TWI692407B - Lamination body peeling device and method, and electronic device manufacturing method - Google Patents

Abstract

The present invention relates to a device for peeling a laminate, which is characterized by comprising: a device for producing a peeling start portion, which is a peelable laminate of three or more substrates, and a device from the end of the laminate The knife is inserted into a specific amount of more than two interfaces in the interface between the adjacent substrate and the substrate to produce two or more peeling start portions; the peeling device deflects at least one of the three or more substrates, And take the peeling start portion of the above two or more interfaces as the starting point for peeling in sequence; and control the device, which controls the peeling start portion manufacturing device to insert the knife in order at the two or more interfaces to make the above After two or more peeling start portions, the peeling device is controlled to peel in sequence starting from the peeling starting portions of the two or more interfaces.

Description

Lamination body peeling device and method, and electronic device manufacturing method

The invention relates to a peeling device and peeling method of a laminate, and a manufacturing method of an electronic device.

As electronic devices such as display panels, solar cells, and thin film secondary batteries become thinner and lighter, it is expected that substrates such as glass plates, resin plates, and metal plates used in these electronic devices will become thinner.

However, if the thickness of the substrate becomes too thin, the operability of the substrate deteriorates, so it is difficult to form a functional layer (thin film transistor (TFT: Thin Film Transistor), color filter (TFT) for electronic devices on the front surface of the substrate CF: Color Filter)).

Therefore, a method of bonding a reinforcing plate (substrate) to the back of the substrate to form a laminate that reinforces the substrate with the reinforcing plate, and forming a functional layer on the front of the substrate in the state of the laminate (refer to the patent Literature 1). In this method, since the operability of the substrate is improved, the functional layer can be formed well on the front surface of the substrate. Furthermore, after forming the functional layer, the reinforcing plate is peeled off from the substrate.

As an example, the peeling method of the reinforcing plate is carried out by moving one of the two corners on the diagonal of the rectangular laminate toward the other, and making the reinforcing plate or substrate, or both Those deflect and deform in directions separated from each other. At this time, in order to carry out the peeling smoothly, a peeling start portion was formed at one corner of the laminate. The peeling start part is produced by inserting a knife (peeling knife) from the end face of the laminate into the interface between the substrate and the reinforcing plate by a specific amount, and forming a peeling start part at a specific area of a corner.

In addition, Patent Document 2 also discloses a peeling device for a laminate. In this peeling device, a blade (wedge) is also inserted into the interface between the substrate and the substrate from the end surface of the laminate to form a peeling start portion.

Therefore, the peeling device of Patent Document 1 inserts the knife into the above interface in a state where the front and back surfaces of the laminate are fixed by an adsorption pad, etc., that is, in a state where the laminate is sandwiched in the thickness direction, so the knife will automatically An unnecessary force is applied to the substrate, and there is a concern that the substrate may be damaged.

In addition, the peeling device of Patent Document 2 clamps the laminate in the thickness direction with the suction pad in the state where the knife is inserted into the interface, so when the laminate is clamped with the suction pad, the portion where the knife is inserted is subjected to squeezing force. There is a risk of substrate damage.

In view of this situation, in recent years, the preparation step of the peeling start portion by the knife and the peeling step by the peeling device have been implemented separately to prevent the defects of Patent Documents 1 and 2.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2011/024689

[Patent Document 2] Japanese Patent Laid-Open No. 10-244545

In the case where the interface to be peeled is only one-sided laminate, after the peeling start portion is made at the interface using the knife of the peeling start portion manufacturing device, the laminate is transferred from the peeling start portion manufacturing device to It is only necessary to peel off the substrate by using the peeling device, and the series of operations do not require much effort.

However, in the case of a laminate including three or more substrates with more than two interfaces to be peeled off, the laminate with the number of faces in the interface must be transported back and forth between the peeling start preparation device and the peeling device , There is a problem that the substrate cannot be stripped efficiently question.

The present invention has been completed in view of such a problem, and its object is to provide a peeling which can efficiently peel off a laminate of a substrate in a laminate including three or more substrates having two or more interfaces to be peeled off Device and peeling method, and manufacturing method of electronic device.

In order to achieve the above object, the device for peeling a laminate of the present invention is characterized by comprising: a device for producing a peeling start portion, which is for a laminate formed by peelably bonding three or more substrates from the end of the laminate Insert a knife into two or more of the interface of the adjacent substrate and the interface of the substrate to produce a peeling start portion of 2 or more; a peeling device that deflects at least one of the above 3 or more substrates Deformed, and sequentially peeled off with the peeling start portion of the above two or more interfaces as the starting point; and a control device, which controls the peeling start portion manufacturing device to sequentially insert the knife at the two or more interfaces and After the two or more peeling start portions are produced, the peeling device is controlled to be peeled in sequence starting from the peeling starting portions of the two or more interfaces.

In order to achieve the above object, the peeling method of the laminate of the present invention is characterized by comprising: a peeling start part manufacturing step, which is directed to a laminate obtained by peelably bonding three or more substrates from the above laminate Inserting a knife into two or more interfaces of the adjacent substrate and the interface of the substrate at a specific amount to produce two or more peeling start portions; and a peeling step, which makes at least three of the above three or more substrates A piece of substrate is flexed and deformed, and peeled in sequence starting from the peeling start portion of the two or more interfaces.

In order to achieve the above object, the method for manufacturing an electronic device of the present invention includes: a functional layer forming step, which is at least one of the above-mentioned substrates contained in a laminate formed by peelably bonding three or more substrates A functional layer is formed on the front surface of the substrate; and a separation step is to separate the substrate on which the functional layer is formed from another substrate; the manufacturing method of the electronic device is characterized in that the separation step includes: a peeling start portion manufacturing step, which system From the end of the layered body, insert a knife into the interface between the adjacent substrate and the substrate of the layered body to produce a specific amount of more than two interfaces to produce two or more peeling start portions; and a peeling step At least one of the three or more substrates is flexed and deformed, and is peeled in sequence starting from the peeling start portion of the two or more interfaces.

According to the present invention, in the device or step of producing the peeling start portion, the peeling starting portion is made using a knife at two or more interfaces, and the substrate is sequentially peeled in the peeling step. In this way, it is only necessary to transport the laminate from the starting device of peeling to the peeling device once. Therefore, even a laminate including three or more substrates having two or more interfaces to be peeled off can be highly efficient Peel the substrate.

