs) in the case of LCDs) on the surface of a substrate made of glass, resin, metal, or the like.

The substrate is configured as a laminate by attaching its back surface to a reinforcing plate before the formation of the functional layer. Thereafter, a functional layer is formed on the surface of the substrate in the state of the laminate. And after formation of a functional layer, a reinforcing plate peels from a board|substrate.

That is, the manufacturing process of an electronic device is equipped with the functional layer formation process of forming a functional layer on the surface of a board|substrate in the state of a laminated body, and the separation process of isolate|separating a reinforcing plate from the board|substrate on which the functional layer was formed. In this separation process, the peeling apparatus and peeling method of the laminated body which concern on this invention are applied.

[Laminate (1)]

1 : is a principal part enlarged side view which shows an example of the laminated body 1. As shown in FIG.

The laminated body 1 is provided with the board|substrate (1st board|substrate) 2 on which a functional layer is formed, and the glass reinforcing board (2nd board|substrate) 3 which reinforces the board|substrate 2 . Moreover, the reinforcing plate 3 is provided with the resin layer 4 as an adsorption|suction layer on the surface 3a, and the back surface 2b of the board|substrate 2 is attached to the resin layer 4 . That is, the substrate 2 can be peeled from the reinforcing plate 3 via the resin layer 4 by the Van der Waals force acting between the resin layer 4 or the adhesive force of the resin layer 4 . is attached In addition, the length of one side of the laminated body 1 is 600 mm or more.

[Substrate (2)]

A functional layer is formed on the surface (exposed surface) 2a of the substrate 2 . As the substrate 2, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be exemplified. Among these board|substrates, a glass substrate is excellent in chemical-resistance and moisture permeability-resistance, and since the coefficient of linear expansion is small, it is suitable as the board|substrate 2 for electronic devices. In addition, as the coefficient of linear expansion decreases, there is also an advantage in that the pattern of the functional layer formed under high temperature is less likely to shift at the time of cooling.

As glass of a glass substrate, an alkali free glass, borosilicate glass, soda-lime glass, high silica glass, and the oxide type glass which has another silicon oxide as a main component can be illustrated. As oxide type glass, the glass whose content of the silicon oxide by oxide conversion is 40-90 mass % is preferable.

As for the glass of a glass substrate, it is preferable to select and employ|adopt the glass suitable for the kind of electronic device to manufacture, and the glass suitable for the manufacturing process. For example, it is preferable to employ|adopt glass (alkali free glass) which does not contain an alkali metal component substantially for the glass substrate for liquid crystal panels.

The thickness of the substrate 2 is set according to the type of the substrate 2 . For example, when a glass substrate is employed for the substrate 2, the thickness thereof is preferably 0.7 mm or less, more preferably 0.3 mm or less, still more preferably 0.1 mm or less for weight reduction and thinning of the electronic device. is set to When thickness is 0.3 mm or less, favorable flexibility can be provided to a glass substrate. Moreover, when thickness is 0.1 mm or less, although a glass substrate can be wound up in roll shape, it is preferable that the thickness is 0.03 mm or more from a viewpoint of manufacture of a glass substrate, and the viewpoint of handling of a glass substrate.

In addition, although the board|substrate 2 is comprised by one board|substrate in FIG. 1, the board|substrate 2 may be comprised by the board|substrate of several sheets. That is, the board|substrate 2 can also be comprised by the laminated body which laminated|stacked multiple board|substrates. In this case, the thickness of the sum total of all the board|substrates which comprise the board|substrate 2 turns into the thickness of the board|substrate 2 .

[Reinforcement plate (3)]

As the reinforcing plate 3, a glass substrate is used.

The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is set according to the type, thickness, etc. of the substrate 2 to be reinforced. In addition, although the thickness of the reinforcing plate 3 may be thicker than the board|substrate 2, and may be thin, in order to reinforce the board|substrate 2, it is preferable that it is 0.4 mm or more.

In addition, although the reinforcing plate 3 is comprised from one board|substrate in this example, the reinforcing board 3 can also be comprised with the laminated body which laminated|stacked the multiple board|substrate. In this case, the thickness of the sum total of all the board|substrates which comprise the reinforcement board 3 turns into the thickness of the reinforcement board 3 .

[Resin Layer (4)]

In order to prevent the resin layer 4 from peeling between the resin layer 4 and the reinforcing plate 3 , the bonding force between the reinforcing plate 3 and the substrate 2 is set higher than the bonding force between the resin layer 4 and the substrate 2 . do. Thereby, in a peeling process, the board|substrate 2 peels at the interface of the resin layer 4 and the board|substrate 2 .

Although resin which comprises the resin layer 4 is not specifically limited, An acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a silicone resin, and a polyimide silicone resin can be illustrated. Several types of resins may be mixed and used. Especially, a silicone resin and a polyimide silicone resin are preferable from a viewpoint of heat resistance or peelability. In embodiment, a silicone resin layer is illustrated as the resin layer 4 .

