TWI692407B - Lamination body peeling device and method, and electronic device manufacturing method - Google Patents
Lamination body peeling device and method, and electronic device manufacturing method Download PDFInfo
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- TWI692407B TWI692407B TW104113778A TW104113778A TWI692407B TW I692407 B TWI692407 B TW I692407B TW 104113778 A TW104113778 A TW 104113778A TW 104113778 A TW104113778 A TW 104113778A TW I692407 B TWI692407 B TW I692407B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G41/00—Supporting frames or bases for conveyors as a whole, e.g. transportable conveyor frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/50—Auxiliary process performed during handling process
- B65H2301/51—Modifying a characteristic of handled material
- B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
- B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
- B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本發明係關於一種積層體之剝離裝置,其特徵在於具備:剝離起始部製作器件,其針對由3片以上之基板可剝離地貼合而成之積層體,自上述積層體之端部將刀插入相鄰之基板與基板之界面中之2個以上之界面特定量而製作2個以上之剝離起始部;剝離器件,其使上述3片以上之基板中之至少一片基板撓曲變形,並以上述2個以上之界面之上述剝離起始部為起點依序剝離;及控制器件,其於控制上述剝離起始部製作器件在上述2個以上之界面使上述刀依序插入而製作上述2個以上之剝離起始部後,控制上述剝離器件以上述2個以上之界面之上述剝離起始部為起點依序剝離。 The present invention relates to a device for peeling a laminate, which is characterized by comprising: a device for producing a peeling start portion, which is a peelable laminate of three or more substrates, and a device from the end of the laminate The knife is inserted into a specific amount of more than two interfaces in the interface between the adjacent substrate and the substrate to produce two or more peeling start portions; the peeling device deflects at least one of the three or more substrates, And take the peeling start portion of the above two or more interfaces as the starting point for peeling in sequence; and control the device, which controls the peeling start portion manufacturing device to insert the knife in order at the two or more interfaces to make the above After two or more peeling start portions, the peeling device is controlled to peel in sequence starting from the peeling starting portions of the two or more interfaces.
Description
本發明係關於一種積層體之剝離裝置及剝離方法、以及電子裝置之製造方法。 The invention relates to a peeling device and peeling method of a laminate, and a manufacturing method of an electronic device.
隨著顯示面板、太陽電池、薄膜二次電池等電子裝置之薄型化、輕量化,期待該等電子裝置所使用之玻璃板、樹脂板、金屬板等基板之薄板化。 As electronic devices such as display panels, solar cells, and thin film secondary batteries become thinner and lighter, it is expected that substrates such as glass plates, resin plates, and metal plates used in these electronic devices will become thinner.
然而,若基板之厚度變得過薄,則基板之操作性會變差,故而難以於基板之正面形成電子裝置用之功能層(薄膜電晶體(TFT:Thin Film Transistor)、彩色濾光片(CF:Color Filter))。 However, if the thickness of the substrate becomes too thin, the operability of the substrate deteriorates, so it is difficult to form a functional layer (thin film transistor (TFT: Thin Film Transistor), color filter (TFT) for electronic devices on the front surface of the substrate CF: Color Filter)).
因此,提出有將補強板(基板)貼合於基板之背面而構成藉由補強板對基板進行了補強之積層體,並於積層體之狀態下於基板之正面形成功能層之方法(參照專利文獻1)。於該方法中,由於基板之操作性提高,故而可於基板之正面良好地形成功能層。而且,於形成功能層後將補強板自基板剝離。 Therefore, a method of bonding a reinforcing plate (substrate) to the back of the substrate to form a laminate that reinforces the substrate with the reinforcing plate, and forming a functional layer on the front of the substrate in the state of the laminate (refer to the patent Literature 1). In this method, since the operability of the substrate is improved, the functional layer can be formed well on the front surface of the substrate. Furthermore, after forming the functional layer, the reinforcing plate is peeled off from the substrate.
作為一例,補強板之剝離方法係藉由如下而進行,即:自位於矩形狀之積層體之對角線上之2個角部之一者朝向另一者,使補強板或基板、或者其兩者向相互隔開之方向撓曲變形。此時,為了順利地進行剝離,而於積層體之一角部製作剝離起始部。剝離起始部係如專利文獻1般,藉由自積層體之端面將刀(剝離刀)插入基板與補強板之界面特定量,而於一角部之特定之區域形成剝離起始部而製作。 As an example, the peeling method of the reinforcing plate is carried out by moving one of the two corners on the diagonal of the rectangular laminate toward the other, and making the reinforcing plate or substrate, or both Those deflect and deform in directions separated from each other. At this time, in order to carry out the peeling smoothly, a peeling start portion was formed at one corner of the laminate. The peeling start part is produced by inserting a knife (peeling knife) from the end face of the laminate into the interface between the substrate and the reinforcing plate by a specific amount, and forming a peeling start part at a specific area of a corner.
又,於專利文獻2中,亦揭示有積層體之剝離裝置,於該剝離裝置中亦藉由將刀(楔)自積層體之端面插入基板與基板之界面而形成剝離起始部。 In addition, Patent Document 2 also discloses a peeling device for a laminate. In this peeling device, a blade (wedge) is also inserted into the interface between the substrate and the substrate from the end surface of the laminate to form a peeling start portion.
因此,專利文獻1之剝離裝置係於利用吸附墊等固定積層體之正反面之狀態下、即於在厚度方向上夾持積層體之狀態下將刀插入上述界面,故而於插入時會自刀對基板施加不需要之力,而存在基板破損之顧慮。 Therefore, the peeling device of Patent Document 1 inserts the knife into the above interface in a state where the front and back surfaces of the laminate are fixed by an adsorption pad, etc., that is, in a state where the laminate is sandwiched in the thickness direction, so the knife will automatically An unnecessary force is applied to the substrate, and there is a concern that the substrate may be damaged.
又,專利文獻2之剝離裝置係於將刀插入界面之狀態下利用吸附墊等於厚度方向上夾持積層體,故而於利用吸附墊夾持積層體時刀所插入之部分會受到擠壓力,而有基板破損之虞。 In addition, the peeling device of Patent Document 2 clamps the laminate in the thickness direction with the suction pad in the state where the knife is inserted into the interface, so when the laminate is clamped with the suction pad, the portion where the knife is inserted is subjected to squeezing force. There is a risk of substrate damage.
根據此種情況,近年來,將利用刀而進行之剝離起始部製作步驟與利用剝離裝置而進行之剝離步驟分開實施,以防止專利文獻1、2之不良情況。 In view of this situation, in recent years, the preparation step of the peeling start portion by the knife and the peeling step by the peeling device have been implemented separately to prevent the defects of Patent Documents 1 and 2.
[專利文獻1]國際公開第2011/024689號公報 [Patent Document 1] International Publication No. 2011/024689
[專利文獻2]日本專利特開平10-244545號公報 [Patent Document 2] Japanese Patent Laid-Open No. 10-244545
於欲進行剝離之界面僅為1面之積層體之情形時,於利用剝離起始部製作裝置之刀於該界面製作剝離起始部後,將該積層體自剝離起始部製作裝置搬送至剝離裝置,並利用剝離裝置使基板剝離即可,該一系列之作業不耗費工夫。 In the case where the interface to be peeled is only one-sided laminate, after the peeling start portion is made at the interface using the knife of the peeling start portion manufacturing device, the laminate is transferred from the peeling start portion manufacturing device to It is only necessary to peel off the substrate by using the peeling device, and the series of operations do not require much effort.
