KR102535656B1 - Peeling apparatus and peeling method for laminate, and manufacturing method of electronic device - Google Patents

Abstract

In the present invention, with respect to a laminate in which three or more substrates are peelably attached, a knife is inserted by a predetermined amount into an interface between adjacent substrates and two or more surfaces, which is an interface between adjacent substrates, from an end of the laminate to initiate separation of two or more substrates. Peeling start portion forming means for forming a portion, and peeling means for bending and deforming at least one substrate among the three or more substrates, and sequentially peeling from the peeling start portion at the interface of the two or more surfaces as a starting point, and the peeling start portion After controlling the formation means to insert the knife into the interfaces of the two or more surfaces in order to form the two or more peeling start portions, controlling the peeling means to sequentially start the peeling start portions of the interfaces of the two or more surfaces as starting points It relates to a peeling device for a layered product characterized by having a control means for peeling.

Description

Peeling device and peeling method of a layered product, and manufacturing method of an electronic device

This invention relates to the peeling apparatus and peeling method of a laminated body, and the manufacturing method of an electronic device.

BACKGROUND ART As electronic devices such as display panels, solar cells, and thin-film secondary batteries become thinner and lighter, thinning of substrates such as glass plates, resin plates, and metal plates used in these electronic devices is required.

However, when the thickness of the substrate becomes thin, the handleability of the substrate deteriorates, so it is preferable to form a functional layer for electronic devices (thin film transistor (TFT), color filter (CF)) on the surface of the substrate. It gets difficult.

Therefore, a method has been proposed in which a reinforcing plate (substrate) is attached to the back side of the substrate, a laminate is formed in which the substrate is reinforced by the reinforcing plate, and a functional layer is formed on the surface of the substrate in the state of the laminate (Patent Documents). 1). Since the handleability of the substrate is improved in this method, the functional layer can be satisfactorily formed on the surface of the substrate. Then, the reinforcing plate is peeled off from the substrate after formation of the functional layer.

As an example, the peeling method of the reinforcing plate is carried out by bending and deforming the reinforcing plate or the substrate or both of them in a direction that separates them from each other from one side of the two corner portions located on the diagonal of the rectangular laminate to the other side. . At this time, in order to perform peeling smoothly, the peeling start part is formed in one corner part of a laminated body. As in Patent Document 1, the peeling start part is formed by inserting a knife (peeling blade) in a predetermined amount from the end face of the laminate to the interface between the substrate and the reinforcing plate, and forming the peeling start part in a predetermined area of one corner portion. made by doing

Also in Patent Document 2, a laminate peeling device is disclosed, and also in this peeling device, a peeling start portion is formed by inserting a knife (wedge) into the interface between the substrate and the substrate from the end surface of the laminate.

By the way, since the peeling device of Patent Document 1 inserts a knife into the interface in a state where the front and back surfaces of the laminate are fixed by a suction pad or the like, that is, in a state where the laminate is held in the thickness direction, the substrate is removed from the knife at the time of insertion. Unnecessary force is applied to the substrate, and there is a risk that the substrate may be damaged.

Further, since the peeling device of Patent Literature 2 clamps the layered product in the thickness direction with a suction pad or the like in a state where a knife is inserted into the interface, pressing force is applied to the portion where the knife is inserted when the layered product is clamped by the suction pad. As a result of this, there is a possibility that the substrate may be damaged.

Due to these circumstances, in recent years, the peeling start part formation process by a knife and the peeling process by a peeling apparatus are performed separately, and the problem of patent document 1, 2 is prevented.

International Publication No. 2011/024689 Japanese Unexamined Patent Publication No. 10-244545

In the case of a layered product having only one interface at which separation is performed, a peeling start portion is formed on the interface with a knife of a peeling start portion forming device, and then the layered product is transported from the peeling start portion forming device to a peeling device, Just peel the board|substrate with a peeling device, and it does not take many hands for a series of operations.

However, in the case of a laminate comprising three or more substrates having interfaces to be separated on two or more surfaces, the laminate must be transported back and forth between the separation start portion forming device and the separation device by the number of surfaces of the interface, so that the laminate can be transported efficiently. There was a problem that the substrate could not be peeled off.

The present invention has been made in view of these problems, and in a laminate including three or more substrates having two or more interfaces to be separated, a laminate peeling device and peeling method capable of efficiently peeling the substrate, And it aims at providing a manufacturing method of an electronic device.

In order to achieve the above object, the peeling device for a laminate of the present invention is an interface between adjacent substrates and two or more surfaces, with respect to a laminate in which three or more substrates are detachably attached, at the interface of two or more surfaces, the end of the laminate Separation start portion formation means for forming two or more peeling start portions by inserting a knife by a predetermined amount therefrom; After sequentially inserting the knife into the interface of the two or more surfaces to form the two or more peeling start portions by controlling the peeling means for sequentially peeling and the peeling start portion forming means, the peeling means is controlled to separate the two surfaces It is characterized by having a control means for sequentially peeling from the above-described separation start portion of the interface as a starting point.

In order to achieve the above object, the peeling method of a laminate of the present invention is an interface between adjacent substrates and two or more surfaces, with respect to a laminate in which three or more substrates are peelably attached, A peeling start portion forming step of forming two or more peeling start portions, respectively, by inserting a knife from an end portion by a predetermined amount; bending at least one substrate among the three or more substrates; and the peeling start portion at the interface of the two or more surfaces. It is characterized by having a peeling step of sequentially peeling from the starting point.

In order to achieve the above object, the method for manufacturing an electronic device of the present invention is a functional layer for forming a functional layer on the surface of at least one of the substrates included in a laminate in which three or more substrates are detachably attached. An electronic device manufacturing method comprising a formation step and a separation step of separating the substrate on which the functional layer is formed from another substrate, wherein the separation step is an interface between adjacent substrates of the laminate and two or more surfaces. Then, a peeling start portion forming step of forming two or more peeling start portions by inserting a knife from the end of the laminate by a predetermined amount, respectively, bending at least one substrate among the three or more substrates, and forming the two or more surfaces It is characterized by comprising a peeling step of sequentially peeling from the peeling start portion of the interface as a starting point.

