TWI659848B - Peeling device and method of laminated body, and manufacturing method of electronic device - Google Patents

Abstract

The present invention relates to a peeling device for a laminated body, which includes a peeling blade, and the blade tip is provided on the laminated body for a rectangular laminated body formed by releasably attaching the first substrate and the second substrate. The cut corner portion of the corner portion pierces a certain amount into the interface between the first substrate and the second substrate to form a peeling start portion at the interface; and a peeling portion that starts from the peeling start portion and starts at the interface according to the peeling portion. The peeling is performed sequentially; and the tip of the peeling blade is in point contact with one of the obtuse corners at both ends of the chamfered corner and penetrates into the interface.

Description

Peeling device and method of laminated body, and manufacturing method of electronic device

The invention relates to a peeling device and a peeling method of a laminated body, and a manufacturing method of an electronic device.

Accompanying the reduction in thickness and weight of electronic devices such as display panels, solar cells, and thin-film secondary batteries, thinning of substrates (first substrates) such as glass plates, resin plates, and metal plates for these electronic devices is urgently desired.

However, if the thickness of the substrate becomes thinner, the rationality of the substrate becomes worse. Therefore, it is difficult to form a functional layer for electronic devices (TFT: Thin Film Transistor), color filter (CF : Color Filter)).

Therefore, a manufacturing method of an electronic device is proposed in which a reinforcing plate (second substrate) is attached to the back surface of the substrate to constitute a laminated body that reinforces the substrate by the reinforcing plate, and a functional layer is formed on the front surface of the substrate in the state of the laminated body. This manufacturing method improves the rationality of the substrate, so that a functional layer can be formed on the front side of the substrate well. The reinforcing plate is peeled from the substrate after the functional layer is formed.

The peeling method of the reinforcing plate disclosed in Patent Document 1 is to separate the reinforcing plate or the substrate, or both directions thereof, from one of the two corners located on the diagonal line of the rectangular laminated body toward the other. Deformation is performed in the direction. At this time, in order to make peeling progress smoothly, a peeling start part is formed in one corner part of a laminated body. The peeling start portion is formed by piercing a blade edge of a peeling blade from a corner of the laminated body into a certain amount of the interface between the substrate and the reinforcing plate.

Further, as disclosed in Patent Document 2, a glass substrate for FPD (Flat Panel Display) such as a liquid crystal display and a plasma display is used for a substrate having cut corners at four corners of a rectangular shape. For the substrate and the reinforcing plate used for the laminated body, the corner-cutting portion is also provided at the corner portion, so that the corner-cutting portion is provided at the corner portion of the laminated body.

The chamfered portion is formed by cutting the corner into a wedge shape using a grindstone. The chamfered part indicates the model of the laminated body, and the amount of chamfered angle and the angle of the chamfered part are different according to the model. For example, the general cut-angle portion is set to 45, 21.8, and 18.4 degrees.

FIG. 17 is a plan view showing a laminated body 102 having a chamfered portion 100 having a chamfered angle θ of 45 degrees, and a peeling blade 104 arranged to face the chamfered portion 100.

The 45-degree cut corner portion 100 shown in the figure can be obtained by using the corner portion 106 of the laminated body 102 (the imaginary corner portion in the case where there is no cut corner portion 100) 106 as the a portion of the side portion 108 of the apex angle. And the b portion of the other side portion 110 is obtained by cutting into a triangular shape with a cutting angle of 1 mm, 1.5 mm, 3 mm, or 5 mm, respectively. The 21.8-degree chamfered portion can be obtained by machining a portion having a triangular shape with a cut angle of 5 mm for the part a and 2 mm. Furthermore, a 18.4 degree chamfered portion can be obtained by cutting into a triangular shape by cutting a part at 3 mm and b section at 1 mm.

That is, the chamfer angle θ described in this specification refers to an angle formed by the corner portion 106 of the laminated body 102 as one of the apex angles and the side E of the chamfer portion 100, and the amount of the chamfer angle refers to part a and b The length of the part.

[Prior technical literature] [Patent Literature]

[Patent Document 1] International Publication No. 2011/024689

[Patent Document 2] Japanese Patent Laid-Open No. 2011-207739

In the case where the peeling start portion is formed in the laminated body 102, the tip 105 of the peeling blade 104 is inserted into the interface (not shown) of the laminated body 102 from the cut corner portion 100. At this time, at the cut corner 100 In a configuration in which the edge E is on the same plane as the edge line L of the cutting edge 105 and the edge E is parallel to the edge line L, that is, the line (edge E) and the line (edge line L) are brought close to each other. In the form of the blade tip 105 penetrating into the interface, it is difficult to accurately align the horizontal level (height position) of the line (edge E) and the line (point line L), so there may be cases where the blade tip 105 cannot penetrate into the interface.

The present invention has been made in view of such a problem, and an object thereof is to provide a laminated body capable of surely piercing the interface of the cut corner portion of the laminated body with the cutting edge of the peeling blade even if the laminated body is provided with the cut edge portion. Device and peeling method, and manufacturing method of electronic device.

In order to achieve the above object, the peeling device of the laminated body of the present invention is characterized in that it has a peeling blade, which has a self-setting blade tip for a rectangular laminated body formed by releasably attaching the first substrate and the second substrate. The cut corners of the corners of the laminated body pierce a certain amount into the interface between the first substrate and the second substrate to form a peeling start portion at the interface; and a peeling portion, which uses the peeling start portion as a starting point. Peeling is sequentially performed at the interface; and the tip of the peeling blade is in point contact with one of the obtuse corners of the obtuse corners at both ends of the chamfered corners and penetrates into the interface.

In order to achieve the above-mentioned object, the method for peeling a laminated body of the present invention is performed on an interface between the first substrate and the second substrate for a rectangular laminated body in which the first substrate and the second substrate are releasably attached. A peeler; characterized in that it includes a step of forming a peeling start portion that pierces a blade edge of a peeling blade from a corner portion provided at a corner portion of the laminated body into the interface between the first substrate and the second substrate by a specific amount. Forming a peeling start portion at the interface; and a peeling step that peels at the interface with the peeling start portion as a starting point; and in the peeling start portion forming step, the tip of the peeling blade is in point contact In this manner, the oblique angle portion at both ends of the oblique angle portion at the two ends of the chamfered angle portion is inserted into the interface.