然而,於具備2個以上之欲進行剝離之界面之包含3片以上之基板之積層體之情形時,必須於剝離起始部製作裝置與剝離裝置之間使界面之面數之積層體往返搬送,因此存在無法高效率地剝離基板之問 題。 However, in the case of a laminate including three or more substrates with more than two interfaces to be peeled off, the laminate with the number of faces in the interface must be transported back and forth between the peeling start preparation device and the peeling device , There is a problem that the substrate cannot be stripped efficiently question.
本發明係鑒於此種問題而完成者,其目的在於提供一種於具備2個以上之欲進行剝離之界面之包含3片以上之基板之積層體中,可高效率地剝離基板之積層體之剝離裝置及剝離方法、以及電子裝置之製造方法。 The present invention has been completed in view of such a problem, and its object is to provide a peeling which can efficiently peel off a laminate of a substrate in a laminate including three or more substrates having two or more interfaces to be peeled off Device and peeling method, and manufacturing method of electronic device.
為了達成上述目的,本發明之積層體之剝離裝置之特徵在於具備:剝離起始部製作器件,其針對由3片以上之基板可剝離地貼合而成之積層體,自上述積層體之端部將刀插入相鄰之基板與基板之界面中之2個以上之界面特定量而製作2個以上之剝離起始部;剝離器件,其使上述3片以上之基板中之至少一片基板撓曲變形,並以上述2個以上之界面之上述剝離起始部為起點依序剝離;及控制器件,其於控制上述剝離起始部製作器件在上述2個以上之界面使上述刀依序插入而製作上述2個以上之剝離起始部後,控制上述剝離器件以上述2個以上之界面之上述剝離起始部為起點依序剝離。 In order to achieve the above object, the device for peeling a laminate of the present invention is characterized by comprising: a device for producing a peeling start portion, which is for a laminate formed by peelably bonding three or more substrates from the end of the laminate Insert a knife into two or more of the interface of the adjacent substrate and the interface of the substrate to produce a peeling start portion of 2 or more; a peeling device that deflects at least one of the above 3 or more substrates Deformed, and sequentially peeled off with the peeling start portion of the above two or more interfaces as the starting point; and a control device, which controls the peeling start portion manufacturing device to sequentially insert the knife at the two or more interfaces and After the two or more peeling start portions are produced, the peeling device is controlled to be peeled in sequence starting from the peeling starting portions of the two or more interfaces.
為了達成上述目的,本發明之積層體之剝離方法之特徵在於具備:剝離起始部製作步驟,其係針對由3片以上之基板可剝離地貼合而成之積層體,自上述積層體之端部將刀插入相鄰之基板與基板之界面中之2個以上之界面特定量而分別製作2個以上之剝離起始部;及剝離步驟,其係使上述3片以上之基板中之至少一片基板撓曲變形,並以上述2個以上之界面之上述剝離起始部為起點依序剝離。 In order to achieve the above object, the peeling method of the laminate of the present invention is characterized by comprising: a peeling start part manufacturing step, which is directed to a laminate obtained by peelably bonding three or more substrates from the above laminate Inserting a knife into two or more interfaces of the adjacent substrate and the interface of the substrate at a specific amount to produce two or more peeling start portions; and a peeling step, which makes at least three of the above three or more substrates A piece of substrate is flexed and deformed, and peeled in sequence starting from the peeling start portion of the two or more interfaces.
為了達成上述目的,本發明之電子裝置之製造方法係具有:功能層形成步驟,其係於由3片以上之基板可剝離地貼合而成之積層體所含之上述基板中之至少1片基板之正面形成功能層;及分離步驟,其係將形成有上述功能層之上述基板自另一基板分離;該電子裝置之製造方法之特徵在於上述分離步驟具備:剝離起始部製作步驟,其係 自上述積層體之端部將刀插入上述積層體之相鄰之基板與基板之界面中之2個以上之界面特定量而分別製作2個以上之剝離起始部;及剝離步驟,其係使上述3片以上之基板中之至少一片基板撓曲變形,並以上述2個以上之界面之上述剝離起始部為起點依序剝離。 In order to achieve the above object, the method for manufacturing an electronic device of the present invention includes: a functional layer forming step, which is at least one of the above-mentioned substrates contained in a laminate formed by peelably bonding three or more substrates A functional layer is formed on the front surface of the substrate; and a separation step is to separate the substrate on which the functional layer is formed from another substrate; the manufacturing method of the electronic device is characterized in that the separation step includes: a peeling start portion manufacturing step, which system From the end of the layered body, insert a knife into the interface between the adjacent substrate and the substrate of the layered body to produce a specific amount of more than two interfaces to produce two or more peeling start portions; and a peeling step At least one of the three or more substrates is flexed and deformed, and is peeled in sequence starting from the peeling start portion of the two or more interfaces.
根據本發明,於剝離起始部製作器件或步驟中,於2個以上之界面使用刀製作剝離起始部,並於剝離步驟中將基板依序剝離。藉此,將積層體自剝離起始部製作器件向剝離器件搬送1次便可,因此即便為具備2個以上之欲進行剝離之界面之包含3片以上之基板之積層體,亦可高效率地剝離基板。 According to the present invention, in the device or step of producing the peeling start portion, the peeling starting portion is made using a knife at two or more interfaces, and the substrate is sequentially peeled in the peeling step. In this way, it is only necessary to transport the laminate from the starting device of peeling to the peeling device once. Therefore, even a laminate including three or more substrates having two or more interfaces to be peeled off can be highly efficient Peel the substrate.
於本發明之一態樣中,較佳為上述剝離起始部製作器件或步驟之上述刀之插入位置係設定為上述積層體之第1角部且於上述積層體之厚度方向上重疊之位置,且上述刀之插入量係以針對上述每一界面而不同之方式設定,且因上述剝離器件或步驟所致之上述基板之撓曲方向係自上述第1角部朝向與上述第1角部對向之角部而設定。 In one aspect of the present invention, it is preferable that the insertion position of the knife in the device or step of making the peeling start portion is set to a position where the first corner of the laminate body overlaps in the thickness direction of the laminate body , And the insertion amount of the knife is set differently for each interface, and the deflection direction of the substrate due to the peeling device or step is from the first corner to the first corner Set to the opposite corner.
於本發明中提及之上述基板之撓曲方向可為連結上述第1角部及與上述第1角部對向之角部之直線方向,亦可為相對於積層體之一邊呈45度之方向。即,上述基板之撓曲方向只要自上述第1角部朝向與上述第1角部對向之角部設定即可。 The deflection direction of the substrate mentioned in the present invention may be a linear direction connecting the first corner and the corner opposite to the first corner, or may be 45 degrees relative to one side of the laminate direction. That is, the deflection direction of the substrate may be set from the first corner to the corner opposite to the first corner.
根據上述本發明之一態樣,若藉由剝離器件或步驟使基板自第1角部朝向與第1角部對向之角部撓曲,則於2個以上之界面中之刀之插入量最大之界面,基板最先剝離。繼而,若使基板向該方向撓曲,則於刀之插入量第2大之界面基板剝離。根據上述本發明之一態樣,藉由使刀之插入量針對每一界面不同,可控制欲進行剝離之界面之順序。 According to one aspect of the present invention described above, if the substrate is flexed from the first corner to the corner opposite to the first corner by peeling off the device or step, the amount of insertion of the knife in more than two interfaces The largest interface, the substrate is peeled first. Then, if the substrate is flexed in this direction, the interface substrate with the second largest insertion amount of the blade is peeled off. According to one aspect of the present invention described above, by making the insertion amount of the knife different for each interface, the order of the interfaces to be peeled off can be controlled.