Although the thickness of the resin layer 4 is not specifically limited, Preferably it is set to 1-50 micrometers, More preferably, it is set to 4-20 micrometers. By making the thickness of the resin layer 4 into 1 μm or more, when bubbles or foreign substances are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles and foreign substances is absorbed by the deformation of the resin layer 4 can do. On the other hand, by making the thickness of the resin layer 4 into 50 micrometers or less, the formation time of the resin layer 4 can be shortened and since resin of the resin layer 4 is not used more than necessary, it is economical.

In addition, the outer shape of the resin layer 4 is the same as the outer shape of the reinforcing plate 3 or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entire resin layer 4 . desirable. In addition, it is preferable that the external shape of the resin layer 4 is the same as the external shape of the board|substrate 2 or larger than the external shape of the board|substrate 2 so that the resin layer 4 can closely_contact|adhere the whole board|substrate 2 .

In addition, although the resin layer 4 is comprised by one layer in FIG. 1, the resin layer 4 can also be comprised by two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 becomes the thickness of the resin layer. In addition, in this case, the kind of resin which comprises each layer may differ.

In addition, although the resin layer 4 which is an organic film was used as an adsorption layer in embodiment, you may use an inorganic layer instead of the resin layer 4 . The inorganic film which comprises an inorganic layer contains at least 1 sort(s) chosen from the group which consists of metal silicide, nitride, carbide, and carbonitride, for example.

In addition, although the laminated body 1 of FIG. 1 is equipped with the resin layer 4 as an adsorption|suction layer, it is good also as a structure which removes the resin layer 4 and consists of the board|substrate 2 and the reinforcement board 3. In this case, the substrate 2 and the reinforcing plate 3 are detachably attached by a van der Waals force or the like acting between the substrate 2 and the reinforcing plate 3 . In addition, in this case, it is preferable to form an inorganic thin film on the surface 3a of the reinforcement plate 3 so that the board|substrate 2 which is a glass substrate and the reinforcement plate 3 which is a glass plate may not adhere|attach at high temperature.

[Laminate body 6 of embodiment in which a functional layer was formed]

A functional layer is formed in the surface 2a of the board|substrate 2 of the laminated body 1 by passing through a functional layer formation process. As a formation method of a functional layer, vapor deposition methods, such as a CVD (Chemical Vapor Deposition) method, a PVD (Physical Vapor Deposition) method, and a sputtering method are used. The functional layer is formed in a predetermined pattern by a photolithography method or an etching method.

Fig. 2 is an enlarged side view of a main part showing an example of the rectangular laminate 6 produced during the LCD manufacturing process. This laminate 6 also has a length of 600 mm or more on one side.

As for the laminated body 6, the reinforcement board 3A, the resin layer 4A, the board|substrate 2A, the functional layer 7, the board|substrate 2B, the resin layer 4B, and the reinforcement board 3B are laminated|stacked in this order. is made up That is, the laminated body 6 of FIG. 2 corresponds to the laminated body which the laminated body 1 shown in FIG. 1 is arrange|positioned symmetrically with the functional layer 7 interposed therebetween. In addition, the reinforcing plates 3A and 3B are also made of glass. Hereinafter, the laminate comprising the substrate 2A, the resin layer 4A, and the reinforcement plate 3A is referred to as the first laminate 1A, and the substrate 2B, the resin layer 4B and the reinforcement plate 3B are The included laminate is called a 2nd laminated body 1B.

A thin film transistor TFT as a functional layer 7 is formed on the surface 2Aa of the substrate 2A of the first laminate 1A, and the surface 2Ba of the substrate 2B of the second laminate 1B. A color filter CF as the functional layer 7 is formed there.

The first laminate 1A and the second laminate 1B are integrated with the surfaces 2Aa and 2Ba of the substrates 2A and 2B overlapping each other. Thereby, the laminated body 6 of the structure in which the 1st laminated body 1A and the 2nd laminated body 1B was arrange|positioned symmetrically across the functional layer 7 is manufactured.

After the peeling initiation part is formed with a knife in the peeling initiation part manufacturing method to be described later in the laminate 6, the reinforcing plates 3A and 3B are sequentially peeled in the peeling step of the separation step, and then a polarizing plate, a backlight, etc. are installed As a result, LCD is manufactured.

[Peeling initiation part manufacturing apparatus 10]

3(A) to 3(E) are explanatory views showing a peeling start part manufacturing method by the peeling start part manufacturing apparatus 10, and FIG. 3(A) is a laminate 6 and a knife An explanatory view showing the positional relationship of N, FIG. 3B is an explanatory view for producing the peeling start part 26 on the interface 24 with a knife N, FIG. 3C is an explanatory view for the interface 28 An explanatory view showing the state immediately before the peeling start part 30 is produced, FIG. ) is an explanatory view of the laminate 6 in which the peeling start portions 26 and 30 were produced. Moreover, FIG. 4 is a top view of the laminated body 6 in which the peeling start parts 26 and 30 were produced.