In order to achieve the above object, the method for manufacturing an electronic device according to the present invention includes a functional layer forming step, which is a rectangular shape in which a first substrate and a second substrate are releasably attached. The laminated body forms a functional layer on the exposed surface of the first substrate; and a separation step of separating the second substrate from the first substrate on which the functional layer is formed; and the method for manufacturing the electronic device is characterized by: The separation step includes a step of forming a peeling start portion, which pierces a blade edge of the peeling blade from a corner portion provided at a corner portion of the laminated body into a specific amount to an interface between the first substrate and the second substrate, and The interface forms a peeling start portion; and a peeling step that peels at the interface with the peeling start portion as a starting point; and in the peeling start portion forming step, the tip of the peeling blade is in point contact with the One of the obtuse-angled corners at the two ends of the chamfered-angle part touches the interface after touching.

According to the present invention, in the step of forming the peeling start portion, the tip of the peeling blade is brought into point contact with one of the obtuse corner portions of the obtuse corner portions at both ends of the cut corner portion, and then the first substrate is contacted with the first substrate. The interface of the second substrate penetrates into the blade tip. Thereby, according to the present invention, since the alignment of the previous line and the line is aligned with the point (obtuse angle) and the point (knife tip), the alignment of the level becomes easy. Therefore, it is possible to surely pierce the tip of the peeling blade into the interface of the cut corner portion.

In the present invention, it is preferable that, for the laminated body having the above-mentioned cut corner portion having a cut angle of 45 degrees, 21.8 degrees, or 18.4 degrees, an angle formed by either side of the laminated body and a tip line of the peeling blade Set 23 degrees to 44 degrees on the same surface.

According to this aspect of the present invention, in a laminated body having a commonly-used cutting angle of 45 degrees, 21.8 degrees, or 18.4 degrees, the angle formed by any side of the laminated body and the edge line of the peeling knife is on the same surface. The upper setting is 23 degrees or more and 44 degrees or less. Thereby, the point (obtuse angle) and the point (knife tip) are aligned with each other, so that the tip of the peeling blade can be surely pierced into the interface of the cut corner. Furthermore, in consideration of the machining accuracy of the chamfered portion, it is preferably 24 degrees or more and 42 degrees or less. In addition, even when the angle formed above is set to 1 degree or more and 21 degrees on the same surface, the point-to-point alignment is achieved, but since the angle formed above is small, peeling starts. The shape of the part becomes slender, which is not good as a starting point for peeling. As a starting point for stripping Preferably, the shape of the peeling start portion is a right-angle isosceles triangle. In the case of 23 degrees or more and 44 degrees or less, the shape of the peeling start portion can be made close to the right-angle isosceles triangle.

According to the peeling device, the peeling method, and the manufacturing method of the electronic device of the laminated body of the present invention, even if it is a laminated body provided with a chamfered portion, the tip of the peeling blade can be surely pierced into the interface of the chamfered portion.

1‧‧‧ laminated body

1A‧‧‧The first laminated body

1B‧‧‧Second layered body

2‧‧‧ substrate

2A‧‧‧ substrate

2Aa‧‧‧ Front side of substrate

2B‧‧‧ substrate

2Ba‧‧‧ Front side of substrate

2a‧‧‧ Front side of substrate

2b‧‧‧ Back of substrate

3‧‧‧ Reinforcing board

3A‧‧‧ Reinforcing board

3B‧‧‧ Reinforcing board

Back of 3Bb‧‧‧ Reinforcing Board

Front of 3a‧‧‧ Reinforcing Board

4‧‧‧ resin layer

4A‧‧‧Resin layer

4B‧‧‧Resin layer

6‧‧‧ laminated body

6A‧‧‧Cut corner

6Aa‧‧‧Corner

6B‧‧‧Cut corner

6C‧‧‧Cut corner

6D‧‧‧Cut corner

7‧‧‧ functional layer

10‧‧‧ peeling start part forming device

12‧‧‧ platform

14‧‧‧ retainer

16‧‧‧ height adjustment device

18‧‧‧feeding device

20‧‧‧ Liquid

22‧‧‧Liquid supply device

24‧‧‧ interface

26‧‧‧ Stripping start

28‧‧‧ interface

30‧‧‧ stripping start

40‧‧‧ peeling device

42‧‧‧ stripping unit

44‧‧‧ movable body

46‧‧‧ Mobile device

48‧‧‧Drive

50‧‧‧controller

52‧‧‧ flexible board

54‧‧‧ Adsorption Department

56‧‧‧ double-sided tape

58‧‧‧ flexible board

60‧‧‧breathable sheet

62‧‧‧sealing frame member

64‧‧‧ double-sided tape

66‧‧‧slot

68‧‧‧through hole

70‧‧‧ par

72‧‧‧ Ball Joint

74‧‧‧Frame

76‧‧‧ buffer member

78‧‧‧Adsorption pad

80‧‧‧ transfer device

82‧‧‧Feed screw

84‧‧‧ Motor

86‧‧‧Control Department

88‧‧‧Laminated body

88A‧‧‧Cut corner

88Aa‧‧‧Corner

90‧‧‧ laminated body

90A‧‧‧Cut corner

90Aa‧‧‧ Corner

92‧‧‧Laminated body

92A‧‧‧Cut corner

92Aa‧‧‧Corner

94‧‧‧layer

94A‧‧‧Cut corner

94Aa‧‧‧ Corner

96‧‧‧Laminated body

96A‧‧‧Cut corner

96Aa‧‧‧ Corner

98‧‧‧ stripping start

100‧‧‧Cut corner

102‧‧‧layer

104‧‧‧Stripping Knife

105‧‧‧Blade

106‧‧‧ Corner

108‧‧‧Edge

110‧‧‧Edge

E‧‧‧side

J‧‧‧side

L‧‧‧ blade line

N‧‧‧Blade

Na‧‧‧Blade

P‧‧‧ Panel

θ‧‧‧ angle

θ1‧‧‧ angle

FIG. 1 is an enlarged side view of a main part showing an example of a laminated body provided for a manufacturing process of an electronic device.

FIG. 2 is an enlarged side view showing a main part of an example of a multilayer body produced in the middle of the manufacturing steps of an LCD (liquid crystal display).

3 (A) to 3 (E) are explanatory diagrams showing a method for forming a peeling start portion using a peeling start portion forming apparatus.

FIG. 4 is a plan view of a laminated body having a peeling start portion formed by a peeling start portion forming method.