於本發明之另一態樣中,較佳為上述剝離起始部製作器件或步驟之上述刀之插入位置至少設定為上述積層體之第1角部與除上述第1 角部以外之另一角部,且因上述剝離器件或步驟所致之上述基板之撓曲方向係自上述第1角部朝向與上述第1角部對向之角部而設定,且係自上述另一角部朝向與上述另一角部對向之角部而設定。 In another aspect of the present invention, it is preferable that the insertion position of the knife in the device or step of making the peeling start portion is set at least to the first corner of the laminate and the first The other corner than the corner, and the deflection direction of the substrate due to the peeling device or step is set from the first corner to the corner opposite to the first corner, and is set from the above The other corner is set toward the corner facing the other corner.
根據上述本發明之另一態樣,若藉由剝離器件或步驟使基板自第1角部朝向與第1角部對向之角部撓曲,則以第1角部所具備之剝離起始部為起點而該基板剝離。又,若藉由剝離器件或步驟使基板自另一角部朝向與另一角部對向之角部撓曲,則以另一角部所具備之剝離起始部為起點而該基板剝離。根據上述本發明之另一態樣,藉由使基板撓曲之方向,可控制欲進行剝離之界面之順序。 According to another aspect of the present invention described above, if the substrate is flexed from the first corner to the corner opposite to the first corner by peeling off the device or step, the peeling of the first corner starts The substrate is peeled off as the starting point. In addition, if the substrate is flexed from the other corner to the corner opposite to the other corner by the peeling device or step, the substrate is peeled starting from the peeling start portion provided in the other corner. According to another aspect of the present invention described above, by deflecting the substrate, the order of the interfaces to be peeled off can be controlled.
於本發明中,上述積層體較佳為至少第1基板、第2基板、第3基板、及第4基板依序可剝離地貼合而成之積層體,上述剝離起始部製作器件或步驟之上述刀之插入位置較佳設定為上述第1基板與上述第2基板之界面、及上述第3基板與上述第4基板之界面。 In the present invention, the laminate is preferably a laminate in which at least a first substrate, a second substrate, a third substrate, and a fourth substrate are peelably bonded in sequence, and the device or step for producing the peeling start portion The insertion position of the knife is preferably set to the interface between the first substrate and the second substrate, and the interface between the third substrate and the fourth substrate.
本發明例如係將包含第1至第4基板之積層體作為對象。於剝離起始部製作器件或步驟中,於第1基板與第2基板之界面、及第3基板與第4基板之界面分別製作剝離起始部。於剝離器件或步驟中,於該2個界面將基板依序剝離,並取出貼合有第2基板與第3基板之製品基板。於製品基板為電子裝置之情形時,於功能層形成步驟中,於第2基板與第3基板之各者之對向面形成功能層。 The present invention targets, for example, a laminate including the first to fourth substrates. In the device or step of manufacturing the peeling start portion, the peeling start portion is formed at the interface between the first substrate and the second substrate, and the interface between the third substrate and the fourth substrate, respectively. In the device or step of peeling, the substrates are sequentially peeled off at the two interfaces, and the product substrate to which the second substrate and the third substrate are bonded is taken out. When the product substrate is an electronic device, in the functional layer forming step, the functional layer is formed on the opposing surface of each of the second substrate and the third substrate.
根據本發明之積層體之剝離裝置及剝離方法、以及電子裝置之製造方法,於具備2個以上之欲進行剝離之界面之包含3片以上之基板之積層體中,可高效率地剝離基板。 According to the peeling device and peeling method of the laminate of the present invention, and the manufacturing method of the electronic device, in a laminate including three or more substrates having two or more interfaces to be peeled off, the substrate can be efficiently peeled off.
1‧‧‧積層體 1‧‧‧Layered body
1A‧‧‧第1積層體 1A‧‧‧Layer 1
1B‧‧‧第2積層體 1B‧‧‧Layer 2
2‧‧‧基板 2‧‧‧ substrate
2a‧‧‧基板之正面 2a‧‧‧Front of substrate
2b‧‧‧基板之背面 2b‧‧‧Back of the substrate
2A‧‧‧基板 2A‧‧‧Substrate
2Aa‧‧‧基板之正面 2Aa‧‧‧Front of the substrate
2B‧‧‧基板 2B‧‧‧Substrate
2Ba‧‧‧基板之正面 2Ba‧‧‧Front of the substrate
3‧‧‧補強板 3‧‧‧Reinforcement board
3a‧‧‧補強板之正面 3a‧‧‧Front of reinforcement board
3A‧‧‧補強板 3A‧‧‧Reinforcement board
3B‧‧‧補強板 3B‧‧‧Reinforcement board
3Bb‧‧‧補強板之背面 3Bb‧‧‧The back of the reinforcement board
4‧‧‧樹脂層 4‧‧‧Resin layer
4A‧‧‧樹脂層 4A‧‧‧Resin layer
4B‧‧‧樹脂層 4B‧‧‧Resin layer
6‧‧‧積層體 6‧‧‧Layered body
6A、6B‧‧‧角部 6A, 6B ‧‧‧ corner
7‧‧‧功能層 7‧‧‧Functional layer
10‧‧‧剝離起始部製作裝置 10‧‧‧Stripping device
12‧‧‧工作台 12‧‧‧Workbench
14‧‧‧支持器 14‧‧‧Support
16‧‧‧高度調整裝置 16‧‧‧ Height adjustment device
18‧‧‧運輸裝置 18‧‧‧Transportation device
20‧‧‧液體 20‧‧‧Liquid
22‧‧‧液體供給裝置 22‧‧‧Liquid supply device
24‧‧‧界面 24‧‧‧Interface
26‧‧‧剝離起始部 26‧‧‧Stripping start
28‧‧‧界面 28‧‧‧Interface
30‧‧‧剝離起始部 30‧‧‧Stripping start
32、34‧‧‧剝離起始部 32、34‧‧‧Stripping start
40‧‧‧剝離裝置 40‧‧‧Stripping device
42‧‧‧可撓性板 42‧‧‧Flexible board
44‧‧‧可動體 44‧‧‧Moveable body
46‧‧‧可動裝置 46‧‧‧movable device
48‧‧‧驅動裝置 48‧‧‧Drive device
50‧‧‧控制器 50‧‧‧Controller
52‧‧‧吸附片 52‧‧‧Adsorption tablets
54‧‧‧彈性片 54‧‧‧Elastic sheet
56‧‧‧本體板 56‧‧‧Body board
58‧‧‧槽 58‧‧‧slot
60‧‧‧貫通孔 60‧‧‧Through hole
62‧‧‧桿 62‧‧‧
64‧‧‧球形接頭 64‧‧‧ball joint
66‧‧‧框架 66‧‧‧Frame
68‧‧‧緩衝構件 68‧‧‧buffer member
70‧‧‧面板 70‧‧‧Panel
72‧‧‧吸附墊 72‧‧‧Adsorption pad
74‧‧‧搬送裝置 74‧‧‧Conveying device
76‧‧‧控制裝置 76‧‧‧Control device
A~H‧‧‧箭頭 A~H‧‧‧arrow
N‧‧‧刀 N‧‧‧ knife
圖1係表示供於電子裝置之製造步驟之積層體之一例之要部放大側視圖。 FIG. 1 is an enlarged side view of a main part showing an example of a laminate to be used in a manufacturing step of an electronic device.
圖2係表示於LCD(Liquid Crystal Display,液晶顯示裝置)之製造步驟之中途製作之積層體之一例之要部放大側視圖。 FIG. 2 is an enlarged side view of a main part showing an example of a layered body produced in the middle of a manufacturing process of an LCD (Liquid Crystal Display).
圖3(A)~(E)係表示利用剝離起始部製作裝置之第1剝離起始部製作方法之說明圖。 FIGS. 3(A) to (E) are explanatory diagrams showing a first peeling start portion manufacturing method using a peeling start portion manufacturing apparatus.
圖4係藉由第1剝離起始部製作方法製作有剝離起始部之積層體之俯視圖。 FIG. 4 is a plan view of the laminate with the peeling start portion produced by the first peeling start portion production method.