According to the present invention, in the means or step for forming the separation start portion, the separation start portion is formed on two or more interfaces using a knife, and the substrate is sequentially separated in the separation step. As a result, since the transport of the laminate from the separation start portion forming unit to the separation unit is completed in one operation, it is possible to efficiently peel the substrate even if it is a laminate including three or more substrates having two or more interfaces to be separated. can

In one aspect of the present invention, the insertion position of the knife by the peeling start portion forming means or step is set to a position overlapping in the thickness direction of the laminate at the first corner of the laminate, and It is preferable that the cutting amount of the knife is set to be different for each interface, and the bending direction of the substrate by the peeling means or process is set from the first corner portion toward a corner portion opposite to the first corner portion. .

The bending direction of the substrate in the present invention may be a straight line direction connecting the first corner portion and a corner portion opposite to the first corner portion, or may be a direction of 45 degrees with respect to one side of the laminate. That is, the bending direction of the board|substrate should just be set from the said 1st corner part toward the corner part which opposes the said 1st corner part.

According to one aspect of the present invention described above, when the substrate is bent from the first corner portion toward the corner portion opposite to the first corner portion by the peeling means or step, the interface where the cutting amount of the knife is the largest among the interfaces of two or more surfaces is reached. In this case, the substrate is first peeled off. Then, when the substrate is bent in the same direction, the substrate is separated at the interface where the cutting amount of the knife is second largest. According to one aspect of the present invention described above, the order of interfaces in which peeling is performed can be controlled by making the cutting amount of the knife different for each interface.

In another aspect of the present invention, the cutting position of the knife by the peeling start portion forming means or step is set at least at the first corner portion of the laminate and other corner portions other than the first corner portion, The bending direction of the substrate by the peeling means or step is set from the first corner portion toward the corner portion opposing the first corner portion, and from the other corner portion toward the corner portion opposing the other corner portion. It is desirable to set

According to another aspect of the present invention, when the substrate is bent from the first corner portion toward the corner portion opposite to the first corner portion by the peeling means or process, starting from the peel start portion provided in the first corner portion, The substrate peels off. Further, when the substrate is bent from the other corner portion toward the corner portion opposite to the other corner portion by the peeling means or process, the substrate is separated from the peel start portion provided in the other corner portion as a starting point. According to another aspect of the present invention, the order of interfaces at which separation is performed can be controlled according to the direction in which the substrate is bent.

In the present invention, it is preferable that the laminate is a laminate in which at least a first substrate, a second substrate, a third substrate, and a fourth substrate are attached in this order so as to be peelable, and the peel start portion forming means or step It is preferable that the insertion position of the knife is set at an interface between the first substrate and the second substrate and at an interface between the third substrate and the fourth substrate.

The present invention is directed to a laminate including, for example, first to fourth substrates. In the separation start portion forming means or step, the separation start portion is formed at an interface between the first substrate and the second substrate and at an interface between the third substrate and the fourth substrate, respectively. In the peeling means or step, the substrates are sequentially peeled at the two interfaces, and the product substrate with the second substrate and the third substrate is taken out. In the case where the product substrate is an electronic device, a functional layer is formed on the opposing surfaces of the second substrate and the third substrate in the functional layer forming step.

According to the peeling apparatus and method for a layered product and the method for manufacturing an electronic device of the present invention, in a layered body including three or more substrates having two or more surfaces with interfaces to be peeled, the substrate can be peeled efficiently. there is.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an enlarged side view of essential parts showing an example of a laminate provided in a manufacturing process of an electronic device.
Fig. 2 is an enlarged side view of a main part showing an example of a laminate produced during the LCD manufacturing process.
3(A) to 3(E) are explanatory views showing a method of forming a first peeling start portion using a peeling start portion forming device.
Fig. 4 is a plan view of a laminate in which a peel start portion is formed by a first peel start portion forming method;
5(A) to 5(E) are explanatory views showing a method of forming a second peeling start portion using a peeling start portion forming device.
Fig. 6 is a plan view of a laminate in which a peel start portion is formed by a second peel start portion forming method;
Fig. 7 is a longitudinal sectional view showing the configuration of a peeling device according to an embodiment;
Fig. 8 is a plan view of a flexible board schematically showing arrangement positions of a plurality of movable bodies relative to the flexible board.
9(a) and 9(b) are plan and cross-sectional views showing the configuration of the flexible board.
Fig. 10 is a longitudinal sectional view of a peeling device that peels a substrate at an interface of a laminate.
11(A) to 11(C) are explanatory views showing a peeling method of peeling the reinforcing plate of the laminate in which the peeling start portion is formed by the first peeling start portion forming method in time sequence.
12(A) to 12(C) are explanatory views showing a peeling method of peeling the reinforcing plate of the layered body sequentially following Fig. 11;
Fig. 13 is an explanatory diagram of a peeling method for peeling a reinforcing board of a laminate in which a peeling start portion is formed by a second peel start portion forming method.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described according to accompanying drawings.

Below, the case where the peeling apparatus and peeling method of the layered product concerning this invention are used in the manufacturing process of an electronic device is demonstrated.

Electronic devices refer to electronic components such as display panels, solar cells, and thin film secondary batteries. As the display panel, a liquid crystal display (LCD) panel, a plasma display panel (PDP), and an organic electro luminescence display (OELD) panel may be exemplified.

[Production process of electronic device]

BACKGROUND OF THE INVENTION Electronic devices are manufactured by forming functional layers for electronic devices (thin film transistors (TFTs) and color filters (CFs) in the case of LCDs) on the surface of a substrate made of glass, resin, metal, or the like.

The back side of the substrate is attached to a reinforcing plate (substrate) before formation of the functional layer to form a laminate. After that, a functional layer is formed on the surface of the substrate in a laminated body state. Then, after formation of the functional layer, the reinforcing plate is peeled off from the substrate.

That is, the manufacturing process of the electronic device includes a functional layer forming process of forming a functional layer on the surface of a substrate in a laminated body state and a separation process of separating the reinforcing plate from the substrate on which the functional layer is formed. To this separation step, the layered product peeling device and peeling method according to the present invention are applied.

[Laminate (1)]

1 is an enlarged side view of a main part showing an example of a laminate 1 .

The laminate 1 includes a substrate 2 on which a functional layer is formed, and a reinforcing plate 3 reinforcing the substrate 2. In addition, the front surface 3a of the reinforcing board 3 is equipped with the resin layer 4 as an adsorption layer, and the back surface 2b of the board|substrate 2 is attached to the resin layer 4. That is, the substrate 2 is peelable from the reinforcing board 3 via the resin layer 4 by the Van der Waals force acting between it and the resin layer 4 or the adhesive force of the resin layer 4. attached

In addition, the laminated body 1 of FIG. 1 is a laminated body in which two board|substrates (substrate 2 and reinforcing board 3) were attached so that peeling was possible. Therefore, although it is not a laminate in which three or more substrates are detachably attached, which is the subject of the present invention, it is shown as a reference diagram to explain the basic structure of the laminate.