Fig. 5 is a side view showing the overall configuration of the peeling start portion forming apparatus.

FIG. 6 is a plan view of the peeling start portion forming apparatus shown in FIG. 5.

Fig. 7 is a longitudinal sectional view showing the configuration of a peeling device according to the embodiment.

FIG. 8 is a plan view schematically showing a flexible plate in which the movable body is disposed with respect to the disposing unit.

9 (A) to (C) are explanatory diagrams showing the configuration of the peeling unit.

FIG. 10 is a longitudinal cross-sectional view showing a peeling device that peels at the interface of the laminated body.

FIGS. 11 (A) to (C) are explanatory diagrams showing a peeling method of a reinforcing plate for peeling a laminated body having a peeling start portion formed by a peeling start portion forming method in time series.

FIGS. 12 (A) to (C) are explanatory diagrams showing the peeling method of the reinforcing plate for peeling the laminated body in time series following FIGS. 11 (A) to (C).

FIG. 13 is a plan view showing a state where a blade edge of a blade is in contact with a corner portion of a chamfered portion.

14 (A) to (E) are explanatory diagrams showing a case where the angle formed by the edge of the laminated body and the edge line of the blade is set to 23 degrees or more and 44 degrees or less.

FIG. 15 is an explanatory diagram showing the shape of the peeling start portion when the angle formed by the edge of the laminated body and the edge line of the blade is set to 1 degree or more and 21 degree or less.

FIG. 16 is an explanatory diagram showing the shape of the peeling start portion when the angle formed by the edge of the laminated body and the blade line of the blade is set to 23 degrees or more and 44 degrees or less.

FIG. 17 is a plan view showing a laminated body having a 45-degree cut angle portion and a peeling blade.

Hereinafter, embodiments of the present invention will be described in accordance with the accompanying drawings.

Hereinafter, the case where the peeling device and the peeling method of the laminated body of this invention are used in the manufacturing process of an electronic device is demonstrated.

The electronic device refers to electronic components such as a display panel, a solar cell, and a thin film secondary battery. Examples of the display panel include a liquid crystal display (LCD: Liquid Crystal Display) panel, a plasma display panel (PDP: Plasma Display Panel), and an organic EL display (OELD: Organic Electro Luminescence Display) panel.

[Manufacturing steps of electronic device]

The electronic device is manufactured by forming a functional layer for an electronic device (if it is an LCD, a thin film transistor (TFT), a color filter (CF)) formed on the front surface of a substrate made of glass, resin, or metal.

Before forming the functional layer, the back surface of the substrate is attached to a reinforcing plate to form a laminated body. Thereafter, a functional layer is formed on the front surface of the substrate in the state of the laminated body. After the functional layer is formed, the reinforcing plate is peeled from the substrate.

That is, in the manufacturing steps of the electronic device, a functional layer forming step of forming a functional layer on the front surface of the substrate in a state of a laminate is provided, and the substrate is separated from the substrate on which the functional layer is formed. Separation steps of the reinforcing plate. In this separation step, the peeling device and peeling method of the laminated body of the present invention are applied.

[Laminated body 1]

FIG. 1 is an enlarged side view showing a main part of an example of the laminated body 1.

The laminated body 1 includes a substrate (first substrate) 2 on which a functional layer is to be formed, and a reinforcing plate (second substrate) 3 for reinforcing the substrate 2. Further, the reinforcing plate 3 includes a resin layer 4 as an adsorption layer on the front surface 3 a, and the rear surface 2 b of the substrate 2 is attached to the resin layer 4. That is, the substrate 2 is releasably attached to the reinforcing plate 3 through the resin layer 4 by the van der Waals force acting on the resin layer 4 or the adhesive force of the resin layer 4.

[Substrate 2]

A functional layer is formed on the front surface (exposed surface) 2a of the substrate 2. Examples of the substrate 2 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among these substrates, since the glass substrate is excellent in chemical resistance and moisture permeability resistance, and has a small linear expansion coefficient, it is preferably used as the substrate 2 for electronic devices. In addition, there is also an advantage that as the linear expansion coefficient becomes smaller, the pattern of the functional layer formed at a high temperature is less likely to shift when cooled.

Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses containing silicon oxide as a main component. The oxide-based glass is preferably a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide.

The glass of the glass substrate is preferably selected from glass suitable for the type of electronic device to be manufactured, and glass suitable for the manufacturing steps thereof. For example, as the glass substrate for a liquid crystal panel, glass (alkali-free glass) that does not substantially contain an alkali metal component is preferably used.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when the substrate 2 is a glass substrate, the thickness of the electronic device is preferably set to 0.7 mm or less, more preferably 0.3 mm or less, and further preferably 0.1 mm or less in order to reduce the weight and thickness of the electronic device. When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. and then, When the thickness is 0.1 mm or less, the glass substrate can be wound into a roll shape, but from the viewpoint of manufacturing the glass substrate and the viewpoint of processing the glass substrate, the thickness is preferably 0.03 mm or more.

Furthermore, in FIG. 1, the substrate 2 includes one substrate, but the substrate 2 may include a plurality of substrates. That is, the substrate 2 may include a laminated body formed by laminating a plurality of substrates. In this case, the total thickness of all the substrates constituting the substrate 2 becomes the thickness of the substrate 2.

[Boost plate 3]

Examples of the reinforcing plate 3 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate.

The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and it is set according to the type, thickness, and the like of the substrate 2 to be reinforced. In addition, the thickness of the reinforcing plate 3 may be thicker than the substrate 2 or may be thinner than the substrate 2. However, in order to reinforce the substrate 2, it is preferably 0.4 mm or more.

Furthermore, in this example, the reinforcing plate 3 includes one substrate, but the reinforcing plate 3 may also include a laminated body formed by laminating a plurality of substrates. In this case, the total thickness of all the substrates constituting the reinforcing plate 3 becomes the thickness of the reinforcing plate 3.

[Resin layer 4]

In order to prevent peeling between the resin layer 4 and the reinforcing plate 3, the bonding force between the resin layer 4 and the reinforcing plate 3 is set to be higher than the bonding force between the resin layer 4 and the substrate 2. Thereby, in the peeling step, peeling is performed at the interface between the resin layer 4 and the substrate 2.

The resin constituting the resin layer 4 is not particularly limited, and examples thereof include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polysiloxane resin, and a polyimide polysiloxane resin. Several resins can also be mixed and used. Among these, from the viewpoints of heat resistance and releasability, polysiloxane resins and polyimide polysiloxane resins are preferred.