In one aspect of the present invention, it is preferable that the insertion position of the knife in the device or step of making the peeling start portion is set to a position where the first corner of the laminate body overlaps in the thickness direction of the laminate body , And the insertion amount of the knife is set differently for each interface, and the deflection direction of the substrate due to the peeling device or step is from the first corner to the first corner Set to the opposite corner.

The deflection direction of the substrate mentioned in the present invention may be a linear direction connecting the first corner and the corner opposite to the first corner, or may be 45 degrees relative to one side of the laminate direction. That is, the deflection direction of the substrate may be set from the first corner to the corner opposite to the first corner.

According to one aspect of the present invention described above, if the substrate is flexed from the first corner to the corner opposite to the first corner by peeling off the device or step, the amount of insertion of the knife in more than two interfaces The largest interface, the substrate is peeled first. Then, if the substrate is flexed in this direction, the interface substrate with the second largest insertion amount of the blade is peeled off. According to one aspect of the present invention described above, by making the insertion amount of the knife different for each interface, the order of the interfaces to be peeled off can be controlled.

In another aspect of the present invention, it is preferable that the insertion position of the knife in the device or step of making the peeling start portion is set at least to the first corner of the laminate and the first The other corner than the corner, and the deflection direction of the substrate due to the peeling device or step is set from the first corner to the corner opposite to the first corner, and is set from the above The other corner is set toward the corner facing the other corner.

According to another aspect of the present invention described above, if the substrate is flexed from the first corner to the corner opposite to the first corner by peeling off the device or step, the peeling of the first corner starts The substrate is peeled off as the starting point. In addition, if the substrate is flexed from the other corner to the corner opposite to the other corner by the peeling device or step, the substrate is peeled starting from the peeling start portion provided in the other corner. According to another aspect of the present invention described above, by deflecting the substrate, the order of the interfaces to be peeled off can be controlled.

In the present invention, the laminate is preferably a laminate in which at least a first substrate, a second substrate, a third substrate, and a fourth substrate are peelably bonded in sequence, and the device or step for producing the peeling start portion The insertion position of the knife is preferably set to the interface between the first substrate and the second substrate, and the interface between the third substrate and the fourth substrate.

The present invention targets, for example, a laminate including the first to fourth substrates. In the device or step of manufacturing the peeling start portion, the peeling start portion is formed at the interface between the first substrate and the second substrate, and the interface between the third substrate and the fourth substrate, respectively. In the device or step of peeling, the substrates are sequentially peeled off at the two interfaces, and the product substrate to which the second substrate and the third substrate are bonded is taken out. When the product substrate is an electronic device, in the functional layer forming step, the functional layer is formed on the opposing surface of each of the second substrate and the third substrate.

According to the peeling device and peeling method of the laminate of the present invention, and the manufacturing method of the electronic device, in a laminate including three or more substrates having two or more interfaces to be peeled off, the substrate can be efficiently peeled off.

1‧‧‧Layered body

1A‧‧‧Layer 1

1B‧‧‧Layer 2

2‧‧‧ substrate

2a‧‧‧Front of substrate

2b‧‧‧Back of the substrate

2A‧‧‧Substrate

2Aa‧‧‧Front of the substrate

2B‧‧‧Substrate

2Ba‧‧‧Front of the substrate

3‧‧‧Reinforcement board

3a‧‧‧Front of reinforcement board

3A‧‧‧Reinforcement board

3B‧‧‧Reinforcement board

3Bb‧‧‧The back of the reinforcement board

4‧‧‧Resin layer

4A‧‧‧Resin layer

4B‧‧‧Resin layer

6‧‧‧Layered body

6A, 6B ‧‧‧ corner

7‧‧‧Functional layer

10‧‧‧Stripping device

12‧‧‧Workbench

14‧‧‧Support

16‧‧‧ Height adjustment device

18‧‧‧Transportation device

20‧‧‧Liquid

22‧‧‧Liquid supply device

24‧‧‧Interface

26‧‧‧Stripping start

28‧‧‧Interface

30‧‧‧Stripping start

32、34‧‧‧Stripping start

40‧‧‧Stripping device

42‧‧‧Flexible board

44‧‧‧Moveable body

46‧‧‧movable device

48‧‧‧Drive device

50‧‧‧Controller

52‧‧‧Adsorption tablets

54‧‧‧Elastic sheet

56‧‧‧Body board

58‧‧‧slot

60‧‧‧Through hole

62‧‧‧

64‧‧‧ball joint

66‧‧‧Frame

68‧‧‧buffer member

70‧‧‧Panel

72‧‧‧Adsorption pad

74‧‧‧Conveying device

76‧‧‧Control device

A~H‧‧‧arrow

N‧‧‧ knife

FIG. 1 is an enlarged side view of a main part showing an example of a laminate to be used in a manufacturing step of an electronic device.

FIG. 2 is an enlarged side view of a main part showing an example of a layered body produced in the middle of a manufacturing process of an LCD (Liquid Crystal Display).

FIGS. 3(A) to (E) are explanatory diagrams showing a first peeling start portion manufacturing method using a peeling start portion manufacturing apparatus.

FIG. 4 is a plan view of the laminate with the peeling start portion produced by the first peeling start portion production method.

5(A) to (E) are explanatory diagrams showing a second peeling start part manufacturing method using a peeling start part manufacturing device.

FIG. 6 is a plan view of the laminate with the peeling start portion produced by the second peeling start portion production method.

7 is a longitudinal cross-sectional view showing the structure of the peeling device of the embodiment.

8 is a plan view schematically showing the flexible plate relative to the arrangement positions of the plural movable bodies of the flexible plate.

9(a) and (b) are a plan view and a cross-sectional view showing the configuration of a flexible board.

10 is a longitudinal cross-sectional view of a peeling device that peels a substrate at the interface of a laminate.

11(A) to (C) are time-series explanatory diagrams showing a peeling method for peeling off the reinforcing plate of the laminate with the peeling start portion produced by the first peeling start portion manufacturing method.

12(A) to (C) are explanatory diagrams showing the peeling method for peeling off the reinforcing plate of the laminate in time series following FIG. 11.

FIG. 13 is an explanatory diagram of a peeling method for peeling off the reinforcing plate of the laminate with the peeling start portion produced by the second peeling start portion manufacturing method.

Hereinafter, an embodiment of the present invention will be described based on the accompanying drawings.

Hereinafter, a case where the peeling device and peeling method of the laminate of the present invention are used in the manufacturing process of an electronic device will be described.