[Substrate (2)]

The substrate 2 has a functional layer formed on its surface 2a. As the substrate 2, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be exemplified. Among these substrates, since the glass substrate is excellent in chemical resistance and moisture permeability resistance and has a small coefficient of linear expansion, it is suitable as the substrate 2 for electronic devices. In addition, as the linear expansion coefficient decreases, there is also an advantage that the pattern of the functional layer formed under high temperature becomes difficult to shift during cooling.

As the glass of the glass substrate, alkali-free glass, borosilicate glass, soda-lime glass, high-silica glass, and other oxide-based glasses containing silicon oxide as a main component can be exemplified. As oxide type glass, the glass whose content of silicon oxide by oxide conversion is 40-90 mass % is preferable.

It is preferable to select and employ|adopt the glass of a glass substrate suitable for the kind of electronic device to manufacture, and the glass suitable for the manufacturing process. For example, it is preferable to employ|adopt the glass (alkali free glass) which does not contain an alkali metal component substantially for the glass substrate for liquid crystal panels.

The thickness of the substrate 2 is set according to the type of the substrate 2 . For example, when a glass substrate is used for the substrate 2, its thickness is preferably 0.7 mm or less, more preferably 0.3 mm or less, still more preferably 0.1 mm or less, for the purpose of reducing the weight and thinning of the electronic device. is set to When thickness is 0.3 mm or less, favorable flexibility can be provided to a glass substrate. Moreover, although a glass substrate can be wound up in roll shape when thickness is 0.1 mm or less, it is preferable that the thickness is 0.03 mm or more from a viewpoint of manufacturing a glass substrate, and a viewpoint of handling a glass substrate.

In addition, although the board|substrate 2 is comprised by one board|substrate in FIG. 1, the board|substrate 2 may be comprised by several board|substrates. That is, the substrate 2 may be formed of a laminated body in which a plurality of substrates are stacked. In this case, the total thickness of all substrates constituting the substrate 2 becomes the thickness of the substrate 2 .

[Reinforcing plate (3)]

As the reinforcement board 3, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be illustrated.

The kind of reinforcing board 3 is selected according to the kind of electronic device to manufacture, the kind of board|substrate 2 used for that electronic device, etc. If the reinforcing board 3 and the board|substrate 2 are made of the same material, warp and peeling due to a temperature change can be reduced.

The difference (absolute value) in the average coefficient of linear expansion between the reinforcing plate 3 and the substrate 2 is appropriately set according to the dimensions and shape of the substrate 2, but is preferably 35×10 ^-7 /°C or less. Here, "average linear expansion coefficient" refers to the average linear expansion coefficient (JIS R3102: 1995) in the temperature range of 50-300 degreeC.

The thickness of the reinforcing board 3 is set to 0.7 mm or less, and is set according to the type of the reinforcing board 3, the type and thickness of the substrate 2 to be reinforced, and the like. In addition, the thickness of the reinforcement board 3 may be thicker or thinner than the board|substrate 2, but it is preferable that it is 0.4 mm or more in order to reinforce the board|substrate 2.

Further, in this example, the reinforcing board 3 is constituted by a single board, but the reinforcing board 3 may be constituted by a laminated body in which a plurality of substrates are laminated. In this case, the total thickness of all substrates constituting the reinforcing board 3 becomes the thickness of the reinforcing board 3 .

[Resin layer (4)]

In order to prevent the resin layer 4 from peeling between the resin layer 4 and the reinforcement board 3, the bonding force between the reinforcing board 3 is set higher than the bonding force between the substrate 2. do. Thereby, in the peeling step, the substrate 2 is peeled at the interface between the resin layer 4 and the substrate 2 .

Resin constituting the resin layer 4 is not particularly limited, but examples thereof include acrylic resins, polyolefin resins, polyurethane resins, polyimide resins, silicone resins, and polyimide silicone resins. A mixture of several types of resin may also be used. Among them, from the viewpoint of heat resistance and peelability, silicone resins and polyimide silicone resins are preferable. In embodiment, a silicone resin layer is illustrated as the resin layer 4.

The thickness of the resin layer 4 is not particularly limited, but is preferably set to 1 to 50 μm, more preferably 4 to 20 μm. By setting the thickness of the resin layer 4 to 1 μm or more, when air bubbles or foreign substances are mixed between the resin layer 4 and the substrate 2, the thickness of the air bubbles or foreign substances is absorbed by the deformation of the resin layer 4. can do. On the other hand, by making the thickness of the resin layer 4 into 50 micrometers or less, since the formation time of the resin layer 4 can be shortened and resin of the resin layer 4 is not used more than necessary, it is economical.

In addition, the outer shape of the resin layer 4 is the same as or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entire resin layer 4. it is desirable In addition, the outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2 so that the resin layer 4 can closely adhere to the entire substrate 2 .

In addition, although the resin layer 4 is comprised by one layer in FIG. 1, the resin layer 4 can also be comprised by two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 is the thickness of the resin layer. In addition, in this case, the kind of resin which comprises each layer may be different.

In addition, in embodiment, although the resin layer 4 which is an organic film was used as an adsorption layer, you may use an inorganic layer instead of the resin layer 4. The inorganic film constituting the inorganic layer contains, for example, at least one selected from the group consisting of metal silicides, nitrides, carbides, and carbonitrides.

In addition, although the laminated body 1 of FIG. 1 is equipped with the resin layer 4 as an adsorption layer, it is good also as a structure which eliminates the resin layer 4 and contains the board|substrate 2 and the reinforcement board 3. In this case, the substrate 2 and the reinforcing plate 3 are attached so that they can be separated by van der Waals force or the like acting between the substrate 2 and the reinforcing plate 3 . In this case, it is preferable to form an inorganic thin film on the surface 3a of the reinforcing plate 3 so that the substrate 2, which is a glass substrate, and the reinforcing plate 3, which is a glass plate, do not adhere at high temperatures.

[Laminate 6 of Embodiment with Functional Layer Formed]

A functional layer is formed on the surface 2a of the substrate 2 of the laminate 1 by passing through the functional layer forming step. As a method for forming the functional layer, vapor deposition methods such as CVD (Chemical Vapor Deposition) method and PVD (Physical Vapor Deposition) method and sputtering method are used. The functional layer is formed in a predetermined pattern by a photolithography method or an etching method.