At the time of manufacture of the peeling start parts 26 and 30, the laminated body 6 is horizontally (FIG. is supported in the X-axis direction).

The knife N is horizontally supported by the holder 14 so that the blade edge|tip opposes to the end surface of 6 A of corner parts of the laminated body 6 . In addition, as for the knife N, the position of the height direction (Z-axis direction in a figure) is adjusted by the height adjustment device 16. As shown in FIG. Further, the knife N and the laminate 6 are relatively moved in the horizontal direction by a transfer device 18 such as a ball screw device. What is necessary is just to move the at least one of the knife N and the table 12 in the horizontal direction, and the conveyance apparatus 18 will move the knife N in embodiment. Moreover, the liquid supply device 22 which supplies the liquid 20 to the upper surface of the knife N before or during magnetic-graining is arrange|positioned above the knife N.

[Method for producing peeling initiation part]

In the peeling start part manufacturing method by the peeling start part manufacturing apparatus 10, the cut-in position of the knife N is the corner part 6A of the laminated body 6, and is set to the position which overlaps in the thickness direction of the laminated body 6, , and set the amount of cutting of the knife N to be different for every interface 24 and 28 .

The production procedure will be described.

In the initial state, the blade edge of the knife N exists in the position shifted|deviated from the height direction (Z-axis direction) with respect to the interface 24 of the board|substrate 2B and the resin layer 4B which are a 1st magnetic-graining position. Accordingly, first, as shown in FIG. 3A , the knife N is moved in the height direction, and the height of the blade tip of the knife N is set to the height of the interface 24 .

Then, like FIG.3(B), the knife N is horizontally moved toward the corner part 6A of the laminated body 6, and the knife N is inserted in the interface 24 by a predetermined amount. In addition, the liquid 20 is supplied to the upper surface of the knife N from the liquid supply device 22 at the time of magnetic insertion of the knife N or before magnetic insertion. Thereby, since the board|substrate 2B of 6 A of corner parts peels from the resin layer 4B, the peeling start part 26 of planar view triangular shape is produced in the interface 24 like FIG. In addition, although supply of the liquid 20 is not essential, if the liquid 20 is used, the liquid 20 remains in the peeling starting part 26 even after the knife N is removed, so the peeling starting part 26 which cannot be reattached. ) can be produced.

Next, the knife N is removed from the corner portion 6A in the horizontal direction, and, as shown in Fig. 3C, the edge of the knife N is set at the interface 28 between the substrate 2A and the resin layer 4A, which is the second piercing position. ) is set to the height of

Then, like FIG.3(D), the knife N is horizontally moved toward the laminated body 6, and the knife N is inserted in the interface 28 by a predetermined amount. Similarly, the liquid 20 is supplied to the upper surface of the knife N from the liquid supply device 22 . Thereby, the peeling start part 30 is produced in the interface 28 like FIG.3(D). Here, the cutting amount of the knife N with respect to the interface 28 is made into small amount with respect to the interface 24. The above is the peeling initiation part manufacturing method. Moreover, it is good also considering the amount of cutting of the knife N with respect to the interface 24 smaller than the amount of cutting with respect to the interface 28.

The laminate 6 in which the peeling initiation parts 26 and 30 were produced is taken out from the peeling initiation part manufacturing apparatus 10, it is conveyed to the peeling apparatus mentioned later, and is reinforced at the interfaces 24 and 28 by the peeling apparatus. The plates 3B and 3A are sequentially peeled off.

Although the details of the peeling method will be described later, as shown by arrow A in FIG. 4 , by bending the laminate 6 from the corner portion 6A toward the corner portion 6B opposite to the corner portion 6A, the peeling start portion ( At the interface 24 with a large area of 26), it peels first from the peeling start part 26 as a starting point. Thereby, the reinforcing plate 3B peels. Then, by bending the laminated body 6 again from the corner part 6A toward the corner part 6B, the peeling start part 30 is the starting point at the interface 28 where the area of the peeling start part 30 is small. so it is peeled off Thereby, 3 A of reinforcement boards peel.

Moreover, according to the size of the laminated body 6, the amount of cutting of the knife N becomes like this. Preferably it is 7 mm or more, More preferably, it is set to about 15-20 mm.

[Peeling device (40)]

FIG. 5 is a longitudinal sectional view showing the configuration of the peeling device 40 of the embodiment, and FIG. 6 is a schematic view of the arrangement positions of the plurality of movable bodies 44 with respect to the flexible plate 42 of the peeling device 40. It is a plan view of the illustrated flexible plate 42 . 5 corresponds to a cross-sectional view taken along line C-C in FIG. 6 , and in FIG. 6 , the laminate 6 is shown by a solid line.