The thickness of the resin layer 4 is not particularly limited, but is preferably set to 1 to 50 μm, and more preferably set to 4 to 20 μm. By setting the thickness of the resin layer 4 to 1 μm or more, when bubbles or foreign matter are mixed between the resin layer 4 and the substrate 2, the resin layer 4 can be absorbed by deformation of the resin layer 4. Thickness of bubbles or foreign objects. On the other hand, by setting the thickness of the resin layer 4 to 50 μm or less, the formation time of the resin layer 4 can be shortened, and the resin of the resin layer 4 is not required to be used excessively, so it is economical.

Furthermore, the outer shape of the resin layer 4 is preferably the same as or smaller than the outer shape of the reinforcing plate 3 so that the entirety of the resin layer 4 can be supported by the reinforcing plate 3. The outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2 so that the resin layer 4 can be in close contact with the entirety of the substrate 2.

In addition, in FIG. 1, the resin layer 4 includes one layer, but the resin layer 4 may include two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 becomes the thickness of the resin layer 4. In this case, the types of resin constituting each layer may be different.

Furthermore, in the embodiment, the resin layer 4 as an organic film is used as the adsorption layer, but an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer includes, for example, at least one selected from the group consisting of a metal silicide, a nitride, a carbide, and a carbonitride.

Furthermore, although the laminated body 1 of FIG. 1 includes the resin layer 4 as an adsorption layer, the resin layer 4 may be removed and a structure including the substrate 2 and the reinforcing plate 3 may be used. In this case, the substrate 2 and the reinforcing plate 3 are releasably attached by a Van der Waals force or the like acting between the substrate 2 and the reinforcing plate 3. In addition, when the substrate 2 and the reinforcing plate 3 are glass substrates, it is preferable to form an inorganic thin film on the front surface 3a of the reinforcing plate 3 so that the substrate 2 as the glass substrate and the reinforcing plate 3 as the glass plate are not exposed to high temperatures And then.

[Laminated body 6 in which the functional layer is formed]

A functional layer is formed on the front surface 2a of the substrate 2 of the laminated body 1 through the functional layer forming step. As a method for forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method and a PVD (Physical Vapor Deposition) method are used. The functional layer is formed into a specific pattern by a photolithography method or an etching method.

FIG. 2 is an enlarged side view of a main part showing an example of a rectangular laminated body 6 manufactured in the middle of the manufacturing steps of the LCD.

The laminated body 6 is formed by sequentially stacking a reinforcing plate 3A, a resin layer 4A, a substrate 2A, a functional layer 7, a substrate 2B, a resin layer 4B, and a reinforcing plate 3B. That is, the laminated body 6 in FIG. 2 corresponds to a laminated body in which the laminated body 1 shown in FIG. 1 is symmetrically arranged with the functional layer 7 interposed therebetween. Hereinafter, the laminated body including the substrate 2A, the resin layer 4A, and the reinforcing plate 3A is referred to as a first laminated body 1A, and the laminated body including the substrate 2B, the resin layer 4B, and the reinforcing plate 3B is referred to as a second laminated body 1B.

On the front surface 2Aa of the substrate 2A of the first laminated body 1A, a thin film transistor (TFT) as a functional layer 7 is formed, and on the front surface 2Ba of the substrate 2B of the second laminated body 1B, a color filter (functional layer 7) is formed ( CF).

The first multilayer body 1A and the second multilayer body 1B are superimposed on each other and integrated with the front surfaces 2Aa, 2Ba of the substrates 2A, 2B. Thereby, the laminated body 6 of the structure which arrange | positioned the 1st laminated body 1A and the 2nd laminated body 1B symmetrically via the functional layer 7 was manufactured.

In the peeling start portion forming step of the separation step, after the peeling start portion is formed at the interface of the laminated body 6 by the blade edge of the blade (stripping knife), the reinforcing plates 3A and 3B are peeled off sequentially in the peeling step of the separation step. Thereafter, a polarizing plate, a backlight device, and the like are installed to manufacture an LCD as a product.

[Peeling start portion forming device 10]

FIGS. 3 (A) to (E) are explanatory diagrams showing a main part configuration of a peeling start portion forming apparatus 10 used in the peeling start portion forming step and a peeling start portion forming method using the peeling start portion forming apparatus 10, and FIG. 3 ( A) is an explanatory diagram showing the positional relationship between the laminated body 6 and the blade (stripping knife) N. FIG. 3 (B) is an explanatory diagram of forming the peeling start portion 26 at the interface 24 by the blade N, and FIG. 3 (C) is FIG. 3 (D) is an explanatory diagram showing a state immediately before the peeling start portion 30 is formed at the interface 28. FIG. 3 (D) is an explanatory diagram of the peeling start portion 30 being formed at the interface 28 by the blade N. FIG. The explanatory drawing of the laminated body 6 of the parts 26 and 30.

4 is a plan view of the multilayer body 6 in which the peeling start portions 26 and 30 are formed.

Further, FIG. 5 is a side view showing the overall configuration of the peeling start portion forming apparatus 10, and FIG. 6 is a plan view of the peeling start portion forming apparatus 10 shown in FIG. 5.

In FIG. 4, cut corner portions 6A, 6B, 6C, and 6D are provided at each corner portion of the laminated body 6. The chamfered portions 6A to 6D are cut into a wedge-shaped cut by a grindstone, indicating the model of the laminated body 6, and the chamfered amount and the chamfered angle are different according to the model. In the laminated body 6 in FIG. 4, cut corners 6A to 6D are provided at all corners, but there is also a laminated body provided with cut corners at at least one selected corner. In addition, in FIG. 4 and FIG. 6, the cut corner portions 6A to 6D are exaggerated with respect to the size of the laminated body 6, but the sizes are actually small.

Returning to FIG. 3, when the peeling start portions 26 and 30 are formed, the laminated body 6 is as shown in FIG. 3 (A). The back surface 3Bb of the reinforcing plate 3B is sucked and held by the platform 12 and is horizontally (X-axis direction in the figure). stand by.