Electronic devices refer to electronic components such as display panels, solar cells, thin-film secondary batteries, etc. Pieces. As the display panel, a liquid crystal display (LCD: Liquid Crystal Display) panel, a plasma display panel (PDP: Plasma Display Panel), and an organic EL display (OELD: Organic Electro Luminescence Display) panel can be exemplified.

[Manufacturing steps of electronic device]

The electronic device is manufactured by forming a functional layer (for a LCD, a thin-film transistor (TFT) or a color filter (CF)) for an electronic device on the front surface of a substrate made of glass, resin, or metal.

Before the above-mentioned substrate is formed with a functional layer, its back surface is bonded to a reinforcing plate (substrate) to constitute a laminate. Thereafter, a functional layer is formed on the front surface of the substrate in the state of the laminate. Next, after forming the functional layer, the reinforcing plate is peeled from the substrate.

That is, the manufacturing step of the electronic device includes: a functional layer forming step, which forms the functional layer on the front surface of the substrate in the state of the laminate; and a separation step, which separates the reinforcing plate from the substrate on which the functional layer is formed. In the separation step, the peeling device and peeling method of the laminate of the present invention are applied.

[Laminate 1]

FIG. 1 is an enlarged side view showing the main part of an example of the laminate 1.

The laminate 1 includes: a substrate 2 which is to form a functional layer; and a reinforcing plate 3 which reinforces the substrate 2. In addition, the reinforcing plate 3 includes a resin layer 4 as an adsorption layer on the front surface 3 a, and the back surface 2 b of the substrate 2 is bonded to the resin layer 4. That is, the substrate 2 is peelably bonded to the reinforcing plate 3 via the resin layer 4 by the Van der Waals force acting between the resin layer 4 and the adhesive force of the resin layer 4.

In addition, the laminate 1 of FIG. 1 is a laminate in which two substrates (substrate 2 and reinforcing plate 3) are peelably bonded. Therefore, although it is not intended to be the object of the present invention, a laminate formed by peelably bonding three or more substrates is shown as a reference diagram for explaining the basic structure of the laminate.

[Substrate 2]

The substrate 2 is to form a functional layer on its front surface 2a. Examples of the substrate 2 include glass substrates, ceramic substrates, resin substrates, metal substrates, and semiconductor substrates. Among these substrates, glass substrates are excellent in chemical resistance and moisture permeability resistance, and have a low coefficient of linear expansion, so they are preferably used as substrates 2 for electronic devices. In addition, as the coefficient of linear expansion decreases, the pattern of the functional layer formed at high temperature is less likely to shift when cooled.

As the glass of the glass substrate, there can be exemplified alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and oxide-based glass having other silica as a main component. The oxide-based glass is preferably a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide conversion.

The glass of the glass substrate is preferably selected and a glass suitable for the type of electronic device to be manufactured and a glass suitable for its manufacturing process are used. For example, for the glass substrate for a liquid crystal panel, it is preferable to use glass (alkali-free glass) that does not substantially contain an alkali metal component.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when a glass substrate is used for the substrate 2, in order to achieve weight reduction and thinning of the electronic device, the thickness is preferably set to 0.7 mm or less, more preferably 0.3 mm or less, and further preferably 0.1 mm or less . When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Furthermore, when the thickness is 0.1 mm or less, the glass substrate may be rolled into a roll shape. However, from the viewpoint of manufacturing the glass substrate and the viewpoint of handling the glass substrate, the thickness is preferably 0.03 mm or more.

In addition, in FIG. 1, the substrate 2 is composed of one substrate, but the substrate 2 may be composed of plural substrates. That is, the substrate 2 may be composed of a laminate in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the substrate 2 becomes the thickness of the substrate 2.

[Reinforcement board 3]

Examples of the reinforcing plate 3 include glass substrates, ceramic substrates, resin substrates, metal substrates, and semiconductor substrates.

The type of reinforcement board 3 is based on the type of electronic device to be manufactured The type of substrate 2 used is selected. If the reinforcing plate 3 and the substrate 2 are made of the same material, warpage and peeling caused by temperature changes can be reduced.

The difference (absolute value) of the average linear expansion coefficient of the reinforcing plate 3 and the substrate 2 is appropriately set according to the dimensions and the like of the substrate 2, and is preferably 35×10 ^-7 /°C or less. Here, the "average linear expansion coefficient" refers to the average linear expansion coefficient within the temperature range of 50 to 300°C (JIS R3102: 1995).

The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is appropriately set according to the type of the reinforcing plate 3, the type and thickness of the substrate 2 to be reinforced, and the like. In addition, the thickness of the reinforcing plate 3 may be thicker than the substrate 2 or thinner than the substrate 2, but in order to reinforce the substrate 2, it is preferably 0.4 mm or more.

In addition, in this example, the reinforcing plate 3 is composed of one substrate, but the reinforcing plate 3 may be composed of a laminate in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the reinforcing plate 3 becomes the thickness of the reinforcing plate 3.

[Resin layer 4]

In order to prevent peeling between the resin layer 4 and the reinforcing plate 3, the bonding force between the resin layer 4 and the reinforcing plate 3 is set to be higher than the bonding force with the substrate 2. Thereby, in the peeling step, the substrate 2 is peeled off at the interface between the resin layer 4 and the substrate 2.

The resin constituting the resin layer 4 is not particularly limited, and examples thereof include acrylic resins, polyolefin resins, polyurethane resins, polyimide resins, polysiloxane resins, and polyimide polysiloxane resins. Several kinds of resins can also be mixed and used. Among them, from the viewpoint of heat resistance or peelability, polysiloxane resins and polyimide polysiloxane resins are preferred. In the embodiment, a silicone resin layer is exemplified as the resin layer 4.

The thickness of the resin layer 4 is not particularly limited, and is preferably set to 1 to 50 μm, and more preferably set to 4 to 20 μm. By setting the thickness of the resin layer 4 to 1 μm or more, when bubbles or foreign substances are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign substances can be absorbed by the deformation of the resin layer 4. On the other hand, by setting the thickness of the resin layer 4 to 50 μm or less, the tree can be shortened The formation time of the grease layer 4 does not require excessive use of the resin of the resin layer 4, so it is economically advantageous.

Furthermore, the outer shape of the resin layer 4 is preferably the same as or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entire resin layer 4. In addition, the outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2 so that the resin layer 4 can closely contact the entire substrate 2.

In FIG. 1, the resin layer 4 is composed of one layer, but the resin layer 4 may be composed of two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 becomes the thickness of the resin layer. Also, in this case, the types of resins constituting each layer may be different.