As shown in Fig. 5, the peeling device 40 includes a pair of movable devices 46 and 46 arranged vertically with the laminate 6 interposed therebetween. Since the movable devices 46 and 46 have the same configuration, the movable device 46 disposed on the lower side in Fig. 5 will be described, and the movable device 46 disposed on the upper side will be given the same reference numerals for explanation. omit

The movable device 46 includes a flexible plate (flexible member) 42 , a plurality of movable bodies 44 , a plurality of drive devices 48 and a drive device for lifting and lowering the movable body 44 for each movable body 44 . It is comprised by the controller 50 etc. which control the drive device 48 for every 48.

In order to bend and deform the reinforcing board 3B, the flexible board 42 vacuum-sucks and supports the reinforcing board 3B. Further, instead of vacuum adsorption, electrostatic adsorption or magnetic adsorption may be used.

[Flexible plate (42)]

Fig. 7A is a plan view of the flexible plate 42, and Fig. 7B is an enlarged longitudinal sectional view of the flexible plate 42 taken along the line D-D in Fig. 7A.

The flexible plate 42 is a rectangular porous sheet for adsorbing and holding the reinforcement plate 3B of the laminate 6 (porous member: Nitto Denko Co., Ltd., ultra-high molecular weight polyethylene porous film, trade name "Sanmap") (52) , a rectangular body plate (body portion) 54 supporting the porous sheet 52 with a double-sided adhesive sheet 53 interposed therebetween.

The thickness of the porous sheet 52 is 2 mm or less for the purpose of reducing the tensile stress which arises in the reinforcement board 3B at the time of peeling, Preferably it is 1 mm or less, and the thing of 0.5 mm is used in embodiment. The Young's modulus of the porous sheet 52 is preferably 1 GPa or less. When a small foreign material such as glass or metal enters, the foreign material is filled in the porous sheet, thereby preventing the reinforcing plate from being scratched.

The body plate 54 is provided with a frame-shaped member 56 that surrounds the porous sheet 52 and is in contact with the edge portion of the reinforcing plate 3B. The frame-shaped member 56 is supported on the main body plate 54 via a double-sided adhesive sheet 57 . Further, the frame member 56 is preferably a closed-cell sponge having a Shore E hardness of 20 degrees or more and 50 degrees or less, and the thickness thereof is 0.3 mm to 0.5 mm thick with respect to the thickness of the porous sheet 52. . Shore E hardness is hardness measured using a durometer type E specified in JIS K 6253:2012. A durometer is generally called a shore hardness tester, but it is manufactured by a number of manufacturers besides Shore. Below, a comparison table of hardness standards of rubber and hardness of rubber is shown.

A frame-shaped groove 58 is formed between the porous sheet 52 and the frame-shaped member 56 . In addition, a plurality of through-holes 60 are opened in the body plate 54, one end of these through-holes 60 communicates with the groove 58, and the other end is an intake source ( For example, it is connected to a vacuum pump).

Accordingly, when the air intake source is driven, the air in the suction pipe path, the through hole 60 and the groove 58 is sucked, so that the reinforcing plate 3B of the laminate 6 is supported by vacuum suction on the porous sheet 52 . and is supported by the main body plate 54 . In addition, since the edge portions of the four sides of the reinforcing plate 3B are pressed against the frame-shaped member 56 , the sealing property of the adsorption space surrounded by the frame-shaped member 56 can be improved.

The body plate 54 has a higher bending rigidity than the porous sheet 52 and the frame-like member 56 , and the bending rigidity of the body plate 54 dominates the bending rigidity of the flexible plate 42 . It is preferable that the bending rigidity per unit width (1 mm) of the flexible plate 42 is 1000-40000 N*mm<2>/mm. For example, in the part where the width|variety of the flexible board 42 is 100 mm, flexural rigidity will be 100000-4000000N*mm<2>. By making the bending rigidity of the flexible plate 42 into 1000 N·mm 2 /mm or more, bending of the reinforcing plate 3B adsorbed and held by the flexible plate 42 can be prevented. Moreover, by making the bending rigidity of the flexible board 42 into 40000 N*mm<2>/mm or less, the reinforcing board 3B adsorbed and held by the flexible board 42 can be appropriately flexibly deformed.

The body plate 54 is a plate-shaped body formed by bonding a plate material 54A having a thickness of 3 mm and a plate material 54B having a thickness of 0.5 mm to each other via a double-sided adhesive sheet 54C. In addition, the plate material 54A and the plate material 54B are preferably resin members having a Young's modulus of 10 GPa or less, for example, polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, polyacetal (POM) resin. It is a resin-made member, such as these.

[Moveable Device (46)]

To the lower surface of the main body plate 54, a plurality of disk-shaped movable bodies 44 shown in FIG. 5 are fixed in a checkerboard shape as shown in FIG. Although these movable bodies 44 are fixed to the main body plate 54 by fastening members, such as a bolt, they may be adhesively fixed instead of a bolt. These movable bodies 44 are independently moved up and down by the drive device 48 driven by the controller 50 .