As shown in FIG. 6, the blade N is supported by the holder 14 of FIG. 3 in a horizontal direction so that the cutting edge Na and one corner portion (obtuse angle portion) 6Aa of the cut corner portion 6A of the laminated body 6 face each other. The position of the blade N in the height direction (Z-axis direction in the figure) is adjusted by the height adjustment device 16. Further, the blade N and the laminated body 6 are relatively moved in a horizontal direction (X direction in the figure) by a feeding device 18 such as a ball screw device. The feeding device 18 may move at least one of the blade N and the platform 12 in the horizontal direction. In the embodiment, the blade N is moved. Furthermore, a liquid supply device 22 for supplying the liquid 20 to the upper surface of the tip Na of the blade N before or during the insertion is disposed above the blade N.

[Method for Forming Peel-off Part]

In the peeling start portion forming method using the peeling start portion forming apparatus 10, the penetration position of the blade N is set to the corner portion 6Aa of the laminated body 6, and the position overlapping in the thickness direction of the laminated body 6, and the interface 24 and 28 set the penetration amount of the blade N in different ways.

The formation procedure will be described.

In the initial state, the blade tip Na of the blade N exists relative to the first penetration position. The interface 24 between the substrate 2B and the resin layer 4B is shifted in the height direction (Z-axis direction). Therefore, first, as shown in FIG. 3 (A), the blade N is moved in the height direction, and the height of the tip Na of the blade N is set to the height of the interface 24.

Thereafter, the blade N is moved in a horizontal direction (direction of arrow A in FIG. 6) toward the corner portion 6Aa of the laminated body 6, and after the point Na of the blade N contacts the corner portion 6Aa, as shown in FIG. 3 (B), The blade tip Na penetrates into the interface 24 by a certain amount. Further, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the blade tip Na at the time of or before the insertion of the blade N. As a result, the substrate 2B of the corner portion 6Aa is peeled from the resin layer 4B. Therefore, as shown in FIG. 4, a peeling start portion 26 having a triangular shape in plan view is formed on the interface 24. In addition, the supply of the liquid 20 is not necessary, but if the liquid 20 is used, the liquid 20 will remain in the peeling start portion 26 even after the blade N is pulled out. Therefore, a peeling start portion 26 that can no longer be attached can be formed.

Next, the blade N is pulled out from the corner portion 6Aa in the horizontal direction (direction of arrow B in FIG. 6). As shown in FIG. 3 (C), the blade tip Na of the blade N is set as the substrate 2A and the second penetration position. The height of the interface 28 of the resin layer 4A.

Thereafter, the blade N is moved toward the laminated body 6 in the horizontal direction (direction of arrow A in FIG. 6), and after the point Na of the blade N is brought into contact with the corner portion 6Aa, as shown in FIG. 3 (D), the blade Na A specific amount is penetrated into the interface 28. Similarly, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the tip Na. Thereby, as shown in FIG. 3 (E), a peeling start portion 30 is formed on the interface 28. Here, the amount of penetration of the blade N into the interface 28 is set to be smaller than the amount of penetration into the interface 24. The above is the method of forming the peeling start portion. Furthermore, the amount of penetration of the blade N into the interface 24 may be set to be smaller than the amount of penetration into the interface 28.

The laminated body 6 having the peeling start portions 26 and 30 formed thereon is taken out from the peeling start portion forming apparatus 10 and proceeds to a peeling step. In the peeling step, the laminated body 6 is sequentially peeled at the interfaces 24 and 28 by a peeling device described below.

The details of the peeling method at the interfaces 24 and 28 are described below. As shown by the arrow C in FIG. 4, the laminated body 6 is bent from the cut corner portion 6A toward the cut corner portion 6C opposite to the cut corner portion 6A. However, the interface 24 having a larger area at the peeling start portion 26 is peeled off initially with the peeling start portion 26 as a starting point. Thereby, the reinforcing plate 3B is peeled. Thereafter, the laminated body 6 is deflected again from the chamfered portion 6A toward the chamfered portion 6C, and the interface 28 having a smaller area at the peeling start portion 30 is peeled off with the peeling start portion 30 as a starting point. Thereby, the reinforcing plate 3A is peeled. The penetration amount of the blade N is set according to the size of the laminated body 6, and is preferably set to 7 mm or more, and more preferably about 15 to 20 mm.

Moreover, the peeling device and the peeling method of this invention are characterized by the peeling start part formation method of the blade N, and this point is mentioned later.

[Peeling device 40]

FIG. 7 is a longitudinal sectional view showing the configuration of a peeling device (peeling section) 40 according to the embodiment, and FIG. 8 is a plan view schematically showing the peeling unit 42 where a plurality of movable bodies 44 are arranged relative to the peeling unit 42 of the peeling device 40. . 7 is equivalent to a cross-sectional view taken along the line D-D in FIG. 8, and the laminated body 6 is indicated by a solid line in FIG. 8.

As shown in FIG. 7, the peeling device 40 includes a pair of movable devices 46 and 46 arranged one above the other with the laminated body 6 interposed therebetween. Since the movable devices 46 and 46 have the same structure, the movable device 46 disposed on the lower side in FIG. 7 will be described here, and the movable device 46 disposed on the upper side will be omitted by using the same reference numerals.

The movable device 46 includes a plurality of movable bodies 44, a plurality of driving devices 48 that move the movable body 44 up and down for each movable body 44, and a controller 50 that controls each of the driving devices 48.

The peeling unit 42 vacuum-holds the reinforcing plate 3B so as to flex and deform the reinforcing plate 3B. Furthermore, instead of vacuum adsorption, electrostatic adsorption or magnetic adsorption may be used.

[Stripping unit 42]

FIG. 9 (A) is a top view of the peeling unit 42, and FIG. 9 (B) is an enlarged vertical cross-sectional view of the peeling unit 42 along line E-E of FIG. 9 (A). 9 (C) is an enlarged longitudinal cross-sectional view of the peeling unit 42 and shows that the suction portion 54 constituting the peeling unit 42 is detachably installed via a double-sided tape 56. The rectangular plate-shaped flexible plate 52 constituting the peeling unit 42 is opposed to each other.

As described above, the peeling unit 42 is configured by detachably attaching the suction unit 54 to the flexible plate 52 via the double-sided tape 56.

The suction portion 54 includes a flexible plate 58 having a thickness smaller than that of the flexible plate 52. The lower surface of the flexible plate 58 is detachably attached to the upper surface of the flexible plate 52 via a double-sided tape 56.

Furthermore, a rectangular air-permeable sheet 60 is provided on the suction portion 54 to suck and hold the inner surface of the reinforcing plate 3B of the laminated body 6. In order to reduce the tensile stress generated in the reinforcing plate 3B during peeling, the thickness of the air-permeable sheet 60 is 2 mm or less, preferably 1 mm or less, and 0.5 mm is used in the embodiment.