Fig. 2 is an enlarged side view of main parts showing an example of a rectangular laminate 6 produced during the LCD manufacturing process, and is an example of the laminate to which the present invention is intended.

The laminate 6 includes a reinforcing plate (first substrate) 3A, a resin layer 4A, a substrate (second substrate) 2A, a functional layer 7, a substrate (third substrate) 2B, a water The ground layer 4B and the reinforcing board (fourth substrate) 3B are laminated in this order to form a structure. That is, the layered body 6 of FIG. 2 corresponds to the layered body in which the layered body 1 shown in FIG. 1 is symmetrically arranged with the functional layer 7 interposed therebetween. Hereinafter, a laminate comprising a substrate 2A, a resin layer 4A, and a reinforcing plate 3A is referred to as a first laminate 1A, and the substrate 2B, the resin layer 4B, and the reinforcing plate 3B A layered body including the is referred to as a second layered body 1B.

A thin film transistor (TFT) as the functional layer 7 is formed on the surface 2Aa of the substrate 2A of the first laminate 1A, and the surface 2Ba of the substrate 2B of the second laminate 1B. ), a color filter CF as the functional layer 7 is formed.

The first layered body 1A and the second layered body 1B are integrated with the surfaces 2Aa and 2Ba of the substrates 2A and 2B overlapping each other. Thereby, the laminate 6 of the structure in which the 1st laminated body 1A and the 2nd laminated body 1B are symmetrically arrange|positioned with the functional layer 7 interposed is manufactured.

In the laminate 6, after the peeling start part is formed by a knife in the peeling start part step of the separating step, the reinforcing plates 3A and 3B are sequentially peeled off in the peeling step of the separating step, and then a polarizing plate, a backlight, etc. are installed. Then, the product, LCD, is manufactured.

[Peel-off start portion forming device 10]

3(A) to 3(E) are explanatory diagrams showing a first peeling start portion forming method by the peeling start portion forming device (peeling start portion forming means) 10, and FIG. 3 (A ) is an explanatory diagram showing the positional relationship between the laminate 6 and the knife N, and FIG. 3(B) is an explanatory diagram in which the peeling start portion 26 is formed at the interface 24 by the knife N. 3(C) is an explanatory diagram showing a state immediately before forming the peeling start portion 30 on the interface 28, and FIG. 3(E) is an explanatory view of the layered product 6 in which the peel start portions 26 and 30 are formed. 4 is a plan view of the laminated body 6 in which the peeling start portions 26 and 30 are formed.

At the time of formation of the peeling start parts 26 and 30, the back surface 3Bb of the reinforcing board 3B adsorbs and holds the laminated body 6 by the table 12 like FIG. 3(A), and is horizontal. (X-axis direction in the drawing) is supported.

The knife N is horizontally supported by the holder 14 so that the blade edge faces the end surface of the corner portion (first corner portion) 6A of the stacked body 6 . In addition, the position of the knife N in the height direction (Z-axis direction in the drawing) is adjusted by the height adjusting device 16 . In addition, the knife N and the laminated body 6 are relatively moved in the horizontal direction by a conveying device 18 such as a ball screw device. The conveying device 18 should just move at least one of the knife N and the table 12 in the horizontal direction, and the knife N moves in embodiment. Further, a liquid supply device 22 for supplying the liquid 20 to the upper surface of the knife N before or during cutting is disposed above the knife N.

[Method of Forming First Peeling Start Portion]

In the 1st peeling start part formation method by the peeling start part forming apparatus 10, the cutting position of the knife N is the corner part 6A of the laminated body 6, and is in the thickness direction of the laminated body 6 It is set at overlapping positions, and the cutting amount of the knife N is set differently for each of the interfaces 24 and 28.

The formation procedure is explained.

In the initial state, the blade tip of the knife N exists at a position shifted in the height direction (Z-axis direction) with respect to the interface 24 between the substrate 2B and the resin layer 4B, which is the first cutting position. Therefore, first, as shown in FIG. 3(A), the knife N is moved in the height direction, and the height of the edge of the knife N is set to the height of the interface 24.

After that, as shown in FIG. 3(B), the knife N is moved horizontally toward the corner portion 6A of the laminate 6, and the knife N is inserted into the interface 24 by a predetermined amount. At this time, since the layered body 6 is not clamped in the thickness direction, there is no fear of damaging the substrate 2B when the knife N is inserted. In addition, the liquid 20 is supplied to the upper surface of the knife N from the liquid supply device 22 at or before the knife N is inserted into the knife. As a result, since the substrate 2B of the corner portion 6A is separated from the resin layer 4B, a separation start portion 26 having a triangular shape in plan view is formed on the interface 24 as shown in FIG. 4 . In addition, although the supply of the liquid 20 is not essential, if the liquid 20 is used, the liquid 20 remains in the peeling start portion 26 even after the knife N is pulled out, so that the peeling start that cannot be reattached. A portion 26 may be formed.

Next, the knife N is pulled out in the horizontal direction from the corner portion 6A, and the blade edge of the knife N is moved to the substrate 2A and the resin layer 4A, which are the second cutting positions, as shown in FIG. 3(C). set to the height of the interface 28 of

After that, as shown in FIG. 3(D), the knife N is moved horizontally toward the layered body 6, and the knife N is inserted into the interface 28 by a predetermined amount. Similarly, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N. Thereby, the peeling start part 30 is formed in the interface 28 like FIG. 3(D). Here, the amount of cutting of the knife N into the interface 28 is smaller than the amount of cutting into the interface 24 . The above is the 1st peeling start part formation method. In addition, it is good also considering the insertion amount of the knife N with respect to the interface 24 smaller than the insertion amount with respect to the interface 28.

The layered product 6 in which the peeling start portions 26 and 30 are formed is taken out of the peeling start portion forming device 10 and conveyed to a peeling device (peeling means) described later, and is then transferred to the interfaces 24 and 28 by the peeling device. ), the reinforcing plates 3B and 3A are sequentially peeled off.

Although the details of the peeling method will be described later, as shown by arrow A in FIG. 4 , the laminate 6 is bent from the corner part 6A toward the corner part 6B opposite to the corner part 6A, thereby forming a peeling start part. In the interface 24 where the area of (26) is large, it peels first starting from the peeling start part 26. Thereby, the reinforcing board 3B peels. Then, by bending the layered product 6 again from the corner portion 6A toward the corner portion 6B, in the interface 28 where the area of the peeling start portion 30 is small, the peeling start portion 30 is formed. It is separated from the starting point. Thereby, 3 A of reinforcing plates are peeled.