Furthermore, in the embodiment, the resin layer 4 as an organic film is used as the adsorption layer, but an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer includes, for example, at least one selected from the group consisting of metal silicide, nitride, carbide, and carbonitride.

Furthermore, the laminate 1 of FIG. 1 includes a resin layer 4 as an adsorption layer, but the resin layer 4 may be removed and the substrate 2 and the reinforcing plate 3 may be included. In this case, the substrate 2 and the reinforcing plate 3 are peelably attached by a van der Waals force acting between the substrate 2 and the reinforcing plate 3. In this case, it is preferable to form an inorganic thin film on the front surface 3a of the reinforcing plate 3 in such a manner that the substrate 2 as a glass substrate and the reinforcing plate 3 as a glass plate do not adhere at a high temperature.

[Layered body 6 of the embodiment in which the functional layer is formed]

The functional layer is formed on the front surface 2a of the substrate 2 of the laminate 1 by going through the functional layer forming step. As a method of forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method, or a sputtering method is used. The functional layer is formed into a specific pattern by photolithography and etching.

FIG. 2 shows one of the rectangular laminates 6 produced in the middle of the LCD manufacturing process The main part of the example is an enlarged side view, and it is an example of a layered body that is an object of the present invention.

The laminate 6 is a reinforcing plate (first substrate) 3A, a resin layer 4A, a substrate (second substrate) 2A, a functional layer 7, a substrate (third substrate) 2B, a resin layer 4B, and a reinforcing plate (fourth substrate) 3B It is formed by layering in sequence. That is, the laminate 6 of FIG. 2 corresponds to the laminate in which the laminate 1 shown in FIG. 1 is arranged symmetrically via the functional layer 7. Hereinafter, the laminate including the substrate 2A, the resin layer 4A, and the reinforcement plate 3A is referred to as a first laminate 1A, and the laminate including the substrate 2B, the resin layer 4B, and the reinforcement plate 3B is referred to as a second laminate 1B.

A thin film transistor (TFT) as a functional layer 7 is formed on the front surface 2Aa of the substrate 2A of the first layered body 1A, and a color filter as a functional layer 7 is formed on the front surface 2Ba of the substrate 2B of the second layered body 1B CF).

The first laminated body 1A and the second laminated body 1B-based substrates 2A, 2B have front surfaces 2Aa, 2Ba overlapping each other to be integrated. With this, the laminated body 6 having the structure in which the first laminated body 1A and the second laminated body 1B are arranged symmetrically via the functional layer 7 is manufactured.

Regarding the laminate 6, after the peeling start portion is formed by a knife in the peeling start portion step of the separating step, the reinforcing plates 3A and 3B are peeled in order in the peeling step of the separating step, and then, the polarizing plate is bonded, Backlights, etc. are used to manufacture LCDs as products.

[Stripping start device 10]

FIGS. 3(A) to (E) are explanatory diagrams showing a first peeling start part manufacturing method using a peeling start part manufacturing apparatus (stripping start part manufacturing device) 10, and FIG. 3(A) shows a laminate 6 FIG. 3(B) is an explanatory diagram of making the peeling start part 26 on the interface 24 by the knife N. FIG. 3(C) shows that the peeling start part 30 will be made on the interface 28 FIG. 3(D) is an explanatory diagram of the peeling start portion 30 produced at the interface 28 by the knife N. FIG. 3(E) is a layered body 6 with peeling start portions 26 and 30. Illustrating. In addition, FIG. 4 is a plan view of the laminate 6 with the peeling start portions 26 and 30 produced.

When the peeling start portions 26 and 30 are produced, as shown in FIG. 3(A), the back surface 3Bb of the reinforcing plate 3B of the laminate 6 is adsorbed and held on the table 12 and supported horizontally (X-axis direction in the figure) to).

The knife N is horizontally supported by the holder 14 in such a manner that the tip of the knife and the end of the corner (first corner) 6A of the laminate 6 face each other. In addition, the knife N adjusts the position of the height direction (Z-axis direction in the figure) by the height adjusting device 16. Furthermore, the knife N and the laminate 6 are relatively moved in the horizontal direction by a transport device 18 such as a ball screw device. The transport device 18 only needs to move at least one of the knife N and the table 12 in the horizontal direction, and in the embodiment, moves the knife N. Furthermore, the liquid supply device 22 that supplies the liquid 20 to the upper surface of the blade N before or during insertion is disposed above the blade N.

[The first method of making the peeling start]

In the first peeling start portion manufacturing method using the peeling start portion manufacturing apparatus 10, the insertion position of the knife N is set to a position where the corner portion 6A of the laminate 6 overlaps in the thickness direction of the laminate 6 and The insertion amount of the knife N is set differently for each interface 24, 28.

The production sequence will be described.

In the initial state, the tip of the knife N exists at a position offset in the height direction (Z-axis direction) with respect to the interface 24 between the substrate 2B and the resin layer 4B as the first insertion position. Therefore, first, as shown in FIG. 3(A), the knife N is moved in the height direction, and the height of the tip of the knife N is set to the height of the interface 24.

Thereafter, as shown in FIG. 3(B), the knife N is horizontally moved toward the corner portion 6A of the laminate 6 and the knife N is inserted into the interface 24 by a certain amount. At this time, since the laminated body 6 is not sandwiched in the thickness direction, there is no fear of damaging the substrate 2B when the knife N is inserted. In addition, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N during or before the insertion of the knife N. As a result, the substrate 2B of the corner portion 6A is peeled off from the resin layer 4B, so that the peeling start portion 26 having a triangular shape in plan view as shown in FIG. 4 is produced at the interface 24. Furthermore, the supply of the liquid 20 is not necessary, but if the liquid 20 is used, the liquid 20 also remains in the peeling start portion 26 after the knife N is pulled out, so that the peeling start portion 26 that can no longer be attached can be produced.

Then, the knife N is pulled out horizontally from the corner 6A, as shown in FIG. 3(C), the knife The blade tip of N is set to the height of the interface 28 between the substrate 2A and the resin layer 4A as the second insertion position.

Thereafter, as shown in FIG. 3(D), the knife N is moved horizontally toward the laminate 6 and the knife N is inserted into the interface 28 by a certain amount. Similarly, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N. As a result, as shown in FIG. 3(D), the peeling start portion 30 is formed on the interface 28. Here, the insertion amount of the knife N to the interface 28 is set to be smaller than the insertion amount of the knife N to the interface 24. The above is the first method for manufacturing the peeling start portion. Furthermore, the insertion amount of the knife N to the interface 24 may be set to be smaller than the insertion amount of the knife N to the interface 28.