圖5(A)~(E)係表示利用剝離起始部製作裝置之第2剝離起始部製作方法之說明圖。 5(A) to (E) are explanatory diagrams showing a second peeling start part manufacturing method using a peeling start part manufacturing device.
圖6係藉由第2剝離起始部製作方法製作有剝離起始部之積層體之俯視圖。 FIG. 6 is a plan view of the laminate with the peeling start portion produced by the second peeling start portion production method.
圖7係表示實施形態之剝離裝置之構成之縱剖視圖。 7 is a longitudinal cross-sectional view showing the structure of the peeling device of the embodiment.
圖8係模式性表示相對於可撓性板之複數個可動體之配置位置之可撓性板之俯視圖。 8 is a plan view schematically showing the flexible plate relative to the arrangement positions of the plural movable bodies of the flexible plate.
圖9(a)及(b)係表示可撓性板之構成之俯視圖及剖視圖。 9(a) and (b) are a plan view and a cross-sectional view showing the configuration of a flexible board.
圖10係於積層體之界面將基板剝離之剝離裝置之縱剖視圖。 10 is a longitudinal cross-sectional view of a peeling device that peels a substrate at the interface of a laminate.
圖11(A)~(C)係時間序列性地表示將藉由第1剝離起始部製作方法製作有剝離起始部之積層體之補強板剝離之剝離方法之說明圖。 11(A) to (C) are time-series explanatory diagrams showing a peeling method for peeling off the reinforcing plate of the laminate with the peeling start portion produced by the first peeling start portion manufacturing method.
圖12(A)~(C)係繼圖11時間序列性地表示將積層體之補強板剝離之剝離方法之說明圖。 12(A) to (C) are explanatory diagrams showing the peeling method for peeling off the reinforcing plate of the laminate in time series following FIG. 11.
圖13係將藉由第2剝離起始部製作方法製作有剝離起始部之積層體之補強板剝離之剝離方法之說明圖。 FIG. 13 is an explanatory diagram of a peeling method for peeling off the reinforcing plate of the laminate with the peeling start portion produced by the second peeling start portion manufacturing method.
以下,根據隨附圖式對本發明之實施形態進行說明。 Hereinafter, an embodiment of the present invention will be described based on the accompanying drawings.
以下,對在電子裝置之製造步驟中使用本發明之積層體之剝離裝置及剝離方法之情形進行說明。 Hereinafter, a case where the peeling device and peeling method of the laminate of the present invention are used in the manufacturing process of an electronic device will be described.
電子裝置係指顯示面板、太陽電池、薄膜二次電池等電子零 件。作為顯示面板,可例示液晶顯示器(LCD:Liquid Crystal Display)面板、電漿顯示面板(PDP:Plasma Display Panel)、及有機EL顯示器(OELD:Organic Electro Luminescence Display)面板。 Electronic devices refer to electronic components such as display panels, solar cells, thin-film secondary batteries, etc. Pieces. As the display panel, a liquid crystal display (LCD: Liquid Crystal Display) panel, a plasma display panel (PDP: Plasma Display Panel), and an organic EL display (OELD: Organic Electro Luminescence Display) panel can be exemplified.
[電子裝置之製造步驟] [Manufacturing steps of electronic device]
電子裝置係藉由於玻璃製、樹脂製、金屬製等基板之正面形成電子裝置用之功能層(若為LCD,則為薄膜電晶體(TFT)、彩色濾光片(CF))而製造。 The electronic device is manufactured by forming a functional layer (for a LCD, a thin-film transistor (TFT) or a color filter (CF)) for an electronic device on the front surface of a substrate made of glass, resin, or metal.
上述基板於形成功能層前,其背面被貼合於補強板(基板)而構成積層體。其後,於積層體之狀態下於基板之正面形成功能層。接下來,於形成功能層後,將補強板自基板剝離。 Before the above-mentioned substrate is formed with a functional layer, its back surface is bonded to a reinforcing plate (substrate) to constitute a laminate. Thereafter, a functional layer is formed on the front surface of the substrate in the state of the laminate. Next, after forming the functional layer, the reinforcing plate is peeled from the substrate.
即,電子裝置之製造步驟具備:功能層形成步驟,其係於積層體之狀態下於基板之正面形成功能層;及分離步驟,其係將補強板自形成有功能層之基板分離。於該分離步驟中應用本發明之積層體之剝離裝置及剝離方法。 That is, the manufacturing step of the electronic device includes: a functional layer forming step, which forms the functional layer on the front surface of the substrate in the state of the laminate; and a separation step, which separates the reinforcing plate from the substrate on which the functional layer is formed. In the separation step, the peeling device and peeling method of the laminate of the present invention are applied.
[積層體1] [Laminate 1]
圖1係表示積層體1之一例之要部放大側視圖。 FIG. 1 is an enlarged side view showing the main part of an example of the laminate 1.
積層體1具備:基板2,其欲形成功能層;及補強板3,其補強該基板2。又,補強板3於正面3a具備作為吸附層之樹脂層4,且基板2之背面2b貼合於樹脂層4。即,基板2係藉由作用於與樹脂層4之間之凡得瓦耳力或樹脂層4之黏著力而隔著樹脂層4可剝離地貼合於補強板3。
The laminate 1 includes: a substrate 2 which is to form a functional layer; and a reinforcing
再者,圖1之積層體1係2片基板(基板2及補強板3)可剝離地貼合而成之積層體。因此,雖並非設為本發明之對象之由3片以上之基板可剝離地貼合而成之積層體,但為了說明積層體之基本構造而作為參考圖進行表示。 In addition, the laminate 1 of FIG. 1 is a laminate in which two substrates (substrate 2 and reinforcing plate 3) are peelably bonded. Therefore, although it is not intended to be the object of the present invention, a laminate formed by peelably bonding three or more substrates is shown as a reference diagram for explaining the basic structure of the laminate.
[基板2] [Substrate 2]
基板2係於其正面2a欲形成功能層。作為基板2,可例示玻璃基板、陶瓷基板、樹脂基板、金屬基板、半導體基板。該等基板之中,玻璃基板之耐化學品性、耐透濕性優異,且線膨脹係數較小,因此較佳為作為電子裝置用之基板2。又,亦具有隨著線膨脹係數減小,於高溫下形成之功能層之圖案於冷卻時不易偏移之優點。
The substrate 2 is to form a functional layer on its
作為玻璃基板之玻璃,可例示無鹼玻璃、硼矽酸玻璃、鹼石灰玻璃、高二氧化矽玻璃、以其他氧化矽作為主要之成分之氧化物系玻璃。作為氧化物系玻璃,較佳為藉由氧化物換算而得之氧化矽之含量為40~90質量%之玻璃。 As the glass of the glass substrate, there can be exemplified alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and oxide-based glass having other silica as a main component. The oxide-based glass is preferably a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide conversion.
玻璃基板之玻璃較佳為選擇並採用適合欲製造之電子裝置之種類之玻璃、適合其製造步驟之玻璃。例如,對於液晶面板用之玻璃基板,較佳為採用實質上不含鹼金屬成分之玻璃(無鹼玻璃)。 The glass of the glass substrate is preferably selected and a glass suitable for the type of electronic device to be manufactured and a glass suitable for its manufacturing process are used. For example, for the glass substrate for a liquid crystal panel, it is preferable to use glass (alkali-free glass) that does not substantially contain an alkali metal component.