Further, a sealing frame member 62 is provided on the suction portion 54 to surround the air-permeable sheet 60 and to be in contact with the outer peripheral surface of the reinforcing plate 3B. The seal frame member 62 and the air-permeable sheet 60 are adhered to the upper surface of the flexible plate 58 via the double-sided tape 64. In addition, the sealing frame member 62 is a sponge with independent bubbles having a Shore E hardness of 20 to 50 degrees, and has a thickness of 0.3 mm to 0.5 mm with respect to the thickness of the air-permeable sheet 60.

A frame-shaped groove 66 is provided between the air-permeable sheet 60 and the sealing frame member 62. Further, the flexible plate 52 is provided with a plurality of through holes 68. One end of the through holes 68 communicates with the groove 66, and the other end is connected to an air intake source (for example, a vacuum pump) through a suction pipe (not shown). .

Therefore, when the above-mentioned air intake source is driven, the air of the suction pipe, the through hole 68, and the groove 66 is sucked, and the inner surface of the reinforcing plate 3B of the laminated body 6 is vacuum-adsorbed and held on the air-permeable sheet 60, In addition, since the outer peripheral surface of the reinforcing plate 3B is pressed against the seal frame member 62, the airtightness of the adsorption space surrounded by the seal frame member 62 is improved.

The bending rigidity of the flexible plate 52 is higher than that of the flexible plate 58, the breathable sheet 60, and the sealing frame member 62. The bending rigidity of the flexible plate 52 determines the bending rigidity of the peeling unit 42. The bending rigidity per unit width (1 mm) of the peeling unit 42 is preferably 1000 to 40,000 N. mm ² / mm. For example, in a part where the width of the peeling unit 42 is 100 mm, the bending rigidity becomes 100,000 to 4000000 N. mm ² . By setting the bending rigidity of the peeling unit 42 to 1000N. mm ² / mm or more, the bending of the reinforcing plate 3B held by the peeling unit 42 can be prevented. The bending rigidity of the peeling unit 42 is set to 40,000 N. mm ² / mm or less, the reinforcing plate 3B adsorbed and held on the peeling unit 42 can be appropriately flexed and deformed.

The flexible plates 52 and 58 are resin members having a Young's modulus of 10 GPa or less, such as resin members such as polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, and polyacetal (POM) resin.

[Movable device 46]

On the lower surface of the flexible plate 52, a plurality of disk-shaped movable bodies 44 shown in FIG. 7 are fixed in a grid shape as shown in FIG. 8. The movable bodies 44 are fixed to the flexible plate 52 by fastening members such as bolts, but may be subsequently fixed instead of the bolts. The movable bodies 44 are independently moved up and down by a driving device 48 driven and controlled by the controller 50.

That is, the controller 50 controls the driving device 48 such that the movable body 44 located on the side of the chamfered portion 6A of the laminated body 6 from the movable body 44 located on the side of the chamfered portion 6C in the peeling traveling direction shown by the arrow C in FIG. 8. Sequentially descend and move. By this operation, as shown in the longitudinal cross-sectional view of FIG. 10, the interface 24 of the laminated body 6 is peeled off with the peeling start portion 26 (see FIG. 4) as a starting point. The laminated body 6 shown in FIGS. 7 and 10 is a laminated body 6 having peeling start portions 26 and 30 formed by the peeling start portion forming method described with reference to FIG. 3.

The drive device 48 includes, for example, a rotary servo motor and a ball screw mechanism. The rotary motion of the servo motor is converted into linear motion in the ball screw mechanism and transmitted to the rod 70 of the ball screw mechanism. A movable body 44 is provided at a front end portion of the lever 70 via a ball joint 72. Thereby, as shown in FIG. 10, the movable body 44 can be tilted following the flexure and deformation of the peeling unit 42. Accordingly, the peeling unit 42 can be flexibly deformed from the cut corner portion 6A toward the cut corner portion 6C without applying a forcible force to the peeling unit 42. Furthermore, the drive device 48 is not limited to a rotary servo motor and a ball screw mechanism, and may be a linear servo motor or a fluid pressure cylinder (for example, a pneumatic cylinder).

The plurality of driving devices 48 are preferably mounted on a frame 74 that can be raised and lowered via a buffer member 76. The buffer member 76 is elastically deformed so as to follow the flexural deformation of the peeling unit 42. Thereby, the lever 70 is tilted with respect to the frame 74.

When removing the peeled reinforcing plate 3B from the peeling unit 42, the frame 74 is moved downward by a driving portion (not shown).

The controller 50 is configured as a computer including a recording medium such as a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). . The controller 50 controls the plurality of driving devices 48 for each of the programs recorded in the recording medium by causing the CPU to execute the programs, thereby controlling the lifting and lowering movements of the plurality of movable bodies 44.

[Peeling method of the reinforcing plates 3A and 3B using the peeling device 40]

FIGS. 11 (A) to (C) to 12 (A) to (C) show the laminated body 6 in which the peeling start portions 26 and 30 are formed on the corner portion 6Aa by the peeling start portion forming method described in FIG. 3. Stripping method. That is, in this figure, the peeling method of the reinforcing plates 3A and 3B of the laminated body 6 is shown in time series.

The carrying-in operation of the laminated body 6 into the peeling device 40 and the carrying-out operation of the peeled reinforcing plates 3A, 3B, and the panel P are performed by a carrying device 80 including an adsorption pad 78 shown in FIG. 11 (A). In addition, in FIGS. 11 and 12, in order to avoid the complexity of the drawings, the illustration of the movable device 46 is omitted. In addition, the panel P refers to a product panel in which a substrate 2A and a substrate 2B other than the reinforcing plates 3A and 3B are attached via a functional layer 7.

FIG. 11 (A) is a side view of the peeling device 40 that places the laminated body 6 on the peeling unit 42 on the lower side by the operation shown by the arrows F and G of the conveying device 80. In this case, the lower peeling unit 42 and the upper peeling unit 42 are moved to a relatively sufficiently retracted position in advance, so that the conveying device 80 is inserted between the lower peeling unit and the upper peeling unit 42. Then, when the laminated body 6 is placed on the lower peeling unit 42, the reinforcing plate 3B of the laminated body 6 is vacuum-adsorbed and held by the lower peeling unit 42. That is, in FIG. 11 (A), the table An adsorption step of adsorbing and holding the reinforcing plate 3B by the lower peeling unit 42 is shown.