That is, the controller 50 controls the driving device 48, and a corner in the peeling advancing direction indicated by an arrow A from the movable body 44 located on the corner portion 6A side of the laminate 6 in FIG. 6 . The movable body 44 located on the side of the part 6B is moved downward in sequence. By this operation, like the longitudinal cross-sectional view of FIG. 8, the laminated body 6 is peeled from the peeling start part 26 (refer FIG. 4) of the interface 24 as a starting point. In addition, the laminated body 6 shown in FIGS. 5 and 8 is the laminated body 6 in which the peeling start parts 26 and 30 were produced by the peeling start part manufacturing method demonstrated with FIG.

The driving device 48 is constituted of, for example, a rotary servo motor and a ball screw mechanism. The rotational motion of the servo motor is converted into linear motion in the ball screw mechanism, and is transmitted to the rod 62 of the ball screw mechanism. A movable body 44 is provided at the distal end of the rod 62 via a ball joint 64 . Thereby, as shown in FIG. 8 , the movable body 44 can be tilted following the bending deformation of the flexible plate 42 . Accordingly, the flexible plate 42 can be bent and deformed from the corner portion 6A toward the corner portion 6B without applying an excessive force to the flexible plate 42 . In addition, as the drive device 48, it is not limited to a rotary servomotor and a ball screw mechanism, A linear servomotor or a hydraulic cylinder (for example, a pneumatic cylinder) may be sufficient.

It is preferable that the plurality of drive devices 48 be provided to the frame 66 that can be moved up and down via a cushion member 68 . The cushion member 68 is elastically deformed to follow the bending deformation of the flexible plate 42 . Thereby, the rod 62 tilts with respect to the frame 66 .

The frame 66 is moved downward by a drive unit (not shown) when the peeled reinforcing plate 3B is removed from the flexible plate 42 .

The controller 50 is configured as a computer including a recording medium such as a CPU, ROM and RAM, and the like. The controller 50 controls the plurality of drive devices 48 for each drive device 48 by executing the program recorded on the recording medium on the CPU, and controls the lifting and lowering movement of the plurality of movable bodies 44 .

[The peeling method of the reinforcement boards 3A, 3B by the peeling apparatus 40]

In Figs. 9A to 9C to Figs. 10A to 10C, a peeling initiation part ( The peeling method of the laminate 6 from which 26, 30 was fabricated is shown. That is, the peeling method of peeling the reinforcement plates 3A, 3B of the laminated body 6 is shown in time series in the said figure. In addition, the carrying-in operation|work of the laminated body 6 with respect to the peeling apparatus 40, and the carrying out operation|work of the reinforcing plates 3A and 3B and the panel 70 which peeled are the suction pad 72 shown to Fig.9 (A). It is performed by the conveying apparatus 74 provided with. In addition, in FIGS. 9 and 10, illustration of the movable device 46 is abbreviate|omitted in order to avoid the complexity of drawing. In addition, the panel 70 is a product panel to which the board|substrate 2A and the board|substrate 2B were affixed via the functional layer 7 except reinforcement board 3A, 3B.

FIG. 9A is a side view of the peeling device 40 in which the laminate 6 is mounted on the lower flexible plate 42 by the operation indicated by the arrows E and F of the conveying device 74 . In this case, the lower flexible plate 42 and the upper flexible plate 42 are relatively sufficiently retracted so that the conveying device 74 is inserted between the lower flexible plate 42 and the upper flexible plate 42 . pre-moved to position. And when the laminated body 6 is mounted on the lower flexible board 42, the reinforcement board 3B of the laminated body 6 is vacuum-sucked and supported by the lower flexible board 42 (holding process).

9B shows that the lower flexible plate 42 and the upper flexible plate 42 are moved in a relatively close direction, so that the reinforcing plate 3A of the laminate 6 is moved to the upper flexible plate 42 ) is a side view of the peeling device 40 in a vacuum adsorption-supported state.

9C shows the interface 24 of the laminate 6 while bending and deforming the lower flexible plate 42 downward from the corner portion 6A of the laminate 6 toward the corner portion 6B. It is a side view which shows the state which peels the reinforcing plate 3B from the peeling start part 26 (refer FIG. 4) as a starting point. That is, in the plurality of movable bodies 44 of the lower flexible plate 42 shown in FIG. 8 , the corner portions 6B from the movable body 44 positioned on the corner portion 6A side of the laminate 6 . The movable body 44 located on the side is moved downward one by one, and the reinforcing plate 3B is peeled at the interface 24 (a peeling process).

10A is a side view of the peeling device 40 in a state in which the reinforcing plate 3B is completely peeled off at the interface 24 . According to the drawing, the peeled reinforcing plate 3B is vacuum-sucked and supported by the lower flexible plate 42, and the laminate 6 (reinforcing plate 3A and panel 70) excluding the reinforcing plate 3B. (a laminate comprising a) is vacuum-sucked and supported by an upper flexible plate 42 .