The laminate 6 having the peeling start portions 26 and 30 is taken out from the peeling start portion manufacturing apparatus 10 and transported to the following peeling device (peeling device), and the reinforcing plate 3B, 3A peeled in order.

The details of the peeling method will be described below. As shown by the arrow A in FIG. 4, by flexing the laminate 6 from the corner 6A toward the corner 6B opposite to the corner 6A, at the beginning of peeling The interface 24 with a larger area 26 starts from the peeling start portion 26 and the reinforcing plate 3B is peeled first. By this, the reinforcing plate 3B is peeled off. Thereafter, the laminate 6 is flexed again from the corner portion 6A toward the corner portion 6B, and at the interface 28 where the area of the peeling start portion 30 is small, the reinforcing plate 3A is peeled off using the peeling start portion 30 as a starting point. With this, the reinforcing plate 3A is peeled off.

That is, the first method for producing the peeling start portion is to produce the peeling start portions 26, 30 in order at the interfaces 24, 28 using the knife N in the peeling start portion manufacturing step, and thereafter, at the interfaces 24, 28 in the peeling step Strip the reinforcing plates 3B and 3A in sequence. In this way, the laminated body 6 can be transported from the peeling start part preparation device 10 to the peeling device once. Therefore, even for the laminate 6 having two interfaces 24 and 28 to be peeled off, it can be efficiently peeled and reinforced. Plates 3A, 3B.

In addition, the deflection direction of the laminate 6 shown by arrow A in FIG. 4 may be a straight direction connecting the corner 6A and the corner 6B, or may be a direction at 45 degrees with respect to one side of the laminate 6. That is, the deflection direction of the laminate 6 may be set from the corner 6A toward the corner 6B.

[Second method of making the peeling start part]

In the second peeling start portion manufacturing method using the peeling start portion manufacturing apparatus 10, the insertion position of the knife N is set to the corner portion 6A of the laminate 6 and the other corner portion other than the corner portion 6A (here it is set It is a corner 6B, but it can be other corners), a peeling start is made at the interface 24 of the substrate 2B and the resin layer 4B of the corner 6A, and a peeling is made at the interface 28 of the substrate 2A and the resin layer 4A of the corner 6B The beginning.

The production sequence will be described.

First, as shown in FIG. 5(A), the height of the tip of the knife N is set to the height of the interface 24.

After that, as shown in FIG. 5(B), the knife N is horizontally moved toward the corner 6A, the knife N is inserted into the interface 24 at the corner 6A by a certain amount, and the upper surface of the knife N is supplied from the liquid supply device 22 Liquid 20. With this, the peeling start portion 32 is formed at the interface 24 of the corner portion 6A (see FIGS. 5(E) and 6).

Then, the blade N is pulled out from the corner 6A in the horizontal direction, and as shown in FIG. 5(C), the blade tip of the blade N is opposed to the corner 6B of the laminate 6 and set to the height of the interface 28.

Thereafter, as shown in FIG. 5(D), the knife N is horizontally moved toward the corner 6B, the knife N is inserted into the interface 28 at the corner 6B by a certain amount, and the upper surface of the knife N is supplied from the liquid supply device 22 Liquid 20. Thereby, as shown in FIG. 5(E), the peeling start portion 34 is formed at the interface 28 of the corner portion 6B. The above is the method of manufacturing the second peeling start portion. Furthermore, the insertion amount of the knife N to the interfaces 24 and 28 may be the same or different.

The laminate 6 having the peeling start portions 32 and 34 is taken out from the peeling start portion manufacturing device 10 and transported to the peeling device, and the reinforcing plates 3B and 3A are peeled in sequence at the interfaces 24 and 28 by the peeling device. The details of the peeling method are described below. As shown by arrow A in FIG. 6, by flexing the laminate 6 from the corner 6A toward the corner 6B, at the interface 24, the peeling start portion 32 is used as a starting point. The reinforcing plate 3B is peeled off. By this, the reinforcing plate 3B is peeled off. Thereafter, as shown by arrow B in FIG. 6, by flexing the laminate 6 from the corner portion 6B toward the corner portion 6A, the reinforcing plate 3A is peeled off at the interface 28 with the peeling start portion 34 as a starting point. With this, Strip the reinforcing plate 3A. Furthermore, peeling of the reinforcing plate 3A may be performed first.

As described above, the second method for producing the peeling start portion is to produce the peeling start portions 32 and 34 in order at the interfaces 24 and 28 using the knife N in the peeling start portion manufacturing step, and to the interface 24 and the peeling step during the peeling step. 28 Strip the reinforcing plates 3B and 3A in sequence. In this way, the laminated body 6 can be transported from the peeling start part preparation device 10 to the peeling device once. Therefore, even for the laminate 6 having two interfaces 24 and 28 to be peeled off, it can be efficiently peeled and reinforced. Plates 3A, 3B.

In addition, the insertion amount of the knife N is preferably set to 7 mm or more, more preferably about 15 to 20 mm, according to the size of the laminate 6.

In addition, the deflection direction of the laminate 6 shown by arrow B in FIG. 6 may be a straight direction connecting the corner 6B and the corner 6A, or may be a direction at 45 degrees relative to one side of the laminate 6. That is, the deflection direction of the laminate 6 may be set from the corner 6B toward the corner 6A.

[Stripping device 40]

7 is a longitudinal cross-sectional view showing the configuration of the peeling device 40 of the embodiment, and FIG. 8 is a plan view of the flexible plate 42 schematically showing the arrangement positions of the plural movable bodies 44 of the peeling device 40 with respect to the flexible plate 42. In addition, FIG. 7 corresponds to a cross-sectional view taken along line C-C of FIG. 8, and in FIG. 8, the laminate 6 is indicated by a solid line.

As shown in FIG. 7, the peeling device 40 includes a pair of movable devices 46 and 46 arranged vertically along the layered body 6. Since the movable devices 46 and 46 have the same structure, the movable device 46 arranged on the lower side in FIG. 7 will be described here, and the description will be omitted by denoting the same symbol on the movable device 46 arranged on the upper side.

The movable device 46 is composed of a flexible plate 42, a plurality of movable bodies 44, a plurality of driving devices 48 that move the movable body 44 up and down for each movable body 44, and a controller that controls the driving device 48 for each driving device 48 50 and so on.