FIG. 11 (B) is a peeling device that moves the lower peeling unit 42 and the upper peeling unit 42 in a relatively close direction, and vacuum-holds the reinforcing plate 3A of the laminated body 6 by the upper peeling unit 42. Side view of 40. That is, FIG. 11 (B) shows an adsorption step in which the reinforcing plate 3A is adsorbed and held by the peeling unit 42 on the upper side.

When the substrate 2 of the laminated body 1 shown in FIG. 1 is peeled from the reinforcing plate 3 by the peeling device 40, the substrate 2 as the first substrate is supported by the upper peeling unit 42. The lower peeling unit 42 sucks and holds the reinforcing plate 3 as the second substrate. In this case, the support portion of the support substrate 2 is not limited to the peeling unit 42, and may be any one that can detachably support the substrate 2. However, by using the peeling unit 42 as a support portion, the substrate 2 and the reinforcing plate 3 can be bent and peeled at the same time. Therefore, there is an advantage that the peeling force can be reduced compared to a configuration in which only the substrate 2 or the reinforcing plate 3 is bent. .

Returning to FIG. 11, FIG. 11 (C) shows that the peeling unit 42 on the lower side is flexed and deformed from the cut corner portion 6A of the laminated body 6 toward the cut corner portion 6C while peeling off at the interface 24 of the laminated body 6 The start portion 26 (see FIG. 4) is a side view of a state where the starting point is peeled. That is, among the plurality of movable bodies 44 of the peeling unit 42 on the lower side shown in FIG. 10, the movable bodies 44 located on the cut corner portion 6A side of the laminated body 6 and the movable bodies 44 located on the cut corner portion 6C side are sequentially lowered. Move and peel off the reinforcing plate 3B at the interface 24. In addition, in conjunction with this action, the movable body 44 located on the cut-off portion 6A side of the laminated body 6 to the movable body 44 located on the cut-off portion 6C side of the plurality of movable bodies 44 of the upper peeling unit 42 may be used. Ascending and moving in order, peeling occurs at the interface 24. This makes it possible to reduce the peeling force compared to a case where only the reinforcing plate 3B is bent.

FIG. 12 (A) is a side view of the peeling device 40 in a state where the reinforcing plate 3B of the interface 24 is completely peeled. According to the figure, the peeled reinforcing plate 3B is vacuum-adsorbed and held on the lower peeling unit 42, and the laminated body 6 (including the laminated plate 3A and the panel P) other than the reinforcing plate 3B is vacuum-adsorbed and held on the upper side. Peeling unit 42.

Moreover, the peeling unit 42 on the lower side and the peeling unit 42 on the upper side are moved to be relatively sufficient The retracted position is such that the conveying device 80 shown in FIG. 11 (A) is inserted between the upper and lower peeling units 42.

Thereafter, first, the vacuum suction of the lower peeling unit 42 is released. Next, the reinforcing plate 3B is adsorbed and held by the resin layer 4B through the adsorption pad 78 of the conveying device 80. Then, the reinforcing plate 3B is carried out from the peeling device 40 by the operation of the transfer device 80 (see FIG. 11 (A)) shown by arrows H and I in FIG. 12 (A).

FIG. 12 (B) is a side view of the laminated body 6 other than the reinforcing plate 3B being vacuum-adsorbed and held by the peeling unit 42 on the lower side and the peeling unit 42 on the upper side. That is, the lower peeling unit 42 and the upper peeling unit 42 are moved in a relatively close direction, and the lower peeling unit 42 vacuum-holds the substrate 2B.

FIG. 12 (C) shows that the peeling unit 42 on the upper side is flexed and deformed from the chamfered portion 6A of the laminated body 6 toward the chamfered portion 6C, and the peeling start portion 30 is formed on the interface 28 of the laminated body 6 (see FIG. 4) A side view of a state where peeling is performed as a starting point. In other words, among the plurality of movable bodies 44 of the peeling unit 42 on the upper side shown in FIG. 10, the movable bodies 44 located on the cut corner portion 6A side of the laminated body 6 and the movable bodies 44 located on the cut corner portion 6C side are sequentially moved upward. , And the reinforcing plate 3A is peeled off at the interface 28. In addition, in conjunction with this action, the movable body 44 located on the side of the corner 6A of the laminated body 6 among the plurality of movable bodies 44 of the lower peeling unit 42 may be moved to the movable body on the side of the corner 6C. 44 moves downward in order and peels off at the interface 28. This makes it possible to reduce the peeling force compared to a case where only the reinforcing plate 3A is bent.

Thereafter, the reinforcing plate 3A completely peeled from the panel P is taken out from the peeling unit 42 on the upper side, and the panel P is taken out from the peeling unit 42 on the lower side. The above is the peeling method of the laminated body 6 in which the peeling start part 26 and 30 was formed in the corner part 6Aa.

[Features of the peeling start portion forming apparatus 10]

FIG. 13 is a plan view showing a state where the cutting edge Na of the insert N contacts the corner portion 6Aa of the cut corner portion 6A of the laminated body 6. The blade N is formed in a flat plate shape, and a straight blade Na is provided along its edge.

As shown in FIG. 5, the laminated body 6 and the blade N are arranged on a horizontal surface. The blade N is brought into point contact with the corner portion 6Aa by moving the blade N in the direction of arrow A in FIG. 13 on a horizontal plane, and thereafter, the blade Na is inserted into the interfaces 24 and 28 (see FIG. 3 (B), (D)). That is, the peeling start portion forming device 10 is characterized in that, in the penetration form of the cutting edge Na to the interfaces 24 and 28, it is aligned from the previous line and line level to a point (corner portion 6Aa) and a point ( The blade point Na) is aligned. With this, the level alignment is facilitated, and therefore, the cutting edge Na can be surely penetrated into the interfaces 24 and 28 of the cut corner portion 6A.

Returning to FIG. 5, the blade N is reciprocated in the direction of the arrow A and the direction of the arrow B of FIG. 6 by the feeding device 18 including the feeding screw 82 and the motor 84. The amount of movement in the penetration direction shown by arrow A and the amount of movement in the retreat direction shown by arrow B are controlled by the control unit 86 of FIG. 5 that controls the motor 84.