基板2之厚度係根據基板2之種類而設定。例如,於對基板2採用玻璃基板之情形時,為了實現電子裝置之輕量化、薄板化,其厚度較佳設定為0.7mm以下,更佳設定為0.3mm以下,進而較佳設定為0.1mm以下。於厚度為0.3mm以下之情形時,可對玻璃基板賦予良好之可撓性。進而,於厚度為0.1mm以下之情形時,可將玻璃基板捲曲成捲狀,但就玻璃基板之製造之觀點及玻璃基板之操作之觀點而言,其厚度較佳為0.03mm以上。 The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when a glass substrate is used for the substrate 2, in order to achieve weight reduction and thinning of the electronic device, the thickness is preferably set to 0.7 mm or less, more preferably 0.3 mm or less, and further preferably 0.1 mm or less . When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Furthermore, when the thickness is 0.1 mm or less, the glass substrate may be rolled into a roll shape. However, from the viewpoint of manufacturing the glass substrate and the viewpoint of handling the glass substrate, the thickness is preferably 0.03 mm or more.
再者,於圖1中基板2係由1片基板構成,但基板2亦可由複數片基板構成。即,基板2亦可由將複數片基板積層而成之積層體構成。於此情形時,構成基板2之所有基板之合計之厚度成為基板2之厚度。 In addition, in FIG. 1, the substrate 2 is composed of one substrate, but the substrate 2 may be composed of plural substrates. That is, the substrate 2 may be composed of a laminate in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the substrate 2 becomes the thickness of the substrate 2.
[補強板3] [Reinforcement board 3]
作為補強板3,可例示玻璃基板、陶瓷基板、樹脂基板、金屬基板、半導體基板。
Examples of the reinforcing
補強板3之種類係根據欲製造之電子裝置之種類、該電子裝置所
使用之基板2之種類等而選定。若補強板3與基板2為相同之材質,則可降低因溫度變化而引起之翹曲、剝離。
The type of
補強板3與基板2之平均線膨脹係數之差(絕對值)係根據基板2之尺寸形狀等適當設定,較佳為35×10-7/℃以下。此處,「平均線膨脹係數」係指50~300℃之溫度範圍內之平均線膨脹係數(JIS R3102:1995年)。
The difference (absolute value) of the average linear expansion coefficient of the reinforcing
補強板3之厚度設定為0.7mm以下,且係根據補強板3之種類、欲補強之基板2之種類、厚度等而適當設定。再者,補強板3之厚度可厚於基板2,亦可薄於基板2,但為了補強基板2,較佳為0.4mm以上。
The thickness of the reinforcing
再者,於本例中補強板3係由1片基板構成,但補強板3亦可由將複數片基板積層而成之積層體構成。於此情形時,構成補強板3之所有基板之合計之厚度成為補強板3之厚度。
In addition, in this example, the reinforcing
[樹脂層4] [Resin layer 4]
為了防止於樹脂層4與補強板3之間剝離,樹脂層4與補強板3之間之結合力設定為高於與基板2之間之結合力。藉此,於剝離步驟中,於樹脂層4與基板2之界面,基板2被剝離。
In order to prevent peeling between the resin layer 4 and the reinforcing
構成樹脂層4之樹脂並未特別限定,可例示丙烯酸系樹脂、聚烯烴樹脂、聚胺基甲酸酯樹脂、聚醯亞胺樹脂、聚矽氧樹脂、聚醯亞胺聚矽氧樹脂。亦可將若干種樹脂混合使用。其中,就耐熱性或剝離性之觀點而言,較佳為聚矽氧樹脂、聚醯亞胺聚矽氧樹脂。於實施形態中,例示聚矽氧樹脂層作為樹脂層4。 The resin constituting the resin layer 4 is not particularly limited, and examples thereof include acrylic resins, polyolefin resins, polyurethane resins, polyimide resins, polysiloxane resins, and polyimide polysiloxane resins. Several kinds of resins can also be mixed and used. Among them, from the viewpoint of heat resistance or peelability, polysiloxane resins and polyimide polysiloxane resins are preferred. In the embodiment, a silicone resin layer is exemplified as the resin layer 4.
樹脂層4之厚度並未特別限定,較佳設定為1~50μm,更佳設定為4~20μm。藉由將樹脂層4之厚度設為1μm以上,於氣泡或異物混入樹脂層4與基板2之間時,可藉由樹脂層4之變形而吸收氣泡或異物之厚度。另一方面,藉由將樹脂層4之厚度設為50μm以下,可縮短樹 脂層4之形成時間,進而無需過度使用樹脂層4之樹脂,故而於經濟方面良好。 The thickness of the resin layer 4 is not particularly limited, and is preferably set to 1 to 50 μm, and more preferably set to 4 to 20 μm. By setting the thickness of the resin layer 4 to 1 μm or more, when bubbles or foreign substances are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign substances can be absorbed by the deformation of the resin layer 4. On the other hand, by setting the thickness of the resin layer 4 to 50 μm or less, the tree can be shortened The formation time of the grease layer 4 does not require excessive use of the resin of the resin layer 4, so it is economically advantageous.
再者,樹脂層4之外形較佳為與補強板3之外形相同或小於補強板3之外形以使補強板3可支持樹脂層4之整體。又,樹脂層4之外形較佳為與基板2之外形相同或大於基板2之外形以使樹脂層4可將基板2之整體密接。
Furthermore, the outer shape of the resin layer 4 is preferably the same as or smaller than the outer shape of the reinforcing
又,於圖1中樹脂層4係由1層構成,但樹脂層4亦可由2層以上構成。於此情形時,構成樹脂層4之所有層之合計之厚度成為樹脂層之厚度。又,於此情形時,構成各層之樹脂之種類可不相同。 In FIG. 1, the resin layer 4 is composed of one layer, but the resin layer 4 may be composed of two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 becomes the thickness of the resin layer. Also, in this case, the types of resins constituting each layer may be different.
進而,於實施形態中,使用作為有機膜之樹脂層4作為吸附層,但亦可使用無機層代替樹脂層4。構成無機層之無機膜例如包含選自由金屬矽化物、氮化物、碳化物、及碳氮化物所組成之群中之至少1種。 Furthermore, in the embodiment, the resin layer 4 as an organic film is used as the adsorption layer, but an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer includes, for example, at least one selected from the group consisting of metal silicide, nitride, carbide, and carbonitride.