That is, in the first peeling start portion formation step, in the peeling start portion forming step, the peeling start portions 26 and 30 are sequentially formed on the interfaces 24 and 28 using a knife N, and thereafter, the interfaces are formed. In (24, 28), reinforcement board 3B, 3A is peeled in order in a peeling process. As a result, since the transfer of the layered product 6 from the peeling start portion forming device 10 to the peeling device is completed in one cycle, even if the layered product 6 provided with the interfaces 24 and 28 to be peeled on two surfaces, Reinforcement board 3A, 3B can be peeled off efficiently.

In addition, the bending direction of the laminated body 6 indicated by arrow A in FIG. 4 may be a straight line direction connecting the corner portions 6A and 6B, and 45 relative to one side of the laminated body 6 It may be in the direction of the figure. That is, the bending direction of the laminated body 6 should just be set from the corner part 6A toward the corner part 6B.

[Method of Forming Second Peeling Start Portion]

In the 2nd peeling start part formation method by the peeling start part forming apparatus 10, the cutting position of the knife N is set to the corner part 6A of the laminated body 6, and the corner part 6A other than the other It is set as a corner portion (here referred to as a corner portion 6B, but other corners may be provided), and a peeling start portion is formed at the interface 24 between the substrate 2B and the resin layer 4B at the corner portion 6A, In the corner part 6B, a peeling start part is formed in the interface 28 of the board|substrate 2A and the resin layer 4A.

The formation procedure is explained.

First, as shown in FIG. 5(A), the height of the edge of the knife N is set to the height of the interface 24.

Then, as shown in FIG. 5(B), the knife N is moved horizontally toward the corner portion 6A, and the knife N is applied to the interface 24 located at the corner portion 6A by a predetermined amount. Upon entry, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N. Thereby, the peeling start part 32 (refer FIG. 5(E), FIG. 6) is formed in the interface 24 of 6 A of corner parts.

Next, while pulling out the knife N horizontally from the corner part 6A, and facing the edge part of the knife N to the corner part 6B of the laminated body 6 as shown in FIG. 5(C) , set to the height of the interface 28.

After that, as shown in FIG. 5(D), the knife N is moved horizontally toward the corner portion 6B, and the knife N is applied to the interface 28 located at the corner portion 6B by a predetermined amount. Upon entry, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N. Thereby, like FIG.5(E), the peeling start part 34 is formed in the interface 28 of the corner part 6B. The above is the 2nd peeling start part formation method. Incidentally, the cutting amount of the knife N to the interfaces 24 and 28 may be the same or different.

The layered product 6 in which the peeling start portions 32 and 34 are formed is taken out of the peeling start portion forming device 10 and conveyed to the peeling device, and the reinforcing plate ( 3B and 3A) are sequentially peeled off. Details of the peeling method will be described later, but as indicated by the arrow A in FIG. 6 , at the interface 24, the laminate 6 is bent from the corner 6A toward the corner 6B. It peels from the start part 32 as a starting point. Thereby, the reinforcing board 3B peels. Then, as indicated by the arrow B in FIG. 6 , the peeling start portion 34 is formed at the interface 28 by bending the laminate 6 from the corner portion 6B toward the corner portion 6A. It is separated from the starting point. Thereby, 3 A of reinforcing plates are peeled. In addition, you may perform peeling of 3 A of reinforcement boards first.

As described above, in the second peeling start portion forming step, in the peeling start portion forming step, the peeling start portions 32 and 34 are sequentially formed on the interfaces 24 and 28 using a knife N, and the interface 24 , 28), reinforcing plates 3B and 3A are sequentially peeled in a peeling step. As a result, since the transfer of the layered product 6 from the peeling start portion forming device 10 to the peeling device is completed in one cycle, even if the layered product 6 provided with the interfaces 24 and 28 to be peeled on two surfaces, Reinforcement board 3A, 3B can be peeled off efficiently.

In addition, the cutting amount of the knife N is preferably set to 7 mm or more, more preferably about 15 to 20 mm depending on the size of the layered body 6.

In addition, the bending direction of the laminated body 6 indicated by the arrow B in FIG. 6 may be a straight line direction connecting the corner portions 6B and 6A, with respect to one side of the laminated body 6 45 It may be in the direction of the figure. That is, the bending direction of the laminated body 6 should just be set from the corner part 6B toward the corner part 6A.

[peeling device 40]

FIG. 7 is a longitudinal sectional view showing the configuration of the peeling device 40 of the embodiment, and FIG. 8 is a schematic arrangement position of a plurality of movable members 44 with respect to the flexible plate 42 of the peeling device 40. It is a plan view of the flexible plate 42 shown in . 7 corresponds to a cross-sectional view taken along the line C-C in FIG. 8, and in FIG. 8, the laminate 6 is shown by a solid line.

As shown in FIG. 7 , the peeling device 40 includes a pair of movable devices 46 and 46 disposed vertically with the laminate 6 interposed therebetween. Since the movable devices 46 and 46 have the same structure, the movable device 46 disposed on the lower side in FIG. 7 will be described here, and the movable device 46 disposed on the upper side will be described by giving the same reference numerals. omit

The movable device 46 includes a flexible plate 42, a plurality of movable bodies 44, a plurality of drive devices 48 that lift and move the movable body 44 for each movable body 44, and a plurality of drive devices 48. It is composed of a controller 50 that controls the driving device 48 and the like.

The flexible board 42 vacuum-adsorbs and holds the reinforcing board 3B in order to bend and deform the reinforcing board 3B. In addition, instead of vacuum adsorption, electrostatic adsorption or magnetic adsorption may be used.

Fig. 9(a) is a plan view of the flexible board 42, and Fig. 9(b) is a longitudinal sectional view of the flexible board 42 along line D-D of Fig. 9(a).

The flexible plate 42 is a cloth-shaped adsorption sheet 52 for adsorbing and holding the reinforcing plate 3B of the laminated body 6, an elastic sheet 54 covered with the adsorption sheet 52, and an elastic sheet 54 ) It is composed of a body plate 56 supporting the. The surface of the elastic sheet 54 is provided with a through frame-shaped groove 58, and the suction sheet 52 is covered inside the groove 58. In addition, a plurality of through holes 60 are opened in the main body plate 56, one end of these through holes 60 communicates with the groove 58, and the other end passes through a suction pipe (not shown) to the intake source ( For example, it is connected to a vacuum pump).