Since the flexible plate 42 deflects and deforms the reinforcing plate 3B, the reinforcing plate 3B is vacuum-held. Furthermore, it can also be electrostatic adsorption or magnetic adsorption instead of vacuum adsorption.

FIG. 9(a) is a top view of the flexible board 42, and FIG. 9(b) is the flexible along the line D-D of FIG. 9(a) Vertical cross-sectional view of the sex board 42.

The flexible plate 42 is composed of a cloth-shaped suction sheet 52 that absorbs and holds the reinforcing plate 3B of the laminate 6, an elastic sheet 54 covered with the suction sheet 52, and a body plate 56 that supports the elastic sheet 54. The front surface of the elastic sheet 54 is provided with a through-frame-shaped groove 58, and the suction sheet 52 is covered on the inner side of the groove 58. In addition, the body plate 56 is provided with a plurality of through holes 60, one end of the through holes 60 communicates with the groove 58, and the other end is connected to an air source (such as a vacuum pump) via a suction pipe (not shown).

Therefore, when the suction source is driven, the air in the suction pipe, the through-hole 60, and the groove 58 is sucked, whereby the reinforcing plate 3B of the laminate 6 is vacuum-sucked and held by the suction sheet 52. In this case, the outer shape of the suction sheet 52 is set to be larger than that of the reinforcing plate 3B so that the suction sheet 52 can support the reinforcing plate 3B as a whole. In addition, the material of the elastic sheet 54 is not particularly limited, but is preferably rubber. The rubber is preferably silicone rubber.

The body plate 56 and the elastic sheet 54 are the same size. In addition, the body plate 56 has a higher bending rigidity than the elastic sheet 54, and the bending stiffness of the body plate 56 controls the bending rigidity of the flexible plate 42. The bending stiffness of the flexible board 42 per unit width (1mm) is preferably 1000~40,000N. mm ² /mm. For example, in the portion where the width of the flexible plate 42 is 100 mm, the bending stiffness becomes 100,000 to 4,000,000 N. mm ² . By setting the bending stiffness of the flexible plate 42 to 1000N. mm ² /mm or more can prevent the bending of the reinforcing plate 3B that is adsorbed and held on the flexible plate 42. Also, by setting the bending stiffness of the flexible plate 42 to 40000N. Below mm ² /mm, the reinforcing plate 3B that is adsorbed and held on the flexible plate 42 can be appropriately bent and deformed.

As the main body plate 56, for example, in addition to resin plates such as polyvinyl chloride (PVC) resin, polycarbonate resin, acrylic resin, and polyacetal (POM) resin, metal plates are used.

A plurality of disk-shaped movable bodies 44 as shown in FIG. 7 are fixed to the lower surface of the body plate 56 in a grid shape as shown in FIG. 8. These movable bodies 44 are fixed to the main body plate 56 by fastening members such as bolts, and may be subsequently fixed instead of bolts. The movable bodies 44 are independently moved up and down by the driving device 48 controlled and driven by the controller 50.

That is, the controller 50 controls the driving device 48 to sequentially move the movable body 44 located on the corner 6A side of the laminate 6 in FIG. 8 to the movable body 44 located on the corner 6B side in the peeling direction shown by arrow A Move down. With this operation, as shown in the vertical cross-sectional view of FIG. 10, the laminate 6 is peeled off using the peeling start portion 26 (see FIG. 4) of the interface 24 as a starting point. In addition, the laminate 6 shown in FIGS. 7 and 10 is the laminate 6 in which the peeling start portions 26 and 30 are produced by the first peeling start portion production method described in FIG. 3.

The drive device 48 is composed of, for example, a rotary servo motor and a ball screw mechanism. The rotary motion of the servo motor is converted into linear motion in the ball screw mechanism and transmitted to the rod 62 of the ball screw mechanism. A movable body 44 is provided through the ball joint 64 at the front end of the rod 62. As a result, as shown in FIG. 10, the movable body 44 can be tilted following the deflection of the flexible plate 42. Therefore, the flexible plate 42 can be flexed and deformed from the corner 6A toward the corner 6B without applying excessive force to the flexible plate 42. Furthermore, the drive device 48 is not limited to a rotary servo motor and a ball screw mechanism, but may be a linear servo motor or a fluid pressure cylinder (for example, an air pressure cylinder).

The plurality of driving devices 48 are preferably mounted on the frame 66 that can be raised and lowered via the buffer member 68. The cushion member 68 is elastically deformed in a manner to follow the flexural deformation of the flexible plate 42. With this, the rod 62 tilts relative to the frame 66.

When the stripped reinforcing plate 3B is detached from the flexible plate 42, the frame 66 is moved down by a driving unit (not shown).

The controller 50 is configured as a computer including a recording medium such as a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The controller 50 controls the plurality of drive devices 48 for each drive device 48 by causing the CPU to execute the program recorded on the recording medium, thereby controlling the movement of the plurality of movable bodies 44.

[Peeling method of the reinforcing plates 3A and 3B using the peeling device 40]

[Peeling method based on the first peeling starting part production method]

FIGS. 11(A) to (C) to FIGS. 12(A) to (C) show that the peeling start part 26 is produced at the corner 6A by the first peeling start part manufacturing method described in FIG. 3. , 30 peeling method of the laminate 6. That is, in this figure, a peeling method for peeling the reinforcing plates 3A and 3B of the laminate 6 is shown in time series. In addition, the carrying-in operation to the laminate 6 of the peeling device 40 and the carrying-out operation of the reinforcing plates 3A, 3B and the panel 70 after peeling are performed by the conveying device 74 having the suction pad 72 shown in FIG. 11(A) . In addition, in FIGS. 11 and 12, in order to avoid the complexity of the drawings, the illustration of the movable device 46 is omitted. In addition, the panel 70 is a product panel formed by bonding the substrate 2A and the substrate 2B except the reinforcing plates 3A and 3B via the functional layer 7.

FIG. 11(A) is a side view of the peeling device 40 that places the laminated body 6 on the lower flexible plate 42 according to the actions indicated by arrows E and F of the transport device 74. In this case, the lower flexible plate 42 and the upper flexible plate 42 are moved in advance in such a manner that the transport device 74 is inserted between the lower flexible plate 42 and the upper flexible plate 42 To a relatively fully retreated position. Next, when the laminated body 6 is placed on the lower flexible plate 42, the reinforcing plate 3B of the laminated body 6 is vacuum-sucked and held by the lower flexible plate 42.