進而,又,圖1之積層體1具備樹脂層4作為吸附層,但亦可設為去掉樹脂層4而包含基板2與補強板3之構成。於此情形時,藉由作用於基板2與補強板3之間之凡得瓦耳力等而將基板2與補強板3可剝離地貼合。又,於此情形時,較佳為以作為玻璃基板之基板2與作為玻璃板之補強板3於高溫下不會接著之方式於補強板3之正面3a形成無機薄膜。
Furthermore, the laminate 1 of FIG. 1 includes a resin layer 4 as an adsorption layer, but the resin layer 4 may be removed and the substrate 2 and the reinforcing
[形成有功能層之實施形態之積層體6]
[
藉由經過功能層形成步驟而於積層體1之基板2之正面2a形成功能層。作為功能層之形成方法,使用CVD(Chemical Vapor Deposition,化學氣相沈積)法、PVD(Physical Vapor Deposition,物理氣相沈積)法等蒸鍍法、濺鍍法。功能層係藉由光微影法、蝕刻法而被形成為特定之圖案。
The functional layer is formed on the
圖2係表示於LCD之製造步驟之中途製作之矩形狀之積層體6之一
例之要部放大側視圖,且係設為本發明之對象之積層體之一例。
FIG. 2 shows one of the
積層體6係補強板(第1基板)3A、樹脂層4A、基板(第2基板)2A、功能層7、基板(第3基板)2B、樹脂層4B、及補強板(第4基板)3B依序積層而構成。即,圖2之積層體6相當於圖1所示之積層體1隔著功能層7呈對稱配置而成之積層體。以下,將包含基板2A、樹脂層4A、及補強板3A之積層體稱為第1積層體1A,將包含基板2B、樹脂層4B、及補強板3B之積層體稱為第2積層體1B。
The
於第1積層體1A之基板2A之正面2Aa形成有作為功能層7之薄膜電晶體(TFT),於第2積層體1B之基板2B之正面2Ba形成有作為功能層7之彩色濾光片(CF)。
A thin film transistor (TFT) as a
第1積層體1A與第2積層體1B係基板2A、2B之正面2Aa、2Ba相互重合而被一體化。藉此,製造隔著功能層7而第1積層體1A與第2積層體1B呈對稱配置之構造之積層體6。
The first
關於積層體6,於在分離步驟之剝離起始部步驟中藉由刀形成剝離起始部後,於分離步驟之剝離步驟中依序剝離補強板3A、3B,其後,貼合偏光板、背光裝置等而製造作為製品之LCD。
Regarding the
[剝離起始部製作裝置10] [Stripping start device 10]
圖3(A)~(E)係表示利用剝離起始部製作裝置(剝離起始部製作器件)10之第1剝離起始部製作方法之說明圖,圖3(A)係表示積層體6與刀N之位置關係之說明圖,圖3(B)係藉由刀N於界面24製作剝離起始部26之說明圖,圖3(C)係表示將要於界面28製作剝離起始部30之前之狀態之說明圖,圖3(D)自藉由刀N於界面28製作剝離起始部30之說明圖,圖3(E)係製作有剝離起始部26、30之積層體6之說明圖。又,圖4係製作有剝離起始部26、30之積層體6之俯視圖。
FIGS. 3(A) to (E) are explanatory diagrams showing a first peeling start part manufacturing method using a peeling start part manufacturing apparatus (stripping start part manufacturing device) 10, and FIG. 3(A) shows a
於製作剝離起始部26、30時,如圖3(A)所示般,積層體6之補強板3B之背面3Bb被吸附保持於工作台12而被水平地支持(圖中X軸方
向)。
When the peeling
刀N係以刀尖與積層體6之角部(第1角部)6A之端面對向之方式藉由支持器14而被水平地支持。又,刀N係藉由高度調整裝置16而調整高度方向(圖中Z軸方向)之位置。進而,刀N與積層體6係藉由滾珠螺桿裝置等運輸裝置18而於水平方向上相對移動。運輸裝置18只要使刀N與工作台12中之至少一者於水平方向上移動即可,於實施形態中係使刀N移動。進而,又,對插入前或插入中之刀N之上表面供給液體20之液體供給裝置22係配置於刀N之上方。
The knife N is horizontally supported by the
[第1剝離起始部製作方法] [The first method of making the peeling start]
於利用剝離起始部製作裝置10之第1剝離起始部製作方法中,將刀N之插入位置設定為積層體6之角部6A且於積層體6之厚度方向上重疊之位置,且以針對各界面24、28而不同之方式設定刀N之插入量。
In the first peeling start portion manufacturing method using the peeling start
對其製作順序進行說明。 The production sequence will be described.
於初始狀態下,刀N之刀尖存在於相對於作為第1插入位置之基板2B與樹脂層4B之界面24而沿高度方向(Z軸方向)偏移之位置。因此,首先,如圖3(A)所示,使刀N沿高度方向移動,並將刀N之刀尖之高度設定至界面24之高度。
In the initial state, the tip of the knife N exists at a position offset in the height direction (Z-axis direction) with respect to the
此後,如圖3(B)所示般,使刀N朝向積層體6之角部6A水平地移動,並將刀N插入界面24特定量。此時,由於積層體6未於厚度方向上被夾持,故而無於刀N之插入時損傷基板2B之顧慮。又,於刀N之插入時或插入前,自液體供給裝置22向刀N之上表面供給液體20。藉此,角部6A之基板2B自樹脂層4B剝離,因此於界面24製作如圖4般於俯視下為三角形狀之剝離起始部26。再者,液體20之供給並非為必須,但若使用液體20,則於拔出刀N後液體20亦殘留於剝離起始部26,因此可製作無法再附著之剝離起始部26。
Thereafter, as shown in FIG. 3(B), the knife N is horizontally moved toward the
繼而,自角部6A將刀N沿水平方向拔出,如圖3(C)所示般,將刀
N之刀尖設定至作為第2插入位置之基板2A與樹脂層4A之界面28之高度。
Then, the knife N is pulled out horizontally from the
此後,如圖3(D)所示般,使刀N朝向積層體6水平地移動,並將刀N插入界面28特定量。同樣地自液體供給裝置22向刀N之上表面供給液體20。藉此,如圖3(D)所示般,於界面28製作剝離起始部30。此處,刀N對界面28之插入量設為較刀N對界面24之插入量少量。以上為第1剝離起始部製作方法。再者,亦可將刀N對界面24之插入量設為較刀N對界面28之插入量少量。
Thereafter, as shown in FIG. 3(D), the knife N is moved horizontally toward the
將製作有剝離起始部26、30之積層體6自剝離起始部製作裝置10取出,並搬送至下述剝離裝置(剝離器件),藉由剝離裝置於界面24、28將補強板3B、3A依序剝離。
The
剝離方法之詳細內容於下文中進行敍述,如圖4之箭頭A所示般,藉由使積層體6自角部6A朝向與角部6A對向之角部6B撓曲,於剝離起始部26之面積較大之界面24,以剝離起始部26為起點而補強板3B最先被剝離。藉此,剝離補強板3B。其後,藉由使積層體6自角部6A朝向角部6B再次撓曲,於剝離起始部30之面積較小之界面28,以剝離起始部30為起點而補強板3A被剝離。藉此,剝離補強板3A。
The details of the peeling method will be described below. As shown by the arrow A in FIG. 4, by flexing the laminate 6 from the
即,第1剝離起始部製作方法係於剝離起始部製作步驟中,使用刀N於界面24、28依序製作剝離起始部26、30,此後,於剝離步驟中於界面24、28依序剝離補強板3B、3A。藉此,將積層體6自剝離起始部製作裝置10向剝離裝置搬送1次便可,因此即便為具備2個欲進行剝離之界面24、28之積層體6,亦可高效率地剝離補強板3A、3B。
That is, the first method for producing the peeling start portion is to produce the peeling
再者,圖4之箭頭A所示之積層體6之撓曲方向可為連結角部6A與角部6B之直線方向,亦可為相對於積層體6之一邊呈45度之方向。即,積層體6之撓曲方向只要自角部6A朝向角部6B設定即可。
In addition, the deflection direction of the
[第2剝離起始部製作方法] [Second method of making the peeling start part]
於利用剝離起始部製作裝置10之第2剝離起始部製作方法中,將刀N之插入位置設定為積層體6之角部6A與除角部6A以外之另一角部(此處係設為角部6B,但亦可為其他角部),於角部6A之基板2B與樹脂層4B之界面24製作剝離起始部,於角部6B之基板2A與樹脂層4A之界面28製作剝離起始部。
In the second peeling start portion manufacturing method using the peeling start
對其製作順序進行說明。 The production sequence will be described.