Therefore, when the suction source is driven, air is sucked through the suction pipe, through hole 60 and groove 58, and the reinforcing plate 3B of the laminate 6 is vacuum-sucked to the suction sheet 52. holding is supported In this case, the external shape of the adsorbing sheet 52 is set larger than that of the reinforcing plate 3B so that the adsorbing sheet 52 can support the reinforcing plate 3B as a whole. In addition, although it is not specifically limited as a material of the elastic sheet 54, rubber is preferable. As the rubber, silicone rubber is preferred.

The body plate 56 is the same size as the elastic sheet 54 . Further, the body plate 56 has higher bending rigidity than the elastic sheet 54, and the bending rigidity of the body plate 56 dominates the bending rigidity of the flexible plate 42. It is preferable that the flexural rigidity per unit width (1 mm) of the flexible board 42 is 1000 to 40000 N mm 2 /mm. For example, in a portion where the width of the flexible board 42 is 100 mm, the bending stiffness is 100000 to 4000000 N mm 2 . By setting the bending rigidity of the flexible board 42 to 1000 N mm 2 /mm or more, bending of the reinforcing board 3B adsorbed and held by the flexible board 42 can be prevented. Moreover, the reinforcement board 3B adsorption-held by the flexible board 42 can be appropriately bent and deformed by making the bending rigidity of the flexible board 42 into 40000 N*mm<2>/mm or less.

As the main body plate 56, a metal plate other than a resin plate such as polyvinyl chloride (PVC) resin, polycarbonate resin, acrylic resin, or polyacetal (POM) resin is used, for example.

On the lower surface of the body plate 56, a plurality of disc-shaped movable members 44 shown in FIG. 7 are fixed in a checkerboard shape as shown in FIG. These movable bodies 44 are fixed to the main body plate 56 by means of fastening members such as bolts, but may be bonded instead of bolts. These movable bodies 44 are moved up and down independently by a driving device 48 driven and controlled by the controller 50 .

That is, the controller 50 controls the driving device 48, and from the movable body 44 located on the corner part 6A side of the laminated body 6 in FIG. The movable body 44 located on the side of the corner portion 6B is sequentially moved downward. By this operation, as shown in the longitudinal cross-sectional view of FIG. 10 , the layered product 6 is peeled starting from the peeling start portion 26 (see FIG. 4 ) of the interface 24 . The laminate 6 shown in FIGS. 7 and 10 is a laminate 6 in which the peel start portions 26 and 30 are formed by the first peel start portion formation method described in FIG. 3 .

The driving device 48 is constituted by, for example, a rotary servo motor and a ball screw mechanism. The rotational motion of the servo motor is converted into linear motion in the ball screw mechanism and transmitted to the rod 62 of the ball screw mechanism. A movable body 44 is attached to the distal end of the rod 62 via a ball joint 64 . Thereby, as shown in FIG. 10 , the movable body 44 can be tilted following the bending deformation of the flexible board 42 . Therefore, the flexible board 42 can be bent and deformed from the corner part 6A toward the corner part 6B, without applying excessive force to the flexible board 42. In addition, the drive device 48 is not limited to a rotary servomotor and a ball screw mechanism, and may be a linear servomotor or a fluid pressure cylinder (for example, a pneumatic cylinder).

It is preferable that the plurality of drive devices 48 are installed on a frame 66 that can be moved up and down with a cushion member 68 interposed therebetween. The cushion member 68 elastically deforms to follow the bending deformation of the flexible plate 42 . As a result, the rod 62 tilts with respect to the frame 66 .

The frame 66 is moved downward by a driving unit (not shown) when the peeled reinforcing board 3B is detached from the flexible board 42 .

The controller 50 is configured as a computer including a CPU, a recording medium such as ROM and RAM, and the like. The controller 50 controls the plurality of drive devices 48 for each drive device 48 and controls the lifting and lowering of the plurality of movable bodies 44 by causing the CPU to execute a program recorded on a recording medium.

[Peel method of reinforcing board 3A, 3B by peeling device 40]

[Peel method based on first peel start portion formation method]

In FIGS. 11(A) to 11(C) to 12(A) to 12(C), the corner portion 6A is formed by the first peeling start portion forming method described in FIG. 3 The peeling method of the laminated body 6 in which the peeling start parts 26 and 30 were formed is shown in this. That is, the peeling method of peeling reinforcement board 3A, 3B of the laminated body 6 is shown time-sequentially in the figure. In addition, the carry-in operation of the layered product 6 to the peeling device 40 and the carrying-out operation of the peeled reinforcing plates 3A and 3B and the panel 70 are carried out by the suction pad 72 shown in FIG. 11(A) It is performed by the conveying device 74 provided with. 11 and 12, illustration of the movable device 46 is omitted in order to avoid the complexity of the drawings. In addition, the panel 70 is a product panel to which the substrate 2A and the substrate 2B excluding the reinforcing plates 3A and 3B are attached via the functional layer 7.

11(A) is a side view of the peeling device 40 in which the layered product 6 is mounted on the lower flexible board 42 by operations indicated by the arrows E and F of the conveying device 74 . In this case, the lower flexible board 42 and the upper flexible board 42 are relatively It is moved in advance to a sufficiently retracted position. Then, when the laminated body 6 is placed on the lower flexible board 42, the reinforcing board 3B of the laminated body 6 is vacuum-sucked and held by the lower flexible board 42.

In (B) of FIG. 11 , the lower flexible board 42 and the upper flexible board 42 are moved in a direction in which they are relatively closer together, and the reinforcing board 3A of the laminated body 6 is the upper flexible board 42. It is a side view of the peeling device 40 in the state of being held by vacuum adsorption by the plate 42.

11(C) shows the interface 24 of the laminate 6 while bending the lower flexible board 42 downward from the corner 6A of the laminate 6 toward the corner 6B. ), it is a side view showing a state in which the reinforcing plate 3B is peeled from the peeling start part 26 (see Fig. 4) as a starting point. That is, in the plurality of movable bodies 44 of the lower flexible plate 42 shown in FIG. 10, the corner portion ( 6B), the movable body 44 located on the side is sequentially moved downward, and the reinforcing plate 3B is peeled at the interface 24.