In addition, the lower flexible plate 42 and the upper flexible plate 42 are relatively sufficiently retracted so that the conveying device 74 shown in Fig. 9A is inserted between the upper and lower flexible plates 42. moved to position

Thereafter, first, the vacuum suction of the lower flexible plate 42 is released. Next, the reinforcing plate 3B is adsorbed and held by the suction pad 72 of the conveying device 74 . Then, the reinforcement board 3B is carried out from the peeling apparatus 40 by operation|movement of the conveyance apparatus 74 shown by arrow G, H of FIG.10(A).

10B is a side view in which the laminate 6 except for the reinforcing plate 3B is supported by vacuum suction by the lower flexible plate 42 and the upper flexible plate 42 . That is, the lower flexible plate 42 and the upper flexible plate 42 are moved in a relatively close direction, and the substrate 2B is vacuum-sucked and supported by the lower flexible plate 42 .

10C shows the interface 28 of the laminate 6 while bending and deforming the upper flexible plate 42 upward from the corner portion 6A of the laminate 6 to the corner portion 6B. It is a side view which shows the state which peels 3 A of reinforcing plates from the peeling start part 30 (refer FIG. 4) as a starting point. That is, in the plurality of movable bodies 44 of the upper flexible plate 42 shown in FIG. 5 , the corner portions 6B from the movable bodies 44 positioned on the corner portions 6A side of the laminate 6 . The movable body 44 located on the side is moved upward one after another to peel the reinforcing plate 3A at the interface 28 .

Thereafter, the reinforcing plate 3A completely peeled from the panel 70 is taken out from the upper flexible plate 42 , and the panel 70 is taken out from the lower flexible plate 42 . The above is the peeling method of the laminated body 6 by which the peeling start parts 26 and 30 were produced in 6 A of corner parts.

[Features of the peeling device 40]

The feature of the peeling device 40 is that it is a laminate to be peeled, and the frequency of occurrence of breakage during peeling is high, that is, the reinforcing plate does not slide with respect to the porous sheet 52, and the length of one side is glass reinforcement of 600 mm or more. It is aimed at the laminated body 6 provided with the board 3B. Moreover, it is because the thickness of the porous sheet 52 corresponding to the interplanar distance between the body plate 54 of the flexible board 42 and the laminated body 6 is prescribed|regulated to 2 mm or less.

Hereinafter, an Example and a comparative example are illustrated and demonstrated about the tensile stress which generate|occur|produces in the reinforcing plate 3B to peel.

In FIG. 11, the relationship between the interplanar distance (mm: it corresponds to the thickness of the porous sheet 52 in embodiment) and the tensile stress (MPa) which generate|occur|produces in the reinforcing plate 3B is shown graphically. That is, the horizontal axis in FIG. 11 represents the interplanar distance, and the vertical axis represents the tensile stress.

12 is a longitudinal sectional view of a main part of the flexible plate 42 of the embodiment, and FIG. 13 is a main part sectional view showing an example of the conventional flexible plate 100 .

The flexible plate 42 of FIG. 12 is formed by bonding a porous sheet 52 to a body plate 54 via a double-sided adhesive sheet 53 . Here, the thickness a of the main body plate 54 is 3.5 mm, the thickness b of the porous sheet 52 is 0.5 mm, and the thickness c of the reinforcement board 3B is 0.5 mm. In addition, the thickness of the double-sided adhesive sheet 53 will be ignored.

In the flexible plate 100 of Fig. 13, a rubber plate 104 is adhered to the body plate 102 via a double-sided adhesive sheet 103, and the plate 104 is covered with a porous sheet 52. become made Here, the thickness d of the body plate 102 is 3.5 mm, the thickness e of the plate-like body 104 is 3 mm, the thickness f of the porous sheet 52 is 0.3 mm, and the thickness g of the reinforcing plate 3B is 0.5 mm. . In addition, the thickness of the double-sided adhesive sheet 103 will be ignored. In addition, the length of one side shall be 600 mm or more of reinforcing board 3B.

Returning to the graph of FIG. 11, the tensile stress shown in the figure is based on the Young's modulus of the reinforcing plate 3B and the body plates 54 and 102, the radius of curvature of the reinforcing plate 3B, and the thickness of the reinforcing plate 3B. It is obtained by a known stress calculation formula. Here, the reinforcing plate 3B is made of glass, and the Young's modulus is 77.6 GPa. The body plates 54 and 102 are made of polycarbonate, and the Young's modulus is 2.55 GPa. And the radius of curvature at the time of peeling is 1000 mm.

The graph A of FIG. 11 shows the tensile stress which generate|occur|produces in the outer peripheral part of the reinforcing plate 3B single-piece|unit, and this tensile stress becomes a fixed value (about 19 MPa) irrespective of the interplanar distance.

Graph B shows the tensile stress generated in the neutral plane of the reinforcing plate 3B, and this tensile stress has a proportional relationship with the interplanar distance.