Figures 14 (A) ~ (E) show the angle formed by any one side of the laminated body and the cutting edge line of the blade N in the laminated body having the commonly-used corners of 45 degrees, 21.8 degrees, and 18.4 degrees. (Θ1 in FIG. 13) An explanatory diagram of a case where 23 ° to 44 ° is set on the same surface.

Specifically, the 45-degree chamfered portion 88A of the laminated body 88 shown in FIG. 14 (A) is processed by cutting the a and b portions shown in FIG. 17 at 1 mm, 1.5 mm, 3 mm, or 5 mm, respectively. Triangular shape.

The 21.8-degree chamfered portion 90A of the laminated body 90 shown in FIG. 14 (B) is similarly formed by processing a part at a angle of 5 mm and part b at a cut angle of 2 mm to form a triangular shape.

The 68.2-degree cut corner portion 92A of the laminated body 92 shown in FIG. 14 (C) is formed by processing part a into a triangular shape with a cut angle of 2 mm and part b with a cut angle of 5 mm, and cuts with FIG. 14 (B). The corner portions 90A have substantially the same shape.

The 18.4 degree chamfered portion 94A of the laminated body 94 shown in FIG. 14 (D) is formed by processing part a into a triangular shape with a cut angle of 3 mm and part b with a cut angle of 1 mm.

The chamfered portion 96A of the laminated body 96 shown in FIG. 14 (E) is formed by processing a part at a angle of 1 mm and part b at a cut angle of 3 mm to form a triangular shape, and the chamfered portion 94A of FIG. 14 (D) for Substantially the same shape.

For such a laminated body 88 to 96 having cut corner portions 88A to 96A, any one of the sides of the laminated body 88 to 96 (side J is shown in FIG. 14 but other sides may be used) and the cutting edge Na (see FIG. 6) Etc.) The angle formed by the cutting edge line L is set to 23 degrees or more and 44 degrees or less on the same surface.

With this, the blade tip Na is necessarily in point contact with one of the corner portions 88Aa, 90Aa, 92Aa, 94Aa, and 96Aa of the cut corner portions 88A to 96A. That is, as long as the angle formed by the above is set to 23 degrees or more and 44 degrees or less, even if the laminated bodies 88 to 96 having different models are provided in the peeling start portion forming device 10, they will inevitably become points (corners 88Aa to 96Aa) and The position of the point (knife tip Na) is aligned, so that the knife point Na can be surely penetrated into the interface of the corner 88Aa to 96Aa.

In addition, in consideration of the machining accuracy of the chamfered portions 6A, 88A to 96A, it is preferable to set the angle formed above to 24 degrees or more and 42 degrees or less.

In addition, even when the angle formed by the above-mentioned angle is set to be 1 degree or more and 22 degrees or less on the same plane as the blade point line L shown in FIG. 15, the corner portion 6Aa also becomes a point-to-point level. Alignment, but because the angle formed above is small, the shape of the peeling start portion 98 formed by the blade tip Na becomes elongated, which is not good as the starting point of peeling.

On the other hand, if the angle formed by the above is set to 23 degrees or more and 44 degrees or less as shown by the knife edge line L shown in FIG. 16, the shape of the peeling start portion 26 (30) formed by the knife edge Na is close. A right-angled isosceles triangle is a preferred peeling start portion as a peeling starting point.

The present invention has been described in detail and with reference to specific implementation aspects, but it should be understood by the practitioner that various changes or modifications can be made without departing from the spirit and scope of the present invention.

This application is based on Japanese Patent Application No. 2014-143019 filed on July 11, 2014, the contents of which are incorporated herein by reference.

Claims (3)

A peeling device for a laminated body, comprising: a peeling blade; for a rectangular laminated body formed by releasably attaching a first substrate and a second substrate, a blade tip is set at a corner of the laminated body; The chamfered portion penetrates a specific amount into the interface between the first substrate and the second substrate to form a peeling start portion at the interface; and a peeling portion that peels sequentially at the interface with the peeling start portion as a starting point; In addition, the tip of the peeling blade is in point contact with one of the obtuse corners at both ends of the chamfered corner, and penetrates into the interface, where the angle with the chamfered angle is 45 degrees, 21.8 The laminated body of the above-mentioned cut-angle portion of 18.4 degrees or 18.4 degrees, the angle formed by one side of the laminated body and the tip line of the peeling blade is set to 23 degrees or more and 44 degrees or less on the same plane. A method for peeling a laminated body, which is a rectangular laminated body formed by releasably attaching a first substrate and a second substrate, and peeling off the interface between the first substrate and the second substrate; The method includes the step of forming a peeling start portion, which inserts a blade edge of a peeling blade from a cut corner portion provided at a corner portion of the laminated body into a specific amount of an interface between the first substrate and the second substrate, and at the interface. Forming a peeling start part; and a peeling step for peeling at the interface with the peeling start part as a starting point; and in the peeling start part forming step, the tip of the peeling blade is in point contact with the cut One of the obtuse-angled corners at both ends of the corners touches the interface after the obtuse-angled corners contact, and for the above-mentioned laminated body having the notch-angled corners at 45, 21.8, or 18.4 degrees, the above-mentioned peeling In the starting portion forming step, an angle formed by one side of the laminated body and a tip line of the peeling blade is set to 23 degrees or more and 44 degrees or less on the same plane. An electronic device manufacturing method includes a functional layer forming step of forming a functional layer on an exposed surface of the first substrate with respect to a rectangular laminated body in which a first substrate and a second substrate are releasably attached. And a separation step, which separates the second substrate from the first substrate on which the functional layer is formed; and the manufacturing method of the electronic device is characterized in that the separation step includes a peeling start portion forming step that peels a peeling knife The blade tip penetrates a certain amount from the cut corner portion provided at the corner portion of the laminated body to the interface between the first substrate and the second substrate to form a peeling start portion at the interface; and a peeling step, which uses the peeling The starting portion is a starting point and is peeled at the interface; and in the step of forming the peeling start portion, the tip of the peeling blade is an obtuse angle with one of the obtuse angle portions at both ends of the chamfered angle portion in a point contact manner After the corner contacted, the interface was pierced, and the laminated body including the chamfered portion having a chamfered angle of 45 degrees, 21.8 degrees, or 18.4 degrees was formed at the peeling start portion. Step, the laminate of any of the above and the side line of the cutting edge of the blade to the release angle is set to 44 degrees or less than 23 degrees on the same plane.