12(A) is a side view of the peeling device 40 in a state in which the reinforcing plate 3B is completely peeled from the interface 24. As shown in FIG. According to the figure, the peeled reinforcing board 3B is held in vacuum by the lower flexible board 42, and the laminate 6 (reinforcing board 3A and panel ( 70) is vacuum-sucked and held by the flexible plate 42 on the upper side.

In addition, the lower flexible board 42 and the upper flexible board 42 are relatively It is moved to a fully evacuated position.

After that, the vacuum adsorption of the flexible plate 42 on the lower side is released first. Next, the reinforcing board 3B is suction-held by the suction pad 72 of the conveyance device 74. Then, the reinforcing board 3B is carried out from the peeling apparatus 40 by the operation|movement of the conveying apparatus 74 shown by the arrows G and H of FIG. 12(A).

12(B) is a side view in which the laminate 6 excluding the reinforcing plate 3B is vacuum-sucked and held by the flexible board 42 on the lower side and the flexible board 42 on the upper side. That is, the lower flexible board 42 and the upper flexible board 42 are moved in a direction in which they become relatively closer, and the substrate 2B is vacuum-sucked and held by the lower flexible board 42 .

12(C) shows the interface 28 of the laminate 6 while bending and deforming the upper flexible board 42 upward from the corner 6A of the laminate 6 toward the corner 6B. ), it is a side view showing a state in which the reinforcing plate 3A is peeled starting from the peeling start portion 30 (see Fig. 4). That is, in the plurality of movable bodies 44 of the upper flexible plate 42 shown in FIG. 7 , the corner portion ( The movable body 44 located on the 6B) side is sequentially moved upward, and the reinforcing plate 3A is peeled at the interface 28.

Thereafter, the reinforcing board 3A completely peeled from the panel 70 is detached from the upper flexible board 42, and the panel 70 is detached from the lower flexible board 42. The above is the peeling method of the laminated body 6 in which the peeling start parts 26 and 30 were formed in 6 A of corner parts.

Therefore, according to the peeling method of the above embodiment, the peeling start part forming device 10 forms the peeling start parts 26 and 30 at the interfaces 24 and 28, and reinforces them at the interfaces 24 and 28. Plates 3B and 3A are sequentially peeled with the peeling device 40 . As a result, the conveyance of the layered product 6 from the peeling start portion forming device 10 to the peeling device 40 is completed in one cycle, so that the layered product 6 provided with the interfaces 24 and 28 to be peeled on both sides. Even if it is, reinforcement board 3A, 3B can be peeled off efficiently.

[Peel method based on second peel start portion formation method]

13 shows a method for peeling the layered product 6 in which peeling start portions 32 and 34 (see FIG. 6 ) are formed at corner portions 6A and 6B by the second peeling start portion forming method described in FIG. 5 . The main part is shown.

In this peeling method, the reinforcing plate 3B is first peeled at the interface 24 starting from the peeling start portion 32, but the process is shown in FIGS. 11(A) to 11(C) to 12 Since it is the same as the steps shown in (A) and (B) of FIG. 12, the description is omitted.

The peeling method based on the 2nd peeling start part formation method removes the corner part 6A from the corner part 6B of the laminated body 6, as shown in FIG. 13 from the state of FIG. 12(B). In the interface 28 of the layered product 6, while bending and deforming the upper flexible board 42 upward, the reinforcing board 3A is formed starting from the peeling start portion 34 (see Fig. 6). peel off

After that, the reinforcing board 3A completely peeled from the panel 70 is taken out from the upper flexible board 42, and the panel 70 is taken out from the lower flexible board 42. The above is the peeling method of the laminated body 6 in which the peeling start part 32 was formed in the corner part 6A, and the peeling start part 34 was formed in the corner part 6B.

Therefore, according to the peeling method of the above embodiment, the peeling start part forming device 10 forms the peeling start parts 32 and 34 at the interfaces 24 and 28, and reinforces them at the interfaces 24 and 28. Plates 3B and 3A are sequentially peeled with the peeling device 40 . As a result, since the conveyance of the layered product 6 from the peeling start portion forming device 10 to the peeling device 40 is completed in one cycle, the layered product 6 provided with the interfaces 24 and 28 to be peeled on both sides. Even if it is, reinforcement board 3A, 3B can be peeled off efficiently.

In addition, the peeling start portion forming operation of the interfaces 24 and 28 by the peeling start portion forming device 10 and the peeling operation on the interfaces 24 and 28 by the peeling device 40 are performed by the peeling start portion forming device. It is preferable to control by the control apparatus (control means) 76 of FIG. 7 which controls (10) and the peeling apparatus 40 collectively.

Further, in the embodiment, the laminate 6 provided with the interfaces 24 and 28 on two surfaces was exemplified, but the laminate 6 to which the present invention is intended is not limited to the laminate 6, but three What is necessary is just a laminated body to which the above board|substrates were affixed so that peeling was possible.

Although this invention was detailed also demonstrated with reference to the specific embodiment, it is clear for those skilled in the art that various changes and correction can be added without deviating from the mind and range of this invention.

This application is based on Japanese Patent Application No. 2014-093440 filed on April 30, 2014, the contents of which are incorporated herein by reference.

N: knife
1: Laminate
1A: 1st laminated body
1B: 2nd laminated body
2: substrate
2a: the surface of the substrate
2b: back side of substrate
2A: Substrate
2Aa: surface of substrate
2B: substrate
2Ba: surface of substrate
3: reinforcement plate
3a: surface of reinforcing plate
3A: reinforcement plate
3B: reinforcement plate
3Bb: back side of stiffening plate
4: resin layer
4A: resin layer
4B: resin layer
6: laminate
6A, 6B: corner part
7: functional layer
10: Peeling start portion forming device
12: table
14: Holder
16: height adjustment device
18: transfer device
20: liquid
22: liquid supply device
24: interface
26: peeling start portion
28: interface
30: peeling start portion
32, 34: peeling start portion
40: peeling device
42: flexible plate
44: movable body
46: mobile device
48: driving device
50: controller
52: adsorption sheet
54: elastic sheet
56: body plate
58: home
60: through hole
62: load
64: ball joint
66: frame
68: cushion member
70: panel
72 suction pad
74 conveying device
76: control device

Claims (9)