11(B) shows that the lower flexible plate 42 and the upper flexible plate 42 move in a relatively close direction, and the reinforcing plate 3A of the laminate 6 is vacuum-absorbed by the upper flexible plate 42 Side view of the peeling device 40 in the maintained state.

FIG. 11(C) shows that the lower flexible plate 42 is flexibly deformed downward from the corner 6A of the laminate 6 toward the corner 6B, while peeling the starting portion 26 at the interface 24 of the laminate 6 ( 4) is a side view of the state where the reinforcing plate 3B is peeled off at the starting point. That is, of the plurality of movable bodies 44 of the lower flexible plate 42 shown in FIG. 10, the movable body 44 located on the corner 6A side of the laminate 6 to the movable body 44 located on the corner 6B side are sequentially Moving downward, the interface 24 peels off the reinforcing plate 3B.

12(A) is a side view of the peeling device 40 in a state where the reinforcing plate 3B of the interface 24 is completely peeled off. According to the figure, the stripped reinforcing plate 3B is vacuum-held and held on the lower flexible plate 42 and the laminate 6 (including the reinforcing plate 3A and the panel 70) except for the reinforcing plate 3B The laminated body) is vacuum-absorbed and held on the upper flexible plate 42.

Further, the lower flexible plate 42 and the upper flexible plate 42 are moved to be relatively fully retracted in such a manner that the conveying device 74 shown in FIG. 11(A) is inserted between the upper and lower flexible plates 42 After the location.

After that, first, the vacuum suction of the lower flexible plate 42 is released. Subsequently, the reinforcing plate 3B is sucked and held by the suction pad 72 of the transport device 74. Next, the reinforcing plate 3B is carried out of the peeling device 40 according to the operation of the conveying device 74 shown by arrows G and H in FIG. 12(A).

FIG. 12(B) is a side view of the laminate 6 other than the reinforcing plate 3B being vacuum-sucked and held by the lower flexible plate 42 and the upper flexible plate 42. That is, the lower flexible plate 42 and the upper flexible plate 42 move in a relatively close direction, and the substrate 2B is vacuum-sucked and held by the lower flexible plate 42.

FIG. 12(C) shows that the upper flexible plate 42 is flexibly deformed upward from the corner 6A of the laminate 6 toward the corner 6B, while peeling the starting portion 30 at the interface 28 of the laminate 6 (see Fig. 4) is a side view of the state where the reinforcing plate 3A is peeled off at the starting point. That is, among the plurality of movable bodies 44 of the upper flexible plate 42 shown in FIG. 7, the movable body 44 located on the corner 6A side of the laminate 6 to the movable body 44 located on the corner 6B side are raised in sequence It moves, and the reinforcing plate 3A is peeled off at the interface 28.

Thereafter, the reinforcing plate 3A completely peeled off from the panel 70 is taken out from the upper flexible plate 42, and the panel 70 is taken out from the lower flexible plate 42. The above is the peeling method for producing the laminate 6 having the peeling start portions 26 and 30 in the corner portion 6A.

Therefore, according to the peeling method of the above-mentioned embodiment, the peeling start portions 26 and 30 are produced on the interfaces 24 and 28 by the peeling starting portion production device 10, and the reinforcing plate 3B and the reinforcing plate 3B are sequentially peeled on the interfaces 24 and 28 by the peeling device 40. 3A. In this way, the laminated body 6 can be transported once from the peeling start part preparation device 10 to the peeling device 40, so that even the laminated body 6 having two interfaces 24, 28 to be peeled off can be peeled off efficiently Reinforcement board 3A, 3B.

[Peeling method based on the second peeling starting part production method]

FIG. 13 shows the need for the peeling method of the laminated body 6 in which the peeling start portions 32 and 34 (see FIG. 6) are produced in the corner portions 6A and 6B by the second peeling start portion manufacturing method described in FIG. 5. unit.

This peeling method first peels the reinforcing plate 3B at the interface 24 with the peeling start portion 32 as the starting point. This step is the same as the steps shown in FIGS. 11(A) to (C) to FIGS. 12(A) and (B). Therefore, the description is omitted.

The peeling method based on the second peeling starting part manufacturing method is to bring the upper flexible plate 42 upward from the corner 6B of the laminate 6 toward the corner 6A from the state shown in FIG. 12(B) as shown in FIG. 13 The flexural deformation peels the reinforcing plate 3A from the peeling start portion 34 (refer to FIG. 6) at the interface 28 of the laminate 6 as a starting point.

Thereafter, the reinforcing plate 3A completely peeled off from the panel 70 is taken out from the upper flexible plate 42, and the panel 70 is taken out from the lower flexible plate 42. The above is the peeling method of the laminated body 6 which produced the peeling start part 32 in the corner part 6A, and produced the peeling start part 34 in the corner part 6B.

Therefore, according to the peeling method of the above-mentioned embodiment, the peeling start portions 32 and 34 are produced at the interfaces 24 and 28 by the peeling starting portion production device 10, and the reinforcing plate 3B and the reinforcing plate 3B are sequentially peeled at the interfaces 24 and 28 by the peeling device 40. 3A. In this way, the laminated body 6 can be transported once from the peeling start part preparation device 10 to the peeling device 40, so that even the laminated body 6 having two interfaces 24, 28 to be peeled off can be peeled off efficiently Reinforcement board 3A, 3B.

Furthermore, it is preferable to control the production of the peeling start portion of the interfaces 24 and 28 of the peeling start portion production device 10 by controlling the peeling start portion production device 10 and the peeling device 40 of FIG. 7 together with the control device (control device) 76 of FIG. 7. Action and peeling action of the interfaces 24, 28 of the peeling device 40.

Furthermore, in the embodiment, the laminated body 6 having two interfaces 24 and 28 is exemplified, but the laminated body targeted by the present invention is not limited to the laminated body 6 as long as it can be peeled from three or more substrates The laminated body formed by lamination is sufficient.

The present invention has been described in detail with reference to specific embodiments, but the practitioner should understand that various changes or modifications can be added without departing from the spirit and scope of the present invention.

This application is based on the Japanese patent application 2014-093440 filed on April 30, 2014, and the contents thereof are incorporated herein by reference.