Graph C is a tensile stress obtained by adding the tensile stress of graph A and tensile stress of graph B (hereinafter referred to as summed stress), and is a tensile stress actually occurring in the outer circumferential portion of the reinforcing plate 3B.

Next, based on the graph of FIG. 11 , the summed stress generated in the reinforcing plate 3B of FIG. 12 and the summed stress generated in the reinforcing plate 3B of FIG. 13 are compared.

Since the thickness of the porous sheet 52 of the flexible plate 42 in Fig. 12 is 0.5 mm (interplanar distance = 0.5 mm), the total stress generated in the reinforcing plate 3B is about 55 MPa based on the graph C. Incidentally, the tensile stress generated in the neutral plane is 36 MPa based on the graph B.

In contrast, in the flexible plate 100 of FIG. 13 , the sum of the thickness of the plate-like body 104 and the thickness of the porous sheet 52 is 3.3 mm (interface distance = 3.3 mm), so the The summed stress is about 95 MPa based on graph C. Further, the tensile stress generated in the neutral plane is 76 MPa based on the graph B.

Therefore, according to the flexible board 42 of embodiment, even if it is a case where the reinforcement board 3B is bent with the same radius of curvature (1000 mm), compared with the conventional flexible board 100, generation|occurrence|production in the reinforcement board 3B The total stress to be applied can be reduced by about 48%. In addition, the tensile stress generated in the neutral plane can be reduced by about 53%.

Here, the upper limit of the summed stress for preventing damage to the reinforcing plate 3B is not particularly defined, but the frequency is extremely small, but since the reinforcing plate 3B may be damaged when it exceeds 80 MPa, the upper limit is It is preferable to set it as 80 MPa. That is, it is preferable to make the thickness of the porous sheet 52 into 2 mm or less.

Therefore, according to the peeling apparatus 40 of the embodiment, even if the length of one side is the laminate 6 of 600 mm or more, that is, even if it is a reinforcing plate 3B which does not slide with respect to the body plate 54 at the time of bending deformation, it is porous. Since the thickness of the sheet|seat 52 is prescribed|regulated to 2 mm or less, damage to the reinforcement board 3B at the time of peeling can be prevented.

Moreover, when the peeling apparatus 40 of embodiment was used, even if it was a laminated body whose length of one side is 1000 mm or more, the reinforcement board 3B was able to peel smoothly. For example, even if it was a laminated body whose long side is 1300 mm and short side is 1100 mm, it was able to peel, without damaging the reinforcement board 3B.

Moreover, when the thickness of the porous sheet 52 shall be 1 mm or less, since the tensile stress which generate|occur|produces in the reinforcement board 3B can be reduced more, it becomes suitable for peeling of the reinforcement board 3B of a larger size.

In addition, as the main body plate 54 of the flexible plate 42, the resin member whose Young's modulus is 10 GPa or less was employ|adopted. When the main body plate 54 is made of a material approximately equal to the Young's modulus (70 GPa to 80 GPa) of glass, the main body plate 54 cannot bear the tensile stress of the reinforcing plate 3B that occurs during bending deformation. Conversely, since the reinforcing plate 3B may bear the tensile stress of the main body plate 54, it is not preferable.

Therefore, since the Young's modulus of the main body plate 54 is made of a resin member of 10 GPa or less, the tensile stress of the reinforcing plate 3B generated at the time of flexural deformation can be borne by the main body plate 54, whereby the reinforcing plate ( The tensile stress generated in 3B) can be further reduced.

Fig. 14(A) is a side view in which the laminate 6 is held by the conventional flexible plate 100 shown in Fig. 13, and Fig. 14(B) is a flexible plate (B) of the embodiment shown in Fig. 12 ( It is a side view in which the laminated body 6 was hold|maintained by 42).

As shown in Fig. 14A, in the conventional flexible plate 100, when the vertically arranged flexible plates 42 and 42 are pressed in a direction approaching each other by the movable body 44, the pressing force The main body plate 102 bends locally, and the rubber plate-shaped body 104 does not follow the bending. Thereby, the clearance gap 106 generate|occur|produces locally between the laminated body 6 and the plate-shaped object 104, and the problem that suction air leaks from a clearance gap arises.

In contrast, the flexible plate 42 of the embodiment is provided with a frame-like member 56 that is a closed-cell sponge having a Shore E hardness of 20 degrees or more and 50 degrees or less, as shown in Fig. 7B.

Therefore, even when the body plate 102 is locally bent, as shown in Fig. 14B, the deformation can be absorbed by the elasticity of the frame-shaped member 56, so that the frame-shaped member 56 and the laminated body The adhesiveness of (6) can be maintained, and the leak of the suction air can be prevented by this.

Although this invention was detailed also demonstrated with reference to the specific embodiment, it is clear for those skilled in the art that various changes and correction can be added without deviating from the mind and range of this invention.