首先,如圖5(A)所示,將刀N之刀尖之高度設定至界面24之高度。
First, as shown in FIG. 5(A), the height of the tip of the knife N is set to the height of the
此後,如圖5(B)所示般,使刀N朝向角部6A水平地移動,將刀N插入位於角部6A之界面24特定量,並且自液體供給裝置22向刀N之上表面供給液體20。藉此,於角部6A之界面24製作剝離起始部32(參照圖5(E)、圖6)。
After that, as shown in FIG. 5(B), the knife N is horizontally moved toward the
繼而,自角部6A將刀N沿水平方向拔出,並如圖5(C)所示般使刀N之刀尖與積層體6之角部6B對向,並且設定至界面28之高度。
Then, the blade N is pulled out from the
此後,如圖5(D)所示般,使刀N朝向角部6B水平地移動,將刀N插入位於角部6B之界面28特定量,並且自液體供給裝置22向刀N之上表面供給液體20。藉此,如圖5(E)所示般,於角部6B之界面28製作剝離起始部34。以上為第2剝離起始部製作方法。再者,刀N對界面24、28之插入量可相同亦可不同。
Thereafter, as shown in FIG. 5(D), the knife N is horizontally moved toward the
將製作有剝離起始部32、34之積層體6自剝離起始部製作裝置10取出,並搬送至剝離裝置,藉由剝離裝置於界面24、28將補強板3B、3A依序剝離。剝離方法之詳細內容於下文中進行敍述,如圖6之箭頭A所示,藉由使積層體6自角部6A朝向角部6B撓曲,於界面24,以剝離起始部32為起點而補強板3B被剝離。藉此,剝離補強板3B。其後,如圖6之箭頭B所示,藉由使積層體6自角部6B朝向角部6A撓曲,於界面28,以剝離起始部34為起點而補強板3A被剝離。藉此,
剝離補強板3A。再者,亦可首先實施補強板3A之剝離。
The
如上所述,第2剝離起始部製作方法係於剝離起始部製作步驟中,使用刀N於界面24、28依序製作剝離起始部32、34,並於剝離步驟中於界面24、28依序剝離補強板3B、3A。藉此,將積層體6自剝離起始部製作裝置10向剝離裝置搬送1次便可,因此即便為具備2個欲進行剝離之界面24、28之積層體6,亦可高效率地剝離補強板3A、3B。
As described above, the second method for producing the peeling start portion is to produce the peeling
再者,刀N之插入量根據積層體6之尺寸,較佳設定為7mm以上,更佳設定為15~20mm左右。
In addition, the insertion amount of the knife N is preferably set to 7 mm or more, more preferably about 15 to 20 mm, according to the size of the
又,圖6之箭頭B所示之積層體6之撓曲方向可為連結角部6B與角部6A之直線方向,亦可為相對於積層體6之一邊呈45度之方向。即,積層體6之撓曲方向只要自角部6B朝向角部6A設定即可。
In addition, the deflection direction of the
[剝離裝置40] [Stripping device 40]
圖7係表示實施形態之剝離裝置40之構成之縱剖視圖,圖8係模式性表示剝離裝置40之複數個可動體44相對於可撓性板42之配置位置之可撓性板42之俯視圖。再者,圖7相當於沿圖8之C-C線之剖視圖,又,於圖8中以實線表示積層體6。
7 is a longitudinal cross-sectional view showing the configuration of the
如圖7所示,剝離裝置40具備隔著積層體6而沿上下配置之一對可動裝置46、46。由於可動裝置46、46為相同構成,故而此處對圖7之配置於下側之可動裝置46進行說明,並藉由對配置於上側之可動裝置46標註相同之符號而省略說明。
As shown in FIG. 7, the peeling
可動裝置46係由可撓性板42、複數個可動體44、針對各可動體44而使可動體44升降移動之複數個驅動裝置48、及針對各驅動裝置48而控制驅動裝置48之控制器50等構成。
The
由於可撓性板42係使補強板3B撓曲變形,故而真空吸附保持補強板3B。再者,亦可為靜電吸附或磁性吸附以代替真空吸附。
Since the
圖9(a)係可撓性板42之俯視圖,圖9(b)係沿圖9(a)之D-D線之可撓
性板42之縱剖視圖。
FIG. 9(a) is a top view of the
可撓性板42係由吸附保持積層體6之補強板3B之布狀之吸附片52、被覆有吸附片52之彈性片54、及支持彈性片54之本體板56構成。於彈性片54之正面具備貫通之框狀之槽58,於較該槽58靠內側被覆有吸附片52。又,於本體板56開設有複數個貫通孔60,該等貫通孔60之一端連通於槽58,另一端經由未圖示之抽吸管路連接於抽氣源(例如真空泵)。
The
因此,若驅動上述抽氣源,則上述抽吸管路、貫通孔60、及槽58之空氣被抽吸,藉此積層體6之補強板3B被真空吸附保持於吸附片52。於此情形時,吸附片52之外形設定為大於補強板3B之外形以使吸附片52可整體支持補強板3B。又,作為彈性片54之材料並未特別限定,較佳為橡膠。作為橡膠,較佳為聚矽氧橡膠。
Therefore, when the suction source is driven, the air in the suction pipe, the through-
本體板56與彈性片54為相同大小。又,本體板56較彈性片54彎曲剛度更高,本體板56之彎曲剛度支配可撓性板42之彎曲剛度。可撓性板42之每單位寬度(1mm)之彎曲剛度較佳為1000~40000N.mm2/mm。例如,於可撓性板42之寬度為100mm之部分,彎曲剛度成為100000~4000000N.mm2。藉由將可撓性板42之彎曲剛度設為1000N.mm2/mm以上,可防止吸附保持於可撓性板42之補強板3B之折彎。又,藉由將可撓性板42之彎曲剛度設為40000N.mm2/mm以下,可使吸附保持於可撓性板42之補強板3B適當地撓曲變形。
The
作為本體板56,例如除聚氯乙烯(PVC)樹脂、聚碳酸酯樹脂、丙烯酸系樹脂、聚縮醛(POM)樹脂等樹脂板以外,使用金屬板。
As the
如圖7所示之圓盤狀之複數個可動體44係如圖8所示般以柵格狀固定於本體板56之下表面。該等可動體44係藉由螺栓等緊固構件固定於本體板56,亦可進行接著固定以代替螺栓。該等可動體44係藉由利用控制器50控制驅動之驅動裝置48而獨立地升降移動。
A plurality of disk-shaped
即,控制器50控制驅動裝置48,並使圖8中之位於積層體6之角部6A側之可動體44至位於箭頭A所示之剝離進行方向之角部6B側之可動體44依序下降移動。藉由該動作,如圖10之縱剖視圖所示般以界面24之剝離起始部26(參照圖4)為起點將積層體6剝離。再者,圖7、圖10所示之積層體6係於圖3中說明之藉由第1剝離起始部製作方法製作剝離起始部26、30之積層體6。
That is, the
驅動裝置48例如係由旋轉式之伺服馬達及滾珠螺桿機構等構成。伺服馬達之旋轉運動於滾珠螺桿機構中被轉換為直線運動,並被傳遞至滾珠螺桿機構之桿62。於桿62之前端部經由球形接頭64設置有可動體44。藉此,如圖10所示般可使可動體44追隨可撓性板42之撓曲變形而傾動。因此,不對可撓性板42施加過多之力便可使可撓性板42自角部6A朝向角部6B撓曲變形。再者,作為驅動裝置48,並不限定於旋轉式之伺服馬達及滾珠螺桿機構,亦可為線性式之伺服馬達、或流體壓汽缸(例如空氣壓汽缸)。
The
複數個驅動裝置48較佳為隔著緩衝構件68安裝於可升降之框架66。緩衝構件68係以追隨可撓性板42之撓曲變形之方式彈性變形。藉此,桿62相對於框架66傾動。
The plurality of driving
於將剝離後之補強板3B自可撓性板42卸下時,框架66係藉由未圖示之驅動部而下降移動。
When the stripped reinforcing
控制器50構成為包含CPU(Central Processing Unit,中央處理單元)、ROM(Read Only Memory,唯讀記憶體)、及RAM(Random Access Memory,隨機存取記憶體)等記錄媒體等之電腦。控制器50藉由使CPU執行記錄於記錄媒體之程式,而針對各驅動裝置48控制複數個驅動裝置48,從而控制複數個可動體44之升降移動。
The
[利用剝離裝置40之補強板3A、3B之剝離方法]
[Peeling method of the reinforcing
[基於第1剝離起始部製作方法之剝離方法] [Peeling method based on the first peeling starting part production method]