6‧‧‧Layered body

6A‧‧‧Corner

6B‧‧‧Corner

26‧‧‧Stripping start

30‧‧‧Stripping start

A‧‧‧arrow

Claims (9)

A peeling device for a laminate, characterized by comprising: a device for producing a peeling starting portion, which is a laminate formed by peelably bonding three or more substrates, and inserting a knife from the end of the laminate 2 or more of the specified amount of the interface between the substrate and the interface of the substrate to produce two or more peeling initiation parts; a peeling device that deflects at least one of the above three or more substrates, and uses the above 2 The peeling start part of more than one interface is a starting point for sequential peeling; and a control device that controls the peeling start part to make a device to cut the knife in order at the two or more interfaces to make the above two or more After peeling off the starting part, the peeling device is controlled to peel in sequence from the peeling starting part of the two or more interfaces as the starting point; and the insertion position of the knife of the device for making the peeling starting part is set to the first position of the laminate 1 The position where the corner portion overlaps in the thickness direction of the laminate, and the insertion amount of the blade is set differently for each interface, and the deflection direction of the substrate due to the peeling device is from The direction of the first corner is set to the corner facing the first corner. A peeling device for a laminate, characterized by comprising: a device for producing a peeling starting portion, which is a laminate formed by peelably bonding three or more substrates, and inserting a knife from the end of the laminate 2 or more of the specified amount of the interface between the substrate and the interface of the substrate to produce two or more peeling initiation parts; a peeling device that deflects at least one of the above three or more substrates, and uses the above 2 The above-mentioned peeling start part of more than one interface is the starting point to peel in order And a control device, which controls the peeling device to control the peeling device to control the peeling device after the peeling start portion is made at the two or more interfaces so that the knife is sequentially cut into the two or more peeling starting portions. The peeling start part of the above interface is a starting point for sequential peeling; and the insertion position of the knife of the peeling start part making device is set to at least the first corner of the laminate and other than the first corner A corner, and the deflection direction of the substrate due to the peeling device is set from the first corner toward the corner opposite to the first corner, and from the other corner toward the other One corner is set opposite to the corner. A peeling device for a laminate according to claim 1 or 2, wherein the above-mentioned laminate system is a laminate in which at least the first substrate, the second substrate, the third substrate, and the fourth substrate are sequentially peelably bonded, and the peeling The insertion position of the knife in the device for producing the starting portion is set to the interface between the first substrate and the second substrate, and the interface between the third substrate and the fourth substrate. A method for peeling a laminate, characterized by comprising: a peeling starting part manufacturing step, which is a laminate formed by peelably bonding more than 3 substrates, and a knife is inserted into the phase from the end of the laminate At least a specific amount of two or more interfaces in the interface between the adjacent substrate and the substrate to produce two or more peeling start portions; and a peeling step, which deflects at least one of the above three or more substrates, And the peeling start portion of the two or more interfaces is used as a starting point for peeling in sequence; and the insertion position of the knife in the peeling start portion preparation step is set to the first corner of the laminate and at the position of the laminate The position overlapping in the thickness direction, and The amount of insertion of the knife is set differently for each of the above interfaces, and the deflection direction of the substrate due to the peeling step is from the first corner to the opposite corner of the first corner And set. A method for peeling a laminate, characterized by comprising: a peeling starting part manufacturing step, which is a laminate formed by peelably bonding more than 3 substrates, and a knife is inserted into the phase from the end of the laminate At least a specific amount of two or more interfaces in the interface between the adjacent substrate and the substrate to produce two or more peeling start portions; and a peeling step, which deflects at least one of the above three or more substrates, The peeling start portion of the two or more interfaces is used as a starting point for peeling in sequence; and the insertion position of the knife in the peeling start portion preparation step is set to at least the first corner of the laminate and the first The other corner than the corner, and the deflection direction of the substrate due to the peeling step is set from the first corner toward the corner opposite to the first corner, and from the other corner The direction of the part is set to the corner facing the other corner. The method for peeling a laminate according to claim 4 or 5, wherein the laminate system is a laminate in which at least the first substrate, the second substrate, the third substrate, and the fourth substrate are peelably bonded together, and the peeling starts The insertion position of the knife in the part preparation step is set to the interface between the first substrate and the second substrate, and the interface between the third substrate and the fourth substrate. A method for manufacturing an electronic device, comprising: a functional layer forming step, which is to form a function on the front side of the above-mentioned adjacent substrate among the above-mentioned substrates contained in a laminate formed by peelably bonding three or more substrates Layer; and a separation step which separates the substrate on which the functional layer is formed from the substrate on which the functional layer is formed The other adjacent substrate is separated; the manufacturing method of the electronic device is characterized in that the separation step includes: a peeling start part manufacturing step, which inserts a knife into the adjacent layer of the laminate from the end of the laminate The interface between the substrate and the substrate has a specific amount of more than two interfaces to produce two or more peeling initiation portions; and a peeling step that deflects and deforms at least one of the three or more substrates. The peeling start portion of the two or more interfaces is a starting point for sequential peeling; and the insertion position of the knife in the peeling start portion manufacturing step is set to the first corner of the laminate and the thickness of the laminate The overlapping position in the direction, and the insertion amount of the knife is set differently for each interface, and the deflection direction of the substrate due to the peeling step is from the first corner to the first 1 The corner is set to the opposite corner. A method for manufacturing an electronic device, comprising: a functional layer forming step, which is to form a function on the front side of the above-mentioned adjacent substrate among the above-mentioned substrates contained in a laminate formed by peelably bonding three or more substrates Layer; and a separation step, which separates the substrate on which the functional layer is formed from another substrate adjacent to the substrate on which the functional layer is formed; the manufacturing method of the electronic device is characterized in that the separation step includes : The preparation step of the peeling starting part, which starts from inserting a knife at the end of the laminated body into a specific amount of more than two interfaces in the interface between the adjacent substrate and the substrate of the laminated body to produce two or more peels respectively The beginning; and the peeling step, which is to deflect at least one of the above three or more substrates, and to sequentially peel from the above two or more interfaces of the peeling starting portion as a starting point And the insertion position of the knife in the peeling start part manufacturing step is set to at least the first corner of the laminate and the other corner except the first corner, and the substrate due to the peeling step The deflection direction is set from the first corner toward the corner opposite to the first corner, and from the other corner toward the corner opposite to the other corner. The method for manufacturing an electronic device according to claim 7 or 8, wherein the above-mentioned layered system is a layered body in which at least the first substrate, the second substrate, the third substrate, and the fourth substrate are peelably bonded, and The functional layer is formed on the opposing surface of each of the substrate and the third substrate, and the insertion position of the knife in the peeling start part preparation step is set to the interface between the first substrate and the second substrate, and the above The interface between the third substrate and the fourth substrate.

Images