This application is based on the JP Patent application 2014-105850 for which it applied on May 22, 2014, The content is taken in here as a reference.

N: knife
1: Laminate
1A: first laminate
1B: second laminate
2: Substrate
2a: the surface of the substrate
2b: the back side of the substrate
2A: substrate
2Aa: the surface of the substrate
2B: substrate
2Ba: the surface of the substrate
3: reinforcing plate
3a: surface of reinforcing plate
3A: reinforcing plate
3B: reinforcing plate
3Bb: back side of reinforcing plate
4: resin layer
4A: resin layer
4B: resin layer
6: Laminate
6A, 6B: Corner
7: functional layer
10: Peeling start part manufacturing apparatus
12: table
14: holder
16: height adjustment device
18: transfer device
20: liquid
22: liquid supply device
24: interface
26: peeling start part
28: interface
30: peeling start part
40: peeling device
42: flexible board
44: movable body
46: movable device
48: drive device
50: controller
52: porous sheet
53: double-sided adhesive sheet
54: body plate
57: double-sided adhesive sheet
58: home
60: through hole
62: load
64: ball joint
66: frame
68: cushion member
70: panel
72: suction pad
74: conveying device

Claims (14)

With respect to a rectangular laminate having a side length of 600 mm or more, in which a first substrate and a second glass substrate are detachably attached, along the peeling proceeding direction from one end side of the second substrate to the other end side, In the peeling apparatus of a laminated body which peels the said 2nd board|substrate from the said 1st board|substrate by bending a 2nd board|substrate,
and a flexible member that supports the second substrate and bends in the peeling proceeding direction;
The flexible member includes a body portion and a porous member,
The second substrate is adsorbed and held in the main body portion with the porous member interposed therebetween;
The said porous member is a sheet-like member with a thickness of 2 mm or less, The peeling apparatus of the laminated body characterized by the above-mentioned. The apparatus for peeling a laminate according to claim 1, wherein the porous member has a thickness of 1 mm or less. The apparatus for peeling a laminate according to claim 1 or 2, wherein the main body portion of the flexible member is a resin member having a Young's modulus of 10 GPa or less. The frame-shaped member according to claim 1 or 2, wherein the body portion of the flexible member is provided with a frame-shaped member that surrounds the porous member and is in contact with the second substrate,
The above-mentioned frame-shaped member is a closed-cell sponge having a Shore E hardness of 20 degrees or more and 50 degrees or less. A peeling method of a rectangular laminate having a side length of 600 mm or more, wherein a first substrate and a second glass substrate are detachably attached, wherein the second substrate of the laminate is a porous member having a thickness of 2 mm or less; a holding step of adsorbing and holding the body portion via the porous member of the flexible member provided with the body portion;
and a peeling step of peeling the second substrate from the first substrate by bending the flexible member along a peeling proceeding direction from one end side of the second substrate to the other end side. peeling method. The method for peeling a laminate according to claim 5, wherein the laminate has a side length of 1000 mm or more. The method of claim 5 or 6, wherein the porous member has a thickness of 1 mm or less. The method for peeling a laminate according to claim 5 or 6, wherein the body portion of the flexible member is a resin member having a Young's modulus of 10 GPa or less. The frame-shaped member according to claim 5 or 6, wherein a frame-shaped member that is a closed-cell sponge having a Shore E hardness of 20 degrees or more and 50 degrees or less is provided in the body portion of the flexible member so as to surround the porous member,
In the holding step, a method for peeling a laminate in which all edge portions of the second substrate are brought into close contact with the frame-shaped member. A functional layer forming step of forming a functional layer on an exposed surface of the first substrate in a rectangular laminate having a side length of 600 mm or more, wherein a first substrate and a second glass substrate are detachably attached; A method of manufacturing an electronic device comprising a separation step of separating the second substrate from the first substrate on which a functional layer is formed, the method comprising:
The separation process is
a holding step of adsorbing and holding the second substrate of the laminate through the porous member of the flexible member including a porous member having a thickness of 2 mm or less and a body portion;
and a peeling step of peeling the second substrate from the first substrate by bending the flexible member along a peeling progress direction from one end side to the other end side of the second substrate. manufacturing method. The method for manufacturing an electronic device according to claim 10, wherein the laminate has a side length of 1000 mm or more. The method for manufacturing an electronic device according to claim 10 or 11, wherein the porous member has a thickness of 1 mm or less. The method for manufacturing an electronic device according to claim 10 or 11, wherein the body portion of the flexible member is a resin member having a Young's modulus of 10 GPa or less. 12. The method according to claim 10 or 11, wherein a frame-shaped member that is a closed-cell sponge having a Shore E hardness of 20 degrees or more and 50 degrees or less is provided in the body portion of the flexible member so as to surround the porous member,
In the said holding process, the manufacturing method of the electronic device which makes all the edge parts of the said 2nd board|substrate closely_contact|adhere to the said frame-shaped member.

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