於圖11(A)~(C)~圖12(A)~(C)中表示有於圖3中說明之藉由第1剝離起始部製作方法於角部6A製作有剝離起始部26、30之積層體6之剝離方法。即,於該圖中時間序列性地表示有將積層體6之補強板3A、3B剝離之剝離方法。又,向剝離裝置40之積層體6之搬入作業、及剝離後之補強板3A、3B及面板70之搬出作業係藉由圖11(A)所示之具備吸附墊72之搬送裝置74而進行。再者,於圖11、圖12中,為了避免圖式之繁雜,而省略可動裝置46之圖示。又,面板70係除補強板3A、3B以外之基板2A與基板2B隔著功能層7貼合而成之製品面板。
FIGS. 11(A) to (C) to FIGS. 12(A) to (C) show that the peeling
圖11(A)係根據搬送裝置74之箭頭E、F所示之動作將積層體6載置於下側之可撓性板42之剝離裝置40之側視圖。於此情形時,以搬送裝置74插入至下側之可撓性板42與上側之可撓性板42之間之方式使下側之可撓性板42與上側之可撓性板42預先移動至相對地充分退避後之位置。接下來,若將積層體6載置於下側之可撓性板42,則藉由下側之可撓性板42真空吸附保持積層體6之補強板3B。
FIG. 11(A) is a side view of the
圖11(B)係下側之可撓性板42與上側之可撓性板42向相對接近之方向移動,而積層體6之補強板3A藉由上側之可撓性板42而被真空吸附保持之狀態之剝離裝置40之側視圖。
11(B) shows that the lower
圖11(C)係表示一面使下側之可撓性板42自積層體6之角部6A朝向角部6B向下方撓曲變形,一面於積層體6之界面24以剝離起始部26(參照圖4)為起點將補強板3B剝離之狀態之側視圖。即,於圖10所示之下側之可撓性板42之複數個可動體44中,使位於積層體6之角部6A側之可動體44至位於角部6B側之可動體44依序下降移動,而於界面24將補強板3B剝離。
FIG. 11(C) shows that the lower
圖12(A)係於界面24補強板3B完全被剝離後之狀態之剝離裝置40之側視圖。根據該圖,經剝離後之補強板3B被真空吸附保持於下側之可撓性板42,除補強板3B以外之積層體6(包含補強板3A及面板70
之積層體)被真空吸附保持於上側之可撓性板42。
12(A) is a side view of the
又,以圖11(A)所示之搬送裝置74插入至上下之可撓性板42之間之方式使下側之可撓性板42與上側之可撓性板42移動至相對充分地退避後之位置。
Further, the lower
此後,首先,解除下側之可撓性板42之真空吸附。繼而,藉由搬送裝置74之吸附墊72吸附保持補強板3B。接下來,根據圖12(A)之箭頭G、H所示之搬送裝置74之動作將補強板3B自剝離裝置40搬出。
After that, first, the vacuum suction of the lower
圖12(B)係除補強板3B以外之積層體6藉由下側之可撓性板42與上側之可撓性板42而被真空吸附保持之側視圖。即,下側之可撓性板42與上側之可撓性板42向相對接近之方向移動,而基板2B被真空吸附保持於下側之可撓性板42。
FIG. 12(B) is a side view of the
圖12(C)係表示一面使上側之可撓性板42自積層體6之角部6A朝向角部6B向上方撓曲變形,一面於積層體6之界面28以剝離起始部30(參照圖4)為起點將補強板3A剝離之狀態之側視圖。即,於圖7所示之上側之可撓性板42之複數個可動體44中,使位於積層體6之角部6A側之可動體44至位於角部6B側之可動體44依序上升移動,而於界面28將補強板3A剝離。
FIG. 12(C) shows that the upper
此後,將自面板70完全剝離之補強板3A自上側之可撓性板42取出,並將面板70自下側之可撓性板42取出。以上為於角部6A製作有剝離起始部26、30之積層體6之剝離方法。
Thereafter, the reinforcing
因此,根據上述實施形態之剝離方法,利用剝離起始部製作裝置10於界面24、28製作剝離起始部26、30,並利用剝離裝置40於該界面24、28依序剝離補強板3B、3A。藉此,將積層體6自剝離起始部製作裝置10向剝離裝置40搬送1次便可,因此即便為具備2個欲進行剝離之界面24、28之積層體6,亦可高效率地剝離補強板3A、3B。
Therefore, according to the peeling method of the above-mentioned embodiment, the peeling
[基於第2剝離起始部製作方法之剝離方法] [Peeling method based on the second peeling starting part production method]
於圖13中表示有藉由於圖5中說明之第2剝離起始部製作方法於角部6A、6B製作有剝離起始部32、34(參照圖6)之積層體6之剝離方法之要部。
FIG. 13 shows the need for the peeling method of the
該剝離方法首先係以剝離起始部32為起點於界面24將補強板3B剝離,該步驟與圖11(A)~(C)~圖12(A)、(B)所示之步驟相同,因此省略說明。
This peeling method first peels the reinforcing
基於第2剝離起始部製作方法之剝離方法係自圖12(B)之狀態如圖13所示般一面使上側之可撓性板42自積層體6之角部6B朝向角部6A向上方撓曲變形,一面於積層體6之界面28以剝離起始部34(參照圖6)為起點將補強板3A剝離。
The peeling method based on the second peeling starting part manufacturing method is to bring the upper
此後,將自面板70完全剝離之補強板3A自上側之可撓性板42取出,並將面板70自下側之可撓性板42取出。以上為於角部6A製作有剝離起始部32、及於角部6B製作有剝離起始部34之積層體6之剝離方法。
Thereafter, the reinforcing
因此,根據上述實施形態之剝離方法,利用剝離起始部製作裝置10於界面24、28製作剝離起始部32、34,並利用剝離裝置40於該界面24、28依序剝離補強板3B、3A。藉此,將積層體6自剝離起始部製作裝置10向剝離裝置40搬送1次便可,因此即便為具備2個欲進行剝離之界面24、28之積層體6,亦可高效率地剝離補強板3A、3B。
Therefore, according to the peeling method of the above-mentioned embodiment, the peeling
又,較佳為藉由統一控制剝離起始部製作裝置10及剝離裝置40之圖7之控制裝置(控制器件)76控制剝離起始部製作裝置10之界面24、28之剝離起始部製作動作及剝離裝置40之界面24、28之剝離動作。
Furthermore, it is preferable to control the production of the peeling start portion of the
再者,於實施形態中,例示了具備2個界面24、28之積層體6,但本發明設為對象之積層體並不限定於積層體6,只要為由3片以上之基板可剝離地貼合而成之積層體即可。
Furthermore, in the embodiment, the
參照特定之實施態樣對本發明詳細地進行了說明,但業者應明瞭可於不脫離本發明之精神與範圍之情況下添加各種變更或修正。 The present invention has been described in detail with reference to specific embodiments, but the practitioner should understand that various changes or modifications can be added without departing from the spirit and scope of the present invention.
本申請案係基於在2014年4月30日提出申請之日本專利申請2014-093440者,其內容係作為參照而被引用至本文中。 This application is based on the Japanese patent application 2014-093440 filed on April 30, 2014, and the contents thereof are incorporated herein by reference.
6‧‧‧積層體 6‧‧‧Layered body
6A‧‧‧角部 6A‧‧‧Corner
6B‧‧‧角部 6B‧‧‧Corner
26‧‧‧剝離起始部 26‧‧‧Stripping start
30‧‧‧剝離起始部 30‧‧‧Stripping start
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