For a laminate in which three or more substrates are detachably attached, a knife is removed from an end of the laminate in a state where the interface between adjacent substrates and two or more surfaces is not held in the thickness direction of the laminate. Peeling start portion forming means for forming two or more peeling start portions by metered injection;
Separation means for bending and deforming at least one substrate among the three or more substrates and sequentially peeling them from the separation start portion of the interface of the two or more surfaces as a starting point;
After controlling the peeling start portion formation means to sequentially insert the knife into the interface of the two or more surfaces to form the two or more peeling start portions, the peeling means is controlled to set the peeling start portion of the interface of the two or more surfaces as the starting point. To provide a control means for peeling in order,
The cutting position of the knife by the peeling start portion forming means is set at the first corner of the laminate and overlaps in the thickness direction of the laminate, and the cutting amount of the knife is different for each interface. is set, and the bending direction of the substrate by the peeling means is set from the first corner portion toward the corner portion opposite to the first corner portion, and the interface where the cutting amount of the knife is large is the cutting amount of the knife A peeling device for a laminate characterized in that it peels before a small interface. For a laminate in which three or more substrates are detachably attached, a knife is removed from an end of the laminate in a state where the interface between adjacent substrates and two or more surfaces is not held in the thickness direction of the laminate. Peeling start portion forming means for forming two or more peeling start portions by metered injection;
Separation means for bending and deforming at least one substrate among the three or more substrates and sequentially peeling them from the separation start portion of the interface of the two or more surfaces as a starting point;
After controlling the peeling start portion formation means to sequentially insert the knife into the interface of the two or more surfaces to form the two or more peeling start portions, the peeling means is controlled to set the peeling start portion of the interface of the two or more surfaces as the starting point. To provide a control means for peeling in order,
The insertion position of the knife by the peeling start portion forming means is set at least at a first corner portion of the laminate and other corner portions other than the first corner portion, and the bending direction of the substrate by the peeling means is , The peeling device for a layered product characterized in that it is set from the first corner portion toward a corner portion facing the first corner portion, and is set toward a corner portion opposing the other corner portion from the other corner portion. The layered body according to claim 1 or 2, wherein at least a first substrate, a second substrate, a third substrate and a fourth substrate are attached in this order so as to be peelable, and the peeling start portion forming means The cutting position of the knife by is set at the interface between the first substrate and the second substrate and the interface between the third substrate and the fourth substrate. For a laminate in which three or more substrates are detachably attached, a knife is removed from an end of the laminate in a state where the interface between adjacent substrates and two or more surfaces is not held in the thickness direction of the laminate. A peeling start portion forming step of forming two or more peeling start portions, respectively, by metered injection;
A peeling step of flexurally deforming at least one substrate among the three or more substrates and sequentially peeling from the peeling start portion of the interface of the two or more surfaces as a starting point;
The insertion position of the knife by the peeling start portion forming step is set at a position overlapping in the thickness direction of the laminate at the first corner of the laminate, and the insertion amount of the knife is different for each interface. set, and the bending direction of the substrate by the peeling step is set from the first corner portion toward the corner portion opposite to the first corner portion, and the interface where the cutting amount of the knife is large is the cutting amount of the knife A peeling method of a laminate characterized by peeling before a small interface. For a laminate in which three or more substrates are detachably attached, a knife is removed from an end of the laminate in a state where the interface between adjacent substrates and two or more surfaces is not held in the thickness direction of the laminate. A peeling start portion forming step of forming two or more peeling start portions, respectively, by metered injection;
A peeling step of flexurally deforming at least one substrate among the three or more substrates and sequentially peeling from the peeling start portion of the interface of the two or more surfaces as a starting point;
The insertion position of the knife by the peeling start portion forming step is set at least at the first corner portion of the laminate and other corner portions other than the first corner portion, and the bending direction of the substrate by the peeling step is , The method of peeling a laminate characterized in that the first corner portion is set toward a corner portion facing the first corner portion, and the other corner portion is set toward a corner portion opposed to the other corner portion. The layered product according to claim 4 or 5, wherein at least a first substrate, a second substrate, a third substrate, and a fourth substrate are attached to each other in a peelable manner, and The cutting position of the knife is set at the interface between the first substrate and the second substrate and the interface between the third substrate and the fourth substrate. A functional layer forming step of forming a functional layer on the surface of at least one of the substrates included in a laminate in which three or more substrates are detachably attached, and separating the substrate on which the functional layer is formed from other substrates. In the method of manufacturing an electronic device having a separation step,
The separation process is
Two or more peeling start portions are respectively formed by inserting a knife from an edge of the laminate by a predetermined amount into an interface between two or more planes of the interface between adjacent substrates of the laminate and not being pinched in the thickness direction of the laminate. A peeling start portion forming step to do;
A peeling step of flexurally deforming at least one substrate among the three or more substrates and sequentially peeling from the peeling start portion of the interface of the two or more surfaces as a starting point;
The insertion position of the knife by the peeling start portion forming step is set at a position overlapping in the thickness direction of the laminate at the first corner of the laminate, and the insertion amount of the knife is different for each interface. set, and the bending direction of the substrate by the peeling step is set from the first corner portion toward the corner portion opposite to the first corner portion, and the interface where the cutting amount of the knife is large is the cutting amount of the knife A method of manufacturing an electronic device, characterized in that the peeling occurs before the small interface. A functional layer forming step of forming a functional layer on the surface of at least one of the substrates included in a laminate in which three or more substrates are detachably attached, and separating the substrate on which the functional layer is formed from other substrates. In the method of manufacturing an electronic device having a separation step,
The separation process is
Two or more peeling start portions are respectively formed by inserting a knife from an edge of the laminate by a predetermined amount into an interface between two or more planes of the interface between adjacent substrates of the laminate and not being pinched in the thickness direction of the laminate. A peeling start portion forming step to do;
A peeling step of flexurally deforming at least one substrate among the three or more substrates and sequentially peeling from the peeling start portion of the interface of the two or more surfaces as a starting point;
The insertion position of the knife by the peeling start portion forming step is set at least at the first corner portion of the laminate and other corner portions other than the first corner portion, and the bending direction of the substrate by the peeling step is , The method of manufacturing an electronic device characterized in that the first corner portion is set toward a corner portion opposite to the first corner portion, and the other corner portion is set toward a corner portion opposed to the other corner portion. The laminate according to claim 7 or 8, wherein at least a first substrate, a second substrate, a third substrate, and a fourth substrate are attached to each other in a peelable manner, and the second substrate and the third substrate are attached to each other in a peelable manner. The functional layer is formed on each opposing surface of, and the insertion position of the knife by the peeling start portion forming step is the interface between the first substrate and the second substrate and the third substrate and the fourth substrate. A method for manufacturing an electronic device characterized in that it is set on an interface.

Images